Patent application number | Description | Published |
20090311537 | INSULATING PASTE FOR LOW TEMPERATURE CURING APPLICATION - This invention relates to an insulating paste for an electric module that avoids cracks occurring in an insulating layer. The insulating paste comprises heat-curable silicone resin, inorganic filler and solvent. | 12-17-2009 |
20100009203 | INSULATION LAYER AND METHOD FOR PRODUCING THEREOF - An insulation layer formed on a metal or ceramic substrate includes a glass component, wherein the glass component contains 0.1 to 10 wt % of B | 01-14-2010 |
20100084681 | PRODUCTION PROCESS FOR SURFACE-MOUNTING CERAMIC LED PACKAGE, SURFACE-MOUNTING CERAMIC LED PACKAGE PRODUCED BY SAID PRODUCTION PROCESS, AND MOLD FOR PRODUCING SAID PACKAGE - The present invention is related to a surface-mounting ceramic LED package and a method for its production comprising: layering a ceramic green sheet which has a hole and a second ceramic green sheet, inserting a mold with a groove to form a partition in the bottom of the ceramic green sheet substrate, and firing the ceramic green sheet substrate. | 04-08-2010 |
20100155117 | CONDUCTOR PASTE FOR CERAMIC SUBSTRATE AND ELECTRIC CIRCUIT - A conductor paste for a ceramic substrate contains a) a conductive metal powder comprising a silver powder and a palladium powder; b) a glass powder; and c) an organic solvent, wherein the conductive metal powder has an average particle diameter of not more than 1.2 μm, and the glass powder is a Bi | 06-24-2010 |
20100200283 | INSULATION PASTE FOR A METAL CORE SUBSTRATE AND ELECTRONIC DEVICE - The insulation paste of the present invention contains (a) a glass powder, and (b) an organic solvent, wherein one or both of alumina (Al | 08-12-2010 |
20100200815 | ELECTRICALLY CONDUCTIVE COMPOSITION FOR VIA-HOLES - The present invention relates to an electrically conductive composition for filling via-holes formed in an electronic circuit substrate containing an electrically conductive metal and a vehicle, wherein the content of the electrically conductive metal is 57 vol % or more, and the composition is a plastic fluid for which fluidity increases when external pressure is applied to the composition. | 08-12-2010 |
20110073242 | PRODUCTION PROCESS FOR SURFACE-MOUNTING CERAMIC LED PACKAGE, SURFACE-MOUNTING CERAMIC LED PACKAGE PRODUCED BY SAID PRODUCTION PROCESS, AND MOLD FOR PRODUCING SAID PACKAGE - The present invention is related to a surface-mounting ceramic LED package and a method for its production comprising: layering a ceramic green sheet which has a hole and a second ceramic green sheet, inserting a mold with a groove to form a partition in the bottom of the ceramic green sheet substrate, and firing the ceramic green sheet substrate. | 03-31-2011 |
20110076793 | PRODUCTION PROCESS FOR SURFACE-MOUNTING CERAMIC LED PACKAGE, SURFACE-MOUNTING CERAMIC LED PACKAGE PRODUCED BY SAID PRODUCTION PROCESS, AND MOLD FOR PRODUCING SAID PACKAGE - The present invention is related to a surface-mounting ceramic LED package and a method for its production comprising: layering a ceramic green sheet which has a hole and a second ceramic green sheet, inserting a mold with a groove to form a partition in the bottom of the ceramic green sheet substrate, and firing the ceramic green sheet substrate. | 03-31-2011 |
20110114898 | CONDUCTOR PASTE FOR CERAMIC SUBSTRATE AND ELECTRIC CIRCUIT - A conductor paste for a ceramic substrate contains a) a conductive metal powder comprising a silver powder and a palladium powder; b) a glass powder; and c) an organic solvent, wherein the conductive metal powder has an average particle diameter of not more than 1.2 μm, and the glass powder is a Bi | 05-19-2011 |
20130160834 | BACK-SIDE ELECTRODE OF P-TYPE SOLAR CELL, AND METHOD FOR FORMING THE SAME - The invention relates to a back-side electrode adjacently formed on silicon layer of p-type solar cell, comprises a conductive component comprising, before firing, (a) aluminum powder, (b) organic medium and (c) metal-containing component selected from the group consisting of (i) metal selected from the group consisting of Titanium(Ti), Manganese(Mn) and Cerium (Ce), and (ii) carbide, oxide, nitride, boride, carbonate, hydroxide and resinate of (i) metal. | 06-27-2013 |
20130160835 | BACK-SIDE ELECTRODE OF P-TYPE SOLAR CELL AND METHOD FOR FORMING THE SAME - The invention relates to a back-side electrode adjacently formed on silicon layer of p-type solar cell comprises a conductive component comprising (a) aluminum powder, (b) organic medium and (c) metal-containing component selected from the group consisting of (i) metal selected from the group consisting of Bismuth (Bi), Molybdenum (Mo), Strontium (Sr) and Stibium (Sb), and (ii) carbide, oxide, nitride, boride, carbonate, hydroxide and resinate of (i) metal, and (iii) Copper (Cu). | 06-27-2013 |
20140190560 | BACK-SIDE ELECTRODE OF P-TYPE SOLAR CELL - A back-side aluminum electrode adjacently formed on silicon wafer of p-type solar cell, comprising, (a) first aluminum layer and (b) second aluminum layer, wherein (a) first aluminum layer formed adjacent to the silicon wafer, formed from first aluminum paste comprises aluminum powder and glass frit, wherein the weight ratio of the glass frit for the aluminum powder (glass/aluminum) is 0.02-1.0, and wherein (b) second aluminum layer formed adjacent to the first aluminum layer, formed from second aluminum paste comprises at least aluminum powder, wherein the weight ratio (glass/aluminum) of the second aluminum paste is less than the weight ratio(glass/aluminum) of the first aluminum paste. | 07-10-2014 |
20140306165 | METHOD OF MANUFACTURING NON-FIRING TYPE ELECTRODE - A method of manufacturing a non-fired type electrode comprising the steps of: (a) applying a conductive paste on a substrate, the conductive paste comprising; (i) 100 parts by weight of a conductive powder; (ii) an organic boron compound comprising an amine borate, a boronic acid, a boronic acid ester, a trimer of the boronic acid or a mixture thereof, wherein the boron element of the organic boron compound is 0.03 to 1.4 parts by weight; and (iii) 20 to 150 parts by weight of an organic vehicle; and (b) heating the applied conductive paste at 100 to 300° C. | 10-16-2014 |