Autry, US
Bill Autry, Guy, AR US
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20140287668 | Apparatus and method for skinning and removing usable meat from a large game animal carcass - An improved apparatus and method for skinning large game animals is used by fastening the animal head to an upright at one end of the apparatus structure, making incisions at and cuts around the neck and attaching to the skin the end of a cable from a manually powered windlass mechanism mounted on an upright at the opposite end of the structure. As the windlass is operated the skin is drawn back over and off the carcass and the carcass is brought to a near horizontal position in open space between the two end upright parts of the structure. Two extensions are then swung into place along the animal's hind legs and attachments are made to the leg tendons. The skinned hide is then removed from the hind legs. The carcass is thus secured in a convenient and sanitary position for removing usable meat. | 09-25-2014 |
Billy Arthur Autry, Guy, AR US
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20150272138 | HIDE GRIPPING DEVICE - A hide gripping device has an elongated head, a plurality of teeth which are connected to the head in a row that extends generally parallel to a longitudinal axis of the head, and a handle which is connected to the head and is oriented in a vertical plane that extends generally perpendicularly to the longitudinal axis. The handle includes an elongated hand grip which extends in a first horizontal plane that is vertically spaced apart from a second horizontal plane n which the longitudinal axis lies, and the teeth extend from the head in a direction opposite the hand grip. | 10-01-2015 |
Brenden Autry, Savannah, GA US
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20150246718 | METHODS FOR MANUFACTURING AN I-STRINGER OF AN AIRCRAFT AND DEVICES FOR USE IN SUCH METHODS - Methods for manufacturing a reinforced composite structure for an aircraft and devices used in such methods are provided. A method includes advancing a composite material layout through a cap-forming device. The advancing results in a preformed cap section, a first length of the layout and a second length of the layout. The layout is removed from the cap-forming device and the preformed cap section of the layout is arranged within a cavity of a flexible mandrel with a foot portion of the first length and a foot portion of the second length remaining outside the cavity of the flexible mandrel. The foot portion of the first length and the foot portion of the second length contact a skin structure. The layout is heated and pressurized using the flexible mandrel to cure the layout and form the reinforced composite structure affixed to the skin structure. | 09-03-2015 |
Byron James Autry, Charleston, SC US
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20160069746 | METHODS AND SYSTEMS FOR FORMING A MANDREL ASSEMBLY FOR USE WITH A LOCATING SYSTEM - A method of forming a mandrel assembly for use in fabricating a large scale component includes boring a plurality of cavities into an outer surface of the mandrel assembly and filling the plurality of cavities with a contrast color substrate to form a contrast target on the mandrel assembly. The method also includes curing the contrast color substrate such that an outer surface of the contrast color substrate is substantially flush with the outer surface of the mandrel assembly when the substrate is fully cured. | 03-10-2016 |
Christopher Lowell Autry, New London, CT US
Patent application number | Description | Published |
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20090054395 | SULFONYL AMIDE DERIVATIVES FOR THE TREATMENT OF ABNORMAL CELL GROWTH - The present invention relates to a compound of the formula I | 02-26-2009 |
20110166120 | SULFONYL AMIDE DERIVATIVES FOR THE TREATMENT OF ABNORMAL CELL GROWTH - The present invention relates to a compound of the formula I | 07-07-2011 |
20130005964 | SULFONYL AMIDE DERIVATIVES FOR THE TREATMENT OF ABNORMAL CELL GROWTH - The present invention relates to a compound of the formula I | 01-03-2013 |
20140100368 | SULFONYL AMIDE DERIVATIVES FOR THE TREATMENT OF ABNORMAL CELL GROWTH - The present invention relates to a compound of the formula I | 04-10-2014 |
20150080368 | SULFONYL AMIDE DERIVATIVES FOR THE TREATMENT OF ABNORMAL CELL GROWTH - The present invention relates to a compound of the formula I | 03-19-2015 |
Geneva Autry, New York, NY US
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20130326804 | Quiet Bath Filler N Dispenser - The invention provides a specially designed hose attachment for bath tub nozzles, with the device boasting an integrated dispenser through which liquid bath products are easily dispensed. The invention effectively eliminates the loud splashing noise associated with filling a bath tub as well as provide a simple means of dispensing bath products into the bath as the tub is filled. | 12-12-2013 |
James Autry, New York, NY US
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20130326804 | Quiet Bath Filler N Dispenser - The invention provides a specially designed hose attachment for bath tub nozzles, with the device boasting an integrated dispenser through which liquid bath products are easily dispensed. The invention effectively eliminates the loud splashing noise associated with filling a bath tub as well as provide a simple means of dispensing bath products into the bath as the tub is filled. | 12-12-2013 |
John Autry, Fayetteville, NC US
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20160030869 | AIR FILTER DEVICE AND AIR FITLER ELEMENT HAVING AN INTEGRATED BYPASS - A filter element has a filter media hollow body with a hollow interior circumferentially enclosing an outflow passage. A second filter as a bypass filter element is arranged at or integrated into the end cap the filter element. The bypass filter element is configured as an ambient airflow restriction device providing a significantly higher pressure drop relative to the in the filter media of the filter element, the significantly higher pressure drop is operable to limit or prevent airflow through the auxiliary inflow path. When the primary inflow path is obstructed, the ambient airflow restriction device operates to provide auxiliary airflow into the outflow passage, bypassing filtering of the filter media hollow body of the filter element. | 02-04-2016 |
John A. Autry, Colleyville, TX US
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20090091310 | Apparatus and Methods for Powering Remote Devices Under Dynamic Source and Load Conditions - Power provided to a remote network component is regulated. A monitoring circuit estimates a DC input voltage that is received from a central network supply. A control circuit compares the DC input voltage to a threshold DC voltage value to determine if the DC input voltage exceeds the threshold DC voltage value. A voltage conversion circuit converts the DC input voltage to a DC output voltage that is provided at an output voltage conductor and that is less than the threshold DC voltage value, if the DC input voltage exceeds the threshold DC voltage value. A bypass circuit bypass the voltage conversion circuit and transmit the DC input voltage to the output voltage conductor as the DC output voltage if the DC input voltage is less than the threshold DC voltage value. | 04-09-2009 |
John R. Autry, Wauseon, OH US
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20100290831 | COUPLING ASSEMBLY FOR FURNITURE COMPONENTS - Coupling assemblies ( | 11-18-2010 |
Marcy S. Autry, Acworth, GA US
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20080229471 | Protection System - A protection system for the neck, chest, and torso on down to the mid-thigh area as it shields the wearer from a variety of messy situations. One embodiment employs sleeves that cover both arms of a user entirely and end with thin, elastic cuffs or bands at the wrists. In addition, the protective layer features a base that is A-lined and extends to the mid-thigh area. The back of the protective layer remains open from the adjustable closure device down to the bottom. | 09-25-2008 |
20090265827 | Protection System - A protection system for the neck, chest, and torso on down to the mid-thigh area as it shields the wearer from a variety of messy situations. One embodiment employs sleeves that cover both arms of a user entirely and end with thin, elastic cuffs or bands at the wrists. In addition, the protective layer features a base that is A-lined and extends to the mid-thigh area. The back of the protective layer remains open from the adjustable closure device down to the bottom. | 10-29-2009 |
Tracy Autry, Trabuco Canyon, CA US
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20080237827 | Integrated circuit with flexible planer leads - A microelectronic device including a microelectronic circuit and at least one planar flexible lead. These planar flexible leads are adapted to bend and flex during mechanical stress allow direct mounting of the device to a member, and withstand extreme thermal cycling, such as −197° C. to +150° C. such as encountered in space. | 10-02-2008 |
20090134508 | Integrated circuit with flexible planar leads - A microelectronic device including a microelectronic circuit and at least one planar flexible lead. These planar flexible leads are adapted to bend and flex during mechanical stress, allowing direct mounting of the device to a member and able withstand extreme thermal cycling between −20° C. to +80° C. encountered in terrestrial applications. Advantageously, the microelectronic device is adapted to be both weldable and solderable. The invention may comprise a solar cell diode, which is flexible and so thin that it can be affixed directly to the solar panel proximate the solar cell. | 05-28-2009 |
20100109147 | Less expensive high power plastic surface mount package - A high power surface mount package including a thick bond line of solder interposed between the die and a heatsink, and between the die and a lead frame, wherein the lead frame has the same coefficient of thermal expansion as the heatsink. In one preferred embodiment, the heatsink and the lead frame are comprised of the same material. The package can be assembled using standard automated equipment, and does not require a weight or clip to force the parts close together, which force typically reduces the solder bond line thickness. Advantageously, the thermal stresses on each side of the die are effectively balanced, allowing for a large surface area die to be packaged with conventional and less expensive materials. One type of die that benefits from the present invention can include a transient voltage suppressor, but could include other dies generating a significant amount of heat, such as those in excess of 0.200 inches square. | 05-06-2010 |
20100136748 | Flexible diode package and method of manufacturing - A single step packaging process that both melts a solder and also cures an adhesive about a microelectronic circuit. The process finds technical advantages by simplifying packaging of a die that may be coupled to a planar flexible lead, which leads to a lower production cost and quicker manufacturing time. The planar flexible lead may be adapted to bend and flex during mechanical stress and during extreme temperature cycling, and allow direct mounting of the device to a member by easily welding or soldering. The invention may comprise a flexible solar cell diode that can be closely positioned on solar panels at an extremely low cost. | 06-03-2010 |
20110193097 | Silicon carbide semiconductor - A hermetically sealed integrated circuit package that includes a cavity housing a semiconductor die, whereby the cavity is pressurized during assembly and when formed. The invention prevents the stress on a package created when the package is subject to high temperatures at atmospheric pressure and then cooled from reducing the performance of the die at high voltages. By packaging a die at a high pressure, such as up to 50 PSIG, in an atmosphere with an inert gas, and providing a large pressure in the completed package, the dies are significantly less likely to arc at higher voltages, allowing the realization of single die packages operable up to at least 1200 volts. Moreover, the present invention is configured to employ brazed elements compatible with Silicon Carbide dies which can be processed at higher temperatures. | 08-11-2011 |
20110193098 | High voltage high package pressure semiconductor package - A hermetically sealed integrated circuit package that includes a cavity housing a semiconductor die, whereby the cavity is pressurized during assembly and when formed. The invention prevents the stress on a package created when the package is subject to high temperatures at atmospheric pressure and then cooled from reducing the performance of the die at high voltages. By packaging a die at a high pressure, such as up to 50 PSIG, in an atmosphere with an inert gas, and providing a large pressure in the completed package, the dies are significantly less likely to arc at higher voltages, allowing the realization of single die packages operable up to at least 1200 volts. Moreover, the present invention is configured to employ brazed elements compatible with Silicon Carbide dies which can be processed at higher temperatures. | 08-11-2011 |
20120326323 | HIGH VOLTAGE HIGH PACKAGE PRESSURE SEMICONDUCTOR PACKAGE - A hermetically sealed integrated circuit package that includes a cavity housing a semiconductor die, whereby the cavity is pressurized during assembly and when formed. The invention prevents the stress on a package created when the package is subject to high temperatures at atmospheric pressure and then cooled from reducing the performance of the die at high voltages. By packaging a die at a high pressure, such as up to 60 PSIG or more, in an atmosphere with an inert gas, and providing a large pressure in the completed package, the dies are significantly less likely to arc at higher voltages, allowing the realization of single die packages operable up to at least 1200 volts or more. Moreover, the present invention is configured to employ brazed elements compatible with Silicon Carbide dies which can be processed at higher temperatures. | 12-27-2012 |
20130023089 | LESS EXPENSIVE HIGH POWER PLASTIC SURFACE MOUNT PACKAGE - A high power surface mount package including a thick bond line of solder interposed between the die and a heatsink, and between the die and a lead frame, wherein the lead frame has the same coefficient of thermal expansion as the heatsink. The heatsink and the lead frame preferably comprise the same material. The package can be assembled using standard automated equipment, and does not require a weight or clip to force the parts close together, which force typically reduces the solder bond line thickness. Advantageously, the thermal stresses on each side of the die are effectively balanced, allowing for a large surface area die to be packaged with conventional and less expensive materials. One type of die that benefits from the present invention can include a transient voltage suppressor, but could include other dies generating a significant amount of heat, such as those in excess of 0.200 inches square. | 01-24-2013 |