Class / Patent application number | Description | Number of patent applications / Date published |
324755100 | Dendritic structure | 6 |
20120187970 | Methods for making contact device for making connection to an electronic circuit device and methods of using the same - A method for manufacturing an electronic device is disclosed. A design description of the electronic device is generated using one or more computer aided design tools. Physical device data are generated that represent a physical description of the electronic device, which includes data determining connection points for connecting the electronic device to one or more external circuits. A physical embodiment of the electronic device is produced in accordance with the physical device data. Physical test member data is determined that represents conductors and contact points of a test member for testing the electronic device. The test member is produced in accordance with the test member data. The electronic device is tested with the test member. | 07-26-2012 |
20120242362 | TEST APPARATUS - A test apparatus includes a circuit board and an expansion slot. A number of golden fingers are arranged on a first side of the circuit board. A second side of the circuit board is connected to a bottom of the expansion slot. The golden fingers are electrically connected to the expansion slot. A number of first test pads and second test pads are arranged on the circuit board between the first side and the second side. The first and second test pads have different shapes, sizes, and/or colors. The first and second test pads are electrically connected to pins in the expansion slot. | 09-27-2012 |
20120256650 | TEST APPARATUS - A test apparatus includes a circuit board. The circuit board includes a number of first golden fingers arranged on a first side of the circuit board, and a first test circuit. The first test circuit includes a first capacitor. A first terminal of the first capacitor is grounded. A second terminal of the first capacitor is electrically connected to a first pin of the first golden fingers. A first test pad is connected to the second terminal of the first capacitor. A second test pad is connected to a second pin of the first golden fingers. The second pin is grounded. | 10-11-2012 |
20120319715 | PROBE-ABLE VOLTAGE CONTRAST TEST STRUCTURES - Test structures and method for detecting defects using the same. A probe-able voltage contrast (VC) comb test structure that includes first, second and third probe pads, a comb-like structure including grounded tines, floating tines between the grounded tines, switching devices coupled with an end portion of each floating tine, and connecting the floating tines to the second probe pad, and the third probe pad being a control pad which controls the switching devices. A probe-able VC serpentine test structure that includes first, second, third and fourth probe pads, a comb-like structure including grounded tines, floating tines between the grounded tines and each floating tine connected together between the second and third probe pads, switching devices connected to an end portion of each floating tine and connecting the floating tines to the second and third probe pads, and the fourth probe pad being a control pad which controls the switching devices. | 12-20-2012 |
20130234747 | FINE PITCH PROBE ARRAY FROM BULK MATERIAL - Fine pitch probe array from bulk material. In accordance with a first method embodiment, an article of manufacture includes an array of probes. Each probe includes a probe tip, suitable for contacting an integrated circuit test point. Each probe tip is mounted on a probe finger structure. All of the probe finger structures of the array have the same material grain structure. The probe fingers may have a non-linear profile and/or be configured to act as a spring. | 09-12-2013 |
20150061716 | TESTING FINGER - A testing finger ( | 03-05-2015 |