Patent application number | Description | Published |
20100233497 | CERAMIC MATERIAL WITH A COMPOSITION WHICH IS MATCHED TO A COEFFICIENT OF THERMAL EXPANSION SPECIFIED BY A METALLIC MATERIAL - A non-conductive ceramic material contains a base ceramic material and at least one other ceramic material having a lower coefficient of thermal expansion than that of the base material so that the coefficient of thermal expansion of the non-conductive ceramic material is identical to that of a metallic material to which it will be matched. Methods of making and using same are disclosed. | 09-16-2010 |
20120223344 | ARRAY OF SCALABLE CERAMIC DIODE CARRIERS HAVING LEDS - Ceramic diode carriers ( | 09-06-2012 |
20120263896 | EXTRUDED MOLDED FUNCTIONAL BODY MADE OF HIGHLY THERMALLY CONDUCTIVE CERAMIC - The invention relates to molded functional bodies made of highly thermally conductive materials, namely aluminum nitride, to a method for the production thereof by way of extrusion, and to the use thereof. | 10-18-2012 |
20130241425 | LED DRIVER CIRCUIT - In order to supply power and control the power supplied to an LED ( | 09-19-2013 |
20130241426 | LED LIGHT COMPRISING AN INTEGRATED DRIVER - Disclosed is an LED light comprising at least one LED ( | 09-19-2013 |
20130248499 | METHOD FOR JOINING TWO PARTNERS TO BE JOINED, I.E. CERAMIC AND METAL/CERAMIC MATERIALS, USING A LASER BEAM - The invention relates to a method for joining two partners to be joined at defined joining points, one partner ( | 09-26-2013 |
20130342302 | COIL BODIES HAVING A CERAMIC CORE - Coil bodies having a ceramic core. | 12-26-2013 |
20140009946 | INJECTION-MOLDED LAMP BODY WITH CERAMIC COOLING APPARATUSES AND LEDS - In order to extend the life and reduce the fitting complexity involved, what is proposed is: the light-emitting unit comprises a plurality of individual identical cooling apparatus/light-emitting means modules ( | 01-09-2014 |
20140016330 | CERAMIC PRINTED CIRCUIT BOARD COMPRISING AN AL COOLING BODY - The invention relates to a ceramic printed circuit board comprising an upper side and a lower side, sintered metallization regions being arranged on the upper side, and the lower side being embodied as a cooling body. In order to improve the heat dissipation of components on the upper side of the printed circuit board, the lower side is also provided with sintered metallization regions to which a metal cooling body is soldered. | 01-16-2014 |
20140022784 | LED LAMP COMPRISING AN LED AS THE LUMINAIRE AND A GLASS OR PLASTIC LAMPSHADE - The invention relates to an LED lamp comprising at least one LED as the luminaire, a ceramic base and a ceramic supporting body, arranged on the base and having a supporting surface for accommodating the LEDs, and further comprising a light-permeable lampshade which is fixed on the supporting body and put on the supporting surface, sintered metalized sections, which form a circuit board, being arranged on the supporting surface for the LEDs to be soldered to and optionally for applying a corresponding circuit thereto. In order for the light emitted by the LEDs to be influenced and guided by simple means, the lampshade has a cupola, dome or bonnet design and consists of glass or plastic. | 01-23-2014 |
20140290985 | EMBEDDED METAL STRUCTURES IN CERAMIC SUBSTRATES - The invention relates to a method for producing a substrate comprising embedded conductive metal structures or metallizations, in particular for use as printed circuit boards. The aim of the invention is to allow the buried metallization of three-dimensional, i.e. curved or angular, substrates in addition to the two-dimensional flat and level, i.e. plate-shaped, substrates. According to the invention, this is achieved in that trenches and/or recesses are dug into the substrate using laser technology, and the metal structures are then produced in the trenches and/or recesses. | 10-02-2014 |