Class / Patent application number | Description | Number of patent applications / Date published |
528338000 | From at least two dicarboxylic acids or derivatives or mixtures thereof and at least two organic polyamines | 6 |
20080214777 | Heteropolymeric Polyimide Polymer Compositions - The present disclosure describes comprises a polyimide composition comprising at least one diamine monomer and at least two dianhydride monomer types, at least two diamine monomer types and at least one dianhydride monomer at least two diamine monomer types and at least two dianhydride monomer types. In one embodiment, the diamine monomers are 2,2-bis[4-(4aminophenoxy)phenyl]-hexafluoropropane (BDAF) or 4,4′-diaminobenzanilide (DABA) or combinations of the foregoing and the dianhydride monomers are 4,4′-(hexafluoroisopropylidene)di-phthalicanhydride (6-FDA) and 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride (s-BDPA) or combinations of the foregoing. The polyimide compositions described herein have controllable and variable properties, such as but not limited to CTE, allowing the use of the polyimide compositions in a wide variety of applications. | 09-04-2008 |
20120277401 | METHOD FOR MANUFACTURING A WHOLLY AROMATIC POLYIMIDE RESIN HAVING IMPROVED HEAT RESISTANCE AND ELONGATION PROPERTIES IN A HIGH TEMPERATURE RANGE - The present invention relates to a method for preparing wholly aromatic polyimide resin with improved heat-resistance. In particular, the present invention provides a method for preparing polyimide resin having enhanced heat-resistance and superior mechanical properties, especially elongation rate and tensile strength at high temperature through liquid polymerization of two kinds of aromatic tetracarboxylic dianhydrides and aromatic diamine whose mixed ratio is properly regulated. | 11-01-2012 |
20130211040 | POLYIMIDES AND POLYIMIDE FILMS - A polyimide and a polyimide film obtained by reacting: an aromatic diamine, and 3,3′,4,4′-biphenyltetracarboxylic acid dianhydride, pyromellitic acid dianhydride, p-phenylenediamine and 4,4′-diaminodiphenyl ether, the amount of the component (I) being 0.1 to 10.0 mol % and the amount of the components (II) being 99.9 to 90.0 mol % based on the total amount of the component (I) and the components (II) (in Formula (1), R | 08-15-2013 |
20140303341 | Polyamide Resin, Preparation Method Thereof, and Article Comprising Same - The present invention relates to: a polyamide resin which is a copolymer of a mixture comprising (a1) one or more aliphatic diamine monomers selected from C | 10-09-2014 |
20160053135 | POLYAMIC ACID, VARNISH CONTAINING SAME, AND POLYIMIDE FILM - The present invention addresses the problem of providing a high-transparency polyimide film in which the thickness-direction phase difference Rth is kept within a predetermined range. The present invention also addresses the problem of providing a polyamic acid and a varnish used to obtain the polyimide film. In order to overcome the aforementioned problem, the present invention is a polyimide film containing a polyimide obtained by bringing about a reaction between a tetracarboxylic dianhydride and a diamine, the polyimide film having (a) a thickness-direction phase difference Rth of −5 to 100 nm per 10 μm of thickness, (b) a transmittance of 80% or more with respect to light having a wavelength of 400 nm, (c) a haze of 3% or less, and (d) a glass transition point of 250° C. or higher. | 02-25-2016 |
20160090448 | Copolymerized Polyamide Resin, Method for Preparing the Same and Molded Article Comprising the Same - A copolymerized polyamide resin includes a polymer of a monomer mixture comprising a dicarboxylic acid component comprising adipic acid and a dicarboxylic acid represented by Formula 1, wherein each R | 03-31-2016 |