Entries |
Document | Title | Date |
20090280597 | Surface cleaning and texturing process for crystalline solar cells - Methods for surface texturing a crystalline silicon substrate are provided. In one embodiment, the method includes providing a crystalline silicon substrate, wetting the substrate with an alkaline solution comprising a wetting agent, and forming a textured surface with a structure having a depth about 1 μm to about 10 μm on the substrate. In another embodiment, a method of performing a substrate texture process includes providing crystalline silicon substrate, pre-cleaning the substrate in a HF aqueous solution, wetting the substrate with a KOH aqueous solution comprising polyethylene glycol (PEG) compound, and forming a textured surface with a structure having a depth about 3 μm to about 8 μm on the substrate. | 11-12-2009 |
20090311821 | Method for producing silicon substrate for solar cells - A method for producing a silicon substrate for solar cells is provided. The method includes performing a saw damage removal (SDR) and surface macro-texturing on a silicon substrate with acids solution, so that a surface of the silicon substrate becomes an irregular surface. Thereafter, a metal-activated selective oxidation is performed on the irregular surface with an aqueous solution containing an oxidant and a metal salt, in which the oxidant is one selected from persulfate ion, permanganate ion, bichromate ion, and a mixture thereof. Afterwards, the irregular surface is etched with an aqueous solution containing HF and H | 12-17-2009 |
20100029034 | METHOD OF MANUFACTURING SOLAR CELL - A method of manufacturing a solar cell having a texture on a surface of a silicon substrate includes first forming a porous layer on the surface of the silicon substrate by dipping the silicon substrate into a mixed aqueous solution of oxidizing reagent containing metal ions and hydrofluoric acid. Second, a texture is formed by etching the surface of the silicon substrate after the porous layer is formed, by dipping the silicon substrate into a mixed acid mainly containing hydrofluoric acid and nitric acid. | 02-04-2010 |
20100087030 | METHOD, APPARATUS AND SYSTEM OF MANUFACTURING SOLAR CELL - A method of manufacturing a crystalline silicon solar cell includes steps of preparing a crystalline silicon substrate, texturing the substrate using plasma to form uneven patterns for increasing light absorption, doping ions in the substrate using plasma to form a doping layer for a PN junction, heating the substrate to activate the doped ions, forming an antireflection film on the doping layer, and forming front and back electrodes on front and back surfaces of the substrate, respectively. | 04-08-2010 |
20100159629 | METHOD TO TEXTURE A LAMINA SURFACE WITHIN A PHOTOVOLTAIC CELL - It is advantageous to create texture at the surface of a photovoltaic cell to reduce reflection and increase travel length of light within the cell. A method is disclosed to create texture at the surface of a silicon body by reacting a silicide-forming metal at the surface, where the silicide-silicon interface is non-planar, then stripping the silicide, leaving behind a textured surface. Depending on the metal and the conditions of silicide formation, the resulting surface may be faceted. The peak-to-valley height of this texturing will generally be between about 300 and about 5000 angstroms, which is well-suited for use in photovoltaic cells comprising a thin silicon lamina. | 06-24-2010 |
20100178723 | Method and Structure for Fabricating Solar Cells Using a Thick Layer Transfer Process - A photovoltaic cell device, e.g., solar cell, solar panel, and method of manufacture. The device has an optically transparent substrate comprises a first surface and a second surface. A first thickness of material (e.g., semiconductor material, single crystal material) having a first surface region and a second surface region is included. In a preferred embodiment, the surface region is overlying the first surface of the optically transparent substrate. The device has an optical coupling material provided between the first surface region of the thickness of material and the first surface of the optically transparent material. | 07-15-2010 |
20100184248 | Creation and Translation of Low-Relieff Texture for a Photovoltaic Cell - Low-relief texture can be created by applying and firing frit paste on a silicon surface. Where frit contacts the surface at high temperature, it etches silicon, dissolving silicon in the softened glass frit. The result is a series of small, randomly located pits, which produce a near-Lambertian surface, suitable for use in a photovoltaic cell. This texturing method consumes little silicon, and is advantageously used in a photovoltaic cell in which a thin silicon lamina comprises the base region of the cell. When the lamina is formed by implanting ions in a donor wafer to form a cleave plane and cleaving the lamina from the donor wafer at the cleave plane, the ion implantation step will serve to translate texture formed at a first surface to the cleave plane, and thus to the second, opposing surface following cleaving. Low-relief texture formed by other methods can be translated from the first surface to the second surface in this way as well. | 07-22-2010 |
20100190288 | THIN SILICON OR GERMANIUM SHEETS AND PHOTOVOLATICS FORMED FROM THIN SHEETS - Thin semiconductor foils can be formed using light reactive deposition. These foils can have an average thickness of less than 100 microns. In some embodiments, the semiconductor foils can have a large surface area, such as greater than about 900 square centimeters. The foil can be free standing or releasably held on one surface. The semiconductor foil can comprise elemental silicon, elemental germanium, silicon carbide, doped forms thereof, alloys thereof or mixtures thereof. The foils can be formed using a release layer that can release the foil after its deposition. The foils can be patterned, cut and processed in other ways for the formation of devices. Suitable devices that can be formed form the foils include, for example, photovoltaic modules and display control circuits. | 07-29-2010 |
20100267186 | METHOD FOR FABRICATING A THREE-DIMENSIONAL THIN-FILM SEMICONDUCTOR SUBSTRATE FROM A TEMPLATE - A method is presented for fabrication of a three-dimensional thin-film solar cell semiconductor substrate from a template. A semiconductor template having three-dimensional surface features comprising a top surfaces substantially aligned along a ( | 10-21-2010 |
20100291728 | MANUFACTURING METHOD OF THE SOLAR CELL - A method of manufacturing a solar cell, which can improve productivity by improving a surface texturing process for effectively capturing incident light during a process for manufacturing the solar cell, is provided. The method includes cleaning a substrate, texturing a surface of the substrate, doping and diffusing impurities into the substrate, coating an anti-reflection layer on the substrate, formed metal electrodes on the substrate, and cutting off corner electrodes among the metal electrodes. The texturing of the surface of the substrate includes printing a mask having a predetermined pattern on the substrate through an imprint process, etching the substrate, and removing the mask. | 11-18-2010 |
20100304521 | Shadow Mask Methods For Manufacturing Three-Dimensional Thin-Film Solar Cells - Methods for manufacturing three-dimensional thin-film solar cells using a template. The template comprises a template substrate comprising a plurality of three-dimensional surface features. The three-dimensional thin-film solar cell substrate is formed by forming a sacrificial layer on the template, subsequently depositing a semiconductor layer, selectively etching the sacrificial layer, and releasing the semiconductor layer from the template. Select portions of the three-dimensional thin-film solar cell substrate are then doped with a first dopant, while other select portions are doped with a second dopant. Next, selective emitter and base metallization regions are formed using a PECVD shadow mask process. | 12-02-2010 |
20100304522 | ION IMPLANTATION FABRICATION PROCESS FOR THIN-FILM CRYSTALLINE SILICON SOLAR CELLS - A front contact thin-film solar cell is formed on a thin-film crystalline silicon substrate. Emitter regions, selective emitter regions, and a back surface field are formed through ion implantation processes. In yet another embodiment, a back contact thin-film solar cell is formed on a thin-film crystalline silicon substrate. Emitter regions, selective emitter regions, base regions, and a front surface field are formed through ion implantation processes. | 12-02-2010 |
20110003423 | Trench Process And Structure For Backside Contact Solar Cells With Polysilicon Doped Regions - A solar cell includes polysilicon P-type and N-type doped regions on a backside of a substrate, such as a silicon wafer. A trench structure separates the P-type doped region from the N-type doped region. Each of the P-type and N-type doped regions may be formed over a thin dielectric layer. The trench structure may include a textured surface for increased solar radiation collection. Among other advantages, the resulting structure increases efficiency by providing isolation between adjacent P-type and N-type doped regions, thereby preventing recombination in a space charge region where the doped regions would have touched. | 01-06-2011 |
20110003424 | Back Side Contact Solar Cell Structures And Fabrication Processes - In one embodiment, active diffusion junctions of a solar cell are formed by diffusing dopants from dopant sources selectively deposited on the back side of a wafer. The dopant sources may be selectively deposited using a printing method, for example. Multiple dopant sources may be employed to form active diffusion regions of varying doping levels. For example, three or four active diffusion regions may be fabricated to optimize the silicon/dielectric, silicon/metal, or both interfaces of a solar cell. The front side of the wafer may be textured prior to forming the dopant sources using a texturing process that minimizes removal of wafer material. Openings to allow metal gridlines to be connected to the active diffusion junctions may be formed using a self-aligned contact opening etch process to minimize the effects of misalignments. | 01-06-2011 |
20110027937 | METHODS OF FORMING PHOTOVOLTAIC DEVICES - A template for growth of an anticipated semiconductor film has a deformation textured substrate. The template also has an intermediate epitaxial film coupled to the deformation textured substrate, the intermediate epitaxial film being chemically compatible and substantially lattice matched with the anticipated semiconductor film. A method of manufacturing a template for the growth of an anticipated semiconductor is also disclosed. A substrate is deformed to produce a textured surface. An intermediate epitaxial film, chemically compatible and substantially lattice matched with the anticipated semiconductor film, is deposited. A further disclosed photovoltaic device has a semiconductor layer, a deformation textured substrate, and an intermediate epitaxial film coupled to the deformation textured substrate. The intermediate epitaxial film is chemically compatible and substantially lattice matched with the semiconductor layer. The semiconductor layer is epitaxially grown on the intermediate epitaxial film. | 02-03-2011 |
20110045627 | SOLAR CELLS WITH TEXTURED SURFACES - Semiconductor photovoltaic cells have surfaces that are textured for processing and photovoltaic reasons. The absorbing regions may have parallel grooves that reduce loss of solar energy that would otherwise be lost by reflection. One form of texturing has parallel grooves and ridges. The cell also includes regions of metallization for collecting the generated electrical carriers and conducting them away, which may be channels. The topography is considered during production, using a process that takes advantage of the topography to govern what locations upon will receive a specific processing, and which locations will not receive such a processing. Liquids are treated directly into zones of the cell. They migrate throughout a zone and act upon the locations contacted. They do not migrate to other zones, due to impediments to fluid flow that are features of the surface texture, such as edges, walls and ridges. Blocking liquid may also be deposited and migrate within a zone, to block or mask a subsequent activity, such as etching. | 02-24-2011 |
20110059570 | Process For The Rough-Etching of Silicon Solar Cells - The present invention relates to a novel process for producing textured surfaces on multicrystalline, tricrystalline and monocrystalline silicon surfaces of solar cells or on silicon substrates which are used for photovoltaic purposes. It relates in particular to an etching process and an etching agent for producing a textured surface on a silicon substrate. | 03-10-2011 |
20110059571 | Trench Process and Structure for Backside Contact Solar Cells with Polysilicon Doped Regions - A solar cell includes polysilicon P-type and N-type doped regions on a backside of a substrate, such as a silicon wafer. An interrupted trench structure separates the P-type doped region from the N-type doped region in some locations but allows the P-type doped region and the N-type doped region to touch in other locations. Each of the P-type and N-type doped regions may be formed over a thin dielectric layer. Among other advantages, the resulting solar cell structure allows for increased efficiency while having a relatively low reverse breakdown voltage. | 03-10-2011 |
20110081742 | TEXTURING SEMICONDUCTOR SUBSTRATES - Semiconductors are textured with aqueous solutions containing non-volatile alkoxylated glycols, their ethers and ether acetate derivatives having molecular weights of 170 or greater and flash points of 75° C. or greater. The textured semiconductors can be used in the manufacture of photovoltaic devices. | 04-07-2011 |
20110129956 | WEDGE IMPRINT PATTERNING OF IRREGULAR SURFACE - Patterned substrates for photovoltaic and other uses are made by pressing a flexible stamp upon a thin layer of resist material, which covers a substrate, such as a wafer. The resist changes phase or becomes flowable, flowing away from locations of impression, revealing the substrate, which is subjected to some shaping process, typically etching. Portions exposed by the stamp being are removed, moved, and portions that protected by the resist, remain. A typical substrate is silicon, and a typical resist is a wax. Workpiece textures include extended grooves, discrete, spaced apart pits, and combinations and intermediates thereof. Platen or rotary patterning apparatus may be used. Rough and irregular workpiece substrates may be accommodated by extended stamp elements. Resist may be applied first to the workpiece, the stamp, or substantially simultaneously, in discrete locations, or over the entire surface of either. The resist dewets the substrate completely where desired. | 06-02-2011 |
20110143483 | TRANSPARENT CONDUCTIVE LAYER AND METHOD OF MANUFACTURING THE SAME - A transparent conductive layer includes a substrate, a first conductive layer disposed on the substrate, and a second conductive layer disposed on the first conductive layer, wherein the second conductive layer comprises a textured surface and an opening which exposes the first conductive layer, wherein the opening comprises a diameter of about 1 micrometer to about 3 micrometers. Also disclosed is a method of manufacturing the transparent conductive layer and a photoelectric device. | 06-16-2011 |
20110165724 | TECHNIQUES FOR USE OF NANOTECHNOLOGY IN PHOTOVOLTAICS - Techniques for combining nanotechnology with photovoltaics are provided. In one aspect, a method of forming a photovoltaic device is provided comprising the following steps. A plurality of nanowires are formed on a substrate, wherein the plurality of nanowires attached to the substrate comprises a nanowire forest. In the presence of a first doping agent and a first volatile precursor, a first doped semiconductor layer is conformally deposited over the nanowire forest. In the presence of a second doping agent and a second volatile precursor, a second doped semiconductor layer is conformally deposited over the first doped layer. The first doping agent comprises one of an n-type doping agent and a p-type doping agent and the second doping agent comprises a different one of the n-type doping agent and the p-type doping agent from the first doping agent. A transparent electrode layer is deposited over the second doped semiconductor layer. | 07-07-2011 |
20110177647 | METHOD AND APPARATUS FOR FORMING A PHOTODIODE - A method for forming a photodiode is provided. The method comprises: providing a region of semiconductor material having a first surface and a second surface; coupling a first conductive layer to the first surface of the semiconductor material; and coupling a second conductive surface to the second surface of the semiconductor material to form a photodiode, the second conductive surface comprising a metal surface having a two-dimensional periodic array of openings therethrough, wherein the photodiode is configured to be operated such that light is incident on the second conductive surface. A method for reducing the required thickness of a photodiode is also provided. | 07-21-2011 |
20110183457 | RTA for Fabrication of Solar Cells - A method of semiconductor junction formation in RTA process for fabrication of solar cells provides for delivery of inert gases in the vicinity of the Si wafer while dopant species are being driven form a dopant source into the surface of the wafer irradiated by a laser beam. The laser beam is emitted by CW- or pulsed operated lasers including fiber lasers operative to provide annealing and diffusion operation. Optionally, the passivation of the surface and formation of the antireflection coating are performed simultaneously with the penetration the dopant species. | 07-28-2011 |
20110183458 | FORMING SOLAR CELLS USING A PATTERNED DEPOSITION PROCESS - Embodiments of the invention contemplate the formation of a high efficiency solar cell using novel methods to form the active doped region(s) and the metal contact structure of the solar cell device. In one embodiment, the methods include the steps of depositing a dielectric material that is used to define the boundaries of the active regions and/or contact structure of a solar cell device. Various techniques may be used to form the active regions of the solar cell and the metal contact structure. | 07-28-2011 |
20110207259 | LOW-COST SOLAR CELLS AND METHODS FOR THEIR PRODUCTION - Methods for fabricating solar cells without the need to perform gasification of metallurgical-grade silicon are disclosed. Consequently, the costs and health and environmental hazards involved in fabricating the solar or silicon grade silicon are being avoided. A solar cell structure comprises a metallurgical grade doped silicon substrate and a thin-film structure formed over the substrate to form a p-i-n junction with the substrate. The substrate may be doped p-type, and the thin film structure may be an intrinsic amorphous layer formed over the substrate and an n-type amorphous layer formed over the intrinsic layer. | 08-25-2011 |
20110223708 | LOW-COST MULTI-JUNCTION SOLAR CELLS AND METHODS FOR THEIR PRODUCTION - Methods for fabricating solar cells without the need to perform gasification of metallurgical-grade silicon are disclosed. Consequently, the costs and health and environmental hazards involved in fabricating the solar or silicon grade silicon are being avoided. A solar cell structure comprises a metallurgical grade doped silicon substrate and a thin-film structure formed over the substrate to form a p-i-n junction with the substrate. The substrate may be doped p-type, and the thin film structure may be an intrinsic amorphous layer formed over the substrate and an n-type amorphous layer formed over the intrinsic layer. | 09-15-2011 |
20110230004 | Methods of Building Crystalline Silicon Solar Cells For Use In Combinatorial Screening - Embodiments of the current invention describe methods of forming different types of crystalline silicon based solar cells that can be combinatorially varied and evaluated. Examples of these different types of solar cells include front and back contact silicon based solar cells, all-back contact solar cells and selective emitter solar cells. These methodologies all incorporate the formation of site-isolated regions using a combinatorial processing tool and the use of these site-isolated regions to form the solar cell area. Therefore, multiple solar cells may be rapidly formed on a single crystalline silicon substrate for use in combinatorial methodologies. Any of the individual processes of the methods described may be varied combinatorially to test varied process conditions or materials. | 09-22-2011 |
20110256659 | METHOD FOR MANUFACTURING SOLAR CELL, ETCHING DEVICE, AND CVD DEVICE - A solar cell manufacturing method according to the present invention is a solar cell manufacturing method that forms a transparent conductive film of ZnO as an electric power extracting electrode on a light incident side, the method comprises at least in a following order: a process A forming the transparent conductive film on a substrate by applying a sputtering voltage to sputter a target made of a film formation material for the transparent conductive film; a process B forming a texture on a surface of the transparent conductive film; a process C cleaning the surface of the transparent conductive film on which the texture has been formed using an UV/ozone; and a process D forming an electric power generation layer on the transparent conductive film. | 10-20-2011 |
20110263068 | METHODS FOR ENHANCING LIGHT ABSORPTION DURING PV APPLICATIONS - Embodiments of the invention generally relate to solar cell devices and methods for manufacturing such solar cell devices. In one embodiment, a method for forming a solar cell device includes depositing a conversion layer over a first surface of a substrate, depositing a first transparent conductive oxide layer over a second surface of the substrate that is opposite the first surface, depositing a first p-doped silicon layer over the first transparent conductive oxide layer, depositing a first intrinsic silicon layer over the first p-doped silicon layer, and depositing a first n-doped silicon layer over the first intrinsic silicon layer. The method further includes depositing a second transparent conductive oxide layer over the first n-doped silicon layer, and depositing an electrically conductive contact layer over the second transparent conductive oxide layer. | 10-27-2011 |
20110287570 | LASER PROCESSING APPARATUS, LASER PROCESSING METHOD, AND MANUFACTURING METHOD OF PHOTOVOLTAIC DEVICE - To provide a conveying unit that holds a workpiece and conveys the workpiece at a constant rate in one direction, a laser oscillator that emits a pulsed laser beam, a splitter that splits a pulsed laser beam into a pattern having a predetermined geometric pitch, a first deflector that scans the split pulsed laser beam in the other direction substantially orthogonal to the one direction, a second deflector that adjusts and deflects the split pulsed laser beam deflected by the first deflector on the surface to be processed in the one direction so as to scan the resultant pulsed laser beam onto the surface to be processed at a constant rate equal to a rate at which the workpiece is conveyed, and a condenser that condenses the split pulsed laser beam deflected by the second deflector onto the surface to be processed. | 11-24-2011 |
20110294248 | METHOD FOR HEATING A SUBSTRATE OF SOLAR CELL - Disclosed is a method for heating a substrate of a solar cell. The method includes: providing a single or poly crystalline substrate; heating the substrate at atmosphere by a non-contact heater; and forming a thin film, which includes amorphous silicon or silicon alloy, on the substrate. | 12-01-2011 |
20110294249 | METHOD FOR CLEANING A SUBSTRATE OF SOLAR CELL - Disclosed is a method for cleaning the substrate of a solar cell. The method includes: providing a single or poly crystalline substrate; performing a wet etching process such that the surface of the substrate is textured; performing an atmospheric pressure plasma cleaning process on the textured substrate; and forming p-n junction. | 12-01-2011 |
20110312121 | METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE - A method for manufacturing a photoelectric conversion device including a first-conductivity-type crystalline semiconductor region, an intrinsic crystalline semiconductor region, and a second-conductivity-type semiconductor region that are stacked over an electrode is provided for a new anti-reflection structure. An interface between the electrode and the first-conductivity-type crystalline semiconductor region is flat. The intrinsic crystalline semiconductor region includes a crystalline semiconductor region, and a plurality of whiskers that are provided over the crystalline semiconductor region and include a crystalline semiconductor. The first-conductivity-type crystalline semiconductor region and the intrinsic crystalline semiconductor region are formed by a low pressure chemical vapor deposition method at a temperature higher than 550° C. and lower than 650° C. The second-conductivity-type semiconductor region is formed by a low pressure chemical vapor deposition method at a temperature lower than or equal to 550° C. or higher than or equal to 650° C. | 12-22-2011 |
20110318864 | METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE - The purpose is manufacturing a photoelectric conversion device with excellent photoelectric conversion characteristics typified by a solar cell with effective use of a silicon material. A single crystal silicon layer is irradiated with a laser beam through an optical modulator to form an uneven structure on a surface thereof. The single crystal silicon layer is obtained in the following manner; an embrittlement layer is formed in a single crystal silicon substrate; one surface of a supporting substrate and one surface of an insulating layer formed over the single crystal silicon substrate are disposed to be in contact and bonded; heat treatment is performed; and the single crystal silicon layer is formed over the supporting substrate by separating part of the single crystal silicon substrate fixed to the supporting substrate along the embrittlement layer or a periphery of the embrittlement layer. Then, irradiation with a laser beam is performed on a separation surface of the single crystal silicon layer through an optical modulator which modulates light intensity regularly, and unevenness is formed on the surface. Due to the unevenness, reflection of incident light is reduced and absorptance with respect to light is improved, therefore, photoelectric conversion efficiency of the photoelectric conversion device is improved. | 12-29-2011 |
20120003779 | ABRASION-ETCH TEXTURING OF GLASS - A method for texturing a surface of a substrate comprising creating micro-fractures in the surface of the substrate to be textured, and etching the surface of the substrate to be textured to open the micro-fractures. | 01-05-2012 |
20120003780 | PHOTOVOLTAIC CELL MANUFACTURE - A photovoltaic cell manufacturing method is disclosed. Methods include manufacturing a photovoltaic cell having a selective emitter and buried contact (electrode) structure utilizing nanoimprint technology. The methods include providing a semiconductor substrate having a first surface and a second surface opposite the first surface; forming a first doped region in the semiconductor substrate adjacent to the first surface; performing a nanoimprint process and an etching process to form a trench in the semiconductor substrate, the trench extending into the semiconductor substrate from the first surface; forming a second doped region in the semiconductor substrate within the trench, the second doped region having a greater doping concentration than the first doped region; and filling the trench with a conductive material. The nanoimprint process uses a mold to define a location of an electrode line layout. | 01-05-2012 |
20120003781 | SOLAR CELL AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a solar cell and a method for manufacturing the same. More specifically, the present invention provides a silicon solar cell capable of minimizing defects and recombination of electrons-holes by removing a damaged layer formed by a laser edge isolation process to isolate a silicon substrate and covering a protective layer on a surface thereof and a method for manufacturing the same. | 01-05-2012 |
20120015470 | METHOD FOR ROUGHENING SUBSTRATE SURFACE AND METHOD FOR MANUFACTURING PHOTOVOLTAIC DEVICE - A method of roughening a substrate surface includes forming an opening in a protection film formed on a surface of a semiconductor substrate, performing a first etching process using an acid solution by utilizing the protection film as a mask so as to form a first concave under the opening and its vicinity area, performing an etching process by using the protection film as a mask so as to remove an oxide film formed on a surface of the first concave, performing anisotropic etching by using the protection film as a mask so as to form a second concave under the opening and its vicinity area, and removing the protection film. | 01-19-2012 |
20120021555 | PHOTOVOLTAIC CELL TEXTURIZATION - A photovoltaic cell texturization method is disclosed. The method includes providing a photovoltaic cell substrate; and texturizing a surface of the photovoltaic cell substrate. The texturizing implements a nanoimprint lithography process to expose a portion of the surface of the photovoltaic cell substrate. An etching process is performed on the exposed portion of the exposed portion of the surface of the photovoltaic cell substrate. | 01-26-2012 |
20120040489 | METHOD, APPARATUS AND SYSTEM OF MANUFACTURING SOLAR CELL - A method of manufacturing a crystalline silicon solar cell includes steps of preparing a crystalline silicon substrate, texturing the substrate using plasma to form uneven patterns for increasing light absorption, doping ions in the substrate using plasma to form a doping layer for a PN junction, heating the substrate to activate the doped ions, forming an antireflection film on the doping layer, and forming front and back electrodes on front and back surfaces of the substrate, respectively. | 02-16-2012 |
20120045867 | ANTI-REFLECTIVE PHOTOVOLTAIC MODULE - An anti-reflective surface on a photovoltaic can reduce optical reflection. | 02-23-2012 |
20120064659 | METHOD FOR MANUFACTURING SOLAR CELL - A method for manufacturing a solar cell includes conducting texturing by injecting plasma on an entire surface of a solar cell wafer, forming an emitter layer by diffusing a solid source on the textured solar cell wafer, forming a passivation layer on the solar cell wafer on which the emitter layer is formed, and forming electrodes. A PSG (PhosphoSilicate Glass) layer is prevented from being formed on the solar cell wafer. | 03-15-2012 |
20120107996 | SURFACE TREATMENT PROCESS PERFORMED ON A TRANSPARENT CONDUCTIVE OXIDE LAYER FOR SOLAR CELL APPLICATIONS - Embodiments of the invention provide methods of a surface treatment process performing on a transparent conductive oxide layer used in solar cell devices. In one embodiment, a method of performing a surface treatment process includes providing a substrate having a transparent conductive oxide layer disposed thereon in a processing chamber, supplying a gas mixture including an oxygen containing gas into the processing chamber, and performing a surface treatment process using the gas mixture on the surface of the transparent conductive oxide layer. | 05-03-2012 |
20120122266 | POROUS LIFT-OFF LAYER FOR SELECTIVE REMOVAL OF DEPOSITED FILMS - A porous lift off layer facilitates removal of films from surfaces, such as semiconductors. A film is applied over a patterned porous layer, the layer comprising openings typically larger than the film thickness. The porous material and the film are then removed from areas where film is not intended. The porous layer can be provided as a slurry, dried to open porosities, or fugitive particles within a field, which disassociate upon the application of heat or solvent. The film can be removed by etchant that enters through porosities where the film does not bridge the spaces between solid portions, so that the etchant attacks both film surfaces | 05-17-2012 |
20120149144 | METHOD FOR MANUFACTURING SOLAR CELL - A method for manufacturing a solar cell is presented. The method includes: forming an amorphous silicon layer on a first surface of a light absorbing layer; doping the amorphous silicon layer with a dopant; forming a dopant layer by diffusing the dopant into the amorphous silicon layer with a laser; forming a semiconductor layer by removing the dopant that remains outside the dopant layer; etching the surface of the semiconductor layer by using an etchant; forming a first electrode on the semiconductor layer; and forming a second electrode on a second surface of the light absorbing layer. | 06-14-2012 |
20120164779 | METHOD OF FABRICATING A DIFFERENTIAL DOPED SOLAR CELL - A method of fabricating a differential doped solar cell is provided. The method comprises the steps of (a) providing a light doped semiconductor substrate; (b) forming a heavy doped layer having the same type of dopant used in step (a) on a front surface of the semiconductor substrate; and (c) forming an emitter layer having a different type of dopant used in step (a) on a surface of the heavy doped layer to constitute a p-n junction with the heavy doped layer. | 06-28-2012 |
20120164780 | METHOD AND APPARATUS FOR MAKING A SOLAR PANEL THAT IS PARTIALLY TRANSPARENT - A method is described for making a partially transparent thin film solar panel based on transparent glass or plastic substrates by creating an array of small light transmitting apertures through all the opaque layers by using an ink jet print head to apply droplets of an etching fluid to the top electrode layer to form apertures in the electrode layer. These apertures may then be used as a contact mask for etching holes though the underlying active layer (if this is opaque). In this second stage, the etchant may be applied using an ink jet print head or by spraying or the panel may be immersed in the etchant. | 06-28-2012 |
20120171804 | PATTERNING OF SILICON OXIDE LAYERS USING PULSED LASER ABLATION - Various laser processing schemes are disclosed for producing various types of hetero junction and homo-junction solar cells. The methods include base and emitter contact opening, selective doping, metal ablation, annealing to improve passivation, and selective emitter doping via laser heating of aluminum. Also, laser processing schemes are disclosed that are suitable for selective amorphous silicon ablation and selective doping for hetero junction solar cells. Laser ablation techniques are disclosed that leave the underlying silicon substantially undamaged. These laser processing techniques may be applied to semiconductor substrates, including crystalline silicon substrates, and further including crystalline silicon substrates which are manufactured either through wire saw wafering methods or via epitaxial deposition processes, or other cleavage techniques such as ion implantation and heating, that are either planar or textured/three-dimensional. These techniques are highly suited to thin crystalline semiconductor, including thin crystalline silicon films. | 07-05-2012 |
20120178203 | LASER ANNEALING FOR ALUMINUM DOPING AND FORMATION OF BACK-SURFACE FIELD IN SOLAR CELL CONTACTS - Various laser processing schemes are disclosed for producing various types of hetero junction and homo-junction solar cells. The methods include base and emitter contact opening, selective doping, metal ablation, annealing to improve passivation, and selective emitter doping via laser heating of aluminum. Also, laser processing schemes are disclosed that are suitable for selective amorphous silicon ablation and selective doping for hetero junction solar cells. Laser ablation techniques are disclosed that leave the underlying silicon substantially undamaged. These laser processing techniques may be applied to semiconductor substrates, including crystalline silicon substrates, and further including crystalline silicon substrates which are manufactured either through wire saw wafering methods or via epitaxial deposition processes, or other cleavage techniques such as ion implantation and heating, that are either planar or textured/three-dimensional. These techniques are highly suited to thin crystalline semiconductor, including thin crystalline silicon films. | 07-12-2012 |
20120178204 | COPPER-ASSISTED, ANTI-REFLECTION ETCHING OF SILICON SURFACES | 07-12-2012 |
20120184062 | COMPOSITION FOR FORMING N-TYPE DIFFUSION LAYER, METHOD FOR FORMING N-TYPE DIFFUSION LAYER, AND METHOD FOR PRODUCING PHOTOVOLTAIC CELL - The composition for forming an n-type diffusion layer in accordance with the present invention contains a donor element-containing glass powder and a dispersion medium. An n-type diffusion layer and a photovoltaic cell having an n-type diffusion layer are prepared by applying the composition for forming an n-type diffusion layer, followed by a thermal diffusion treatment. | 07-19-2012 |
20120196397 | Methods of Building Crystalline Silicon Solar Cells For Use In Combinatorial Screening - Embodiments of the current invention describe methods of forming different types of crystalline silicon based solar cells that can be combinatorially varied and evaluated. Examples of these different types of solar cells include front and back contact silicon based solar cells, all-back contact solar cells and selective emitter solar cells. These methodologies all incorporate the formation of site-isolated regions using a combinatorial processing tool and the use of these site-isolated regions to form the solar cell area. Therefore, multiple solar cells may be rapidly formed on a single crystalline silicon substrate for use in combinatorial methodologies. Any of the individual processes of the methods described may be varied combinatorially to test varied process conditions or materials. | 08-02-2012 |
20120208313 | METHODS OF FORMING AGGREGATE PARTICLES OF NANOMATERIALS - Methods for forming aggregates of nanomaterials are provided. The aggregates are formed from a liquid dispersion of the nanomaterials in a liquid. The dispersion is aerosolized and the liquid removed from the aerosolized dispersion to provide the aggregates. The aggregates are useful as a photoelectric layer and/or a light-dispersive layer in dye-sensitized solar cells. | 08-16-2012 |
20120214270 | PROCESS FOR THE PRODUCTION OF SOLAR CELLS COMPRISING A SELECTIVE EMITTER - The present invention relates to a process for the production of solar cells comprising a selective emitter using an improved etching-paste composition which has significantly improved selectivity for silicon layers | 08-23-2012 |
20120225517 | TEXTURING SURFACE OF LIGHT-ABSORBING SUBSTRATE - Etched substrates, and particularly, light-absorbing etched substrates, and methods for making such substrates are described. | 09-06-2012 |
20120238050 | Combinatorial Screening of Transparent Conductive Oxide Materials for Solar Applications - Embodiments of the current invention include methods of improving a process of forming a textured TCO film by combinatorial methods. The combinatorial method may include depositing a TCO by physical vapor deposition or sputtering, annealing the TCO, and etching the TCO where at least one of the depositing, the annealing, or the etching is performed combinatorially. Embodiments of the current invention also include improved methods of forming the TCO based on the results of combinatorial testing. | 09-20-2012 |
20120258565 | SUBSTRATE PROCESSING APPARATUS AND METHOD FOR FORMING COATING FILM ON SURFACE OF REACTION TUBE USED FOR THE SUBSTRATE PROCESSING APPARATUS - There is provided a substrate processing apparatus, comprising: a processing chamber in which a plurality of substrates are housed, the substrate having thereon a lamination film composed of any one of copper-indium, copper-gallium, or copper-indium-gallium; a reaction tube formed so as to constitute the processing chamber; a gas supply tube configured to introduce elemental selenium-containing gas or elemental sulfur-containing gas to the processing chamber; an exhaust tube configured to exhaust an atmosphere in the processing chamber; and a heating section provided so as to surround the reaction tube, wherein a porous coating film having a void rate of 5% to 15% mainly composed of a mixture of chromium oxide (Cr | 10-11-2012 |
20120270359 | METHOD OF FORMING P-N JUNCTION IN SOLAR CELL SUBSTRATE - Embodiments of the present invention relate to a single step diffusion process used in selective emitter solar cell fabrication. In one embodiment, a dopant paste is selectively applied on a front surface of a substrate having opposite conductivity type from the dopant paste. The substrate is then exposed to a dopant containing vapor to deposit a doping layer having opposite conductivity type from the substrate on the front surface of the substrate. While the substrate is exposed to the dopant containing vapor, a portion of the dopant paste also contribute to deposition of the doping layer via gas phase transport of doping atoms from the dopant paste. The substrate is then heated in an atmosphere comprising oxygen and/or nitrogen to a temperature sufficient to cause the dopant atoms in the dopant paste and the doping layer to diffuse into the substrate, forming heavily and lightly doped emitter regions. | 10-25-2012 |
20120295390 | SINGLE-CRYSTALLINE SILICON ALKALINE TEXTURING WITH GLYCEROL OR ETHYLENE GLYCOL ADDITIVES - Alternative additives that can be used in place of isopropyl alcohol in aqueous alkaline etchant solutions for texturing a surface of a single-crystalline silicon substrate are provided. The alternative additives do not have volatile constituents, yet can be used in an aqueous alkaline etchant solution to provide a pyramidal shaped texture surface to the single-crystalline silicon substrate that is exposed to such an etchant solution. Also provided is a method of forming a textured silicon surface. The method includes immersing a single-crystalline silicon substrate into an etchant solution to form a pyramid shaped textured surface on the single-crystalline silicon substrate. The etchant solution includes an alkaline component, silicon (etched into the solution as a bath conditioner) and glycerol or ethylene glycol as an additive. The textured surface of the single-crystalline silicon substrate has (111) faces that are now exposed. | 11-22-2012 |
20120329200 | SILICON SURFACE TEXTURING METHOD FOR REDUCING SURFACE REFLECTANCE - A method of texturing a surface of a crystalline silicon substrate is provided. The method includes immersing a crystalline silicon substrate into an aqueous alkaline etchant solution to form a pyramid shaped textured surface, with (111) faces exposed, on the crystalline silicon substrate. The aqueous alkaline etchant solution employed in the method of the present disclosure includes an alkaline component and a nanoparticle slurry component. Specifically, the aqueous alkaline etchant solution of the present disclosure includes 0.5 weight percent to 5 weight percent of an alkaline component and from 0.1 weight percent to 5 weight percent of a nanoparticle slurry on a dry basis. | 12-27-2012 |
20130011956 | Method For Texturing A Photovoltaic Cell - A method for texturing an active surface of a photovoltaic cell in single-crystal silicon or poly-crystal silicon includes depositing a resin on the active surface of the cell, texturing the resin on the active surface with geometric patterns, and texturing the active surface of the cell by eliminating the deposited resin. The depositing of the resin is preceded by pre-texturing the resin on a depositing tool. The texturing step of the resin on the active surface is simultaneous with the depositing of the resin on the active surface. | 01-10-2013 |
20130045561 | SOLAR CELLS WITH TEXTURED SURFACES - Semiconductor photovoltaic cells have surfaces that are textured for processing and photovoltaic reasons. The absorbing regions may have grooves that reduce loss of solar energy that would otherwise be lost by reflection. One form of texturing has grooves and ridges. The cell also includes metallizations for collecting generated electrical carriers and conducting them away, which may be channels. The topography is considered during production, using a process that takes advantage of the topography to govern what locations will receive a specific processing, and which locations will not. Liquids are treated directly into zones. They migrate throughout a zone and act upon the locations contacted. They do not migrate to other zones, due to impediments to flow, such as edges, walls and ridges. Liquid may also be deposited and migrate within a zone, to block or mask a subsequent activity, such as etching. | 02-21-2013 |
20130065350 | Thin Interdigitated Backside Contact Solar Cell and Manufacturing Process Thereof - A design and manufacturing method for an interdigitated backside contact photovoltaic (PV) solar cell less than 100 μm thick are disclosed. A porous silicon layer is formed on a wafer substrate. Portions of the PV cell are then formed using diffusion, epitaxy and autodoping from the substrate. All backside processing of the solar cell (junctions, passivation layer, metal contacts to the N | 03-14-2013 |
20130078756 | AQUEOUS ALKALINE ETCHING AND CLEANING COMPOSITION AND METHOD FOR TREATING THE SURFACE OF SILICON SUBSTRATES - An aqueous alkaline etching and cleaning composition for treating the surface of silicon substrates, the said composition comprising: (A) a quaternary ammonium hydroxide; and (B) a component selected from the group consisting of water-soluble acids and their water-soluble salts of the general formulas (I) to (V): (R | 03-28-2013 |
20130095595 | METHOD FOR PRODUCING A PHOTOVOLTAIC SOLAR CELL - A method for producing a photovoltaic solar cell, including the following steps: A. texturizing a front ( | 04-18-2013 |
20130095596 | METHOD FOR TEXTURING SILICON SURFACE TO CREATE BLACK SILICON FOR PHOTOVOLTAIC APPLICATIONS - The surface of silicon is textured to create black silicon on a nano-micro scale by electrochemical reduction of a silica layer on silicon in molten salts. The silica layer can be a coating, or a layer caused by the oxidation of the silicon. | 04-18-2013 |
20130102107 | METHOD FOR PROCESSING SILICON SUBSTRATE - It is an object to provide a method for processing a silicon substrate that can reduce surface reflectance as much as possible. The method includes a first step of forming a thin film including a metal having higher electronegativity than silicon and having a plurality of openings on a silicon substrate, a second step of soaking the silicon substrate subjected to the first step in a hydrofluoric acid solution containing oxidizer, and a third step of soaking the silicon substrate subjected to the second step in an ammonia aqueous solution containing oxidizer. By performing the steps in the above order, a minute uneven structure is formed on a surface of the silicon substrate to reduce the reflectance. | 04-25-2013 |
20130109126 | BACK-CONTACT FOR THIN FILM SOLAR CELLS OPTIMIZED FOR LIGHT TRAPPING FOR ULTRATHIN ABSORBERS | 05-02-2013 |
20130109127 | METHOD FOR MAKING SOLAR CELL | 05-02-2013 |
20130109128 | MANUFACTURING METHOD FOR PHOTOVOLTAIC POWER DEVICE AND MANUFACTURING APPARATUS FOR PHOTOVOLTAIC POWER DEVICE | 05-02-2013 |
20130143349 | SOLAR CELL AND METHOD OF MANUFACTURING THE SAME - In one embodiment, a method of manufacturing a solar cell includes forming a first electrode over a substrate; forming a light-converting layer over the first electrode and patterning the light-converting layer to form a plurality of patterned light-converting layers that are spaced apart from each other; forming a transparent insulating layer over the first electrode including the patterned light-converting layers; and forming a second electrode over the transparent insulating layer. | 06-06-2013 |
20130149808 | METHOD OF FABRICATING A SOLAR CELL - A solar cell and a fabricating method thereof are provided. In the method of fabricating the solar cell, a p-type semiconductor substrate on whose light-receiving surface an anti-reflection coating is formed is loaded into a processing chamber. In this case, the p-type semiconductor substrate may be loaded on a substrate support of an apparatus of processing a plurality of substrates along the circumference of the substrate support, in the state where the back surface of the p-type semiconductor substrate faces upward. Then, a back surface field (BSF) layer having the characteristic of Negative Fixed Charge (NFC) is formed with AlO, AN or ALON on the back surface of the p-type semiconductor substrate. At this time, the BSF layer may be formed by simultaneously injecting an Al source gas, a first purge gas, an oxidizing agent gas and/or a ntiriding agent gas, and a second purge gas through injection holes of individual gas injection units while relatively rotating the substrate support with respect to the shower head. Thereafter, a back surface electrode is formed on the BSF layer such that the back surface electrode is electrically connected to the BSF layer. | 06-13-2013 |
20130164878 | HYBRID POLYSILICON HETEROJUNCTION BACK CONTACT CELL - A method for manufacturing high efficiency solar cells is disclosed. The method comprises providing a thin dielectric layer and a doped polysilicon layer on the back side of a silicon substrate. Subsequently, a high quality oxide layer and a wide band gap doped semiconductor layer can both be formed on the back and front sides of the silicon substrate. A metallization process to plate metal fingers onto the doped polysilicon layer through contact openings can then be performed. The plated metal fingers can form a first metal gridline. A second metal gridline can be formed by directly plating metal to an emitter region on the back side of the silicon substrate, eliminating the need for contact openings for the second metal gridline. Among the advantages, the method for manufacture provides decreased thermal processes, decreased etching steps, increased efficiency and a simplified procedure for the manufacture of high efficiency solar cells. | 06-27-2013 |
20130164879 | HYBRID POLYSILICON HETEROJUNCTION BACK CONTACT CELL - A method for manufacturing high efficiency solar cells is disclosed. The method comprises providing a thin dielectric layer and a doped polysilicon layer on the back side of a silicon substrate. Subsequently, a high quality oxide layer and a wide band gap doped semiconductor layer can both be formed on the back and front sides of the silicon substrate. A metallization process to plate metal fingers onto the doped polysilicon layer through contact openings can then be performed. The plated metal fingers can form a first metal gridline. A second metal gridline can be formed by directly plating metal to an emitter region on the back side of the silicon substrate, eliminating the need for contact openings for the second metal gridline. Among the advantages, the method for manufacture provides decreased thermal processes, decreased etching steps, increased efficiency and a simplified procedure for the manufacture of high efficiency solar cells. | 06-27-2013 |
20130171761 | SOLAR CELL SYSTEM MANUFACTURING METHOD - A solar cell system making method includes steps of making a round P-N junction by (a) stacking a P-type silicon layer and a N-type silicon layer on top of each other, and (b) forming a P-N junction near an interface between the P-type silicon layer and the N-type silicon layer; cutting the round P-N junction into a plurality of arc shaped solar cell preforms; forming an arc shaped surface by stacking the plurality of arc shaped solar cell preforms along a first direction and forming an electrode layer between each adjacent two of the plurality of arc shaped solar cell preforms; and forming a first collection electrode and a second collection electrode to form an arc shaped solar cell system having a photoreceptive surface being on the arc shaped surface and being configured to receive incident light beams. | 07-04-2013 |
20130183790 | ASYMMETRIC SURFACE TEXTURING FOR USE IN A PHOTOVOLTAIC CELL AND METHOD OF MAKING - A novel surface texturing provides improved light-trapping characteristics for photovoltaic cells. The surface is asymmetric and includes shallow slopes at between about 5 and about 30 degrees from horizontal as well as steeper slopes at about 70 degrees or more from horizontal. It is advantageously used as either the front or back surface of a thin semiconductor lamina, for example between about 1 and about 20 microns thick, which comprises at least the base or emitter of a photovoltaic cell. In embodiments of the present invention, the shallow slopes are formed using imprint photolithography. | 07-18-2013 |
20130183791 | SILICON SUBSTRATE HAVING TEXTURED SURFACE, SOLAR CELL HAVING SAME, AND METHOD FOR PRODUCING SAME - The purpose of the present invention is to obtain a finer texture for a silicon substrate having a textured surface and thereby obtain a thinner silicon substrate for a solar cell. The invention provides a silicon substrate that has a thickness of 50 [mu]m or less and substrate surface orientation ( | 07-18-2013 |
20130210187 | METHOD OF MANUFACTURING SOLAR CELL - A solar cell is manufactured, which includes: a solar cell substrate including a semiconductor substrate, a p-type surface and an n-type surface exposed on a first principal surface, and a texture structure in a second principal surface; a p-side electrode disposed on the p-type surface; an n-side electrode disposed on the n-type surface; and an insulation layer formed on the first principal surface and isolating the p-side electrode and the n-side electrode from each other. The manufacturing method of the solar cell includes: forming an insulation film covering the first principal surface; forming the texture structure in the second principal surface; and removing part of the insulation film, thereby forming the insulation layer. | 08-15-2013 |
20130217171 | METHOD FOR FABRICATING SEMICONDUCTOR LAYER HAVING TEXTURED SURFACE AND METHOD FOR FABRICATING SOLAR CELL - The disclosure provides a method for fabricating a semiconductor layer having a textured surface, including: (a) providing a textured substrate; (b) forming at least one semiconductor layer on the textured substrate; (c) forming a metal layer on the semiconductor layer; and (d) conducting a thermal process to the textured substrate, the semiconductor layer and the metal layer, wherein the semiconductor layer is separated from the textured substrate by the thermal process to obtain the semiconductor layer having the metal layer and a textured surface. | 08-22-2013 |
20130224898 | COMPOSITIONS AND METHODS FOR TEXTURING POLYCRYSTALLINE SILICON WAFERS - Compositions and methods for chemical texturing a surface of a polycrystalline silicon wafer to be used in the manufacture of solar cells provide increased efficiency in the manufacture and operation of solar cells. The compositions and methods disclosed herein include first and second components, wherein the first component is a UKON etch composition, including a hydrofluoric acid/nitric acid mixture and water, while the second component includes a silicon wafer texturing enhancer (SWTE). | 08-29-2013 |
20130237005 | METHOD FOR FABRICATING SEMICONDUCTOR LAYER HAVING TEXTURED SURFACE AND METHOD FOR FABRICATING SOLAR CELL - The disclosure provides a method for fabricating a semiconductor layer having a textured surface, including: (a) providing a textured substrate; (b) forming at least one semiconductor layer on the textured substrate; (c) forming a metal layer on the semiconductor layer; and (d) conducting a thermal process or a low temperature process to the textured substrate, the semiconductor layer and the metal layer, wherein the semiconductor layer is separated from the textured substrate by the thermal process to obtain the semiconductor layer having the metal layer and a textured surface. | 09-12-2013 |
20130244369 | CLEANING METHOD OF SILICON SUBSTRATE AND MANUFACTURING METHOD OF SOLAR BATTERY - A cleaning method of a silicon substrate includes a first step of etching a surface of a silicon substrate by a metal-ion-containing mixed aqueous solution of an oxidizing agent and hydrofluoric acid and of forming a porous layer on the surface of the silicon substrate, a second step of etching a pore of the porous layer by mixed acid mainly containing hydrofluoric acid and nitric acid and of forming texture on the surface of the silicon substrate, a third step of etching the surface of the silicon substrate on which the texture is formed with an alkaline chemical solution, and a fourth step of treating the silicon substrate etched by the alkaline chemical solution by ozone-containing water, of generating an air bubble within the pore formed in the silicon substrate, and of removing metal and organic impurities from within the pore. | 09-19-2013 |
20130252371 | METHOD FOR MANUFACTURING THIN FILM SOLAR CELL - A method for manufacturing a thin film solar cell includes depositing a front electrode on a substrate in a chamber, etching the front electrode formed on the substrate to form an uneven portion on the surface of the front electrode, forming a photoelectric conversion unit on the front electrode, and forming a back electrode on the photoelectric conversion unit. The depositing of the front electrode includes depositing the front electrode while reducing a process pressure of the chamber from a first pressure to a second pressure lower than the first pressure. The etching of the front electrode form the uneven portion of the front electrode so that a top portion of the uneven portion includes a portion formed at the second pressure. | 09-26-2013 |
20130260506 | METHOD FOR MAKING SOLAR CELLS - A method for making a solar cell includes the following steps. A silicon plate having a first surface and a second surface is provided. A patterned mask layer is formed on the second surface to expose a portion of the second surface. A number of three-dimensional nano-structures are formed by etching the exposed portion of the second surface and the mask layer is removed. A doped silicon layer is formed on surfaces of the three-dimensional nano-structures. An upper electrode is applied to contact with the doped silicon layer. A back electrode is placed on the first surface. | 10-03-2013 |
20130260507 | Method for Forming a Fibrous Layer - The present invention relates to a method for forming, on the surface of one of the sides of a silicon substrate, a fibrous layer having a mean lattice pitch of no more than 2 μm, without requiring soaking. | 10-03-2013 |
20130288421 | METHOD OF FABRICATING A DIFFERENTIAL DOPED SOLAR CELL - A method of fabricating a differential doped solar cell is provided. The method comprises the steps of (a) providing a light doped semiconductor substrate; (b) forming a heavy doped layer having the same type of dopant used in step (a) on a front surface of the semiconductor substrate; and (c) forming an emitter layer having a different type of dopant used in step (a) on a surface of the heavy doped layer to constitute a p-n junction with the heavy doped layer. | 10-31-2013 |
20130295712 | METHODS OF TEXTURING SURFACES FOR CONTROLLED REFLECTION - Novel methods for the texturing of photovoltaic cells is described, wherein texturing minimizes reflectance losses and hence increases solar cell efficiency. In one aspect, a microstamp with the mirror inverse of the optimum surface structure is described. The photovoltaic cell substrate to be etched and the microstamp are immersed in a bath and pressed together to yield the optimum surface structure. In another aspect, micro and nanoscale structures are introduced to the surface of a photovoltaic cell by wet etching and depositing nanoparticles or introducing metal induced pitting to a substrate surface. In still another aspect, remote plasma source (RPS) or reactive ion etching (RIE), is used to etch nanoscale features into a silicon-containing substrate. | 11-07-2013 |
20130295713 | Modification and Optimization of a Light Management Area - A method for manufacturing an optoelectronic device is provided. The method includes providing a substrate. Thereafter, the method includes providing a lacquer layer on the substrate. The method further includes providing light management texture in the lacquer layer. Providing light management texture in the lacquer layer includes providing a replication substrate having a negative texture and imprinting the negative texture into the lacquer layer using the replication substrate, such that the light management texture is created in the lacquer layer. Furthermore, the method includes providing a first electrode layer on the lacquer layer. The method further includes etching, prior to deposition of first electrode layer, to enable formation of less steep light management texture in the lacquer layer and subsequently less steep texture on first electrode layer by etching at least one of the textures in the production of the negative texture on the replication substrate, or the light management texture on the lacquer layer itself. | 11-07-2013 |
20130330871 | METHODS FOR TEXTURING A SEMICONDUCTOR MATERIAL - A method for modifying the texture of a semiconductor material is provided. The method includes performing a first texture step comprising reactive ion etching to a first surface of semiconductor material. After the first texture step, the first surface of the semiconductor material has a random texture comprising a plurality of peaks and a plurality of valleys, and wherein at least fifty percent of the first surface has a peak-to-valley height of less than one micron and an average peak-to-peak distance of less than one micron. Additional texture steps comprising wet etch or RIE etching may be optionally applied. | 12-12-2013 |
20130330872 | ION IMPLANTATION FABRICATION PROCESS FOR THIN-FILM CRYSTALLINE SILICON SOLAR CELLS - A front contact thin-film solar cell is formed on a thin-film silicon solar cell. Emitter regions, selective emitter regions, and a back surface field are formed through ion implantation processes. In one embodiment, front contact thin-film solar cell is formed on a thin-film silicon solar cell. Emitter regions, selective emitter regions, base regions, and a back surface field are formed through ion implantation processes. | 12-12-2013 |
20130344641 | MECHANICAL AND CHEMICAL TEXTURIZATION OF A SILICON SHEET FOR PHOTOVOLTAIC LIGHT TRAPPING - A process for modifying a surface of a cast polycrystalline silicon sheet to decrease the light reflectance of the cast polycrystalline sheet is disclosed. The cast polycrystalline silicon sheet has at least one structural feature resulting from the cast polycrystalline silicon sheet being directly cast to a thickness less than 1000 micrometers. The process comprises grit blasting the surface of the cast polycrystalline silicon sheet to give an abraded surface on the cast polycrystalline silicon sheet. The process further comprises chemically etching the abraded surface of the cast polycrystalline silicon sheet to give a chemically-etched, abraded surface. The light reflectance of the chemically-etched, abraded surface is decreased in comparison to the light reflectance of the surface of the cast polycrystalline silicon sheet before the step of grit blasting. | 12-26-2013 |
20130344642 | TEXTURED TRANSPARENT FILM HAVING PYRAMIDAL PATTERNS THAT CAN BE ASSOCIATED WITH PHOTOVOLTAIC CELLS - A transparent plate includes at least two parallel main borders and has, in relief on at least one of its main surfaces, repetitive pyramidal relief features, each including an apex, a base, and a set of edges that join the apex to the base, and at least one edge of the features being such that its projection in the general plane of the plate is substantially parallel to the two parallel main borders. The plate may be combined with photovoltaic cells so as to enhance the transmission of light to the cells. The plate can easily be produced by hot rolling. | 12-26-2013 |
20140004648 | TRANSPARENT CONDUCTIVE ELECTRODE FOR THREE DIMENSIONAL PHOTOVOLTAIC DEVICE | 01-02-2014 |
20140017846 | SYSTEMS AND METHODS FOR ENHANCED LIGHT TRAPPING IN SOLAR CELLS - Methods for improving the light trapping characteristics of crystalline silicon solar cells are provided. In one embodiment, the backside surface of a crystalline silicon solar cell substrate is textured with a pulsed laser beam. The textured backside surface of the crystalline silicon solar cell substrate is then annealed to remove damage from the laser texturization process. | 01-16-2014 |
20140017847 | METHOD FOR MANUFACTURING SOLAR CELL - Provided is a method of manufacturing a solar cell, wherein a solar cell is manufactured by combining a damage removal etching process, a texturing process and an edge isolation process. The method is advantageous in that RIE and DRE are conducted, and then DRE/PSG and/or an edge isolation removal process are simultaneously conducted, so that the movement of a substrate (that is, a wafer) is minimized, thereby reducing the damage rate of the substrate. | 01-16-2014 |
20140038338 | FRONT CONTACT SOLAR CELL WITH FORMED EMITTER - A bipolar solar cell includes a backside junction formed by an N-type silicon substrate and a P-type polysilicon emitter formed on the backside of the solar cell. An antireflection layer may be formed on a textured front surface of the silicon substrate. A negative polarity metal contact on the front side of the solar cell makes an electrical connection to the substrate, while a positive polarity metal contact on the backside of the solar cell makes an electrical connection to the polysilicon emitter. An external electrical circuit may be connected to the negative and positive metal contacts to be powered by the solar cell. The positive polarity metal contact may form an infrared reflecting layer with an underlying dielectric layer for increased solar radiation collection. | 02-06-2014 |
20140038339 | PROCESS OF MANUFACTURING CRYSTALLINE SILICON SOLAR CELL - A process of manufacturing a crystalline silicon solar cell includes forming a rough surface on a surface of the crystalline silicon wafer and an Al | 02-06-2014 |
20140057383 | METHOD OF PRODUCING WAFER FOR SOLAR CELL, METHOD OF PRODUCING SOLAR CELL, AND METHOD OF PRODUCING SOLAR CELL MODULE - Provided is a method of producing a wafer for a solar cell that can produce the solar cell with high conversion efficiency. | 02-27-2014 |
20140057384 | SOLAR CELL AND FABRICATING METHOD THEREOF - Discussed herein are a solar cell and a fabricating method thereof. The solar cell includes a first conductivity-type semiconductor substrate, a second conductivity-type semiconductor layer formed on a front surface of the first conductivity-type semiconductor substrate, and having a conductivity opposite to that of the first conductivity-type semiconductor substrate, an anti-reflection film including at least one opening exposing a part of a surface of the second conductivity-type semiconductor layer, and formed on the second conductivity-type semiconductor layer, at least one front electrode contacting a part of the surface of the second conductivity-type semiconductor layer exposed through the at least one opening, and at least one rear electrode formed on a rear surface of the first conductivity-type semiconductor substrate, wherein the at least one front electrode includes a metal containing silver and lead-free glass frit. | 02-27-2014 |
20140065757 | METHOD FOR MANUFACTURING SOLAR CELL - A method for manufacturing a solar cell includes performing a dry etching process to form a textured surface including a plurality of minute protrusions on a first surface of a semiconductor substrate, performing a first cleansing process for removing damaged portions of surfaces of the minute protrusions using a basic chemical and removing impurities adsorbed on the surfaces of the minute protrusions, performing a second cleansing process for removing impurities remaining or again adsorbed on the surfaces of the minute protrusions using an acid chemical after performing the first cleansing process, and forming an emitter region at the first surface of the semiconductor substrate. | 03-06-2014 |
20140073081 | Solar Cell Having Selective Emitter - The present invention provides a solar cell having a selective emitter structure on a doped silicon substrate. The silicon substrate is mono-crystalline or multi-crystalline. A plurality of trenches are formed at the illuminated side of the silicon substrate. After one-time diffusion doping, the silicon substrate is processed through selective etching. The region outside the trenches obtains a lower doping concentration, while the region of the trenches remains to be highly doped. Thus, a selective emitter structure is formed. | 03-13-2014 |
20140080246 | MANUFACTURING METHOD FOR SOLAR CELL - The present invention reduces the time required to manufacture a solar cell. After etching main surfaces ( | 03-20-2014 |
20140099747 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device includes a substrate and a first insulating layer. The first insulating layer includes a first lower layer and a first upper layer on the first lower layer. The first insulating layer has a first opening through the first lower layer and the first upper layer. A maximum width of the first opening at the first lower layer is different from a maximum width of the first opening at the first upper layer. | 04-10-2014 |
20140134778 | AQUEOUS ALKALINE COMPOSITIONS AND METHOD FOR TREATING THE SURFACE OF SILICON SUBSTRATES - An aqueous alkaline composition for treating the surface of silicon substrates, the said composition comprising: (A) a quaternary ammonium hydroxide; and (B) a component selected from the group consisting of water-soluble acids and their water-soluble salts of the general formulas (I) to (V): (R | 05-15-2014 |
20140141561 | METHODS OF PROVIDING LIQUID MATERIAL TO SELECTED REGIONS OF SEMICONDUCTOR MATERIAL WITH TEXTURED SURFACES - Semiconductor bodies, such as for solid state electronics and photovoltaic cells, have surfaces that are textured for processing, charge carrying and photovoltaic reasons. Absorbing regions may have grooves that reduce loss of solar energy by reflection. Semiconductor bodies also include metallizations for conducting electrical carriers, which may be channels. Production processes take advantage of the topography to govern which locations will receive a specific processing, and which locations will not. Liquids are treated directly into zones. They migrate throughout a zone and act upon the locations contacted. They do not migrate to other zones, due to impediments to flow, such as edges, walls and ridges. Liquid may also be deposited and migrate within a zone, to block or mask a subsequent activity, such as etching. | 05-22-2014 |
20140154832 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD - A dry etching apparatus includes a tray for conveying substrates. The tray has substrate housing holes as through holes each capable of housing the three substrates. The substrates are supported by a substrate support section protruding from a hole wall of each of the substrate housing holes. A stage is provided in a chamber in which plasma is generated. The stage includes substrate installation sections to be inserted from a lower surface side of the tray to the substrate housing holes so that lower surfaces of the plurality of the substrates transferred from the substrate support section are installed on substrate installation surfaces that are their upper end surfaces. High shape controllability and favorable productivity for the angular substrate can be implemented while preventing increased in size of the apparatus. | 06-05-2014 |
20140162395 | Method for Manufacturing Solar Cell - A method of manufacturing a solar cell is disclosed. The method includes forming a dielectric film on a semiconductor substrate doped with a first conductive type impurity, exposing a high concentration doping region of a predetermined selective emitter by partially removing the dielectric film, and ion-implanting a second conductive type impurity into a front surface of the semiconductor substrate with the dielectric film formed thereon to form a high concentration doping layer in the semiconductor substrate to correspond to the high concentration doping region and to form a low concentration doping layer in the semiconductor substrate to correspond to a region in which the dielectric film is formed. | 06-12-2014 |
20140206129 | METHOD OF MANUFACTURING SEE-THROUGH THIN FILM SOLAR CELLS - A method of manufacturing see-through thin film solar cells includes the steps of: placing a patterned photo mask above a first substrate which has a photoelectric conversion film formed on the surface thereof; and ablating the photoelectric conversion film via a laser beam passing through the patterned photo mask to form at least one hollow-out zone with different transmittance. By incorporating the laser beam with the photo mask in the manufacturing process, the problem of shortened laser lifespan caused by frequent switching of the laser for ablating patterns that occurs to the conventional technique can be resolved. Through controlling the thickness of the patterned photo mask, grey scale patterns can be displayed and resolution thereof can also be increased, thereby improve the added value of the thin film solar cells. | 07-24-2014 |
20140242744 | SUBSTRATE AND SUPERSTRATE DESIGN AND PROCESS FOR NANO-IMPRINTING LITHOGRAPHY OF LIGHT AND CARRIER COLLECTION MANAGEMENT DEVICES - A process for forming a nano-element structure is provided that includes contacting a template with a material to form the nano-element structure having an array of nano-elements and a base physically connecting the array of nano-elements. The material that is contacted with the template is the nano-element structure material or precursor material from which the array of nano-elements is formed. The nano-element structure is then removed from contact with the template. The nano-element structure material or its precursor is brought into contact with the template for the forming of the array of nano-elements by techniques such as nano-imprinting and printing. A final substrate subsequently supports the array of nano-elements so produced. The array of nano-elements is exposed free and at least one layer of a dopant layer, a spacer layer, a light absorber layer, a conductor, or a counter electrode layer, are employed to complete an operative device. | 08-28-2014 |
20140273330 | METHOD OF FORMING SINGLE SIDE TEXTURED SEMICONDUCTOR WORKPIECES - Methods of creating a workpiece having a smooth side and a textured side are disclosed. In some embodiments, a first side of a workpiece is doped, using ion implantation or diffusion, to create a doped layer. This doped layer of the first side may be more resistant to chemical treatment than the second side of the workpiece. This allows the second side of the workpiece to be textured without capping or otherwise protecting the doped first side, even though the doped layer of the first side physically contacts the chemical treatment. In some embodiments, a p-type dopant is used to create the doped layer. In some embodiments, the workpiece is processed to form a solar cell. | 09-18-2014 |
20140273331 | METHODS FOR WET CHEMISTRY POLISHING FOR IMPROVED LOW VISCOSITY PRINTING IN SOLAR CELL FABRICATION - A method of fabricating a solar cell is disclosed. The method includes forming a polished surface on a silicon substrate and forming a first flowable matrix in an interdigitated pattern on the polished surface, where the polished surface allows the first flowable matrix to form an interdigitated pattern comprising features of uniform thickness and width. In an embodiment, the method includes forming the silicon substrate using a method such as, but not limited to, of diamond wire or slurry wafering processes. In another embodiment, the method includes forming the polished surface on the silicon substrate using a chemical etchant such as, but not limited to, sulfuric acid (H | 09-18-2014 |
20140295612 | SOLAR CELL AND MANUFACTURING METHOD THEREOF - A solar cell and a manufacturing method thereof are provided. A laser doping process is adopted to form positive and negative doping regions for an accurate control of the doping regions. No metal contact coverage issue arises since a contact opening is formed by later firing process. The solar cell is provided with a comb-like first electrode, a sheet-like second electrode corresponding to the doping regions to obtain high photoelectric conversion efficiency by fully utilizing the space in the semiconductor substrate. Furthermore, the sheet-like second electrode can be formed by a material having high reflectivity to improve the light utilization rate of the solar cell. The manufacturing process of the solar cell is simplified and the processing yield is improved. | 10-02-2014 |
20140322858 | Solar Cells with Patterned Antireflective Surfaces - Systems and methods for producing nanoscale textured low reflectivity surfaces may be utilized to fabricate solar cells. A substrate may be patterned with a resist prior to an etching process that produces a nanoscale texture on the surface of the substrate. Additionally, the substrate may be subjected to a dopant diffusion process. Prior to dopant diffusion, the substrate may be optionally subjected to liquid phase deposition to deposit a material that allows for patterned doping. The order of the nanoscale texture etching and dopant diffusion may be modified as desired to produce post-nano emitters or pre-nano emitters. | 10-30-2014 |
20140335646 | Method for Forming Metal Silicide Layers - The present invention is related to a method for forming a metal silicide layer on a textured silicon substrate surface. The method includes providing a metal layer on a textured silicon substrate and performing a pulsed laser annealing step providing at least one UV laser pulse with a laser fluence in the range between | 11-13-2014 |
20140342492 | Methods For Dual-Scale Surface Texturing - Methods for preparing a substrate surface are provided, for purposes including manufacturing a low reflectivity surface. In some aspects, the methods include providing a material comprising an etching mask on a substrate, subjecting the material to a first isotropic etching phase, and subjecting the material to a first anisotropic etching phase, thereby forming a textured surface on the material, wherein the textured surface comprises structures with dimensions in a sub-micron range. | 11-20-2014 |
20140357012 | MANUFACTURING METHOD AND MANUFACTURING DEVICE FOR OPTICAL SUBSTRATE HAVING CONCAVO-CONVEX PATTERN USING FILM-SHAPED MOLD, AND MANUFACTURING METHOD FOR DEVICE PROVIDED WITH OPTICAL SUBSTRATE - A method for manufacturing an optical substrate includes: a step for preparing a long film-shaped mold; a step for preparing a sol; a step for forming a coating film of the sol on a substrate; a step for drying the coating film; a step for pressing a pattern surface of the film-shaped mold against the dried coating film with a pressing roll while feeding the film-shaped mold to the pressing roll; a step for releasing the film-shaped mold from the coating film; and a step for baking the coating film to which the concave and convex pattern has been transferred. | 12-04-2014 |
20140370643 | FORMULATION FOR ACIDIC WET CHEMICAL ETCHING OF SILICON WAFERS - Acid etch compositions for etching multicrystalline silicon substrates are disclosed which may include hydrofluoric acid, an oxidizer, an acid diluent, and soluble silicon. The soluble silicon may be hexafluorosilicic acid or ammonium fluorosilicate. Silicon substrates patterned with organic resist may be used with the acid etch compositions for selective silicon patterning for solar cell applications. | 12-18-2014 |
20140370644 | METHOD OF MANUFACTURING SOLAR CELL - A method of manufacturing a solar cell including a crystalline semiconductor substrate, includes: etching or washing at least part of a first principal surface of the substrate by treatment with an aqueous alkaline solution; and depositing a p-type semiconductor layer containing boron on at least part of a second principal surface of the substrate before the treatment with the aqueous alkaline solution. | 12-18-2014 |
20150037923 | METHODS TO SELECTIVELY TREAT PORTIONS OF A SURFACE USING A SELF-REGISTERING MASK - Processes increase light absorption into silicon wafers by selectively changing the reflective properties of the bottom portions of light trapping cavity features. Modification of light trapping features includes: deepening the bottom portion, increasing the curvature of the bottom portion, and roughening the bottom portion, all accomplished through etching. Modification may also be by the selective addition of material at the bottom of cavity features. Different types of features in the same wafers may be treated differently. Some may receive a treatment that improves light trapping while another is deliberately excluded from such treatment. Some may be deepened, some roughened, some both. No alignment is needed to achieve this selectively. The masking step achieves self-alignment to previously created light trapping features due to softening and deformation in place. | 02-05-2015 |
20150056742 | ANNEALING FOR DAMAGE FREE LASER PROCESSING FOR HIGH EFFICIENCY SOLAR CELLS - Annealing solutions providing damage-free laser patterning utilizing auxiliary heating to anneal laser damaged ablation regions are provided herein. Ablation spots on an underlying semiconductor substrate are annealed during or after pulsed laser ablation patterning of overlying transparent passivation layers. | 02-26-2015 |
20150056743 | MANUFACTURING METHOD OF SOLAR CELL - A manufacturing method of a solar cell includes a protection-film forming step of forming a protection film on one surface side of a semiconductor substrate, a first processing step of forming a plurality of first openings having a shape close to a desired opening shape and a size smaller than a target opening size in the protection film by a method having relatively high processing efficiency, a second processing step of forming second openings in the protection film by expanding the first openings up to the target opening size by a method having relatively high processing accuracy, and an etching step of forming an asperity structure having the a concave portion in an inverted pyramid shape on the one surface side of the semiconductor substrate by performing anisotropic wet etching on the semiconductor substrate in a region under the second openings via the second openings. | 02-26-2015 |
20150087105 | Methods and Apparatuses for Manufacturing Geometric Multicrystalline Cast Silicon and Geometric Multicrystalline Cast Silicon Bodies for Photovoltaics - Methods and apparatuses are provided for casting silicon for photovoltaic cells and other applications. With such methods and apparatuses, a cast body of geometrically ordered multi-crystalline silicon may be formed that is free or substantially free of radially-distributed impurities and defects and having at least two dimensions that are each at least about 10 cm is provided. | 03-26-2015 |
20150104897 | DEVICE FOR THE HOMOGENEOUS WET-CHEMICAL TREATMENT OF SUBSTRATES - A device for wet-chemical treatment of substrates includes: an accommodation device for a substrate and a process medium, the substrate having a treatment side in operative connection with the process medium; a fluid guidance element, having a specified surface texture, housed in the accommodation device, the specified surface texture being configured to provide a guidance of the process medium along the specified surface texture, the specified surface texture being positioned lying opposite and at a predetermined fixed recess at a distance from the treatment side of the substrate; and the process medium being moved in the intervening space between the specified surface texture of the fluid guidance element and the treatment side of the substrate. | 04-16-2015 |
20150118785 | METHOD FOR CONSISTENTLY TEXTURIZING SILICON WAFERS DURING SOLAR CELL WET CHEMICAL PROCESSING - A method for consistently texturizing silicon wafers dating solar cell wet chemical processing. In one aspect, the invention includes submerging a batch of silicon wafers within a process chamber having an alkaline solution mixture therein. The invention utilizes a feed and bleed technique to bleed chemicals from the process chamber and introduce fresh chemicals into the process chamber to maintain chemical concentrations within a desired range and to maintain etch by-products below a threshold. The alkaline solution etches the silicon wafers to texturize the surfaces of the silicon wafers to form a pattern of pyramids (i.e., texturization pattern) on the surface of the silicon wafers. The feed and bleed technique enables the texturization pattern on the surfaces of the processed wafers and the reflectance of the processed wafers to be consistent among different batches of silicon wafers that are submerged into the alkaline mixture in the process chamber. | 04-30-2015 |
20150118786 | METHOD OF PRODUCING SOLAR CELL - A method of producing a solar cell, including: a first coating step in which a pre-wet composition is spin-coated on a surface of a semiconductor substrate; a second coating step in which a diffusing material including a solvent and a diffusing agent containing a first impurity element is spin-coated on the surface where the pre-wet composition has been spin-coated, so as to form a coating film of the diffusing agent; and a first impurity diffusion layer forming step in which the semiconductor substrate having the coating film formed thereon is heated, so as to form a first impurity diffusion layer in which the impurity element contained in the diffusing agent is diffused. | 04-30-2015 |
20150125988 | SCRIBING APPARATUS FOR MANUFACTURING SOLAR CELLS - A scribing apparatus for manufacturing a solar cell, and a method of manufacturing a solar cell using the same are provided. The scribing apparatus includes a stage part configured to support a substrate having at least one thin film layer, a scribing unit configured to scribe on the at least one thin film layer, and a moving unit configured to move at least one of the stage part and the scribing unit during the scribing process. A method of manufacturing a solar cell using the scribing apparatus includes scribing a first pattern onto a reflective electrode layer using the scribing apparatus, the reflective electrode layer being on the substrate, the scribing apparatus further including a needle installation part having a first needle configured to scribe on one side of the reflective electrode layer, and a second needle configured to scribe on a side surface of the reflective electrode layer. | 05-07-2015 |
20150140721 | PATTERNING OF SILICON OXIDE LAYERS USING PULSED LASER ABLATION - Various laser processing schemes are disclosed for producing various types of hetero junction and homo-junction solar cells. The methods include base and emitter contact opening, selective doping, metal ablation, annealing to improve passivation, and selective emitter doping via laser heating of aluminum. Also, laser processing schemes are disclosed that are suitable for selective amorphous silicon ablation and selective doping for hetero junction solar cells. Laser ablation techniques are disclosed that leave the underlying silicon substantially undamaged. These laser processing techniques may be applied to semiconductor substrates, including crystalline silicon substrates, and further including crystalline silicon substrates which are manufactured either through wire saw wafering methods or via epitaxial deposition processes, or other cleavage techniques such as ion implantation and heating, that are either planar or textured/three-dimensional. These techniques are highly suited to thin crystalline semiconductor, including thin crystalline silicon films. | 05-21-2015 |
20150333194 | METHOD FOR MANUFACTURING NANO-STRUCTURAL FILM IN SOLAR CELL - A method for manufacturing a nanostructural film in a solar cell is revealed herein to include steps of forming an optical layer on a surface of a solar cell, heating a substrate of the solar cell at a temperature ranging from 100° C. to 200° C., imprinting a micro-pattern of a brightness enhanced film (BEF) on the optical layer in a vacuum environment, wherein the micro-pattern has a triangular pyramid shape and arranged periodically on the optical layer, finally removing the BEF after cooling so that the optical layer is formed into a nanostructured film corresponding to the micro-pattern of the BEF. | 11-19-2015 |
20150333195 | METHOD FOR MANUFACTURING SOLAR CELL WITH NANO-STRUCTURAL FILM - The invention relates to a method for manufacturing a solar cell with a nanostructural film, including steps of treating a glass substrate with UV ozone, uniformly coating a polystyrene nanospherical layer containing plural nanospheres on the surface of the glass substrate and curing the polystyrene nanospherical layer for adhesion onto the glass substrate, forming a first optical layer on the surface of the polystyrene nanospherical layer, curing and releasing the first optical layer from the polystyrene nanospherical layer to obtain a concave spherical nanostructured film, and finally affixing the concave spherical nanostructured film on the surface of a solar cell to manufacture a solar cell with nanostructure after curing by baking. | 11-19-2015 |
20150340540 | METHODS OF IMPRINT PATTERNING OF IRREGULAR SURFACE - Patterned substrates for photovoltaic and other uses are made by pressing a flexible stamp upon a thin layer of resist material, which covers a substrate, such as a wafer. The resist changes phase or becomes flowable, flowing away from locations of impression, revealing the substrate, which is subjected to some shaping process. A typical substrate is silicon, and a typical resist is a wax. Workpiece textures include extended grooves, discrete, spaced apart pits, and combinations and intermediates thereof. Platen or rotary patterning apparatus may be used. Rough and irregular workpiece substrates may be accommodated by extended stamp elements. Resist may be applied first to the workpiece, the stamp, or substantially simultaneously, in discrete locations, or over the entire surface of either. The resist dewets the substrate completely where desired. | 11-26-2015 |
20150357509 | SOLAR CELL AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a solar cell includes forming a first dielectric layer on a second surface opposite a first surface of a substrate; forming second dielectric layers respectively on an emitter region and the first dielectric layer; forming a third dielectric layer on the second dielectric layer that is positioned on the emitter region; forming a hydrogenated silicon oxide layer on the third dielectric layer; forming a first electrode on the emitter region and connected to the emitter region; and forming a second electrode on the second surface of the substrate and connected to the substrate, wherein the first surface of the substrate has first and second textured surfaces, and wherein the first textured surface includes a plurality of first protrusions and a plurality of first depressions and the second textured surface includes a plurality of second protrusions and a plurality of second depressions. | 12-10-2015 |
20160005914 | Method Of Forming An Interdigitated Back Contact Solar Cell - A method of forming an interdigitated back contact solar cell is described. The method uses a deposition process to create a doped glass layer on the substrate, which, when diffused, created either the emitter or back surface fields. The deposition process may also create an oxide layer on top of the doped glass layer. This oxide layer serves as a mask for a subsequent ion implant. This ion implant directs ions having the opposite conductivity of the doped glass layer into exposed regions of the substrate. A thermal process is used to diffuse the dopant from the doped glass layer into the substrate and repair any damage caused by the ion implant. | 01-07-2016 |
20160072003 | MANUFACTURING METHOD OF SOLAR CELL - A manufacturing method of a solar cell having diffusion layers of different conductivity types on a front surface of a semiconductor substrate and a back surface thereof, respectively, includes a step of forming a diffusion protection mask containing impurities to cover at least a partial region of the semiconductor substrate, and a diffusion step of performing a diffusion step including a thermal step in a state where at least the partial region of the semiconductor substrate is covered with the diffusion protection mask containing impurities, forming a first-impurity diffusion layer in a first region covered with the diffusion protection mask, and forming a second-impurity diffusion layer having a different impurity concentration or a different conductivity type from that of the diffusion protection mask in a second region exposed from the diffusion protection mask. | 03-10-2016 |
20160079453 | THIN REFRACTORY METAL LAYER USED AS CONTACT BARRIER TO IMPROVE THE PERFORMANCE OF THIN-FILM SOLAR CELLS - A thin film amorphous silicon solar cell may have front contact between a hydrogenated amorphous silicon layer and a transparent conductive oxide layer. The cell may include a layer of a refractory metal, chosen among the group composed of molybdenum, tungsten, tantalum and titanium, of thickness adapted to ensure a light transmittance of at least 80%, interposed therebetween, before growing by PECVD a hydrogenated amorphous silicon p-i-n light absorption layer over it. A refractory metal layer of just about 1 nm thickness may effectively shield the oxide from the reactive plasma, thereby preventing a diffused defect when forming the p.i.n. layer that would favor recombination of light-generated charge carriers. | 03-17-2016 |
20160087123 | SOLAR CELL AND METHOD FOR MANUFACTURING THE SAME - A solar cell and a method for manufacturing the same are discussed. The solar cell includes a semiconductor substrate, a first doped region of a first conductive type, a second doped region of a second conductive type opposite the first conductive type, a back passivation layer having contact holes exposing a portion of each of the first and second doped regions, a first electrode formed on the first doped region exposed through the contact holes, a second electrode formed on the second doped region exposed through the contact holes, an alignment mark formed at one surface of the semiconductor substrate, and a textured surface that is formed at a light receiving surface of the semiconductor substrate opposite the one surface of the semiconductor substrate in which the first and second doped regions are formed. | 03-24-2016 |
20160099360 | WAFER FOR SOLAR CELL, METHOD OF PRODUCING WAFER FOR SOLAR CELL, METHOD OF PRODUCING SOLAR CELL, AND METHOD OF PRODUCING SOLAR CELL MODULE - Provided is a wafer for solar cell which can be produced using a polycrystalline semiconductor wafer cut out using a bonded abrasive wire, which wafer can be used for manufacturing a solar cell with high conversion efficiency. | 04-07-2016 |
20160111565 | BACK CONTACT SOLAR CELL AND FABRICATION METHOD THEREOF - The present invention discloses a back contact solar cell. The back contact solar cell includes a semiconductor substrate having a front surface and a rear surface; a first conductive type semiconductor region having a first conductive type and a second conductive type semiconductor region having a second conductive type at an interval on the rear surface of the semiconductor substrate. Furthermore, the rear surface of the semiconductor substrate has a texturing structure at the interval between the first conductive type semiconductor region and the second conductive type semiconductor region. | 04-21-2016 |
20160111584 | METHODS OF GROWING HETEROEPITAXIAL SINGLE CRYSTAL OR LARGE GRAINED SEMICONDUCTOR FILMS AND DEVICES THEREON - A method is disclosed for making semiconductor films from a eutectic alloy comprising a metal and a semiconductor. Through heterogeneous nucleation said film is deposited at a deposition temperature on flexible substrates, such as glass. Specifically said film is vapor deposited at a fixed temperature in said deposition temperature where said deposition temperature is above a eutectic temperature of said eutectic alloy and below a temperature at which the substrate softens. Such films are nearly to entirely free of metal impurities and have widespread application in the manufacture and benefit of photovoltaic and display technologies. | 04-21-2016 |
20160111589 | LOW-COST SOLAR CELL METALLIZATION OVER TCO AND METHODS OF THEIR FABRICATION - Methods for fabricating busbar and finger metallization over TCO are disclosed. Rather than using expensive and relatively resistive silver paste, a high conductivity and relatively low cost copper is used. Methods for enabling the use of copper as busbar and fingers over a TCO are disclosed, providing good adhesion while preventing migration of the copper into the TCO. Also, provisions are made for easy soldering contacts to the copper busbars. | 04-21-2016 |
20160118265 | Spectrally and Temporally Engineered Processing using Photoelectrochemistry - Methods and apparatus for subtractively fabricating three-dimensional structures relative to a surface of a substrate and for additively depositing metal and dopant atoms onto the surface and for diffusing them into the bulk. A chemical solution is applied to the surface of the semiconductor substrate, and a spatial pattern of electron-hole pairs is generated by projecting a spatial pattern of illumination characterized by a specified intensity, wavelength and duration at each pixel of a plurality of pixels on the surface. An electrical potential is applied across the interface of the semiconductor and the solution with a specified temporal profile relative to the temporal profile of the spatial pattern of illumination. Such methods are applied to the fabrication of a photodetector integral with a parabolic reflector, cell size sorting chips, a three-dimensional photonic bandgap chip, a photonic integrated circuit, and an integrated photonic microfluidic circuit. | 04-28-2016 |
20160118512 | METHOD FOR MANUFACTURING SOLAR-POWER-GENERATOR SUBSTRATE AND APPARATUS FOR MANUFACTURING SOLAR-POWER-GENERATOR SUBSTRATE - A method for manufacturing a solar-power-generator substrate by cutting out a semiconductor substrate by slicing a semiconductor ingot and then by forming a texture structure on a surface of the semiconductor substrate by performing a surface treatment on the surface of the semiconductor substrate, includes: cleaning including cleaning and removing an organic impurity and a metal impurity adhering to the surface of the semiconductor substrate with a cleaning fluid containing an oxidizing chemical; and etching including removing a damaged layer on a substrate surface generated by the slicing and forming the texture structure on the surface of the semiconductor substrate by performing anisotropic etching on the surface of the semiconductor substrate with an alkaline aqueous solution, the etching being performed subsequent to the cleaning. | 04-28-2016 |
20160172529 | Method for producing a solar cell, in particular a silicon thin-film solar cell | 06-16-2016 |
20160204286 | THREE-DIMENSIONAL CONDUCTIVE ELECTRODE FOR SOLAR CELL | 07-14-2016 |
20160380131 | SHIELDED ELECTRICAL CONTACT AND DOPING THROUGH A PASSIVATING DIELECTRIC LAYER IN A HIGH-EFFICIENCY CRYSTALLINE SOLAR CELL, INCLUDING STRUCTURE AND METHODS OF MANUFACTURE - Solar cell structures and formation methods which utilize the surface texture in conjunction with a passivating dielectric layer to provide a practical and controllable technique of forming an electrical contact between a conducting layer and underlying substrate through the passivating dielectric layer, achieving both good surface passivation and electrical contact with low recombination losses, as required for high efficiency solar cells. The passivating dielectric layer is intentionally modified to allow direct contact, or tunnel barrier contact, with the substrate. Additional P-N junctions, and dopant gradients, are disclosed to further limit losses and increase efficiency. | 12-29-2016 |
20160380144 | COPPER OXIDE/SILICON THIN-FILM TANDEM SOLAR CELL - A method of making a copper oxide/inorganic thin film tandem semiconductor device including the steps of: depositing a textured buffer layer on an amorphous substrate, depositing a copper-inorganic film from a solid phase eutectic alloy on said buffer layer, and introducing O | 12-29-2016 |