Patent application number | Description | Published |
20090199739 | ORGANOMETALLIC COMPOUNDS, PROCESSES FOR THE PREPARATION THEREOF AND METHODS OF USE THEREOF - This invention relates to organometallic compounds having the formula (L | 08-13-2009 |
20090200524 | ORGANOMETALLIC COMPOUNDS, PROCESSES FOR THE PREPARATION THEREOF AND METHODS OF USE THEREOF - This invention relates to organometallic compounds having the formula L | 08-13-2009 |
20090202740 | ORGANOMETALLIC COMPOUNDS, PROCESSES FOR THE PREPARATION THEREOF AND METHODS OF USE THEREOF - This invention relates to organometallic compounds having the formula L | 08-13-2009 |
20090203917 | ORGANOMETALLIC COMPOUNDS, PROCESSES FOR THE PREPARATION THEREOF AND METHODS OF USE THEREOF - This invention relates to organometallic compounds having the formula L | 08-13-2009 |
20090203928 | ORGANOMETALLIC COMPOUNDS, PROCESSES FOR THE PREPARATION THEREOF AND METHODS OF USE THEREOF - This invention relates to organometallic compounds having the formula (L | 08-13-2009 |
20090205538 | ORGANOMETALLIC COMPOUNDS, PROCESSES FOR THE PREPARATION THEREOF AND METHODS OF USE THEREOF - This invention relates to organometallic compounds having the formula (L | 08-20-2009 |
20090205968 | ORGANOMETALLIC COMPOUNDS, PROCESSES FOR THE PREPARATION THEREOF AND METHODS OF USE THEREOF - This invention relates to organometallic compounds having the formula (L | 08-20-2009 |
20090208670 | ORGANOMETALLIC COMPOUNDS, PROCESSES FOR THE PREPARATION THEREOF AND METHODS OF USE THEREOF - This invention relates to organometallic compounds having the formula (L | 08-20-2009 |
20090209777 | ORGANOMETALLIC COMPOUNDS, PROCESSES FOR THE PREPARATION THEREOF AND METHODS OF USE THEREOF - This invention relates to organometallic compounds having the formula (L | 08-20-2009 |
20100022083 | CARBON NANOTUBE INTERCONNECT STRUCTURES - A method including forming an interconnect of single-walled carbon nanotubes on a sacrificial substrate; transferring the interconnect from the sacrificial substrate to a circuit substrate; and coupling the interconnect to a contact point on the circuit substrate. A method including forming a nanotube bundle on a circuit substrate between a first contact point and a second contact point, the nanotube defining a lumen therethrough; filling a portion of a length of the lumen of the nanotube bundle with an electrically conductive material; and coupling the electrically conductive material to the second contact point. A system including a computing device comprising a microprocessor, the microprocessor coupled to a printed circuit board, the microprocessor including a substrate having a plurality of circuit devices with electrical connections made to the plurality of circuit devices through interconnect structures including carbon nanotube bundles. | 01-28-2010 |