50th week of 2014 patent applcation highlights part 16 |
Patent application number | Title | Published |
20140361416 | RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING RESIN-SEALED SEMICONDUCTOR DEVICE - A resin-sealed semiconductor device | 2014-12-11 |
20140361417 | GROUND SHIELD STRUCTURE AND SEMICONDUCTOR DEVICE - Various embodiments provide ground shield structures, semiconductor devices, and methods for forming the same. An exemplary structure can include a substrate and a dielectric layer disposed on the substrate. The structure can further include multiple conductive rings disposed in the substrate, in the dielectric layer, and/or on the dielectric layer. Each conductive ring of the multiple conductive rings can have openings of about three or more, and the openings of the each conductive ring can divide the multiple conductive rings into a plurality of sub-conductive rings arranged spaced apart. The structure can further a ground ring electrically connected to each of the plurality of sub-conductive rings. | 2014-12-11 |
20140361418 | A SEMICONDUCTOR PACKAGE OF A FLIPPED MOSFET - The invention relates to a semiconductor package of a flip chip and a method for making the semiconductor package. The semiconductor chip comprises a metal-oxide-semiconductor field effect transistor. On a die paddle including a first base, a second base and a third base, half-etching or punching is performed on the top surfaces of the first base and the second base to obtain plurality of grooves that divide the top surface of the first base into a plurality of areas comprising multiple first connecting areas, and divide the top surface of the second base into a plurality of areas comprising at least a second connecting area. The semiconductor chip is connected to the die paddle at the first connecting areas and the second connecting area. | 2014-12-11 |
20140361419 | POWER CONTROL DEVICE AND PREPARATION METHOD THEREOF - A power semiconductor device comprises a lead frame unit, a control die, a first MOSFET die and a second MOSFET die, wherein the lead frame unit comprises at least a die paddle for mounting the first and second MOSFET dies, a first pin and a second pin for connecting to top electrodes of the first and second MOSFET dies, a first row of carrier pins and a second row of carrier pins disposed in-line with the first and second pins respectively for the control die to mount thereon. | 2014-12-11 |
20140361420 | HYBRID PACKAGING MULTI-CHIP SEMICONDUCTOR DEVICE AND PREPARATION METHOD THEREOF - A hybrid packaging multi-chip semiconductor device comprises a lead frame unit, a first semiconductor chip, a second semiconductor chip, a first interconnecting structure and a second interconnecting structure, wherein the first semiconductor chip is attached on a first die paddle and the second semiconductor chip is flipped and attached on a third pin and a second die paddle, the first interconnecting structure electrically connecting a first electrode at a front surface of the first semiconductor chip and a third electrode at a back surface of the second semiconductor chip and a second electrode at the front surface of the first semiconductor chip is electrically connected by second interconnecting structure. | 2014-12-11 |
20140361421 | LEAD FRAME BASED SEMICONDUCTOR DIE PACKAGE - A lead frame based semiconductor die package includes a lead frame having a die pad that supports a semiconductor die and lead fingers that surround the die and die pad. The die is electrically connected to the lead fingers with bond wires. The die and bond wires are covered with an encapsulant with ends of the lead fingers projecting out from the encapsulant. One set of the lead fingers are bent and project down and another set of the lead fingers are bent and project inwardly, and under a bottom surface of the encapsulant. The encapsulant includes a slot or groove for receiving the lead fingers of the second set. | 2014-12-11 |
20140361422 | SEMICONDUCTOR DEVICE - In a QFN that includes a die pad, a semiconductor chip mounted on the die pad, a plurality of leads arranged around the semiconductor chip, a plurality of wires that electrically connect the plurality of electrode pads of the semiconductor chip with the plurality of leads, respectively, and a sealing member sealing the semiconductor chip and the plurality of wires, first and second step portions are formed at shifted positions on the left and right sides of each of the leads to make the positions of the first and second step portions shifted between the adjacent leads. As a result, the gap between the leads is narrowed, thereby achieving the miniaturization or the increase in the number of pins of the QFN. | 2014-12-11 |
20140361423 | Semiconductor Device and Method of Using Leadframe Bodies to Form Openings Through Encapsulant for Vertical Interconnect of Semiconductor Die - A semiconductor device has a leadframe with a plurality of bodies extending from the base plate. A first semiconductor die is mounted to the base plate of the leadframe between the bodies. An encapsulant is deposited over the first semiconductor die and base plate and around the bodies of the leadframe. A portion of the encapsulant over the bodies of the leadframe is removed to form first openings in the encapsulant that expose the bodies. An interconnect structure is formed over the encapsulant and extending into the first openings to the bodies of the leadframe. The leadframe and bodies are removed to form second openings in the encapsulant corresponding to space previously occupied by the bodies to expose the interconnect structure. A second semiconductor die is mounted over the first semiconductor die with bumps extending into the second openings of the encapsulant to electrically connect to the interconnect structure. | 2014-12-11 |
20140361424 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a plurality of semiconductor modules, each of which includes a semiconductor circuit having a circuit board on which at least one or more semiconductor chips are mounted; and a module storage case that accommodates the plurality of semiconductor modules which are arranged in parallel. In the module storage case, a plurality of pairs of positioning guide members, which position and guide the semiconductor modules, are formed on opposite surfaces forming a module storage region for accommodating the semiconductor modules so as to protrude inward and to face each other, so that a distance between the plurality of semiconductor modules in a longitudinal direction can be selected. A pair of fitting concave portions, which are fitted to the pair of positioning guide members, are formed at both ends of each semiconductor module in the longitudinal direction. | 2014-12-11 |
20140361425 | SEMICONDUCTOR DEVICE INCLUDING COOLER - A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together. | 2014-12-11 |
20140361426 | STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME - A stacked semiconductor package includes: a first semiconductor chip formed with a first through electrode, the first through electrode protruding above a first surface of the first semiconductor chip; a first polymer layer formed over the first surface of the first semiconductor chip such that the first through electrode is exposed by the first polymer layer; a second semiconductor chip having a first surface attached onto the first semiconductor chip by medium of the first polymer layer and a vial hole passing through the second semiconductor chip, the first surface of the second semiconductor chip being formed with a bonding pad having a through hole which corresponds to the first through electrode; and a second through electrode located within the through hole and the via hole and is electrically connected with the first through electrode. | 2014-12-11 |
20140361427 | FLEXIBLE STACK PACKAGES, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND MEMORY CARDS INCLUDING THE SAME - Flexible stack packages are provided. The flexible stack package includes a first unit package and a second unit package which are sequentially stacked. Each of the first and second unit packages has a fixed area and a floating area. The fixed area of the first unit package is connected and fixed to the fixed area of the second unit package by a fixing part. | 2014-12-11 |
20140361428 | SEMICONDUCTOR PACKAGES - A semiconductor package comprises a lower package comprising a lower substrate, a lower semiconductor chip on the lower substrate, a lower graphene layer on the lower semiconductor chip, and a lower molding layer between the lower substrate and the lower graphene layer. An upper package is on the lower substrate, the upper package spaced apart from the lower package, the upper package comprising an upper substrate, an upper semiconductor chip, and an upper molding layer. Lower conductive bumps are positioned between the lower substrate and the upper substrate, the lower bumps comprising a ground bump and a signal transmitting bump. | 2014-12-11 |
20140361429 | SEMICONDUCTOR DEVICE WITH BUMPS AND DISPLAY DEVICE MODULE INCORPORATING THE SAME - A semiconductor device includes: a semiconductor chip having a main face which has a pair of long sides parallel to each other and a pair of short sides orthogonal to the pair of long sides; first bumps arrayed in a first bump placement region of the semiconductor chip, the first bump placement region being positioned along one of the pair of long sides; second bumps arrayed in a second bump placement region of the semiconductor chip, the second bump placement region being positioned along the other of the pair of long sides; first power lines disposed in a region between the first bump placement region and the second bump placement region, the first power lines extending in a direction parallel to the pair of long sides; and third bumps integrated on the semiconductor chip. Each of the third bumps provides short-circuiting of the first power lines. | 2014-12-11 |
20140361430 | SEMICONDUCTOR DEVICE - A semiconductor chip and a wiring board are coupled to each other through conductor posts. The centers of conductor posts situated above openings at the outermost periphery shift from the centers of the openings in a direction away from the center of the semiconductor chip. When a region where each of the conductor posts and an insulating layer are overlapped with each other is designated as an overlapped region, the width of the overlapped region more on the inner side than the opening is smaller than the width of the overlapped region more on the outer side than the opening. Thus, while stress applied to the conductor posts is relaxed, coupling reliability between the semiconductor chip and the wiring board is retained. | 2014-12-11 |
20140361431 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a first semiconductor electronic component which includes a pad electrode, a solder bump, and a metal layer between a pad and solder that is configured to have an underlying metal layer formed between the pad electrode and the solder bump and connected to the pad electrode, and a main metal layer formed on the underlying metal layer, and in which the main metal layer has an eave portion at an outer edge portion thereof. | 2014-12-11 |
20140361432 | Pillar Design for Conductive Bump - A system and method for conductive pillars is provided. An embodiment comprises a conductive pillar having trenches located around its outer edge. The trenches are used to channel conductive material such as solder when a conductive bump is formed onto the conductive pillar. The conductive pillar may then be electrically connected to another contact through the conductive material. | 2014-12-11 |
20140361433 | SEMICONDUCTOR DEVICE - A semiconductor device, including: a semiconductor layer; a first conductive layer formed above the semiconductor layer and having a first width; a second conductive layer connected to the first conductive layer and having a second width which is smaller than the first width; an interlayer dielectric formed above the first conductive layer and the second conductive layer; and an electrode pad formed above the interlayer dielectric. A connection section at which the first conductive layer and the second conductive layer are connected is disposed in a specific region positioned inward from a line extending vertically downward from an edge of the electrode pad; and a reinforcing section is provided at the connection section. | 2014-12-11 |
20140361434 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THEREOF, CIRCUIT BOARD AND ELECTRONIC APPARATUS - A semiconductor device is provided comprising: a semiconductor element including a plurality of electrodes; first wirings coupled to the electrodes and directed toward a center of the semiconductor element from a portion coupled to the electrodes; second wirings coupled between the first wirings and external terminals, the second wirings being directed to an outer area of the semiconductor element relative to the center; and at least one resin layer formed between the first wirings and the second wirings. | 2014-12-11 |
20140361435 | METHODS OF FORMING COPPER-BASED NITRIDE LINER/PASSIVATION LAYERS FOR CONDUCTIVE COPPER STRUCTURES AND THE RESULTING DEVICE - One illustrative method disclosed herein includes forming a trench/via in a layer of insulating material, forming a barrier layer in the trench/via, forming a copper-based seed layer on the barrier layer, converting at least a portion of the copper-based seed layer into a copper-based nitride layer, depositing a bulk copper-based material on the copper-based nitride layer so as to overfill the trench/via and performing at least one chemical mechanical polishing process to remove excess materials positioned outside of the trench/via to thereby define a copper-based conductive structure. A device disclosed herein includes a layer of insulating material, a copper-based conductive structure positioned in a trench/via within the layer of insulating material and a copper-based silicon or germanium nitride layer positioned between the copper-based conductive structure and the layer of insulating material. | 2014-12-11 |
20140361436 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, STORAGE MEDIUM AND SEMICONDUCTOR DEVICE - A semiconductor device manufacturing method includes forming a second conductive layer on an underlying layer which has an insulating layer in which a recess is formed and a first conductive layer exposed on a bottom surface of the recess; forming a third conductive layer on the second conductive layer; supplying, into the third conductive layer, a material solid-soluble in the third conductive layer; and heating the third conductive layer into which the solid-soluble material is supplied. | 2014-12-11 |
20140361437 | PACKAGE SUBSTRATES AND METHODS OF FABRICATING THE SAME - Package substrates are provided. The package substrate includes a core layer having a first surface defining trench portions and ridge portions between the trench portions, at least one first trace on a bottom surface of each of the trench portions, and second traces on respective ones of top surfaces of the ridge portions. Related methods are also provided. | 2014-12-11 |
20140361438 | SEAL RING STRUCTURE AND METHOD OF FORMING THE SAME - A method of forming a seal ring structure includes the following steps. A substrate is provided, and the substrate includes a seal ring region. A metal stack is formed in the seal ring region. A first dielectric layer covering the metal stack is formed. A part of the first dielectric layer is removed to form an opening to expose the metal stack, and at least a side of the opening is not perpendicular to a top surface of the first dielectric layer. A conductive layer is formed to fill the opening. A second dielectric layer is formed to continuously cover the first dielectric layer and the conductive layer, and the second dielectric layer has a v-shaped surface totally overlapping the conductive layer. | 2014-12-11 |
20140361439 | PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING SAME - A packaging substrate includes a first wiring layer, a first dielectric layer formed on the first wiring layer, a second wiring layer formed on the first dielectric layer, and a number of copper pillar bumps. Each copper pillar bump includes a base portion and a protruding portion. The base portion is connected to the first wiring layer, and the protruding portion is formed on the base portion. A size of the protruding portion is less than a size of the base portion, and a size of the copper pillar bump gradually increases from the protruding portion to the base portion. | 2014-12-11 |
20140361440 | PROCESS FOR PRODUCING AT LEAST ONE THROUGH-SILICON VIA WITH IMPROVED HEAT DISSIPATION, AND CORRESPONDING THREE-DIMENSIONAL INTEGRATED STRUCTURE - A method for producing at least one through-silicon via inside a substrate may include forming a cavity in the substrate from a first side of the substrate until an electrically conductive portion is emerged onto. The method may also include forming an electrically conductive layer at a bottom and on walls of the cavity, and at least partly on a first side outside the cavity. The process may further include at least partially filling the cavity with at least one phase-change material. Another aspect is directed to a three-dimensional integrated structure. | 2014-12-11 |
20140361441 | STACK PACKAGES AND METHODS OF MANUFACTURING THE SAME - A stack package includes a substrate having connection terminals and a first chip on the substrate. The first chip has first connectors on edges thereof. A second chip is stacked on the first chip to expose outer portions of the first connectors. The second chip has second connectors on edges thereof. Connection members to connect the exposed outer portions of the first connectors to the connection terminals. Sidewall interconnectors to connect the exposed outer portions of the first connectors to the second connectors. The sidewall interconnectors extend from the exposed outer portions of the first connectors along sidewalls of the second chip to cover the second connectors. | 2014-12-11 |
20140361442 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE - The stack package includes a first semiconductor package and a second semiconductor package. The first semiconductor package includes a first substrate having a first modulus and at least one semiconductor chip mounted on the first substrate. The second semiconductor package stacked on the first semiconductor package and includes a second substrate having a second modulus and at least one semiconductor chip mounted on the second substrate. The second modulus is less than the first modulus. Even in the event that the first semiconductor package is under severe warpage due to a temperature change, the flexible second substrate, which includes e.g., polyimide or poly ethylene terephthalate, of the second semiconductor package may be less sensitive to the temperature change, thereby improving reliability of the stack package. | 2014-12-11 |
20140361443 | METHOD OF MANUFACTURING FLIP-CHIP TYPE SEMICONDUCTOR DEVICE - An object of the present invention is to provide a method of manufacturing a flip-chip type semiconductor device with a simplified process, in which various types of information are supplied in a visually recognizable manner. The present invention relates to a method of manufacturing a flip-chip type semiconductor device comprising: a step A of laminating on a semiconductor wafer a film for the backside of a flip-chip type semiconductor, in which the film is to be formed on the backside of a semiconductor element that is flip-chip connected onto an adherend; a step B of dicing the semiconductor wafer; and a step C of laser marking the film for the backside of a flip-chip type semiconductor, wherein the film for the backside of a flip-chip type semiconductor in the step C is uncured. | 2014-12-11 |
20140361444 | SEMICONDUCTOR DEVICE WITH OVERLAPPED LEAD TERMINALS - The size and thickness of a semiconductor device are reduced. A semiconductor package with a flip chip bonding structure includes: a semiconductor chip having a main surface with multiple electrode pads formed therein and a back surface located on the opposite side thereto; four lead terminals each having an upper surface with the semiconductor chip placed thereover and a lower surface located on the opposite side thereto; and a sealing body having a main surface and a back surface located on the opposite side thereto. In this semiconductor package, the distance between adjacent first lower surfaces of the four lead terminals exposed in the back surface of the sealing body is made longer than the distance between adjacent upper surfaces thereof. This makes it possible to suppress the production of a solder bridge when the semiconductor package is solder mounted to a mounting board and to reduce the size and thickness of the semiconductor package and further enhance the reliability of the semiconductor package. | 2014-12-11 |
20140361445 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - When a conductive post is bonded to a bonding target member such as a semiconductor chip or an insulating substrate with conductive patterns by using metal nanoparticles, a strong bonding layer can be obtained by forming a bottom surface of the distal end of the conductive post in a concave shape. | 2014-12-11 |
20140361446 | RESIN-SEALED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A resin-sealed semiconductor device includes a mesa-type semiconductor element which includes a mesa-type semiconductor base body having a pn junction exposure portion in an outer peripheral tapered region surrounding a mesa region, and a glass layer which covers at least the outer peripheral tapered region; and a molding resin which seals the mesa-type semiconductor element, wherein the glass layer is formed by forming a layer made of a predetermined glass composition for protecting a semiconductor junction which substantially contains no Pb such that the layer covers the outer peripheral tapered region and, subsequently, by baking the layer made of the glass composition for protecting a semiconductor junction. | 2014-12-11 |
20140361447 | TURBOMACHINE FUEL-AIR MIXER COMPONENT INCLUDING AN ADDITIVELY MANUFACTURED PORTION JOINED TO A NON-ADDITIVELY MANUFACTURED PORTION AND METHOD - A turbomachine fuel-air mixer component includes a first component portion formed from a non-additive manufacturing process. The first component portion includes a plurality of tube elements each having an end portion. A second, additively manufactured component portion is additively joined to the first component portion. The second, additively manufactured component portion includes a plurality of additively manufactured tube sections constructed at, and fluidically connected with, respective ones of each end portion of the plurality of tube elements. The first and second component portions collectively defining at least a portion of the turbomachine fuel-air mixer component. | 2014-12-11 |
20140361448 | Multi-Layered Evaporative Media Module for Heat Exchange Apparatus - The present invention relates to liquid to air evaporative heat exchange apparatus, mainly for cooling towers, air conditioning units, and humidifies alike. The present invention incorporate an evaporative module embedded with a liquid delivery system through all of its layers. Such a design allows for an even and smooth liquid distribution, while at the same time maximized the duration and surface area for heat exchange to take place. The evaporative module of the present invention can be sealed off at various sections to redirect air flow. Such a design serves dual functions as a drift eliminator or regulator. | 2014-12-11 |
20140361449 | LIQUID DISTRIBUTOR - A liquid flow distributor for positioning above one or more packing sections in a packed exchange tower includes a plurality of troughs. At least one trough in the plurality of troughs has along a side thereto a deflecting member. The deflecting member is angulated to generally follow a shape of the at least one trough. A diffuser side of the deflecting member is positioned to deposit the liquid into a discharge region. A deflector side of the deflecting member is positioned for deflecting ascending vapor away from the discharge region. | 2014-12-11 |
20140361450 | DIRECT FORCED DRAFT FLUID COOLER/COOLING TOWER AND LIQUID COLLECTOR THEREFOR - A water collector for use in fluid coolers, cooling towers and the like is provided with fans at the bottom of the collector, and a plurality of layers of water collection troughs or channels above the fans to capture water droplets sprayed downwardly from the top of the device through a heat exchanger or fill media above the collection troughs. In one embodiment the collection troughs supply the collected water to one or more gutters inside the housing which lead the water to an external collection tank from which the water is recirculated through the system. | 2014-12-11 |
20140361451 | FLUID DISPERSION UNIT WITH DIRECTIONAL COMPONENT VECTOR - A valve-tray assembly and method for lighter fluid heavier fluid contact towers. The active area of the tray is constructed with valves having multiple lighter fluid discharge areas facilitating improved mass transfer efficiency. The valves include first and second support legs oriented in line with the heavier fluid flow with both legs and the valve top constructed with apertures wherein the heavier fluid may flow into engagement with the lighter fluid passing from beneath the tray up, through and out of the valve. | 2014-12-11 |
20140361452 | METHOD AND APPARATUS FOR MAKING A TAPER IN AN OPTICAL FIBER - A method of making a taper in an optical fiber including: securing the optical fiber in a first holder and a second holder, heating the optical fiber, and moving the first holder in a first direction with a pulling speed and at the same time moving the second holder in the first direction with a feeding speed, wherein a ratio of the pulling speed to the feeding speed is greater than one. | 2014-12-11 |
20140361453 | Method and apparatus for appreciating artwork - A system is provided for a blind person to provide the person with the experience of seeing a two dimensional piece of art by scanning the two dimensional piece of art, extracting various features and creating a three dimensional rendition of the two dimensional art using the extracted features. | 2014-12-11 |
20140361454 | Concrete Slab Forming Method - A method for fabricating a concrete slab upon a surface, the concrete slab having a final thickness and having, upon drying, a maximum dry density, the method including steps of providing a body of no-slump concrete, the no-slump concrete including a combination of aggregate and paste; dispensing the no-slump concrete upon the surface in an even depth layer which has an upper surface and includes an air volume, a portion of the paste residing at an upper surface of the even depth layer; removing a portion of the air volume from the no-slump concrete layer by compaction; trowel mulching the paste which resides at the upper surface; and trowel transporting the mulched paste horizontally over the upper surface to form a smooth concrete paste upper slab surface. | 2014-12-11 |
20140361455 | METHOD AND MOLD FOR MANUFACTURING FIBER-REINFORCED PLASTIC STRUCTURE - In the manufacturing method of the present invention, as preparation for providing a mold | 2014-12-11 |
20140361456 | METHOD FOR PRODUCING LONG STRETCHED FILM - A method for producing a long stretched film according to one aspect of the present invention includes at least a step of forming a long film, a step of obliquely stretching the long film and a step of winding the long stretched film. A winding direction of the long stretched film can be arbitrarily changed to a direction oblique to a delivering direction of the long film. In the oblique stretching step, grip release points of gripping tools gripping opposite end parts of the long stretched film are independently movable in the winding direction of the long stretched film and so adjusted that a grip release line connecting the grip release points on respective opposite sides becomes parallel to the width direction of the long stretched film. | 2014-12-11 |
20140361457 | PROCESS FOR PRODUCING MICROPOROUS POLYOLEFIN FILM - In a method for manufacturing a polyolefin microporous film, non-uniformity in a film resulting from non-uniform drying during solvent extraction is minimized, high-speed drying and high-speed continuous productivity of the polyolefin microporous film are implemented. In the method for manufacturing a polyolefin microporous film, in which a composition composed of a polyolefin resin and a plasticizer is made into a film form using extrusion, the plasticize is extracted and removed using a solvent, and the film is thereafter dried. After the foregoing extraction and before the drying, the film is brought into close contact with a roll, or its width is mechanically restrained. A liquid (heating medium) having a temperature greater than r equal to the boiling point of the solvent is made to contact the film while the film is in close contact with the roll or while the width is restrained, whereby the film is heated and dried. | 2014-12-11 |
20140361458 | METHOD OF MANUFACTURING LIQUID EJECTION HEAD - Provided is a method of manufacturing a liquid ejection head, including: forming, on a substrate, a flow path mold pattern that becomes a mold of a liquid flow path; forming a negative photosensitive resin layer on the flow path mold pattern; subjecting the negative photosensitive resin layer to exposure processing with use of a reduction projection exposing apparatus and a mask pattern having an ejection orifice mask shape for forming ejection orifices; and subjecting the negative photosensitive resin layer obtained after the exposure processing to development processing to form the ejection orifices, in which the ejection orifices are formed by correcting, by the ejection orifice mask shape, an inclination of an ejection angle due to an off-axis telecentricity caused by the reduction projection exposing apparatus so as to be close to a direction perpendicular to a surface of the substrate. | 2014-12-11 |
20140361459 | NEEDLE-LIKE MATERIAL AND METHOD FOR MANUFACTURING NEEDLE-LIKE MATERIAL - A needle-shaped structure includes a needle-shaped projection and a support substrate supporting the projection wherein the projection contains at least a chitosan and an organic acid, places a low burden on a living body and is able to keep the microscopic form after puncture into the skin. | 2014-12-11 |
20140361460 | METHODS FOR FIBER REINFORCED ADDITIVE MANUFACTURING - Various embodiments related to three dimensional printers, and reinforced filaments, and their methods of use are described. In one embodiment, a void free reinforced filament is fed into an extrusion nozzle. The reinforced filament includes a core, which may be continuous or semi-continuous, and a matrix material surrounding the core. The reinforced filament is heated to a temperature greater than a melting temperature of the matrix material and less than a melting temperature of the core prior to extruding the filament from the extrusion nozzle. | 2014-12-11 |
20140361461 | METHOD FOR PRODUCING A PLASTIC CONTAINER - A method for producing a plastic container from a first plastic half-shell and a second plastic half-shell, with a first attachment permanently fastened to the first plastic half-shell. | 2014-12-11 |
20140361462 | INJECTION MOLDING - In an injection molding process, the mold parts can be moved relative to each other (separation of the mold parts shown as line | 2014-12-11 |
20140361463 | METHOD AND APPARATUS FOR THREE-DIMENSIONAL FABRICATION - The present invention relates to methods and an apparatus for the fabrication of solid three-dimensional objects from liquid polymerizable materials. | 2014-12-11 |
20140361464 | SYSTEM AND METHOD FOR ADDITIVE MANUFACTURING - A method for forming a component includes providing a first layer of a mixture of first and second powders. The method includes determining the frequency of an alternating magnetic field to induce eddy currents sufficient to bulk heat only one of the first and second powders. The alternating magnetic field is applied at the determined frequency to a portion of the first layer of the mixture using a flux concentrator. Exposure to the magnetic field changes the phase of at least a portion of the first powder to liquid. A change in power transferred to the powder during a phase change in the powder is calculated to determine the quality of component formation. | 2014-12-11 |
20140361465 | Method for Recycling Furniture, in Particular Bed Bases, Web of Material Obtained by Such A Method, and Associated Recycling Installation - The invention relates to a method for recycling furniture containing wooden parts, in particular bed bases, the method comprising the following steps: | 2014-12-11 |
20140361466 | Method for Preparing A Sample of Rock Cuttings Extracted From A Subsoil and Associated Analysis Assembly - The method comprises placing a sample of rock on a mold surface ( | 2014-12-11 |
20140361467 | METHOD AND DEVICE FOR MOLDING FIBER-REINFORCED PLASTIC MEMBER - A method for molding a fiber-reinforced plastic member involves disposing a reinforced-fiber base material | 2014-12-11 |
20140361468 | METHOD FOR MANUFACTURING A COMPOSITE USING A DEGRADABLE MEMBRANE - A method for manufacturing a composite is provided herein, including laying at least one reinforcement layer onto the inner surface of a mould, positioning a degradable membrane onto the outermost reinforcement layer of the at least one reinforcement layer, applying suction between the inner surface of the mould and the degradable membrane to press the at least one reinforcement layer towards the inner surface of the mould, covering the degradable membrane with at least one vacuum film, generating a vacuum in the region between the vacuum film and the mould, injecting resin into this region by means of vacuum, and letting cure the resin, initiating a degradation of the degradable membrane by provoking a physical or chemical change of the membrane material after having generated a vacuum in the region between the vacuum film and the mould and before the resin has cured completely. | 2014-12-11 |
20140361469 | COMPOSITE SHEET HAVING A CORE HAVING END WALLS AND A MAT WITH FIBERS - This invention relates to a composite sheet and a method of making a composite sheet. A core having end walls is provided. Continuous fibers or a continuous fiber mat is secured to the core such that the continuous fibers align with the end walls of the core. Various manufacturing methods are disclosed. | 2014-12-11 |
20140361470 | MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR PRODUCING THE SAME - When a multilayer ceramic substrate with a cavity is reduced in thickness, a bottom wall portion defining the bottom of the cavity is reduced in thickness, thereby leading to the problem that the bottom wall portion is likely to be broken. A bottom wall portion defining a cavity of a multilayer ceramic substrate has a stack structure formed with a high thermal expansion coefficient layer sandwiched between first and second low thermal expansion coefficient layers. This configuration generates compression stress in the low thermal expansion coefficient layers during a cooling process after firing, thereby allowing the mechanical strength at the bottom wall portion to be improved. | 2014-12-11 |
20140361471 | Rapid curing of thin composite material sections - A method of preparing and rapidly curing a composite material having a thin cross section. The composite material includes a mixture of solid particles, at least some of which are a material that reacts with CO | 2014-12-11 |
20140361472 | METHOD AND DEVICE FOR OPERATING A SMELTING REDUCTION PROCESS - In a method and a device for operating a smelting reduction process, at least part of an export gas from a blast furnace or a reduction unit is thermally utilized in a gas turbine and the exhaust gas of this gas turbine is used in a waste heat steam generator to generate steam. The remaining part of the export gas is fed to a CO | 2014-12-11 |
20140361473 | VARIABLE PEDAL FEELING ADJUSTMENT DEVICE - Disclosed herein is a variable pedal feeling adjustment device. A pedal simulator includes a simulator block formed with an oil hole at an upper portion thereof which is connected to a master cylinder to receive hydraulic pressure caused by pedal effort of a driver and a bore which communicates with the oil hole, a first reaction unit and a second reaction unit arranged in series in the bore and configured to be pressurized sequentially by pedal effort, and a damping housing configured to support the second reaction unit and installed to a lower portion of the bore while being restricted in rotation. An actuator includes a spindle screw-coupled to the damping housing and a motor connected to the spindle to supply rotational force to the spindle. The damping housing is moved linearly and changed in position by forward and backward rotation of the spindle. | 2014-12-11 |
20140361474 | CHAMBER CLUSTER FOR A CO-AXIAL DAMPER UNIT IN A SUSPENSION MODULE - A chamber cluster ( | 2014-12-11 |
20140361475 | RUBBER COMPOSITION FOR RUBBER VIBRATION INSULATOR - A rubber composition gives rise to a rubber vibration insulator superior not only in heat resistance and low-temperature performance but also in fundamental properties and damping properties. The rubber composition for rubber vibration insulator comprising: a rubber component comprising high-cis-high-vinyl butadiene rubber containing 85 to 93% of cis-1,4 bonds and 5 to 13% of vinyl bonds, sulfur, and a bismaleimide compound, wherein the sulfur is included in an amount of up to 1 part by weight, per 100 parts by weight of the rubber component. | 2014-12-11 |
20140361476 | SEPARATING APPARATUS - A separating apparatus for separating stacked magnetically conductible workpieces, includes a support assembly and a magnet assembly positioned adjacent to the support assembly. The support assembly includes a support member and a support rod fixedly coupled with the support member, the support is used for supporting the tacked magnetically conductible workpieces. The magnet assembly includes a holding member and at least one magnet member received in the holding member. The inner magnetic field of the at least one magnet member has a direction parallel to an extending direction of the support member. The at least one holding member is spaced from the support rod by a predetermined distance thereby separating the stacked magnetically conductible workpieces apart along the support rod via the inner magnetic field of the at least one magnet member. | 2014-12-11 |
20140361477 | Tool for Clamping Using End Faces of Workpieces - A tool for clamping using end surfaces of box workpieces, comprises a soleplate and an upper template. A tightening cylinder has a piston rod connected with a top plate, and the top plate and the piston rods are in swinging connection. Three protrusions are arranged on the upper surface of the top plate and distributed in a triangle shape. A rotating shaft is arranged beside a position of the upper template, the upper end of the rotating shaft is provided with a hand wheel capable of driving the rotating shaft to rotate, the rotating shaft is sleeved with a compression spring on the portion between the hand wheel and the upper surface of the upper template, and the lower end of the rotating shaft is fixed with one end of a transverse support rod which is linked with the rotating shaft. | 2014-12-11 |
20140361478 | ELECTRIC CLAMP APPARATUS - An electric clamp apparatus includes a body, a rotary drive unit which is driven rotatably by an electric signal, and a rotary body rotated under a driving action of the rotary drive unit. Gear teeth of a clamp arm are enmeshed with helical screw grooves formed on the outer circumferential surface of the rotary body. The rotary body is rotated by driving the rotary drive unit, whereby the clamp arm, which is enmeshed with the screw grooves, is rotated through a predetermined angle to bring about a clamped state for clamping a workpiece. | 2014-12-11 |
20140361479 | BENCH VICE - A bench vice includes a fixed vice body, a movable vice body, a screw rod, a screw nut, a quick-action mechanism, and an operating handle. The quick-action mechanism controls the screw rod and screw nut to engage or disengage so as to move slowly or quickly. The operating handle operates the quick-action mechanism. The movable vice body is assembled with the screw rod into an assembly, and both the quick-action mechanism and the operating handle are arranged on the front end of the fixed vice body. Since the quick-action mechanism and the operating handle are arranged on the front end of the fixed vice body, the operator can operate more conveniently, and thereby the working efficiency is improved. | 2014-12-11 |
20140361480 | PRECISION ALIGNMENT UNIT FOR SEMICONDUCTOR TRAYS - A precision alignment unit and techniques are described that include a tray assembly configured to be used in a testing system, where the tray assembly includes at least one pocket formed in the tray assembly, the pocket configured to contain an integrated circuit chip, and at least one pin pass-through, and a device positioning unit including at least one alignment device configured to extend through the at least one pin pass-through. In implementations, a process for using the precision alignment system that employs the techniques of the present disclosure includes mounting a precision alignment unit to a vacuum chuck of a handler; loading at least one alignment tray into the handler; placing the at least one alignment tray on the precision alignment unit; and aligning at least one integrated circuit chip device disposed on the at least one alignment tray. | 2014-12-11 |
20140361481 | AUTOMATIC DOCUMENT FEEDER - An automatic document feeder includes a paper transmitting path for guiding documents, a driving motor for providing driving torque, a pickup device disposed at the upstream of the paper transmitting path, an output device disposed at the downstream of the paper transmitting path and transmitting rollers disposed along the paper transmitting path for transmitting the documents, a first driving gear disposed between the pickup device and the output device, a transmitting gear swing arm equipped with a transmitting gear set and axially hinged with the first driving gear to swing according to the driving torque between a first position meshing the transmitting gear set with the pickup device and a second position idling the transmitting gear set, an actuator connected with the output device and a braking device disposed on the output device for locking the transmitting gear swing arm according to the position of the output device. | 2014-12-11 |
20140361482 | SHEET DETECTING APPARATUS, SHEET CONVEYING APPARATUS, AND IMAGE FORMING APPARATUS - A sheet detecting apparatus including: a detection unit including a lever member having an abutment surface abutting a conveying sheet and a holding member configured to hold the lever member, the detection unit moved by the lever member pushed by the sheet; a first urging portion configured to urge the holding member to a waiting position after the sheet is separated from the abutment surface; a support portion configured to support the lever member movable with respect to the holding member to move the lever member to a retracted position for allowing the sheet to pass the lever member contacting a surface of the sheet when the holding member is in the waiting position; and a second urging portion configured to urge the lever member so that the lever member is moved from the retracted position to a position in which the abutment surface abuts a succeeding sheet. | 2014-12-11 |
20140361483 | SHEET CONVEYING APPARATUS AND IMAGE FORMING APPARATUS - A sheet conveying apparatus including: a locking member having an abutment surface abutting a sheet to correct skew feed of the sheet; a holding member configured to hold the locking member to rotate from a waiting position when the locking member is pushed by the sheet; a roller pair configured to nip the sheet abutting the abutment surface; a first urging portion configured to urge the holding member to the waiting position; a movable support portion configured to support the locking member in a manner that the locking member is located a retracted position where the locking member contacts a surface of the sheet and allows the sheet to pass; and a second urging portion configured to urge the locking member to a position where the abutment surface abuts a succeeding sheet. | 2014-12-11 |
20140361484 | ROULETTE-STYLE GAME OF CHANCE - A method of playing a game of chance including providing a game layout surface having a plurality of discrete wagering areas each configured for receiving a wager on the outcome of the game of chance. A card shuffling device is disposed adjacent the game layout surface and configured to rotate about a vertical axis. The device includes thirty eight slots configured to receive an individual card from among a defined set of cards. Each of the set of cards includes indicia thereon relevant to the outcome of the game of chance. One of the set of cards has indicia of a black joker and one of the set of cards has indicia of a color joker. After the cards are located in the slots and wagers are placed in one or more of the plurality of wagering areas, the card shuffling device is rotated. A card from among the set of cards is then selected to determine the outcome of the game of chance. The one or more wagers are then resolved based on the outcome according to the payouts of a conventional roulette game. | 2014-12-11 |
20140361485 | ROTATIONAL MOTION DICE GAME SYSTEM - A rotational motion dice game system is provided. The system includes a circular surface centered around a central vertical axis. Then, a first driving mechanism is connected to the circular surface and configured to move between a first position and a second position along the central vertical axis. A ring surface is positioned above the circular surface and configured for rotational motion around the central vertical axis. A plurality of bumpers is arranged in a circumference along the ring surface. Finally, a controller is connected to the first driving mechanism and configured to cause the movement of the driving mechanism from the first position to the second position, further causing the movement of the circular surface from the first position to the second position in order to cause the movement of at least one die residing on the circular surface. | 2014-12-11 |
20140361486 | U.S. Presidential Election Campaign Game and Method of Play - Described is a United States presidential election campaign board game. The board game includes a game board on which a map of the United States is drawn, wherein the map shows the boundaries between the different states. The game board includes an election headquarters space that is centrally located on the map and which provides the starting space for the game. Players take turns rolling a die that determines the number of spaces players can move along any of a plurality of player paths towards several campaign centers. Players start the game with a predetermined amount of money and raise and spend campaign funds throughout the game in order to gain the highest number of electoral votes. Campaign funds can be used to win electoral votes at each campaign center, and players can gain electoral votes by rolling a die or by drawing from a deck of game cards. | 2014-12-11 |
20140361487 | MAHJONG GAME SET - A mahjong game set has a table and four mahjong tile sets. A tabletop of the table has a concaved surface and multiple tile holders; wherein each tile holder has multiple tile standing recesses and multiple tile displaying recesses. Each mahjong tile set has multiple mahjong tiles respectively having different pattern surfaces or character surfaces, and each mahjong tile is spherical. When playing a mahjong match using the mahjong game set, each player selects a mahjong tile and throws the selected mahjong tile hard into the concaved surface of the table. The spherical mahjong tile rolls in the concaved surface and does not slip out of the tabletop. The players get sufficient exercise by throwing the mahjong tiles | 2014-12-11 |
20140361488 | INTERACTIVE AMUSEMENT GAME - An interactive amusement game in which players collect projectiles emitted randomly from a centralized location. A preferred embodiment has a centralized location constructed in the shape of a garbage can which randomly ejects plastic flies through apertures in the housing lid. Players surround the centralized location with plastic fly swatters constructed with non-permanent adhering means that attach to the flies emitted from the centralized location. | 2014-12-11 |
20140361489 | Axially Retractable Brush Seal System - The present application provides an axially retractable seal system positioned within a seal slot of a stationary component and adjacent to a rotating component. The axially retractable seal system may include a seal with an upper flange positioned within the seal slot and one more bristles extending towards the rotating component and a spring positioned axially between the upper flange of seal and the seal slot such that the seal is forced into a retracted position. | 2014-12-11 |
20140361490 | Pressure Resistant Static and Dynamic Seal Assembly and Method - A shaft sealing assembly for static and dynamic sealing includes a stator member attached to a housing and a rotor member attached to a shaft rotatable about an axis. The rotor member includes first and second pocket sections extending from upper and lower radial flanges extending in a cantilevered fashion from a tubular member. At least one static sealing member is attached to and encapsulates each pocket section. Each static sealing member presents a core portion and a pair of radial lips extending from the core portion. The stator member presents an annular wall extending to inner walls inclined conically to a central radial rim or flange separating two pocket portions and the static sealing members presenting a contact and frictionally engaging with the central radial rim as the rotor member is at a stand-still or static position. | 2014-12-11 |
20140361491 | EMERGENCY SACRIFICIAL SEALING METHOD IN FILTERS, EQUIPMENT, OR SYSTEMS - A system seals a filter or equipment component to abase and will continue to seal the filter or equipment component to the base in the event of hot air or fire. The system includes a first sealing material between the filter or equipment component and the base; and a second sealing material between the filter or equipment component and the base and proximate the first sealing material. The first sealing material and the second seal material are positioned relative to each other and relative to the filter or equipment component and the base to seal the filter or equipment component to the base and upon the event of fire the second sealing material will be activated and expand to continue to seal the filter or equipment component to the base in the event of hot air or fire. | 2014-12-11 |
20140361492 | SYSTEM, METHOD AND APPARATUS FOR SPRING-ENERGIZED DYNAMIC SEALING ASSEMBLY - A seal assembly is disclosed. The seal comprises a metal spring bonded to an elastomer body that is coupled to a polymer ring. The spring may comprise a cantilevered, overlapped metal strip. The elastomer and polymer mechanically interlock with radial members. The elastomer has contacting surfaces configured in outward extending radii to enhance forward edge loading and oil removal from the dynamic surface. In hydraulic service, the seal prevents the egress of hydraulic fluid and ingress of foreign particles. | 2014-12-11 |
20140361493 | SEALING DEVICE - A sealing device is provided for use with an assembly having radially inner and outer parts in fluid communication and movable relative to one another. The sealing device includes a first annular lip which defines an opening for receiving the radially inner part, and an annular channel disposed radially outward of the opening. The first annular lip is configured and adapted for deformation and compressive sealed engagement with the radially inner part while permitting movement of the radially inner part relative thereto. An annular body integrally formed with the first annular lip of the sealing device defines an interior space in communication with the annular channel and the opening. The annular body extends radially outward of the first annular lip and is configured and adapted for sealed engagement with the radially outer part. | 2014-12-11 |
20140361494 | SYSTEM, METHOD AND APPARATUS FOR SPRING-ENERGIZED DYNAMIC SEALING ASSEMBLY - A seal assembly is disclosed. The seal comprises a metal spring bonded to an elastomer body that is coupled to a polymer ring. The spring may comprise a cantilevered, overlapped metal strip. The elastomer and polymer mechanically interlock with radial members. The elastomer has contacting surfaces configured in outward extending radii to enhance forward edge loading and oil removal from the dynamic surface. In hydraulic service, the seal prevents the egress of hydraulic fluid and ingress of foreign particles. | 2014-12-11 |
20140361495 | Static Gasket and Method of Construction Thereof - A metal static gasket and method of construction thereof is provided. The gasket includes at least one metal layer. At least one of the metal layers has opposite sides with at least one through opening extending through the opposite sides, with the through opening being configured to register with an opening to be sealed. At least one metal layer of the gasket has least one raised annular seal bead extending adjacent the through opening. A plurality of protrusions extend outwardly from at least one of the opposite sides, wherein the plurality of protrusions are formed from separate pieces of metal from the at least one metal layer and are individually fixed to the at least one metal layer via separate bond joints. | 2014-12-11 |
20140361496 | SPHERICAL ANNULAR SEAL MEMBER AND METHOD OF MANUFACTURING THE SAME - A spherical annular seal member | 2014-12-11 |
20140361497 | SWELLABLE ENERGIZERS FOR OIL AND GAS WELLS - A seal stack including a sealing element including an annular seal ring having a diameter and an axis defined therethrough perpendicular to the diameter, a groove defined in the seal ring, wherein the groove has an opening at a first end of the seal ring, and a swellable energizer disposed in the groove, wherein the swellable energizer swells upon exposure to a solvent causing the seal ring to expand. The seal stack also includes a first annular back-up and a second annular back-up provided at opposing ends of the sealing element, wherein said first back-up includes an interior surface that receives a second end of the sealing element. | 2014-12-11 |
20140361498 | MOVABLE INSTALLATION PARTS OR MACHINE PARTS WITH A COVER DEVICE - The object of the invention is a cover device ( | 2014-12-11 |
20140361499 | SHAPE MEMORY ALLOY INTERSEGMENT SEALS - A high-temperature seal for use in sealing gaps between adjacent turbine components includes a seal body constructed of a shape-memory alloy having inoperative size and shape that, in use, expands to an operative size and shape where it is in sealing engagement with the adjacent turbine component upon reaching a predetermined transition temperature. Upon subsequent cooling to a temperature below the predetermined temperature, the seal body reverts to the first inoperative shape or to another inoperative size and shape. | 2014-12-11 |
20140361500 | EXPANDABLE ARBOR, CLAMPING SYSTEM AND METHOD OF CLAMPING ONE OF A WORKPIECE AND A TOOL TO A MACHINE - An expandable arbor for rotatably mounting an object to a machine tool comprises a mounting portion fastenable to a machine tool spindle and a clamping portion located on the mounting portion. The clamping portion comprises a finger extending from the mounting portion, an expandable sleeve coupled to the finger, and a nut for coupling the expandable sleeve to the mounting portion and for coupling the mounting portion to the rotating spindle. The expansion of the expandable sleeve allows for the clamping of the expandable sleeve to an internal surface of a tool or workpiece. | 2014-12-11 |
20140361501 | CARRIER - A carrier including a body and a gravity modulating module disposed at the body is provided. The gravity modulating module includes a weight block, a tilting sensing assembly and a driver. The tilting sensing assembly is adapted for sensing the tilting condition of the body and sending a left turning signal or a right turning signal. The driver is adapted to move the weight block according to the left turning signal or the right turning signal, so that the center of gravity of the carrier shifts to keep balance. | 2014-12-11 |
20140361502 | STRADDLE-TYPE VEHICLE - A straddle-type vehicle including left and right front wheels effectively prevents deterioration of a travel feeling caused by vibrations occurring in the left and right front wheels. The straddle-type vehicle includes a body frame, left and right front wheels, a link mechanism configured to connect the left and right front wheels with the body frame, a shock absorber configured to damp vibrations in the same phase occurring in the left and right front wheels, and a damper configured to damp vibrations in opposite phases occurring in the left and right front wheels. The damper is configured such that its damping force increases at least in a certain frequency range as the frequency of the vibrations in the opposite phases increases. | 2014-12-11 |
20140361503 | WHEEL FRAME FOR A SKATEBOARD - An improved wheel frame for a skateboard, wherein slipping wheels connect with a skateboard body stably, comprises: a wheel frame main body having a screw hole on each side; two wheel axles for screwing in the screw hole of the wheel frame main body, wherein in each axle a through hole is set, the through hole has at least one longitudinal expansion joint in the thread for flexible expanding the diameter; and an expansion element for setting in the through hole of the both axles, wherein the diameter of the thread within the axle is forced to expand, so that the thread of the axles and the screw holes of the wheel frame main body are firmly held together. | 2014-12-11 |
20140361504 | Axle Adjustment for Axles of Utility Vehicles - An axle adjustment for axles of utility vehicles includes a frame unit, an eccentric element, and an adjustment unit, wherein the eccentric element has a first contour engageable by a select one of the frame unit and the adjustment unit, and the eccentric element) has a second contour engageable by the other of the frame unit and the adjustment unit, wherein the first contour is arranged eccentric to the second contour, and wherein the frame unit and the adjustment unit are secured in a predetermined position in an adjustment direction and supported pivotably relative to each other by setting a certain angle of twist of the eccentric element. | 2014-12-11 |
20140361505 | KINGPIN ASSEMBLY FOR STEERING AND SUSPENSION LINKAGE ASSEMBLY - A kingpin assembly for pivotally supporting a steering knuckle of a steering linkage assembly is disclosed herein. The kingpin assembly includes a pin and a bearing mount assembly. The pin includes a shoulder disposed between a first tapered portion and a second tapered portion. The first tapered portion is structured and arranged for load bearing and is in engagement with the steering knuckle. The second tapered portion is in reverse taper configuration relative to the first tapered portion, measured axially along the pin. The bearing mount assembly has a first bearing half and a second bearing half. The first and second bearing halves sandwiches the second tapered portion for retention thereof. Each of the first and second bearing halves is in engagement with the steering knuckle. | 2014-12-11 |
20140361506 | MOTORBIKE STEERING AND SUSPENSION SYSTEM - A steering and suspension mechanism for a motorbike, scooter, bicycle, skateboard or other two wheeled, in-line, vehicle, incorporating a steering axis rake that is inclined to the vertical, in a direction that is upwards and forwards from the ground in the normal direction of travel, together with a trailing radial arm suspension, in combination. Steering may be effected via a push rod attached to the handlebars, which in turn pivot on the main chassis. A brake calliper may be pivoted on the wheel axle, with a link to the steering head assembly to prevent rotation of the calliper with the brake disc under braking. This link may be parallel or nearly parallel to the radial arm. The exact angle can be chosen to control ‘dive’ due to weight shift under braking. | 2014-12-11 |
20140361507 | LOWER ARM FOR VEHICLE SUSPENSION SYSTEM - The present invention relates to a lower arm for vehicle suspension system comprising a first bush mounting part and a second bush mounting part mounted to a front member mounting assembly of a vehicle chassis to be spaced apart therebetween at front and rear, a first arm having one end part connected to the first bush mounting part and the other end part extruding laterally from the vehicle chassis to be connected to a ball joint mounting part to support a wheel mounting assembly, and a second arm having one end part extending integrally from the first arm and the other end part connected to the second bush mounting part, wherein the first arm is formed by forming a metal plate, the one end part of the first arm connected to the first bush mounting part has a pair of ring members which are formed by forming the metal plate to be parallel therebetween in an axial direction and to contact and support through their inner round surfaces an outer round surface of the first bush mounting part. Therefore, welding parts are removed in the manufacturing process so that easy manufacturing, high strength and weight reduction compared to the conventional art can be accomplished. | 2014-12-11 |
20140361508 | SUSPENSION ARM MOUNTING STRUCTURE - A suspension arm mounting structure comprises: an arm body section ( | 2014-12-11 |
20140361509 | BICYCLE FRAME ASSEMBLY - A bicycle frame assembly is formed of a head tube, a seat tube, a linking member, and a support holder. The linking member includes a first part, two second parts, and two positioning parts. The first part is connected with the seat tube. The two positioning parts are spaced from each other and extend in an interval toward the head tube from the first part to jointly form a limiting portion therebetween. The two second parts are connected with the head tube and located between the head tube and the two positioning parts. The support holder is movably mounted to the limiting portion relative to the linking member for accommodating a portable part or accessory. Therefore, the present invention facilitates that the rider can take or put the portable part or accessory from or into the support holder with his or her natural riding posture. | 2014-12-11 |
20140361510 | Bicycle - The present invention concerns a pedal cycle which is devised in such a way that, in order to improve on the fact that principally with unicycles the rider cannot easily mount, the space inside the hub is provided with a plurality of rollers for dividing up and receiving the weight transmitted to the frame at a downwardly widening angle rather than in the centre of the wheel, and a geared drive force is transmitted to the wheel via a gear coupled to a pedal shaft passing through one end of the rollers. | 2014-12-11 |
20140361511 | BICYCLE TRANSMISSION - A chainless drive mechanism for a bicycle using pedal arms, one on each side of the bicycle, each pedal arm carrying a pedal engageable with a rider's foot. Each pedal arm is mounted to a crank by a rotating joint and connected to the frame of the bicycle by a link, each link having rotating joints at each end. The cranks are connected by a shaft passing through the hub of to the driven wheel of the bicycle. The cranks may be connected to the driven wheel by a multi ratio free wheeling gear mechanism. | 2014-12-11 |
20140361512 | SADDLE-RIDE TYPE VEHICLE - A saddle-ride type vehicle may include a rear cushion that extends upward while one end thereof in a longitudinal direction is connected to a swing arm and that elongates and contracts in the longitudinal direction according to swinging of the swing arm to generate damping force with respect to the swinging of the swing arm, and a rear cushion supporting portion that is provided to a center upper cross frame provided in an upper portion of a vehicle and that supports the other end of the rear cushion in the longitudinal direction. The center upper cross frame is positioned on an extension line of the rear cushion in the longitudinal direction, an opening that penetrates through a horizontal direction is formed in a pivot plates, and in a side view, a rear cushion supporting portion is positioned inside of the opening. | 2014-12-11 |
20140361513 | Gooseneck Trailer with Coupling Link Actuators - Trailer with a detachable gooseneck having a deck supported toward the rear by ground engaging wheels, mating surfaces on the gooseneck and the deck which abut against each other when the gooseneck is attached to the deck, coupling pins extending along spaced apart, parallel axes from the gooseneck and the deck on opposite sides of the abutting surfaces, a coupling link movable along the pin on the gooseneck between a first position in which the link engages the pin on the deck and a second position in which the link is disengaged from the pin on the deck, and an actuator for moving the coupling link between the first and second positions. A latch hook is rotatively mounted on the deck to the rear of the abutting surfaces for engagement with a laterally extending latch bar which depends from the gooseneck, and a pneumatic actuator is operatively connected to the latch hook for moving the latch hook into and out of engagement with the latch bar. | 2014-12-11 |
20140361514 | SAFETY SKI BINDING SYSTEM - The invention relates to a safety ski binding system for the releasable fixing of a ski boot to a ski having an adjustable release mechanism and fixed holding elements. In accordance with the invention, two latching elements which each project laterally from the ski boot and which cooperate with a holder element formed fixed to the ski as a heel holder are arranged at the ski boot. The invention further relates to a ski boot which forms a part of the aforesaid safety binding system. | 2014-12-11 |
20140361515 | FOLDING VEHICLE - A folding vehicle structure includes a frame having a plurality of members. A first member intersects a second member at a first pivot point. A third member, spaced from the first and second members, intersects a fourth member, which is also spaced from the first and second members, at a second pivot point. The frame includes a first cross-member extending between the first and second intersection points. The frame is collapsible. | 2014-12-11 |