Class / Patent application number | Description | Number of patent applications / Date published |
324759010 | After-test activity | 18 |
20100295571 | Device and Method for Configuring a Semiconductor Circuit - A device and method for configuring a semiconductor circuit having at least two identical or similar functional units, the faulty unit being identified and deactivated if an error occurs in at least one of the identical or similar functional units. | 11-25-2010 |
20120056637 | APPARATUS AND METHOD FOR QUICKLY DETERMINING FAULT IN ELECTRIC POWER SYSTEM - An apparatus for quickly determining a fault in an electric power system includes a current transformer, a current determination unit and a fault determination unit. The current transformer detects current supplied to the electric power system and outputs a current detection voltage. The current determination unit respectively compares the current detection voltage, the first-order differential voltage of the current detection voltage and the second-order differential voltage of the current detection voltage with predetermined first, second and third reference voltages. The fault determination unit determines whether a fault occurs based on the compared result of the current determination unit and generates a trip signal when it is determined that the fault has occurred. | 03-08-2012 |
20120119775 | CIRCUITRY FOR HOT-SWAPPABLE CIRCUIT BOARDS - Electronic circuits and methods are provided for use in hot-swappable circuit board applications. Circuitry detects an electrical ground connection and signals operation of a hot-swap controller. Detection of stable operating power causes a hierarchical startup of plural voltage regulators. Sensing stable output power from the last of the voltage regulators triggers the configuration of one or more programmable devices. Circuitry and other resources of a hot-swappable circuit board are protected against electrical transient-related damage by virtue of the present teachings. | 05-17-2012 |
20130106459 | 3D-IC INTERPOSER TESTING STRUCTURE AND METHOD OF TESTING THE STRUCTURE | 05-02-2013 |
20140091828 | Sort Probe Gripper - A sort probe gripper includes a body, a jaw mount inserted into the body, a plurality of grippers mounted in the jaw mount and an actuator sleeve slidable along the body to engage the plurality of grippers. | 04-03-2014 |
20140118019 | METHOD OF TESTING A SEMICONDUCTOR STRUCTURE - A method of testing a semiconductor structure is provided, including providing at least a semiconductor structure having an interposer and a semiconductor element disposed on the interposer; disposing the semiconductor structure on a carrier having a supporting portion, with the interposer being supported by the supporting portion; and performing a test process. The semiconductor structure has been tested for its electrical performance prior to packaging, thereby eliminating the necessity for a conductive pathway to pass through an inner circuit of an package substrate. Therefore, the testing process is accelerated and the time is save. | 05-01-2014 |
20140266286 | THROUGH-SUBSTRATE VIA WITH A FUSE STRUCTURE - A device includes a conductive via to provide an electrical path through a substrate. The device further includes a conductive element. The device further includes a fuse coupled to the conductive via and coupled to the conductive element to provide a conductive path between the conductive via and the conductive element. The conductive path enables testing of continuity of at least a portion of the conductive via. The fuse is configured to be disabled after the testing of the continuity of the conductive via. | 09-18-2014 |
20140266287 | TESTING DEVICE FOR ELECTRICAL SAFETY USING WIRELESS COMMUNICATION - Devices and methods for enhancing electrical safety are provided herein. Devices testing the safety of light fixtures are provided. Also provided are a variety of testing tools for improving electrical safety. The devices are generally capable of wirelessly communicating with a computer, particularly a hand-held device such as a smart-phone or tablet. Methods for using the devices are also provided. | 09-18-2014 |
20150115992 | GLASS SUBSTRATE FOR ELECTRONIC AMPLIFICATION AND METHOD FOR MANUFACTURING THE SAME - There is provided a glass substrate for electronic amplification having through holes formed on a plate-like glass member and used for causing an electron avalanche in the through holes, wherein a shape of the glass substrate for electronic amplification and a material of the glass member are determined so that an insulation resistance in a plate thickness direction per plane of 100 cm | 04-30-2015 |
20160087428 | SEMICONDUCTOR APPARATUS AND TEST SYSTEM INCLUDING THE SAME - A semiconductor apparatus includes an input/output pad configured to exchange signals with an external device; a control pad configured to be inputted with a discharge signal from the external device; and a first electrostatic protection unit configured to form an electrostatic discharge path from the input/output pad to a first voltage supply line according to the discharge signal. | 03-24-2016 |
324759020 | Marking tested objects | 2 |
20140055160 | APPARATUS AND METHOD FOR INSPECTION OF MARKING - An apparatus and method for inspecting whether marking of a target chip in a wafer has been performed normally are provided. The apparatus includes a voltage application detector which detects application of a voltage to an external circuit, an image pickup unit which captures an image, and a controller which controls the image pickup unit to capture an image at at least one predetermined point when the application of the voltage is detected by the voltage application detector and determines whether the marking of the target chip has been performed normally based on the captured image. Accordingly, extra time is not required to inspect whether the marking of the target chip in the wafer has been performed normally and the inspection is performed without using a prober operation program. | 02-27-2014 |
20160003899 | OSCILLATION-BASED SYSTEMS AND METHODS FOR TESTING RFID STRAPS - Systems and methods are provided for testing remote frequency identification (RFID) straps. A testing system includes an amplifier electrically coupled to an inductor or inductive component. The system further includes a pair of contact points to be placed in contact with a pair of contact pads of an RFID strap. Connecting the contact points and the contact pads places the RFID strap in parallel with the inductor to define a resonant circuit. The characteristics of the resonant circuit as an oscillator depend at least in part on the capacitance and the resistance of the RFID strap. As such, the characteristics of the resonant circuit as an oscillator may be monitored to determine the capacitance and/or the resistance of the RFID strap. One or more characteristics of the RFID strap may be compared to one or more threshold values to determine whether the RFID strap is acceptable or defective. | 01-07-2016 |
324759030 | Sorting tested objects | 6 |
20120194214 | EQUIPMENT AND METHOD TO CLASSIFY SEMICONDUCTOR PACKAGES - An equipment and method to classify semiconductor packages diced on a substrate into defective and non-defective semiconductor packages includes a loading preparation table to receive a plurality of semiconductor packages to be inspected, a first inspection unit to inspect and classify the semiconductor packages received at the loading preparation table into normal semiconductor packages and defective semiconductor packages, a temporary loading table to temporarily receive at least a portion of the normal semiconductor packages, a first loading picker to transfer the defective semiconductor packages from the loading preparation table to a defective package loading tray and to transfer the normal semiconductor packages from the temporary loading table to the loading preparation table, and a second loading picker to transfer the normal semiconductor packages from the loading preparation table to a normal package loading tray. | 08-02-2012 |
20130057311 | SCREENING METHOD, SCREENING DEVICE AND PROGRAM - This invention is to detect defective products of semiconductor devices with high accuracy even when the characteristics of the semiconductor devices vary according to their positions on each of wafers. A screening method includes the steps of measuring respective electrical characteristic values of a plurality of semiconductor devices included in a wafer; acquiring respective positional information of the semiconductor devices over the wafer; subtracting components relatively gently varying over the surface of the wafer, of variations in the electrical characteristic values of the semiconductor devices from the respective electrical characteristic values of the semiconductor devices to thereby correct the respective electrical characteristic values of the semiconductor devices; generating distributions of the post-correction electrical characteristic values with respect to the semiconductor devices; and detecting semiconductor devices in which the post-correction electrical characteristic values assume outliers, out of the semiconductor devices, based on the distributions. | 03-07-2013 |
20130241591 | Apparatus and Method for Screening Electrolytic Capacitors - A method for screening electrolytic capacitors places a capacitor in series with a resistor, applying a test voltage and following the charge curve for the capacitor. A high voltage drop across the capacitor indicates high reliability and a low voltage drop is used to reject the piece. The leakage current is not adversely affected during the test. | 09-19-2013 |
20130300448 | TESTING METHOD AND TESTING DEVICE FOR PHOTOELECTRIC CONVERSION DIE - A testing device includes a laser source, a current testing device, and a processor. The processor includes a user interface, a control unit, a calculation unit, and a data generation unit. The user interface receives user inputs to determine control parameters. The control unit controls the laser source to emit a laser beam on a photoelectric conversion die according to the control parameters. | 11-14-2013 |
20140176178 | METHOD FOR AUTOMATICALLY SORTING LEDS ACCORDING TO ELECTROSTATIC RESISTANCE AND SYSTEM USING THE SAME - Disclosed is a method for automatically sorting LEDs (light emitting diode) according to electrostatic resistance and a system using the same. The system includes a transport carrier for laying LEDs and passing LEDs through an electrostatic discharging zone, a lightening evaluating zone, and a sorting zone in sequence. An electrostatic discharging device discharges an electrostatic power to the LED in the electrostatic discharging zone. Furthermore, a lighting device inputs a lightening power to the LED in the lightening evaluating zone. Moreover, an evaluating device in the evaluating zone generates an evaluating signal to a sorting device in the sorting zone according to the lighting condition of the LED for allowing the sorting device to sort LEDs according to electrostatic resistance. Thereby the reliability both for the failure rate and the detection rate can be raised. | 06-26-2014 |
20140184262 | LOW-VOLTAGE IC TEST FOR DEFECT SCREENING - System and method using low voltage current measurements to measure voltage network currents in an integrated circuit (IC). In one aspect, a low voltage current leakage test is applied voltage networks for the IC or microchip via one or more IC chip connectors. One or multiple specifications are developed based on chip's circuit delay wherein a chip is aborted or sorted into a lesser reliability sort depending whether the chip fails specification. Alternately, a low voltage current leakage test begins an integrated circuit test flow. Then there is run a high voltage stress, and a second low voltage current leakage test is thereafter added. Then, there is compared the second low voltage test to the first low V test, and if the measured current is less on second test, this is indicative of a defect present which may result in either a scrap or downgrade reliability of chip. | 07-03-2014 |