Akihiro Koyama
Akihiro Koyama, Takarazuka-Shi JP
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20080209950 | Processing Method for Glass Substrate, Processed Glass Product and Stress Applying Apparatus - A processing method for glass substrate of the present invention includes: applying heat and external force to a glass substrate and then cooling it down to thereby form a compression stressed part having a different etching rate from that of other parts with respect to an etching reagent to be used, on the surface of the glass substrate and in the vicinity thereof; and performing chemical etching using the etching reagent on the glass substrate having the compression stressed part formed thereon, so as to form a relief on the surface of the glass substrate. | 09-04-2008 |
20120083401 | COVER GLASS AND METHOD FOR PRODUCING COVER GLASS - The disclosed cover glass is produced by etching a glass substrate that has been formed by a down-drawing process, and chemically strengthening the glass substrate to provide the glass substrate with a compressive-stress layer on the principal surfaces thereof. The glass substrate contains, as components thereof, 50% to 70% by mass of SiO | 04-05-2012 |
20120171497 | COVER GLASS AND METHOD FOR PRODUCING SAME - A cover glass having a compressive-stress layer on the principal surfaces thereof, and having a glass composition containing 50% to 70% by mole of SiO | 07-05-2012 |
20130029830 | GLASS SUBSTRATE FOR FLAT PANEL DISPLAY AND METHOD FOR MANUFACTURING SAME - Provided are: a glass substrate for p-Si TFT flat panel displays that is composed of a glass having high characteristic temperatures in the low-temperature viscosity range, typified by the strain point and glass transition point, having a small heat shrinkage rate, and being capable of avoiding the occurrence of the problem regarding the erosion/wear of a melting tank at the time of melting through direct electrical heating; and a method for manufacturing same. The present glass substrate is composed of a glass comprising 52-78 mass % of SiO | 01-31-2013 |
20130059718 | GLASS SUBSTRATE FOR FLAT PANEL DISPLAY AND METHOD FOR MANUFACTURING SAME - A substrate for p-Si TFT flat panel displays made of a glass having a high low-temperature-viscosity characteristic temperature and manufactured while avoiding erosion/wear of a melting tank during melting through direct electrical heating. The glass substrate comprises 52-78 mass % of SiO | 03-07-2013 |
20140249018 | GLASS SUBSTRATE FOR FLAT PANEL DISPLAY AND MANUFACTURING METHOD THEREOF - A flat panel display glass substrate according to the present invention includes a glass comprising, as expressed in mol %, 55-80% SiO | 09-04-2014 |
20140249019 | GLASS SUBSTRATE FOR FLAT PANEL DISPLAY AND MANUFACTURING METHOD THEREOF - A glass substrate for p-Si TFT flat panel displays that is composed of a glass comprising 52-78 mass % of SiO | 09-04-2014 |
20140309098 | GLASS SUBSTRATE FOR FLAT PANEL DISPLAY - A flat panel display glass substrate includes a glass comprising, in mol %, 55-80% SiO | 10-16-2014 |
Akihiro Koyama, Mie JP
Patent application number | Description | Published |
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20110143908 | GLASS COMPOSITION, GLASS SUBSTRATE FOR FLAT PANEL DISPLAY USING THE SAME, FLAT PANEL DISPLAY, AND METHOD FOR PRODUCING GLASS SUBSTRATE FOR FLAT PANEL DISPLAY - Provided is a glass composition suitable for a glass substrate for a flat panel display such as a liquid crystal display. This glass composition has high thermal stability, and is substantially free of BaO but has a low devitrification temperature. It is suitable for the production of a glass substrate by a downdraw process. This glass composition contains, in terms of mass %; 54 to 62% of SiO | 06-16-2011 |
20130345041 | GLASS COMPOSITION, GLASS SUBSTRATE FOR FLAT PANEL DISPLAY USING THE SAME, FLAT PANEL DISPLAY, AND METHOD FOR PRODUCING GLASS SUBSTRATE FOR FLAT PANEL DISPLAY - Provided is a glass composition suitable for a glass substrate for a flat panel display such as a liquid crystal display. This glass composition has high thermal stability, and is substantially free of BaO but has a low devitrification temperature. It is suitable for the production of a glass substrate by a downdraw process. This glass composition contains, in terms of mass %: 54 to 62% of SiO | 12-26-2013 |
Akihiro Koyama, Hyogo JP
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20130023400 | GLASS SUBSTRATE FOR FLAT PANEL DISPLAY AND MANUFACTURING METHOD THEREOF - A flat panel display glass substrate according to the present invention includes a glass comprising, as expressed in mol %, 55-80% SiO | 01-24-2013 |
20130065748 | GLASS SUBSTRATE FOR FLAT PANEL DISPLAY AND MANUFACTURING METHOD THEREOF - A flat panel display glass substrate includes a glass comprising, in mol %, 55-80% SiO | 03-14-2013 |
Akihiro Koyama, Kosai-Shi JP
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20140325837 | METHOD OF MANUFACTURING GROUND CONNECTION STRUCTURE - A ground connection structure is a structure for collectively connecting, to a body of a vehicle, a plurality of grounding wires which are connected to respective electrical components installed in the vehicle. The ground connection structure includes: a connection box to which the plurality of grounding wires are connected; a grounding terminal part connected to the vehicle in an electrically conducting state; and an electrically conducting connection part having one end connected to the connection box and the other end connected to the grounding terminal part, the electrically conducting connection part connecting the connection box and the grounding terminal part in an electrically conducting manner. The electrically conducting connection part is made of a low-inductance material having low inductance. | 11-06-2014 |
20140327303 | GROUND CONNECTION STRUCTURE - A ground connection structure is a structure for collectively connecting, to a body of a vehicle, a plurality of grounding wires which are connected to respective electrical components installed in the vehicle. The ground connection structure includes: a connection box to which the plurality of grounding wires are connected; a grounding terminal part connected to the vehicle in an electrically conducting state; and an electrically conducting connection part having one end connected to the connection box and the other end connected to the grounding terminal part, the electrically conducting connection part connecting the connection box and the grounding terminal part in an electrically conducting manner. The electrically conducting connection part is made of a low-inductance material having low inductance. | 11-06-2014 |