Entries |
Document | Title | Date |
20080232629 | Boundary microphone - In a boundary microphone, a high-frequency current caused by extraneous electromagnetic waves is prevented from flowing into a microphone case via a microphone cord that is drawn into the microphone case. A portion in which the microphone cord | 09-25-2008 |
20080267439 | CONDENSER MICROPHONE - A condenser microphone includes: a casing including a sound hole; a vibration film disposed in the casing so as to face the sound hole; a back plate disposed opposed to the vibration film; a spacer disposed between the vibration film and the back plate; and a hold member including a spring member. The back plate has an outer peripheral shape that is smaller than an inner peripheral shape of the casing so as to provide a clearance between an outer peripheral surface of the back plate and an inner peripheral surface of the casing. The back plate is held by the hold member from an opposite side of the vibration fills. | 10-30-2008 |
20080279407 | Mems Microphone, Production Method and Method for Installing - A microphone in a miniaturized form is described herein. The microphone includes a flat carrier substrate having a first recess extending through the carrier substrate. The microphone includes a first electro-acoustic transducer on a first surface of the carrier substrate and at least partially overlapping the first recess. The microphone also includes a cap on a second surface opposite the first surface having a tight seal with the second surface and spanning the first recess. The cap includes at least one metallic layer for electromagnetic shielding. | 11-13-2008 |
20080310662 | Earpiece snoring sound transmitter - The present invention is a battery-powered, Bluetooth-enabled wireless earpiece with a microphone mounted for use inside the wearer's ear canal. Its intended purpose is to transmit sounds such as snoring, generated in the user's upper airway, to a separate device for recording and/or sound analysis. In particular, the present invention is composed of a small housing that fits to all or part of the user's external ear, with a microphone that fits inside the external ear canal. An earplug sandwiched between the microphone and the housing insulates the microphone from noises generated in the outside environment. The housing of the present invention contains on the inside a rechargeable battery and Bluetooth chip, as well as necessary wiring. On its surface, the housing has an ear support piece, an on/off switch, an indicator LED, and an adaptor jack for connection to a battery charger or power cord. | 12-18-2008 |
20080310663 | Microphone package adapted to semiconductor device and manufacturing method therefor - A microphone package includes a sound detection unit, which further includes a microphone chip for detecting sound and a control circuit for controlling the microphone chip, a substrate having a mount surface for mounting the microphone chip and the control circuit and a ring-shaped side wall, which projects upwardly from the mount surface so as to surround the sound detection unit, and a cover that is arranged above the substrate so as to form a hollow cavity with the mount surface and the ring-shaped side wall of the substrate. A sound hole establishing communication between the cavity and the external space is formed in a prescribed position of the substrate or the cover, wherein a recess or a projection is formed inside of the cover. A directional regulator is formed in the housing so as to block excessive pressure variations and environmental factors from being directed to the microphone chip. | 12-18-2008 |
20090003640 | Microphone Array With Rear Venting - Microphone arrays (MAs) are described that position and vent microphones so that performance of a noise suppression system coupled to the microphone array is enhanced. The MA includes at least two physical microphones to receive acoustic signals. The physical microphones make use of a common rear vent (actual or virtual) that samples a common pressure source. The MA includes a physical directional microphone configuration and a virtual directional microphone configuration. By making the input to the rear vents of the microphones (actual or virtual) as similar as possible, the real-world filter to be modeled becomes much simpler to model using an adaptive filter. | 01-01-2009 |
20090022350 | Acoustic Vibration Sensor - An acoustic vibration sensor, also referred to as a speech sensing device, is provided. The acoustic vibration sensor receives speech signals of a human talker and, in response, generates electrical signals representative of human speech. The acoustic vibration sensor includes at least one diaphragm positioned adjacent to a front port and at least one coupler. The coupler couples a first set of signals to the diaphragm while isolating the diaphragm from the second set of signals. The coupler includes at least one material with acoustic impedance matched to the acoustic impedance of human skin. | 01-22-2009 |
20090052713 | WIRELESS MICROPHONE SYSTEM - A wireless microphone transmitter | 02-26-2009 |
20090067659 | Miniature microphone assembly with hydrophobic surface coating - A miniature microphone assembly comprises a capacitive-microphone transducer, a microphone carrier, and an integrated circuit die. The capacitive-microphone transducer includes a microphone-electrical contact or terminal. The microphone carrier comprises a carrier electrical contact or terminal formed on a first surface of the microphone carrier. An integrated circuit die includes a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a hydrophobic layer or coating. The side surfaces of the integrated circuit die and/or the capacitive-microphone transducer may also include the hydrophobic layer or coating. | 03-12-2009 |
20090080682 | ELECTRET CONDENSER MICROPHONE - An electret condenser microphone includes: a substrate | 03-26-2009 |
20090087009 | MICROPHONE ASSEMBLY WITH A REPLACEABLE PART - The invention relates to a microphone assembly comprising a housing, a microphone element within the housing, a base element, contacting elements, a removable element, and connecting means. The housing is configured such that it may be opened and re-closed. The base element is positioned inside the housing and comprises one or more first electrical conductors. The base element comprises one or more first conducting surface parts connected to one or more of the first conductors. The contacting elements facilitate electrical contact between one or more of the first conductors and one or more conductors positioned outside the housing. The removable element is positioned within the housing and comprises one or more second electrically conductive surface parts. The connecting means provides an easily breakable/removable electrical connection between a first surface part and a second surface part. | 04-02-2009 |
20090097686 | BOUNDARY MICROPHONE - A boundary microphone, comprising: a base made of a metal; a cover made of a metal having a plurality of holes for introducing sound waves; and internal components including a microphone unit that is disposed in an internal space enclosed by the base and the cover; a first metallic part disposed on one side of the upper and lower sides of the internal components; and a second metallic part, which is disposed on other side of the upper and lower sides of the internal components and which encloses the internal components along with the first metallic part from all directions, are provided, wherein the base, the cover, the first metallic part, and the second metallic part are alternately overlapped at their peripheral portions, and wherein at least one of the first metallic part and the second metallic part is made of a metallic mesh. | 04-16-2009 |
20090116674 | Microphone - A microphone includes a casing. A circuit board is mounted in the casing. The circuit board includes an audio conversion unit and a switch mounted thereon. Activation of the switch controls on/off the audio conversion unit. A mounting member is securely mounted in the casing. The mounting member includes a plurality of holes and a plurality of returning members monolithically formed thereon. A lid includes a plurality of hooks engaged with the respective holes of the mounting member. The lid can be moved for activation of the switch and can be urged to its original position by the plurality of returning members. | 05-07-2009 |
20090154752 | CONDENSER MICROPHONE - An exemplary condenser microphone includes a printed circuit board, a first via, a second via, and a number of through holes. The first and second vias are formed in the printed circuit board for the signal line and ground line respectively passing therethrough. The through holes are formed surrounding the first and second vias. Inner walls of the through holes are coated with a conductive material. | 06-18-2009 |
20090154753 | Dynamic microphone - There is provided a dynamic microphone in which the output impedance does not increase and also the failure rate does not increase though using a microphone unit and a vibration detecting unit to reduce handling noise. In the dynamic microphone including a microphone unit | 06-18-2009 |
20090169042 | ELECTRONIC ANTI-SABOTAGE MICROPHONE GROMMET - A tamper detection apparatus includes a housing defining an internal cavity. A sensing device embodied as a microphone is positioned within the internal cavity of the housing, which may also be a protective grommet. A conductive element spans the internal cavity and is positioned in front of the microphone. The conductive element initiates a fault signal when a specified electrical condition is met to indicate a tampering or an attempted tampering with the microphone. | 07-02-2009 |
20090169043 | Microphone Housing - One embodiment of a microphone housing having at its base a cylindrical solid section ( | 07-02-2009 |
20090175477 | Vibration transducer - A vibration transducer (e.g. a condenser microphone) having a high sensitivity is constituted of a housing composed of an airtight material having a through-hole, a vibration conversion die (e.g. a microphone die) which is attached to the interior surface of the housing at the prescribed position embracing the through-hole in plan view, and a barrier diaphragm composed of an airtight material whose external periphery is attached to the exterior surface of the housing in an airtight manner oppositely to the prescribed position. The barrier diaphragm has a vibration area which is larger than the sectional area of the through-hole. A space allowing the barrier diaphragm to vibrate is formed between the barrier diaphragm and the exterior surface of the housing, wherein the distance between the barrier diaphragm and the exterior surface of the housing can be gradually reduced from the vibration axis to the external periphery. | 07-09-2009 |
20090252364 | VOICE SIGNAL TRANSMITTING/RECEIVING APPARATUS - A voice signal transmitting/receiving apparatus includes: a device body; a speaker array arranged in the device body and including a plurality of arrayed speaker units; and a microphone array arranged in the device body and including a plurality of arrayed microphones. By thus integrating the speaker array and the microphone array, it is possible to improve the operability of a user, to acquaint the user relatively easily with the error in the set position and to make the device compact. | 10-08-2009 |
20090257613 | Microphone Screen With Common Mode Interference Reduction - A microphone assembly includes a microphone composed of a case having an open end and a printed circuit board. The printed circuit board is disposed in the open case end. The microphone assembly further includes a metal screen coupled to the case over the printed circuit board for shielding the microphone from electromagnetic interference. The metal screen includes several apertures. | 10-15-2009 |
20090257614 | PACKAGE FOR MICRO-ELECTRO-MECHANICAL ACOUSTIC TRANSDUCER WITH IMPROVED DOUBLE SIDE MOUNTABLE ELECTRODES - A surface mountable package includes a base and a cover with a cavity defined thereby, and an acoustic transducer unit received in the cavity. The cover includes a first metal ring to enclose the acoustic transducer unit. The base includes a second metal ring to press against the first metal ring in order to form a metal shielding area. First and second metal connecting paths are formed electrically connected to the metal shielding area and the acoustic transducer unit, respectively. Besides, two pairs of first and second surface mountable metal electrodes are electrically connected to the first and the second metal connecting paths, respectively. As a result, the package can be selectively double surface mountable to a user's circuit board via the metal electrodes of the base or the metal electrodes of the cover. | 10-15-2009 |
20090290740 | MICROPHONE UNIT AND METHOD OF MANUFACTURING THE SAME - A microphone unit includes a microphone substrate. A plurality of diaphragm units are disposed on the microphone substrate. Each of the diaphragm units includes a diaphragm. A plurality of partition walls are disposed on the microphone substrate. Each of the partition walls surrounds the diaphragm so as to define a first area. A signal processor is disposed at a second area outside the first area and is configured to process signals output from the diaphragm units. | 11-26-2009 |
20090304219 | MICROPHONE ASSEMBLY AND A PORTABLE ELECTRONIC DEVICE USING THE MICROPHONE ASSEMBLY - A microphone assembly ( | 12-10-2009 |
20090310810 | MEMS MICROPHONE PACKAGE WITH RF INSENSITIVE MEMS MICROPHONE CHIP - A micro-electro-mechanical-system microphone package includes a substrate, a micro-electro-mechanical-system microphone chip mounted on the substrate, and a cover attached to the substrate to cover the micro-electro-mechanical-system microphone chip. The cover is provided with a sound inlet through which the micro-electro-mechanical-system microphone receives external sound. The micro-electro-mechanical-system microphone chip includes a conductive base connected to a constant voltage, a shielding layer supported by the conductive base and connected to the constant voltage, a diaphragm disposed between the conductive base and the shielding layer, and a back plate also disposed between the conductive base and the shielding layer. | 12-17-2009 |
20100027830 | CHIP-SCALED MEMS MICROPHONE PACKAGE - An MEMS microphone package includes a circuit board and an MEMS microphone chip. The MEMS microphone chip, mounted on the circuit board, includes a substrate, an MEMS transducer formed on the substrate, and a readout circuit also formed on the substrate. The MEMS transducer generates a sound signal according to sound pressure variations. The readout circuit reads the sound signal from the MEMS transducer. | 02-04-2010 |
20100034412 | LIP SHIELD FOR MICROPHONES - A lip shield or block is attachable to a microphone and is sized to block or shield the lips of the user from being viewed by third parties when the user is speaking into the microphone. | 02-11-2010 |
20100034413 | MICROPHONE DEVICE - A microphone device includes an enclosure, a nontransparent supporter, a light source, an annular-shaped optical sensor, a lens and a vibrating membrane. The enclosure has a bottom portion and a sidewall extending from the bottom portion. An opening is defined in the enclosure and opposite to the bottom portion. A nontransparent supporter is enclosed in the enclosure and positioned on the bottom portion. A passage is defined in the supporter, and has a first aperture and a second aperture at two opposite ends. The first aperture is adjacent to the bottom portion. The light source is positioned on the bottom portion, received in the passage and adjacent to the first aperture. The optical sensor is positioned on the supporter. The lens is received in the optical sensor and positioned on the supporter and covers the second aperture. The vibrating membrane is supported on the sidewall. | 02-11-2010 |
20100054515 | MICROPHONE - There is provided a microphone ( | 03-04-2010 |
20100092020 | Microphone Having Multiple Transducer Elements - A microphone is provided. The microphone has a housing; an acoustic port located in the housing; a substrate coupled with the housing; an integrated circuit positioned onto the substrate; and two or more MEMS transducers mounted on the substrate wherein the transducers are connected in parallel. | 04-15-2010 |
20100135514 | MICROPHONE - There is provided a microphone comprising a housing ( | 06-03-2010 |
20100142744 | BOARD MOUNTING OF MICROPHONE TRANSDUCER - A portable communication device assembly comprising a housing and a PCB provided therein. A microphone is provided at least partly within an aperture in the PCB, which aperture is positioned adjacent to a sound input of the housing. The microphone may be attached to a carrier element also attached to the PCB, and additional electronic components may be attached to the carrier element. Acoustic and/or electromagnetic shielding may be provided. | 06-10-2010 |
20100177922 | CONDENSER MICROPHONE USING THE CERAMIC PACKAGE WHOSE INSIDE IS ENCOMPASSED BY METAL OR CONDUCTIVE MATERIALS - A condenser microphone comprising a substrate disposed on a micro electro mechanical system (MEMS) microphone chip and a circuit part; a package having a ring shape disposed on the substrate with the package surrounding the MEMS microphone chip and the circuit part; an insertion part having a ring shape formed of a conductive material, the insertion part being attached to an inner wall of the package; and an upper plate completely covering the package, wherein the package or the upper plate has an acoustic hole through which sound passes. | 07-15-2010 |
20100208929 | MICROPHONE HAVING REAR PHASE REJECTION COLLECTION TUBE - A microphone includes an annular gap between the inner cylindrical housing and the outer tubular shell such that the undesired acoustical signals entering the microphone from the side and rear flow into and through the annular gap. The signals are ported through a phase reversal entrance circumferentially surrounding a magnet assembly and impact the diaphragm such that the undesired acoustical signals entering the front of the microphone are substantially cancelled out by undesired acoustical signals originating from the side and rear. | 08-19-2010 |
20100290660 | VIBRATION PICKUP MICROPHONE - To provide a microphone used for telecommunication or speech recognition input in a high noise environment, or more specifically, a vibration pickup microphone that hardly howls even when transmission and reception occur simultaneously. A vibration pickup microphone has: a housing | 11-18-2010 |
20100303271 | SILICON MICROPHONE PACKAGE - A silicon microphone package is provided, including an integrated microphone die having opposing first and second surfaces, a first cover member formed over the first surface of the integrated microphone die to form a first chamber therebetween, and a second cover member formed over the second surface of the integrated microphone die to form a second chamber therebetween. | 12-02-2010 |
20100322450 | BOUNDARY MICROPHONE - A boundary microphone includes: a metal mesh; a base made of metal; a cover made of metal on which a plurality of holes through which a sound wave is passed is formed; and a microphone unit that is installed on the base and converts sound into an electrical signal. The metal mesh is welded onto the base with a metal material of the base entering a space of the metal mesh. The microphone unit is covered by the metal mesh. | 12-23-2010 |
20110007924 | Microphone - Thus there is provided a microphone ( | 01-13-2011 |
20110013799 | WATERPROOF MICROPHONE - A waterproof microphone includes a transducer unit defining a sound receiving opening, a first waterproof layer fully covering the sound receiving opening, and a second waterproof layer spaced from the first waterproof layer for forming a closed decompression chamber. | 01-20-2011 |
20110019856 | BOUNDARY MICROPHONE - A boundary microphone including: a base made of metal; a cover that is made of metal and has a plurality of holes through which a sound wave is guided; a microphone unit that is disposed on the base and converts sound into an electric signal; and a pressing material that presses the cover against the base. The cover has a flange portion on a peripheral portion. The pressing material presses the flange portion of the cover against the base make the flange portion of the cover surface to surface contact with the base. | 01-27-2011 |
20110026752 | MINIATURE MICROPHONE, PROTECTION FRAME THEREOF AND METHOD FOR MANUFACTURING THE SAME - A miniature microphone is provided. In one embodiment, the miniature microphone comprises: a circuit board substrate at the upper part of the miniature microphone, wherein a plurality of contact pads are configured at prescribed positions on one side of the circuit board substrate and one or more electrical components are installed on the other side thereof; a protection frame with a cavity in the central portion thereof, wherein one or more components are installed inside the cavity, the outer side of the protection frame forms the body portion, a first metal shielding layer is provided on the inner surface of the body portion, and an insulating mechanism is provided on the inner side of the first metal shielding layer, which enables the one or more components to be electrically insulated from the first metal shielding layer; and a bottom plate, wherein one or more sound holes are provided in the central portion thereof for passing sound, and a second metal shielding layer is provided on the whole surface of the side of the bottom plate coming into contact with the protection frame. Since a metal shielding layer and an insulating mechanism are provided on the inner side the protection frame of the miniature microphone, the electromagnetic shielding effect is good, meanwhile, an inner short circuit can be prevented in the miniature microphone. Besides, the production costs are low and the manufacturing process is simple. | 02-03-2011 |
20110038501 | RIBBON MICROPHONE UNIT AND RIBBON MICROPHONE - A ribbon microphone unit includes a permanent magnet that forms a magnetic field and a ribbon diaphragm that is disposed in the magnetic field and vibrates upon receiving a sound wave. An elastic layer made of synthetic resin is formed at least at a portion of the ribbon diaphragm, the portion vibrating upon receiving the sound wave. Preferably, the ribbon diaphragm is formed into triangular waves with the portion vibrating upon receiving sound waves being alternately folded along lines in a width direction across the entire length. The elastic layer may be formed on one or both surfaces of the ribbon diaphragm and may be provided only at both side ends of the ribbon diaphragm. | 02-17-2011 |
20110038502 | Electret Capacitor Microphone with One-Piece Vocal Cavity Component - An electret capacitor microphone with one-piece vocal cavity component includes; a shell, a vibration element and a circuit board which is used to envelop the shell containing cavity and connect with the shell; the first vocal cavity is formed between the vibration element and the inner surface of the top of the shell; voice holes are connected with the first vocal cavity; wherein, one-piece vocal component that lies between the vibration element and circuit board is installed in the shell. The one-piece vocal cavity component is formed by an annular sidewall and a cavity board formed in one-piece on the annular sidewall. A through-hole is formed on the cavity board and inner concave at lower end of an annular sidewall. The second vocal cavity is formed between the annular sidewall and the cavity board. An external surface of the annular sidewall is coated with an insulating material layer. | 02-17-2011 |
20110103633 | CAPACITOR MICROPHONE UNIT AND CAPACITOR MICROPHONE - Electro-acoustic converters each include a diaphragm, and a fixed electrode apart from the diaphragm for a certain distance and facing the diaphragm. The electro-acoustic converters are anteroposteriorly disposed on the same axis in a single casing, and are electrically connected in series. The front and rear converters each include impedance converters, and are serially connected with each other together with the impedance converters. | 05-05-2011 |
20110110550 | Microphone with Variable Low Frequency Cutoff - A microphone system has a package with an interior, a MEMS microphone within the package interior and forming a backvolume between it and the package interior, and a MEMS valve coupled with at least one input aperture in the package. The package defines at least one input aperture (e.g., the prior noted aperture) for receiving an acoustic signal, and the MEMS microphone is mechanically coupled to at least a portion of one input aperture. The valve has a valve opening generally circumscribed by a valve seat. The valve is considered as having an open mode for permitting acoustic signal access into the package interior through the valve opening, and a closed mode for substantially preventing acoustic signal access into the package interior through the valve opening. The valve has a movable member configured to contact the valve seat when in the closed mode. This movable member is configured to move between the open mode and the closed mode in a direction that is generally perpendicular to the valve seat. | 05-12-2011 |
20110116671 | AUDIO DEVICE COMPRISING A MICROPHONE - An audio device includes a microphone, a sound canal allowing sound to pass from the surroundings to the microphone, a signal path from the microphone to a receiver, and a current source, such that sounds received at the microphone may be enhanced and presented at the ear level of the user. A protection screen is provided at the sound canal, and includes a first surface which faces the surroundings and a second surface which faces the sound canal, and defines a slit-formed opening between the first surface and the second surface. The curvature between the first surface and the slit-formed opening is smooth and gradual, and a sharp edge is located at the transition between the second surface and the slit-formed opening. | 05-19-2011 |
20110158449 | Microphone Unit - A microphone unit ( | 06-30-2011 |
20110158450 | MICROPHONE UNIT - To provide a downsized microphone unit in which a differential microphone is densely mounted thereon. | 06-30-2011 |
20110158451 | Close-Talking Capacitor Microphone - A close-talking capacitor microphone includes: a capacitor microphone unit including a diaphragm, a diaphragm holder to which the diaphragm is attached, a fixed electrode, a printed circuit board, an insulating base on the rear side of the fixed electrode, and a unit casing; a microphone casing fixing the capacitor microphone unit therein and provided with a sound-wave guidance hole; and a shielded wire through which a sound signal is communicated. The unit casing has an opening on a peripheral side surface at a portion between the front side of the printed circuit board and the rear side of the fixed electrode with regard to the height direction. The unit casing has a space that communicates the opening to the printed circuit board. The shielded wire is inserted through the opening on the peripheral side surface of the unit casing to be connected to the printed circuit board. | 06-30-2011 |
20110170726 | MICROPHONE UNIT, CLOSE-TALKING TYPE SPEECH INPUT DEVICE, INFORMATION PROCESSING SYSTEM, AND METHOD FOR MANUFACTURING MICROPHONE UNIT - A microphone unit | 07-14-2011 |
20110176698 | Differential Microphone - A differential microphone includes a housing having a first space and a second space formed therein, and a first diaphragm arranged within the housing. A first opening connecting the first space to outside and a second opening connecting the second space to the outside are formed in the housing. A dimension of the first opening and the second opening in a first direction perpendicular to a straight line passing through centers of both openings is longer than a dimension of the first opening and the second opening in a second direction parallel to the straight line passing through the centers of both openings. | 07-21-2011 |
20110222717 | SEMICONDUCTOR DEVICE AND MICROPHONE - The semiconductor device has a simplified structure which includes a package structure in which a member for mounting a semiconductor element is separate from a member including a signal input/output unit. A microphone package is configured with a cover and a substrate. A microphone chip and a circuit element are adhered and fixed to a top surface of a recess formed in the cover. A plurality of bonding pads are arranged on the lower surface of the cover on the outer side of the recess. A bonding wire is connected to the circuit element and the bonding pad. The substrate includes a signal input/output terminal serving as the signal input/output unit, and a connection electrode, conducted with the signal input/output terminal, is arranged facing the bonding pad on the upper surface of the substrate. The substrate, cover, connection electrode, and bonding pad are joined with a conductive member. | 09-15-2011 |
20110235841 | MICROPHONE UNIT - A microphone unit includes a case; a diaphragm arranged inside the case; and an electric circuit unit that processes an electric signal generated in accordance with vibration of the diaphragm. The case has a first sound introducing space that introduces a sound from outside of the case to a first surface of the diaphragm via a first sound hole; and a second sound introducing space that introduces a sound from outside of the case to a second diaphragm, via a second sound hole. A resonance frequency of the diaphragm is set in the range of ±4 kHz based on the resonance frequency of at least one of the first sound introducing space and the second sound introducing space. | 09-29-2011 |
20110249852 | WIRELESS MICROPHONE - A wireless microphone includes a grip that includes a barrel. The barrel includes a barrel body that is configured with a battery receiving space and that has one side formed with a cutout for access to the battery receiving space. The grip further includes a lid coupled to the barrel body and operable to a closing state for closing the cutout. The grip also includes an external thread formed on the barrel and the lid and constituted by a first thread part on the barrel and a second thread part on the lid. The wireless microphone further includes a retainer configured for threaded connection to the external thread to retain the lid in the closing state. | 10-13-2011 |
20110255728 | SOUND-TRANSMITTING MEMBRANE FOR MICROPHONE, SOUND-TRANSMITTING MEMBRANE MEMBER FOR MICROPHONE PROVIDED WITH THE MEMBRANE, MICROPHONE, AND ELECTRONIC DEVICE PROVIDED WITH MICROPHONE - The present invention provides a sound-transmitting membrane for a microphone, to be disposed to a sound-collecting opening of the microphone so as to allow sound to transmit through the membrane while preventing a foreign matter from entering into the microphone through the opening. This membrane for a microphone prevents the entry of a foreign matter, such as fine dust and water vapor, that is difficult for conventional sound-transmitting membranes to block, and ensures the microphone performance. This membrane for a microphone is composed of a nonporous film or a multilayer membrane including a nonporous film, has a surface density of 30 g/m | 10-20-2011 |
20110261987 | Condenser Microphone - A condenser microphone includes a housing ( | 10-27-2011 |
20110286619 | Ribbon transducer with improved distortion characteristics - A ribbon-type electroacoustic transducer with improved electrical, electromechanical, electromagnetic characteristics is described. | 11-24-2011 |
20110293126 | MICROPHONE - A miniaturized microphone maintaining the properties of a microphone chip and achieving a smaller mounting area. The microphone includes a package which includes a first and second member. At least one of the first second members includes a recess. The microphone also includes a circuit element installed on an inner surface of the first member. Additionally, the microphone includes a microphone chip arranged on a surface on an opposite side of an installing surface of the circuit element. | 12-01-2011 |
20120057737 | Hybrid Acoustic/Electric Signal Converting Device - This disclosure is directed to implementing a measure of additionally including and installing a load register connected to a circuit chip in a printed circuit board so that the corresponding circuit chip may normally obtain and receive a series of operation powers by using the load register included in the printed circuit board; and a measure of additionally installing a ground terminal, a signal output terminal and a power receiving terminal to a joining portion of a printed circuit board joined to the circuit board of the electronic device, and electrically connecting both of the signal output terminal and the power receiving terminal to the load register and the circuit chip in the printed circuit board so that the corresponding load register and the circuit chip may normally obtain the operation power supplied from the electronic device by indirectly using the output signal receiving terminal and the signal output terminal. | 03-08-2012 |
20120063628 | SOUND REPRODUCTION SYSTEMS AND METHOD FOR ARRANGING TRANSDUCERS THEREIN - Loudspeaker system including a housing and at least four transducers arranged therein. Each transducer includes a substantially circular diaphragm and the diaphragms are constructed with specific sizes such that the ratio of a diameter of each diaphragm to the diameter of an immediately larger diaphragm is between 1:1 and 1:Phi | 03-15-2012 |
20120063629 | Microphone having flexible pipe - There is provided a microphone having a flexible pipe, which has a configuration capable of preventing both of the occurrence of noise caused by extraneous electromagnetic waves and the occurrence of noise caused by electric discharge when touched. In a unit holder | 03-15-2012 |
20120076338 | Microphone Screen With Common Mode Interference Reduction - A microphone assembly includes a microphone composed of a case having an open end and a printed circuit board. The printed circuit board is disposed in the open case end. The microphone assembly further includes a metal screen coupled to the case over the printed circuit board for shielding the microphone from electromagnetic interference. The metal screen includes several apertures. | 03-29-2012 |
20120106769 | Filter Circuit For An Electret Microphone - A miniature electret microphone includes a housing, a back plate/diaphragm assembly, an integrated circuit and a filter circuit. The housing for the microphone includes a sound inlet port. The back plate/diaphragm assembly is disposed within the housing and the assembly has an output responsive to sound pressure incident on the diaphragm. The integrated circuit includes a floating ground substrate and a p-n junction disposed within the housing coupled to the output. The filter circuit is formed within the integrated circuit, the filter circuit including a capacitor formed by the p-n junction. | 05-03-2012 |
20120163646 | WIRELESS MICROPHONE - A wireless microphone includes a barrel that includes a grip having top and bottom ends. The barrel further includes a battery accommodating section connected to the bottom end of the grip. The battery accommodating section has at least one battery seat formed with an outward opening and configured for receiving and electrically connecting to a battery, and is formed with an accommodation space disposed adjacent to the at least one battery seat. The wireless microphone further includes a battery cap removably sleevable over the battery accommodating section, and an audio pick-up unit mounted to the top end of the grip and configured to pick-up a sound signal. In addition, the wireless microphone includes a circuit unit that includes a control circuit board and an antenna. | 06-28-2012 |
20120201409 | HIDDEN MICROPHONES FOR A MOBILE COMPUTING DEVICE - A mobile computing device is disclosed. The mobile computing device comprises a first housing segment and a second housing segment that are slideably coupled to each other so that the mobile computing device can be in an extended position or a contracted position. The second housing segment includes a section that is overlaid by the first housing segment regardless of whether the mobile computing device is in the extended position or the contracted position. The mobile computing device also includes two microphones. A first microphone is provided with the second housing segment and is exposed to an opening of the second housing segment. A second microphone is provided at the overlaid section. | 08-09-2012 |
20120201410 | MICROPHONE UNIT, CLOSE-TALKING VOICE INPUT DEVICE, INFORMATION PROCESSING SYSTEM, AND METHOD OF MANUFACTURING MICROPHONE UNIT - A microphone unit includes: a housing which has an inner space; a partition member which is provided in the housing and divides the inner space into a first space and a second space, the partition member being at least partially formed of a diaphragm; and an electrical signal output circuit which outputs an electrical signal based on vibrations of the diaphragm. In the housing, a first through-hole through which the first space communicates with an outer space of the housing and a second through-hole through which the second space communicates with the outer space are formed. | 08-09-2012 |
20120207334 | Microphone Having Multiple Transducer Elements - A microphone is provided. The microphone has a housing; an acoustic port located in the housing; a substrate coupled with the housing; an integrated circuit positioned onto the substrate; and two or more MEMS transducers mounted on the substrate wherein the transducers are connected in parallel. | 08-16-2012 |
20120237071 | SHIELDED MICROPHONE FOR MOBILE COMMUNICATIONS DEVICE - A shielded microphone, and method for shielding a microphone, are provided for use in a communications device having a circuit board and a microphone. The microphone is provided in an electromagnetic shield and a resilient separator is provided over the shield. The device housing is stacked over the separator and shield, while the latter are stacked over the circuit board so that the separator and shield, with microphone there under, are sandwiched between the housing and the circuit board. By this sandwiching the separator is loaded onto the shield to drive the shield directly against the circuit board to make an electrical ground connection therewith, the microphone also being electrically connected to the printed circuit board. The resilience of the separator accommodates the variation in the stacking of the components. | 09-20-2012 |
20120250925 | PACKAGES AND METHODS FOR PACKAGING MICROPHONE DEVICES - Packages for electronic amplification include a packaged microphone device that includes a housing and an acoustic transducer disposed therein. The housing includes an exterior top surface and an exterior bottom surface that includes electrical terminals disposed thereon. The package microphone device can include a flexible substrate having a top portion, a bottom portion and a flexible middle portion. The flexible middle portion is folded around the housing such that the top portion at least partially overlays and attaches to the exterior top surface of the housing and the bottom portion at least partially overlays and attaches to the exterior bottom surface of the housing. | 10-04-2012 |
20120250926 | Condenser Microphone Unit and Condenser Microphone - A condenser microphone unit includes a diaphragm, a diaphragm ring, a fixed electrode, a casing unit accommodating the diaphragm ring, the diaphragm, and the fixed electrode. A condenser microphone includes the condenser microphone unit. The diaphragm ring is indirectly fixed to the interior of the unit casing through a fixing ring fixed to the unit casing. The fixing ring has a planar ring portion and a plurality of projections projecting from the internal periphery of the ring portion and provided in a circumferential direction. The plurality of projections urges the diaphragm ring toward the fixed electrode. | 10-04-2012 |
20120257777 | MICROPHONE UNIT AND VOICE INPUT DEVICE COMPRISING SAME - A microphone unit ( | 10-11-2012 |
20120263332 | CONDENSER MICROPHONE UNIT AND CONDENSER MICROPHONE - To stably obtain high acoustic resistance required for pressure equalization in a non-directional condenser microphone unit. | 10-18-2012 |
20120300969 | MICROPHONE UNIT AND VOICE INPUT DEVICE COMPRISING SAME - A microphone unit ( | 11-29-2012 |
20120328142 | MICROPHONE UNIT, AND SPEECH INPUT DEVICE PROVIDED WITH SAME - A microphone unit includes first and second diaphragms; a substrate on a top surface of which are installed the first and second diaphragms; and a cover disposed covering the first and second diaphragms, the cover joined to an outside edge of the substrate and forming an internal space. There are formed in the substrate first and second openings that are formed respectively in the top and bottom surfaces of the substrate, and an internal sound path communicating from the first opening to the second opening. The first diaphragm is disposed on the substrate so as to cover and hide the first opening. The second diaphragm is disposed so as to seal off a partial region away from the first opening of the top surface of the substrate. A third opening is formed in the cover, and the internal space communicates to an outside space via the third opening. | 12-27-2012 |
20130010995 | WELDING TYPE CONDENSER MICROPHONE USING SPRING BASE - A welding type condenser microphone using a spring base to prevent interferences due to deviations of thicknesses of components, wherein a second base is an elastic spring. The welding type condenser microphone includes a case sub-assembly, in which a diaphragm and a back plate face each other across a spacer in a metal case and the back plate is insulated from the case by a first base formed of an insulation material; a printed circuit board (PCB) sub-assembly, in which circuit devices and a second base, which is an elastic spring, are mounted on a PCB via a surface mounting technology (SMT) method; and a unit for attaching the case sub-assembly and the PCB sub-assembly to each other. Furthermore, the second base is a leaf spring that is bent once, a U-shaped leaf spring having wings, or a coil spring. | 01-10-2013 |
20130010996 | WELDING TYPE CONDENSER MICROPHONE USING CURLING AND METHOD OF ASSEMBLYING THE SAME - A condenser microphone that is manufactured by attaching components installed in a case by using curling to prevent movement of the components when the case and a printed circuit board (PCB) are welded to each other and to stably transfer electrical signals, and a method of manufacturing the condenser microphone. The condenser microphone using curling includes a case sub assembly prevented from moving by mounting a diaphragm, a spacer, a back plate, and a first base in a case with an open side and then curling an end portion of the open side; a printed circuit board (PCB); and an adhesion portion for adhering the case sub assembly and the PCB sub assembly to each other. A curling portion is formed on the end portion of the open side of the metal case and is curled. In addition, slits are formed in opposite lower ends of the curling portion. | 01-10-2013 |
20130058515 | Dynamic Microphone Unit and Dynamic Microphone - A dynamic microphone unit has a diaphragm | 03-07-2013 |
20130094689 | Microphone Unit, Method of Manufacturing Microphone Unit, Electronic Apparatus, Substrate for Microphone Unit and Method of Manufacturing Substrate for Microphone Unit - This microphone unit includes a vibrating portion converting a sound to an electric signal, a substrate having a first surface where the vibrating portion is set and a second surface opposite to the first surface and including a hollow portion transmitting a sound therein, and a coating layer formed on an inner surface of the hollow portion of the substrate. The substrate further includes a first substrate sound hole portion provided on the first surface for causing the hollow portion and the vibrating portion to communicate with each other, a second substrate sound hole portion provided on the first surface for causing the hollow portion and the exterior to communicate with each other, and a coating liquid draining hole portion provided on the second surface for causing the hollow portion and the exterior to communicate with each other. | 04-18-2013 |
20130129136 | Microphone Module with Sound Pipe - A microphone module has a substrate with an aperture to allow sound waves to pass through the substrate, a lid mounted to the substrate to define a first interior volume, a microphone mounted to the substrate within the first interior volume, and a housing coupled to the substrate and covering the aperture. The housing forms a second interior volume and includes an acoustic port configured to allow sound to enter the second interior volume. The module further includes a pipe extending from the acoustic port in the housing, and at least one exterior interface pad outside of the second interior volume. The pipe has an open end to receive sound waves and direct them toward the acoustic port in the housing. Moreover, the at least one exterior interface pad electrically couples to the microphone. | 05-23-2013 |
20130136291 | MEMS MICROPHONE - A MEMS microphone includes a case having sidewalls, a top wall, and an opened bottom; a PCB attached to the bottom of the case; a MEMS chip, which is arranged on the PCB and includes an inner-MEMS space; and at least one sound hole formed through a surface of the case for introduction of external sounds, wherein an internal communicating unit which forms a sound path via which the sound hole and the inside-MEMS space communicate with each other is arranged inside the case such that external sounds introduced via the sound hole pass through the sound path and enter the inner-MEMS space. | 05-30-2013 |
20130136292 | MICROPHONE UNIT - A microphone unit ( | 05-30-2013 |
20130148836 | Dynamic Microphone Unit and Dynamic Microphone - A dynamic microphone unit includes: a diaphragm that vibrates in response to received sound waves; a voice coil that is fixed to the diaphragm and vibrates together with the diaphragm; a magnetic circuit that generates a magnetic field in a magnetic gap, the voice coil being disposed in the magnetic gap; a resonator that is disposed adjacent to the obverse of the diaphragm; and a noise canceling coil that is fixed to a surface of the resonator so as to face a position of fixing the voice coil, the surface facing the diaphragm. The noise canceling coil is connected in series with the voice coil and has a winding direction different from that of the voice coil. | 06-13-2013 |
20130195306 | Microphone Shield with Common Mode Interference Reduction - A microphone assembly includes a microphone composed of a case having an open end and a printed circuit board. The printed circuit board is disposed in the open case end. The microphone assembly further includes a conductive ring coupled to the microphone case and extending beyond the open case end for shielding the microphone from electromagnetic interference. | 08-01-2013 |
20130322675 | SENSOR MODULE - A cost-effective and extremely space-saving module approach is provided for at least two micromechanical sensor elements having the same packaging requirements. The sensor module described here includes at least two micromechanical sensor elements whose sensor function is based on the direct or indirect impact of a measuring medium. The at least two sensor elements are situated in a shared housing having at least one access opening for the measuring medium, and the at least two sensor elements are stacked with one component back side on one component front side, so that the upper sensor element at least partially covers the active area of the lower sensor element, while still ensuring the impact of the measuring medium, which is used for the sensor function, on the active area of the lower sensor element. | 12-05-2013 |
20130329931 | MICROPHONE ASSEMBLY AND ELECTRONIC DEVICE USING SAME - A microphone assembly includes a base and a microphone cover. The base defines a receiving groove for receiving a microphone and a first recess communicating with the receiving groove. The microphone cover defines a second recess covering the base. The first recess and the second recess of the microphone cover together define a sound channel communicating with the receiving groove therebetween, and running through an end of the base. | 12-12-2013 |
20140037120 | Microphone Assembly - A Microelectromechanical system (MEMS) assembly includes a cover, a substrate, at least one wall disposed and between and attached to the cover and the substrate, a MEMS device disposed at the cover and an integrated circuit disposed at the substrate. The integrated circuit and the MEMS device are disposed one over the other and electrically connected together at least in part by conduits that extend through the walls. Alternatively, the MEMS device may be disposed on the substrate and the integrated circuit disposed on the base. | 02-06-2014 |
20140044297 | Microphone Assembly With Barrier To Prevent Contaminant Infiltration - A microphone assembly includes a cover, a base coupled to the cover, a microelectromechanical system (MEMS) device disposed on the base. An opening is formed in the base and the MEMS device is disposed over the opening. The base includes a barrier that extends across the opening and is porous to sound. The remaining portions of the base do not extend across the opening. | 02-13-2014 |
20140105440 | ACOUSTIC SYSTEMS FOR ELECTRONIC DEVICES - A portable electronic device may have acoustic ports such as microphone and speaker ports. Acoustic devices such as microphones and speakers may be associated with the acoustic ports. An acoustic port may have an opening between an interior and exterior of the portable electronic device. The opening may be covered by a metal mesh. An acoustic fabric may be interposed between the metal mesh and the opening. The opening may be formed from a hole in a glass member having outer and inner chamfers. A microphone boot may be provided that forms front and rear radial seals with a housing of the device and a microphone unit respectively. The microphone boot may also form multiple face seals with the microphone unit. A speaker for the speaker port may be enclosed in a sealed speaker enclosure. The speaker enclosure may have a pressure-equalizing vent slit covered with an acoustic mesh. | 04-17-2014 |
20140126762 | COMPONENT HAVING A MICROMECHANICAL MICROPHONE STRUCTURE - Measures for dynamically regulating the microphone sensitivity of a MEMS microphone component at low frequencies by way of variable roll-off behavior are proposed. The micromechanical microphone structure of the component, which is implemented in a layer structure on a semiconductor substrate, encompasses an acoustically active diaphragm having leakage openings which spans a sound opening in the substrate back side, and a stationary acoustically permeable counterelement having through openings which is disposed in the layer structure above/below the diaphragm. The component furthermore encompasses a capacitor assemblage for signal sensing, having at least one deflectable electrode on the diaphragm and at least one stationary electrode on the counterelement, and an arrangement for implementing a relative motion between the diaphragm and counterelement parallel to the layer planes. | 05-08-2014 |
20140133685 | Microphone System with Mechanically-Coupled Diaphragms - A microphone system has two diaphragms and are mechanically interconnected such that they respond in antiphase to an acoustic signal impinging on one of the diaphragms. The two diaphragms produce two variable capacitances that vary proportionately but inversely to one another. Voltage signals produced by the two variable capacitances are summed to provide an output signal proportional to the acoustic signal, but with greater sensitivity than a single-diaphragm microphone. | 05-15-2014 |
20140133686 | APPARATUS TO PREVENT EXCESS MOVEMENT OF MEMS COMPONENTS - An acoustic device includes a substrate, a microelectromechanical system (MEMS) apparatus, a cover, a port, and a stop. The MEMS apparatus includes a diaphragm and a back plate. The cover is coupled to the substrate and encloses the MEMS apparatus. The port is disposed through the substrate, and the MEMS apparatus is disposed over the port. The stop is disposed over the MEMS apparatus and configured to prevent movement of portions of the MEMS apparatus that would damage the portions of the MEMS apparatus. | 05-15-2014 |
20140133687 | APPARATUS FOR PREVENTION OF PRESSURE TRANSIENTS IN MICROPHONES - An acoustic device includes a substrate, a microelectromechanical system (MEMS) apparatus, a cover, a port, and a valve. The MEMS apparatus includes a diaphragm and a back plate. The cover is coupled to the substrate and encloses the MEMS apparatus. The port is disposed through the substrate and the MEMS apparatus is disposed over the port. The valve is disposed over the port and opposite the MEMS apparatus. The valve is configured to assume a closed position during the occurrence of a high pressure event and prevent a pressure transient from damaging the MEMS apparatus. The valve is configured to assume an open position during the absence of a high pressure event. | 05-15-2014 |
20140205127 | Microphone System with Non-Orthogonally Mounted Microphone Die - A microphone system has a lid coupled with a base to form a package with an interior chamber. The package has a top, a bottom, and a plurality of sides, and at least one of those sides has a portion with a substantially planar surface forming an opening for receiving an acoustic signal. The microphone system also has a microphone die positioned within the interior chamber. The microphone is positioned at a non-orthogonal, non-zero angle with regard to the opening in the at least one side. | 07-24-2014 |
20140241559 | MICROPHONE ASSEMBLY - A mobile microphone assembly ( | 08-28-2014 |
20140254850 | ACOUSTIC SENSOR PACKAGE - Representative implementations of devices and techniques provide an improved signal receive time to a sensor component. The sensor component is enclosed within a package arranged to allow the sensor to potentially receive a signal in less time. The package may have a cavity, and the cavity may be at least partly filled with an acoustical transducer. | 09-11-2014 |
20140254851 | MEMS MICROPHONE PACKAGING STRUCTURE - The invention provides a MEMS microphone packaging structure for reducing the packaging structure volume, lowering manufacturing cost and improving impact resistance. The packaging structure has a large back cavity formed by a recess of a controlling chip and a deep hole of a MEMS microphone chip. The controlling chip is disposed on the MEMS microphone chip for protecting the MEMS microphone chip. A plastic molding process can be applied on the packaging structure. A plurality of pads on a base of the packaging structure are protected by sealant or primer for protection against corrosion under atmospheric condition. In conclusion, the invention has advantages of small volume and thinner thickness without downgrading the performance, and the manufacturing cost can be lowered. | 09-11-2014 |
20140376760 | HANDHELD MICROPHONE - A handheld microphone includes a microphone unit supported with a vibration insulator on a microphone case; the handheld microphone comprising a filter circuit for filtering output signals from the microphone unit; the filter circuit comprising a passive filter connected to an output terminal of the microphone unit, and a high-pass filter connected downstream of the passive filter and outputting the filtered signals from the microphone unit. | 12-25-2014 |
20150010191 | GRADIENT MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) MICROPHONE - In at least one embodiment, a micro-electro-mechanical systems (MEMS) microphone assembly is provided. The assembly includes an enclosure, a MEMS transducer, and a plurality of substrate layers. The single MEMS transducer is positioned within the enclosure. The plurality of substrate layers support the single MEMS transducer. The plurality of substrate layers define a first transmission mechanism to enable a first side of the single MEMS transducer to receive an audio input signal and a second transmission mechanism to enable a second side of the single MEMS transducer to receive the audio input signal. | 01-08-2015 |
20150092975 | MICROPHONE DEVICE - There is provided a microphone device with which an operation state of the microphone device may be easily checked and that may effectively reduce noise to be played back, the noise being caused by vibration that has propagated through a table or the like. A microphone device is configured such that a microphone case | 04-02-2015 |
20150125022 | MICROPHONE SYSTEM FOR NOTEBOOK COMPUTER - Briefly, in accordance with one or more embodiments, a display includes a housing comprising a first surface and a second surface opposite to the first surface. The second surface comprises a transparent material covering the second surface and the housing includes two or more microphone ports disposed along a parting line between the first surface and the second surface exterior to the transparent material. The housing further includes two or more microphones coupled with the two or more microphone ports. A microphone signal processing system may be utilize to increase directional sensitivity of the two more microphones toward an audio source. An angle detector to detect an angle of the may be utilized to accommodate the directional sensitivity provided by the microphone signal processing system. | 05-07-2015 |
20150139467 | ACOUSTIC DEVICE AND MICROPHONE PACKAGE INCLUDING THE SAME - There are provided an acoustic device manufactured using a micro electro mechanical system (MEMS) technology, and a microphone package including the acoustic device. The acoustic device includes a device substrate including a cavity formed therein, a diaphragm formed to cover the cavity on the device substrate, a back plate formed to be spaced apart from the diaphragm, and a shielding plate disposed to be spaced apart from the diaphragm and the back plate, including a plurality of through holes, and shielding noise introduced from outside. | 05-21-2015 |
20150326979 | Top-Port MEMS Microphone and Method of Manufacturing the Same - A top-port MEMS-microphone has an upper side and a bottom side. The microphone includes a MEMS chip with a monolithically connected protection element at the upper side, a backplate, and a membrane. The microphone also includes a sound inlet at the upper side and a mechanical or electrical connection at the bottom side. | 11-12-2015 |
20150373438 | Microphone Device - A microphone device includes: a housing having an opening section in an upper face thereof; and a non-directional microphone unit incorporated in the housing and provided inside the opening section. The upper face of the housing has a shape in which a distance from an edge defined as a boundary between the upper face and a side face or a bottom face to the opening section throughout a whole circumference of the upper face changes in ½ or more of the whole circumference of the edge and an average value of the distance from the edge to the opening section is shorter than ½ of a wavelength of a sound wave in a frequency range in which an auditory sensitivity of humans is low. | 12-24-2015 |
20150373444 | Microphone - A microphone includes a base seat, a tube unit connected the base seat, a sound head, and a cable. The base seat includes a surrounding wall that is formed with at least one through hole, and a base wall that cooperates with the surrounding wall to define a receiving space therebetween, and that has a conical surface for reflecting sound waves toward the through hole. The sound head is disposed in the receiving space, and is spaced apart from the base wall of the base seat. The cable is electrically connected to the sound head and extends through the tube unit. | 12-24-2015 |
20160037256 | MICROPHONE - When external pressure extremely increases, a waterproof vibration membrane tends to be resiliently deformed extremely toward the inside. However, an inward resilient deformation inhibiting member provided on the inner side of the waterproof vibration membrane with a space therebetween inhibits this extreme inward resilient deformation of the waterproof vibration membrane, whereby the waterproof vibration membrane is prevented from being ruptured or plastically deformed. On the other hand, when the internal pressure extremely increases, the waterproof vibration membrane tends to be resiliently deformed extremely toward the outside. However, an outward resilient deformation inhibiting member provided on the outer side of the waterproof vibration membrane with a space therebetween inhibits this extreme outward resilient deformation of the waterproof vibration membrane, whereby the waterproof vibration membrane is prevented from being ruptured or plastically deformed. | 02-04-2016 |
20160095242 | ELECTRONIC DEVICE WITH DUST PROTECTING FUNCTION AND METHOD FOR FABRICATING ELECTRONIC DEVICE WITH DUST PROTECTING FUNCTION - The present invention provides an electronic device with dust protecting function and a method for fabricating the electronic device with dust protecting function. The electronic device comprises: a chamber structure and a first electronic element. The chamber structure comprises: a substrate; and a cap. The cap is connected to the substrate, and has a hole and a protruding part, wherein the protruding part protrudes toward inside of the chamber structure. The first electronic element is disposed in the chamber structure, wherein the protruding part is a block between the first electronic element and the hole of the cap. | 03-31-2016 |
20160105737 | PACKAGES AND METHODS FOR PACKAGING - A three-dimensional printing technique can be used to form a microphone package. The microphone package can include a housing having a first side and a second side opposite the first side. A first electrical lead can be formed on an outer surface on the first side of the housing. A second electrical lead can be formed on an outer surface on the second side of the housing. The first electrical lead and the second electrical lead may be electrically shorted to one another. Further, vertical and horizontal conductors can be monolithically integrated within the housing. | 04-14-2016 |
20160192086 | CAPACITIVE MICROPHONE WITH INSULATED CONDUCTIVE PLATE - A capacitive microphone may include a housing, a membrane, and a first backplate, wherein a first insulating layer may be disposed on a first side of the first backplate facing the membrane and a second insulating layer may be disposed on a second side of the first backplate opposite to the first side of the first backplate. A further insulating layer may be disposed on a side wall of at least one of a plurality of perforation holes in the first backplate. Each conductive surface of the first backplate may be covered with insulating material. | 06-30-2016 |