Patent application number | Description | Published |
20090243011 | Manufacturing Optical MEMS with Thin-Film Anti-Reflective Layers - In accordance with the teachings of one embodiment of the present disclosure, a method for manufacturing a semiconductor device includes forming a support structure outwardly from a substrate. The support structure has a first thickness and a first outer sidewall surface that is not parallel with the substrate. The first outer sidewall surface has a first minimum refractive index. A first anti-reflective layer is formed outwardly from the support structure and outwardly from the substrate. A second anti-reflective layer is formed outwardly from the first anti-reflective layer. The first and second anti-reflective layers each includes respective compounds of at least two elements selected from the group consisting of: silicon; nitrogen; and oxygen. | 10-01-2009 |
20100025832 | REDUCED STICTION AND MECHANICAL MEMORY IN MEMS DEVICES - A MEMS device is packaged in a process which hydrogen (H) deuterium (D) for reduced stiction. H is exchanged with D by exposing the MEMS device with a deuterium source, such as deuterium gas or heavy water vapor, optionally with the assistance of a direct or downstream plasma. | 02-04-2010 |
20120307342 | MANUFACTURING OPTICAL MEMS WITH THIN-FILM ANTI-REFLECTIVE LAYERS - In accordance with the teachings of one embodiment of this disclosure, a method for manufacturing a semiconductor device includes forming a support structure outwardly from a substrate. The support structure has a first thickness and a first outer sidewall surface that is not parallel with the substrate. The first outer sidewall surface has a first minimum refractive index. A first anti-reflective layer is formed outwardly from the support structure and outwardly from the substrate. A second anti-reflective layer is formed outwardly from the first anti-reflective layer. The first and second anti-reflective layers each includes respective compounds of at least two elements selected from the group consisting of: silicon; nitrogen; and oxygen. | 12-06-2012 |
20140192397 | MEMS DEVICE WITH SLOPED SUPPORT - A microelectromechanical (MEMS) device has a movable member supported in elevated position spaced by a sloped support structure above a substrate. The movable member may be a polished metallic plate such as a mirror of a digital micromirror device (DMD) supported by a flexible hinge above an integrated circuit wafer die region. The plate may supported centrally at a raised juncture of two upwardly oppositely directed and symmetrically converging hinge legs for pivoting about a parallel axis. The plate may also be supported at a top end of a hinge leg in cantilever fashion, for pivoting about a perpendicular axis. Optional spring tips are provided for limiting movement and recovering energy. In a described fabrication method, hinge material is deposited over a sacrificial layer that has been directly or indirectly patterned using a grayscale photoresist exposure to define sloped surfaces which provide a template for configuring the hinge and optional other components. | 07-10-2014 |