52nd week of 2014 patent applcation highlights part 30 |
Patent application number | Title | Published |
20140376147 | ESD PROTECTION DEVICE - An ESD protection device | 2014-12-25 |
20140376148 | ELECTROSTATIC CHUCK DEVICE - An electrostatic chuck device includes an electrostatic chuck part that has an upper surface as a placement surface for placing a plate-shaped sample and has an internal electrode for electrostatic attraction built therein; and a cooling base part that cools the electrostatic chuck part. The electrostatic chuck part and the cooling base part are integrally adhered to each other via an adhesive layer. An insulator having a double pipe structure including an insulator and an insulator provided coaxially with an outer peripheral portion of the insulator is provided in a cooling gas hole, formed in the electrostatic chuck part and the cooling base part, so as to cover an exposed surface of the adhesive layer on the cooling gas hole side. | 2014-12-25 |
20140376149 | PHASE CHANGE MATERIAL VARIABLE CAPACITOR - A method of manufacturing a variable capacitor includes forming a capacitor conductor. The method also includes forming a phase change material adjacent the capacitor conductor. The method further includes forming a first contact on the capacitor conductor. The method additionally includes forming a second contact and a third contact on the phase change material. | 2014-12-25 |
20140376150 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including, a ceramic body including dielectric layers, internal electrodes disposed in the ceramic body to face each other with the dielectric layers interposed therebetween, and having an average thickness of 1.0 μm or less, and external electrodes formed on outer surfaces of the ceramic body and electrically connected to the internal electrodes, wherein at least one of the internal electrodes is formed of only a conductive metal. | 2014-12-25 |
20140376151 | METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MULTILAYER CERAMIC ELECTRONIC COMPONENT MANUFACTURED THEREBY - There is provided a method of manufacturing a multilayer ceramic electronic component, the method including: preparing a ceramic multilayer body by stacking and sintering ceramic green sheets having internal electrodes formed thereon; determining whether or not a distance d | 2014-12-25 |
20140376152 | LAMINATED CERAMIC CAPACITOR - The laminated ceramic capacitor has a laminate block made of alternately laminated ceramic dielectric layers and internal electrodes, a pair of cover layers, laminated on top and bottom of the laminate block, ceramic bodies formed on both side faces of the laminate block, and a pair of external electrodes that are electrically connected to the internal electrodes, wherein the average grain size of the ceramic dielectric grains constituting the ceramic body is smaller than the average grain size of the ceramic dielectric grains constituting the ceramic dielectric layer in the laminate block. | 2014-12-25 |
20140376153 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes provided within the ceramic body and including lead-out portions exposed to a first surface of the ceramic body and having an overlapping area, the overlapping area being exposed to the first surface of the ceramic body; external electrodes formed on the first surface of the ceramic body and connected to the respective lead-out portions; and an insulation layer formed on the first surface of the ceramic body and on third and fourth surfaces thereof connected to the first surface, wherein the lead-out portions have a predetermined interval from the third or fourth surface of the ceramic body. | 2014-12-25 |
20140376154 | METALLIZED FILM CAPACITOR AND CASE MOLD TYPE CAPACITOR INCLUDING SAME - A metallized film capacitor includes first and second metal electrodes, a dielectric film disposed between the first and second metal electrodes, and first and second external electrodes which are connected to the first and second metal electrodes, respectively. At least one of the first metal electrode and the second metal electrode comprises magnesium. The magnesium is distributed unevenly in the at least one of the first metal electrode and the second metal electrode. | 2014-12-25 |
20140376155 | Ceramic Electronic Component - A ceramic electronic component wherein outer electrode is placed over both end portions of a ceramic body. A first coating mainly containing Ni and a second coating containing Sn, solder, or the like are placed on a surface of the outer electrode. The outer electrode includes an end-surface portion and a side-surface turnover portion. The outer electrode includes a glass layer which is placed in a region within at least 5 μm in linear distance L from a covering end portion of the side-surface turnover portion in a direction toward the end-surface portion so as to be in contact with the ceramic body and which contains, at least, Si. The average thickness t of the glass layer is 3 μm to 10 μm. The content of a Si component is 11% by weight or more (preferably 40% by weight or less). | 2014-12-25 |
20140376156 | GRAPHENE MOUNTED ON AEROGEL - An apparatus having reduced phononic coupling between a graphene monolayer and a substrate is provided. The apparatus includes an aerogel substrate and a monolayer of graphene coupled to the aerogel substrate. | 2014-12-25 |
20140376157 | NON-REDUCIBLE LOW TEMPERATURE SINTERABLE DIELECTRIC POWER ELECTRONIC CAPACITOR MODULE FOR VEHICLE - A power electronic capacitor module for vehicle that may reduce the number of solderings by inserting and thereby mounting a capacitor between a single pair of bus bars and thereby may simplify an assembly process. The power electronic capacitor module for vehicle may include a single pair of bus bars disposed to be separate from each other and each having an external electrode support member; an insulating support frame formed to expose the external electrode support member and wrap around a single pair of bus bars and thereby support the bus bars; and a capacitor element having a single pair of external electrodes and inserted between a single pair of bus bars to thereby be supported by the bus bars or the external electrode support members and electrically connect the external electrodes to the external electrode support members. | 2014-12-25 |
20140376158 | YARN-TYPE MICRO-SUPERCAPACITOR METHOD FOR FABRICATING SAME - The present invention relates to a yarn-type micro-supercapacitor fabricated by twisting a hybrid nanomembrane coated with a conducting polymer on a carbon nanotube sheet. Thus, the yarn-type micro-supercapacitor has superior performance. Particularly, since a 2-ply electrode manufactured by being twisted together with a metal wire has very high power and energy density in liquid or solid electrolyte and also has superior mechanical strength and flexibility, the yarn-type micro-supercapacitor may be variously deformed—for example, bent, twisted, or woven—to maintain superior electrochemical performance. | 2014-12-25 |
20140376159 | COVER FOR AN ENERGY STORAGE UNIT, ENERGY STORAGE UNIT COMPRISING SAID COVER, AND METHOD FOR MANUFACTURING SUCH AN ENERGY STORAGE UNIT - The invention relates to a cover ( | 2014-12-25 |
20140376160 | ELECTRIC STORAGE DEVICE AND ELECTRIC STORAGE MODULE - An electric storage device includes: a positive electrode; a negative electrode; and a separator placed between the positive electrode and the negative electrode. The positive electrode includes a positive electrode substrate, a positive active material layer formed on the positive electrode substrate, and a protective layer that covers at least one of side surfaces in a width direction of the positive active material layer. The negative electrode includes a negative electrode substrate and a negative active material layer formed on the negative electrode substrate. The separator includes a separator substrate opposed to the negative active material layer, and an inorganic layer containing a binder, the inorganic layer formed on the separator substrate and opposed to the positive active material layer. | 2014-12-25 |
20140376161 | ELECTRONIC DEVICE WITH DISPLAY HAVING REDUCED BORDER REGION - An electronic device includes a display module, a first housing, and a second housing. The display module includes a display and a touch plate. The first housing includes a flange and a number of latching blocks. The second housing includes a resisting wall and a number of receiving grooves, and a projection is formed in each receiving groove. The flange of the first housing abuts against the resisting wall, each latching block is received in a corresponding receiving groove and is latched by the projection, the display | 2014-12-25 |
20140376162 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE DISPLAY DEVICE - A display device may include a display panel, a cover member, and a protective layer. The display panel may include a display portion that is configured to display an image according to a signal. The cover member may overlap the display panel, may include a cover portion, and may have a through hole that extends through the cover portion. The protective layer may be configured to cover the through hole. | 2014-12-25 |
20140376163 | DISPLAY APPARATUS - A display apparatus includes a display panel, a variable member to vary a shape of the display panel, the variable member including at least a first part and a second part that are discontiguous, and a drive unit to provide energy required to vary a separation distance between the first part and the second part. | 2014-12-25 |
20140376164 | DISPLAY PANEL AND MANUFACTURING METHOD OF DISPLAY PANEL - A display panel including a driving substrate, a display film, a first protection film, a first adhesion layer, and a sidewall structure is provided. The display film is disposed on the driving substrate. The first protection film is adhered on the display film through the first adhesion layer. The display film is located between the driving substrate and the first protection film. A material of the first adhesion layer is thermal melt-able. The sidewall structure is in contact with a side surface of the display film and includes the material of the first adhesion layer which is melted and re-solidified. In addition, a manufacture method of the display panel includes irradiating the driving substrate the first protection film and the first adhesion layer with a laser to form the sidewall structure in contact with the side surface of the display film. | 2014-12-25 |
20140376165 | TRANSFER FILM, METHOD FOR TRANSFERRING THE SAME AND ELECTRONIC DEVICE - A transfer film that shields light to prevent a display image from being transmitted to a part of a window, a method for transferring the same and an electronic device are provided. The electronic device includes a transfer film having a laminated structure, wherein the transfer film includes a base layer, a release layer removable from the base layer, a printing layer to implement a pattern and a color, and an adhesion layer adhered by pressure to a window provided to view visual information output from a display. | 2014-12-25 |
20140376166 | FRONT MEMBER FOR CAPACITIVE DISPLAY SCREEN PANEL OF ELECTRONIC DEVICES - Front member applicable to capacitive display screen ( | 2014-12-25 |
20140376167 | MANAGEMENT DEVICE FOR ELECTRONIC DEVICE - A management device includes a control module, a display module, and an input module. The control module includes a control chip and a detecting unit. The detecting unit is used to receive first signals corresponding to a working status of hard disks and a backplane. The display module is coupled to the control chip to display parameters presenting the working status of the hard disks. The input module is used to input signals to control the display module to display more detailed parameters of the hard disks. | 2014-12-25 |
20140376168 | SUPPORTING MECHANISM AND ELECTRONIC DEVICE THEREWITH - A supporting mechanism for supporting a first module on a second module is disclosed. The first module is pivoted to the second module via a hinge assembly. The supporting mechanism includes a first member and a second member. The first member includes a sliding end slidably installed on the first module. The second member is connected to the first member in a relatively slidable manner. The second member includes a pivoting end pivoted to the second module. When the first module is rotated along an expanding direction with respect to the second module, the sliding end of the first member slides along a first direction toward the hinge assembly such that the first member slides along a second direction further away from the second member. | 2014-12-25 |
20140376169 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, a semiconductor memory device includes an electrical terminal disposed in a first side; a first surface including a first part, a second part, and a third part, a mark of the semiconductor memory device being printed in the first part, the second part being disposed in a second side, the second side being opposite side of the first side, the third part being disposed around the first part, a first surface roughness of the first part being higher than a second surface roughness of the third part. | 2014-12-25 |
20140376170 | PROCESSOR CARD HOUSING WITH FAN - A device can include a housing, a fan, and a heat sink. The heat sink can dissipate heat from a processor card. The device can be installed into a chassis of a computer. | 2014-12-25 |
20140376171 | MOUNTING APPARATUS FOR DATA STORAGE DEVICES - A mounting apparatus includes a drive bracket and a securing piece. The drive bracket includes a bottom plate and a side plate. A separating plate is located on the bottom plate to divide the drive bracket into a first portion and a second portion. The first portion defines an engaging hole. The second portion defines a first slide groove. | 2014-12-25 |
20140376172 | DEVICE ACCESSORY BAY - An embodiment a device, including: a device sleeve comprising a plurality of ends, each of the plurality of ends terminating in a lip portion configured to fit a screen bezel of an information handling device; the device sleeve including an accessory bay having one or more attachment mechanisms disposed therein, the one or more attachment mechanisms acting to reversibly secure an attachment portion of an accessory; and an element disposed in the device sleeve and positioned to communicate one or more of power and data with the information handling device. Other aspects are described and claimed. | 2014-12-25 |
20140376173 | EXTENSION APPARATUS AND EXTENSION SYSTEM - According to one embodiment, an extension apparatus includes, a housing, a hook portion, a switch portion, a mechanical portion which moves the hook portion between the engaged state and the disengaged state, a pin portion provided inside the switch portion, a first spring portion interposed between the housing and the pin portion, an abutting portion provided in the mechanical portion, abutting a distal end of the pin portion, and releasing abutment when the pushing amount of the switch portion exceeds a predetermined amount, and a second spring portion striking the distal end of the pin portion against a sound-producing portion when abutment of the distal end of the pin portion is released. | 2014-12-25 |
20140376174 | ELECTRONIC ASSEMBLY WITH THERMAL CHANNEL AND METHOD OF MANUFACTURE THEREOF - An electronic assembly and method of manufacturing includes: an airflow bracket having a circular rail and an airflow tab, the airflow bracket electrically coupling the circular rail and the airflow tab; a top board attached to the circular rail for electrically coupling the top board and the circular rail; and a bottom board attached to the circular rail for electrically coupling the top board and the circular rail, the bottom board positioned to form a thermal channel between the top board and the bottom board for directing air through a vent opening of the circular rail. | 2014-12-25 |
20140376175 | Apparatus for Preventing Deformation of Communication Card - An apparatus for preventing deformation of a communication card includes a card holder configured to install a communication card; a temperature control component that is located on one side of the card holder and connected to a power supply configured to perform cooling or heating; a temperature sensor configured to collect temperature of the card holder; and the power supply configured to generate a supply current according to the temperature collected by the temperature sensor to supply power to the temperature control component, so that the temperature control component performs cooling or heating to maintain the temperature of the card holder within a preset temperature range, and the communication card is not deformed when the communication card is in the card holder and within the preset temperature range. | 2014-12-25 |
20140376176 | LIQUID TEMPERATURE CONTROL COOLING - Examples of the present disclosure may include methods and systems for liquid temperature control cooling. An example of a liquid temperature control cooling system for an electronics rack ( | 2014-12-25 |
20140376177 | SERVER WITH A FUNCTION OF GENERATING FAN TABLE AND METHOD FOR GENERATING FAN TABLE - A method for generating a fan table includes the following. A temperature of each electronic component and a speed of a fan are obtained at preset intervals, The obtained temperature of each electronic component is compared with the corresponding preset temperature. In addition, the speed and a corresponding combination of loads are recorded to a fan table of the electronic component when the temperature of the electronic component is equal to the corresponding present temperature. | 2014-12-25 |
20140376178 | HEAT DISSIPATING SYSTEM - Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar. | 2014-12-25 |
20140376179 | Surface Content for a Support Component - A surface contact for a support component is described. The support component, for example, can serve as a “kickstand” that can be positioned to support the apparatus in a variety of orientations relative to an adjacent surface. A surface contact disposed on the support component can serve as an interface (e.g., a “foot”) for the support component on the adjacent surface. For instance, the surface contact can be formed from a slip-resistant material such that slippage of the support component on an adjacent surface is reduced or eliminated. In at least some embodiments, the surface contact is embedded with a material that responds to a magnetic field, e.g., a ferromagnetic material. The surface contact is attracted to magnets on an adjacent edge of the attached apparatus, thus stabilizing the support component in a closed position. | 2014-12-25 |
20140376180 | HINGE AND FOLDABLE ELECTRONIC APPARATUS THEREWITH - A hinge includes a pivot, two connection members pivotally connected by the pivot, a first magnetic part connected to one of the connection members, a second magnetic part moveably disposed relative to the first magnetic part and kinetically connected to the other one of the connection members, and an adjustment part kinetically connected to the other connection member and urging against the adjustment part. The magnetic moment of the second magnetic part is opposite to that of the first magnetic part. When the two connection members rotate relatively, the other connection member drives the adjustment part and the second magnetic part to rotate relative to the first magnetic part, so as to produce a repulsive moment resisting the rotation and varies with the rotation. A foldable electronic apparatus has the hinge. | 2014-12-25 |
20140376181 | Unlocking Method And Electronic Apparatus - An unlocking method and an electronic apparatus are described. The unlocking method is applied in an electronic apparatus that includes a first body, a second body, and a capacitance detecting unit wherein the first body and the second body are locked by a locking mechanism. The method includes detecting whether there is an unlocking operation from a first user based on the capacitance detecting unit; generating an unlocking instruction in response to the unlocking operation when the unlocking operation is detected; and executing the unlocking instruction to control the locking mechanism to release lock, so as to make the first body able to be separated from the second body. | 2014-12-25 |
20140376182 | EXTERNAL STRUCTURE AND ELECTRONIC APPARATUS - Provided is an external structure configured to be attached to or detached from an electronic device having a concave portion formed on a surface of a housing, and a connection connector provided in a position of the concave portion receding from the surface of the housing, the concave portion having a cross-sectional shape enabling locking of the external structure, the external structure including a first fitting unit configured to be fitted to the connection connector. | 2014-12-25 |
20140376183 | COOLING DEVICE INCLUDING ETCHED LATERAL MICROCHANNELS - In some examples, a cooling system includes a silicon substrate defining a first trench, a second trench, and a plurality of channels extending between the first trench and the second trench. The silicon substrate may define a first surface and a second surface substantially opposite to and substantially parallel to the first surface, and each of the plurality of channels may extend substantially parallel to the surface of the silicon substrate. The cooling system also may include a microelectronic device comprising a heat-generating area. The microelectronic device may be attached to the first surface or the second surface of the silicon substrate. In some examples, the plurality of channels may be etched between the first trench and the second trench. | 2014-12-25 |
20140376184 | SEMICONDUCTOR DEVICE AND COOLER THEREOF - A semiconductor device exhibits low pressure loss and is capable of cooling a plurality of power semiconductor chips evenly. This semiconductor device includes a semiconductor module and a cooler for cooling a power semiconductor element mounted in the semiconductor module. A cooling unit of the cooler has a first header part that has a first bottom surface disposed between a coolant inlet and an end portion of a first substrate on the coolant outlet side and inclined toward a bottom plane of cooling fins so that a coolant supplied from the coolant inlet flows toward the cooling fins; and a second header part that has a second bottom surface inclined from an end portion of the bottom plane of the cooling fins on the coolant outlet side so that the coolant discharged from the cooling fins flows to the coolant outlet. | 2014-12-25 |
20140376185 | COOLING DEVICE - A cooling device according to an exemplary embodiment of the present invention includes: a chamber including at least one flexible surface; a piezoelectric element formed in the at least one flexible surface and generating a volume change in the chamber by bending the at least one flexible surface in a first direction or a second direction to generates a first directional air flow or a second directional air flow; an opening formed in the chamber and becoming a channel of the first direction air flow or the second directional air flow; and at least one connection unit connected to the outer side of the chamber and the outer side of a heat source that is provided at a distance from the chamber and connecting the chamber and the heat source. | 2014-12-25 |
20140376186 | POWER SUPPLY CHASSIS - A welding power supply includes a housing and a one-piece chassis. The one-piece chassis is coupled to the housing and configured to be enclosed within the housing. Moreover, the one-piece chassis is configured to be selectively removable from the housing and the one-piece chassis is configured to have multiple components coupled thereto. The components include one or more transformers, a fan blade, one or more rectifiers, one or more inductors, and control circuitry. | 2014-12-25 |
20140376187 | PACKAGE MOUNTING STRUCTURE - A package mounting structure includes: a first substrate having wiring; a second substrate having wiring; at least one cooling unit having a first face and a second face different from the first face; at least one power supply unit that is mounted on the first substrate and is joined to the first face of the cooling unit; and at least one electronic component that is mounted on the second substrate and is joined to the second face of the cooling unit, wherein the power supply unit supplies power to the electronic component through the wiring of the first substrate, the cooling unit, and the wiring of the second substrate. | 2014-12-25 |
20140376188 | ELECTRONIC DEVICE - In an electronic device, a one-side heat radiation element and a two-side heat radiation element are disposed on a surface of a substrate adjacent to a heat sink. The one-side heat radiation element has a rear-side covered conductive portion and a rear-surface molded portion on the rear-side covered conductive portion adjacent to the heat sink, and radiates heat to the substrate. A surface of a rear-side exposed conductive portion of the two-side heat radiation element adjacent to the heat sink is exposed and the two-side heat radiation element radiates heat to the substrate and the heat sink. The rear-surface molded portion controls a limit position of the one-side heat radiation element toward the heat sink due to deformation of the substrate. A heat radiation gel is filled in between the rear-side exposed conductive portion and the heat sink to radiate heat from the two-side heat radiation element toward the heat sink. | 2014-12-25 |
20140376189 | INTERPOSER, METHOD FOR MANUFACTURING INTERPOSER, AND SEMICONDUCTOR DEVICE - Electrodes pads formed on device surfaces connect semiconductor chips to through electrodes of an intermediate substrate. A flow path is formed inside the intermediate substrate. A cooling medium flows through the flow path. Stoppers are attached to an inner surface of the flow path. The stoppers include metal abutment members, respectively. An end of each pipe abuts against the counterpart abutment member. Solder connects the pipes to the abutment members. | 2014-12-25 |
20140376190 | ELECTRONIC SYSTEM WITH HEAT EXTRACTION AND METHOD OF MANUFACTURE THEREOF - An electronic system, and a method of manufacture thereof, including: a substrate; an electrical device over the substrate; and a surface mount heat sink next to the electrical device, the surface mount heat sink having an extruded shape characteristic of being formed using an extrusion mechanism. | 2014-12-25 |
20140376191 | HYBRID INSULATION SHEET AND ELECTRONIC APPARATUS USING THE SAME - Provided are an insulation sheet and an electronic apparatus using the same. The insulation sheet includes: a radiating layer that spreads and radiates heat generated from a heat generating component of an electronic apparatus; and an insulating layer that suppresses the heat saturated in the radiating layer from being delivered to the outside of the electronic apparatus. | 2014-12-25 |
20140376192 | PROTECTING COVER FOR ELECTRONIC DEVICE - A protecting cover for an electronic device is provided, the protecting cover including a front cover portion positioned on a front surface of the electronic device, a back cover portion connected with the front cover portion and positioned on a back surface of the electronic device, an auxiliary display unit provided on the front cover portion, and a module configured to control transmission and reception of data and power supply depending on opening and closing of the front cover portion. | 2014-12-25 |
20140376193 | ELECTRIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE SAME - There is provided an electronic component module capable of increasing a degree of integration by mounting electronic component on both surfaces of a substrate, the module including: a first substrate having mounted electrodes formed on both surfaces thereof; a plurality of electronic components mounted on both surfaces of the first substrate; at least one second substrate bonded to a lower surface of the first substrate; and an insulating part formed in at least one position in a gap between the first substrate and the second substrate and bonding the first substrate to the second bonding substrate. | 2014-12-25 |
20140376194 | SIGNAL REFERENCING FOR MEMORY - Apparatus, systems, and methods for signal referencing for memory are described. In one embodiment, connector for a memory device comprises a housing having a first panel and a second panel opposite the first panel to be positioned adjacent a circuit board, the first panel and second panel defining a slot to receive a portion of the memory device, a first plurality of electrically conductive pins disposed in the slot and proximate the first panel to establish electrical connections with a plurality of electrical connectors on the memory device, wherein at least one of the first plurality of pins is a ground pin and a layer of conductive material disposed proximate the second surface. The ground pin is electrically coupled to the layer of conductive material. Other embodiments are also disclosed and claimed. | 2014-12-25 |
20140376195 | Methods of forming dual sided coreless package structures with land side capacitor - Methods of forming coreless package structures comprising backside land side capacitors (LSC) and dual sided solder resist are described. Those methods and structures may include forming a nickel coating on a first and second side of a core, forming a conductive plating on the nickel coating, forming building up layers on the conductive plating to form two panels on the core, de-paneling the panels from the core to form two coreless substrates, forming a laminate on the first and second sides of the coreless substrates, and forming an LSC on a backside of the coreless substrates. | 2014-12-25 |
20140376196 | METHOD FOR PRODUCING A PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST TWO PRINTED CIRCUIT BOARD REGIONS, AND PRINTED CIRCUIT BOARD - The invention relates to a method for producing a printed circuit board consisting of at least two printed circuit board regions, wherein the printed circuit board regions each comprise at least one conductive layer and/or at least one conductive component, wherein printed circuit board regions to be connected to one another, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a mechanical coupling. According to the invention, at least one sub-region or connection port of the conductive layer, and/or a conductive element of the component are electrically conductively coupled to each other at the lateral surface, whereby a simple and reliable lateral electrical coupling between printed circuit board regions to be connected to each other is rendered possible. The invention further relates to such a printed circuit board. | 2014-12-25 |
20140376197 | METHOD OF TRANSFERRING AND ELECTRICALLY JOINING A HIGH DENSITY MULTILEVEL THIN FILM TO A CIRCUITIZED AND FLEXIBLE ORGANIC SUBSTRATE AND ASSOCIATED DEVICES - A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer. | 2014-12-25 |
20140376198 | READILY DETACHABLE PANEL DEVICE - A panel device including a first panel, a second panel, a frame, and a binder is provided. The frame has a wrenchable structure. The first panel is between the second panel and the frame. The binder adheres the second panel to the frame. The second panel can be detached from the frame through the wrenchable structure. | 2014-12-25 |
20140376199 | LAMINATED MULTI-CONDUCTOR CABLE - A laminate body includes a plurality of dielectric sheets laminated together. A first ground conductor is provided in or on the laminate body. A second ground conductor is provided in or on the laminate body and located on a different layer from the first ground conductor. A signal line is provided between the ground conductors and with respect to a direction of lamination. A signal line is provided between the ground conductors and with respect to the direction of lamination and located closer to the second ground conductor than the signal line is, and the signal line has a portion extending along the signal line in a parallel-lines area when viewed from the direction of lamination. The first ground conductor has openings in the parallel-lines area, and the openings are arranged over the signal line when viewed from the direction of lamination. | 2014-12-25 |
20140376200 | RELIABLE DEVICE ASSEMBLY - Microelectronic assemblies and methods for making the same are disclosed herein. In one embodiment, a method of forming a microelectronic assembly comprises assembling first and second components to have first major surfaces of the first and second components facing one another and spaced apart from one another by a predetermined spacing, the first component having first and second oppositely-facing major surfaces, a first thickness extending in a first direction between the first and second major surfaces, and a plurality of first metal connection elements at the first major surface, the second component having a plurality of second metal connection elements at the first major surface of the second component; and plating a plurality of metal connector regions each connecting and extending continuously between a respective first connection element and a corresponding second connection element opposite the respective first connection element in the first direction. | 2014-12-25 |
20140376201 | GUARDED PRINTED CIRCUIT BOARD ISLANDS - A device with low dielectric absorption includes a printed circuit board (PCB), a component connection area including a first conductor layered on a top surface of the component connection area and a second conductor layered on a bottom surface of the component connection area, an aperture surrounding the component connection area, a low-leakage component connecting the component connection area to the PCB across the aperture, and a guard composed of a third conductor at least substantially surrounding the aperture on a top surface of the PCB and a fourth conductor at least substantially surrounding the aperture on a bottom surface of the PCB. | 2014-12-25 |
20140376202 | PRINTED CIRCUIT BOARD, SEMICONDUCTOR DEVICE CONNECTION STRUCTURE, AND METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD - First electrode pads formed on one semiconductor package surface include a first reinforcing electrode pad having a surface area larger than that of other first electrode pads. Second electrode pads formed on a printed wiring board on which the semiconductor package is mounted include at least one second reinforcing electrode pad. The second reinforcing electrode pad opposes the first reinforcing electrode pad, and has a surface area greater than that of the other second electrode pads. The first and second electrode pads are connected by solder connection parts. A cylindrical enclosing member encloses an outer perimeter of a solder connection part connecting the first and second reinforcing electrode pads. Increases in the amount of warping of semiconductor devices such as the package substrate and the printed wiring board are suppressed, and the development of solder bridges with respect to adjacent solder connecting parts or adjacent components is reduced. | 2014-12-25 |
20140376203 | DISPLAY APPARATUS - A display apparatus according to the embodiment of the present invention includes a display body outputting an image signal; a stand supporting the display body and disposed on an installing surface; and a swivel member disposed in a bottom part of the stand and rotating the stand at a certain angle in a status where the stand is disposed on the installing surface, wherein the swivel member, includes a plurality of rotatable rolling members mounted in the bottom part of the stand, and the plurality of rolling members have the same revolution center. | 2014-12-25 |
20140376204 | TFT DISPLAY TRIM LIGHTING STRUCTURE - The present teachings provide for a light guide for a vehicle dashboard display having a first display panel. The light guide can include a guide structure secured to the vehicle dashboard display proximate to the first display panel. The guide structure can be configured to transmit light from the first display panel at a first position, through the guide structure, to a second position spaced apart from the first display panel. | 2014-12-25 |
20140376205 | PHOSPHOR AND LIGHT-EMITTING DEVICE USING THE SAME - A phosphor according to the present disclosure is obtained by adding a rare earth element to a host material having boron, nitrogen, and oxygen as main components, and a composition formula is represented by B(l)O(m)N(n):Z. Here, B, O, N, and Z indicate boron, oxygen, nitrogen, and the rare earth element, respectively. Moreover, each of l, m, and n indicates element content. | 2014-12-25 |
20140376206 | Merchandise display system - The present invention relates to an arrangement ( | 2014-12-25 |
20140376207 | OPTICAL APPARATUS FOR ILLUMINATING A PIXEL MATRIX AND/OR A CONTROLLABLE SPATIAL LIGHT MODULATOR FOR A DISPLAY - The invention relates to optical device for illuminating a pixel matrix and/or a controllable spatial light modulator for a display, in particular a stereoscopic or holographic 3D display, wherein the optical device comprises a layer formed as a light waveguide, in which illumination light is guided in a light guiding layer, in particular according to the principle of total internal reflection, between two reflection layers lying opposite one another, wherein an extraction means for extracting illumination light from the light guiding layer is provided. The optical device is characterized in that the extraction means has different properties, in particular different optical properties, at a first extraction position than at another extraction position different to the first extraction position. | 2014-12-25 |
20140376208 | OPTICAL STRUCTURE AND BACKLIGHT UNIT - An optical structure includes a body facing a light emitting surface of a light emitting diode package and including a portion protruding toward the light emitting surface of the light emitting diode package, where a surface of the protruding portion faces the light emitting surface and forms a reflective surface of the optical structure; and a leg elongated from a periphery of the body toward the point light source, where the leg supports the body to be spaced apart from the light emitting diode package. | 2014-12-25 |
20140376209 | Wearing Apparel with LED Light Module - A wearing apparel includes at least a seam line and an elongated sleeve extended adjacent to the seam line. A LED light module has a flexible wire configuration allowing freedom of movement when the wearing apparel is worn. The LED light module includes a flexible light string received along the elongated sleeve and a power supply electrically connected to the light string. The light string generates a light effect thereby illuminating the wearer for ornamental and safety purpose. | 2014-12-25 |
20140376210 | Lighting control system for utility helmet - A control system for automatically switching power between two separate light sources integrated with a welding shield pivotally mounted to an adjustable headband includes at least one magnetic positional switch attached to the headband having electrical communication with at least one battery and the light sources, and two magnetic positional sensors strategically mounted on the interior surface of the welding shield along a defined arcurate path of rotation of the shield about the headband. | 2014-12-25 |
20140376211 | Method for controlling a lighting system integrated with a utility helmet - Using a control system for automatically switching power between a first light source attached to a welding shield pivotally mounted to an adjustable headband, and a second light source attached to the headband, a method for alternating power to the light sources includes steps (a) raising the shield to the uppermost rotational position resulting in power on to the second light source, the second light source remaining on at the raised position, and (b) lowering the welding shield to the maximum allowable distance resulting in power off to the second light source immediately followed by power on to the first light source, the first light source remaining on at the lowered position. | 2014-12-25 |
20140376212 | MODULAR LIGHTING SYSTEM FOR RETROFIT TO A WELDING SHIELD - A lighting system retrofitted to a stock helmet with an interiorly fastened headband and a welding shield rotably mounted thereto includes a first light source mounted on an exterior surface of the welding shield, the welding shield adjustable to positions above and below the headband, a second light source mounted to the headband, a power source, a magnetic positional switching facility mounted on the exterior of the headband having electrical connection to the power source and the first and second light sources, a first positional sensor, and a second positional sensor, the first and second positional sensors mounted on the interior surface of the welding shield along an arcurate path defining the angular range of rotation of the welding shield relative to the magnetic positional switching facility. | 2014-12-25 |
20140376213 | MODULAR LUMINAIRES FOR APPLIANCE LIGHTING - The luminaires of the present disclosure provide a slim profile and simple construction for use in a variety of lighting applications. A circuit board can have a plurality of light sources thereon, and a lens can at least partially encapsulate the circuit board to protect and electrically insulate the circuit board. When used, for example, in a lighted shelf application, power can be provided to the luminaire through shelf brackets along the side of the shelf panel. | 2014-12-25 |
20140376214 | BACKLIGHT TILE SYSTEM - A backlight tile system is configured to be attached to a wall stud and to be surrounded by tile attached to drywall. The backlight tile system has a rear channel that is mechanically coupled to the wall stud and extending through the drywall. A first lighting strip is detachably coupled to the rear channel with a first adhesive strip. A front channel is detachably coupled to the rear channel with a first magnetic strip. A mosaic tile is directly attached to the front channel. The first lighting strip is configured to render light through the mosaic tile. | 2014-12-25 |
20140376215 | Photoelectric Recovery Device For Use In Lighting Device - A photoelectric recovery device for use in a lighting device includes a controller unit; at least one light emission element, each light emission element being electrically connected to the controller unit; at least one light recovery module, each light recovery module being electrically connected to the controller unit, each light recovery module being arranged adjacent to the light emission element; and an electricity accumulation unit, the electricity accumulation unit being electrically connected to the controller unit, the electricity accumulation unit storing electricity from the light recovery module. Each light recovery module is mounted in the lighting device and each light recovery module receives extra light from the light emission element of the lighting device, which is subjected to photoelectric conversion from optical energy into electrical energy. The electrical energy is stored in the electricity accumulation unit for secondary use. | 2014-12-25 |
20140376216 | Combination Emergency Scene Illumination and Traffic Control System - A combination scene lighting and traffic control system includes a scene illumination apparatus for illuminating an emergency scene, and a detachable adapter for converting the illumination apparatus into a traffic light. The scene illumination apparatus includes at least two separately actuatable lighting elements within a tripod-mounted housing. A control device allows simultaneous actuation of both lighting elements when maximum illumination is desired or actuation of a single element if less illumination is desired. The adapter holds two different colored filters, each of which overlies a different one of the lighting elements when the adapter is secured to the illumination apparatus, so that one colored light will be visible to approaching motorists when a first of the lighting elements is actuated and a different colored light will be visible when a second of the lighting elements is actuated. The filter colors are preferably associated with traditional traffic control colors such as red and green, so that approaching motorists will stop or go depending on which color light is visible. | 2014-12-25 |
20140376217 | ILLUMINATION DEVICE - An illuminating apparatus ( | 2014-12-25 |
20140376218 | LED Strip Assembly for Generating an Extra Wide Beam of Light - The invention discloses an LED strip assembly for generating an extra wide beam light of greater than 180 degrees, comprising one linear support structure (typically of aluminum material), and at least two LED arrays. In addition, the support structure has an upper part, a lower part and two grooves in between. The said LED arrays are arranged on the upper part; the lower part is arc shaped and of 1 PI radians or less, having fins to dissipate heat to ambient environment. | 2014-12-25 |
20140376219 | LIGHT-EMITTING DEVICE, ILLUMINATING APPARATUS, AND DISPLAY APPARATUS - The invention provides a light-emitting device which is capable of applying light to a display panel with uniformity in brightness and can be made lower in profile. A light-emitting device ( | 2014-12-25 |
20140376220 | MICROSTRUCTURE-BASED OPTICAL DIFFUSERS FOR CREATING BATWING AND OTHER LIGHTING PATTERNS - A light transmissive structure includes a light transmissive substrate having first and second opposing faces and array of microprism elements on the first face, with a respective microprism element including a plurality of concentric microprisms. The light transmissive structure is configured to receive light from a light source facing the first face and distribute the light emerging from the second face in a 2D batwing distribution. | 2014-12-25 |
20140376221 | INTERNAL DEFLECTION VENTING - Methods and systems are provided for a lighting module and related components for efficiently directing dissipated heat and/or heated air away from the lighting module. Deflectors are often used to funnel heat away from solid-state light emitters and channel airflow away from a curing surface, but the risk of constrained airflow may negatively affect emitter output as well as disturb the curing process of a workpiece emitted light is directed towards. To efficiently remove heat as well as not disturb the curing process or shape of the lighting module, louvered vents are provided that extend into an interior of a housing of the lighting module for guiding heated air in a deflecting direction away from the emitted light direction. | 2014-12-25 |
20140376222 | LIGHTING DEVICE - The invention relates to a lighting device comprising a flat light-emitting means having two side faces, wherein a first side face is transparent and a second side face is partially metal-coated, having a partially or completely metal-coated further third face, which is arranged parallel to but spaced apart from the second partially metal-coated face, and comprising at least one further light-emitting means, which outputs light in the direction of the partially metal-coated second face, which light is partially reflected on the partially metal-coated second face and is then reflected on the partially or completely metal-coated third face back in the direction towards the partially metal-coated second face and is partially transmitted through the partially metal-coated second face. | 2014-12-25 |
20140376223 | LIGHT SOURCE WITH LED CHIP AND LUMINOPHORE LAYER - A light source may include an LED chip having a light-emitting surface, on which a luminophore layer is arranged. The luminophore layer may include adjacently arranged regions having different luminophores. A lighting device may include at least one light source. | 2014-12-25 |
20140376224 | ILLUMINATION DEVICES AND METHODS FOR MAKING THE SAME - The present disclosure is generally directed to illumination devices, and methods for making the same. The device, in particular, includes a first conductor layer, a first insulator layer disposed on the first conductor layer and having at least one first aperture defined therein through the first insulator layer, a second conductor layer disposed on the first insulator layer and having at least one second aperture defined therein through the second conductor layer and positioned to align with the at least one first aperture, and a light manipulation layer disposed on the second conductor layer and having at least one pair of apertures defined therein through the light manipulation layer including a third aperture and a fourth aperture, where the third aperture is positioned to align with the at least one second and first apertures. | 2014-12-25 |
20140376225 | Lamp for General Lighting - A lamp includes a lamp housing which has a light exit opening. A light source of a first type is arranged in the lamp housing. A mounting is fastened to the lamp housing and at least one light source of a second type is fastened to the holder. The at least one light source of the second type includes an organic light-emitting diode and the at least one light source of the second type is arranged downstream of the light exit opening in an emission direction. | 2014-12-25 |
20140376226 | LED LIGHT FOR A LIGHT BOX SIGN - A LED light has a main power wire and at least one light module mounted on the main power wire. The at least one light module has a base, a circuit board, at least one LED, a translucent panel and an engaging piece. The circuit board is mounted on a top of the base and a circuit mounted on the circuit board is electrically connected to the main power wire. The at least one LED is mounted on the circuit board. The translucent panel is mounted above the circuit board and has at least one lens corresponding to the at least one LED formed on the translucent panel. The engaging piece is mounted on a bottom of the base to allow a user to easily mount the LED light on a pole of a light box sign. | 2014-12-25 |
20140376227 | LUMINAIRE WITH LONG CHAINS OF LOWER POWER LEDS AND MULTIPLE ON-BOARD LED DRIVERS - A luminaire may include an input connection that receives AC line voltage, one or more chains of LEDs, and one or more drivers for driving each chain of LEDs, all within a housing, which may be in the form of a canopy. Each chain of LEDs may contain at least 36 LEDs connected in series. Each LED may have a power rating of no more than 1 watt and may be oriented to direct light outside of the housing when illuminated. Each driver may receive power that is extracted from AC line voltage connected to the input connection and provide one or more outputs that drive at least one of the chains of LEDs. | 2014-12-25 |
20140376228 | SECURITY LIGHTING SYSTEMS FOR PERIMETER FENCES - A security light for a fence includes a light module having an LED unit and a junction box. The junction box contains electrical components for operating the LED unit, and has a rear end with a rear wall and a front end having a front opening that opposes the rear wall. A clamp assembly is coupled with the junction box and opposes the rear end of the junction box to define an opening for a fence post. The front opening of the junction box provides access to the interior of the junction box for conducting electrical wiring operations. A front cover plate is assembled with the junction box for covering the front opening of the junction box. When the junction box is clamped to the fence post, the front cover plate is removable for providing access to the interior of the junction box. | 2014-12-25 |
20140376229 | OUTDOOR LUMINAIRE - An outdoor luminaire comprising a blue LED chip having a maximum peak at a wavelength of 420-480 nm and a phosphor layer disposed forward of the LED chip in its emission direction is provided. The phosphor layer comprises a phosphor of the formula: Lu | 2014-12-25 |
20140376230 | LIGHT EMITTING DIODE BULB - A light emitting diode bulb includes a lampshade, a lamp housing, a heat sink, a driving circuit, light emitting diode modules and a lamp cap. The lamp housing is connected to the lampshade and includes a cup-shaped casing and a heat conduction part. The heat conduction part is disposed in the cup-shaped casing. The heat sink is disposed in the lampshade and includes a heat-dissipating shell and a heat-dissipating frustum. The heat-dissipating shell covers the heat conduction part. The heat-dissipating frustum includes a top surface, a bottom surface and four side surfaces. The heat-dissipating frustum includes an axis vertical to the bottom surface. An included angle between the axis and each of the side surfaces is smaller than 90 degrees. The light emitting diode modules are adhered to the top surface and the side surfaces and connected to the driving circuit. The lamp cap is connected to the driving circuit. | 2014-12-25 |
20140376231 | UNIVERSAL CORNICE LIGHT FOR PRODUCT DISPLAY - A light fixture assembly for illuminating a display. The light fixture having a heat sink, a lens, and a body. The heat sink has edges and includes at least one corresponding light emitting diode (LED) board including one or more corresponding LEDs for emitting light. The lens has ending edges and is positioned over the heat sink and LED. The body has an inner wall and an outer wall. The body also has at least two pairs of heat sink mounting channels formed in the inner wall. A first pair of heat sink mounting channels is configured for slidably receiving the edges of the heat sink to provide a first orientation of the corresponding LEDs. A second pair of heat sink mounting channels is configured for slidably receiving the edges of the heat sink to provide a second orientation of the corresponding LEDs, with the first orientation being different than the second orientation. | 2014-12-25 |
20140376232 | LIGHTING DEVICE - A lighting device may include a semiconductor light source module, an optical unit, and a common support for the semiconductor light source module and the optical unit. The optical unit is mounted on a front side of the support and has at least one dowel, which extends into a precisely fitting hole in the semiconductor light source module. The semiconductor light source module rests on a rear side of the support. The at least one dowel projects through an aperture in the support and extends into the precisely fitting hole in the semiconductor light source module. The at least one dowel forms a shoulder, which rests on a supporting surface of the semiconductor light source module that rests on the rear side of the support. | 2014-12-25 |
20140376233 | LIGHTING DEVICE - Provided is a lighting device, including: a printed circuit board; one or more light emitting units formed on the printed circuit board; a resin layer which is formed on the printed circuit board, in which the light emitting units are embedded; a diffusion plate formed on an upper side of the resin layer, whereby an entire thickness of the lighting device can be reduced, and when the product is designed, a degree of freedom in design can be improved because flexibility is secured. | 2014-12-25 |
20140376234 | CAMOUFLAGED OPENINGS IN ELECTRONIC DEVICE HOUSINGS - Techniques and apparatus for providing one or more holes in a housing for an electronic device are disclosed. The one or more holes in the housing can be used to facilitate visual indicators. A light source can be controlled to provide light into a hole and thus emit light from the hole. When the light source is not providing light to the hole, the hole can be visually disguised (e.g., camouflaged) so it blends with the surrounding portions of the housing. The electronic device can, for example, be a small electronic device, such as a portable or handheld electronic device. | 2014-12-25 |
20140376235 | LENS WITH DIFFERENT LAYERS AND METHOD MAKING THE SAME - A lens includes a first optical layer, a second optical layer and a third optical layer sequentially stacked. The third optical layer has a light refractive index larger than that of the second optical layer, and the second optical layer has a light refractive layer larger than that of the first optical layer. A method for making the lens is also provided. | 2014-12-25 |
20140376236 | SEMICONDUCTOR LAMP WITH REARWARD BASE REGION - Various embodiments relate to a semiconductor bulb, including a housing, and at least one semiconductor light source that is arranged on the housing. The housing includes a rearward base region that is embodied from an electrically non-conductive material for the purpose of engaging in a bulb socket. At least one electrical contact element is arranged on the base region for the purpose of contacting the bulb socket. The base region is embodied for the purpose of arranging electrical contact elements of different base types. | 2014-12-25 |
20140376237 | METHOD OF MANUFACTURING PROTECTIVE WINDOW AND DISPLAY DEVICE PRODUCED BY USING THE SAME - A display device includes preparing a high hardness film. In the high hardness film, a first supporting member, a silsesquioxane film, and a second supporting member are deposited. The high hardness film is pre-treated, forming a pre-window. A transparent member is formed on a surface of the pre-window through an injection process. The transparent member is formed of polycarbonate. The first supporting member and the second supporting member are formed of polyethylene terephthalate or polyethylene naphthalate. | 2014-12-25 |
20140376238 | LIGHTING DEVICE WITH A CIRCUIT BOARD MOUNTING - The present invention relates to a lighting device ( | 2014-12-25 |
20140376239 | APPARATUS AND METHOD FOR CONTROLLING LIGHTING IN PLANT FACTORY - An apparatus and method for controlling lighting in a plant factory are disclosed. The apparatus includes a weight calculation unit, a height calculation unit, a light information extraction unit, and a distance control unit. The weight calculation unit calculates the weight of at least one crop being cultivated based on a sensing result received from a weight sensor disposed in a crop cultivation bed. The height calculation unit calculates the height of the crop based on information about the growth of the crop corresponding to the weight of the crop. The light information extraction unit extracts information about artificial light corresponding to the height of the crop based on the information about the growth of the crop. The distance control unit controls the height of an artificial lighting device based on the information about artificial light. | 2014-12-25 |
20140376240 | Counter weighted hinged light pole - The invention disclosed herein is a counter weighted hinged light pole which allows easy access to the light fixtures and other devices attached at the top of the light pole to be accessed. The counter weighted hinged light pole consists of a support base, a central support pole which is attached to the base and which has a hinge located at the end opposite the base. A top pole to which the lights and other devices are attached is affixed to the hinge. A second bottom member is also attached to the hinge and is an extension of the top pole in the opposite direction. A counter weight approximating the weight of the light fixtures is attached to the end of the second bottom member. A rope attached to the end of the top pole near the light fixtures enables a worker to lower the light fixtures by applying tension to the rope. The top of the top pole rotates in a downward arc around the hinge. | 2014-12-25 |
20140376241 | BASE, ILLUMINATION APPARATUS USING THE SAME, AND INTERIOR MATERIAL - The base of the present invention includes a fiber base layer containing fibers, and has a basis weight of 300 to 1,500 g/m | 2014-12-25 |
20140376242 | Lighting device - Lighting device for emission of light through a windshield of a vehicle consisting of at least one lighting unit intended to be temporarily mounted on the inside of a windshield with at least one fastening device. The lighting unit consists of at least one reflector, one lamp and at least one seal between the lighting unit and the windshield. The lighting unit is powered by electric energy and the lamp's on and off switch is controlled by at least one sensor designed to detect turned on high-beams which wirelessly sends control signals to the lighting unit. The lighting device consists of a function with which the light's illumination can be adjusted and with which the light can be completely or partially blocked. | 2014-12-25 |
20140376243 | LIGHT EMISSIVE PLASTIC GLAZING - A window assembly having a first transparent area and a light emissive area. The panel includes a first transparent layer with an ultraviolet blocking layer and an abrasion layer. The light emissive area includes a light emissive layer that may be an organic light emitting display, an electroluminescent display, a polymer light emitting display or a light pipe configured to receive light from a light source. | 2014-12-25 |
20140376244 | LIGHT EMITTING APPARATUS AND AUTOMOTIVE LAMP - A light emitting apparatus includes LED chips and a light condenser condensing the light emitted from the LED chips. The light condenser has a first opening functioning as an incident part through which the light emitted from the LED chips enters, a side surface function as a reflector that reflects the light having entered through the first opening, and a second opening functioning as an emission part that emits the light reflected by the side surface. A phosphor layer, which converts the wavelength of the light emitted from the LED chips and emits the wavelength-converted light, is formed in the first opening. The light condenser is arranged such that the phosphor layer is located on the light emission surfaces of the LED chips. | 2014-12-25 |
20140376245 | LIGHTING DEVICE IN A MOTOR VEHICLE - The present invention relates to a lighting device in a motor vehicle. The lighting device includes a light source for emitting light and at least one plate-shaped light conductor, which is made in form of a block optics. The block optics includes two boundary surfaces which run opposite towards each other at a certain distance, a totally reflective side surface between the boundary surfaces, and a light coupling-out area arranged between the boundary surfaces. A coupling-in section is arranged on at least one of the boundary surfaces. The lighting device further includes at least one substantially rod-shaped light conductor with a light output area which extends along the longitudinal extension of the light conductor in addition to the at least one block optics. | 2014-12-25 |
20140376246 | VEHICLE HEADLIGHT AND OPTICAL FIBER BUNDLE USED IN VEHICLE HEADLIGHT - An optical fiber bundle is used in a vehicle headlight, the optical fiber bundle being configured by binding a plurality of optical fibers. Each optical fiber can include a core having an incident end face on which a laser beam is made incident and an emission end face from which the laser beam is emitted. A clad can surround the core. Emission end faces of the respective plurality of optical fibers can be arranged adjacent to one another on a substantially same plane to create an emission end face group, an external shape of which is a substantial rectangle. | 2014-12-25 |