06th week of 2017 patent applcation highlights part 71 |
Patent application number | Title | Published |
20170041995 | LED LUMINAIRE DRIVING CIRCUIT AND METHOD - A flyback converter is provided with a first output associated with a first secondary winding, a primary side controller arranged to maintain the first output at a predetermined voltage level and a second output associated with a second secondary windings; an LED controller. A first secondary electronically controlled switch is responsive to the LED controller; a first LED luminaire arranged to provide a first illumination responsive to a power signal on the second output when the first secondary electronically controlled switch is in a closed state and not provide the first illumination when the first secondary electronically controlled switch is in the open state, wherein the turns ratio of the first secondary winding and the second secondary winding is such that power is delivered to the first output via the first unidirectional electronic valve only when the first secondary electronically controlled switch is switched to the open state. | 2017-02-09 |
20170041996 | LOAD CONTROL DEVICE FOR A LIGHT-EMITTING DIODE LIGHT SOURCE - A load control device for controlling the intensity of a lighting load, such as a light-emitting diode (LED) light source, may include a power converter circuit operable to receive a rectified AC voltage and to generate a DC bus voltage, a load regulation circuit operable to receive the bus voltage and to control the magnitude of a load current conducted through the lighting load, and a control circuit operatively coupled to the load regulation circuit for pulse width modulating or pulse frequency modulating the load current to control the intensity of the lighting load to a target intensity. The control circuit may control the intensity of the lighting load by pulse width modulating the load current when the target intensity is above a predetermined threshold and control the intensity of the lighting load by pulse frequency modulating the load current when the target intensity is below the predetermined threshold. | 2017-02-09 |
20170041997 | Light Emitting Diode Illumination Combination Kit - A light emitting diode (LED) illumination combination kit includes one or a plurality of modular illumination units and a power supply device which supplies power to the LED illumination combination kit. Each of the modular illumination units includes a plurality of LED element luminous spots and an electronic component for voltage regulation serially connected to the LED element luminous spots. The modular illumination units are installed on a flexible plastic bottom plate or packaged in a flexible plastic outer case. When the plurality of modular illumination units are included in the LED illumination combination kit, illumination unit modules are parallelly connected into a long strip. Each of the LED element luminous spots is a monochromatic light luminous spot or a polychromatic light luminous spot. | 2017-02-09 |
20170041998 | SYSTEMS AND METHODS OF LED COLOR OVERLAP - The disclosed systems and methods emphasize driving LEDs in series and in parallel with the same LED driver chip and a single inductor. For creating overlap, the systems and methods of LED color overlap disclosed herein take advantage of the fact that green and blue LEDs have the same voltage. Thus, green and blue LEDs can be driven in parallel as needed. LED suppliers can screen parts for sufficiently close voltage matching between green and blue LEDs. This is especially true when using green LED die based on a blue die with a green phosphor. Cyan may be produced by driving a green LED and a blue LED in parallel. White may produced by driving a green LED and a blue LED in parallel and a red LED in series with this green and blue parallel pair. | 2017-02-09 |
20170041999 | SYSTEMS AND METHODS FOR SELECTION OF DISPLAY MODE USING A SINGLE BUTTON LIGHTING MODULE - A method for a user to select the color displayed by a multicolor LED device comprises a timed sequence display of color choices and sensing of a corresponding selection by user input. | 2017-02-09 |
20170042000 | CLOUD-BASED MULTI-CHANNEL STAGE LIGHT ADJUSTMENT SYSTEM TECHNICAL FIELD - The cloud-based multi-channel stage light adjustment system of the present patent application includes a cloud-based control center, an encoding and modulation unit, a ZIGBEE transceiving unit, a proximal end lighting regulation unit and the stage lighting sets. The cloud-based control center further comprises an interference reduce and light adjustment unit, a scenario generation unit and an instruction switching unit, achieves a multi-channel control of stage light adjustment, greatly reduces the interference with other stage systems, while adopts the multi-point transceiving model which is based on ZIGBEE to improve the transmission efficiency of regulation. | 2017-02-09 |
20170042001 | METHODS, SYSTEMS, AND APPARATUS FOR INTELLIGENT LIGHTING - An ambient light sensor measures an ambient light level at one point in an illuminated environment, such as a warehouse, office, shop, cold-storage facility, or industrial facility, and provides an indication of the measured ambient light level to a processor. The processor maps the measured ambient light level to an estimated ambient light level at a different point in the illuminated environment from the measured ambient light level (e.g., a “task height” about three feet from a warehouse floor). The processor may determine the difference between the estimated ambient light level and a desired light level at the task height, and may change the artificial illumination provided by a light fixture to make the actual ambient light level at task height match the desired light level at the task height. | 2017-02-09 |
20170042002 | LED DISPLAY APPARATUS - An LED display apparatus includes a first LED display including a first LED, a second LED display including a second LED, and a luminance corrector. The luminance corrector corrects a luminance of the first LED in accordance with a first cumulative lighting period of the first LED and with both luminance transitions and a second cumulative lighting period of the second LED. | 2017-02-09 |
20170042003 | INTELLIGENT LIGHTING AND SENSOR SYSTEM AND METHOD OF IMPLEMENTATION - An intelligent lighting and sensor system is disclosed that includes a processor, a memory arranged to store program logic software, the program logic software executable by the processor, a light control module in communication with at least one light source in which the operation of the light control module is directed according to the program logic software that is executed by the processor, and a sensor interface in communication with a plurality of sensor devices in which the operation of the sensor interface is directed according to the program logic software that is executed by the processor. | 2017-02-09 |
20170042004 | Location-Based Configuration of a Load Control Device - A method of automatically programming a new load control device that replaces an old load control device takes advantage of a remote identification tag (e.g., an RFID tag) located in the vicinity of the old device. The remote identification tag stores an identifier that is representative of a location in which the old device is installed. The method includes the steps of: (1) storing a setting of an old device in a memory of a controller; (2) associating the setting with the identifier of the old device in the memory of the controller; (3) the new device retrieving the identifier from the remote identification tag after the new device is installed in the location of the old device; (4) the new device transmitting the identifier to the controller; and (5) the controller transmitting the setting of the old device to the new device in response to receiving the identifier. | 2017-02-09 |
20170042005 | Intelligent Illumination Device - Intelligent illumination device are disclosed that use components in an LED light to perform one or more of a Wide variety of desirable lighting functions for very low cost. The LEDs that produce light can be periodically turned off momentarily, for example, for a duration that the human eye cannot perceive, in order for the light to receive commands optically. The optically transmitted commands can be sent to the light, for example, using a remove control device. The illumination device can use the LEDs that are currently off to receive the data and then configure the light accordingly, or to measure light. Such light can be ambient light for a photosensor function, or light from other LEDs in the illumination device to adjust the color mix. | 2017-02-09 |
20170042006 | LIQUID FILAMENT FOR INCANDESCENT LIGHTS - A filament for a light bulb includes a tube and a filament material within the tube, wherein the filament material is configured to be in a liquid state while the light bulb is in use. | 2017-02-09 |
20170042007 | ELECTRO-STATIC DISCHARGE PROTECTION DEVICE - An electro-static discharge protection device includes a ceramic base material, first and second outer electrodes on the outer surface of the ceramic base material, a hollow portion inside the ceramic base material, a first discharge electrode including a first end portion electrically connected to the first outer electrode and a second end portion in the hollow portion, a second discharge electrode including a first end portion electrically connected to the second outer electrode and a second end portion spaced apart from the first discharge electrode in the hollow portion, and a discharge supporting electrode including silicon carbide and between the second end portion of the first discharge electrode and the second end portion of the second discharge electrode. The elemental alkali metal in the ceramic base material is about 3 percent by weight or less. | 2017-02-09 |
20170042008 | GANTRY SYSTEM FOR CT IMAGING SYSTEM AND METHODS OF ASSEMBLING SAME - A gantry system for use with a computed tomography (CT) imaging system is provided. The gantry system includes a gantry assembly configured to rotate about a rotational axis to collect imaging data from an object. The gantry assembly includes a support rail. A radially inner surface of the support rail includes a canted first portion and an oppositely canted second portion. The gantry system also includes a plurality of roller assemblies rotatably supporting the gantry assembly. Each of the plurality of roller assemblies comprises a first roller sleeve configured to engage the first portion and a second roller sleeve configured to engage the second portion. | 2017-02-09 |
20170042009 | RADIATION IMAGING SYSTEM - A radiation imaging system includes a radiation source and a notifying unit. The radiation source is for still image shooting and moving image shooting performed by the radiation imaging system to obtain image data of a subject. The notifying unit notifies whether a type of imaging to be performed is the still image shooting or the moving image shooting in a mode in which the type is instinctively recognizable by at least one of sense of sight, sense of hearing, and sense of touch. | 2017-02-09 |
20170042010 | APPARATUS AND TECHNIQUES TO TREAT SUBSTRATES USING DIRECTIONAL PLASMA AND REACTIVE GAS - An apparatus to treat a substrate. The apparatus may include a reactive gas source having a reactive gas outlet disposed in a process chamber, the reactive gas outlet to direct a first reactive gas to the substrate; a plasma chamber coupled to the process chamber and including an extraction plate having an extraction aperture extending along a first direction, disposed within the process chamber and movable along a second direction perpendicular to the first direction between a first position facing the reactive gas source and a second position facing the extraction aperture; and a gas flow restrictor disposed between the reactive gas outlet and the extraction aperture, the gas flow restrictor defining a differential pumping channel between at least the plasma chamber and substrate stage. | 2017-02-09 |
20170042011 | CARTRIDGE FOR A LIQUID-COOLED PLASMA ARC TORCH - A torch head for a liquid-cooled plasma arc torch is provided. The torch head includes a torch body and a torch insulator, coupled to the torch body, having a substantially non-conductive insulator body. The torch insulator includes (i) a first liquid coolant channel, disposed within the insulator body, configured to conduct a fluid flow from the torch head into a consumable cartridge along a first preexisting flow path, (ii) a first liquid return channel, disposed within the insulator body, configured to return at least a portion of the fluid flow from the cartridge to the torch head along the first preexisting flow path, and (iii) a gas channel, disposed within the insulator body, configured to conduct a first gas flow from the torch head to the cartridge along a second preexisting flow path. The first and second preexisting flow paths are fluidly isolated from each other. | 2017-02-09 |
20170042012 | CARTRIDGE FOR A LIQUID-COOLED PLASMA ARC TORCH - A consumable cartridge for a liquid-cooled plasma arc torch is provided. The consumable cartridge comprises a cartridge frame including a proximal end having an end surface, a distal end and a body having a central longitudinal axis extending therethrough. The cartridge configured to form a radio-frequency identification (RFID) interface with a torch head. The consumable cartridge also comprises an arc emitter and an arc constrictor affixed to the cartridge frame at the distal end and an RFID mounting feature formed on or in the cartridge frame adjacent to the end face. The RFID mounting feature is non-concentric with the central longitudinal axis of the body. The consumable cartridge further comprises an RFID tag disposed in or on the RFID mounting feature for transmitting information about the cartridge to a reader device in the torch head when the cartridge is connected to the torch head. | 2017-02-09 |
20170042013 | CARTRIDGE FOR A LIQUID-COOLED PLASMA ARC TORCH - A consumable cartridge frame for a liquid-cooled plasma arc torch is provided. The consumable cartridge frame includes an insulator body configured to be disposed between a torch head and a cartridge tip. The consumable cartridge also includes a first cooling channel, disposed in the body, configured to conduct a first fluid flow received from the torch head to contact a component of the cartridge tip connected to the cartridge frame. The consumable cartridge further includes a first return channel, disposed in the body, configured to conduct at least a portion of the first fluid flow from the component to the torch head. The first cooling channel and the first return channel are non-concentric in relation to a central longitudinal axis of the body. | 2017-02-09 |
20170042014 | CARTRIDGE FOR A LIQUID-COOLED PLASMA ARC TORCH - A liquid-cooled consumable cartridge for a plasma arc torch is provided. The cartridge includes (i) an electrode, (ii) a swirl ring with a first outer retaining feature and a second outer retaining feature on an exterior surface, where the electrode is secured to the swirl ring, and (iii) a nozzle with an inner retaining feature on an interior surface, where the inner retaining feature of the nozzle is mated with the first outer retaining feature of the swirl ring. The cartridge also includes a cartridge frame with an inner retaining feature on an interior surface and an outer retaining feature on an exterior surface. The inner retaining feature of the cartridge frame is mated with the second outer retaining feature of the swirl ring. The cartridge further includes a shield with an inner retaining feature on an interior surface mated with the outer retaining feature of the cartridge frame. | 2017-02-09 |
20170042015 | Electrode for a Contact Start Plasma Arc Torch and Contact Start Plasma Arc Torch Employing Such Electrodes - A swirl ring component of a contact start plasma arc torch is provided. The swirl ring component includes a hollow body formed of a front portion and a rear portion along a longitudinal axis and defining an exterior surface and an interior surface. The swirl ring component also includes one or more gas passageways extending from the exterior surface to the interior surface in the front portion of the hollow body and a resilient element disposed relative to the interior surface in the rear portion of the hollow body and configured to pass at least a pilot arc current to an electrode body. The swirl ring component further includes a shoulder portion configured to retain the resilient element in the hollow body. | 2017-02-09 |
20170042016 | Plasma Arc Cutting Systems, Consumables and Operational Methods - The invention features methods and apparatuses for regulating a shielding liquid in a plasma torch. A liquid-injection shield for a plasma torch includes a body having an exterior surface and an interior surface and a liquid injection regulation component circumferentially disposed within and in direct contact with the interior surface of the body. The liquid injection regulation component and the interior surface of the body define a chamber. The liquid injection regulation component also defines a first set of ports sized to regulate a liquid entering the chamber and a second set of ports oriented to distribute a fluid exiting the chamber. | 2017-02-09 |
20170042017 | HEAT PIPE EMBEDDED HEAT SINK WITH INTEGRATED POSTS - An apparatus includes a heat sink and a post that supports the heat sink that is monolithically formed with the heat sink. The apparatus can further include a printed wiring board attached to a top side of the heat sink with electronic components attached to the printed wiring board, a plurality of posts integrated into a bottom side of the heat sink and extending outwards from the heat sink, wherein the heat sink and the plurality of posts are monolithically formed, and a heat pipe attached to the bottom side of the heat sink with a first end near an electronic component and a second end near one of the plurality of posts. | 2017-02-09 |
20170042018 | Dual Layer Shielding Cover and Terminal - A dual layer shielding cover is provided and includes a dual layer structure with an upper layer shielding cover ( | 2017-02-09 |
20170042019 | TAMPER DETECTION CIRCUITS - In an example, a polymeric material is disclosed. The polymeric material includes a polymer substrate and a plurality of graphene traces arranged to form a tamper detection circuit on the polymer substrate. | 2017-02-09 |
20170042020 | PRINTED CIRCUIT BOARD, DISPLAY APPARATUS HAVING A PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE PRINTED CIRCUIT BOARD - A printed circuit board (“PCB”) includes a first pattern structure, a second pattern structure, a third pattern structure, and a fourth pattern structure. The first pattern structure includes a first ground pattern. The second pattern structure includes a first line pattern overlapping the first ground pattern and a second ground pattern electrically insulated from the first line pattern. The third pattern structure includes a third ground pattern overlapping the first line pattern and a second line pattern overlapping the second ground pattern. The fourth pattern structure includes a fourth ground pattern overlapping the second line pattern. Therefore, the PCB may decrease noise. | 2017-02-09 |
20170042021 | Arrangement for connecting - An arrangement for connecting a sensor assembly and a cable assembly. The arrangement includes a signal wire. The arrangement includes a transversely-extending insulating barrier. The signal wire extends through the insulating barrier. The arrangement includes a shield wire that is configured to provide at least part of a grounding pathway. The shield wire extends through the insulating barrier at a location spaced from the signal wire. The arrangement includes at least one conductive layer that is located upon the insulating barrier. The at least one conductive layer is spaced away from the signal wire and is in electrical contact with the shield wire. At least a portion of the insulating barrier has a non-linear profile. At least a portion of the at least one conductive layer that is located upon the at least a portion of the insulating barrier has the non-linear profile. | 2017-02-09 |
20170042022 | CIRCUIT, DISPLAY SUBSTRATE AND DISPLAY DEVICE - The present invention discloses a circuit, a display substrate and a display device, the circuit comprises a plurality of circuit modules, distances of at least one circuit module from two circuit modules adjacent thereto are a first distance and a second distance, respectively, the first distance is smaller than the second distance, and the absolute value of the difference between the second distance and the first distance is not equal to an integer multiple of the first distance. In the present invention, distances of at least one circuit module from two circuit modules adjacent thereto satisfy the above specific condition, so that at least one circuit module can be prevented from being positioned at the middle position of the standing wave field between the two circuit modules adjacent thereto, therefore, interference of standing wave to transmission signals is reduced, and signal distortion and signal attenuation are alleviated. | 2017-02-09 |
20170042023 | TAMPER DETECTION CIRCUITS - In an example, a process includes forming a patterned layer on a polymer substrate. The process also includes depositing a graphene-containing material on the patterned layer to form a plurality of graphene traces of a tamper detection circuit. | 2017-02-09 |
20170042024 | WIRED CIRCUIT BOARD - A wired circuit board includes a metal pedestal portion formed from a metal material that is the same as the material of the metal supporting board at the pad portion, a pedestal opening formed by opening the metal pedestal portion, a lower conductive layer disposed on one side in the thickness direction of the metal pedestal portion as the first conductive layer, and an upper conductive layer as the second conductive layer formed on one side in the thickness direction of the lower conductive layer as the first conductive layer, wherein one of the lower conductive layer as the first conductive layer and the upper conductive layer as the second conductive layer is disposed in the pedestal opening when projected in the thickness direction, and the periphery of the other is disposed outside of the pedestal opening when projected in the thickness direction. | 2017-02-09 |
20170042025 | Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device - Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum ridge height Sp as measured with a laser microscope according to ISO 25178 on the surface of the carrier-attached copper foil on the side of the ultrathin copper layer is 0.193 to 3.082 μm. | 2017-02-09 |
20170042026 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A circuit board including a substrate, a photo imageable dielectric layer and a plurality of conductive bumps is provided. The substrate has a first surface and a first circuit layer, wherein the first surface has a chip disposing area and an electrical connection area, and the first circuit layer is embedded in the first surface. The photo imageable dielectric layer is disposed on the electrical connection area and has a plurality of openings, wherein parts of the first circuit layer is exposed by the openings. The conductive bumps are disposed at the openings respectively and connected to the first circuit layer, wherein a side surface of each of the conductive bumps is at least partially covered by the photo imageable dielectric layer. In addition, a manufacturing method of the circuit board is also provided. | 2017-02-09 |
20170042027 | HYBRID CIRCUIT ASSEMBLY - A hybrid circuit assembly includes an integrated metal substrate (IMS) having high-voltage, high-power components mounted thereon. The IMS includes a metal base plate an insulating adhesive on the metal base plate, and one or more wiring layers on the insulating adhesive. The hybrid circuit assembly includes a multi-layer printed wiring board (PWB) having low-voltage, low-power components mounted thereon. The multi-layer PWB is connected to the IMS and has an upper surface that is co-planar with an upper surface of the IMS. The PWB is mounted on the metal base plate via the insulating adhesive. | 2017-02-09 |
20170042028 | PRINTED CIRCUIT BOARD CONSISTING OF AT LEAST TWO PRINTED CIRCUIT BOARD REGIONS - In a method for producing a printed circuit board consisting of at least two printed circuit regions, wherein the printed circuit board regions each compromise at least one conductive layer and/or at least one device or once conductive component, wherein printed circuit board regions to be connected to another one, in the region of in each case at least one lateral surface directly adjoining one another, are connected to one another by a coupling or connection, and wherein, after a coupling or connection of printed circuit board regions, at least one additional layer or ply of the printed circuit board is applied over the printed circuit board regions, the additional layer is embodied as a conductive layer, which is contact-connected via plated-through holes to conductive layers or devices or components integrated in the printed circuit board regions. | 2017-02-09 |
20170042029 | LAMINATED ELECTRONIC COMPONENT AND LAMINATED ELECTRONIC COMPONENT MOUNTING STRUCTURE - A laminated electronic component includes a main body composed of a stacked body in which dielectric layers and internal electrode layers are alternately laminated, and an external electrode disposed on an outer surface of the stacked body so as to make electrical connection with the internal electrode layers; and a first joining member and a second joining member which are provided on a first face side located in a stacking direction of the dielectric layers and the inner electrode layers. The first joining member and the second joining member are provided on a first side and second side which constitute the first face, respectively, and located in a region which includes midpoints thereof but does not include a vertex of the main body. By mounting such a laminated electronic component to a substrate via the joining members, acoustic noise can be suppressed. | 2017-02-09 |
20170042030 | BOARD-MOUNTED CIRCUIT BREAKERS FOR ELECTRONIC EQUIPMENT ENCLOSURES - A board-mounted circuit breaker assembly for an electronic equipment enclosure includes a printed circuit board having a plurality of quick-connect terminals and a circuit breaker. The circuit breaker includes a housing and a plurality of quick-connect terminals that are at least partially recessed into a portion of the housing to reduce the overall “z”-height of the circuit breaker. The quick-connect terminals on the circuit breaker are adapted to mechanically and electrically connect to the quick-connect terminals on the printed circuit board. | 2017-02-09 |
20170042031 | METHOD FOR PROTECTING AN ELECTRONIC CIRCUIT CARRIER AGAINST ENVIRONMENTAL INFLUENCES AND CIRCUIT MODULE - The present disclosure provides a method for protecting an electronic interconnect device from environmental effects. The electronic interconnect device may be connected to at least one electronic component, wherein the electronic interconnect device and the at least one electronic component are at least partially covered with an encapsulating material in a material-bonded manner. The method may include applying the encapsulating material to the electronic interconnect device with a 3D printer during a 3D printing process. | 2017-02-09 |
20170042032 | CLAMP AND DISPLAY DEVICE INCLUDING SAME - According to an embodiment of the present disclosure, since the electronic components are fixed on the PCB by the clamp, post processing, such as soldering or application of an adhesive, may be not needed. Also, since the PCB can be spaced from the adjacent configurations by the clamp, the efficient layout of the PCB is possible, resulting in an improvement of productivity of the PCB. In accordance with an aspect of the present disclosure, there is provided a clamp comprises a fixing part configured to surround at least one part of the outer surface of an electronic component, a connection part extending from the fixing part, and penetrating a Printed Circuit Board (PCB), an interference part provided in at least one of the fixing part or the connection part, and configured to be interfered by the PCB and a spacing part protruding from at least one of the connection part or the fixing part. | 2017-02-09 |
20170042033 | COMPONENT BUILT-IN MULTILAYER BOARD - In an LC composite component, a chip capacitor is built in a multilayer substrate including base material layers made of a thermoplastic resin. The number of the base material layers in a portion overlapping the component as seen from a lamination direction is equal to the number of the base material layers in a portion around the component as seen from the lamination direction. Wiring patterns that adjust the thickness of the multilayer substrate are provided around the chip capacitor as seen from the lamination direction, and on principal surfaces of the base material layers, so as to surround the chip capacitor. | 2017-02-09 |
20170042034 | SYSTEM AND METHODS FOR ADDITIVE MANUFACTURING OF ELECTROMECHANICAL ASSEMBLIES - A hybrid additive manufacturing approach that incorporates three-dimensional (3D) printing and placement of modules selected from a library of modules to fabricate an electromechanical assembly. By virtue of fabrication of the electromechanical assembly, mechanical properties and electrical properties of the assembly are created. The invention overcomes the material and process limitations of current printable electronics approaches, enabling complete, complex electromechanical assemblies to be fabricated. | 2017-02-09 |
20170042035 | FLEXIBLE PRINTED CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE - The present disclosure provides a flexible printed circuit board, a method for manufacturing the same and a display device. The flexible printed circuit board includes a first component and a second component, wherein the first component includes a main body and a first connection portion, wherein at least one first signal line is arranged in the main body and the first connection portion; the second component includes a connector and a second connection portion, wherein a second signal line corresponding to the first signal line is arranged in the connector and the second connection portion; the first connection portion and the second connection portion are connectable to each other, so as to electrically connect the first signal line to the corresponding second signal line. | 2017-02-09 |
20170042036 | Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device - Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order. The maximum trough depth Sv as measured with a laser microscope according to ISO 25178 on a surface of a bismaleimide-triazine resin substrate exposed by detaching the carrier and etching and removing the ultrathin copper layer after the carrier-attached copper foil is heat pressed against the resin substrate from the ultrathin copper layer side under the pressure of 20 kgf/cm | 2017-02-09 |
20170042037 | METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF PYRIDYL ALKYLAMINES AND BISEPOXIDES - Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyridyl alkylamines and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features. | 2017-02-09 |
20170042038 | PROCESS FOR PRODUCING SUBSTRATE HAVING WIRING, RADIATION-SENSITIVE COMPOSITION, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE - A process for producing a substrate having wiring includes steps (i) to (v) described as follows: (i) applying a radiation-sensitive composition on a substrate to form a coating film; (ii) irradiating a prescribed part of the coating film with radiation to allow the coating film to have a radiation-irradiated region and a radiation-unirradiated region; (iii) allowing the coating film obtained in the step (ii) to have a concave region and a convex region; (iv) forming wiring on the concave region; and (v) removing the convex region by an application of radiation or by heating. | 2017-02-09 |
20170042039 | ELECTROLESS METALLIZATION OF DIELECTRICS WITH ALKALINE STABLE PYRAZINE DERIVATIVE CONTAINING CATALYSTS - Pyrazine derivatives which contain one or more electron donating groups on the ring are used as catalytic metal complexing agents in aqueous alkaline environments to catalyze electroless metal plating on metal clad and un-clad substrates. The catalysts are monomers and free of tin and antioxidants. | 2017-02-09 |
20170042040 | COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM PHOSPHORUS ON COPPER, AND A COATED COMPONENT THEREFROM - A solution comprising a palladium compound and a polyaminocarboxylic compound has been found to be suitable as a bath for electroless plating of palladium onto copper. Use of such a solution produces a plated component comprising a copper surface and a palladium plated coating having a thickness of between 0.01 micrometers (μm) and 5 μm. A method for electroless plating of palladium onto a copper surface of a component includes preparing a bath having a palladium compound and a polyaminocarboxylic compound. The copper component is submerged in the bath to plate a palladium layer on the copper surface of the component. The component resulting from the plating method has a palladium layer plated on the copper surface. | 2017-02-09 |
20170042041 | ATTACHING APPARATUS FOR CHIP-ON-FILMS - An attaching apparatus for chip-on-films includes: a base; a rotary table; a first driving device configured to drive the rotary table to rotate around the axis of the rotary table; a TCP side adhesive-attaching mechanism configured to attach a conductive film onto a chip-on-film on a carrier located in the TCP adhesive-attaching region; a PCB side adhesive-attaching mechanism configured to attach a conductive film onto a chip-on-film on a carrier located in the PCB adhesive-attaching region; and a pre-pressing mechanism configured to pre-press conductive films attached on a chip-on-film on a carrier located in the pre-pressing region. The rotary table is in a first operating position, a second operating position, a third operating position and a fourth operating position successively during a rotation around its axis. When the rotary table is in any one of the operating positions, there is always one carrier in each region of the base. | 2017-02-09 |
20170042042 | INTELLIGENT SOLDERING CARTRIDGE FOR AUTOMATIC SOLDERING CONNECTION VALIDATION - An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal. | 2017-02-09 |
20170042043 | FLUXING-ENCAPSULANT MATERIAL FOR MICROELECTRONIC PACKAGES ASSEMBLED VIA THERMAL COMPRESSION BONDING PROCESS - A fluxing-encapsulant material and method of use thereof in a thermal compression bonding (TCB) process is described. In an embodiment, the TCB process includes ramping the bond head to 250° C.-300° C. at a ramp rate of 50° C./second-100° C./second. In an embodiment, the fluxing-encapsulant material comprising one or more epoxy resins having an epoxy equivalent weight (EEW) of 150-1,000, a curing agent, and a fluxing agent having a mono-carboxylic acid or di-carboxylic acid and a pKa of 4-5. | 2017-02-09 |
20170042044 | Carrier-Attached Copper Foil, Laminate, Method For Producing Printed Wiring Board, And Method For Producing Electronic Device - Provided herein is a carrier-attached copper foil having desirable fine circuit formability. The carrier-attached copper foil includes a carrier, an interlayer, and an ultrathin copper layer in this order, wherein D2-D1 is 0.30 to 3.83 μm, where D1 is the gravimetrically measured thickness of the carrier-attached copper foil excluding the carrier and the interlayer, and D2 is the maximum thickness of the layer remaining on a bismaleimide-triazine resin substrate in case of detaching the carrier after the carrier-attached copper foil is laminated to the resin substrate from the ultrathin copper layer side by being heat pressed under a pressure of 20 kgf/cm | 2017-02-09 |
20170042045 | CURVED SURFACE DISPLAY DEVICE AND CURVED SURFACE DISPLAY METHOD - A curved surface display device and a curved surface display method, which belong to the field of display technology. The curved display device comprises a display panel, a motor, a first arc lever and a second arc lever. A first end of the first arc lever and the second arc lever are connected with the motor through a connector, and a second end of the first arc lever and second arc lever are connected with the casing of the device. The connector is used for pulling the first end of the first arc lever and the first end of the second arc lever with rotation of the motor, such that the first arc lever and the second arc lever rotate around their pivots respectively, thus realizing automatic bending of the casing, which meets the user's requirement of adjusting the curvature of the curved surface display device. | 2017-02-09 |
20170042046 | DISPLAY DEVICE, AND METHOD AND APPARATUS FOR MANUFACTURING THE SAME - A display device, and a method and apparatus for manufacturing the display device, are provided. The display device includes a cover window including a curved portion, and a display panel smaller in at least one of length or width than the cover window and laminated on a flat portion of the cover window. | 2017-02-09 |
20170042047 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A display device and a method of manufacturing the same are disclosed. In one aspect, the display device includes a flexible substrate having a display area and a peripheral area outside the display area, and a second surface opposite to the first surface, and a display unit located on the display area. The display device also includes an adhesive layer located on the second surface of the flexible substrate, wherein a first groove is formed in a first portion of the adhesive layer and wherein the first portion corresponds to the peripheral area. The display device further includes a lower protective film located on the adhesive layer and having a first opening passing therethrough and overlapping the first groove in the depth dimension of the display device, and a first planarization layer at least partially filling the first groove. | 2017-02-09 |
20170042048 | Module Arrangement - The invention relates to a module arrangement ( | 2017-02-09 |
20170042049 | THERMAL SLEEVE WITH REFLECTIVE POSITIONING MEMBER, ASSEMBLY THEREWITH AND METHOD OF CONSTRUCTION THEREOF - A thermal sleeve for protecting an electronic member connected to a wiring harness against exposure to heat, combination thereof, and method of construction thereof is provided. The thermal sleeve has a tubular member including a circumferentially continuous wall with an insulative inner layer bounding an inner cavity extending along a central longitudinal axis between open opposite ends and a reflective outer layer. The sleeve further includes a positioning member constructed of resilient, reflective metal material. The positioning member has a tubular portion and at least one resilient finger extending radially inwardly from the tubular portion for abutment with the wiring harness. The tubular portion is fixedly attached to one of the opposite ends of the wall of the tubular member. | 2017-02-09 |
20170042050 | THERMAL SLEEVE WITH REFLECTIVE POSITIONING MEMBER, ASSEMBLY THEREWITH AND METHOD OF CONSTRUCTION THEREOF - A thermal sleeve for protecting an electronic member connected to a wiring harness against exposure to heat is provided. The thermal sleeve has a tubular member including a circumferentially continuous wall with an inner surface bounding an inner cavity extending along a central axis between open opposite ends and a reflective outer surface. The thermal sleeve includes a positioning member constructed of a separate piece of material from the tubular member. The positioning member has a circumferentially continuous, tubular portion and at least one resilient flange extending radially inwardly from the tubular portion for abutment with the wiring harness. The tubular portion has a plurality of tangs extending radially therefrom. The tangs are fixedly disposed in the wall of the tubular member to inhibit relative rotational and/or axial movement between the tubular member and the positioning device. | 2017-02-09 |
20170042051 | SEMICONDUCTOR DEVICE - When a nut housing member is inserted from a first opening portion into a case (terminal housing area) in a semiconductor device, first and second protrusions of the nut housing member slide on and pass through the first and second opening portions. Ultimately, the nut housing member is housed in the case (terminal housing area), with the first protrusion being in contact with a lower end of the second opening portion and the second protrusion being in contact with a lower end of the first opening portion. Even if the nut housing member is not inserted in parallel with the terminal housing area, the forefront does not hit against a first beam. Therefore, the nut housing member is inserted stably and housed reliably in the terminal housing area of the case, and the assemblability of the nut housing member with respect to the case is improved. | 2017-02-09 |
20170042052 | PRESSURE COMPENSATION ELEMENT HAVING SPRING ELEMENT, CASING AND ELECTRONIC CONTROL DEVICE - A pressure compensation element for casings includes a connecting body in the form of a hollow body, a membrane seat having a contact surface for a membrane and an impact protection device. The membrane seat is arranged on the connecting body wherein the impact protection device is coupled to the connecting body. The membrane is arranged on the contact surface between the impact protection means and the membrane seat. The connecting body has a first opening arranged on a first free end, and a second opening leading to the contact surface of the membrane seat, wherein a spring element is arranged inside the second opening abutting the contact surface. The spring element provides a support contour for the membrane. | 2017-02-09 |
20170042053 | SEMICONDUCTOR DEVICE - In a semiconductor device, a multilayer substrate includes an insulating substrate, a first circuit board having a first semiconductor chip disposed thereon, and a second circuit board having a second semiconductor chip disposed thereon. On the multilayer substrate of the semiconductor device, a plate portion of a resin plate including a first positioning portion that regulates the position of each semiconductor chip is sandwiched between a first jumper terminal, which includes a first terminal connected to the first semiconductor chip and a first plate member perpendicular to the first terminal, and a second jumper terminal, which includes a second terminal connected to the second semiconductor chip and a second plate member perpendicular to the second terminal. | 2017-02-09 |
20170042054 | REMOVAL ASSEMBLY - A removal assembly includes a main body, a positioning element, an elastic element, an actuating element, and a wrench element. The positioning element is movably disposed in an inner space of the main body, including a clasp part and an oblique side surface, and the clasp part extends out of the main body. The elastic element is disposed between the main body and the positioning element. The actuating element is pivotally installed in the inner space of the main body, including a pressing part and an abutting part, the pressing part extends out of the main body, and the abutting part abuts against the oblique side surface of the positioning element. The wrench element is connected to the main body, including a fixing part and a pivoting part. | 2017-02-09 |
20170042055 | COMPONENT QUICK RELEASE LATCH ASSEMBLY - Latch mechanism having a latch slide having a receiving portion and configured to couple a component with a server chassis. A latch ramp disposed on the latch slide at a first end of the receiving portion, a release ramp disposed on the latch slide at a second end of the receiving portion, and a biasing element biasing the latch slide in a latched position. The latch ramp configured to draw the pin into the receiving portion and the release ramp configured to draw the pin away from the receiving portion. When the latch slide transitions to the latched position, the pin is received in the receiving portion and engages the latch ramp, thereby sliding the latch slide and compressing the biasing element. When the latch slide transitions to the unlatched position, the biasing member is compressed causing the pin to engage the release ramp and translate the component. | 2017-02-09 |
20170042056 | EQUIPMENT SECURING DEVICE, ATTACHMENT-FRAME-INTERNAL STORAGE EQUIPMENT, RACK-MOUNT SEVER DEVICE AND EQUIPMENT SECURING METHOD - The present invention reduces an area in which an attachment frame for storing equipment on which a device is mounted is arranged. | 2017-02-09 |
20170042057 | Electronics Cabinet - An electronics cabinet having a cabinet frame, a front equipment rail, and a structural air dam. The cabinet frame includes a first pair of front-to-back beams connected to a pair of top side-to-side beams to form a top frame, a second pair of front-to-back beams connected to a pair of bottom side-to-side beams to form a bottom frame, and a plurality of vertical post connected to the top frame and the bottom frame. The front equipment rail is removably connected to one of the first pair of front-to-back beams and to one of the second pair of front-to-back beams. The structural air dam is connected to the front equipment rail and to one of the plurality of vertical posts. | 2017-02-09 |
20170042058 | PARALLEL HEAT SPREADER - A heat spreader including multiple layers of anisotropic material to conduct thermal energy. Multiple graphite sheet layers may be laminated and each sheet may be thermally connected to one or more thermal energy sources in a portable electronic device. Methods for making a heat spreader are also disclosed. | 2017-02-09 |
20170042059 | HEAT DISSIPATION DEVICE FOR AN ELECTRICAL METER SOCKET - A heat dissipation device is presented for an electrical meter socket. The heat dissipation device includes a conduit with a first end configured to be mounted to a first opening in a housing of the electrical meter socket. The heat dissipation device includes a vent cap to cover a second end of the conduit, and may include one or more optional apertures to dissipate heat from the electrical meter socket. The heat dissipation device can also include mesh or screen to keep insects out of the device. An electrical meter socket system is also presented, including the electrical meter socket a heat dissipation device and a connector to connect the device to an opening in a housing of the socket. A method is also presented, for dissipating heat from an electrical meter socket. | 2017-02-09 |
20170042060 | QUICK RELEASE FAN MODULE - A liftable and lockable fan is provided. The fan includes: a housing having a side wall; a tab mounted in the side wall, including an upwardly extending lower portion, an outwardly facing locking projection above the lower portion, and an inwardly facing surface above the outwardly facing locking projection; the tab having a first tab position in which the outwardly facing locking projection extends from the side wall and is configured to engage with an exterior locking surface, and a second tab position in which the outwardly facing locking projection is at least partially retracted into the housing; the housing having a recess above the outwardly facing locking projection; and a top cover rotatably mounted to the housing, including a handle on a first end of the cover, an arm on a second end of the cover. | 2017-02-09 |
20170042061 | SERVER FAN FLAP AND SHUTTER SYSTEM FOR PREVENTION OF AIR FLOW DIVERSION - A server rack can include a plurality of server chassis. The server chassis can form a opening configured to receive a removable fan through the opening. The removable fan can including a plurality of shutters, the plurality of shutters can be automatically transitionable between an open configuration and a closed configuration. In the open configuration the fan can draw in or push out air to cool the components located within the server chassis. In the closed configuration the shutters can prevent air from entering or exiting the server chassis. A flap can be coupled to the server chassis and automatically transitionable between an open configuration and a closed configuration. In the open configuration the fan is inserted into the server chassis and the flaps are opened into the server chassis. In the closed configuration the fan is removed from the server chassis and the flaps can prevent air from entering or exiting the server chassis. | 2017-02-09 |
20170042062 | HEAT DISSIPATION DEVICE AND WORKING METHOD THEREOF, DISPLAY DEVICE - The present disclosure provides a heat dissipation device, a working method thereof and a display device. The heat dissipation device is applied to a display device, including a temperature monitoring unit, configured to monitor an environment temperature of each predetermined region of the display device; a control unit, connected to the temperature monitoring unit, configured to determine regions to be cooled according to a monitoring result of the temperature monitoring unit and then send a control instruction to a movement unit; the movement unit, connected to the control unit, and configured to move at least one heat dissipation fan to the regions to be cooled in response to the received control instruction; and the at least one heat dissipation fan connected to the movement unit. | 2017-02-09 |
20170042063 | HYBRID THERMAL MANAGEMENT OF ELECTRONIC DEVICE - An enclosure with hybrid thermal management for a heat-generating electronic device comprises a passive heat sink for conducting heat away from the electronic device, a cold skin adapted to slide over the top of the passive heat sink and having a front wall forming a plurality of air intake ports, and a plurality of blowers mounted inside the cold skin for drawing air into the cold skin though the air intake ports and then directing the air through the passive heat sink. In one implementation, the passive heat exchanger includes multiple thermally conductive fins adjacent to the electronic device and extending rearwardly from the intake ports, the fins being spaced apart from each other for conducting heat away from the electronic device. The blowers preferably direct air rearwardly from the intake ports in the front wall into the spaces between the thermally conductive fins. | 2017-02-09 |
20170042064 | THERMAL MODULE - A thermal module includes a heat pipe and a heat dissipation unit. The heat pipe has a main body and at least one first heat conduction section integrally radially and axially extending from a circumference of the main body. The heat dissipation unit has multiple radiating fins. The radiating fins are arranged at intervals. Each radiating fin is formed with a perforation. At least one first locating slit outward extend from the perforation. The main body and the first heat conduction section are respectively correspondingly fitted through the perforations and the first locating slits to tightly connect the heat pipe with the heat dissipation unit. The first heat conduction section of the heat pipe provides much larger heat conduction area for the heat pipe so that the heat conduction effect of the heat dissipation unit is greatly enhanced and the heat dissipation performance and efficiency are enhanced. | 2017-02-09 |
20170042065 | HEAT SPREADER AND POWER MODULE - The present disclosure provides a heat spreader and a power module. The heat spreader comprises: a base plate comprising a first surface and a second surface opposite to the first surface; an insulating frame fixedly connected to the first surface of the base plate; and an insulating material attached to at least a part of a surface of the insulating frame. The present disclosure can effectively satisfy design requirements for both heat dissipation and insulation, and significantly increase a layout space for a printed circuit board. | 2017-02-09 |
20170042066 | ELECTRONIC CIRCUIT DEVICE AND HEAT SINK STRUCTURE FOR THE SAME - An electronic circuit device and a heat sink structure for the electronic circuit device capable of simultaneously achieving improved space efficiency and safeness are provided. The electronic circuit device includes: a substrate with circuit wiring formed thereon; an electronic component requiring heat dissipation, which is mounted on the substrate; and a heat sink structure configured to dissipate heat radiated by the electronic component requiring heat dissipation. The heat sink structure includes: a contact part to be in direct or indirect contact with the electronic component requiring heat dissipation; a generally tabular heat-dissipating part disposed substantially parallel to the substrate; and a connection part configured to connect between the contact part and the heat-dissipating part. | 2017-02-09 |
20170042067 | ENERGY EFFICIENT VERTICAL DATA CENTER - The vertical data center module is a multistory compact footprint data center unit that exploits vertical air movements, both downward and upward, to efficiently sustain conventional low-cost air-cooled computing systems. It integrates a hybrid cooling system that can benefit from an air-side economizer without compromising its compact footprint. For polluted urban environments, this air-side economizer comprises an air-to-air heat exchanger to effectively limit the amount of outside air that can enter the module and come into contact with sensitive computing systems. Through side-to-side, side-to-back or back-to-back juxtaposition, multiple units can be assembled in clusters on a colocation site to create large-scale vertical data center complexes, effectively maximizing real estate use and cost effectiveness by fully exploiting all three dimensions. | 2017-02-09 |
20170042068 | Use of Computationally Generated Thermal Energy - In one aspect, a computing device-implemented method includes receiving at least one triggering event signal from one or more components of a heat recovery system. The method also includes determining, based in part on the at least one triggering event signal, a computation workload assignment to be executed on one or more computation devices. The method further includes sending one or more command signals to the one or more computation devices. The one or more command signals include a portion of the computation workload assignment for execution by the one or more computation devices. The method also includes initiating capture of heat energy to be stored in one or more heat reservoirs, the heat energy being generated by the one or more computation device based upon the computation workload assignment. | 2017-02-09 |
20170042069 | APPARATUS AND METHODS RELATED TO CONFORMAL COATING IMPLEMENTED WITH SURFACE MOUNT DEVICES - Apparatus and methods related to conformal coating implemented with surface mount devices. In some embodiments, a radio-frequency (RF) module includes a packaging substrate configured to receive a plurality of components. The RF also includes a surface mound device (SMD) mounted on the packaging substrate, the SMD including a metal layer that faces upward when mounted. The RF module further includes an overmold formed over the packaging substrate, the overmold dimensioned to cover the SMD. The RF module further includes an opening defined by the overmold at a region over the SMD, the opening having a depth sufficient to expose at least a portion of the metal layer. The RF module further includes a conformal conductive layer formed over the overmold, the conformal conductive layer configured to fill at least a portion of the opening to provide an electrical path between the conformal conductive layer and the metal layer of the SMD. | 2017-02-09 |
20170042070 | HIGH ISOLATION GROUNDING DEVICE - The device includes a body and a plurality of contact portions. The body is substantially planar. The plurality of contact portions are associated with the body so as to form ports. The plurality of contact portions are in electrical communication with the body. The port of each contact portion having an inside diameter substantially equal to ID | 2017-02-09 |
20170042071 | MANUFACTURING METHOD OF CASING - A manufacturing method of a casing is provided. First, a plate, a frame and a main shell are provided, wherein the plate has an adhering region and at least one thermal fusion region, and the frame has a first surface and a second surface opposite to each other. Then, the plate is stacked on the first surface of the frame, wherein the thermal fusion region is overlapped with the frame, and the adhering region is not overlapped with the frame. The main shell is adhered to the adhering region of the plate and the second surface of the frame. The thermal fusion region is fixed to the frame by thermal fusion. In addition, a casing manufactured through the above-mentioned method is also provided. | 2017-02-09 |
20170042072 | OPTIMIZATION PROGRAM AND MOUNTING WORK SYSTEM - With multiple-board substrate defined as a circuit substrate provided with multiple boards of circuit pattern on which multiple electronic components are mounted, when performing mounting work of multiple electronic components on a multiple-board substrate using three mounters lined up in a row, electronic component mounting work procedures are set such that mounting work of electronic components for each of multiple circuit patterns is performed by all three mounters. Work procedures for mounting work of electronic components surrounded by the dashed lines are set to a first mounter, work procedures for mounting work of electronic components surrounded by the single-dashed solid lines are set to a second mounter, and work procedures for mounting work of electronic components surrounded by the double-dashed solid lines are set to a third mounter. | 2017-02-09 |
20170042073 | ELECTRONIC COMPONENT MOUNTER - There is provided an electronic component mounter configured to include a supplier holder in which a radial lead type electronic component supplier can be mounted, and to cause a mounting head to hold a radial lead type electronic component so as to mount the component on a board positioned by a board holder. The electronic component mounter includes a tape guide passage that guides a tape body after the radial lead type electronic components are picked up from the tape body. The electronic component supplier is configured to further include a posture converter that converts a posture of the tape body from a posture perpendicular to a horizontal plane to a posture parallel to the horizontal plane, after the radial lead type electronic components are picked up from the tape body, and that introduces the tape body to the tape guide passage. | 2017-02-09 |
20170042074 | Spiraea plant named 'Odessa' - A new and distinct cultivar of | 2017-02-09 |
20170042075 | Fuchsia plant named 'FWULR24-0' - A new and distinct | 2017-02-09 |
20170042076 | Fuchsia plant named 'FWUNW20-0' - A new and distinct | 2017-02-09 |
20170042077 | Ornithogalum plant named 'MFYELLSTAR' - A new and distinct | 2017-02-09 |
20170042078 | Ornithogalum plant named 'MFPRINSTAR' - A new and distinct | 2017-02-09 |