30th week of 2009 patent applcation highlights part 12 |
Patent application number | Title | Published |
20090184390 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device is disclosed, which includes a semiconductor substrate including a device region and an isolation region having an isolation trench, a gate electrode formed on the device region through a gate insulating film, a first isolation insulating film formed in the isolation trench, the first isolation insulating film having a recess, a second isolation insulating film formed on the first isolation insulating film to be filled in the recess, the second isolation insulating film having an upper surface higher than the upper surface of the semiconductor substrate, and an impurity region formed in the semiconductor substrate under the first isolation insulating film, the impurity region having a conductivity type the same as a conductivity type of the semiconductor substrate, an impurity concentration higher than an impurity concentration of the semiconductor substrate, and a width of the impurity region smaller than a width of the isolation trench. | 2009-07-23 |
20090184391 | Semiconductor devices having fuses and methods of forming the same - Semiconductor devices having a plurality of fuses and methods of forming the same are provided. The semiconductor device having a fuse including a substrate having a cell region and/or a fuse box region. A first insulation interlayer may be formed on the substrate. A first etch stop layer may be formed on the first insulation interlayer. A metal wiring including a barrier layer, a metal layer and/or a capping layer may be formed on the first etch stop layer of the cell region. Fuses, spaced apart from each other, may be formed on the first etch stop layer of the fuse box region. Each fuse may include the barrier layer and/or the metal layer. A second insulation interlayer having an opening exposing the fuse box region may be formed on the metal wiring and/or the first etch stop layer. The etch stop layer may allow the fuses to be formed more uniformly and decrease the probability of breaking the fuses. | 2009-07-23 |
20090184392 | METHOD AND STRUCTURE FOR FORMING TRENCH DRAM WITH ASYMMETRIC STRAP - A method of forming a trench device structure having a single-side buried strap is provided. The method includes forming a deep trench in a semiconductor substrate, said deep trench having a first side portion and a second side portion; depositing a node dielectric on said deep trench, wherein said node dielectric covers said first side portion and said second side portion; depositing a first conductive layer over said node dielectric; performing an ion implantation or ion bombardment at an angle into a portion of said node dielectric, thereby removing said portion of said node dielectric from said first side portion of said deep trench; and depositing a second conductive layer over said first conductive layer, wherein said second conductive layer outdiffuses into a portion of said semiconductor substrate. A trench device structure having a single-side buried strap is also provided. The device structure includes a semiconductor substrate having a deep trench therein; and a first conductive layer and a second conductive layer sequentially disposed on said deep trench, wherein said second conductive layer outdiffuses into a portion of said semiconductor substrate. | 2009-07-23 |
20090184393 | MEMORY CAPACITOR AND MANUFACTURING METHOD THEREOF - The structure strength of a memory capacitor is reduced as the height of the memory capacitor is increased, which results in collapse and a short circuit. This invention provides a capacitor with a special reinforced structure outside, wherein the reinforced structure extends upward from the bottom of the lower electrode of the capacitor to a height, thus reducing the deformation caused by the process loading and supplying sufficient capacitance. In addition, the height of the reinforced structure is adaptable to requirement. Thereby, even when the capacitors are connected with one another because the capacitors collapse, the capacitors are prevented from malfunction. Moreover, the reinforced structures can be connected to one another or not, and thus the structure strength of the capacitor arrays is increased. Besides, the process is simplified and the cost is also reduced. | 2009-07-23 |
20090184394 | High performance system-on-chip inductor using post passivation process - A system and method for forming post passivation passive components, such as resistors and capacitors, is described. High quality electrical components, are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer. | 2009-07-23 |
20090184395 | INPUT/OUTPUT (I/O) BUFFER - An I/O buffer including an I/O circuit, a pad and a pulling resistant device. The I/O circuit is for inputting or outputting a signal. The pulling resistant device has a plurality of resistant elements electrically connected between the I/O circuit and the pad, for forming a resistance value. | 2009-07-23 |
20090184396 | Resistive random access memories and methods of manufacturing the same - Provided are resistive random access memories (RRAMs) and methods of manufacturing the same. A RRAM includes a storage node including a variable resistance layer, a switching device connected to the storage node, and a protective layer covering an exposed part of the variable resistance layer. The protective layer includes at least one of aluminum oxide and titanium oxide. The variable resistance layer is a metal oxide layer. | 2009-07-23 |
20090184397 | NONVOLATILE MEMORY DEVICE AND PROCESSING METHOD - A method of processing a nonvolatile memory device includes forming a first electrode, depositing a layer of sol-gel solution on the first electrode, hydrolyzing the layer of sol-gel solution to form a layer of variable electric resistance material, and forming a second electrode on the layer of variable electric resistance material. | 2009-07-23 |
20090184398 | GROUP III NITRIDE COMPOUND SEMICONDUCTOR DEVICE - Disclosed is a group III nitride compound semiconductor device having a substrate, buffer layers on the substrate, and a group III nitride compound semiconductor layer on the top layer of the buffer layers. The buffer layers comprises a first buffer layer formed on the substrate and a second buffer layer formed on the first buffer layer. The first buffer layer is made of transition metal nitride, and the second buffer layer is made of nitride of gallium and a transition metal. | 2009-07-23 |
20090184399 | SYSTEM FOR AND METHOD OF MICROWAVE ANNEALING SEMICONDUCTOR MATERIAL - A system for and method of processing, i.e., annealing semiconductor materials. By controlling the time, frequency, variance of frequency, microwave power density, wafer boundary conditions, ambient conditions, and temperatures (including ramp rates), it is possible to repair localized damage lattices of the crystalline structure of a semiconductor material that may occur during the ion implantation of impurities into the material, electrically activate the implanted dopant, and substantially minimize further diffusion of the dopant into the silicon. The wafer boundary conditions may be controlled by utilizing susceptor plates ( | 2009-07-23 |
20090184400 | VIA GOUGING METHODS AND RELATED SEMICONDUCTOR STRUCTURE - Methods for via gouging and a related semiconductor structure are disclosed. In one embodiment, the method includes forming a via opening in a dielectric material, the via opening aligned with a conductor; forming a protective coating over the dielectric material and in the via opening; performing via gouging; and removing the protective coating over horizontal surfaces of the dielectric material. A semiconductor structure may include a via having an interface with a conductor, the interface including a three-dimensionally shaped region extending into and past a surface of the conductor, wherein an outer edge of the three-dimensionally shaped region is distanced from an outermost surface of the via. | 2009-07-23 |
20090184401 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - It is made possible to provide a method for manufacturing a semiconductor device that has a high-quality insulating film in which defects are not easily formed, and experiences less leakage current. A method for manufacturing a semiconductor device, includes: forming an amorphous silicon layer on an insulating layer; introducing oxygen into the amorphous silicon layer; and forming a silicon oxynitride layer by nitriding the amorphous silicon layer having oxygen introduced thereinto. | 2009-07-23 |
20090184402 | METHOD OF FABRICATING A SHALLOW TRENCH ISOLATION STRUCTURE INCLUDING FORMING A SECOND LINER COVERING THE CORNER OF THE TRENCH AND FIRST LINER. - A method of fabricating a shallow trench isolation structure is provided. First, a pad oxide layer and a mask layer are formed sequentially on a substrate. Then, the mask layer and the pad oxide layer are patterned and the substrate is etched to form a trench. After that, a first liner is formed in the trench. Thereafter, a portion of the first liner is removed to expose corners of the trench. Then, a second liner is formed over the substrate to cover the corners of the trench and the first liner. The material of the second liner is different from that of the first liner. An insulation layer is further formed over the substrate to fill up the trench. The insulation layer, the second liner, the mask layer and the pad oxide layer outside the trench are eventually removed. | 2009-07-23 |
20090184403 | METHOD OF FORMING A SEMICONDUCTOR PACKAGE AND STRUCTURE THEREOF - An electromagnetic interference (EMI) and/or electromagnetic radiation shield is formed by forming a conductive layer ( | 2009-07-23 |
20090184404 | Electromagnetic shilding structure and manufacture method for multi-chip package module - An electromagnetic shielding structure for a multi-chip package module includes a substrate having at least one conductive point, a plurality of chips, an encapsulating body and an electromagnetic shielding layer. Wherein the chips are arranged and encapsulated by the encapsulating body on the substrate. The electromagnetic shielding layer is arranged on the encapsulating body and the conductive point to shield highly frequency electromagnetic wave by printing. Meanwhile, the electromagnetic shielding layer can replace the conventional metal shell to reduce the whole size of the multi-chip package module. | 2009-07-23 |
20090184405 | Package structure - A package structure is provided. The package structure includes a substrate, a semiconductor device, and a shielding cap. The substrate has at least an alignment recess located at a corner of the substrate. The semiconductor device is disposed on an upper surface of the substrate. The shielding cap having an alignment pin covers the semiconductor device. The alignment pin is inserted into the alignment recess. | 2009-07-23 |
20090184406 | SEMICONDUCTOR PACKAGE HAVING INSULATED METAL SUBSTRATE AND METHOD OF FABRICATING THE SAME - Provided is a semiconductor package in which an adhesion force between an insulation metal substrate and a molding member is increased by removing a solder mask layer from the insulation metal substrate and a method of fabricating the semiconductor package. The semiconductor package includes an insulation metal substrate that includes a base member, an insulating layer disposed on the base member, and conductive patterns formed on the insulating layer. Semiconductor chips are arranged on the conductive patterns. Solder mask patterns are arranged on the conductive patterns to surround the semiconductor chips. Leads are electrically connected to the conductive patterns through wires. A sealing member is arranged on an upper surface and side surfaces of the substrate to cover portions of the leads, the wires, the semiconductor chips, and the solder mask patterns. | 2009-07-23 |
20090184407 | METHOD TO RECOVER UNDERFILLED MODULES BY SELECTIVE REMOVAL OF DISCRETE COMPONENTS - Methods and reworked intermediate and resultant electronic modules made thereby, whereby a component in need of rework is located and removed from the module to reveal encapsulated solder connections residing within an underfill matrix. Heights of both the solder connections and underfill matrix are reduced, followed by etching the solder out of the solder connections to form openings within the underfill matrix. The underfill material is then removed to expose metallurgy of the substrate. A blank having a release layer with an array of solder connections is aligned with the exposed metallurgy, and this solder array is transferred from the blank onto the metallurgy. The transferred solder connections are then flattened using heat and pressure, followed by attaching solder connections of a new component to the flattened solder connections and underfilling these reworked solder connections residing between the new chip and substrate. | 2009-07-23 |
20090184408 | Semiconductor device for fingerprint recognition - A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reliability. | 2009-07-23 |
20090184409 | SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR CHIPS WITH DIFFERENT THICKNESS - In a stacked-type semiconductor device, a first semiconductor device and at least one second semiconductor device are stacked. The first semiconductor device includes a wiring board and a first semiconductor chip mounted on the wiring board. The second semiconductor device includes a wiring board and a second semiconductor chip mounted on the wiring board. The thickness of the second semiconductor chip of each second semiconductor device is thicker than the thickness of the first semiconductor chip. | 2009-07-23 |
20090184410 | SEMICONDUCTOR PACKAGE APPARATUS HAVING REDISTRIBUTION LAYER - Provided is a semiconductor package apparatus having a redistribution layer. The apparatus includes at least one or more semiconductor chips, a packing part protecting the semiconductor chips, and a support part supporting the semiconductor chips. The apparatus also includes external terminals extending outside the packing part, redistribution layers installed between the semiconductor chips and the support part and including redistribution paths, first signal transmitting units, and second signal transmitting units. The first signal transmitting units transmitting electrical signals generated from the semiconductor chips to the redistribution paths of the redistribution layers, and the second signal transmitting units transmit the electrical signals from the redistribution paths to the external terminals. Therefore, a size and a thickness of the semiconductor package apparatus can be reduced, and processes can be simplified to improve productivity. | 2009-07-23 |
20090184411 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME - Provided are semiconductor packages and methods of manufacturing the semiconductor package. The semiconductor packages may include a substrate including a chip pad, a redistributed line which is electrically connected to the chip pad and includes an opening. The semiconductor packages may also include an external terminal connection portion, and an external terminal connection pad which is disposed at an opening and electrically connected to the redistributed line. The present general inventive concept can solve the problem where an ingredient of gold included in a redistributed line may be prevented from being diffused into an adjacent bump pad to form a void or an undesired intermetallic compound. In a chip on chip structure, a plurality of bumps of a lower chip are connected to an upper chip to improve reliability, diversity and functionality of the chip on chip structure. | 2009-07-23 |
20090184412 | RESIN-SEAL TYPE SEMICONDUCTOR DEVICE - There is provided a resin-seal type semiconductor device (BGA type semiconductor device) whose heat dissipating characteristic is improved, so that it is prevented from deteriorating in reliability. This BGA type semiconductor device includes a wiring substrate on a predetermined area on which a semiconductor chip is mounted; a plurality of metal bumps that are formed to be arranged at predetermined intervals in an area of the substrate different from the area on which the semiconductor chip is mounted; and a sealing resin layer that covers at least the semiconductor chip. Each of the plurality of metal bumps is covered with the sealing resin layer described above, with a part thereof exposed at a top face of the sealing resin layer. | 2009-07-23 |
20090184413 | INSULATIVE WIRING BOARD, SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD FOR PRODUCING THE INSULATIVE WIRING BOARD - The insulative wiring board of the present invention, with its both surfaces being covered with solder resist, includes at least one via hole in a semiconductor chip-mounting area penetrating the insulative wiring board, wherein conductor layers are electrically connected to each other via said at least one via hole. Further, the mounting area is covered with the solder resist, excluding said at least one via hole that penetrates the insulative wiring board. Therefore, it is possible to achieve an insulative wiring board that prevents defects caused by expansion occurred due to heating of moisture absorbed by the board, as well as reducing an area where a wiring cannot be provided. | 2009-07-23 |
20090184414 | WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFFICIENCY WITH AN EMF SHIELD AND A METHOD FOR FABRICATING THE SAME - A wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield is presented. The wafer level chip scale package includes a semiconductor chip, an insulation layer, and a metal plate. The semiconductor chip has a plurality of bonding pads on an upper face thereof. The insulation layer is disposed over the upper face of the semiconductor chip and has openings that expose some portions of the bonding pads. The metal plate covers an upper face of the insulation layer and side faces of the semiconductor chip in which the metal plate is electrically insulated from the bonding pads. | 2009-07-23 |
20090184415 | MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE - A manufacturing method of a semiconductor device comprises: providing a first insulating film whose relative dielectric constant is at most a predetermined value above a substrate; providing a second insulating film whose relative dielectric constant is greater than the predetermined value on a surface of the first insulating film; forming a recess for a wire through the second insulating film and extending into the first insulating film, and also forming a recess for a dummy wire through the second insulating film and extending into the first insulating film spaced from a formed area of the recess for the wire; providing a conductive material inside the recess for the wire and the recess for the dummy wire; and providing a wire inside the recess for the wire and providing a dummy wire inside the recess for the dummy wire by polishing and removing the conductive material. | 2009-07-23 |
20090184416 | MCM packages - An RF/IPD package with improved thermal management is described. The IPD substrate is attached to a system substrate with a thin RF chip mounted in the standoff between the IPD substrate and the system substrate. RF interconnections are made between the top of the RF chip and the bottom of the IPD substrate. Heat sinking is provided by bonding a heat sink layer on the RF chip to a heat sink layer on the system substrate. The heat sink may also serve as a ground plane connection. Combinations of other types of integrated devices may be fabricated using this approach. | 2009-07-23 |
20090184417 | POLYOL PHOTOSENSITIZERS, CARRIER GAS UV LASER ABLATION SENSITIZERS, AND OTHER ADDITIVES AND METHODS FOR MAKING AND USING SAME - Disclosed are photosensitizers that include a polyol moiety covalently bonded to a fused aromatic moiety. Also disclosed is a method for improving UV laser ablation performance of a coating, such as a cationic UV curable coating, by incorporating an oxalyl-containing additive into the cationic UV curable or other coating. Oxalyl-containing sensitizers having the formula Q-O—C(O)—C(O)—O—R | 2009-07-23 |
20090184418 | WIRING SUBSTRATE, TAPE PACKAGE HAVING THE SAME, AND DISPLAY DEVICE HAVING THE SAME - A wiring substrate includes a base film, a plurality of first wirings and a plurality of second wirings. The base film has a chip-mounting region configured for mounting a semiconductor chip thereon. The first wirings extend in a first direction from inside the chip-mounting region to outside the chip-mounting region, and include first connection end portions extending in a second direction different from the first direction. The first connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip. The second wirings extend in the first direction from inside the chip-mounting region to outside the chip-mounting region, and include second connection end portions extending in the opposite direction to the second direction in which the first connection end portions extend, and the second connection end portions may be formed inside the chip-mounting region and configured to electrically connect to the semiconductor chip. | 2009-07-23 |
20090184419 | Flip Chip Interconnect Solder Mask - A solder mask for flip chip interconnection has a common opening that spans a plurality of circuit elements. The solder mask allows confinement of the solder during the remelt stage of interconnection, yet it is within common design rules for solder mask patterning. Also, a substrate for flip chip interconnection includes a substrate having the common opening that spans a plurality of circuit elements. Also, a flip chip package includes a substrate having a common opening that spans a plurality of circuit elements. | 2009-07-23 |
20090184420 | Post bump and method of forming the same - A post bump and a method of forming the post bump are disclosed. The method of forming the post bump can include: forming a resist layer, in which an aperture is formed in correspondence to a position of an electrode pad, over a substrate, on which the electrode pad is formed; forming a metal post by filling a part of the aperture with a metallic material; filling a remaining part of the aperture with solder; reflowing the solder by applying heat; and removing the resist layer. This method can be utilized to prevent deviations in the plated solder and prevent the unnecessary flowing of the solder over the sides of the metal post during reflowing, so that the amount of solder used can be minimized. | 2009-07-23 |
20090184421 | SEMICONDUCTOR DEVICE WITH HIGH RELIABILITY AND MANUFACTURING METHOD THEREOF - A semiconductor device is provided, which includes a substrate, an insulator film formed over the substrate, and plural metal wirings with different widths containing copper as a main component and an impurity which is different from copper. The plural metal wirings includes a first metal wiring having a concentration profile where the concentration of the impurity metal increases from the center part of the stacking direction to the surface and the second metal wiring having a concentration profile where the concentration of the impurity metal decreases from the bottom surface of the stacking direction to the surface. Moreover, the width of the second metal wiring may be larger than the width of the first metal wiring. | 2009-07-23 |
20090184422 | METHOD FOR FORMING METAL LINE OF SEMICONDUCTOR DEVICE WITHOUT PRODUCTION OF SIDEWALL OXIDE IN METAL LINE FORMING REGION - A method for forming a metal line of a semiconductor device includes forming an insulation layer having a contact hole over a semiconductor substrate. Any one of a TiN layer and a TaN layer is formed on the insulation layer, including a surface of the contact hole, and an anti-reflection layer is formed on any one of the TiN layer and the TaN layer. A trench is defined at an upper end of the contact hole by etching the anti-reflection layer, any one of the TiN layer and the TaN layer, and the insulation layer. Subsequently, the anti-reflection layer is removed and a metal layer is formed to fill the trench and the contact hole. | 2009-07-23 |
20090184423 | LOW RESISTANCE AND INDUCTANCE BACKSIDE THROUGH VIAS AND METHODS OF FABRICATING SAME - A backside contact structure and method of fabricating the structure. The method includes: forming a dielectric isolation in a substrate, the substrate having a frontside and an opposing backside; forming a first dielectric layer on the frontside of the substrate; forming a trench in the first dielectric layer, the trench aligned over and within a perimeter of the dielectric isolation and extending to the dielectric isolation; extending the trench formed in the first dielectric layer through the dielectric isolation and into the substrate to a depth less than a thickness of the substrate; filling the trench and co-planarizing a top surface of the trench with a top surface of the first dielectric layer to form an electrically conductive through via; and thinning the substrate from a backside of the substrate to expose the through via. | 2009-07-23 |
20090184424 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME - The production of a crack in an insulating film under an external terminal of a semiconductor device due to external force applied to the external terminal is suppressed or prevented. Over the principal surface of a semiconductor substrate, there are formed multiple wiring layers. In the fifth wiring layer directly under the uppermost wiring layer of the wiring layers, the following measure is taken: a conductor pattern (fifth wiring, dummy wiring, and plug) is not formed directly under the probe contact area of each bonding pad PD in the uppermost wiring layer. In the fifth wiring layer, conductor patterns (fifth wiring, dummy wirings, and plugs) are formed in the areas other than directly under the probe contact area of each bonding pad in the uppermost wiring layer. | 2009-07-23 |
20090184425 | Conductive line structure and the method of forming the same - The conductive line structure of a semiconductor device including a base; at least one patterned conductive layer formed over the base; a conductive line formed over the at least one patterned conductive layer; a protection layer that encompasses the top surface and sidewall of the conductive line to prevent undercut generated by etching. The structure further comprises an underlying layer under the conductive line. The underlying layer includes Ni, Cu or Pt. The conductive line includes gold or copper. The at least one patterned conductive layer includes at least Ti/Cu. The protection layer includes electro-less plating Sn, Au, Ag or Ni. | 2009-07-23 |
20090184426 | CONTACT PLUGS OF SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME - The contact plugs of a semiconductor device includes first contact plugs having an elliptical sectional shape, and second contact plugs formed on the first contact plugs and having a circular sectional shape. The second contact plugs being configured to come in contact with the first contact plugs, thereby preventing voids from being formed. | 2009-07-23 |
20090184427 | FLASH MEMORY DEVICE WITH WORD LINES OF UNIFORM WIDTH AND METHOD FOR MANUFACTURING THEREOF - A method for manufacturing a semiconductor device, the method including: forming a bit line in a semiconductor substrate; forming a plurality of word lines which intersect with the bit line at predetermined intervals on the semiconductor substrate; eliminating a portion of the plurality of word lines; forming an interlayer insulating film on the semiconductor substrate; and forming a metal plug which penetrates through the interlayer insulating film and is coupled to the bit line in a region where the portion of the plurality of word lines was eliminated. | 2009-07-23 |
20090184428 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor substrate, an interwiring insulating film formed on the semiconductor substrate, a first protective film formed on the interwiring insulating film having an opening and a pad metal formed on the opening are provided. A groove is formed in a portion corresponding to a peripheral portion of the pad metal, and the groove is covered with the pad metal. Thus, without decreasing bonding properties, insulation between pads can be maintained as well as cracks in a protective film around pads can be prevented. | 2009-07-23 |
20090184429 | Integrated Circuit Comprising Conductive Lines and Contact Structures and Method of Manufacturing an Integrated Circuit - An integrated circuit comprises a first conductive lines and second lines as well as contact structures being in contact with the first and second conductive lines. The first conductive lines are arranged in a first metallization level, and second conductive lines are arranged in a second metallization level arranged above the first metallization level. The second conductive lines are arranged above the contact structures, and a pitch of neighboring contact structures is equal to a pitch of neighboring second conductive lines. The distance between neighboring contact structures is smaller than 100 nm. | 2009-07-23 |
20090184430 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR MODULE INCLUDING SEMICONDUCTOR DEVICES - Semiconductor device | 2009-07-23 |
20090184431 | Liquid epoxy resin composition and flip chip semiconductor device - A liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) an aromatic amine curing agent comprising at least 5% by weight of a specific aromatic amine compound, and (C) an inorganic filler has a low viscosity for ease of working, cures into a cured product which has improved adhesion to the surface of silicon chips, and offers an encapsulated semiconductor device that does not suffer a failure even at a reflow temperature of 260-270° C., does not deteriorate under hot humid conditions, and does not peel or crack on thermal cycling. | 2009-07-23 |
20090184432 | Air Freshener Device And Methods For Controlling An Amount Of Evaporated Scented Material Emitted From The Air Freshener Device - A method for controlling an amount of evaporated scented material emitted from an air freshener device include generating a first control signal to induce the motor to rotate fan blades at a first rotational speed during a first time interval which urges air flow toward the aperture of the container to induce evaporation of the scented material in the container. The method further includes generating additional control signals to induce the motor to increase a rotational speed of the fan blades during a second time interval to increase air flow toward the aperture of the container, the second time interval being after the first time interval, such that first and second mass rates of evaporated scented material from the container during the first and second time intervals, respectively, are maintained within a predetermined mass rate range. | 2009-07-23 |
20090184433 | Integrated Air Intake and Primer for Internal Combustion Engine - An air intake component and assembly, as well as an associated carburetor assembly and related method of assembly, are disclose. In at least some embodiments, the intake component includes a surface capable of being coupled at least indirectly to a carburetor assembly, where the surface includes first and second orifices, a first channel capable of communicating engine intake air from a first location to the first orifice of the surface, and a second channel by which at least one of the first location and a second location is connected to the second orifice. The second channel is capable of communicating at least one of a primer air pressure pulse from the at least one location to the second orifice and fuel fumes from the second orifice to the at least one location. In at least some further embodiments, the intake component can be fitted with any of several interchangeable covers. | 2009-07-23 |
20090184434 | VARIABLE VENTURI CARBURETOR - A carburetor includes a main body defining a bore, a main passage and a venturi defined within the bore, and a fuel nozzle carried by the main body and including a fuel nozzle outlet communicating with the venturi. The carburetor may also include a valve member translatable across an axis of the bore, such that in a closed state, the valve member closes the main passage but maintains the venturi at least partially open. The carburetor may also include a needle valve disposed at an end of the fuel nozzle substantially opposite of the fuel nozzle outlet to variably control flow of fuel into a fuel nozzle inlet, and a needle valve transmission may be coupled between a throttle shaft and the needle valve to convert rotation of the throttle shaft to translation of the needle valve. | 2009-07-23 |
20090184435 | CONTROLLING THE SYNTHESIS AND GEOMETRY OF LIPID TUBULE NETWORKS - Nano-sized lipid vesicles with tailored properties are used as building blocks to generate lipid tubules between two glass surfaces. The tubules formed not only have defined orientation, width, and length, but they can also grow to be as long as 13 mm under ambient conditions, without externally supplied flow, temperature control, or catalyzing agents. The tubule membrane and its internal aqueous content can be manipulated by controlling the combination of different vesicle's lipid composition and aqueous entrapment. This self-assembly process opens up new pathways for generating complicated and flexible architectures for use in biocompatible molecular and supramolecular engineering. Aspects of the invention generate, for example, tubules encapsulated with siRNA, tubules with multiple branches, and polymerized fluorescent tubules in a single-throughput self-assembly process. | 2009-07-23 |
20090184436 | METHOD AND APPARATUS FOR MAKING A COMPOSITE, IN PARTICULAR COMPRISING AN INJECTION-MOLDED PART WITH A POLYURETHANE COATING - In a method for producing a composite, a carrier component is placed into an opened cavity of a mold. The mold is then closed to a predetermined position, thereby creating an cavity of a first expanded size. To improve venting, a vacuum is generated in the expanded cavity before filling the expanded cavity with a flooding material. A compression step is then executed either at the same time as flooding material is introduced or following the introduction of the flooding material. | 2009-07-23 |
20090184437 | Resin transfer molding device and resin transfer molding method - The present invention relates to an RTM molding device designed to mold a FRP molded body by injecting a resin composition into a mold and by impregnating the molded body therewith. The resin composition is a CCP. A CCP accommodating layer is disposed adjacent to the outer side of the molded body. The layer contains the CCP. The layer is provided with a Vf limit value, the value defined by the curing characteristics of the CCP and the characteristics of dissipation of heat from the CCP into the exterior. A means for separating the molded body is disposed between the body and the layer. | 2009-07-23 |
20090184438 | Device and process for the injection of filling material inside boats - A device and a process for the injection of a filling material in a boat comprising a plurality of separate chambers. The filling material is prepared in a plurality of distinct preparation and injection units, corresponding in number to the number of chambers to be filled, and is then injected simultaneously into the chambers. | 2009-07-23 |
20090184439 | METHOD OF COVERING A RAIL FOR A RAILWAY VEHICLE - The invention concerns a method for covering parts of a rail ( | 2009-07-23 |
20090184440 | MOLDING EQUIPMENT AND METHOD TO MANUFACTURE STACKABLE INTER-ENGAGING BRICKS, BLOCKS, STONES AND THE LIKE WITH A SMOOTH OR EMBOSSED FACE - A molding equipment and method to mold stackable inter-engaging bricks, blocks, stones and the like and bricks, blocks, stones and the like produced therewith are disclosed. The molding equipment comprises a main structure which contains individual cavities. Each cavity preferably has a middle structure to which a brick separating element can be attached. Without the brick separating element, each cavity can form two attached splittable bricks whereas with the brick separating element attached, each cavity can hold two individual smooth or embossed face bricks. The size and shape of the stackable inter-engaging bricks is such that once out of the mold but still in an uncured form, the said brick can stand on its side without falling down, being damaged, buckling or being otherwise deformed during the manufacturing process. | 2009-07-23 |
20090184441 | Microstructure roller, microstructure fabrication method, tool for fabricating a microstructure roller - A microstructure roller formed of a cylinder and a resin pattern layer is disclosed. The microstructure roller is made by: providing a cylinder having a groove extending around the periphery, and then adhering a flexible mold plate to the periphery of the cylinder to have a cavity be defined in between the groove of the cylinder and a patterned face of microstructure patterns of the flexible mold plate, and then filling a resin in the cavity, and the curing the resin, and then removing the flexible mold plate from the cylinder. | 2009-07-23 |
20090184442 | ANTISTATIC AGENTS, COMPOSITIONS THEREOF, AND METHODS OF MANUFACTURE - A quaternary onium aromatic sulfonate represented by the formula: | 2009-07-23 |
20090184443 | Method of manufacturing a new airless or pneumatic tire having a reinforced rubber structure and a polyurethane tread - A method of manufacturing a new tire having a reinforced rubber structure and a polyurethane tread. | 2009-07-23 |
20090184444 | OPTICAL MOLDING APPARATUS AND OPTCIAL MOLDING METHOD - An optical molding apparatus molds a three-dimensional model by stacking cured layers. Each cured layer is formed by emitting light according to cross-sectional-shape data of the three-dimensional model onto a surface of photo-curable resin. The optical molding apparatus includes a container that contains the photo-curable resin, a movable stage that is movable in a direction orthogonal to the surface of the photo-curable resin, an optical system that emits the light onto the surface of the photo-curable resin contained in the container so as to form each cured layer on the movable stage, and a discharging mechanism that performs a discharging operation for discharging new photo-curable resin onto a surface of each cured layer formed on the movable stage before stacking a subsequent cured layer. | 2009-07-23 |
20090184445 | METHOD FOR FORMING AND ALIGNING CHEMICALLY MEDIATED DISPERSION OF MAGNETIC NANOPARTICLES IN A POLYMER - A method. The method includes providing Au-doped Co nanoparticles. The nanoparticles include a combination of non-ferromagnetic nanoparticles and weakly ferromagnetic nanoparticles. The nanoparticles each have an exterior surface. The surfaces of the nanoparticles are functionalized with 7-(5-uracil-ylcarbamoyl)heptanoic acid. A polymer is provided having a general formula including a uracil group. A dispersion is formed by agitating a solution of the nanoparticles. The solution is spin cast into a film. The film is heated under vacuum at a first temperature, T | 2009-07-23 |
20090184446 | METHOD AND SYSTEM FOR STRETCHING POLYMER FILM - In a polymer film stretching system, a tentering machine draws polymer film of cellulose acylate containing additive of triphenyl phosphate in a transverse direction while the polymer film is guided continuously and heated. A stretching chamber contains the tentering machine. A far infrared heater and heat roller heat the polymer film before entry to the stretching chamber to set temperature of the polymer film upon entry to the stretching chamber in a range equal to or higher than T+10 (deg. C.) and equal to or lower than T+80 (deg. C.), where T (deg. C.) is a condensation temperature of the additive evaporated in the stretching chamber. Furthermore, a film dispenser supplies the polymer film from a film roll to the tentering machine. | 2009-07-23 |
20090184447 | FLUID-FILLED TYPE VIBRATION DAMPING DEVICE - A Fluid-filled type vibration damping device, which is configured to be free from the necessity of supplying a continuous application of electricity to a coil so as to maintain a movable valve body in either an opened state or a closed state, is provided. The device includes a cam mechanism, which transmits a rotational drive force of a motor to the movable valve body in the form of a reciprocating drive force. In the device, a first rotation angle switch is connected to a first control switch in series relative to a motor coil, and a second rotation angle switch is connected to a second control switch in parallel relative to the first switch. The first rotation angle switch is turned on in a state of a first angular range θ | 2009-07-23 |
20090184448 | ISOLATION SYSTEM FOR A SEAT OR THE LIKE, AND VEHICLE INCORPORATING SAME - An isolation system for use in damping and isolating low frequency oscillations and shock loads between two members. An exemplary application is a seat isolation system for use with a vehicle such as a lawn mower. The seat isolation system may include two or more isolators interposed between a chassis of the vehicle, and a seat (e.g., operator's seat). The isolators may permit attenuation of shock or low frequency oscillation inputs via damping and isolation in both vertical and horizontal (fore-and-aft and side-to-side) directions. In some embodiments, the isolators include an elastomeric element that provides the seat with six degrees of freedom. | 2009-07-23 |
20090184449 | Device for Holding and Positioning Implements, Workpieces and Tools - A device to hold and position implements, workpieces and tools has a console ( | 2009-07-23 |
20090184450 | Automatic workpiece clamp and support - An automatic clamping device is disclosed for holding planar workpieces such as: doors, windows, panels, plasterboard, etc. The planar workpiece is held in an upright position by clamping jaws actuated by the weight of the workpiece. Automatic clamping is accomplished by placing the workpiece through a slot at the top of the clamping device and lowering it onto a flexible strap connected to movable jaws which, under the weight of the workpiece, move laterally towards and clamp the workpiece. The workpiece is released by simply lifting it up through the slot and coil springs will automatically return the jaws to an open position. The device also provides support for holding planar workpieces on an incline. | 2009-07-23 |
20090184451 | CLAMP APPARATUS - A clamp apparatus includes a clamp unit capable of retaining a workpiece, a cylinder driven under the supply of a pressure fluid, and a drive force transmission mechanism, which is capable of transmitting a drive force from the cylinder to the clamp unit. The drive force transmission mechanism includes a guide body disposed displaceably inside of a body, two pairs of rollers retained rotatably on both side surfaces of the guide body, and a spindle inserted through a second link groove of the guide body that rotatably supports a clamp arm. The clamp arm is rotatably operated and is capable of clamping the workpiece under a displacement action of the guide body. | 2009-07-23 |
20090184452 | Print Type Binder for Paper Money, System Including the Binder, and Motion Method Thereof - A printer type paper money binding apparatus can print bundle-of-paper money information, such as a logo, the date, the money unit and the amount of money, on the binding strip, which is used to bind a bundle of paper money. A printer type paper money binding system capable of authenticating an operator and the operation method thereof can prevent an unauthorized operator from performing a printing and binding operation, thereby ensuring security in the printing and binding operation. | 2009-07-23 |
20090184453 | Aerodynamic Positioning Device - The gathering, conveyance, and assembly of printed material utilizing one or more aerodynamic positioning devices in conjunction with binding machinery is disclosed. The aerodynamic positioning device utilizes controlled fluid flow via a series of discretely spaced jets that create a low pressure region beneath a signature dropping from an adjacent feeder. The aerodynamic positioning device allows the binding machinery to operate at high speeds with lightweight and unbalanced signatures while maintaining high-quality production with reduced paper jams. | 2009-07-23 |
20090184454 | SHEET POST PROCESS DEVICE WITH STAPLER MECHANISM - A sheet post process device with a stapler mechanism includes a conveying path configured to convey a sheet on which an image is formed to the stapler mechanism; a first sensor disposed along the conveying path and configured to detect a moving position of the sheet; and a tray in which the sheets are stacked to undergo a stapling process; and a rotary cam having a spiral shape disposed at a conveying path outlet through which the sheet is ejected from the conveying path to the tray. When the sheet passes through the conveying path outlet, the cam rotates and comes into contact with the sheet to move the sheet to the tray. | 2009-07-23 |
20090184455 | IMAGE FORMING APPARATUS - An image forming apparatus includes: a reading mechanism having an original placement portion on which an original document is placed for reading an image; a recording mechanism having a medium supply tray on which a recording medium is set, the recording mechanism being disposed in such a manner that a longitudinal direction of the medium supply tray is substantially perpendicular to a longitudinal direction of the original placement portion; an angular casing that houses the reading mechanism and the recording mechanism while stacking the reading mechanism and the recording mechanism vertically; and a cartridge holder that houses an ink cartridge and is disposed in a space located at a corner position of the casing below the reading mechanism and surrounded by a circumferential wall of the casing and a side wall of the medium supply tray. | 2009-07-23 |
20090184456 | PRINT SYSTEM - When a paper sheet is required during execution of a print job, a printing apparatus requests paper sheet information about the states of paper feed trays from the other printing apparatuses. When the other printing apparatuses transmit the paper sheet information, the printing apparatus of the request source displays a search result display screen | 2009-07-23 |
20090184457 | Sheet feeding apparatus - There is provided a sheet feeding apparatus including a first feeding member that feeds at least one of the sheets from a discharge tray; a second feeding member that feeds the sheet fed by the first feeding member; a separating member, wherein a nip portion is formed between the separating member and the second feeding member, and when two sheets are entered the nip portion, the separating member separates one of the entered sheets from the other; an adjusting unit that changes a force of the separating member; a detecting unit that detects at least one of a distance by which the other of the entered sheets is transported beyond the nip portion and an advancing speed of the other of the entered sheets at the nip portion; and a controller that controls the adjusting unit based on a detection value of the detecting unit. | 2009-07-23 |
20090184458 | EQUIPMENT FOR STORING IN AN ORDERLY WAY BANKNOTES AND/OR PAPERS AND THE LIKE - An equipment ( | 2009-07-23 |
20090184459 | POST-PROCESSING APPARATUS AND IMAGE FORMING APPARATUS - There provided is a post-processing apparatus which has a simple structure and makes more than one sheet of recording paper easily slide down a slope of a post-processing tray, has no irregularity in the alignment of the sheets of recording paper in the discharging direction, and makes the alignment of sheets of recording paper easier after that. A finisher unit is provided with conveyance rollers for discharging sheets to a processing tray, aligning plates for guiding both sides of the sheets discharged by the conveyance rollers, and a control CPU for controlling an operation of the aligning plates. When the sheets guided by the pair of aligning plates slide down a slope of the processing tray, the control CPU causes the pair of aligning plates to vibrate in the cross direction of the sheet and in the same direction. | 2009-07-23 |
20090184460 | A DEVICE FOR AUTOMATICALLY JOGGING MAILPIECES - A jogging device for a feeder of a mail handling machine, which jogging device comprises a side jogging abutment mounted to move, under the action of a drive motor, along a guide rail that is disposed perpendicularly to a referencing wall, said side jogging abutment being provided with at least: a first sensor that is fastened to its base and that, when unmasked, causes said side jogging abutment to move towards said referencing wall, and, when masked, causes this movement to stop; and a second sensor that is fastened to the top of said side jogging abutment and that, when masked, causes said side jogging abutment to move away from said referencing wall, and, when unmasked, causes this movement to stop. | 2009-07-23 |
20090184461 | SHEET CONVEYANCE DEVICE - A sheet conveyance device includes: a first conveyance member configured to convey a sheet in a first direction; a second conveyance member configured to convey the sheet in a second direction; a guide disposed between the first conveyance member and the second conveyance member, the guide having a curved face configured to guide the sheet conveyed from the first conveyance member to the second conveyance member; and an adjustment member disposed at an inner position of the curvature of the curved face of the guide, the adjustment member being configured to swing to contact with a curved inner face of the sheet guided by the guide in accordance with a contact force applied by the sheet. | 2009-07-23 |
20090184462 | DRIVE TRANSMISSION MECHANISM OF SHEET TRANSPORTATION APPARATUS AND DOCUMENT TRANSPORTATION APPARATUS - A drive transmission mechanism of a sheet transportation apparatus of the present invention comprises an upstream transportation roller gear and a planet gear for transmitting a first driving force from a driving source to the upstream transportation roller gear, and a release mechanism for preventing the upstream transportation roller gear and the planet gear from engaging with each other. The release mechanism prevents the engagement of the planet gear and the upstream transportation roller gear when the driven gear is driven to reversely rotate by a second driving force. The release mechanism prevents the engagement by moving a release member before the planet gear and the driven gear engage with each other. The release mechanism moves the release member by the driven gear being reversely rotated by the second driving force which is a driving force other than the driving source. This makes it possible to realize a drive transmission mechanism of a sheet transportation apparatus comprising a release mechanism capable of releasing the engagement of the driven gear and the drive gear for transmitting the driving force from the driving source to the driven gear, without the need of reversely rotating the driving source or the fear of impairing the driving force from the driving source. | 2009-07-23 |
20090184463 | APPARATUS AND METHOD FOR STABILIZING A MOVING SHEET RELATIVE TO A SENSOR - A method includes receiving a sheet of material at a sensor assembly. The sensor assembly includes a sensor configured to measure a property of the sheet. The method also includes stabilizing the sheet with respect to the sensor using a guide roller. Stabilizing the sheet includes using the guide roller to remove at least a portion of a first boundary layer of air moving towards the guide roller and to reform at least a portion of a second boundary layer of air moving away from the guide roller. For example, the guide roller could include a plurality of grooves or openings in a surface of the guide roller, or the guide roller could include a plurality of rings spaced apart from one another. Air could move from one side of the guide roller to another side of the guide roller through the grooves, through the openings, or between the rings. | 2009-07-23 |
20090184464 | Belt Feed Apparatus and Image Forming Apparatus Using the Same - A belt feed apparatus, includes: an endless belt member; a belt back surface member including a close portion disposed close to the endless belt member to such a degree that, when the endless belt member stands stationary, the close portion is prevented from touching the endless belt member, and while the endless belt member is circulating, the close portion can be contacted with the endless belt member irregularly; and a non-sticking portion that includes a non-sucking surface contactable with the endless belt member to prevent the endless belt member from being electrostatically sucked to the close portion, the non-sucking surface being provided in an entire portion or part of a surface of the close portion opposed to the endless belt member, and due to the existence of the non-sucking surface, the non-sticking portion being able to prevent the endless belt member from sticking to the close portion. | 2009-07-23 |
20090184465 | Media diversion mechanism for a sheet media processing device, and a media processing device - A check processing device conveys checks into branch paths without the check jamming. The downstream end of the check transportation path | 2009-07-23 |
20090184466 | Printing apparatus - A printing apparatus comprises: a first paper discharge roller unit | 2009-07-23 |
20090184467 | Board game with laterally movable pieces - A puzzle board game for completing puzzle pictures or patterns of animals, words, phrases, or geometric designs includes a case, a cover for the case, a card holder on the inside of the cover for holding additional game cards with various puzzle patterns imprinted thereon, intersecting tracks for supporting the lateral (left/right or up/down) movement of square or circular-shaped game playing pieces some of which have on their facing surfaces portions of the puzzle pattern or picture printed thereon, with from one to three game playing piece positions left open for determining puzzle solution degree of difficulty, and an end member attachably removably to one side of the case so that after completion of one puzzle game, the end member is removed, the playing pieces are emptied from the tracks, the playing pieces are then randomly inserted back onto the tracks, and the end member is attached to the case so that the next play of the puzzle board game can commence. | 2009-07-23 |
20090184468 | Electrical chess module - An electrical chess module is disclosed. A LED and a first coil are configured at every chessman, and the LED and the first coil are parallel connection. A electric power and a second coil are configured at the chessboard, wherein the second coil makes the electromagnetic induction due to a magnetic field resulted from the electric current of the electric power, thereby the luminous apparatus of every chessman will shine because the first coil produces a electric current due to the electromagnetic induction between the first coil and the magnetic field. | 2009-07-23 |
20090184469 | POLYGON IDENTIFICATION BOARD GAME - A board game includes a board having an upper surface with a peripheral region and a central region. The peripheral region has positions for placement of player pieces thereupon, each peripheral region having located thereon an image of one of a plurality of polygonal shapes. The central region has central sub-regions, each of which has a plurality of polygonal cut-outs for receiving a corresponding one of a plurality of polygonal objects of a particular color that are shaped in a same manner as the polygonal cut-out. When a player answers a question related to polygon shapes correctly, that player places a respective polygon-shaped piece into a corresponding polygon-shaped cut-out region in his/her assigned central region. Players move player pieces a number of positions on the peripheral region of the board corresponding to dice roll numbers. When a player answers a question incorrectly, for the player's next turn, the player piece is moved in the opposite direction on the peripheral region of the board. | 2009-07-23 |
20090184470 | GAME AND A LAYOUT FOR A GAME INCLUDING A WHEEL AND DICE - The disclosure relates to a game comprising the following steps placing a wager, spinning a wheel, rolling a set of dice and betting on a particular color during a spin of a wheel or a roll of dice. The game can be played on a gaming surface comprising at least one wheel. At least one surface for rolling dice, wherein the surface, comprises a plurality of number areas for placing bets. There is also at least one area for placing color bets, at least one rim for allowing dice to remain on the surface for rolling dice, and at least one area for placing bets that a roll of dice tie a number on a spin of a wheel. There is also at least one area for placing bets that a roll of dice beats a number on a spin of a wheel. In addition there is at least one area for placing bets that a number on a spin of a wheel beats a roll of dice. | 2009-07-23 |
20090184471 | GAMES OF THREE CARD BLACK JACK AND BACCARAT - Methods of playing card games similar to Blackjack and Baccarat are described. The methods include dealing initial hands of two cards. The hands must draw a third card if the first two cards have a value of 16 or less, and must stand if the first two cards have a value of 17 or more. Copy hands are a tie. Players are allowed to place bonus bets on the hands, such as three of a kind in the same suit, three of a kind, three low cards, three card straight, and first two cards are a pair. | 2009-07-23 |
20090184472 | Card Game - A card game method of play and apparatus, comprising a deck of cards containing numerical values and suits, and a plurality of wild cards (FIGS. | 2009-07-23 |
20090184473 | Card game with auxiliary game - The present invention provides a method of playing a card game which includes a main sub-game and an auxiliary sub-game, the method comprising the steps of: providing to the player an option of playing the auxiliary sub-game according to pre-determined auxiliary sub-game rules, said playing including placing a bet on the auxiliary sub-game; dealing cards to the player; allowing the dealer to deal cards to itself; if the total of the point value of the cards dealt to the player equals the total of the point value of the cards dealt to the dealer, determining that a winning outcome has been achieved by the player in the main sub-game; if such a winning outcome has been achieved, awarding the player a prize in accordance with said main sub-game rules based on the cards dealt to the player; if the player's and dealer's cards have the same point value, allowing the player to enter the auxiliary sub-game; and determining if the player has achieved a winning outcome in the auxiliary sub-game based on the player's cards in the main sub-game. | 2009-07-23 |
20090184474 | Electronic target - An electronic target has a base, a sensing assembly and a collector. The base has a body and a stand. The base is an electrical target module and has an outer edge and a front surface. The stand is mounted on the outer edge of the body and hold the body vertical. The sensing assembly is formed on the front surface of the body and has a sticky cushion. The collector corresponds to, is mounted on and protrudes from the stand below the sensing assembly. When a pellet strikes the sticky cushion, the sticky cushion momentarily deforms slightly to hold the pellet momentarily and absorb energy of the pellet. After the pellet momentarily sticks to the sticky cushion, it falls into the collector. | 2009-07-23 |
20090184475 | FACE SEAL FOR GAS TURBINE ENGINE - A face seal for a gas turbine engine comprises a seal body that has a contact face to engage a rotating surface. The contact face is defined as an area extending radially between an inner diameter of the seal body and an outer diameter of the seal body at one seal end. A ratio of the outer diameter to the inner diameter is at least 1.054. | 2009-07-23 |
20090184476 | BUTTERFLY VALVE WITH A RIGID SEAL - A valve is disclosed and can include a valve body having a central bore for passage of fluid there through and a longitudinal axis. The valve can also include a seal installed within the valve body along the central bore. The seal can include a first seal member having an annular ring portion and a hub portion extending from the annular ring portion. The seal can also include a second seal member including an annular ring configured to engage a distal end of the hub portion and create a sealing engagement between the hub portion and the annular ring when a compressive force is applied to the first and the second seal members. | 2009-07-23 |
20090184477 | BLADE SEAL - A blade seal comprising: a base; a tip; a first part formed from an elastomeric material which extends continuously from the base to the tip; and a second part formed from an elastomeric material mixed with conductive filler which extends continuously from the base to the tip. The blade seal is manufactured by compressing the first and second parts together; and curing one or both of the parts as they are compressed together. | 2009-07-23 |
20090184478 | Metal gasket - A metal gasket includes at least one structural plate having a sealing bore and bolt holes located around the seal bore. An inner bead is formed on the at least one structural plate to surround the sealing bore. The inner bead has first neighboring portions near the bolt holes and first outer portions outside the first neighboring portions. The first neighboring portion has a compression resistance smaller than that of the first outer portion. An outer bead is formed on the at least one structural plate to surround the inner bead such that the bolt holes are located inside thereof. The outer bead has second neighboring portions near the bolt holes and second outer portions outside the second neighboring portions. The second neighboring portion has a compression resistance greater than that of the second outer portion. | 2009-07-23 |
20090184479 | Clamping Tool - A clamping tool includes a holder, a connector and a tool. The holder has a rearwardly tapering bore and a holder thread having a first pitch. The connector has a cylindrical shape and a connector through bore. The connector further has a first connector thread having a pitch similar to the first pitch, and a second connector thread having a second pitch that is different from the first pitch. The tool has a rearwardly tapering rear portion and a tool thread having a pitch similar to the second pitch. In an assembled position, the rearwardly tapering rear portion of the tool abuts the rearwardly tapering bore of the holder, the holder thread is threadingly engaged with the first connector thread, and the tool thread is threadingly engaged with the second connector thread. | 2009-07-23 |
20090184480 | INFORMATION BASED CONTROLLING OF CHASSIS HEIGHT OF A VEHICLE - In a method of operating a vehicle system for automatically adjusting the chassis height of a vehicle, height adjusting devices are operated for adjusting the chassis height in relation to one or more axles of the vehicle from a first height level to second height level. The operation of height adjusting devices is controlled by positioning identification devices so as to move the chassis from the first to the second height level in response to receiving from the position identification devices an indication to the effect that the vehicle is approaching or has arrived at one of a plurality of predetermined positions and/or positions fulfilling predetermined criteria. The predetermined positions may be defined by wireless position indicators to be detected by a position detector installed in the vehicle. The position identification devices can include a global navigation system. | 2009-07-23 |
20090184481 | Unitary quad roller skate - A quad roller skate for use on outdoor surfaces that has a unified structure that includes a quad boot permanently secured to a horizontal support plate and skate forward and rearward trucks permanently secured to the support plate. The front and rear left and right skates lie in left and right vertical planes spaced from the maximum side edges of the boot. The skate wheels have apexes that extend to a horizontal plane at least as high as the plane of the horizontal support plate and can extend higher. Each of the wheels preferably are thin width wheels and have semi-circular profiles. | 2009-07-23 |
20090184482 | Mechanic's creeper - The mechanic's creeper has a lower body support, an upper body support and dual wheel assemblies mounted to the frame in a triangular array. The triangular positioning of the dual wheel assemblies provides for exceptional mobility when a person is working in a reclined position underneath a motor vehicle. The mechanic's creeper may have trays for holding small tools and parts attached to the frame near the lower body support. | 2009-07-23 |
20090184483 | MULTI-RIDER SCOOTER - A scooter for transporting one or more persons. The scooter has a base wherein at least two handlebar members are disposed about a portion of the base with one operable to support a driver and steer the scooter, and a second operable to support a passenger. One or more seat members may also be disposed about the base for accommodating riders. | 2009-07-23 |
20090184484 | ARM FOR A MOTOR-VEHICLE INDEPENDENT SUSPENSION AND MOTOR-VEHICLE INDEPENDENT SUSPENSION COMPRISING THE SAME | 2009-07-23 |
20090184485 | Vehicle Running Board Assembly - A running board assembly is provided that has structural tubing mounted to one of the spaced, longitudinally-extending frame rails. The structural tubing is configured to bear side impact loads in part by providing a continuous load-bearing path to direct the load to the frame rail. Additionally, because the structural tubing is of a higher strength than materials typically used for running boards, the structural tubing itself absorbs some of the side impact load. | 2009-07-23 |
20090184486 | BOARDING AND/OR ACCESS AID FOR VEHICLES WITH PASSENGER TRANSPORTATION - A boarding and/or access aid for vehicles with passenger carrying service, contains a frame ( | 2009-07-23 |
20090184487 | BOARDING AND/OR ACCESS AID FOR PASSENGER VEHICLES - A boarding and/or access aid for vehicles with passenger carrying service contains a frame with two parallel side parts ( | 2009-07-23 |
20090184488 | Kid cab trike - The present invention relates generally to a recumbent tricycle. More particularly, the invention relates to a recumbent pedicab. The invention further relates to a kid cab pedicab. The inventive pedicab can accommodate at least one passenger and is light-weight and/or modular for easy transportation from one location to another location. The recumbent tricycle has at least one enclosure to seat and protect the passengers. A front frame and a rear frame are pivotally interconnected. The front frame supports, preferably, a single wheel drive mechanism and a driver's seat, while the rear frame supports at least a two-wheeled passenger cab. The cab frame supports fabric forming side panels, front to rear panel, passenger seat, at least one storage pouch, and signal lights. The rear cab portion has at least one window or panel which can be rolled down for protection of the passengers or rolled-up and secured to allow an open view or ventilation for the passengers. The inventive pedicab also has a cargo and storage area which is preferably behind the passenger seat and where the contents are secured using at least one cargo net attached to the cab frame. Lightweight decking on rear frame provides floor for cab and entry area. | 2009-07-23 |
20090184489 | Leg support for a motorcycle - A leg support for a motorcycle and/or bicycle including a support member, a body portion and at least one securing means for securing said body portion and/or support member to the motorcycle, whereby the leg support provides a means of assisting a person to hold their body in a forward position while riding. | 2009-07-23 |