Scalable up and down nesting integrated electronic enclosures with form factors including asteroids and/or dumbbells and/or approximated tessellation(s)/tiling(s) or combinations thereof with thermal management, wiring, sliding fit, manual and/or automated full range vertical to horizontal positioning, access and structural systems for individual modules and intra-and inter-planar stacks, columns, rows, arrays and associated infrastructures - diagram, schematic, and image 34
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