Class / Patent application number | Description | Number of patent applications / Date published |
382151000 | Alignment, registration, or position determination | 56 |
20080292177 | System and Method for Providing Backside Alignment in a Lithographic Projection System - A system and method of providing alignment of the top surface of the substrate to alignment marks on the back side of the substrate on a lithographic projection system. A back-side optical alignment system is integrated under a movable substrate stage of the projection system. Alignment marks on the mask, which correspond to the location and separation of the substrate back side alignment marks are projected directly using UV illumination to the back-side optical alignment system, processed by a pattern recognition optical system, and stored. With a substrate on the movable stage, the substrate back-side alignment marks are positioned to correspond with the stored co-ordinate data. The projection system images the front side of the wafer after it has been aligned to the back side alignment marks. | 11-27-2008 |
20080298671 | Method For Increasing The Accuracy Of The Positioning Of A First Object Relative To A Second Object - A method is provided for increasing the accuracy of the positioning of a first object relative to a second object. The method overcomes the disadvantageous influence of thermal drift between a first and a second object during a positioning of a first object on a second object. The method finds applications in manufacturing, for example, in the manufacturing of semiconductor components. The method utilizes recognition of structures on the second object which have a minimum structure width. At a first instant, using one recognition procedure, the first object is positioned on the second object in a desired position. The relative displacement of the two objects is determined at the first instant and on at least one subsequent instant. A second recognition procedure may be used for this purpose. The second recognition procedure may have a resolution accuracy which is different than the resolution accuracy of the first resolution procedure. The second recognition procedure may be a pattern recognition method. The relative displacement determined at the second instant is used to correct the positioning of the first and second objects as necessary to maintain a desired position of the two objects. | 12-04-2008 |
20090010528 | METHOD FOR PLACING AT LEAST ONE COMPONENT PROVIDED WITH CONNECTION POINTS ON A SUBSTRATE, AS WELL AS SUCH A DEVICE - A method for placing at least one component provided with connection points on a substrate. First, positions of the connection points are determined, after which the component is positioned at desired positions on the substrate with the connection points thereof. Upon placement of a number of components, the contour of a component as well as the positions of the connection points relative to said contour are determined for a first number of components. On the basis of the calculated positions of the connection points relative to the contours average positions of the connection points relative to the contour are calculated. Upon placement of a second number of components the contour of a component is determined, whereupon the expected positions of the connection points relative to the contour are calculated on the basis of said average positions. | 01-08-2009 |
20090010529 | Method for Automatically De-Skewing of Multiple Layer Wafer for Improved Pattern Recognition - A method for processing wafers includes learning a first pattern at a de-skew site on a first wafer layer, saving the first patterns in a recipe for de-skewing wafers, learning a second pattern at the de-skew site a second wafer layer, and saving the second pattern in the same recipe for de-skewing wafers. Learning the first pattern may include determining a score of uniqueness for the first pattern. The method further includes finding the de-skew site on the second wafer layer using the first pattern before learning the second pattern. Finding the de-skew site includes determining a score of similarity between the first pattern and the second pattern. Learning the second pattern is performed when the score of similarity is less than a threshold value. A recipe for de-skewing wafers includes multiple patterns of a de-skew site of a wafer, wherein the patterns include a first pattern at the de-skew site on a first wafer layer and a second pattern at the de-skew site on a second wafer layer. | 01-08-2009 |
20090103800 | COORDINATE SYSTEM CONVERTER - A coordinate system converter efficiently converts coordinates of one coordinate system to a different coordinate system. A base system library module provides a common platform where different algorithms based on different coordinate systems can “shake hands” or be integrated into an overall conversion process in a manner that is transparent to each other. The number of supported coordinate systems can be dynamically extended without changing software to support different tools. | 04-23-2009 |
20090110264 | POSITION DETECTOR, POSITION DETECTION METHOD, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD - A position detector, which detects the position of a mark formed on a substrate (W), comprises a creating unit ( | 04-30-2009 |
20090226078 | Method and apparatus for aligning a substrate and for inspecting a pattern on a substrate - In a method and apparatus of aligning a substrate, a mark image may be generated from an alignment mark on the substrate. The mark image may be generated after a given process for manufacturing a semiconductor device including the substrate has been performed. The mark image may be compared with a given reference image, and the substrate may be aligned based on the comparison, so that the alignment mark corresponds to one of the reference image and the mark image. The alignment method may be used in a method of inspecting the substrate, wherein the process after which the mark image is created is performed in accordance with a process recipe to form a pattern. The inspection method may include inspecting whether the pattern from the aligned substrate corresponds to the process recipe. | 09-10-2009 |
20090263006 | BIOCHIP INSPECTING DEVICE AND BIOCHIP INSPECTING METHOD - There is provided a biochip inspecting device capable of showing a manifestation state as a graphical display that can be intuitively grasped. Reading means optically reads respective sites over a biochip, on the basis of an imaging signal from an optical reader. Digitizing means digitizes manifestation states in respective sites on the basis of results of reading by the reading means. Scaling means scales the numerical values of the respective sites acquired via the digitizing means. Image-outputting means outputs an image (a graphical chip image) obtained by disposing spot images having gradation values acquired via the scaling means at respective positions specified on a site-by-by-site basis. | 10-22-2009 |
20090310850 | SCREEN PRINTING APPARATUS - A screen printing apparatus for and method of printing deposits of material onto a workpiece, the apparatus comprising: an inspection station for determining a positional relationship of features on upper and lower surfaces of the workpiece, the inspection station comprising: an imaging system for determining a positional relationship of features on upper and lower surfaces of the workpiece, the imaging system comprising at least two spaced imaging units for imaging features on an upper surface of the workpiece, at least two spaced imaging units for imaging features on a lower surface of the workpiece, and a processing unit for determining a positional relationship of the imaged features on the upper and lower surfaces of the workpiece; and a printing station for printing deposits of material onto the workpiece, the printing station comprising: a workpiece support assembly comprising a workpiece support member for supporting the workpiece at a printing zone; a printing screen disposed above the workpiece support member; a transport mechanism for transporting the workpiece to the printing zone; and an alignment system for aligning the upper surface of the supported workpiece and the printing screen in relation to one another, the alignment system comprising at least two spaced workpiece imaging units for imaging features on a lower surface of the workpiece, and an alignment stage for moving the workpiece support member and the printing screen in relation to one another such as to align the upper surface of the workpiece and the printing screen in relation to one another by reference to positions of the imaged features on the lower surface of the workpiece as imaged at the printing zone and the positional relationship of the imaged features on the upper and lower surfaces of the workpiece as determined at the inspection zone. | 12-17-2009 |
20100002933 | OVERLAY MARK, METHOD OF CHECKING LOCAL ALIGMNENT USING THE SAME AND METHOD OF CONTROLLING OVERLAY BASED ON THE SAME - An overlay mark is described, including N sets of parallel x-directional linear patterns respectively defined by N (≧2) exposure steps and N sets of parallel y-directional linear patterns respectively defined by the N exposure steps, and a set of parallel x-directional photoresist bars and a set of parallel y-directional photoresist bars both formed in a lithography process. The N sets of x-directional linear patterns and the set of x-directional photoresist bars are arranged in parallel. The N sets of y-directional linear patterns and the set of y-directional photoresist bars are arranged in parallel. | 01-07-2010 |
20100014749 | METHOD AND DEVICE FOR ADJUSTING THE DEPOSIT POSITION OF A SEMICONDUCTOR WAFER IN AN OVEN - A method for loading a semiconductor wafer into a process unit comprises opening the process unit, inserting a wafer into the process unit, adjusting the position of the wafer in the process unit so that it is in a certain position in relation to markers, and inserting a camera into the process unit facing the markers. The camera acquires an image of the markers and of a part of the wafer, and displays on a display screen the image acquired. The position of the wafer is adjusted according to the position of the wafer in relation to the markers on the image displayed. | 01-21-2010 |
20100086198 | PRINTED CIRCUIT BOARD, LOCATING SYSTEM AND METHOD THEREOF - A printed circuit board includes a substantially rectangular circuit portion including operation points for connecting with electronic components, and a first margin portion adjacent to the circuit portion. The first margin portion includes groups of reference marks arranged in a first row parallel to a side of the printed circuit board. A related locating system and a locating method for locating position of the operation points of the printed circuit board are also disclosed. | 04-08-2010 |
20100092070 | HIGH ACCURACY BEAM PLACEMENT FOR LOCAL AREA NAVIGATION - An improved method of high accuracy beam placement for local area navigation in the field of semiconductor chip manufacturing. This invention demonstrates a method where high accuracy navigation to the site of interest within a relatively large local area (e.g. an area 200 μm×200 μm) is possible even where the stage/navigation system is not normally capable of such high accuracy navigation. The combination of large area, high-resolution scanning, digital zoom and registration of the image to an idealized coordinate system enables navigation around a local area without relying on stage movements. Once the image is acquired any sample or beam drift will not affect the alignment. Preferred embodiments thus allow accurate navigation to a site on a sample with sub-100 nm accuracy, even without a high-accuracy stage/navigation system. | 04-15-2010 |
20100172570 | PATTERN INSPECTION METHOD AND ITS APPARATUS - A pattern inspection method including: sequentially imaging plural chip formed on a substrate; selecting at least one of pattern sections of each inspection image obtained by the imaging, while discarding other pattern sections, based on a recipe created in advance, the recipe including information for determining which pattern sections to be selected or discarded; calculating position gap between an inspection image of a chip obtained by the imaging and a reference image stored in a memory by using positional information of pattern images included in the inspection image and reference pattern images which are both corresponding to the at least one of pattern sections selected at the selecting; aligning the inspection image and the reference image by using information of the calculated position gap; and comparing the aligned inspection image with the reference image, and extracting a difference between the two images as a defect candidate. | 07-08-2010 |
20100195897 | INSPECTION APPARATUS AND INSPECTION METHOD - Aims to provide an inspection apparatus and an inspection method for precisely detecting an amount of misalignment of a component mounted on a panel through an adhesive which contains conductive particles. The inspection apparatus detects an amount of misalignment, from a predetermined mounting position, of a component mounted on a surface of a panel through an ACF, and includes: a visible light camera ( | 08-05-2010 |
20100272347 | SYSTEMS AND METHODS FOR DYNAMIC ALIGNMENT BEAM CALIBRATION - A method for performing DA (Dynamic Alignment) beam calibration in a plasma processing system is provided. The method including acquiring a positional difference, the positional difference is acquired using an optical imaging approach. The optical imaging approach comprising of positioning the wafer on the end effector, taking a still image of the wafer on the end effector, processing the still image to ascertain the center of the wafer and an end effector-defined center defined by the end effector, and determining the positional difference between the center of the wafer and the end effector-defined center defined by the end effector. The method also includes centering a wafer with respect to an end effector by compensating for a positional difference between the wafer and the end effector with robot movement compensation. The method including moving the wafer and the end effector through DA beams associated with a plasma processing module. The method also includes obtaining a reference DA beam pattern by recording a break-and-make pattern of the DA beams. The break-and-make pattern occurring as the wafer and the end effector move through the DA beams. | 10-28-2010 |
20100303335 | Methods for Determining Inconsistency Characteristics of a Composite Structure - Methods for determining an inconsistency characteristic of a composite structure, such as inconsistency density-per-unit area. In one implementation, a method is disclosed for determining an inconsistency characteristic of a composite structure. The method involves determining a first distance from a first reference point of the composite structure to an inconsistency; determining a second distance from a second reference point of the composite structure to the inconsistency; using the first and second distances to establish a reference area of the composite structure; and considering each inconsistency detected within the reference area and producing therefrom an inconsistency characteristic representative of the composite structure. | 12-02-2010 |
20100310152 | SUBSTRATE SURFACE INSPECTING APPARATUS AND SUBSTRATE SURFACE INSPECTING METHOD - A substrate surface inspection apparatus and method enabling judgment and analysis of the state of even portions of a substrate supported by supports using a captured image are provided. A support mechanism | 12-09-2010 |
20100329541 | Pattern inspection method and apparatus - A color image of an inspection object is taken by an imaging means capable of taking a color image to obtain color information of an RGB color space. A gray-scale image of a color component of the RGB color space or another color space is generated, and the inspection object is detected by a pattern recognition technique. Alternatively, a binary image is generated from the generated gray-scale image, and the inspection object is detected by performing pattern recognition on the binary image. Color data of a pixel occupied by the detected inspection object is compared with color data of a non-defective inspection object which is previously prepared to judge whether or not the inspection object is defective. In addition, this judgment result is reflected in another manufacturing step through a network and product quality is improved. | 12-30-2010 |
20110058731 | Dual-sided substrate measurement apparatus and methods - An apparatus for measuring the relative positions of frontside and backside alignment marks located on opposite sides of a substrate is disclosed. The apparatus includes upper and lower optical systems that allow for simultaneous imaging of frontside and backside alignment marks. The frontside and backside alignment mark images are processed to determine the relative position of the marks, as a measurement of the alignment and/or overlay performance of the tool that formed the marks on the substrate. | 03-10-2011 |
20110085726 | Tunable Wavelength Illumination System - A lithographic apparatus has an alignment system including a radiation source configured to convert narrow-band radiation into continuous, flat and broad-band radiation. An acoustically tunable narrow pass-band filter filters the broad-band radiation into narrow-band linearly polarized radiation. The narrow-band radiation may be focused on alignment targets of a wafer so as to enable alignment of the wafer. In an embodiment, the filter is configured to modulate an intensity and wavelength of radiation produced by the radiation source and to have multiple simultaneous pass-bands. The radiation source generates radiation that has high spatial coherence and low temporal coherence. | 04-14-2011 |
20110096981 | Focus Finding And Alignment Using A Split Linear Mask - Disclosed is a method for determining a focus parameter for aligning a wafer (W) in an exposure tool ( | 04-28-2011 |
20110268346 | BACK-UP PIN DEVICE AND BACK-UP PIN PLACING METHOD AND DEVICE - A plurality of indicated back-up pin devices are detachably placed on a back-up plate provided on a component mounting apparatus, to a plurality of indicated positions of the back-up plate to support a board from an under surface thereof, to which already mounted components have been mounted, when another components are to be mounted on an upper surface of the board. The back-up pin device comprises a base portion detachably placed on the back-up plate, at least one support pin erected upright on the base portion to support the board by contacting an upper end thereof with an under surface of the board and at least one of an identification mark for identifying the type of the back-up pin device and a position mark as a reference to determine a position of the base portion on the back-up plate, which is provided on the base portion. | 11-03-2011 |
20110268347 | METHOD AND SYSTEM FOR ACCURATE ALIGNMENT AND REGISTRATION OF ARRAY FOR DNA SEQUENCING - In a genome sequencing system and methodology, a protocol is provided to achieve precise alignment and accurate registration of an image of a planar array of nanoballs subject to optical analysis. Precise alignment correcting for fractional offsets is achieved by correcting for errors in subperiod x-y offset, scale and rotation by use of minimization techniques and Moiré averaging. In Moiré averaging, magnification is intentionally set so that the pixel period of the imaging element is a noninteger multiple of the site period. Accurate registration is achieved by providing for pre-defined pseudo-random sets of sites, herein deletion or reserved sites, where nanoballs are prevented from attachment to the substrate so that the sites of the array can be used in a pattern matching scheme as registration markers for absolute location identification. Information can be extracted with a high degree of confidence that it is correlated to a known location, while at the same time the amount of information that can be packed on a chip is maximized. | 11-03-2011 |
20110268348 | FOCUSING METHOD AND APPARATUS - Methods and apparatus for placing wafers axially in an optical inspection system. A “best worst” focus method includes a series of through-focus images of a test wafer acquired using full field of view of the inspection optics. The value of the worst quality in each image is associated with the respective axial location, forming a locus of “worst” values as a function of axial location. The axial location is chosen which optimizes the locus, giving an axial location that provides the “best-worst” image quality. A “video focus” method includes a series of through-focus images generated using reduced field of view. A figure of merit is associated with each image, providing through-focus information. The “video focus” can be calibrated against the “best worst” focus. Further, a point sensor can be used to generate a single z-value for one (x,y) location that can be calibrated with “video focus”. | 11-03-2011 |
20110293168 | METHOD FOR MOUNTING TRANSPARENT COMPONENT - A transparent component locally includes one or both of a plurality of thick parts that have a large thickness in the vertical direction, and a plurality of thin parts that have a small thickness in the vertical direction. A component recognition camera captures an image of the transparent component held by a mount head, from above or below the transparent component, while a single spotlight or a plurality of spotlights are being irradiated onto the transparent component. | 12-01-2011 |
20120070067 | Method for Inspecting Overlay Shift Defect during Semiconductor Manufacturing and Apparatus Thereof - A method for inspecting overlay shift defect during semiconductor manufacturing is disclosed herein and includes a step for providing a charged particle microscopic image of a sample, a step for identifying an inspection pattern measure in the charged particle microscopic image, a step for averaging the charged particle microscopic image by using the inspection pattern measure to form an averaged inspection pattern measure, a step for estimating an average width from the averaged inspection pattern measure, and a step for comparing the average width with a predefined threshold value to determine the presence of the overlay shift defect. | 03-22-2012 |
20120288183 | ELECTRONIC PART RECOGNITION APPARATUS AND CHIP MOUNTER HAVING THE SAME - A method of operating a chip mounter is provided, comprising: preparing an electronic part on a part supply unit and a printed circuit board on a main body; gripping the electronic part using a part conveyor unit to move the electronic part along a part moving path on the part supply unit and the main body; photographing the electronic part when the electronic part is located at a part recognition region within the part moving path without stoppage and during the movement of the electronic part; transmitting a photographed image of the electronic part to a controller using the image processing unit; comparing the photographed image with a reference image using the controller; and displaying the photographed image to the exterior using the controller; wherein the part recognition region is set by at least one coordinate in the controller to be located on a light source of the processing unit. | 11-15-2012 |
20130039565 | SEMICONDUCTOR FAULT ANALYSIS DEVICE AND FAULT ANALYSIS METHOD - A failure analysis apparatus | 02-14-2013 |
20130044938 | MEASUREMENT SYSTEM USING ALIGNMENT SYSTEM AND POSITION MEASUREMENT METHOD - Disclosed herein are a system of measuring position information of a workpiece, such as a substrate (or a semiconductor wafer) using one or more alignment systems, and a position measurement method using the same. Positions of respective alignment systems are calculated using multiple fiducial marks (FMs) disposed on a fiducial alignment scope unit mark array (FAA) on a table, and positions of alignment marks (AMs) disposed on the workpiece are measured by moving the table so that the AMs are located within a field of vision (FOV) of the alignment system. The position information of the workpiece is measured using the position information of the alignment system and the position information of the FMs. | 02-21-2013 |
20130077851 | THREE DIMENSIONAL PATTERN INSPECTION SYSTEM - An inspection system of a printed substrate, the printed substrate at least includes a three-dimensional pattern, the system includes a light source, for emitting light beams toward the substrate, the light beams being substantially aligned when impinging on the substrate, an imager, for acquiring an image of the substrate, the image including a representation of the three-dimensional pattern and of the matter printed on the substrate and a processor, coupled with the light source and the imager, for processing the acquired image to determine the correctness of the three-dimensional pattern. | 03-28-2013 |
20130129189 | ROBUST INSPECTION ALIGNMENT OF SEMICONDUCTOR INSPECTION TOOLS USING DESIGN INFORMATION - A method of performing inspection alignment point selection for semiconductor devices includes importing, with a computer device, one or more semiconductor design files corresponding to an area of a semiconductor die; aligning a design taken from the one or more semiconductor design files with an image taken from a die of a semiconductor wafer; and selecting an alignment point and recording a portion of the design file corresponding to the alignment point as a master reference image. | 05-23-2013 |
20130148878 | ALIGNMENT METHOD FOR ASSEMBLING SUBSTRATES WITHOUT FIDUCIAL MARK - An alignment method for assembling substrates without fiducial mark is provided and has steps of: pre-defining at least two partially standard character regions; capturing at least two partially actual images of a first substrate; comparing to obtain at least two partially actual character regions; building an actual coordinate system of the first substrate; comparing the actual coordinate system with a coordinate system of a second substrate to obtain three types of offset values; moving the first substrate to a correct waiting position based on the offset values; ensuring if the first substrate is disposed at the correct waiting position; and stacking the first substrate with the second substrate to finish the alignment and installation. Thus, the alignment method of the present invention can be applied to to-be-installed substrates without any fiducial mark for alignment. | 06-13-2013 |
20130170735 | SCREEN PRINTING DEVICE AND SCREEN PRINTING METHOD - Prior to a mark imaging process executed for the purpose of detecting a position of recognition marks for positioning the substrate and the mask, an optical axis calibration processing process of detecting a horizontal relative position between imaging optical axes, and a surface correction data creation processing process of detecting a local positional deviation of the imaging optical axes, which is caused by the travel of the imaging unit, are executed. Before starting production, a production pre-start precision evaluation process for evaluating a substrate positioning precision is executed by using a verification substrate and a verification mask, and after starting the production, a production post-start precision evaluation process for evaluating a substrate positioning precision after starting the production is executed by using a commercial production substrate and a commercial production mask. | 07-04-2013 |
20130251238 | METHODS OF ALIGNING OBJECTS AND APPARATUSES FOR PERFORMING THE SAME - A method of aligning an object may include obtaining a first actual image of a first pattern on the object, setting the first actual image as a first reference image, obtaining a second actual image of a second pattern on the object, comparing the second actual image with the first reference image to obtain first relative position difference values of the second actual image with respect to the first reference image, and converting the first relative position difference values into first absolute position difference values with respect to a reference point on the object. | 09-26-2013 |
20140023265 | PATTERN MATCHING APPARATUS AND COMPUTER PROGRAM - It is an object of the present invention to provide a semiconductor inspection apparatus capable of well carrying out position alignment and correctly determining whether the position alignment has been carried out successfully or has ended in a failure without operator interventions even if an inspected image is an image having few characteristics as is the case with a repetitive pattern or the inspected image is an image having a complicated shape. | 01-23-2014 |
20140119638 | SYSTEM, METHOD AND COMPUTER PROGRAM PRODUCT TO EVALUATE A SEMICONDUCTOR WAFER FABRICATION PROCESS - Systems, methods and computer program products for computerized evaluation of a semiconductor wafer fabrication process are described. An exemplary method comprises receiving an SEM image of a printed semiconductor wafer area and a reference image reflecting a circuit design pattern, enhancing the SEM image to produce a feature image, and comparing the feature image to the reference image to determine whether the positions of the images are the same. Based upon this analysis, evaluation of the fabrication process used to print the circuit on the SEM image can be conducted in an efficient and uniform manner. | 05-01-2014 |
20140177941 | Optimal Patch Ranking for Coordinate Transform Estimation of Microscope Images from Sparse Patch Shift Estimates - A method of determining a coordinate transform between a first image and a second image, said method comprising the steps of: determining a rate of change of pixel values for locations on the first image to identify candidate alignment patches in the first image; specifying subsets of patches from the set of candidate alignment patches based on an error metric, selecting a subset of candidate alignment patches from said plurality of subsets of candidate alignment patches based upon a predetermined criterion; estimating, for each patch in the selected subset, a shift between the patch and a corresponding patch in the second image, the location of the corresponding patch in the second image being determined from the location of the patch in the first image; and determining the coordinate transform between the first image and second image based on the estimated shifts. | 06-26-2014 |
20140301631 | PLATELIKE WORKPIECE WITH ALIGNMENT MARK - A platelike workpiece having an alignment mark formed on the front side thereof and adapted to be recognized by an imaging unit included in an alignment apparatus for performing alignment. The platelike workpiece includes a plurality of direction indicating marks formed at given intervals so as to surround the alignment mark. Each of the direction indicating marks is pointed toward the alignment mark. The space of the direction indicating marks is set so that at least two of the plural direction indicating marks fall in the visual field of the imaging unit in viewing the platelike workpiece from the imaging unit. | 10-09-2014 |
20140307949 | METHOD FOR CORRECTING POSITION MEASUREMENTS FOR OPTICAL ERRORS AND METHOD FOR DETERMINING MASK WRITER ERRORS - A method is disclosed for correcting errors introduced by optical distortions or aberrations in the measured values of coordinates of targets of an array of targets, like for example structures on a wafer or a photolithography mask. The array of targets is placed into a field of view of an imaging system via which the coordinates are to be measured. The array of targets is placed at different relative positions with respect to the field of view, and for each relative position the coordinates of the targets relative to the array of targets are determined by measurements. From the results of these measurements an alignment function, giving a correction for optical errors as a function of the position in the field of view, is derived. The measured coordinates are corrected by the alignment function. The corrected coordinates can be used to identify registration errors of a mask writer. | 10-16-2014 |
20150043805 | IMAGE PROCESSING SYSTEM, IMAGE PROCESSING METHOD, AND COMPUTER-READABLE RECORDING MEDIUM - An image processing system includes: an image acquiring unit that acquires a plurality of pieces of image data of an imaging target; a preprocessing device that performs specified preprocessing on the plurality of pieces of image data acquired by the image acquiring unit; and a control device that has a post-processing unit for extracting image data to be measured from the plurality of pieces of image data processed by the preprocessing device and performing a measurement process according to a measurement item by using the extracted image data, holds the preprocessing device to communicate with each other, and outputs a measurement result acquired by the measurement process performed by the post-processing unit. | 02-12-2015 |
20150104095 | METHOD FOR EVALUATING BANDGAP DISTRIBUTIONS OF NANOWIRES - A method for evaluating bandgap distributions of nanowires is provided. First, a plurality of nanowires located on a surface of a substrate is provided. Second, a metal electrode on the surface and electrically connected to the plurality of nanowires is provided. Third, a SEM image is taken on the plurality of nanowires and the metal electrode. Fourth, the bandgap distributions of the plurality of nanowires are evaluated through the SEM image. | 04-16-2015 |
20150117755 | WAFER SLIP DETECTION DURING CMP PROCESSING - A wafer-slip detection apparatus used in association with a chemical mechanical polishing (CMP) apparatus may include an imaging device that generates images corresponding to at least an area of a rotation table of the CMP apparatus, and an image processing unit coupled to the imaging device for receiving and processing the generated images during a CMP process. The image processing unit includes a reference image that is compared with each of the generated images for detecting a wafer presence within the at least an area of the rotation table, whereby the detected wafer presence is indicative of a wafer-slip event. | 04-30-2015 |
20150125069 | METHOD AND SYSTEM FOR WAFER ALIGNMENT - A method for a system to generate a recipe for performing wafer alignment, includes: generating first and second alignment data sets, the first alignment data set including image information regarding a first site on a wafer and coordinates of characteristic points at the first site, and the second alignment data set including image information regarding a second site different than the first site on the wafer and coordinates of characteristic points at the second site; and saving the generated first and second alignment data sets as a recipe for wafer alignment; wherein the generating of the first alignment data set includes: selecting, as the first site, a site including a characteristic pattern on the wafer; determining first and second characteristic points at the selected site; and recording coordinates of the determined first and second characteristic points. | 05-07-2015 |
20150146969 | METHOD FOR DETECTING A STRUCTURE TO BE APPLIED TO A SUBSTRATE WITH A PLURALITY OF OPTICAL IMAGE ACQUISITION UNITS AND AN APPARATUS THEREFOR - A method and an apparatus are disclosed for detecting a structure to be applied to a substrate, such as an adhesive bead or a sealant track, with one or more optical acquisition apparatuses. The images from the optical acquisition apparatuses are combined to form a plan view such that a representation of the optical acquisition devices is output in a common image. The optical acquisition devices have, as a center, an application device for applying the structure to the substrate. | 05-28-2015 |
20150324964 | Inspection Recipe Setup from Reference Image Variation - Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer. | 11-12-2015 |
20150336275 | PRESENCE SENSING AND POSITION CORRECTION FOR WAFER ON A CARRIER RING - Embodiments of the invention include apparatuses and systems for determining the position of a carrier ring assembly supported by an end effector. In an embodiment, the position of the carrier ring assembly is determined by passing the carrier ring assembly through a plurality of through beam sensors. As the carrier ring passes through the sensors, a plurality of sensor transitions along points on the carrier ring assembly are detected. Each sensor transition indicates that one of the through beam sensors changed from an unblocked state to a blocked state, or changed from an blocked state to an unblocked state. The position of the end effector is recorded at each sensor transition and is associated with the sensor transition that caused the end effector position to be recorded. A position of the carrier ring assembly is then calculated from the plurality of sensor transitions and their associated end effector positions. | 11-26-2015 |
20160027164 | DETERMINING COORDINATES FOR AN AREA OF INTEREST ON A SPECIMEN - Methods and systems for determining coordinates for an area of interest on a specimen are provided. One system includes one or more computer subsystems configured for, for an area of interest on a specimen being inspected, identifying one or more targets located closest to the area of interest. The computer subsystem(s) are also configured for aligning one or more images for the one or more targets to a reference for the specimen. The image(s) for the target(s) and an image for the area of interest are acquired by an inspection subsystem during inspection of the specimen. The computer subsystem(s) are further configured for determining an offset between the image(s) for the target(s) and the reference based on results of the aligning and determining modified coordinates of the area of interest based on the offset and coordinates of the area of interest reported by the inspection subsystem. | 01-28-2016 |
20160078609 | METHOD FOR CORRECTING POSITION MEASUREMENTS FOR OPTICAL ERRORS AND METHOD FOR DETERMINING MASK WRITER ERRORS - A method for correcting optical errors occurring in coordinates of positions of a plurality of targets measured via an imaging system comprising a field of view. The plurality of targets includes a first array of targets and a second array of targets overlapping the first array of targets, and a portion of the plurality of targets are outside of the field of view. The method broadly includes the following steps: a) placing the first array of targets in the field of view of the imaging system; b) measuring coordinates of each target within the first array of targets repeatedly via the imaging system; c) placing the second array of targets in the field of view of the imaging system; d) measuring coordinates of each target within the second array of targets repeatedly via the imaging system; e) determining an alignment function from the measurement results of step b, step d, or steps b and d, the alignment function being a function of coordinates of the field of view of the imaging system and giving an additive correction for optical errors of the coordinates of positions of the plurality of targets measured by the imaging system; f) correcting the coordinates of the positions of the plurality of targets measured by the imaging system by adding the respective value of the alignment function at the field-of-view coordinates at which the coordinates of the position of the respective target were measured; and, g) obtaining a final result for the position of each target of the plurality of targets by averaging over the corrected coordinates found in step f for the respective target at each relative position of the plurality of targets and field of view of the imaging system. | 03-17-2016 |
20160078612 | ALIGNMENT APPARATUS - An alignment apparatus for aligning a wafer by optically detecting an alignment mark includes an imaging unit configured to image an imaging region extending across a circumferential edge of the wafer, an irradiation unit configured to irradiate light toward the imaging region, a reflection part configured to reflect toward the imaging region the light that is irradiated from the irradiation unit upwardly, and a control unit configured to detect the circumferential edge. The reflection part has a reflectance making a luminance difference between the outside of the wafer and the circumferential edge of the wafer in a luminance distribution pattern obtained by imaging the imaging region. The control unit detects the alignment mark and the circumferential edge based on the luminance distribution pattern. | 03-17-2016 |
20160082566 | WAFER SLIP DETECTION DURING CMP PROCESSING - A wafer-slip detection apparatus used in association with a chemical mechanical polishing (CMP) apparatus may include an imaging device that generates images corresponding to at least an area of a rotation table of the CMP apparatus, and an image processing unit coupled to the imaging device for receiving and processing the generated images during a CMP process. The image processing unit includes a reference image that is compared with each of the generated images for detecting a wafer presence within the at least an area of the rotation table, whereby the detected wafer presence is indicative of a wafer-slip event. | 03-24-2016 |
20160104275 | METHOD AND DEVICE FOR DETERMINING A LATERAL OFFSET OF A PATTERN ON A SUBSTRATE RELATIVE TO A DESIRED POSITION - A method for determining a lateral offset of a pattern on a substrate relative to a desired position with the steps: a) providing a plurality of measurement and simulation images of the pattern with equidistant defocus positions, b) forming a plurality of first and second pairs, which each has a measurement image and a simulation image, wherein each first pair has the same first focal distance and each second pair has the same second focal distance, being different from the first focal distance, of the defocus positions thereof, and determining a first and second lateral distance of the patterns for each first and second pair, respectively, c) determining a first and a second linear fit line based on the determined first and second lateral distances, respectively, and d) determining the lateral offset of the pattern on the substrate relative to the desired position using the linear fit lines of step c). | 04-14-2016 |
20160125589 | SYSTEM AND METHOD TO DETECT SUBSTRATE AND/OR SUBSTRATE SUPPORT MISALIGNMENT USING IMAGING - A method and apparatus for detecting substrate misalignment (i.e., position displacement error) and/or substrate support misalignment. According to certain aspects, a method for detecting a misalignment of an object in a processing system is provided. The method generally includes obtaining a first image of the object, determining first values associated with pixels in at least one region of the first image, calculating at least one of a center of gravity value of the pixels in the at least one region or an average weight of the pixels in the at least one region, and detecting a misalignment of the object based on at least one of the calculated center of gravity or average weight of the pixels in the at least one region. | 05-05-2016 |
20160189390 | SUBSTRATE TRANSPORT APPARATUS AND SUBSTRATE TRANSPORT METHOD - An apparatus for transporting a substrate includes a base, a holding device which retracts relative to the base and holds multiple substrates in multiple stages, respectively, a detection device including three detection components such that the three detection components are positioned to detect peripheries of the substrates held by the holding device from different positions, respectively, and a control device including circuitry which estimates a position of the substrates based on detection result of the detection device, calculates an amount of shifting between a base position and an estimated position of the substrates, determines whether a calculated amount of shifting is within a threshold value, and executes transport of the substrates held by the holding device when the calculated amount of shifting is determined to be within the threshold value. | 06-30-2016 |
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