Class / Patent application number | Description | Number of patent applications / Date published |
420507000 | GOLD BASE | 26 |
20080304999 | Au-Sn Alloy Bump Having no Trapped-In Large Void and Process for Producing the Same - An Au—Sn alloy bump that does not include large voids and a method of producing the same are provided. The An Au—Sn alloy bump that does not include large voids comprises a composition containing Sn: 20.5 to 23.5 mass % and the balance Au and unavoidable impurities, and a structure where 0.5 to 30 area % of Sn-rich primary crystal phase is crystallized in the matrix. | 12-11-2008 |
20090022621 | BONDING WIRE - The invention relates to a gold alloy containing 99 wt. %, preferably 99.9 wt. % gold, and 1 to 1000 ppm, preferably 10 to 100 ppm calcium, and 1 to 1000 ppm, preferably 10 to 100 ppm ytterbium or europium or a mixture of ytterbium and europium, as well as a method for producing a homogeneous gold alloy containing europium and/or ytterbium. | 01-22-2009 |
20090074608 | PROCESS FOR MERCURY CONTROL DURING PRESSURE OXIDATION - A method for suppressing mercury dissolution during pressure oxidation of precious metal-containing materials in the presence of halogens and halides is provided. Pressure oxidation is performed under controlled oxidative conditions to maintain the mercury predominantly in the solid residue. | 03-19-2009 |
20100143184 | METHOD FOR MANUFACTURING METAL NANORODS AND USE THEREOF - A method for manufacturing metal nanorods includes: a step of adding a reducing agent to a metallic salt solution; a step of radiating light into the metallic salt solution containing the reducing agent; and a step of leaving the light-radiated metallic salt solution containing the reducing agent stationary in a dark place so as to grow metal nanorods. Metal nanorods can be also grown by forming a mixed solution by fractionating the above light-radiated metallic salt solution and mixing the fractionated metallic salt solution into a non-radiated metallic salt solution containing the reducing agent, or mixing a non-radiated metallic salt solution and the reducing agent into the above light-radiated metallic salt solution; and leaving the mixed solution stationary in a dark place so as to grow metal nanorods. | 06-10-2010 |
20100226816 | GOLD ALLOY WIRE FOR BALL BONDING - There is provided a gold alloy wire for a ball bonding. The gold alloy consists of 10 to 50 ppm by mass of magnesium (Mg); 5 to 20 ppm by mass of europium (Eu); 2 to 9 ppm by mass of calcium (Ca); and a remaining portion being gold (Au) having a purity of a minimum of 99.998% by mass. In the gold alloy wire for a ball bonding, an addition amount of calcium (Ca) is a maximum of half that of europium (Eu). | 09-09-2010 |
20110076183 | Au-Ga-In Brazing Material - A brazing material which can be melted at a suitable temperature at which damage is not given to a device inside a package upon sealing, and besides the brazing material is not remelted, e.g., upon mounting to a board, and which has a low temperature difference between a liquid and a solid. The brazing material is made of a Au—Ga—In ternary alloy, wherein weight concentrations of the elements lie within a region of a polygon with a point A (Au: 90%. Ga: 10%, In: 0%), a point B (Au: 70%, Ga: 30%, In: 0%), a point C (Au: 60%. Ga: 0%. In: 40%) and a point D (Au: 80%, Ga: 0%. In: 20%) as vertexes. excluding lines on which In and Ga become 0%, in a Au—Ga—In ternary phase diagram. | 03-31-2011 |
20120134873 | METHOD FOR FABRICATING A GOLD NANOPARTICLE - The present invention is directed to a method for fabricating a gold nanoparticle, the method comprising the steps of contacting a gold ion with a protein, wherein the protein has an inner cavity that can accommodate the gold ion, separating the protein with the encapsulated gold ion(s) from non-encapsulated gold ions, contacting the protein-encapsulated gold ion with a first reductant to reduce the gold ion and form a gold nanocluster seed in the inner cavity of the protein, wherein the first reductant is a strong reductant, and contacting the gold nanocluster seed in the inner cavity of the protein with a second reductant to mineralize and grow the gold nanoparticle. | 05-31-2012 |
20130108501 | Method of Releasing High Temperature Films and/or Devices From Metallic Substrates | 05-02-2013 |
20130209310 | THERMAL DIFFUSION CONTROL FILM FOR USE IN MAGNETIC RECORDING MEDIUM, FOR HEAT-ASSISTED MAGNETIC RECORDING, MAGNETIC RECORDING MEDIUM, AND SPUTTERING TARGET - A thermal diffusion control film which includes an Ag alloy containing Nd, Bi, and Si. The thermal diffusion control film can be used for a magnetic recording medium for heat-assisted magnetic recording. The thermal diffusion control film has a good heat resistance even after heat hysteresis at about 600° C. | 08-15-2013 |
20140234157 | METHODS FOR FORMING GOLD NANOWIRES ON A SUBSTRATE AND GOLD NANOWIRES FORMED THEREOF - A method for forming gold nanowires on a substrate is provided. The method includes a) attaching noble metal nanoparticles onto the substrate; and b) contacting the noble metal nanoparticles with an aqueous solution comprising a ligand, gold ions and a reducing agent, wherein the ligand is an organic compound having a thiol group. Gold nanowires formed by a method according to the method, and an electronic device comprising the gold nanowires are also provided. | 08-21-2014 |
20140356225 | METHOD FOR PRE-TREATMENT OF GOLD-BEARING OXIDE ORES - The disclosure relates to pre-treatment of precious metal-bearing oxide ores, prior to precious metal leaching by thiosulfate. The process comprises mixing oxide ore in oxygenated water in the presence of a carbon-based material (e.g., activated carbon or other type of carbon). The carbon-based material can be separated from the ore slurry, and, the gold is thereafter leached by a thiosulfate lixiviant. | 12-04-2014 |
20140356226 | Au-Ga-In BRAZING MATERIAL - A brazing material which can be melted at a suitable temperature at which damage is not given to a device inside a package upon sealing, and besides the brazing material is not remelted, e.g., upon mounting to a board, and which has a low temperature difference between a liquidus and a solidus. The brazing material is made of a Au—Ga—In ternary alloy, wherein weight concentrations of the elements lie within a region of a polygon with a point A (Au: 90%, Ga: 10%, In: 0%), a point B (Au: 70%, Ga: 30%, In: 0%), a point C (Au: 60%, Ga: 0%, In: 40%) and a point D (Au: 80%, Ga: 0%, In: 20%) as vertexes (excluding lines on which In and Ga become 0%), in a Au—Ga—In ternary phase diagram. | 12-04-2014 |
20150315696 | GOLD EVAPORATIVE SOURCES WITH REDUCED CONTAMINANTS AND METHODS FOR MAKING THE SAME - A unique sequence of steps is provided to reduce contaminants along one or more surfaces and faces of gold evaporative sources without deleteriously impacting the structure of the gold evaporative sources. Edges are deburred; contaminants are successfully removed therealong; and surface smoothness is substantially retained. The resultant gold evaporative source is suitable for use in evaporative processes as a precursor to gold film deposition without the occurrence or a substantial reduction in the likelihood of spitting by virtue of significantly reduced levels of contaminants, in comparison to gold evaporative sources subject to a standard cleaning protocol. | 11-05-2015 |
20160167136 | SYNTHESIS OF CHIRAL NANOPARTICLES USING CIRCULARLY POLARIZED LIGHT | 06-16-2016 |
420508000 | Palladium containing | 8 |
20110058979 | BONDING WIRE - [Issues to be Solved] Second bonding failures caused by attached oxide of additive elements on high purity Au bonding wire are to be resolved. | 03-10-2011 |
20120114522 | GRAY GOLD ALLOY FREE OF NICKEL AND COPPER - The present invention relates to a white gold alloy free of nickel and copper having a hardness that is suitable in particular for watchmakers and jewellers. Said alloy consists of (in wt %): more than 75% of Au; more than 18% to less than 24% of Pd; more than 1% to less than 6% of at least one element selected from among Mn, Hf, Nb, Pt, Ta, V, Zn and Zr; optionally, no more than 0.5% of at least one element selected from among Si, Ga and Ti; and optionally, no more than 0.2% of at least one element selected from among Ru, Ir and Re. The invention also relates to a method for preparing said alloy. | 05-10-2012 |
20140328718 | 18K Ni-FREE AGE HARDENABLE WHITE GOLD ALLOY - The present invention is directed to a reduced-cost 18K white gold alloy that is Ni-free, and otherwise contains a low w % of precious metals, including about 7 w % palladium, exhibits a color which is considered white, and shows age hardening characteristics commensurate with nickel containing 18 Karat gold alloys. | 11-06-2014 |
20150071814 | CRYSTALLINE GOLD ALLOYS WITH IMPROVED HARDNESS - The disclosure provides gold alloys. The alloys can have improved strength and hardness. The gold alloys can have various gold colors, including yellow gold and rose gold. The gold alloys can be used as enclosures for electronic devices. | 03-12-2015 |
20150368756 | TIMEPIECE MADE FROM ROSE GOLD ALLOY - The invention relates to a timepiece or piece of jewelry comprising an alloy containing at least 750 wt.-‰ gold, characterised in that the alloy comprises copper, calcium at a concentration of less than or equal to 10‰ or 7‰ or even 5‰, and/or silicon at a concentration of less than or equal to 2‰ or less than or equal to 0.5‰. | 12-24-2015 |
20150368757 | TIMEPIECE MADE FROM ROSE GOLD ALLOY - The invention relates to a timepiece or piece of jewelry comprising an alloy containing at least 750 wt.-‰ gold, characterised in that the alloy also contains copper, palladium and indium, the sum of the concentrations of palladium and indium being less than or equal to 35‰, or less than or equal to 30‰, or even less than or equal to 25‰, and/or the sum of the concentrations of palladium and indium being between 15‰ and 35‰, or between 20‰ and 35‰, or even between 25‰ and 33‰. | 12-24-2015 |
420509000 | Platinum containing | 2 |
20090232695 | GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH INITIAL BONDABILITY, HIGH BONDING RELIABILITY, HIGH ROUNDNESS OF COMPRESSION BALL, HIGH STRAIGHTNESS, HIGH RESIN FLOWABILITY RESISTANCE, AND LOW SPECIFIC RESISTANCE - There are provided a gold alloy wire for a bonding wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance. The gold alloy wire having high initial bonding ability, high bonding reliability, high roundness of a compression ball, high straightness, high resin flowability resistance, and low specific resistance contains one or more of Pt and Pd of 500 to less than 1000 ppm in total, Ir of 1 to 100 ppm, Ca of more than 30 to 100 ppm, Eu of more than 30 to 100 ppm, Be of 0.1 to 20 ppm, if necessary, one or more of La, Ba, Sr, and Bi of 30 to 100 ppm in total, if necessary, and a balance being Au and inevitable impurities. | 09-17-2009 |
20120039744 | GOLD-BASED ALLOY, FREE OF SILVER AND TIN, FOR DENTAL COPINGS OR ABUTMENTS - Alloys and dental copings or abutments formed of alloys include 50-60 wt % gold, 5-14 wt % platinum, 0.1-3.0 wt % iridium and the remainder palladium. Other alloys and dental copings or abutments formed of alloys include 58 wt % gold, 10 wt% platinum, 1.0 wt % iridium, and 31 wt % palladium. The alloys are capable of withstanding temperature profiles during casting and multiple high temperature exposures of porcelain firing without excessive softening. The alloys also exhibit advantageous shear strain properties giving the alloys improved manufacturability characteristics. | 02-16-2012 |
420510000 | Platinum containing | 1 |
20130259736 | Thermoregulatory Interactive Gold Alloys for Therapeutic Jewelry Items - Gold alloys are provided that offer therapeutic benefits to a biological organism by enhancing thermoregulation, metabolism, and improving blood circulation. In addition to the therapeutic benefits, the alloys retain their metallurgical properties, thereby allowing the alloys to be utilized with conventional lost-wax casting techniques as both jewelry items and therapeutic instruments. The alloys contain 88% to 95% gold, 2% to 10% platinum, 0.1% to 0.9% silver, 0.01% to 1.5% rhodium, and 0.01% to 1.5% iron. | 10-03-2013 |
420511000 | Silver containing | 3 |
20080206091 | Novelty in the Method for the Combination of Gold and the Other Minerals - The invention relates to a method for combining the different minerals used for the jewels comprising the process steps of thinning and fixing to each other the bottom and the top layers ( | 08-28-2008 |
20090191089 | Gold alloy compositions formed by environmentally friendly process - Rose-color and yellow-color gold alloys are formed from a gold-base alloy containing silver and copper. Mining these elements is usually highly detrimental to the environmental. Environmentally friendly alloys are obtained through the use of recycled elements and elements recovered from mines utilizing specific guidelines. Jewelry manufactured from these environmentally friendly alloys may be more receptive to a consumer, resulting in a competitive advantage. | 07-30-2009 |
20160375526 | Au-Sn-Ag BASED SOLDER ALLOY AND ELECTRONIC COMPONENT SEALED WITH THE SAME Au-Sn-Ag BASED SOLDER ALLOY, AND ELECTRONIC COMPONENT MOUNTING DEVICE - To provide an lead-free, Au—Sn—Ag based solder alloy for high temperature use that is sufficiently usable in bonding electronic components and electronic component mounting devices that are required to have very high reliability, such as crystal quartz devices, SAW filters and MEMS, yet at a particularly low cost, is excellent in processability and stress-relaxation property, and has high reliability. | 12-29-2016 |