27th week of 2011 patent applcation highlights part 14 |
Patent application number | Title | Published |
20110163424 | Molecular Self-Assembly In Substrate Processing - Methods for sealing a porous dielectric are presented including: receiving a substrate, the substrate including the porous dielectric; exposing the substrate to an organosilane, where the organosilane includes a hydrolysable group for facilitating attachment with the porous dielectric, and where the organosilane does not include an alkyl group; and forming a layer as a result of the exposing to seal the porous dielectric. In some embodiments, methods are presented where the organosilane includes: alkynyl groups, aryl groups, fluoroalkyl groups, heteroaryl groups, alcohol groups, thiol groups, amine groups, thiocarbamate groups, ester groups, ether groups, sulfide groups, and nitrile groups. In some embodiments, method further include: removing contamination from the porous dielectric and a conductive region of the substrate prior to the exposing; and removing contamination from the conductive region after the forming. | 2011-07-07 |
20110163425 | SEMICONDUCTOR DEVICE - Disclosed is a semiconductor device which includes a semiconductor chip and a base substrate. The semiconductor chip includes a semiconductor substrate, an interconnect layer and a high-frequency interconnect. The interconnect layer is provided on the substrate. The high-frequency interconnect is formed within the interconnect layer. The semiconductor chip is mounted onto the base substrate. An electromagnetic shield layer is provided between the high-frequency interconnect and the interconnect. | 2011-07-07 |
20110163426 | Dice Rearrangement Package Structure Using Layout Process to Form a Compliant Configuration - A dice rearrangement package structure is provided, which a dice having an active surface and a bottom surface, and a plurality of pads is disposed on the active surface; a package body is provided to cover the dices and the plurality of pads being exposed; one ends of plurality of metal traces is electrically connected to the each pads; a protection layer is provided to cover the active surface and the other ends of the exposed metal traces is electrically connected to the plurality of conductive elements, the characteristic in that the package body is a B-stage material. | 2011-07-07 |
20110163427 | METHOD AND APPARATUS FOR DIRECTING MOLDING COMPOUND FLOW AND RESULTING SEMICONDUCTOR DEVICE PACKAGES - Flow diverting structures for preferentially impeding, redirecting or both impeding and redirecting the flow of flowable encapsulant material, such as molding compound, proximate a selected surface or surfaces of a semiconductor die or dice during encapsulation are disclosed. Flow diverting structures may be included in or associated with one or more portions of a lead frame, such as a paddle, tie bars, or lead fingers. Flow diverting structures may also be inserted into a mold in association with semiconductor dice carried on non-lead frame substrates, such as interposers and circuit boards, to preferentially impede, redirect or both impede and redirect the flow of molding compound flowing between and over the semiconductor dice. | 2011-07-07 |
20110163428 | SEMICONDUCTOR PACKAGES WITH EMBEDDED HEAT SINK - Semiconductor packages and methods for making and using the same are described. The semiconductor packages contain a leadframe having an array of holes with a layout corresponding to the land pad array of the package, wherein the holes contain a thermally-conductive dielectric material with a via therein containing an electrically conductive material. The electrically conductive materials can extend past the bottom of the leadframe to form the land pad array of the packages. With such a configuration, the leadframe can act as an embedded heat sink in the package and there is no need to mount an additional heat sink to the package for thermal dissipation, allowing a thinner package to be manufactured. With such a configuration, the semiconductor packages have a full land pad array, providing a smaller footprint and a higher I/O capacity. Other embodiments are also described. | 2011-07-07 |
20110163429 | Semiconductor Chip Package Assembly with Deflection-Resistant Leadfingers - The invention relates to leadframes and semiconductor chip package assemblies using leadframes, and to methods for their assembly. A disclosed embodiment of the invention includes a semiconductor package leadframe with a chip mounting surface for receiving a semiconductor chip and a plurality of leadfingers. The leadfingers have a proximal end for receiving one or more wirebond, and a distal end for providing an electrical path from the proximal end. One or more of the leadfingers also has an offset portion at its proximal end for increasing the clearance between the leadfinger and underlying heat spreader, increasing the stiffness of the leadfinger, and increasing leadfinger deflection-resistance and spring-back. The offset is in the direction opposite the plane of a heat spreader thermally coupled to the mounting surface. Preferred embodiments of the invention further include a semiconductor chip affixed to the mounting surface and a plurality of bondwires operably coupling bond pads of the chip to the offset portions of the proximal ends of individual leadfingers. | 2011-07-07 |
20110163430 | Leadframe Structure, Advanced Quad Flat No Lead Package Structure Using the Same, and Manufacturing Methods Thereof - A package structure and related methods are described. In one embodiment, the package structure includes a chip, a plurality of leads disposed around and electrically coupled to the chip, and a package body formed over the chip and the plurality of leads. At least one lead includes a central metal layer having an upper surface and a lower surface, a first protruding metal block having an upper surface and extending upwardly from the upper surface of the central metal layer, a second protruding metal block having a lower surface and extending downwardly from the lower surface of the central metal layer, a first finish layer on the upper surface of the first protruding metal block, and a second finish layer on the lower surface of the second protruding metal block. The package body substantially covers the first protruding metal block and the first finish layer of each of the leads. | 2011-07-07 |
20110163431 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - Retaining regions | 2011-07-07 |
20110163432 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - Protrusions | 2011-07-07 |
20110163433 | LEAD FRAME SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR APPARATUS - A lead frame substrate, including: a metal plate having a first surface and a second surface; a semiconductor element mount portion and a semiconductor element electrode connection terminal that are formed on the first surface; an external connection terminal formed on the second surface and electrically connected to the semiconductor element electrode connection terminal; a conducting wire that connects the semiconductor element electrode connection terminal and the external connection terminal to each other; a resin layer formed on the metal plate; a hole portion that is partly formed in the second surface of the metal plate and does not penetrate the metal plate; and a plurality of protrusions that are formed on a bottom surface of the hole portion and protrude in a direction away from the metal plate, the protrusions having a height lower than a position of the second surface, not being in electrical conduction with the conducting wire, and being dispersed separately. | 2011-07-07 |
20110163434 | STACKED POWER CONVERTER STRUCTURE AND METHOD - A power converter can include an output circuit having a high-side device and a low-side device which can be formed on a single die (a “PowerDie”). The power converter can further include a controller integrated circuit (IC) formed on a different die which can be electrically coupled to, and co-packaged with, the PowerDie. The PowerDie can be attached to a die pad of a leadframe, and the controller IC die can be attached to an active surface of the first die such that the first die is interposed between the controller IC die and the die pad. | 2011-07-07 |
20110163435 | Lead frame substrate and method of manufacturing the same, and semiconductor device - A lead frame substrate, includes: a metal plate having first and second surfaces; a semiconductor element mounting section, semiconductor element electrode connection terminals, and a first outer frame section formed on the first surface; external connection terminals formed on the second surface and electrically connected with the semiconductor element electrode connection terminals; a second outer frame section formed on the second surface; and a resin layer formed on a gap between the first outer frame and the second outer frame. Each external connection terminal buried in the resin layer has at least one projection formed on a side surface thereof throughout a side lower portion of the first surface. | 2011-07-07 |
20110163436 | WIRING BOARD, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device including a semiconductor element | 2011-07-07 |
20110163437 | Semiconductor package and method of manufacturing the same - There is provided a semiconductor package. A semiconductor package according to an aspect of the invention may include a core part having a semiconductor chip mounted within a receiving space therein; an insulation part provided on one surface of the core part; and a via part provided by filling a hole-processed surface formed simultaneously through the insulation part and a passivation layer for protecting an electrode pattern part on the semiconductor chip. | 2011-07-07 |
20110163438 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A semiconductor chip is mounted on a heat sink disposed inside a through-hole of a wiring board, electrodes of the semiconductor chip and connecting terminals of the wiring board are connected by bonding wires, a sealing resin is formed to cover the semiconductor chip and the bonding wires, and solder balls are formed on the lower surface of the wiring board, thereby constituting the semiconductor device. The heat sink is thicker than the wiring board. The heat sink has a protruded portion protruding to outside from the side surface of the heat sink, the protruded portion is located on the upper surface of the wiring board outside the through-hole, and the lower surface of the protruded portion contacts to the upper surface of the wiring board. When the semiconductor device is manufactured, the heat sink is inserted from the upper surface side of the wiring board. | 2011-07-07 |
20110163439 | DIE BONDING A SEMICONDUCTOR DEVICE - A method includes providing a silicon-containing die and providing a heat sink having a palladium layer over a first surface of the heat sink. A first gold layer is located over one of a first surface of the die or the palladium layer. The silicon-containing die is bonded to the heat sink, where bonding includes joining the silicon-containing die and the heat sink such that the first gold layer and the palladium layer are between the first surface of the silicon-containing die and the first surface of the heat sink, and heating the first gold layer and the palladium layer to form a die attach layer between the first surface of the silicon-containing die and the first surface of the heat sink, the die attach layer comprising a gold interface layer having a plurality of intermetallic precipitates, each of the plurality of intermetallic precipitates comprising palladium, gold, and silicon. | 2011-07-07 |
20110163440 | SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device includes providing a carrier and attaching a plurality of semiconductor chips to the carrier. The semiconductor chips have a first electrode pad on a first main face and at least a second electrode pad on a second main face opposite to the first main face, whereby the first electrode pad is electrically connected to the carrier. A plurality of first bumps are formed on the carrier, the first bumps being made of a conductive material. The carrier is then singulated into a plurality of semiconductor devices, wherein each semiconductor device includes at least one semiconductor chip and one first bump. | 2011-07-07 |
20110163441 | PB-FREE SOLDER BUMPS WITH IMPROVED MECHANICAL PROPERTIES - A method of forming a semiconductor device is disclosed. A semiconductor substrate is provided that has a first contact and an undoped electroplated lead-free solder bump ( | 2011-07-07 |
20110163442 | METHOD OF MANUFACTURING A PLURALITY OF ICS AND TRANSPONDERS - A method of manufacturing a plurality of ICs for different transponder types adapted for different operating range is provided, wherein the method comprises manufacturing a first IC having a first capacitance corresponding to a first operating range of the first transponder and manufacturing a second IC having a second capacitance corresponding to a second operating range of the second transponder, wherein a common layout is used for manufacturing the first IC and the second IC. | 2011-07-07 |
20110163443 | METHODS FOR WAFER-LEVEL PACKAGING OF MICROELECTRONIC DEVICES AND MICROELECTRONIC DEVICES FORMED BY SUCH METHODS - Methods for packaging microelectronic devices, microelectronic workpieces having packaged dies, and microelectronic devices re disclosed herein. One aspect of the invention is directed toward a microelectronic workpiece comprising a substrate having a device side and a backside. In one embodiment, the microelectronic workpiece further includes a plurality of dies formed on the device side of the substrate, a dielectric layer over the dies, and a plurality of bond-pads on the dielectric layer. The dies have integrated circuitry and a plurality of bond-pads electrically coupled to the integrated circuitry. The ball-pads are arranged in ball-pad arrays over corresponding dies on the substrate. The microelectronic workpiece of this embodiment further includes a protective layer over the backside of the substrate. The protective layer is formed on the backside of the substrate from a material that is in a flowable state and is then cured to a non-flowable state. | 2011-07-07 |
20110163444 | SEMICONDUCTOR DEVICE HAVING ELASTIC SOLDER BUMP TO PREVENT DISCONNECTION - Regarding a semiconductor device, especially the present invention suppresses disconnection of the connection structure concerned in the semiconductor device which has the electric and mechanical connection structure using solder, and aims at improving connection reliability. And to achieve the above objects, the semiconductor device has the solder bump which electrically connects a semiconductor chip and a package substrate, the under-filling resin with which it filled up between the semiconductor chip and the package substrate, and a solder ball which electrically connects a package substrate with the outside, and the solder bump's elastic modulus is made lower than the elastic modulus of a solder ball. | 2011-07-07 |
20110163445 | Electronic Packages With Fine Particle Wetting and Non-Wetting Zones - Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be made hemi-wicking by particles of the same general characteristics. | 2011-07-07 |
20110163446 | METHOD TO GENERATE AIRGAPS WITH A TEMPLATE FIRST SCHEME AND A SELF ALIGNED BLOCKOUT MASK AND STRUCTURE - A structure and method to produce an airgap on a substrate having a dielectric layer and copper interconnects with sublithographic perforations therein which are ordered throughout the wafer structure in a macro level and a micro level with no change in order orientation and the top layer of the copper interconnects are not exposed. | 2011-07-07 |
20110163447 | High-Purity Copper or High-Purity Copper Alloy Sputtering Target, Process for Manufacturing the Sputtering Target, and High-Purity Copper or High-Purity Copper Alloy Sputtered Film - Provided is a high-purity copper or high-purity copper alloy sputtering target of which the purity is 6N or higher and in which the content of the respective components of P, S, O and C is 1 ppm or less, wherein the number of nonmetal inclusions having a particle size of 0.5 μm or more and 20 μm or less is 30,000 inclusions/g or less. As a result of using high-purity copper or high-purity copper alloy from which harmful inclusions of P, S, C and O system have been reduced as the raw material and controlling the existence form of nonmetal inclusions, the present invention addresses a reduction in the percent defect of wirings of semiconductor device formed by sputtering a high-purity copper target so as to ensure favorable repeatability. | 2011-07-07 |
20110163448 | SUBSTRATE HAVING A TRANSPARENT ELECTRODE AND METHOD FOR PRODUCING THE SAME - A zinc oxide transparent electroconductive oxide has been difficult to use as a substrate having a transparent electrode because the oxide, when configured as a thin film, because of increased resistivity due to air and/or moisture exposure. Though doping can inhibit increase of resistance to some extent, there has been difficulty in selecting a type and an amount of a doping substance and because doping causes high initial resistance. A substrate having a transparent electrode with stable resistivity against various environments is produced by a magnetron sputtering method using a target composed of a zinc oxide transparent electroconductive oxide containing 0.50 to 2.75% silicon dioxide by weight relative to the oxide. | 2011-07-07 |
20110163449 | SUPERFILLED METAL CONTACT VIAS FOR SEMICONDUCTOR DEVICES - In accordance with one aspect of the invention, a method is provided for fabricating a semiconductor element having a contact via. In such method, a hole can be formed in a dielectric layer to at least partially expose a region including at least one of semiconductor or conductive material. A seed layer can be deposited over a major surface of the dielectric layer and over a surface within the hole. In one embodiment, the seed layer can include a metal selected from the group consisting of iridium, osmium, palladium, platinum, rhodium, and ruthenium. A layer consisting essentially of cobalt can be electroplated over the seed layer within the hole to form a contact via in electrically conductive communication with the region. | 2011-07-07 |
20110163450 | INTEGRATED CIRCUIT LINE WITH ELECTROMIGRATION BARRIERS - A method for fabricating an integrated circuit comprising an electromigration barrier in a line of the integrated circuit includes forming a spacer; forming a segmented line adjacent to opposing sides of the spacer, the segmented line formed from a first conductive material; removing the spacer to form an empty line break; and filling the empty line break with a second conductive material to form an electromigration barrier that isolates electromigration effects within individual segments of the segmented line. An integrated circuit comprising an electromigration barrier includes a line, the line comprising a first conductive material, the line further comprising a plurality of line segments separated by one or more electromigration barriers, wherein the one or more electromigration barriers comprise a second conductive material that isolates electromigration effects within individual segments of the line. | 2011-07-07 |
20110163451 | FILM FORMING METHOD AND PROCESSING SYSTEM - Provided is a film-forming method for performing a film-forming process on a surface of a target substrate to be processed in an evacuable processing chamber, a recessed portion being formed on the surface of the target substrate. The method includes a transition metal-containing film processing process in which a transition metal-containing film is formed by a heat treatment by using a source gas containing a transition metal; and a metal film forming process in which a metal film containing an element of the group VIII of the periodic table is formed. | 2011-07-07 |
20110163452 | SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SUBSTRATE PROCESSING APPARATUS - Provided is a semiconductor device including a metal film which can be formed with lower costs but still mange to have a necessary work function and oxidation resistance. The semiconductor device includes an insulating film disposed on a substrate; and a metal film disposed adjacent to the insulating film. The metal film includes a stacked structure of a first metal film and a second metal film. The oxidation resistance of the first metal film is greater than that of the second metal film. The second metal film has a work function greater than 4.8 eV and is different from the first metal film in material. The first metal film is disposed between the second metal film and the insulating film. | 2011-07-07 |
20110163453 | Semiconductor device and method for manufacturing the same - The present invention provides a semiconductor device having a low-k film including an interconnect layer and a highly-reliable through-substrate contact plug. The semiconductor device includes:
| 2011-07-07 |
20110163454 | ELECTROLESS PLATING A NICKLE LAYER AND A GOLD LAYER IN A SEMICONDUCTOR DEVICE - A method and resulting device for maintaining non-porous nickel layer at a nickel/passivation interface of a semiconductor device in a nickel/gold electroless plating process. The method can include determining a thickness of a gold layer of the semiconductor device; determining an electroless plating rate and plating time of the gold layer to reach the determined thickness; determining a thickness of nickel under the gold layer to maintain the non-porous nickel layer at the nickel/passivation interface at a termination of an electroless gold plating process; and following the determinations, sequentially electroless plating of each of the nickel layer and gold layer on the device layer to the determined thicknesses. | 2011-07-07 |
20110163455 | Tunnel Junction Via - A method for forming a tunnel junction (TJ) circuit, the method includes forming a bottom wiring layer; forming a plurality of TJs contacting the bottom wiring layer; forming a plurality of tunnel junction vias (TJVs) simultaneously with the formation of the plurality of TJs, the TJVs contacting the bottom wiring layer; and forming a top wiring layer contacting the plurality of TJs and the plurality of TJVs. A circuit comprising a plurality of tunnel junctions (TJs) includes a bottom wiring layer contacting the plurality of TJs, the bottom wiring layer further contacting a plurality of tunnel junction vias (TJVs), wherein the plurality of TJs and the plurality of TJVs comprise the same material; and a top wiring layer contacting the plurality of TJs and the plurality of TJVs. | 2011-07-07 |
20110163456 | ELECTRONIC DEVICE SUBSTRATE, ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE SUBSTRATE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS - An electronic device substrate includes a resin layer, a semiconductor layer disposed in a first region on the resin layer, a plurality of insulating films disposed in the first region on the resin layer, and connection terminals disposed in a second region on the resin layer, the connection terminals being used for connection to an external component to be connected. The connection terminals in plan view do not overlap with any insulating films composed of an inorganic material among the plurality of insulating films. | 2011-07-07 |
20110163457 | INTEGRATED CIRCUIT MICRO-MODULE - One aspect of the present invention relates to an integrated circuit package that includes multiple layers of a planarizing, photo-imageable epoxy that are formed over a substrate. In some designs, the substrate is a silicon wafer. An integrated circuit is embedded in the epoxy. An antenna, which is electrically coupled to the active face of the integrated circuit through an interconnect layer, is formed over one of the epoxy layers. In various embodiments, at least some of the epoxy layers are positioned between the substrate and the antenna such that there is a distance of at least approximately 100 microns between the substrate and the antenna. | 2011-07-07 |
20110163458 | Method for manufacturing electronic device and electronic device - An electronic device is disclosed which can suppress the formation of voids in a region below an overhanging portion of a first semiconductor device overhanging a support member. The support member is disposed over a package substrate. The first semiconductor device is disposed over the support member and, when seen in plan, at least a part of the first semiconductor device overhangs the support member. A first resin layer fills up a space below the first semiconductor device in at least a part of the overhanging portion of the first semiconductor device around the support member. The first resin layer is in contact with the support member. A second resin layer seals the first semiconductor device and the support member. | 2011-07-07 |
20110163459 | METHOD FOR MANUFACTURING A STACKED SEMICONDUCTOR PACKAGE, AND STACKED SEMICONDUCTOR PACKAGE - A method for manufacturing a stacked semiconductor package where a plurality of semiconductor chips are stacked on a substrate, including: forming insulating layers at portions of a wafer corresponding to sides of the plurality of semiconductor chips when the plurality of semiconductor chips are in the wafer; processing the wafer so as to obtain the plurality of semiconductor chips; subsequently stacking the plurality of semiconductor chips on the substrate such that the insulating layers formed at the sides of the plurality of semiconductor chips are respectively positioned at the same side as one another; and forming a wiring over the insulating layers formed at the sides of the plurality of semiconductor chips so that the plurality of semiconductor chips are electrically connected with one another and one or more of the plurality of semiconductor chips are electrically connected with the substrate. | 2011-07-07 |
20110163460 | Thermally Conductive Silicone Composition And Semiconductor Device - A thermally conductive silicone composition comprises (A) an organopolysiloxane having a viscosity equal to or greater than 100 mPa·s at 25° C.; (B) aluminum powder having an average size of particles ranging from 0.1 to 100 μm; (C) zinc oxide powder having an average size of particles ranging from 0.05 to 50 μm; (D) (i) an organopolysiloxane containing univalent hydrocarbon groups which have unsaturated aliphatic bonds, (ii) an organopolysiloxane containing hydrocarbon groups which are free of unsaturated aliphatic bonds, or a mixture of constituents (i) and (ii); and (E) a silane compound or a product of partial hydrolyzation and condensation of said silane compound. The composition has high conductivity and excellent handleability. | 2011-07-07 |
20110163461 | ELECTRONIC PACKAGING - Provided is an epoxy resin composition comprising: (A) an epoxy compound represented by the general formula (1): wherein R | 2011-07-07 |
20110163462 | Universal Infrastructure for Chemical Processes - The invention relates to a plant for carrying out chemical processes comprising at least means for directly carrying out the conversion in the form of means for developing products and/or in the form of at least one reactor for the continuous industrial manufacture of products, devices for receiving and/or providing starting materials and/or products and devices for controlling the conversion, which are combined to a single integrated and transportable functional unit serving as infrastructure, preferably in the form of a standardised transport container. | 2011-07-07 |
20110163463 | Carbon measurement in aqueous samples using oxidation at elevated temperatures and pressures - Apparatus and methods for measuring the concentrations of organic and inorganic carbon, or of other materials, in aqueous samples are described, together with related, specially adapted components and sub-assemblies and related control, operational and monitoring systems. | 2011-07-07 |
20110163464 | Natural evaporation type humidifier - A natural evaporation type humidifier including a sheet-like member provided with a water supply section to supply water to a humidifying section. Because the water supply section immersed in the water is folded up, that portion of the sheet-like member which has a large area is compact in size, and this allows the portion to be immersed in water so as to function as the water supply section. That is, although compactly formed, that portion of the sheet-like member which has the area which is relatively large can function as the water supply section, and as a result, the water supply section has high water supply performance. In contrast to the water supply section, the humidifying section has an expanded shape, so that the humidifying section has a sufficient area for evaporating the water. | 2011-07-07 |
20110163465 | METHOD OF CONSTRUCTING A THIN FILM MIRROR - Method for producing a large size mirror from a thin film, involving (a) the attachment of a thin film to a suction chamber, the edge of which has the required geometry of the mirror, and (b) the production of a controllable partial vacuum in the suction chamber so that the thin film takes on the required geometry of the mirror. The method is characterized in that the region of the mirror having the required geometry is enlarged by preshaping the thin film, prior to the attachment thereof to the suction chamber, by controlled tensioning in a closed pressurization chamber comprising two circular discs with a common axis and a thin film which is attached to the edges of the discs and the lateral sides of which are conjoined so as to form a conical surface, and by additionally tensioning the thin film by means of a mechanism for moving the discs apart along the common axis thereof. In order to facilitate and accelerate the process of forming a mirror from a thin film, the pressurization chamber together with the thin film attached thereto is placed in a thermal box in which the film is uniformly heated to an optimum temperature for deforming the film under increased pressure in the pressurization chamber. | 2011-07-07 |
20110163466 | METHOD OF MANUFACTURING LENS CASTING MOLD AND METHOD OF MANUFACTURING EYEGLASS LENS - The present invention relates to a method of manufacturing a lens casting mold in which an upper surface of a glass material being formed is formed into a shape of a molding surface for forming a surface comprising a progressive surface or a progressive element by using a continuous heating furnace. As the forming mold, a forming mold having a curvature distribution on the forming surface is utilized. In one aspect, a temperature of the continuous heating furnace is controlled so that the continuous heating furnace comprises a temperature rising region having a temperature distribution such that the temperature rises in a conveyance direction of the forming mold, and a separation distance between the forming surface of the forming mold and a lower surface of the glass material being formed is specified in two or more spots before introduction to the continuous heating furnace. The forming mold is conveyed in the temperature rising region so that a portion with the greatest separation distance among the specified separation distances is comprised in a portion on a side of the conveyance direction as divided in two by a virtual line, the virtual line running orthogonally to the conveyance direction of the forming mold and passing through a geometric center of the forming surface. In another aspect, a forming mold position control region is provided in the continuous heating furnace, a temperature is directly or indirectly measured at multiple measurement points on the forming surface in the forming mold position control region, and the forming mold is conveyed so that a portion on the forming surface of greatest curvature is present in a high temperature portion that has been determined based on the measurement result. A virtual line A passing through a geometric center and a maximum temperature point among the multiple measurement points is specified, and then a portion containing the maximum temperature point as divided in two by a virtual line B running orthogonally to the virtual line A and passing through the geometric center is determined as the high temperature portion. | 2011-07-07 |
20110163467 | INJECTION MOLDING OF PARTHAVING NONUNIFORM THICKNESS - Injection molding of a part having a nonuniform thickness is provided. One disclosed embodiment of an injection molding device includes one or more side walls, a first mold surface intersecting the side walls and being stationary with respect to the side walls, and a second mold surface intersecting the side walls so as to define with the side walls and the first mold surface a cavity configured to receive a metered amount of injected molten thermoplastic material. The second mold surface is moveable toward the first mold surface in such a manner that a first end of the second mold surface moves a larger physical travel distance toward the first mold surface than does a second end of the second mold surface during a molding process. | 2011-07-07 |
20110163468 | Device For Preparation of Liposomes and Method Thereof - Disclosed is a device for preparation of liposomes, comprises a reaction tank and an infusion unit. The reaction tank comprises a collector mounted in a predetermined position of the reaction tank; Two inlet ports are included: the first inlet port for infusing an aqueous solution; and the second inlet port for infusing an organic solution. The infusion unit can introduce a bioactive agent containing-aqueous solution into the reaction tank. The infusion unit comprises a filter connected to one end of the infusion unit and being adjacent to the collector. The method using the device comprises the steps of infusing an aqueous solution and an organic solution into the reaction tank of the device and thus forming an interface between the filter and the collector; infusing a bioactive agent containing-aqueous solution and being filtered by the filter, the bioactive agent is encapsulated to form a water-in-oil emulsion; the water-in-oil emulsion is passing through the aqueous solution and thus to form a water-in-oil-in-water double emulsion. Finally the removal of the organic phase of water-in-oil-in-water double emulsion enables the harvest a plurality of liposomes. It has advantages such that simple-used and automation production. Thus nano size or sub-micro size liposomes can be prepared with high encapsulation efficiency without sonicators or delicate microfluidic systems. | 2011-07-07 |
20110163469 | HIGH-THROUGHPUT FABRICATION OF MICROPARTICLES - The high-throughput fabrication of microparticles based on the double emulsion/solvent evaporation technique for screening and optimizing microparticle formulations for particular characteristics allows for the preparation of multiple microparticle formulations in parallel. The system involves the formation of an emulsion containing aqueous bubbles with the payload in an organic phase containing the polymer or polymer blend being used for the microparticles. This first emulsion is then transferred to a larger aqueous phase, and a second waterin-oil-in water emulsion is formed. The organic solvent is then removed, and the resulting particles are optionally washed and/or freeze dried. The resulting microparticles are similar or better than microparticles prepared using the traditional one formulation at a time approach. The high-throughput fabrication of microparticles is particularly useful in optimizing microparticles formulations for drug delivery. | 2011-07-07 |
20110163470 | SYSTEM FOR CREATING A DATA RECORD DESCRIBING A DENTAL PROSTHESIS PART, SYSTEM FOR THE PRODUCTION OF A DENTAL PROSTHESIS PART, METHOD AND DATA RECORD - A system for creating a data record describing a dental prosthesis part, wherein the system comprises means with which a data record can be created, comprising: Entries regarding a plurality of elements that describe the surface or the shape of a dental prosthesis part, wherein for each entry one, two or more attributes are listed. The invention further relates to a corresponding system for producing a dental prosthesis part with a data record, corresponding methods and a corresponding data record. | 2011-07-07 |
20110163471 | IMAGE FORMING APPARATUS, DRIVING DEVICE AND DRIVING FRAME THEREOF - An image forming apparatus includes driving device frame having a base plate on which is formed integrally with the base plate one or more supporting shafts for supporting one or more power transmission members that transmit driving power from a driving source to driven bodies of the image forming apparatus. | 2011-07-07 |
20110163472 | FOAMED SOL-GEL AND METHOD OF MANUFACTURING THE SAME - A process for making foamed glasses and ceramics from sol-gels is disclosed. The method includes preparing a mixture of reactants capable of forming a sol-gel with addition of a catalyst to control the condensation stage followed by foaming using vigorous agitation in the presence of surfactants. The gelled bodies are aged, dried, and thermally stabilized to obtain a consolidated macroporous material. The resulting structure comprises a three-dimensional network of spherical open pores that are thoroughly interconnected. The process may involve sol-gel systems using a mixture of metal alkoxides, and may produce glasses in unary systems (SiO | 2011-07-07 |
20110163473 | COMPARTMENTALIZED PELLET FOR IMPROVED CONTAMINANT REMOVAL - This invention is to an improved method for cleaning contaminated polymer when that polymer is to be blended with clean material. The method involves combining the contaminated material and the clean material in a compartmentalized pellet wherein the contaminated material is placed in the outermost compartment, the clean material is placed in an inner compartment and then subjecting the pellet to an extraction process. | 2011-07-07 |
20110163474 | DIVINYLARENE DIOXIDE FORMULATIONS FOR VACUUM RESIN INFUSION MOLDING - A resin formulation for use in a vacuum resin infusion molding process, said formulation comprising (a) a divinylarene dioxide, and (b) a polyaminoether; wherein the polyaminoether does not have pendent hydroxyl groups; and wherein the resin formulation may have a low viscosity of less than about 400 mPa-s. | 2011-07-07 |
20110163475 | METHOD FOR PRODUCING ROOFING TILES AND DEVICE FOR PRODUCING SAID ROOFING TILES - The invention relates to a method for producing roofing tiles by means of a core shooting device. A core box comprises a mold carrier in the interior thereof. Fresh concrete is introduced into the core box through an injection opening. The core box is ventilated by means of at least one screen nozzle disposed on the mold carrier. The roofing tile produced in the core box is removed from the core box and fed into a cutting device, where protruding burrs of the roofing tile are removed. | 2011-07-07 |
20110163476 | Diaphragm with Segmented Insert - A flush valve diaphragm of a flush valve includes a body having a segmented insert within a flexible body portion and a central passageway. The body further includes a peripheral sealing portion with the flexible body portion within the peripheral sealing portion. The peripheral sealing portion can include an integral filter, an exit chamber and a bypass arrangement, such that water flowing through the filter flows through the bypass arrangement. The integral filter version will retard clogging of the bypass arrangement. The segmented insert includes a plurality of trapezoidal members with outward protrusions. The plurality of trapezoidal members are connected to each other on their outermost edge by a runner. | 2011-07-07 |
20110163477 | IMPRINT LITHOGRAPHIC APPARATUS AND IMPRINT LITHOGRAPHIC METHOD - An imprint lithography apparatus includes an actuator configured to displace an imprint template holder relative to a substrate holder to perform an imprint process. The imprint template holder and/or the substrate holder being supported on a support structure, the support structure being mounted to a vibration isolation system that is mounted to a base of the apparatus. The vibration isolation system is configured to provide a vibration isolation of the support structure relative to the base. A control unit is configured to control the actuator during the imprint process. The control unit is arranged to control an adjustable member of the vibration isolation system to adjust a dynamical characteristic of the vibration isolation system during at least part of the imprint process so as to reduce a displacement of the support structure relative to the base due to a force exerted on the support structure during the imprint process. | 2011-07-07 |
20110163478 | Porous Membrane and Recording Media Comprising Same - The present invention relates to a porous membrane obtainable by polymerizing a curable composition comprising at least one type of curable compound, water and at least one type of chain transfer agent having a chain transfer constant of more than 0.1 with styrene, methyl methacrylate, methyl acrylate, ethyl acrylate, butyl acrylate or acrylonitrile. The invention further relates to image recording materials, in which these membranes are used. | 2011-07-07 |
20110163479 | METHOD OF MOLDING A MICRONEEDLE - A method of molding a microneedle using a mold apparatus that includes the use of high frequency acoustic energy, such as ultrasonic energy. | 2011-07-07 |
20110163480 | METHOD AND MOLD FOR THE PRODUCTION OF PARTS FROM FIBER-REINFORCED COMPOSITE MATERIAL BY MEANS OF MICROWAVES - Disclosed herein is a method for producing a part comprising at least one layer of fiber-reinforced composite material. Said method encompasses at least the following steps: a) the at least one layer of polymerizable fiber-reinforced composite material is arranged in a shape that has a base and a plurality of elevations; b) at least one mold is placed so as to be in contact with at least one elevation, said mold having a microwave-sensitive material at least on one contact surface towards the at least one elevation; c) the at least one elevation is polymerized by irradiating the at least one mold with microwaves. The mold used has a stable three-dimensional shape and has a contact surface for the part. At least the contact surface is made of microwave-sensitive material. | 2011-07-07 |
20110163481 | RESIN FORMING METHOD AND RESIN FORMING APPARATUS - The present invention presents a resin forming method and a resin forming apparatus | 2011-07-07 |
20110163482 | PHOTO-CURABLE COMPOSITION HAVING INHERENTLY EXCELLENT RELEASING PROPERTY AND PATTERN TRANSFER PROPERTY, METHOD FOR TRANSFERRING PATTERN USINGTHE COMPOSITION AND LIGHT RECORDING MEDIUM HAVING POLYMER PATTERN LAYER PRODUCED USING THE COMPOSITION - A method of forming a patterned polymer layer on a substrate is provided. The method of forming a patterned polymer layer on a substrate includes forming a coating of a photo-curable composition on a substrate, imprinting the coating by embedding a stamper having a predetermined pattern in the photo-curable composition, irradiating the coating with light to cure the photo-curable composition, while the stamper is embedded in the coating, and separating the stamper from the coating on the substrate. | 2011-07-07 |
20110163483 | Method for Molding and Sealing a Hollow Plastic Tank - A method for manufacturing a hollow parison includes forming a parison having a wall of multiple layers of polymer including a barrier layer, and open ends, each end having an end surface extending around the periphery of the respective end. A mold is formed having a first section and a second section facing the first section, the mold forming a cavity between the two mold sections when the mold is closed, and defining surfaces to which the parison conforms when the mold is closed. The mold sections are closed on the parison such that in the mold at each end of the parison a first portion of each end surface is compressed against a second portion of the respective end surface. The mold sections are further closed on the parison such the barrier layer of the first portion and second portion of the end surface at each parison end are joined and welded mutually along a seal line. Then the mold is opened and a hollow, formed tank is removed from the mold. | 2011-07-07 |
20110163484 | Transport Cases with Hinged Side Parts Made of Plastic - A transport case | 2011-07-07 |
20110163485 | FORMING APPARATUS AND METHOD USING WATER PRESSURE OR VAPOR PRESSURE - Provided is a forming method comprising fixing an object in a mold of a forming apparatus comprising a water pressure or vapor pressure generator and the mold communicated with the water pressure or vapor pressure generator; generating water pressure or vapor pressure using the water pressure or vapor pressure generator and then injecting the water pressure or vapor pressure into the mold; and forming the object fixed in the mold using pressure generated by the water pressure or vapor pressure, and a forming apparatus used in the same. According to the present invention, it is possible to form an under-cut portion and other fine shapes which could not be formed by a conventional forming method and also it is possible to solve the problems such as the thickness variation and the whitening phenomenon after the forming process. | 2011-07-07 |
20110163486 | ROTARY DEGASSERS AND COMPONENTS THEREFOR - Disclosed are degassers, couplings, impeller shafts and impellers for use in molten metal. One such coupling transfers gas into an impeller shaft, the coupling having a smooth, tapered internal surface to align with a corresponding surface on the impeller shaft and help prevent gas leakage and to assist in preventing damage to the impeller shaft. Improved impellers for shearing and mixing gas are also disclosed, as is a degasser including one or more of these components. | 2011-07-07 |
20110163487 | LINEAR FILAMENT COMPRESSION AND TORSION SPRING - A spring including a wire having an elasticity by which the wire is compressible by an external force to a first position at which first and second ends thereof of are separated by a first distance and when the force is removed or an electrical current applied, the wire is extensible in response to an internal spring force to a second position at which the wire is substantially straight. A spring assembly is disclosed including a plurality of inventive wires cross-coupled with a support structure consisting of a plurality of coaxial rings. In the assembly, the wires extend parallel to an axis through a center of the rings. | 2011-07-07 |
20110163488 | MACHINE TOOL - A machine tool includes: a hydraulic pump that supplies pressure oil; a fixture plate that positions a workpiece; a fixture base that detachably holds the fixture plate and that moves relative to a tool during machining; a hydraulic cylinder performs an attaching/removing operation for attaching or removing the fixture plate to or from the fixture base; an accumulator that accumulates the pressure oil from the hydraulic pump and that supplies the pressure oil to the hydraulic cylinder; and a manual valve that is manually switched to supply the pressure oil in the accumulator to the hydraulic cylinder to thereby control the attaching/removing operation of the hydraulic cylinder. | 2011-07-07 |
20110163489 | GRIPPING AND RELEASING MECHANISM OF BLANK PIPES IN A MOULD FOR EXPANDING SAID BLANK PIPES-PRIOR TO THEIR MOLECULAR ORIENTATION - This mechanism offers a simple solution wherein an axial movement of a grooved piece ( | 2011-07-07 |
20110163490 | POSITIONER - A positioner includes a housing, a table, a drive portion, a cylinder, a first winder, and a first cord. The cylinder includes a first opening at the rotation center of the table, and a second opening opposite and connected to the first opening. The first winder is disposed outside the second opening of the cylinder. The first cord includes a first lead-out portion and a first wound portion. The first lead-out portion enters the second opening, passes through the cylinder, and is led out from the table. The first wound portion is wound around the first winder according to the rotation of the table. Thus, the positioner can increase the number of air tubes or wires led out onto the table without increasing its size. | 2011-07-07 |
20110163491 | SHEET FEEDING APPARATUS AND IMAGE FORMING SYSTEM - A high productivity sheet feeding apparatus in which there is no occurrence of abnormalities related to sheet feeding irrespective of the size and type of sheet, and an image forming system having that sheet feeding apparatus are provided. This sheet feeding apparatus has the feature that it has, a stacking unit for stacking sheets, a conveying unit that is placed above and spaced from said stacking unit and that conveys the sheets, a flotation unit that makes the sheets in the upper part of the sheets stacked in said stacking unit float up towards said conveying unit, and a suction unit that sucks the air included in between the plurality of sheets that have been made to float up towards said conveying unit by said flotation unit. | 2011-07-07 |
20110163492 | SHEET FEEDING APPARATUS AND IMAGE FORMING SYSTEM - A sheet feeding apparatus, having: a sheet stacking table to stack sheets; a sheet feeding device to feed the sheets one by one from an upper most section of the sheets stacked on the sheet stacking table; an assist air blower device to blow an assist air at a lateral side, a front side or a rear side of the sheet fed from the sheet stacking table so as to assist sheet feeding; a detecting device to detect a behavior of the sheet assisted by the assist air; and a control device to set an amount of the assist air used in image forming to be an optimum air amount based on a detected result which is obtained by detecting the behavior of the sheet when the assist air blower device is operated at a predetermined timing while image forming is not carried out. | 2011-07-07 |
20110163493 | MEDIA SEPARATOR AND METHOD - To provide a media separator including a lumped-media conveyer mechanism which receives lumped media to convey the lumped media in a predetermined direction, and a picker roller which separates the lumped media conveyed by the lumped-media conveyer mechanism, the lumped-media conveyer mechanism including an auxiliary conveyer body for conveying the lumped media to the picker roller. That makes it possible to reliably separate and send out the lumped media, when having shorter media mixed, and to achieve downsizing of the media separator. | 2011-07-07 |
20110163494 | Device For Horizontally Rotating Flat Articles Supplied Along A Transport Line - The device ( | 2011-07-07 |
20110163495 | Sheet Adjusting Device, sheet holding receptacle, image forming mechanism, and image reading mechanism - A sheet adjusting device applicable to a sheet holding receptacle, an image forming mechanism, and an image reading mechanism includes a sheet setting plate to place a sheet thereon; first and second regulating member to slidably move in a given direction, and a friction-reducing unit disposed on the sheet setting plate to reduce a frictional force on an underside of the sheet. Alternatively, a sheet adjusting device includes a sheet setting plate, a sheet contact face disposed downstream of the sheet setting plate to cause the leading edge of the sheet abuts against the sheet contact face, first and second regulating member, and a friction-reducing unit disposed on the sheet contact face to reduce a frictional force on the sheet contact face and the leading edge of the sheet. | 2011-07-07 |
20110163496 | Sheet adjusting device, sheet holding receptacle incorporating same, and image forming apparatus incorporating same - A sheet adjusting device, applicable to a sheet holding receptacle and an image forming apparatus, includes a sheet setting plate to place a sheet thereon, first and second regulating member to slidably move in a given direction, and a drive transmission unit to transmit a driving power generated by a driving power source to at least the first regulating member and move the first regulating member in the given direction and to include a torque limiting unit to stop the first regulating member moving on the sheet setting plate by cutting off transmission of the driving power between a driven side transmission roller unit of the torque limiting unit and a driving side transmission roller unit of the torque limiting unit when a torque exceeding a given threshold is applied to the driven side transmission roller unit. | 2011-07-07 |
20110163497 | Three Dimensional Random Number Generator - A method and apparatus for generating three dimensional random numbers using three separate number generators for the x-axis, the y-axis, and the z-axis. The present invention aims to further randomize number generation making use of the human intuitive sense. The number generators for each axis are the same apparatus. The random number generator apparatus makes use of disks that rotate at different rates with digits that are evenly distributed in a radial fashion. A reading sensor scans digits at certain positioned when a user intuitively triggers for a scan. | 2011-07-07 |
20110163498 | WALL-MOUNTABLE GAME DEVICE - A game device having a top panel, a bottom panel, a left panel, a right panel, and a back panel. The top panel is disposed laterally between the left panel and the right panel, with the top panel oriented substantially perpendicular to the left and right panels. The back panel is disposed. transversely between the left and right panels. The bottom panel is disposed laterally between the left and right panels. The front edge of the bottom panel terminates at the front edge of the top panel, and the back edge of the bottom panel terminates at the bottom edge of the back panel. The top panel has one or more apertures adapted to removably retain one or more cups. A cup support panel may be located below and oriented parallel with the top panel. The game device is adapted to be secured to a rigid structure, such as a wall, by hooks, hangers, or the like. | 2011-07-07 |
20110163499 | BOARD GAME FOR STIMULATING INFANTS - A board game for stimulating infants and for use by two or more players or teams for use with an infant as an active part of the board game. The game board sized to allow an infant to be placed thereon, having score/progress/position indicia thereon and two or more score markers for placement at or on the indicia to indicate the position/progress/score of each player/team. In one form, the game also includes a ball-like element to be placed upon the infant so that when the players/teams vie for the attention of the infant and get the infant to turn in their direction, the ball-like element rolls or slides off the infant toward the player(s) to earn a point or advancement. Preferably, the game board is covered in a soft fabric, similar to a baby blanket, and is sized similarly to a baby blanket or larger. In another preferred form the ball-like element is replaced with a die-like element to be placed upon the infant so that when the players/teams vie for the attention of the infant and get the infant to turn in their direction, the die-like element rolls or slides off the infant toward the player(s) to earn a point or advancement. The die has six sides, with indicia on the sides of the die matching up with positions on the game board. In one form, the indicia are letters and the positions on the game board have matching letters so that when the infant “rolls” the die, the die indicates indicia representing a position on the game board and the player can advance to that position. | 2011-07-07 |
20110163500 | Multi-Leveled Information Displaying Device with Labeled Path - A multi-leveled information displaying device with labeled path comprises the base layer, the base layer comprises at least one area for putting the additional layer and several information showing area; and at least a Nth additional layer, which comprises several information showing areas, wherein N is an integer more than or equal to 1, and N is a natural number, when N equals to 1, the Nth additional layer is set at the top of the base layer; when N is larger than 1, the Nth additional layer is set at the top of the (N−1)th additional layer. | 2011-07-07 |
20110163502 | HAND HELD PRODUCT FOR PLAYING A GAME - A hand-held product for playing a game is disclosed. The hand-held game includes a basketball goal assembly and a ring coupled to the basketball goal assembly that can be attached to the finger, wrist, arm, or other body parts or limbs of a user. The basketball goal assembly includes a backboard and a rim. The rim can be foldable. In one embodiment, the ring is adjustable to fit different sized fingers, wrists, arms, or other body parts. The adjustable ring can be an adjustable band with adjusters at ends of the band. The ring is coupled to the basketball goal assembly using at least one of an adhesive, tape, a snap-on clip, a press fit mechanism, a mounting bracket, welding and molding. The hand-held game can come in a variety of sizes, shapes, and colors. | 2011-07-07 |
20110163503 | Reactive Target shooting system - This invention was created to add a unique reactive visual display to the sport of casual target shooting. It is designed to create an explosive effect, using common and inexpensive media, and without introducing a fire danger. It can also be used to launch balls and other small objects. Physically, this invention is comprised of a metal frame, a hub and axle, and pivoting arms. Conceptually, this invention captures and diverts a portion of the substantial kinetic energy imparted to a bullet when fired, and, using simple leverage, redirects the energy to produce a spectacular visual effect, all without relying on any form of external electrical or battery power source. | 2011-07-07 |
20110163504 | TRAVELING TARGET - A reactive target for firearms is disclosed. The target may include a center, four legs, and four heads. Each of the four legs may comprise an exterior end and radially extending from proximate the center to the exterior end. Each of the four heads may connect to the exterior end of a different leg of the four legs. Each of the four heads may also provide at least one target surface withstanding, without degradation, multiple impacts from firearm-fired projectiles. When an appropriate head is hit by a projectile, the target may roll a discrete, incremental distance on a supporting surface. | 2011-07-07 |
20110163505 | Adverse Pressure Gradient Seal Mechanism - An adverse pressure gradient seal mechanism for use with variable speed components. The adverse pressure gradient seal mechanism may include a number of labyrinth teeth positioned on a component and an adverse pressure gradient seal positioned between a pair of the labyrinth teeth. The adverse pressure gradient seal may include a number of strips with each of the strips having an angled end. | 2011-07-07 |
20110163506 | Turbine Seal Plate Assembly - A seal plate assembly for use with a rotor wheel assembly of a turbine engine. The seal plate assembly may include a seal plate positioned about a rim of a rotor wheel. The seal plate may include a number of seal plate segments and a number of locking pins extending through the seal plate segments and into the rim of the rotor wheel. | 2011-07-07 |
20110163507 | Shaft Seal with Lubrication Device - A shaft seal assembly for use with a reciprocating or rotating shaft includes a shaft seal, a lubricant-storing ring, and a retainer. The retainer and ring can be formed as a subassembly and then combined with a shaft seal. The seal includes an annular body portion, a first sealing lip portion, and a first pocket portion. The first sealing lip portion has a substantially uniform axial dimension and is adapted to sealingly engage a shaft. The first pocket portion includes a plurality of pockets, each having an opening toward the first sealing lip portion. The plurality of pockets are each adapted to collect a working fluid when the shaft axially displaces in a first direction and to dispense the working fluid when the shaft axially displaces in a second direction. The assembly provides a lubricated shaft and seal that improves the effective life of the shaft seal. | 2011-07-07 |
20110163508 | GASKET FOR CYLINDER HEAD - A gasket for arrangement between a cylinder block and cylinder head of an internal combustion engine. The gasket includes a lubricant hole through which lubricant is supplied to the cylinder head. A high pressure bead extends around the lubricant hole. A low pressure bead is extends around the high pressure bead and at least partially extends around a hollow portion, which is in communication with a lubricant reservoir of the engine, when the gasket is arranged between the cylinder block and the cylinder head. | 2011-07-07 |
20110163509 | AMORPHOUS ALLOY SEAL - Provided in one embodiment is an article, comprising a first part having a first surface and a hermetic seal disposed over a portion of the first surface, wherein the hermetic seal comprises a composition that is at least partially amorphous. | 2011-07-07 |
20110163510 | Edging Seal Profile - Edging seal profile for kitchen worktops and the like, which is equipped with a top layer. The edging seal profile comprises a hollow chamber profile, which is enclosed by one front wall leg and two substantially parallel limiting legs deployed at a distance from each other, and which can be filled with a plate element or with an insulation mass, wherein the limiting legs are connected with the front wall leg projecting at right angle, and its upper limiting leg forms on its upper side a supporting surface for the top layer, which is connected with the front wall leg. | 2011-07-07 |
20110163511 | Operational Methods For A Road-Building Machine - A method of operating a road-building machine involves a machine having a chassis with four ground engaging supports and four working cylinders connecting the ground engaging supports to the chassis. A height of the left front and right rear ground engaging supports is adjusted in a first direction. The height of the right front and left rear ground engaging supports is adjusted in a second direction opposite the first direction. | 2011-07-07 |
20110163512 | STEERING TIE ROD END MADE OF STEEL AND METHOD OF MANUFACTURING THE SAME - A steel tie rod end includes a shaft portion and first and second fitting portions. A minimum area portion having a small radially cross-sectional area is provided for the shaft portion, and 90% or above of a steel structure of the minimum area portion is formed of martensite or tempered martensite. The surface hardness of the minimum area portion and the average hardness of the radial cross section of the minimum area portion are 600 Hv or below, and the average hardness of the radial cross section of the first fitting portion and the average hardness of the radial cross section of the second fitting portion are 300 Hv or below. A method of manufacturing a steel tie rod end includes a quenching process of heating only a prospective shaft portion by high frequency to an austenitizing temperature and then rapidly cooling the prospective shaft portion by water or cooling medium. | 2011-07-07 |
20110163513 | Longitudinal link for an auxiliary frame, particularly for motor vehicles - The invention relates to an auxiliary frame ( | 2011-07-07 |
20110163514 | TOP MOUNT TRAILING ARM SUSPENSION - A trailing arm suspension includes a trailing arm body having an axle mount portion that is attached to an axle wrap. The axle wrap includes at least one internal weld window to secure the axle wrap to an axle. In one example, the internal weld window is positioned within an internal cavity defined by the trailing arm body and axle wrap includes an external weld window located external of the trailing arm body. In one example, the trailing arm suspension includes a reinforcement bracket that is attached to both the trailing arm body and the axle wrap. In one example, a spring pedestal includes a support plate at one end of trailing arm body and a side wall portion that extends downwardly from the support plate to be attached to the axle wrap. In one example, the axle wrap includes a weld window having a V-shaped lower edge surface. | 2011-07-07 |
20110163515 | SUSPENSION BICYCLE SEAT POST - A bicycle seat post assembly that dampens movement between a seat and a bicycle frame. The seat post assembly includes a seat post, a collar that passes through the seat post, and a dampener that is disposed between the collar and the seat post. The collar is pivotably connected to the seat post so that the collar can rotate relative to the seat post. The collar rotates about an axis that extends in a crossing direction relative to both a longitudinal axis of the bicycle frame and a longitudinal axis of the seat post. | 2011-07-07 |
20110163516 | FLYWHEEL ASSEMBLIES AND VEHICLES INCLUDING SAME - A vehicle includes a frame, an engine, a steering assembly, a steerable wheel, a brake system, a flywheel assembly, and a controller. The frame defines a roll axis. The engine is supported by the frame. The steering assembly is pivotally coupled with the frame and is pivotable about a steering axis. The steerable wheel is rotatably coupled with the steering assembly. The flywheel assembly comprises at least one inertial mass and is coupled with the frame. A controller is coupled with the flywheel assembly and is configured to facilitate rotation of said at least one inertial mass. | 2011-07-07 |
20110163517 | MOBILE BARRIER - In one embodiment, a safety trailer has semi-tractor hitches at both ends and a safety wall that is fixed to one side of the trailer. That side, however, can be changed to the right or left side of the road, depending on the end to which the truck attaches. A caboose can be attached at the end of the trailer opposite the tractor to provide additional lighting and impact protection. Optionally, the trailer can be equipped with overhead protection, lighting, ventilation, onboard hydraulics, compressors, generators and other equipment, as well as related fuel, water, storage and restroom facilities and other amenities. | 2011-07-07 |
20110163518 | ASSEMBLY OF SEAT UNIT AND CHILD STROLLER - A seat unit and child stroller assembly includes a stroller having a frame, a seat and a safety device connected to the frame for preventing a child seated on the seat from falling off; a seat unit including a seat frame, a connecting means and an operating means mounted on the seat frame, the connecting means comprising a first locking member for locking the seat frame into the safety device and a second locking member for locking the seat frame into any device except the stroller, the first locking member being shiftable between a locking status during which the seat unit and the safety device are interconnected, and an unlocking status during which the seat unit can be removed from the stroller; wherein, the operating means is set to control the first locking member only, making the first locking member shift from locking status to unlocking status. | 2011-07-07 |
20110163519 | Stroller - A stroller includes a stroller frame having two opposite side frames, two first connecting devices disposed respectively on the two side frames of the stroller frame, a first removable seat including a seat body and two second connecting devices disposed respectively on two sides of the seat body of the first removable seat, a second removable seat including a seat body, and two third connecting devices disposed respectively on two sides of the seat body of the second removable seat. The first connecting devices are selectively and respectively connected with the second connecting devices or the third connecting devices so as to selectively mount the first removable seat or the second removable seat to the stroller frame. | 2011-07-07 |
20110163520 | STROLLER LINER WITH TOY ATTACHMENT SYSTEM - A stroller liner includes a flexible body configured to nest in the seat portion of a stroller, a track at least partially embedded in a portion of the stroller liner, and a clip slidingly engaged with the track, the clip defining an opening for attaching an item to the stroller liner. An item such as a toy, teething ring, pacifier, or other item may be attached. The body may be padded, and may define one or more openings positioned to receive portions of a seat belt of the stroller through the body when the stroller liner is nested in the seat portion of the stroller, to secure a child in the stroller. | 2011-07-07 |
20110163521 | INFLATABLE AIRBAG ASSEMBLY WITH AN INFLATOR BRACKET - Inflatable curtain airbags can be attached to an inflator at a throat portion of the airbag. The attachment of the inflator to the throat portion may be mediated by an inflator mounting bracket. An extended portion of the inflator mounting bracket can protrude through an aperture in the throat portion to provide an anti-rotation function as well as a retention function. | 2011-07-07 |
20110163522 | AIRBAG MODULE WITH AN AIRBAG AND A TUBULAR GAS GENERATOR THAT CAN BE FASTENED TO A MODULE HOUSING - An airbag module with an airbag and a tubular gas generator fastened to a module housing is provided. Said tubular gas generator having gas outlet openings along the periphery thereof and can be fastened to the module housing by means of only a clamping ring that is movable over the tubular gas generator and over a section of the module housing. The clamping ring has in axial direction elongated sections being separated from each other and continuing axial in the opposite direction. The module housing has in its bottom an opening for inserting the tubular gas generator, wherein on the module housing below this opening a support for the tubular gas generator is provided. The clamping ring is designed such that said clamping ring reaches below the support after positioning the tubular gas generator with the elongated section by axial moving in direction of the centre of the tubular gas generator. | 2011-07-07 |
20110163523 | TRAILER SUPPORT APPARATUS AND METHODS - Adjustable trailer supports and method for propping up a trailer with adjustable trailer supports, the adjustable trailer supports including a body element configured to couple to the front end of the trailer, a leg for supporting the trailer, the leg including a pivot element having a proximal end pivotably coupled to the body element and a distal end, and an extension element slidably coupled to the distal end of the pivot element, wherein the leg is configured to pivot between a stowed position and a support position. In some examples, the leg includes a pivot element and does not include an extension element. | 2011-07-07 |
20110163524 | STEERING APPARATUS - A steering apparatus having a stationary bracket fixed to a vehicle body including a pair of first side plates; a receiving portion provided on the steering column for receiving one end of a conductive member; a pair of second side plates; a conductive cylindrical shaft secured between the pair of first side plates and inserted through the pair of the second side plates; and a plate-shaped conductive member interposed between the receiving portion and an outer peripheral surface of the cylindrical shaft. The conductive member includes first and second bow springs that fit the cylindrical shaft resiliently. The first bow spring is interposed between the second bow spring and the receiving portion, a first contact portion of the second contact portion of the first bow spring is pressed to the receiving portion. | 2011-07-07 |