32nd week of 2010 patent applcation highlights part 44 |
Patent application number | Title | Published |
20100203705 | SEMICONDUCTOR DEVICE WITH IMPROVED OVERLAY MARGIN AND METHOD OF MANUFACTURING THE SAME - Semiconductor devices with an improved overlay margin and methods of manufacturing the same are provided. In one aspect, a method includes forming a buried bit line in a substrate; forming an isolation layer in the substrate to define an active region, the isolation layer being parallel to the bit line without overlapping the bit line; and forming a gate line including a gate pattern and a conductive line by forming the gate pattern in the active region and forming a conductive line that extends at a right angle to the bit line across the active region and is electrically connected to the gate pattern disposed thereunder. The gate pattern and the conductive line can be integrally formed. | 2010-08-12 |
20100203706 | METHOD OF MANUFACTURING AN SOI SUBSTRATE AND METHOD OF MANUFACUTIRNG A SEMICONDUCTOR DEVICE - It is an object of the present invention is to provide a method of manufacturing an SOI substrate provided with a single-crystal semiconductor layer which can be practically used even when a substrate having a low heat-resistant temperature, such as a glass substrate or the like, is used, and further, to manufacture a semiconductor device with high reliability by using such an SOI substrate. A semiconductor layer which is separated from a semiconductor substrate and bonded to a supporting substrate having an insulating surface is irradiated with electromagnetic waves, and the surface of the semiconductor layer is subjected to polishing treatment. At least part of a region of the semiconductor layer is melted by irradiation with electromagnetic waves, and a crystal defect in the semiconductor layer can be reduced. Further, the surface of the semiconductor layer can be polished and planarized by polishing treatment. | 2010-08-12 |
20100203707 | SUBSTRATE DIVIDING METHOD - A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate | 2010-08-12 |
20100203708 | AMORPHIZATION/TEMPLATED RECRYSTALLIZATION METHOD FOR HYBRID ORIENTATION SUBSTRATES - The present invention provides an improved amorphization/templated recrystallization (ATR) method for fabricating low-defect-density hybrid orientation substrates. ATR methods for hybrid orientation substrate fabrication generally start with a Si layer having a first orientation bonded to a second Si layer or substrate having a second orientation. Selected regions of the first Si layer are amorphized and then recrystallized into the orientation of the second Si layer by using the second Si layer as a template. The process flow of the present invention solves two major difficulties not disclosed by prior art ATR methods: the creation of “corner defects” at the edges of amorphized Si regions bounded by trenches, and undesired orientation changes during a high temperature post-recrystallization defect-removal annealing of non-ATR'd regions not bounded by trenches. In particular, this invention provides a process flow comprising the steps of (i) amorphization and low-temperature recrystallization performed in substrate regions free of trenches, (ii) formation of trench isolation regions that subsume the defective regions at the edge of the ATR'd regions, and (iii) a high-temperature defect-removal anneal performed with the trench isolation regions in place. | 2010-08-12 |
20100203709 | DEPOSITION OF CHALCOGENIDE MATERIALS VIA VAPORIZATION PROCESS - A method of depositing a chalcogenide material. The method includes forming a condensed phase chalcogenide source material on a deposition surface, capping the deposition surface, vaporizing the chalcogenide source material, and subsequently forming a product chalcogenide material on the deposition surface by condensing the vapor. Vaporization may occur via sublimation or evaporation and the condensed phase chalcogenide source material may be a solid-phase source material or a liquid-phase source material. The sublimation-condensation process achieves a spatial redistribution of chalcogenide material on the deposition surface. The deposition surface may include a patterned feature such as a hole, trench or other opening, where the spatial redistribution afforded by the method provides more conformal coverage or more uniform filling of the feature. The composition of the redistributed product chalcogenide material closely corresponds to the composition of the chalcogenide source material. | 2010-08-12 |
20100203710 | Method of manufacturing a semiconductor device - A method of manufacturing a semiconductor device by thinning a substrate by grinding, and performing ion implantation. In a diode in which a P anode layer and an anode electrode are formed at a side of a right face of an N | 2010-08-12 |
20100203711 | Trench Formation Method For Releasing A Thin-Film Substrate From A Reusable Semiconductor Template - A method is provided for fabricating a thin-film semiconductor substrate by forming a porous semiconductor layer conformally on a reusable semiconductor template and then forming a thin-film semiconductor substrate conformally on the porous semiconductor layer. An inner trench having a depth less than the thickness of the thin-film semiconductor substrate is formed on the thin-film semiconductor substrate. An outer trench providing access to the porous semiconductor layer is formed on the thin-film semiconductor substrate and is positioned between the inner trench and the edge of the thin-film semiconductor substrate. The thin-film semiconductor substrate is then released from the reusable semiconductor template. | 2010-08-12 |
20100203712 | PROCESS FOR FORMING A WIRE PORTION IN AN INTEGRATED ELECTRONIC CIRCUIT - A process for forming a wire portion in an integrated electronic circuit includes epitaxially growing the wire portion on a side surface of a seed layer portion ( | 2010-08-12 |
20100203713 | METHOD OF MANUFACTURING ELECTRONIC DEVICE - An object of this invention is to provide a method for manufacturing an electronic device wherein a conductor layer is uniformly formed on a substrate having a super large area. In the method for manufacturing the electronic device, a metal film for forming a gate electrode is selectively embedded in a transparent resin film formed on a substrate, and the metal film is formed by sputtering directly on the substrate at the gate electrode portion, and on an insulating coat film on portions other than the gate electrode portion. The metal film on the insulating coat film is removed by chemical liftoff with removal of the insulating coat film by etching. | 2010-08-12 |
20100203714 | SEMICONDUCTOR STORAGE DEVICE - It is intended to provide a semiconductor device having a reduced thickness of a silicon nitride film on an outer periphery of a gate electrode of an SGT. A semiconductor device of the present invention is constructed using a MOS transistor which has a structure where a drain, a gate and a source are arranged in a vertical direction with respect to a substrate, and the gate is formed to surround a pillar-shaped semiconductor layer. The semiconductor device comprises: a silicide layer formed in an upper surface of each of upper and lower diffusion layers formed in upper and underneath portions of the pillar-shaped semiconductor layer, in a self-alignment manner, wherein the silicide layer is formed after forming a first dielectric film on a sidewall of the pillar-shaped semiconductor layer to protect the sidewall of the pillar-shaped semiconductor layer during formation of the silicide layer; and a second dielectric film formed, after forming the silicide layer and then removing the first dielectric film, in such a manner as to cover a source/drain region formed in the underneath portion of the pillar-shaped semiconductor layer, the gate electrode formed on the sidewall of the pillar-shaped semiconductor layer, and a source/drain region formed on the upper portion of the pillar-shaped semiconductor layer. | 2010-08-12 |
20100203715 | THIN FILM TRANSISTOR ARRAY PANEL AND FABRICATION - The present invention provides a manufacturing method of a thin film transistor array panel, which includes forming a gate line on a substrate; forming a gate insulating layer, a semiconductor layer, and an ohmic contact on the gate line; forming a first conducting film including Mo, a second conducting film including Al, and a third conducting film including Mo on the ohmic contact; forming a first photoresist pattern on the third conducting film; etching the first, second, and third conducting films, the ohmic contact, and the semiconductor layer using the first photoresist pattern as a mask; removing the first photoresist pattern by a predetermined thickness to form a second photoresist pattern; etching the first, second, and third conducting films using the second photoresist pattern as a mask to expose a portion of the ohmic contact; and etching the exposed ohmic contact using a Cl-containing gas and a F-containing gas. | 2010-08-12 |
20100203716 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE HAVING DUAL GATE - A method of fabricating a semiconductor device having a dual gate allows for the gates to have a wide variety of threshold voltages. The method includes forming a gate insulation layer, a first capping layer, and a barrier layer in the foregoing sequence across a first region and a second region on a substrate, exposing the gate insulation layer on the first region by removing the first capping layer and the barrier layer from the first region, forming a second capping layer on the gate insulation layer in the first region and on the barrier layer in the second region, and thermally processing the substrate on which the second capping layer is formed. The thermal processing causes material of the second capping layer to spread into the gate insulation layer in the first region and material of the first capping layer to spread into the gate insulation layer in the second region. Thus, devices having different threshold voltages can be formed in the first and second regions. | 2010-08-12 |
20100203717 | CUT FIRST METHODOLOGY FOR DOUBLE EXPOSURE DOUBLE ETCH INTEGRATION - A multiple etch process for forming a gate in a semiconductor structure in which a cut area is first formed followed by the forming of the gate conductor lines. | 2010-08-12 |
20100203718 | MITIGATION OF HIGH STRESS AREAS IN VERTICALLY OFFSET STRUCTURES - Alternative methods of constructing a vertically offset structure are disclosed. An embodiment includes forming a flexible layer having first and second end portions, an intermediate portion coupling the first and second portions, and upper and lower surfaces. The distance between the upper and lower surfaces at the intermediate portion is less than the distance between the upper and lower surfaces at the first and second end portions. The first end portion is bonded to a base member. The second end portion of the flexible layer is deflected until the second end portion contacts the base member. The second end portion is bonded to the base member. | 2010-08-12 |
20100203719 | Method of Forming an Antifuse and a Conductive Interconnect, and Methods of Forming DRAM Circuitry - A first via opening is formed to a first conductor and a second via opening is formed to a second conductor. The first and second via openings are formed through insulative material. Then, the first conductor is masked from being exposed through the first via opening and to leave the second conductor outwardly exposed through the second via opening. An antifuse dielectric is formed within the second via opening over the exposed second conductor while the first conductor is masked. Then, the first conductor is unmasked to expose it through the first via opening. Then, conductive material is deposited to within the first via opening in conductive connection with the first conductor to form a conductive interconnect within the first via opening to the first conductor and to within the second via opening over the antifuse dielectric to form an antifuse comprising the second conductor, the antifuse dielectric within the second via opening and the conductive material deposited to within the second via opening. Other aspects are contemplated. | 2010-08-12 |
20100203720 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME FOR DECREASING NUMBER OF PROCESSES - A semiconductor package and a method for manufacturing the same. The semiconductor package includes a semiconductor chip having bonding pads; a first insulation layer pattern; redistribution line patterns; a second insulation layer pattern; and conductive balls. The first insulation layer pattern having first openings exposing the bonding pads. The redistribution line patterns are located on the first insulation layer pattern and are electrically connected with the bonding pads. The second insulation layer pattern covering the redistribution line patterns and having second openings having first open areas which expose portions of the redistribution line patterns and having second open areas which extend from the first open areas along the semiconductor chip. The conductive balls are electrically connected with the portions of the redistribution line patterns which are exposed through the first open areas of the second insulation layer pattern. | 2010-08-12 |
20100203721 | MULTI-COMPONENT INTEGRATED CIRCUIT CONTACTS - An integrated circuit connection is describe that includes a first, securing member and a second, connection member. The first member, in an embodiment, is a spike that has a portion of its body fixed in a layer of an integrated circuit structure and extends outwardly from the integrated circuit structure. The second material is adapted to form a mechanical connection to a further electrical device. The second material (e.g., solder), is held by the first member to the integrated circuit structure. The first member increases the strength of the connection and assists in controlling the collapse of second member to form the mechanical connection to another circuit. The connection is formed by coating the integrated circuit structure with a patterned resist and etching the layer beneath the resist. A first member material (e.g., metal) is deposited. The resist is removed. The collapsible material is fixed to the first member. | 2010-08-12 |
20100203722 | Semiconductor Device Having a Second Level of Metallization Formed over a First Level with Minimal Damage to the First Level and Method - A method for processing a semiconductor structure includes the steps of capping a top surface of the semiconductor structure that defines the metallization layer with a thin stop layer, forming a dielectric layer over the thin stop layer, wherein the dielectric layer defines at least one area where the thin stop layer is exposed, and removing the exposed thin stop layer to expose a top surface of the metallization layer using etchant gases substantially free from oxygen, so that the metallization layer is substantially free of damage. | 2010-08-12 |
20100203723 | Semiconductor device and method of manufacturing semiconductor device - There is provided a method of manufacturing a semiconductor device, the method including performing at least one of: processing, when forming the first redistribution layer, of forming the first electrically conductive material layer by growing the first electrically conductive material using electroplating, and polishing the first resist film and the first electrically conductive material layer from the main surface side to flatten their surfaces; and processing, when forming the second redistribution layer, forming the second electrically conductive material layer by growing the second electrically conductive material using electroplating, and polishing the second resist film and the second electrically conductive material layer from the main surface side to flatten their surfaces. | 2010-08-12 |
20100203724 | METHOD OF MANUFACTURING A SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A manufacturing technique is disclosed for producing a semiconductor integrated circuit device having plural layers of buried wirings, and such that there is prevented the occurrence of a discontinuity caused by stress migration at an interface between a plug connected at a bottom thereof to a buried wiring and the buried wiring. For example, in the case where the width of a first Cu wiring is not smaller than about 0.9 μm and is smaller than about 1.44 μm, and the width of a second Cu wiring and the diameter of a plug are about 0.18 μm, there are arranged two or more plugs which connect the first wirings and the second Cu wirings electrically with each other. | 2010-08-12 |
20100203725 | Methods of fabricating semiconductor devices and semiconductor devices including a contact plug processed by rapid thermal annealing - A method of fabricating a semiconductor device includes depositing tungsten on an insulating layer in which a contact hole is formed by chemical vapor deposition (CVD), performing chemical mechanical planarization (CMP) on the tungsten to expose the insulating layer and form a tungsten contact plug, and performing rapid thermal oxidation (RTO) on the tungsten contact plug in an oxygen atmosphere such that the tungsten expands volumetrically into tungsten oxide (W | 2010-08-12 |
20100203726 | Method of Forming a Through Substrate Via in a Compound Semiconductor - A method is provided for forming a through substrate via in a compound semiconductor having a transistor on a front side of the substrate. The method comprises forming a protective stop pad over a contact area on the front side of the substrate, forming a contact pad overlying the protective stop pad, such that the contact pad is in contact with a terminal of the transistor and plasma etching a backside of the substrate to form a contact coupling via to the protective stop pad. The method further comprises performing a chemical wet etch to remove the protective stop pad and depositing a conductive contact layer in the contact coupling via to provide a conductive contact to the contact pad. | 2010-08-12 |
20100203727 | METHOD FOR INTEGRATED CIRCUIT FABRICATION USING PITCH MULTIPLICATION - Different sized features in the array and in the periphery of an integrated circuit are patterned on a substrate in a single step. In particular, a mixed pattern, combining two separately formed patterns, is formed on a single mask layer and then transferred to the underlying substrate. The first of the separately formed patterns is formed by pitch multiplication and the second of the separately formed patterns is formed by conventional photolithography. The first of the separately formed patterns includes lines that are below the resolution of the photolithographic process used to form the second of the separately formed patterns. These lines are made by forming a pattern on photoresist and then etching that pattern into an amorphous carbon layer. Sidewall pacers having widths less than the widths of the un-etched parts of the amorphous carbon are formed on the sidewalls of the amorphous carbon. The amorphous carbon is then removed, leaving behind the sidewall spacers as a mask pattern. Thus, the spacers form a mask having feature sizes less than the resolution of the photolithography process used to form the pattern on the photoresist. A protective material is deposited around the spacers. The spacers are further protected using a hard mask and then photoresist is formed and patterned over the hard mask. The photoresist pattern is transferred through the hard mask to the protective material. The pattern made out by the spacers and the temporary material is then transferred to an underlying amorphous carbon hard mask layer. The pattern, having features of difference sizes, is then transferred to the underlying substrate. | 2010-08-12 |
20100203728 | SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF - A semiconductor device includes at least two adjacent memory cell blocks, each of the memory cell blocks having a plurality of memory cell units, each of memory cell units having a plurality of electrically reprogrammable and erasable memory cells connected in series, a plurality of cell gates for selecting the plurality of memory cells within the two adjacent memory cell blocks, each of the plurality of cell gates being formed with roughly rectangular closed loops or roughly U shaped open loops, each of the loops being connected to a corresponding cell of the memory cells in a corresponding memory cell unit of the plurality of memory cell units within one of the two adjacent memory cell blocks and being connected to a corresponding memory cell of the memory cells in a corresponding memory cell unit of the plurality of memory cell units within the other memory cell block of the two adjacent memory cell blocks and a plurality of pairs of first and second selection gates for selecting the memory cell block, the plurality of cell gates being located between one pair of the first and second selection gates within a corresponding block of the memory cell block. | 2010-08-12 |
20100203729 | COMPOSITION FOR CHEMICAL MECHANICAL POLISHING - Provided is a composition for use in chemical mechanical polishing. The composition includes an amino acid and its derivatives, a surfactant, and an additive that increases the swelling of polishing particles. | 2010-08-12 |
20100203730 | Epitaxial Lift Off in Inverted Metamorphic Multijunction Solar Cells - A process for selectively freeing an epitaxial layer from a single crystal substrate upon which it was grown, by providing a first substrate; depositing a separation layer on said first substrate; depositing on said separation layer a sequence of layers of semiconductor material forming a solar cell; mounting and bonding a surrogate substrate on top of the sequence of layers; attaching a connecting link element to at least two opposed points on the periphery of the surrogate substrate; and etching said separation layer while applying tension to said link element so as to remove said epitaxial layer from said first substrate. | 2010-08-12 |
20100203731 | Formation of a Zinc Passivation Layer on Titanium or Titanium Alloys Used in Semiconductor Processing - Embodiments of the current invention describe methods of processing a semiconductor substrate that include applying a zincating solution to the semiconductor substrate to form a zinc passivation layer on the titanium-containing layer, the zincating solution comprising a zinc salt, FeCl | 2010-08-12 |
20100203732 | FIN AND FINFET FORMATION BY ANGLED ION IMPLANTATION - A semiconductor device is formed by providing a substrate and forming a semiconductor-containing layer atop the substrate. A mask having a plurality of openings is then formed atop the semiconductor-containing layer, wherein adjacent openings of the plurality of openings of the mask are separated by a minimum feature dimension. Thereafter, an angled ion implantation is performed to introduce dopants to a first portion of the semiconductor-containing layer, wherein a remaining portion that is substantially free of dopants is present beneath the mask. The first portion of the semiconductor-containing layer containing the dopants is removed selective to the remaining portion of semiconductor-containing layer that is substantially free of the dopants to provide a pattern of sublithographic dimension, and the pattern is transferred into the substrate to provide a fin structure of sublithographic dimension. | 2010-08-12 |
20100203733 | ETCHING METHOD, SEMICONDUCTOR AND FABRICATING METHOD FOR THE SAME - An organic/inorganic hybrid film represented by SiC | 2010-08-12 |
20100203734 | METHOD OF PITCH HALVING - The present disclosure provides a method of fabricating a semiconductor device that includes forming a mask layer over a substrate, forming a dummy layer having a first dummy feature and a second dummy feature over the mask layer, forming first and second spacer roofs to cover a top portion of the first and second dummy features, respectively, and forming first and second spacer sleeves to encircle side portions of the first and second dummy features, respectively, removing the first spacer roof and the first dummy feature while protecting the second dummy feature, removing a first end portion and a second end portion of the first spacer sleeve to form spacer fins, and patterning the mask layer using the spacer fins as a first mask element and the second dummy feature as a second mask element. | 2010-08-12 |
20100203735 | SOLUTION FOR REMOVING RESIDUE AFTER SEMICONDUCTOR DRY PROCESS AND METHOD OF REMOVING THE RESIDUE USING THE SAME - A residue-removing solution for removing residues present on semiconductor substrates after dry etching and/or ashing, the residue-removing solution comprising a Cu surface protective agent including: at least one compound selected from compounds (1), (2) and (3) each having as a basic skeleton a five-membered or six-membered heteratomic structure as defined herein; a compound capable of forming a complex or chelate with Cu (copper); and water. Further, the residue-removing solution has a pH of 4 to 9. | 2010-08-12 |
20100203736 | Plasma Processing Method - There is provided a plasma processing method which controls a bias power to be constant without affecting the bias power supplied to a wafer, even if a part of a bias power supplied to a wafer is divided and supplied to a focus ring, and does not change the etching characteristic of the entire substrate to be processed. A high-frequency bias power supplied to a focus ring is changed by controlling the impedance control circuit according to the waste quantity of the focus ring that is wasted by the plasma processing. On the other hand, the high-frequency bias power supplied to the specimen support is controlled to the given high-frequency bias power by controlling the output of the high-frequency bias power supply. | 2010-08-12 |
20100203737 | ETCHING METHOD AND SYSTEM - An etching method and an etching system are adapted to produce a high etch selectivity for a mask, an excellent anisotropic profile and a large etching depth. An etching system according to the invention comprises a floating electrode arranged vis-à-vis a substrate electrode in a vacuum chamber and held in a floating state in terms of electric potential, a material arranged at the side of the floating electrode facing the substrate electrode to form an anti-etching film and a control unit for intermittently applying high frequency power to the floating electrode. An etching method according to the invention uses a material arranged at the side of the floating electrode opposite to the substrate electrode to form an anti-etching film as target and only rare gas as main gas and is adapted to repeat a step of forming a film on the substrate by sputtering by applying high frequency power to the floating electrode and a step of subsequently etching the substrate by suspending the application of high frequency power to the floating electrode and introducing etching gas into the vacuum chamber in a predetermined sequence. | 2010-08-12 |
20100203738 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device which includes a gate electrode formed in the shape substantially vertical to a semiconductor substrate is disclosed. A gate electrode is formed by anisotropically etching a gate electrode film having a metal-containing film formed on the semiconductor substrate via a gate insulating film to expose a portion of the gate insulating film. A modified film is formed on a side wall of the metal-containing film by modifying the side wall of the metal-containing film. The exposed portion of the gate insulating film is removed and a portion of the gate insulating film sandwiched between the semiconductor substrate and the metal-containing film is recessed so as to recede from the modified side wall of the metal-containing film by isotropically etching. A side portion of the metal-containing film protruding from the receded gate insulating film is removed by isotropically etching. | 2010-08-12 |
20100203739 | METHOD FOR ETCHING A LAYER ON A SILICON SEMICONDUCTOR SUBSTRATE - A method for selective etching of an SiGe mixed semiconductor layer on a silicon semiconductor substrate by dry chemical etching of the SiGe mixed semiconductor layer with the aid of an etching gas selected from the group including ClF | 2010-08-12 |
20100203740 | Process for Increasing Feature Density During the Manufacture of a Semiconductor Device - Methods used during the manufacture of a semiconductor device, such as one that includes forming a plurality of vertically oriented first support features. Each feature comprises first and second sidewalls and the first support features are formed to have a first pitch. A plurality of first mask spacers are formed, wherein one first mask spacer is formed on each first support feature sidewall, and each first mask spacer comprises an exposed, vertically oriented sidewall. A plurality of vertically oriented second support features are formed, wherein one second support feature is formed on the exposed, vertically oriented sidewall of each first mask spacer, and each second support feature is separated from an adjacent second support feature by a gap. A plurality of second mask features are formed, wherein one second mask feature is formed within each gap. The first and second support features are removed, and the first and second mask spacers are left to provide an etch pattern, wherein the first and second mask features have a second pitch. The first pitch is about three times the second pitch. | 2010-08-12 |
20100203741 | SEMICONDUCTOR MANUFACTURING SYSTEM - Disclosed is a technique for effectively suppressing the generation of particles resulting from peeling-off of unnecessary films that have unavoidably adhered to the inner surface of the reaction tube of an ALD film-forming apparatus. A precoating process utilizing ALD is performed to deposit a metal oxide film, e.g., an aluminum oxide film, onto the unnecessary films, in order to prevent peeling-off of the unnecessary films. The type and/or position of the nozzle for supplying ozone, as a precoat gas, into the reaction tube during the precoating process is different from that of the nozzle for supplying ozone, as a film-forming gas, into the reaction tube during forming of a film on a semiconductor substrate. | 2010-08-12 |
20100203742 | Negatively Charged Passivation Layer in a Photovoltaic Cell - Embodiments of the invention are directed to methods and apparatus for processing of a solar substrate for making a photovoltaic device. In particular, methods and apparatus for creating a negatively charged passivation layer by are provided. | 2010-08-12 |
20100203743 | CONNECTION METHOD FOR FLEXIBLE BOARD AND A FLEXIBLE BOARD CONNECTOR - The present invention suggests a flexible board connector having a frame element, which comprises an insertion opening, and a cover element. The frame element is provided and intended for being mounted to a circuit board. The insertion opening is provided and adapted to accept a flexible board, which has at least one conductive contact on a first side thereof. The cover element has at least an opened position and a closed position. When the cover element is in the closed position, the cover element is adapted for exerting a pressure against a second surface of the flexible board, when the flexible board is inserted through the insertion opening into the frame element of the flexible board connector. | 2010-08-12 |
20100203744 | SOUND SOCKET CONNECTOR WITH BUILT-IN SOUND PROCESSING CAPABILITY - A sound socket connector with built-in sound processing capability includes a base, a sound circuit board, a metallic casing and a rear cover. The base has a front surface and a rear surface. The front surface has a plurality of sound input ports. The rear surface has a plurality of outward-extending electric-conductive pins at positions corresponding to those of the sound input ports. One end of the sound circuit board has a plurality of perforations. The electric-conductive pins pass through the perforations to be electrically connected to the sound circuit board. The other end of the sound circuit board is electrically connected with electric-conductive terminals. The electric-conductive terminals are electrically connected to a mother board. A decoder, a sound processor and a wireless module are electrically connected between the perforations and the electric-conductive terminals. | 2010-08-12 |
20100203745 | LOW PROFILE ELECTRICAL CONDUCTOR ASSEMBLY FOR INTERCONNECTING CONDUCTIVE COMPONENTS IN A STACKED CONFIGURATION - A thin profile electrical connector assembly for interconnecting conductive components, such as circuit boards, in a stacked configuration, includes a frame-shaped insulating body member having opposite ends and opposite leg members. A plurality of adjacently disposed and spaced apart connector elements are configured on at least one of the leg members. Each connector element includes a lower arm held in the leg member and that terminates at a contact tail that extends outward from an outer side of the leg member, and a resilient arm that extends from the lower arm at an obtuse angle towards the opposite leg member. The resilient arm terminates in a resilient contact nose that extends above an upper surface of the leg members. The insulating body defines an open space between the opposite leg members whereby the resilient arms of the connector elements are pressed into the open space upon use of the connector assembly such that the connector assembly has a profile height in use that corresponds essentially to the thickness of the leg members. | 2010-08-12 |
20100203746 | ELECTRICAL JUNCTION BOX - To provide an electrical junction box wherein terminals juxtaposed in the box can be supported, when fuses or the like are fitted in the terminals. An electrical junction box is provided on an outer surface with electrical component containing sections. Terminals are juxtaposed in the containing sections. The terminals are connected to an internal circuit member. Each terminal is provided on opposite side edges in a width direction with recesses or protrusions. Support pins project from the electrical junction box or an insulation plate contained in the box so that each support pin is disposed between the adjacent terminals to extend in a direction perpendicular to the terminals and is fitted in the recesses or protrusions. | 2010-08-12 |
20100203747 | FLEXIBLE PRINTED CIRCUIT BOARD HAVING EMBOSSED CONTACT ENGAGING PORTION - A flexible printed circuit board ( | 2010-08-12 |
20100203748 | Electrical ground connector - An electrical ground connector assembly including a bus bar adapted to have a plurality of electrical wires separately connected thereto; and a combined electrical connection and mounting post assembly directly connected to the bus bar. The combined electrical connection and mounting post assembly is adapted to directly connect an electrical conductor thereto. The combined electrical connection and mounting post assembly extends from the bus bar in a generally cantilever fashion and is configured to supportingly attach the bus bar to a structure. | 2010-08-12 |
20100203749 | ELECTRONIC DEVICE WITH AN EXTERNAL CONNECTOR - An electronic device with an external connector having a body having a 1st engaged portion, a connector provided on said body, a connector cap mounted on said connector having a 1st cap engagement portion, a cover attached to said body, and having a 2nd engaged portion which engaging with said 1st engaged portion, and having a 2nd cap engagement portion catching by said 1st cap engagement portion when said connector cap is mounted on said connector. | 2010-08-12 |
20100203750 | RETENTION-EXTRACTION DEVICE FOR REMOVABLE CARDS IN A CHASSIS - A retention-extraction device is provided for a removable card in a chassis. The device includes an actuation rod having a cam slot, the actuation rod configured to provide linear movement along the length of the actuation rod, and an extraction lever operatively connected to a proximal end of the actuation rod and pivotally secured to the chassis. The device also includes a bell crank with a cam follower that is configured to ride in the cam slot and a latch hook that pivots between an open and closed position based on the motion of the bell crank. The linear movement of the actuation rod causes the extraction lever to apply a force to a portion of the card and causes the latch hook to pivot to an open position to allow removal of the card. | 2010-08-12 |
20100203751 | SOCKET STRUCTURE - A socket structure includes a plastic base, a connection slot, a circuit board and pin terminals. The connection slot may be engaged with an inserted plug. The circuit board positioned in the plastic base and located in the connection slot has many first traces. Each first trace has a first contact on one surface of a front section of the circuit board, and a second contact on a rear section of the circuit board. The first contacts are electrically connected to the plug. The pin terminals are electrically connected to the second contacts of the first traces. One end of each of the pin terminals extends out of the plastic base. | 2010-08-12 |
20100203752 | CONTACT AND ELECTRICAL CONNECTOR HAVING INCREASED CONNECTION OBJECT REMOVAL FORCE - A contact has a coupling portion formed of a material which can be bent and unbent. The contact has a spring portion adapted to be connected to a first connection object and a connecting portion adapted to be connected to a second connection object. The spring portion and the connecting portion extend from the coupling portion. The coupling portion is bent into a shape surrounding an axis and maintained in the shape. An electrical connector may be formed by holding the contact in a housing. | 2010-08-12 |
20100203753 | ELECTRONIC COMMUNICATION WIRE CONNECTOR - An electronic communication wire connecting an input speed sensor and a computer controller in a transmission system is provided. The electronic communication wire connects at one end to the input speed sensor through a first aperture in the transmission case and at the other end to the computer controller through a second aperture in the transmission case. Thus, the electronic communication wire is attached at both ends to internal devices but it partially exists external to the transmission case along the length of the electronic communication wire. The connection between the electronic communication wire and the input speed sensor is sealed with at least a single O-ring while the connection between the electronic communication wire and the computer controller is sealed with at least a pair of O-rings. A method of electronically connecting the input speed sensor and the computer controller externally of the transmission case is also provided. | 2010-08-12 |
20100203754 | CABLE ASSEMBLY WITH LATCHING MECHANISM - A cable assembly ( | 2010-08-12 |
20100203755 | ELECTRICAL CONNECTOR - An electrical connector for transmitting data signals between the insulated conductors of a first data cable and corresponding insulated conductors of a second data cable, including a first part having a socket shaped to at least partially receive a plug of said first data cable; a second part having a plurality of insulation displacement contact slots shaped to receive end sections of the conductors of the second data cable; and a plurality of electrically conductive contacts including resiliently compressible spring finger contacts extending into the socket for electrical connection with corresponding conductors of the first cable; insulation displacement contacts seated in corresponding insulation displacement contact slots for effecting electrical connection with corresponding conductors of the second data cable; and mid sections extending therebetween, wherein mid sections of the contacts are seated in corresponding channels. | 2010-08-12 |
20100203756 | JOINT CONNECTOR AND WIRE SHORT-CIRCUITING METHOD USING THE SAME - A joint connector capable of mutually short-circuiting wires reliably without an increase in the number of components and size thereof. The joint connector (JC) comprises a joint terminal for short-circuiting and a connector housing. The joint terminal includes a plurality of electric contact portions and a short-circuiting portion connecting the electric contact portions. The connector housing has a bottom wall and other walls surrounding a terminal insertion space into which each of the wire-side terminal is inserted, and a lance for locking the inserted wire-side terminal. The lance adapted to be deflected so as to project outwardly from the bottom wall, until the wire-side terminal reaches a proper insertion depth position, to be retracted from the wire-side terminal, and elastically return into the bottom wall, when the wire-side terminal reaches the position. The deflection of the lance allows the insertion of the wire-side terminal to be checked. | 2010-08-12 |
20100203757 | JUMPER CONNECTOR FOR A LIGHTING ASSEMBLY - A jumper connector for connecting lighting components to one another includes a connector body having a mating surface configured to engage more than one lighting component, where the connector body is configured to be secured to a substrate by a fastener. The jumper connector also includes a conductor held by the body, wherein the conductor is configured to be electrically connected to more than one lighting component during the same manufacturing step in which the connector body is secured to the substrate. | 2010-08-12 |
20100203758 | REPLACEABLE PROBE APPARATUS FOR PROBING SEMICONDUCTOR WAFER - A probe apparatus is provided with a plurality of probe tiles, an interchangeable plate for receiving the probe tiles, a floating plate being disposed between the respective probe tile and a receiving hole on the interchangeable plate, and a control mechanism providing multi-dimensional freedom of motions to control a position of the probe tile relative to the respective receiving hole of the interchangeable plate. A method of controlling the floating plate is also provided by inserting a pair of joysticks into two respective adjustment holes disposed on the floating plate and moving the pair of joysticks to provide translational motions (X-Y) and rotational (theta) motion of the floating plate, and turning the pair of jack screws clockwise and counter-clockwise to provide a translational motion (Z) and two rotational (pitch and roll) motions of the floating plate. | 2010-08-12 |
20100203759 | CONNECTOR - A connector (M) includes a terminal fitting accommodation member ( | 2010-08-12 |
20100203760 | Connecting Assembly For An End Of A Coaxial Cable And Method Of Connecting A Coaxial Cable To A Connector - A connecting assembly for an end of a coaxial cable and having a first element, that is turned around a first axis in a first rotational direction to progressively tighten the first element to a connector, and a housing. The connecting assembly further has: a) an axially elongated first groove in one component; and b) an axially elongated first finger on a second component that resides within the first groove with the connecting assembly in a first state. With the connecting assembly in the first state, turning of the housing in the first rotational direction causes the first finger to cause driving of the first element with a torque up to a predetermined torque. Continued turning of the housing with a torque exceeding the predetermined torque causes reconfiguration of the connecting assembly in a manner whereby the first finger moves circumferentially out of the first groove. | 2010-08-12 |
20100203761 | MICRO GANGMATE MULTI-PORT MODULAR RF CARD EDGE CONNECTOR - A connector assembly includes: at least one signal contact adapted to terminate at least one conductor of a cable; at least one terminal adapted to receive the at least one signal contact; a housing including a channel configured to receive the at least one terminal and adapted to receive at least a portion of a printed circuit board; and means for biasing the at least one terminal against the circuit board, thereby pressing the at least one signal contact against the circuit board to inhibit horizontal movement of the at least one signal contact relative to the at least a portion of a printed circuit board. | 2010-08-12 |
20100203762 | AC MAINS FILTER AND POWER SUPPLY SYSTEM - A power supply system with a filter with at least a first and second connector, wherein the first connector is connected to a power source and the second connector is connected to a power supply. A power supply system with a first filter with at least a first and second connector, a second filter with at least a third and fourth connector, wherein the first connector is connected to a power source, wherein the first filter is connected to the second filter, and the fourth connector is connected to a power supply. A filter with a housing, a male connector, and a female connector. | 2010-08-12 |
20100203763 | PLUG-TYPE CONNECTOR - The invention relates to a plug-in connector ( | 2010-08-12 |
20100203764 | CONNECTOR CAPABLE OF READING IMAGE - A connector capable of reading image includes an outer shell, a seat body, a rear lid body and an image-reading module. The outer shell has a front decorative plate, two sides of which are extended two lateral plates corresponding to each other, and an upper edge of which has a folded plate folded between the two lateral plates, and which has a plurality of perforations arranged thereon. The seat body is disposed in the outer shell and has a first interface and a second interface, both of which are arranged at a front face of the seat body and corresponded to the plural perforations. An electric connector is disposed in the second interface. The rear lid body is disposed at a rear side of the seat body. The image-reading module, which is disposed in the first interface, is comprised of a circuit board, a camera, a signal-converting unit and a plurality of electrically conductive terminals. After the camera reads the external image, the analogous signals are converted into digital signals by a signal-converting unit. Then, the digital signals are output via the plural thermally conductive terminals. | 2010-08-12 |
20100203765 | ELECTRICAL CONNECTOR WITH STAGGERED SINGLE ENDED CONTACTS - The invention relates to an electrical connector that includes an insulating connector housing containing a plurality of slots arranged in a matrix of rows and columns. A plurality of single ended contacts is received in the slots. In particular, the single ended contacts are arranged in pairs in said slots of said matrix, such that, in a first row, a first pair of said contacts accommodates slots in a first column and a second column of said matrix and, in a second row adjacent to said first row, a second pair of said contacts accommodates slots in said second column and a third column of said matrix, wherein positions corresponding respectively to the first row and the third column, and to the first column and the second row are free of contact. | 2010-08-12 |
20100203766 | ELECTRICAL CONNECTOR HAVING DUAL-SOLDERING SURFACES - An electrical connector comprises an insulative housing ( | 2010-08-12 |
20100203767 | MULTIFUNCTIONAL ELECTRICAL CONNECTOR - An electrical receptacle is provided and includes an insulative housing defining a first receiving space and a second space in communication with the first receiving space and a plurality of contacts comprising audio contacts, power contacts and at least one grounding contact. The audio contacts and the at least one grounding contact are received in the first receiving space and establish a path for transmitting audio signals, while the power contacts are received in the second receiving space and corporate with the at least one grounding contact to establish a path for power supply. | 2010-08-12 |
20100203768 | CONNECTOR - A connector according to the invention includes an insulative body, and a first contact and a second contact that are disposed in the body at different height levels from each other, the first contact or the second contact being elastically deformable. The first contact includes an mismatched portion having an higher impedance than that of another portion of the first contact. The second contact includes an adjusting portion to be brought close to the mismatched portion by elastic deformation of the first contact or the second contact in a direction close to the second contact or the first contact. | 2010-08-12 |
20100203769 | NETWORK SOCKET CONNECTOR WITH BUILT-IN IP BOX FUNCTION - A network socket connector with built-in IP BOX function includes a base, a front cover, a circuit board, an upper cover and a metallic housing. A rear surface of the base is provided with a plurality of conductive pins and a front surface thereof is provided with a plurality of electrode terminals. The front cover is assembled to the front end of the base and has a connecting port. The circuit board has a network AV streaming broadcast circuit. The upper cover is assembled with the base and the front cover. The metallic housing is configured as a hollow body for sealing the base, the front cover, the circuit board and the upper cover. When a plug of a network line is inserted into the connecting port to be electrically connected with the electrode terminals, the Internet can be accessed by the network AV streaming broadcast circuit of the circuit board. | 2010-08-12 |
20100203770 | Connector system for a vehicle antenna - A connector system for a vehicle antenna is a system by joining a fixed connector having legs connected to a terminal of the vehicle antenna, with a movable connector that is removably connected to the fixed connector and has a cable connected to a signal receiving apparatus. A first slide mechanism is located on the fixed connector, extended along a surface where the legs touch, and the second slide mechanism, able to be fitted in the slide mechanism on the fixed connector, is located on the movable connector. By sliding the first slide mechanism and the second slide mechanism to be fitted in each other, the movable connector can be joined to the fixed connector along the surface where the connector system is installed. | 2010-08-12 |
20100203771 | ELECTRICAL INTERCONNECT AND METHOD FOR ELECTRICALLY COUPLING A PLURALITY OF DEVICES - An electrical interconnect system includes a first circuit board that includes at least one via, and a conductor configured to transmit an electrical current therethrough. The conductor includes a first signal contact extending from a conductor first end, and a dielectric cylinder configured to receive the conductor therethrough. The dielectric cylinder includes a first bellows element extending from a first end of the dielectric cylinder that is positioned adjacent to the first signal contact. The first bellows element and the dielectric cylinder are configured to form a substantially continuous outer conductor, wherein the conductor and the first bellows are configured to electrically interface to the via and maintain connection thereto using a biasing force. | 2010-08-12 |
20100203772 | ELECTRICAL CONNECTOR WITH HIGH PROFILE - An electrical connector includes an insulating housing ( | 2010-08-12 |
20100203773 | TERMINAL BLOCK HAVING A CONNECTOR - A terminal block is disclosed which includes at least one or more connectors for electrical conductors or plugs and a plurality of busbars connecting the conductor or plug connections to one another in an electrically conductive fashion. A freely configurable, pluggable transverse connector can be provided for the electrically conductive connection of at least two or more of the busbars disposed in various planes. The connector being designed as a connector pin having conductive and non-conductive sections in the axial direction. | 2010-08-12 |
20100203774 | WIRE FORM RAIL ADAPTER - A wire form rail adapter for use in connecting an electrical component to a mounting rail includes a wire form spring clip that is formed to provide both a connection portion and a spring portion. The connection portion is configured to selectively engage the mounting rail and retain the rail against the rail adapter. The spring portion is configured to provide a biasing force that urges the wire form spring clip toward a position in which the connection portion engages the mounting rail. | 2010-08-12 |
20100203775 | GROUNDING APPARATUS AND GROUNDING SYSTEM INCLUDING THE SAME - A grounding system includes a mounting surface, a first ground conductor including first and second ends, a plurality of second ground conductors, and a grounding apparatus. The grounding apparatus includes an elongated conductive member having a first end including an open jaw lug structured to receive and electrically and mechanically engage a portion of the first ground conductor extending transverse to the elongated conductive member, an opposite second end, and an intermediate portion disposed between the first end and the opposite second end. The intermediate portion includes a plurality of lugs. Each of the plurality of lugs is structured to receive and electrically and mechanically engage an end portion of a corresponding one of the second ground conductors. The intermediate portion further includes a plurality of mounting apertures. Each of a plurality of fasteners mounts the intermediate portion to the mounting surface at a corresponding one of the mounting apertures. | 2010-08-12 |
20100203776 | Socket Contact - A conductive contact base, comprising a conductive component, an elastic component, and a contact surface is described in which the conductive component is clamped by the elastic component, the conductive component opens and closes freely within an elastic limit whereby accommodating plugs with different sizes, and the contact surface is disposed between the conductive component and the elastic component. The conductive contact base of the invention has the advantages of a large contact surface, strong clamping force, good impact resistance, good vibration resistance, and good deformation resistance. | 2010-08-12 |
20100203777 | HYBRID MARINE POWER TRAIN SYSTEM - A hybrid marine power train system is provided that facilitates selective use of one of multiple prime movers for powering and driving a boat. The multiple prime movers can include an internal combustion engine and an electric motor which can itself be part of a motor/generator assembly. The system further includes a power-take-in assembly that can have either an active or passive clutching device for selectively importing power from the prime movers into the transmission. The system is configured so that the second prime mover occupies relatively little space within an engine compartment of the boat, for example when compared to an amount of space occupied by the first prime mover and transmission. Since the second prime mover occupies relatively little space within the engine compartment, the system can be readily retrofitted to existing marine power train systems. | 2010-08-12 |
20100203778 | Remote Drive - A remote powered propulsive device having a rudder which carries a propeller or oscillating fins which are powered by pedals alone or with hydraulic assist or by an electric motor. | 2010-08-12 |
20100203779 | AMPHIBIOUS SHOE AND METHOD OF USE - An amphibious shoe has a sole with a fin compartment integrated therein retractably houses of a lightweight fin that converts the shoe from a walking shoe to a swimming shoe. The amphibious shoe includes a fin comprising ridges intermittent between material arranged in an accordion construction. The fin is capable of being ejected from the compartment and expanded to a fan configuration. The shoe is further provided with a pivotal stabilizing strap for enhanced stability during swimming. In one embodiment the fin is removed by a release button in communication with a spring. Other embodiments provide for manual deployment by pulling on the fin from the fin compartment. In operation, the wearer can comfortably run or walk swiftly along the land as the integrated fin has a thin lightweight construction. Upon reaching the water's edge, the shoe is readily converted for swimming by ejecting and positioning the fin. | 2010-08-12 |
20100203780 | RESCUE DEVICE | 2010-08-12 |
20100203781 | Light weight insulated, flexible buoyant article - An insulated, flexible article having insulating properties, as well as light weight and excellent buoyancy characteristics, and comprising a core mat with individual close spaced air or flexible other gas filled cells made of thin, highly flexible plastic and with one or both faces of the mat having one or more flexible face sheets laminated to the core mat to form a composite sheet that can be shaped using patterns and sewn, bonded or otherwise assembled to be a flexible, insulative and buoyant article. | 2010-08-12 |
20100203782 | SULFONATED BLOCK COPOLYMERS HAVING ACRYLIC ESTERAND METHACRYLIC ESTER INTERIOR BLOCKS, AND VARIOUS USES FOR SUCH BLOCKS, AND VARIOUS USES FOR SUCH BLOCK COPOLYMERS - A sulfonated block copolymer which is solid and non-dispersible in water having at least two polymer end blocks A and at least one interior block B wherein each A block is a polymer block resistant to sulfonation and each B block is a polymer block susceptible to sulfonation, wherein the A and B blocks do not contain any significant levels of olefinic unsaturation. Each A block having one or more segments selected from (i) acrylic esters, (ii) methacrylic esters, and (viii) mixtures thereof; and each B block comprising segments of one or more polymerized vinyl aromatic monomers selected from (i) unsubstituted styrene monomers, (ii) ortho-substituted styrene monomers, (iii) meta-substituted styrene monomers, (iv) alpha-methylstyrene, (v) 1,1-diphenylethylene, (vi) 1,2-diphenylethylene and (vii) mixtures thereof. | 2010-08-12 |
20100203783 | SULFONATED BLOCK COPOLYMERS METHOD FOR MAKING SAME, AND VARIOUS USES FOR SUCH BLOCK COPOLYMERS - A sulfonated block copolymer which is solid and non-dispersible in water having at least two polymer end blocks A and at least one polymer interior block B wherein each A block is a polymer containing essentially no sulfonic acid or sulfonate functional groups and each B block is a polymer block containing 10 to 100 mol percent sulfonic acid or sulfonate functional groups based on the number of monomer units of the B block, and wherein said A and B blocks do not contain any significant levels of olefinic unsaturation. Also claimed are processes for making such block copolymers, and the various end uses and applications for such block copolymers. | 2010-08-12 |
20100203784 | PROCESS FOR PREPARING SULFONATED BLOCK COPOLYMERS AND VARIOUS USES FOR SUCH BLOCK COPOLYMERS - A process for preparing sulfonated block copolymers that are solid in water having at least two polymer end blocks A and at least one polymer interior block B involving sulfonating the interior block B until substantially sulfonated. Each A block having one or more segments selected from polymerized (i) para-substituted styrene monomers, (ii) ethylene, (iii) alpha olefins of 3 to 18 carbon atoms; (iv) hydrogenated 1,3-cyclodiene monomers, (v) hydrogenated monomers of conjugated dienes having a vinyl content less than 35 mol percent prior to hydrogenation, (vi) acrylic esters, (vii) methacrylic esters, and (viii) mixtures thereof. Each B block having segments of one or more polymerized vinyl aromatic monomers selected from (i) unsubstituted styrene monomers, (ii) ortho-substituted styrene monomers, (iii) meta-substituted styrene monomers, (iv) alpha-methylstyrene, (v) 1,1-diphenylethylene, (vi) 1,2-diphenylethylene and (vii) mixtures thereof. | 2010-08-12 |
20100203785 | COMPOSITION CONTAINING SULFONATED BLOCK COPOLYMERS AND ARTICLES MADE THEREFROM - A composition having a sulfonated block copolymer which is solid and non-dispersible in water having at least two polymer end blocks A, at least one polymer interior block B, and at least one polymer block D. Each A block is a segment of one or more polymerized para-substituted styrene monomers, each B block contains segments of one or more vinyl aromatic monomers selected from polymerized (i) unsubstituted styrene monomers, (ii) ortho-substituted styrene monomers, (iii) meta-substituted styrene monomers, (iv) alpha-methylstyrene, (v) 1,1-diphenylethylene, (vi) 1,2-diphenylethylene and (vii) mixtures thereof, and each D block having a glass transition temperature of less than 20° C. and a number average molecular weight of between 1,000 and 50,000 Adhesives, coatings and membranes are formed from the composition. Various articles are formed with the composition including films, fibers, fabrics, laminates, and absorbent cores. | 2010-08-12 |
20100203786 | PLASTIC SUBSTRATE AND LIQUID CRYSTAL DISPLAY DEVICE HAVING SAME - A plastic substrate according to the present invention is used in optical instruments. The plastic substrate includes a composite substrate | 2010-08-12 |
20100203787 | THERMOSET RESIN FIBRES - The present invention relates to thermoset resin fibre components, composite materials comprising thermoset resin fibre components, composite articles manufactured using such composite materials and methodologies for manufacturing same. The thermoset resin fibre components may comprise a single fibre of thermoset resin or a plurality of fibres commingled together. There properties and characteristics of the thermoset resin used are chosen according to the material to be produced therefrom. The thermoset fibre components may be woven into reinforcement fibres to form prepregs. Thermoplastic fibres may be commingled and co-woven with the thermoset fibre components. | 2010-08-12 |
20100203788 | BUFFER SUBSTRATE AND USE THEREOF - In a nonwoven fiber assembly which comprises a fiber comprising a thermal adhesive fiber under moisture and in which the fiber are entangled with each other, the fibers are bonded at contacting points of the fibers by melting the thermal adhesive fiber under moisture to distribute the bonded points approximately uniformly, thereby obtaining a buffer substrate. The buffer substrate may further comprises a conjugated fiber comprising a plurality of resins which are different in thermal shrinkage and form a phase separation structure, and the conjugated fibers may have an approximately uniform crimps having an average curvature radius of 20 to 200 μm and are entangled with the fibers constituting the nonwoven fiber assembly. The buffer substrate can be obtained by a method comprising the steps of: forming a web from the fiber comprising the thermal adhesive fiber under moisture; and subjecting the obtained fiber web to a heat and moisture treatment with a high-temperature water vapor to melt the thermal adhesive fiber under moisture for bonding the fibers. The buffer substrate has a high air-permeability, an excellent cushion property and softness. | 2010-08-12 |
20100203789 | ELECTRICALLY CONDUCTIVE GASKET MATERIAL - An electrically conductive material for an electrically conductive gasket is to be provided, the electrically conductive material permitting easy manufacture of an electrically conductive gasket in an arbitrary shape, having a cushioning property and making it possible to greatly diminish cutting wastes in punching work and also greatly diminishing the formation of fray and fluff. | 2010-08-12 |
20100203790 | ENHANCED BARRIER MULTIFUNCTIONAL COATINGS FOR NYLON FILMS - High barrier multilayer films are disclosed that incorporate a selectively permeable outer layer and a moisture barrier nanocomposite membrane. More particularly, insulation facing materials and insulation articles can incorporate an insulation facing material having a variable vapor barrier. The facing materials can include a moisture barrier membrane that incorporates a nanoclay. | 2010-08-12 |
20100203791 | METHOD FOR MANUFACTURING SPARK PLUG - A method for manufacturing a spark plug which includes: (a) preparing a metal shell; (b) preparing an insulator; (c) inserting the insulator in an insertion hole of the metal shell; (d) forming an intended crimping portion of the metal shell into a crimping portion; and (e) pressing a lower side portion of the metal shell closer to a position lower than the intended compressive deformation portion, and pressing the crimping portion of the metal shell in an axial direction to compressively deform the intended compressive deformation portion of the metal shell and thus seal a space between a stepped portion of the metal shell and a stepped portion of the insulator, wherein step (e) controls a pressing amount of a press in a constant value from the start of compressive deformation to the end thereof. | 2010-08-12 |
20100203792 | METHOD FOR MANUFACTURING PLASMA DISPLAY PANEL - In order to realize a plasma display panel with high-definition/high-luminance display performance as well as with low power consumption, after formation of a primary film, a metal oxide paste made up of aggregated particles of metal oxide particles, an organic resin component, and diluting solvent is applied and fired. Thereby, a plurality of aggregated particles of the metal oxide particles are attached and formed onto the primary film. The metal oxide paste is obtained by mixing a first metal oxide paste with a content of the aggregated particles of the metal oxide, the organic resin component, and the diluting solvent being not smaller than 1.5 vol % and a second metal oxide paste made up only of the organic resin component and the diluting solvent. | 2010-08-12 |
20100203793 | METHOD AND APPARATUS OF FORMING ALIGNMENT LAYER FOR LIQUID CRYSTAL DISPLAY DEVICE - A method for forming an alignment layer is disclosed, to prevent light leakage generated by a physical contact between a rubbing roll and a substrate, which includes preparing a substrate; coating an alignment material on the substrate, for initial alignment of liquid crystal; applying an electric field or a magnetic field to the alignment material, for determination of alignment direction in the alignment material; and curing the alignment material. | 2010-08-12 |
20100203794 | FLAT PANEL DISPLAY - A method for forming a flat panel display includes disposing a light guide plate below a display panel, disposing at least one optical film between the display panel and the light guide plate, and disposing at least one illuminating device package in proximity to the light guide plate. The method for forming the illuminating device package includes forming a light emitting diode device over a substrate and forming a lens encapsulating the light emitting diode device. The lens includes two reflective surfaces disposed substantially symmetrically at either side of a central axis. The reflective surfaces is configured to reflect portions of light beams to at least one of the diffractive surfaces. The lens also includes a plurality of diffractive surfaces separating the reflective surfaces. The diffractive surfaces are configured to diffract the reflected light beams into a convergent angle. Each of the diffractive surfaces having a tilt angle respective to the central axis. | 2010-08-12 |
20100203795 | Display Packaging for Reconfigurable Product - The present invention is directed generally to container for reconfigurable products and, in particular, to a display package operable to display a product in multiple configurations. The display package may include product housing portions adapted to slide from a first, adjacent position, where one product portion is positioned adjacent to another product portion, to a second, separated position, where one product portion is spaced from the other product portion. The display package may include a plurality of product housings adapted to rotate with respect to each other along a common axis such that product portions within the product housings may be selectively aligned to form desired configurations of a completed, displayed product. The display package may include a stationary housing section and a movable housing section adapted to rotate with respect to the stationary housing section such that the product portions within the movable housing section may be selectively aligned with the product portions of the stationary housing section. | 2010-08-12 |
20100203796 | CONSTRUCTIONAL BUILDING SET COMPRISING BUILDING ELEMENTS FOR PERSON WITH COLOR VISION DEFICIENCY, AND SUCH BUILDING ELEMENTS - A building element for a constructional building comprising a top face, a plurality of side walls extending downwardly from the top face, a plurality of coupling studs which are arranged on the top face, a plurality of cavities arranged in a two-dimensional periodical pattern between the side walls to receive the coupling studs in frictional engagement and at least one color indicator which is part of the building element and indicates the color of at least one surface area of the building element. The color indicator is a symbol or a model of a real object. The color indicator also represents the shade of the color of the building element. The color indicator is a three dimensional space positioned within the the external surface of the said building element or is a three dimensional protruding structure positioned on the external surface of the building element or is printed on the external surface of the building element. The color indicator which is in the form of protruding three dimensional structure can be released from the external surface of the building element. Same color indicators are positioned on more than one side walls of the said building element allowing the perception of the color when color indicator on other wall is not visible. The position of the color indicator or the dimensions of the color indicator may be used to represent color of the building element. Multiple color indicators may be combined together to represent a new color. The building element may have boundaries to indicate the color of a specific area on the surface of the building element. | 2010-08-12 |
20100203797 | CONSTRUCTIONAL BUILDING SET COMPRISING BUILDING ELEMENTS WITH OBJECT CONTAINER, AND SUCH BUILDING ELEMENTS - A constructional building element comprising a top face, a plurality of side walls extending downwardly from the top face, a plurality of coupling studs which are arranged on the top face, a plurality of cavities arranged in a two-dimensional periodical pattern at the bottom of the building element to receive coupling studs in frictional engagement and at least one container with opaque external surface and opening to accomadate favorite objects which cannot be easily joined. The object container with opaque external surface can be frictionally releasable from the building element. The object container with opaque external surface accomodates a surface area with coupling studs/cavities to frictionally engage with favorite objects. The building element may accommodate multiple containers with opaque external surfaces. The object container with opaque external surface may have tray to accommodate favorite objects. | 2010-08-12 |
20100203798 | CONSTRUCTIONAL BUILDING SET COMPRISING BUILDING ELEMENTS FOR BLIND PERSON, AND SUCH BUILDING ELEMENTS - A building element for a building constructional set comprising top face, a plurality of side walls extending downwardly from the top face, a plurality of coupling studs which are arranged on the top face in a two-dimensional periodical pattern, a plurality of cavities arranged in a two-dimensional periodical pattern between the side walls to receive the coupling studs in frictional engagement and at least one color indicator which is in form of spatially distributed raised points of the same shape and is part of the building element for the purpose of indicating the color of at least one surface area of the building element. Different spatially distribution of raised points of the same shape indicates different colors. The color indicator may also represents the type/strength of shade of the color of at least one surface area of the building element. The color indicator may be positioned on more than one side walls of the said building element allowing the perception of the color when color indicator on other walls is not visible. The building element may also include boundaries to indicate the color of a specific area on the surface of the building element. A color map on the external surface of the building elements, may provide color information for surface areas of the building elements which do not have enough space to accommodate a color indicator. | 2010-08-12 |
20100203799 | FABRIC DIVING STICK - A diving stick of the type that, after being tossed into a swimming pool, sinks to the bottom while maintaining an upright posture so that it be can easily grasped by a diver. The stick includes a soft hollow shank designed to prevent accidental impalement. | 2010-08-12 |
20100203800 | Underwater toy device - An underwater toy device utilizing a base portion having an extending wings and tail. An elevator is also included in the invention and is capable of fitting in anyone of a number of slots located in the base portion in the tail. In this manner, the underwater toy device follows various paths within a body of water. | 2010-08-12 |
20100203801 | Spin message toy - Spin message toy with a rigid rectangular block member, a right side string loop and a left side string loop. The block member has a broad front surface and broad rear surface. The string loops are attached to the left and right sides of the block so that it is capable of spinning on a horizontal plane when a user pulls in opposing directions on the string loops that have been twisted by the user just before operation. The front surface has a first partial message printed upon it. The rear surface has a second partial message printed upon it. The first and second partial messages form the illusion of a complete message when the rectangular block member is spun by the user. | 2010-08-12 |
20100203802 | PLASTIC BEEHIVE - The present invention relates to demounted beehives wherein the air circulation is realized effectively and the heat isolation is enhanced. The beehive essentially comprises one or more body ( | 2010-08-12 |
20100203803 | BRASSIERE WITH INTERCHANGEABLE MODESTY PANEL - Disclosed is a brassiere that is adjustable for varying levels of modesty or daring. The brassiere includes a modesty panel that is integrated to the design of the brassiere, but is also interchangeable with other modesty panels. The modesty panel can be selected from among a set of modesty panels. In this manner, a wearer may vary the look of an outfit or ensemble by using modesty panels of varying colors, fabrics, textures, or levels of modesty or daring. In various embodiments, the modesty panel is fastened to the brassiere using traditional hook and loop fasteners. In other various embodiments, the modesty panel may be fastened using hook material and corresponding loop material, or may be fastened using buttons or snap fasteners. Any other manner of fastening systems may be used to render the modesty panel combined with the brassiere as a single article of clothing. | 2010-08-12 |
20100203804 | Powder Delivery Rate Control for Air Abrasive Instruments - A micro-abrasive blasting device and method for perturbation control using a plurality of delivery conduits of various lengths and/or apertures. The user is able to individually open and close bypass conduit pinch valve(s) external to micro-abrasive blasting device to affect the perturbation intensity internal to the mixing chamber. By selectively opening and closing flow through delivery conduits it is possible to provide a more consistent perturbation rate and select the perturbation intensity internal to mixing chamber. | 2010-08-12 |