Class / Patent application number | Description | Number of patent applications / Date published |
381175000 | Semiconductor junction microphone | 11 |
20090016550 | MEMS MICROPHONE AND METHOD FOR MANUFACTURING THE SAME - An MEMS microphone includes a casing ( | 01-15-2009 |
20090034760 | ELECTRONIC COMPONENT, FABRICATION METHOD FOR THE SAME AND ELECTRONIC DEVICE HAVING THE SAME - The electronic component includes: a fixed film; a vibration film facing the fixed film; a first electrode formed on the fixed film and having at least one first through hole in the center portion; and a second electrode formed on a portion of the vibration film corresponding to the first electrode and having at least one second through hole in the peripheral portion. An air gap communicating with the first and second through holes is formed between the fixed film and the vibration film and surrounded with a rib. At least one side hole is provided to extend in the rib surrounding the air gap from the air gap toward outside. | 02-05-2009 |
20090232336 | Component Comprising a MEMS Microphone and Method for the Production of Said Component - A component with a housing for a MEMS microphone is proposed that has a cavity with terminals arranged in the cavity, a sound inlet opening, and SMT contacts on an outer side. The MEMS chip installed in this housing closes the sound inlet opening from the inside and is connected by means of electrically conductive connections to the terminals of the housing. Opposite the electrically conductive connections, the MEMS chip is in mechanically intimate contact with the housing. The dimensioning of the housing relative to the MEMS chip allows the cavity at the sides of the MEMS chip to be used as an acoustic rear volume. | 09-17-2009 |
20100158281 | MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) MICROPHONE AND METHOD OF MANUFACTURING THE SAME - Provided are a micro-electromechanical systems (MEMS) microphone and a method of manufacturing the same. A manufacturing process is simplified compared to a conventional art using both upper and lower substrate processes. Since defects which may occur during manufacturing are reduced due to the simplified manufacturing process, the manufacturing throughput is improved, and since durability of the MEMS microphone is improved, system stability against the external environment is improved. | 06-24-2010 |
20110038493 | STRUCTURE WITH AN INTEGRATED CIRCUIT AND A SILICON CONDENSER MICROPHONE MOUNTED ON A SINGLE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A structure with an integrated circuit (IC) and a silicon condenser microphone mounted thereon includes a substrate having a first area and a second area. The IC is fabricated on the first area in order to form a conducting layer and an insulation layer. Both the conducting layer and the insulation layer further extend to the second area. The insulation layer is removed under low temperature in order to expose the conducting layer on which the silicon condenser microphone is fabricated. The silicon condenser microphone includes a first film layer, a connecting layer and a second film layer under a condition that the connecting layer connects the first and the second film layers. The first film layer and the second film layer act as two electrodes of a variable capacitance. | 02-17-2011 |
20110123053 | ACOUSTICS TRANSDUCER - According to an embodiment of the disclosure, an acoustics transducer is provided, which includes a support substrate having an upper surface and a lower surface, the upper surface including a first portion and a second portion surrounding the first portion, a recess extending from the upper surface towards the lower surface, the recess is between the first portion and the second portion of the upper surface, a vibratable membrane disposed directly on the recess, the vibratable membrane including a fixed portion fixed on the support substrate and a suspended portion, and a back plate disposed on the support substrate and opposite to the vibratable membrane. The suspended portion has an edge extending substantially along with an edge of an opening of the recess. The suspended portion is separated from the first portion and the second portion of the upper surface by an inner interval and an outer interval, respectively. | 05-26-2011 |
20130010990 | APPARATUS AND METHOD FOR DRIVING PARASITIC CAPACITANCES USING DIFFUSION REGIONS UNDER A MEMS STRUCTURE - A semiconductor microphone including a silicon substrate having a perimeter; an N-well diffused into the substrate at the perimeter; a deformable diaphragm disposed over at least a portion of the silicon substrate and in contact with at least a portion of the perimeter; and a signal channel in electrical communication with the diaphragm. The signal channel includes a microphone output channel and a feedback output channel. The diaphragm produces an electric signal on the signal channel in response to deformation of the diaphragm and a portion of the electric signal is transmitted on the feedback output channel to the N-well. | 01-10-2013 |
20140037116 | Method for Fabricating a Cavity Structure, for Fabricating a Cavity Structure for a Semiconductor Structure and a Semiconductor Microphone Fabricated by the Same - Embodiments show a method for fabricating a cavity structure, a semiconductor structure, a cavity structure for a semiconductor device and a semiconductor microphone fabricated by the same. In some embodiments the method for fabricating a cavity structure comprises providing a first layer, depositing a carbon layer on the first layer, covering at least partially the carbon layer with a second layer to define the cavity structure, removing by means of dry etching the carbon layer between the first and second layer so that the cavity structure is formed. | 02-06-2014 |
20150043759 | MICROPHONE, ACOUSTIC SENSOR, AND METHOD OF MANUFACTURING ACOUSTIC SENSOR - A microphone has a package, and an acoustic sensor, an under surface of which is fixed to an inner face of the package. The acoustic sensor has a substrate having a plurality of hollows penetrating the substrate from a top surface to an under surface, and a capacitor structure made by a movable electrode plate and a fixed electrode plate disposed above each of the hollows. A package sound hole is opened in the package in a position opposed to the under surface of the acoustic sensor. A dent which is communicated with each of the hollows and open below the under surface side of the substrate is formed below the under surface of the substrate. A height of the dent measured from the under surface of the substrate is equal to or less than half of a height of the hollow. | 02-12-2015 |
20150125007 | PACKAGED MICROPHONE WITH FRAME HAVING DIE MOUNTING CONCAVITY - A packaged microphone has a lid structure with an inner surface having a concavity, and a microphone die secured within the concavity. The packaged microphone also has a substrate coupled with the lid structure to form a package having an interior volume containing the microphone die. The substrate is electrically connected with the microphone die. In addition, the packaged microphone also has aperture formed through the package, and a seal proximate to the microphone die. The seal acoustically seals the microphone and the aperture to form a front volume and a back volume within the interior volume. The aperture is in acoustic communication with the front volume. | 05-07-2015 |
20150146894 | SEMICONDUCTOR DEVICE AND A METHOD FOR FORMING A SEMICONDUCTOR DEVICE - A semiconductor device includes a microphone module implemented on a first semiconductor die and a signal processing module implemented on a second semiconductor die. The microphone module includes a movable microphone element arranged at a main side of the first semiconductor die and the second semiconductor die is mounted to the main side of the first semiconductor die. | 05-28-2015 |