Entries |
Document | Title | Date |
20090011143 | PATTERN FORMING APPARATUS AND PATTERN FORMING METHOD - A pattern forming apparatus includes a liquid material application mechanism that includes an opening for applying a liquid material on a substrate, and a laser processing mechanism that includes an irradiation section for irradiating the liquid material applied on the substrate with laser light to immobilize the liquid material so that a pattern is formed. The laser processing mechanism is integrated with the liquid material application mechanism. | 01-08-2009 |
20090011144 | Method of Forming Layers of Getter Material on Glass Parts - A method of forming a layer ( | 01-08-2009 |
20090081381 | METHOD OF ENABLING SELECTIVE AREA PLATING ON A SUBSTRATE - A method of enabling selective area plating on a substrate includes forming a first electrically conductive layer ( | 03-26-2009 |
20090087581 | MANUFACTURING DIFFRACTIVE OPTICAL ELEMENTS - A method and related apparatus for registering diffractive optical structures, in which: (a) a transparent substrate is positioned next to a starting material inside a chamber, (b) the starting material is vapourised or sublimated, (c) the vapour phase is deposited on the substrate, and (d) the area of the substrate on which the vapour phase was deposited is irradiated concurrently with a random distribution of the light intensity. The deposit has a diffractive optical functionality owing to the local changes produced in its structure, which are controlled by the distribution of the light intensity used in the production process. | 04-02-2009 |
20090123661 | System and method for forming high resolution electronic circuits on a substrate - A system and method for forming high resolution electronic circuits on a substrate is provided. The system ( | 05-14-2009 |
20090220705 | METHOD FOR MANUFACTURING ORGANIC EL DISPLAY DEVICE - A method for manufacturing an organic EL display device is provided, which includes forming a first emission layer via a hole injection transport layer over a substrate having first, second and third anode electrodes formed thereon, irradiating the second and third anode electrodes with light, to remove the first emission layer selectively to expose the hole injection transport layer on the second and third anode electrodes, forming a second emission layer, on the first emission layer and on the exposed hole injection transport layer, irradiating the third anode electrode with light to remove the second emission layer selectively, to expose the hole injection transport layer on the third anode electrode, forming a third emission layer, on the second emission layer and on the exposed hole injection transport layer, and forming a cathode electrode over the first, second and third anode electrodes via at least one of the emission layers. | 09-03-2009 |
20090258161 | Circuitized substrate with P-aramid dielectric layers and method of making same - A circuitized substrate including a dielectric layer having a p-aramid paper impregnated with a halogen-free, low moisture absorptivity resin and not including continuous or semi-continuous fiberglass fibers as part thereof, and a first circuitized layer positioned on the dielectric layer. A method of making this substrate is also provided. | 10-15-2009 |
20090269510 | PRINTED ELECTRONICS BY METAL PLATING THROUGH UV LIGHT - Methods and systems for applying printed electronics to various substrates are provided. In specific embodiments methods and systems for providing a highly reflective silver coating to a substrate are provided. Such methods include use of a photocatalytic material to initiate the reduction of a silver complex applied to the substrate to provide the highly reflective silver coating. The silver coating may conduct electricity. | 10-29-2009 |
20090291231 | METHOD AND APPARATUS FOR PRODUCING A SOLAR CELL MODULE WITH INTEGRATED LASER PATTERNING - The present invention refers to a method as well as an apparatus for producing a solar cell module having an array of photovoltaic cells on a common substrate, the apparatus comprising at least one treating chamber for depositing a layer on a substrate and at least one laser for patterning the deposited layer, wherein a treating chamber for laser patterning comprising means for setting up technical vacuum conditions is provided for. | 11-26-2009 |
20100009094 | METHOD FOR THE PRODUCING STRUCTURED ELECTRICALLY CONDUCTIVE SURFACES - Method for producing structured electrically conductive surfaces on a substrate, which comprises the following steps:
| 01-14-2010 |
20100015354 | Method of making rollers with a fine pattern - A method of making rollers with a fine pattern has the acts of casting a ceramic layer onto a roller surface, grinding and polishing the roller surface, forming a pattern on the roller surface with laser, and cleaning the roller surface. Therefore, the roller thus made has a pattern with higher precision than the conventional method of mold casting. Since the roller surface has a ceramic layer that has better resistance to erosion than steel, the roller has a longer lifetime. | 01-21-2010 |
20100062180 | Method of repairing a coating on an article - A method of locally repairing a coating ( | 03-11-2010 |
20100129566 | PREPARATION METHOD OF ELECTROCONDUCTIVE COPPER PATTERNING LAYER BY LASER IRRADIATION - A preparation method of an electroconductive copper patterning layer includes (Step 1) preparing a dispersion solution of copper-based particles selected from the group consisting of copper particles, copper oxide particles, and their mixtures; (Step 2) forming a copper-based particle patterning layer by printing or filling the dispersion solution of copper-based particles to a substrate into a predetermined shape; and (Step 3) irradiating laser to the copper-based particle patterning layer to burn and interconnect the copper-based particles contained in the copper-based particle patterning layer. This preparation method burns a copper-based particle patterning layer with a strong energy within a short time by using laser. Thus, it is possible to obtain a copper patterning layer that is hardly oxidized even in the atmosphere, so a copper patterning layer with excellent electric conductivity is formed. | 05-27-2010 |
20100136258 | METHOD FOR IMPROVED CERAMIC COATING - A method of manufacturing an article having a ceramic topcoat includes the steps of forming the ceramic topcoat on the article, heating the ceramic topcoat, and establishing a desired thermal gradient through the ceramic topcoat to induce segmentation cracking in the ceramic topcoat. | 06-03-2010 |
20100183822 | SURFACE MARKED ARTICLES, RELATED METHODS AND SYSTEMS - A method of surface marking an article, especially a building product, is provided. One described method includes the steps of laser marking a first graphic design element on a surface of an article and ink-jet printing a second graphic design element in registry with the first graphic design element on the surface of the article to create a high quality overall graphic design. Also provided are articles made according to this method, and systems for carrying out the method. | 07-22-2010 |
20100227080 | Method of Defining Electrodes Using Laser-Ablation and Dielectric Material - A method of forming an electrochemical test sensor includes providing a base. Electrochemically-active material is placed on the base. Dielectric material is applied over the electrochemically-active material. A first selected area of the dielectric material is laser-ablated to expose the electrochemically-active material. A second selected area of the dielectric material and the electrochemically-active material are laser-ablated to expose the base. The first selected area is different from the second selected area. A second layer is applied to assist in forming a channel in the test sensor. The channel assists in allowing a fluid sample to contact a reagent located therein. The dielectric material is located between the base and the second layer. | 09-09-2010 |
20100323122 | Method for making fine patterns using mask template - Provided is a method for forming a micropattern using a mask template. The method includes: forming a mask template on a substrate, wherein the mask template has an exposure section through which a portion of the substrate is exposed to the exterior and a non-exposure section provided by a polymer material applied on the remaining portion of the substrate; supplying conductive ink to the top of the mask template to deposit the conductive ink on the non-exposure section and on the substrate exposed through the exposure section; and heat treating the conductive ink in order to extract the conductive ink nanoclusters dissolved or dispersed in the conductive ink, wherein the conductive ink nanoclusters disposed on the non-exposure section are bound to the non-exposure section to form an insulating pattern having electrical insulating property, while the conductive ink nanoclusters disposed on the substrate form a conductive pattern having electroconductive property. The method enables formation of a micropattern without any alignment error between patterns in the case of a direct printing process. | 12-23-2010 |
20110003086 | Method for Fabricating Blackened Conductive Patterns - The present invention relates to a method for fabricating blackened conductive patterns, which includes (i) forming a resist layer on a non-conductive substrate; (ii) forming fine pattern grooves in the resist layer using a laser beam; (iii) forming a mixture layer containing a conductive material and a blackening material in the fine pattern grooves; and (iv) removing the resist layer remained on the non-conductive substrate. | 01-06-2011 |
20110020564 | PROCESSING METHOD FOR CLEANING SULFUR ENTITIES OF CONTACT REGIONS - A method for forming a thin film photovoltaic device. The method includes providing a transparent substrate comprising a surface region and forming a first electrode layer overlying the surface region of the transparent substrate. The first electrode layer has an electrode surface region. In a specific embodiment, the method includes masking one or more portions of the electrode surface region using a masking layer to form an exposed region and a blocked region. The method includes forming an absorber layer comprising a sulfur entity overlying the exposed region and removing the mask layer. In a specific embodiment, the method causing formation of a plurality of metal disulfide species overlying the blocked region. In a specific embodiment, the metal disulfide species has a semiconductor characteristic. The method includes subjecting the plurality of metal disulfide species to electromagnetic radiation from a laser beam to substantially remove the metal disulfide species. The method includes exposing the blocked region free and clear from the metal disulfide | 01-27-2011 |
20110027499 | RADIATION-ASSISTED NANOPARTICLE PRINTING - A method of nanoparticle printing including: contacting a printing plate with a target substrate, while the printing plate is contacting the target substrate, illuminating nanoparticies on the printing plate with intense flashes of LASER light, or subjecting the nanoparticles to microwave radiation, such that energy is selectively transferred into the particles, increasing a local temperature of the particles which causes an increased interaction of the particles with the target substrate and produces a strong junction and removes the particles from the printing plate; and peeling off the printing plate from the target substrate. | 02-03-2011 |
20110097514 | Method for Fabricating Fine Conductive Patterns Using Surface Modified Mask Template - Disclosed is a method for fabricating fine conductive patterns using a surface modified mask template, the method including: depositing a high molecular substance on a substrate; applying a hydrophobic material onto the high molecular substance so that the hydrophobic material can infiltrate into the high molecular substance; forming a mask template by removing a part of the high molecular substance to form a recess where a region of the substrate is exposed to an outside; depositing conductive ink on the mask template; and performing annealing to abstract metal particles from a metallic compound dissolved in the conductive ink so that an insulating pattern can be formed in a region on which the high molecular substance is deposited, but a conductive pattern can be formed as the metal particles are abstracted from the conductive ink in the recess and cohere with each other. | 04-28-2011 |
20110111134 | Systems and Methods of Preparation of Photovoltaic Films and Devices - Described herein are systems and methods for deposition of films using energy dispensers combined with film-material dispensers. The processes achieve high energy efficiency and speed by deposition of film materials that absorb energy in a designed radiation band, coupled with delivery of energy using a radiation source with a band matched to the absorbance band of the film deposition material. It is possible to use the energy for drying, fusion, chemical conversion, sintering of the deposited materials to produce films for visual, graphic or electronic applications. The process does not cause significant heating of substrates. The energy can be delivered to specified material deposition locations, thus using substantially less energy than bulk heating. | 05-12-2011 |
20110123725 | METHOD OF ENABLING SELECTIVE AREA PLATING ON A SUBSTRATE - A method of enabling selective area plating on a substrate includes forming a first electrically conductive layer ( | 05-26-2011 |
20110129615 | Apparatuses and Methods for Maskless Mesoscale Material Deposition - Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100° C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible. | 06-02-2011 |
20110159207 | METHOD FOR PRODUCING BUILD-UP SUBSTRATE - A method for producing a build-up substrate containing two layers of wiring patterns that are separated from each other with an insulating film intervening therebetween and are electrically connected to each other at a contact part penetrating through the insulating film, includes: ejecting a liquid repelling agent having repellency to an ink for forming the insulating film from a liquid droplet ejecting head onto one of the wiring patterns, thereby forming a liquid repelling part; then ejecting the ink for forming the insulating film from a liquid droplet ejecting head onto portions on the wiring pattern except for the liquid repelling part provided, thereby forming the insulating film; then removing the liquid repelling part; and then forming the contact part and the other of the wiring patterns by electroless plating. | 06-30-2011 |
20110165344 | SURFACE ANTENNA FORMATION METHOD - A surface antenna formation method to form an antenna on the surface of an antenna carrier economically by means of spraying a conducting paint into a patterned opening of a shield being covered on the antenna carrier and then employing a laser etching technique to remove burrs from the border of the antenna thus formed on the surface of the antenna carrier after removal of the shield. | 07-07-2011 |
20110183082 | Method for Improving Plating on Non-Conductive Substrates - A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated. | 07-28-2011 |
20110236597 | METHOD FOR PATTERNING SUBSTRATE AND METHOD FOR FABRICATING CAPACITIVE TOUCH PANEL - A method for patterning a substrate is presented, which includes the following steps. A conductive material is jet-printed onto a part of at least one side of the substrate. A surface of the at least one side of the substrate is imprinted with a laser to pattern a first conductive pattern. By using the method, the process can be simplified and substrates of a touch panel can be integrated, so as to achieve an objective of decreasing the overall thickness of an electronic device. | 09-29-2011 |
20110300307 | METHOD FOR MANUFACTURING WIRING BOARD - A method for manufacturing a wiring board includes forming a conductive pattern on an insulation layer, forming on the conductive pattern a resin insulation layer containing a resin and a silica-type filler, and irradiating a laser beam having an absorption rate with respect to the conductive pattern is in an approximate range of 30˜60% such that an opening portion reaching the conductive pattern is formed through the resin insulation layer. The silica-type filler in the resin insulation layer is in an amount of approximately 2˜60 wt. %. | 12-08-2011 |
20120015112 | METHOD OF FABRICATING PATTERN - Disclosed is a method of fabricating a pattern, and more particularly is a method of fabricating a pattern by using laser. The method includes:
| 01-19-2012 |
20120100304 | MICROMETRIC DIRECT-WRITE METHODS FOR PATTERNING CONDUCTIVE MATERIAL AND APPLICATIONS TO FLAT PANEL DISPLAY REPAIR - A method for direct-write patterning comprises providing a cantilever having a cantilever end, wherein the cantilever is a tipless cantilever; providing an ink disposed at the cantilever end; providing a substrate surface; and moving the cantilever end or moving the substrate surface so that ink is delivered from the cantilever end to the substrate surface. A method for direct writing of conductive metal or metal precursor comprises providing a tipless cantilever having a cantilever end; providing an ink disposed at the cantilever end, wherein the ink comprises one or more metals, one or more metallic nanoparticles, or one or more metal salts; providing a substrate surface; and contacting the cantilever end and the substrate surface so that ink is delivered from the cantilever end to the substrate surface. | 04-26-2012 |
20120100305 | METHOD OF FABRICATING A PART DECORATED WITH RELIEF - A method for fabricating a part with relief, wherein portions in relief are at least partially coated with a decorative layer. The method a) forms the body of the part; b) selectively alters the surface state of the body of the part to change the adherence thereof locally relative to the decorative layer; c) directly deposits the decorative layer over the entire body; d) removes the portions of the deposited layer which have not adhered to the body of the part. The method can be utilized in decorating timepieces. | 04-26-2012 |
20120135162 | MOLDED RESIN PRODUCT AND PROCESS FOR SURFACE TREATMENT THEREOF - A molded resin product includes a substrate made of a transparent resin, opaque coating film disposed on rear surface of the substrate except for an area set aside for a patterned portion, a transparent resin material disposed in the area set aside for the patterned portion on the rear surface of the substrate, and an opaque reflection coating or a half-reflective coating laminated to the transparent resin material. Under this configuration, the patterned portion looks as if it pops up from the rear surface of the substrate. If a half-reflective coating is used, the pattern is visible through the half-reflective coating when the pattern is viewed from the rear surface of the lid of a molded resin product. | 05-31-2012 |
20120164348 | METHOD FOR THE STRUCTURED COATING OF SUBSTRATES - The invention relates to a method for the structured coating of substrates from liquid phase and also to a device for the structured coating. Furthermore, the invention includes the use of the method. | 06-28-2012 |
20120164349 | SYSTEM AND METHOD FOR DEPOSITING MATERIAL IN A SUBSTRATE - One embodiment of the present invention is a unique method for depositing materials in a substrate. Another embodiment is a unique system for depositing materials in a substrate. Other embodiments include apparatuses, systems, devices, hardware, methods, and combinations for depositing materials within a substrate. Further embodiments, forms, features, aspects, benefits, and advantages of the present application will become apparent from the description and figures provided herewith. | 06-28-2012 |
20120171389 | METHODS FOR DEPOSITING MATERIAL ONTO MICROFEATURE WORKPIECES IN REACTION CHAMBERS AND SYSTEMS FOR DEPOSITING MATERIALS ONTO MICROFEATURE WORKPIECES - Methods for depositing material onto microfeature workpieces in reaction chambers and systems for depositing materials onto microfeature workpieces are disclosed herein. In one embodiment, a method includes depositing molecules of a gas onto a microfeature workpiece in the reaction chamber and selectively irradiating a first portion of the molecules on the microfeature workpiece in the reaction chamber with a selected radiation without irradiating a second portion of the molecules on the workpiece with the selected radiation. The first portion of the molecules can be irradiated to activate the portion of the molecules or desorb the portion of the molecules from the workpiece. The first portion of the molecules can be selectively irradiated by impinging the first portion of the molecules with a laser beam or other energy source. | 07-05-2012 |
20120213943 | POLYMER LASER MARKING - An aqueous marking composition is described which upon application to a polymeric surface and laser irradiation, produces one or more marks or other indicia having high contrast in the polymeric surface. | 08-23-2012 |
20120213944 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A method for manufacturing a printed wiring board including forming a penetrating hole in a core substrate, forming a first conductor on a first surface of the substrate, forming a second conductor on a second surface of the substrate, and filling a conductive material in the hole such that a through-hole conductor is formed in the hole and the first and second conductors are connected via the through-hole conductor. The forming of the hole includes forming a first opening in the first surface, forming a second opening from the bottom of the first opening toward the second surface such that the second opening has a smaller diameter than the first opening, forming a third opening in the second surface, and forming a fourth opening from the bottom of the third opening toward the first surface such that the fourth opening has a smaller diameter than the third opening. | 08-23-2012 |
20120225216 | Method for Forming a Microretarder Film - The present invention provides a method for forming a micro-retarder film. The method comprises utilizing a tension-assisted rolling process for a microstructure phase film layer to form a microstructure phase film pattern with a plurality of openings and a plurality of phase retarder patterns. Next, a homogeneous material layer is formed on the microstructure phase film pattern. Finally, a transmutation treatment is applied for backside of the microstructure phase film pattern. | 09-06-2012 |
20120231179 | EMBEDDED WIRING BOARD AND A MANUFACTURING METHOD THEREOF - An embedded wiring board includes an upper wiring layer, a lower wiring layer, an insulation layer, a first conductive pillar and a second conductive pillar. The upper wiring layer contains an upper pad, the lower wiring layer contains a lower pad, and the insulation layer contains an upper surface and a lower surface opposite to the upper surface. The upper pad is embedded in the upper surface and the lower pad is embedded in the lower surface. The first conductive pillar is located in the insulation layer and includes an end surface which is exposed by the upper surface. A height of the first conductive pillar relative to the upper surface is larger than a depth of the upper pad relative to the upper surface. In addition, the second conductive pillar is located in the insulation layer and is connected between the first conductive pillar and the lower pad. | 09-13-2012 |
20120244295 | METHOD OF DEFINING ELECTRODES USING LASER-ABLATION AND DIELECTRIC MATERIAL - A method of forming an electrochemical test sensor includes providing a base. Electrochemically-active material is placed on the base. Dielectric material is applied over the electrochemically-active material. A first selected area of the dielectric material is laser-ablated to expose the electrochemically-active material. A second selected area of the dielectric material and the electrochemically-active material are laser-ablated to expose the base. The first selected area is different from the second selected area. A second layer is applied to assist in forming a channel in the test sensor. The channel assists in allowing a fluid sample to contact a reagent located therein. The dielectric material is located between the base and the second layer. | 09-27-2012 |
20120251735 | PRINTING CONDUCTIVE LINES - A method for printing conductive lines on a substrate includes printing a pattern of conductive material ( | 10-04-2012 |
20120288641 | SYSTEM AND METHOD FOR DEPOSITING MATERIAL ON A PIEZOELECTRIC ARRAY - A system having a print head for depositing material on a piezoelectric array, where the print head and array are moveable with respect to each other, and a computer for controlling movement of the print head and array with respect to each other to locations along the array, and controlling the print head to dispense the material onto the array at such locations. The print head deposits a pre-determined amount of material in one of dots, or in a line with movement of the print head and array with respect to each other. The system enables deposit of conductive material for electrical connections to array elements. Non-conductive polymer material may be deposited on the array before depositing conductive material to create barriers avoiding unintended connection of array elements by the conductive material. The system may also be used for fabricating a piezoelectric array by depositing electro-ceramic material. | 11-15-2012 |
20120288642 | DECORATIVE LAMINATE BOARD AND RELATED METHODS - A method of providing a decorative laminate board is provided. The method includes providing a board having a decorative upper surface, treating a portion of the decorative upper surface with a laser for embossing the decorative upper surface, and coating the laser treated portion of the decorative upper surface. | 11-15-2012 |
20120301630 | METHOD FOR FORMING FLEXIBLE PRINTED CIRCUIT BOARD - A method for forming a flexible printed circuit board is provided. First, an insulating substrate with a first side and a second side is provided. Second, a through hole connecting the first side and the second side is formed in the insulating substrate. Then, a printing step is carried out to print a conductive precursor which is on the first side and cover and fill the through hole. Later, the conductive precursor is cured to form a conductive composition and to simultaneously form a circuit to obtain a flexible printed circuit board. The conductive composition includes at least one of carbon and silver. | 11-29-2012 |
20120315402 | CONTROL ELEMENT - A control element is provided, in particular for a motor vehicle, including a material through which light can be passed and whish is provided with at least one opaque coating provided with symbols, and having a transparent enamel layer on the coating, wherein nanoparticles are introduced into the enamel layer and the coating and the enamel layer are removed by means of a laser. | 12-13-2012 |
20120321815 | Thin Film Battery Fabrication With Mask-Less Electrolyte Deposition - A method of fabricating a thin film battery may include a blanket deposition of an electrolyte layer followed by selective laser patterning of the electrolyte layer. Some or all of the other device layers may be in situ patterned layers—formed using shadow masks. | 12-20-2012 |
20130011576 | DISPLAY DEVICE AND LIGHT SENSING SYSTEM - A method for manufacturing an embedded wiring board is provided. An activating insulation layer is formed. The activating insulation layer includes a plurality of catalyst particles, and covers a first wiring layer. An intaglio pattern and at least one blind via partially exposing the first wiring layer are formed on the activating insulation layer, in which some of the catalyst particles are activated and exposed in the intaglio pattern and the blind via. The activating insulation layer is dipped in a first chemical plating solution, and a solid conductive pillar is formed in the blind via through electroless plating. The activating insulation layer is dipped in a second chemical plating solution after the solid conductive pillar is formed, and a second wiring layer is formed in the intaglio pattern through the electroless plating. Components of the first chemical plating solution and the second chemical plating solution are different. | 01-10-2013 |
20130011577 | METHOD FOR PROVIDING A METAL ELECTRODE ON THE SURFACE OF A HYDROPHOBIC MATERIAL - A method of making a metal electrode on the surface of a hydrophobic material ( | 01-10-2013 |
20130084405 | METHOD FOR FORMING CIRCUITS ON HOUSING BY SPRAYING AND LASER ENGRAVING - A method for plating circuits on a housing by spraying and laser engraving is provided. Before manufacturing the circuit, a first spraying layer is formed. The thickness of the first spraying layer is approximately equal to that of the circuit to be formed thereon. Laser engraving is used to form laser engraving areas for forming the circuit metal layer. Then the circuit metal layer is formed by chemical plating, and the thickness of the metal layer is approximately equal to that of the first spraying layer. Then a second spraying layer is applied on both of the metal layer and the first spraying layer so as to present a flat and aesthetic appearance. As the present invention is applied in 2-shot molding, each time the pattern of the circuit is changed, it is only necessary to change the paths in the laser engraving. No more molds modification is needed for changing the pattern of the circuit. | 04-04-2013 |
20130101754 | Method of Heating Dispersion Composition and Method of Forming Glass Pattern - Provided are a method of heating a composition which is applicable to a substrate provided with a material having low heat resistance and a method of forming a glass pattern which leads to reduction of cracks. A composition formed over a substrate is irradiated with a laser beam to bake the paste through local heating. Scan with the laser beam is, performed so that there can be no difference in the laser beam irradiation period between the middle portion and the perimeter portion of the composition. Specifically, irradiation with the laser beam is performed so that the width of the beam spot overlapping with the composition in the scanning direction is substantially uniform. | 04-25-2013 |
20130115385 | METHOD FOR MANUFACTURING COLOR FILTER SUBSTRATE - The present invention provides a method for manufacturing a color filter substrate, in which the occurrence of color mixing between adjacent sub-pixels is prevented even when an inkjet method is used. A color filter substrate having color filters of a plurality of colors arranged in a matrix with a bank therebetween is manufactured using this method. The method has: a first inkjet step in which an ink is jetted to at least one region among a plurality of regions partitioned by the bank, and the ink is not jetted to any of regions adjacent to the one region in the horizontal direction and the vertical direction; and a second inkjet step in which the ink is jetted to at least one region to which the ink has not been jetted in the first inkjet step, the aforementioned at least one region being among the plurality of regions partitioned by the bank. | 05-09-2013 |
20130122216 | STRUCTURE OF EMBEDDED-TRACE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an embedded-trace substrate is provided. First, a core plate is provided. Next, a through hole and a plurality of trenches are formed on the core plate, wherein the through hole passes through the core plate, and the trenches are formed on the upper and the lower surfaces of the core plate. Then, the core plate is subjected to one-plating step for electroplating a conductive material in the through hole and the trenches at the same time. Afterwards, the excess conductive material is removed. | 05-16-2013 |
20130136869 | Method for Improving Plating on Non-Conductive Substrates - A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated. | 05-30-2013 |
20130136870 | Droplet Deposition Apparatus and Method for Manufacturing the Same - A method of forming a component for a droplet deposition apparatus, includes the steps of: providing a protection material so as to fill fluid chambers and; directing a high-powered laser at the component so as to ablate an array of nozzles communicating with respective filter chambers. The protection material acts to inhibit damage to the walls of the chamber during ablation, such as damage to the interior passivation coating, or electrodes provided on the walls of the chamber, and can be removed for example by flushing with a heated solvent. | 05-30-2013 |
20130149465 | BUILDING MATERIAL AND METHOD FOR MANUFACTURING THEREOF - The present invention provides a building material in which a coating is applied to a front surface and a side surface is sufficiently adhered to a sealing and method for manufacturing thereof. In a building material in which a coating is applied to a front surface, a coating film on a side surface is removed or reduced by laser irradiation. The part of the side surface in which the coating film has been removed or reduced by laser irradiation has a width of at least 5 mm from a front surface side toward a rear surface side of the building material, or extends over the entire side surface from the front surface side toward the rear surface side of the building material, or is formed more than a part in which coating film is formed. | 06-13-2013 |
20130164457 | METHOD OF MANUFACTURING PATTERNED X-RAY OPTICAL ELEMENTS - A pulsed laser beam engraves a groove pattern on substrate of material relatively transparent to the laser beam. The grooves of the pattern are filled with a filling material of different density or different electron density. The pattern of grooves filled with material of different density creates a spatial density modulation that forms the basic structure of various optical elements. By adjusting the flux density of the laser beam to exceed a material break-down threshold only in specific locations, the material ablation can be reduced to a diameter smaller than the diameter of the laser beam itself. The grooves fabricated in this manner can be filled with a deformable material under vacuum with subsequent exposure to air pressure or higher pressure. It is also possible to fill the grooves with nanoparticles of different density and secured by heat application or with a coating. | 06-27-2013 |
20130171373 | PROCESS FOR OBTAINING METAL OXIDES BY LOW ENERGY LASER PULSES IRRADIATION OF METAL FILMS - The present invention relates to processes for obtaining metal oxides by irradiation of low energy laser pulses of metal layers, wherein said metals can be formed as simple metals, alloys, or multilayers. The present invention performs the oxidation of a thin metal film deposited on a substrate; e.g., glass (SiO | 07-04-2013 |
20130177715 | Platinum-Based Electrocatalysts Synthesized by Depositing Contiguous Adlayers on Carbon Nanostructures - High-surface-area carbon nanostructures coated with a smooth and conformal submonolayer-to-multilayer thin metal films and their method of manufacture are described. The manufacturing process may involve initial oxidation of the carbon nanostructures followed by immersion in a solution with the desired pH to create negative surface dipoles. The nanostructures are subsequently immersed in an alkaline solution containing non-noble metal ions which adsorb at surface reaction sites. The metal ions are then reduced via chemical or electrical means and the nanostructures are exposed to a solution containing a salt of one or more noble metals which replace adsorbed non-noble surface metal atoms by galvanic displacement. Subsequent film growth may be performed via the initial quasi-underpotential deposition of a non-noble metal followed by immersion in a solution comprising a more noble metal. The resulting coated nanostructures may be used, for example, as high-performance electrodes in supercapacitors, batteries, or other electric storage devices. | 07-11-2013 |
20130251915 | TECHNIQUES FOR MARKING PRODUCT HOUSINGS - Techniques or processes for providing markings on products are disclosed. The markings provided on products can be textual and/or graphic. The techniques or processes can provide high resolution markings on surfaces that are flat or curved. In one embodiment, the products have housings and the markings are to be provided on the housings. For example, the housing for a particular product can include an outer housing surface and the markings can be provided on the outer housing surface. The markings can be formed using a ultra-violet (UV) curable material that can be selectively cured on a surface (e.g., housing surface) in places where markings, namely text and/or graphics, are to be provided. | 09-26-2013 |
20130260056 | Apparatuses and Methods for Maskless Mesoscale Material Deposition - Apparatuses and processes for maskless deposition of electronic and biological materials. The process is capable of direct deposition of features with linewidths varying from the micron range up to a fraction of a millimeter, and may be used to deposit features on substrates with damage thresholds near 100° C. Deposition and subsequent processing may be carried out under ambient conditions, eliminating the need for a vacuum atmosphere. The process may also be performed in an inert gas environment. Deposition of and subsequent laser post processing produces linewidths as low as 1 micron, with sub-micron edge definition. The apparatus nozzle has a large working distance—the orifice to substrate distance may be several millimeters—and direct write onto non-planar surfaces is possible. | 10-03-2013 |
20130273259 | MARKING COATING - A composition for allowing marking of a product, the composition comprising: (a) a volatile solvent; (b) a silicone resin comprising a trifunctional unit of formula (R)SiO | 10-17-2013 |
20130273260 | METHOD FOR MANUFACTURING GRAPHERE LAYER BY LASER - The present invention relates to a method for manufacturing a graphene layer, comprising the following steps: providing a substrate; forming a metal layer on a first side of the substrate; forming a carbon source layer on the metal layer; providing a laser, which irradiates a second side of the substrate and passes through the substrate to form a graphene layer on an interface between the substrate and the metal layer; and providing an organic solvent and an acid solution to remove the carbon source layer and the metal layer respectively. | 10-17-2013 |
20130302534 | METHOD FOR MANUFACTURING DISPLAY DEVICE - According to one embodiment, a method is disclosed for manufacturing a display device. A film material layer is formed on a support substrate. A first heating process for the film material layer at a first temperature to form a film layer and a second heating process for a second region surrounding a first region at a second temperature higher than the first temperature are performed. The first region is provided in a central part of the film layer. A display layer is formed in the first region and a peripheral circuit section is formed at least in a part of the second region. A third heating process is performed for at least a part of the film layer at a third temperature higher than the second temperature. In addition, the film layer is peeled off from the support substrate. | 11-14-2013 |
20130316092 | METHOD OF HIGH RESOLUTION LASER ETCHING ON TRANSPARENT CONDUCTING LAYER OF TOUCH PANEL - The method disclosed comprises steps of preparing a transparent conducting material, and forming a transparent conducting ink with the transparent conducting material mixing with carbon materials. Next, prepare a transparent plastic film, and form a transparent conducting layer by forming the transparent conducting ink film on the transparent plastic film via spray coating, screen printing, ink jet printing or roll to roll ink coating film. Lastly, project laser beams on the transparent conducting layer of the transparent plastic film. The transparent conducting layer includes carbon materials for facilitating the light condensing effect of the laser beams. In the laser beams etching process, the line width of the transparent conducting layer etching is produced less than 50 um, the width of the ineffective area near the etching edge after the etching of the transparent conducting layer is less than 10 um in order to complete a high resolution laser etching process. | 11-28-2013 |
20130323433 | PLATING METHOD USING LASER ETCHING PROCESS - Disclosed is a method for plating on a nickel plated layer using a laser etching process including: forming a nickel plated layer on the surface of a raw material; forming a laser etched layer by laser etching a graphic on the nickel plated layer; and forming a chromium plated layer on the laser etched layer. | 12-05-2013 |
20130323434 | INKJET PRINTING WITH IN SITU FAST ANNEALING FOR PATTERNED MULTILAYER DEPOSITION - Patterned multilayer films, such as those used in electronic devices, solar cells, solid oxide fuel cells (SOFCs), and solid oxide electrolysis cells (SOECs) may be deposited and annealed in a single tool. The tool includes an inkjet printer head, a heater, and a laser. The inkjet printer head deposits on a substrate either suspended particles of a functional material or solvated precursors of a functional material. The head is mounted on a support that allows the head to scan the substrate by moving along the support in a first direction and moving the support along a second direction. After the head deposits the material the heater evaporates solvent from substrate, and the depositing and heating may be repeated one or more times to form a patterned multilayer material. Then, a laser, microwave, and/or Joule effect heating device may be used to anneal the multilayer material to a desired pattern and crystalline state. | 12-05-2013 |
20130337188 | RESIN COMPOSITION AND METHOD FOR PRODUCING CIRCUIT BOARD - The present invention relates to a resin composition which includes a copolymer consisting of a first monomer containing a monomer unit having at least one carboxyl group and a second monomer copolymerizable with the first monomer, and also includes an ultraviolet absorber. The resin composition used is a resin composition for which, when ∈1 represents an absorbance coefficient per unit weight of a resin film | 12-19-2013 |
20140030443 | Sapphire Window - Methods for creating sapphire windows are provided herein. In particular, one embodiment may take the form of a method of manufacturing sapphire windows. The method includes obtaining a polished sapphire wafer and applying decoration to the sapphire wafer. The method also includes cutting the sapphire wafer into discrete windows. In some embodiments, the cutting step comprises laser ablation of the sapphire. | 01-30-2014 |
20140037862 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a method for manufacturing a printed circuit board for forming a solder resist of an outermost layer having a step structure by performing laser machining or exposing and developing processes. | 02-06-2014 |
20140065321 | PULL-BACK DESIGN TO MITIGATE PLASTIC SENSOR CRACKS - The described embodiments relate generally to the singulation of circuits and more particularly to a method of cutting of a polymer substrate that is overlaid with a conductive element and a passivation layer. In one embodiment, the passivation layer is applied selectively to the polymer substrate in an area covering the conductive element and extending at least a first distance past an outer edge of the conductive element. Then, a cutting operation is performed along a cutting path located a second distance from an outer edge of the passivation layer. The second distance is a minimum distance between the edge of the passivation layer and the cutting path that prevents a load applied at the second distance from causing a stress crack in the passivation layer. | 03-06-2014 |
20140106085 | METHOD OF MANUFACTURING INTERNAL ANTENNA BY LASER - Disclosed is a method of manufacturing an internal antenna by laser, which includes preparing a case, forming an antenna groove, forming a pattern, and plating. The preparing the case includes preparing the case of the portable terminal. The forming the antenna groove includes emitting a laser beam to the case and thus forming the antennal groove corresponding to an antenna shape. The forming the pattern includes emitting a laser beam to a bottom of the antenna groove and thus forming the engraved pattern. The plating comprises plating an internal portion of the antenna groove with a conductive metallic material. | 04-17-2014 |
20140134350 | METAL NANOPARTICLES AND METHODS FOR PRODUCING AND USING SAME - A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers. | 05-15-2014 |
20140170333 | MICRO-AND NANO-FABRICATION OF CONNECTED AND DISCONNECTED METALLIC STRUCTURES IN THREE-DIMENSIONS USING ULTRAFAST LASER PULSES - In one aspect, a method for fabricating metal structures in two or three dimensions is disclosed, which includes providing a mixture of a polymer, a metal precursor and a solvent, and applying the mixture to a surface of a substrate. The applied mixture can then be cured (e.g., via a heat treatment) to generate a polymeric layer (e.g., a polymeric film) with ions associated with the metal precursor distributed therein. Subsequently, radiation (e.g., radiation pulses) at a wavelength to which the polymeric layer is substantially transparent is focused onto at least one location of the polymeric layer so as to cause chemical reduction of metal ions associated with the metal precursor within at least a portion of that location, thereby generating at least one metalized region. | 06-19-2014 |
20140234552 | METHOD FOR PRODUCING AN AIRCRAFT STRUCTURE COMPONENT HAVING AN OUTER SKIN PROVIDED WITH ELECTRIC CONDUCTOR ELEMENTS - A method for producing an aircraft structure component is disclosed the component having an outer skin provided with electric conductor elements. The method includes providing an aircraft structure component having an outer skin, applying particles of electrically conductive material onto the outer surface of the outer skin of said aircraft structure component in a predetermined pattern, such that the accumulated particles of electrically conductive material form electric conductor elements along the outer surface of the outer skin, and applying particles of electrically insulating material onto the outer surface of the outer skin of said aircraft structure component in a predetermined pattern, such that the accumulated particles of electrically isolating material form an insulating layer for the electric conductor elements. | 08-21-2014 |
20140255618 | METHOD AND APPARATUS FOR MARKING CONSUMER PRODUCTS - A system for providing consumers with information relating to packaged consumer goods involves marking the package for the goods with a permanent digital code that may be scanned with a cell phone to communicate over the Internet with a web site containing information about the package contents. The website and its associated server can determine if the packaging is genuine or forged and track the consumers. The marking is formed on a bottle by vapor depositing a gold layer and laser marking the layer with the code. | 09-11-2014 |
20140255619 | METHOD FOR PRODUCING A FUEL CELL SEPARATOR - Provided is a method for producing a fuel cell separator which can achieve a stable power generation over a prolonged period of time and a method of producing the fuel cell separator. The fuel cell separator has a recess for gas flow path whose surface is roughened in such a manner that the arithmetic mean roughness Ra is 0.5 to 10 μm, and the recess for gas flow path is brought into contact with a fluorine-containing gas or a gas containing both fluorine and oxygen. The thus obtained fuel cell separator can retain a uniform liquid film formed on the surface thereof for at least 10 seconds when a test piece prepared from the fuel cell separator is immersed in water for 30 seconds and pulled out therefrom to a position at not less than 1 cm from the water surface within 1 second. | 09-11-2014 |
20140287158 | PERFORMANCE OF CONDUCTIVE COPPER PASTE USING COPPER FLAKE - A conductive paste for screen application has a mixture of copper flake having a mean diameter between 1.0-8.0 micrometers and copper nanoparticles having a mean diameter from 10 nm to 100 nm, wherein the ratio of the copper flake to the nanoparticles is between 2:1 and 5:1 by weight; and a resin comprising about half of a polymer having a molecular weight in excess of 10,000 and one or more solvents. | 09-25-2014 |
20140287159 | CONDUCTIVE PASTE FORMULATIONS FOR IMPROVING ADHESION TO PLASTIC SUBSTRATES - A conductive paste for screen application to a substrate has a mixture of copper particles having a mean diameter between 1.0-5.0 micrometers and polymer-coated copper nanoparticles having a mean diameter from 10 nm to 100 nm. The ratio of the copper particles to the nanoparticles is between 2:1 and 5:1 by weight. The paste has a resin comprising a binder portion and a solvent portion, wherein the binder portion is about half of the resin by weight, and a plasticizer having a boiling point above about 200 degrees C., wherein the plasticizer is from 1-3% of the paste, by weight. | 09-25-2014 |
20140308459 | BIOSENSOR, THIN FILM ELECTRODE FORMING METHOD, QUANTIFICATION APPARATUS, AND QUANTIFICATION METHOD - A biosensor is disclosed comprising a support; a conductive layer composed of an electrical conductive material such as a noble metal, for example gold or palladium, and carbon; slits parallel to and perpendicular to the side of the support; working, counter, and detecting electrodes; a spacer which covers the working, counter, and detecting electrodes on the support; a rectangular cutout in the spacer forming a specimen supply path; an inlet to the specimen supply path; a reagent layer formed by applying a reagent containing an enzyme to the working, counter, and detecting electrodes, which are exposed through the cutout in the spacer; and a cover over the spacer. The biosensor can be formed by a simple method, and provides a uniform reagent layer on the electrodes regardless of the reagent composition. | 10-16-2014 |
20140349030 | POLYMER ARTICLE AND METHOD FOR SELECTIVE METALLIZATION OF THE SAME - A method for selective metallization of a surface of a polymer article is provided. The polymer article contains a base polymer and at least one metal compound dispersed in the base polymer. The method includes gasifying at least a part of a surface of the polymer article by irradiating the surface with an energy source, and forming at least one metal layer on the surface of the polymer article by chemical plating. The metal compound contains a tin oxide doped with at least one doping element selected from a group including: V, Sb, In, and Mo. | 11-27-2014 |
20150010717 | THIN FILM BATTERY FABRICATION USING LASER SHAPING - A method of fabricating a battery comprises selecting a battery substrate having cleavage planes, and depositing at least one battery component film comprising a metal or metal compound. A plurality of pulsed laser beam bursts from a femtosecond laser source that is set to provide a pulsed laser beam having an irradiance level of from about 10 to about 800 J/cm | 01-08-2015 |
20150050429 | METHOD FOR MANUFACTURING DECORATIVE PART FOR VEHICLE, AND DECORATIVE PART FOR VEHICLE - At least either convex parts | 02-19-2015 |
20150293371 | DIFFRACTIVE OPTICAL ELEMENTS AND METHODS FOR PATTERNING THIN FILM ELECTROCHEMICAL DEVICES - A method of fabricating an electrochemical device, comprising: depositing device layers, including electrodes and corresponding current collectors, and an electrolyte layer, on a substrate; and directly patterning at least one of said device layers by a laser light pattern generated by a laser beam incident on a diffractive optical element, the laser light pattern directly patterning at least an entire device in a single laser shot. The laser direct patterning may include, among others: die patterning of thin film electrochemical devices after all active layers have been deposited; selective ablation of cathode/anode material from corresponding current collectors; and selective ablation of electrolyte material from current collectors, Furthermore, directly patterning of the electrochemical device may be by a shaped beam generated by a laser beam incident on a diffractive optical element, and the shaped beam may be moved across the working surface of the device. | 10-15-2015 |
20150344929 | BIOSENSOR, THIN FILM ELECTRODE FORMING METHOD, QUANTIFICATION APPARATUS, AND QUANTIFICATION METHOD - A biosensor is disclosed comprising a support; a conductive layer composed of an electrical conductive material such as a noble metal, for example gold or palladium, and carbon; slits parallel to and perpendicular to the side of the support; working, counter, and detecting electrodes; a spacer which covers the working, counter, and detecting electrodes on the support; a rectangular cutout in the spacer forming a specimen supply path; an inlet to the specimen supply path; a reagent layer formed by applying a reagent containing an enzyme to the working, counter, and detecting electrodes, which are exposed through the cutout in the spacer; and a cover over the spacer. The biosensor can be formed by a simple method, and provides a uniform reagent layer on the electrodes regardless of the reagent composition. | 12-03-2015 |
20150357070 | NANOSTRUCTURES AND ASSEMBLY OF NANOSTRUCTURES - Examples are described related to nanostructures and assembling nanostructures. A fluid including nanostructures may be deposited onto a surface of a substrate. Optical beams may be directed towards a region of the surface of the substrate such that the optical beams overlap at a location within the region. Radiation pressure generated by the optical beams may effectively drive at least some of the nanostructures in the fluid towards the substrate. In this manner, the nanostructures may be assembled on the substrate. | 12-10-2015 |
20150368785 | MASK FRAME ASSEMBLY AND METHOD OF MANUFACTURING THE SAME - A mask frame assembly for manufacturing a display device, and a method of manufacturing the mask frame assembly are disclosed. In one aspect, the mask frame assembly includes a frame having at least one opening portion defined therein. The mask frame assembly further includes a polymer film having a plurality of slits defined therein and combined to the frame. | 12-24-2015 |
20150376768 | SYSTEMS AND METHODS FOR IMPLEMENTING DIGITAL VAPOR PHASE PATTERNING USING VARIABLE DATA DIGITAL LITHOGRAPHIC PRINTING TECHNIQUES - A system and method are provided for implementing a unique scheme by which to execute digital vapor phase patterning on metals, semiconductor substrates and other surfaces using a proposed variable data digital lithographic image forming architecture or technique. For certain substrate printing and manufacturing applications, including some printed electronics applications, the disclosed schemes implement techniques to digitally pattern metal layers with bulk material properties in a manner that is aligned with underlying layers on the fly. The disclosed digital printing process may pattern a release oil on a substrate in support of a metal deposition process. Changeable patterning is implemented with an ability to modify the alignment of the patterns on-the-fly. The release layer on a drum is laser patterned in order that the patterned release layer is transferred to the substrate, or the patterning of the release layer is accomplished directly on the substrate. | 12-31-2015 |
20160008923 | REMOVAL OF SELECTED PORTIONS OF PROTECTIVE COATINGS FROM SUBSTRATES | 01-14-2016 |
20160011369 | SURFACE-MOUNT CONNECTOR STRUCTURE FOR EMBEDDED OPTICAL AND ELECTRICAL TRACES | 01-14-2016 |
20160016846 | METHOD FOR HEAT-TREATING A COATING - A process for the heat treatment of a coating deposited on at least one portion of a first face of a substrate including a first face and a second face opposite the first face, wherein the coating is treated by a laser radiation focused on the coating in the form of a laser line extending along a first direction, the heat treatment being such that, in a second direction transverse to the first direction, a relative displacement movement is created between the substrate and the laser line, wherein the second face is heated locally at a temperature of at least 30° C. in an additional heating zone extending facing the laser line over a length of at least 10 cm along the second direction, with the aid of at least one additional heater positioned on the side opposite the laser line with respect to the substrate. | 01-21-2016 |
20160029748 | METHOD FOR PROVIDING NANOCRYSTALLINE DIAMOND COATINGS ON GEMSTONES AND OTHER SUBSTRATES - A method to apply nano-crystalline diamond onto a selected substrate, including preparing Nanodiamond slurry of Nanodiamond particles dispersed in a medium. The medium may include a liquid or a sol-gel. The selected substrate is immersed in the Nanodiamond slurry for a predetermined period of time. Then the substrate is removed from the slurry. The substrate is then dried with a flow of inert gas. The substrate is left coated with a coating of the nanodiamond particles that are highly adherently held by van der Waals forces. | 02-04-2016 |
20160158864 | Functionalized Metal Oxide Soldering Methods and UV Sensor Manufactured Thereof - Provided are a method of soldering a functionalized metal oxide, and an electronic device manufactured thereby, and more particularly, a method of soldering a functionalized metal oxide which is capable of growing a solder structure by a hydrothermal synthesis method using a pulsed laser, and is usable in a UV sensor, and an electronic device manufactured thereby. According to the present invention, thermal diffusion generated from a laser is limited due to the use of a pulsed laser, and thus, nanosolder having high density and a shape to be precisely adjustable may be prepared by a hydrothermal synthesis method by the pulsed laser, thereby facilitating the joining of the nanostructure, and further, the nanosolder is formed between the nanostructures, thereby being usable as a metal oxide structure having functionality. | 06-09-2016 |
20160186322 | POLYMER ARTICLES, INK COMPOSITIONS, AND METHODS FOR SELECTIVELY METALIZING POLYMER ARTICLES - Embodiments of the present disclosure are directed to a polymer article. The polymer article includes a polymer matrix and a metal compound dispersed in the polymer matrix. The metal compound is a compound represented by formula (I): A | 06-30-2016 |