Patent application number | Description | Published |
20090057808 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR ELEMENT, AND SUBSTRATE - A semiconductor device, a semiconductor element, and a substrate are provided, which allow the semiconductor element to be provided with a reduced size when combined. The semiconductor device of the invention has a rectangular semiconductor element mounted on a substrate formed with an external input terminal, an external output terminal, and a plurality of wiring patterns connected to each of the external input terminal and the external output terminal. The semiconductor element includes a grayscale voltage generating unit for generating a plurality of grayscale voltages by dividing a reference voltage, a plurality of electrodes for the reference voltage formed in the neighborhood of the grayscale voltage generating unit; and an internal wiring for connecting the grayscale voltage generating unit and the reference voltage electrodes. The substrate includes a wiring pattern for the reference voltage for connecting the external input terminal and the reference voltage electrodes. | 03-05-2009 |
20090057886 | SEMICONDUCTOR DEVICE AND SUBSTRATE - A semiconductor device of the invention include a rectangular semiconductor element mounted on a substrate formed with an external input terminal, an external output terminal, and a plurality of wiring patterns connected to each of the external input terminal and the external output terminal. The semiconductor element comprises, a plurality of first electrodes formed along a first edge of a surface thereof, a plurality of second electrodes formed along an edge opposite to the first edge of the surface, a plurality of third electrodes formed in the neighborhood of a functional block, and an internal wiring for connecting the first electrodes and the third electrodes. The substrate comprises, a first wiring pattern for connecting the external input terminal and the first electrodes, a second wiring pattern for connecting the external output terminal and the second electrodes, and a third wiring pattern for connecting the first electrodes and the third electrodes. | 03-05-2009 |
20090079047 | COF PACKAGE AND TAPE SUBSTRATE USED IN SAME - The present invention provides a COF package which comprises a tape substrate including a plurality of external input terminals and a plurality of external output terminals provided in a chip non-mounting area, a plurality of input wirings connected to the external input terminals respectively, a plurality of output wirings connected to the external output terminals respectively, a plurality of internal input wirings which are provided from the chip non-mounting area to a chip mounting area and provided between the input wirings and which are connected to the external input terminals, respectively, and a dummy wiring provided from the chip non-mounting area to the chip mounting area and provided between the internal input wirings; and a semiconductor chip including a plurality of input electrodes connected to the input wirings respectively, a plurality of output electrodes connected to the input wirings respectively, internal input electrodes connected to the internal input wirings respectively, and a dummy electrode provided with being spaced from each input electrode along one side lying over a chip surface, and connected to the dummy wiring. | 03-26-2009 |
20090127928 | Travel Control Device for Work Vehicle and Work Vehicle - A travel control device for a work vehicle includes: a hydraulic pump; a plurality of hydraulic motors connected to the hydraulic pump in parallel through a closed-circuit connection, that drive different wheels with pressure oil delivered from the hydraulic pump; a slip detection device that detects a slip occurring at each of the wheels; and a flow control device that reduces, upon detection of a slip occurring at any of the wheels by the slip detection device, a quantity of pressure oil supplied to a hydraulic motor for driving the wheel at which the slip has been detected, among the plurality of hydraulic motors. | 05-21-2009 |
20100032219 | Travel Drive System for Work Vehicle, Work Vehicle, and Travel Drive Method - A travel drive system for a work vehicle includes: an HST drive device comprising a hydraulic pump driven by a prime mover and a hydraulic motor connected to the hydraulic pump by a closed circuit; an electric motor driven by using electric power generated by drive of the prime mover; a first drive wheel driven by the HST drive device; a second drive wheel driven by the electric motor; a vehicle speed detector that detects a vehicle speed; and a control unit that distributes output of the prime mover to the HST drive device and to the electric motor such that, as the vehicle speed detected by the vehicle speed detector increases, a proportion of a first power distributed to the HST drive device decreases and a proportion of a second power distributed to the electric motor increases. | 02-11-2010 |
20110090005 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR ELEMENT, AND SUBSTRATE - A semiconductor device, a semiconductor element, and a substrate are provided, which allow the semiconductor element to be provided with a reduced size when combined. The semiconductor device has a rectangular semiconductor element mounted on a substrate formed with an external input terminal, an external output terminal, and a plurality of wiring patterns connected to each of the external input terminal and the external output terminal. The semiconductor element includes a grayscale voltage generating unit for generating a plurality of grayscale voltages by dividing a reference voltage, a plurality of electrodes for the reference voltage formed in the neighborhood of the grayscale voltage generating unit; and an internal wiring for connecting the grayscale voltage generating unit and the reference voltage electrodes. The substrate includes a wiring pattern for the reference voltage for connecting the external input terminal and the reference voltage electrodes. | 04-21-2011 |
20120146233 | SEMICONDUCTOR DEVICE AND SUBSTRATE - A semiconductor device of the invention include a rectangular semiconductor element mounted on a substrate formed with an external input terminal, an external output terminal, and a plurality of wiring patterns connected to each of the external input terminal and the external output terminal. The semiconductor element comprises, a plurality of first electrodes formed along a first edge of a surface thereof, a plurality of second electrodes formed along an edge opposite to the first edge of the surface, a plurality of third electrodes formed in the neighborhood of a functional block, and an internal wiring for connecting the first electrodes and the third electrodes. The substrate comprises, a first wiring pattern for connecting the external input terminal and the first electrodes, a second wiring pattern for connecting the external output terminal and the second electrodes, and a third wiring pattern for connecting the first electrodes and the third electrodes. | 06-14-2012 |
20140167277 | SEMICONDUCTOR WIRING PATTERNS - A semiconductor device includes a rectangular semiconductor element mounted on a substrate formed with an external input terminal, an external output terminal, and a plurality of wiring patterns connected to each of the external input terminal and the external output terminal. The semiconductor element includes, a plurality of first electrodes formed along a first edge of a surface thereof, a plurality of second electrodes formed along an edge opposite to the first edge of the surface, a plurality of third electrodes formed in the neighborhood of a functional block, and an internal wiring for connecting the first electrodes and the third electrodes. The substrate includes, a first wiring pattern for connecting the external input terminal and the first electrodes, a second wiring pattern for connecting the external output terminal and the second electrodes, and a third wiring pattern for connecting the first electrodes and the third electrodes. | 06-19-2014 |