43rd week of 2015 patent applcation highlights part 85 |
Patent application number | Title | Published |
20150305110 | LED lighting system - A lighting system includes at least one lighting apparatus having a light emitting element capable of emitting a controllably variable light output in a region. A position determination subsystem is capable of determining a position in three dimensions of at least one mobile entity within the region. A control subsystem is capable of variably controlling a light output of the at least one lighting apparatus according to the position of the mobile entity. The system may determine position by radio ranging with mobile electronic elements. The system may include multiple lighting elements and may determine light levels according to positions of multiple mobile entities. The system may include a database of information about lighting elements, mobile entities, and lighting plans that may be selected from mobile electronic elements. | 2015-10-22 |
20150305111 | Portable Lamp Comprising a Contact-less Control Device - A portable lamp, such as a headlamp, having control of the light power without the need for any manual switch is presented. The lamp comprises
| 2015-10-22 |
20150305112 | OPERATING DEVICE FOR ILLUMINANT - An operating device ( | 2015-10-22 |
20150305113 | SYSTEM AND METHOD FOR PROVIDING GRADIENT INTENSITY ILLUMINATION FOR LIGHTED MIRRORS FOR DRESSING ROOMS AND OTHER APPLICATIONS - An illumination system comprising a light source with a linear array of light emitting elements and an arrangement for regulating power to the array whereby the light emitting elements emit light in accordance with a tapered gradient intensity profile. In the illustrative embodiment, the light source includes first and second linear arrays of light emitting elements and a mirror is mounted there between. The tapered profile begins at the waist of a user when a user is standing near and in front of the mirror. In the digital embodiment, a camera is included along with software for detecting the user's waist (or detecting the user's height and inferring therefrom said user's waist) and adjusting the profile based on the detection of the user's height or waist. Any intensity profile, e.g. ramp, Gaussian, etc., may be implemented and one or more such arrays may be used and mounted horizontally, vertically or both. Each array may have a different intensity or luminous profile. In addition, or as an alternative, to the intensity profile, other optical qualities, such as color, may be changed across one or more of the arrays. | 2015-10-22 |
20150305114 | Energy Saving OLED Lighting System and Method - Described herein are systems, devices, and methods related to adjusting the intensity of specific wavelengths in an illumination panel based on the presence of a person near the panel. By reducing some emitted wavelengths, such as wavelengths associated with blue light, when such wavelengths are not needed or desired, the lifetime and/or efficiency of the lighting panel can be increased. The systems, devices, and methods can be used to reduce energy costs and also to delay the aging of lighting panels. | 2015-10-22 |
20150305115 | Lighting Control System and Method - A system and method of controlling lighting schedules in a lighting control application on a computer system is disclosed. A graphical user interface is displayed to a user on a display in signal-communication with the computer system. The graphical user interface has a plurality of lighting control schedule areas. Each lighting control schedule area has an in-schedule portion and a corresponding out-of-schedule portion. One or more interface objects, corresponding to one or more lighting control devices, are associated with the in-schedule lighting control schedule of a first lighting control schedule area of the plurality of lighting control schedule areas without instructing the corresponding one or more lighting control devices to operate on said in-schedule lighting control schedule, in response to a user moving the one or more interface objects to the out-of-schedule portion of the first lighting control schedule area. | 2015-10-22 |
20150305116 | Lighting Control System and Method - A graphical user interface is displayed to a user on a display in signal communication with the computer system. The graphical user interface has a first lighting control schedule area and a first interface object representing a lighting control device. The first interface object is located outside of the first lighting control schedule area. A second lighting control schedule area is displayed adjacent the first lighting control schedule area when the first lighting control schedule area is empty of any interface object representing a lighting control device and the first interface object is moved into the first lighting control schedule area. | 2015-10-22 |
20150305117 | METHOD FOR CREATING AMBIENCE LIGHTING EFFECT BASED ON DATA DERIVED FROM STAGE PERFORMANCE - The invention provides a method for creating in a display space an ambience lighting effect, wherein the display space comprises a screen configured to display moving images and a display space light source configured to provide the ambience lighting effect, wherein the moving images are representative of a stage performance in a performance space, the method comprising (a) deriving ambience lighting effect input data from one or more of (i) a light related cue provided by a cue manager, (ii) lighting effects accompanying the stage performance, and (iii) an analysis of a video shot by a video camera configured to monitor at least a part of an audience present in the performance space; and (b) displaying the moving images on the screen in the display space, while creating with the display space light source said ambience lighting effect at least based on the ambience lighting effect input data. | 2015-10-22 |
20150305118 | LIGHTING APPARATUS WITH BRIGHTNESS SELF-ADJUSTMENT AND SELF-ADJUSTING METHOD THEREOF - A lighting apparatus ( | 2015-10-22 |
20150305119 | LIGHTING CONTROL DEVICE AND LIGHTING SYSTEM - A detector detects first information which represents sensing presence or absence of a person in an illuminated space and represents a position of the person in the illuminated space when sensing the presence, and second information representing brightness of the illuminated space. When external light enters the illuminated space, a controller receives both detected results of first information and second information and controls lighting fixtures in a lump so that the second information becomes a prescribed target value when the presence is sensed. When no external light enters the illuminated space, the controller receives a detected result of the first information and individually controls respective lighting fixtures in accordance with the first information regardless of the second information. | 2015-10-22 |
20150305120 | LED Lighting System - A lighting system includes at least one lighting apparatus having a light emitting element capable of emitting a controllably variable light output in a region. A position determination subsystem is capable of determining a position in three dimensions of at least one mobile entity within the region. A control subsystem is capable of variably controlling a light output of the at least one lighting apparatus according to the position of the mobile entity. The system may determine position by radio ranging with mobile electronic elements. The system may include multiple lighting elements and may determine light levels according to positions of multiple mobile entities. The system may include a database of information about lighting elements, mobile entities, and lighting plans that may be selected from mobile electronic elements. | 2015-10-22 |
20150305121 | CONFIGURABLE LIGHTING DEVICES UNDER BROADCAST CONTROL - A control unit for controlling an illumination parameter of one or more light sources of a plurality of light sources is described. The control unit being arranged to—select the one or more light sources of the plurality of light sources, receive an input signal representing a required value of the illumination parameter for the selected one or more light sources, convert the input signal to a broadcast signal for the plurality of light sources;—enable the broadcast signal to be provided to the plurality of light sources thereby enabling the selected one or more light sources to comply with the required value of the illumination parameter. | 2015-10-22 |
20150305122 | LED FIXTURE AND LED LIGHTING ARRANGEMENT COMPRISING SUCH LED FIXTURE - An LED fixture comprises: -at least one LED; -an electrical power terminal, electrically connected to the LED, the electrical power terminal for electrically connecting the LED to an LED driver, -a storagedevice for storing datain relation to the LED, and -a data processing device, electrically connected to the storage device for storing data in the storage device and reading data therefrom, the data processing device being arranged and connected for providing data communication via at least one of the electrical power terminal and the LED. | 2015-10-22 |
20150305123 | Lighting Control System and Method - A lighting control system and method is provided. A first electronic device for lighting control detects wirelessly one or more available network messages corresponding to one or more other electronic devices within wireless range of the first electronic device. The first electronic device connects wirelessly to a next electronic device of the one or more other electronic devices. The first electronic device sends a first device ID wirelessly to the next electronic device. The connection to the next electronic device is maintained if a registering handshake message is received via the next electronic device. The first electronic device disconnects from the next electronic device if the registering handshake message is not received within a predetermined timeout amount of time. | 2015-10-22 |
20150305124 | LIGHTING APPARATUS - Disclosed is a lighting apparatus. The lighting apparatus includes: a control module supplying power; a heat sink receiving the control module; a light source mounted on the heat sink and connected to the control module; and a communication module including a connection terminal inserted into the heat sink and connected to the control module, and an antenna device protruding from the heat sink. Since the lighting apparatus can be controlled in a wireless scheme, a user of the lighting apparatus can easily control the lighting apparatus. | 2015-10-22 |
20150305125 | SENSOR NETWORK-ENABLED LIGHT SOCKET ADAPTOR - A light power socket adaptor may be positioned between an energy-saving light bulb and a light socket that may provide electrical power to the light bulb. Adaptors may include a motorized rotational mechanism that allows sensors to rotate in any direction. Light power socket adaptors may be network-enabled. Each node on a sensor network may operate independently. Each node may also function as a router so that it may forward data packets to other nodes if the data received is targeted for its own consumption. Adaptors may further include a motion sensor, an image sensor, a sound sensor, and a photo (day/night) sensor. | 2015-10-22 |
20150305126 | ILLUMINATION SYSTEM AND ILLUMINATION DEVICE - An illumination system includes an illumination device, a control unit for controlling a turn-on operation of the illumination device, and a terminal through which manipulation information of the illumination device is inputted by a user. The control unit includes an information extracting unit for extracting illumination information, within a period between a first moment prior to a falling-asleep time of the user and a second moment after a wakeup time of the user, from manipulation information and operation information of the illumination device stored in a memory unit, and an information transceiver unit for transmitting and receiving the illumination information to and the terminal. The terminal includes a terminal transceiver unit for transmitting and receiving the illumination information to and from the control unit, a display unit for displaying the illumination information received through the terminal transceiver unit and an input unit by which the manipulation information is inputted. | 2015-10-22 |
20150305127 | OPTICAL NAVIGATION SENSOR WITH INTEGRATED CHARGE PUMP - An optical navigation sensor includes: a driving circuit and a charge pump. The driving circuit is employed for driving a light source externally connected to the optical navigation sensor. The charge pump is employed for intermittently performing an operation of providing a first supply voltage to the light source. When the driving circuit drives the light source, the charge pump does not perform the operation of providing the first supply voltage to the light source. | 2015-10-22 |
20150305128 | PROTECTING CIRCUIT FOR ARC DISCHARGE LAMP - Provided is a method to detect an arcing condition in an arc discharge lamp ballasts is disclosed. An AC current signal flows from the lamp load to ground via at least one ring core. The ring core is provided for detecting an arcing condition in AC current signal and the ballast circuit by detecting a current spike along the ring core. When there is a current spike in the primary core, created by the arcing condition, a proportional increase in voltage within a control signal occurs on the secondary core. A rectifier circuit is used for conditioning the increase in voltage within the control signal. A control circuit, responsive to the increase in voltage within the control signal, dynamically adjusts the operating frequency of a resonant inverter so that the arcing condition is extinguished. | 2015-10-22 |
20150305129 | DISCHARGE LAMP LIGHTING DEVICE AND HEADLIGHT USING SAME - Control unit decreases power to be supplied to high-pressure discharge lamp when an output voltage or an output current for high-pressure discharge lamp measured by measurement unit is in an abnormal range. Drive unit driving switching element includes capacitor that supplies, to a control electrode of switching element disposed on high potential side, electric charge necessary for turning on switching element disposed on high potential side when switching element disposed on low potential side is turned off. When high-pressure discharge lamp is started up, a discharge lamp lighting device starts to charge capacitor before DC/DC converter is started to operate, and control unit has a determination period for determining presence/absence of an abnormality based on a measured value acquired by measurement unit in a state in which DC/DC converter and DC/AC inverter are operated after completion of charging of capacitor. | 2015-10-22 |
20150305130 | AIR STREAM CONTROLLER AND SYSTEM FOR STATIC CHARGE REDUCTION - An air stream controller and a system for static charge reduction comprising such air stream controller are disclosed. The air stream controller comprises an enclosed hollow body having a first surface and a second surface, wherein, an opening is on the first surface facing an incoming tubing of a device for static charge reduction for receiving air stream from the device for static charge reduction, wherein an outgoing tubing of the device for static charge reduction is attached onto the second surface of the enclosed hollow body for discharging the air stream. A technical solution to more effectively prevent the “leaking of air stream passage” can be achieved through the design of a multi-holes structure at the air passage to more broadly expand its air sucking area coverage without increasing the original suction power. | 2015-10-22 |
20150305131 | STRUCTURE ELECTRON BEAM INSPECTION SYSTEM FOR INSPECTING EXTREME ULTRAVIOLET MASK AND STRUCTURE FOR DISCHARGING EXTREME ULTRAVIOLET MASK - A structure for discharging an extreme ultraviolet mask (EUV mask) is provided to discharge the EUV mask during the inspection by an electron beam inspection tool. The structure for discharging an EUV mask includes at least one grounding pin to contact conductive areas on the EUV mask, wherein the EUV mask may have further conductive layer on sidewalls or/and bottom. The inspection quality of the EUV mask is enhanced by using the electron beam inspection system because the accumulated charging on the EUU mask is grounded. | 2015-10-22 |
20150305132 | BASIC ELECTROMAGNETIC FORCE FIELD - An electromagnetic force field configured to protect designated assets against incoming objects, comprising a plurality of layers, wherein the layers are a member of a group consisting of a supercharged plasma window, a curtain of high-energy laser beams arranged in a lattice-like configuration, and a carbon nanotube (CNT) layer, wherein the laser beams are positioned at equal distance between each other and as such as to ensure that at least four laser beams are in the path of the smallest object, and wherein, the CNT layer comprises a plurality of CNT sheets. | 2015-10-22 |
20150305133 | Plasma Torch - A plasma torch is provided and adapted to generate very high operating temperatures to gasify various types of materials, such as biomass materials and various carbonaceous materials. The plasma torch is composed of a ceramic body that has first, second, and third intersecting bores. Each of the first, second, and third intersecting bores defines a threaded portion therein. A first and second tungsten carbide electrode is adjustably disposed in the first and second intersecting bores and operative to be adjustable to establish a controlled gap size therebetween. A compressed gas connection is threadably disposed in the threaded portion of the third bore and is operative to introduce a flow of compressed gas through the controlled gap. The first and second tungsten carbide electrodes are connectable to a source of electrical energy and functions to produce an electrical arc across the controlled gap. The resulting flame produced by the electrical arc burns at an extreme temperature. | 2015-10-22 |
20150305134 | DEVICE AND METHOD FOR COLLECTING ELECTRICALLY CHARGED PARTICLES - A device for collecting electrically charged particles comprising a first shell and a second shell disposed concentrically around the first shell is provided. Each of the shells is divided respectively into a first half-shell and a second half-shell. A first switch is disposed between the first half-shell of the first shell and the second half-shell of the first shell. A second switch is disposed between the second half-shell of the first shell and the first half-shell of the second shell. The first half-shell of the second shell has a through opening. | 2015-10-22 |
20150305135 | Formation Of Multiple Proton Beams Using Particle Accelerator And Stripper Elements - A particle acceleration system includes a particle accelerator and at least one beam-transparent stripper element. The particle accelerator is configured to accelerate charged particles along a trajectory. The beam-transparent stripper element(s) is/are positioned along the trajectory. Each beam-transparent stripper element has a surface normal to the trajectory, wherein said surface defines a plurality of apertures configured to cause a first plurality of charged particles that strike the surface to undergo a stripping process while a second plurality of charged particles pass through one or more of the plurality of apertures without undergoing the stripping process. | 2015-10-22 |
20150305136 | PRINTED CIRCUIT BOARD - Provided is a printed circuit board which is used in a bent state, including: a substrate; a first conductive layer which is formed on the substrate; a first insulation layer which is formed on the substrate so as to cover the first conductive layer; and a second conductive layer which is formed on the first insulation layer, wherein on the assumption that the Youngs modulus of the first insulation layer is indicated by Ei1 and the fracture elongation of the second conductive layer is indicated by Bc2, the following equations (I) and (II) are satisfied. | 2015-10-22 |
20150305137 | ELECTRONIC DEVICE WITH COMBINATION HEAT SINK/BLOWER OR FAN ASSEMBLY HAVING AIR DUCT - An electronic device includes a circuit board having heat generating components thereon. A heat sink with air current generating electric device assembly lies over the circuit board, through which heat from the circuit board and the components thereon is dispersed. The assembly includes a heat sink having a solid central core and a plurality of fins protruding from the core. An air current generating electric device is disposed over the heat sink and having an air intake facing a top of the heat sink and an exhaust opening directed parallel to a plane of the circuit board. An air duct extends from the exhaust opening of the air current generating electric device to exhaust apertures on at least one side wall of the electronic device. | 2015-10-22 |
20150305138 | WRAP-AROUND MICRO-WIRE CIRCUIT METHOD - A method of making a micro-wire circuit structure adapted for wrapping includes providing a display and a flexible substrate. The flexible substrate includes a plurality of electrically conductive micro-wires on, in, or adjacent to a common side of the flexible substrate and forming micro-wire electrodes in a touch portion of the flexible substrate. One or more electrical circuits is located on or in a circuit portion of the flexible substrate and one or more micro-wires electrically connects the one or more electrical circuits to corresponding micro-wire electrodes. The flexible substrate is located in relation to the display with the touch portion located adjacent to a display viewing side, the circuit portion located adjacent to a display back side, and an edge portion of the flexible substrate wrapping around a display edge from the display viewing side to the display back side. | 2015-10-22 |
20150305139 | FLEXIBLE PRINT CIRCUIT BOARD AND DEVICE PROVIDED WITH THE SAME - A flexible print circuit board has a hole into which a pillar-shaped projection protruding from a base body of a device is fitted. The hole includes at least one first edge part formed to have a convex shape toward the center of the hole, and second edge parts provided on the both sides of the first edge part respectively and formed to have a concave shape toward the center of the hole. | 2015-10-22 |
20150305140 | CIRCUIT BOARD REFLOW OF COMPONENTS USING ON BOARD COPPER TRACES AS HEATING ELEMENT - An electronic circuit board has at least one copper trace, at least one array of contact pads connected to the copper trace, a heater connected to the copper trace, wherein when heat is applied to the copper trace, solder in the array of contact pads will reflow. An electronic circuit board system has an electronic circuit board. The electronic circuit board includes at least one copper trace, at least one array of contact pads connected to the copper trace, a heater connection to the copper trace, wherein when heat is applied to the copper trace, solder in the array of contact pads with reflow, and a heater to connect to the copper trace, wherein when heat is applied to the copper trace, solder in the array of contact pads will reflow. | 2015-10-22 |
20150305141 | STRUCTURE FOR DELIVERING POWER - A structure for delivering power is described. In some embodiments, the structure can include conductors disposed on two or more layers. Specifically, the structure can include a first set of interdigitated conductors disposed on a first layer and oriented substantially along an expected direction of current flow. At least one conductor in the first set of interdigitated conductors may be maintained at a first voltage, and at least one conductor in the first set of interdigitated conductors may be maintained at a second voltage, wherein the second voltage is different from the first voltage. The structure may further include a conducting structure disposed on a second layer, wherein the second layer is different from the first layer, and wherein at least one conductor in the conducting structure is maintained at the first voltage. | 2015-10-22 |
20150305142 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A printed circuit board ( | 2015-10-22 |
20150305143 | MULTI-LAYER PRINTED CIRCUIT BOARD STRUCTURE, CONNECTOR MODULE AND MEMORY STORAGE DEVICE - A multi-layer printed circuit board structure, a connector module and a memory storage device are provided. The multi-layer printed circuit board structure includes a first layout layer and a second layout layer. The first layout layer includes a shielding element and at least one pad. The shielding element provides the grounding voltage. The second layout layer is disposed corresponding to the first layout layer and includes at least one wire, and one end of each wire is coupled to one of the pads. A predefined proportion of the wire is covered by a projection plane of the shielding element projected on the second layout layer. | 2015-10-22 |
20150305144 | SHIELD FILM AND SHIELD PRINTED WIRING BOARD - Provided is a shield film having good shielding characteristics in the high frequency region, and a shield printed wiring board. A shield film, provided with, in a layered state: a plurality of metal layers ( | 2015-10-22 |
20150305145 | JOINING METHODS FOR BULK METALLIC GLASSES - Bulk metallic glass having at least one surface: applying a contact layer to at least a portion of the at least one surface of the bulk metallic glass; applying a diffusion barrier layer to the contact layer; applying a cap layer to the diffusion barrier layer to form a layered bulk metallic glass; and joining a material to the layered bulk metallic glass. | 2015-10-22 |
20150305146 | STRETCHABLE FLEXIBLE SUBSTRATE AND PRODUCTION METHOD FOR THE SAME - A stretchable flexible substrate includes a film base. At least a portion of the film base includes a rolled part. The rolled part includes a first curved part having a curved shape in which the film base is folded back with one main surface of the film base facing inward, a second curved part having a curved shape in which the film base is folded back with another main surface of the film base facing inward, and a base layered part located outside the first curved part and the second curved part. The base layered part has a shape in which the film base is rolled in such a way that a portion of the film base that is contiguous with the first curved part and another portion of the film base that is contiguous with the second curved part are layered on one another. | 2015-10-22 |
20150305147 | WRAP-AROUND MICRO-WIRE CIRCUIT STRUCTURE - A micro-wire circuit structure adapted for wrapping includes a display and a flexible substrate. The flexible substrate includes a plurality of electrically conductive micro-wires formed on, in, or adjacent to a common side of the flexible substrate. One or more electrical circuits is located on or in a circuit portion of the flexible substrate and electrically connect to corresponding micro-wire electrodes in a touch portion of the flexible substrate. The flexible substrate is located in relation to the display with the touch portion located adjacent to a display viewing side, the circuit portion located adjacent to a display back side, and an edge portion of the flexible substrate wrapping around a display edge side from the display viewing side to the display back side. | 2015-10-22 |
20150305148 | GLASS COMPOSITE WITH FUNCTIONAL ELEMENT - A glass composite has at least one first main glass panel ( | 2015-10-22 |
20150305149 | PRINTED CIRCUIT BOARD - A printed circuit board has a printed wiring board and a semiconductor package mounted on the printed wiring board. The printed wiring board and the semiconductor package are connected with a plurality of solder balls. An underfill material covering the plurality of solder balls is filled between the printed wiring board and the semiconductor package. The underfill material has a relative dielectric constant of 8.6 or more and 54.4 or less. Thus, crosstalk noise generated in wiring in the out-of-plane direction is reduced without increasing the mounting area. | 2015-10-22 |
20150305150 | MULTI-LAYER RESIN SUBSTRATE AND METHOD OF MANUFACTURING MULTI-LAYER RESIN SUBSTRATE - A multi-layer resin substrate is a multi-layer resin substrate integrated by stacking and thermocompression bonding a plurality of resin layers each composed of a thermoplastic resin as a main material and having a main surface. The plurality of resin layers include a resin layer having a pattern member arranged on the main surface. A surface of at least some resin layers of the plurality of resin layers has a paint layer, which is obtained by applying a thermoplastic resin paint to a region corresponding to a region insufficient in thickness as a stack as a whole during a process for stacking and thermocompression bonding the plurality of resin layers. The pattern member is provided, for example, by a conductor pattern. | 2015-10-22 |
20150305151 | SYNTHETIC PAPER - Synthetic paper, including: between 10 and 90 wt. % of structural fibers, and between 90 and 10 wt. % of bonding fibers. The structural fibers are non-thermoplastic poly(p-phenylene telephthalamide) (PPTA) fibers having a fineness of between 1 and 2 denier, and a length of between 3 and 10 mm. The bonding fibers are fibrids or a pulp of the non-thermoplastic PPTA. The structural fibers and the bonding fibers are shaped by a wet-forming papermaking method, and hot rolled to form the synthetic paper. | 2015-10-22 |
20150305152 | EPOXY RESIN COMPOSITION AND PRINTED CIRCUIT BOARD INCLUDING INSULATING LAYER USING THE EPOXY RESIN COMPOSITION - An epoxy resin composition according to an embodiment of the present invention includes an epoxy compound, a curing agent including diaminodiphenyl sulfone, and an inorganic filler. | 2015-10-22 |
20150305153 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE - A wiring substrate includes an insulating layer, and a connection terminal formed on the insulating layer. The connection terminal includes a metal layer formed on the insulating layer and including an upper surface, a metal post formed on the upper surface of the metal layer and including upper and side surfaces, and a surface plating layer that covers the upper and side surfaces of the metal post. The metal layer includes a material that is inactive with respect to a material included in the surface plating layer. The metal layer has an upper surface edge part that is exposed at an outside from the side surface of the metal post in a plan view. The surface plating layer is formed to expose the upper surface edge part of the metal layer. | 2015-10-22 |
20150305154 | WIRING BOARD, MOUNTING STRUCTURE EQUIPPED WITH THE WIRING BOARD, AND METHOD FOR MANUFACTURING WIRING BOARD - A wiring board includes a first electrically-conductive layer; and a first resin layer covering the first electrically-conductive layer, the first resin layer including a resin portion and inorganic insulating particles dispersed in the resin portion. The first resin layer has a first layer region which is in contact with one main surface and side surfaces of the first electrically-conductive layer, and a second layer region which is located on a side of the first layer region which side is opposite to the first electrically-conductive layer. The inorganic insulating particles include a plurality of first inorganic insulating particles contained in the first layer region, and a plurality of second inorganic insulating particles contained in the second layer region. A content rate of the first inorganic insulating particles in the first layer region is lower than a content rate of the second inorganic insulating particles in the second layer region. | 2015-10-22 |
20150305155 | WIRING BOARD - The wiring board according to the embodiment of the present invention includes a core substrate including a through-hole for a grounding and a through-hole for a power supply disposed adjacent to each other, and a build-up layer formed on one surface of the core substrate. The through-hole for a grounding and the through-hole for a power supply have a cross-sectional shape perpendicular to a thickness direction of the core substrate, being any one of a triangular shape, a quadrangular shape and a hexagonal shape, containing a corner portion and a side portion connecting between the corner portions. The side portions of the through-hole for a grounding and the through-hole for a power supply being mutually adjacent are disposed so as to face each other. | 2015-10-22 |
20150305156 | SUSPENSION BOARD WITH CIRCUIT - A suspension board with circuit includes a pad portion configured to be bonded to an electronic element. The pad portion includes a conductive layer; in the pad portion, a through hole passing through the pad portion with its periphery closed by the pad portion is formed; and at least a part of an inner peripheral surface facing the through hole in the pad portion is divided only by the conductive layer. | 2015-10-22 |
20150305157 | METHOD OF MANUFACTURING A WIRING BOARD HAVING VIA STRUCTURES - A method of manufacturing a wiring board includes: forming an outer through hole in a core substrate; filling the outer through hole with an insulation resin; forming a first conductive layer on a surface of the insulation resin at a portion where a core connecting via is formed; forming a land around the first conductive layer; laminating the wiring layer on the core substrate after the forming of the first conductive layer and the forming of the land; forming an inner through hole having a smaller diameter than that of the outer through hole and penetrating through the core substrate and the wiring layer so as to penetrate through the insulation resin; and coating a first conductive film on an inner wall surface of the inner through hole, in which the core substrate and the first conductive film are electrically connected through the first conductive layer and the land. | 2015-10-22 |
20150305158 | Metal-Free Monolithic Epitaxial Graphene-On-Diamond PWB - According to some embodiments, an apparatus includes a circuit board made of polycrystalline diamond. The circuit board is formed by deposition of layers of poly(hydridocarbyne). Each layer has the geometry of a cross section of the circuit board. The circuit board is further formed by pyrolysis of the layers of poly(hydridocarbyne) at a temperature greater than or equal to 100 degrees Celsius and less than or equal to 800 degrees Celsius. The apparatus additionally includes a plurality of tubes formed within the circuit board. The tubes have a plurality of terminations at one or more surfaces of the circuit board. Each tube comprises a layer of graphene that is operable to permit each tube to conduct electrical current. Each layer of graphene is formed by thermolysis of the polycrystalline diamond circuit board at a temperature greater than or equal to 900 degrees Celsius. Each tube is substantially hollow each layer of graphene forms an outer surface of the respective tube. | 2015-10-22 |
20150305159 | CHIP CAPACITOR, CIRCUIT ASSEMBLY, AND ELECTRONIC DEVICE - A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate. | 2015-10-22 |
20150305160 | PACKAGE FOR MOUNTING ELECTRONIC ELEMENT, ELECTRONIC DEVICE, AND IMAGING MODULE - There are provided a package for mounting an electronic element which can be reduced in size and an electronic device. A package for mounting an electronic element includes an insulating base including a frame section; an electrode pad disposed on an upper surface of the frame section; a first wall conductor disposed in an upper end part of an inner wall of the frame section so as to be electrically connected to the electrode pad; and a wiring conductor embedded within the frame section so as to be electrically connected to the first wall conductor. Consequently, the package for mounting an electronic element can be reduced in size, and is capable of suppressing electrical short-circuiting between the wiring conductor and an electronic element and of suppressing occurrence of a crack in the insulating base. | 2015-10-22 |
20150305161 | EMBEDDED COMPONENT STRUCTURE AND PROCESS THEREOF - An embedded component structure includes a wiring board, a component and an encapsulant. The wiring board has a front side, a reverse side opposite to the front side, an opening and an interconnection layer. The opening penetrates the wiring board and connects the front side and the reverse side of the wiring board. The interconnection layer is located on the front side of the wiring board and extends toward the opening. The component includes an active surface, a back side opposite to the active side, and a working area located on the active surface. The active surface is connected to the interconnection layer of the wiring board. The encapsulant is filled inside the opening and covers the component, which makes the working area of the component exposed. Besides, a method of the embedded component structure is also provided. | 2015-10-22 |
20150305162 | PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF - A fabrication method of a packaging substrate is provided, which includes the steps of: forming first conductive portions on a carrier; sequentially forming a conductive post and an alignment layer on each of the first conductive portions; forming an encapsulant on the carrier for encapsulating the first conductive portions, the conductive posts and the alignment layers; forming a conductive via on each of the alignment layers in the encapsulant and forming second conductive portions on the conductive vias and the encapsulant; and removing the carrier. Each of the first conductive portions and the corresponding conductive post, the alignment layer and the conductive via form a conductive structure. The alignment layer has a vertical projection area larger than those of the conductive post and the conductive via to thereby reduce the size of the conductive post and the conductive via, thus increasing the wiring density and the electronic element mounting density. | 2015-10-22 |
20150305163 | HYBRID ELECTRONIC SHEETS - In accordance with the present disclosure, a hybrid electronic sheet which exhibits superior electrical property and allows biomaterial functionalization and flexible device patterning may be provided by binding a graphitic material in colloidal state to a biomaterial capable of binding thereto specifically and nondestructively. Since the electronic sheet is an electronic sheet wherein a biomaterial and an electrical material (graphitic material) are hybridized, it exhibits good compatibility with biomaterials and can be further functionalized with, for example, an enzyme that selectively reacts with a biochemical substance. Accordingly, an electrical material and a chemical or biological material may be effectively nanostructurized and it can be realized as a multi-functional, high-performance electronic sheet. | 2015-10-22 |
20150305164 | Backlight Module, Printed Circuit Board Used For Backlight Module, And Manufacturing Method For The Same - A method for manufacturing a printed circuit board of a backlight module is provided. The printed circuit board includes a light bar region and a heat dissipating region. The light bar region used for mounting a light bar of the backlight module and formed with a conductive circuit for supplying power for the light bar. The heat dissipating region is connected with the light bar region. A connection location of the light bar region and the heat dissipating region is subjected to cutting to form a slot located at a side of the printed circuit board in order to prevent short-circuiting between the heat dissipating region and the conductive circuit of the light bar region. The cutting is made to partly penetrate through the thickness of a dielectric layer on which the conductive circuit is formed in order to completely separate the light bar region from the heat dissipating region. | 2015-10-22 |
20150305165 | ETCHING METHOD - A solution is characteristic in being an etching method that processes a surface of a target object by corroding the surface by a corrosive, and the etching method including includes: a resist forming step of forming a resist on the surface using resist liquid by ink jet printing the resist liquid on the surface; a surface corroding step of corroding a portion of the surface where the resist is not formed by bringing the corrosive into contact with a surface side of the target object where the resist has been formed in the resist forming step; and a resist detaching step of detaching the resist from the surface after the surface corroding step, wherein the resist forming step is a step of forming the resist by the resist liquid containing monofunctional monomers or monofunctional oligomers, and polyfunctional monomers or polyfunctional oligomers. | 2015-10-22 |
20150305166 | LASER PATTERNING OF DUAL SIDED TRANSPARENT CONDUCTIVE FILMS - A method of patterning an unpatterned transparent conductive film, the unpatterned transparent conductive film comprising: a transparent substrate, a first conductive layer disposed on a first surface of the transparent substrate, and a second conductive layer disposed on a second surface of the transparent substrate, the first and second surfaces being disposed on two opposing sides of the unpatterned transparent conductive film, the first conductive layer comprising a first set of metal nanostructures, and the second conductive layer comprising a second set of metal nanostructures, the method comprising irradiating the first conductive layer with at least one first laser to form a patterned transparent conductive film, where the irradiation of the first conductive layer patterns the first conductive layer with a first pattern without also patterning the second conductive layer with the first pattern, and also where the unpatterned transparent conductive film and the patterned transparent conductive film both exhibit total visible light transmissions of at least about 90%. | 2015-10-22 |
20150305167 | SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD - A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, and the cobalt content is 0.001 mass % or more and 0.008 mass % or less. | 2015-10-22 |
20150305168 | PROCESS OF DEPOSITING A METALLIC PATTERN ON A MEDIUM - Process of depositing a metallic pattern on a medium, said process comprising: generating pulsed laser beams from a pulsed laser source, wherein the laser beams have a wavelength for which the medium is substantially transparent, focussing the laser beams onto a target layer comprising inorganic particles, dispersed in a laser light degradable/combustible organic matrix, said target layer producing ejecta in response to an interaction of said laser beams and said target layer, accumulating at least a portion of said ejecta on said medium within the desired pattern, providing the pattern by electroless metal plating. The invention further relates to a transparent medium comprising a metallic pattern wherein the adhesion between the metallic pattern and the medium is at least 5N/cm. | 2015-10-22 |
20150305169 | Electronic Control Device - The invention provides an electronic control device having a high-grade heat sink that: does not require tight control at the time of manufacturing; does not restrict the range of electronic components that can be used; is structurally simple; can be produced at a higher production rate; and is cost-effective. In this device, when a circuit board | 2015-10-22 |
20150305170 | Portable Electronics Case - An improved, self-supporting portable electronics case for withstanding impact forces, dead loads and torsional forces; the case comprising a first plate having a first surface, a second surface, and a first set of flanges. The case further includes a second plate having a third surface, a fourth surface, and a second set of flanges extending from the second plate; and at least one spacer joined to the first set of flanges and the second set of flanges. | 2015-10-22 |
20150305171 | CHASSIS ASSEMBLY STRUCTURE - According to a chassis assembly structure, in assembling a front chassis side assembly in a bottom chassis, a front chassis side assembly | 2015-10-22 |
20150305172 | ELECTRONICS ENCLOSURE - An electronics housing assembly is provided. The assembly includes an electronics housing defining an internal cavity. The electronics housing defines an outer side, and the electronics housing having portions defining a vent hole therein. The vent hole extends through the outer side. A sealing element is disposed adjacent to the electronics housing and contacting the outer side. The sealing element covers the vent hole. A method for sealing an electronics housing assembly is also provided. | 2015-10-22 |
20150305173 | ELECTRONIC DEVICE - In general, according to one embodiment, an electronic device includes a first component, a wall member, and an accommodating part. The wall member includes a plurality of first walls surrounding the first component, a gap being formed between at least one of the first walls and the first component. The accommodating part is between the first component and the at least one of the first walls, and is configured to accommodate a second component. | 2015-10-22 |
20150305174 | GROMMET AND WIRE HARNESS - A grommet includes: a grommet body including a lip portion which contacts a water stopped surface defining an accommodation recess portion in a state in which the grommet body is attached to the accommodation recess portion; an outer which presses the lip portion toward the water stopped surface in a state in which the grommet body is sandwiched between the outer and the water stopped surface; and a rigid body portion which is interposed between the outer and the lip portion with respect to a pressing direction of the outer and which has rigidity higher than that of the lip portion. At least a part of the lip portion is placed in a pressed region pressed by the outer. | 2015-10-22 |
20150305175 | UNITARY HOUSING FOR ELECTRONIC DEVICE - An electronic device having a unitary housing is disclosed. The device can include a first housing component having an open cavity, an internal electronic part disposed within the cavity, a second housing component disposed across the cavity, and a support feature disposed within the cavity and arranged to support the second housing component. The first housing component can be formed from metal, while the second housing component can be formed from a plurality of laminated foil metal layers. The second housing component can be attached to the first housing component via one or more ultrasonic welds, such that a fully enclosed housing is created. The fully enclosed housing can be hermetically sealed, and the outside surfaces thereof can be machined or otherwise finished after the ultrasonic welding. | 2015-10-22 |
20150305176 | Wireless Device Skin - A wireless device skin houses a wireless device such as a wireless router or WiFi access point. The wireless device skin includes a mounting plate having a first side and a second side, the first side being mountable to a surface; an inner shell that is mounted onto the second side of the mounting plate, the inner shell and the mounting plate forming a housing in which the wireless device is disposed, and the inner shell including a center aperture; an outer skin that is releasably mounted onto the second side of the mounting plate, the outer skin covering the inner shell, and the outer skin including a center aperture; and a center disk configured to pass through the center aperture of the outer skin and close the center aperture of the inner shell. | 2015-10-22 |
20150305177 | FIXING STRUCTURE OF ELECTRIC APPARATUS TO VEHICLE - Provided is a fixing structure of an electric apparatus in an engine compartment provided in a front portion of a vehicle. The fixing structure includes a tray, a removal mechanism, and a protecting plate. The tray is fixed in the engine compartment and configured such that the electric apparatus is placed thereon. The removal mechanism is configured to remove the electric apparatus from the tray when the electric apparatus receives a predetermined impact force or more from a front side of the vehicle. The protecting plate is attached to the electric apparatus, and is configured to abut with a structural object placed at a rear side of the vehicle relative to the electric apparatus when the electric apparatus is removed from the tray due to the impact force so as to move rearward. | 2015-10-22 |
20150305178 | TELEVISION MONITOR COMBINATION STAND AND WALL MOUNT - A combination television monitor stand and wall mount is presented. The combination stand and mount has an assembly of parts that can be assembled into two different configurations. The parts assembly includes a base plate, brackets, screws, and a stand cover. In a stand configuration, the described apparatus functions as a table stand for a television or computer monitor. In a wall mount configuration, the described apparatus allows a monitor to be mounted to a wall. A second embodiment provides a stand configuration having a neck pivotably attached to a base plate by a hinge, and a locking lever arm supporting the neck when the neck is in an upright position. | 2015-10-22 |
20150305179 | CASING FOR ELECTRICAL EQUIPMENT - A casing for electrical equipment, which has a drip-proof louver structure, includes a first plate and a second plate. The first plate has a plurality of first openings and a plurality of tongue-shaped louvers disposed in the respective first openings. Each one of the louvers has a lower end continuous to the first plate and right and left sides and an upper end all of which are separated from the first plate. The upper end side of each louver is folded to a back side of the first plate. The second plate is disposed on a front of the first plate and has a plurality of second openings each one of which has a smaller area than each first opening. The first and second plates are overlapped with each other so that the first and second openings communicate with each other, thereby forming a louver structure. | 2015-10-22 |
20150305180 | DEVICE FOR OPTIMIZING ELECTRICAL ENERGY - The invention includes; a sealed housing made of a plastic or metal material; a conductive plate made of a copper material, positioned in the center of the housing, and respectively connected to power lines so as to accumulate magnetic energy generated in an internal polymer-clay nanocomposite; a base insulation plate having insulation characteristics so as to fix the conductive plate; electric wires which are power lines for transmitting the magnetic energy stored on the conductive plate to the outside; the polymer-clay nano composite filled in the bottom portion of the housing such that the conductive plate is submerged therein; an upper ceramic layer coated on the inner wall of the housing so as to promote the magnetic interaction of a ceramic compound in the upper space portion of the polymer-clay nano composite. | 2015-10-22 |
20150305181 | ELECTRONIC COMPONENT UNIT - An electronic component unit includes a housing. The housing includes a housing space that houses an electronic component. The housing space is divided into a plurality of divided spaces by a central wall-shaped part protruding from a bottom of the housing space. The bottom defines a lower side of the housing space in the vertical direction. The central wall-shaped part has a connecting portion-fitting part to which a connecting part of an electric wire is fitted. For each of the divided spaces, the bottom has a short side direction tilted surface that is tilted from the central wall-shaped part toward the lower side in the vertical direction in a state where the housing is installed at an installation position, and a drain hole formed at a lower end of the short side direction tilted surface in the vertical direction. | 2015-10-22 |
20150305182 | SECURING ACCESS TO ONE OR MORE ELEMENTS OF A DEVICE - Aspects of the present invention include systems and methods include unique solutions for providing secure, selectable access to one or more functional elements of a device. In embodiments, a tab-lock system with moveable tab-locks can be positioned to block or allow access to functional elements of a device. In embodiments, the tab-lock system is configured so that when a locking device, such as a common Kensington lock, is locked to the device, the tab-locks settings cannot be changed. Such systems may be used to control the ability of individuals to physically access the interfaces of the device. Thus, such systems help secure an electronic device against inadvertent or malicious actions. | 2015-10-22 |
20150305183 | Lock Catch Structure - The lock catch structure comprises a first lock catch main body and a second lock catch main body. The first lock catch main body comprises a first base and a first main body rotationally connected to the first base; The second lock catch structure comprises a second base, a second main body rotationally connected to the second base, a handle hinged at the base and a draw-off locking member pivoted with the handle through a pivot shaft; one end of the draw-off locking member is limited in the groove, and the handle rotates around the pivot shaft as the support point, so that the draw-off locking member drives the first lock catch main body to move towards the second lock catch main body until the first inclined surface is pressed against the second inclined main surface. | 2015-10-22 |
20150305184 | LOCKING STRUCTURE BETWEEN MEMBER TO BE SUPPORTED AND SUPPORTING BODY - A locking structure between a member to be supported and a supporting body includes an electronic component unit as a member to be supported, an electronic component unit housing part of an electrical connection box as a supporting body, a lock mechanism for upper insertion fitting (an engagement claw and a lock arm) that, when the electronic component unit is fitted to the electronic component unit housing part from an upper-side opening, locks the electronic component unit to the electronic component unit housing part to prevent the electronic component unit from escaping toward the upper-side opening, and a lock mechanism for lower insertion fitting (an engagement claw and a lock arm) that, when the electronic component unit is fitted to the electronic component unit housing part from a lower-side opening, locks the electronic component unit to the electronic component unit housing part to prevent from escaping toward the lower-side opening. | 2015-10-22 |
20150305185 | HINGE ASSEMBLY - In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect a first section of the chassis to a second section of the chassis, comprising a hinge assembly to be coupled between the first section of the chassis and the second section of the chassis to allow rotation of the second section of the chassis with respect to the first section of the chassis, and a translation assembly to be coupled to the hinge assembly of the chassis for the electronic device to allow translation of the second section of the chassis with respect to the first section of the chassis, wherein rotation of the hinge assembly activates the translation assembly. Other embodiments may be described. | 2015-10-22 |
20150305186 | Electronic Device Cover Assembly - An electronic device cover assembly is provided. The electronic device cover assembly is configured to provide a convenient apparatus that allows a user to store his personal items in the same location as his electronic device. The assembly includes a cover configured to receive an electronic device therein. The cover includes grooves along an outer edge of a rear portion of the cover and at least one latching fastener configured to removably attach one of a plurality of interchangeable accessory portions. The interchangeable accessory portions include a first accessory portion having a housing and at least one sliding mechanism configured to support a user's keys. A second accessory portion includes a housing divided into a plurality of compartments configured to support a user's medicinal pills. A third accessory portion includes a battery pack configured to provide electrical power to the electronic device supported within the cover. | 2015-10-22 |
20150305187 | CRYOGENIC ELECTRICAL FEED-THROUGH - A cryogenic electrical power feed-through assembly includes a contact header assembly. The contact header assembly includes a feed-through body forming a feed-through body cavity disposed therethrough extending between a first opening end to a second opening end. A first contactor plate assembly is disposed at and hermetically seals the first opening end of the feed-through body with a first electron beam weld formed between the first contactor plate and the first opening end. A second contactor plate assembly is disposed at and hermetically seals the second opening end of the feed-through body with a second electron beam weld formed between the second contactor plate and the second opening end. Each contactor plate assembly includes a contactor plate, a plurality of insulative bushings hermetically sealed to and extending through the contactor plate, and a plurality of contact pins hermetically sealed to and extending through the plurality of insulative bushings. | 2015-10-22 |
20150305188 | Electric Power Converter - An object of the invention is to improve the cooling performance for a bus bar and a smoothing capacitor in an electric power converter. The electric power converter of the present invention includes a power semiconductor module including a power semiconductor element that converts a DC current to an AC current, a capacitor cell that smooths a DC voltage, a bus bar that electrically connects the power semiconductor module and the capacitor cell, a base plate that is disposed between the bus bar and the capacitor cell, and a sealing material that seals the capacitor cell, the bus bar, and the base plate. The base plate forms an opening through which a capacitor terminal extending from the capacitor cell passes. | 2015-10-22 |
20150305189 | THERMAL INTERFACE MATERIAL ASSEMBLIES AND RELATED METHODS - Example embodiments of the present disclosure generally relate to thermal interface material assemblies. In an example embodiment, a thermal interface material assembly generally includes a substrate and one or more pillars along a first and/or second side portion of the substrate. | 2015-10-22 |
20150305190 | Electronic System - An electronic system includes a carrier including at least one waveguide feeding, a semiconductor chip including a first surface and a second surface, and an integrated RF circuit, and a cooling element including a backshort. The semiconductor chip is mounted to the carrier such that the first surface faces the carrier. The integrated RF circuit is connected to the at least one waveguide feeding. The cooling element is mounted to the carrier such that the backshort is adjacent one end of the at least one waveguide feeding, and the cooling element at least partially covers the semiconductor chip such that the second surface of the semiconductor chip faces the cooling element. | 2015-10-22 |
20150305191 | METHOD TO ALIGN SURFACE MOUNT PACKAGES FOR THERMAL ENHANCEMENT - A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink. | 2015-10-22 |
20150305192 | DIELECTRIC THERMAL PAD USING DUAL-SIDED THERMALLY CONDUCTIVE ADHESIVE ON CERAMIC - A device includes: an electronic component that generates heat; a heatsink configured to absorb at least part of the heat through thermal transfer; and a thermally conductive dielectric pad that attaches the electronic component and the heatsink to each other and facilitates the thermal transfer. The thermally conductive dielectric pad includes: a ceramic tile; a first layer of adhesive that attaches a first side of the ceramic tile to the electronic component; and a second layer of adhesive that attaches a second side of the ceramic tile to the heatsink. | 2015-10-22 |
20150305193 | CHASSIS SYSTEM WITH FRONT COOLING INTAKE - A line card includes a metal frame that includes a front section, and a bottom section connected to the front section via an angled section, where the angled section results in an opening between the line card and a second line card, when the line card is installed above the second line card in a rack, and where the opening allows directed air to enter the rack from a front direction; a printed circuit board attached to the metal frame; and a group of front panel connectors attached to the front section of the metal frame. | 2015-10-22 |
20150305194 | HEAT DISSIPATION SYSTEM AND COMMUNICATIONS DEVICE - A heat dissipation system used for a communications device is disclosed, where the communications device includes a chassis, a network board, a service board, a backplane, and a high-rate cable; the chassis is configured to house the network board, the service board, the backplane, and the high-rate cable; the backplane is vertically inserted in a middle part or a middle rear part of the chassis, and parallel to a front side of the chassis; the service board and the network board are parallel and are connected to a front side of the backplane; the high-rate cable is connected between the network board and the service board on a rear side of the backplane; and the heat dissipation system further includes multiple fans that are installed in an array form on a rear side of the chassis, and an air vent that penetrates through the backplane. | 2015-10-22 |
20150305195 | HEAT DISSIPATION APPARATUS AND CABINET BODY HAVING THE SAME - Embodiments of the present invention provide a heat dissipation apparatus. The heat dissipation apparatus includes multiple heat exchange sheets, a first path and a second path are formed between the multiple heat exchange sheets, and the first path includes a first countercurrent channel, a guide channel, and a first-outlet cross-flow channel; the second path includes a second countercurrent channel and a second-inlet cross-flow channel. One part of a first fluid that enters the first path enters the first countercurrent channel and mainly performs countercurrent heat exchange with a second fluid that is in the second countercurrent channel, and the other part passes the guide channel and rapidly performs cross-flow heat exchange, so that heat exchange efficiency can be improved. | 2015-10-22 |
20150305196 | Water-cooled Cooling Apparatus Integrated to Load Devices - Disclosed is a water-cooled cooling apparatus integrated to load devices comprising: a common cold airflow chamber, a common warm airflow tunnel, a cabinet group, a water-cooled cooling device, and a group of electrical fans, wherein the enclosed airflow space is surrounded by the water-cooled cooling device and the group of electrical fans. Accordingly, a high efficiency and continuous cooling effect is provided. | 2015-10-22 |
20150305197 | EQUIPMENT ENCLOSURE FAN CONTROL SYSTEMS AND METHODS - An uninterruptible power supply (UPS) system includes an enclosure and a plurality of power converter modules positioned in the enclosure, each power conversion module including a power converter circuit, a module controller circuit configured to control the power converter circuit and at least one module fan controlled by the module controller circuit. The system further includes a system controller positioned in the enclosure and configured to communicate with the module controller circuits over a communications bus and at least one exhaust fan configured to exhaust air from the enclosure and controlled by the system controller. The system controller is configured to control the at least one exhaust fan responsive to information, such as temperature and/or load information, received from the module controller circuits. | 2015-10-22 |
20150305198 | MONOLITHIC MULTI-MODULE ELECTRONICS CHASSIS WITH MULTI-PLANAR EMBEDDED FLUID COOLING CHANNELS - A cooling system for cooling a heat source includes a monolithic structure having a plurality of embedded cooling channels arranged in a multi-planar arrangement, the embedded cooling channels configured to carry a cooling fluid to a plurality of locations throughout the monolithic structure, the cooling fluid configured to absorb heat transferred from a heat source associated with the monolithic structure. The monolithic structure is formed integrally with the embedded cooling channels using an additive manufacturing process. | 2015-10-22 |
20150305199 | HEAT DISSIPATION PIPE LOOP AND BACKLIGHT MODULE USING SAME - The present invention provides a heat dissipation pipe loop and a backlight module using the dissipation pipe loop. The heat dissipation pipe loop includes: an evaporator section ( | 2015-10-22 |
20150305200 | HEAT DISSIPATION DEVICE, ELECTRONIC DEVICE, AND BASE STATION DEVICE - A heat dissipation device includes: a first plate with a first surface on which a first heat dissipation fin is formed; a second plate with a first surface on which a second heat dissipation fin is formed, and a heat conduction unit that passes through a first through-hole of the first plate and a second through-hole of the second plate. | 2015-10-22 |
20150305201 | Carrier and Package Having the Carrier - A carrier is disclosed, including: a main body having a first surface and a second surface opposing the first surface; a conductive part formed on the first surface of the main body; and a plurality of heat conductors that are not in contact with the conductive part and penetrate the main body to connect the first surface with the second surface. Therefore, heat generated by electronic elements can be effectively dissipated outside to improve the functionality and lifetime of electronic elements. | 2015-10-22 |
20150305202 | ADJUSTABLE AIRFLOW BARRIER SYSTEM - An adjustable airflow barrier system has a roll of flexible sheet air barrier contained in a housing. The air barrier is biased in retracted position and has a range of extended positions. A pull bar is attached to a free edge of the air barrier. A first magnetic mount is coupled to the housing to removably mount the housing to a first support surface, such as a cabinet in a data center. A second magnetic mount is coupled to the pull bar to removably mount the pull bar to a second support surface spaced from the first support surface. The housing is operable to form a substantial air seal with the first support surface, and the pull bar is operable to form a substantial air seal with the second support surface. | 2015-10-22 |
20150305203 | DATA CENTER WITH COOLING SYSTEM - Data center includes a first container and a second container containing data racks therein. The first container includes an air intake for inputting outside cooling air into the first container. The second container contacts the first container via a base between the first container and the second container. The base defines a cooling air passage and heated air passage both communicating the first container and the second container. The cooling air passage inputs cooling air from the first container to the second container. The heated air passage inputs heated air from the second container to the first container. | 2015-10-22 |
20150305204 | DATA CENTER WITH COOLING SYSTEM - Data center includes a first container, a second container, a first duct and a second duct. The first container includes an air intake for inputting outside cooling air, an air input window for inputting heated air, and an air exhaust. The outside cooling air and the heated air in the first container are mixed to be cooling air. The second container has data racks contained therein. The second container includes an air inlet and an air outlet. The first air duct couples the air exhaust of the first container and the air inlet of the second container, for guiding the cooling air from the first container to cool data equipment at the data racks. The second air duct couples the air outlet of the second container and the input window of the first container, for guiding the heated air from the second container to the first container. | 2015-10-22 |
20150305205 | Kinetic-Heat-Sink-Cooled Server - A rack server has a base supporting a plurality of circuit elements, and a kinetic heat sink in direct contact with at least one first circuit element. The direct contact is configured to produce a heat-conduction relationship between the at least one first circuit element and the kinetic heat sink. The kinetic heat sink has a radial side spanning 360 degrees. The rack server also has a member for radially directing air from the kinetic heat sink. The member has an exhaust port spanning no more than about 180 degrees of the radial side, and the kinetic heat sink is configured to exhaust air from no more than about 180 degrees of the radial side. The exhaust port faces at least one second circuit element and is configured to direct air toward the at least one second circuit element. | 2015-10-22 |
20150305206 | STORAGE APPARATUS AND STORAGE CONTROLLER OF STORAGE APPARATUS - A storage apparatus configured to provide an external apparatus with a logical storage area as a data storage area, the storage apparatus having a physical storage medium configured to generate the logical storage area, and a storage controller communicatively coupled to the physical storage medium to control data input/output processing between the external apparatus and the logical storage area, wherein the storage controller includes a circuit package including a circuit board which implements a predetermined function of the storage controller and a circuit board case to accommodate the circuit board, a plurality of cooling fan units that generate cooling air for cooling a circuit component mounted on the circuit board of the circuit package, and a chassis having a structure for accommodating the circuit package and the cooling fan units, at least some of the plurality of circuit packages are inserted to be accommodated in the chassis from one opening thereof and are arranged side by side across a width direction of the chassis. | 2015-10-22 |
20150305207 | CONTAINER AIR HANDLING UNIT AND COOLING METHOD - A modular cooling system configured to treat IT air generated by a data center includes a frame and a plurality of cooling sub-system modules supported by the frame. The plurality of cooling sub-system modules are configured to operate in parallel to achieve total cooling effect or a lesser cooling effect with some level of redundancy within the data center. Each cooling sub-system module includes a housing configured to support cooling equipment, an air-to-air heat exchanger supported by the housing to cool IT air generated by the data center, the air-to-air heat exchanger having at least one tube configured to direct IT from one end of the air-to-air heat exchanger to an opposite end of the air-to-air heat exchanger and configured so that outdoor air circulates around the at least one tube, and a mechanical cooling system supported by the housing. The mechanical cooling system is configured to receive IT air treated by the air-to-air heat exchanger and to provide further cooling to the treated IT air. Other embodiments of the cooling system and methods of cooling are further disclosed. | 2015-10-22 |
20150305208 | Data Centre - A data centre ( | 2015-10-22 |
20150305209 | COOLING SYSTEM FOR ELECTRONIC DEVICE STORING APPARATUS AND COOLING SYSTEM FOR ELECTRONIC DEVICE STORING BUILDING - A cooling system of an electronic device storing apparatus of the present invention comprises: a rack including an electronic device and a plurality of placement shelves to place the electronic device; in the rack, a vaporizer having a refrigerant internally being mounted; outside the rack, a condensing part connected with the vaporizer by a laying pipe being installed; and a refrigerant adjustment means for adjusting a height of a refrigerant surface in the vaporizer. | 2015-10-22 |