Class / Patent application number | Description | Number of patent applications / Date published |
428634000 | Free carbon containing component | 16 |
20080233425 | Substrate Coated With a Layered Structure Comprising a Tetrahedral Carbon Coating - The invention relates to a metal substrate ( | 09-25-2008 |
20080286602 | HEAT CONDUCTOR - A heat conductor that improves heat conductivity is provided. The heat conductor has a first heat conductive region and a second heat conductive region. The first heat conductive region is configured by lamination of a first metal member and a graphite member. The second heat conductive region is configured by lamination of the first metal member and a second metal member. | 11-20-2008 |
20090197113 | Interconnect structure and method of fabricating the same - A method of fabricating an interconnect structure is described. A substrate is provided. A patterned interfacial metallic layer is formed on the substrate. An amorphous carbon insulating layer or a carbon-based insulating layer is formed covering the substrate and the interfacial metallic layer. A conductive carbon line or plug is formed in the amorphous carbon or carbon-based insulating layer electrically connected with the interfacial metallic layer. An interconnect structure is also described, including a substrate, a patterned interfacial metallic layer on the substrate, an amorphous carbon insulating layer or a carbon-based insulating layer on the substrate, and a conductive carbon line or plug disposed in the amorphous carbon or carbon-based insulating layer and electrically connected with the interfacial metallic layer. | 08-06-2009 |
20090286104 | MULTI-LAYERED NICKEL-PHOSPHOROUS COATINGS AND PROCESSES FOR FORMING THE SAME - Multiple layers of nickel phosphorous coatings are formed by electroless plating onto a base metal substrate such as a turbine component. In one embodiment, a first nickel layer metallurgical bonded by a heat treatment process to a surface of the base metal substrate, the first nickel layer containing about 4 to about 6 weight percent phosphorous with the balance being essentially nickel; and a second nickel layer deposited onto the first layer, the second nickel layer containing about 8 to about 12 weight percent phosphorous with the balance being essentially nickel, wherein the first and second layers are formed by electroless plating. In this manner, adhesion is maximized without degrading the properties of the second layer such as corrosion resistance and ductility. Also disclosed are processes for forming the multilayered nickel phosphorus coatings. | 11-19-2009 |
20110014493 | Composite-plated article and method for producing same - A composite-plated article in which carbon nanofibers are used, and an adequate degree of strength is obtained thereby. Carbon nanofibers having microparticles bonded thereto are used. On reacting with carbon and forming a compound, the microparticles will be securely bonded to the carbon nanofibers, and a high-strength composite-plated article is obtained. | 01-20-2011 |
20110123823 | METHOD OF JOINING GRAPHITE FIBERS TO A SUBSTRATE - Disclosed is a method of assembling a metallic-graphite structure ( | 05-26-2011 |
20110165435 | SANITARY OBJECT - A method for manufacturing composite bodies is provided by applying a firmly adhering layer to substrates composed of plastic or metal, particularly stainless steel, brass, aluminum, or zinc, it is provided that a layer composed of carbon is deposited on the substrate by means of chemical vapor deposition and a hard material layer is deposited on the carbon layer by means of physical vapor deposition. | 07-07-2011 |
20110189503 | SURFACE-TREATED COPPER FOIL - Object is to provide a surface-treated copper foil free from chromium in the surface-treatment layer and excellent in peel strength of a circuit and chemical resistance against to degradation of the peel strength after processing into a printed wiring board. To achieve the object, the surface-treated copper foil having a surface-treatment layer on a bonding surface of a copper foil for manufacturing a copper-clad laminate by laminating it to an insulating resin substrate has the surface-treatment layer formed by depositing a metal component having high melting point not lower than 1400° C. by dry process film formation method to the bonding surface of the copper foil after the cleaning treatment and further depositing a carbon component to the surface. | 08-04-2011 |
20120077058 | CORROSION AND WEAR-RESISTANT CLADDINGS - The present invention discloses corrosion and wear-resistant claddings comprising hard particles and an alloying addition dispersed in a nickel-based alloy matrix. The alloying addition comprises at least one of molybdenum or copper. The cladding does not include cobalt-bonded tungsten carbide particles. | 03-29-2012 |
20120237791 | HEAT CONDUCTIVE COMPOSITE SUBSTRATE HAVING HEAT DISSIPATION PROPERTIES AND MANUFACTURING METHOD THEREOF - The present invention discloses a heat conductive composite substrate having heat dissipation properties and a manufacturing method thereof. The heat conductive composite substrate comprises a heat dissipation substrate and a metal diamond composite layer physically disposed on the heat dissipation substrate for passing heat energy to the heat dissipation substrate. The metal diamond composite layer is a growth substance including at least one kind metal, and the growth substance is distributed with plural diamond particles therein. | 09-20-2012 |
20120270064 | SLIDE MEMBER INCLUDING DIAMOND-LIKE-CARBON FILM - The object of the present invention is to provide a slide member excellent in wear resistance and highly reliable over a long period by improving the adhesion property (anti-flaking property) of a diamond-like-carbon coating in the slide member including the diamond-like-carbon coating. The sliding member includes a substrate; and a diamond-like-carbon film including layers serially stacked in order of a first layer, a second layer and a hard carbon layer, in which the substrate is formed of an alloy steel containing at least one element selected from the group consisting of V, Cr, Nb, Mo, Ta and W, in which the first layer contains at least one element selected from the group consisting of V, Cr, Nb, Mo, Ta and W, and in which the first layer adheres to the substrate. | 10-25-2012 |
20130143067 | ANTI-OXIDATION COATING USING GRAPHENE - A metal plate or wire coated with a graphene layer and a method for manufacturing the graphene coated metal plate or wire are provided. The graphene coated metal plate or wire can include a nickel layer or a copper layer coated on an outer surface of the metal plate or wire, and a graphene layer coated on an outer surface of the nickel layer or the copper layer. The graphene coated metal plate or wire can be manufactured by using a chemical vapor deposition equipment or spraying a reduced graphene oxide (RGO) solution or a graphene oxide (GO) solution on the surface. | 06-06-2013 |
20130164557 | COATED BODY AND A PROCESS FOR COATING A BODY - The invention relates to a body with a substrate ( | 06-27-2013 |
20150337437 | METHOD FOR PRODUCING A TRIBOLOGICALLY DISTRESSED LAMINATE, A LAMINATE AND USE OF AN ORGANOMETALLIC COMPOUND FOR PRODUCING A FUNCTIONAL LAYER OF THE LAMINATE - A method for producing a laminate that has to undergo frictional loads, including a substrate and a functional layer formed from tungsten-containing, amorphous diamond-like carbon. To be able to produce such functional layers easily, they are applied by means of a tungsten-containing precursor and by using a PACVD process. A laminate including a functional layer produced by means of a precursor and to the use of a metallo-organic compound as a precursor for producing a functional layer. | 11-26-2015 |
20160144460 | Materials and Methods for Soldering, and Soldered Products - A tin-based alloy consists essentially of: (i) matrix components comprising two or more of Ag, Cu, Sb, Bi, Pb, In, Zn, Cd, Ga, Au, Ge, Si, P, Al, each matrix component being present in an amount 0.01-6.0 wt %; (ii) a transition metal active component comprising one or more of Cr, Ni, Ti, Co, Fe, Mn, Nb, Mo, Hf, Ta, W, the total amount of all said transition metal active components being more than 1.0 wt % and not more than 10 wt %; (iii) C present in an amount 0.01-1.0 wt %, and (iv) balance Sn and incidental impurities. Preferred compositions include Sn—(Ag, Cu, Sb, Bi, Pb)—(Cr, Ni)—C. The alloy is of use for soldering carbon-based materials such as carbon nanotubes. | 05-26-2016 |
20160185605 | COPPER SUBSTRATE FOR DEPOSITION OF GRAPHENE - Technologies are presented for growing graphene by chemical vapor deposition (CVD) on a high purity copper surface. The surface may be prepared by deposition of a high purity copper layer on a lower purity copper substrate using deposition processes such as sputtering, evaporation, electroplating, or CVD. The deposition of the high purity copper layer may be followed by a thermal treatment to facilitate grain growth. Use of the high purity copper layer in combination with the lower purity copper substrate may provide thermal expansion matching, compatibility with copper etch removal, or reduction of contamination, producing fewer graphene defects compared to direct deposition on a lower purity substrate at substantially less expense than deposition approaches using a high purity copper foil substrate. | 06-30-2016 |