44th week of 2012 patent applcation highlights part 16 |
Patent application number | Title | Published |
20120273927 | Semiconductor Device and Method of Forming Wafer Level Multi-Row Etched Lead Package - A semiconductor device has a base carrier having first and second opposing surfaces. The first surface of the base carrier is etched to form a plurality of cavities and multiple rows of base leads between the cavities extending between the first and second surfaces. A second conductive layer is formed over the second surface of the base carrier. A semiconductor die is mounted within a cavity of the base carrier. A first insulating layer is formed over the die and first surface of the base carrier and into the cavities. A first conductive layer is formed over the first insulating layer and first surface of the base carrier. A second insulating layer is formed over the first insulating layer and first conductive layer. A portion of the second surface of the base carrier is removed to expose the first insulating layer and electrically isolate the base leads. | 2012-11-01 |
20120273928 | CHIP ON FILM TYPE SEMICONDUCTOR PACKAGE - A chip on film (COF) type semiconductor package is provided. The chip on film (COF) type semiconductor package includes a film, a plurality of leads formed on a surface of the film, a chip adhered to ends of the leads, an underfill layer filled within a space between the chip and the leads, and a heat dissipation layer adhered to an other surface of the film, the heat dissipation layer including a graphite material layer, a protection layer formed on a surface of the graphite material layer to cover the graphite material layer, and an adhesion layer formed on an other surface of the graphite material layer to adhere the heat dissipation layer to the other surface of the film. | 2012-11-01 |
20120273929 | MULTI-DIE PACKAGES INCORPORATING FLIP CHIP DIES AND ASSOCIATED PACKAGING METHODS - The present technology discloses a multi-die package. The package comprises a lead frame structure and three dies including a first flip chip die, a second flip chip die and a third flip chip die stacked vertically. The first flip chip die is mounted on the bottom surface of the lead frame structure through the flip chip bumps; the second flip chip is mounted on the top surface of the first flip chip die through flip chip bumps; and the third flip chip die is mounted on the top surface of the lead frame structure through flip chip bumps. | 2012-11-01 |
20120273930 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME - A semiconductor package structure is provided, including: a semiconductor chip having electrode pads disposed thereon and metal bumps disposed on the electrode pads; an encapsulant encapsulating the semiconductor chip; a dielectric layer formed on the encapsulant and having a plurality of patterned intaglios formed therein for exposing the metal bumps; a wiring layer formed in the patterned intaglios of the dielectric layer and electrically connected to the metal bumps; and a metal foil having a plurality of metal posts disposed on a surface thereof such that the metal foil is disposed on the encapsulant with the metal posts penetrating the encapsulant so as to extend to the inactive surface of the semiconductor chip. Compared with the prior art, the present invention reduces the overall thickness of the package structure, increases the electrical transmission efficiency and improves the heat dissipating effect. | 2012-11-01 |
20120273931 | Integrated circuit chip package and manufacturing method thereof - The present invention discloses an integrated circuit (IC) chip package and a manufacturing method thereof. The IC chip package includes: a lead frame, including a lead frame array having plural conductive cells, wherein some of the conductive cells are respectively electrically connected with corresponding first extended wires; at least one redistribution layer, wherein each redistribution layer includes plural second extended wires, which are respectively electrically connected to the first extended wires or the second extended wires of another redistribution layer; and a solder array, including plural solder balls, which are electrically connected to the lead frame array. | 2012-11-01 |
20120273932 | POWER SUPPLY MODULE AND PACKAGING AND INTEGRATING METHOD THEREOF - A power supply module and a packaging and integrating method thereof are provided. The power supply module includes a lead frame, a passive element, an integrated circuit (IC), and a power switch Metallic Oxide Semiconductor Field Effect Transistor (MOSFET). The passive element is soldered onto the lead frame by using the surface mount technology. The IC is a flip chip and is mounted and soldered onto the lead frame. | 2012-11-01 |
20120273933 | THREE-DIMENSIONAL SYSTEM-IN-A-PACKAGE - A microelectronic assembly can include first, second and third stacked substantially planar elements, e.g., of dielectric or semiconductor material, and which may have a CTE of less than 10 ppm/° C. The assembly may be a microelectronic package and may incorporate active semiconductor devices in one, two or more of the first, second or third elements to function cooperatively as a system-in-a-package. In one example, an electrically conductive element having a minimum thickness less than 10 microns, may be formed by plating, and may electrically connect two or more of the first, second or third elements. The conductive element may entirely underlie a surface of another one of the substantially planar elements. | 2012-11-01 |
20120273934 | REDUCED-STRESS BUMP-ON-TRACE (BOT) STRUCTURES - The embodiments of bump-on-trace (BOT) structures and their layout on a die described reduce stresses on the dielectric layer on the metal pad and on the metal traces of the BOT structures. By orienting the axes of the metal bumps away from being parallel to the metal traces, the stresses can be reduced, which can reduce the risk of delamination of the metal traces from the substrate and the dielectric layer from the metal pad. Further, the stresses of the dielectric layer on the metal pad and on the metal traces may also be reduced by orienting the axes of the metal traces toward the center of the die. As a result, the yield can be increased. | 2012-11-01 |
20120273935 | Semiconductor Device and Method of Making a Semiconductor Device - A semiconductor device and a method of manufacturing a semiconductor device are disclosed. An embodiment comprises forming a bump on a die, the bump having a solder top, melting the solder top by pressing the solder top directly on a contact pad of a support substrate, and forming a contact between the die and the support substrate. | 2012-11-01 |
20120273936 | Micro Bump And Method For Forming The Same - A method for forming a micro bump includes forming a first nano-particle layer on a substrate and forming a second nano-particle layer on the first nano-particle layer. The first and second nano-particle layers include a plurality of first nano particles and a plurality of second nano particles, respectively. The method further includes irradiating a laser beam onto the second nano-particle layer, where the laser beam penetrates through the second nano-particle layer and is at least partially absorbed by at least some of the first nano particles to generate heat. The first nano particles and the second nano particles have different absorption rates with respect to the laser beam. | 2012-11-01 |
20120273937 | Semiconductor Device and Method of Forming Bump Interconnect Structure with Conductive Layer Over Buffer Layer - A semiconductor device has a substrate with a plurality of contact pads. A first insulation layer is formed over the substrate and contact pads. A portion of the first insulating layer is removed to form a toroid-shaped SRO over the contact pads while retaining a central portion of the first insulating layer over the contact pads. The central portion of the first insulating layer can extend above a surface of the first insulating layer outside the first conductive layer. A first conductive layer is formed over the central portion of the first insulating layer and through the SRO in the first insulating layer over the contact pads. The first conductive layer may extend above a surface of the first insulating layer outside the second conductive layer. A semiconductor die is mounted to the substrate with the bumps electrically connected to the first conductive layer. | 2012-11-01 |
20120273938 | Semiconductor Device and Method of Forming an Interconnect Structure with Conductive Material Recessed Within Conductive Ring Over Surface of Conductive Pillar - A semiconductor device has a semiconductor die with a first conductive layer formed over an active surface of the semiconductor die. An insulation layer is formed over the active surface of the semiconductor die. A second conductive layer is conformally applied over the insulating layer and first conductive layer. Conductive pillars are formed over the first conductive layer. Conductive rings are formed around a perimeter of the conductive pillars. A conductive material is deposited over the surface of the conductive pillars within the conductive rings. A substrate has a third conductive layer formed over a surface of the substrate. The semiconductor die is mounted to a substrate with the third conductive layer electrically connected to the conductive material within the conductive rings. The conductive rings inhibit outward flow of the conductive material from under the conductive pillars to prevent electrical bridging between adjacent conductive pillars. | 2012-11-01 |
20120273939 | FILLED THROUGH-SILICON VIA AND THE FABRICATION METHOD THEREOF - By adding particles of high thermal conductivity and low thermal expansion coefficient into the copper as a composite material and filling with the composite material into the through-via hole, the mismatch of the coefficient of thermal expansion and the stress of the through-silicon via are lowered and the thermal conductivity of the through-silicon via is increased. | 2012-11-01 |
20120273940 | SEMICONDUCTOR APPARATUS AND METHOD FOR FABRICATING THE SAME - A semiconductor apparatus includes a first chip comprising a first bonding pad and a dielectric layer exposes a portion of the first bonding pad; a first bonding layer covering entirely or partially the first front side of the first chip, a second chip comprising a second bonding pad and a through-silicon via, and a conductive projection formed over the second bonding pad. The dielectric layer is formed on of the first chip, a second back side of the second chip is bonded to the first front side of the first chip by the medium of the first bonding layer, and the second bonding pad formed on a second front side of the second chip is coupled to the first bonding pad by the through-silicon via. | 2012-11-01 |
20120273941 | PACKAGE STRUCTURE HAVING EMBEDDED ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - A package structure having an embedded electronic component includes: a carrier having a cavity penetrating therethrough; a semiconductor chip received in the cavity and having solder bumps disposed thereon; a dielectric layer formed on the carrier and the semiconductor chip so as to encapsulate the solder bumps; a wiring layer formed on the dielectric layer; an insulating protection layer formed on the dielectric layer and the wiring layer; and a solder material formed in the dielectric layer and the insulating protection layer for electrically connecting the wiring layer and the solder bumps, thereby shortening the signal transmission path between the semiconductor chip and the carrier to avoid signal losses. | 2012-11-01 |
20120273942 | Flip-chip Mounting Structure and Flip-chip Mounting Method - When a flip-chip mounting component with an Al/Au bonding structure is exposed to high temperature, voids may be caused in the Al electrode. The generation of voids causes failed connection or failed bonding between the Al electrode and the Au bump, thereby significantly degrading the connection reliability and bonding reliability in the flip-chip mounting structure. An object of the preset invention is to provide a flip-chip mounting structure that has high connection reliability and bonding reliability without being degraded even in high temperature. In a flip-chip mounting structure for wirelessly connecting an IC chip | 2012-11-01 |
20120273943 | Solder Joint Flip Chip Interconnection Having Relief Structure - A flip chip interconnect has a tapering interconnect structure, and the area of contact of the interconnect structure with the site on the substrate metallization is less than the area of contact of the interconnect structure with the die pad. A solder mask has an opening over the interconnect site, and the solder mask makes contact with the interconnect structure at the margin of the opening. The flip chip interconnect is provided with an underfill. During the underfill process, the contact or near proximity of the solder mask with the interconnect structure interferes with flow of the underfill material toward the substrate adjacent the site, resulting in formation of a void left unfilled by the underfill, adjacent the contact of the interconnect structure with the site on the substrate metallization. The void can help provide relief from strain induced by changes in temperature of the system. | 2012-11-01 |
20120273944 | Power Semiconductor Package With Bottom Surface Protrusions - A package includes a body that encapsulates a semiconductor die, the body having a first pair of opposing lateral sides, a second pair of opposing lateral sides, a top, and a bottom. The bottom has a primary surface and a plurality of protrusions that extend outward from the primary surface. When the package is mounted to a printed circuit board (PCB) the protrusions contact the PCB and the primary surface is disposed a first distance away from the PCB. The package further includes a plurality of leads that extend outward from the first pair of opposing lateral sides. | 2012-11-01 |
20120273945 | INTEGRATED CIRCUIT DEVICE INCLUDING A COPPER PILLAR CAPPED BY BARRIER LAYER - This description relates to an integrated circuit device including a semiconductor substrate, an under-bump-metallurgy (UBM) layer overlying the semiconductor substrate and a copper-containing pillar on the UBM layer. The copper-containing pillar includes a top surface, an upper sidewall surface adjacent to the top surface, and a lower sidewall surface adjacent to the UBM layer. The integrated circuit device further includes a barrier layer on the upper sidewall surface of the copper-containing pillar, wherein the barrier layer exposes the lower sidewall surface. The copper-containing pillar has a first height and the upper sidewall surface has a second height. The second height is greater than about 30 percent of the first height. | 2012-11-01 |
20120273946 | SEMICONDUCTOR DEVICE - A semiconductor device entirely having a small height, which performs a fan-out operation for input/output signals and forms a short electrical path is provided. The semiconductor device includes a first semiconductor die having a first surface, a second surface opposed to the first surface, a third surface connecting the first and second surfaces to each other, a first bond pad disposed on the first surface, and a first through electrode passing between the first surface and second surface and electrically connected to the first bond pad. A first redistribution part is disposed under the second surface and includes a first redistribution layer electrically connected to the first through electrode. A second redistribution part is disposed over the first surface and includes a second redistribution layer electrically connected to the first bond pad. | 2012-11-01 |
20120273947 | CHIP PACKAGE WITH A CHIP EMBEDDED IN A WIRING BODY - An electronic device is disclosed. The electronic device comprises at least one electronic chip and a package for the electronic chip. The package comprises a laminate substrate, wherein the electronic chip is attached on the laminate substrate. The laminate substrate comprises one or more conduction layers, one or more insulation layers and a plurality of pads formed in a conduction layer on the side of the laminate substrate opposite to the side connected to the electronic chip. Furthermore, the package comprises an insulation body formed around the electronic chip. Moreover, the package comprises a plurality of electrodes that extend through the insulation body. For each pad of the laminate substrate, wiring is formed in the one or more of conduction layers and in one or more vias passing through the one or more insulation layers for electrically connecting the pad with at least one of the electrodes. The package further comprises an interconnection body formed on the insulation body and the electronic chip. The interconnection body comprises a plurality of pads on the side of the interconnection body opposite to the side connected to the insulation body and the electronic chip and it also comprises wiring inside the interconnection body for electrical connections between the pads of the electronic chip, the electrodes and the pads of the interconnection body. A method for manufacturing the electronic device is also disclosed. | 2012-11-01 |
20120273948 | INTEGRATED CIRCUIT STRUCTURE INCLUDING A COPPER-ALUMINUM INTERCONNECT AND METHOD FOR FABRICATING THE SAME - An integrated circuit structure including a copper-aluminum interconnect with a barrier layer including a titanium nitride layer and a method for fabricating the same are disclosed. The method for fabricating an integrated circuit structure including a copper-aluminum interconnect according to the present invention comprises the steps of providing a copper (Cu) layer; forming a barrier layer connected to the copper layer, wherein the barrier layer comprises a first layer including a tantalum layer and a tantalum nitride layer and a second layer including a titanium nitride layer, the first layer contacts the copper layer and is disposed between the copper layer and the second layer, and the barrier layer has a recess correspondingly above the copper layer; and forming an aluminum (Al) layer disposed in the recess. | 2012-11-01 |
20120273949 | METHOD OF FORMING OXIDE ENCAPSULATED CONDUCTIVE FEATURES - Semiconductor devices are formed with a Cu or Cu alloy interconnect encapsulated by a substantially uniform MnO or Al | 2012-11-01 |
20120273950 | INTEGRATED CIRCUIT STRUCTURE INCLUDING COPPER-ALUMINUM INTERCONNECT AND METHOD FOR FABRICATING THE SAME - An integrated circuit structure including a copper-aluminum interconnect with a CuSiN layer and a method for fabricating the same are provided. The method for fabricating an integrated circuit structure including a copper-aluminum interconnect according to the present invention comprises the steps of providing a copper (Cu) layer; forming a barrier layer including a CuSiN layer on the copper layer; forming a wetting layer on the barrier layer; and forming an aluminum (Al) layer on the wetting layer. | 2012-11-01 |
20120273951 | Contact Metal for Hybridization and Related Methods - A contact structure for interconnecting a first substrate to an indium interconnect structure on a second substrate. The contact structure comprises a diffusive layer and a non-oxidizing layer, with a thickness of less than approximately 150 nm, positioned on the diffusive layer for alignment with the indium interconnect. | 2012-11-01 |
20120273952 | MICROELECTRONIC CHIP, COMPONENT CONTAINING SUCH A CHIP AND MANUFACTURING METHOD - Microelectronic chip including a semiconductor substrate; at least one area of its surface which is suitable to be electrically connected to a metal frame designed to accommodate the chip; at least one interconnect area formed by a copper-based conductive layer and comprising a connecting device, the interconnect area being connected to the area by a conductor, wherein the area is formed by a layer forming a copper diffusion barrier inserted between interconnect area and the substrate. | 2012-11-01 |
20120273953 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 2012-11-01 |
20120273954 | SEMICONDUCTOR DEVICE WITH PROTECTIVE MATERIAL AND METHOD FOR ENCAPSULATING - A semiconductor device and method for encapsulating the semiconductor device are provided. The method includes: forming a plurality of wire bonds on a surface of the semiconductor device by bonding each of a plurality of copper wires onto corresponding ones of a plurality of aluminum pads; applying a protective material around the plurality of wire bonds, the protective material having a first pH; and encapsulating at least a portion of the semiconductor device and the protective material with an encapsulating material having a second pH, wherein the first pH of the protective material is for neutralizing the second pH of the encapsulating material around the plurality of wire bonds. | 2012-11-01 |
20120273955 | SYSTEM COMPRISING A SEMICONDUCTOR DEVICE AND STRUCTURE - A system includes a semiconductor device. The semiconductor device includes a first semiconductor layer comprising first transistors, wherein the first transistors are interconnected by at least one metal layer comprising aluminum or copper. The second mono-crystallized semiconductor layer includes second transistors and is overlaying the at least one metal layer, wherein the second mono-crystallized semiconductor layer is less than 150 nm in thickness, and at least one of the second transistors is an N-type transistor and at least one of the second transistors is a P-type transistor. | 2012-11-01 |
20120273956 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 2012-11-01 |
20120273957 | CHIP-PACKAGING MODULE FOR A CHIP AND A METHOD FOR FORMING A CHIP-PACKAGING MODULE - A chip-packaging module for a chip is provided, the chip-packaging module including an isolation material configured to cover a chip on at least one side, the isolation material having a first surface proximate to a first side of a chip, and said isolation material having a second surface facing an opposite direction to the first surface; and at least one layer in connection with the chip first side, the at least one layer further configured to extend from the chip first side to the second surface of the isolation material. | 2012-11-01 |
20120273958 | MULTILAYER INTERCONNECT STRUCTURE AND METHOD FOR INTEGRATED CIRCUITS - A multilayer interconnect structure is formed by, providing a substrate ( | 2012-11-01 |
20120273959 | Semiconductor Device and Method of Embedding TSV Semiconductor Die Within Substrate for Vertical Interconnect in POP - A semiconductor device has a substrate with a first conductive layer over a surface of the substrate and a plurality of cavities exposing the first conductive layer. A first semiconductor die having conductive TSV is mounted into the cavities of the substrate. A first insulating layer is formed over the substrate and first semiconductor die and extends into the cavities to embed the first semiconductor die within the substrate. A portion of the first insulating layer is removed to expose the conductive TSV. A second conductive layer is formed over the conductive TSV. A portion of the first conductive layer is removed to form electrically common or electrically isolated conductive segments of the first conductive layer. A second insulating layer is formed over the substrate and conductive segments of the first conductive layer. A second semiconductor die is mounted over the substrate electrically connected to the second conductive layer. | 2012-11-01 |
20120273960 | Semiconductor Device and Method of Embedding TSV Semiconductor Die Within Encapsulant with TMV for Vertical Interconnect in POP - A semiconductor device has a carrier or first conductive layer with a plurality of TSV semiconductor die mounted over the carrier or first conductive layer. An encapsulant is deposited around the first semiconductor die and over the carrier or first conductive layer to embed the first semiconductor die. A conductive TMV is formed through the encapsulant. A second conductive layer is formed over a first surface of the encapsulant. A first insulating layer is formed over the first surface of the encapsulant while exposing portions of the second conductive layer. A second insulating layer is formed over the second surface of the encapsulant while exposing portions of the first conductive layer. Alternatively, a first interconnect structure is formed over the first surface of the encapsulant. The carrier is removed and a second interconnect structure is formed over a second surface of the encapsulant. | 2012-11-01 |
20120273961 | SEMICONDUCTOR APPARATUS - A semiconductor apparatus includes a plurality of semiconductor chips which are stacked; and an auxiliary semiconductor chip configured to recover and transmit signals of the plurality of semiconductor chips through a plurality of through vias which extend vertically, at a predetermined time interval. | 2012-11-01 |
20120273962 | SEMICONDUCTOR DEVICE HAVING AIR GAP AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a semiconductor device having an air gap, includes: providing a substrate having a first dielectric layer and a second dielectric layer formed thereon successively; forming a mask layer on the second dielectric layer; patterning the first and the second dielectric layer by using the mask layer as a mask so as to form a plurality of grooves; filling a conducting material into the grooves; removing redundant conducting material on the second dielectric layer utill the second dielectric layer is exposed so as to form a plurality of conductive trenches; forming a molecular sieve on the second dielectric layer and the conductive trenches; and removing the second dielectric layer partly or completely by flowing a reactant gas towards the second dielectric layer through the molecular sieve, so as to form an air gap. It is novel and simple to form an air gap through molecular sieve. | 2012-11-01 |
20120273963 | MICROELECTRONIC INTERCONNECT SUBSTRATE AND PACKAGING TECHNIQUES - There is provided herein an electrical cross-over comprising: a substrate having an upper surface and a lower surface; an electrically-conductive valve metal area extending from said upper surface to said lower surface; an electrical isolation structure extending from said upper surface to said lower surface and encompassing said electrically conductive area; a first electrically-conductive trace formed on a first electrical isolation area and at least traversing said electrically-conductive crossing area, and at least two second electrically-conductive traces each one of said at least two electrically-conductive traces is at least partially formed on a corresponding second electrical isolation area, wherein said each one of said at least second electrically-conductive traces at least partially extends into said crossing area thereby generating electrical conductivity between said at least two second electrically-conductive traces and said first electrically-conductive trace is electrically isolated from said at least two second electrically-conductive traces. | 2012-11-01 |
20120273964 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A manufacturing method of a semiconductor device includes: forming an insulating layer above a substrate; forming a recessed section in the insulating layer; forming, on the insulating layer, a mask pattern having a first opening which exposes the recessed section, and a second opening which is arranged outside the first opening and does not expose the recessed section; forming a first conductive member and a second conductive member by respectively depositing a conductive material in the first opening and the second opening; and polishing and removing the first conductive member and the second conductive member on the upper side of the insulating layer so as to leave the first conductive member in the recessed section. | 2012-11-01 |
20120273965 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor memory device includes a plurality of memory blocks formed over a substrate including source regions and separated from each other by a slit, a plurality of bit lines coupled to the strings of the memory blocks and disposed over the memory blocks, and source contact lines formed within the slits, coupled to the source regions, respectively, and disposed in a direction to cross the plurality of bit lines. | 2012-11-01 |
20120273966 | INTEGRATED CIRCUIT INTERCONNECT STRUCTURE - An integrated circuit (IC) interconnect structure that includes a first via positioned in a dielectric and coupled to a high current device at one end, and a buffer metal segment positioned in a dielectric and coupled to the first via at an opposite end thereof. The buffer metal segment includes a plurality of electrically insulating inter-dielectric (ILD) pads forming an ILD cheesing pattern thereon, to direct current. The IC interconnect structure further includes a second via positioned in a dielectric formed over the buffer metal segment and coupled to the buffer metal segment at one end and a metal power line formed in a dielectric and coupled to the second via at an opposite end thereof. The use of the ILD pads on the buffer metal segment enables a more even distribution of current along the metal power line. | 2012-11-01 |
20120273967 | Semiconductor Wafer Having Through-Hole Vias on Saw Streets with Backside Redistribution Layer - A semiconductor wafer contains a plurality of die with contact pads disposed on a first surface of each die. Metal vias are formed in trenches in the saw street guides and are surrounded by organic material. Traces connect the contact pads and metal vias. The metal vias can be half-circle vias or full-circle vias. The metal vias are surrounded by organic material. Redistribution layers (RDL) are formed on a second surface of the die opposite the first surface. The RDL and through-hole vias (THV) provide expanded interconnect flexibility to adjacent die. Repassivation layers are formed between the RDL on the second surface of the die for electrical isolation. The die are stackable and can be placed in a semiconductor package with other die. The RDL provide electrical interconnect to the adjacent die. Bond wires and solder bumps also provide electrical connection to the semiconductor die. | 2012-11-01 |
20120273968 | Printed Circuit Board With Coextensive Electrical Connectors And Contact Pad Areas - A printed circuit board is disclosed having coextensive electrical connectors and contact pad areas. Areas of the contact pads where the traces and/or vias are located may be etched away to ensure electrical isolation between the traces, vias and contact pads. | 2012-11-01 |
20120273969 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 2012-11-01 |
20120273970 | SEMICONDUCTOR DEVICE - Miniaturization and acceleration of the operating speed of a System In Package (SIP) type semiconductor device in which a memory chip and a microcomputer chip are mounted over a wiring board are promoted. When mounting a microcomputer chip and a memory chip over an upper surface of a wiring board, the memory chip is disposed such that second conductive pads of the wiring board arranged along a first chip side (a side along which data system electrode pads are arranged) of the memory chip are positioned, in the plan view, in a region between an extended line of a third chip side of the microcomputer chip and an extended line of a fourth chip side of the microcomputer chip. Thus, a length of a data system wiring for coupling a data system electrode pad of the microcomputer chip with the data system electrode pad of the memory chip is minimized. | 2012-11-01 |
20120273971 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a semiconductor device that comprises a wiring substrate, at least two semiconductor chips mounted on the wiring substrate, and at least one reinforcing substrate disposed so as to straddle at least portions of the two semiconductor chips. | 2012-11-01 |
20120273972 | SEMICONDUCTOR DEVICE - Mounting a power supply ring-shaped conductor and a ground ring-shaped conductor within the innermost circumferential ring-shaped area enclosing the semiconductor chip and within the ring-shaped region adjacent to the outer side of this innermost circumferential ring-shaped region when mounting the semiconductor chip on the substrate package, makes the chip more resistant to noise but also conversely causes the problem of increased cost and size for the entire semiconductor device. The power supply pad and ground pad are here clustered in the outermost ring-shaped area on the semiconductor chip. The power supply terminal and ground terminal are clustered on the innermost ring-shaped region enclosing the semiconductor chip. This placement reduces the size and manufacturing cost of the overall semiconductor device. | 2012-11-01 |
20120273973 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE DESIGN METHOD, SEMICONDUCTOR DESIGN APPARATUS, AND PROGRAM - A potential-supply connection interconnect is provided in a multilayer interconnect layer. The potential supply connection interconnect overlaps some cell of I/O cells in the outer peripheral cell column and some cell of I/O cells in the inner peripheral cell column in a plan view. The potential-supply connection interconnect connects a power potential supply interconnect located below the outer peripheral cell column to a power potential supply interconnect located below the inner peripheral cell column and also connects a ground potential supply interconnect located below the outer peripheral cell column to a ground potential supply interconnect located below the inner peripheral cell column. | 2012-11-01 |
20120273974 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE - The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000. | 2012-11-01 |
20120273975 | SHEET FOR PROTECTING SURFACE OF SEMICONDUCTOR WAFER, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR WAFER PROTECTION METHOD USING SHEET - To provide a semiconductor wafer surface protection sheet having good adhesion to irregularities on a patterned surface of a semiconductor wafer and having good peelability after wafer grinding. Specifically, a semiconductor wafer surface protection sheet is provided that includes a base layer having a tensile elasticity at 25 C°, E(25), of 1 GPa or more; a resin layer A that satisfies the condition E | 2012-11-01 |
20120273976 | MOISTURE BARRIER COATINGS FOR ORGANIC LIGHT EMITTING DIODE DEVICES - A process for fabricating an amorphous diamond-like film layer for protection of a moisture or oxygen sensitive electronic device is described. The process includes forming a plasma from silicone oil, depositing an amorphous diamond-like film layer from the plasma, and | 2012-11-01 |
20120273977 | DEVICE AND METHOD FOR PRODUCING THERAPEUTIC FOAM - A device and a method for generating therapeutic foam from a sclerosing solution such as polidocanol and a gas which is absorbable or dissolvable in the body comprises a disposable cassette including a liquid container and a flexible chamber containing gas, chamber being formed as a loop. Located in the loop chamber is a foam generating mesh. In use, liquid is introduced into the chamber and then the cassette is inserted into a pumping machine where it is engaged by a peristaltic pump which circulates the contents of the loop chamber through the mesh, thus creating foam. When a steady state is reached, foam may be withdrawn using a syringe via either a port or septum. | 2012-11-01 |
20120273978 | Centrifugal Fan Device - An apparatus for delivering a compound includes a reservoir containing a compound to be delivered to the environment of use. The compound includes fragrances and insecticides. A compound permeable substrate includes a wick which extends from the substrate into the reservoir. A centrifugal fan is operatively associated with the compound permeable substrate to force air over the substrate when the fan is operational. A cover is disposed over the centrifugal fan in which the cover has at least one aperture on a top surface and provides for a side air passage from the centrifugal fan to the environment. | 2012-11-01 |
20120273979 | EXHAUST GAS TREATMENT APPARATUS - The exhaust gas treatment apparatus has a sealed vessel which is vertically partitioned into two spaces by a partition. The partition is provided with a gas riser for deriving treated exhaust gas from an upper space of the absorbing liquid storage portion. A large number of sparger pipes are provided in a effective region, so as to reach inside an absorbing liquid stored in the absorbing liquid storage portion. A non-jet region is provided in the effective region. The froth layer is not formed in the non-jet region, and the absorbing liquid in a foamed state flows down from the froth layer therearound to circulate the absorbing liquid. | 2012-11-01 |
20120273980 | Method and System For Improved-Efficiency Air-Conditioning - “Systems and methods for circulating air in an enclosed environment are disclosed. In some embodiments, the system includes an inlet to receive air from outside of the enclosed environment and an air handling unit coupled to the inlet and also configured to receive circulated air from the enclosed environment. The air handling unit can be configured to affect a temperature of at least one of the received outside air and the received circulated air. Based on the received outside air and the received circulated air, the air handling unit can be further configured to generate air for supplying to the enclosed environment.” | 2012-11-01 |
20120273981 | METHOD FOR MAKING LENS ARRAY - An exemplary method for making a lens array requires an imprinting mold and a substrate. A blob of molding material is applied on each molding section of the substrate. First alignment marks, and second alignment mark of the imprinting mold aligned with third and fourth alignment marks on each one of the imprinting regions, respectively. The imprinting mold is pressed on the molding material on the imprinting region. The pressed portions of the imprinting region are solidified to obtain lenses in the imprinting region. The imprinting mold is pressed on another one of the imprinting region, and the imprinting mold is removed. This process is repeated for each other imprinting region. Thus, a large-scale lens array is obtained. | 2012-11-01 |
20120273982 | Novel Preparation Of An Enteric Release System - Hydrophobic liquids are microencapsulated by an enteric matrix in an environment substantially free of organic solvents, the process including forming an emulsion of the enteric material and hydrophobic liquid in water, the emulsion titrated with an acid to form a particulate precipitate of the microencapsulated hydrophobic liquid in an enteric matrix. | 2012-11-01 |
20120273983 | Adjustment Mechanism of Mold System Having Electrically Adjusting and Positioning Functions - A mold system includes a carrier platform and an adjustment mechanism. The carrier platform is provided to arrange at least one mold member. The adjustment mechanism includes at least two adjustment units arranged on the carrier platform. Each of the adjustment units includes a positioning member and an electrically-driven adjustment member pivot-connected therewith. In adjustment operation, the positioning members commonly engage with the mold member and are driven by the electrically-driven adjustment members. | 2012-11-01 |
20120273984 | PROCESS FOR RECYCLING MULTIPHASE MOLDINGS - The present invention relates to a process for recycling multiphase moldings. | 2012-11-01 |
20120273985 | De-Mold Liner Based Injection Tool - A mold apparatus comprising a release liner removably securable to a mold tool face by a liner vacuum system configured to hold the release liner in place against the tool face, the liner vacuum system comprising at least one liner vacuum port extending and providing fluid communication between the mold face and a vacuum source. The liner vacuum system is actuable to hold the release liner in place against the tool face in advance of and during material injection and during curing and may be further actuable to subsequently release the tool from the liner, leaving the release liner to be peeled from the cured material. | 2012-11-01 |
20120273986 | PROCESS FOR PRODUCING NONWOVENS AND ARTICLES CONTAINING SUBMICRON FIBERS - Processes for producing nonwoven web products containing sub-micron fibers are provided, and more specifically processes for producing nonwoven web products having sub-micron fibers formed by fibrillation of polymer films are provided. | 2012-11-01 |
20120273987 | INORGANIC NANOWIRES - Provided in one embodiment is a method of forming an inorganic nanowire, comprising: providing an elongated organic scaffold; providing a plurality of inorganic nanoparticles attached to the organic scaffold along a length of the organic scaffold; and fusing the nanoparticles attached to the organic scaffold to form an inorganic nanowire. | 2012-11-01 |
20120273988 | Impregnation Section with Upstream Surface and Method for Impregnating Fiber Rovings - An impregnation section of a die and a method for impregnating at least one fiber roving with a polymer resin are disclosed. The impregnation section includes an impregnation zone configured to impregnate the roving with the resin and a gate passage in fluid communication with the impregnation zone for flowing the resin therethrough such that the resin coats the roving. Additionally, the impregnation section includes a surface disposed upstream of the impregnation zone in a run direction of the roving for contacting the roving. The method includes traversing at least one fiber roving over a surface, flowing a polymer resin through a gap, the gap being in the range between approximately 0.1 millimeters and approximately 4 millimeters, coating the roving with the resin, and traversing the coated roving through an impregnation zone to impregnate the roving with the resin. | 2012-11-01 |
20120273989 | SYSTEM FOR PRODUCING FIBER-REINFORCED MOLDED PARTS AND METHOD FOR OPERATING A SYSTEM FOR PRODUCING FIBER-REINFORCED MOLDED PARTS - A system for the continuous production of fiber-reinforced resin sheets during the production of fiber-reinforced molded parts by extrusion in a molding press, wherein a production device for producing resin sheets, comprising a mixing device for combining at least one resin base having fibers and a fulling and saturating device for mixing the fibers with the resin base into a resin sheet is arranged in succession, a thickening device is arranged for maturation of the resin sheet and a transfer device is arranged for cutting the resin sheet to length to a cut sheet for subsequent transfer of at least one cut sheet to the molding press; in the thickening device there is a transport section between the inlet point of the resin sheet into and an outlet point of the resin sheet out of the thickening device. At least one positioning device is arranged substantially within the thickening device. | 2012-11-01 |
20120273990 | Method and Apparatus for Making an Apertured Web - A method for making apertures in a web comprising providing a precursor web material; providing a pair of counter-rotating, intermeshing rollers, wherein a first roller comprises circumferentially-extending ridges and grooves, and a second roller comprises teeth being tapered from a base and a tip, the teeth being joined to the second roller at the base, the base of the tooth having a cross-sectional length dimension greater than a cross-sectional width dimension; and moving the web material through a nip of the counter-rotating, intermeshing rollers; wherein apertures are formed in the precursor web material as the teeth on one of the rollers intermesh with grooves on the other of the rollers. | 2012-11-01 |
20120273991 | APPARATUS AND METHOD FOR PREPARING LAMINATED NANO-COMPOSITE MATERIAL - Apparatus and method for preparing laminated nano-composite material. The apparatus comprising: a plasticizing-and-feeding device assembly consisting n plasticizing-and-feeding device; a current collector having n inlets, one outlet and a conjunction runner; k laminated composite generators connected in series, wherein generator comprises one melt inlet channel, m branch laminated runners and one melt outlet channel, while in vicinity of each melt inlet channel is provided with m distributary openings, and each branch laminated runner can make each equal composite melt flown out from each distributary opening rotates approximately 90 degrees and extends m times in width as it flows forward, and then joins together and forms laminated structure melt, and the laminated structure melt which joins together at the melt outlet channel of the last laminated composite generator has n×m | 2012-11-01 |
20120273992 | DEVICE FOR SEALING A COOLING TANK FOR AN EXTRUDED PLASTIC PROFILE - A device for sealing an extruded plastics material profile in at least one of an inlet region and an outlet region of a tank is disposed at an end face of the tank. The device includes a rigid element and a closed annular cross section formed of a resilient material and including a cavity. An outer peripheral shape of the annular cross section is disposed against the rigid element. The annular cross section is alterable by applying a vacuum to the cavity, wherein the annular cross section is configured to be applied to an outside of the plastics material profile. A stretching device is disposed against the rigid element and is configured to stretch the resilient material along an extrusion axis during an alteration of the annular cross section. | 2012-11-01 |
20120273993 | METHOD OF GENERATING COLLAGEN FIBERS - A method of generating a collagen fiber is disclosed. The method comprises extruding a solution of liquid crystalline collagen into a coagulating solution, thereby generating the collagen fiber. Fibers generated thereby are also disclosed as well as scaffolds comprising such fibers. | 2012-11-01 |
20120273994 | FLEXIBLE TUBE DEVICE AND ENDOSCOPE - A method for producing a flexible tube device includes supplying a tubular structure to an extrusion head, extruding a molten rigid resin and a molten non-rigid resin at a constant pressure to the tubular structure through an orifice formed in the extrusion head, controlling a moving speed of the tubular structure when extruding the molten rigid resin such that the moving speed becomes a highest speed VH when the proximal end passes through the orifice, and decreases at a first constant acceleration rate until a first change point, located closer to the proximal end than to the distal end, passes through the orifice to reach a lowest speed VL, controlling the moving speed of the tubular structure when extruding the molten non-rigid resin, and cooling the tubular structure to obtain the flexible tube device. | 2012-11-01 |
20120273995 | METHOD OF SEALING A GAP - A sealing unit for sealing a gap between a pair of surfaces includes a nozzle for injecting sealant into the gap, rollers, an endless track round the rollers, and a curing device. The sealing unit is moved along the length of the gap. A sealant is injected into the gap from the nozzle and the track is rotated around the rollers as they are moved along the length of the gap. The track is pressed onto first and second surfaces so the sealant in the gap is constrained by the track to lie substantially flush with the first and second surfaces. The sealing unit is moved along the length of the gap at a rate such that the sealant becomes sufficiently cured when it is in contact with the track so that the track can be peeled away from the sealant as the track rotates round the second roller. | 2012-11-01 |
20120273996 | APPARATUS AND METHOD FOR INJECTION MOLDING OPENING DEVICES ON SHEET PACKAGING MATERIAL FOR PACKAGING POURABLE FOOD PRODUCTS - An apparatus for injection molding an opening device on a sheet packaging material having a hole possessing an axis, formed through a first layer and sealed by a cover portion of a second layer; comprises a mold cavity coaxially housing the cover portion and comprising a first chamber adapted to be filled with molten plastic material on a first side of the cover portion, and a second tubular chamber projecting along the axis from the first chamber and adapted to be filled with the molten plastic material coming from the first chamber through an annular peripheral portion of the cover portion to form, on a second side of the cover portion, a spout; an annular rib delimiting a passage connecting the first and second chamber and defining, when filled with the plastic material, an annular tearable membrane connection portion between the spout and the plastic material covering the cover portion. | 2012-11-01 |
20120273997 | Process for Making a Micro-Textured Web - Processes for making micro-textured webs. The process comprises providing a precursor web; providing a pair of mated forming structures, including a first forming structure and a second forming structure, wherein at least the first forming structure comprises voids, and wherein at least the second forming structure comprises protrusions; and moving the web through a deformation zone of the mated forming structures, wherein the voids of the first forming structure engage with the protrusions of the second forming structure at an engagement position. Discrete three-dimensional elements are formed in the web as the protrusions on the second forming structure engage with the voids on the first mating structure. At least one protrusion has center-to-center spacings of less than about 800 microns with at least three of its adjacent protrusions. | 2012-11-01 |
20120273998 | INTERMITTENT FILM FORMING SYSTEM AND INTERMITTENT FILM FORMING MTHOD - An intermittent film forming system is provided, comprising a mold having a fine projections and depressions shape formed on the surface, a press for pressing a film to the surface of the mold, a transportation for carrying the film, and a releasing device for releasing the film from the mold surface. The releasing device is provided with a stripper roll for stripping the film, a means for rotary driving the stripper roll, an auxiliary roll arranged substantially in parallel with the stripper roll across a film path line, a means for moving the auxiliary roll on the periphery of the stripper roll such that the film embraces the stripper roll, and a guide for moving the stripper roll and the auxiliary roll in the vicinity of the surface of the mold in parallel therewith, while maintaining the relative positional relationship that the film embraces the stripper roll. | 2012-11-01 |
20120273999 | METHOD FOR PATTERNING A STACK - The embodiments disclose a method for patterning a stack, including embedding servo patterns within a final template and creating positions of plural cross-tracked shifted position error signal (PES) fields incrementally from the embedded servo patterns on the final template. | 2012-11-01 |
20120274000 | SYSTEMS AND METHODS FOR MOBILE AND/OR MODULAR MANUFACTURING - Systems and methods for manufacturing that are scaleable and de-scaleable based upon the production requirements of the customer's manufacturing facility. Systems and methods for mobile and/or modular manufacturing positioned at or near a customer's production facility that are scaleable and de-scaleable based upon the production requirements of the customer's manufacturing facility. The systems and methods of manufacturing may include identifying a customer's production requirements at the customer's production facility, designing a manufacturing cell based upon the identified production requirements, delivering components for the manufacturing cell to a location at or near the customer's production facility, assembling the components to form the manufacturing cell at the location, and training operational personnel to operate the manufacturing cell. The systems and methods may comprise using a modular preform mold system. | 2012-11-01 |
20120274001 | HYBRID STENT AND METHOD OF MAKING - A stent is formed by encasing or encapsulating metallic rings in an inner polymeric layer and an outer polymeric layer. At least one polymer link connects adjacent metallic rings. The stent is drug loaded with one or more therapeutic agent or drug, for example, to reduce the likelihood of the development of restenosis in the coronary arteries. The inner and outer polymeric materials can be of the same polymer or different polymer to achieve different results, such as enhancing flexibility and providing a stent that is visible under MRI, computer tomography and x-ray fluoroscopy. | 2012-11-01 |
20120274002 | METHOD FOR MANUFACTURING SEAMLESS BELT FOR ELECTROPHOTOGRAPHY - A method capable of efficiently manufacturing a high-quality seamless belt for electrophotography is provided. The method is a method for manufacturing a seamless belt for electrophotography including a base layer having a thermoplastic resin composition, and a surface layer, wherein the method includes: (1) forming an energy curable coated film having a glass transition temperature on an outer surface of a test tube-shaped preform including a thermoplastic resin; then blow molding the preform to obtain a blow bottle; (2) irradiating the blow bottle with an energy ray to cure the coated film to thereby form the surface layer; and (3) cutting out a seamless belt from the blow bottle obtained in (2) and having a surface layer. | 2012-11-01 |
20120274003 | METHOD FOR ENHANCED FIBER BUNDLE DISPERSION WITH A DIVERGENT FIBER DRAW UNIT - A method and associated apparatus for melt extruding a nonwoven web includes providing a plurality of fibers from an extrusion device. The fibers are conveyed through a diverging profile portion of a fiber drawing unit (FDU) that causes the fibers to spread and expand in the machine direction within the FDU. The fibers are then conveyed through a diverging diffusion chamber spaced from the outlet of the FDU to reduce the velocity of the fibers and further spread the fibers in the machine direction. The fibers may be subjected to an applied electrostatic charge in either the diffusion chamber or the FDU. From the outlet of the diffusion chamber, the fibers are laid onto a forming surface as a nonwoven web. | 2012-11-01 |
20120274004 | NANOPATTERNING METHOD AND APPARATUS - Embodiments of the invention relate to methods and apparatus useful in the nanopatterning of large area substrates, where a movable nanostructured film is used to image a radiation-sensitive material. The nanopatterning technique makes use of Near-Field photolithography, where the nanostructured film used to modulate light intensity reaching radiation-sensitive layer. The Near-Field photolithography may make use of an elastomeric phase-shifting mask, or may employ surface plasmon technology, where a movable film comprises metal nano holes or nanoparticles. | 2012-11-01 |
20120274005 | PROCESS FOR PREPARING FOR CASTING - A process for preparing for casting is provided and includes forming a cast component defining an interior having a complex and/or irregular shape, introducing a non-solid material into the cast component interior and solidifying the non-solid material to form an inner shell, forming an outer shell about the cast component and removing the cast component from between the inner and outer shells. | 2012-11-01 |
20120274006 | IMPRINT APPARATUS, IMPRINT METHOD, AND METHOD FOR PRODUCING DEVICE - An imprint apparatus for transferring a pattern to an imprint material using a mold includes a substrate holding mechanism and a control unit. The substrate holding mechanism is configured to be divided into a plurality of areas, capable of varying an attracting force for attracting the substrate in each of the areas and to hold the substrate. The control unit is configured to, when a plurality of shots is formed on the substrate, control an imprint operation of transferring the pattern to the plurality of shots which are not adjacent to one another, makes the attracting force in the area of the substrate holding mechanism corresponding to the shot to which the pattern is transferred among the plurality of areas smaller than the attracting force at the time of the imprint operation and suck the substrate. | 2012-11-01 |
20120274007 | Cemented Carbide Body and Method - A method of producing a cemented carbide body provides: (1) a grain refiner compound comprising a grain refiner and carbon and/or nitrogen, and, (2) a grain growth promoter, on at least one portion of the surface of a compact of a WC-based starting material comprising one or more hard-phase components and a binder, and then sinters the compact. The invention also relates to a cemented carbide body comprising a WC-based hard phase and a binder phase, wherein at least one part of an intermediate surface zone has a lower average binder content than a part further into the body, and at least one part of an upper surface zone has in average a larger average WC grain size than the intermediate surface zone. The cemented carbide body can be used as a cutting tool insert for metal machining, an insert for a mining tool, or a coldforming tool. | 2012-11-01 |
20120274008 | OXYGEN TORCH RECLAMATION OF METALS WITH NITRIC ACID RECOVERY - Disclosed is a system for removing metals from waste, particularly electronic waste (or “e-waste”). The process generally includes the steps of dissolving at least some of the metals from the wastein a nitric acid bath and then causing at least some of the metals to precipitate as metal oxides and/or metal nitrates. The system can include multiple tanks or locations for dissolving metals and/or precipitating metals, preferably as metal oxides or metal nitrates. The process and system reclaim more preferably NOx gas for the regeneration of nitric acid, which is recycled for use in the metal reclamation system. | 2012-11-01 |
20120274009 | Adaptive Motor Mount - A hydraulic mount includes a closable bypass and a decoupling membrane. When the bypass is opened, however, the main effect that can be achieved by opening the bypass, namely the decrease in the spring rate at higher frequencies, is worsened. It is thus desirable to render the decoupling membrane ineffective when the bypass is open. The aim is achieved in that the closure device of the bypass includes blocking elements for blocking the decoupling membrane in the first switching position of the closure device when the bypass is open and can be released in the second position of the closure device when the bypass is closed. | 2012-11-01 |
20120274010 | METHOD AND AUXILIARY DEVICE FOR PRECISION POSITIONING OF WELDED TYPE NOZZLES - The present invention relates to a method and an auxiliary device for precision positioning of welded type nozzles. The auxiliary device for precision positioning of welded type nozzles includes a plurality of alignment tips and an alignment bar. Each alignment tip is connected to a welding adapter and extends a distance. The alignment bar is combined with the alignment tips so that first positioning portions of the alignment tips are aligned with a plurality of second positioning portions of the alignment bar, and after the alignment bar is combined with the alignment tips, a correction distance between an end surface of the alignment bar and a center line of a main pipe header in a longitudinal direction is larger than a length of an assembled nozzle after a nozzle tip is combined with the corresponding welding adapter. In this way, the geometric positions of the nozzles can be accurately corrected. | 2012-11-01 |
20120274011 | VACUUM-GRIPPER - The present invention relates to a vacuum gripper and in particular to a vacuum gripper for gently gripping work-pieces having sensitive surfaces, such as solar cells, wafers, or panels for flat screens, and for gripping heavy glass plates or plates made of other material having a very smooth surface that are stacked on top of each other and should be removed from above, wherein the vacuum gripper has the following characteristics: a straight or curved gripper plate ( | 2012-11-01 |
20120274012 | DEVICE FOR A USER TO SECURE A WORKPIECE | 2012-11-01 |
20120274013 | SAW BUCK - An apparatus for holding a log or similar material during cutting is disclosed. The apparatus includes a log holder having a housing and a saddle. A cavity formed in the housing is tapered along a longitudinal axis for receiving an end of a log. The saddle is disposed adjacent to the tapered cavity and offset from the longitudinal axis to inhibit rotation of the log during cutting. A pole and a base rotatably support the log holder in the elevated position. | 2012-11-01 |
20120274014 | SUPPORT STRUCTURES AND CLAMPING SYSTEMS FOR SEMICONDUCTOR DEVICES DURING WIRE AND RIBBON BONDING OPERATIONS - A support structure for supporting a semiconductor device during a bonding operation is provided. The support structure comprises a body portion defining an upper surface configured to support a semiconductor device during a bonding operation. The upper surface defines a constraining feature for constraining at least a portion of the semiconductor device during the bonding operation. | 2012-11-01 |
20120274015 | SHEET FINISHING SYSTEM INCLUDING DUAL SHEET STACKING - A substrate finishing system includes a sheet input that feeds sheets to a compiler for compiling. The sheets may be stapled at the compiler. A trail edge support of the compiler is movable from a first position to a second position. The compiler is configured to drop a sheet or set of sheets to build compiled set stacks at the first and second positions on a stacking tray positioned beneath the compiler. | 2012-11-01 |
20120274016 | IMAGE FORMING APPARATUS AND SHEET SUPPLY APPARATUS HAVING PLURALITY OF SHEET SUPPLY UNITS - An image forming apparatus which can prevent decrease in useful lives of components for air sheet feeding without bringing about throughput degradation when performing an image forming operation using a plurality of sheet supply units. When a sheet is fed from a first sheet supply unit having a fan that is driven so as to supply sheets, then a sheet is supplied from a second sheet supply unit, and then a sheet is supplied form the first sheet supply unit again, and in a case where a suspension time period over which no sheet is supplied from the first sheet supply unit is longer than a preparation time period from when driving of the fan is started to when the fan is brought into a driving state required to supply a sheet, driving of the fan is temporarily stopped. | 2012-11-01 |
20120274017 | PAPER FEEDING DEVICE, IMAGE FORMING APPARATUS, AND SETTING INFORMATION SWITCHING METHOD - To provide a paper feeding device that can switch setting information only with an easy action of sheet removal and setting in a predetermined position. The paper feeding device includes a first detecting unit that detects whether a sheet is set in a predetermined position, a second detecting unit that detects whether the sheet removal and setting is performed in the predetermined position after the setting of the sheet is detected by the first detecting unit, and a switching unit that switches setting information concerning the sheet when the sheet removal and setting is detected by the second detecting unit. | 2012-11-01 |
20120274018 | STACKER - A stacker is described, in particular in an installation of the paper processing industry, for forming a stack of several flat parts to be fed in a transport direction, in particular film sheets or paper sheets, with a stack forming area and a support device for supporting the stack to be formed from the flat parts in the stack forming area. The special nature of the invention lies in that the support device has a plurality of discrete support elements that are at least arranged one behind the other seen in the transport direction of the flat parts and are supported in a moveable manner between a lower position and an upper position at an angle to the transport direction of the flat parts, preferably approximately at right angles to the transport direction A of the flat parts and/or approximately vertically. | 2012-11-01 |
20120274019 | METHOD OF ADVANCING SUCCESSIVE SHEETS OF MEDIA - A method of advancing successive sheets of media by providing a gear and a pick roller configured to rotate independently between a first and a second relative orientation; advancing a first sheet at a first advance speed to an intermediate roller by driving the gear to rotate the pick roller with the gear and the pick roller oriented at the first relative orientation; advancing the first sheet at a greater advance speed by rotating the intermediate roller, thereby orienting the gear and the pick roller in the second relative orientation; advancing the first sheet until the pick roller is in contact with a second sheet; driving the gear while the pick roller remains stationary until the gear and the pick roller are oriented in the first relative orientation; and advancing the second sheet at the first advance speed by driving the gear to rotate the pick roller. | 2012-11-01 |
20120274020 | Document Sorting Machine - A machine and method to sort documents in a plurality of pockets includes a stacker having a tier of the plurality of pockets and two magazines positioned at the same end of the stacker. A first transport and a second transport are operably associated with the first magazine and the second magazine, respectively, and are adapted to carry the documents through the stacker. The method includes separating the documents into a first portion and a second portion, the first portion being carried by a first transport through a first end of a stacker, the second portion being carried by a second transport and through a second end of the stacker, and merging the second portion with the first portion. | 2012-11-01 |
20120274021 | Image Forming Apparatus - An image forming apparatus including an image forming unit, a discharger, and a presser including a swingable member and a contact member is provided. The contact member is partially attached to the swingable member in a condition to create clearance between an unattached part and the swingable member. Weights of the contact member and the swingable member affect the sheet when the recording medium contacts the contact member and the contact member is moved to swing upward along with the swingable member by the recording medium. Resilient force is provided by the contact member to affect the recording medium when the recording medium contacts the contact member and the contact member is moved in a direction to narrow the clearance. | 2012-11-01 |
20120274022 | Exotic craps bet and a novel place bet - A exotic wager named Double D bet is introduced in the game of Craps which allows for Craps to be played in a conventional manner. Double D bet allows for higher payout, based on pay table; total number of different doubles rolled before “seven out” will determine the payout. A second wager named Broad Bar (6,6) is also introduced. This is a novel “Place Bet”. This bet wins when a double is rolled, except for a pair (6,6) and loses when the shooter “seven out.” The payout can be set by the party offering this wager but a 7:6 is recommended. Although Bar (6,6) was chosen as a push, any other pair (x,x) can be substituted and allow a roll of (6,6) to win. | 2012-11-01 |
20120274023 | BUILDING BLOCK TOY WITH INTERCONNECTING EDGES - The present invention relates generally to a block toy and a method for producing the same, and in particular to a block with interconnecting edges that can have other blocks connected thereto in succession in three dimensions to form various shapes and a method for producing the same. | 2012-11-01 |
20120274024 | TRANSACTION PRODUCT WITH FOLDABLE SHEET - A transaction product includes a first cover panel, a second cover panel, and an intermediate sheet, and an account identifier. The intermediate sheet transitions between a collapsed and an extended position and defines fold lines dividing the intermediate sheet into sections. When the intermediate sheet is in the collapsed position, the sections form a stack. The first cover panel is coupled with one of the sections that forms a top of the stack, and the second cover panel is coupled with another of the sections that forms a bottom of the stack. The account identifier is coupled with at least one of the first and second cover panels and the intermediate sheet and links the transaction product to an account or record configured to track a value available for use toward a purchase of one or more of goods and services. Other products, combinations, and associated methods are also disclosed. | 2012-11-01 |
20120274025 | Blackjack Game with Additional Player Flexibility - A variation of casino blackjack. The player can have the option to split any two cards whether they are identical or not. The player can also double down and receive a double down card, and if the player does not like his or her double down card, then the player can discard the double down card and receive a second double down card | 2012-11-01 |
20120274026 | Playing Cards - A deck of playing cards wherein at least one card comprises a base layer that bears a front surface and a back surface and a substantially planar holographic optical element that is operatively configured to form a holographic image, the holographic optical element disposed at or towards a surface that is selected from the front and back surfaces the at least one card characterised in that the holographic optical element is of a type that is substantially transparent and manufactured to substantially prevent said holographic image from being viewed in a first range of directions with respect to the selected surface and to substantially enable said holographic image to be viewed from a second range of directions that are outside of the first range. | 2012-11-01 |