Entries |
Document | Title | Date |
20100301887 | PROBE CARD - A probe card according to the present invention includes a support plate for supporting probes that contact an object to be inspected, a circuit board, a holding member for holding a lower surface of an outer peripheral portion of the support plate, and an abutting member disposed between the lower surface of the outer peripheral portion of the support plate and the holding member and protruding upward to abut to the lower surface of the outer peripheral portion of the support plate. Accordingly, horizontal expansion of the support plate itself is allowed, and at the time of inspecting electrical characteristics of the object to be inspected, even though the temperature of the support plate is increased and the support plate expands, the support plate can expand in a horizontal direction, thereby suppressing vertical deformation of the support plate. | 12-02-2010 |
20100301888 | PROBE DEVICE - A reinforcing member is formed at a top surface side of a probe card including a support plate for supporting a contactor and a circuit board. A plurality of long guide holes are formed in an outer peripheral portion of the reinforcing member. Fixing members fixed to a holding member and collars formed around outer circumferences of the fixing members are formed in the guide holes. A length in a longitudinal direction of each of the guide holes is greater than a diameter of each of the collars, and a central line in the longitudinal direction of each of the guide holes passes through a center of the reinforcing member. Due to the guide holes, horizontal expansion of the reinforcing member itself is allowed. | 12-02-2010 |
20100308854 | PROBE CARD SUBSTRATE WITH BONDED VIA - The present invention is directed to a probe head having a probe contactor substrate with at least one slot that passes through the probe contactor substrate, at least one probe contactor adapted to test a device under test, with the probe contactor being coupled to the a top side of the probe contactor substrate and electrically connected to a terminal also disposed on top of the probe contactor substrate, and a space transformer having at least one bond pad coupled to a top side of the space transformer, and a bond interconnect which electrically couples the bond pad to the terminal through the slot in the probe contactor substrate. | 12-09-2010 |
20100308855 | PROBE CARD FOR TESTING INTEGRATED CIRCUITS - An embodiment of a probe card adapted for testing at least one integrated circuit integrated on a corresponding at least one die of a semiconductor material wafer, the probe card including a board adapted for the coupling to a tester apparatus, and a plurality of probes coupled to the said board, wherein the probe card comprises a plurality of replaceable elementary units, each one comprising at least one of said probes for contacting externally-accessible terminals of an integrated circuit under test, the plurality of replaceable elementary units being arranged so as to correspond to an arrangement of at least one die on the semiconductor material wafer containing integrated circuits to be tested. | 12-09-2010 |
20100327896 | PROBE ASSEMBLY AND MANUFACTURING METHOD THEREOF - A probe assembly has insertion holes formed in a base layer provided on a circuit board. Probe pins are inserted into the insertion holes and fixed by a conductive adhesive filled in the insertion holes. The probe pins can be arranged with small pitch without mechanically electrically interfering with neighboring pins using the insertion holes. Furthermore, the base layer is formed of a semiconductor material to prevent a problem caused by a difference in the coefficient of thermal expansion between the base layer and a wafer. Moreover, coplanarity and alignment accuracy of the probe pins can be improved using aligning mask layers or aligning mask in a process of manufacturing the probe assembly. In addition, probe assembly manufacturing time can be reduced by using a pin array frame into which a large number of probe pins are temporarily inserted. | 12-30-2010 |
20100327897 | WIRING SUBSTRATE AND PROBE CARD - A wiring substrate that allows wiring at a fine pitch and has a coefficient of thermal expansion close to the coefficient of thermal expansion of silicone, and a probe card that includes the wiring substrate are provided. To this end, there are provided a wiring substrate that includes a ceramic substrate having a coefficient of thermal expansion of 3×10 | 12-30-2010 |
20100327898 | PROBE CARD AND INSPECTION APPARATUS - An automatic switching mechanism is controlled by a probe card independent from a tester without limitation of the number of control signals from the tester. A probe card and an inspection apparatus include probes to be brought into contact with electrodes of inspection targets and a power supply channel electrically connecting the probes to a tester. The automatic switching mechanism divides each of the power supply channels into a plurality of power supply wiring portions, which are respectively connected to the probes; and shuts off the power supply wiring responsive to electrical fluctuation such as overcurrent. An electrical fluctuation detection mechanism detects an electrical fluctuation due to a defective product among the inspection targets. A control mechanism, responsive to detection of an electrical fluctuation, shuts off the power supply wiring portion if the electrical fluctuation is caused by the automatic switching mechanism. | 12-30-2010 |
20110001506 | TESTING APPARATUS FOR INTEGRATED CIRCUIT - An apparatus for testing an integrated circuit comprises: a chip unit with a plurality of electronic parts such as chip units arranged on the upside of a chip support; a probe unit having a plurality of contacts arranged on the underside of a probe support and spaced downward from the chip unit; a connection unit supporting the probe unit spaced downward from the chip unit on a pin support so as to penetrate the pin support in an up-down direction; and a coupling unit which couples separably the chip unit, the probe unit and the connection unit and displaces one of the chip support and the probe support and the pin support in a direction to approach each other and to be away from each other relative to the connection unit. | 01-06-2011 |
20110001507 | SEMICONDUCTOR DEVICE AND METHOD OF PERFORMING ELECTRICAL TEST ON SAME - A semiconductor device comprises a substrate, a plurality of bonding pads formed on the substrate, a reference pad comprising a plurality of sensing lines located in a reference pad area of the substrate, and a plurality of detection wirings electrically connected to the respective sensing lines. The bonding pads are configured to make contact with a plurality of probe pins of a test apparatus to receive electrical test signals for an electrical test of the semiconductor device. The reference pad is configured to make contact with a reference pin of the test apparatus, and the reference pad area has substantially the same shape and size as the bonding pads such that positions in the reference pad area correspond one-to-one with positions in each of the bonding pads. | 01-06-2011 |
20110006797 | PROBE CARD AND TEST EQUIPMENT - Provided are a probe card including a first area group including a plurality of first areas, each including a plurality of probes for input pad and probes for output pad, the first areas being aligned in L rows by M columns (L, M: natural number); and a second area group including a plurality of second areas, each including a plurality of probes for input pad, the second areas being aligned in (L×N) rows by M columns (N: natural number); and the first area group and the second area group are continuously connected in a column direction according to the chip alignment, such that the first areas and the second areas are aligned in {L+(L×N)} rows by M columns. | 01-13-2011 |
20110006798 | PROBE CARD CASSETTE AND PROBE CARD - A holding section ( | 01-13-2011 |
20110018568 | Semiconductor test equipment with concentric pogo towers - A semiconductor test equipment with concentric pogo towers is disclosed, which comprises a base, a tester head, an outer pogo tower, and an inner pogo tower. The inner pogo tower is concentrically received in the outer pogo tower, and a connecting slot of the inner pogo tower is correspondingly engaged with a connecting pin of the outer pogo tower. The outer pogo tower is fixed to the load board together with the inner pogo tower, whereby a plurality of outer pogo pins of the outer pogo tower and a plurality of inner pogo pins of the inner pogo tower are electrically connected to the load board respectively. Therefore, the present invention is capable of expanding the test specifications, but also to change rapidly from different test specifications through replacing a different probe card but without to modify any other hardware. | 01-27-2011 |
20110018569 | TEST APPARATUS OF SEMICONDUCTOR DEVICE AND METHOD THEREOF - A test apparatus according to the present invention includes a probe card recognition unit that recognizes positions of at least two probe card marks formed to a probe card and assumes a probe card mark connection line connecting the positions of the probe card marks, a backing material recognition unit that recognizes positions of at least two backing material marks formed to a backing material where a semiconductor chip is fixed thereto and assumes a backing material mark connection line connecting the positions of the backing material mark, a positional relationship recognition unit that recognizes a positional relationship between the probe card and the backing material according to the probe card mark connection line and the backing material mark connection line, and a correction unit that corrects the position of at least one of the probe card and the backing material according to the positional relationship. | 01-27-2011 |
20110025359 | BOND AND PROBE PAD DISTRIBUTION - An integrated circuit (IC) that includes a plurality of bond pads disposed on a surface of the IC and a plurality of probe pads disposed on the surface of the IC is provided. Each of the plurality of probe pads is in electrical communication with corresponding bond pads. The plurality of probe pads are linearly configured across the surface. In one embodiment, the probe pads are disposed along a diagonal of the surface of the die defined between opposing vertices of the die surface. In another embodiment, multiple rows of linearly disposed probe pads are provided on the surface. | 02-03-2011 |
20110025360 | SEMICONDUCTOR INTEGRATED CIRCUIT TEST DEVICE - A semiconductor IC test device includes: an IC tester providing first and second control signals (CS | 02-03-2011 |
20110031991 | PROBE BLOCK - A probe block mounted on a probe card is provided for achieving fine pitch probes. A probe block for a probe card of a semiconductor test device according to the present invention includes a guide member and a probe. A guide member includes pairs of upper and lower holes and middle holes each interconnecting the upper and lower holes of each pair. A probe includes a first pin tip protruded through a corresponding upper hole for contacting a pad of a device to be tested and a second pin tip protruded through a corresponding lower hole for transferring an electrical signal to the device and a bridge part situated within the middle hole for interconnecting the first and second pin tips. The upper, lower, and middle holes allow the probe to elastically moves in vertical direction. The probe block of the present invention is advantageous in that the probes are supported by guide members so as not to be bent while maintaining a fine pitch. Also, the probe block of the present invention is advantageous in fabrication and repair since probes are elastically contacted rather than directly bonded to the circuit substrate of the probe card. | 02-10-2011 |
20110031992 | TESTER AND SEMICONDUCTOR DEVICE TEST APPARATUS HAVING THE SAME - Provided are a tester and a semiconductor device test apparatus having the tester. The tester includes a tested head configured to transfer electronic signals to a probe card. The tester also includes a leveling unit is provided on the tester head. The leveling unit is configured to apply a load to the probe card to maintain a level state of the probe card. | 02-10-2011 |
20110037492 | WAFER PROBE TEST AND INSPECTION SYSTEM - An apparatus for electrically testing a semiconductor device is herein disclosed. The apparatus includes carriers for a semiconductor device and a probe card ( | 02-17-2011 |
20110043237 | WAFER TRAY AND TEST APPARATUS - In order to shorten testing time of a plurality of devices under test formed on a semiconductor wafer, a wafer tray used by a test apparatus performing the test is provided. The wafer tray includes a first flow passage for fixing the semiconductor wafer to the wafer tray using vacuum suction, a second flow passage for fixing the wafer tray to the test apparatus using vacuum suction, and a heater for heating a loading surface on which at least the semiconductor wafer is loaded. By using this wafer tray, the semiconductor wafer, which is the object being tested, can be smoothly attached to and detached from different test heads, and testing can be begun quickly after the semiconductor wafer is attached to a test head. | 02-24-2011 |
20110043238 | METHOD OF MANUFACTURING NEEDLE FOR PROBE CARD USING FINE PROCESSING TECHNOLOGY, NEEDLE MANUFACTURED BY THE METHOD AND PROBE CARD COMPRISING THE NEEDLE - Disclosed are probe card needles manufactured using microfabrication technology, a method for manufacturing the probe card needles, and a probe card having the probe card needles. The probe needles are manufactured by forming, on a ceramic board, probe needle bases made of conductive metal, and a polymeric elastomer layer, by using photolithography and a photoresist, and continuously depositing conductive metal layers on the probe needle bases in such a manner as to be supported by the polymeric elastomer layer. The probe card comprises: a printed circuit board (PCB) which is connected to a test head for transmitting an electrical signal from a tester; a ceramic board located below the PCB and electrically connected to the PCB by a plurality of interface pins; a jig for mechanically holding the interface pins and the multilayer ceramic board to the PCB; and a plurality of probe needles attached to the lower surface of the multilayer ceramic board and making contact with electrical/electronic devices. | 02-24-2011 |
20110043239 | PROBE CARD - An object of the present invention is to provide a probe card which has good stability of the connection between testing electrodes and test electrodes even after exposure to high temperatures in the burn-in test, and is less susceptible to displacements in the positions of contact between the testing electrodes and conductive portions or between the conductive portions and probe needles or the test electrodes even after repeated use of the probe card. The probe card of the present invention is a probe card which includes a testing circuit board having the testing electrodes formed so as to correspond to the test electrodes and an anisotropic conductive member electrically connecting the test electrodes with the testing electrodes. The testing electrodes are formed so that at least ends of the testing electrodes protrude from a surface of the testing circuit board, and the anisotropic conductive member is a member which has an insulating base made of an anodized aluminum film having micropores therein and a plurality of conductive paths made of a conductive material, insulated from one another, and extending through the insulating base in a thickness direction of the insulating base. | 02-24-2011 |
20110043240 | METHOD AND APPARATUS FOR PROVIDING ACTIVE COMPLIANCE IN A PROBE CARD ASSEMBLY - A probe card assembly can comprise a first source of compliance and a second source of compliance. The probe card assembly can further comprise a controller, which can be configured to apportion a total compliance demand placed on the probe card assembly between the first source of compliance and the second source of compliance. | 02-24-2011 |
20110050265 | METHOD AND APPARATUS FOR MULTILAYER SUPPORT SUBSTRATE - Embodiments of the present invention can relate to probe card assemblies, multilayer support substrates for use therein, and methods of designing multilayer support substrates for use in probe card assemblies. In some embodiments, a probe card assembly may include a multilayer support substrate engineered to substantially match thermal expansion of a reference material over a desired temperature range; and a probe substrate coupled to the multilayer support substrate. In some embodiments, the reference material may be silicon. | 03-03-2011 |
20110050266 | Probe card - A probe card includes a plurality of probes that contacts a plurality of electrodes provided in the semiconductor wafer and that inputs or outputs an electrical signal in or from the electrodes, a probe head that holds the probes, a substrate having a wiring which is provided near the surface of the substrate facing the probe head so as to be contactable with the probe head and is connected to the probes, a core layer formed of a material which is buried in the substrate and has a coefficient of thermal expansion lower than that of the substrate, and a connecting member that electrically connects at least some of the probes with an external device via the wiring. | 03-03-2011 |
20110050267 | ELECTROMAGNETIC SHIELD FOR TESTING INTEGRATED CIRCUITS - An embodiment of a probe card is proposed. The probe card comprises a plurality of probes. Each probe is adapted to contact a corresponding terminal of a circuit integrated in at least one die of a semiconductor material wafer during a test phase of the wafer. Said plurality of probes includes at least one probe adapted to provide and/or receive a radio frequency test signal to/from the corresponding terminal during the test phase. Said probe card comprises at least one electromagnetic shield structure corresponding to the at least one probe adapted to provide and/or receive the radio frequency test signal for the at least partial shielding of an electromagnetic field irradiated by such at least one probe adapted to provide and/or receive the radio frequency test signal. | 03-03-2011 |
20110057678 | Ceramic Substrate, Functional Ceramic Substrate, Probe Card and Method for Manufacturing Ceramic Substrate - A ceramic substrate has a base material composed of an amorphous phase and particles composed of a crystalline phase and dispersed in the base material. Some of the particles are permitted to protrude from at least one surface of the base material. | 03-10-2011 |
20110089966 | APPARATUS AND SYSTEMS FOR PROCESSING SIGNALS BETWEEN A TESTER AND A PLURALITY OF DEVICES UNDER TEST - Apparatus is for processing signals between a tester and devices under test. In one embodiment, the apparatus includes at least one multichip module. Each multichip module has a plurality of micro-electromechanical switches between a set of connectors to the tester and a set of connectors to devices under test. At least one driver is provided to operate each of the micro-electromechanical switches. Other embodiments are also disclosed. | 04-21-2011 |
20110089967 | MEMS PROBE CARD AND MANUFACTURING METHOD THEREOF - Provided are a micro-electro-mechanical system (MEMS) probe card and a method for manufacturing the same. The method includes preparing first to nth low-temperature co-fired ceramic (LTCC) substrates each having a via hole, filling each via hole with a via filler conductor or a resistor, stacking the first to nth LTCC substrates and firing the stacked substrates at a temperature of 1,000° C. or less to prepare a LTCC multilayer substrate, forming an insulating layer on the surface of the LTCC multilayer substrate, and forming a thin film conductive line on the surfaces of the insulating layer and the via filler conductor. | 04-21-2011 |
20110095778 | PROBE CARD - A probe card is provided. The probe card detaches or separates a probe assembly and a test signal generator which generates test signals from the tester and the printed circuit board, so as to form a probe system module. The probe system module is secured into a probe card module by one or more securing unit. The probe card module includes the printed circuit board. Control signals from the tester are wirelessly transmitted to the probe system module and drive the probe system module to generate the corresponding test signals. Therefore, the loss or distortion of the test signals due to having longer transmitting distances will be reduced and thus the test quality can be improved. | 04-28-2011 |
20110109338 | INTERPOSER, PROBE CARD AND METHOD FOR MANUFACTURING THE INTERPOSER - An interposer is disclosed. The interposer includes a substrate capable of being processed by dry etching. The substrate includes a plurality of conductive holes penetrating from one side to the other side of said substrate. Each of said plurality of conductive holes has one end provided with a contact element on at least one side of said conductive hole. | 05-12-2011 |
20110121851 | PROBE CARD - A probe card of a semiconductor test apparatus having a plurality of space transformers supporting probe units of the probe card is provided. A probe card of the present invention includes a plurality of probe units, each comprising a guide member and at least one probe secured by the guide member and contacting a chip pad to be tested; a plurality of space transformers arranged below the respective probe units, each space transformer having wires electrically connected to lower terminals of the probes; a frame having a plurality of guide holes for fixedly positioning the respective probe units; an interposer array arranged below the space transformers for supporting the space transformers, interposer array comprising electrical connection means for supplying test signals to the wires of the space transformers; and a printed circuit board arranged below the interposer array for supporting the interposer array and electrically connected to the electrical connection means for supplying the test signals. In the probe card of the present invention, the probe units are independently supported by respective space transformers such that it is possible to reduce thermal distortion of the probe card and simplifying the manufacturing and repairing processes. | 05-26-2011 |
20110121852 | PROBE CARD AND TEST APPARATUS INCLUDING THE SAME - A probe card and a test apparatus including the probe card for improving test reliability. The probe card may include a first input terminal Microelectromechanical Systems (MEMS) switch that connects a first input terminal and a first input probe pin, wherein the first input terminal MEMS switch comprises a control portion that receives an operation signal and a connection portion that connects the first input terminal and the first input probe pin. The probe card may further include a first output terminal MEMS switch that connects a first output terminal and a first output probe pin, wherein the first output terminal MEMS switch comprises a control portion that receives the operation signal and a connection portion that connects the first output terminal and the first output probe pin. | 05-26-2011 |
20110128028 | PROBE CARD, MAINTENANCE APPARATUS AND METHOD FOR THE SAME - A maintenance apparatus and a maintenance method for a probe card are provided. The maintenance apparatus includes a first supporting member, a second supporting member, a first clamping member, a second clamping member, and a plurality of locking units. In the maintenance method, the first supporting member and the second supporting member are initially positioned underneath below the two sides of a positioning slice, respectively, and then the first clamping member and the second clamping member are each disposed on the first supporting member and the second supporting member, respectively. First clamping member and first supporting member, and second clamping member and second supporting member are secured together respectively by locking units. Thus two sides of positioning slice are secured tightly and the positioning slice is well fastened. A probe card is also provided. The probe card includes a guide slot having a size corresponding to that of maintenance apparatus. | 06-02-2011 |
20110128029 | STIFFENER ASSEMBLY FOR USE WITH TESTING DEVICES - A stiffener assembly for use with testing devices is provided herein. In some embodiments, a stiffener assembly for use with testing devices can be part of a probe card assembly that can include a stiffener assembly comprising an upper stiffener coupled to a plurality of lower stiffeners; and a substrate constrained between the upper stiffener and the plurality of lower stiffeners, the stiffener assembly restricting non-planar flex of the substrate while facilitating radial movement of the substrate with respect to the stiffener assembly. | 06-02-2011 |
20110148449 | CANTILEVER PROBE STRUCTURE FOR A PROBE CARD ASSEMBLY - A probe for a probe card assembly includes a beam and a fulcrum element. The fulcrum element is positioned between a base end portion of the beam and a tip end portion of the beam and is adapted for contact with the beam such that the beam is cantilevered by the fulcrum. | 06-23-2011 |
20110156740 | PROBE CARD - There is provided a probe card. A probe card according to an aspect of the invention may include: a printed circuit board; a horizontal regulator passing through the printed circuit board and having an insertion portion having a horizontal regulation bolt and an insertion portion having a curved portion provided on an end portion of the horizontal regulation bolt; a probe substrate electrically connected to the printed circuit board; and a connection member mounted on the probe circuit, engaged with the horizontal regulation portion, and having an insertion recess therein so that the insertion portion is rotated within the insertion recess. | 06-30-2011 |
20110163774 | PROBE CARD - In one embodiment, a probe card includes a substrate, a probe provided on the substrate, and a contact terminal. The contact terminal is provided at a position on the substrate where the contact terminal comes in contact with the probe when a shape anomaly is generated in the probe. | 07-07-2011 |
20110169517 | MEMS PROBE CARD AND METHOD OF MANUFACTURING SAME - Provided are a micro-electro-mechanical system (MEMS) probe card and a method for manufacturing thereof. The MEMS probe card includes a substrate provide with a via hole filler conductor or a via hole filled with the resistor, the resistive film formed on the via hole and the substrate, the insulating film and the resistive film formed on the resistive film and the substrate, and the electrode formed on the substrate to cover the insulating film | 07-14-2011 |
20110169518 | PROBE CARD, SEMICONDUCTOR INSPECTING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - A frame bonded and fixed to a back face of a probe sheet so as to surround a group of pyramid-shaped or truncated pyramid-shaped contact terminals collectively formed at a central region portion of the probe sheet on a probing side thereof is protruded from a multi-layered wiring board, and pressing force is imparted to the frame and a pressing piece at a central portion by a plurality of guide pins having spring property so as to tilt finely. | 07-14-2011 |
20110169519 | CONDUCTIVE FILM STRUCTURE, FABRICATION METHOD THEREOF, AND CONDUCTIVE FILM TYPE PROBE DEVICE FOR IC - A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump. | 07-14-2011 |
20110175637 | METHOD FOR MANUFACTURING PROBE CARD, PROBE CARD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR FORMING PROBE - Provided is a method for manufacturing a probe card which inspects electrical characteristics of a plurality of semiconductor devices in batch. The method includes: a step of forming a plurality of probes, which are to be brought into contact with external terminals of the semiconductor devices, on one side of a board which forms the base body of the probe card; a step of forming on the board, by photolithography and etching, a plurality of through-holes which reach the probes from the other side of the board; a step of forming, in the through-holes, through electrodes to be conductively connected with the probes, respectively; and a step of forming wiring, which is conductively connected with the through electrodes, on the other side of the board. | 07-21-2011 |
20110181314 | Member for adjusting horizontality, and probe card with the same - Disclosed herein are a member for adjusting horizontality and a probe card with the same. The member for adjusting horizontality according to the present invention horizontally couples a micro probe head to a probe substrate with an adhesive layer therebetween, and the member for adjusting horizontality which is coupled to the micro probe head does not have an edge of the coupling portion and an edge of the adhesive layer. Therefore, according to the member for adjusting horizontality and the probe card with the same of the present invention, it is possible to prevent the coupling portions of the micro probe head from being broken, by reducing stress applied to the micro probe head during the process of horizontally coupling the micro probe head to the probe substrate. | 07-28-2011 |
20110221465 | PROBE CARD AND MANUFACTURING METHOD THEREOF - A probe card and a manufacturing method thereof are provided. To manufacture the probe card, via holes for receiving probe pins are formed in a plate-shaped or block-shaped probe substrate, and the probe pins are simultaneously inserted into the via holes. Then the probe substrate is bonded onto a supportable board having a thermal expansion coefficient similar to that of a wafer, and the probe substrate is separated into individual parts each having a specific size that disallows a deviation in location of the probe pins from chip pads of the wafer in spite of thermal expansion of the probe substrate. Therefore, the probe card can be manufactured through a simpler and more cost-effective process while preventing a location deviation of the probe pins due to a difference in thermal expansion coefficient between the probe card and the wafer. The probe substrate and a main circuit board are electrically connected through connecting members passing through openings in the supportable board. The connecting members may be directly or indirectly connected to the main circuit board, and the probe substrate may be composed of first and second probe substrates. | 09-15-2011 |
20110227596 | PROBE-UNIT BASE MEMBER AND PROBE UNIT - A probe-unit base member having high rigidity and requiring no troublesome operations for its manufacture and a probe unit are provided. To achieve the purpose, the probe-unit base member includes a conductive substrate | 09-22-2011 |
20110234251 | PROBE CARD - A probe card installed in a probe device includes a supporting plate capable of supporting a contact body and a circuit board installed above a top surface of the supporting plate. A connection member is installed at a top surface of the circuit board and the supporting plate and the connection member are connected to each other by a connection body. Load control members are installed at a top surface of the connection member and capable of maintaining a contact load between the contact body and an object to be inspected at a constant level. Elastic members are installed at a peripheral portion of the connection member and capable of fixing a horizontal position of the supporting plate. An intermediate member is installed between the circuit board and the supporting plate and configured to elastically and electrically connect the circuit board and the supporting plate. | 09-29-2011 |
20110241716 | TEST HEAD AND SEMICONDUCTOR WAFER TEST APPARATUS COMPRISING SAME - [Object] Providing a test head capable of suppressing a probe card from bending. | 10-06-2011 |
20110254577 | Non-Reflow Probe Card Structure - In accordance with an embodiment, a probe card structure comprises a base board, a connection interposer over the base board, a substrate over the connection interposer, and a fixture over the substrate securing the substrate and the connection interposer to the base board. The connection interposer comprises interposer electrodes that provide an electrical connection between electrodes on the base board and first electrodes on the substrate. | 10-20-2011 |
20110254578 | SPACE TRANSFORMER COMPRISING AN ISOLATION RESISTOR FOR A PROBE CARD, AND METHOD FOR MANUFACTURING SAME - The invention provides a space transformer for a probe card including an isolation resistor for isolating electrical effects between adjacent channels to perform tests on a plurality of devices under test (DUTs) formed on a wafer at one time, the space transformer including: a plurality of ceramic layers on which circuits for testing the DUTs are printed and which are stacked on one another; an isolation resistor disposed between the ceramic layers and formed by printing a resistance material so as not to be exposed to the outside. The invention also provides a method of manufacturing a space transformer for a probe card including an isolation resistor for isolating electrical effects between adjacent channels to perform tests on a plurality of devices under test (DUTs) formed on a wafer at one time, the method including the steps of: printing a resistance material to form the isolation resistor in a ceramic sheet; stacking a ceramic sheet on the ceramic sheet on which the resistance material is printed such that the resistance material is disposed between the ceramic sheets; and sintering the stacked ceramic sheets. | 10-20-2011 |
20110260744 | PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD - A probe card for conducting an electrical test on a test subject includes a substrate body including a first surface, which faces toward the test subject, and a second surface, which is opposite to the first surface. A through electrode extends through the substrate body between the first surface and the second surface. A contact bump is formed in correspondence with the electrode pad and electrically connected to the through electrode. An elastic body is filled in an accommodating portion, which is formed in the substrate body extending from the first surface toward the second surface. The contact bump is formed on the elastic body. | 10-27-2011 |
20110279139 | PROBE CARD FOR TESTING HIGH-FREQUENCY SIGNALS - A probe card includes a circuit board, a flexible substrate, and a plurality of probes. The flexible substrate includes a plurality of arrayed conductive strips. The plurality of conductive strips is electrically connected to the printed circuit board. The plurality of probes is fixed to the printed circuit board, and the end of each probe is attached to one corresponding conductive strip. | 11-17-2011 |
20110291687 | PROBE CARD FOR TESTING SEMICONDUCTOR DEVICE AND PROBE CARD BUILT-IN PROBE SYSTEM - A probe card is includes a wafer and a plurality of needle patterns penetrating the wafer. The needle patterns are configured to supply an electrical signal for testing a separate wafer. The probe card may be mounted to a printed circuit board in a manner in which conductive patterns of the probe card are electrically connected to conductive terminals of the printed circuit board. The needle patterns may protrude from a lower end of the wafer and be formed so that an interval between needle patterns is the same as an interval between pads of a wafer to be tested. | 12-01-2011 |
20110309854 | Probe Card for Simultaneously Testing Multiple Dies - In accordance with an embodiment, a probe card comprises a contact pad interface comprising front side contacts and back side contacts electrically coupled together. The front side contacts are arranged to simultaneously electrically couple respective bumps of a plurality of dies on a wafer, and the back side contacts are arranged to electrically couple respective contacts of a testing structure. | 12-22-2011 |
20110316576 | Probe Card - Disclosed is a probe card including: a circuit board; a supporting plate installed below the circuit board and supporting a plurality of contact members contacting a subject to be inspected during inspection; an elastic member installed below the circuit board and above the supporting plate and having flexibility with gas filled therein, and applying a predetermined contact pressure to the plurality of contact members when the plurality of contact members contact the subject to be inspected; and a conductive section placed in the elastic member and electrically connecting the circuit board and the contact members during inspection, and the conductive section includes a conductive layer that includes an insulating layer having flexibility and a wiring layer formed on the insulating layer. | 12-29-2011 |
20120007626 | TESTING TECHNIQUES FOR THROUGH-DEVICE VIAS - Techniques for testing an electronic device with through-device vias can include using a probe card assembly with probes for contacting connection structures of the electronic device including ends of through-device vias of the electronic device. A pair of the probes can be electrically connected in the probe card assembly and can thus contact and form a direct return loop from one through-device via to another through-device via of a pair of the through-device vias with which the pair of probes is in contact. The electronic device can include test circuitry for driving a test signal onto the one of the through-device vias and a receiver for detecting the test signal on the other of the through-device vias. | 01-12-2012 |
20120007627 | PROBE HEAD OF PROBE CARD AND MANUFACTURING METHOD OF COMPOSITE BOARD OF PROBE HEAD - A probe head of vertical probe card and a manufacturing method of a composite board thereof are provided. The probe head includes guide plate, composite board, and probe pin. The composite board includes first board layer and second board layer which are laminated together by joining operation. The composite board further includes through hole which is made by drilling and passed all the way through the first board layer and the second board layer. The friction coefficient of the first board layer is less than that of the second board layer, and the thermal expansion coefficient of the second board layer is less than that of the first board layer. The probe pin is penetrated all the way through the through hole of the composite board. By this, friction between the probe pin and composite board is reduced so as to stabilize the position of the probe pin. | 01-12-2012 |
20120038384 | PROBE BOARD AND METHOD OF MANUFACTURING THE SAME - There are provided a probe board and a method of manufacturing the same. The probe board includes a ceramic substrate having an uneven portion in one surface thereof, one or more electrode pads placed on the uneven portion, and a buffer portion placed along an outer circumferential surface of each of the electrode pads, the buffer portion being formed by melting the ceramic substrate. | 02-16-2012 |
20120043987 | Probe Card for Testing Semiconductor Devices and Vertical Probe Thereof - A vertical probe for testing semiconductor devices includes a bottom contact and a top contact stacked on the bottom contact in a substantially linear manner. In one embodiment of the present invention, the bottom contact includes a plurality of first wave springs stacked one on top of another in a crest to crest manner, the bottom contact has a bottom opening configured to contact a device under test, and the wave spring is configured to provide a vertical displacement for relieving the stress generated as the vertical probe contacts the device under test, wherein the width of the top contact is greater than the width of the bottom contact. | 02-23-2012 |
20120068728 | Probe Card - A probe card to be used with a tester that tests an electrical characteristic of an electronic circuit formed in in a wafer is disclosed. The probe card includes a first transmitter/receiver component that is mounted on a lower surface of a tester board and electrically connected to the tester; a second transmitter/receiver component that is provided to oppose the first transmitter/receiver component and carries out contactless transmission/reception of signals with the first transmitter/receiver component; plural probes that are configured to come in contact with corresponding electrode pads of the electronic circuit and electrically connect the corresponding electrode pads and the second transmitter/receiver component; an expandable chamber having flexibility so that the expandable chamber may be inflated by introducing gas thereinto, thereby moving the plural probes away from the tester board. | 03-22-2012 |
20120098563 | INSPECTION DEVICE WITH VERTICALLY MOVEABLE ASSEMBLY - The inspection of semiconductors or like substrates by the present mechanism minimizes deflection in the checkplate and probe card. An inspection device including a housing, a toggle assembly within the housing, an objective lens assembly attached within the toggle assembly including an objective coupled within an objective focus, wherein the objective focus is deflectable along an optics axis, and a cam assembly including a rotary cam and a window carrier, wherein the window carrier is moveable along the optics axis with rotation of the rotary cam, wherein the cam assembly is coupled to the toggle assembly with the objective and window are aligned along the optics axis. | 04-26-2012 |
20120112781 | CONTACTOR, CONTACT STRUCTURE, PROBE CARD, AND TEST APPARATUS - A contactor and an associated contact structure, probe card and test apparatus are provided. The contact may include a base part having three or more steps in a stairway state, a support part with a rear end side provided at the base part and a front end side sticking out from the base part, and a conductive part formed on a surface of the support part and electrically contacting a contact of a device under test. | 05-10-2012 |
20120119773 | Testing Auxiliary Apparatus - A testing auxiliary apparatus for assisting a testing apparatus to test signals of testing points of a circuit board, includes: a testing base having a testing platform with probes vertically disposed thereon and corresponding to the testing points, and extension testing points exposed from the testing platform and electrically connected to the probes so as for the testing apparatus to test signals; a carrier board disposed on the testing base and capable of ascending and descending relative to the testing platform and including a positioning portion for positioning the circuit board and through holes corresponding to the probes; and a pressing member disposed on the testing base for pressing the circuit board and driving the carrier board to descend such that the probes come into contact with the testing points through the through holes, thereby avoiding the inconvenience of searching for testing points on the circuit board with high-density pins. | 05-17-2012 |
20120126843 | PROBE CARD HOLDING APPARATUS AND PROBER - A probe card holding apparatus which is provided at a prober and holds a probe card includes: a clamp mechanism which clamps a clamp head which is formed at the probe card; a clamp bar which is laid over an opening of the prober in which the probe card is inserted; and an elevator device which is provided at the clamp bar and moves up and down the clamp mechanism. | 05-24-2012 |
20120146679 | PROBE CARD STIFFENER WITH DECOUPLING - A stiffener for a probe card assembly can include decoupling mechanisms disposed within radial arms of the stiffener. The decoupling mechanisms can be compliant in a direction along a radial direction of said radial arm and rigid in a direction perpendicular to said radial arm. The decoupling mechanisms can decouple the stiffener from thermally induced differential radial contraction and expansion of the stiffener relative to the cardholder to which the stiffener is mounted. This can reduce thermally-induced vertical translation of the probe card assembly. | 06-14-2012 |
20120153982 | TESTER AND TEST SYSTEM INCLUDING THE SAME - Provided are a tester configured to test a semiconductor device and a test system including the same. The tester may include at least one contact unit and at least one memory controller. The contact unit is in contact with the semiconductor device. The memory controller is connected to the contact unit. The memory controller controls data input/output (I/O) operations of the semiconductor device and tests the semiconductor device. | 06-21-2012 |
20120169367 | HIGH FREQUENCY PROBING STRUCTURE - The present disclosure provide a probe card for wafer level testing. The probe card includes a space transformer having a power line, a ground line, and signal lines embedded therein, wherein the space transformer includes various conductive lines having a first pitch on a first surface and a second pitch on a second surface, the second pitch being substantially less than the first pitch; a printed circuit board configured approximate the first surface of the space transformer; and a power plane disposed on the first surface of the space transformer and patterned to couple the power line and the ground line of the space transformer to the printed circuit board. | 07-05-2012 |
20120187972 | WAFER LEVEL TESTING STRUCTURE - A wafer level testing structure, disposed between a wafer and a prober, for transmitting the electrical signal of the wafer to the prober, the wafer level testing structure includes: a socket and a probe interface board disposed between the socket and the prober, wherein the probe interface board is electrically coupled to the prober, and a plurality of pogo pins is inserted through the socket, and one end of the plurality of pogo pins is electrically coupled to the wafer, the other end of the plurality of pogo pins is electrically coupled to the probe interface board, thereby the electrical signal of the wafer transmits from the probe interface board to the prober. | 07-26-2012 |
20120194212 | Fine pitch guided vertical probe array having enclosed probe flexures - Probes suitable for use with densely packed fine-pitch 2-D contact arrays are provided by use of an electrically insulating guide plate in connection with vertical probes, where the vertical probes have probe flexures that are either vertically folded sections, or coils having a horizontal axis. Preferably, the probes are configured such that the probe flexures are inside the guide plate holes, and the parts of the probes extending past the guide plate are relatively rigid. This configuration alleviates problems associate with probe shorting, because the probe flexures are enclosed by the guide plate holes, and are therefore unable to come into contact with flexures from other probes during probing. | 08-02-2012 |
20120194213 | PROBE CARD - A probe card for testing electrical characteristics of an object to be tested includes a plurality of contactors for contacting the object during the testing; a plurality of tester chips configured to send and receive electric test signals to and from the object to test the electrical characteristics of the object; and a conductive portion electrically connecting the contactors with the corresponding tester chips, the contactors being arranged on a lower surface of the conductive portion. The probe card further includes a pressing portion configured to press the conductive portion against the object during the testing, so that a pressing force is applied between the contactors and the object. | 08-02-2012 |
20120223732 | TRANSMISSION DEVICE AND METHOD OF TESTING TRANSMISSION CHARACTERISTIC OF DUT - There is provided a transmission device. The transmission device includes: an adapter device ( | 09-06-2012 |
20120280706 | CLEANING SHEET, CLEANING MEMBER, CLEANING METHOD, AND CONTINUITY TEST APPARATUS - Provided is a cleaning unit for removing foreign matter adhering to a probe needle of a probe card for a continuity test, the cleaning unit being capable of effectively removing the foreign matter adhering to the probe needle without abrading the probe needle. A cleaning sheet of the present invention is a cleaning sheet, including a cleaning layer for removing foreign matter adhering to a probe needle of a probe card for a continuity test, in which the cleaning layer has an arithmetic average roughness Ra in conformity with JIS-B-0601 of 100 nm or less. | 11-08-2012 |
20130021053 | PROBE CARD HAVING ADJUSTABLE HIGH FREQUENCY SIGNAL TRANSMISSION PATH FOR TRANSMISSION OF HIGH FREQUENCY SIGNAL - A probe card for high-frequency signal transmission includes a circuit board with transmission lines, a plurality of probes, and a signal path adjuster having first lead wires with a same length respectively connected between the transmission lines and the probes. Each first lead wire is selectively replaceable by a second lead having a length different from that of the first lead wire. As a result, a first high-frequency signal transmitting from one transmission line through the associated first lead wire to the associated probe and a second high-frequency signal transmitting from another transmission line through the associated second lead wire to the associated probe may have a same output timing when the first and second high-frequency signals are synchronously inputted into the circuit board. | 01-24-2013 |
20130027073 | INTEGRATED CIRCUIT COMPRISING AT LEAST AN INTEGRATED ANTENNA - An integrated circuit on a substrate including at least one peripheral portion that surrounds an active area and is realized close to at least one scribe line providing separation with other integrated circuits realized on a same wafer. The integrated circuit includes at least one conductive structure that extends in its peripheral portion on different planes starting from the substrate and realizes an integrated antenna for the circuit. | 01-31-2013 |
20130033283 | PROBING DEVICE - A probing device includes a circuit board, a reinforcing plate, at least one space transformer and at least one probe assembly. The reinforcing plate is disposed on the circuit board, and the reinforcing plate has a plurality of inner conductive wires electrically connecting to those of the circuit board. The reinforcing plate defines a plurality of receiving space therein. The space transformer is disposed on the reinforcing plate, and the space transformer has a plurality of inner conductive wires electrically connecting to those of the reinforcing plate via a plurality of first solder balls. The probe assembly is disposed on the space transformer, and the probe assembly includes a plurality of probes. The first solder balls are disposed in the receiving spaces, and the reinforcing plate abuts against the space transformer. | 02-07-2013 |
20130069686 | PROBING DEVICE AND MANUFACTURING METHOD THEREOF - A probing device and manufacturing method thereof are provided. The manufacturing method includes first disposing a plurality of space transformers on a reinforcing plate and the space transformer includes several first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings is formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer is planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer. | 03-21-2013 |
20130088251 | PROBE CARD AND MANUFACTURING METHOD THEREOF - There are provided a probe substrate and a manufacturing method thereof that may prevent an electrode pad bonded with a probe pin from being released from the probe substrate. The probe card includes: a ceramic substrate having at least one electrode pad on one surface thereof; and a probe pin bonded to the electrode pad, and the electrode pad has a larger dimension than a bonding surface of the probe pin. | 04-11-2013 |
20130093452 | PROBE CARD PARTITION SCHEME - A method of probe card partitioning for testing an integrated circuit die includes providing a first probe card partition layout having a first number of distinct sections. Each distinct section uses a distinct probe card for testing. The first probe card partition layout is repartitioned into a second probe card partition layout having a second number of distinct sections. The second number is less than the first number. | 04-18-2013 |
20130093453 | CONNECTING DEVICE, SEMICONDUCTOR WAFER TEST APPARATUS COMPRISING SAME, AND CONNECTING METHOD - A connecting device electrically connects a performance board which has PB terminals and a test head, and includes a sub board which is electrically connected to the test head and has sub terminals which face the PB terminals, a sealing mechanism which forms a sealed space between the sub board and the performance board, and a pressure reducing device which reduces the pressure of the sealed space. The pressure reducing device reduces the pressure of the sealed space so that the performance board and the sub board approach each other and the PB terminals and the sub terminals contact. | 04-18-2013 |
20130099815 | PROBE CARD HANDLING CARRIAGE - A probe card handling carriage is applicable to various working environments. The probe card handling carriage includes a main body provided to be travelable on the ground, a drawer unit provided to be movable in a forward and backward direction with respect to the main body, and a transfer robot installed on the drawer unit to transfer a probe card. | 04-25-2013 |
20130120016 | PROBE CARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a probe card is provided wherein probes are held in a holding plate such that the respective probes correspond to through holes with their connecting end portions projected from one surface of the holding plate. A plate-like member including openings having larger diameters than diameters of the through holes and housing the connecting end portions in the openings is arranged by making one surface of the plate-like member abut the one surface of the holding plate. After supplying solder cream in the respective openings from the other surface of the plate-like member, a connection base plate and the holding plate are relatively fixed so that the solder cream, burying the connecting end portions of the respective probes held in the holding plate with the plate-like member removed, may abut the respective corresponding connection pads, and the solder cream is heated to melt the solder cream. | 05-16-2013 |
20130127488 | CONFIGURABLE TESTING PLATFORMS FOR CIRCUIT BOARDS WITH REMOVABLE TEST POINT PORTION - Circuit boards are provided that include a functional portion and at least one removable test point portion. The removable test point portion may include test points which are accessed to verify whether the functional portion is operating properly or whether installed electronic components are electrically coupled to the board. If multiple boards are manufactured together on a single panel (in which the individual boards are broken off), the test points can be placed on bridges (e.g., removable portions) that connect the individual boards together during manufacturing and testing. Configurable test boards are also provided that can be adjusted to accommodate circuit boards of different size and electrical testing requirements. Methods and systems for testing these circuit boards are also provided. | 05-23-2013 |
20130141132 | INSPECTION APPARATUS FOR SEMICONDUCTOR DEVICES AND CHUCK STAGE USED FOR THE INSPECTIONAPPARATUS - The present invention provides an inspection apparatus, which comprises probes for front side electrodes, probes for back side electrodes, and a chuck stage, wherein the probes for front side electrodes and the probes for back side electrodes are formed on the upper surface of the chuck stage, and the probe contact area electrically continues to the wafer holding area, and the probes for front side electrodes and the probes for back side electrodes are located leaving a distance in horizontal direction between them so that the probes for back side electrodes move relatively within the probe contact area when the probes for front side electrodes are moved relatively within the wafer under test by the movement of the chuck stage. According to the inspection apparatus of the present invention, it is possible to inspect characteristics of semiconductor devices having electrodes on both side of a wafer more accurately in wafer state. | 06-06-2013 |
20130147506 | WAFER INSPECTION INTERFACE AND WAFER INSPECTION APPARATUS - The wafer inspection interface | 06-13-2013 |
20130154682 | PROBE ASSEMBLY, PROBE CARD INCLUDING THE SAME, AND METHODS FOR MANUFACTURING THESE - Quality of connection portions between respective probes and respective wires in a probe assembly is improved. Also, time required for work for connection between the probes and the wires is shortened. Further, improper connection between the probes and the wires is eliminated. A probe assembly includes an electric insulating substrate, a plurality of probes supported on one surface of the substrate, a plurality of through holes provided in the substrate to respectively correspond to the plurality of probes and filled with a conductive material attached to the respective probes, and a plurality of conductive membranes formed on the other surface of the substrate and respectively attached to the conductive material in the plurality of through holes. | 06-20-2013 |
20130162280 | PROBE CARD AND METHOD OF MANUFACTURING THE SAME - There are provided a probe card and a method of manufacturing the same, in which an electrode pad having a probe pin bonded thereto may be prevented from being delaminated from a substrate. The probe card according to embodiments of the present invention may include a ceramic substrate including at least one pad groove formed in one surface thereof and an electrode pad embedded in the pad groove; and a probe pin bonded to the electrode pad. | 06-27-2013 |
20130162281 | Probe Card and Fabricating Method Thereof - A probe card includes a circuit board and an integrated circuit (IC) test interface. The IC test interface includes a first probe assembly, disposed on a terminal of the circuit board, and a second probe assembly, disposed on another terminal of the circuit board, wherein the first probe assembly and the second probe assembly are separated to allow being independently assembled to, or disassembled from, the circuit board. Each of the first probe assembly and the second probe assembly includes a probe base, disposed on the circuit board; a plurality of needles, which are cantilever needles; and a covering layer, for covering the plurality of needles, and fixed on a surface of the probe base. | 06-27-2013 |
20130169305 | WIRING BOARD AND PROBE CARD USING THE SAME - A wiring board | 07-04-2013 |
20130176048 | Mullite-Based Sintered Body, Circuit Board Using Same and Probe Card - A mullite-based body including mullite, alumina, and titanium manganese oxide is disclosed. The mullite-based sintered body includes mullite of 79.3 to 85.2 mass %, alumina of 14.2 to 19.8 mass % and MnTiO | 07-11-2013 |
20130187676 | INSPECTION APPARATUS - An inspection apparatus includes a probe card having a plurality of probes arranged to correspond to each chip of a semiconductor wafer under inspection and contacting a plurality of electrodes of each chip and a test head electrically connected to the respective probes of the probe card and applying test signals from a tester, and a plurality of tester lands of a probe substrate electrically connected respectively to the plurality of probes. A plurality of electrical connecting portions on the tester side of the test head, corresponding to the respective tester lands, are arranged to constitute a plurality of arrangement areas sectioned to correspond to the respective chips under inspection, and the plurality of probes of the probe substrate are connected to the corresponding tester lands provided in the arrangement areas in units of chips under inspection. | 07-25-2013 |
20130200914 | Methods and Systems for Cleaning Needles of a Probe Card - A method of cleaning needles of a probe card in a test system includes mounting the probe card, which has a plurality of device under tests (DUTs) and needles, in a card mounting part. The DUTs and needles are scanned using a camera positioned in the test system to provide a scan result. A laser beam is focused on at least one of the needles based on the scan result and the laser beam is irradiated on the at least one of the needles to clean the at least one of the needles. | 08-08-2013 |
20130207683 | ELECTRICAL CONNECTING APPARATUS AND METHOD FOR ASSEMBLING THE SAME - An electrical connecting apparatus includes a wiring base plate having a first surface coupled with a reinforcing plate and provided on an opposite surface with first electrical connection portions, a probe base plate provided on a first surface with second electrical connection portions corresponding to the first electrical connection portions and provided on a second surface with probes electrically connected to the second electrical connection portions, anchor portions formed on the first surface of the probe base plate and provided with screw holes, cylindrical spacers having first ends removably coupled with the anchor portions, having screw grooves, and passing through the wiring base plate and the reinforcing plate, reference plates having reference planes to receive the spacers and removably coupled with the reinforcing plate, shims inserted between the respective reference plates and the reinforcing plate, and bolt screwed in the screw groove of the spacer. | 08-15-2013 |
20130241590 | CONDUCTIVE FILM STRUCTURE AND CONDUCTIVE FILM TYPE PROBE DEVICE FOR ICS - A method for forming a conductive film structure is provided, which includes: providing an insulating substrate having a surface; forming a plurality of trenches in the surface of the insulating substrate, wherein the trenches are extended substantially parallel to each other; disposing the insulating substrate into a plating solution and plating conducting layers within the trenches to form a plurality of micro-wires; and stacking a plurality of the insulating substrates or winding or folding the insulating substrate along an axis substantially parallel to an extended direction of the micro-wires to form a conducting lump. | 09-19-2013 |
20130249586 | Probing Assembly for Testing Integrated Circuits - A probing assembly is disclosed. The probing assembly includes an interface board, a structural support element, a trace support element and a probe support element. The structural support element provides structural and mechanical support to the trace support element. The trace support element includes a body and multiple trace lines located on the body. The probe support element includes a plate having multiple guide holes in which micro probes are inserted. At least one of the micro pins is in contact with one of the trace lines within the trace support element. A set of rails are utilized to secure the probe support element, the trace support element and the structural support element to the interface board. | 09-26-2013 |
20130249587 | WAFER INSPECTION INTERFACE AND WAFER INSPECTION APPARATUS - A wafer inspection interface | 09-26-2013 |
20130271175 | Wiring Substrate With Filled Vias To Accommodate Custom Terminals - A probe card assembly and associated processes of forming them may include a wiring substrate with a first surface and an opposite surface, an electrically conductive first via comprising electrically conductive material extending into the wiring substrate from the opposite surface and ending before reaching the first surface, and a plurality of electrically conductive second vias, and a custom electrically conductive terminal disposed on the first surface such that said custom terminal covers the first via and contacts one of the second vias adjacent to said first via without electrically contacting the first via. Each of the second vias may be electrically conductive from the first surface to the opposite surface. The first via may include electrically insulating material disposed within a hole in the first via. | 10-17-2013 |
20130307574 | PROBE SUPPORTING AND ALIGNING APPARATUS - An apparatus for testing electrical characteristics of a device, having one or more testing sites. The apparatus comprises a nonconductive plate having a through-hole. The through-hole is positioned such that it at least partially overlays one of the one or more testing sites when at least a portion of the bottom surface of the nonconductive plate is adjacent to the device to be tested. The apparatus also comprises an adhesive on at least a portion of the bottom surface of the nonconductive plate for attaching the bottom surface of the nonconductive plate to the device to be tested. The apparatus also comprises a probe positioning body protruding from the top surface of the nonconductive plate and having a through-hole. The probe positioning body is positioned such that the through-hole of the probe positioning body at least partially aligns with the through-hole of the nonconductive plate. | 11-21-2013 |
20130321019 | PROBE CARD - It is an object of the present invention to provide a probe card capable of controlling generation of a scratch or an indentation in a connection pad and capable of controlling generation of heat in a connection pad and its vicinity having contacted a contact probe at low cost and in a simple way. A probe card includes a probe substrate, at least one contact probe electrically connected to a signal line provided to an insulating base of the probe substrate and fixed to the insulating base, and at least one engagement member installed on the contact probe at a position near a tip end portion of the contact probe. The engagement member has at least one engagement portion that makes abutting contact with another predetermined member during operation to restrain the operation of the contact probe. | 12-05-2013 |
20130328585 | PROBE CARD - An electrode and wiring can be provided on an FPC board without restriction by a through hole. A probe card in which an FPC board of a probe assembly is fixed to the main board side by a clamp mechanism is provided. The clamp mechanism is provided with a fixing ring fixed to the main board side and on which the FPC board is mounted and a rotating ring screwed into the fixing ring and pressing a peripheral edge portion of the FPC board. In the fixing ring, a pressing ring pressed by screwing of the rotating ring for pressing the peripheral edge portion of the FPC board to the main board side is provided. | 12-12-2013 |
20130328586 | Probe Card for Simultaneously Testing Multiple Dies - In accordance with an embodiment, a probe card comprises a contact pad interface comprising front side contacts and back side contacts electrically coupled together. The front side contacts are arranged to simultaneously electrically couple respective bumps of a plurality of dies on a wafer, and the back side contacts are arranged to electrically couple respective contacts of a testing structure. | 12-12-2013 |
20130342235 | PROBE CARD - The present invention relates to a probe card having improved electrical characteristics and mechanical durability of a portion where the probe needle and bump electrode of the probe card come into contact with each other. | 12-26-2013 |
20140015560 | INTERFACE BOARD OF A TESTING HEAD FOR A TEST EQUIPMENT OF ELECTRONIC DEVICES AND CORRESPONDING PROBE HEAD - An interface board of a testing head for a test equipment of electronic devices is described. The testing head includes a plurality of contact probes, each contact probe having at least one contact tip suitable to abut against contact pads of a device to be tested, as well as a contact element for the connection with a board of the test equipment. Suitably, the interface board comprises a substrate and at least one redirecting die housed on a first surface of that substrate and a plurality of contact pins projecting from a second surface of that substrate opposed to the first surface. The redirecting die includes at least one semiconductor substrate whereon at least a first plurality of contact pads is realized, suitable to contact a contact element of a contact probe of the testing head, the contact pins being suitable to contact the board. | 01-16-2014 |
20140015561 | HIGH FREQUENCY PROBE CARD - A high frequency probe card includes at least one substrate having at least one first opening, an interposing plate disposed on the at least one substrate and having at least one second opening corresponding to the at least one first opening, a circuit board disposed on the interposing plate and having a third opening corresponding to the at least one first and second openings, and at least one probe module including at least one N-type ground probe and at least one high frequency signal probe passing through the corresponding substrate, the interposing plate and the third opening and being electrically connected with the circuit board. Each high frequency signal probe includes an N-type signal probe and a first conductor corresponding to the N-type signal probe and being electrically connected with the N-type ground probe. An insulation layer is disposed between the first conductor and the N-type signal probe. | 01-16-2014 |
20140028341 | PROBE CARD AND TESTING APPARATUS - Provided is a probe card capable of effectively placing electronic parts. A probe card according to the present invention includes a plurality of probes that come into contact with a plurality of electrodes of a device, a probe board including the plurality of probes provided thereon, a wiring board that is placed facing a surface of the probe board opposite to a surface including the probes provided thereon, a connector that includes a connection pin and a holder, in which the connection pin electrically connects a line of the probe board and a line of the wiring board, and the holder holds the connection pin between the probe board and the wiring board, and a first electronic part that is mounted on a probe board side surface of the wiring board and placed in a mounting space formed by a through hole or a recess provided in the holder. | 01-30-2014 |
20140028342 | Probe Card Assemblies And Probe Pins Including Carbon Nanotubes - A probe card assembly for testing circuit boards is disclosed. In some embodiments, the assembly includes the following: a multi-layered dielectric plate aligned with an integrated circuit, the integrated circuit having on its surface a first plurality of electrical contacts arranged in a pattern, the dielectric plate having arrayed upon its surface a second plurality of electrical contacts arranged in a pattern substantially matching the first plurality of electrical contacts; a nanotube interposer interposed between the dielectric plate and the integrated circuit, the nanotube interposer having compliant carbon nanotubes that are arranged to match the pattern of electrical contacts on the integrated circuit and the dielectric plate; and a plurality of vertical probes arrayed upon the nanotube interposer and joined with the nanotubes, the vertical probes making electrical contact with the first plurality of electrical contacts and the second plurality of electrical contacts via the nanotubes. | 01-30-2014 |
20140055157 | PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD - A probe card for conducting an electrical test on a test subject includes a substrate body including a first surface, which faces toward the test subject, and a second surface, which is opposite to the first surface. A through electrode extends through the substrate body between the first surface and the second surface. A contact bump is formed in correspondence with the electrode pad and electrically connected to the through electrode. An elastic body is filled in an accommodating portion, which is formed in the substrate body extending from the first surface toward the second surface. The contact bump is formed on the elastic body. | 02-27-2014 |
20140055158 | Integrated Circuit Die Having Input and Output Circuit Pads, Test Circuitry, and Multiplex Circuitry - Test circuits located on semiconductor die enable a tester to test a plurality of die/ICs in parallel by inputting both stimulus and response patterns to the plurality of die/ICs. The response patterns from the tester are input to the test circuits along with the output response of the die/IC to be compared. Also disclosed is the use of a response signal encoding scheme whereby the tester transmits response test commands to the test circuits, using a single signal per test circuit, to perform: (1) a compare die/IC output against an expected logic high, (2) a compare die/IC output against an expected logic low, and (3) a mask compare operation. The use of the signal encoding scheme allows functional testing of die and ICs since all response test commands (i.e. 1-3 above) required at each die/IC output can be transmitted to each die/IC output using only a single tester signal connection per die/IC output. In addition to functional testing, scan testing of die and ICs is also possible. | 02-27-2014 |
20140070834 | PROBE CARD FOR TESTING INTEGRATED CIRCUITS - An embodiment of a probe card adapted for testing at least one integrated circuit integrated on a corresponding at least one die of a semiconductor material wafer, the probe card including a board adapted for the coupling to a tester apparatus, and a plurality of probes coupled to the said board, wherein the probe card comprises a plurality of replaceable elementary units, each one comprising at least one of said probes for contacting externally-accessible terminals of an integrated circuit under test, the plurality of replaceable elementary units being arranged so as to correspond to an arrangement of at least one die on the semiconductor material wafer containing integrated circuits to be tested. | 03-13-2014 |
20140077833 | PROBE CARD AND MANUFACTURING METHOD THEREOF - A probe card for being abutted against a plurality of probes is provided. The probe card includes a substrate, at least two IC boards, and a plurality of probe pads. The IC boards are located on the substrate, and a predetermined distance is formed between the IC boards. Each of the IC boards has a plurality of lead connection points. The probe pads are plated on the IC boards, and are respectively connected to the lead connection points to cover the lead connection points. A probe area is surrounded by the probe pads on each of the IC boards. The probe pads are used to abut against the probes. In addition, a method of manufacturing the probe card is provided. | 03-20-2014 |
20140084955 | FINE PITCH INTERPOSER STRUCTURE - A fine pitch interposer structure includes a Multi-core base substrate and a plurality of buildup laminates. A surface of each Multi-core base substrate has a first circuit layer, and a second circuit layer which is electrically connected to the first circuit layer. The buildup laminates are stacked on the surface of the Multi-core base substrate. Each buildup laminate includes a photosensitive dielectric layer, and a plurality of blind vias with a pre-determined interval therebetween which are correspondingly arranged on each of the plurality of vias formed on the photosensitive dielectric layer. The blind vias are electrically connected to the first circuit layer. At least one blind via of one buildup laminate is superimposed on another blind via of another buildup laminate. | 03-27-2014 |
20140091825 | FINE PITCH INTERFACE FOR PROBE CARD - A probe card interface for interfacing a probe head with a first circuit. The probe card interface includes an impedance control element to interface a first set of pins of the probe head with the first circuit. The impedance control element is further configured to control the impedance of the first set of pins. The probe card interface includes a conductive plane to interface a second set of pins of the probe head with the first circuit. The conductive plane is further coupled to provide at least one of power or ground to the second set of pins. | 04-03-2014 |
20140091826 | FINE PITCH INTERFACE FOR PROBE CARD - A probe card interface for interfacing a probe head with a first circuit. The probe card interface includes an impedance control element to interface a first set of pins of the probe head with the first circuit. The impedance control element is further configured to control the impedance of the first set of pins. The probe card interface includes a printed circuit board (PCB) to interface a second set of pins of the probe head with the first circuit. The PCB is further coupled to provide at least one of power or ground to the second set of pins. For some embodiments, the PCB comprises a flexible polyimide substrate coupled between a first conductive layer and a second conductive layer. The first conductive layer is coupled to ground. The second conductive layer is coupled to a power source on the first circuit. | 04-03-2014 |
20140091827 | PROBE CARD FOR CIRCUIT-TESTING - A probe card for circuit-testing comprising a testing PCB, a probe head, and a silicon interposer substrate is provided. The probe head has a plurality of probes provided with a fine pitch arrangement and held inside. The silicon interposer substrate is used for conveying signals between said probes and said test PCB. The interconnection of said silicon interposer substrate is formed by utilizing the through-silicon via process. A plurality of upper terminals and a plurality of lower terminals are respectively array-arranged on the top surface and the bottom surface of said silicon interposer substrate. The pitch between the upper terminals is larger than the pitch between the lower terminals and the pitch between adjacent lower terminals is equal to the fine pitch of the arrangement of probes. | 04-03-2014 |
20140118017 | MULTILAYER WIRING BASE PLATE AND PROBE CARD USING THE SAME - A multilayer wiring base plate includes an insulating plate including a plurality of synthetic resin layers made of an insulating material, a wiring circuit provided in the insulating plate, a thin-film resistor formed along at least one of the synthetic resin layers to be buried in the synthetic resin layer and inserted in the wiring circuit, and a heat expansion and contraction restricting layer formed to be buried in the synthetic resin layer adjacent to the synthetic resin layer in which the thin-film resistor is formed to be buried, arranged along the thin-film resistor, and having a smaller linear expansion coefficient than a linear expansion coefficient of the adjacent synthetic resin layers. | 05-01-2014 |
20140118018 | INSPECTION UNIT, PROBE CARD, INSPECTION DEVICE, AND CONTROL SYSTEM FOR INSPECTION DEVICE - An inspection unit in which a probe card is united with a connection body via a vacuum chamber. It prevents flatness of tips of probes provided on the probe card from worsening when the probe card is united with a connection body by suction force (negative pressure) of the vacuum chamber. The inspection unit includes a probe card with probes on a first surface and a connection body united with a second surface of the probe card via a first vacuum chamber. The first chamber is formed with a plurality of chambers. | 05-01-2014 |
20140125371 | STAND ALONE MULTI-CELL PROBE CARD FOR AT-SPEED FUNCTIONAL TESTING - A probe card includes at least two connection arrangements on a printed circuit board and a daughter board connected to the printed circuit board through one of the connection arrangements. The daughter board includes a plurality of cell modules, with each of the cell modules having a socket for receiving a device under test and each of the connection arrangements of the printed circuit board being connectable to each of predetermined daughter boards respectively. | 05-08-2014 |
20140125372 | PROBE CARD AND METHOD OF MANUFACTURING THE SAME - A probe card includes a wiring substrate including an opening portion and a connection pad arranged on an upper face of the wiring substrate located on the periphery of the opening portion, a resin portion formed in the opening portion of the wiring substrate, and the resin portion formed of a material having elasticity, a contact terminal arranged to protrude from the lower face of the resin portion, and wire buried in the resin portion and connecting the contact terminal and the connection pad, wherein the contact terminal is formed of an end part of the wire, and is formed integrally with the wire. | 05-08-2014 |
20140139250 | Contactor Devices With Carbon Nanotube Probes Embedded In A Flexible Film And Processes Of Making Such - Electrically conductive columns of intertwined carbon nanotubes embedded in a mass of material flexible, resilient electrically insulating material can be used as electrically conductive contact probes. The columns can extend between opposing sides of the mass of material. Terminals of a wiring substrate can extend into the columns and be electrically connected to an electrical interface to a tester that controls testing of a device under test. A pair of physically interlocked structures can coupling the mass of material to the wiring substrate. The pair can include a receptacle and a protrusion. | 05-22-2014 |
20140139251 | TESTER HAVING AN APPLICATION SPECIFIC ELECTRONICS MODULE, AND SYSTEMS AND METHODS THAT INCORPORATE OR USE THE SAME - In one embodiment, an automated test equipment (ATE) system includes a tester having a tester electronics module, an application specific electronics module, and a tester-to-device under test (DUT) interface mount. The tester electronics module has a first electronics interface configured to electrically connect to a tester-to-DUT interface when the tester-to-DUT interface is coupled to the tester-to-DUT interface mount. The application specific electronics module has a second electronics interface and a third electronics interface. The second and third electronics interfaces are configured to electrically connect to the tester-to-DUT interface when the tester-to-DUT interface is coupled to the tester-to-DUT interface mount. The application specific electronics module is configured to communicate with the tester electronics module via the second electronics interface, and with at least one DUT via the third electronics interface. | 05-22-2014 |
20140145742 | PROBE APPARATUS AND TEST APPARATUS - A probe apparatus providing an electrical connection between a device under test and a test apparatus body, comprising a device-side terminal unit including a flexible sheet and device-side connection terminals passing through the sheet and connected to the device under test; an intermediate substrate provided on the test apparatus body side of the device-side terminal unit and including device-side intermediate electrodes electrically connected to the device-side connection terminals and tester-side intermediate electrodes electrically connected to the test apparatus body; a tester-side substrate that is provided on the test apparatus body side of the intermediate substrate and includes, on the intermediate substrate side thereof, tester-side electrodes electrically connected to the test apparatus body; and a contact section provided between the intermediate substrate and the tester-side substrate and including first pins connected to the tester-side intermediate electrodes and second pins connected to the tester-side electrodes. | 05-29-2014 |
20140176177 | PROBE CARD CAPABLE OF TRANSMITTING HIGH-FREQUENCY SIGNALS - A probe card which is capable of transmitting high-frequency signals provided by a DUT, and the DUT includes an output pin group and an input pin group for sending and receiving the high-frequency signals respectively. The probe card includes a first signal pin group, a second signal pin group, and a multiband circuit. The first signal pin group is made of a conductive material, and is used to contact the output pin group; the second signal pin group is made of a conductive material too, and is used to contact the input pin group; the multiband circuit is electrically connected to the first signal pin group and the second signal pin group to allow signals within a first bandwidth and a second bandwidth to pass therethrough. | 06-26-2014 |
20140203834 | PROBE MODULE - A probe module includes a substrate having a through hole, and at least four probe-needle rows arranged on the substrate. The probe-needle rows are arranged from a first side to a second side along a first direction. Each of the probe-needle rows has at least two needles arranged along a second direction. Each of the needles has a contact segment and an arm segment having an included angle with the contact segment. An end of the arm segment is connected to the substrate, and the other end of which extends toward the through hole to connect the contact segment. The lengths of the contact segments of the needles of each of the probe-needle rows are the same. The included angles of the needles of the probe-needle rows along the first direction are gradually increased from the first side to the second side. | 07-24-2014 |
20140210505 | WAFER TESTING PROBE CARD - A wafer testing probe card includes a printed circuit board, a flexible circuit board, an elastic piece, and a probe unit. The flexible circuit board is electrically connected to the printed circuit board. The elastic piece is disposed between the printed circuit board and the flexible circuit board. The probe unit includes a probe head and a plurality of probes. The probe head is fixed on the printed circuit board and has a plurality of through holes. The probes respectively pass through the through holes and move up and down relative to the probe head. | 07-31-2014 |
20140239996 | TEST APPARATUS HAVING A PROBE CARD AND CONNECTOR MECHANISM - A test apparatus for testing a semiconductor device includes a circuit board having a contact pattern on one side and an opening therethrough, and a probe card supporting a probe needle array. The probe needle array is insertable into the opening of the circuit board and is configured to probe a device under test. The probe needle array is in electrical contact with the contact pattern of the circuit board, to allow signals through the probe card and circuit board to a test equipment. A holder supports the probe card and other probe cards. The holder has multiple sides, each of which is supportable of a probe card having a probe needle array. The holder is rotatable to manipulate and position the probe needle arrays of the probe cards relative to a device under test. The holder allows disconnection and replacement of the probe needle arrays from the holder. | 08-28-2014 |
20140239997 | MEASUREMENT JIG FOR SOLAR BATTERY AND METHOD FOR MEASURING OUTPUT OF SOLAR BATTERY CELL - Electrical characteristics are measured accurately, even for solar battery cells having a busbarless structure. This invention, which has a plurality of probe pins which are brought into contact with a linear electrode formed on the surface of a solar battery cell, and a holder for holding the probe pins, is provided with: a current measuring terminal that is formed by a plurality of probe pins arranged thereon, and disposed on the linear electrode so as to measure current characteristics of the solar battery cell; and a voltage measuring terminal that is formed by a plurality of probe pins arranged thereon, and disposed on the linear electrode so as to measure voltage characteristics of the solar battery cell, and in this structure, the current measuring terminal and the voltage measuring terminal are disposed in parallel with each other. | 08-28-2014 |
20140253165 | PROBE CARD - A probe card includes a first circuit substrate electrically connected to a tester, the first circuit substrate having a first size, a second circuit substrate on a lower surface of the first circuit substrate and electrically connected to the first circuit substrate, the second circuit substrate having a second size smaller than the first size, a probe head under the second circuit substrate and electrically connected to the second circuit substrate, the probe head including a plurality of probes in contact with terminals of a device under test (DUT), and a probe holder under the first circuit substrate and supporting the probe head. | 09-11-2014 |
20140253166 | INSPECTION DEVICE WITH VERTICALLY MOVEABLE ASSEMBLY - The inspection of semiconductors or like substrates by the present mechanism minimizes deflection in the checkplate and probe card. An inspection device including a housing, a toggle assembly within the housing, an objective lens assembly attached within the toggle assembly including an objective coupled within an objective focus, wherein the objective focus is deflectable along an optics axis, and a cam assembly including a rotary cam and a window carrier, wherein the window carrier is moveable along the optics axis with rotation of the rotary cam, wherein the cam assembly is coupled to the toggle assembly with the objective and window are aligned along the optics axis. | 09-11-2014 |
20140266282 | Test System for Improving Throughout or Maintenance Properties of Semiconductor Testing - A semiconductor test system includes test head pins; per-pin resources which are connectable to the test head pins on a one-to-one basis; shared resources, each of which is connectable to one of the test head pins; a tester controller for controlling the per-pin resources and the shared resources; and a tabular-form test plan including: a first column for specifying a measurement function that uses at least one of the per-pin resources and the shared resources; and at least one second column for specifying input and output parameters of the measurement function, the tabular-form test plan further including program rows, the tabular-form test plan being executed by the tester controller, the tabular-form test plan further including a third column for specifying how rows that are executed by asynchronous parallel execution are to be grouped. | 09-18-2014 |
20140266283 | Chip-on-Wafer Process Control Monitoring for Chip-on-Wafer-on-Substrate Packages - An embodiment method includes providing a standardized testing structure design for a chip-on-wafer (CoW) structure, wherein the standardized testing structure design comprises placing a testing structure in a pre-selected area a top die in the CoW structure, and electrically testing a plurality of microbumps in the CoW structure by applying a universal testing probe card to the testing structure. | 09-18-2014 |
20140300383 | PROBE ASSEMBLY AND PROBE BASE PLATE - A probe assembly includes a wiring base plate arranged on a lower surface side of a reinforcing plate and a probe base plate arranged on a lower surface side of the wiring base plate. The probe base plate includes a plurality of probes on a lower surface thereof and a plurality of anchor portions on an upper surface thereof, respectively. The anchor portions are set so that a height of the anchor portion arranged at a center portion of the probe base plate may be greater than a height of the anchor portion located at a peripheral portion of the probe base plate. Between the respective anchor portions and the reinforcing plate are arranged a plurality of brace portions corresponding to the plurality of anchor portions and determining a space between the probe base plate and the wiring base plate together with the anchor portions. | 10-09-2014 |
20140327463 | Membrane Sheet with Bumps for Probe Card, Probe Card and Method for Manufacturing Membrane Sheet with Bumps for Probe Card - A probe card is for testing a wafer which allows for stable contact with electrode pads of a wafer simultaneously under small contact pressure in wafer test procedures. A probe card includes a frame plate which is provided with a plurality of through-holes corresponding to semiconductor chips of a wafer, a wiring substrate, an anisotropic conductive membrane which has a size corresponding to that of the through-hole and is fixed in the through-hole or on a periphery of the through-hole in the frame plate, and a contact membrane which also has a size corresponding to that of the through-hole and is fixed on the periphery of the through-hole in the frame plate. The contact membrane includes an insulating membrane, a conductive electrode provided in the insulating membrane and on a reverse face of the insulating membrane, and a bump. The bump is formed by plating an upper end of an electrode body which is exposed by half-etching the insulating membrane. The bump has a pointy tip end portion is electrically contacted with a terminal in the wiring substrate via a conductive path in the anisotropic conductive membrane. | 11-06-2014 |
20140340108 | TEST ASSEMBLY - A test assembly adapted to test a semiconductor device is provided. The test assembly includes a main circuit board, a space transformer, a plurality of electrical connection elements, an intermediary stiffener, and a plurality of test probes. The space transformer is disposed on the main circuit board and has a first surface and a second surface opposite to the first surface. The first surface of the space transformer faces the main circuit board. The electrical connection elements are disposed between the main circuit board and the first surface of the space transformer. The space transformer is electrically connected to the main circuit board through the electrical connection elements. The intermediary stiffener is disposed between the main circuit and the first surface of the space transformer. The intermediary stiffener has a plurality of accommodating through holes. Each of the electrical connection elements is disposed in one of the accommodating through holes. The test probes are disposed on the second surface of the space transformer and electrically connected to the space transformer. | 11-20-2014 |
20140340109 | TEST PROBE CARD STRUCTURE - A test probe card structure includes a probe card and a connection circuit common plate. The probe card includes a probe substrate, A test circuit board is disposed between the probe substrate and the connection circuit common plate, The test circuit board has a lest circuit connection section attached to and electrically connected with a common circuit adaptation section of the connection circuit common plate. A circuit extension section is formed around the connection circuit common plate, which is all-channel electrically connectable between a tester and the teat circuit connection section. The connection circuit common plate serves to provide an all-channel test circuit convergence connection ability for the test circuit board so as to greatly minify the size of the test circuit board and lower the manufacturing cost of the probe card. | 11-20-2014 |
20140354322 | PROBE CARD PARTITION SCHEME - A method of testing an integrated circuit die comprises partitioning a first probe card partition layout of the integrated circuit die having one or more sections comprising a first quantity of section types into a second probe card partition layout having a greater quantity of sections comprising a second quantity of section types, the second quantity of section types being less than the first quantity of section types. The method also comprises using one or more probe cards to test the sections in the second probe card partition layout, each of the one or more probe cards having a test contact pattern that corresponds with a test contact pattern of one of each section type included in the second probe card partition layout. | 12-04-2014 |
20140361803 | Capacitive Test Method, Apparatus and System for Semiconductor Packages - A multi-channel probe plate includes an electrically insulating body with opposing first and second main surfaces, and a plurality of spaced apart electrically conductive coupling regions embedded in or attached to the body at the first main surface. Each of the coupling regions covers a different zone of a semiconductor package when the package is positioned in close proximity to the first main surface of the plate. Circuitry electrically connected to each of the coupling regions of the probe plate via a different channel is operable to: measure a parameter indicative of the degree of capacitive coupling between each coupling region of the probe plate and the zone of the semiconductor package covered by the corresponding coupling region; provide a capacitance signal based on the parameter measured for each of the coupling regions of the probe plate; and select different ones of the capacitance signals for analysis. | 12-11-2014 |
20140361804 | METHOD AND APPARATUS OF WAFER TESTING - A system for testing a wafer includes a probe card and a wafer. The probe card includes at least one first probe site and at least one second probe site. The wafer includes a plurality of dies. The at least one first probe site is arranged for a first test, and the at least one second probe site is arranged for a second test. Each of the plurality of dies corresponds to first probe pads and second probe pads. Each of the at least one first probe site is arranged to touch the first probe pads of each of the plurality of dies. Each of the at least one second probe site is arranged to touch the second probe pads of each of the plurality of dies. | 12-11-2014 |
20140368229 | PROBE CARD AND METHOD FOR MANUFACTURING THE SAME - A probe card for an electric test of a device under test on a working table incorporating a heat source includes a circuit base plate including conductive paths connected to a tester, a probe base plate including conductive paths corresponding to the conductive paths and provided with probes connected to the conductive paths, and a heat expansion adjusting member bonded to the probe base plate, having a different linear expansion coefficient from that of the probe base plate to restrain heat expansion of the probe base plate, and constituting a composite body with the probe base plate. In a case where, when the device under test is at two measuring temperatures, the composite body is at corresponding achieving temperatures, expansion changing amounts of the device under test and the composite body under temperature differences between the respective measuring temperatures and the corresponding achieving temperatures are set to be approximately equal. | 12-18-2014 |
20150008951 | METHOD OF MANUFACTURING MULTILAYER WIRING BOARD, PROBE CARD INCLUDING MULTILAYER WIRING BOARD MANUFACTURED BY THE METHOD, AND MULTILAYER WIRING BOARD - A method of manufacturing a multilayer wiring board includes a stacking process in which insulating layers, each of which includes a ceramic layer and a shrinkage suppression layer being stacked on top of the ceramic layer, are stacked on top of one another, a press-bonding process in which the insulating layers are press-bonded, so that a multilayer body is formed, and a firing process in which the multilayer body is fired. In the stacking process, in each of the insulating layers, a wiring electrode is formed on a surface of the shrinkage suppression layer on the opposite side to the surface of the layer facing the ceramic layer, and the thickness of a peripheral area of the shrinkage suppression layer located around the area of the shrinkage suppression layer that is in contact with the electrode is larger than those of portions of the layer except for the peripheral area. | 01-08-2015 |
20150015295 | SIGNAL PATH SWITCH AND PROBE CARD HAVING THE SIGNAL PATH SWITCH - A probe card, which is between a tester and a device under test (DUT), includes two first electrical lines, two second electrical lines, two inductive elements, and a capacitor. The first electrical lines are electrically connected to the probes respectively. The second first electrical lines are electrically connected to the first electrical lines respectively. The inductive elements are electrically connected the first electrical lines and the tester respectively; and the capacitor has opposite ends connected to the second first electrical lines respectively. | 01-15-2015 |
20150022229 | PROBE CARD AND METHOD OF MANUFACTURING THE SAME - A probe card, includes, a wiring substrate having an opening portion and including a first connection pad and a second connection pad, the first connection pad being arranged at a periphery of the opening portion, the second connection pad being arranged to be adjacent to the first connection pad, a resin portion formed inside the opening portion of the wiring substrate, a first wire buried in the resin portion and having one end connected to the first connection pad and the other end constituting a first contact terminal protruding from a lower face of the resin portion, and a second wire buried in the resin portion and having one end connected to the second connection pad and the other end constituting a second contact terminal protruding from the lower face of the resin portion, wherein diameters of the first contact terminal and the second contact terminal are equal to diameters of the first wire and the second wire in the resin portion, and the first contact terminal and the second contact terminal are gathered but divided from each other such that the pair of first and second contact terminals touch one electrode pad of a test object. | 01-22-2015 |
20150022230 | PROBE CARD AND METHOD OF MANUFACTURING THE SAME - A probe card includes a wiring substrate including an opening portion, a first connection pad, and a second connection pad arranged in an opposite area to the first connection pad, a resin portion formed in the opening portion, a first wire buried in the resin portion, in which one end is connected to the first connection pad and other end constitutes a first contact terminal, and a second wire buried in the resin portion, in which one end is connected to the second connection pad and other end constitutes a second contact terminal, wherein the first and second wires extend on one line, and the first and second contact terminals are arranged on the one line, and the first and second contact terminals are gathered to be separated such that the first and second contact terminals touch one electrode pad of a text object with a pair. | 01-22-2015 |
20150028911 | HIGH FREQUENCY PROBE CARD FOR PROBING PHOTOELECTRIC DEVICE - A high frequency probe card for probing a photoelectric device includes a substrate having a first opening and at least one first through hole, an interposing plate disposed on the substrate and having a second opening and at least one second through hole, a circuit board disposed on the interposing plate and having a third opening and at least one third through hole, and a probe module mounted to the substrate and having at least one ground probe and at least one high-frequency impedance matching probe having a signal transmitting structure and a grounding structure passing through the at least one first, second and third through holes and being electrically connected with a signal pad and a ground pad of the circuit board, respectively. The first, second and third openings are communicated with each other for light transmission. | 01-29-2015 |
20150048861 | HIGH FREQUENCY PROBING STRUCTURE - A probe card for wafer level test includes a space transformer having a power line, a ground line, and signal lines embedded therein, wherein the space transformer includes a first surface having a first pitch and a second surface having a second pitch substantially less than the first pitch, a printed circuit board configured approximate the first surface of the space transformer, a first power plane disposed on the first surface of the space transformer and patterned to couple the power line and the ground line to the printed circuit board, and a second power plane disposed on a surface of the printed circuit board and patterned to couple the power line and the ground line of the space transformer to the printed circuit board, wherein the second power plane is in electrical connection with the first power plane. | 02-19-2015 |
20150054541 | Large-Area Probe Card and Method of Manufacturing the Same - A large-area probe card and method of manufacturing the same including an insulation plate including at least one contactor formed thereon, a main substrate disposed below the insulation plate, and a flexible signal connector vertically passing through the insulation plate and disposed between the at least one contactor and the main substrate to electrically connect the at least one contactor with the main substrate. | 02-26-2015 |
20150061718 | WAFER-LEVEL TESTING METHOD FOR SINGULATED 3D-STACKED CHIP CUBES - Disclosed is a wafer level testing method for testing a plurality of singulated 3D-stacked chip cubes by utilizing adjustable wafer maps to adjust the pick-and-place positions of the cubes on a carrier wafer. The wafer maps have a plurality of probe-card activated regions each including a plurality of component-attaching regions. Two wafer-level testing steps are performed on the cubes disposed on the carrier wafer according to the wafer maps. By analyzing the electrical testing results of the trial-run wafer-level testing step from the original wafer map, some prone-to-overkill component-attaching regions are confirmed and to create a corrected wafer map which the prone-to-overkill component-attaching regions are excluded from probe-card activated regions. Then, according to the corrected wafer map, cubes are disposed on the carrier wafer without disposing in the prone-to-overkill component-attaching regions. Accordingly, the real-production wafer-level testing step can be run smoothly without unnecessary shut down of adjustment or repair leading to the maximum productivity without overkill issues. | 03-05-2015 |
20150061719 | VERTICAL PROBE CARD FOR MICRO-BUMP PROBING - The present invention relates to a probe card, and more particularly a probe card that can provide fine pitch for micro-bump probing, can be manufactured at a low cost for a short time through a simple manufacturing process, and can have excellent electric characteristics because it can have the components and a thin film resistance therein. | 03-05-2015 |
20150077152 | SUBSTRATE INSPECTION APPARATUS - A substrate inspection apparatus can efficiently inspect electric characteristics of the semiconductor device. A prober | 03-19-2015 |
20150109015 | SYSTEM-LEVEL TESTING OF NON-SINGULATED INTEGRATED CIRCUIT DIE ON A WAFER - Structures and methods for system-level testing of integrated circuit dies at wafer sort is disclosed. This concept combines a system-level test (which is traditionally a “socketed” test performed on a packaged IC in a test socket) with the ability to contact an integrated circuit die on a wafer using a probe card. The die on the wafer becomes part of the system-level environment in order to test the integrated circuit die in the system-level environment prior to packaging, and may be used to better identify known good die. | 04-23-2015 |
20150109016 | TEST PROBE CARD - A test probe card adapted for testing a plurality of chips of a wafer is provided. The test probe card includes a substrate, a plurality of light-guiding elements, a plurality of lens units and a plurality of probes. The substrate has a plurality of through holes. Each of the through holes has a light entrance opening and a light exit opening. The light-guiding elements are disposed at the through holes, respectively. The lens units are disposed at the light exit openings, respectively. One end of each of the probes is electrically connected to the substrate and another end of each of the probes is adapted for electrically contacting one of the image sensing chips. Light emitted from a light source passes through one of the light-guiding elements and the lens element corresponding thereto in order and then is projected to one of the image sensing chips. | 04-23-2015 |
20150123690 | PROBE CARD - A probe card including a circuit board, a transformer, a probe head, and a reinforcement structure is provided. The transformer including a body, a plurality of solder balls, and a plurality of first contact points are disposed on the substrate. The body has a first surface and a second surface, wherein the first surface is located between the circuit board and the second surface. The solder balls are disposed on the first surface, and the first contact points are disposed on the second surface. The probe head is disposed on the second surface. The probe head is electrically connected to the circuit board by the first solder balls. The reinforcement structure is disposed between the probe head and the circuit board. | 05-07-2015 |
20150123691 | METHOD FOR MANUFACTURING PROBE CARD, PROBE CARD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR FORMING PROBE - Provided is a method for manufacturing a probe card which inspects electrical characteristics of a plurality of semiconductor devices in batch. The method includes: a step of forming a plurality of probes, which are to be brought into contact with external terminals of the semiconductor devices, on one side of a board which forms the base body of the probe card; a step of forming on the board, by photolithography and etching, a plurality of through-holes which reach the probes from the other side of the board; a step of forming, in the through-holes, through electrodes to be conductively connected with the probes, respectively; and a step of forming wiring, which is conductively connected with the through electrodes, on the other side of the board. | 05-07-2015 |
20150130498 | SYSTEMS FOR PROBING SEMICONDUCTOR WAFERS - A wafer probing system includes a plurality of contacting pins connected to a test head. The system further includes a probe card electrically connectable with the test head, where the probe card includes a circuit board having a plurality of contact pads on opposite sides of the circuit board. | 05-14-2015 |
20150137848 | INTERCONNECT FOR TRANSMITTING SIGNALS BETWEEN A DEVICE AND A TESTER - A system includes: a circuit board including electrical elements arranged at a first pitch; a wafer including contacts arranged at a second pitch, where the second pitch is less than the first pitch; and an interconnect including additively-manufactured electrical conduits that are part of an electrical pathway between the electrical elements and the contacts, where the additively-manufactured electrical conduits include electrically-conductive material. | 05-21-2015 |
20150137849 | PROBE CARD AND METHOD FOR MANUFACTURING PROBE CARD - A probe card includes a first insulation layer, a contact terminal arranged on the first insulation layer, and a wiring pattern arranged on an upper surface of the first insulation layer. The wiring pattern includes a rewire connected to the contact terminal and a first pad connected to the rewire. The probe card further includes a wiring substrate. The wiring substrate includes an interlayer insulation layer, a wiring layer, and a cavity defined in central portions of the interlayer insulation layer and the wiring layer. The wiring substrate is spaced apart from the first insulation layer arranged in the cavity. The cavity is filled with a second insulation layer. A conductive wire is arranged in the second insulation layer to electrically connect the first contact terminal and the wiring layer. The second insulation layer has a lower elasticity than the interlayer insulation layer. | 05-21-2015 |
20150369842 | PROBE CARD FOR TESTING SEMICONDUCTOR WAFERS - A probe card is disclosed. The probe card includes a top plate, a disc, a removable plate and multiple micro probes. One of the micro probes includes a curved segment and a linear segment connected to each other at an angle stop. The linear segment is shorter than the curved segment. The top plate includes a set of holes formed therein, and one of the holes is configured to receive the curved segment of the micro probe. The disc includes a set of holes formed therein, and one of the holes is configured to receive the linear segment of the micro probe at the angle stop. The removable plate is removably connected to the disc, and the removable plate includes a set of holes formed therein, wherein one of the holes is configured to receive the linear segment of the micro probe. | 12-24-2015 |
20160018439 | PROBE CARD, AND CONNECTING CIRCUIT BOARD AND SIGNAL FEEDING STRUCTURE THEREOF - A probe card includes a connecting circuit board, a connector, and a probe. The connecting circuit board includes a substrate having a signal via and a plurality of ground vias, a signal feeding structure disposed on the substrate, and a connecting layer having the connector disposed thereon. The signal feeding structure includes a signal feeding pad and a ground pad, which is connected to the ground via, and has a matching compensation opening having a first side and a second side wider than the first side. The signal feeding pad does not contact the ground pad, and has a first end and a second end wider than the first end. The second end is connected to the signal via. The connecting layer has a signal connecting portion connected to the signal via, and a ground connecting portion connected to the ground vias. The probe is connected to the first end. | 01-21-2016 |
20160041220 | Probe Card and Method for Performing an Unclamped Inductive Switching Test - A probe card with a ground contact, a first contact element and a second contact element is provided. The first contact element is coupled to an interconnection node via a first interconnection line having a definite length and the second contact element is coupled to the interconnection node via a second interconnection line having the same definite length. The interconnection node is directly connected to the ground contact. | 02-11-2016 |
20160047844 | PROBE CARD STRUCTURE, ASSEMBLING METHOD THEREOF AND REPLACING METHOD THEREOF - The present invention provides a probe card structure, an assembling method thereof and a replacing method thereof. The probe card structure comprises a circuit board and a probe head assembly. The circuit board includes a first side and a second side opposite the first side. The circuit board also has at least one first connecting part and a containing hole penetrating the first side and the second side of the circuit board. The probe assembly, which is partially disposed in the containing hole, further comprises a fixing part and a probe head. The fixing part includes at least one second connecting part corresponding to the at least one first connecting part. The fixing part is detachably connected with the circuit board through the connection of the second connecting part and the first connecting part. The probe head is integrally formed with or detachably connected with the fixing part. | 02-18-2016 |
20160061882 | PROBE DEVICE - A probe device includes an electrode plate arranged above a mounting table for mounting thereon a semiconductor wafer and electrically connected to a tester, a contact probe arranged at a side of the mounting table and electrically connected to a mounting table electrode of the mounting table. The contact probe includes a contact portion, having a top surface formed uneven, to be in contact with the electrode plate, and a cable connection portion formed as one unit with the contact portion. The contact portion and the cable connection portion are vertically movable by a biasing member provided below the cable connection portion. When the probes are made contact with electrodes of a semiconductor device of the semiconductor wafer by moving up the mounting table, the contact portion and the electrode plate are made contact with each other and the backside electrode and the tester are electrically connected to each other. | 03-03-2016 |
20160077129 | PROBE CARD ASSEMBLY - A probe card assembly for nondestructive integrated circuit testing is disclosed. The probe card assembly includes an outer gimbal bearing with a tapered bearing surface being mounted on a top surface of a printed circuit board. The probe card assembly further includes an inner gimbal bearing with a spherical bearing surface which contacts the tapered bearing surface of the outer gimbal bearing at a single point of contact about a circumference thereof. The probe card assembly further includes a spring plate mounted to the outer gimbal bearing, providing a downward force to a substrate | 03-17-2016 |
20160084905 | APPARATUS FOR TESTING STACKED DIE ASSEMBLIES, AND RELATED METHODS - Apparatus for testing semiconductor devices comprising die stacks, the apparatus comprising a substrate having an array of pockets in a surface thereof arranged to correspond to conductive elements protruding from a semiconductor device to be tested. The pockets include conductive contacts with traces extending to conductive pads, which may be configured as test pads, jumper pads, edge connects or contact pads. The substrate may comprise a semiconductor wafer or wafer segment and, if the latter, multiple segments may be received in recesses in a fixture. Testing may be effected using a probe card, a bond head carrying conductive pins, or through conductors carried by the fixture. | 03-24-2016 |
20160178668 | PROBE CARD | 06-23-2016 |
20160202293 | TESTING METHOD FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT | 07-14-2016 |
20160377655 | HIGH-PLANARITY PROBE CARD FOR A TESTING APPARATUS FOR ELECTRONIC DEVICES - A probe card for a testing apparatus of electronic devices comprises at least one testing head which houses a plurality of contact probes, each contact probe having at least one contact tip suitable to abut onto contact pads of a device under test, and a support plate of the testing head associated with a stiffener and an intermediate support, connected to the support plate and suitable to provide a spatial transformation of the distances between contact pads made on the opposite sides thereof. Conveniently, the probe card comprises a support element which is joined to the intermediate support, this support element being made by means of a material having a greater stiffness than the intermediate support, thereby being able to provide local micro rectifications of the intermediate support. | 12-29-2016 |
20160377656 | PROBE CARD FOR A TESTING APPARATUS OF ELECTRONIC DEVICES, PARTICULARLY FOR EXTREME TEMPERATURE APPLICATIONS - A probe card for a testing apparatus of electronic devices comprises at least one testing head which houses a plurality of contact probes, each contact probe having at least one contact tip suitable to abut onto contact pads of a device under test, and a support plate of the testing head associated with a stiffener and an intermediate support, connected to the support plate and suitable to provide a spatial transformation of the distances between contact pads made on opposite sides thereof. Conveniently, the probe card comprises a support which is joined to the intermediate support, which is made of a material compatible with the printed circuit board technologies and has a coefficient of thermal expansion greater than 10×10 | 12-29-2016 |
20170234924 | WAFER INSPECTION SYSTEM, WAFER INSPECTION APPARATUS AND PROBER | 08-17-2017 |
20180024164 | APPARATUSES, SYSTEMS AND METHODS FOR TESTING ELECTRICAL FUNCTIONS | 01-25-2018 |