Patent application number | Description | Published |
20130258575 | FORMED PCB - Methods for forming PCBs that can be used in a portable computing device are described. The PCBs can be installed in the portable computing device in a bent configuration. In a particular embodiment, a contiguously formed PCB can be shaped with two large regions connected a thin connector portion. The thin connector portion can connect components one each of the two large regions and can be used in lieu of a flex connector. In one embodiment, the PCB can be formed from multiple layers including trace and substrate layers. The trace and substrate layer can be adjusted to affect the stiffness of the PCB in various regions, such as to allow the PCB to hold a bent configuration after a bending moment is applied. | 10-03-2013 |
20140152632 | Solar Cell Ambient Light Sensors For Electronic Devices - An electronic device is provided with a display and a solar cell ambient light sensor that receives light through a portion of the display. The solar cell ambient light sensor may include one or more thin-film photovoltaic cells. A voltage that accumulates within the thin-film photovoltaic cell in response to ambient light is sampled and converted into ambient light data. The device includes control circuitry that modifies the intensity of display light generated by the display based on the ambient light data from the photovoltaic cell. The solar cell ambient light sensor is attached to a transparent cover layer, a color filter layer, or any other layer of the display. When the accumulated voltage is not being sampled for ambient light measurements, the voltage may be used to provide charge to a battery in the device. | 06-05-2014 |
20140300832 | Electronic Device Signal Routing Structures With Conductive Adhesive - An electronic device may have structures that are coupled together using conductive adhesive such as anisotropic conductive film and other adhesives. The structures that are coupled together may include a touch sensor structure formed from electrodes on the inner surface of a display cover layer, a display module having display layers such as a thin-film transistor layer, and circuitry mounted on substrates such as printed circuits. Conductive signal path structures may be used in routing signals within the electronic device. The conductive signal path structures may be formed from pins that are embedded within injection molded plastic, from metal traces such as laser-deposited metal traces that are formed on the surface of a plastic member or other dielectric, from metal structures that run within channels in a plastic, printed circuit traces, and other signal path structures. | 10-09-2014 |
20150116958 | CIRCUIT BOARD MODULES HAVING MECHANICAL FEATURES - A modularized printed circuit board including mechanical features. The modularized printed circuit board may include a printed circuit board, at least one electronic component affixed to the printed circuit board, and an overmold material adjacent at least a portion of the printed circuit board and defining a region of overmold material. The modularized printed circuit board may also include a feature formed from the overmold material. | 04-30-2015 |
20150221460 | WATERPROOF BUTTON ASSEMBLY - A waterproof button assembly. The waterproof button assembly may include a housing including an opening and a button. The button may be positioned at least partially within the housing via the opening. The assembly may also include a plurality of engagement components positioned on opposite-distal ends of the button. The plurality of engagement components may be configured to retain the button within the housing. The engagement components may extend distally from the button, such that a portion of the engagement components may be positioned within apertures formed in the sidewall of the housing. The assembly may also include a plurality of supports, a tactile dome in contact with the button and at least one of the plurality of supports. A sensing component of the assembly may be positioned adjacent the housing and in alignment with the button and/or tactile dome for sensing actuation of the button within the assembly. | 08-06-2015 |
20150263450 | ELASTOMERIC CONNECTORS - In a first embodiment, an elastomeric connector may include conductive and nonconductive portions and a guide that at least partially surrounds the connector and transfers compression in at least two directions. In a second embodiment, an elastomeric connector includes conductive portions at least partially surrounded by a nonconductive portion that is at least partially surrounded by conductive material connectible to ground to shield. In a third embodiment, an elastomeric connector may include multiple conductive portions and a nonconductive portion. One of the conductive portions may be separated from a first other in a cross section of a first connection surface and a second one of the others outside the cross section. At least one of the conductive portions may be connected to at least one of the others within the connector. In a fourth embodiment, a sealing component may include conductive and nonconductive elastomeric material. | 09-17-2015 |
20150295332 | REDUCING OR ELIMINATING BOARD-TO-BOARD CONNECTORS - Embodiments of the present disclosure provide a method for creating a connection mechanism for a circuit board. The method includes securing a plurality of electrical conductors to a sleeve. Once the electrical conductors have been coupled to the sleeve, the sleeve and the plurality of conductors are coupled to, and molded with, the circuit board. At least one side of the circuit board, such as, for example, the molding over the plurality of electrical conductors, is subsequently reduced to expose at least a portion of at least one of the plurality of electrical conductors. An electrical connector is then coupled to the at least the portion of the one or more of the plurality of electrical conductors that was exposed when the first side of the printed circuit board was reduced. | 10-15-2015 |
20150303244 | Electronic Devices With Display-Integrated Light Sensors - An electronic device is provided, with a display and a display-integrated light sensor. The display includes a transparent cover layer, light-generating layers, and a touch-sensitive layer. The display-integrated light sensor is interposed between the transparent cover layer and a display layer such as the touch-sensitive layer or a thin-film transistor layer of the light-generating layers. The light-generating layers include a layer of organic light-emitting material. The display-integrated light sensor can be implemented as an ambient light sensor or a proximity sensor. The display-integrated, light sensor may be a packaged light sensor that is integrated into the display layers of the display or may be formed from light-sensor components formed directly on a display circuitry layer such as the touch-sensitive layer or the thin-film transistor layer. | 10-22-2015 |