Class / Patent application number | Description | Number of patent applications / Date published |
523434000 | Polymer derived from ethylenic reactants only | 11 |
20120029117 | ADHESIVE FILM FOR SEMICONDUCTOR ASSEMBLY - An adhesive film composition includes a polymer binder; a curable resin; and about 40 to about 60 wt. % of solvent, wherein the solvent is a binary solvent consisting essentially of at least a first solvent with a boiling point of about 40° C. to about 100° C. and at least a second solvent with a boiling point of about 140° C. to about 200° C. | 02-02-2012 |
20120259042 | TOUGHENED EPOXY RESIN FORMULATIONS - A low viscosity toughened epoxy resin formulation including a divinylbenzene dioxide as a component in the formulation; wherein the formulation is useful for the manufacture of thermoset polymers. | 10-11-2012 |
20130085208 | PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD - [Problems] The present invention provides a photosensitive resin composition having good dryness to touch and excellent resistance to electroless gold plating; a cured film thereof; and a printed circuit board comprising the cured film. | 04-04-2013 |
20130137797 | POLYESTER COMPOSITIONS AND INSERT-MOLDED ARTICLES MADE THEREFROM - A thermoplastic polyester composition comprises polyalkylene terephthalate, a block copolymer comprising a semi-crystalline polyolefin block and at least one of a vinyl aromatic polymer block and an elastomeric polyolefin block, and reinforcing filler. The composition is capable of providing insert-molded articles, comprising a metal part, with high durability and resistance to cracking when subjected to a rigorous thermal cycle. | 05-30-2013 |
20130197130 | B-STAGEABLE AND SKIP-CURABLE WAFER BACK SIDE COATING ADHESIVES - An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler. | 08-01-2013 |
20130281571 | EPOXY-BASED COMPOSITION, ASHESIVE FILM, DICING DIE-BONDING FILM AND SEMICONDUCTOR DEVICE - Provided are an epoxy composition, an adhesive film, a dicing die bonding film and a semiconductor device using the same. Specifically, the epoxy composition and a use thereof are provided, wherein the epoxy composition has a gel content of 5˜20%, measured under certain conditions. The epoxy composition according to the present invention, as an adhesive agent, shows excellent elastic properties, when prepared to have a low glass transition temperature, exhibiting good adhesion at high temperature and having minimal occurrence of burrs during processing. According to the present invention, it is therefore possible to prevent defects owing to die cut shift, during a wire bonding or molding process at high temperature, and obtain a highly reliable semiconductor device owing to the excellent adhesiveness and workability of the adhesive agent. | 10-24-2013 |
20140194555 | ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM INCLUDING THE SAME - An adhesive composition for semiconductors, an adhesive film, and a semiconductor device, wherein, in a curing process including a first stage at a temperature ranging from 120° C. to 130° C. for 1 to 20 minutes, a second stage at a temperature ranging from 140° C. to 150° C. for 1 to 10 minutes, a third stage at a temperature ranging from 160° C. to 180° C. for 30 seconds to 10 minutes, and a fourth stage at a temperature ranging from 160° C. to 180° C. for 10 minutes to 2 hours, the adhesive film has a DSC curing rate in the first stage that is 40% or less of a total curing rate, a DSC curing rate in the fourth stage that is 30% to 60% higher than a DSC curing rate in the third stage, and DSC curing rates in each of the second and third stages that are 5% or more higher than a DSC curing rate of a preceding stage thereof. | 07-10-2014 |
20140243453 | CONDUCTIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF - A conductive resin composition which includes an epoxy resin (A), a compound (B) having a (meth)acryloyl group and a glycidyl group, a phenolic resin curing agent (C), a radical polymerization initiator (D) and a conductive particle (E). The conductive resin composition which may be B-staged (semi-cured) at a relatively low temperature to exhibit sufficient tack-free properties and excellent pressure-sensitive tackiness. This permits temporary bonding of parts without involving solvent evaporation or light illumination, thereby reducing or avoiding an increase in facility costs. The conductive resin composition may thereafter be cured (C-staged) to provide a cured product having a desirable bond strength, while maintaining a low specific resistivity. | 08-28-2014 |
20140309338 | WATER-BASED COATING COMPOSITIONS - Coating compositions are disclosed. In some embodiments, the coating compositions are used to coat substrates such as packaging materials and the like for the storage of food and beverages. The coating compositions can be prepared by reacting an epoxidized vegetable oil and a hydroxyl functional material in the presence of an acid catalyst to form a hydroxyl functional oil polyol, mixing the hydroxyl functional oil polyol (with or without epoxidized polybutadiene) and a functional polyolefin copolymer to form a mixture, reacting the mixture with an ethylenically unsaturated monomer component in the presence of an initiator to form a graft copolymer, and crosslinking the graft copolymer with a crosslinker to form the coating composition, wherein the graft copolymer or the crosslinked graft copolymer is inverted into water. | 10-16-2014 |
20150025176 | FLAME RETARDANT STRUCTURAL EPOXY RESIN ADHESIVES AND PROCESS FOR BONDING METAL MEMBERS - A heat-curable structural adhesive includes at least one non-rubber-modified epoxy resin; an optional rubber or toughener, one or more epoxy curing agents, one or more epoxy curing catalysts; and a flame retardant mixture that includes (i) alumina trihydrate, (ii) zinc borate and (iii) melamine or a melamine derivative. The structural adhesive is useful for bonding metals to other materials or metals to other metals. The structural adhesive strongly resists ignition when welding is performed in the presence of the uncured material, and does not interfere significantly with weld performance. | 01-22-2015 |
20150148451 | EPOXY RESIN COMPOSITION - An epoxy resin composition, the epoxy resin composition including components (A1) to (C1) described below, wherein the content of the component (B1) is 8 to 20 parts by mass relative to 100 parts by mass of the component (A1), and the content of the component (C1) is 12 to 110 parts by mass relative to 100 parts by mass of the component (A1): component (A1): an epoxy resin; component (B1): a boron trihalide-amine complex; and component (C1): rubber particles. | 05-28-2015 |