52nd week of 2010 patent applcation highlights part 32 |
Patent application number | Title | Published |
20100328868 | CIRCUITIZED SUBSTRATES UTILIZING SMOOTH-SIDED CONDUCTIVE LAYERS AS PART THEREOF - A circuitized substrate in which two conductive layers (e.g., electroplated copper foil) are bonded (e.g., laminated) to an interim dielectric layer. Each of the two foil surfaces which physically bond to the dielectric are smooth (e.g., preferably by chemical processing) and include a thin, organic layer thereon, while the outer surfaces of both foils are also smooth (e.g., preferably also using a chemical processing step). One of these resulting conductive layers may function as a ground or voltage plane while the other may function as a signal plane with a plurality of individual signal lines as part thereof. An electrical assembly and an information handling system utilizing such a circuitized substrate are also provided. | 2010-12-30 |
20100328869 | PORTABLE ELECTRONIC DEVICE - A portable electronic device is provided. The portable electronic device includes a frame, a display and at least one spacing element. The display includes a panel, wherein the panel is disposed in the frame. The spacing element is adhered to the frame, and disposed between the frame and the panel. | 2010-12-30 |
20100328870 | INFORMATION PROCESSING APPARATUS - An information processing apparatus includes: a wireless communication unit configured to perform wireless communication with counterpart devices; a housing configured to include the wireless communication unit, the housing being formed with an opening for exposing the wireless communication unit; a lid member configured to be movable between an opened position for opening the opening and a closing position for closing the opening; and an input device configured to receive an input and outputs an operation signal in accordance with the input, the input device being provided on the housing, wherein the input device includes the lid member. | 2010-12-30 |
20100328871 | ELECTRONIC DEVICE WITH DETACHABLE TOUCHPAD - A portable computer includes a main body having a top surface, a keyboard, a touchpad, an ejector assembly, and a latching assembly. A receiving recess and a receiving hole are defined in the top surface. The receiving hole is positioned between the receiving recess and the keyboard and communicates with the receiving recess to form a connecting portion. The touchpad is detachably received in the receiving recess and includes a touchpad body and an engaging member with an engaging portion protruding from the touchpad body adjacent to the keyboard. The ejector assembly includes at least one elastic member. One end of the elastic member is fixed to a side of the receiving recess, and the other end abuts the touchpad body. The latching assembly includes a first restricting member connected to the connecting portion and a second restricting member fixed to the receiving hole and exposed from the receiving hole. | 2010-12-30 |
20100328872 | ADJUSTABLE MOUNT ASSEMBLY - An adjustable mount assembly and a related rack mount system are provided. The adjustable mount assembly is adapted for mounting a user interaction device outward from a cabinet structure comprising a first surface and a second surface adjacent to the first surface. The adjustable mount assembly comprises a moving member movable substantially horizontally with respect to the first surface. The adjustable mount assembly further comprises an adjustable frame member coupled to the moving member for mounting the user interaction device, wherein a length of the adjustable frame member is adjustable with respect to the second surface. In accordance with an embodiment, the adjustable frame member comprises a two-fold sliding track, wherein the two-fold sliding track comprises a first fold slidably mounted on the first surface and a second fold fixedly holding the user interaction device. | 2010-12-30 |
20100328873 | MONITOR - A monitor comprises a back cover defining a depressed portion to receive a hard disk, a motherboard, and a power supply. The depressed portion comprises a bottom board and a side wall connected between the bottom board and a baseboard of the back cover. An opening corresponding to a plurality of input/output interfaces of the motherboard is defined in the side wall of the depressed portion. | 2010-12-30 |
20100328874 | FOLDABLE USB FLASH MEMORY DEVICE - An exemplary USB flash memory device includes a main body, a bending portion, a memory unit, and a connector. The main body includes a front wall, a back wall, and two side walls between the front and back walls. A transverse width of each of the front wall and the back wall is larger than a transverse width of each side wall. The bending portion is pivotably connected to the main body, a rotation axis of the bending portion is substantially perpendicular to the front wall and the back wall of the main body. The memory unit is received in the main body. The connector is electrically connected to the memory unit, the connector is secured to an end of the bending portion farthest away from the main body. | 2010-12-30 |
20100328875 | REMOVABLE MODULE FOR A CONSOLE - A housing, which may contain a hard disk drive, is configured to removably mount to a recessed surface of a console. The housing includes a lip and a biased latch arm so that the lip can be inserted into a corresponding feature in the recessed surface and the housing can be rotatably mounted to the recessed surface. The biased latch arm is retained by a latch arm retainer so that the housing is held in place. A cable connector extends from the bottom of the housing and is configured to connect to a receptor on the console when the housing is installed. When desired, a latch on the housing can be translated where the translation cause the biased latch arm to translate so as to clear the latch arm retainer. Thus the housing can be readily removed from the console. Preferably a portion of the housing extends beyond a wall of the recessed surface so that when installed, the housing alters the profile of the console. | 2010-12-30 |
20100328876 | Ejection Mechanisms For Computer Equipment - In one embodiment, an ejection mechanism for ejecting a removable module from a piece of equipment includes a two-part ejection lever including a first lever portion that is snap fit to a second lever portion, wherein the first lever portion can separate from the second portion when a user pulls on the ejection lever in an attempt to eject the removable module when the module has been locked within the equipment. | 2010-12-30 |
20100328877 | METHODS AND DEVICES FOR FORCED AIR COOLING OF ELECTRONIC FLIGHT BAGS - An electronic flight bag computer (EFB) includes a housing defining first and second compartments that are fluidly isolated from and in thermal communication with one another. The first compartment contains electronic components connected to a user interface on an exterior portion of the housing for providing interactive flight related computation functions to a user. The second compartment contains a forced convection cooling component in thermal communication with the electronic components. The forced convection cooling component directs a flow of cooling fluid into the second compartment to convey heat produced by the electronic components out of the housing, such that the cooling fluid in the second compartment remains fluidly isolated from the electronic components in the first compartment of the housing. | 2010-12-30 |
20100328878 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus includes an enclosure, printed wiring board, electronic component, fan, duct, fin assembly, and heat pipe. The enclosure has an exhaust port in a sidewall thereof. The electronic component is mounted on the printed wiring board. The fan is placed in the vicinity of the exhaust port. The duct guides an airflow generated by the fan to the exhaust port. The fin assembly constituted of a plurality of fins, is arranged between an exit of the duct and the exhaust port, and includes an extension portion. A part of the extension portion extends to a range configured to overhang the printed wiring board. | 2010-12-30 |
20100328879 | ELECTRONIC DEVICE WITH SELECTABLE BATTERY CONNECTION STRUCTURE - An electronic device includes a back cover, a mounting frame fixed to inner surface of the back cover, a battery connector, a sliding member, and a driving member. The battery connector is fixed to the sliding member and is configured for connecting to a battery of the electronic device. The mounting frame includes a guide portion. The driving member driving member is connected to the back cover 20 and externally accessible and is capable of rotating in response to user operation; the sliding member is configured for moving only along the guide portion; when the driving member is rotated, the driving member drives the sliding member to move and then establish or discontinue the connection between the battery connector and the battery. | 2010-12-30 |
20100328880 | COMPUTER SYSTEM - A computer system is provided. The computer system includes a chassis, a motherboard secured in the chassis, and a mounting bracket. A connector is arranged on the motherboard, and a riser card is inserted in the connector. The mounting bracket is secured to the chassis and located above the motherboard. The computer system further includes a positioning member attached to the riser card. The positioning member has two opposite side plates. One of the side plates is secured to the second riser card, and the other side plate is secured to the mounting bracket. | 2010-12-30 |
20100328881 | ELECTRONIC DEVICE - An electronic device is directly disposed on a lamp base and is powered by the lamp base. The electronic device includes a connection base matching with a specification of the lamp base, and an air-flow generator. The connection base may be directly screwed into the lamp base to power the air-flow generator, so that the air-flow generator operates to generate an air flow. | 2010-12-30 |
20100328882 | DIRECT JET IMPINGEMENT-ASSISTED THERMOSYPHON COOLING APPARATUS AND METHOD - Cooling apparatuses and methods are provided for facilitating cooling of an electronic device utilizing a cooling subassembly, a pump and a controller. The cooling subassembly includes a jet impingement structure, and a thermosyphon. The jet impingement structure directs coolant into a chamber of the subassembly onto a surface to be cooled when in a jet impingement mode, and the thermosyphon, which is associated with the chamber, facilitates convective cooling of the surface to be cooled via boiling of coolant within the chamber when in a thermosyphon mode. The controller, which is coupled to the pump to control activation and deactivation of the pump, also controls transitioning between the jet impingement mode and the thermosyphon mode based on a sensed temperature of the electronic device. | 2010-12-30 |
20100328883 | Pluggable Power Cell For An Inverter - In one embodiment, a power cell chamber for a drive system includes moveable and fixed portions. The moveable portion includes a rectifier stage to rectify an input signal received from a secondary winding of a transformer to provide a rectified signal and an inverter stage having a plurality of switching devices to receive a DC signal and output an AC signal. This moveable portion can be slidably adapted within a cabinet of the drive system. In turn, the fixed portion includes a DC link having at least one capacitor to receive the rectified signal and provide the DC signal to the inverter stage. | 2010-12-30 |
20100328884 | ELECTRIC EQUIPMENT - An electric equipment includes: first opening | 2010-12-30 |
20100328885 | Rotatable Cooling Module - A rotatable cooling module includes a cooling coil. An input line is coupled to the cooling coil via a coupler that allows the cooling coil to rotate independent of the input line. An output line is coupled to the cooling coil via a second coupler that allows the cooling coil to rotate independent of the output line. A coolant flows through the input line and the first coupler and passes through the cooling coil, which removes heat from an electronic assembly to which the cooling unit is attached. The coolant then flows through the second coupler and through the output line and returns to a heat exchanger, which cools the liquid before recirculating through the cooling unit. The couplers are disposed about a single axis which allows the cooling module to be rotated, and the couplers prevent damage from occurring to any of the elements of the cooling module. | 2010-12-30 |
20100328886 | SINGLE FAN TRAY IN A MIDPLANE ARCHITECTURE - A chassis may include a front section that contains a first electronic circuit board oriented in a first plane, a rear section that contains a second electronic circuit board oriented in a second plane, where the first plane and the second plane are substantially orthogonal, a midplane dividing the front and the rear sections, and a fan tray assembly including a plurality of fans to cool both the first electronic circuit board of the front section and the second electronic circuit board of the rear section. | 2010-12-30 |
20100328887 | Heat Sink for a Circuit Device - Various heat sinks, method of use and manufacture thereof are disclosed. In one aspect, a method of providing thermal management for a circuit device is provided. The method includes placing a heat sink in thermal contact with the circuit device wherein the heat sink includes a base member in thermal contact with the circuit device, a first shell coupled to the base member that includes a first inclined internal surface, a lower end and first plurality of orifices at the lower end to enable a fluid to transit the first shell, and at least one additional shell coupled to the base member and nested within the first shell. The at least one additional shell includes a second inclined internal surface and a second plurality of orifices to enable the fluid to transit the at least one additional shell. The fluid is moved through the first shell and the at least one additional shell. | 2010-12-30 |
20100328888 | COOLING APPARATUS WITH THERMALLY CONDUCTIVE POROUS MATERIAL AND JET IMPINGEMENT NOZZLE(S) EXTENDING THEREIN - A cooling apparatus and method of fabrication are provided for facilitating cooling of an electronic device. The cooling apparatus includes a thermally conductive porous material and a liquid coolant supply. The thermally conductive porous material (such as metal foam material) is coupled to a surface of the electronic device to be cooled, or a structure coupled to the electronic device. The liquid coolant supply includes a jet impingement structure, which includes one or more jet nozzles for directing liquid coolant onto the surface to be cooled. The jet nozzle(s) extends into the thermally conductive porous material, and facilitates delivery of liquid coolant onto the surface to be cooled. The thermally conductive porous material is in thermal contact with the surface to be cooled and facilitates cooling of the electronic device by boiling of the liquid coolant passing through the porous material. | 2010-12-30 |
20100328889 | COOLED ELECTRONIC MODULE WITH PUMP-ENHANCED, DIELECTRIC FLUID IMMERSION-COOLING - Cooled electronic modules and methods of fabrication are provided with pump-enhanced, dielectric fluid immersion-cooling of the electronic device. The cooled electronic module includes a substrate supporting an electronic device to be cooled. A cooling apparatus couples to the substrate, and includes a housing configured to at least partially surround and form a sealed compartment about the electronic device. Additionally, the cooling apparatus includes dielectric fluid and one or more pumps disposed within the sealed compartment. The dielectric fluid is in direct contact with the electronic device, and the pump is an impingement-cooling, immersed pump disposed to actively pump dielectric fluid within the sealed compartment towards the electronic device. Multiple condenser fins extend from the housing into the sealed compartment in an upper portion of the sealed compartment, and a liquid-cooled cold plate or an air-cooled heat sink is coupled to the top of the housing for cooling the condenser fins. | 2010-12-30 |
20100328890 | CONDENSER STRUCTURES WITH FIN CAVITIES FACILITATING VAPOR CONDENSATION COOLING OF COOLANT - Vapor condensers and cooling apparatuses are provided which facilitate vapor condensation cooling of a coolant employed in cooling an electronic device. The vapor condenser includes a thermally conductive base structure with a plurality of condenser fins extending from the base structure. The condenser fins have a proximal end coupled to the base structure and a remote end remote from the base structure. At least one exposed cavity is provided within each condenser fin extending from the remote end towards the proximal end. The exposed cavities are sized to provide greater condenser fin surface area for facilitating vapor condensate formation, and thereby facilitate cooling of an electronic device using a two-phase coolant. | 2010-12-30 |
20100328891 | CONDENSER BLOCK STRUCTURES WITH CAVITIES FACILITATING VAPOR CONDENSATION COOLING OF COOLANT - Condenser structures and cooling apparatuses are provided which facilitate vapor condensation heat transfer of a coolant employed in cooling an electronic device. The condenser structure includes a thermally conductive condenser block with multiple exposed cavities therein extending from a first main surface towards a second main surface. The condenser block is a monolithic structure, and the first main surface is a coolant vapor condensate formation surface when the condenser structure is operationally facilitating cooling of an electronic device. The exposed cavities extend from the first main surface into the condenser block to increase a condensation surface area of the condenser block, thereby facilitating coolant vapor condensate formation on the condenser block, and thus cooling of the electronic device using a two-phase coolant. The condenser structure also includes coolant-carrying channels for facilitating cooling of the condenser block, and thus vapor condensate formation on the condenser block. | 2010-12-30 |
20100328892 | MOLDED HEAT SINK AND METHOD OF MAKING SAME - A heat sink for use with a heat generating component includes a molded cooling block including a molded cooling passage for receiving a cooling medium. The cooling block is configured to be positioned in sufficient heat transfer relationship with respect to the heat generating component so that the cooling medium receives heat from the heat generating component. | 2010-12-30 |
20100328893 | COOLING DEVICE FOR SEMICONDUCTOR ELEMENT MODULE AND MAGNETIC PART - A cooling device for a semiconductor element module and a magnetic part, includes: a water-cooled type heat sink having a cooling water passage; a semiconductor element module including a plurality of chips arranged side by side in a circulation direction in the cooling water passage, the semiconductor element module being mounted on the heat sink; and a magnetic part including a core and a winding portion mounted on the core, the magnetic part being mounted on the heat sink or another heat sink. In the cooling device, a plurality of cooling fins is disposed to extend along the circulation direction in the cooling water passage in a manner that the plurality of cooling fins are separated into groups for the respective chips arranged side by side in the circulation direction, and that the groups of the cooling fins are offset from each other in a direction perpendicular to the circulation direction. Accordingly, it is possible to have improved cooling efficiency of a heat sink with cooling fins. | 2010-12-30 |
20100328894 | OPTICAL INTERCONNECTION DEVICE - Provided is an optical interconnection device in which a volume required for cooling is reduced. In the optical interconnection device, a plurality of optical modules ( | 2010-12-30 |
20100328895 | Composite, Thermal Interface Material Containing the Composite, and Methods for Their Preparation and Use - A composite includes a thermally conductive metal matrix and silicone particles dispersed therein. The composite can be used to form a thermal interface material in an electronic device. The composite can be used for both TIM1 and TIM2 applications. | 2010-12-30 |
20100328896 | ARTICLE INCLUDING THERMAL INTERFACE ELEMENT AND METHOD OF PREPARATION - An article and method of forming the article is disclosed. The article includes a heat source, a heat-sink, and a thermal interface element having a plurality of freestanding nanosprings, a top layer, and a bottom layer. The nanosprings, top layer, and the bottom layers of the article include at least one inorganic material. The article can be prepared using a number of methods including the methods such as GLAD and electrochemical deposition. | 2010-12-30 |
20100328897 | HEAT SINK ASSEMBLY WITH TEMPERATURE DISPLAY - A heat sink assembly dissipates heat of a chip on a circuit board. A temperature collecting module of the heat sink assembly senses temperature of the chip and generates corresponding analog signals. A display module of the heat sink assembly receives the analog signals and converts the analog signals into digital signals, and then displays the digital signals with temperature unit symbol. | 2010-12-30 |
20100328898 | Integrated Circuits Having Interconnects and Heat Dissipators Based on Nanostructures - The present invention provides for nanostructures grown on a conducting or insulating substrate, and a method of making the same. The nanostructures grown according to the claimed method are suitable for interconnects and/or as heat dissipators in electronic devices. | 2010-12-30 |
20100328899 | VLSI HOT-SPOT MINIMIZATION USING NANOTUBES - The invention relates to a semiconductive device comprising a die with at least one defined hot-spot area lying in a plane on the die and a cooling structure comprising nanotubes such as carbon nanotubes extending in a plane different than the plane of the hot-spot area and outwardly from the plane of the hot-spot area. The nanotubes are operatively associated with the hot-spot area to decrease any temperature gradient between the hot-spot area and at least one other area on the die defined by a temperature lower than the hot-spot area. A matrix material comprising a second heat conducting material substantially surrounds the nanotubes and is operatively associated with and in heat conducting relation with the other area on the die defined by a temperature lower than the hot-spot area. The heat conductivity of the nanotubes is greater than the heat conductivity of the matrix material, with the distal ends of the nanotubes exposed to present a distal surface comprising the first heat conducting means for direct contact with a medium comprising a cooling fluid. The inventors also disclose processes for manufacturing and using the device and products produced by the processes. | 2010-12-30 |
20100328900 | Apparatus - An apparatus including: an intermediate chassis configured to move in at least a first direction and configured to define a reaction surface; a movable chassis configured to move in at least a second direction orthogonal to the first direction and configured to define a follower wherein the reaction surface and follower interact to convert movement of the intermediate chassis and reaction surface in the first direction to movement of the follower and movable chassis in the second direction. Also, an apparatus including a first movable housing portion having side faces including one or more interface components; and a second housing portion; wherein the first movable housing portion is movable relative to the second housing portion between a compact configuration in which the one or more interface components are obscured by the second housing portion and an expanded configuration in which the one or more interface components are exposed. | 2010-12-30 |
20100328901 | LINKED SEMICONDUCTOR MODULE UNIT AND ELECTRONIC CIRCUIT-INTEGRATED MOTOR VEHICLE DEVICE USING SAME - A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts. | 2010-12-30 |
20100328902 | Coil Transducer Isolator Packages - In an embodiment, the invention provides a coil transducer isolator package comprising at least one lead frame, at least two integrated circuits (ICs) and a flex circuit comprising at least a first coil transducer. The first coil transducer comprises at least one metal coil. The coil transducer isolator package is fabricated such that no portion of the lead frame is physically located within a spatial volume extending substantially perpendicular to the at least one metal coil. The boundaries of the spatial volume are defined by a periphery of the at least one metal coil. At least one of the two ICs is at least partially located within the spatial volume extending substantially perpendicular to the at least one metal coil. | 2010-12-30 |
20100328903 | CIRCUIT BOARD MODULE AND ELECTRONIC APPARATUS - A circuit board module includes: a board having a mounting surface; an electronic component mounted on the mounting surface; a frame which is mounted on the mounting surface so as to surround the electronic component; a resin portion which is provided inside the frame and closely contacts the electronic component, the mounting surface, and the frame; and a lid portion which covers the electronic component, and which is connected to the frame. The lid portion includes a flat portion which is provided at a region containing an area corresponding to the electronic component not covered with the resin portion and which protrudes outward more than the other regions. | 2010-12-30 |
20100328904 | ELECTRONIC DEVICE - According to one embodiment, an electronic device includes a housing, a first substrate having rigidity and including a slit, contained in the housing, a part mount portion provided on the first substrate and adjacent to the slit, an electronic part mounted on the part mount portion and a second substrate having flexibility. The second substrate is stacked on an inside of the first substrate and an inside of the part mount portion, and it crosses the slit, thereby supporting the part mount portion to be displaceable with respect to the first substrate. | 2010-12-30 |
20100328905 | ELECTRONIC DEVICE - An electronic device includes a bracket, a rear plane, a mounting member, and a middle plane. The bracket is configured for receiving at least one hard disk drive therein, and includes a bottom plate. The rear plane is secured to the bracket. The mounting member secures the middle plane to the bottom plate, so that the middle plane is perpendicular to the bottom plate and parallel to the rear plane. | 2010-12-30 |
20100328906 | ELECTRONIC DEVICE WITH A MOTHERBOARD WATERPROOFING MECHANISM - An electronic device includes: first and second housing bodies cooperating to form an inner receiving space; a motherboard disposed in the inner receiving space, partitioned by a partition line into a port zone having at least one input/output connector, and a non-port zone; first and second waterproof strips disposed respectively between the first housing body and the motherboard and between the second housing body and the motherboard, and disposed at the partition line, the second waterproof strip having opposite ends formed with respective extension parts extending perpendicularly toward the first waterproof strip and disposed at the peripheral edge of the motherboard; and a third waterproof strip connected to the first waterproof strip to form a closed seal ring therewith, disposed between the first and second housing bodies, and disposed at an outer side of a peripheral edge of the non-port zone. | 2010-12-30 |
20100328907 | POSITIONING STRUCTURE FOR PORTABLE ELECTRONIC DEVICE - A positioning structure for portable electronic device includes two latching elements and a positioning element. Each latching element includes a blocking portion. The positioning element includes a cover portion and two fixing portions formed at two ends thereof. The cover portion defines a plurality of cavities for receiving electronic components. Each fixing portion defines a hole, and the blocking portion is received in the hole. | 2010-12-30 |
20100328908 | BUSBAR-BLOCK MOUNTING STRUCTURE - In order to readily and securely mount, for example, a fuse block to a cover and readily accommodate increase in the number of circuits, bus bars each having on one side a terminal portion for connection of an electrical component and on the other side a terminal portion for connection of circuit board are provided in an insulating block body parallel to each other to constitute a busbar block. The bus bars are prevented from uplifting by virtue of a rib integral with the block body. Recessed portions for positioning are provided in an insulating cover corresponding to the ribs, and at the same time as the busbar block is attached to the cover, the ribs are brought into engagement with the recessed portions to provide positioning of the busbar block. Terminal block constructed by terminals each having on one end thereof a terminal portion for connection of an electrical component and on the other side thereof a terminal portion for connection of circuit board | 2010-12-30 |
20100328909 | ELECTRONIC APPARATUS - An electronic apparatus comprises a body chassis to which a cabinet is fastened by a screw, the screw is screwed from outside of the cabinet into a boss made of synthetic resin on the body chassis to pass through the boss, the body chassis is provided with a component having a metal surface arranged thereon, and the screw includes a tip opposed to the metal surface of the component. The body chassis is provided with a grounded metal plate arranged thereon, on which a projection intervening between the tip of the screw and the metal surface of the component is formed, the projection includes a through-hole through which the tip of the screw can pass, and the smallest gap length between inner peripheral surface of the through-hole and the screw is set to be smaller than the smallest gap length between the metal surface of the component and the screw. | 2010-12-30 |
20100328910 | AUTOMATION APPLIANCE - An automation appliance with at least one wireless communication interface has electronics arranged on a printed circuit board, where the printed circuit board is in a housing having externally accessible plug connectors. A plug connector is connected to the communication interface electronics and is aligned adjacent to the printed circuit board in the area of the interface electronics. The plug connector has a center contact for RF signal connection surrounded by outer contacts that provide RF shielding. Another plug connector of similar mechanical design is also provided which provides for cable based communications interface and is not a RF plug. | 2010-12-30 |
20100328911 | MOBILE DIGITAL VIDEO RECORDER - A mobile digital video recorder (MDVR) has a hollow shell, two board tracks, two brackets, a main board, power board, VSM board, and a storage device. The board tracks and the brackets are attached securely in the shell. The main board is mounted slidably and detachably in the shell via the tracks. The power board is mounted slidably and detachably in the shell via the tracks. The VSM board is mounted slidably and detachably in the shell via the tracks. The storage device is mounted slidably and detachably in the shell via the brackets. Therefore, the main board, power board, VSM board and the storage device are easily pulled out from the shell for repairing, replacing, or upgrading to new technology. | 2010-12-30 |
20100328912 | Method for Mechanical Packaging of Electronics - Electronics mounted on a printed circuit board are housed within a high conductivity case with connecting pins extending therethrough. The case is filled with thermally conductive potting material to provide thermal conduction from the printed circuit board to the case. The case may be a conduit having open ends through which the printed circuit board is inserted or it may comprise a cover mounted to a base plate. | 2010-12-30 |
20100328913 | METHOD FOR THE PRODUCING AN ELECTRONIC SUBASSEMBLY, AS WELL AS ELECTRONIC SUBASSEMBLY - In a method for producing an electronic subassembly, at least one electronic component is mounted on an insulating layer of a conductive foil in a first step, the active side of the electronic component pointing in the direction of the conductive foil. In a second step, the conductive foil having the at least one electronic component mounted thereon is laminated to a circuit board substrate, the at least one electronic component pointing in the direction of the circuit board substrate. Finally, circuit tracks are developed by patterning the conductive foil, and the at least one electronic component is contacted. | 2010-12-30 |
20100328914 | Placement Method of an Electronic Module on a Substrate and Device Produced by Said Method - The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved by a placement process on a support, called substrate, of at least one electronic assembly consisting of a chip including at least one electric contact on one of its faces, said contact being connected to a segment of conductive track, and said placement being carried out by means of a placement device holding and positioning said assembly on the substrate, comprising the following steps:
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20100328915 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A printed circuit board has a core substrate including a resin substrate having an opening, a capacitor formed in the opening and having a first electrode structure having a portion facing to the upper surface of the core substrate and a second electrode structure having a portion facing to the lower surface of the core substrate, an upper insulating layer formed over the upper surface of the core substrate and having a conductive circuit formed over the upper insulating layer and a via hole electrically connecting the portion of the first electrode structure and the conductive circuit of the upper insulating layer, and a lower insulating layer formed over the lower surface of the core substrate and having a conductive circuit formed over the lower insulating layer and a via hole electrically connecting the portion of the second electrode structure and the conductive circuit of the lower insulating layer. | 2010-12-30 |
20100328916 | SEMICONDUCTOR DEVICE - A protection circuit used for a semiconductor device is made to effectively function and the semiconductor device is prevented from being damaged by a surge. A semiconductor device includes a terminal electrode, a protection circuit, an integrated circuit, and a wiring electrically connecting the terminal electrode, the protection circuit, and the integrated circuit. The protection circuit is provided between the terminal electrode and the integrated circuit. The terminal electrode, the protection circuit, and the integrated circuit are connected to one another without causing the wiring to branch. It is possible to reduce the damage to the semiconductor device caused by electrostatic discharge. It is also possible to reduce faults in the semiconductor device. | 2010-12-30 |
20100328917 | MULTICHIP MODULE, PRINTED CIRCUIT BOARD UNIT, AND ELECTRONIC APPARATUS - A multichip module includes a package substrate, a first semiconductor device, a second semiconductor device and a conductive bump. The first semiconductor device is flip-chip bonded to the package substrate. The first semiconductor device includes a first chip pad on a surface thereof. The second semiconductor device is mounted on the first semiconductor device. The second semiconductor device includes a second chip pad facing the first chip pad. The conductive bump connects the first chip pad to the second chip pad. The conductive bump includes a first metallic body that has a first diffusion rate and a second metallic body that has a second diffusion rate lower than the first diffusion rate. | 2010-12-30 |
20100328918 | COMPOSITE STRUCTURE OF ELECTRONIC COMPONENT AND SUPPORTING MEMBER - A composite structure includes an electronic component and a supporting member. The electronic component includes a main body and a plurality of pins extended outwardly from the main body. The supporting member includes a first supporting part and a second supporting part. The first supporting part is foldable with respect to the second supporting part. The main body of the electronic component is accommodated within the first supporting part of the supporting member. The pins are accommodated with the second supporting part of the supporting member. The first supporting part is folded with respect to the second supporting part such that the pins are bent to define a bent structure. | 2010-12-30 |
20100328919 | METHOD OF MAKING A FIBER REINFORCED PRINTED CIRCUIT BOARD PANEL AND A FIBER REINFORCED PANEL MADE ACCORDING TO THE METHOD - A method of making a printed circuit board panel, a printed circuit board panel made according to the method, and a system incorporating a printed circuit board provided onto the panel. The printed circuit board panel has a panel top edge, a panel bottom edge parallel to the panel top edge, and two parallel panel side edges, and further includes a first set of fiber bundles extending at the predetermined angle with respect to the panel side edges, and a second set of fiber bundles extending at the predetermined angle with respect to the panel top edge. | 2010-12-30 |
20100328920 | High-speed transmission circuit board connection structure - A high-speed transmission circuit board connection structure includes a first high-speed transmission circuit board including a laminated substrate including a first signal transmission wiring formed on a surface thereof and a ground plane formed inside thereof, a second high-speed transmission circuit board including a circuit substrate and a second signal transmission wiring formed on a surface of the circuit substrate, a conductive board connecting member for fixing the first and second high-speed transmission circuit boards to a surface thereof, and a bonding wire for electrically connecting the first signal transmission wiring and the second signal transmission wiring. The ground plane is exposed on a side end face of the laminated substrate, and a conductive film is formed on the side end face such that the ground plane of the first high-speed transmission circuit board is electrically connected to the board connecting member with the conductive film. | 2010-12-30 |
20100328921 | IMAGE DISPLAY ELEMENT AND MANUFACTURING METHOD THEREOF - An image display element includes: a front panel; a back panel opposite thereto; plural pixels arranged in a matrix between the panels; and plural electrodes for controlling the pixels. The panels are bonded with the pixels and the electrodes interposed therebetween. The electrodes are connected to a driving circuit via metal film wires. The back panel is divided so as to expose electrode terminals, and a groove part V-shaped in cross section is formed at the divided portion. The metal film wires are formed on the top surface of the back panel, and the electrode terminals and the metal film wires are connected by a conductive paste coated along the tilt surfaces forming the groove part. A contact resistance reducing means is disposed at the connection part interface between the electrode terminal and the conductive paste. | 2010-12-30 |
20100328922 | Security Document - A security document ( | 2010-12-30 |
20100328923 | MULTIPLE LAYER PHOSPHOR BEARING FILM - A multiple layer phosphor bearing film having a phosphor bearing layer comprising phosphor. The film may also have an optical layer having a refractive index that is higher than a refractive index for the phosphor bearing layer. The phosphor beraing layer may be adhesive to enable the film to be applied to a light source. | 2010-12-30 |
20100328924 | LIGHTED UMBRELLA - Lighted umbrella ( | 2010-12-30 |
20100328925 | ILLUMINATION DEVICE WITH LED AND A TRANSMISSIVE SUPPORT COMPRISING A LUMINESCENT MATERIAL - The invention provides an illumination device ( | 2010-12-30 |
20100328926 | ILLUMINATION DEVICE WITH LED AND ONE OR MORE TRANSMISSIVE WINDOWS - The invention provides an illumination device ( | 2010-12-30 |
20100328927 | FRAME STRUCTURE, BACKLIGHT MODULE AND DISPLAY MODULE - A frame structure includes a frame body and fixing structures. The frame structure has an inner edge, an end edge and an outer edge. The fixing structures are disposed on two opposite sides of the frame body respectively, wherein each fixing structure includes a first protrusion, a second protrusion and a stopper portion. One end of the first protrusion or one end of the second protrusion connects to the inner and the end edges to form a containing cavity. The stopper portion is located inside the containing cavity and arranged in parallel to the first and the second protrusions. The lengths of the first and the second protrusions are respectively “L | 2010-12-30 |
20100328928 | LIGHT SOURCE AND DEVICE HAVING THE SAME - Deterioration of the whole electroluminescence layer which is caused by moisture penetration through the electroluminescence layer because of a pinhole in an electrode is prevented. A plurality of island-shaped electroluminescence layers are provided. That is, an electroluminescence layer is divided into plural layers. In addition, the plurality of island-shaped electroluminescence layers are interposed between a pair of common electrodes. Accordingly, even when moisture penetrates into one of the island-shaped electroluminescence layers, moisture does not penetrate into another of the island-shaped electroluminescence layers. | 2010-12-30 |
20100328929 | HAND-HELD POWER TOOL - A hand-held power tool includes a housing with a tool fitting for receiving an insertion tool, and at least one illuminating element for illuminating the working area of the hand-held power tool; wherein the at least one illuminating element is located in the region of the tool fitting. | 2010-12-30 |
20100328930 | Energy-saving fluorescent lamp - This invention relates to an energy-saving fluorescent lamp in which a solar energy collection unit is provided on the reflection hood of the fluorescent lamp, the solar energy collection unit being connected to a power storage unit through the circuit of a light-to-electricity converting unit, the power storage unit being capable of supplying electricity to the fluorescent lamp tube, a control unit being further provided between the power storage unit and the fluorescent lamp tube, the power storage unit being controlled by the control unit in such a manner that the power is supplied to the tube only when the power storage unit is stored with electricity, otherwise the tube being still supplied with electricity of utility power. In this manner, energy-saving effect can be achieved. | 2010-12-30 |
20100328931 | Solar Light Assembly for Street and Park Lighting - The present solar light assembly uses a unique housing having a light that can be adjustably rotated and tilted for park and street lighting applications. Once assembled, the housing is covered by a solar panel that charges a remotely located battery and acts as a protective lid over the housing. Rather than removing the solar panel to access the contents of the housing, the housing can be accessed by excessively tilting the light until a shroud swings away from an opening in the housing designed to accommodate the light. The shroud, which can retract into the housing, protects the contents of the housing from inclement weather and from view. When the light is excessively tilted, the shroud swings away from the housing to expose wires, electronics and other contents of the housing that may require servicing. Because a solar light system is pole mounted at least several meters above ground level, being able to easily access the housing from below without needing to remove any heavy or awkward parts provides a much safer alternative than other solar light systems. | 2010-12-30 |
20100328932 | Solar Light Assembly for Street and Park Lighting - The present solar light assembly uses a unique housing having a light that can be adjustably rotated and tilted for park and street lighting applications. Once assembled, the housing is covered by a solar panel that charges a remotely located battery and acts as a protective lid over the housing. Rather than removing the solar panel to access the contents of the housing, the housing can be accessed by excessively tilting the light until a shroud swings away from an opening in the housing designed to accommodate the light. The shroud, which can retract into the housing, protects the contents of the housing from inclement weather and from view. When the light is excessively tilted, the shroud swings away from the housing to expose wires, electronics and other contents of the housing that may require servicing. Because a solar light system is pole mounted at least several meters above ground level, being able to easily access the housing from below without needing to remove any heavy or awkward parts provides a much safer alternative than other solar light systems. | 2010-12-30 |
20100328933 | Lighting System - A lighting system hardware and control are described. Advantages of the system include the ability to add lighting to an otherwise unmodified location by providing a clamping system that is adaptable to multiple configurations and remote operability. Remote operability includes the ability to use renewable power sources such as solar or wind power and the ability for self-calibration with respect to the time of day. The system also minimizes the number of circuit components required thus making it optimally inexpensive and reliable. | 2010-12-30 |
20100328934 | Self-Powered Luminant Banner - A self-powered luminant banner is provided, including at least a brace, at least a blade, and a controller. The blade is attached to the brace with at least one side. The blade further includes at least an embedded piezoelectric transducer and at least a luminous element attached to the blade. The piezoelectric transducer embedded in the blade has related circuitry for electrically connecting to the controller so that the controller can power the luminous element and control the luminance of luminous element or store the excessive power. When the banner of the present invention is deformed or vibrates due to the airflow, the embedded transducer will transforms the mechanical energy into electrical energy to power the luminous element. In comparison with the conventional banner that requires extra lights connected to a power cable, the self-powered luminant banner of the present invention is both convenient to use and cost-effective, as well as provides safer application. | 2010-12-30 |
20100328935 | MULTICOLOR LIGHTING SYSTEM - A system for displaying multiple colors individually or in combination with one another. The system may emit red, green and blue light from light emitting diodes and may additionally provide white light to brighten the color provided by the red, green and blue light emitting diodes. The white light source may also be used to increase the power efficiency of the system, thus increasing the lifetime of the system for displaying multiple colors. The white light source may be used to backlight the color provided by the red, green and blue light emitted by the light emitting diodes, or may also be used as an additional light source to the light provided by the red, green and blue light emitting diodes. | 2010-12-30 |
20100328936 | MULTICOLOR LIGHT EMITTING DIODES - A device such as a multicolor light emitting diode that emits different colors of light and that may combine the different colors emitted by individual light emitting diodes. The multicolor LED may include a common anode terminal that may be connected to each anode of the individual light emitting diodes. The multicolor LED may be a five terminal multicolor LED. Additionally, the multicolor LED may include two anode terminals, in which the first anode terminal may be a common anode terminal connected to three of the individual color LEDs and the second anode terminal may be connected to an anode of a white LED. In this embodiment, the multicolor LED may be a six terminal multicolor LED. | 2010-12-30 |
20100328937 | METHOD AND APPARATUS FOR GENERATING MONOCHROMATIC OR POLYCHROMATIC RADIATION - A method and apparatus involve a radiation source assembly that outputs radiation along an output path of travel, and that has a support section configured to facilitate support of the assembly so that a position of the assembly can be adjusted approximately pivotally about the output path of travel. According to a different aspect, a method and apparatus involve: generating radiation with a radiation source in a radiation source assembly that is a modular unit; emitting this radiation approximately in a direction; supporting the radiation source near an input port of a radiation guide so that the radiation from the radiation source enters the input port, and so that the radiation source is positionally adjustable toward and away from the input port parallel to the direction; and supplying radiation through the radiation guide from the input port to an output port thereof. | 2010-12-30 |
20100328938 | LED LIGHTING MODULE WITH LARGE LIGHT EMITTING ANGLE - An LED lighting module includes a base, a plurality of first LEDs disposed on a top side of the base, and a plurality of reflectors disposed on the top side of the base. The reflectors correspond to the first LEDs, respectively, whereby light generated by the first LEDs can illuminate an area to which a bottom side of the base faces. A plurality of second LEDs are disposed on the top side of the base and located within the reflectors. | 2010-12-30 |
20100328939 | LED ILLUMINATION MODULE WITH LARGE LIGHT EMITTING ANGLE - An LED illumination module includes a base, a plurality of first LEDs disposed on a top side of the base and a reflecting barrel disposed on the top side of the base. The first LEDs are disposed outside of the reflecting barrel, whereby light generated by the first LEDs is reflected by the reflecting barrel to illuminate a space below a bottom side of the base. | 2010-12-30 |
20100328940 | LENS, LED MODULE AND ILLUMINATION APPARATUS UTILIZING THE SAME - An LED module includes an LED and a lens combined with the LED. The lens includes a light input face for light from the LED entering into the lens and a light output face refracting the light from the light input face. The light output face includes a first light output face continuously distributed thereon and a plurality of second light output faces inwardly recessed from the first light output face. The second light output faces can deflect the light extending therethrough toward a predefined area where the light extending through the first light output face is focused. An illumination apparatus utilizing the LED module is also provided. | 2010-12-30 |
20100328941 | LED MODULE - An LED module includes an LED and a lens fixed with the LED for refracting light emitted by the LED. The lens has a center axis and a concaved inner face for incidence of the light and an opposite convex outer face for the light refracting out thereof. The lens is symmetric to a first plane and a second plane perpendicularly intersected with the first plane at the center axis. In the first plane, a peak intensity for the LED occurs within 68-78 degrees off the center axis. In the second plane, a peak intensity occurs within 0-22 degrees off the center axis. | 2010-12-30 |
20100328942 | Ceramic radiator with conductive circuit - A ceramic radiator with conductive circuit uses the ceramic with high conductive ceramic and better radiation physical characteristics to manufacture the one-body-shaped radiator. The radiator has front side, back side and ends. The conductive circuit is set on the front side of the radiator to enable one or more LED lights installed thereon lightened. Several sets of the heat sinks are installed on the back side and the ends to increase the efficiency of heat dissipating. A lamp mask covers the LED lights. The ceramic radiator may remove its lamp mask when placed indoors. | 2010-12-30 |
20100328943 | LIGHTING DEVICE - Provided is a lighting device having high luminance in-plane uniformity without a dark part occurring at a connecting part between surface light source panels. | 2010-12-30 |
20100328944 | LIGHTING ELEMENT - A lighting element for which it is possible to assemble various lighting arrangements includes at least one light source, a reflecting surface and elements for supplying power to the light source, which is kept substantially above the reflecting surface supported by a support element, whereby light emitted everywhere by the light source can be effectively utilized. The reflecting surface directs the light substantially in the lighting direction of the lighting element past the light source. Around the light source, there is a collar structure manufactured of light-reflecting material which controls the light substantially in the lighting direction. Covers and a stand of the lighting elements are designed such that it is possible to join the lighting elements together to form a lighting arrangement. In the reflecting surface, there can be a protrusion which reflects light fallen on it past the light source in the lighting direction. The light sources obtain their power via the support elements. | 2010-12-30 |
20100328945 | LED LAMP - An LED (light emitting diode) lamp includes a lamp body, a plurality of fixing assemblies fixed to a top of the lamp body and a plurality of fasteners fixed to the fixing assemblies. The lamp body comprises a housing defining a plurality of runners in a top thereof and a light emitting module mounted in a bottom of the housing and applying an LED module as a light source. The fixing assemblies are placed on the top of the housing. Each fastener has a head located at an underside of a corresponding one of the fixing assemblies and securely received in a corresponding runner. The fixing assemblies are provided for securely fixing the LED lamp in position and in a desired illuminating angle. | 2010-12-30 |
20100328946 | LIGHT DEVICES HAVING CONTROLLABLE LIGHT EMITTING ELEMENTS - In some embodiments, a light device for generating light includes light emitting diodes (LEDs), and power supply circuitry including at least one switching regulator including switching elements to provide power to the LEDs. The light device includes a device support structure including a device connector and an LED support to support the LEDs, wherein the device connector is one end of the device support structure, and the power supply circuitry is supported by the device support structure. Other embodiments are described. | 2010-12-30 |
20100328947 | LIGHT-EMITTING DIODE LIGHT SOURCE ASSEMBLY WITH HEAT DISSIPATION BASE - A light-emitting diode (LED) light source assembly with a heat dissipation base is provided. The LED light source assembly includes the heat dissipation base and a light bar. The light bar includes a flexible printed circuit (FPC) board and at least one LED unit which is disposed on the FPC board and electrically connected to the FPC board. The heat dissipation base has two retaining recesses for lodging the side portions of the FPC board, so the FPC board can be thermally conductively connected to the heat dissipation base. Because of the flexibility of the FPC board, it is easy to lodge the FPC board in the heat dissipation base via the retaining recesses. Thus, the cost for arranging the light bar can be economized. | 2010-12-30 |
20100328948 | LED LAMP WITH LARGE LIGHT EMITTING ANGLE - An LED lamp includes a heat sink, a bracket, a plurality of LED modules. The heat sink includes a supporting plate and a plurality of fins extending upwardly from a first surface of the supporting plate. The bracket is mounted on a second surface of the supporting plate and includes a plurality of bottom plates each angled an acute angle relative to the second surface of the supporting plate. The bottom plates are arranged radially from a central portion of the supporting plate. Each of the bottom plates includes an outer surface facing downwardly and outwardly away from the second surface of the supporting plate. The LED modules are mounted on the outer surfaces of the bottom plates, respectively. | 2010-12-30 |
20100328949 | ILLUMINATION DEVICE - An illumination device includes a light source and a heat dissipation device. The light source includes a base and at least a light emitting diode on the base. The heat dissipation device includes a fan for dissipating heat from the light source, and a hollow shell. The hollow shell has an inlet and an outlet defined thereon. The fan is located on the hollow shell, and the airflow from the fan is parallel to a rotation plane of the fan. In operation, air is impelled from the hollow shell by the fan, and heat from the light source is evacuated by airflow from the inlet to the outlet, and air pressure in the shell is reduced. Cool air flows into the hollow shell through the inlet. | 2010-12-30 |
20100328950 | ILLUMINATION DEVICE - An illumination device includes a light source and a heat-dissipation device. The heat-dissipation device has an air impeller configured for dissipating heat from the light source, and a hollow shell. The hollow shell has an inlet and an outlet with a height difference therebetween. The air impeller is removably installed on the shell between the inlet and outlet. The air impeller is adjacent to the outlet and accelerates airflow therefrom. Air pressure around the outlet is reduced and a pressure difference between the inside and outside of the hollow shell is generated. Air in hollow shell is heated by the light source and leaves the hollow shell via the outlet. Cold air enters the hollow shell via the inlet. | 2010-12-30 |
20100328951 | LUMINAIRE SYSTEM WITH THERMAL CHIMNEY EFFECT - A luminaire system having an elongated throughway utilizing a thermal chimney effect. The thermal chimney effect within the throughway circulates air to remove heat generated from the electrical components of the system. Dissipating heat into the throughway from the electrical components can increase the life expectancy of the lamp and the output of the lamp. The electrical components of the system being entirely sealed and isolated from the throughway results in a permanent air, dust, and water tight seal. The seal can minimize damage to the electrical components of the system as well as prevent the build up of moisture and dust within these sealed components. | 2010-12-30 |
20100328952 | LIGHTING DEVICE WITH SENSOR - The lighting device mainly contains an upper casing, an intermediate casing, a circuit board, and a lower casing. The intermediate casing has a cylindrical body with threads around a top end and a bottom end for joining with the upper and the lower casings, respectively. A spherical concave is provided in the center on the top side of the intermediate casing, surrounded by a number of LEDs. Inside the hollow lower casing, the circuit board is housed with appropriate wiring to the LEDs and a sensor assembly. The lower casing further has electrical contract means on a bottom side for introducing electricity. The spherical sensor assembly is rotatably placed in the spherical concave on the top side of the intermediate casing. | 2010-12-30 |
20100328953 | String Light Connector And The Applications Thereof - A string light assembly includes a string light connector and a lighting module electrically connected with the string light connector. The string light connector includes a cable, a plug connected with one end of the cable, and a socket module connected with the other end of the cable. The socket module has a plurality of interface modules of which at least one is used for connecting the lighting module, and at least one is used for connecting a plug of another string light connector. A plurality of the string light assemblies are connected to form a light string by engaging the plugs and the corresponding interface modules of the socket modules thereof with one of the plugs used for connecting power source. The string light assembly is designed to facilitate the connection and disconnection between two string light assemblies so as to conveniently adjust the length of the light string. | 2010-12-30 |
20100328954 | Limited F-Cone Light Source - A shutter includes micro-optics having first and second concentrator arrays. A transducer laterally displaces one of the first and second concentrator arrays between transmissive and shuttered modes. In the transmissive mode, the arrays of concentrators are optically aligned to permit electromagnetic energy passing through the first array of concentrators to pass through the second array of concentrators. In the shuttered mode, the electromagnetic radiation is blocked from passing through the second array of concentrators. The concentrators may be compound parabolic concentrators, or lenslets positioned on opposing plates with pinholes printed therethrough. The shutter may increase f-number of radiation passing therethrough, and may be used in a limited f-cone radiation source with shuttering abilities, for example reducing f-cone of radiation output from the radiation source. | 2010-12-30 |
20100328955 | INCANDESCENT ILLUMINATION SYSTEM INCORPORATING AN INFRARED-REFLECTIVE SHROUD - An improved incandescent lamp and incandescent lighting system are disclosed, for projecting a beam of light with substantially improved energy efficiency. The incandescent lamp includes a pair of reflective ceramic filament supports for supporting one or more filaments in prescribed position(s) within an envelope while reflecting back substantially all visible and infrared light for incorporation into the projected beam or for absorption by the filament(s). The incandescent lighting system includes a special infrared-reflective shroud concentrically encircling the incandescent lamp, for reflecting infrared light back toward the lamp filament(s) while transmitting visible light to a concave reflector for incorporation into the projected beam. The infrared-reflective coating is deposited onto the shroud's inner surface, and it includes a dielectric coating and an underlying transparent conductive coating. The lamp and the shroud are separately mounted relative to the concave reflector and are configured such that the lamp is removable without requiring removal of the shroud. | 2010-12-30 |
20100328956 | LED LAMP - An LED lamp includes a heat sink, an LED module, a lamp cover, a driving circuit module and a rear cover. The heat sink defines isolated first and second cavities in two opposite ends thereof. The LED module is received in the first cavity of the heat sink and connecting with the heat sink. The lamp cover is arranged at an opening of the first cavity and covering the LED module. The driving circuit module is received in the second cavity of the heat sink and electrically connecting with the LED module. The rear cover is arranged at an opening of the second cavity of the heat sink and covering the driving circuit module. | 2010-12-30 |
20100328957 | Ink Receptive Substrate - A process for preparing an ink receptive substrate comprising the steps of:
| 2010-12-30 |
20100328958 | LED MODULE - An LED module includes an LED and a lens fixed with the LED for refracting light emitted by the LED. The lens has a center axis and a concaved inner face for incidence of the light and an opposite convex outer face for the light refracting out thereof. A peak intensity for light generated by the LED occurs within 52-67 degrees off the center axis when the light leaves the outer face. | 2010-12-30 |
20100328959 | LAMP REFLECTOR - A lamp reflector includes a reflector cup having an enlarged end and a narrow end being opposite to the enlarged end. The narrow end gradually is expanded toward the enlarged end. The reflecting cup has multiple tiers longitudinally formed thereon along the axis. Each tier has multiple convex surfaces longitudinally equidistantly formed on an inner periphery thereof for scattering light beams emitted from different angles. Each tier has multiple concave faces respectively radially formed on the inner periphery thereof for condensing light beams emitted form different angles. | 2010-12-30 |
20100328960 | WATERPROOF ASSEMBLY OF LED LAMP CUP - A LED lamp cup includes a heat-conducting substrate, a LED unit, a casing and a light-transmitting lamp cover. The casing can be detachably assembled with the heat-conducting substrate or the light-transmitting lamp cover easily. Further, the casing or the light-transmitting lamp cover is configured that it can be retained from outside toward inside, so that the casing may not rotated reversely after being assembled with the heat-conducting substrate or the light-transmitting lamp cover. Thus, the biasing force exerted on the first and second waterproof gaskets may not be reduced to enlarge the gap. Thus, the penetration of moisture can be prevented to achieve a good waterproof effect. | 2010-12-30 |
20100328961 | LIGHT-EMITTING MODULE - A light-emitting module includes a printed circuit board (PCB), a fastening member, and a light-emitting package. The PCB has a power-supplying pad to provide electrical power. The fastening member is disposed on the PCB and has a package-receiving hole exposing the power-supplying pad. The light-emitting package is received by the package-receiving hole such that the light-emitting package is electrically connected to the power-supplying pad and detachably coupled with the fastening member. Therefore, the light-emitting package may be easily combined with the PCB, and the light-emitting package may be replaced when desired. | 2010-12-30 |
20100328962 | Movable multi-directional light stand - A movable multi-directional light stand is revealed. The movable multi-directional light stand includes a retractable top support rod that can be received into and connected with a hollow middle support rod. The top support rod is disposed with a mounting slot on a wall, along an axial direction thereof. A sleeve with external threads is disposed around the top of the top support rod and is arranged with a guiding slot corresponding to the mounting slot of the top support rod. A retractable light rod is pivoted to the wall of the top support rod that is disposed with the mounting slot. The retractable light rod is formed by a hollow outer tube and an inner tube that slides in the outer tube and having a hook. The light stand further includes an adjustment nut with threads engaging corresponding external threads of the sleeve so that the adjustment nut can support the outer tube, locate the retractable light rod in the mounting slot and adjust the height of the light. Thereby the light stand is retractable and rotatable in a horizontal plane so as to illuminate in different directions. | 2010-12-30 |
20100328963 | LIGHTING SYSTEM - A lighting system includes a first lighting apparatus, an annular second lighting apparatus, and an annular stay. The first lighting apparatus includes a light source covered with a housing. The annular second lighting apparatus is disposed around the housing and includes a plurality of light-emitting elements disposed annularly so as to be radially spaced apart from an outer periphery of the first lighting apparatus. The annular stay is supported by the housing to support the second lighting apparatus. | 2010-12-30 |
20100328964 | HEAD UNIT BACKGROUND ILLUMINATION - A front panel display assembly may have an integrated decorative film having first and second sides. The first side may have a half-mirrored surface that allows the passage of light in only a single direction and the second side may have a non-uniform diffusion pattern that extends across it. The non-uniform diffusion pattern may regulate and diffuse light irradiated onto the second side to pass through the integrated decorative film and to be regulated and emitted uniformly across the front panel display assembly. | 2010-12-30 |
20100328965 | Automotive Exterior Lamp Assembly with Charge Port - An automotive vehicle capable of receiving power from a remote power source includes an exterior lamp assembly integrated with the vehicle. The lamp assembly includes an illumination source, and an electrical port configured to be electrically connected with the remote power source. | 2010-12-30 |
20100328966 | SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD OF FABRICATING THEREOF - Provided are a light unit and a display apparatus comprising the same. The light unit comprises a bottom cover comprising a groove; a light source unit generating light in the bottom cover; an optical sheet unit on the bottom cover; and a reflective support member reflecting light and supporting the optical sheet unit in the bottom cover. | 2010-12-30 |
20100328967 | RESONANT POWER CONVERTER - A resonant power converter including synchronous rectifiers adapted to operate with an overlapping conduction phase and a fixed frequency. | 2010-12-30 |