Class / Patent application number | Description | Number of patent applications / Date published |
156706000 | Using direct fluid current against work during delaminating | 24 |
20110253314 | DEBONDING EQUIPMENT AND METHODS FOR DEBONDING TEMPORARY BONDED WAFERS - A debonder apparatus for debonding a temporary bonded wafer pair includes a chuck assembly, a flex plate assembly, a contact roller and a resistance roller. The chuck assembly includes a chuck and a first wafer holder configured to hold a first wafer of the temporary bonded wafer pair in contact with a top surface of the chuck. The flex plate assembly includes a flex plate and a second wafer holder configured to hold a second wafer of the temporary bonded wafer pair in contact with a first surface of the flex plate. The flex plate is configured to be placed above the top surface of the chuck. The contact roller is arranged adjacent to a first edge of the chuck and includes means for pushing and lifting up a first edge of the flex plate. The resistance roller includes means for traversing horizontally over the flex plate and means for applying a downward force upon the flex plate. The contact roller pushes and lifts up the first edge of the flex plate while the resistance roller simultaneously applies the downward force upon the flex plate and traverses horizontally away from the first edge of the flex plate and thereby the temporary bonded wafer pair delaminates along a release layer and the first and second wafers are separated from each other. | 10-20-2011 |
20120247686 | Systems and Methods For Ultrasonically Cleaving A Bonded Wafer Pair - Systems and methods for the ultrasonic cleaving of bonded wafer pairs are described. The system includes a tank for containing a volume of liquid, a wafer boat having a recess formed therein for receiving the bonded wafer pair. The recess has a pair of opposing, spaced-apart sidewalls disposed at an angle from a vertical axis. An ultrasonic agitator is configured to ultrasonically agitate the volume of liquid. The ultrasonic agitation of the volume of liquid results in the cleaving of the bonded wafer pair. | 10-04-2012 |
20130146230 | Label for Removable Attachment to an Article - A label for removable application to an article such as a beverage bottle includes a backing layer ( | 06-13-2013 |
20150122426 | MULTIPLE BONDING LAYERS FOR THIN-WAFER HANDLING - Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side. | 05-07-2015 |
156707000 | Using vacuum directly against work during delaminating | 15 |
20110214819 | Method For Detaching And Removing A Semiconductor Chip From A Foil - The detachment and removal of a semiconductor chip from a foil occurs in accordance with the invention in three phases. In the first phase there is a partial detachment of the semiconductor chip from the foil with mechanical means, but without the participation of a chip gripper. In the second phase the semiconductor chip is further detached from the foil, with the semiconductor chip being held by the chip gripper. In the third phase the chip gripper is lifted and moved away. | 09-08-2011 |
20110290427 | MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED DEVICE - In a chip pick-up process after dicing in an assembly process during manufacture of a semiconductor integrated circuit device it is an important subject to diminish a pick-up defect caused by the reduction in thickness of each chip which is proceeding in quick tempo. Particularly, bending of the chip peripheral portion caused by a peeling operation is very likely to induce cracking and chipping of the chip. In the present invention, to solve these problems, in case of peeling a chip from a dicing tape (adhesive tape) or the like while vacuum-chucking the chip by a chucking collet, the flow rate of a vacuum chucking system in the chucking collet is monitored to check a bent state of the chip before complete separation of the first chip from the adhesive tape. | 12-01-2011 |
20120168091 | Method and Apparatus for Forming a Thin Lamina - A method for producing a lamina from a donor body includes implanting the donor body with an ion dosage and separably contacting the donor body with a susceptor assembly, where the donor body and the susceptor assembly are in direct contact. A lamina is exfoliated from the donor body, and a deforming force is applied to the lamina or to the donor body to separate the lamina from the donor body. | 07-05-2012 |
20120216961 | METHOD FOR DE-BONDING FLEXIBLE DEVICE - The disclosure provides a method for de-bonding a flexible device. The method for de-bonding a flexible device includes providing a first carrier to mount a carrier substrate thereon, a release layer thereon and a flexible device covering the release layer and a portion of the carrier substrate. A vacuum suction process is performed to suction the flexible device using a vacuum device. A separation process is performed with air entering into an interface between the flexible device and the release layer to separate a portion of the flexible device from the release layer and the carrier substrate using a separation device. A first release process is performed so that the portion of the flexible device is separated from the vacuum device. | 08-30-2012 |
20120227909 | Removal Roller, Device and Method for Detaching a Film from a Disc-Shaped Workpiece - The present invention provides a removal roller ( | 09-13-2012 |
20130048222 | SUBSTRATE SEPARATING APPARATUS, LOAD LOCK APPARATUS, SUBSTRATE BONDING APPARATUS, AND SUBSTRATE SEPARATING METHOD - A substrate separating method includes: holding, in a predetermined position, a substrate sandwiched between a first holder and a second holder opposed to each other; and relatively moving the first holder and the second holder while the substrate is held in the predetermined position. In holding the substrate, the substrate may be held in the predetermined position by effecting a pressurizing force or a suction force onto the substrate. Also in holding the substrate, the substrate may be held in contact with one of the first holder and the second holder. | 02-28-2013 |
20130133838 | Vacuum Peeling Apparatus and Method - The invention relates generally to a vacuum peeling apparatus and a vacuum peeling method. The vacuum peeling apparatus may include a chamber, a sealing maintain frame disposed inside the chamber, a first air tube disposed along a bottom end of the sealing maintain frame and configured to be expandable, a peeling prevention panel configured so as to be inserted into a center of the sealing maintain frame, and a second air tube disposed along an end of the peeling prevention panel. | 05-30-2013 |
20130186574 | Fiber Batt Reclaiming Method and Apparatus - The fiber batt reclaiming method and apparatus separates the fiber batt portion of surplus or defective fiberglass insulation from the paper backing material attached to the fiber batt. As the insulation is fed to a perforated roller, a vacuum means draws the backing material to the roller so that the backing material adheres to the roller. As the roller rotates the fiber batt portion of the insulation is separated from the backing material by a separation tool. In accordance with various embodiments of the apparatus, the separation tool may be an elongated knife, a pressurized air bar, a circular saw bar, or an elongated wire brush. | 07-25-2013 |
20140060748 | FILM PEELING APPARATUS AND FILM PEELING METHOD USING THE SAME - A film peeling apparatus includes a peeling pin that push-lifts a first end portion of a cut portion of a film toward a second end portion of the cut portion, a peeling roller that push-lifts the second end portion of the cut portion toward the first end portion of the cut portion by closely contacting the second end portion of the cut portion and rotating, and an absorbing unit that absorbs and removes the cut portion of the film push-lifted by the peeling pin and peeling roller. | 03-06-2014 |
20140262053 | DEBONDERS AND RELATED DEVICES AND METHODS FOR SEMICONDUCTOR FABRICATION - Disclosed are systems, devices and methodologies for debonding wafers from carrier plates. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed. | 09-18-2014 |
20140283999 | FILM RELEASING DEVICE AND FILM RELEASING METHOD - A film releasing device includes at least one transport member configured to transport a stack of a substrate and a film and to discharge the stack, a negative-pressure-generating unit provided on a discharge side of the transport member and configured to attract the film with a negative pressure generated on a surface of the film, and a communicating portion communicating with atmosphere and provided in a region of the film that is on a side facing the substrate, the region overlapping a part of a negative-pressure-generated area of the film. The film is released from the substrate in such a manner as to be guided in a direction that is different from a direction of discharge while the film is attracted to the negative-pressure-generating unit. | 09-25-2014 |
20140299277 | WAFER-RELATED DATA MANAGEMENT METHOD AND WAFER-RELATED DATA CREATION DEVICE - A wafer-related data creation device including a setting stand for setting wafer pallets, a test-use suction nozzle for picking up die on dicing sheet of a wafer pallet set on the setting stand, a test-use pusher pin for pushing up the adhesive section of die from dicing sheet which is being attempted to be picked up by test-use suction nozzle, and a test-use camera for capturing an image of die on dicing sheet is used. The wafer pallet for which wafer-related data is to be created is set on the setting stand of wafer-related device creation device, an image captured by test-use camera is processed, pusher movement of test-use pusher pin and die pickup movement of test-use pickup nozzle is performed, and wafer-related data is created. | 10-09-2014 |
20150114572 | DEVICES AND METHODS OF OPERATION FOR SEPARATING SEMICONDUCTOR DIE FROM ADHESIVE TAPE - The embodiments described herein provide an apparatus and method for separating dies from adhesive tape. In general, these techniques use applied vacuum and one or more channels in an extractor base surface to progressively peel adhesive tape away from the die. When the adhesive tape has been peeled away from the entire die the die can be removed and packaged. Such a technique can reduce the strain the die and thus may reduce the probability of cracks occurring in the die, and is thus particularly applicable to removing adhesive tape from relatively thin dies. | 04-30-2015 |
20150122427 | FLEXIBLE DISPLAY PANEL PEELING APPARATUS AND PEELING METHOD USING THE SAME - A flexible display panel peeling apparatus for peeling a flexible display panel attached to a top surface of a substrate includes a stage fixed to the substrate and a peeling plate comprising a bottom surface that is convex toward the flexible display panel and a plurality of adsorption units defined in the bottom surface to adsorb the flexible display panel to the bottom surface. Since the flexible display panel is successively peeled through the peeling plate, the flexible display panel may be peeled from the substrate without being damaged. | 05-07-2015 |
20160159069 | LAMINATED SUBSTRATE SEPARATING DEVICE AND METHOD FOR SEPARATING LAMINATED SUBSTRATE - A laminated substrate separating device used for separating a first substrate from a second substrate of a laminated substrate is provided. The first and the second substrates are misaligned at an edge of the laminated substrate. The laminated substrate separating device includes a base where the laminated substrate is disposed thereon, and a separating tool movably disposed on the base along an axis. The separating tool presses a portion of the first substrate being exposed out of the second substrate at a misaligned edge such that a gap is formed between the first and the second substrates. The separating tool inserts into the gap at the misaligned edge to press the first substrate, such that the second substrate is separated from the first substrate. A method for separating laminated substrate is also provided. | 06-09-2016 |
156708000 | Using air blast directly against work during delaminating | 5 |
20130255887 | HIGH TEMPERATURE SHEET HANDLING SYSTEM AND METHODS - Methods and apparatus provide for imparting a controlled supply of gas to at least one Bernoulli chuck to provide a balanced draw and repellant gas flow to a material sheet; and at least one of: elevating a temperature of the supply of gas to the at least one Bernoulli chuck such that the gas flow to the material sheet is provided at the elevated temperature, providing a stream of gas to an insulator substrate to promote separation of an exfoliation layer from a donor semiconductor wafer, and providing a stream of gas to a junction of the insulator substrate and any support structure to promote separation of the insulator substrate and the supporting structure. | 10-03-2013 |
20140238617 | SYSTEM AND METHOD FOR REMOVAL OF A LAYER - A system includes a first drive unit used for driving at least one of a release device, a gripper device, and a second drive unit used for driving a support device. The release device is a vacuum device. The vacuum device is coupled to a vacuum source and applies a suction force against an edge portion of one layer among a first layer disposed on a second layer. Another layer among the first layer and the second layer is held by a support surface of the support device. The vacuum device and/or the support device are movable upwards and downwards for peeling the edge portion of the one layer from the other layer. The gripper device holds the peeled edge portion of the one layer and the support device or the gripper device is movable along at least one axis for removing the one layer from the other layer. | 08-28-2014 |
20140332166 | PEELING DEVICE, PEELING SYSTEM, AND PEELING METHOD - A peeling device separates a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate. The peeling device includes a holding unit configured to hold the superposed substrate, and a plurality of position adjustment units movable forward and backward with respect to a side surface of the superposed substrate held in the holding unit, and the position adjustment unit configured to perform a position adjustment of the superposed substrate by contacting the side surface of the superposed substrate. | 11-13-2014 |
20160018587 | System for Assembling Optical Films for Displays - Display backlight structures may provide backlight illumination that passes through display layers in the display. Computer-controlled equipment such as robotic arms with gripper structures may be used in assembling backlight layers such as a reflector, light guide plate, diffusers, and prism films into a backlight unit. The grippers may include mechanical grippers and vacuum heads. A vacuum gripper head may have a plenum to which a perforated plate and porous layer are attached for distributing the vacuum. Computer-controlled air sources may be used to blow streams of deionized air between backlight layers to separate the backlight layers during assembly. Release liners may be removed using robotic arms and grippers. Translation stages may move a backlight layer storage frame between stations. A cleaning tool with a solvent dispenser and air jets may clean backlight layers. A camera system may be used during alignment and positioning operations. | 01-21-2016 |
20160163907 | PHOTOVOLTAIC STRUCTURE CLEAVING SYSTEM - A cleaving system is described. The system can include a holding apparatus to retain a photovoltaic structure at a center section of a cleaving platform. The system can further include a contact apparatus to make contact with the photovoltaic structure and separate it into a plurality of strips. During operation, the system can activate an actuator to move the contact apparatus against the photovoltaic structure, thereby separating the photovoltaic structure into strips. | 06-09-2016 |