Entries |
Document | Title | Date |
20080198645 | NONVOLATILE MEMORY DEVICE HAVING MEMORY AND REFERENCE CELLS - A nonvolatile memory device includes a stack-type memory cell array, a selection circuit and a read circuit. The memory cell array includes multiple memory cell layers and a reference cell layer, which are vertically laminated. Each of the memory cell layers includes multiple nonvolatile memory cells for storing data, and the reference cell layer includes multiple reference cells for storing reference data. The selection circuit selects a nonvolatile memory cell from the memory cell layers and at least one reference cell, corresponding to the selected nonvolatile memory cell, from the reference cell layer. The read circuit supplies a read bias to the selected nonvolatile memory cell and the selected reference cell corresponding to the selected nonvolatile memory cell, and reads data from the selected nonvolatile memory cell. | 08-21-2008 |
20080198646 | NONVOLATILE MEMORY DEVICE USING RESISTANCE MATERIAL - The present invention provides a nonvolatile memory device that uses a resistance material. The nonvolatile memory device includes: a stacked memory cell array having a plurality of memory cell layers stacked in a vertical direction, the stacked memory cell array having at least one memory cell group and at least one redundancy memory cell group; and a repair control circuit coupled to the stacked memory cell array, the repair control circuit configured to repair a defective one of the at least one memory cell group with a selected one of the at least one redundancy memory cell group. The features that enable repair improve the fabrication yield of the nonvolatile memory device. | 08-21-2008 |
20080205118 | INTEGRATED CIRCUIT HAVING A RESISTIVE SWITCHING DEVICE - An integrated circuit, a memory cell, memory device and method of operating the memory device is disclosed. In one embodiment, an integrated circuit having a resistively switching memory cell includes a bitline electrode and a second electrode having a lower voltage potential than the bitline electrode; a switching active volume and a selection transistor connected in series between the bitline electrode and the second electrode. The second electrode is connected, via a connection transistor, to a third electrode having the same or a lower voltage potential than the second electrode; wherein the second electrode includes a buried electrode at least partially positioned below the bitline electrode and the third electrode. | 08-28-2008 |
20080205119 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - In order to determine data stored in a memory cell of a resistive cross-point cell array, two reference cells having two different known resistance values (e.g., data “0” and data “1”) are provided, and a difference in current between a selected cell and the reference cell having data “0” and a difference in current between the selected cell and the reference cell having data “1” are compared. By comparison with a current of the reference cell which has a parasitic current as with the selected cell and has known data “0”/“1”, data can be determined while suppressing an influence of a parasitic current. | 08-28-2008 |
20080212359 | Memory Device and Semiconductor Integrated Circuit - First electrode layer includes a plurality of first electrode lines (W | 09-04-2008 |
20080219039 | Nonvolatile memory elements with metal-deficient resistive-switching metal oxides - Nonvolatile memory elements are provided that have resistive switching metal oxides. The nonvolatile memory elements may be formed by depositing a metal-containing material on a silicon-containing material. The metal-containing material may be oxidized to form a resistive-switching metal oxide. The silicon in the silicon-containing material reacts with the metal in the metal-containing material when heat is applied. This forms a metal silicide lower electrode for the nonvolatile memory element. An upper electrode may be deposited on top of the metal oxide. Because the silicon in the silicon-containing layer reacts with some of the metal in the metal-containing layer, the resistive-switching metal oxide that is formed is metal deficient when compared to a stoichiometric metal oxide formed from the same metal. | 09-11-2008 |
20080219040 | Method to prevent overreset - A method of addressing a memory cell includes applying a plurality of pulses to the memory cell, wherein a subsequent pulse has an amplitude greater than an initial pulse. In addition, a memory includes a memory cell and a control circuit configured to address the memory cell by applying a plurality of pulses to the memory cell, wherein a subsequent pulse has an amplitude greater than an initial pulse. | 09-11-2008 |
20080225571 | Complementary bit PCRAM sense amplifier and method of operation - A method and apparatus is disclosed for sensing the resistance state of a Programmable Conductor Random Access Memory (PCRAM) element using complementary PCRAM elements, one holding the resistance state being sensed and the other holding a complementary resistance state. A sense amplifier detects voltages discharging through the high and low resistance elements to determine the resistance state of an element being read. | 09-18-2008 |
20080232153 | Non-volatile memory device - A non-volatile memory device | 09-25-2008 |
20080232154 | RESISTANCE MEMORY ELEMENT AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR MEMORY DEVICE - A resistance memory element memorizing a high resistance state or a low resistance state in a memory region and switched between the high resistance state and the low resistance state by an application of a voltage includes a resistance memory layer | 09-25-2008 |
20080239787 | LARGE ARRAY OF UPWARD POINTING P-I-N DIODES HAVING LARGE AND UNIFORM CURRENT - An upward-pointing p-i-n diode formed of deposited silicon, germanium, or silicon-germanium is disclosed. The diode has a bottom heavily doped p-type region, a middle intrinsic or lightly doped region, and a top heavily doped n-type region. The top heavily doped p-type region is doped with arsenic, and the semiconductor material of the diode is crystallized in contact with an appropriate silicide, germanide, or silicide-germanide. A large array of such upward-pointing diodes can be formed with excellent uniformity of current across the array when a voltage above the turn-on voltage of the diodes is applied. This diode is advantageously used in a monolithic three dimensional memory array. | 10-02-2008 |
20080239788 | INTEGRATED CIRCUIT HAVING A RESISTIVELY SWITCHING MEMORY AND METHOD - An integrated circuit having a resistance-based or resistively switching memory cell, and a method for operating a resistively switching memory cell is disclosed. One embodiment is adapted to be put in a low-resistance state by applying a first threshold voltage and in a high-resistance state by applying a second threshold voltage, wherein reading out of the data content from the memory cell is performed by applying a voltage to the memory cell in the range of the first or second threshold voltage or a higher voltage. | 10-02-2008 |
20080247214 | INTEGRATED MEMORY - In one aspect, a resistive memory device may be implemented in an embedded system. A resistive memory may comprise a resistive switchable medium that may be electrically connected to a first and a second electrode. In one aspect the first and the second electrode may comprise a via conductor and an interconnection line of an embedded structure. | 10-09-2008 |
20080247215 | RESISTIVE SWITCHING ELEMENT - According to one aspect, a switching element may comprise a first electrode, a second electrode, and a resistive switching region extending from the first electrode to the second electrode and comprising transition metal oxinitride. | 10-09-2008 |
20080247216 | METHOD AND APPARATUS FOR IMPLEMENTING IMPROVED WRITE PERFORMANCE FOR PCRAM DEVICES - A method of implementing a write operation for a programmable resistive random access memory array includes coupling a current source to a bit line associated with a programmable resistive memory element; prior to activating a word line associated with the memory element, precharging the bit line by passing current the bit line and through a dummy path selectively coupled to the bit line; and upon achieving a desired operating point of bit line current and bit line voltage, decoupling the dummy path from the bit line and activating the word line associated with the memory element so as to cause current from the bit line to flow for a period of time selected to program the memory element to one of a low resistance state and a high resistance state. | 10-09-2008 |
20080247217 | Integrated circuit, memory cell array, memory module, method of operating an integrated circuit, and computing system - An integrated circuit includes a plurality of resistivity changing memory cells and a plurality of resistivity changing reference cells. The integrated circuit is arranged such that each memory cell is switchable between N resistance levels, N being an integer greater than or equal to 2. To each of at least two possible resistance levels of a memory cell an individual reference cell as assigned. A resistance level of a memory cell is determined or set depending on the resistance level of the reference cell which is assigned to the resistance level of the memory cell. | 10-09-2008 |
20080247218 | DESIGN STRUCTURE FOR IMPLEMENTING IMPROVED WRITE PERFORMANCE FOR PCRAM DEVICES - A design structure embodied in a machine readable medium used in a design process includes a circuit for implementing a write operation for a programmable resistive random access memory array, the circuit including a current source coupled to a bit line associated with a programmable resistive memory element; a dummy path configured for selective coupling to the bit line prior to activation of a word line associated with the memory element, wherein the passage of current through the bit line and dummy path precharges the bit line; and control circuitry for decoupling the dummy path from the bit line and for activating the word line associated with the memory element upon achieving a desired operating point of bit line current and bit line voltage, so as to cause current from the bit line to flow for a period of time selected to program the memory element to one of a low resistance state and a high resistance state. | 10-09-2008 |
20080247219 | Resistive Random Access Memory Devices Including Sidewall Resistive Layers and Related Methods - A resistive random access memory (RRAM) device may include a first metal pattern on a substrate, a first insulating layer on the first metal pattern and on the substrate, an electrode, a second insulating layer on the first insulating layer, a resistive memory layer, and a second metal pattern. Portions of the first metal pattern may be between the substrate and the first insulating layer, and the first insulating layer may have a first opening therein exposing a portion of the first metal pattern. The electrode may be in the opening with the electrode being electrically coupled with the exposed portion of the first metal pattern. The first insulating layer may be between the second insulating layer and the substrate, and the second insulating layer may have a second opening therein exposing a portion of the electrode. The resistive memory layer may be on side faces of the second opening and on portions of the electrode, and the second metal pattern may be in the second opening with the resistive memory layer between the second metal pattern and the side faces of the second opening and between the second metal pattern and the electrode. Related methods are also discussed. | 10-09-2008 |
20080253164 | Integrated Circuit, Resistivity Changing Memory Device, Memory Module and Method of Fabricating an Integrated Circuit - According to one embodiment of the present invention, an integrated circuit includes a plurality of resistivity changing memory cells, and a plurality of conductive elements being electrically connected to the resistivity changing memory cells, at least some of the conductive elements comprising copper. | 10-16-2008 |
20080253165 | Method of Manufacturing a Memory Device, Memory Device, Cell, Integrated Circuit, Memory Module, and Computing System - In one embodiment of the present invention, a method of fabricating a memory device includes: providing a composite structure including a resistivity changing layer and a first conductive layer disposed on or above the resistivity changing layer, forming a second conductive layer on or above the first conductive layer, and patterning the second conductive layer such that at least a part of the patterned second conductive layer is usable as a via for contacting the first conductive layer. | 10-16-2008 |
20080253166 | Integrated Circuit, Method for Manufacturing an Integrated Circuit, Memory Cell Array, Memory Module, and Device - According to one embodiment of the present invention, a memory cell array comprises a plurality of voids, the spatial positions and dimensions of the voids being chosen such that mechanical stress occurring within the memory cell array is at least partly compensated by the voids. | 10-16-2008 |
20080253167 | Integrated Circuit, Method of Operating an Integrated Circuit, Method of Manufacturing an Integrated Circuit, Active Element, Memory Module, and Computing System - According to one embodiment of the present invention, an active element includes a reactive electrode, an inert electrode and a solid electrolyte disposed between the reactive electrode and the inert electrode. The solid electrolyte has a negative differential resistance. | 10-16-2008 |
20080253168 | Integrated circuit, resistivity changing memory device, memory module, and method of fabricating an integrated circuit - According to one embodiment of the present invention, a memory device includes a composite structure including a resistivity changing layer and an electrode layer being arranged on or above the resistivity changing layer. The resistivity changing memory device further includes a protection layer being arranged on or above the composite structure, the protection layer protecting the electrode layer against electromagnetic waves. | 10-16-2008 |
20080253169 | Semiconductor memory device and writing method thereof - A semiconductor memory device includes a phase-change memory and has high compatibility with DRAM interface. The memory cell array comprises a memory cell that includes a phase-change element provided at the intersection of a bit line and word line. A write address and data accompanying a write request are temporarily held in a write address register and a data register respectively, and a write operation is not performed on the memory cell array in this cycle of write request. And when a next write request occurs, the held data is written to the memory cell array. At this time, two write cycles—RESET cycle and SET cycle—are provided. Then the written contents of the memory cell and the rewrite data are compared, and after only SET cells are temporarily RESET (amorphization, increasing the resistance), it is operated so as to write only SET data (crystallization, lowering the resistance). | 10-16-2008 |
20080259672 | 4F2 SELF ALIGN SIDE WALL ACTIVE PHASE CHANGE MEMORY - Arrays of memory cells are described along with devices thereof and method for manufacturing. Memory cells described herein include self-aligned side wall memory members comprising an active programmable resistive material. In preferred embodiments the area of the memory cell is 4F | 10-23-2008 |
20080266931 | Resistive memory device having enhanced resist ratio and method of manufacturing same - Disclosed herein are new resistive memory devices having one or more buffers layer surrounding a dielectric layer. By inserting one or more buffer layers around the dielectric layer of the device, the resistive ratio of the device is highly enhanced. For example, tests using this unique stack structure have revealed a resistance ratio of approximately 1000× over conventional electrode-dielectric-electrode stack structures found in resistive memory devices. This improvement in the resistance ratio of the resistive memory device is believed to be from the improved interface coherence, and thus smoother topography, between the buffer layer(s) and the dielectric layer. | 10-30-2008 |
20080266932 | CIRCUIT FOR PROGRAMMING A MEMORY ELEMENT - An integrated circuit includes a memory element configured to be programmed to any one of at least three resistance states and a circuit. The circuit is configured to program the memory element to a selected one of the at least three resistance states by applying a pulse to the memory element. The pulse includes one of at least three tail portions wherein each tail portion corresponds to one of the at least three resistance states. | 10-30-2008 |
20080266933 | Method and Apparatus for Refreshing Programmable Resistive Memory - Nonvolatile memory cells with programmable resistive memory elements, such as chalcogenide material elements, undergo a refresh operation. A refresh operation includes a hot signal and a cold signal, where the hot signal has higher power than a reset signal, and a cold signal has a longer duration than a set signal. | 10-30-2008 |
20080266934 | NONVOLATILE MEMORY DEVICE AND METHOD TO CONTROL THE SAME - A nonvolatile memory device is disclosed. The nonvolatile memory device includes a source selector transistor connected at one end thereof to a source line, a plurality of cell selector transistors connected in series with each other and to the other end of said source selector transistor and a basic memory unit including a variable resistor element which is constituted as a memory element to store bit information and is provided for each of said cell selector transistors, being connected at one end thereof to the drain terminal of said cell selector transistor and connected at the other end thereof to the bit line. The source selector transistor and said cell selector transistor provided between one end of said variable resistor element to be accessed and said source line are controlled to turn on. | 10-30-2008 |
20080273369 | Integrated Circuit, Memory Module, Method of Operating an Integrated Circuit, and Computing System - According to one embodiment of the present invention, a memory device includes a plurality of resistivity changing memory cells including a current path input terminal and a current path output terminal, respectively, and a plurality of select devices. Each current path output terminal is connected to at least one different current path output terminal via at least one select device. | 11-06-2008 |
20080273370 | Integrated Circuit, Method of Operating an Integrated Circuit, Memory Cell Array, and Memory Module - According to one embodiment of the present invention, an integrated circuit includes a memory cell that includes at least two resistivity changing layers being stacked above each other, each resistivity changing layer serving as a separate data storage layer and having individual data storing properties. | 11-06-2008 |
20080273371 | MEMORY INCLUDING WRITE CIRCUIT FOR PROVIDING MULTIPLE RESET PULSES - An integrated circuit includes an array of resistive memory cells having varying critical dimensions and a write circuit. The write circuit is configured to reset a selected memory cell by applying a first pulse having a first amplitude and a second pulse having a second amplitude less than the first amplitude to the selected memory cell. | 11-06-2008 |
20080273372 | Method of Programming Multi-Layer Chalcogenide Devices - A method of programming a multi-layer chalcogenide electronic device. The device includes an active region in electrical communication with two terminals, where the active region includes two or more layers. The method includes providing an electrical signal between the two terminals, where the electrical signal alters an electrical characteristic of a layer remote from one of the terminals. In one embodiment, the layer remote from the terminal is a chalcogenide material and the electrical characteristic is resistance. In another embodiment, an electrical characteristic of the layer in contact with the terminal is also altered. The alteration of an electrical characteristic may be caused by a transformation of a chalcogenide material from one structural state to another structural state. | 11-06-2008 |
20080278988 | RESISTIVE SWITCHING ELEMENT - According to one aspect, an integrated circuit may comprise a first electrode, a second electrode, and a resistive switching rod extending from the first electrode to the second electrode and being at least partly embedded in a thermal barrier matrix. | 11-13-2008 |
20080278989 | Resistive memory device and method of manufacturing the same - Provided is a resistive memory device and a method of manufacturing the resistive memory device that includes a bottom electrode, an insulating layer that is formed on the bottom electrode and has a hole that exposes the bottom electrode, a resistance layer and an intermediate layer which are formed in the hole, a switch structure formed on a surface of the intermediate layer, and an upper electrode formed on the switch structure. | 11-13-2008 |
20080278990 | RESISTIVE-SWITCHING NONVOLATILE MEMORY ELEMENTS - Nonvolatile memory elements are provided that have resistive switching metal oxides. The nonvolatile memory elements may be formed in one or more layers on an integrated circuit. Each memory element may have a first conductive layer, a metal oxide layer, and a second conductive layer. Electrical devices such as diodes may be coupled in series with the memory elements. The first conductive layer may be formed from a metal nitride. The metal oxide layer may contain the same metal as the first conductive layer. The metal oxide may form an ohmic contact or a Schottky contact with the first conductive layer. The second conductive layer may form an ohmic contact or a Schottky contact with the metal oxide layer. The first conductive layer, the metal oxide layer, and the second conductive layer may include sublayers. The second conductive layer may include an adhesion or barrier layer and a workfunction control layer. | 11-13-2008 |
20080285328 | Phase Change Memory - A phase change memory is provided. The method includes forming contact plugs in a first dielectric layer. A second dielectric layer is formed overlying the first dielectric layer and a trench formed therein exposing portions of the contact plugs. A metal layer is formed over surfaces of the trench. One or more heaters are formed from the metal layer such that each heater is formed along one or more sidewalls and a portion of the bottom of the trench, wherein the portion of the heater along the sidewalls does not include a corner region of adjacent sidewalls. The trench is filled with a third dielectric layer, and a fourth dielectric layer is formed over the third dielectric layer. Trenches are formed in the fourth dielectric layer and filled with a phase change material. An electrode is formed over the phase change material. | 11-20-2008 |
20080285329 | RECORDABLE ELECTRICAL MEMORY - A memory device includes a plurality of memory cells each including a recordable layer between two metal layers, the recordable layer including a first sub-cell and a second sub-cell. Each memory cell is constructed and designed to change from an as-deposited state to an initialized state upon application of an initialization signal, from the initialized state to a first inscribed state upon application of a first write signal, and from the initialized state to a second inscribed state upon application of a second write signal. The memory cell has a resistor-like current-voltage (I-V) characteristic when in the as-deposited state, a diode-like I-V characteristic when in the initialized state, and resistor-like I-V characteristics when in the first and second inscribed states for voltages within a predetermined range. | 11-20-2008 |
20080285330 | METHODS OF OPERATING A BISTABLE RESISTANCE RANDOM ACCESS MEMORY WITH MULTIPLE MEMORY LAYERS AND MULTILEVEL MEMORY STATES - A method is described for operating a bistable resistance random access memory having two memory layer stacks that are aligned in series is disclosed. The bistable resistance random access memory comprises two memory layer stacks per memory cell, the bistable resistance random access memory operates in four logic states, a logic “00” state, a logic “01” state, a logic “10” state and a logic “11” state. The relationship between the four different logic states can be represented mathematically by the two variables n and f and a resistance R. The logic “0” state is represented by a mathematical expression (1+f) R. The logic “1” state is represented by a mathematical expression (n+f) R. The logic “2” state is represented by a mathematical expression (1+nf) R. The logic “3” state is represented by a mathematical expression n(1+f) R. | 11-20-2008 |
20080291715 | NONVOLATILE MEMORY DEVICE USING VARIABLE RESISTIVE MATERIALS - A nonvolatile memory device includes a nonvolatile memory cell, a read circuit and a control bias generating circuit. The nonvolatile memory cell has a resistance level that changes depending on stored data. The read circuit reads the resistance level of the nonvolatile memory cell by receiving a control bias and supplying the nonvolatile memory cell a read bias based on the control bias. The control bias generating circuit receives an input bias, generates the control bias based on the input bias and supplies the control bias to the read circuit. A slope of the control bias to the input bias is less than 1. | 11-27-2008 |
20080291716 | METHOD OF PROGRAMMING A NON-VOLATILE MEMORY DEVICE - A method of programming a non-volatile memory device with memory cells formed of variable resistance elements and disposed between word lines and bit lines, includes: previously charging a selected word line and a selected bit line together with a non-selected word line and a non-selected bit line up to a certain voltage; and further charging the selected word line and the non-selected bit line up to a program voltage higher than the certain voltage and a program-block voltage, respectively, and simultaneously discharging the selected bit line. | 11-27-2008 |
20080298113 | Resistive memory architectures with multiple memory cells per access device - A resistive memory structure, for example, phase change memory structure, includes one access device and two or more resistive memory cells. Each memory cell is coupled to a rectifying device to prevent parallel leak current from flowing through non-selected memory cells. In an array of resistive memory bit structures, resistive memory cells from different memory bit structures are stacked and share rectifying devices. | 12-04-2008 |
20080298114 | Phase change memory structure with multiple resistance states and methods of programming an sensing same - A phase change memory structure with multiple resistance states and methods of forming, programming, and sensing the same. The memory structure includes two or more phrase change elements provided between electrodes. Each phase change element has a respective resistance curve as a function of programming voltage which is shifted relative to the resistance curves of other phase change elements. In one example structure using two phase change elements, the memory structure is capable of switching among four resistance states. | 12-04-2008 |
20080298115 | Memory cell array with low resistance common source and high current drivability - In the present resistive memory array, included are a substrate, a plurality of source regions in the substrate, and a conductor connecting the plurality of source regions, the conductor being positioned adjacent to the substrate to form, with the plurality of source regions, a common source. In one embodiment, the conductor is an elongated metal body of T-shaped cross-section. In another embodiment, the conductor is a plate-like metal body. | 12-04-2008 |
20080304310 | MEMORY HAVING SHARED STORAGE MATERIAL - An integrated circuit includes a bit line, a plurality of access devices coupled to the bit line, and a plate of phase change material. The integrated circuit includes a plurality of phase change elements contacting the plate of phase change material and a plurality of first contacts. Each first contact is coupled between an access device and a phase change element. | 12-11-2008 |
20080304311 | INTEGRATED CIRCUIT INCLUDING LOGIC PORTION AND MEMORY PORTION - An integrated circuit includes a logic portion including M conductive layers, a memory portion including N conductive layers, and at least one common top conductive layer over the logic portion and the memory portion. M is greater than N. | 12-11-2008 |
20080304312 | RESISTANCE MEMORY WITH TUNGSTEN COMPOUND AND MANUFACTURING - Memory devices based on tungsten-oxide memory regions are described, along with methods for manufacturing and methods for programming such devices. The tungsten-oxide memory region can be formed by oxidation of tungsten material using a non-critical mask, or even no mask at all in some embodiments. A memory device described herein includes a bottom electrode and a memory element on the bottom electrode. The memory element comprises at least one tungsten-oxygen compound and is programmable to at least two resistance states. A top electrode comprising a barrier material is on the memory element, the barrier material preventing movement of metal-ions from the top electrode into the memory element. | 12-11-2008 |
20080310208 | PROCESS FOR ERASING CHALCOGENIDE VARIABLE RESISTANCE MEMORY BITS - A method of erasing a chalcogenide variable resistance memory cell is provided. The chalcogenide variable resistance memory cell includes a p-doped substrate with an n-well and a chalcogenide variable resistance memory element. The method includes the step of applying to the variable resistance memory element a voltage that is less than a fixed voltage of the substrate. The applied voltage induces an erase current to flow from the p-doped substrate through the n-well and through the variable resistance memory element. | 12-18-2008 |
20080310209 | Circuit, biasing scheme and fabrication method for diode accesed cross-point resistive memory array - Methods, systems, structures and arrays are disclosed, such as a resistive memory array which includes access devices, for example, back-to-back Zener diodes, that only allow current to pass through a coupled resistive memory cell when a voltage drop applied to the access device is greater than a critical voltage. The array may be biased to reduce standby currents and improve delay times between programming and read operations. | 12-18-2008 |
20080310210 | Semiconductor memory device and method of operation - A memory cell is disclosed. The memory cell comprises a storage element including a first terminal and a second terminal, and a select transistor including a first terminal, a second terminal and a control terminal. The voltage at the control terminal of the select transistor affects a current flowing between the first terminal and the second terminal. The first terminal of the select transistor is coupled to the second terminal of the storage element. A bit line is coupled to the first terminal of the storage element, a first word line is coupled to the control terminal of the select transistor, and a second word line is coupled to the second terminal of the select transistor. | 12-18-2008 |
20080310211 | RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device including: a semiconductor substrate; at least one cell array formed above the semiconductor substrate, each memory cell having a stack structure of a variable resistance element and an access element, the access element having such an off-state resistance value in a certain voltage range that is ten times or more as high as that in a select state; and a read/write circuit formed on the semiconductor substrate as underlying the cell array, wherein the variable resistance element comprises a recording layer formed of a first composite compound expressed by A | 12-18-2008 |
20080316792 | CIRCUIT FOR PROGRAMMING A MEMORY ELEMENT - An integrated circuit includes a memory element and a circuit. The circuit is configured to program the memory element by applying one or more pulses to the memory element until a sensed resistance of the memory element is within a range of a desired resistance. The one or more pulses have a parameter value that is modified for each subsequent pulse based on the parameter value for an immediately preceding pulse and on a difference between the sensed resistance of the memory element and the desired resistance. | 12-25-2008 |
20080316793 | INTEGRATED CIRCUIT INCLUDING CONTACT CONTACTING BOTTOM AND SIDEWALL OF ELECTRODE - An integrated circuit includes a first electrode, a second electrode, and resistivity changing material between the first electrode and the second electrode. The integrated circuit includes a contact contacting a bottom and a first sidewall portion of the first electrode. | 12-25-2008 |
20080316794 | INTEGRATED CIRCUIT HAVING MULTILAYER ELECTRODE - An integrated circuit includes a first electrode including at least two electrode material layers and a resistivity changing material including a first portion and a second portion. The first portion contacts the first electrode and has a same cross-sectional width as the first electrode. The second portion has a greater cross-sectional width than the first portion. The integrated circuit includes a second electrode coupled to the resistivity changing material. | 12-25-2008 |
20080316795 | Method of making nonvolatile memory device containing carbon or nitrogen doped diode - A method of making a nonvolatile memory device includes forming a first electrode, forming at least one nonvolatile memory cell comprising a silicon, germanium or silicon-germanium diode, doping the diode with at least one of nitrogen or carbon, and forming a second electrode over the at least one nonvolatile memory cell. | 12-25-2008 |
20080316796 | Method of making high forward current diodes for reverse write 3D cell - A method of making a nonvolatile memory device includes forming a first electrode, forming at least one nonvolatile memory cell including a diode and a metal oxide antifuse dielectric layer over the first electrode, and forming a second electrode over the at least one nonvolatile memory cell. In use, the diode acts as a read/write element of the nonvolatile memory cell by switching from a first resistivity state to a second resistivity state different from the first resistivity state in response to an applied bias. | 12-25-2008 |
20080316797 | Memory Element Array - Disclosed is a memory element array comprising a plurality of memory elements arranged in an array, wherein the memory elements are switching elements each including a gap of nanometer order in which a switching phenomenon of resistance is caused by applying a predetermined voltage between electrodes, and the memory element array is provided with tunnel elements respectively connected to the switching elements in series, each of the tunnel elements preventing generation of a sneak path current flowing to another switching element at a time of applying the predetermined voltage. | 12-25-2008 |
20080316798 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A path routing from a write current source supplying a write current through an internal data line, a bit line and a source line to a reference potential except a memory cell is configured to have a constant resistance independent of a memory cell position selected in a memory array, and each of the resistance value of the current path between the memory cell and the write current source and the resistance value of the current path between the selected memory cell and the reference potential node is set to 500Ω or lower. A nonvolatile semiconductor memory device having improved reliability of data read/write is achieved. | 12-25-2008 |
20090003032 | INTEGRATED CIRCUIT INCLUDING RESISTIVITY CHANGING MATERIAL HAVING A PLANARIZED SURFACE - An integrated circuit includes a first electrode and a first resistivity changing material coupled to the first electrode. The first resistivity changing material has a planarized surface. The integrated circuit includes a second resistivity changing material contacting the planarized surface of the first resistivity changing material and a second electrode coupled to the second resistivity changing material. A cross-sectional width of the first resistivity changing material is less than a cross-sectional width of the second resistivity changing material. | 01-01-2009 |
20090003033 | QUASI-DIFFERENTIAL READ OPERATION - A memory device includes an array portion of resistive memory cells comprising a plurality of bit line pairs. The device further includes a read circuit operably associated with a first charged line, wherein the read circuit comprises a precharge circuit configured to charge a first line at a first rate, and to charge a second line at a second rate, the first and second charge rates based on a state of a memory cell coupled between the respective lines. The read circuit may further include a ground circuit configured to pull the respective lines to a ground potential, and a sense circuit coupled to the line pair configured to sense a differential voltage between the line pair in response to the state of the memory cell. | 01-01-2009 |
20090003034 | MULTIPLE WRITE CONFIGURATIONS FOR A MEMORY CELL - One embodiment of the present invention relates to a method of programming an array of memory cells. In this method, a selection is made between a first pulse configuration and a second pulse configuration, each of which can write at least two data states to the memory cells of the array. Other embodiments are also disclosed. | 01-01-2009 |
20090003035 | CONDITIONING OPERATIONS FOR MEMORY CELLS - One embodiment of the invention relates to a method for conditioning resistive memory cells of a memory array with a number of reliable resistance ranges, where each reliable resistance range corresponds to a different data state. In the method, group of at least one resistive memory cell is accessed, which group includes at least one unreliable cell. At least one pulse is applied to the at least one unreliable cell to shift at least one resistance respectively associated with the at least one unreliable cell to the highest of the reliable resistance ranges. Other methods and systems are also disclosed. | 01-01-2009 |
20090003036 | Method of making 3D R/W cell with reduced reverse leakage - A method of making a nonvolatile memory device includes forming a semiconductor diode steering element, and forming a semiconductor read/write switching element. | 01-01-2009 |
20090003037 | INTEGRATED CIRCUIT WITH MEMORY HAVING A CURRENT LIMITING SWITCH - An integrated circuit with memory having a current limiting switch. One embodiment provides a memory cell having a programmable resistivity layer and a writing line. A switch is arranged between the resistivity layer and the writing line. The switch includes a control input connected to a select line. The switch is configured to limit a current through the resistivity layer for a write operation. | 01-01-2009 |
20090010039 | NON-VOLATILE MEMORY DEVICE - According to one embodiment, a nonvolatile memory device includes: a memory cell array including memory cells each having a variable resistance element for nonvolatilely storing data identified by an electrically rewritable resistance value; a first data latch storing write and erase data to be written on a given group of memory cells of the memory cell array for a write and erase operation; and a second data latch storing reference data for performing a compensation operation of the given group to compensate write and erase disturbance accompanied by the write or erase operation. | 01-08-2009 |
20090010040 | RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device includes: a memory chip having memory cells of a resistance change type; and a heater so attached to the memory chip as to apply a temperature bias to the memory chip. | 01-08-2009 |
20090016094 | Selection device for Re-Writable memory - A memory cell including a memory element and a non-ohmic device (NOD) that are electrically in series with each other is disclosed. The NOD comprises a semiconductor based selection device operative to electrically isolate the memory element from a range of voltages applied across the memory cell that are not read voltages operative read stored data from the memory element or write voltages operative to write data to the memory element. The selection device may comprise a pair of diodes that are electrically in series with each other and disposed in a back-to-back configuration. The memory cell may be fabricated over a substrate (e.g., a silicon wafer) that includes active circuitry. The selection device and the semiconductor materials (e.g., poly-silicon) that form the selection device are fabricated above the substrate and are integrated with other thin film layers of material that form the memory cell. | 01-15-2009 |
20090021976 | Method of Operating an Integrated Circuit, Integrated Circuit, and Memory Module - A method of operating an integrated circuit is provided. The integrated circuit includes a plurality of resistivity changing memory cells and at least one resistivity changing reference cell; a voltage comparator including a first input terminal and a second input terminal; a signal line being connected to the plurality of resistivity changing memory cells, the at least one resistivity changing reference cell, and the second input terminal; and a switching element connecting the first input terminal to the second input terminal. The method includes: closing the switching element; supplying a first voltage to the first input terminal via the signal line and the switching element; opening the switching element; supplying a second voltage to the second input terminal via the signal line; and comparing the first voltage and the second voltage using the voltage comparator, wherein the first voltage represents a memory state of a resistivity changing memory cell, and the second voltage is a reference voltage which represents a memory state of a resistivity changing reference cell, or vice versa. | 01-22-2009 |
20090027943 | RESISTIVE MEMORY INCLUDING BIDIRECTIONAL WRITE OPERATION - A memory includes a first electrode, a second electrode, and a resistive memory element coupled between the first electrode and the second electrode. The memory includes a circuit configured to write a data value to the resistive memory element by sequentially applying a first signal from the first electrode to the second electrode and a second signal from the second electrode to the first electrode. | 01-29-2009 |
20090027944 | Increased Switching Cycle Resistive Memory Element - An integrated circuit including a resistive memory element and a method of manufacturing the integrated circuit are described. The method of manufacturing the integrated circuit includes depositing a switching layer material and intentionally forming inhomogeneously distributed defects within the switching layer material to increase a number of switching cycles of the resistive memory element. The resistive memory element includes a switching layer that selectively switches between a low resistance state and a high resistance state. The switching layer contains intentionally formed defects that increase the number of switching cycles of the switching layer. | 01-29-2009 |
20090034319 | PHASE CHANGE MEMORY DEVICE HAVING SCHOTTKY DIODE AND METHOD OF FABRICATING THE SAME - A phase change memory device includes wordlines extending along a direction on a semiconductor substrate. Low concentration semiconductor patterns are disposed on the wordlines. Node electrodes are disposed on the low concentration semiconductor patterns. Schottky diodes are disposed between the low concentration semiconductor patterns and the node electrodes. Phase change resistors are disposed on the node electrodes. | 02-05-2009 |
20090034320 | RESISTANCE CHANGE MEMORY AND WRITE METHOD OF THE SAME - A resistance change memory includes a resistance change element having a high-resistance state and a low-resistance state in accordance with write information, and a write circuit configured to supply a write current that the write current flowing through the resistance change element is held constant before and after the resistance change element is changed from the high-resistance state to the low-resistance state, and apply a write voltage that the write voltage applied to the resistance change element is held constant before and after the resistance change element is changed from the low-resistance state to the high-resistance state. | 02-05-2009 |
20090040809 | STORAGE DEVICE - A storage device includes: a wiring including a first conductor with a first conductivity; and first, second and third contacts, each including a second conductor with a second conductivity and contacting the wiring. The storage device also includes: a write switching circuit controlling current for writing information that flows through the first contact, the wiring, and the second contact, and changing resistance values of the first contact to write information; and a read switching circuit controlling current for reading information that flows through the first contact, the wiring, and the third contact. | 02-12-2009 |
20090046495 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a memory cell selecting circuit which selects a selected memory cell (M | 02-19-2009 |
20090046496 | NONVOLATILE MEMORY DEVICE - A variable resistance element ( | 02-19-2009 |
20090052225 | Nonvolatile Semiconductor Memory Device - A nonvolatile semiconductor memory device capable of suppressing parasitic currents in unselected memory cells, in cross-point array including memory cells comprising a two-terminal circuit having a variable resistor storing information according to electric resistance change due to electric stress. The memory cell comprises a series circuit of the variable resistive element holding a variable resistor between an upper and lower electrodes, and the two-terminal element having non-linear current-voltage characteristics making currents flow bi-directionally. The two-terminal element has a switching characteristic that currents bi-directionally flow according to polarity of a voltage applied to both ends when an absolute voltage value exceeds a certain value, and currents larger than predetermined minute currents do not flow when the absolute value is the certain value or less, and can make currents whose current density is 30 kA/cm | 02-26-2009 |
20090052226 | Resistive random access memory device - Provided is a resistive random access memory device that includes a storage node connected to a switching device. The resistive random access memory device includes a first electrode, a resistance variable layer, and a second electrode which are sequentially stacked, wherein a diffusion blocking layer is formed between the first electrode and the resistance variable layer or between the resistance variable layer or/and the second electrode. | 02-26-2009 |
20090052227 | NON-VOLATILE MEMORY DEVICE AND METHOD FOR WRITING DATA THERETO - The present invention provides a method for writing data to a non-volatile memory device having first wirings and second wirings intersecting one another and memory cells arranged at each intersection therebetween, each of the memory cells having a variable resistive element and a rectifying element connected in series. According to the method, the second wirings are charged to a certain voltage not less than a rectifying-element threshold value, prior to a rise in a selected first wiring. Then, a selected first wiring is charged to a voltage required for writing or erasing, after which a selected second wiring is discharged. | 02-26-2009 |
20090052228 | OPERATING PROCESS OF ORGANIC DEVICE - An operating process of an organic device includes performing a programming process and an erasing process. The programming process includes steps of applying a first positive bias from the first electrode to the second electrode on the organic device so that a conductive state of the organic device is switched to be a first turn-on state when the organic device is in a turn-off state and applying a negative bias from the first electrode to the second electrode on the organic device so that the conductive state of the organic device is switched to be a second turn-on state when the organic device is in the first turn-on state. The erasing process includes a step of applying a second positive bias from the first electrode to the second electrode on the organic device so that the conductive state of the organic device is switched to be the turn-off state. | 02-26-2009 |
20090059650 | Memory Device, Semiconductor Device, and Electronic Device - To provide a memory device which can maintain data accurately even when memory characteristics of a memory element deteriorate over time. The memory device includes a memory cell | 03-05-2009 |
20090059651 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF WRITING INTO THE SAME - A method of writing into a semiconductor memory device, which includes a resistance memory element | 03-05-2009 |
20090059652 | Resistive memory cell array with common plate - In the present method of changing the state of a resistive memory device which is capable of adopting an erased, relatively higher resistance state and a programmed, relatively lower resistance state, the resistive memory device having first and second electrodes and an active layer between the first and second electrodes, an electrical potential is applied across the electrodes and current through the resistive memory device is limited by means of a first current limiting structure to change the resistive memory device from the erased, higher resistance state to the programmed, lower resistance state. Furthermore, an electrical potential is applied across the electrodes and current through the resistive memory device is limited by means of a second current limiting structure to change the resistive memory device from the programmed, lower resistance state to the erased, higher resistance state. | 03-05-2009 |
20090067212 | MAGNETIC RANDOM ACCESS MEMORY AND DATA READ METHOD OF THE SAME - A magnetic random access memory includes a memory element having a first fixed layer, a first recording layer, and a first nonmagnetic layer, a first reference element having a second fixed layer, a second recording layer, and a second nonmagnetic layer, antiparallel data being written in the first reference element, a second reference element making a pair with the first reference element, and having a third fixed layer, a third recording layer, and a third nonmagnetic layer, parallel data being written in the second reference element, and a current source which, when a read operation is performed, supplies a current from the second fixed layer to the second recording layer in the first reference element, and supplies the current from the third recording layer to the third fixed layer in the second reference element. | 03-12-2009 |
20090067213 | Method of forming controllably conductive oxide - In fabricating a memory device, a first electrode is provided. An alloy is formed thereon, and the alloy is oxidized to provide an oxide layer. A second electrode is provided on the oxide layer. In a further method of fabricating a memory device, a first electrode is provided. Oxide is provided on the first electrode, and an implantation step in undertaken to implant material in the oxide to form a layer including oxide and implanted material having an oxygen deficiency and/or defects therein. A second electrode is then formed on the layer. | 03-12-2009 |
20090067214 | Electric element, memory device, and semiconductor integrated circuit - An electric element includes a first terminal ( | 03-12-2009 |
20090067215 | Electric element, memory device, and semiconductor integrated circuit - An electric element comprises: a first electrode ( | 03-12-2009 |
20090067216 | RESISTIVE MEMORY DEVICES INCLUDING SELECTED REFERENCE MEMORY CELLS - A magnetic memory cell array device can include a first current source line extending between pluralities of first and second memory cells configured for respective simultaneous programming and configured to conduct adequate programming current for writing one of the pluralities of first and second memory cells, a first current source transistor coupled to the first current source line and to a word line, a programming conductor coupled to the first current source transistor and extending across bit lines coupled to the one of the pluralities of first and second memory cells, configured to conduct the programming current across the bit lines, a second current source transistor coupled to the programming conductor and configured to switch the programming current from the programming conductor to a second current source transistor output, a second current source line extending adjacent the one of the pluralities of first and second memory cells opposite the first current source line, a first bias circuit configured to apply a first bias voltage to the first or second memory cells selected for accessed during a read operation, and a second bias circuit configured to apply a second bias voltage to the first or second memory cells unselected for access during the read operation. | 03-12-2009 |
20090073741 | NAND-STRUCTURED SERIES VARIABLE-RESISTANCE MATERIAL MEMORIES, PROCESSES OF FORMING SAME, AND METHODS OF USING SAME - A variable-resistance material memory array includes a series of variable-resistance material memory cells. The series of variable-resistance material memory cells is in parallel with a corresponding series of control gates. A select gate is also in series with the variable-resistance material memory cells. Writing/reading/erasing to a given variable-resistance material memory cell includes turning off the corresponding control gate, while turning on all other control gates. Devices include the variable-resistance material memory array. | 03-19-2009 |
20090073742 | SEMICONDUCTOR STORAGE DEVICE AND OPERATING METHOD OF THE SAME - A semiconductor storage device includes: reading blocks; third wirings; reading switches; a control circuit; and evaluating circuits. The reading blocks includes first and second wirings extended in a first and second direction, respectively, and resistive storage elements arranged at points where the first and second wirings intersect. The third wirings is extended in the second direction and provided correspondingly to the second wirings. The reading switches are arranged between the third and second wirings. The control circuit controls the reading switches and supplies currents or the like to the first wirings. The evaluating circuits are connected to the third wirings and evaluate the currents or the like. When data is read out, the control circuit selects a selection reading block and a selection first wiring and supplies the currents or the like, and the evaluating circuits execute the evaluations of the currents or the like in the third wirings. | 03-19-2009 |
20090091968 | INTEGRATED CIRCUIT INCLUDING A MEMORY HAVING A DATA INVERSION CIRCUIT - An integrated circuit includes an array of resistivity changing memory cells. The integrated circuit includes a circuit configured to invert a data word to be written to the array in response to determining that writing the inverted data word would use less power than writing the non-inverted data word. | 04-09-2009 |
20090091969 | RESISTANCE CHANGE MEMORY - A resistance change memory includes a memory cell which is connected to a first node, and programmed from a first resistance state to a second resistance state, a first replica cell which is connected to a second node, generates a write voltage for programming from the first resistance state to the second resistance state, and is fixed in the first resistance state, and a first constant-current source connected to the second node, wherein when writing the second resistance state in the memory cell, a voltage of the first node is held equal to that of the second node. | 04-09-2009 |
20090097300 | VARIABLE RESISTANCE ELEMENT, ITS MANUFACTURING METHOD AND SEMICONDUCTOR MEMORY DEVICE COMPRISING THE SAME - Provided is a variable resistance element capable of performing a stable resistance switching operation and having a favorable resistance value retention characteristics, comprising a variable resistor | 04-16-2009 |
20090103350 | Method of Testing an Integrated Circuit, Method of Manufacturing an Integrated Circuit, and Integrated Circuit - According to one embodiment of the present invention, a method of testing a memory device including a memory cell array is provided, the method including: dividing the memory cell array into a plurality of memory cell array subunits, each memory cell array subunit including a plurality of resistivity changing memory cells; simultaneously testing all resistivity changing memory cells of a memory cell array subunit using a common testing signal; and repeating the testing for all further memory cell array subunits. | 04-23-2009 |
20090109727 | Erase, programming and leakage characteristics of a resistive memory device - The present method provides annealing of a resistive memory device so as to provide that the device in its erased state has a greatly increased resistance as compared to a prior art approach. The annealing also provides that the device may be erased by application of any of a plurality of electrical potentials within an increased range of electrical potentials as compared to the prior art. | 04-30-2009 |
20090109728 | RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device including memory cells arranged, the memory cell having a stable state with a high resistance value and storing in a non-volatile manner such multi-level data that at least three resistance values, R | 04-30-2009 |
20090109729 | RESISTANCE CHANGE MEMORY DEVICE AND METHOD FOR ERASING THE SAME - A resistance change memory device including a cell array with memory cells arranged therein to store a resistance value as data in a non-volatile manner, and an erase circuit configured to set the memory cells in the cell array in a reset state prior to data writing, wherein the erase circuit includes: an erase current generating circuit configured to output erase current of the cell array; multiple switch devices so disposed on current paths between the erase current generating circuit and the respective divided areas defined in the cell array as to supply the erase current to the divided areas; and a control circuit configured to sequentially turn on the switch devices. | 04-30-2009 |
20090109730 | RESISTANCE MEMORY ELEMENT - A resistance memory element includes an elementary body and opposing electrodes separated by at least a portion of the elementary body. The elementary body is preferably made of a strontium titanate-based semiconductor ceramic expressed by the formula: (Sr | 04-30-2009 |
20090122590 | CONTROL OF A MEMORY MATRIX WITH RESISTANCE HYSTERESIS ELEMENTS - A control circuit ( | 05-14-2009 |
20090122591 | Sense Amplifier Biasing Method and Apparatus - A memory device comprises sense amplifier circuitry, a current sink and a resistive element. The sense amplifier circuitry is operable to evaluate data read from a memory array included in the memory device responsive to a bias voltage applied to the sense amplifier circuitry. The current sink is operable to sink a bias current. The resistive element couples the current sink to the sense amplifier circuitry. The bias voltage applied to the sense amplifier circuitry corresponds to the voltage drop across the resistive element and current sink as induced by the bias current. | 05-14-2009 |
20090122592 | NON-VOLATILE MEMORY DEVICE AND METHOD OF READING DATA THEREFROM - The present invention provides a method of reading data from a non-volatile memory device including word lines and bit lines that intersect each other and electrically rewritable memory cells that are arranged at intersections of the word lines and the bit lines and that respectively have variable resistive elements nonvolatily storing a resistances as data. The method includes: precharging a selected word line and unselected word lines to a first word line voltage and a selected bit line and unselected bit lines to a first bit line voltage; and reading data from a memory cell connected to the selected word line and the selected bit line by changing the voltage of the selected word line from the first word line voltage to a second word line voltage and changing the voltage of the selected bit line from the first bit line voltage to a second bit line voltage after the precharging. | 05-14-2009 |
20090122593 | Write driver circuit for phase-change memory, memory including the same, and associated methods - A write driver circuit for a memory that includes phase-change memory cells changeable between a RESET state resistance and a SET state resistance in response to an applied current pulse, the write driver circuit including a write current level adjusting unit configured to determine first to n-th SET state current levels in response to a SET state current level signal, where n is an integer greater than 1, and configured to determine a RESET state current level in response to a RESET state current level signal, and a write current output unit configured to generate one of a SET state current pulse and a RESET state current pulse corresponding to a SET state current level or a RESET state current level determined by the write current level adjusting unit. | 05-14-2009 |
20090129140 | Nonvolatile Semiconductor Storage Device and Method for Operating Same - A nonvolatile semiconductor memory device for suppressing a current consumption caused by a transient current because of the potential change of the bit and word lines at the time of shifting between the programming, reading, and erasing actions in a highly integrated memory cell array is provided. A memory cell ( | 05-21-2009 |
20090129141 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a memory cell array having a plurality of memory cells which are set into low-resistance states/high-resistance states according to “0” data/“1” data. An allocation of the “0” data/“1” data and the low-resistance state/high-resistance state is switched when a power source is turned on. | 05-21-2009 |
20090135641 | Semiconductor memory device - A semiconductor memory device ( | 05-28-2009 |
20090135642 | RESISTIVE MEMORY DEVICES INCLUDING SELECTED REFERENCE MEMORY CELLS OPERATING RESPONSIVE TO READ OPERATIONS - A Resistance based Random Access Memory (ReRAM) can include a sense amplifier circuit that includes a first input coupled to a bit line of a reference cell in a first block of the ReRAM responsive to a read operation to a second block. | 05-28-2009 |
20090147558 | VARIABLE RESISTANCE ELEMENT, METHOD FOR PRODUCING THE SAME, AND NONVOLATILE SEMICONDUCTOR STORAGE DEVICE - The variable resistance element of the present invention is a variable resistance element having an electrode, the other electrode, and a metal oxide material sandwiched between the electrodes and having an electrical resistance, between the electrodes, changing reversibly in response to a voltage applied between the electrodes. The variable resistance element further includes, inside the metal oxide material, a low resistance material having a lower electrical resistance than the metal oxide material and being out of contact with at least either one of the electrodes. This makes it possible to reduce a forming voltage for providing a conductive section inside the metal oxide material, without causing a leakage current to increase. | 06-11-2009 |
20090154221 | Non-Volatile memory device using variable resistance element with an improved write performance - A non-volatile memory device using a variable resistive element is provided. The non-volatile memory device includes a memory cell array having a plurality of non-volatile memory cells, a first voltage generator generating a first voltage, a voltage pad receiving an external voltage that has a level higher than the first voltage, a sense amplifier supplied with the first voltage and reading data from the non-volatile memory cells selected from the memory cell array, and a write driver supplied with the external voltage and writing data to the non-volatile memory cells selected from the memory cell array. | 06-18-2009 |
20090154222 | OPERATION METHOD FOR MULTI-LEVEL SWITCHING OF METAL-OXIDE BASED RRAM - Memory devices and methods for operating such devices are described herein. A method as described herein for operating a memory device includes applying a sequence of bias arrangements across a selected metal-oxide memory element to change the resistance state from a first resistance state in a plurality of resistance states to a second resistance state in the plurality of resistance states. The sequence of bias arrangements comprise a first set of one or more pulses to change the resistance state of the selected metal-oxide memory element from the first resistance state to a third resistance state, and a second set of one or more pulses to change the resistance state of the selected metal-oxide memory element from the third resistance state to the second resistance state. | 06-18-2009 |
20090161406 | NON-VOLATILE MEMORY AND METHOD FOR FABRICATING THE SAME - A non-volatile memory including a diode and a memory cell is described. The diode includes a doped region, a metal silicide layer, and a patterned doped semiconductor layer. The doped region of a first conductive type is formed in a substrate. The metal silicide layer is formed on the substrate. The patterned doped semiconductor layer of a second conductive type is formed on the metal silicide layer. The memory cell is formed on the substrate and coupled with the diode. | 06-25-2009 |
20090161407 | Drive Method of Nanogap Switching Element and Storage Apparatus Equipped with Nanogap Switching Element - A nanogap switching element is equipped with an inter-electrode gap portion including a gap of a nanometer order between a first electrode and a second electrode. A switching phenomenon is caused in the inter-electrode gap portion by applying a voltage between the first and second electrodes. The nanogap switching element is shifted from its low resistance state to its high resistance state by receiving a voltage pulse application of a first voltage value, and shifted from its high resistance state to its low resistance state by receiving a voltage pulse application of a second voltage value lower than the first voltage value. When the nanogap switching element is shifted from the high resistance state to the low resistance state, a voltage pulse of an intermediate voltage value between the first and second voltage values is applied thereto before the voltage pulse application of the second voltage value thereto. | 06-25-2009 |
20090161408 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprises a memory cell array including memory cells arranged in matrix each having a selective transistor and a variable resistance element having an electric resistance changed from a first state to a second state by applying a first write voltage and from the second state to the first state by applying a second write voltage. A first write current for a first writing operation to change the electric resistance from the first state to the second state is larger than a second write current for a second writing operation to change it from the second state to the first state. A second memory cell number of memory cells subjected to the second writing operation at a time is greater than a first memory cell number of memory cells subjected to the first writing operation at a time. At least the second memory cell number is plural. | 06-25-2009 |
20090168491 | MEMORY CELL THAT EMPLOYS A SELECTIVELY FABRICATED CARBON NANO-TUBE REVERSIBLE RESISTANCE-SWITCHING ELEMENT AND METHODS OF FORMING THE SAME - In some aspects, a method of fabricating a memory cell is provided that includes (1) fabricating a steering element above a substrate; and (2) fabricating a reversible-resistance switching element coupled to the steering element by selectively fabricating carbon nano-tube (CNT) material above the substrate. Numerous other aspects are provided. | 07-02-2009 |
20090168492 | Two terminal nonvolatile memory using gate controlled diode elements - A nonvolatile memory cell includes a gate controlled diode steering element and a resistivity switching element. | 07-02-2009 |
20090168493 | SEMICONDUCTOR MEMORY DEVICE WITH STACKED MEMORY CELL AND METHOD OF MANUFACTURING THE STACKED MEMORY CELL - In a semiconductor memory device and method, resistive-change memory cells are provided, each including a plurality of control transistors formed on different layers and variable resistance devices comprising a resistive-change memory. Each resistive-change memory cell includes a plurality of control transistors formed on different layers, and a variable resistance device formed of a resistive-change memory. In one example, the number of the control transistors is two. The semiconductor memory device includes a global bit line; a plurality of local bit lines connected to or disconnected from the global bit line via local bit line selection circuits which correspond to the local bit lines, respectively; and a plurality of resistive-change memory cell groups storing data while being connected to the local bit lines, respectively. Each of the resistive-change memory cells of each of the resistive-change memory cell groups comprises a plurality of control transistors formed on different layers, and a variable resistance device formed of a resistive-change memory. In addition, the semiconductor memory device has a hierarchical bit line structure that uses a global bit line and local bit lines. Accordingly, it is possible to increase both the integration density of the semiconductor memory device and the amount of current flowing through each of the resistive-change memory cells. | 07-02-2009 |
20090168494 | Semiconductor device having resistance based memory array, method of operation, and systems associated therewith - In one embodiment, the semiconductor device includes a non-volatile memory cell array, a write circuit configured to write to the non-volatile memory cell array, and a control circuit. The control circuit is configured to store at least one erase indicator. The erase indicator is associated with at least a portion of the non-volatile memory cell array and indicates a logic state. The control circuit is configured to control the write circuit to write the logic state indicated by the erase indicator in the non-volatile memory cell array during an erase operation of the associated portion of the non-volatile memory cell array. | 07-02-2009 |
20090168495 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF WRITING INTO SEMICONDUCTOR MEMORY DEVICE - In the semiconductor memory device having a resistance memory element, a first transistor having a drain terminal connected to one end of the resistance memory element and a source terminal connected to a ground voltage, and a second transistor having source terminal connected to the resistance memory element, when a write voltage is applied to the resistance memory element via the second transistor to switch the resistance memory element from a low resistance state to a high resistance state, a voltage is controlled to be a value which is not less than a reset voltage and less than a set voltage by applying to a gate terminal of the second transistor a voltage which is not less than a total of the reset voltage and a threshold voltage of the second transistor and is less than a total of the set voltage and the threshold voltage. | 07-02-2009 |
20090190388 | RESISTIVE MEMORY AND METHODS FOR FORMING SAME - A method of fabricating a resistive storage device is provided. The method generally comprises providing an electrode structure stack comprising a first electrode and an electrode structure mask arranged at the first electrode, forming a support structure at least partly at the electrode structure mask, removing the electrode structure mask to leave a storage region window in the support structure, and forming a resistive storage region in the storage region window at the first electrode. | 07-30-2009 |
20090196087 | Non-volatile register - A non-volatile register is disclosed. The non-volatile register includes a memory element. The memory element comprises a first end and a second end. The non-volatile register includes a register logic connected with the first and second ends of the memory element. The register logic is positioned below the memory element. The memory element may be a two-terminal memory element configured to store data as a plurality of conductivity profiles that can be non-destructively determined by applying a read voltage across the two terminals. New data can be written to the two-terminal memory element by applying a write voltage of a predetermined magnitude and/or polarity across the two terminals. The two-terminal memory element retains stored data in the absence of power. A reference element including a structure that is identical or substantially identical to the two-terminal memory element may be used to generate a reference signal for comparisons during read operations. | 08-06-2009 |
20090196088 | RESISTANCE CONTROL IN CONDUCTIVE BRIDGING MEMORIES - An integrated circuit may comprise one or more resistive storage cells, wherein each resistive storage cell comprises a resistive storage medium that is switchable between at least a high resistive state and a low resistive state; and a resistance element communicatively coupled to the resistive storage medium in series. | 08-06-2009 |
20090196089 | Phase change material, phase change memory device including the same, and methods of manufacturing and operating the phase change memory device - Disclosed may be a phase change material alloy, a phase change memory device including the same, and methods of manufacturing and operating the phase change memory device. The phase change material alloy may include Si and Sb. The alloy may be a Si—O—Sb alloy further including O. The Si—O—Sb alloy may be Si | 08-06-2009 |
20090201714 | RESISTIVE MEMORY CELL AND METHOD FOR OPERATING SAME - An integrated circuit comprising at least one resistive memory cell, comprising a resistive memory element and a selection device, said resistive memory element having at least two resistive OFF-states, each OFF-state defining a predefined resistance value is described. Moreover, a memory, a computing system and method of operating a memory are described. | 08-13-2009 |
20090201715 | Carbon Diode Array for Resistivity Changing Memories - An integrated circuit and method for manufacturing an integrated circuit are described. In one embodiment, the integrated circuit includes a memory cell including a resistivity changing memory element and a carbon diode electrically coupled to the resistivity changing memory element. | 08-13-2009 |
20090201716 | Memory Element with Positive Temperature Coefficient Layer - An integrated circuit including a memory element and method for manufacturing the integrated circuit are described. In some embodiments, the memory element includes a switching layer that selectively switches between a low resistance state and a high resistance state, and a positive temperature coefficient layer in thermal contact with the switching layer, the positive temperature coefficient layer having a resistance that increases in response to an increase in temperature. | 08-13-2009 |
20090201717 | RESISTANCE-CHANGE MEMORY - A resistance-change memory includes first and second bit lines running in the same direction, a third bit line running parallel to the first and second bit lines, fourth and fifth bit lines running in the same direction, a sixth bit line running parallel to the fourth and fifth bit lines, a first memory element which has one and the other terminals connected to the first and third bit lines, and changes to one of first and second resistance states, a first reference element having one and the other terminals connected to the fourth and sixth bit lines, and set in the first resistance state, a second reference element having one and the other terminals connected to the fifth and sixth bit lines, and set in the second resistance state, and a sense amplifier having first and second input terminals connected to the first and fourth bit lines. | 08-13-2009 |
20090207646 | INTEGRATED CIRCUIT WITH RESISTIVE MEMORY CELLS AND METHOD FOR MANUFACTURING SAME - An integrated circuit including a resistive memory cell and a method of manufacturing the integrated circuit are described. The integrated circuit comprises a plurality of resistive memory cells and a plurality of voltage supply contacts, wherein at least four resistive memory cells are in signal connection with one voltage supply contact. | 08-20-2009 |
20090207647 | NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND DATA WRITING METHOD THEREFOR - A nonvolatile semiconductor storage device comprises: a first wire and a second wire intersecting each other; a memory cell which is disposed at each intersection of the first wire and the second wire and electrically rewritable and in which a variable resistor for memorizing a resistance value as data in a nonvolatile manner and a rectifying device are connected in series; and a control circuit which applies a voltage necessary for writing of data to the first and second wires. The control circuit precharges a non-selected second wire up to a standby voltage larger than a reference voltage prior to a set operation for programming only a variable resistor connected to selected first and second wires by supplying the reference voltage to a non-selected first wire and the selected second wire, applying a program voltage necessary for programming of the selected variable resistor based on the reference voltage to the selected first wire and applying a control voltage which prevents the rectifying device from turning ON based on the program voltage to the non-selected second wire. | 08-20-2009 |
20090213639 | RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device including a memory cell array with first wirings, second wirings, and memory cells, the memory cell including a diode and a variable resistance element, anode of diodes being located on the first wiring side, wherein the memory cell array is sequentially set in the following three states after power-on: a waiting state defined by that both the first and second wirings are set at a first voltage; a standby state defined by that the first wirings are kept at the first voltage and the second wirings are set at a second voltage higher than the first voltage; and an access state defined by that a selected first wiring and a selected second wiring are set at a third voltage higher than the first voltage and the first voltage, respectively. | 08-27-2009 |
20090213640 | CURRENT DRIVEN MEMORY CELLS HAVING ENHANCED CURRENT AND ENHANCED CURRENT SYMMETRY - A method and system for providing and using a magnetic memory is described. The method and system include providing a plurality of magnetic storage cells. Each magnetic storage cell includes a magnetic element and a selection device coupled with the magnetic element. The magnetic element is programmed by write currents driven through the magnetic element in a first or second direction. In one aspect, the method and system include providing a voltage supply and a voltage pump coupled with the magnetic storage cells and the voltage supply. The voltage supply provides a supply voltage. The voltage pump provides to the selection device a bias voltage having a magnitude greater than the supply voltage. Another aspect includes providing a silicon on oxide transistor as the selection device. Another aspect includes providing to the body of the transistor a body bias voltage that is a first voltage when the transistor is off and a second voltage when the transistor is on. | 08-27-2009 |
20090219749 | METHOD AND APPARATUS FOR IMPLEMENTING CONCURRENT MULTIPLE LEVEL SENSING OPERATION FOR RESISTIVE MEMORY DEVICES - An apparatus for sensing the data state of a multiple level, programmable resistive memory device includes an active clamping device connected to a data leg that is selectively coupled a programmable resistive memory element, the clamping device configured to clamp a fixed voltage, at a first node of the data leg, across the memory element, thereby establishing a fixed current sinking capability thereof; and a plurality of differential amplifiers, each of the differential amplifiers configured to compare a first voltage input, taken at a second node of the data leg, with a second voltage input; wherein the second voltage input for each differential amplifier comprises different reference voltages with respect to one another so as to enable each differential amplifier to detect a different resistance threshold, thereby determining a specific resistance state of the programmable resistive memory element. | 09-03-2009 |
20090219750 | NONVOLATILE MEMORY DEVICE AND METHOD OF CONTROLLING THE SAME - A nonvolatile memory device comprises a memory cell array including first and second mutually crossing lines and electrically erasable programmable memory cells arranged at intersections of the first and second lines, each memory cell containing a variable resistive element; a line selector circuit operative to decode an address signal to select the first and second lines; and a control circuit operative to execute control on at least one of data erase, write and read for the memory cell connected between the first and second lines selected at the line selector circuit. The control circuit executes control based on one parameter selected among a plurality of parameters. The line selector circuit specifies the parameter based on a first address portion in the address signal and selects the first and second lines based on a second address portion in the address signal. | 09-03-2009 |
20090219751 | PHASE CHANGE MEMORY - A PCRAM cell has a high resistivity bottom electrode cap to provide partial heating near the interface between the cell and the bottom electrode, preventing separation of the amorphous GST region from the bottom electrode, and reducing the programming current requirements. | 09-03-2009 |
20090231905 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE, AND WRITING METHOD, READING METHOD AND ERASING METHOD OF NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device including a memory cell including a resistance memory element which changes from a low resistance state into a high resistance state by application of a voltage which is higher than a reset voltage and lower than a set voltage and changes from the high resistance state into the low resistance state by application of a voltage higher than the set voltage; a first transistor including a first source/drain diffused layer, and having one end of the first source/drain diffused layer coupled to one end of the resistance memory element; and a second transistor including a second source/drain diffused layer, and having one end of the second source/drain diffused layer coupled to said one end of the resistance memory element and the other end of the second source/drain diffused layer coupled to the other end of the resistance memory element. | 09-17-2009 |
20090237977 | SENSING RESISTANCE VARIABLE MEMORY - The present disclosure includes devices and methods for operating resistance variable memory. One device embodiment includes an array of memory cells wherein a number of the cells are commonly coupled to a select line, the number cells including a number of data cells programmable within a number of target threshold resistance (R | 09-24-2009 |
20090237978 | Semiconductor device having resistance based memory array, method of reading, and systems associated therewith - In one embodiment, the semiconductor device includes a non-volatile memory cell array. Memory cells of the non-volatile memory cell array are resistance based, and each memory cell has a resistance that changes over time after data is written into the memory cell. A write address buffer is configured to store write addresses associated with data being written into the non-volatile memory cell array, and a read unit is configured to perform a read operation to read data from the non-volatile memory cell array. The read unit is configured to control a read current applied to the non-volatile memory cell array during the read operation based on whether a read address matches one of the stored write addresses and at least one indication of settling time of the data being written into the non-volatile memory cell array. | 09-24-2009 |
20090237979 | SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR MEMORY SYSTEM - A semiconduct or memory device comprises a memory cell array including a plurality of memory cells arranged at intersections of word lines and bit lines; a read/write circuit operative to execute data read/write to the memory cell; and an operational circuit operative to compare certain length data read out by the read/write circuit from plural ones of the memory cells with certain length data to be written in the plural memory cells to make a decision, and create a flag representing the decision result. The read/write circuit inverts each bit in the certain length data to be written in the memory cells in accordance with the flag, and writes only rewrite-intended data of the certain length data and the flag. The read/write circuit reads the certain length data together with the flag corresponding thereto, and inverts each bit in the certain length data in accordance with the flag. | 09-24-2009 |
20090244953 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a memory cell array including first and second mutually crossing lines and electrically erasable programmable memory cells arranged at intersections of the first and second lines, each memory cell containing a variable resistive element; a data write circuit operative to apply a voltage required for data write to the memory cell via the first and second lines; and a current limit circuit operative to limit the value of current flowing in the memory cell on the data write at a certain current limit value. | 10-01-2009 |
20090251944 | MEMORY CELL HAVING IMPROVED MECHANICAL STABILITY - Memory cells are described along with methods for manufacturing. A memory cell described herein includes a bottom electrode comprising a base portion and a pillar portion on the base portion, the pillar portion and the base portion having respective outer surfaces and the pillar portion having a width less than that of the base portion. A memory element is on a top surface of the pillar portion of the bottom electrode, and a top electrode is on the memory element. A dielectric spacer contacts the outer surface of the pillar portion, the outer surface of the base portion of the bottom electrode self-aligned with an outer surface of the dielectric spacer. | 10-08-2009 |
20090251945 | SYSTEM AND METHOD OF OPERATION FOR RESISTIVE CHANGE MEMORY - The present invention provides a semiconductor device and a method for manufacturing thereof. The semiconductor device includes a data storage element which includes a variable resistance and an electrode, and a controller which selects a first mode that stores data by the resistance value of the variable resistance and a second mode that stores data by the amount of electrical charges stored in the electrode. By selectively using the data storage element in the first mode and the second mode, a plurality of storage modes can be implemented with a single data storage element. Thus, miniaturization and cost reduction of the semiconductor device can be achieved. | 10-08-2009 |
20090257264 | MEMORY AND METHOD OF EVALUATING A MEMORY STATE OF A RESISTIVE MEMORY CELL - An integrated circuit comprises a first signal line, a second signal line and a resistive memory cell. The resistive memory cell is actively connectable to the first signal line. The integrated circuit further comprises a coupling device configured to generate a difference of potential between the first and second signal line when the resistive memory cell is actively connected to the first signal line. | 10-15-2009 |
20090257265 | Multilevel nonvolatile memory device containing a carbon storage material and methods of making and using same - A nonvolatile memory cell includes a steering element located in series with a storage element. The storage element includes a carbon material and the memory cell includes a rewritable cell having multiple memory levels. | 10-15-2009 |
20090257266 | Multilevel nonvolatile memory device containing a carbon storage material and methods of making and using same - A method of programming a nonvolatile memory cell includes applying at least one initialization pulse having a duration of at least 1 ms, followed by applying plural programming pulses having a duration of less than 1 ms. The cell includes a steering element located in series with a storage element, and the storage element includes a carbon material. | 10-15-2009 |
20090257267 | NON-VOLATILE MULTI-LEVEL RE-WRITABLE MEMORY CELL INCORPORATING A DIODE IN SERIES WITH MULTIPLE RESISTORS AND METHOD FOR WRITING SAME - A very dense cross-point memory array of multi-level read/write two-terminal memory cells, and methods for its programming, are described. Multiple states are achieved using two or more films that each have bi-stable resistivity states, rather than “tuning” the resistance of a single resistive element. An exemplary memory cell includes a vertical pillar diode in series with two different bi-stable resistance films. Each bi-stable resistance film has both a high resistance and low resistance state that can be switched with appropriate application of a suitable bias voltage and current. Such a cross-point array is adaptable for two-dimensional rewritable memory arrays, and also particularly well-suited for three-dimensional rewritable (3D R/W) memory arrays. | 10-15-2009 |
20090257268 | Semiconductor device having single-ended sensing amplifier - A sense amplifier in a semiconductor storage device includes a memory cell for storing information on the basis of the size of the resistance value between a signal input/output terminal and a power supply terminal, the semiconductor storage device having a structure in which the bit line capacitance during signal reading from the memory cell is reduced, wherein the amplifier amplifies a signal outputted from an input/output terminal through the use of a single MOS transistor that has a single-ended structure. | 10-15-2009 |
20090257269 | Low-Complexity Electronic Circuits and Methods of Forming the Same - An electronic circuit such as a latch or a sequencer includes a plurality of transistors, all of the transistors being either NMOS transistors or PMOS transistors, and dissipates less than or approximately the same amount of power as an equivalent CMOS circuit. | 10-15-2009 |
20090257270 | DAMASCENE INTEGRATION METHODS FOR GRAPHITIC FILMS IN THREE-DIMENSIONAL MEMORIES AND MEMORIES FORMED THEREFROM - In some aspects, a microelectronic structure is provided that includes (1) a first conducting layer; (2) a first dielectric layer formed above the first conducting layer and having a feature that exposes a portion of the first conducting layer; (3) a graphitic carbon film disposed on a sidewall of the feature defined by the first dielectric layer and in contact with the first conducting layer at a bottom of the feature; and (4) a second conducting layer disposed above and in contact with the graphitic carbon film. Numerous other aspects are provided. | 10-15-2009 |
20090257271 | RESISTANCE CHANGE ELEMENT AND METHOD OF MANUFACTURING THE SAME - In a resistance change memory (ReRAM) storing data by utilizing change in resistance of a resistance change element, a lower electrode (ground-side electrode) of the resistance change element is formed of a transition metal such as Ni, and an upper electrode (positive polarity-side electrode) is configured of a noble metal such as Pt. In addition, a transition metal oxide film between the lower electrode and the upper electrode is formed of an oxide film (NiOx film) of a transition metal that is of the same kind as the transition metal constituting the lower electrode, for example. | 10-15-2009 |
20090262568 | SEMICONDUCTOR MEMORY DEVICE - A resistance variable memory reduces the nonuniformity of resistance values after programming, so that a rewrite operation can be performed on a memory cell at high speed. A reference resistor is connected in series with the resistance variable memory cell, and a sensor amplifier detects whether the potential at an intermediate node between the memory cell and the reference resistor exceeds a given threshold voltage, so as to stop the write operation based on a detection result. | 10-22-2009 |
20090262569 | SEMICONDUCTOR MEMORY DEVICE WITH STACKED MEMORY CELL STRUCTURE - A semiconductor device including: a first memory cell including a non-volatile first variable resistance element that stores data by varying a resistance value and a selection transistor that selects the first variable resistance element; a first memory layer provided with more than one such first memory cell arranged in a plane; a second memory cell including a non-volatile second variable resistance element that stores data by varying a resistance value and a selection diode that selects the second variable resistance element; and a second memory layer provided with more than one such second memory cell arranged in a plane; wherein more than one such second memory layer is stacked over the first memory layer. | 10-22-2009 |
20090268505 | Method of Operating an Integrated Circuit, and Integrated Circuit - According to one embodiment of the present invention, a method of operating an integrated circuit including a plurality of resistivity changing memory cells connected in parallel is provided. The method includes: choosing a resistivity changing memory cell having a first memory state out of the plurality of resistivity changing memory cells; measuring a first total resistance of the plurality of resistivity changing memory cells; setting the chosen resistivity changing memory cell to a second memory state, measuring a second total resistance of the plurality of resistivity changing memory cells; and determining the first memory state of the chosen resistivity changing memory cell in dependence on the first total resistance and the second total resistance. | 10-29-2009 |
20090268506 | STORAGE DEVICE INCLUDING A MEMORY CELL HAVING MULTIPLE MEMORY LAYERS - In a particular illustrative embodiment, a storage device includes a controller and a plurality of resistive elementary memory cells accessible via the controller. Each resistive elementary memory cell of the plurality of resistive elementary memory cells includes a plurality of memory layers selected to have hysteretic properties to store multiple data values. | 10-29-2009 |
20090268507 | PHASE CHANGE MEMORY DEVICE AND METHOD OF MANUFACTURE - A phase change memory control ring lower electrode is disclosed. The lower electrode includes an outer ring electrode in thermal contact with a phase change memory element, an inner seed layer disposed within the outer ring electrode and in contact with the phase change memory element, and an electrically conductive bottom layer coupled to the outer ring electrode. | 10-29-2009 |
20090268508 | Reverse leakage reduction and vertical height shrinking of diode with halo doping - One embodiment of the invention provides a semiconductor diode device including a first conductivity type region, a second conductivity type region, where the second conductivity type is different from the first conductivity type, an intrinsic region located between the first conductivity type region and the second conductivity type region; a first halo region of the first conductivity type located between the second conductivity type region and the intrinsic region, and optionally a second halo region of the second conductivity type located between the first conductivity type region and the intrinsic region. | 10-29-2009 |
20090268509 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a memory cell array including first and second mutually crossing lines and electrically erasable programmable memory cells arranged at intersections of the first and second lines, each memory cell containing a variable resistor operative to nonvolatilely store the resistance thereof as data and a first non-ohmic element operative to switch the variable resistor; and a clamp voltage generator circuit operative to generate a clamp voltage required for access to the memory cell and applied to the first and second lines. The clamp voltage generator circuit has a temperature compensation function of compensating for the temperature characteristic of the first non-ohmic element. | 10-29-2009 |
20090273964 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises: a two terminal structured variable resistive element, wherein resistive characteristics defined by current-voltage characteristics at both ends transit between low and high resistance states stably by applying a voltage satisfying predetermined conditions to the both ends, a transition from the low resistance state to the high resistance state occurs by applying a voltage of a first polarity whose absolute value is at or higher than a first threshold voltage, and the reverse transition occurs by applying a voltage of a second polarity whose absolute value is at or higher than a second threshold voltage; a load circuit connected to the variable resistive element in series having an adjustable load resistance; and a voltage generation circuit for applying a voltage to both ends of a serial circuit; wherein the variable resistive element can transit between the states by adjusting a resistance of the load circuit. | 11-05-2009 |
20090279343 | OPERATING METHOD OF ELECTRICAL PULSE VOLTAGE FOR RRAM APPLICATION - Metal-oxide based memory devices and methods for operating and manufacturing such devices are described herein. A method for manufacturing a memory device as described herein comprises forming a metal-oxide memory element, and applying an activating energy to the metal-oxide memory element. In embodiments the activating energy can be applied by applying electrical and/or thermal energy to the metal-oxide material. | 11-12-2009 |
20090279344 | RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device includes: a memory cell formed of a variable resistance element and a diode connected in series, the state of the variable resistance element being reversibly changed in accordance with applied voltage or current; and a stabilizing circuit so coupled in series to the current path of the memory cell as to serve for stabilizing the state change of the memory cell passively. | 11-12-2009 |
20090279345 | RESISTIVE MEMORY ELEMENT SENSING USING AVERAGING - A system for determining the logic state of a resistive memory cell element, for example an MRAM resistive cell element. The system includes a controlled voltage supply, an electronic charge reservoir, a current source, and a pulse counter. The controlled voltage supply is connected to the resistive memory cell element to maintain a constant voltage across the resistive element. The charge reservoir is connected to the voltage supply to provide a current through the resistive element. The current source is connected to the charge reservoir to repeatedly supply a pulse of current to recharge the reservoir upon depletion of electronic charge from the reservoir, and the pulse counter provides a count of the number of pulses supplied by the current source over a predetermined time. The count represents a logic state of the memory cell element. | 11-12-2009 |
20090285007 | INTEGRATED CIRCUIT WITH AN ARRAY OF RESISTANCE CHANGING MEMORY CELLS - An integrated circuit includes an array of resistance changing memory cells, and a circuit configured to apply an initialization signal to a first one of the memory cells that is in a virgin resistance state. The initialization signal is configured to modify the first memory cell without switching an operation state of the first memory cell. | 11-19-2009 |
20090285008 | MEMORY DEVICES WITH SELECTIVE PRE-WRITE VERIFICATION AND METHODS OF OPERATION THEREOF - A number of read cycles applied to a selected memory location of a memory device, such as a variable-resistance memory device, is monitored. Write data to be written to the selected memory location is received. Selective pre-write verifying and writing of the received write data to the selected memory location occurs based on the monitored number of read cycles. Selectively pre-write verifying and writing of the received write data may include, for example, writing received write data to the selected memory cell region without pre-write verification responsive to the monitored number of read cycles being greater than a predetermined number of read cycles | 11-19-2009 |
20090285009 | Nonvolatile memory devices using variable resistive elements - A nonvolatile memory device using a variable resistive element is provided. The nonvolatile memory device may include a memory cell array which includes an array of multiple nonvolatile memory cells having variable resistance levels depending on data stored. Word lines may be coupled with each column of the nonvolatile memory cells. Local bit lines may be coupled with each row of the nonvolatile memory cells. Global bit lines may be selectively coupled with the multiple local bit lines. | 11-19-2009 |
20090296449 | Integrated Circuit and Method of Operating an Integrated Circuit - According to one embodiment of the present invention, an integrated circuit is provided including a plurality of resistivity changing memory elements and a plurality of memory element select devices, wherein the select devices are floating body select devices. | 12-03-2009 |
20090296450 | Memory And Writing Method Thereof - A memory having a memory cell, a resistance estimator and a write current generator. The resistance estimator is coupled to the memory cell to estimate the resistance of the memory cell and outputs an estimated resistance level. According to the estimated resistance level, the write current generator generates a write current to flow through the memory cell and to change the resistance of the memory cell. The write current is in a pulse form, and the write current generator sets the pulse width, or magnitude, or both the pulse width and the magnitude of the write current according to the estimated resistance level. | 12-03-2009 |
20090296451 | RESISTANCE CHANGE MEMORY, AND DATA WRITE AND ERASE METHODS THEREOF - A resistance change memory includes a first interconnection, a second interconnection, a first resistance change element which has a first electrode, a second electrode, and a first tunnel insulating film provided between the first electrode and the second electrode, the first tunnel insulating film including a first trap region formed by introducing defects to trap holes or electrons, and the second electrode being connected to the first interconnection, and a first transistor whose current path has one end connected to the first electrode and the other end connected to the second interconnection. | 12-03-2009 |
20090296452 | Semiconductor device - A semiconductor device has a plurality of memory cells including memory elements to store information by varying resistance values of the memory elements. The semiconductor device further has a reference system circuit enables measurement of distribution of the resistance values for the plurality of memory cells. | 12-03-2009 |
20090303772 | Two-Terminal Reversibly Switchable Memory Device - A memory using mixed valence conductive oxides is disclosed. The memory includes a mixed valence conductive oxide that is less conductive in its oxygen deficient state and a mixed electronic ionic conductor that is an electrolyte to oxygen and promotes an electric field effective to cause oxygen ionic motion. | 12-10-2009 |
20090303773 | Multi-terminal reversibly switchable memory device - A memory using mixed valence conductive oxides is disclosed. The memory includes a mixed valence conductive oxide that is less conductive in its oxygen deficient state and a mixed electronic ionic conductor that is an electrolyte to oxygen and promotes an electric field effective to cause oxygen ionic motion. | 12-10-2009 |
20090303774 | METHODS OF OPERATING A BISTABLE RESISTANCE RANDOM ACCESS MEMORY WITH MULTIPLE MEMORY LAYERS AND MULTILEVEL MEMORY STATES - A method is described for operating a bistable resistance random access memory having two memory layer stacks that are aligned in series is disclosed. The bistable resistance random access memory comprises two memory layer stacks per memory cell, the bistable resistance random access memory operates in four logic states, a logic “00” state, a logic “01” state, a logic “10” state and a logic “11” state. The relationship between the four different logic states can be represented mathematically by the two variables n and f and a resistance R. The logic “0” state is represented by a mathematical expression (1+f)R. The logic “1” state is represented by a mathematical expression (n+f)R. The logic “2” state is represented by a mathematical expression (1+nf)R. The logic “3” state is represented by a mathematical expression n(1+f)R. | 12-10-2009 |
20090316471 | RESISTANCE CHANGE MEMORY - A resistance change memory includes first and second memory cell arrays which are adjacent to each other in a first direction, first and second reference cell arrays paired with the first and second memory cell arrays, a first sense amplifier shared by the first and second memory cell arrays and arranged between the first and second memory cell arrays, a first data bus which transfers data of a first readout cell in the first memory cell array to the first sense amplifier, and a second data bus which transfers data of a first reference cell in the first reference cell array to the first sense amplifier. The first and second data buses run on both sides of the first sense amplifier in a second direction and cross each other while sandwiching the first sense amplifier. | 12-24-2009 |
20090323391 | REVERSE SET WITH CURRENT LIMIT FOR NON-VOLATILE STORAGE - A storage system includes a substrate, control circuitry on the substrate, a three dimensional memory array (above the substrate) that includes a plurality of reversible resistance-switching elements, and circuits for limiting the SET current for the reversible resistance-switching elements. The memory cell is SET in a reverse biased fashion. | 12-31-2009 |
20090323392 | SMART DETECTION CIRCUIT FOR WRITING TO NON-VOLATILE STORAGE - A memory system includes a substrate, control circuitry on the substrate, a three dimensional memory array (above the substrate) that includes a plurality of memory cells with reversible resistance-switching elements, and a circuit for detecting the setting and resetting of the reversible resistance-switching elements. | 12-31-2009 |
20090323393 | CAPACITIVE DISCHARGE METHOD FOR WRITING TO NON-VOLATILE MEMORY - A memory system includes a substrate, control circuitry on the substrate, a three dimensional memory array (above the substrate) that includes a plurality of memory cells with reversible resistance-switching elements, and circuits for limiting the SET current for the reversible resistance-switching elements. The circuits for limiting the SET current provide a charge on one or more bit lines that is not sufficient to SET the memory cells, and then discharge the bit lines through the memory cells in order to SET the memory cells. | 12-31-2009 |
20090323394 | PULSE RESET FOR NON-VOLATILE STORAGE - A non-volatile storage system includes a substrate, control circuitry on the substrate, a three dimensional memory array (above the substrate) that includes a plurality of memory cells with reversible resistance-switching elements, and circuits to SET and RESET the resistance-switching elements. The circuits that RESET the resistance-switching elements provide a pulse to the memory cells that is large enough in magnitude to SET and RESET the memory cells, and long enough to potentially RESET the memory cell but not long enough to SET the memory cells. | 12-31-2009 |
20090323395 | SEMICONDUCTOR STORAGE DEVICE - A plurality of memory cells, each including a variable resistance element capable of having four or more values, are arranged at intersections of first wirings and second wirings. A control circuit selectively drives the first and second wirings. A sense amplifier circuit compares, with a reference voltage, a voltage generated by a current flowing through a selected memory cell. A reference voltage generation circuit includes: a resistance circuit including first and second resistive elements connected in parallel. Each of the first resistive elements has a resistance value substantially the same as a maximum resistance value in the variable resistance elements, and each of the second resistive elements has a resistance value substantially the same as a minimum resistance value in the variable resistance elements. A current regulator circuit averages currents flowing through the first and second resistive elements. | 12-31-2009 |
20090323396 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory according to an aspect of the invention including first and second bit lines, a word line, a resistive memory element which has one end and the other end, the one end being connected with the first bit line, a selective switch element which has a current path and a control terminal, one end of the current path being connected with the other end of the resistive memory element, the other end of the current path being connected with the second bit line, the control terminal being connected with the word line, a first column switch connected with the first bit line, a second column switch connected with the second bit line, wherein the first and second bit lines is activated and then the word line is activated when starting writing or reading data with respect to the resistive memory element. | 12-31-2009 |
20090323397 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND READING METHOD OF NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes a memory cell including a resistance memory element which memorizes a high resistance state or a low resistance state, switches the high resistance state and the low resistance state by voltage application, one end of the resistance memory element being coupled to a bit line, the other end of the resistance memory element being coupled to a source line via the first transistor; and a resistor whose resistance value is higher than a resistance value of the resistance memory element in the low resistance state and lower than a resistance value of the resistance memory element in the high resistance state, one end of the resistor being coupled to said one end of the resistance memory element and the bit line, the other end of the resistor being coupled to the source line via the second transistor. | 12-31-2009 |
20090323398 | SEMICONDUCTOR MEMORY DEVICE COMPRISING A PLURALITY OF STATIC MEMORY CELLS - A driver power supply circuit stepping down a power supply voltage is arranged at a power supply node of a word line driver. The driver power supply circuit includes a non-silicide resistance element of N+ doped polycrystalline silicon, and a pull-down circuit lowering a voltage level of the driver power supply node. The pull-down circuit includes a pull-down transistor having the same threshold voltage characteristics as a memory cell transistor pulling down a voltage level of the driver power supply node, and a gate control circuit adjusting at least a gate voltage of the pull-down transistor. The gate control circuit corrects the gate potential of the pull-down transistor in a manner linked to variations in threshold voltage of the memory cell transistor. | 12-31-2009 |
20100002490 | ELECTRIC ELEMENT, MEMORY DEVICE, AND SEMICONDUCTOR INTEGRATED CIRCUIT - An electric element includes: a first electrode; a second electrode; and a variable-resistance film connected between the first electrode and the second electrode. The variable-resistance film includes Fe | 01-07-2010 |
20100002491 | RESISTANCE RAM HAVING OXIDE LAYER AND SOLID ELECTROLYTE LAYER, AND METHOD FOR OPERATING THE SAME - A resistance RAM that is provided with an oxide layer and a solid electrolyte layer, and a method for operating the same are provided. The resistance RAM comprises a first electrode, an oxide layer that is formed on the first electrode, a solid electrolyte layer that is disposed on the oxide layer, and a second electrode that is disposed on the solid electrolyte layer. The method comprises the step of forming a conductive tip in the oxide layer by applying reference voltage to any one of the electrodes of the resistance RAM, applying foaming voltage to the remain one, such that the oxide layer is electrically broken. A conductive filament is formed in the solid electrolyte layer by applying a positive voltage to the second electrode on the basis of the voltage that is applied to the first electrode. The conductive filament that is formed in the solid electrolyte layer is removed by applying a negative voltage to the second electrode on the basis of the voltage that is applied to the first electrode. | 01-07-2010 |
20100002492 | RESISTANCE CHANGE MEMORY - A resistance change type memory includes a first device region and first and second bit lines provided above the first device region and along a first direction. First and second resistance change elements are connected to the first and second bit lines, respectively. A first transistor is serially connected to both the first and second resistance change elements, formed in the first device region, and has a first gate electrode extending along a second direction which intersects with the first direction. The first gate electrode has a gate width equal to a width in the second direction of the first device region. | 01-07-2010 |
20100008122 | Memory Device And Method For Making Same - An embodiment relates to a memory cell comprising a programmable resistance memory element electrically coupled to a heterojunction bipolar transistor. | 01-14-2010 |
20100008123 | Multiple series passive element matrix cell for three-dimensional arrays - A nonvolatile memory cell including at least two two-terminal non-linear steering elements arranged in series, and a resistivity switching storage element arranged in series with the at least two two-terminal non-linear steering elements. A memory array, comprising a plurality of the nonvolatile memory cells is also described. A method of forming a nonvolatile memory cell is also described. | 01-14-2010 |
20100008124 | Cross point memory cell with distributed diodes and method of making same - A cross point memory cell includes a portion of a first distributed diode, a portion of a second distributed diode, a memory layer located between the portion of the first distributed diode and the portion of a second distributed diode, a bit line electrically connected to the first distributed diode, and a word line electrically connected to the second distributed diode. | 01-14-2010 |
20100008125 | SEMICONDUCTOR MEMORY DEVICE AND REDUNDANCY METHOD THEREFOR - A memory cell array is formed by arranging memory cells at intersections of plural first wirings and plural second wirings, and a rectifying element and a variable resistive element are connected in series in the memory cell. The variable resistive element has at least a first resistance value and a second resistance value that is higher than the first resistance value. The control circuit selectively drives the first wirings and the second wirings. The control circuit can perform a short-circuit failure countermeasure program operation. In the short-circuit failure countermeasure program operation, the variable resistive element of the memory cell whose rectifying element is in a short-circuit failure state is programmed from the first resistance value to the second resistance value. | 01-14-2010 |
20100008126 | THREE-DIMENSIONAL MEMORY DEVICE - A three-dimensional memory device includes: a plurality of mats laminated therein, each having memory cells arranged in a two-dimensional manner; and access signal lines and data lines to select memory cells in each mat being shared between respective adjacent mats. Laminated mats are divided into three or more groups. When selecting one of these groups, memory cells in some of the remaining groups are biased so that a leakage current flows therethrough, while memory cells in the rest of the remaining groups are biased so that a leakage current does not flow therethrough. | 01-14-2010 |
20100008127 | RESISTANCE VARIABLE ELEMENT AND RESISTANCE VARIABLE MEMORY APPARATUS - A resistance variable element of the present invention and a resistance variable memory apparatus using the resistance variable element are a resistance variable element ( | 01-14-2010 |
20100008128 | RESISTIVE NONVOLATILE MEMORY ELEMENT, AND PRODUCTION METHOD OF THE SAME - An object of the present invention is to provide a resistive nonvolatile memory element having an electric current path which can be realized by a simple and convenient process, and capable of allowing for micro-fabrication. | 01-14-2010 |
20100014343 | NONVOLATILE MEMORY APPARATUS AND NONVOLATILE DATA STORAGE MEDIUM - [Objective] A nonvolatile memory apparatus and a nonvolatile data storage medium of the present invention, including nonvolatile memory elements each of which changes its resistance in response to electric pulses applied, comprises a first write circuit ( | 01-21-2010 |
20100014344 | Switchable two terminal multi-layer perovskite thin film resistive device and methods thereof - A switchable resistive device has a multi-layer thin film structure interposed between an upper conductive electrode and a lower conductive electrode. The multi-layer thin film structure comprises a perovskite layer with one buffer layer on one side of the perovskite layer, or a perovskite layer with buffer layers on both sides of the perovskite layer. Reversible resistance changes are induced in the device under applied electrical pulses. The resistance changes of the device are retained after applied electric pulses. The functions of the buffer layer(s) added to the device include magnification of the resistance switching region, reduction of the pulse voltage needed to switch the device, protection of the device from being damaged by a large pulse shock, improvement of the temperature and radiation properties, and increased stability of the device allowing for multivalued memory applications. | 01-21-2010 |
20100027314 | Preservation circuit and methods to maintain values representing data in one or more layers of memory - Circuitry and methods for restoring data in memory are disclosed. The memory may include at least one layer of a non-volatile two-terminal cross-point array that includes a plurality of two-terminal memory elements that store data as a plurality of conductivity profiles and retain stored data in the absence of power. Over a period of time, logic values indicative of the stored data may drift such that if the logic values are not restored, the stored data may become corrupted. At least a portion of each memory may have data rewritten or restored by circuitry electrically coupled with the memory. Other circuitry may be used to determine a schedule for performing restore operations to the memory and the restore operations may be triggered by an internal or an external signal or event. The circuitry may be positioned in a logic layer and the memory may be fabricated over the logic layer. | 02-04-2010 |
20100027315 | Resistive memory device and writing method thereof - A resistive memory device operates to sequentially activate bit lines, which are divided into plural groups, after precharging all of word and bit lines in a writing operation. The device is able to write a large amount of data therein at a high frequency, with a reduced the chip size. | 02-04-2010 |
20100027316 | NON-VOLATILE MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A non-volatile memory device having a stack structure, and a method of operating the non-volatile memory device In which the non-volatile memory device includes a plurality of variable resistors arranged in at least one layer. At least one layer selection bit line and a plurality of bit lines coupled to the plurality of the variable resistors are provided. A plurality of selection transistors coupled between the plurality of the bit lines and the plurality of the variable resistors are provided. | 02-04-2010 |
20100027317 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprising: a memory cell array in which memory cells each containing a variable resistive element and a rectifier element connected in series are arranged at intersections of a plurality of first wirings and a plurality of second wirings; and a control circuit for selectively driving said first wirings and said second wirings; wherein said control circuit applies a first voltage to said selected first wiring, and changes said first voltage based on the position of said selected memory cell within said memory cell array to apply a second voltage to said selected second wiring, so that a predetermined potential difference is applied to a selected memory cell arranged at the intersection between said selected first wiring and said selected second wiring. | 02-04-2010 |
20100027318 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a cell array including plural MATs (unit cell arrays) arranged in matrix, each MAT containing a plurality of first lines, a plurality of second lines intersecting the plurality of first lines, and a plurality of memory cells connected at intersections of the first and second lines between both lines, each memory cell containing an electrically erasable programmable variable resistive element of which resistance is nonvolatilely stored as data; and a plurality of write/erase circuits connected to the MATs and operative to execute data write or erase to the memory cells inside the MATs in accordance with input data. A part of the plurality of write/erase circuits writes data to memory cells inside a corresponding MAT while another part of the plurality of write/erase circuits erases data from memory cells inside a corresponding MAT at the same time. | 02-04-2010 |
20100027319 | RESISTANCE CHANGE ELEMENT, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR MEMORY - A resistance change element including a first electrode; a second electrode; and an oxide film, including an oxide of the first electrode, formed at sides of the first electrode and sandwiched between the first electrode and the second electrode in a plurality of regions, wherein at least one of the regions includes a resistance part whose resistance value changes in accordance with a voltage applied to the first and second electrodes. | 02-04-2010 |
20100027320 | RESISTANCE VARIABLE ELEMENT, RESISTANCE VARIABLE MEMORY APPARATUS, AND RESISTANCE VARIABLE APPARATUS - A resistance variable element ( | 02-04-2010 |
20100034009 | Asymmetric Write Current Compensation Using Gate Overdrive for Resistive Sense Memory Cells - Apparatus and associated method for asymmetric write current compensation for resistive sense memory (RSM) cells, such as but not limited to spin-torque transfer random access memory (STRAM) or resistive random access memory (RRAM) cells. In accordance with some embodiments, an RSM cell includes an RSM element coupled to a switching device. The switching device has a plurality of terminals. A control circuit compensates for asymmetric write characteristics of the RSM cell by limiting a range of voltage differentials across the terminals so as to be equal to or less than a magnitude of a source voltage applied to the switching device, thereby providing bi-directional write currents of substantially equal magnitude through the RSM element. | 02-11-2010 |
20100034010 | MEMORY DEVICES WITH CONCENTRATED ELECTRICAL FIELDS - Designs of resistance memory and phase change memory devices with memory cells having metallic inclusion at least in the area of electrode/medium layer interfaces. Such metallic inclusion is used to concentrate electric fields during writing. Consequently, resistance switching for the devices primarily occurs in the area of the metallic inclusion. As a result, better control of the resistance switching can be attained, thereby optimizing performance of the memory devices. | 02-11-2010 |
20100034011 | Multi-Terminal Resistance Device - Embodiments of the invention provide a multi-terminal resistance device with first and second electrodes, a shared third electrode, and a resistance layer providing first and second current paths between the shared third electrode and the first and second electrodes, respectively. A current state of the device may be programmed by applying one or more electrical signals along the first and/or second current paths to change a resistance of the device. In some embodiments, applying an electrical signal may switch a junction resistance of the first and/or second electrodes and the resistance layer between two or more resistance values. The device may include a shared fourth electrode to provide extra programming capability. In some embodiments, the device may be used to store a data state, to determine a count of multiple electrical signals, or to perform a logic operation between two electrical signals. | 02-11-2010 |
20100034012 | SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device having a plurality of unit cell arrays having memory cells each containing a first wiring and a second wiring intersecting each other, and a variable resistive element arranged at each intersection of said first wiring and said second wiring and electrically rewritable to nonvolatilely store a resistance value as data, characterized by comprising: a control circuit for applying a predetermined voltage to said memory cell in selectively accessing said memory cell; wherein said control circuit accumulates a predetermined electric charge in a parasitic capacitance of said memory cell included in a first unit cell array that is said specific unit cell array and not accessed at the first time, while on the other hand, accumulates a predetermined electric charge in a parasitic capacitance of said memory cell included in a second unit cell array that is said specific unit cell array other than said first unit cell array and not accessed at the second time after the passage of a predetermined time from said first time. | 02-11-2010 |
20100046272 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprising a memory cell array of cross-point type having memory cells each composed of a variable resistive element for storing information in the form of variation of the electrical resistance. The operating current in the programming operation is reduced. Main data lines (GDL | 02-25-2010 |
20100046273 | RESISTANCE CHANGE NONVOLATILE MEMORY DEVICE - Memory cells (MC) are formed at intersections of bit lines (BL) extending in the X direction and word lines (WL) extending in the Y direction. A plurality of basic array planes sharing the word lines (WL), each formed for a group of bit lines (BL) aligned in the Z direction, are arranged side by side in the Y direction. In each basic array plane, bit lines in even layers and bit lines in odd layers are individually connected in common. Each of selection switch elements ( | 02-25-2010 |
20100046274 | RESISTANCE CHANGE MEMORY - A resistance change memory includes two memory cell arrays each including a plurality of memory cells, the memory cells including variable resistive elements, two reference cell arrays provided to correspond to the two memory cell arrays, respectively, and each including a plurality of reference cells, the reference cells having a reference value, and a sense amplifier shared by the two memory cell arrays and detecting data in an accessed memory cell by use of a reference cell array corresponding to a second memory cell array different from a first memory cell array including the accessed memory cell. In reading the data, a particular reference cell in one reference cell array is always activated for an address space based on one memory cell array as a unit. | 02-25-2010 |
20100046275 | NONVOLATILE SEMICONDUCTOR STORAGE APPARATUS AND DATA PROGRAMMING METHOD THEREOF - The semiconductor storage apparatus includes a memory cell array including memory cells each having a rectifying element and a variable resistive element connected in series, the memory cells being arranged in crossing portions of a plurality of first wires and a plurality of second wires, and a control circuit configured to control charging to the first wire. The control circuit charges the first wire connected to a selected memory cell up to a first potential, and then set the first wire in a floating state. Then it charges another first wire adjacent to the first wire connected to the selected memory cell to a second potential. The potential of the first wire connected to the selected memory cell is thereby caused to rise to a third potential by coupling. | 02-25-2010 |
20100054014 | HIGH DENSITY RESISTANCE BASED SEMICONDUCTOR DEVICE - Memory devices are described along with methods for manufacturing. A memory device as described herein includes a plurality of memory cells located between word lines and bit lines. Each memory cell comprises a diode and a plurality of memory elements each comprising one or more metal-oxygen compounds, the diode and the plurality of memory elements arranged in electrical series along a current path between a corresponding word line and a corresponding bit line. | 03-04-2010 |
20100054015 | Non-volatile memory device and method of operating the same - Provided is a non-volatile memory device that may include a plurality of variable resistors, each of the variable resistors having first and second terminals, the plurality of variable resistors arranged as a first layer of a plurality of layers and having data storage capability, at least one common bit plane arranged as a second layer of the plurality of layers and coupled to the first terminal of each of the variable resistors of the first layer, and a plurality of bit lines coupled to the second terminal of each of the variable resistors of the first layer. | 03-04-2010 |
20100054016 | Semiconductor memory device having floating body type NMOS transistor - A semiconductor memory device comprises a memory cell array and a sense amplifier circuit. The memory cell array includes a first NMOS transistor which has a gate electrode connected to a word line and has one source/drain region connected to a bit line. The sense amplifier circuit includes a second NMOS transistor which has a gate electrode connected to the bit line and has one source/drain region connected to a predetermined voltage. In the semiconductor memory device, each of the first and second MOS transistors is a floating body type NMOS transistor, and the predetermined voltage is supplied to the bit line at least in a precharge operation, thereby preventing characteristic deterioration due to accumulation of holes in the floating body. | 03-04-2010 |
20100054017 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprising: a plurality of cell arrays having a plurality of first wirings and a plurality of second wirings intersecting each other and memory cells disposed at intersections between said first wirings and said second wirings, each containing a variable resistive element that is electrically rewritable and stores a resistance value as data; and a control circuit for selectively driving said first wirings and said second wirings; wherein said control circuit performs a first operation of applying a voltage required for one operation selected from the data write, read and erase operations to said one memory cell via one combination of said first and second wirings and a second operation of applying a voltage required for an operation selected from the data write, read and erase operations and different from the first operation to said other memory cell via another combination of said first and second wirings. | 03-04-2010 |
20100054018 | SEMICONDUCTOR MEMORY DEVICE AND INFORMATION PROCESSING SYSTEM - A semiconductor memory device comprises a memory cell array and a forming controller. The memory cell array includes a plurality of first memory cells each having a structure in which dielectric material is sandwiched between two electrodes, and the memory cell array is divided into a plurality of areas capable of being designated. The forming controller controls to perform “forming” for the first memory cells in an area selectively designated from the plurality of areas of the memory cell array, and as a result of the forming, the first memory cells are changed to non-volatile second memory cells. | 03-04-2010 |
20100054019 | RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device includes a cell array having multiple layers of mats laminated thereon, each of the mats having word lines and bit lines intersecting each other as well as resistance change type memory cells arranged at intersections thereof, each of the mats further having therein a reference cell and a reference bit line connected to the reference cell, the reference cell set to a state of a certain resistance value; a selection circuit configured to select a word line in each mat of the cell array, and select a bit line intersecting a selected word line and the reference bit line at the same time; and a sense amplifier configured to sense data by comparing respective cell currents of a selected memory cell on the selected bit line and the reference cell on the reference bit line. | 03-04-2010 |
20100054020 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a memory cell having a resistance which differs based on stored data, a bit line connected to the memory cell, a first MOSFET which clamps the bit line to a read voltage when reading data, a sense amplifier which detects the stored data in the memory cell based on a current flowing through the bit line, a first switch element which connects the sense amplifier to a drain of the first MOSFET, a second switch element which connects a source of the first MOSFET to the bit line, a third switch element which connects the drain of the first MOSFET to a ground terminal, and a fourth switch element which connects the source of the first MOSFET to a ground terminal. | 03-04-2010 |
20100061140 | INTEGRATED CIRCUIT INCLUDING DOPED SEMICONDUCTOR LINE HAVING CONDUCTIVE CLADDING - An integrated circuit includes an array of memory cells. Each memory cell includes a diode. The integrated circuit includes a doped semiconductor line formed in a semiconductor substrate. The doped semiconductor line is coupled to a row of diodes. The integrated circuit includes conductive cladding contacting the doped semiconductor line. | 03-11-2010 |
20100061141 | Non-volatile memory device and storage system including the same - A non-volatile memory device may include a plurality of data cells, each data cell of the plurality of data cells programmed to have a first resistance variation among a plurality of first resistance variations; and a plurality of reference cells, each reference cell of the plurality of reference cells programmed to have a second resistance variation among a plurality of second resistance variations. A change in a resistance of the data cells is used to identify a level of data programmed to memory. Because the resistance variation of the data cells may change with time or due to changes in temperature, a reference cell is also included in the non-volatile memory device. The reference cell is used for effective reading of the data value of a corresponding data cell. A storage system may include the non-volatile memory device. | 03-11-2010 |
20100061142 | MEMORY ELEMENT AND MEMORY APPARATUS - Memory elements ( | 03-11-2010 |
20100067281 | VARIABLE WRITE AND READ METHODS FOR RESISTIVE RANDOM ACCESS MEMORY - Variable write and read methods for resistance random access memory (RRAM) are disclosed. The methods include initializing a write sequence and verifying the resistance state of the RRAM cell. If a write pulse is needed, then two or more write pulses are applied through the RRAM cell to write the desired data state to the RRAM cell. Each subsequent write pulse has substantially the same or greater write pulse duration. Subsequent write pulses are applied to the RRAM cell until the RRAM cell is in the desired data state or until a predetermined number of write pulses have been applied to the RRAM cell. A read method is also disclosed where subsequent read pulses are applied through the RRAM cell until the read is successful or until a predetermined number of read pulses have been applied to the RRAM cell. | 03-18-2010 |
20100067282 | MEMORY ARRAY WITH READ REFERENCE VOLTAGE CELLS - The present disclosure relates to memory arrays with read reference voltage cells. In particular the present disclosure relates to variable resistive memory cell apparatus and arrays that include a high resistance state reference memory cell and a low resistance state reference memory cell that provides a reliable average reference voltage on chip to compare to a read voltage of a selected memory cell and determine if the selected memory cell is in the high resistance state or low resistance state. These memory arrays are particularly suitable for use with spin-transfer torque memory cells and resolves many systematic issues related to generation of a reliable reference voltage. | 03-18-2010 |
20100067283 | SENSE AMPLIFIER - A sense amplifier according to an example of the present invention has first, second, third and fourth FETs with a flip-flop connection. A drain of a fifth FET is connected to a first input node, and its source is connected to a power source node. A drain of a sixth FET is connected to a second input node, and its source is connected to the power source node. A sense operation is started by charging a first output node from the first input node with a first current and by charging a second output node from the second input node with a second current. The fifth and sixth FET are turned on after starting the sense operation. | 03-18-2010 |
20100073990 | Contemporaneous margin verification and memory access fr memory cells in cross point memory arrays - Circuitry and methods for restoring data values in non-volatile memory are disclosed. An integrated circuit includes a memory access circuit and a sensing circuit configured to sense a data signal during a read operation to at least one two-terminal non-volatile cross-point memory array. Each memory array includes a plurality of two-terminal memory cells. A plurality of the memory arrays can be fabricated over the substrate and vertically stacked on one another. Further, the integrated circuit can include a margin manager circuit configured to manage a read margin for the two-terminal memory cells substantially during the read operation, thereby providing for contemporaneous read and margin determination operations. Stored data read from the two-terminal memory cells may have a value of the stored data restored (e.g., re-written to the same cell or another cell) if the value is not associated with a read margin (e.g., a hard programmed or hard erased state). | 03-25-2010 |
20100073991 | STORAGE APPARATUS - According to one embodiment, a storage apparatus includes: a first inverter; a second inverter; a first storage element having a first state and a second state; and a second storage element having a third state and a fourth state, wherein the first storage element is brought into the first state when a current flows from the first storage element to the first storage element and is brought into the second state when the current flows from the first storage element to the first storage element, wherein the second storage element is brought into the fourth state when a current flows from the second storage element to the second storage element and is brought into the third state when the current flows from the second storage element to the second storage element. | 03-25-2010 |
20100073992 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a memory cell having a first resistance state and a second resistance state, a bit line connected to the memory cell, a reference cell fixed to the first resistance state, a reference bit line connected to the reference cell, and a generation circuit configured to generate a reading voltage and a reference voltage. The generation circuit includes a constant current source connected to a first node, a first replica cell connected between the first node and a second node and fixed to the first resistance state, a second replica cell connected between the second node and a third node and fixed to the second resistance state, a first resistance element connected between the first node and a fourth node, and a second resistance element connected between the fourth node and the third node. | 03-25-2010 |
20100073993 | MULTI-RESISTIVE INTEGRATED CIRCUIT MEMORY - A capacitor for use in integrated circuits comprises a layer of conductive material. The layer of conductive material including at least a first portion and a second portion, wherein the first portion and the second portion are arranged in a predetermined pattern relative to one another to provide a maximum amount of capacitance per semiconductor die area. | 03-25-2010 |
20100080037 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - Provided is a nonvolatile semiconductor device capable of performing writing operations of different resistance changes for memory cells having variable resistive elements whose resistive characteristics are changed by voltage applications, individually and simultaneously. The device comprises: a load resistive characteristic variable circuit for each bit line connected commonly with the memory cells on the same column for selecting one of two load resistive characteristics according to a first writing operation where the resistive characteristics of the variable resistive element to be written transit from a low resistance state to a high resistance state or a second writing operation where they transit reversely; and a writing voltage pulse application circuit for applying a first voltage pulse in a first writing operation and a second voltage pulse in a second writing operation to the memory cells to be written through the load resistive characteristic variable circuits and the bit limes. | 04-01-2010 |
20100080038 | SEMICONDUCTOR MEMORY DEVICE - An inexpensive nonvolatile memory having high performance which makes random write and readout possible an unlimited number of times is provided. A unit memory cell is formed of a MISFET having a channel body that is electrically isolated from a semiconductor substrate and a resistance change element having a two-terminal structure with one end electrically connected to a drain of the MISFET. The MISFET functions as a volatile memory element, and the resistance change element functions as a nonvolatile memory element, so that information stored in the MISFET is copied to the resistance change element before the power is turned OFF and information stored in the resistance change element is transferred to the MISFET when the power is turned ON, and thus, the MISFET is used as a volatile memory which makes random write and readout possible. | 04-01-2010 |
20100080039 | Nonvoltile memory device and method of driving the same - A nonvolatile memory device and a method of driving the same are provided, which adopt an improved write operation. The method of driving a nonvolatile memory device includes providing the nonvolatile memory device including a plurality of memory banks each having a plurality of local bit lines and a plurality of variable resistance memory cells; selectively connecting read global bit lines for reading data with the local bit lines, and firstly discharging the selectively connected local bit lines by turning on local bit line discharge transistors coupled to the read global bit lines; and selectively connecting write global bit lines for writing data with the local bit lines, and secondly discharging the selectively connected local bit lines by turning on global bit line discharge transistors. | 04-01-2010 |
20100080040 | Nonvolatile memory device and method of driving the same - A nonvolatile memory and a method of driving the same are provided, which adopt an improved write verify operation. The method of driving a nonvolatile memory device having variable resistance memory cells, bit lines coupled to the variable resistance memory cells, and column selection transistors coupled between the variable resistance memory cells and the bit lines to receive a first control voltage being applied to their gates, includes making the first control voltage at a first level, and changing a resistance of the variable resistance memory cells by providing a write bias to the variable resistance cells; verifying and reading whether the changed resistance enters into a specified resistance window; and changing the first control voltage to a second level that is different from the first level, and changing the resistance of the variable resistance memory cells by providing the write bias to the variable resistance memory cells. | 04-01-2010 |
20100080041 | Semiconductor device - A semiconductor device includes a comparison unit for comparing a resistance value of a memory element selectively connected to an input terminal with a resistance value of a reference resistance, and a resistance reference unit capable of selecting one of a plurality of resistance values and capable of being selectively connected to the input terminal. | 04-01-2010 |
20100080042 | INTEGRATING NONVOLATILE MEMORY CAPABILITY WITHIN SRAM DEVICES - A nonvolatile static random access memory (SRAM) device includes a pair of cross-coupled, complementary metal oxide semiconductor (CMOS) inverters configured as a storage cell for a bit of data and a pair of magnetic spin transfer devices coupled to opposing sides of the storage cell. The magnetic spin transfer devices are configured to retain the storage cell data therein following removal of power to the SRAM device, and are further configured to initialize the storage cell with the retained data upon application of power to the SRAM device. | 04-01-2010 |
20100085794 | SET AND RESET DETECTION CIRCUITS FOR REVERSIBLE RESISTANCE SWITCHING MEMORY MATERIAL - Circuitry for performing a set or reset process for a reversible resistance-switching memory element in a memory device. A ramped voltage is applied to the memory cell and its state is constantly monitored so that the voltage can be discharged as soon as the set or reset process is completed, avoiding possible disturbs to the memory cell. One set circuit ramps the voltage using a current source, while detecting a current peak using an op-amp loop. One reset circuit ramps the voltage using an op-amp loop, while detecting a current peak by continuing to draw current at the peak current to maintain the output signal stable. Another set circuit ramps the voltage using an op-amp loop and a source-follower configuration. Another reset circuit ramps the voltage using an op-amp loop and a source-follower configuration with level shifting to reduce power consumption. Faster detection and shutoff, and stable operation, are achieved. | 04-08-2010 |
20100085795 | Asymmetric Write Current Compensation - An apparatus and method for compensating for asymmetric write current in a non-volatile unit cell. The unit cell comprises a switching device and an asymmetric resistive sense element (RSE), such as an asymmetric resistive random access memory (RRAM) element or an asymmetric spin-torque transfer random access memory (STRAM) element. The RSE is physically oriented within the unit cell relative to the switching device such that a hard direction for programming the RSE is aligned with an easy direction of programming the unit cell, and an easy direction for programming the RSE is aligned with a hard direction for programming the unit cell. | 04-08-2010 |
20100085796 | Enhancing Read and Write Sense Margins in a Resistive Sense Element - An apparatus and method for enhancing read and write sense margin in a memory cell having a resistive sense element (RSE), such as but not limited to a resistive random access memory (RRAM) element or a spin-torque transfer random access memory (STRAM) element. The RSE has a hard programming direction and an easy programming direction. A write current is applied in either the hard programming direction or the easy programming direction to set the RSE to a selected programmed state. A read circuit subsequently passes a read sense current through the cell in the hard programming direction to sense the selected programmed state of the cell. | 04-08-2010 |
20100085797 | DUAL STAGE SENSING FOR NON-VOLATILE MEMORY - A method and apparatus for accessing a non-volatile memory cell. In some embodiments, a memory block provides a plurality of memory cells arranged into rows and columns. A read circuit is configured to read a selected row of the memory block by concurrently applying a control voltage to each memory cell along the selected row and, for each column, using a respective local sense amplifier and a column sense amplifier to successively differentiate a voltage across the associated memory cell in said column to output a programmed content of the row. | 04-08-2010 |
20100085798 | SILICON-BASED NANOSCALE RESISTIVE DEVICE WITH ADJUSTABLE RESISTANCE - A non-volatile solid state resistive device that includes a first electrode, a p-type poly-silicon second electrode, and a non-crystalline silicon nanostructure electrically connected between the electrodes. The nanostructure has a resistance that is adjustable in response to a voltage being applied to the nanostructure via the electrodes. The nanostructure can be formed as a nanopillar embedded in an insulating layer located between the electrodes. The first electrode can be a silver or other electrically conductive metal electrode. A third (metal) electrode can be connected to the p-type poly-silicon second electrode at a location adjacent the nanostructure to permit connection of the two metal electrodes to other circuitry. The resistive device can be used as a unit memory cell of a digital non-volatile memory device to store one or more bits of digital data by varying its resistance between two or more values. | 04-08-2010 |
20100085799 | METHOD OF DRIVING MULTI-LEVEL VARIABLE RESISTIVE MEMORY DEVICE AND MULTI-LEVEL VARIABLE RESISTIVE MEMORY DEVICE - Disclosed is a method of driving a multi-level variable resistive memory device. A method of driving a multi-level variable resistive memory device includes supplying a write current to a variable resistive memory cell so as to change resistance of the variable resistive memory cell, verifying whether or not changed resistance enters a predetermined resistance window, the intended resistance window depending on the resistance of reference cells, and supplying a write current having an increased or decreased amount from the write current supplied most recently on the basis of the verification result so as to change resistance of the variable resistive memory cell. | 04-08-2010 |
20100091548 | Non-Volatile Memory Array with Resistive Sense Element Block Erase and Uni-Directional Write - A non-volatile memory cell and associated method of use are disclosed. In accordance with various embodiments, the memory cell includes a switching device and a resistive sense element (RSE) connected in series between first and second control lines. The first control line is supplied with a variable voltage and the second control line is maintained at a fixed reference voltage. A first resistive state of the RSE is programmed by lowering the variable voltage of the first control line below the fixed reference voltage of the second control line to flow a body-drain current through the switching device. A different, second resistive state of the RSE is programmed by raising the variable voltage of the first control line above the fixed reference voltage to flow a drain-source current through the switching device. | 04-15-2010 |
20100091549 | Non-Volatile Memory Cell with Complementary Resistive Memory Elements - A non-volatile memory cell and method of writing data thereto. In accordance with some embodiments, the memory cell includes first and second resistive memory elements (RMEs) configured to concurrently store complementary programmed resistive states. The first RME is programmed to a first resistive state and the second RME is concurrently programmed to a second resistive state by application of a common write current in a selected direction through the memory cell. | 04-15-2010 |
20100091550 | Voltage Reference Generation with Selectable Dummy Regions - Various embodiments of the present invention are generally directed to an apparatus and associated method for generating a reference voltage with dummy resistive sense element regions. A first resistance distribution is obtained for a first dummy region of resistance sense elements and a second resistance distribution is obtained for a second dummy region of resistive sense elements. A user resistive sense element from a user region is assigned to a selected resistive sense element of one of the first or second dummy regions in relation to the first and second resistance distributions. | 04-15-2010 |
20100091551 | SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device includes: a memory cell array having memory cells; and a control circuit configured to apply a first voltage to a selected one of first wirings as well as a second voltage to a selected one of second wirings. The control circuit includes: a signal output circuit configured to output a first signal based on a first current flowing through a selected memory cell and a reference current; and a current retaining circuit configured to retain a second current flowing through the first wirings or a wiring electrically connected to the first wirings during a certain period of time. The signal output circuit is configured to determine the first current based on the second current retained by the current retaining circuit. The control circuit is configured to stop application of the first voltage to the first wirings based on the first signal. | 04-15-2010 |
20100091552 | NONVOLATILE MEMORY DEVICE USING VARIABLE RESISTIVE ELEMENT - A nonvolatile memory device, using a resistance material, includes a memory cell array having nonvolatile memory cells arranged in a matrix, multiple bit lines, a column selection circuit and column drivers. The bit lines are coupled to columns of the nonvolatile memory cells in the memory cell array. The column selection circuit selects at least one bit line in response to column selection signals. Each column driver supplies a column selection signal, and includes a first charge unit that charges an output port of the column driver to a first voltage level in response to a first charge signal, a second charge unit that charges the output port of the column driver to a second voltage level from the first voltage level in response to a second charge signal, and a current controller that controls a current path from the second charge unit to the first charge unit. | 04-15-2010 |
20100091553 | SEMICONDUCTOR DEVICE HAVING RESISTANCE BASED MEMORY ARRAY AND METHOD OF OPERATION ASSOCIATED THEREWITH - In one embodiment, the semiconductor device includes a non-volatile memory cell array, a write circuit configured to write to the non-volatile memory cell array, and a control circuit. The control circuit is configured to store at least one erase indicator. The erase indicator is associated with at least a portion of the non-volatile memory cell array and indicates a logic state. The control circuit is configured to control the write circuit to write the logic state indicated by the erase indicator in the non-volatile memory cell array during an erase operation of the associated portion of the non-volatile memory cell array. | 04-15-2010 |
20100097841 | Multi-Stage Parallel Data Transfer - Apparatus and associated method for transferring data to memory, such as resistive sense memory (RSM). In accordance with some embodiments, input data comprising a sequence of logical states are transferred to a block of memory by concurrently writing a first logical state from the sequence to each of a first plurality of unit cells during a first write step, and concurrently writing a second logical state from the sequence to each of a second non-overlapping plurality of unit cells during a second write step. | 04-22-2010 |
20100097842 | RESISTANCE VARIABLE MEMORY DEVICE PROGRAMMING MULTI-BIT DATA - A phase change memory device is provided to simultaneously program multi-bit data. The phase change memory device includes a memory cell array in which multi-bit data is stored, a buffer circuit storing a lower bit and an upper bit of the multi-bit data, a write driver applying program current to the memory cell array, and a control logic controlling the write driver to simultaneously program the multi-bit data. | 04-22-2010 |
20100097843 | EXTRACTION OF A BINARY CODE BASED ON PHYSICAL PARAMETERS OF AN INTEGRATED CIRCUIT - An integrated cell and method for extracting a binary value based on a value difference between two resistors values, including connection circuitry for a binary reading of the sign of the difference between the resistors, and connection circuitry for a modification of the value of one of the resistors to make the sign of the difference invariable. | 04-22-2010 |
20100103716 | Non-Volatile Memory with Metal-Polymer Bi-Layer - A resistive memory cell that includes a metal-polymer bi-layer proximate a CMOS gate. The memory cell has a substrate having a source contact connected to a source line and a drain contact connected to a drain line, a CMOS gate proximate the substrate electrically connecting the source contact and the drain contact, the bi-layer adjacent the CMOS gate, the bi-layer comprising a thin metal layer and a polymer layer, and a word line connected to the bi-layer. | 04-29-2010 |
20100103717 | TUNING A VARIABLE RESISTANCE OF A RESISTIVE SENSE ELEMENT - Method and apparatus for tuning a variable resistance resistive sense element of an electronic device. In some embodiments, a value indicative of a selected number of consecutive pulses is stored in a memory location and a resistive sense element (RSE) is set to a baseline RSE resistance. A tuning operation is performed by applying the selected number of consecutive pulses to the RSE to tune the baseline RSE resistance to a final adjusted resistance. | 04-29-2010 |
20100103718 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes first and second bit line provided in the same level layer above a semiconductor substrate, a first variable-resistance element disposed under the first bit line, having one terminal connected to one end of a current path of a first MOSFET, a second variable-resistance element disposed under the second bit line, and having one terminal connected to one end of a current path of a second MOSFET, a first interconnect layer connecting the first bit line to the other terminal of the first variable-resistance element, and connecting the first bit line to the other end of the current path of the second MOSFET, and a second interconnect layer connecting the second bit line to the other terminal of the second variable-resistance element, and connecting the second bit line to the other end of the current path of the first MOSFET. | 04-29-2010 |
20100110756 | VARIABLE RESISTIVE MEMORY PUNCHTHROUGH ACCESS METHOD - Variable resistive punchthrough access methods are described. The methods include switching a variable resistive data cell from a high resistance state to a low resistance state by passing a write current through the magnetic tunnel junction data cell in a first direction. The write current is provided by a transistor being electrically coupled to the variable resistive data cell and a source line. The write current passes through the transistor in punchthrough mode. | 05-06-2010 |
20100110757 | RESISTIVE MEMORY - The present disclosure includes resistive memory devices and systems having resistive memory cells, as well as methods for operating the resistive memory cells. One memory device embodiment includes at least one resistive memory element, a programming circuit, and a sensing circuit. For example, the programming circuit can include a switch configured to select one of N programming currents for programming the at least one resistive memory element, where each of the N programming currents has a unique combination of current direction and magnitude, with N corresponding to the number of resistance states of the at least one memory element. In one or more embodiments, the sensing circuit can be arranged for sensing of the N resistance states. | 05-06-2010 |
20100110758 | STRUCTURES FOR RESISTIVE RANDOM ACCESS MEMORY CELLS - A resistive random access memory (RRAM) cell that includes a first electrode having a lower portion, a continuous side portion and an upper portion, the lower portion and the continuous side portion having an outer surface and an inner surface; a resistive layer having a lower portion, a continuous side portion and an upper portion, the lower portion and the continuous side portion having an outer surface and an inner surface; and a second electrode having a lower portion, an upper portion and an outer surface; wherein the outer surface of the resistive layer directly contacts the inner surface of the first electrode. | 05-06-2010 |
20100110759 | PROGRAMMABLE RESISTIVE MEMORY CELL WITH FILAMENT PLACEMENT STRUCTURE - Programmable metallization memory cells having a first metal contact and a second metal contact with an ion conductor solid electrolyte material between the metal contacts. The first metal contact has a filament placement structure thereon extending into the ion conductor material. In some embodiments, the second metal contact also has a filament placement structure thereon extending into the ion conductor material toward the first filament placement structure. The filament placement structure may have a height of at least about 2 nm. | 05-06-2010 |
20100110760 | Resistive Sense Memory Calibration for Self-Reference Read Method - Resistive memory calibration for self-reference read methods are described. One method of self-reference reading a resistive memory unit includes setting a plurality of resistive memory units to a first resistive data state. The resistive memory units forms a memory array. Reading a sensed resistive data state for each resistive memory unit by applying a first read current and a second read current through each resistive memory unit and then comparing voltages formed by the first read current and the second read current to determine the sensed resistive data state for each resistive memory unit. Then the method includes adjusting the first or the second read current, read voltages, or storage device capacitance for each resistive memory unit where the sensed resistive data state was not the same as the first resistive data state until the sensed resistive data state is the same as the first resistive data state. | 05-06-2010 |
20100110761 | Spatial Correlation of Reference Cells in Resistive Memory Array - The present disclosure relates to methods of selectively placing a reference column or reference row in a memory array. The method includes measuring a resistance state resistance value for a plurality of variable resistive memory cells within a memory array and mapping a location of each measured variable resistive memory cell to form a map of the resistance state resistance values for a plurality of variable resistive memory cells within a memory array. Then a column or row is selected to be a reference column or reference row based on the map of the resistance state resistance value for a plurality of variable resistive memory cells within a memory array, to minimize read operation errors, and forming a variable resistive memory cell memory array. | 05-06-2010 |
20100110762 | WRITE METHOD WITH VOLTAGE LINE TUNING - A method of writing to a resistive sense memory unit includes applying a first voltage across a resistive sense memory cell and a semiconductor transistor to write a first data state to the resistive sense memory cell. The first voltage forms a first write current for a first time duration through the resistive sense memory cell in a first direction. Then the method includes applying a second voltage across the resistive sense memory cell and the transistor to write a second data state to the resistive sense memory cell. The second voltage forms a second write current for a second duration through the resistive sense memory cell in a second direction. The second direction opposes the first direction, the first voltage has a different value than the second voltage, and the first duration is substantially the same as the second duration. | 05-06-2010 |
20100110763 | Write Current Compensation Using Word Line Boosting Circuitry - Apparatus and method for write current compensation in a non-volatile memory cell, such as but not limited to spin-torque transfer random access memory (STRAM) or resistive random access memory (RRAM). In accordance with some embodiments, a non-volatile memory cell has a resistive sense element (RSE) coupled to a switching device, the RSE having a hard programming direction and an easy programming direction opposite the hard programming direction. A voltage boosting circuit includes a capacitor which adds charge to a nominal non-zero voltage supplied by a voltage source to a node to generate a temporarily boosted voltage. The boosted voltage is applied to the switching device when the RSE is programmed in the hard programming direction. | 05-06-2010 |
20100110764 | PROGRAMMABLE METALLIZATION CELL SWITCH AND MEMORY UNITS CONTAINING THE SAME - An electronic device that includes a first programmable metallization cell (PMC) that includes an active electrode; an inert electrode; and a solid electrolyte layer disposed between the active electrode and the inert electrode; and a second PMC that includes an active electrode; an inert electrode; and a solid electrolyte layer disposed between the active electrode and the inert electrode, wherein the first and second PMCs are electrically connected in anti-parallel. | 05-06-2010 |
20100110765 | Non-Volatile Memory Cell with Programmable Unipolar Switching Element - A non-volatile memory cell with a programmable unipolar switching element, and a method of programming the memory element are disclosed. In some embodiments, the memory cell comprises a programmable bipolar resistive sense memory element connected in series with a programmable unipolar resistive sense switching element. The memory element is programmed to a selected resistance state by application of a selected write current in a selected direction through the cell, wherein a first resistance level is programmed by passage of a write current in a first direction and wherein a second resistance level is programmed by passage of a write current in an opposing second direction. The switching element is programmed to a selected resistance level to facilitate access to the selected resistance state of the memory element. | 05-06-2010 |
20100110766 | NONVOLATILE MEMORY APPARATUS AND METHOD FOR WRITING DATA IN NONVOLATILE MEMORY APPARATUS - A nonvolatile memory apparatus comprises a memory array ( | 05-06-2010 |
20100110767 | RESISTANCE VARIABLE MEMORY APPARATUS - A resistance variable memory apparatus ( | 05-06-2010 |
20100110768 | RESISTANCE VARIABLE MEMORY DEVICE AND SYSTEM - Disclosed is a resistance variable memory device including a memory cell connected with a bit line, a sense amplifier circuit sensing a voltage level on the bit line, and a pseudo-replica providing the sense amplifier circuit with a control signal that compensates for a drop in the sensing capacity of the sense amplifier circuit in relation to process, voltage and temperature (PVT) variations. | 05-06-2010 |
20100110769 | CONTROLLING A VARIABLE RESISTIVE MEMORY WORDLINE SWITCH - A method of controlling the voltage of a sub-wordline in a variable resistive memory device includes switchably passing a voltage from a main wordline to the sub-wordline, and substantially blocking forward current flow from the sub-wordline to a variable resistive memory cell of the device. | 05-06-2010 |
20100110770 | Variable Resistance Memory Devices Including Arrays of Different Sizes - A variable resistance memory device may include a first array of first variable resistance memory cells and a second array of second variable resistance memory cells on an integrated circuit chip. Each of the first variable resistance memory cells may be configured to store a first data value by maintaining a first electrical resistance and to store a second data value by maintaining a second electrical resistance. The first and second data values are different, and the second resistance is greater than the first resistance. Each of the second variable resistance memory cells may be configured to store the first data value by maintaining a third electrical resistance and to store the second data value by maintaining a fourth electrical resistance. The fourth resistance may be greater than the third resistance, and the third resistance may be less than the first resistance. | 05-06-2010 |
20100110771 | VARIABLE RESISTIVE MEMORY - A variable resistive memory device includes memory sectors, memory cells in each of the memory sectors, sub-wordlines including a first in signal communication with at least a first pair of the memory cells in a first sector and a second in signal communication with at least a second pair of the memory cells in a second sector, local bitlines where each is in signal communication a memory cell, a local bitline selecting signal generator in signal communication with local bitline selecting signal paths, a first local bitline selecting signal path in signal communication with a first pair of the local bitlines, and a second local bitline selecting signal path in signal communication with a second pair of the plurality of local bitlines, where a first of the first pair of local bitlines is in signal communication with a first of the first pair of the memory cells in the first sector and a second of the first pair of local bitlines is in signal communication with a second of the second pair of the memory cells in the second sector, and a first of the second pair of local bitlines is in signal communication with a second of the first pair of the memory cells in the first sector and a second of the second pair of local bitlines is in signal communication with a first of the second pair of the memory cells in the second sector. | 05-06-2010 |
20100118587 | RESISTIVE SENSE MEMORY ARRAY WITH PARTIAL BLOCK UPDATE CAPABILITY - Various embodiments of the present invention are generally directed to a method and apparatus for carrying out a partial block update operation upon a resistive sense memory (RSM) array, such as formed from STRAM or RRAM cells. The RSM array is arranged into multi-cell blocks (sectors), each block having a physical block address (PBA). A first set of user data is written to a selected block at a first PBA. A partial block update operation is performed by writing a second set of user data to a second block at a second PBA, the second set of user data updating a portion of the first set of user data in the first PBA. The first and second blocks are thereafter read to retrieve the second set of user data and a remaining portion of the first set of user data. | 05-13-2010 |
20100118588 | VOLTAGE REFERENCE GENERATION FOR RESISTIVE SENSE MEMORY CELLS - Various embodiments of the present invention are generally directed to an apparatus and associated method for generating a reference voltage for a resistive sense memory (RSM) cell, such as an STRAM cell. A dummy reference cell used to generate a reference voltage to sense a resistive state of an adjacent RSM cell. The dummy reference cell comprises a switching device, a resistive sense element (RSE) programmed to a selected resistive state, and a dummy resistor coupled to the RSE. A magnitude of the reference voltage is set in relation to the selected resistive state of the RSE and the resistance of the dummy resistor. | 05-13-2010 |
20100118589 | Non-Volatile Memory Cell with Multiple Resistive Sense Elements Sharing a Common Switching Device - A non-volatile memory cell array and associated method of use are disclosed. In accordance with various embodiments, the array includes a plurality of programmable resistive sense elements (RSEs) coupled to a shared switching device. The switching device has a common source region and multiple drain regions, each drain region connected to an associated RSE from said plurality of RSEs. | 05-13-2010 |
20100118590 | Bidirectional Non-Volatile Memory Array Architecture - A bidirectional memory array architecture for non-volatile memory is disclosed. In accordance with some embodiments, a plurality of memory cells are arranged into an M number of rows and an N number of columns with each memory cell having a resistive sense element (RSE) and a switching device. A total number of M+N+1 control lines extend adjacent to and are connected with the memory cells to facilitate bi-directional programming of resistive states to each memory cell. | 05-13-2010 |
20100118591 | SEMICONDUCTOR INTEGRATED CIRCUIT - A semiconductor integrated circuit includes: an oxide resistance change element, a constant current source circuit supplying a write current to the oxide resistance change element, and a voltage clamper clamping a voltage in a path in which a write current flows. The voltage clamper is arranged in parallel with the path between the constant current source circuit and the oxide resistance change element. | 05-13-2010 |
20100118592 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF CONTROLLING THE SAME - Provided is a nonvolatile semiconductor memory device capable of performing a writing action for a memory cell at high speed. The device comprises: a memory cell array having a first sub-bank and a second sub-bank each having a plurality of nonvolatile memory cells arranged in a form of a matrix; a row decoder shared by the first sub-bank and the second sub-bank; a first column decoder and a second column decoder provided in the first sub-bank and the second sub-bank, respectively; and a control circuit arranged to execute alternately a first action cycle to perform a programming action in the first sub-bank and a reading action for a programming verifying action in the second sub-bank and a second action cycle to perform the reading action for the programming verifying action in the first sub-bank and the programming action in the second sub-bank. | 05-13-2010 |
20100118593 | VARIABLE RESISTANCE MEMORY DEVICE AND SYSTEM THEREOF - A phase-change random access memory device is provided. The phase-change random access memory device includes a global bit line connected to a write circuit and a read circuit, multiple local bit lines, each being connected to multiple phase-change memory cells, and multiple column select transistors selectively connecting the global bit line with each of the multiple local bit lines, each column select transistor having a resistance that varies depending on its distance from the write circuit and the read circuit. | 05-13-2010 |
20100118594 | METHOD AND APPARATUS PROVIDING A CROSS-POINT MEMORY ARRAY USING A VARIABLE RESISTANCE MEMORY CELL AND CAPACITANCE - The invention relates to a method and apparatus providing a memory cell array in which each resistance memory cell is connected in series to a capacitive element. Access transistors are not necessary to perform read and write operations on the memory cell. In one exemplary embodiment, the capacitive element is a capacitor. | 05-13-2010 |
20100118595 | RESISTANCE VARIABLE MEMORY DEVICES AND READ METHODS THEREOF - A resistance-variable memory device includes memory cells, a high voltage circuit, a precharging circuit, a bias circuit, and a sense amplifier. Each memory cell may, for example, include a resistance-variable material and a diode connected to a bitline. The high voltage circuit provides a high voltage from a power source. The precharging circuit raises the bitline up to the high voltage after charging the bitline up to the power source voltage. The bias circuit supplies a read current to the bitline using the high voltage. The sense amplifier compares a voltage of the bitline with a reference voltage by means of the high voltage. | 05-13-2010 |
20100124095 | Floating Source Line Architecture for Non-Volatile Memory - A method and apparatus for writing data to a non-volatile memory cell, such as an RRAM memory cell. In some embodiments, a semiconductor array of non-volatile memory cells comprises a resistive sense element (RSE) and a switching device. A RSE of a plurality of memory cells is connected to a bit line while the switching device of a plurality of memory cells is connected to a word line and operated to select a memory cell. A source line is connected to the switching device and connects a series of memory cells together. Further, a driver circuit is connected to the bit line and writes a selected RSE of a selected source line to a selected resistive state by passing a write current along a write current path that passes through the selected RSE and through at least a portion of the remaining RSE connected to the selected source line. | 05-20-2010 |
20100124096 | ELECTRIC ELEMENT, SWITCHING ELEMENT, MEMORY ELEMENT, SWITCHING METHOD AND MEMORY METHOD - An electric element includes a pair of electrodes; and a plurality of carbon nanotubes of three-dimensional network structure which are located between the pair of electrodes. The electric element can be applied for a memory element and the like. | 05-20-2010 |
20100124097 | SEMICONDUCTOR STORAGE DEVICE - Plural memory cell arrays laminated on the semiconductor substrate each includes a plurality of first wirings and second wirings formed to intersect with each other. The control circuit provides, in a non-selected second memory cell array that shares the first wiring with a selected first memory cell array, and a non-selected third memory cell array located more distant from the first memory cell array than the second memory cell array, the first potential to all of the first wirings and all of the second wirings. It also provides, in a non-selected fourth memory cell array that shares the second wiring with the first memory cell array and a non-selected fifth memory cell array located more distant from the first memory cell array than the fourth memory cell array, the second potential to all of the first wirings and all of the second wirings. | 05-20-2010 |
20100135063 | SEMICONDUCTOR DEVICE INCLUDING BIT LINE GROUPS - A semiconductor device includes: a first read/write amplifier; a second read/write amplifier; a first group of bit lines belonging to the first read/write amplifier; a second group of bit lines belonging to the second read/write amplifier and mixed with the first group of bit lines. One of the first group of bit lines and one of the second group of bit lines are selected in parallel. A reference potential is supplied to at least one of the first non-selected bit lines adjacent to the first selected bit line selected from the first group of bit lines, and to at least one of the second non-selected bit lines adjacent to the second selected bit line selected from the first group of bit lines. At least one of remaining ones of the first and second non-selected bit lines is set into a floating state. | 06-03-2010 |
20100142254 | Nonvolatile Memory Device Using Variable Resistive Element - A nonvolatile memory device using a variable resistive element is provided. The nonvolatile memory device includes first and second nonvolatile memory cells. Word lines are coupled to the first and second nonvolatile memory cells. First and second bit lines are coupled to the first and second nonvolatile memory cells, respectively. A read circuit reads resistance levels of the first and second nonvolatile memory cells by providing first and second read bias currents of different levels to the first and second bit lines, respectively. | 06-10-2010 |
20100142255 | METHOD TO PROGRAM A MEMORY CELL COMPRISING A CARBON NANOTUBE FABRIC ELEMENT AND A STEERING ELEMENT - A method of programming a carbon nanotube memory cell is provided, wherein the memory cell comprises a first conductor, a steering element, a carbon nanotube fabric, and a second conductor, wherein the steering element and the carbon nanotube fabric are arranged electrically in series between the first conductor and the second conductor, and wherein the entire carbon nanotube memory cell is formed above a substrate, the carbon nanotube fabric having a first resistivity, the method including applying a first electrical set pulse between the first conductor and the second conductor, wherein, after application of the first electrical set pulse, the carbon nanotube fabric has a second resistivity, the second resistivity less than the first resistivity. Other aspects are also provided. | 06-10-2010 |
20100142256 | METHOD OF PROGRAMMING A NONVOLATILE MEMORY CELL BY REVERSE BIASING A DIODE STEERING ELEMENT TO SET A STORAGE ELEMENT - A method of programming a nonvolatile memory cell. The nonvolatile memory cell includes a diode steering element in series with a carbon storage element The method includes providing a first voltage to the nonvolatile memory cell. The first voltage reverse biases the diode steering element. The carbon storage element sets to a lower resistivity state. | 06-10-2010 |
20100149852 | CHARGE RETENTION STRUCTURES AND TECHNIQUES FOR IMPLEMENTING CHARGE CONTROLLED RESISTORS IN MEMORY CELLS AND ARRAYS OF MEMORY - Embodiments of the invention relate generally to semiconductors and semiconductor fabrication techniques, and more particularly, to devices, integrated circuits, memory cells and arrays, and methods to use silicon carbide structures to retain amounts of charge indicative of a resistive state in, for example, a charge-controlled resistor of a memory cell. In some embodiments, a memory cell comprises a silicon carbide structure including a charge reservoir configured to store an amount of charge carriers constituting a charge cloud. The amount of charge carriers in the charge cloud can represent a data value. Further, the memory cell includes a resistive element in communication with the charge reservoir and is configured to provide a resistance as a function of the amount of charge carriers in the charge reservoir. The charge reservoir is configured to modulate the size of the charge cloud to change the data value. | 06-17-2010 |
20100157651 | Method of programming a nonvolatile memory device containing a carbon storage material - A nonvolatile memory cell includes a steering element located in series with a storage element, where the storage element comprises a carbon material. A method of programming the cell includes applying a reset pulse to change a resistivity state of the carbon material from a first state to a second state which is higher than the first state, and applying a set pulse to change a resistivity state of the carbon material from the second state to a third state which is lower than the second state. A fall time of the reset pulse is shorter than a fall time of the set pulse. | 06-24-2010 |
20100157652 | Programming a memory cell with a diode in series by applying reverse bias - A method of programming a memory cell comprises applying a reverse bias to the memory cell using a temporary resistor in series with the memory cell. The memory cell comprises a diode and a resistivity switching material element in series. The state of the resistivity switching material element changes from a first initial state to a second state different from the first state. | 06-24-2010 |
20100157653 | Quad memory cell and method of making same - A non-volatile memory device includes a first electrode, a diode steering element, at least three resistivity switching storage elements, and a second electrode. The diode steering element electrically contacts the first electrode and the at least three resistivity switching storage elements. The second electrode electrically contacts only one of the at least three resistivity switching storage elements. | 06-24-2010 |
20100157654 | Balancing A Signal Margin Of A Resistance Based Memory Circuit - A resistance based memory circuit is disclosed. The circuit includes a first transistor load of a data cell and a bit line adapted to detect a first logic state. The bit line is coupled to the first transistor load and coupled to a data cell having a magnetic tunnel junction (MTJ) structure. The bit line is adapted to detect data having a logic one value when the bit line has a first voltage value, and to detect data having a logic zero value when the bit line has a second voltage value. The circuit further includes a second transistor load of a reference cell. The second transistor load is coupled to the first transistor load, and the second transistor load has an associated reference voltage value. A characteristic of the first transistor load, such as transistor width, is adjustable to modify the first voltage value and the second voltage value without substantially changing the reference voltage value. | 06-24-2010 |
20100157655 | RESISTIVE MEMORY AND DATA WRITE-IN METHOD - An ReRAM of the present invention includes a high speed write-in region and a main memory region, only memory cells designated to have the storage state out of the memory cells corresponded to data are set to the storage state in the high speed write-in region. The data written in the memory cell array are transferred to the main memory region, the memory cells of the memory cell array corresponded to the data transferred from the high speed write-in region are reset to the no-storage state in the main memory region, only the memory cells designated to have the storage state out of the memory cells are set, and all memory cells are reset to the no-storage state, or the initial state, in the high speed write-in region. | 06-24-2010 |
20100157656 | RESISTANCE CHANGE MEMORY - A resistance change memory of an aspect of the present invention including memory cells including resistance change memory element, word lines connected to the memory cells, a row decoder which activates the word lines, redundant cells used instead of defective cells, a redundant word line connected to redundant cells, a redundant row decoder which activates the redundant word line, a control circuit in which defect address information indicating the word line connected to the defective cell is stored and which remedies the defective cell, and regions provided in a memory cell array and a redundant cell array and identified based on column address information, wherein the control circuit replaces a part of the word line connected to the defective cell with a part of the redundant word line in accordance with each of the regions, and allows the redundant row decoder to activate the replaced redundant word line. | 06-24-2010 |
20100157657 | Multi-resistive state memory device with conductive oxide electrodes - A memory cell including conductive oxide electrodes is disclosed. The memory cell includes a memory element operative to store data as a plurality of resistive states. The memory element includes a layer of a conductive metal oxide (CMO) (e.g., a perovskite) in contact with an electrode that may comprise one or more layers of material. At least one of those layers of material can be a conductive oxide (e.g., a perovskite such as LaSrCoO | 06-24-2010 |
20100157658 | Conductive metal oxide structures in non-volatile re-writable memory devices - A memory cell including a memory element comprising an electrolytic insulator in contact with a conductive metal oxide (CMO) is disclosed. The CMO includes a crystalline structure and can comprise a pyrochlore oxide, a conductive binary oxide, a multiple B-site perovskite, and a Ruddlesden-Popper structure. The CMO includes mobile ions that can be transported to/from the electrolytic insulator in response to an electric field of appropriate magnitude and direction generated by a write voltage applied across the electrolytic insulator and CMO. The memory cell can include a non-ohmic device (NOD) that is electrically in series with the memory element. The memory cell can be positioned between a cross-point of conductive array lines in a two-terminal cross-point memory array in a single layer of memory or multiple vertically stacked layers of memory that are fabricated over a substrate that includes active circuitry for data operations on the array layer(s). | 06-24-2010 |
20100157659 | Digital potentiometer using third dimensional memory - A digital potentiometer using third dimensional memory includes a switch configured to electrically couple one or more resistive elements with a first pin and a second pin, and a non-volatile register configured to control the switch. In one example, the non-volatile register can include a BEOL non-volatile memory element, such as a third dimensional memory element. The non-volatile register can include a FEOL active circuitry portion that is electrically coupled with the BEOL non-volatile memory element to implement the non-volatile register. The resistive elements can be BEOL resistive elements that can be fabricated on the same plane or a different plane than the BEOL non-volatile memory elements. The BEOL non-volatile memory elements and the BEOL resistive elements can retain stored data in the absence of power and the stored data can be non-destructively determined by application of a read voltage. | 06-24-2010 |
20100165701 | RESISTIVE MEMORY - A resistive memory includes a plurality of memory cells, a plurality of reference cells having mutually different resistance values, at least one sense amplifier having a first input terminal connected to one selected memory cell which is selected from the plurality of memory cells at a time of read, and a second input terminal connected to one selected reference cell which is selected from the plurality of reference cells at the time of read, and one latch circuit which holds offset information of the at least one sense amplifier. The resistive memory further includes a decoder which selects, in accordance with the offset information, the one selected reference cell from the plurality of reference cells, and connects the one selected reference cell to the second input terminal of the at least one sense amplifier. | 07-01-2010 |
20100165702 | THREE DIMENSIONAL PROGRAMMABLE RESISTANCE MEMORY DEVICE WITH A READ/WRITE CIRCUIT STACKED UNDER A MEMORY CELL ARRAY - A programmable resistance memory device includes a semiconductor substrate, at least one cell array, in which memory cells are arranged formed above the semiconductor substrate. Each of the memory cells has a stack structure of a programmable resistance element and an access element, the programmable resistance element storing a high resistance state or a low resistance state determined due to the polarity of voltage application in a non-volatile manner. The access element has such a resistance value in an off-state in a certain voltage range that is ten time or more as high as that in a select state. A read/write circuit is formed on a semiconductor substrate as underlying the cell array for data reading and data writing in communication with the cell array. | 07-01-2010 |
20100165703 | SEMICONDUCTOR DEVICE FOR SUPPLYING STABLE VOLTAGE TO CONTROL ELECTRODE OF TRANSISTOR - A semiconductor device comprises an internal voltage generator circuit which includes a first transistor having a first and a second main electrode and a control electrode, a control circuit controlling a voltage between the second main electrode and the control electrode of the first transistor such that a voltage at the first main electrode of the first transistor remains at a predetermined voltage, and a second transistor having a first and a second main electrode and a control electrode. A voltage between the second main electrode and the control electrode of the first transistor is applied between the second main electrode and the control electrode of the second transistor. | 07-01-2010 |
20100172170 | VARIABLE RESISTIVE ELEMENT, MANUFACTURING METHOD FOR SAME, AND NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - Provided is a variable resistive element which performs high speed and low power consumption operation. The variable resistive element comprises a metal oxide layer between first and second electrodes wherein electrical resistance between the first and second electrodes reversibly changes in accordance with application of electrical stress across the first and second electrodes. The metal oxide layer has a filament, which is a current path where the density of a current flowing between the first and second electrodes locally increases. A portion including at least the vicinity of an interface between the certain electrode, which is one or both of the first and second electrodes, and the filament, on an interface between the certain electrode and the metal oxide layer is provided with an interface oxide which is an oxide of at least one element included in the certain electrode and different from the oxide of the metal oxide layer. | 07-08-2010 |
20100172171 | RESISTANCE VARIABLE MEMORY APPARATUS - A resistance variable memory apparatus ( | 07-08-2010 |
20100172172 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR SYSTEM INCLUDING THE SAME, AND VOLTAGE SUPPLY METHOD OF SEMICONDUCTOR DEVICE - A semiconductor device, a semiconductor system including the same, and a voltage supply method of the semiconductor device are provided. The semiconductor device includes at least two semiconductor memory devices and a voltage supply controller configured to selectively supply a voltage to each of the at least two semiconductor memory devices. | 07-08-2010 |
20100177551 | BIT SET MODES FOR A RESISTIVE SENSE MEMORY CELL ARRAY - Various embodiments of the present invention are generally directed to a method and apparatus for providing different bit set modes for a resistive sense memory (RSM) array, such as a spin-torque transfer random access memory (STRAM) or resistive random access memory (RRAM) array. In accordance with some embodiments, a group of RSM cells in a non-volatile semiconductor memory array is identified for application of a bit set operation. A bit set value is selected from a plurality of bit set values each separately writable to the RSM cells to place said cells in a selected resistive state. The selected bit set value is thereafter written to at least a portion of the RSM cells in the identified group. | 07-15-2010 |
20100177552 | TABLE-BASED REFERENCE VOLTAGE CHARACTERIZATION SCHEME - Method and apparatus for reading data from a non-volatile memory cell, such as a modified STRAM cell. In some embodiments, at least a first and second memory cell are read for a plurality of resistance values that are used to select and store a voltage reference for each memory cell. | 07-15-2010 |
20100177553 | REWRITABLE MEMORY DEVICE - Memory devices described herein are programmed and erased by physical segregation of an electrically insulating layer out of a memory material to establish a high resistance state, and by re-absorption of at least a portion of the electrically insulating layer into the memory material to establish a low resistance state. The physical mechanism of programming and erasing includes movement of structure vacancies to form voids, and/or segregation of doping material and bulk material, to create the electrically insulating layer consisting of voids and/or dielectric doping material along an inter-electrode current path between electrodes. | 07-15-2010 |
20100177554 | BIPOLAR CMOS SELECT DEVICE FOR RESISTIVE SENSE MEMORY - A resistive sense memory apparatus includes a bipolar select device having a semiconductor substrate and a plurality of transistors disposed in the semiconductor substrate and forming a row or transistors. Each transistor includes an emitter contact and a collector contact. Each collector contact is electrically isolated from each other and each emitter contact is electrically isolated from each other. A gate contact extends along a channel region between the emitter contact and a collector contact. A base contact is disposed within the semiconductor substrate such that the emitter contact and a collector contact is between the gate contact and the base contact. A resistive sense memory cells is electrically coupled to each collector contact or emitter contact and a bit line. | 07-15-2010 |
20100177555 | VARIABLE RESISTANCE NONVOLATILE STORAGE DEVICE - The variable resistance nonvolatile storage device includes a memory cell ( | 07-15-2010 |
20100182820 | Variable resistance memory device - A variable resistance memory device includes: a first common line; a second common line; plural memory cells each formed by serially connecting a memory element, resistance of which changes according to applied voltage, and an access transistor between the second common line and the first common line; a common line pass transistor connected between the first common line and a supply node for predetermined voltage; and a driving circuit that controls voltage of the second common line, the predetermined voltage, and voltage of a control node of the common line pass transistor and drives the memory cells. | 07-22-2010 |
20100182821 | MEMORY DEVICE, MEMORY CIRCUIT AND SEMICONDUCTOR INTEGRATED CIRCUIT HAVING VARIABLE RESISTANCE - A first variable resistor ( | 07-22-2010 |
20100188883 | Simultaneously Writing Multiple Addressable Blocks of User Data to a Resistive Sense Memory Cell Array - Method and apparatus are disclosed for storing data to non-volatile resistive sense memory (RSM) memory cells of a semiconductor memory array, including but not limited to resistive random access memory (RRAM) and spin-torque transfer random access memory (STTRAM or STRAM) cells. In accordance with various embodiments, a plurality of addressable data blocks from a host device are stored in a buffer. At least a portion of each of the addressable data blocks are serially transferred to a separate register of a plurality of registers. The transferred portions of said addressable data blocks are thereafter simultaneously transferred from the registers to selected RSM cells of the array. | 07-29-2010 |
20100188884 | NONVOLATILE MEMORY ELEMENT, NONVOLATILE MEMORY APPARATUS, AND METHOD OF WRITING DATA TO NONVOLATILE MEMORY ELEMENT - A nonvolatile memory element comprises a first electrode ( | 07-29-2010 |
20100188885 | RESISTANCE CHANGE MEMORY DEVICE AND PROGRAMMING METHOD THEREOF - A method of programming a resistance change memory device includes: applying program voltage pulses to a memory cell for programming a target resistance value; setting thermal relaxation times between the respective program voltage pulses; and controlling the shape of each the program voltage pulse in accordance with the present cell's resistance value determined by the preceding program voltage pulse application. | 07-29-2010 |
20100195370 | Nonvolatile semiconductor memory device and method for performing verify write operation on the same - Disclosed herein is a nonvolatile semiconductor memory device including a plurality of memory cells; and a driver circuit configured to perform a verify write operation in a cycle including selecting from an array of the plurality of memory cells a predetermined number of memory cells constituting a write cell unit, writing data collectively to the predetermined number of memory cells, and verifying the written data, the driver circuit further performing the verify write operation repeatedly until all memory cells within the write cell unit are found to have passed the verification. | 08-05-2010 |
20100195371 | MEMORY ELEMENT AND MEMORY DEVICE - The capability of retaining a resistance value of a stored state and an erased state is improved in a resistance variation-type memory device. A memory layer | 08-05-2010 |
20100195372 | RESISTANCE-CHANGING MEMORY DEVICE - A resistance-changing memory device has a cell array having memory cells, each of which stores as data a reversibly settable resistance value, a sense amplifier for reading data from a selected memory cell in the cell array, and a voltage generator circuit which generates, after having read data of the selected memory cell, a voltage pulse for convergence of a resistive state of this selected memory cell in accordance with the read data. | 08-05-2010 |
20100202185 | NONVOLATILE MEMORY DEVICE AND METHOD OF WRITING DATA TO NONVOLATILE MEMORY DEVICE - A nonvolatile memory device ( | 08-12-2010 |
20100202186 | SEMICONDUCTOR MEMORY DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF SCREENING THE SAME - A semiconductor memory device includes first and second memory cells each including a variable resistance element and a diode and having a pillar shape, and an insulating layer provided between the first memory cell and the second memory cell and including a void. A central portion of the diode has a smaller width than widths of upper and lower portions of the diode. | 08-12-2010 |
20100202187 | DATA READ/ WRITE DEVICE - A data read/write device according to an example of the present invention includes a recording layer, and means for applying a voltage to the recording layer, generating a resistance change in the recording layer, and recording data. The recording layer is composed of a composite compound having at least two types of cation elements, at least one type of the cation element is a transition element having a “d” orbit in which electrons have been incompletely filled, and the shortest distance between the adjacent cation elements is 0.32 nm or less. | 08-12-2010 |
20100202188 | Low read current architecture for memory - A low read current architecture for memory. Bit lines of a cross point memory array are allowed to be charged by a selected word line until a minimum voltage differential between a memory state and a reference level is assured. | 08-12-2010 |
20100208508 | Multi-level nonvolatile memory devices using variable resistive elements - Multi-level nonvolatile memory devices using variable resistive elements, the multi-level nonvolatile memory devices including a word line, a bit line, and a multi-level memory cell coupled between the word line and the bit line, the multi-level memory cell having first resistance level and a second resistance level higher than the first resistance level when the first and second write biases having the same polarity are applied thereto, and a third resistance level and a fourth resistance level ranging between the first and second resistance levels, when third and fourth write biases having different polarities from each other are applied thereto. | 08-19-2010 |
20100208509 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE, AND PRODUCTION METHOD THEREOF - A nonvolatile semiconductor memory device according to the present invention includes a memory cell array layer including a first line; a plurality of second and third lines that are formed below or above the first line and cross each other; and a plurality of memory cells arranged at each intersection of the second and third lines, the memory cell including a variable resistor and a transistor, which are connected to each other in series between the first line and the third line, the variable resistor being electrically rewritable and storing a resistance value as data in a nonvolatile manner, and the transistor being a columnar transistor having the second line arranged at its side face as a gate. | 08-19-2010 |
20100208510 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A semiconductor memory device comprises: a memory cell array having memory cells disposed at a crossing-point of a plurality of first lines and a plurality of second lines; and a control circuit configured to apply a first voltage to selected one of the first lines, and to apply a second voltage to selected one of the second lines. The control circuit comprises: a first isolation latch circuit configured to set the first lines to a floating state; and a second isolation latch circuit configured to set the second lines to the floating state. During a forming operation, the first and second isolation latch circuits set one of the first lines and one of the second lines to which a defective memory cell is connected to the floating state, the defective memory cell being one of the memory cells that allows a current to flow due to application of a voltage. | 08-19-2010 |
20100208511 | Memory Devices and Wireless Devices Including the Same - A memory device includes a plurality of memory bit lines connected to a plurality of memory cells, a plurality of reference bit lines connected to a plurality of reference cells and a reference bit line selection circuit. The memory bit lines has a first pattern and a second pattern, and the first pattern has a first critical dimension (CD) distribution, and the second pattern has a second CD distribution. The reference bit lines have the first pattern and the second pattern. The reference bit line selection circuit provides a reference signal by selecting a reference bit line having a same pattern as a selected memory bit line connected to a memory cell to be read. | 08-19-2010 |
20100208512 | SEMICONDUCTOR MEMORY DEVICE PROVIDED WITH RESISTANCE CHANGE ELEMENT - A latch circuit is connected to a first common node, a first, second output node, and a first, second connection node. A first resistance change element is connected to the first connection node, and a second common node. A second resistance change element is connected to the second connection node, and the second common node. When a first data is stored, voltages of the first common node, second common node, and first output node are set at a first reference voltage, and a voltage of the second output node is set at a second reference voltage. When a second data is stored, voltages of the first common node, second common node, and second output node are set at the first reference voltage, and a voltage of the first output node is set at the second reference voltage. | 08-19-2010 |
20100214818 | Memory device and operation method of the same - Disclosed herein is a memory device including: first and second wires; memory cells including a variable-resistance storage element having a data storage state making a transition by a change of a voltage applied and an access transistor connected in series between the first and second wires; driving control sections controlling a direct verify sub-operation by applying a write/erase pulse between the first and second wires in a data write/erase operation respectively for causing a cell current to flow between the first and second wires through the memory cell for a transition of the data storage state; sense amplifiers sensing an electric-potential change occurring on the first wire in accordance with control on the direct verify sub-operation; and inhibit control sections determining whether or not to inhibit a sense node of the sense amplifier from electrically changing at the next sensing time on the basis of an electric potential appearing at the sense node at the present sensing time. | 08-26-2010 |
20100214819 | RESISTIVE MEMORY DEVICES, MEMORY SYSTEMS AND METHODS OF CONTROLLING INPUT AND OUTPUT OPERATIONS OF THE SAME - A resistive memory device includes a resistive memory cell array, an output circuit and an input circuit. The resistive memory cell array includes a plurality of memory cells that are coupled to bitlines. The output circuit generates a sensing output signal during a write operation by sensing a bitline voltage, and generates output data during a read operation by sensing the bitline voltage. The input circuit controls the bitline voltage based on input data for the write operation, and limits the bitline voltage in response to the sensing output signal during the write operation. The memory cells are protected by effectually limiting bitline voltage | 08-26-2010 |
20100214820 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprises: a memory cell array having memory cells disposed at a crossing-point of a plurality of first lines and a plurality of second lines and a control circuit configured to apply a first voltage to selected one or more of the first lines, and to apply a second voltage having a value smaller than the first voltage to selected one of the second lines, such that a certain potential difference is applied to selected one or more of the memory cells. The control circuit adjusts the second voltage based on a position of the selected one or more of the memory cells within the memory cell array and a number of the selected one or more of the memory cells on which an operation is simultaneously executed, during application of the potential difference to the selected one or more of the memory cells. | 08-26-2010 |
20100214821 | CAPACITIVE DIVIDER SENSING OF MEMORY CELLS - The present disclosure includes devices and methods for sensing resistance variable memory cells. One device embodiment includes at least one resistance variable memory cell, and a capacitive divider configured to generate multiple reference levels in association with the at least one resistance variable memory cell. | 08-26-2010 |
20100220512 | PROGRAMMABLE POWER SOURCE USING ARRAY OF RESISTIVE SENSE MEMORY CELLS - Various embodiments of the present invention are generally directed to an apparatus comprising a programmable power source which uses an array of resistive sense memory cells, such as but not limited to STRAM or RRAM cells, to provide a controlled power bias to a load, such as but not limited to a micro-oscillator. In some embodiments, the programmable power source incorporates an array of serially connected resistive sense memory cells. A selectively controllable power level is applied by the programmable power source to a load in relation to a control input which selectively programs at least selected ones of the memory cells to a selected resistance state. | 09-02-2010 |
20100220513 | Bi-Directional Resistive Memory Devices and Related Memory Systems and Methods of Writing Data - A bi-directional resistive memory device includes a memory cell array including a plurality of memory cells and an input/output (I/O) circuit. The I/O circuit is configured to generate a first voltage having a positive polarity and a second voltage having a negative polarity, provide one of the first voltage and the second voltage to the memory cell array through a bitline responsive to a logic state of input data, and adjust magnitudes of the first and second voltage when data written in the memory cell array has an offset. Related memory systems and methods are also provided. | 09-02-2010 |
20100226163 | Method of resistive memory programming and associated devices and materials - A pulse coupled with a microwave field is used for programming a resistive memory into one of non-volatile states. As the result, the programming becomes faster and more energy efficient. Related devices and materials are also described. | 09-09-2010 |
20100226164 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a memory cell array of electrically erasable programmable nonvolatile memory cells arranged in matrix, each memory cell using a variable resistor. A pulse generator generates plural types of write pulses for varying the resistance of the variable resistor based on write data. A selection circuit applies write pulses generated by the pulse generator to the memory cell. A sense amplifier executes verify read to the memory cell. A status decision circuit decides the verify result based on the output from the sense amplifier. A control circuit executes additional write to the memory cell based on the verify result from the status decision circuit. | 09-09-2010 |
20100226165 | RESISTIVE MEMORY DEVICES HAVING A STACKED STRUCTURE AND METHODS OF OPERATION THEREOF - A memory device includes a stacked resistive memory cell array comprising a plurality of resistive memory cell layers stacked on a semiconductor substrate, wherein respective memory cell layers are configured to store data according to respective program modes comprising a number of bits per cell. The memory device further includes a control circuit configured to identify a program mode of a selected memory cell layer responsive to an address signal and to access the selected memory cell layer responsive to the address signal according to the identified program mode. The program modes may include a single-level cell mode and at least one multi-level cell mode. | 09-09-2010 |
20100232204 | RESISTANCE VARIABLE ELEMENT, NONVOLATILE SWITCHING ELEMENT, AND RESISTANCE VARIABLE MEMORY APPARATUS - A resistance variable element comprises a first electrode ( | 09-16-2010 |
20100232205 | Programmable resistance memory - A memory includes an interface through which it provides access to memory cells, such as phase change memory cells. Such access permits circuitry located on a separate integrated circuit to provide access signals, including read and write signals suitable for binary or multi-level accesses. | 09-16-2010 |
20100232206 | NON-VOLATILE MEMORY READ/WRITE VERIFY - An apparatus and associated method for writing data to a non-volatile memory cell, such as a resistive random access memory (RRAM) cell. In some embodiments, a control circuitry is configured to write a logic state to a resistive sense element while simultaneously verifying the logic state of the resistive sense element. | 09-16-2010 |
20100232207 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF RESETTING THE SAME - A nonvolatile semiconductor memory device includes: a plurality of memory cell arrays stacked on a semiconductor substrate and including a plurality of first wires, a plurality of second wires and memory cells disposed at intersections of the first wires and the second wires and having a rectifier element and a variable resistive element are connected in series; and a control circuit configured to selectively drive the first wires and the second wires. The control circuit executes a resetting operation to change a state of the variable resistive element from a low resistance state to a high resistance state. At a time of executing the resetting operation, the control circuit increases a pulse voltage to be applied to the variable resistive element to a first voltage, and then decreases the pulse voltage to a second voltage lower than the first voltage and higher than the ground voltage. | 09-16-2010 |
20100232208 | METHOD OF EXECUTING A FORMING OPERATION TO VARIABLE RESISTANCE ELEMENT - A method of executing a forming operation to a variable resistance element to render a resistance value of the variable resistance element capable of transition, the variable resistance element being included in a memory cell connected between a first wiring and a second wiring and changing the resistance value by electrical control, comprises applying a voltage required to execute the forming operation to the variable resistance element between the first and second wirings and changing the first wiring to a floating state. | 09-16-2010 |
20100232209 | CONTROL CIRCUIT FOR FORMING PROCESS ON NONVOLATILE VARIABLE RESISTIVE ELEMENT AND CONTROL METHOD FOR FORMING PROCESS - A nonvolatile semiconductor memory device can carry out a forming process simultaneously on the nonvolatile variable resistive elements of memory cells and make the forming time shorter. The nonvolatile semiconductor memory device has a forming detection circuit provided between the memory cell array and the second selection line (bit line) decoder. The forming detection circuit detects the completion of the forming process for memory cells by measuring the fluctuation in the potential of second selection lines or the current flowing through the second selection lines when applying a voltage pulse for a forming process through the second selection lines simultaneously to the memory cells on which a forming process is to be carried out connected to the same first selection line (word line), and prevents a voltage from being applied to the second selection lines connected to the memory cells where the completion of the forming process is detected. | 09-16-2010 |
20100232210 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor memory device includes variable resistance elements arranged in a memory area and configured to store data according to a resistance variation, each of the variable resistance elements having a first terminal electrically connected to a first line and a second terminal electrically connected to a second line, and dummy elements arranged in the memory area, formed of the same material as the variable resistance element and electrically isolated. | 09-16-2010 |
20100232211 | MEMORY ARRAY WITH READ REFERENCE VOLTAGE CELLS - The present disclosure relates to memory arrays with read reference voltage cells. In particular the present disclosure relates to variable resistive memory cell apparatus and arrays that include a high resistance state reference memory cell and a low resistance state reference memory cell that provides a reliable average reference voltage on chip to compare to a read voltage of a selected memory cell and determine if the selected memory cell is in the high resistance state or low resistance state. These memory arrays are particularly suitable for use with spin-transfer torque memory cells and resolves many systematic issues related to generation of a reliable reference voltage. | 09-16-2010 |
20100238700 | Quiescent Testing of Non-Volatile Memory Array - A method and apparatus for testing an array of non-volatile memory cells, such as a spin-torque transfer random access memory (STRAM). In some embodiments, an array of memory cells having a plurality of unit cells with a resistive sense element and a switching device has a row decoder and a column decoder connected to the plurality of unit cells. A test circuitry sends a non-operational test pattern through the array via the row and column decoders with a quiescent supply current to identify defects in the array of memory cells. | 09-23-2010 |
20100238701 | SEMICONDUCTOR MEMORY DEVICE - A memory cell arranged between first and second wirings includes a variable-resistor element. A controller controls a voltage applied between the first and second wirings. The controller performs a first operation that applies a first voltage between the first and second wirings to switch the variable-resistor element from a first state with a resistance value not less than a first resistance value, to a second state with a resistance value not more than a second resistance value smaller than the first resistance value. The second operation applies a second voltage smaller than the first voltage between the first and second wirings to switch the variable-resistor element from the second state to the first state. In the first operation, a verify voltage is applied between the first and second wirings. Based on the obtained signal, a third voltage smaller than the first voltage is applied between the first and second wirings. | 09-23-2010 |
20100238702 | SEMICONDUCTOR MEMORY DEVICE - A memory array includes a memory cell, the memory cell being disposed between a first line and a second line and being configured by a variable resistor and a rectifier connected in series. The variable resistor is a mixture of silicon oxide (SiO2) and a transition metal oxide, a proportion of the transition metal oxide being set to 55˜80%. | 09-23-2010 |
20100238703 | INFORMATION RECORDING/REPRODUCING DEVICE - An information recording/reproducing device includes a first electrode layer, a second electrode layer, a recording layer as a variable resistance between the first and second electrode layer, and a circuit which supplies a voltage to the recording layer to change a resistance of the recording layer. Each of the first and second electrode layers is comprised of IV or III-V semiconductor doped with p-type carrier or n-type carrier. | 09-23-2010 |
20100238704 | SEMICONDUCTOR MEMORY DEVICE, METHOD OF MANUFACTURING THE SAME, AND METHOD OF SCREENING THE SAME - A memory cell comprises a variable resistance film; a first conductive film having one surface contacted with one surface of the variable resistance film; and a second conductive film having one surface contacted with another surface of the variable resistance film. A width of the first conductive film or the second conductive film in a direction orthogonal to a direction that a current flows in the first conductive film or the second conductive film is smaller than a width of the variable resistance film in a direction orthogonal to a direction that a current flows in the variable resistance film. The width of the first conductive film and the second conductive film is smaller than a width of the first line and the second line in a direction orthogonal to a direction that a current flows in the first line and the second line. | 09-23-2010 |
20100238705 | NONVOLATILE MEMORY DEVICE AND METHOD SYSTEM INCLUDING THE SAME - A nonvolatile memory device performs interleaving of data to be stored in each wordline (memory page), or of data to be stored in multiple wordlines (memory pages). The NVM includes a memory cell array, a storage circuit of a de-interleaving circuit, and a read/write circuit. The storage circuit of the de-interleaving circuit is configured to store program data to be written interleaved into the memory cell array. The read/write circuit is configured to control the interleaved/deinterleaved data input/output between the memory cell array and the storage circuit. The write operation unit size may be the same or different from the read operation unit size. The storage circuit stores the program data of integer k times of a common divisor of a read operation unit size and a write operation unit size of the read/write circuit, wherein k may equal ‘m’ (the number of bits stored in each memory cell of the NVM). | 09-23-2010 |
20100238706 | NONVOLATILE SEMICONDUCTOR STORAGE DEVICE - A nonvolatile semiconductor storage device includes a memory core that includes plural banks, the bank including plural memory cells and a data write circuit that supplies a bias voltage to the memory cell, the memory core being logically divided into plural pages, the page including a predetermined number of memory cells belonging to a predetermined number of banks; and a control circuit that controls the data write circuit to perform page write in each write unit including a predetermined number of memory cells, pieces of data being written in the page in the page write, the control circuit performing the page write by repeating a step including a program operation and a verify operation, the control circuit performing the program operation and the verify operation in a next step or later only to the write unit in which the data write is not completed in the verify operation. | 09-23-2010 |
20100238707 | RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device includes memory cells including two transistors connected in parallel between a first node and a connecting node and a variable resistance element whose one end is connected to the connecting node. The first node of each memory cell and a second node, which is the other end of the variable resistance element of the memory cell, are connected to different bit lines. The first node of a one memory cell and the first node of another memory cell which is adjacent on a first side along the second axis to the one memory are connected to the same bit line. The second node of the one memory cell and the second node of still another memory cell which is adjacent on a second side along the second axis to the one memory cell are connected to the same bit line. | 09-23-2010 |
20100238708 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprising: a memory cell array including memory cells each provided at individual intersection between a first wiring and a second wiring, the memory cell comprising a variable resistive element, and predetermined numbers of the memory cells shearing the same first wiring to configure a page; a first control circuit configured to select a page subjected to data-writing, and to supply a constant voltage to the first wiring belonging to the selected page; a writing-voltage generating circuit configured to generate plural kinds of writing voltages for programming a resistance of the variable resistive element to one of three or more values based on a write-in data specifying three or more values; and a second control circuit configured to select the page subjected to data-writing, and to supply the writing voltages to predetermined numbers of the respective second wirings belonging to the selected page. | 09-23-2010 |
20100238709 | MEMORY DEVICES INCLUDING DECODERS HAVING DIFFERENT TRANSISTOR CHANNEL DIMENSIONS AND RELATED DEVICES - An integrated circuit memory device includes a memory cell array comprising memory cells having respective data storage regions therein, a plurality of pass transistors having different channel widths and/or channel lengths, and a plurality of conductive lines. Each of the conductive lines electrically couple a respective one of the pass transistors to ones of the memory cells. Each of the memory cells has a line resistance defined by a portion of the corresponding one of the conductive lines extending between the memory cell and the pass transistor coupled thereto. Ones of the memory cells having greater line resistances are coupled to ones of the pass transistors having greater channel widths and/or shorter channel lengths than ones of the memory cells having smaller line resistances. Each of the memory cells may also include a diode therein, and ones of the memory cells having greater line resistances may include diodes having lower resistances. Related devices are also discussed. | 09-23-2010 |
20100238710 | NONVOLATILE MEMORY DEVICE - A nonvolatile memory device, includes: a memory layer having a resistance changeable by performing at least one selected from applying an electric field and providing a current, the storage layer having a first major surface; a plurality of first electrodes provided on the first major surface; a plurality of probe electrodes disposed to face the plurality of first electrodes, the plurality of probe electrodes having a changeable relative positional relationship with the first electrodes; a drive unit connected to the plurality of probe electrodes to record information in the memory layer by causing at least the one selected from the electric field and the current between at least two of the plurality of first electrodes via the plurality of probe electrodes, the electric field having a component parallel to the first major surface, the current flowing in a direction having a component parallel to the first major surface. | 09-23-2010 |
20100238711 | RESISTANCE-CHANGE MEMORY - A resistance-change memory of an aspect of the present invention including a first bit line, second and third bit lines extending in a direction intersecting with the first bit line, first and second word lines, a first select transistor in which a control terminal thereof is connected to the first word line and in which one end of a current path thereof is connected to the second bit line, a second select transistor in which a control terminal thereof is connected to the second word line and in which one end of a current path thereof is connected to the third bit line and in which the end of a current path thereof forms a node together with the other end of the first select transistor, and a resistance-change storage element which has one end connected to the first bit line and the other end connected to the node. | 09-23-2010 |
20100238712 | VARIABLE WRITE AND READ METHODS FOR RESISTIVE RANDOM ACCESS MEMORY - Variable write and read methods for resistance random access memory (RRAM) are disclosed. The methods include initializing a write sequence and verifying the resistance state of the RRAM cell. If a write pulse is needed, then two or more write pulses are applied through the RRAM cell to write the desired data state to the RRAM cell. Each subsequent write pulse has substantially the same or greater write pulse duration. Subsequent write pulses are applied to the RRAM cell until the RRAM cell is in the desired data state or until a predetermined number of write pulses have been applied to the RRAM cell. A read method is also disclosed where subsequent read pulses are applied through the RRAM cell until the read is successful or until a predetermined number of read pulses have been applied to the RRAM cell. | 09-23-2010 |
20100238713 | Non-volatile register - A non-volatile register is disclosed. The non-volatile register includes a memory element. The memory element comprises a first end and a second end. The non-volatile register includes a register logic connected with the first and second ends of the memory element. The register logic is positioned below the memory element. The memory element may be a two-terminal memory element configured to store data as a plurality of conductivity profiles that can be non-destructively determined by applying a read voltage across the two terminals. New data can be written to the two-terminal memory element by applying a write voltage of a predetermined magnitude and/or polarity across the two terminals. The two-terminal memory element retains stored data in the absence of power. A reference element including a structure that is identical or substantially identical to the two-terminal memory element may be used to generate a reference signal for comparisons during read operations. | 09-23-2010 |
20100246239 | Memory device using a variable resistive element - A memory device includes a memory cell array including a plurality of memory blocks, each memory block including a plurality of memory cells, a plurality of word lines coupled to rows of the plurality of memory cells, a plurality of bit lines coupled to columns of the plurality of memory cells, and a control unit controlling an erase operation so that erase data is simultaneously written in the plurality of memory cells corresponding to an erase unit. A first erase mode may include a first erase unit and a first erase data pattern. A second erase mode may include a second erase unit and a second erase pattern. At least one of the first and second erase units and the first and second erase data patterns are different. | 09-30-2010 |
20100246240 | SEMICONDUCTOR DEVICE CONFIGURATION METHOD - A plurality of three-terminal variable resistance switching elements each having a source electrode, a drain electrode, and a gate electrode are connected to each other in series. The source electrode of each of the three-terminal variable resistance switching elements and the drain electrode of its adjacent three-terminal variable resistance switching element are connected to each other through a wiring segment to form a lane. A potential holding section for holding a predetermined potential level is connected to the wiring segment. A column group is configured by selecting one of the three-terminal variable resistance elements in each lane. A common gate line is connected to each of the gate electrodes of the three-terminal variable resistance elements belonging to the column group. | 09-30-2010 |
20100246241 | SEMICONDUCTOR DEVICE WITH SOURCE LINES EXTENDING IN A DIFFERENT DIRECTION - A semiconductor device includes a plurality of word lines extending in a first direction, a plurality of bit lines extending in a second direction, a plurality of source lines formed along a third direction which is different from the first and the second directions, and a source line control circuit serving as a driving arrangement selectively driving the plurality of source lines. | 09-30-2010 |
20100254174 | Resistive Sense Memory with Complementary Programmable Recording Layers - A resistive sense memory and method of writing data thereto. In accordance with various embodiments, the resistive sense memory comprises a first reference layer with a fixed magnetic orientation in a selected direction coupled to a first tunneling barrier, a second reference layer with a fixed magnetic orientation in the selected direction coupled to a second tunneling barrier, and a recording structure disposed between the first and second tunneling barriers comprising first and second free layers. A selected logic state is written to the resistive sense memory by applying a programming input to impart complementary first and second programmed magnetic orientations to the respective first and second free layers. | 10-07-2010 |
20100254175 | CROSS POINT NON-VOLATILE MEMORY CELL - A memory system includes an X line, a first Y line, a second Y line, a semiconductor region of a first type running along the X line, first switching material and a first semiconductor region of a second type between the first Y line and the semiconductor region of the first type, second switching material and a second semiconductor region of the second type between the second Y line and the semiconductor region of the first type, and control circuitry. The control circuitry is in communication with the X line, the first Y line and the second Y line. The control circuitry changes the programming state of the first switching material to a first state by causing a first current to flow from the second Y line to the first Y line through the first switching material, the second switching material, the semiconductor region of the first type, the first semiconductor region of the second type and the second semiconductor region of the second type. | 10-07-2010 |
20100254176 | Multi-Bit Resistance-Switching Memory Cell - A non-volatile storage apparatus comprises a set of Y lines, a set of X lines and a plurality of memory cells in communication with the set of X lines and the set of Y lines. Each memory cell of the plurality of memory cells includes a resistance element in a static resistance condition and two or more reversible resistance-switching elements. The resistance element in the static resistance condition and the two or more reversible resistance-switching elements are connected to different Y lines of the set of Y lines. The resistance element in the low resistance state and the two or more reversible resistance-switching elements are connected to a common X line of the set of X lines. One or multiple bits of data are programmed into a particular memory cell of the plurality of memory cells by causing current flow between Y lines connected to the particular memory cell. | 10-07-2010 |
20100254177 | Programming Non-Volatile Storage Element Using Current From Other Element - A non-volatile storage apparatus includes a set of Y lines, a common X line, multiple data storage elements each of which is connected to the common X line, a dummy storage element connected to the common X line and a particular Y line, and control circuitry in communication with the common X line and the set of Y lines. The multiple data storage elements are capable of being in a first state or a second state. The dummy storage element is in a conductive state. The control circuitry provides control signals to the common X line and the set of Y lines to change a first data storage element of the multiple data storage elements from the first state to the second state by passing a current into the first data storage element from the particular Y line through the dummy storage element. The control circuitry provides control signals to the common X line and the set of Y lines to sequentially change additional data storage elements of the multiple data storage elements from the first state to the second state by passing currents into the additional data storage elements from data storage elements of the multiple data storage elements that were previously changed to the second state and their associated different Y lines. | 10-07-2010 |
20100254178 | STORAGE DEVICE AND INFORMATION RE-RECORDING METHOD - A storage device capable of reducing a number of cycles necessary for a verify at a time of multi-value recording is provided. An initial value of a potential difference VCG between a gate and a source of a switching transistor at the time of the verify is set to a value varied in accordance with a resistance value level of multi-value information. In the case where a writing side performs a 3-value recording, when “01” is the information, an initial value VGS | 10-07-2010 |
20100259966 | NONVOLATILE MEMORY ELEMENT, NONVOLATILE MEMORY APPARATUS, AND NONVOLATILE SEMICONDUCTOR APPARATUS - A nonvolatile memory element comprises a first electrode ( | 10-14-2010 |
20100259967 | MEMORY CELL - A memory cell is provided, in which a resistance value is appropriately controlled, thereby a variable resistance element may be applied with a voltage necessary for changing the element into a high or low resistance state. A storage element | 10-14-2010 |
20100259968 | STORAGE DEVICE AND INFORMATION RERECORDING METHOD - A storage device that improves ability of adjusting a resistance value level in recording and enables stable verification control is provided. VWL supplied from a second power source to a control terminal of a transistor is increased (increase portion: ΔVWL) for every rerecording by verification control by a WL adjustment circuit. In the case where a variable resistive element is able to record multiple values, ΔVWL is a value variable for every resistance value level of multiple value information. That is, ΔVWL is a value variable according to magnitude relation of a variation range of recording resistance of the variable resistive element due to a current. In the region where the variation range of the recording resistance is large (source-gate voltage VGS of the transistor is small), ΔVWL is small, while in the region where the variation range of the recording resistance is small (VGS is large), ΔVWL is large. | 10-14-2010 |
20100259969 | Preservation circuit and methods to maintain values representing data in one or more layers of memory - Circuitry and methods for restoring data in memory are disclosed. The memory may include at least one layer of a non-volatile two-terminal cross-point array that includes a plurality of two-terminal memory elements that store data as a plurality of conductivity profiles and retain stored data in the absence of power. Over a period of time, logic values indicative of the stored data may drift such that if the logic values are not restored, the stored data may become corrupted. At least a portion of each memory may have data rewritten or restored by circuitry electrically coupled with the memory. Other circuitry may be used to determine a schedule for performing restore operations to the memory and the restore operations may be triggered by an internal or an external signal or event. The circuitry may be positioned in a logic layer and the memory may be fabricated over the logic layer. | 10-14-2010 |
20100259970 | RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device including a substrate, first and second wiring lines formed above the substrate to be insulated from each other, and memory cells disposed between the first and second wiring lines, wherein the memory cell includes: a variable resistance element for storing as information a resistance value; and a Schottky diode connected in series to the variable resistance element. The variable resistance element has: a recording layer formed of a composite compound containing at least one transition element and a cavity site for housing a cation ion; and electrodes formed on the opposite sides of the recording layer, one of which serves as a cation source in a write or erase mode for supplying a cation to the recording layer to be housed in the cavity site therein. | 10-14-2010 |
20100265757 | RESISTANCE CHANGE MEMORY DEVICE AND OPERATION METHOD OF THE SAME - A resistance change memory device includes: memory cells each having a current path in which a storage element, whose resistance changes according to the voltage applied, and an access transistor are connected in series; first wirings each connected to one end of the current path; second wirings each connected to the other end of the current path; a well which is a semiconductor region in which the access transistors are formed; and a drive circuit. | 10-21-2010 |
20100271859 | NONVOLATILE MEMORY ELEMENT, NONVOLATILE SEMICONDUCTOR MEMORY APPARATUS, AND READING METHOD AND WRITING METHOD THEREFOR - A nonvolatile memory element ( | 10-28-2010 |
20100271860 | DRIVING METHOD OF VARIABLE RESISTANCE ELEMENT, INITIALIZATION METHOD OF VARIABLE RESISTANCE ELEMENT, AND NONVOLATILE STORAGE DEVICE - A method of driving a variable resistance element includes: a writing step performed by applying a writing voltage pulse having a first polarity to a variable resistance layer to change a resistance state of the layer from high to low; and an erasing step performed by applying an erasing voltage pulse having a second polarity to the layer to change the state from low to high. Here, |Vw1|>|Vw2| where Vw1 represents a voltage value of the writing voltage pulse for first to N-th writing steps (N≧ | 10-28-2010 |
20100271861 | VARIABLE-RESISTANCE MEMORY DEVICE AND ITS OPERATION METHOD - A variable-resistance memory device includes: memory cells; first wires; a second wire; a drive/control section; and a sense amplifier. | 10-28-2010 |
20100271862 | NONVOLATILE MEMORY DEVICE - A nonvolatile memory device includes resistive memory devices in a three-dimensional structure. A block select circuit generates a block select signal for selecting a memory block. In response to the block select signal, local word line selection units connected to each memory block connect global word lines connected to a word line decoder and local word lines, and local bit line selection units connected to each memory block connect global bit lines connected to a sense amplifier and local bit lines. Each memory block includes local word lines which extend in a first direction and are stacked in a second direction perpendicular to the first direction on a second plane perpendicular to a first plane. Local bit lines extend in the second direction to cross local word lines. Memory cells are formed at cross-points where local word lines and local bit lines cross one another. | 10-28-2010 |
20100271863 | Memory Cells, Memory Cell Programming Methods, Memory Cell Reading Methods, Memory Cell Operating Methods, and Memory Devices - Embodiments disclosed include memory cell operating methods, memory cell programming methods, memory cell reading methods, memory cells, and memory devices. In one embodiment, a memory cell includes a wordline, a first bitline, a second bitline, and a memory element. The memory element is electrically connected to the wordline and selectively electrically connected to the first bitline and the second bitline. The memory element stores information via a resistive state of the memory element. The memory cell is configured to convey the resistive state of the memory element via either a first current flowing from the first bitline through the memory element to the wordline or a second current flowing from the wordline through the memory element to the second bitline. | 10-28-2010 |
20100277967 | GRADED METAL OXIDE RESISTANCE BASED SEMICONDUCTOR MEMORY DEVICE - Memory devices are described along with methods for manufacturing and methods for operating. A memory device as described herein includes a plurality of memory cells located between word lines and bit lines. Memory cells in the plurality of memory cells comprise a diode and a metal-oxide memory element programmable to a plurality of resistance states including a first and a second resistance state, the diode of the memory element arranged in electrical series along a current path between a corresponding word line and a corresponding bit line. The device further includes bias circuitry to apply bias arrangements across the series arrangement of the diode and the memory element of a selected memory cell in the plurality of memory cells. | 11-04-2010 |
20100277968 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a memory cell array configured of at least a first portion and a second portion each including a plurality of memory cells each with a variable resistor which stores an electrically rewritable resistance value as a data, and a control circuit which controls a first operation including selected one of operations to erase, write and read the data in the first portion and a second operation including selected one of operations to erase, write and read the data in the second portion, the first operation and the second operation being performed in temporally overlapped relation with each other. | 11-04-2010 |
20100277969 | STRUCTURES FOR RESISTIVE RANDOM ACCESS MEMORY CELLS - A resistive random access memory (RRAM) cell that includes a first electrode having a lower portion, a continuous side portion and an upper portion, the lower portion and the continuous side portion having an outer surface and an inner surface; a resistive layer having a lower portion, a continuous side portion and an upper portion, the lower portion and the continuous side portion having an outer surface and an inner surface; and a second electrode having a lower portion, an upper portion and an outer surface; wherein the outer surface of the resistive layer directly contacts the inner surface of the first electrode. | 11-04-2010 |
20100290266 | COMMAND PROCESSING CIRCUIT AND PHASE CHANGE MEMORY DEVICE USING THE SAME - A command processing circuit for generating internal command signals corresponding to a plurality of unit internal command signals sequentially applied during a plurality of command cycles, the command processing circuit includes a first command latching unit configured to latch a first unit internal command signal applied in a first command cycle and a second command latching unit configured to latch a second unit internal command signal in response to the first unit internal command signal latched in the first command latching unit in a second command cycle after the first command cycle, and output an internal command signal corresponding to the first unit internal command signal and the second unit internal command signal. | 11-18-2010 |
20100296330 | SEMICONDUCTOR MEMORY DEVICE - There is provided a semiconductor memory device capable of suppressing writing disturbances without increasing the cell array area. A semiconductor memory device has a memory cell array where a number of memory cells having a two-terminal type memory element and a transistor for selection connected in series are aligned in a matrix shape, a first voltage applying circuit for applying a writing voltage pulse to a first bit line, and a second voltage applying circuit for applying a pre-charge voltage to a first and second bit line, such that at the time of the writing of a memory cell, the first voltage applying circuit pre-charges the two ends of the memory cell to the same voltage in advance, and after that, the second voltage applying circuit applies a writing voltage pulse via the first bit line directly connected to the transistor for selection. | 11-25-2010 |
20100296331 | SENSING RESISTANCE VARIABLE MEMORY - The present disclosure includes devices and methods for operating resistance variable memory. One device embodiment includes an array of memory cells wherein a number of the cells are commonly coupled to a select line, the number cells including a number of data cells programmable within a number of target threshold resistance (R | 11-25-2010 |
20100302835 | LIMITED CHARGE DELIVERY FOR PROGRAMMING NON-VOLATILE STORAGE ELEMENTS - A memory system includes a substrate, control circuitry on the substrate, a three dimensional memory array (above the substrate) that includes a plurality of memory cells with reversible resistance-switching elements, and a circuit for detecting the setting and resetting of the reversible resistance-switching elements. In one aspect a circuit that has one or more clock inputs is run for a predetermined number of clock cycles. The circuit generates an amount of charge over the predetermined number of clock cycles. At most the amount of charge is provided to non-volatile storage element to program the non-volatile storage element. It is determined whether the non-volatile storage element is programmed to a desired state as a result of providing at most the amount of charge to the non-volatile storage element. Techniques disclosed herein can be applied to program memory cells other than memory cells with reversible resistance-switching elements. | 12-02-2010 |
20100302836 | NONVOLATILE MEMORY CELL COMPRISING A DIODE AND A RESISTANCE-SWITCHING MATERIAL - In a novel nonvolatile memory cell formed above a substrate, a diode is paired with a reversible resistance-switching material, preferably a metal oxide or nitride such as, for example, Ni | 12-02-2010 |
20100315857 | RESISTANCE CHANGE MEMORY - A resistance change memory includes a first conductive line extending in a first direction, a second conductive line extending in a second direction which is crossed to the first direction, a cell unit including a memory element and a rectifying element connected in series between the first and second conductive lines, and a control circuit which is connected to both of the first and second conductive lines. The control circuit controls a voltage to change a resistance of the memory element between first and second values reversibly. The rectifying element is a diode including an anode layer, a cathode layer and an insulating layer therebetween. | 12-16-2010 |
20100321976 | Split Path Sensing Circuit - A sensing circuit is disclosed. The sensing circuit includes a first path including a first resistive memory device and a second path including a reference resistive memory device. The first path is coupled to a first split path including a first load transistor and to a second split path including a second load transistor. The second path is coupled to a third split path including a third load transistor and to a fourth split path including a fourth load transistor. | 12-23-2010 |
20100321977 | PROGRAMMING REVERSIBLE RESISTANCE SWITCHING ELEMENTS - A storage system and method for operating the storage system that uses reversible resistance-switching elements is described. Techniques are disclosed herein for varying programming conditions to account for different resistances that memory cells have. These techniques can program memory cells in fewer attempts, which can save time and/or power. Techniques are disclosed herein for achieving a high programming bandwidth while reducing the worst case current and/or power consumption. In one embodiment, a page mapping scheme is provided that programs multiple memory cells in parallel in a way that reduces the worst case current and/or power consumption. | 12-23-2010 |
20100321978 | SEMICONDUCTOR MEMORY DEVICE AND MEMORY CELL VOLTAGE APPLICATION METHOD - A semiconductor memory device comprises a plurality of parallel word lines, a plurality of parallel bit lines formed crossing the plurality of word lines, and a plurality of memory cells arranged at intersections of the word lines and the bit lines. Each memory cell has one end connected to the word line and the other end connected to the bit line. The device also comprises a drive circuit operative to selectively apply a voltage for data read/write across the word line and the bit line. It further comprises a sense amplifier circuit connected to the plurality of bit lines and operative to read/write data stored in the memory cell. The device also comprises a bit-line drive auxiliary circuit operative to selectively adjust the potentials on the plurality of bit lines based on data read out of the memory cell by the sense amplifier circuit. | 12-23-2010 |
20100321979 | RESISTANCE CHANGE MEMORY - A resistance change memory includes a first conductive line extending in a first direction, a second conductive line extending in a second direction which is crossed to the first direction, a cell unit including a memory element and a rectification connected in series between the first and second conductive lines, and a control circuit which is connected to both of the first and second conductive lines. The control circuit controls a value of voltage which is applied to the memory element to change a resistance of the memory element reversibly between first and second values. The rectification includes a p-type semiconductor layer, an n-type semiconductor layer and an intrinsic semiconductor layer therebetween. The rectification has a first diffusion prevention area in the intrinsic semiconductor layer. | 12-23-2010 |
20100321980 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes a variable resistance element configured to store data “0” and data “1” in accordance with a change in resistance value, a current generator configured to generate a reference current for determining data of the variable resistance element, and having an admittance middle between an admittance of a variable resistance element storing data “0” and an admittance of a variable resistance element storing data “1”, and a sense amplifier includes a first input terminal connected to the variable resistance element and a second input terminal connected to the current generator, and configured to compare currents of the first input terminal and the second input terminal. | 12-23-2010 |
20100321981 | VARIABLE RESISTANCE MEMORY DEVICES COMPENSATING FOR WORD LINE RESISTANCE - Memory devices include a row decoder, a first variable resistance memory cell connected to a first bit line and connected to the row decoder by a word line and a second variable resistance memory cell connected to a second bit line and connected to the row decoder by the word line. The memory devices further include a bit line select circuit coupled to the first and second bit lines and configured to compensate for a difference in word line resistance between the row decoder and the respective first and second memory cells. In some embodiments, the bit line select circuit includes first and second transistors configured to selective respective ones of the first and second bit lines and the first and second transistors have different resistances that compensate for the difference in word line resistance. | 12-23-2010 |
20100321982 | NONVOLATILE STORAGE DEVICE AND METHOD FOR WRITING INTO THE SAME - To provide a nonvolatile storage device ( | 12-23-2010 |
20100328988 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a memory cell array of electrically erasable programmable nonvolatile memory cells arranged in matrix, each memory cell using a variable resistor. A pulse generator is operative to generate plural types of write pulses for varying the resistance of the variable resistor in three or more stages based on ternary or higher write data. A selection circuit is operative to select a write target memory cell from the memory cell array based on a write address and supply the write pulse generated from the pulse generator to the selected memory cell. | 12-30-2010 |
20110002154 | NONVOLATILE MEMORY ELEMENT, MANUFACTURING METHOD THEREOF, AND NONVOLATILE SEMICONDUCTOR DEVICE INCORPORATING NONVOLATILE MEMORY ELEMENT - A nonvolatile memory element of the present invention comprises a first electrode ( | 01-06-2011 |
20110002155 | CURRENT CONTROL ELEMENT, MEMORY ELEMENT, AND FABRICATION METHOD THEREOF - A memory element ( | 01-06-2011 |
20110002156 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a plurality of first wirings; a plurality of second wirings; a plurality of memory cells positioned at respective intersections of the first wirings and the second wirings, each of the memory cells having a variable resistance element and a selective element connected to the variable resistance element in series; a first selection portion selecting the first wiring; a second selection portion selecting the second wiring; and a power source portion applying predetermined selected-wiring-voltages to a selected first wiring being selected by the first selection portion and a selected second wiring being selected by the second selection portion, respectively, and applying predetermined unselected-wiring-voltages to unselected first wirings other than the selected first wiring and unselected second wirings other than the selected second wiring, respectively. A resistance element having a predetermined resistance value is provided between the power source portion and the unselected first and second wirings. | 01-06-2011 |
20110002157 | RESISTANCE CHANGE TYPE MEMORY - A resistance change type memory includes first, second and third drive lines, a resistance change element having one end connected to the third drive line, a first diode having an anode connected to the first drive line and a cathode connected to other end of the first resistance change element, a second diode having an anode connected to other end of the first resistance change element and a cathode connected to the second drive line, and a driver/sinker which supplies a write current to the resistance change element. A write control circuit is arranged such that when first data is written, the write current is caused to flow in a direction from the first drive line to the third drive line, and when second data is written, the write current is caused to flow in a direction from the third drive line to the second drive line. | 01-06-2011 |
20110002158 | METHOD OF PROGRAMMING VARIABLE RESISTANCE ELEMENT AND VARIABLE RESISTANCE MEMORY DEVICE USING THE SAME - A method of programming a variable resistance element to be operated with stability and at a high speed is provided. The method programs a nonvolatile variable resistance element ( | 01-06-2011 |
20110007543 | BIPOLAR SELECT DEVICE FOR RESISTIVE SENSE MEMORY - A resistive sense memory apparatus includes a bipolar select device having a semiconductor substrate, a plurality of collector contacts disposed in a first side of the of the semiconductor substrate, an emitter contact layer disposed in a second side of the semiconductor substrate, and a base layer separating the plurality of collector contacts from the emitter contact layer. Each collector contact is electrically isolated from each other. A resistive sense memory cells is electrically coupled to each collector contacts and a bit line. The base layer and the emitter contact layer provide an electrical path for the plurality of collector contacts. | 01-13-2011 |
20110007544 | Non-Volatile Memory with Active Ionic Interface Region - A non-volatile memory cell and method of use therefore are disclosed. In accordance with various embodiments, the memory cell comprises a tunneling region disposed between a conducting region and a metal region, wherein the tunneling region comprises an active interface region disposed between a first tunneling barrier and a second tunneling barrier. A high resistive film is formed in the active interface region with migration of ions from both the metal and conducting regions responsive to a write current to program the memory cell to a selected resistive state. | 01-13-2011 |
20110007545 | Non-Volatile Memory Cell Stack with Dual Resistive Elements - A non-volatile memory cell and method of use thereof. In some embodiments, an individually programmable resistive sense memory (RSM) element is connected in series with a programmable metallization cell (PMC) switching element. In operation, while the switching element is programmed to a first resistive state, no current passes through the RSM element and while a second resistive state is programmed to the RSM element, current passes through the RSM element. | 01-13-2011 |
20110007546 | Anti-Parallel Diode Structure and Method of Fabrication - An anti-parallel diode structure and method of fabrication is presently disclosed. In some embodiments, an anti-parallel diode structure has a semiconductor region comprising a first insulator layer disposed between a first semiconductor layer and a second semiconductor layer. The semiconductor region can be bound on a first side by a first metal material and bound on a second side by a second metal material so that current below a predetermined value is prevented from passing through the semiconductor region and current above the predetermined value passes through the semiconductor region. | 01-13-2011 |
20110007547 | Vertical Non-Volatile Switch with Punchthrough Access and Method of Fabrication Therefor - A semiconductor device for accessing non-volatile memory cell is provided. In some embodiments, the semiconductor device has a vertical stack of semiconductor layers including a source, a drain, and a well. An application of a drain-source bias voltage to the semiconductor device generates a punchthrough mechanism across the well to initiate a flow of current between the source and the drain. | 01-13-2011 |
20110007548 | Hierarchical Cross-Point Array of Non-Volatile Memory - A method and apparatus for reading data from a non-volatile memory cell. In some embodiments, a cross-point array of non-volatile memory cells is arranged into rows and columns. A selection circuit is provided that is capable of activating the first block of memory cells while deactivating the second block of memory cells. Further, a read circuit is provided that is capable of reading a logical state of a predetermined memory cell in the first block of memory cells with a reduced leak current by programming a first resistive state to the block selection elements corresponding to the first block of memory cells while programming a second resistive state to the block selection elements corresponding to the second block of memory cells. | 01-13-2011 |
20110007549 | SHARED BIT LINE AND SOURCE LINE RESISTIVE SENSE MEMORY STRUCTURE - A resistive sense memory apparatus includes a first semiconductor transistor having a first contact electrically connected to a first source line and a second contact electrically connected to a first resistive sense memory element and a second semiconductor transistor having a first contact electrically connected to a second source line and a second contact electrically connected to a second resistive sense memory element. A bit line is electrically connected to the first resistive sense memory element and the second resistive sense memory element. | 01-13-2011 |
20110007550 | Current Magnitude Compensation for Memory Cells in a Data Storage Array - A data storage device and associated method for providing current magnitude compensation for memory cells in a data storage array. In accordance with some embodiments, unit cells are connected between spaced apart first and second control lines of common length. An equalization circuit is configured to respectively apply a common current magnitude through each of the unit cells by adjusting a voltage applied to the cells in relation to a location of each of the cells along the first and second control lines. | 01-13-2011 |
20110007551 | Non-Volatile Memory Cell with Non-Ohmic Selection Layer - A non-volatile memory cell and associated method is disclosed that includes a non-ohmic selection layer. In accordance with some embodiments, a non-volatile memory cell consists of a resistive sense element (RSE) coupled to a non-ohmic selection layer. The selection layer is configured to transition from a first resistive state to a second resistive state in response to a current greater than or equal to a predetermined threshold. | 01-13-2011 |
20110007552 | Active Protection Device for Resistive Random Access Memory (RRAM) Formation - Apparatus and method for providing overcurrent protection to a resistive random access memory (RRAM) cell during an RRAM formation process used to prepare the cell for normal read and write operations. In accordance with various embodiments, the RRAM cell is connected between a first control line and a second control line, and an active protection device (APD) is connected between the second control line and an electrical ground terminal. A formation current is applied through the RRAM cell, and an activation voltage is concurrently applied to the APD to maintain a maximum magnitude of the formation current below a predetermined threshold level | 01-13-2011 |
20110007553 | NONVOLATILE STORAGE DEVICE AND METHOD FOR WRITING INTO MEMORY CELL OF THE SAME - Provided is a nonvolatile storage device ( | 01-13-2011 |
20110007554 | SEMICONDUCTOR DEVICE - A programmable semiconductor device has a switch element in an interconnection layer, wherein in at least one of the inside of a via, interconnecting a wire of a first interconnection layer and a wire of a second interconnection layer, a contact part of the via with the wire of the first interconnection layer and a contact part of the via with the wire of the second interconnection layer, there is provided a variable electrical conductivity member, such as a member of an electrolyte material. The via is used as a variable electrical conductivity type switch element or as a variable resistance device having a contact part with the wire of the first interconnection layer as a first terminal and having a contact part with the wire of the second interconnection layer as a second terminal. | 01-13-2011 |
20110007555 | RESISTANCE CHANGE ELEMENT, SEMICONDUCTOR MEMORY DEVICE, MANUFACTURING METHOD AND DRIVING METHOD THEREOF - To provide a resistance change element which can reduce the current required to switch the state to the high resistance state from the low resistance state. | 01-13-2011 |
20110013445 | Bias Temperature Instability-Influenced Storage Cell - In a method of using a memory cell employing a field effect transistor (FET), the FET is heated to a first temperature sufficient to support bias temperature instability in the FET. The bit line is driven to a high voltage state. The word line is driven to a predetermined voltage state that causes bias temperature instability in the FET. The temperature, the high voltage state on the bit line and the predetermined voltage state on the word line are maintained for an amount of time sufficient to change a threshold voltage of the FET to a state where a desired data value is stored on the FET. The FET is cooled to a second temperature that is cooler than the first temperature after the amount of time has expired. | 01-20-2011 |
20110019462 | THREE DIMENSIONAL PROGRAMMABLE RESISTANCE MEMORY DEVICE WITH A READ/WRITE CIRCUIT STACKED UNDER A MEMORY CELL ARRAY - A programmable resistance memory device includes a semiconductor substrate, at least one cell array, in which memory cells are arranged formed above the semiconductor substrate. Each of the memory cells has a stack structure of a programmable resistance element and an access element, the programmable resistance element storing a high resistance state or a low resistance state determined due to the polarity of voltage application in a non-volatile manner. The access element has such a resistance value in an off-state in a certain voltage range that is ten time or more as high as that in a select state. A read/write circuit is formed on a semiconductor substrate as underlying the cell array for data reading and data writing in communication with the cell array. | 01-27-2011 |
20110026297 | VARIABLE AND REVERSIBLE RESISTIVE ELEMENT, NON-VOLATILE MEMORY DEVICE AND METHODS FOR OPERATING AND MANUFACTURING THE NON-VOLATILE MEMORY DEVICE - A variable and reversible resistive element includes a transition metal oxide layer, a bottom electrode and at least one conductive plug module. The bottom electrode is disposed under the transition metal oxide layer. The conductive plug module is disposed on the transition metal oxide layer. The conductive plug module includes a metal plug and a barrier layer. The conductive plug is electrically connected with the transition metal oxide layer. The barrier layer surrounds the metal plug, wherein the transition metal oxide layer is made by reacting a portion of a dielectric layer being directly below the metal plug and a portion of the barrier layer contacting the portion of the dielectric layer, wherein the dielectric layer is formed on the bottom electrode. Moreover, a non-volatile memory device and methods for operating and manufacturing the same is disclosed in specification. | 02-03-2011 |
20110026298 | METHOD OF DRIVING STORAGE DEVICE - Provided is a method of driving a storage device capable of improving reliability of data write in the storage device including a variable resistance element. At the time of data write operation, a plurality of write pulses having shapes different from each other are applied between electrodes | 02-03-2011 |
20110026299 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF DATA WRITE/DATA ERASE THEREIN - A nonvolatile semiconductor memory device comprises: a plurality of first lines; a plurality of second lines; a plurality of memory cells each disposed at each of crossing-points of the first lines and the second lines and each comprising a variable resistor and a bi-directional diode; and a voltage control circuit configured to control a voltage of selected one of the first lines, unselected ones of the first lines, selected one of the second lines, and unselected ones of the second lines, respectively. The variable resistor is configured to change its resistance value depending on a polarity of a voltage applied thereto. The voltage control circuit is configured to apply a voltage pulse to the selected one of the first lines and to connect a capacitor of a certain capacitance to one end of the selected one of the second lines. | 02-03-2011 |
20110026300 | Resistive memory device and operating method thereof - A resistive memory device includes: a storage element; a first line and a second line; a first drive controller; and a second drive controller. | 02-03-2011 |
20110026301 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes first select line groups laminated in a vertical direction, and each including first select lines extending in a first direction, second select line groups alternately laminated with the first select line groups, and each including second select lines extending in a second direction that intersects with the first direction, and memory cells arranged between the first select lines and the second select lines. Even-numbered layers and odd-numbered layers of the first select line groups are arranged to be shifted in the second direction. | 02-03-2011 |
20110026302 | WRITE VERIFY METHOD FOR RESISTIVE RANDOM ACCESS MEMORY - Write verify methods for resistance random access memory (RRAM) are provided. The methods include applying a reset operation voltage pulse across a RRAM cell to change a resistance of the RRAM cell from a low resistance state to a high resistance state. Then the method includes applying a forward resetting voltage pulse across the RRAM cell if the RRAM cell has a high resistance state resistance value less than a selected lower resistance limit value. This step is repeated until the high resistance state resistance value is greater than the lower resistance limit value. The method also includes applying a reverse resetting voltage pulse across the RRAM cell if the RRAM cell has a high resistance state resistance values is greater than a selected upper resistance limit value. The reverse resetting voltage pulse has a second polarity being opposite the first polarity. This step is repeated until all the high resistance state resistance value is less than the upper resistance limit value. | 02-03-2011 |
20110026303 | VARIABLE RESISTANCE MEMORY DEVICE AND SYSTEM THEREOF - A nonvolatile memory device comprising: a plurality of memory banks, each of which operates independently and includes a plurality of resistance memory cells, each cell including a variable resistive element having a resistance varying depending on stored data; a plurality of global bit lines, each global bit line being shared by the plurality of memory banks; a temperature compensation circuit including one or more reference cells; and a data read circuit which is electrically connected to the plurality of global bit lines and performs a read operation by supplying at least one of the resistance memory cells with a current varying according to resistances of the reference cells. | 02-03-2011 |
20110026304 | MEMORY CELL - Methods, and circuits, are disclosed for operating a programmable memory device. One method embodiment includes storing a value as a state in a first memory cell and as a complementary state in a second memory cell. Such a method further includes determining the state of the first memory cell using a first self-biased sensing circuit and the complementary state of the second memory cell using a second self-biased sensing circuit, and comparing in a differential manner an indication of the state of the first memory cell to a reference indication of the complementary state of the second memory cell to determine the value. | 02-03-2011 |
20110026305 | Non-Volatile Memory Array With Resistive Sense Element Block Erase and Uni-Directional Write - A non-volatile memory cell and associated method of use are disclosed. In accordance with various embodiments, the memory cell includes a switching device and a resistive sense element (RSE) connected in series between first and second control lines. The first control line is supplied with a variable voltage and the second control line is maintained at a fixed reference voltage. A first resistive state of the RSE is programmed by lowering the variable voltage of the first control line below the fixed reference voltage of the second control line to flow a body-drain current through the switching device. A different, second resistive state of the RSE is programmed by raising the variable voltage of the first control line above the fixed reference voltage to flow a drain-source current through the switching device. | 02-03-2011 |
20110026306 | RESISTANCE VARIABLE MEMORY DEVICE REDUCING WORD LINE VOLTAGE - A resistance variable memory device includes a memory cell array, a sense amplifier circuit, and a column selection circuit. The memory cell array includes a plurality of block units and a plurality of word line drivers, where each of the block units is connected between adjacent word line drivers and includes a plurality of memory blocks. The sense amplifier circuit includes a plurality of sense amplifier units, where each of the sense amplifier units provides a read current to a corresponding block unit and includes a plurality of sense amplifiers. The column selection circuit is connected between the memory cell array and the sense amplifier circuit and selects at least one of the plurality of memory blocks in response to a column selection signal to apply the read current from the sense amplifier circuit to the selected memory block. | 02-03-2011 |
20110026307 | VARIABLE RESISTIVE MEMORY PUNCHTHROUGH ACCESS METHOD - Variable resistive punchthrough access methods are described. The methods include switching a variable resistive data cell from a high resistance state to a low resistance state by passing a write current through the magnetic tunnel junction data cell in a first direction. The write current is provided by a transistor being electrically coupled to the variable resistive data cell and a source line. The write current passes through the transistor in punchthrough mode. | 02-03-2011 |
20110032745 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - A non-volatile semiconductor memory device according to an aspect of embodiments of the present invention includes a memory cell array including: multiple first wirings; multiple second wirings crossing the multiple first wirings; and multiple electrically rewritable memory cells respectively arranged at intersections of the first wirings and the second wirings, and each formed of a variable resistor which stores a resistance value as data in a non-volatile manner. The non-volatile semiconductor memory device according to an aspect of the embodiments of the present invention further includes a controller for selecting a given one of the memory cells, generating an erase pulse which is used for erasing data, and supplying the erase pulse to the selected memory cell. The erase pulse has a pulse width which is increased or decreased exponentially in accordance with an access path length to the selected memory cell. | 02-10-2011 |
20110032746 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device according to an embodiment includes a memory cell array including: a plurality of first lines; a plurality of second lines intersecting the first lines; and a plurality of memory cells each including a variable resistance element disposed at the intersection of the first and second lines and configured to store an electrically rewritable resistance value as data in a nonvolatile manner, and a control unit configured to detect an amount of a current flowing through the first line when a memory cell is accessed, and adjust the voltage of the first or second line based on the amount of the current. | 02-10-2011 |
20110032747 | VARIABLE RESISTANCE MEMORY DEVICES AND METHODS OF PROGRAMMING VARIABLE RESISTANCE MEMORY DEVICES - A variable resistance memory device includes a variable resistance memory cell, and a by-pass circuit configured to electrically by-pass a programming pulse supplied to the variable resistance memory cell after a resistive state of the variable resistance memory cell has changed in response to the programming pulse. | 02-10-2011 |
20110032748 | POLARITY DEPENDENT SWITCH FOR RESISTIVE SENSE MEMORY - A memory unit includes a resistive sense memory cell configured to switch between a high resistance state and a low resistance state upon passing a current through the resistive sense memory cell and a semiconductor transistor in electrical connection with the resistive sense memory cell. The semiconductor transistor includes a gate element formed on a substrate. The semiconductor transistor includes a source contact and a bit contact. The gate element electrically connects the source contact and the bit contact. The resistive sense memory cell electrically is connected to the bit contact. The source contact is more heavily implanted with dopant material then the bit contact. | 02-10-2011 |
20110032749 | NAND Based Resistive Sense Memory Cell Architecture - Various embodiments are directed to an apparatus comprising a semiconductor memory array with non-volatile memory unit cells arranged into a NAND block. Each of the unit cells comprises a resistive sense element connected in parallel with a switching element. The resistive sense elements are connected in series to form a first serial path, and the switching elements are connected in series to form a second serial path parallel to the first serial path. Each resistive sense element is serially connected to an adjacent resistive sense element in the block by a tortuous conductive path having a portion that extends substantially vertically between said elements to provide operational isolation therefor. | 02-10-2011 |
20110038195 | METHOD FOR RESETTING A RESISTIVE CHANGE MEMORY ELEMENT - A method of resetting a resistive change memory element is disclosed. The method comprises performing a series of programming operations—for example, a programming pulse of a predetermined voltage level and pulse width—on a resistive change memory element in order to incrementally increase the resistance of the memory element above some predefined threshold. Prior to each programming operation, the resistive state of the memory element is measured and used to determine the parameters used in that programming operation. If this measured resistance value is above a first threshold value, the memory element is determined to already be in a reset state and no further programming operation is performed. If this measured resistance value is below a second threshold value, this second threshold value being less than the first threshold value, a first set of programming parameters are used within the programming operation. If this initial value is above the second threshold value but below the first threshold value, a second set of programming parameters are used within the programming operation. | 02-17-2011 |
20110038196 | Electronic Devices Containing Switchably Conductive Silicon Oxides as a Switching Element and Methods for Production and Use Thereof - In various embodiments, electronic devices containing switchably conductive silicon oxide as a switching element are described herein. The electronic devices are two-terminal devices containing a first electrical contact and a second electrical contact in which at least one of the first electrical contact or the second electrical contact is deposed on a substrate to define a gap region therebetween. A switching layer containing a switchably conductive silicon oxide resides in the gap region between the first electrical contact and the second electrical contact. The electronic devices exhibit hysteretic current versus voltage properties, enabling their use in switching and memory applications. Methods for configuring, operating and constructing the electronic devices are also presented herein. | 02-17-2011 |
20110038197 | VARIABLE RESISTANCE MEMORY AND MEMORY SYSTEM INCLUDING THE SAME - A variable resistance memory array includes at least one variable resistance memory cell, wherein each variable resistance memory cell includes a well having a first type; and a cell structure on the well, the cell structure including a structure having a second type different from the first type and a variable resistance layer on the structure. | 02-17-2011 |
20110044088 | VARIABLE RESISTANCE NONVOLATILE STORAGE DEVICE AND METHOD OF FORMING MEMORY CELL - A variable resistance nonvolatile storage device which includes (i) a semiconductor substrate ( | 02-24-2011 |
20110044089 | Method for Manufacturing a Resistive Switching Memory Cell Comprising a Nickel Oxide Layer Operable at Low-Power and Memory Cells Obtained Thereof - A resistive switching non-volatile memory element is disclosed comprising a resistive switching metal-oxide layer sandwiched between and in contact with a top electrode and a bottom electrode, the resistive switching metal oxide layer having a substantial isotropic non-stoichiometric metal-to-oxygen ratio. For example, the memory element may comprise a nickel oxide resistive switching layer sandwiched between and in contact with a nickel top electrode and a nickel bottom electrode whereby the ratio oxygen-to-nickel of the nickel oxide layer is between 0 and 0.85. | 02-24-2011 |
20110044090 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device according to an embodiment includes: a memory cell array including a plurality of first lines and second lines intersecting each other and a plurality of memory cells connected at intersections of the plurality of first lines and second lines; and a first line control circuit and a second line control circuit configured to select the first lines and the second lines respectively to supply a voltage or current necessary for a resetting operation or a setting operation on the memory cells. The first line control circuit supplies unselected ones of the first lines with an unselecting voltage corresponding to the distance between the unselected first lines and the second line control circuit. | 02-24-2011 |
20110044091 | TWO-TERMINAL NANOTUBE DEVICES AND SYSTEMS AND METHODS OF MAKING SAME - A two terminal memory device includes first and second conductive terminals and a nanotube article. The article has at least one nanotube, and overlaps at least a portion of each of the first and second terminals. The device also includes stimulus circuitry in electrical communication with at least one of the first and second terminals. The circuit is capable of applying first and second electrical stimuli to at least one of the first and second terminal(s) to change the relative resistance of the device between the first and second terminals between a relatively high resistance and a relatively low resistance. The relatively high resistance between the first and second terminals corresponds to a first state of the device, and the relatively low resistance between the first and second terminals corresponds to a second state of the device. | 02-24-2011 |
20110044092 | SEMICONDUCTOR MEMORY DEVICE - A resistance variable memory reduces the nonuniformity of resistance values after programming, so that a rewrite operation can be performed on a memory cell at high speed. A reference resistor is connected in series with the resistance variable memory cell, and a sensor amplifier detects whether the potential at an intermediate node between the memory cell and the reference resistor exceeds a given threshold voltage, so as to stop the write operation based on a detection result. | 02-24-2011 |
20110044093 | NON-VOLATILE MEMORY DEVICES INCLUDING STACKED NAND-TYPE RESISTIVE MEMORY CELL STRINGS - A non-volatile memory device includes a substrate, an insulating layer on the substrate, and a plurality of serially connected resistive memory cells stacked in the insulating layer such that a first one of the plurality of resistive memory cells is on the substrate and a next one of the plurality of resistive memory cells is on the first one of the plurality of resistive memory cells to define a NAND-type resistive memory cell string. A bit line on the insulating layer is electrically connected to a last one of the plurality of resistive memory cells. At least one of the plurality of resistive memory cells may include a switching device and a data storage element including a variable resistor connected in parallel with the switching device. Related devices and fabrication methods are also discussed. | 02-24-2011 |
20110051492 | RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device including: a cell array with memory cells arranged therein, the memory cell storing a resistance state as data in a non-volatile manner; a write buffer configured to supply voltage and current to a selected memory cell in accordance with data to be written in it; and a write control circuit configured to make a part of current supplied to the selected memory cell flow out in accordance with the selected memory cell's state change in a write mode. | 03-03-2011 |
20110051493 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a memory cell array configured as an arrangement of memory cells each arranged between a first line and a second line and each including a variable resistor. A control circuit controls a voltage applied to the first line or the second line. A current limiting circuit limits a current flowing through the first line or the second line to a certain upper limit or lower. In a case where a writing operation or an erasing operation to a memory cell is implemented a plural number of times repeatedly, the current limiting circuit sets the upper limit in the writing operation or erasing operation of the p-th time higher than the upper limit in the writing operation or erasing operation of the q-th time (q | 03-03-2011 |
20110051494 | MEMORY HAVING TUNNEL BARRIER AND METHOD FOR WRITING AND READING INFORMATION TO AND FROM THIS MEMORY - A resistive memory comprises a tunnel barrier. The tunnel barrier is in contact with a memory material which has a memory property that can be changed by a write signal. Because of the exponential dependence of the tunnel resistance on the parameters of the tunnel barrier, a change in the memory property has a powerful effect on the tunnel resistance, whereby the information stored in the memory material can be read. A solid electrolyte (ion conductor), for example, is suitable as a memory layer, wherein the ions thereof can be moved relative to the interface with the tunnel barrier by the write signal. The memory layer, however, can also be, for example, a further tunnel barrier, the tunnel resistance of which can be changed by the write signal, for example by displacement of a metal layer present in this tunnel barrier. The invention further provides a method for storing and reading information to and from a memory. | 03-03-2011 |
20110051495 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE WITH NO DECREASE IN READ MARGIN AND METHOD OF READING THE SAME - According to one embodiment, a plurality of memory cells, each composed of a variable-resistance element and a diode, are arranged at the intersections of a plurality of word lines and a plurality of bit lines. The sense amplifier compares a voltage corresponding to current in a memory cell selected from the plurality of memory cells with a reference voltage to detect data read from the selected memory cell. The controller generates the reference voltage according to the logical value of a signal output from the sense amplifier. The controller, before detecting data in the memory cell, adjusts the reference voltage on the basis of current flowing in one of a plurality of bit lines connected to a plurality of memory cells in a half-selected state detected by the sense amplifier. | 03-03-2011 |
20110051496 | Resistive Random Access Memory and the Method of Operating the Same - A resistive random access memory utilizing gate induced drain leakage current as the read operation current and the write operation current and a method of operation the same, wherein the resistive random access memory including a plurality of arrayed memory cells, a plurality of bit-lines and a plurality word-lines, each memory cell including: a switching resistor having a first terminal and a second terminal, the first terminal of the switching resistor being connected to one bit-line; and a MOSFET being connected to the second terminal and having a gate, a source, a drain and a substrate, the gate being connected to one word-line, the read operation current and the write operation current of the memory cell being gate induced drain leakage current of the MOSFET. The RRAM array presented in this invention has superior scalability for resistors as well as transistors, which leads to a memory array with higher density. | 03-03-2011 |
20110051497 | METHOD OF MEASURING A RESISTANCE OF A RESISTIVE MEMORY DEVICE - A method of measuring a resistance of a memory cell in a resistive memory device can be provided by applying a data write pulse to a selected cell of the resistive memory device, applying a resistance read pulse to the selected cell after a delay time measured from a time of applying the data write pulse, measuring a drop voltage at the cell responsive to a pulse waveform output when applying the resistance read pulse to the selected cell, measuring a total current through the cell using the drop voltage and an internal resistance of a test device coupled to the cell, and determining a resistance of the resistive memory device using the total current and a voltage of the resistance read pulse. | 03-03-2011 |
20110051498 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes a memory cell, a power supply circuit, an interconnection and a discharging circuit. The memory cell includes a variable resistance element whose resistance varies by application of a voltage. The power supply circuit outputs the voltage to be applied to the memory cell. The interconnection is formed between the power supply circuit and the memory cell and supplies the voltage output from the power supply circuit to the memory cell. The discharging circuit is connected to the interconnection. The discharging circuit discharges electric charge accumulated in the interconnection after a first operation of applying the voltage to the memory cell is ended and before a second operation of applying the voltage to the memory cell next is started. | 03-03-2011 |
20110051499 | METHOD FOR ADJUSTING A RESISTIVE CHANGE ELEMENT USING A REFERENCE - A method of adjusting a resistive change element using a reference is disclosed. The method comprises inspecting a resistive change element to determine a first state; comparing the first state to a reference wherein said reference provides stimulus parameters corresponding to a transition from the first state to a second state; and applying the stimulus parameters to the resistive change element. A resistive change memory cell array is also disclosed. | 03-03-2011 |
20110051500 | NONVOLATILE MEMORY ELEMENT AND NONVOLATILE MEMORY DEVICE - Provided is a nonvolatile memory element which is capable of performing a stable resistance change operation at a low breakdown voltage. | 03-03-2011 |
20110058404 | VARIABLE RESISTIVE MEMORY PUNCHTHROUGH ACCESS METHOD - Variable resistive punchthrough access methods are described. The methods include switching a variable resistive data cell from a high resistance state to a low resistance state by passing a write current through the magnetic tunnel junction data cell in a first direction. The write current is provided by a transistor being electrically coupled to the variable resistive data cell and a source line. The write current passes through the transistor in punchthrough mode. | 03-10-2011 |
20110058405 | Memory Cell With Proportional Current Self-Reference Sensing - Various embodiments of the present invention are generally directed to a method and apparatus for sensing a programmed state of a memory cell, such as a spin-torque transfer random access memory (STRAM) cell. A first read current is applied to the memory cell to generate a first voltage. A second read current is subsequently applied to the memory cell to generate a second voltage, with the second read current being proportional in magnitude to the first read current. A comparison is made between the first and second voltages to determine the programmed state of the memory cell. | 03-10-2011 |
20110058406 | RESISTIVE MEMORY - The present disclosure includes resistive memory devices and systems having resistive memory cells, as well as methods for operating the resistive memory cells. One memory device embodiment includes at least one resistive memory element, a programming circuit, and a sensing circuit. For example, the programming circuit can include a switch configured to select one of N programming currents for programming the at least one resistive memory element, where each of the N programming currents has a unique combination of current direction and magnitude, with N corresponding to the number of resistance states of the at least one memory element. In one or more embodiments, the sensing circuit can be arranged for sensing of the N resistance states. | 03-10-2011 |
20110063887 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE CAPABLE OF TESTING DIODES AND MANUFACTURING METHOD THEREOF - According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array, and a control circuit. The memory cell array includes plural memory cells arranged in rows and columns and each including a diode and resistance-change element. The control circuit tests the diodes for the respective memory cells. The control circuit tests the diode at least at one of times before and after one of a write operation, erase operation and read operation with respect to the memory cell is performed. | 03-17-2011 |
20110063888 | Green Transistor for Resistive Random Access Memory and Method of Operating the Same - A random access memory includes a plurality of memory cells arrayed in bit-lines and word-lines. Each memory cell comprises a green transistor (gFET) including a gate, a source, and a drain; a switching resistor including a first terminal and a second terminal; and a reference resistor including a third terminal and a fourth terminal. The first terminal of the switching resistor and the third terminal is connected to a bit-line, the second terminal of the switching resistor is connected to the first source of the gFET, the fourth terminal of the reference resistor is connected to the second source of the gFET, and the gate of the gFET is connected to a word-line. The method of operating the RRAM includes a write operation and a read operation The write operation comprises steps of: applying a first voltage to the bit-line to perform a large voltage difference across the bit-line and the drain of the gFET, applying a second voltage to the gate of the gFET to turn on the gFET transiently, and a large current pulse flowing through the switching resistor for changing the resistance state. The read operation comprises steps of: applying a third voltage to the bit-line to perform a small voltage difference across the bit-line and the drain of the gFET, applying a second voltage to the word-line to turn on the gFET, and comparing the current through the switching resistor with the current through the reference resistor so as to read the data stored in the memory cell. | 03-17-2011 |
20110063889 | SEMICONDUCTOR STORAGE DEVICE - According to one embodiment, a semiconductor storage device includes memory cells including serially-connected variable-resistance layer and diode. A memory cell array includes the memory cells arranged on a plane including a first and second axes and has a first region lying along an edge of the array and a second region lying opposite to the edge with respect to the first region. A first wiring is continuous along the first axis between both ends of the array, partly lies in the second region, and is connected to the first ends of the memory cells. A second wiring lies along the first axis only in the first region, is connected to the first ends of the memory cells, and is divided between adjacent memory cells. A third wiring is continuous along the second axis between both ends of the array, and connected to the second ends of the memory cells. | 03-17-2011 |
20110063890 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprises: a phase change element (RP) and a memory cell transistor (MN | 03-17-2011 |
20110069528 | ELECTRONIC DEVICE WITH A PROGRAMMABLE RESISTIVE ELEMENT AND A METHOD FOR BLOCKING A DEVICE - One or more embodiments relate to an electronic device comprising a circuitry and a programmable resistive element. The programmable resistive element comprises a first and a second state, wherein the programmable resistive element is configured to allow switching from the second state into the first state in response to a signal comprising at least a predefined level. The circuitry is configured to provide signals up the predefined level, wherein the circuitry is configured to provide a switch signal to the programmable resistive element, wherein the switch signal causes switching from the first into the second state. | 03-24-2011 |
20110069529 | Methods Of Reading And Using Memory Cells - Some embodiments include methods of reading memory cells. The memory cells have a write operation that occurs only if a voltage of sufficient absolute value is applied for a sufficient duration of time; and the reading is conducted with a pulse that is of too short of a time duration to be sufficient for the write operation. In some embodiments, the pulse utilized for the reading may have an absolute value of voltage that is greater than or equal to the voltage utilized for the write operation. In some embodiments, the memory cells may comprise non-ohmic devices; such as memristors and diodes. | 03-24-2011 |
20110069530 | NONVOLATILE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, there is provided a method of manufacturing a nonvolatile memory device. In this method, a first voltage may be applied to a variable resistive element having a resistance value which is electrically rewritable in a high resistance and in a low resistance. In this method, a second voltage may be applied to the variable resistive element in a case where the resistance value of the variable resistive element to which the first voltage has been applied is greater than a resistance value of the low resistance and is not greater than a resistance value of the high resistance. Further, in this method, the applying of the second voltage to the variable resistive element may be repeated until the resistance value of the variable resistive element to which the second voltage has been applied falls within a range of the resistance value of the low resistance. | 03-24-2011 |
20110069531 | NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME - According to one embodiment, a method of manufacturing a nonvolatile semiconductor storage device includes a memory-cell forming step, a first wire forming step, and a second wire forming step. The memory-cell forming step is forming dummy memory cells arranged at a predetermined space apart from an end memory cell located at an end of a group of memory cells set in contact with the same first or second wire among the memory cells, the dummy memory cells having a laminated structure same as that of the memory cells and being set in contact with no second wire. | 03-24-2011 |
20110069532 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array and a control circuit. The memory cell array includes a plurality of first wirings, a plurality of second wirings intersecting the plurality of first wirings, and a plurality of memory cells provided at the intersections of the plurality of first and second wirings and each including a non-ohmic element and a variable resistance element connected in series. The control circuit selects one of the plurality of memory cells, generates an erasing pulse for erasing data from the selected memory cell, and supplies the erasing pulse to the selected memory cell. The control circuit executes data erase by applying a voltage of the erasing pulse to the non-ohmic element in the reverse bias direction. | 03-24-2011 |
20110069533 | RESISTANCE CHANGE MEMORY AND CONTROL METHOD THEREOF - According to one embodiment, a resistance change memory includes a memory cell array in which a plurality of blocks are provided, resistance change storage elements which are provided in blocks and which store data in accordance with a change in resistance state, first and second wirings in the blocks, each of the first and second wirings being connected to each of resistance change storage elements, and a control circuit which controls the state of a selected block targeted for operation and the state of unselected blocks except the selected block among the blocks. The control circuit respectively applies first and second unselect potentials to the first and second wirings in at least one of the unselected blocks during a period in which the selected block is in operation. | 03-24-2011 |
20110075468 | REVERSE SET WITH CURRENT LIMIT FOR NON-VOLATILE STORAGE - A storage system includes a substrate, control circuitry on the substrate, a three dimensional memory array (above the substrate) that includes a plurality of reversible resistance-switching elements, and circuits for limiting the SET current for the reversible resistance-switching elements. The memory cell is SET in a reverse biased fashion. | 03-31-2011 |
20110075469 | RESISTANCE VARIABLE NONVOLATILE MEMORY DEVICE - Each of memory cells (MC) includes one transistor and one resistance variable element. The transistor includes a first main terminal, a second main terminal and a control terminal. The resistance variable element includes a first electrode, a second electrode and a resistance variable layer provided between the first electrode and the second electrode. A first main terminal of one of two adjacent memory cells is connected to a second main terminal of the other memory cell, to form a series path (SP) sequentially connecting main terminals of the plurality of memory cells in series. Each of the memory cells is configured such that the control terminal is a part of a first wire (WL) associated with the memory cell or is connected to the first wire associated with the memory cell, the second electrode is a part of a second wire (SL) associated with the memory cell or is connected to the second wire associated with the memory cell; and the first electrode is a part of a series path (SP) associated with the memory cell or is connected to the series path associated with the memory cell. | 03-31-2011 |
20110080766 | Resistive Memory Device and Manufacturing Method Thereof and Operating Method Thereof - A method of manufacturing resistive memory includes the steps: forming a first implanted stacked structure having a first impurity diffusion layer, a second impurity diffusion layer, and a third impurity diffusion layer in a substrate; etching at least the first implanted stacked structure to form a plurality of second implanted stacked structures, wherein the first impurity diffusion layers are first signal lines; forming a plurality of first insulating layers between the second implanted stacked structures; etching the second implanted stacked structures to form a plurality of third implanted stacked structures, wherein the first signal lines are not etched; forming a plurality of second insulating layers between the third implanted stacked structures; forming a plurality of memory material layers electrically coupled to the third impurity diffusion layers; and forming a plurality of second signal lines perpendicular to the first signal lines and electrically coupled to the memory material layers. | 04-07-2011 |
20110080767 | Integrated circuit including four layers of vertically stackedembedded re-writeable non-volatile two-terminal memory - A multi-layer non-volatile memory integrally formed on top of a substrate including active circuitry is disclosed. Each layer of memory includes memory cells (e.g., a two-terminal memory cell) having a multi-resistive state material layer that changes its resistive state between a low resistive state and a high resistive state upon application of a write voltage across the memory cell. Data stored in the memory cells can be non-destructively determined by applying a read voltage across the memory cells. Data storage capacity can be tailored to a specific application by increasing or decreasing the number of memory layers that are integrally fabricated on top of the substrate (e.g., more than four layers or less than four layers). The memory cells can include a non-ohmic device for allowing access to the memory cell only during read and write operations. Each memory layer can comprise a cross point array. | 04-07-2011 |
20110080768 | WRITE CURRENT COMPENSATION USING WORD LINE BOOSTING CIRCUITRY - Apparatus and method for write current compensation in a non-volatile memory cell, such as but not limited to spin-torque transfer random access memory (STRAM) or resistive random access memory (RRAM). In accordance with some embodiments, a non-volatile memory cell has a resistive sense element (RSE) coupled to a switching device, the RSE having a hard programming direction and an easy programming direction opposite the hard programming direction. A voltage boosting circuit includes a capacitor which adds charge to a nominal non-zero voltage supplied by a voltage source to a node to generate a temporarily boosted voltage. The boosted voltage is applied to the switching device when the RSE is programmed in the hard programming direction. | 04-07-2011 |
20110080769 | Spatial Correlation of Reference Cells in Resistive Memory Array - The present disclosure relates to methods of selectively placing a reference column or reference row in a memory array. The method includes measuring a resistance state resistance value for a plurality of variable resistive memory cells within a memory array and mapping a location of each measured variable resistive memory cell to form a map of the resistance state resistance values for a plurality of variable resistive memory cells within a memory array. Then a column or row is selected to be a reference column or reference row based on the map of the resistance state resistance value for a plurality of variable resistive memory cells within a memory array, to minimize read operation errors, and forming a variable resistive memory cell memory array. | 04-07-2011 |
20110080770 | METHOD OF PROGRAMMING VARIABLE RESISTANCE ELEMENT AND NONVOLATILE STORAGE DEVICE - Applying a writing voltage pulse having a first polarity to a metal oxide layer ( | 04-07-2011 |
20110085370 | SOFT FORMING REVERSIBLE RESISTIVITY-SWITCHING ELEMENT FOR BIPOLAR SWITCHING - A method and system for forming reversible resistivity-switching elements is described herein. Forming refers to reducing the resistance of the reversible resistivity-switching element, and is generally understood to refer to reducing the resistance for the first time. Prior to forming the reversible resistivity-switching element it may be in a high-resistance state. A first voltage is applied to “partially form” the reversible resistivity-switching element. The first voltage has a first polarity. Partially forming the reversible resistivity-switching element lowers the resistance of the reversible resistivity-switching element. A second voltage that has the opposite polarity as the first is then applied to the reversible resistivity-switching element. Application of the second voltage may further lower the resistance of the reversible resistivity-switching element. Therefore, the second voltage could be considered as completing the forming of the reversible resistivity-switching element. | 04-14-2011 |
20110096587 | DYNAMIC SENSE CURRENT SUPPLY CIRCUIT AND ASSOCIATED METHOD FOR READING AND CHARACTERIZING A RESISTIVE MEMORY ARRAY - A dynamic sense current supply circuit and an associated method for rapidly characterizing a resistive memory array is disclosed. In one embodiment, the disclosed circuit comprises a first and second dynamically programmable current mirror sub-circuit. Responsive to a bank of control signals, each dynamically programmable current mirror sub-circuit provides a dynamically adjustable current scaling factor. These scaling factors are used to scale a supplied reference current to generate a plurality of sense currents which can be used within a plurality of read operations on a resistive memory array. A digital circuit is also provided to sense and store the result of each read operation. | 04-28-2011 |
20110096588 | NON-VOLATILE MEMORY ARRAY ARCHITECTURE INCORPORATING 1T-1R NEAR 4F2 MEMORY CELL - A nonvolatile memory array architecture includes a resistive element between each common source/drain (intermediate) node and data line (or bit line), in an otherwise virtual ground-like memory array having serially-connected transistors coupled to the same word line. However, every N+1 transistors the corresponding resistive element is omitted (or generally kept in a low resistance state) to form transistor strings. This achieves an array density of 4F | 04-28-2011 |
20110096589 | NANOWIRE-BASED MEMRISTOR DEVICES - Embodiments of the present invention are directed to memristor devices that provide nonvolatile memristive switching. In one embodiment, a memristor device includes a first electrode, a second electrode, and a nanowire disposed between the first electrode and the second electrode. The nanowire is configured with an inner region surrounded by an outer layer. The memristor device may also include a mobile dopant confined to the inner region by repulsive electrostatic forces between the outer layer and the mobile dopant. The resistance of the nanowire is determined by the distribution of the mobile dopant in the inner region. | 04-28-2011 |
20110096590 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a cell array having plural memory cells arranged in matrix, each memory cell including a variable resistor having a resistance reversibly variable to store data corresponding to the resistance of the variable resistor; a selection circuit operative to select a memory cell from the cell array; and a write circuit operative to execute certain voltage or current supply to the memory cell selected by the selection circuit to vary the resistance of a variable resistor in the selected memory cell to erase or write data. The write circuit terminates the voltage or current supply to the selected memory cell in accordance with resistance variation situation of the variable resistor in the selected memory cell when current flowing in the selected memory cell reaches a certain level appeared after the data erase or write. | 04-28-2011 |
20110103128 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - Nonvolatile semiconductor memory device of an embodiment includes: a memory cell array including a plurality of first and second lines intersecting each other and plural memory cells provided at intersections of the first and second lines and having data written and erased upon application of voltages of the same polarity; and a writing circuit configured to select first and second lines and supply a set or reset pulse to the memory cell through the selected first and second lines. In an erase operation, the writing circuit repeatedly supplies the reset pulse to a selected memory cell until data is erased, by increasing or decreasing voltage level and voltage application time of the reset pulse within a reset region. The reset region, or an aggregate of combinations of voltage level and voltage application time of the reset pulse, is a region where voltage level and voltage application time are negatively correlated. | 05-05-2011 |
20110103129 | VARIABLE-RESISTANCE MATERIAL MEMORIES, PROCESSES OF FORMING SAME, AND METHODS OF USING SAME - A variable-resistance material memory array includes a series of variable-resistance material memory cells. The series of variable-resistance material memory cells can be arranged in parallel with a corresponding series of control gates. A select gate can also be disposed in series with the variable-resistance material memory cells. Writing/reading/erasing to a given variable-resistance material memory cell can include turning off the corresponding control gate, while turning on all other control gates. Various devices can include such a variable-resistance material memory array. | 05-05-2011 |
20110103130 | RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device including: a cell array having a resistance change type of memory cells disposed at the cross-points of word lines and bit lines, the resistance value of the memory cell being reversibly settable; a word line driver circuit configured to apply a selecting drive voltage to one selected in the word lines; and a bit line driver circuit configured to drive multiple bit lines in such a manner that a set mode and a reset mode are set simultaneously for multiple memory cells selected by the selected word line, the set mode being for changing a selected memory cell from a first resistance state into a second resistance state while the reset mode is for changing a selected memory cell from the second resistance state into the first resistance state. | 05-05-2011 |
20110103131 | NONVOLATILE MEMORY ELEMENT AND NONVOLATILE MEMORY DEVICE - Provided is a nonvolatile memory element which has a small variation in operation and allow stable operation. The nonvolatile memory element includes: a first electrode ( | 05-05-2011 |
20110103132 | NONVOLATILE MEMORY ELEMENT AND SEMICONDUCTOR MEMORY DEVICE INCLUDING NONVOLATILE MEMORY ELEMENT - Provided are a nonvolatile memory element which is capable of effectively preventing an event that when a failure occurs in a certain nonvolatile memory element, data cannot be written to and read from another nonvolatile memory element belonging to the same column or row as that to which the nonvolatile memory element in a failed state belongs, and a semiconductor memory device including the nonvolatile memory element. | 05-05-2011 |
20110103133 | MEMORY CELL ARRAY, NONVOLATILE STORAGE DEVICE, MEMORY CELL, AND METHOD OF MANUFACTURING MEMORY CELL ARRAY - A method of manufacturing a memory cell array in which first conductive layers ( | 05-05-2011 |
20110103134 | RESISTANCE RANDOM ACCESS MEMORY HAVING COMMON SOURCE LINE - A method writes data to a resistance random access memory (RRAM) memory cell through first and second write paths, and includes; applying a positive source voltage to a selected source line, applying a word line drive voltage to a selected word line, and applying a voltage at least twice the level of the positive source voltage to a selected bit line via the first write path when writing data having the first state in the memory cell, and applying a ground voltage to the selected bit line via the second write path when writing data having the second state in the memory cell. | 05-05-2011 |
20110103135 | NON-VOLATILE MEMORY DEVICE AND METHOD FOR WRITING DATA THERETO - The present invention provides a method for writing data to a non-volatile memory device having first wirings and second wirings intersecting one another and memory cells arranged at each intersection therebetween, each of the memory cells having a variable resistive element and a rectifying element connected in series. According to the method, the second wirings are charged to a certain voltage not less than a rectifying-element threshold value, prior to a rise in a selected first wiring. Then, a selected first wiring is charged to a voltage required for writing or erasing, after which a selected second wiring is discharged. | 05-05-2011 |
20110110140 | REFERENCE CURRENT GENERATOR FOR RESISTANCE TYPE MEMORY AND METHOD THEREOF - A reference current generator for a resistance type memory and a method thereof is disclosed. The reference current generator comprises N parallel circuit sets. Each of the N parallel circuit sets is formed with at least one first reference element and second reference elements connected in parallel. The number of the first reference elements plus the number of the second reference elements is N. The resistance value of first reference elements (a first resistance value) is not equal to the resistance value of the second reference elements (a second resistance value). An equivalent resistance provided with a equivalent resistance value between the first and second resistance value is formed by connecting the N parallel circuit sets in series between an input terminal and output terminal. A reference current is outputted from the output terminal by applying an operation voltage to the input terminal. | 05-12-2011 |
20110110141 | RESISTIVE MEMORY - A memory device includes an array of memory structures disposed in rows and columns and constructed over a substrate, each memory structure comprising a first signal electrode, a second signal electrode, and a resistive layer coupled to the first signal electrode and the second signal electrode; a plurality of word lines connected to the first signal electrodes of a row of memory cells; and a plurality of bit lines connected to the second signal electrodes of a column of memory cells. | 05-12-2011 |
20110110142 | Memory device and method of reading memory device - A memory device includes: a memory unit in which an electric charge discharging rate between two electrodes is different in accordance with logic of stored information; a sense amplifier that detects the logic of the information by comparing a discharge electric potential of a wiring to which one electrode of the memory unit is connected with a reference electric potential; and a replica circuit that has a replica unit emulating the memory unit and controls a sense timing of the sense amplifier in accordance with a discharge rate of the replica unit. | 05-12-2011 |
20110110143 | METHOD OF PROGRAMMING NONVOLATILE MEMORY ELEMENT - Provided is a programming method for improving the retention characteristics of information in a variable resistance nonvolatile memory element. The method includes: a first writing process of applying a first voltage V | 05-12-2011 |
20110110144 | WRITING METHOD FOR VARIABLE RESISTANCE NONVOLATILE MEMORY ELEMENT, AND VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE - A writing method optimum for a variable resistance element which can maximize an operation window of the variable resistance element is provided. The writing method is performed for a variable resistance element that reversibly changes between a high resistance state and a low resistance state depending on a polarity of an applied voltage pulse. The writing method includes a preparation step (S | 05-12-2011 |
20110116300 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device according to an embodiment comprises a memory cell array including plural mutually crossing first and second lines and memory cells arranged at intersections of the first and second lines, each memory cell containing a variable resistance element and a rectifier element connected in series; and a data write/erase circuit operative to apply a voltage required for data write/erase to the memory cell via the first and second lines. The data write/erase circuit includes a first current limit circuit operative to limit the current flowing in the cathode-side line provided on the cathode side of the rectifier element, of the first and second lines, at the time of data write/erase. | 05-19-2011 |
20110116301 | STATE MACHINE SENSING OF MEMORY CELLS - The present disclosure includes methods, devices, modules, and systems for sensing memory cells using a state machine. One method embodiment includes generating a first sensing reference according to a first output of a state machine. The method includes bifurcating a range of possible programmed levels to which a memory cell can be programmed with the first sensing reference. The method also includes generating a second sensing reference according to a second output of the state machine. The method further includes determining a programmed level of the memory cell with the second generated sensing reference. | 05-19-2011 |
20110116302 | Asymmetric Write Current Compensation Using Gate Overdrive for Resistive Sense Memory Cells - Apparatus and associated method for asymmetric write current compensation for resistive sense memory (RSM) cells, such as but not limited to spin-torque transfer random access memory (STRAM) or resistive random access memory (RRAM) cells. In accordance with some embodiments, an RSM cell includes an RSM element coupled to a switching device. The switching device has a plurality of terminals. A control circuit compensates for asymmetric write characteristics of the RSM cell by limiting a range of voltage differentials across the terminals so as to be equal to or less than a magnitude of a source voltage applied to the switching device, thereby providing bi-directional write currents of substantially equal magnitude through the RSM element. | 05-19-2011 |
20110122675 | Programmable Resistance Memory - A nonvolatile memory includes write circuitry that writes to a selected memory element and, in parallel, to a data latch. The memory is configured to compare the current memory address to the previous memory address and to enable a read operation from the data latch rather than a selected memory element if the current and previous memory addresses are the same. | 05-26-2011 |
20110122676 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes: word lines; bit lines; an insulating film; an interlayer insulating film; and a resistance varying material. The word lines, the bit lines and the insulating film configure a field-effect transistor at each of the intersections of the word lines and the bit lines. The field-effect transistor has one of the word lines as a control electrode and one of the bit lines as a channel region. The field-effect transistor and the resistance varying material configure a memory cell having the field-effect transistor and the resistance varying material connected in parallel. Each of the bit lines includes a first surface opposing the word lines, and a second surface on an opposite side to the first surface. The resistance varying material is disposed in contact with the second surface and has a portion thereof in contact with the interlayer insulating film. | 05-26-2011 |
20110122677 | SEMICONDUCTOR MEMORY DEVICE - First main bit lines correspond to at least one first memory cell. Second main bit lines correspond to at least one second memory cell. At least one sense amplifier outputs read data according to a difference between a voltage of any one of the first main bit lines and a voltage of any one of the second main bit lines. A voltage supply switching section supplies a predetermined reference voltage to one of the first main bit lines corresponding to one of the second main bit lines in which a current according to a threshold voltage of the at least one second memory cell is generated. A resistance switching section forms electrical connection between a ground node and the one of the second main bit lines in which the current according to the threshold voltage of the at least one second memory cell is generated with a predetermined resistance value. | 05-26-2011 |
20110122678 | Anti-Parallel Diode Structure and Method of Fabrication - An anti-parallel diode structure and method of fabrication is presently disclosed. In some embodiments, an anti-parallel diode structure has a semiconductor region comprising a first insulator layer disposed between a first semiconductor layer and a second semiconductor layer. The semiconductor region can be bound on a first side by a first metal material and bound on a second side by a second metal material so that current below a predetermined value is prevented from passing through the semiconductor region and current above the predetermined value passes through the semiconductor region. | 05-26-2011 |
20110122679 | Resistive Sense Memory Calibration for Self-Reference Read Method - Resistive memory calibration for self-reference read methods are described. One method of self-reference reading a resistive memory unit includes setting a plurality of resistive memory units to a first resistive data state. The resistive memory units forms a memory array. Reading a sensed resistive data state for each resistive memory unit by applying a first read current and a second read current through each resistive memory unit and then comparing voltages formed by the first read current and the second read current to determine the sensed resistive data state for each resistive memory unit. Then the method includes adjusting the first or the second read current, read voltages, or storage device capacitance for each resistive memory unit where the sensed resistive data state was not the same as the first resistive data state until the sensed resistive data state is the same as the first resistive data state. | 05-26-2011 |
20110122680 | VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE - A nonvolatile resistance variable memory device ( | 05-26-2011 |
20110128770 | STORED MULTI-BIT DATA CHARACTERIZED BY MULTIPLE-DIMENSIONAL MEMORY STATES - Subject matter disclosed herein relates to enhancing data storage density of a memory device. | 06-02-2011 |
20110128771 | Resistance Based Memory Circuit With Digital Sensing - A method of sensing a data value stored at a resistance based memory is disclosed. The method includes receiving a data signal from a data cell. The data cell includes a resistance based memory element. A reference signal is received from a reference circuit. The reference circuit includes a resistance based memory element. The data signal is converted to a data output signal having a first frequency. The reference signal is converted to a reference output signal having a second frequency. A first output signal is generated when the first frequency exceeds the second frequency. A second output signal is generated when the second frequency exceeds the first frequency. | 06-02-2011 |
20110128772 | Nonvolatile memory cells and nonvolatile memory devices including the same - A nonvolatile memory cell may include a bidirectional switch having a first threshold voltage when a forward current is applied to the bidirectional switch and a second threshold voltage when a reverse current is applied to the bidirectional switch; and a variable resistor connected to the bidirectional switch in series. A state of resistance of the variable resistor may be controlled according to voltage applied to the variable resistor. A sum of a magnitude of the first threshold voltage and a magnitude of the second threshold voltage may be greater than a write voltage that is used to perform a write operation on the variable resistor. | 06-02-2011 |
20110128773 | NONVOLATILE VARIABLE RESISTANCE MEMORY ELEMENT WRITING METHOD, AND NONVOLATILE VARIABLE RESISTANCE MEMORY DEVICE - To provide a variable resistance element writing method that, even when a variable resistance element has a possibility of becoming a half LR state, can ensure a maximum resistance change window by correcting the variable resistance element to a normal low resistance state. In a method of writing data to a variable resistance element ( | 06-02-2011 |
20110128774 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a memory cell array including first and second mutually crossing lines and electrically erasable programmable memory cells arranged at intersections of the first and second lines, each memory cell containing a variable resistor operative to nonvolatilely store the resistance thereof as data and a first non-ohmic element operative to switch the variable resistor; and a clamp voltage generator circuit operative to generate a clamp voltage required for access to the memory cell and applied to the first and second lines. The clamp voltage generator circuit has a temperature compensation function of compensating for the temperature characteristic of the first non-ohmic element. | 06-02-2011 |
20110128775 | NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND DATA WRITING METHOD THEREFOR - A nonvolatile semiconductor storage device comprises: a first wire and a second wire intersecting each other; a memory cell which is disposed at each intersection of the first wire and the second wire and electrically rewritable and in which a variable resistor for memorizing a resistance value as data in a nonvolatile manner and a rectifying device are connected in series; and a control circuit which applies a voltage necessary for writing of data to the first and second wires. The control circuit precharges a non-selected second wire up to a standby voltage larger than a reference voltage prior to a set operation for programming only a variable resistor connected to selected first and second wires by supplying the reference voltage to a non-selected first wire and the selected second wire, applying a program voltage necessary for programming of the selected variable resistor based on the reference voltage to the selected first wire and applying a control voltage which prevents the rectifying device from turning ON based on the program voltage to the non-selected second wire. | 06-02-2011 |
20110128776 | NONVOLATILE MEMORY DEVICE AND METHOD OF WRITING DATA TO NONVOLATILE MEMORY DEVICE - A resistance variable layer has a characteristic in which the resistance variable layer changes to a second resistance state (RL) in such a manner that its resistance value stops decreasing when an interelectrode voltage reaches a first voltage (V | 06-02-2011 |
20110134681 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprises a plurality of memory layers arranged in multi layer, each memory layer including a cell array, the cell array containing a plurality of first parallel lines, a plurality of second parallel lines arranged crossing the first lines, and a plurality of memory cells connected at intersections of the first lines and the second lines; a pulse generator operative to generate pulses required for data access to the memory cell; and a control means operative to control the pulse generator such that the pulse output from the pulse generator has energy in accordance with the memory layer to which the access target memory cell belongs. | 06-09-2011 |
20110134682 | VARIABLE WRITE AND READ METHODS FOR RESISTIVE RANDOM ACCESS MEMORY - Variable write and read methods for resistance random access memory (RRAM) are disclosed. The methods include initializing a write sequence and verifying the resistance state of the RRAM cell. If a write pulse is needed, then two or more write pulses are applied through the RRAM cell to write the desired data state to the RRAM cell. Each subsequent write pulse has substantially the same or greater write pulse duration. Subsequent write pulses are applied to the RRAM cell until the RRAM cell is in the desired data state or until a predetermined number of write pulses have been applied to the RRAM cell. A read method is also disclosed where subsequent read pulses are applied through the RRAM cell until the read is successful or until a predetermined number of read pulses have been applied to the RRAM cell. | 06-09-2011 |
20110141793 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, semiconductor memory device includes: semiconductor substrate; parallel first lines stacked on substrate; parallel second lines intersecting first lines; memory cell array including memory cells at intersections of first and second lines and each including variable resistance element and selecting element series-connected together; first control circuit provided in second region of substrate adjoining first region immediately under array; second control circuit provided in first region of substrate; and dummy lines formed in same layer as second lines, such that they intersect first lines in region above first control circuit. First control circuit applies first voltage to selected first line. Second control circuit applies second voltage lower than first voltage to selected second line, and to dummy lines, third voltage by which potential difference applied to memory cells at intersections of selected first line and dummy lines becomes lower than on-voltage of selecting element. | 06-16-2011 |
20110141794 | SEMICONDUCTOR MEMORY DEVICE AND INSPECTING METHOD OF THE SAME - According to one embodiment, a semiconductor memory device includes a memory cell array includes memory cells, lines provided to correspond to the memory cells, a first decoder configured to select a first line as an inspection target from the lines, a second decoder configured to select a second line for generating a reference voltage from the lines, a driver configured to charge the first and second lines, a discharging circuit configured to simultaneously discharge the first and second lines, and a sense amplifier configured to compare a voltage of the first line with a voltage of the second line to detect a defect of the first line while the first line is discharged. | 06-16-2011 |
20110149634 | Non-volatile memory device ion barrier - An ion barrier layer made from a dielectric material in contact with an electronically insulating layer is operative to prevent mobile ions transported into the electronically insulating layer from passing through the ion barrier layer and into adjacent layers during data operations on a non-volatile memory cell. A conductive oxide layer in contact with the electronically insulating layer is the source of the mobile ions. A programming data operation is operative to transport a portion of the mobile ions into the electronically insulating layer and an erase data operation is operative to transport the mobile ions back into the conductive oxide layer. When the portion is positioned in the electronically insulating layer the memory cell stores data as a programmed conductivity profile and when a substantial majority of the mobile ions are positioned in the conductive oxide layer the memory cell stores data as an erased conductivity profile. | 06-23-2011 |
20110149635 | STORAGE DEVICE AND INFORMATION RERECORDING METHOD - A storage device capable of decreasing the number of voltages necessitating control and decreasing peripheral circuit size is provided. A first pulse voltage (VBLR) is supplied from a first power source through a bit line BLR to an electrode of a variable resistive element. A second pulse voltage (VWL) for selecting a cell is supplied from a second power source through a word line WL to a control terminal of a transistor. A third pulse voltage (VBLT) is supplied from a third power source though a bit line BLT to a second input/output terminal of the transistor. At the time of rewriting information, the voltage value (VBLT) of the third power source is adjusted by an adjustment circuit. Thereby, a cell voltage and a cell current are changed (decreased or increased). | 06-23-2011 |
20110149636 | Ion barrier cap - An ion barrier layer made from a dielectric material in contact with an electronically insulating layer is operative to prevent mobile ions transported into the electronically insulating layer from passing through the ion barrier layer and into adjacent layers during data operations on a non-volatile memory cell. A conductive oxide layer in contact with the electronically insulating layer is the source of the mobile ions. A programming data operation is operative to transport a portion of the mobile ions into the electronically insulating layer and an erase data operation is operative to transport the mobile ions back into the conductive oxide layer. When the portion is positioned in the electronically insulating layer the memory cell stores data as a programmed conductivity profile and when a substantial majority of the mobile ions are positioned in the conductive oxide layer the memory cell stores data as an erased conductivity profile. | 06-23-2011 |
20110149637 | METHOD AND APPARATUS PROVIDING HIGH DENSITY CHALCOGENIDE-BASED DATA STORAGE - A data storage device and methods for storing and reading data are provided. The data storage device includes a data storage medium and second device. The data storage medium has an insulating layer, a first electrode layer over the insulating layer and at least one layer of resistance variable material over the first electrode layer. The second device includes a substrate and at least one conductive point configured to electrically contact the data storage medium. | 06-23-2011 |
20110149638 | NONVOLATILE MEMORY DEVICE AND INFORMATION RECORDING METHOD - According to one embodiment, a nonvolatile memory device includes a memory layer and a driver section. The memory layer has a first state having a first resistance under application of a first voltage, a second state having a second resistance higher than the first resistance under application of a second voltage higher than the first voltage, and a third state having a third resistance between the first resistance and the second resistance under application of a third voltage between the first voltage and the second voltage. The driver section is configured to apply at least one of the first voltage, the second voltage and the third voltage to the memory layer to record information in the memory layer. | 06-23-2011 |
20110149639 | Non-Volatile Memory Cell with Multiple Resistive Sense Elements Sharing a Common Switching Device - A non-volatile memory cell array and associated method of use. In accordance with various embodiments, the array includes a plurality of programmable resistive sense elements (RSEs) coupled to a shared switching device. The switching device has a common source region and multiple drain regions, each drain region connected to an associated RSE from said plurality of RSEs. | 06-23-2011 |
20110157957 | NONVOLATILE SEMICONDUCTOR INTEGRATED CIRCUIT FOR CONTROLLING SENSING VOLTAGE - A nonvolatile semiconductor integrated circuit includes a memory cell array configured to include each of memory cells having a variable resistor; a current sensing unit configured to convert a current which depends on the variable resistor of a corresponding memory cell, into a sensing voltage; and a voltage control unit configured to receive the sensing voltage for a predetermined time in response to a sensing control signal, regulate the received sensing voltage, and provide a sensing output voltage. | 06-30-2011 |
20110157958 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME - According to one embodiment, a semiconductor memory device comprises a memory cell array and a control circuit. The control circuit applies a certain potential difference to a selected one of the memory cells. The control circuit comprises a current mirror circuit, a reference current generating circuit, and a detecting circuit. The current mirror circuit produces a mirror current having a current value identical to that of a cell current flowing in the selected one of the memory cells. The reference current generating circuit produces a reference current, the reference current having a current value that differs from the current value of the mirror current by a certain current value. The detecting circuit detects transition of a resistance state of the selected one of the memory cells based on a magnitude relation of the mirror current and the reference current. | 06-30-2011 |
20110157959 | SEMICONDUCTOR STORAGE DEVICE, MEMORY CELL ARRAY, AND A FABRICATION METHOD AND DRIVE METHOD OF A SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device is provided for solving the problem of the inability to simultaneously realize high reliability and decreased cell area. A selection electrode ( | 06-30-2011 |
20110157960 | Nonvolatile Memory Devices and Related Methods and Systems - Nonvolatile memory devices are provided including a memory cell array having a plurality of stacked memory layers and a rectifier configured to select memory cells constituting each memory layer sharing a word line or a bit line with another adjacent memory layer. The nonvolatile memory devices including a word line driving unit configured to drive a first word line, connected to a first memory cell of a first memory layer to be read, at a first voltage level and drive a second word line, connected to a second memory cell of a second memory layer sharing a first bit line connected to the first memory cell, at a second voltage level. The nonvolatile memory device further includes a bit line biasing unit configured to bias the first bit line at the second voltage level and bias a second bit line, connected to a third memory cell of a third memory layer sharing the first word line, at the first voltage level. Related methods and systems are also provided herein. | 06-30-2011 |
20110164447 | CURRENT STEERING ELEMENT, STORAGE ELEMENT, STORAGE DEVICE, AND METHOD FOR MANUFACTURING CURRENT STEERING ELEMENT - A current steering element which can prevent occurrence of write disturb even when electric pulses having different polarities are applied and can cause large current to flow through a variable resistance element, and with which data can be written without problem. In a storage element ( | 07-07-2011 |
20110170331 | SEMICONDUCTOR DEVICES AND METHODS OF DRIVING THE SAME - Example embodiments disclose a semiconductor device using resistive memory material layers and a method of driving the semiconductor device. The semiconductor device includes a plurality of memory cells. At least one memory cell includes a uni-polar variable resistor and a bi-polar variable resistor connected in series and configured to switch between low resistance states and high resistance states, respectively, according to an applied voltage. | 07-14-2011 |
20110170332 | Methods of Driving Nonvolatile Memory Devices that Utilize Read/Write Merge Circuits - An integrated circuit memory device includes an array of nonvolatile memory cells (e.g., variable resistance cells) having a first plurality of lines electrically coupled to memory cells therein. A read/write control circuit is provided. The read/write control circuit includes a read/write merge circuit and a column selection circuit. The read/write control circuit, which is configured to drive a selected one of the first plurality of lines with unequal write and read voltages during respective write and read operations, includes a compensating unit. This compensating unit is configured to provide a read compensation current to the selected one of the first plurality of lines circuit during the read operation. | 07-14-2011 |
20110170333 | DATA READ/WRITE DEVICE - A data read/write device according to an example of the present invention includes a recording layer, and means for applying a voltage to the recording layer, generating a resistance change in the recording layer, and recording data. The recording layer is composed of a composite compound having at least two types of cation elements, at least one type of the cation element is a transition element having a “d” orbit in which electrons have been incompletely filled, and the shortest distance between the adjacent cation elements is 0.32 nm or less. | 07-14-2011 |
20110170334 | NONVOLATILE MEMORY, MEMORY SYSTEM, AND METHOD OF DRIVING - Provided are a nonvolatile memory and related method of programming same. The nonvolatile memory includes a memory cell array with a plurality of nonvolatile memory cells and a write circuit. The write circuit is configured to write first logic state data to a first group of memory cells during a first program operation using an internally generated step-up voltage, and second logic state data to a second group of memory cells during a second program operation using an externally supplied step-up voltage. | 07-14-2011 |
20110170335 | Vertical Non-Volatile Switch with Punchthrough Access and Method of Fabrication Therefor - A semiconductor device for accessing non-volatile memory cell is provided. In some embodiments, the semiconductor device has a vertical stack of semiconductor layers including a source, a drain, and a well. An application of a drain-source bias voltage to the semiconductor device generates a punchthrough mechanism across the well to initiate a flow of current between the source and the drain. | 07-14-2011 |
20110176350 | RESISTANCE-BASED MEMORY WITH REDUCED VOLTAGE INPUT/OUTPUT DEVICE - A resistance-based memory with a reduced voltage I/O device is disclosed. In a particular embodiment, a circuit includes a data path including a first resistive memory cell and a first load transistor. A reference path includes a second resistive memory cell and a second load transistor. The first load transistor and the second load transistor are input and output (I/O) transistors adapted to operate at a load supply voltage similar to a core supply voltage of a core transistor within the circuit. | 07-21-2011 |
20110176351 | NONVOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, a nonvolatile memory device includes a memory layer and a control unit. The memory layer includes a first conductive layer, a second conductive layer and a resistance change layer. The resistance change layer is provided between the first and second conductive layers and transits between a high resistance state and a low resistance state by at least one of an applied electric field and an applied current. The control unit is electrically connected to the first and second conductive layers and configured to apply a first signal with a first polarity between the first and second conductive layers prior to applying a second signal with a second polarity different from the first polarity between the first and second conductive layers to cause the resistance change layer to transit from the high resistance state to the low resistance state. | 07-21-2011 |
20110176352 | NONVOLATILE MEMORY CELL OPERATING BY INCREASING ORDER IN POLYCRYSTALLINE SEMICONDUCTOR MATERIAL - A nonvolatile memory cell is described, the memory cell comprising a semiconductor diode. The semiconductor material making up the diode is formed with significant defect density, and allows very low current flow at a typical read voltage. Application of a programming voltage permanently changes the nature of the semiconductor material, resulting in an improved diode. The programmed diode allows much higher current flow, in some embodiments one, two or three orders of magnitude higher, at the same read voltage. The difference in current allows a programmed memory cell to be distinguished from an unprogrammed memory cell. Fabrication techniques to generate an advantageous unprogrammed defect density are described. The memory cell of the present invention can be formed in a monolithic three dimensional memory array, having multiple stacked memory levels formed above a single substrate. | 07-21-2011 |
20110176353 | Memristive Device Having a Porous Dopant Diffusion Element - A memristive device ( | 07-21-2011 |
20110182103 | GCIB-TREATED RESISTIVE DEVICE - The present disclosure includes GCIB-treated resistive devices, devices utilizing GCIB-treated resistive devices (e.g., as switches, memory cells), and methods for forming the GCIB-treated resistive devices. One method of forming a GCIB-treated resistive device includes forming a lower electrode, and forming an oxide material on the lower electrode. The oxide material is exposed to a gas cluster ion beam (GCIB) until a change in resistance of a first portion of the oxide material relative to the resistance of a second portion of the oxide material. An upper electrode is formed on the first portion. | 07-28-2011 |
20110182104 | METHOD OF IMPLEMENTING MEMRISTOR-BASED MULTILEVEL MEMORY USING REFERENCE RESISTOR ARRAY - The present invention relates to a memristor, and more particularly, to a method of implementing a memristor-based multilevel memory using a reference resistor array and a write-in circuit and a read-out/restoration circuit for the memristor-based multilevel memory, in which a memristor can be used as a multilevel memory. In the present invention, a reference resistance value is written in a selected memristor of a memristor array by applying repeatedly the current pulses of which widths are proportional to the difference between the resistances of the selected memristor and the selected node of the reference resistor array. | 07-28-2011 |
20110182105 | MEMORY SYSTEM WITH SECTIONAL DATA LINES - A storage system includes a three-dimensional memory array that has multiple layers of non-volatile storage elements grouped into blocks. The blocks are grouped into bays. The storage system includes array lines of a first type in communication with storage elements, array lines of a second type in communication with storage elements, and sense amplifiers. Each block is geographically associated with two sense amplifiers and all blocks of a particular bay share a group of sense amplifiers associated with the blocks of the particular bay. The system includes multiple sets of local data lines in one or more routing metal layers below the three-dimensional memory array and multiple sets of global data lines in one or more top metal layers above the three-dimensional memory array. Each set of one or more blocks include one set of the local data lines. Each bay includes one set of global data lines that connect to the group of sense amplifiers associated with the blocks of the respective bay. Each block includes a subset of first selection circuits for selectively coupling a subset of array lines of the first type to respective local data lines. Each block includes a subset of second selection circuits for selectively coupling a subset of the respective local data lines to global data lines associated with a respective bay. | 07-28-2011 |
20110182106 | Current Cancellation for Non-Volatile Memory - A method and apparatus for reading data from a non-volatile memory cell. In some embodiments, a cross-point array of non-volatile memory cells is arranged into rows and columns that are each controlled by a line driver. A read circuit is provided that is capable of reading a logical state of a predetermined memory cell by differentiating a non-integrated first reference value from a non-integrated second reference value. Further, each reference value is measured immediately after configuring the column corresponding to the predetermined memory cell to produce a first and second amount of current. | 07-28-2011 |
20110182107 | MEMRISTIVE DEVICE - A memristive routing device ( | 07-28-2011 |
20110182108 | Memristive Device and Methods of Making and Using the Same - A memristive device is disclosed herein. The device includes a first electrode, a second electrode, and an active region disposed between the first and second electrodes. At least two mobile species are present in the active region. Each of the at least two mobile species is configured to define a separate state variable of the memristive device. | 07-28-2011 |
20110182109 | VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE AND PROGRAMMING METHOD FOR SAME - A variable resistance nonvolatile memory device ( | 07-28-2011 |
20110188289 | Access signal adjustment circuits and methods for memory cells in a cross-point array - Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to generate access signals to facilitate memory operations in scaled arrays of memory elements, such as memory implemented in third dimensional memory technology formed BEOL directly on top of a FEOL substrate that includes data access circuitry. In at least some embodiments, a non-volatile memory device can include a cross-point array having resistive memory elements disposed among word lines and subsets of bit lines, and an access signal generator. The access signal generator can be configured to modify a magnitude of a signal to generate a modified magnitude for the signal to access a resistive memory element associated with a word line and a subset of bit lines. The modified magnitude can be a function of the position of the resistive memory element in the cross-point array. | 08-04-2011 |
20110188290 | Semiconductor devices including variable resistance materials and methods of operating the same - Semiconductor devices including variable resistance materials and methods of operating the semiconductor devices. The semiconductor devices use variable resistance materials with resistances that vary according to applied voltages as channel layers. | 08-04-2011 |
20110188291 | Preservation circuit and methods to maintain values representing data in one or more layers of memory - Circuitry and methods for restoring data in memory are disclosed. The memory may include at least one layer of a non-volatile two-terminal cross-point array that includes a plurality of two-terminal memory elements that store data as a plurality of conductivity profiles and retain stored data in the absence of power. Over a period of time, logic values indicative of the stored data may drift such that if the logic values are not restored, the stored data may become corrupted. At least a portion of each memory may have data rewritten or restored by circuitry electrically coupled with the memory. Other circuitry may be used to determine a schedule for performing restore operations to the memory and the restore operations may be triggered by an internal or an external signal or event. The circuitry may be positioned in a logic layer and the memory may be fabricated over the logic layer. | 08-04-2011 |
20110188292 | VARIABLE RESISTANCE MEMORY, OPERATING METHOD AND SYSTEM - Provided is an operating method of a variable resistance memory device. The operating method applies a set pulse to a plurality of memory cells to be written in a set state, and applies a reset pulse to a plurality of memory cells to be written in a reset state. The width of the set pulse is narrower than the width of the reset pulse. | 08-04-2011 |
20110188293 | Non-Volatile Memory Cell With Non-Ohmic Selection Layer - A non-volatile memory cell and associated method is disclosed that includes a non-ohmic selection layer. In accordance with some embodiments, a non-volatile memory cell consists of a resistive sense element (RSE) coupled to a non-ohmic selection layer. The selection layer is configured to transition from a first resistive state to a second resistive state in response to a current greater than or equal to a predetermined threshold. | 08-04-2011 |
20110188294 | Multiplexer/de-multiplexer Memristive Device - A multiplexing/de-multiplexing memristive device ( | 08-04-2011 |
20110194328 | VARIABLE RESISTANCE MEMORY DEVICE AND RELATED METHOD OF OPERATION - A variable resistance memory device comprises a variable resistance memory cell, a switch that selectively passes a write voltage to an input terminal of the variable resistance memory cell, and a trigger circuit that controls the switch to cut off the write voltage from the input terminal upon determining that the variable resistance memory cell is programmed to a target state by detecting voltage fluctuation of the one side of variable resistance memory cell. | 08-11-2011 |
20110194329 | MEMORY COMPONENT, MEMORY DEVICE, AND METHOD OF OPERATING MEMORY DEVICE - A memory component includes: a first electrode; a memory layer; and a second electrode which are provided in that order, wherein the memory layer includes an ion source layer containing aluminum (Al) together with at least one chalcogen element selected from the group consisting of tellurium (Te), sulfur (S), and selenium (Se), and a resistance variable layer provided between the ion source layer and the first electrode and containing an aluminum oxide and at least one of a transition metal oxide and a transition metal oxynitride having a lower resistance than the aluminum oxide. | 08-11-2011 |
20110194330 | MEMORY ARRAY WITH READ REFERENCE VOLTAGE CELLS - The present disclosure relates to memory arrays with read reference voltage cells. In particular the present disclosure relates to variable resistive memory cell apparatus and arrays that include a high resistance state reference memory cell and a low resistance state reference memory cell that provides a reliable average reference voltage on chip to compare to a read voltage of a selected memory cell and determine if the selected memory cell is in the high resistance state or low resistance state. These memory arrays are particularly suitable for use with spin-transfer torque memory cells and resolves many systematic issues related to generation of a reliable reference voltage. | 08-11-2011 |
20110199811 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF CONTROLLING NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - According to an embodiment, there are provided a non-volatile semiconductor memory device includes: a memory cell array; a control circuit performing a series of operations to each memory cell and determining, as a defective memory cell, a memory cell whose data retention property does not satisfy a criteria, the series of operations including an operation applying a first bias to the memory cell in a forward direction, and including an operation thereafter applying a second bias to the memory cell in a reverse direction; a storage unit storing an address of the defective memory cell; and an address control unit performing a control to avoid storing data in the defective memory cell whose address is stored in the storage unit. | 08-18-2011 |
20110199812 | Nonvolatile semiconductor memory device - A nonvolatile semiconductor memory device includes: a memory element in which a rate of charge discharge between two electrodes of the memory element differs according to a logical value of stored information; cell wiring connected to one electrode of the memory element; a sense amplifier having a sense node connected to the cell wiring, the sense amplifier reading the logical value of the information by comparing a potential of the sense node with a reference potential; and a readout control circuit capable of switching between a dynamic sense operation performing readout by precharging the cell wiring and discharging or charging the cell wiring via the memory element and a static sense operation performing readout in a state of a current load being connected to the sense node. | 08-18-2011 |
20110199813 | NON-VOLATILE MEMORY DEVICE HAVING 3D STRUCTURE AND METHOD FOR FABRICATING THE SAME - A non-volatile memory device having a three-dimensional (3D) structure includes a plurality of line-type horizontal electrode structures configured to include a plurality of interlayer dielectric layers and a plurality of horizontal electrodes that are alternately stacked over a substrate, a plurality of pillar-type vertical electrodes configured to protrude from the substrate while contacting sidewalls of the plurality of the horizontal electrode structures, and a memory layer interposed between the plurality of the horizontal electrode structures and the plurality of the vertical electrodes, and configured to have a resistance value that varies based on a bias applied to the plurality of the horizontal electrodes and the plurality of the vertical electrodes. | 08-18-2011 |
20110205779 | SEMICONDUCTOR STORAGE DEVICE - According to one embodiment, a semiconductor storage device includes a memory cell array and a control circuit. The memory cell array has memory cells arranged therein at respective intersections between a plurality of first wirings and a plurality of second wirings. Each of the memory cells has a variable resistance element. The control circuit is configured to apply a voltage to a selected one of the first wirings and to a selected one of the second wirings. The control circuit includes a plurality of charge pump circuits and a plurality of clock oscillator circuits. The charge pump circuits generate a voltage applied to the first and second wirings. Each of the clock oscillator circuits is configured to supply a clock signal to a certain number of the charge pump circuits to control the timing of operation thereof. The clock oscillator circuits are configured to output clock signals at different frequencies. | 08-25-2011 |
20110205780 | Semiconductor Integrated Circuit - In one embodiment, a semiconductor integrated circuit includes a first resistive-change element, a second resistive-change element and a first switching element. The first resistive-change element includes one end having a first polarity connected to a first power source. The first resistive-change element includes another end having a second polarity connected to an output node. The second resistive-change element includes one end having the second polarity connected to the output node. The first switching element includes a first terminal connected to another end of the second resistive-change element. The first switching element includes a second terminal connected to a second power source. | 08-25-2011 |
20110205781 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a non-volatile semiconductor memory device includes: a first line; a second line intersecting with the first line; and a memory cell arranged at a position where the second line intersects with the first line, wherein, the memory cell includes: a variable resistance element; and a negative resistance element connected in series to the variable resistance element. | 08-25-2011 |
20110205782 | STEP SOFT PROGRAM FOR REVERSIBLE RESISTIVITY-SWITCHING ELEMENTS - A method and system for forming, resetting, or setting memory cells is disclosed. One or more programming conditions to apply to a memory cell having a reversible resistivity-switching element may be determined based on its resistance. The determination of one or more programming conditions may also be based on a pre-determined algorithm that may be based on properties of the memory cell. The one or more programming conditions may include a programming voltage and a current limit. For example, the magnitude of the programming voltage may be based on the resistance. As another example, the width of a programming voltage pulse may be based on the resistance. In some embodiments, a current limit used during programming is determined based on the memory cell resistance. | 08-25-2011 |
20110205783 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprises a plurality of first row lines arranged in parallel; a plurality of column lines intersecting the first row lines; a plurality of storage elements arranged at intersections of the first row lines and the column lines; a plurality of second row lines arranged in parallel with the first row lines, from positions opposite to the first row lines via the column lines to a certain portion of the column line, and capacitively coupled with the column lines; and a sense amplifier including a field effect transistor having a lower layer control electrode composed of the certain portion of the column line, and an upper layer control electrode composed of the second row line capacitively coupled in the upper layer with the certain portion of the column line. | 08-25-2011 |
20110205784 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a cell array including plural MATs (unit cell arrays) arranged in matrix, each MAT containing a plurality of first lines, a plurality of second lines intersecting the plurality of first lines, and a plurality of memory cells connected at intersections of the first and second lines between both lines, each memory cell containing an electrically erasable programmable variable resistive element of which resistance is nonvolatilely stored as data; and a plurality of write/erase circuits connected to the MATs and operative to execute data write or erase to the memory cells inside the MATs in accordance with input data. A part of the plurality of write/erase circuits writes data to memory cells inside a corresponding MAT while another part of the plurality of write/erase circuits erases data from memory cells inside a corresponding MAT at the same time. | 08-25-2011 |
20110211383 | INTEGRATED CIRCUIT HAVING VARIABLE MEMORY ARRAY POWER SUPPLY VOLTAGE - An integrated circuit comprises a memory array and a bias circuit. The memory array comprises a plurality of memory cells arranged in a grid of rows and columns. A first conductor is coupled to a power supply voltage terminal of each of the plurality of memory cells. A second conductor is coupled to receive a power supply voltage. The memory array also includes a plurality of dummy cells. A transistor of one or more of the plurality of dummy cells has a first current electrode coupled to the first conductor, a second current electrode coupled to the second conductor, and a control electrode. The bias circuit is coupled to the control electrode of the transistor. | 09-01-2011 |
20110216573 | SEMICONDUCTOR INTEGRATED CIRCUIT - According to one embodiment, a semiconductor integrated circuit includes first and second inverters, a first transistor which has a gate connected to a word line, a source connected to a first bit line, and a drain connected to an input terminal of the second inverter, a second transistor which has a gate connected to the word line, a source connected to a second bit line, and a drain connected to an input terminal of the first inverter, a first variable resistive element which has a first terminal connected to the drain of the first transistor, and a second terminal connected to an output terminal of the first inverter, and a second variable resistive element which has a first terminal connected to the drain of the second transistor, and a second terminal connected to an output terminal of the second inverter. | 09-08-2011 |
20110216574 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device in accordance with an embodiment comprises a plurality of first, second lines, a plurality of memory cells, and a control circuit. The plurality of second lines extend so as to intersect the first lines. The plurality of memory cells are disposed at intersections of the first, second lines, and each includes a variable resistor. The control circuit is configured to control a voltage applied to the memory cells. The control circuit applies a first pulse voltage to the variable resistor during a forming operation. In addition, the control circuit applies a second pulse voltage to the variable resistor during a setting operation, the second pulse voltage having a polarity opposite to the first pulse voltage. Furthermore, the control circuit applies a third pulse voltage to the variable resistor during a resetting operation, the third pulse voltage having a polarity identical to the first pulse voltage. | 09-08-2011 |
20110216575 | NONVOLATILE MEMORY DEVICE AND NONVOLATILE MEMORY APPARATUS - According to one embodiment, a nonvolatile memory device includes a recording layer and a conductive first layer. The recording layer includes a main group element, a transition element, and oxygen. The recording layer is capable of recording information by changing reversibly between a high resistance state and a low resistance state. The first layer is made of at least one selected from a metal, a metal oxide, a metal nitride, and a metal carbide. The first layer is provided adjacent to the recording layer. The first layer includes the main group element with a concentration lower than a concentration of the main group element of the recording layer. | 09-08-2011 |
20110216576 | INFORMATION RECORDING/REPRODUCING DEVICE - According to one embodiment, an information recording/reproducing device includes a recording layer and a driver section. The recording layer has a first layer including a first compound. The first compound includes a mixed crystal of a first oxide containing a first metallic element and a second oxide. The second oxide has a crystal structure being same as the first oxide and contains a second metallic element different from the first metallic element. The driver section is configured to produce state change in the recording layer to record information by at least one of application of voltage to the recording layer and passage of current to the recording layer. Composition ratio of an element having a smaller ionic radius of the first and second metallic elements is not less than percolation threshold of a lattice formed of ions of the first and second metallic elements based on the crystal structure. | 09-08-2011 |
20110216577 | VARIABLE RESISTANCE NONVOLATILE STORAGE DEVICE - The variable resistance nonvolatile storage device reduces variations in a resistance value of a variable resistance element ( | 09-08-2011 |
20110222331 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device in accordance with an embodiment includes: a memory cell array having memory cells disposed at respective intersections of first lines and second lines; and a control circuit configured to apply a first pulse voltage multiple times to selected one of the first lines and selected one of the second lines, such that a certain potential difference is applied to a selected memory cell thereby causing transition of a resistance state. The control circuit is configured to, when the selected memory cell is not caused to undergo transition of the resistance state even after application of the first pulse voltage a certain number of times, execute a rescue operation where a second pulse voltage is applied to the selected memory cell subsequent to application of the first pulse voltage, the second pulse voltage having a pulse width longer than that of the first pulse voltage. | 09-15-2011 |
20110228585 | VARIABLE RESISTANCE MEMORY DEVICE AND RELATED METHOD OF OPERATION - A variable resistance memory device comprises a memory cell comprising a variable resistance device and a select transistor connected in series to the variable resistance device. The variable resistance memory device further comprises a write driver for supplying a write voltage to opposite sides of the memory cell, and a feedback circuit for detecting a resistance change of the variable resistance device and controlling a gate voltage of the select transistor according to the detected resistance change. | 09-22-2011 |
20110228586 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes a bit voltage adjusting circuit which, for each bit line, fixes potentials of a selected bit line and a non-selected bit line to a predetermined potential to perform a memory operation and a data voltage adjusting circuit which, for each data line, fixes potentials of a selected data line and a non-selected data line to a predetermined potential to perform a memory operation. Each of the voltage adjusting circuits includes an operational amplifier and a transistor, a voltage required for a memory operation is input to the non-inverted input terminal of the operational amplifier, and the inverted input terminal of the operational amplifier is connected to the bit line or the data line, so that the potential of the bit line or the data line is fixed to a potential of the non-inverted input terminal of the operational amplifier. | 09-22-2011 |
20110228587 | NONVOLATILE SEMICONDUCTOR MEMORY AND MANUFACTURING METHOD OF NONVOLATILE SEMICONDUCTOR MEMORY - According to one embodiment, a nonvolatile semiconductor memory includes word lines, bit lines, memory cells, a dummy word line, a dummy bit line and dummy cells. The word lines and the bit lines cross. The memory cells are provided for each intersection of the word lines and bit lines. Each memory cell includes a first diode and a resistance change memory element. The dummy word line crosses the bit lines. The dummy bit line crosses the word lines. The dummy cells are provided at each intersection of the dummy word line and the bit lines, and at each intersection of the dummy bit line and the word lines. Each dummy cell includes a second diode. | 09-22-2011 |
20110228588 | NONVOLATILE MEMORY DEVICE AND METHOD OF PROGRAMMING THE SAME - A nonvolatile memory device includes a memory cell array having multiple memory cells, a data input/output buffer for temporarily storing data to be stored in the memory cells, and a data scanner for scanning the data stored temporarily in the data input/output buffer. The nonvolatile memory device further includes control logic for reading address information of a memory cell in which at least a portion of the data is to be stored and selectively performing a data scan operation according to the read address information. | 09-22-2011 |
20110228589 | RESISTANCE CHANGE MEMORY - A memory includes memory cells each includes a resistance change element and a diode. The diode comprises areas which is provided in order of a first semiconductor area with a first conductivity type, a second semiconductor area with the first conductivity type, and a third semiconductor area with a second conductivity type, from the column lines to the row lines. An atom density of impurities with the first conductivity type in the second semiconductor area is lower than that in the first semiconductor area. The diode comprises a fourth semiconductor area with the first conductivity type at an end portion in a third direction of the second semiconductor area, the third direction is perpendicular to a direction from the column lines to the row lines, and an atom density of impurities with the first conductivity type in the fourth semiconductor area is higher than that in the second semiconductor area. | 09-22-2011 |
20110228590 | RESISTANCE CHANGE MEMORY - A memory includes memory cells each includes a resistance change element and a diode, and each memory cell between one of row lines and one of column lines, a first decoder which selects one of the row lines as a selected row line, a second decoder which selects one of the column lines as a selected column line, a voltage pulse generating circuit which generates a voltage pulse, a voltage pulse shaping circuit which makes a rise time and a fall time of the voltage pulse longer, and a control circuit which applies the voltage pulse outputting from the voltage pulse shaping circuit to unselected column lines except the selected column line, and which applies a fixed potential to unselected row lines except the selected row line, in a data writing to a memory cell which is provided between the selected row line and the selected column line. | 09-22-2011 |
20110228591 | SEMICONDUCTOR MEMORY HAVING BOTH VOLATILE AND NON-VOLATILE FUNCTIONALITY INCLUDING RESISTANCE CHANGE MATERIAL AND METHOD OF OPERATING - Semiconductor memory is provided wherein a memory cell includes a capacitorless transistor having a floating body configured to store data as charge therein when power is applied to the cell. The cell further includes a nonvolatile memory comprising a resistance change element configured to store data stored in the floating body under any one of a plurality of predetermined conditions. A method of operating semiconductor memory to function as volatile memory, while having the ability to retain stored data when power is discontinued to the semiconductor memory is described. | 09-22-2011 |
20110228592 | Programmable Bipolar Electronic Device - A configurable memristive device ( | 09-22-2011 |
20110228593 | Memristive Device Based on Current Modulation by Trapped Charges - A memristive device ( | 09-22-2011 |
20110235390 | HIGH DENSITY MEMORY DEVICE - A memory device and a method of forming the same are provided. The memory device includes a substrate; a set of electrodes disposed on the substrate; a dielectric layer formed between the set of electrodes; and a transition metal oxide layer formed between the set of electrodes, the transition metal oxide layer configured to undergo a metal-insulator transition (MIT) to perform a read or write operation. | 09-29-2011 |
20110235391 | Reference Cell Write Operations At A Memory - A method of selecting a reference circuit for a write operation is disclosed. The method comprises selecting a reference circuit for a write operation based on an output of a row decode circuit and a column decode circuit. The reference circuit is programmed concurrently with a write operation of at least one of a plurality of memory cells in a memory array without requiring an external reference circuit write command. | 09-29-2011 |
20110235392 | NONVOLATILE SEMICONDUCTOR STORAGE DEVICE - According to one embodiment, a nonvolatile semiconductor storage device having a plurality of operation modes, includes: a plurality of first lines; a plurality of second lines; a plurality of memory cells; a first selection unit that charges the first line to a first selection voltage; and a second selection unit that charges a second line to an unselection voltage and discharges the second line to a second selection voltage after the first line is charged to the first selection voltage by the first selection unit, wherein the second selection unit adjusts at least one of a level of the second selection voltage to which the second line to be selected is to be discharged and a time constant when discharging the second line to be selected, in accordance with an operation mode in which the nonvolatile semiconductor storage device operates among the plurality of operation modes. | 09-29-2011 |
20110235393 | Nonvolatile storage device - A nonvolatile storage device includes: a plurality of memory mats each including a plurality of memory cells; a plurality of plate electrodes each provided for every individual one of the memory mats and each used for applying a voltage to the memory cells; a power-supply section configured to apply a voltage to each of the plate electrodes; a switch circuit having a plurality of switches provided between the power-supply section and each of the plate electrodes and between the plate electrodes; and a control section configured to control the switch circuit in order to disconnect the plate electrodes from the power-supply section and to connect the plate electrodes to each other in order to carry out electrical charging and discharging operations among the plate electrodes. | 09-29-2011 |
20110235394 | SEMICONDUCTOR MEMORY DEVICE - A control circuit applies a first voltage to selected one of first lines and applies a second voltage having a voltage value smaller than that of the first voltage to selected one of second lines, such that a certain potential difference is applied across a memory cell disposed at an intersection of the selected one of the first lines and the selected one of the second lines. A current limiting circuit sets a compliance current defining an upper limit of a cell current flowing in the memory cell, and controls such that the cell current flowing in the memory cell does not exceed the compliance current. The current limiting circuit comprises a current generating circuit and a first current mirror circuit. The current generating circuit generates a first current having a current value equal to a current value of the cell current at a certain timing multiplied by a certain constant. The first current mirror circuit mirrors the first current to a current path supplying the first voltage to the first lines. | 09-29-2011 |
20110235395 | SEMICONDUCTOR MEMORY DEVICE AND WRITING METHOD THEREOF - A memory cell array includes memory transistors each including a gate insulating film formed on a semiconductor substrate, a gate electrode formed on the gate insulating film, and a variable resistance film formed on the gate electrode and made of a variable resistance material having variable resistance and is configured by plural memory strings disposed with longer direction extending in a first direction and including plural series-connected memory transistors. Word lines are disposed with a longer direction extending in a second direction orthogonal to the first direction, and connected commonly to the gate electrodes of the plural memory transistors lined up in the second direction. A plate line is disposed to sandwich the variable resistance film with the gate electrode. First voltage terminals supply a certain voltage to first ends of the plural memory strings. Second voltage terminals supply a certain voltage to second ends of the plural memory strings. | 09-29-2011 |
20110235396 | SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR DEVICE - A semiconductor memory device includes a memory cell array, a first control circuit, and a second control circuit. The first control circuit is configured to apply a first voltage to a selected first line. The second control circuit is configured to apply a second voltage having a voltage value higher than that of the first voltage to a selected second line. The first control circuit includes a detecting circuit. The detecting circuit is configured to detect a leak current to flow from the second line to the first line through a memory cell during a forming operation for bringing the memory cell into a state that allows the memory cell to shift between a high resistance state and a low resistance state. The second control circuit includes a current supply circuit, and a compensating circuit. The current supply circuit is configured to supply a constant current to the second line during the forming operation. The compensating circuit is configured to supply a compensating current having the same current value as that of the leak current to the second line during the forming operation based on the leak current detected by the detecting circuit. | 09-29-2011 |
20110235397 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - A memory cell array includes a memory cell having a variable resistance element and disposed between first and second wirings. A control circuit provides a selected first wiring with a first voltage and provide a selected second wiring with a second voltage having a lower voltage value than the first voltage. A current limitation circuit controls a cell current below a first current. It includes a first current generation circuit for storing a cell current at a first point of time and generating a first current of α times the stored cell current. It also includes a second current generation circuit for generating a second current of (β/α) times the cell current at a second point of time. A determination circuit outputs a control signal when the second current exceeds the stored current. The first current generation circuit newly stores a stored current according to the control signal. | 09-29-2011 |
20110235398 | SEMICONDUCTOR MEMORY DEVICE AND OPERATION METHOD THEREOF - A semiconductor memory device in accordance with an embodiment includes: a memory cell array having memory cells disposed at an intersection of first lines and second lines; and a control circuit configured to execute a read operation, thereby determining a resistance state of the selected one of the memory cells. The read operation is an operation configured to execute a sensing operation multiple times and aggregate determination results thereof. The sensing operation is configured such that a first voltage is applied to selected ones of the first lines and a second voltage lower than the first voltage is applied to a single selected one of the second lines. The control circuit suspends application of the first voltage to the first line connected to the selected one of the memory cells determined to be in a first resistance state in one of the sensing operations, and executes the next sensing operation. | 09-29-2011 |
20110235399 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device according to an embodiment includes a memory cell array configured by plural memory cells each including a variable resistor and each provided between first and second lines. A control circuit applies to a memory cell through the first and second lines a writing voltage for writing data or a reading voltage for reading data. A sense amplifier circuit senses data retained in a memory cell based on a current flowing through the first line. In a data writing operation, the control circuit applies a writing voltage to each of n number of memory cells configuring one unit such that the memory cells may be supplied with different resistance values. In a data reading operation, the sense amplifier circuit compares level relationship of the resistance values of n number of memory cells configuring one unit and reads out n! patterns of data from the one unit. | 09-29-2011 |
20110235400 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR CONTROLLING THE SAME - According to one embodiment, a method for controlling a semiconductor device comprises determining a select bit number for a group of memory cells each includes a variable-resistance element, setting a first voltage corresponding to the select bit number, applying the set first voltage to the memory cell group, and performing verify read on the memory cell group to which the first voltage has been applied and determining whether or not the memory cell group passes the verify read. If the memory cell group is determined not to pass the verify read, the number of bits corresponding to passed memory cells is subtracted from the select bit number, and the first voltage corresponding to the decreased select bit number is set again. | 09-29-2011 |
20110235401 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device according to an embodiment herein includes a memory cell array. The memory cell array includes memory cells each provided between a first line and a second line and each including a variable resistor. A control circuit applies through the first and second lines a voltage necessary for a forming operation of the memory cell. A current limiting circuit limits a value of a current flowing across the memory cell during the forming operation to a certain limit value. The control circuit repeats an operation of applying the voltage by setting the limit value to a certain value and an operation of changing the limit value from the certain value, until forming of the memory cell is achieved. | 09-29-2011 |
20110235402 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes a first cell array includes memory cells and reference cells, a second cell array located adjacent to the first cell array in a first direction, a third cell array located adjacent to the first cell array in a second direction crossing the first direction, a fourth cell array located adjacent to the second cell array in the second direction, and a sense amplifier connected to the first to fourth cell array and configured to compare a current through a memory cell with a current through a reference cell to determine the data of the memory cell. A reference cell is selected from a cell array which is diagonally opposite to a cell array as a read target. | 09-29-2011 |
20110235403 | METHOD AND APPARATUS MANAGING WORN CELLS IN RESISTIVE MEMORIES - A method and apparatus for management worn resistive memory cells are presented. A normal read mode or worn memory cell detecting mode are used depending on the wear state of a resistive memory cell. A detection reference point is changed upon wear indication to detect the resistance of the resistive memory cell. The resistance of the resistive memory cell is detected using the changed detection reference point to determine whether or not the resistive memory cell is worn by comparing the detected resistance to a wear reference level. | 09-29-2011 |
20110235404 | PULSE RESET FOR NON-VOLATILE STORAGE - A non-volatile storage system includes a substrate, control circuitry on the substrate, a three dimensional memory array (above the substrate) that includes a plurality of memory cells with reversible resistance-switching elements, and circuits to SET and RESET the resistance-switching elements. The circuits that RESET the resistance-switching elements provide a pulse to the memory cells that is large enough in magnitude to SET and RESET the memory cells, and long enough to potentially RESET the memory cell but not long enough to SET the memory cells. | 09-29-2011 |
20110235405 | PROGRAMMING NON-VOLATILE STORAGE ELEMENT USING CURRENT FROM OTHER ELEMENT - A non-volatile storage apparatus includes a set of Y lines, a common X line, multiple storage elements each of which is connected to the common X line, and control circuitry in communication with the common X line and the set of Y lines. The multiple data storage elements are capable of being in a first state or a second state. The control circuitry provides control signals to the common X line and the set of Y lines to change a first data storage element of the multiple data storage elements from the first state to the second state by passing a current into the first data storage element from a different Y line through a different storage element. The control circuitry provides control signals to the common X line and the set of Y lines to sequentially change additional data storage elements of the multiple data storage elements from the first state to the second state by passing currents into the additional data storage elements from data storage elements of the multiple data storage elements that were previously changed to the second state and their associated different Y lines. | 09-29-2011 |
20110242874 | RESISTIVE MEMORY AND METHOD FOR CONTROLLING OPERATIONS OF THE SAME - A resistive memory and a method for controlling operations of the resistive memory are provided. The resistive memory has a first memory layer, a second memory layer and a medium layer. Each of the first memory layer and the second memory layer is used to store data. The medium layer is formed between the first memory layer and the second memory layer. The method comprises at least a step of measuring a resistance between the first memory layer and the second memory layer, and determining which one of a first state, a second state and a third state is a state of the resistive memory according to the measured resistance. | 10-06-2011 |
20110242875 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a cell array including a plurality of first lines, a plurality of second lines intersecting the plurality of first lines, and a plurality of memory cells arranged in matrix and connected at intersections of the first and second lines between both lines, each memory cell containing a serial circuit of an electrically erasable programmable variable resistive element of which resistance is nonvolatilely stored as data and a non-ohmic element; and a plurality of access circuits operative to simultaneously access the memory cells physically separated from each other in the cell array. | 10-06-2011 |
20110242876 | Buffering systems for accessing multiple layers of memory in integrated circuits - Embodiments of the invention relate generally to data storage and computer memory, and more particularly, to systems, integrated circuits and methods for accessing memory in multiple layers of memory implementing, for example, third dimension memory technology. In a specific embodiment, an integrated circuit is configured to implement write buffers to access multiple layers of memory. For example, the integrated circuit can include memory cells disposed in multiple layers of memory. In one embodiment, the memory cells can be third dimension memory cells. The integrated circuit can also include read buffers that can be sized differently than the write buffers. In at least one embodiment, write buffers can be sized as a function of a write cycle. Each layer of memory can include a plurality of two-terminal memory elements that retain stored data in the absence of power and store data as a plurality of conductivity profiles. | 10-06-2011 |
20110242877 | METHOD AND APPARATUS PROVIDING A CROSS-POINT MEMORY ARRAY USING A VARIABLE RESISTANCE MEMORY CELL AND CAPACITANCE - The invention relates to a method and apparatus providing a memory cell array in which each resistance memory cell is connected in series to a capacitive element. Access transistors are not necessary to perform read and write operations on the memory cell. In one exemplary embodiment, the capacitive element is a capacitor. | 10-06-2011 |
20110242878 | METHODS FOR OPERATING MEMORY ELEMENTS - Methods for measuring the resistance of multiple memory elements are disclosed. The memory elements may be multi-bit memory and through precise measurement of resistance of the multi-bit memory elements, determination of how many and which memory elements fall into specific memory ranges can be accomplished. Furthermore, storage and/or display of this information may allow for the creation of resistance distribution histograms for modeling of one or more memory arrays. | 10-06-2011 |
20110249485 | RESISTANCE-CHANGE MEMORY - According to one embodiment, a resistance-change memory includes bit lines running in a first direction, word lines running in a second direction, and a memory cell array includes memory cells each includes a selection transistor and a variable resistance element. In a layout of first to fourth variable resistance elements arranged in order in the first direction, the first variable resistance element and the second variable resistance element sandwich one word line therebetween, the third variable resistance element and the fourth variable resistance element sandwich one word line therebetween, a first pair includes the first and second variable resistance elements and a second pair includes the third and fourth variable resistance elements sandwich two word lines therebetween, and a column is constructed by repeating the layout in the first direction. | 10-13-2011 |
20110249486 | RESISTANCE VARIABLE MEMORY APPARATUS - A resistance variable memory apparatus ( | 10-13-2011 |
20110255329 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE, METHOD OF SUPPLYING VOLTAGE IN THE SAME, AND SEMICONDUCTOR DEVICE - A memory cell array is configured as an arrangement of memory cells. A first voltage generating circuit is configured to, during a write operation on the memory cells, generate and supply to the memory cell array a first voltage from a constant voltage, and to, during a read operation on the memory cells, generate and supply to the memory cell array a second voltage from a power supply voltage. A second voltage generating circuit is configured to generate the constant voltage. A selector circuit is configured to, during the write operation, drive the second voltage generating circuit to supply to the first voltage generating circuit the constant voltage, and to, during the read operation, stop the second voltage generating circuit and supply to the first voltage generating circuit the power supply voltage. | 10-20-2011 |
20110255330 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device according to one embodiment of the present invention includes a memory cell array configured by memory cells each provided between a first line and a second line and each including a variable resistor. A control circuit applies to any one of the memory cells through the first and second lines a voltage necessary for an operation of any one of the memory cells. A current limiting circuit is connected to the first line and limits a current flowing across the memory cell during an operation to a certain limit value. During an operation, the control circuit supplies a first voltage to the first line while supplying to the second line a second voltage. The second voltage lowers over time. | 10-20-2011 |
20110255331 | MEMORY CELLS WITH RECTIFYING DEVICE - Memory devices and methods described are shown that provide improvements, including improved cell isolation for operations such as read and write. Further, methods and devices for addressing and accessing cells are shown that provide a simple and efficient way to manage devices with multiple cells associated with each access transistor. Examples of multiple cell devices include phase change memory devices with multiple cells associated with each access transistor. | 10-20-2011 |
20110261606 | Arrays Of Vertically Stacked Tiers Of Non-Volatile Cross Point Memory Cells, Methods Of Forming Arrays Of Vertically Stacked Tiers Of Non-Volatile Cross Point Memory Cells, And Methods Of Reading A Data Value Stored By An Array Of Vertically Stacked Tiers Of Non-Volatile Cross Point Memory Cells - An array of vertically stacked tiers of non-volatile cross point memory cells includes a plurality of horizontally oriented word lines within individual tiers of memory cells. A plurality of horizontally oriented global bit lines having local vertical bit line extensions extend through multiple of the tiers. Individual of the memory cells comprise multi-resistive state material received between one of the horizontally oriented word lines and one of the local vertical bit line extensions where such cross, with such ones comprising opposing conductive electrodes of individual memory cells where such cross. A plurality of bit line select circuits individually electrically and physically connects to individual of the local vertical bit line extensions and are configured to supply a voltage potential to an individual of the global horizontal bit lines. Other embodiments and aspects are disclosed. | 10-27-2011 |
20110261607 | Arrays Of Vertically Stacked Tiers Of Non-Volatile Cross Point Memory Cells, Methods Of Forming Arrays Of Vertically Stacked Tiers Of Non-Volatile Cross Point Memory Cells, And Methods Of Reading A Data Value Stored By An Array Of Vertically Stacked Tiers Of Non-Volatile Cross Point Memory Cells - An array of vertically stacked tiers of non-volatile cross point memory cells includes a plurality of horizontally oriented word lines within individual tiers of memory cells. A plurality of horizontally oriented global bit lines having local vertical bit line extensions extend through multiple of the tiers. Individual of the memory cells comprise multi-resistive state material received between one of the horizontally oriented word lines and one of the local vertical bit line extensions where such cross, with such ones comprising opposing conductive electrodes of individual memory cells where such cross. A plurality of bit line select circuits individually electrically and physically connects to individual of the local vertical bit line extensions and are configured to supply a voltage potential to an individual of the global horizontal bit lines. Other embodiments and aspects are disclosed. | 10-27-2011 |
20110261608 | Self-Repairing Memristor and Method - A self-repairing memristor ( | 10-27-2011 |
20110267870 | Decoders Using Memristive Switches - A decoding structure employs a main terminal ( | 11-03-2011 |
20110267871 | Contemporaneous Margin Verification And Memory Access For Memory Cells In Cross-Point Memory Arrays - Circuitry for restoring data values in re-writable non-volatile memory is disclosed. An integrated circuit includes a memory access circuit and a sensing circuit configured to sense a data signal during a read operation to at least one two-terminal non-volatile cross-point memory array. Each memory array includes a plurality of two-terminal memory elements. A plurality of the memory arrays can be fabricated over the substrate and vertically stacked on one another. Further, the integrated circuit can include a margin manager circuit configured to manage a read margin for the two-terminal memory elements substantially during the read operation, thereby providing for contemporaneous read and margin determination operations. Stored data read from the two-terminal memory elements may have a value of the stored data restored (e.g., re-written to the same cell or another cell) if the value is not associated with a read margin (e.g., a hard programmed or hard erased state). | 11-03-2011 |
20110267872 | RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device includes: a memory cell formed of a variable resistance element and a diode connected in series, the state of the variable resistance element being reversibly changed in accordance with applied voltage or current; and a stabilizing circuit so coupled in series to the current path of the memory cell as to serve for stabilizing the state change of the memory cell passively. | 11-03-2011 |
20110280057 | Memory Device Having A Local Current Sink - A memory device having a local current sink is disclosed. In a particular embodiment, an electronic device is disclosed. The electronic device includes one or more write drivers. The electronic device includes at least one Magnetic Tunnel Junction (MTJ) coupled to a bit line and coupled to a source line. The electronic device also includes a current sink circuit comprising a single transistor, the single transistor coupled to the bit line and to the source line. | 11-17-2011 |
20110280058 | NONVOLATILE MEMORY DEVICE - A memory device comprises an array of memory cells each capable of storing multiple bits of data. Each memory cell includes a programmable transistor in series with a resistance switching device. The transistor is switchable between a plurality of different threshold voltages associated with respective memory states. The resistance switching device is configured to be switchable between a plurality of different resistances associated with respective memory states. | 11-17-2011 |
20110280059 | ALTERNATING BIPOLAR FORMING VOLTAGE FOR RESISTIVITY-SWITCHING ELEMENTS - A method and system for forming reversible resistivity-switching elements is described herein. Forming refers to reducing the resistance of the reversible resistivity-switching element, and may refer to reducing the resistance for the first time. Prior to forming the reversible resistivity-switching element it may be in a high-resistance state. The method may comprise alternating between applying one or more first voltages having a first polarity to the memory cell and applying one or more second voltages having a second polarity that is opposite the first polarity to the memory cell until the reversible resistivity-switching memory element is formed. There may be a rest period between applying the voltages of opposite polarity. | 11-17-2011 |
20110280060 | WRITE BUFFERING SYSTEMS FOR ACCESSING MULTIPLE LAYERS OF MEMORY IN INTEGRATED CIRCUITS - Embodiments of the invention relate generally to data storage and computer memory, and more particularly, to systems, integrated circuits and methods for accessing memory in multiple layers of memory implementing, for example, third dimension memory technology. In a specific embodiment, an integrated circuit is configured to implement write buffers to access multiple layers of memory. For example, the integrated circuit can include memory cells disposed in multiple layers of memory. In one embodiment, the memory cells can be third dimension memory cells. The integrated circuit can also include read buffers that can be sized differently than the write buffers. In at least one embodiment, write buffers can be sized as a function of a write cycle. Each layer of memory can include a plurality of two-terminal memory elements that retain stored data in the absence of power and store data as a plurality of conductivity profiles. | 11-17-2011 |
20110286258 | NONVOLATILE MEMORY DEVICE HAVING A TRANSISTOR CONNECTED IN PARALLEL WITH A RESISTANCE SWITCHING DEVICE - A memory device comprises an array of memory cells each capable of storing multiple bits of data. The memory cells are arranged in memory strings that are connected to a common source line. Each memory cell includes a programmable transistor connected in parallel with a resistance switching device. The transistor is switchable between a plurality of different threshold voltages associated with respective memory states. The resistance switching device is configured to be switchable between a plurality of different resistances associated with respective memory states. | 11-24-2011 |
20110286259 | Reading Memory Elements Within a Crossbar Array - A method for reading the state of a memory element within a crossbar memory array includes storing a first electric current sensed from a half-selected target memory element within the crossbar memory array; and outputting a final electric current based on the stored first electric current and a second electric current sensed from the target memory element when the target memory element is fully selected. | 11-24-2011 |
20110286260 | NONVOLATILE MEMORY DEVICE AND METHOD FOR DRIVING SAME - According to one embodiment, a nonvolatile memory device includes a memory unit and a control unit. The memory unit includes first and second interconnects, and a memory cell. The second interconnect is non-parallel to the first interconnect. The memory cell includes a resistance change layer provided at an intersection between the first and second interconnects. The control unit is connected to the first and second interconnects to supply voltage and current to the resistance change layer. The control unit increases an upper limit of a current supplied to the first interconnect based on a change of a potential of the first interconnect when applying a set operation voltage to the first interconnect in a set operation of changing the resistance change layer from a first state with a first resistance value to a second state with a second resistance value being less than the first resistance value. | 11-24-2011 |
20110286261 | RESISTANCE CHANGE MEMORY - According to one embodiment, a resistance change memory includes a memory cell array area and a resistive element area on a substrate. A first memory cell array in the memory cell array area includes a first control line, a second control line above first control line, and a first cell unit between the first and second control lines. A second memory cell array on the first memory cell array includes the second control line, a third control line above the second control line, and a second cell unit between the second and the third control lines. And a resistive element in the resistive element area includes resistance lines, and a resistor connected to the resistance lines. The resistor includes the same member as one of a member of the cell unit and a member of a contact plug. | 11-24-2011 |
20110292712 | READING A MEMORY ELEMENT WITHIN A CROSSBAR ARRAY - A method for reading a memory element within a crossbar array, the method including selecting a column line connected to a target memory element of the crossbar array by applying a supply voltage to a source follower, a gate terminal of the source follower connected to the column line; applying bias voltages to row lines of the crossbar array; storing an output voltage of the source follower in a storage element; applying a sense voltage to a row line connected to the target memory element; and outputting a difference between the voltage stored in the storage element and an output voltage of the source follower while the sense voltage is applied to the row line. | 12-01-2011 |
20110292713 | Reading a Memory Element Within a Crossbar Array - A method for reading a memory element within a crossbar array includes switching a column line connected to a target memory element of the crossbar array to connected to an input of a current mirror; applying an error voltage to unselected rows of the crossbar array; applying a sense voltage to a row line connected to the target memory element; and measuring an output current of the current mirror. | 12-01-2011 |
20110292714 | STRUCTURES AND METHODS FOR A FIELD-RESET SPIN-TORQUE MRAM - An apparatus and method of programming a spin-torque magnetoresistive memory array includes a metal reset line positioned near each of a plurality of magnetoresistive bits and configured to set the plurality of magnetoresistive memory elements to a known state by generating a magnetic field when an electrical current flows through it. A spin torque transfer current is then applied to selected ones of the magnetoresistive bits to switch the selected bit to a programmed state. In another mode of operation, a resistance of the plurality of bits is sensed prior to generating the magnetic field. The resistance is again sensed after the magnetic field is generated and the data represented by the initial state of each bit is determined from the resistance change. A spin torque transfer current is then applied only to those magnetoresistive bits having a resistance different from prior to the magnetic field being applied. | 12-01-2011 |
20110292715 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a memory cell array in which a plurality of memory cells is aligned in a matrix shape, each memory cell including a two-terminal memory element and a transistor for selection connected in series; a first voltage applying circuit that applies a writing voltage pulse to first bit lines; and a second voltage applying circuit that applies a pre-charge voltage to the first bit lines and second bit lines, wherein in a writing of a memory cell, after the second voltage applying circuit has pre-charged both ends of the memory cell to a same voltage, the first voltage applying circuit applies the writing voltage pulse via the first bit line that is directly connected to the transistor for selection, and the second voltage applying circuit applies the pre-charge voltage to the second bit line directly connected to the memory element. | 12-01-2011 |
20110292716 | Asymmetric Write Current Compensation Using Gate Overdrive for Resistive Sense Memory Cells - Apparatus and associated method for asymmetric write current compensation for resistive sense memory (RSM) cells, such as but not limited to spin-torque transfer random access memory (STRAM) or resistive random access memory (RRAM) cells. In accordance with some embodiments, an RSM cell includes an RSM element coupled to a switching device. The switching device has a plurality of terminals. A control circuit compensates for asymmetric write characteristics of the RSM cell by limiting a range of voltage differentials across the terminals so as to be equal to or less than a magnitude of a source voltage applied to the switching device, thereby providing bi-directional write currents of substantially equal magnitude through the RSM element. | 12-01-2011 |
20110299319 | NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE - A non-volatile semiconductor storage device includes a memory cell array having plural electrically rewritable memory cells, each memory cell including a variable resistive element storing resistance values as data in a non-volatile manner, and a data writing unit having a voltage supply circuit which supplies a voltage needed to write data to the plural memory cells, and a resistance state detecting circuit which detects a resistance state of the variable resistive element at the time of writing the data. The data writing unit stops the supply of the voltage to the memory cell where a resistance state of the variable resistive element becomes a desired resistance state, among the plural memory cells, according to the detection result of the resistance state detecting circuit. | 12-08-2011 |
20110299320 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes a memory cell array, the memory cell array including a plurality of first lines, a plurality of second lines configured to intersect the first lines, and a plurality of electrically rewritable memory cells disposed at each of intersections of the first lines and the second lines, each of the memory cells being configured from a variable resistor operative to store a resistance value of the variable resistor as data in a nonvolatile manner. A voltage supply circuit applies a certain voltage to the memory cells via the first lines and the second lines during writing data to the memory cells or forming of the memory cells. A detection circuit detects a change of the resistance value of the variable resistor in the memory cell during application of the certain voltage to the memory cells and outputs the detected change of the resistance value of the variable resistor as detection information. An output circuit outputs to external at least a portion of the detection information outputted from the detection circuit. | 12-08-2011 |
20110299321 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device in accordance with an embodiment includes a plurality of first word lines, a plurality of bit lines, a resistance varying material, a plurality of second word lines and an insulating film. The bit lines intersect the first word lines. The resistance varying material is disposed at respective intersections of the first word lines and the bit lines. The second word lines intersect the bit lines. The insulating film is disposed at respective intersections of the second word lines and the bit lines. One of the first word lines and one of the second word lines are disposed so as to sandwich the bit lines. The second word lines, the bit lines, and the insulating film configure a field-effect transistor at respective intersections of the second word lines and the bit lines. The field-effect transistor and the resistance varying material configure one memory cell. | 12-08-2011 |
20110299322 | METHOD OF PROGRAMMING VARIABLE RESISTANCE ELEMENT, METHOD OF INITIALIZING VARIABLE RESISTANCE ELEMENT, AND NONVOLATILE STORAGE DEVICE - A method of programming a variable resistance element includes: performing a writing step by applying a writing voltage pulse having a first polarity to a transition metal oxide comprising two metal oxide layers which are stacked, so as to change a resistance state of the transition metal oxide from high to low, each of the two metal oxide layers having a different degree of oxygen deficiency; and performing an erasing step by applying an erasing voltage pulse having a second polarity to the transition metal oxide so as to change the resistance state of the transition metal oxide from low to high, the second polarity being different from the first polarity, wherein |Vw | 12-08-2011 |
20110299323 | Floating Source Line Architecture for Non-Volatile Memory - A method and apparatus for writing data to a non-volatile memory cell, such as an RRAM memory cell. In some embodiments, a semiconductor array of non-volatile memory cells comprises a resistive sense element (RSE) and a switching device. A RSE of a plurality of memory cells is connected to a bit line while the switching device of a plurality of memory cells is connected to a word line and operated to select a memory cell. A source line is connected to the switching device and connects a series of memory cells together. Further, a driver circuit is connected to the bit line and writes a selected RSE of a selected source line to a selected resistive state by passing a write current along a write current path that passes through the selected RSE and through at least a portion of the remaining RSE connected to the selected source line. | 12-08-2011 |
20110299324 | WRITE CURRENT COMPENSATION USING WORD LINE BOOSTING CIRCUITRY - Apparatus and method for write current compensation in a non-volatile memory cell, such as but not limited to spin-torque transfer random access memory (STRAM) or resistive random access memory (RRAM). In accordance with some embodiments, a non-volatile memory cell has a resistive sense element (RSE) coupled to a switching device, the RSE having a hard programming direction and an easy programming direction opposite the hard programming direction. A voltage boosting circuit includes a capacitor which adds charge to a nominal non-zero voltage supplied by a voltage source to a node to generate a temporarily boosted voltage. The boosted voltage is applied to the switching device when the RSE is programmed in the hard programming direction. | 12-08-2011 |
20110305063 | SENSE AMPLIFIER FOR READING A CROSSBAR MEMORY ARRAY - A sense amplifier for reading the data stored in a crossbar array includes a storage transistor to store a first voltage resulting from an electric current from a column line connected to a target memory element while the target memory element is half-selected, the first voltage resulting from bias voltages applied to row lines not connected to the target memory element; a mirror transistor to store a second voltage resulting from an electric current from the column line while the target memory element is fully selected; a cross-coupled inverter circuit having a first branch connected to the storage transistor and a second branch connected to the mirror transistor; and an output node to output a signal from the first branch of the cross-coupled inverter circuit, the signal based on a comparison between the first voltage stored in the storage transistor and the second voltage across the mirror transistor. | 12-15-2011 |
20110305064 | INTERFACE CONTROL FOR IMPROVED SWITCHING IN RRAM - A memory device has a crossbar array including a first array of first electrodes extending along a first direction. A second array of second electrodes extends along a second direction. A non-crystalline silicon structure provided between the first electrode and the second electrode at an intersection defined by the first array and the second array. The non-crystalline silicon structure has a first layer having a first defect density and a second layer having a second defect density different from the first defect density. Each intersection of the first array and the second array defines a two-terminal memory cell. | 12-15-2011 |
20110305065 | NON-VOLATILE VARIABLE CAPACITIVE DEVICE INCLUDING RESISTIVE MEMORY CELL - A non-volatile variable capacitive device includes a capacitor defined over a substrate, the capacitor having an upper electrode and a resistive memory cell having a first electrode, a second electrode, and a switching layer provided between the first and second electrodes. The resistive memory cell is configured to be placed in a plurality of resistive states according to an electrical signal received. The upper electrode of the capacitive device is coupled to the second electrode of the resistive memory cell. The resistive memory cell is a two-terminal device. | 12-15-2011 |
20110305066 | WRITE AND ERASE SCHEME FOR RESISTIVE MEMORY DEVICE - A method for programming a two terminal resistive memory device, the method includes applying a bias voltage to a first electrode of a resistive memory cell of the device; measuring a current flowing through the cell; and stopping the applying of the bias voltage if the measured current is equal to or greater than a predetermined value. | 12-15-2011 |
20110305067 | SEMICONDUCTOR MEMORY DEVICE IN WHICH RESISTANCE STATE OF MEMORY CELL IS CONTROLLABLE - According to one embodiment, a semiconductor memory device includes memory cells and sense amplifiers. One end of the memory cell is connected to each of bit lines. The other end of the memory cell is connected to a source line. The sense amplifiers are connected to the bit lines. First writing changes the resistance of the memory cells connected to a first state by a current running from the source line to the bit lines. Second writing changes the resistance of the memory cells to a second state by a current running from the bit lines to the source line on the basis of data retained by the sense amplifiers after the first writing. Before the first writing, data is read from the memory cells, and the read data is retained in the sense amplifiers, and the data retained by the sense amplifiers is overwritten in accordance with write data. | 12-15-2011 |
20110305068 | RESISTANCE RANDOM ACCESS CHANGE MEMORY DEVICE - A resistance random access change memory device includes: a memory cell array in which plural memory cells having current paths with series-connected access transistors and variable resistive elements are two-dimensionally arranged; plural bit lines that connect one ends of the current paths; plural source lines that connect the other ends of the current paths; and plural word lines that control conduction and non-conduction of the access transistors, wherein bit line contacts are shared between two memory cells to which the word lines are adjacently provided, and pairs of memory cells are formed, all of the pairs of memory cells connected to the adjacent two bit lines are connected to the corresponding source lines via individual source line contacts, and the source lines are formed by a wiring layer upper than that of the bit lines with a larger pitch than that of the bit lines. | 12-15-2011 |
20110305069 | NONVOLATILE MEMORY DEVICE USING RESISTANCE MATERIAL AND MEMORY SYSTEM INCLUDING THE NONVOLATILE MEMORY DEVICE - A nonvolatile memory device includes: a memory array including a plurality of memory banks which are arranged in a first direction; a write global bit line and a read global bit line extending in the first direction to be shared by the memory banks; a write circuit connected to the write global bit line and disposed on a first side of the memory array; and a read circuit connected to the read global bit line and disposed on a second side of the memory array opposite the first side of the memory array, wherein each of the memory banks extends in a second direction different from the first direction and comprises a plurality of nonvolatile memory cells, each of the nonvolatile memory cells having a variable resistive element whose resistance value varies according to data stored therein. | 12-15-2011 |
20110305070 | RESISTANCE CONTROL METHOD FOR NONVOLATILE VARIABLE RESISTIVE ELEMENT - A resistance control method for a nonvolatile variable resistive element in a nonvolatile semiconductor memory device is provided. The device includes a memory cell array in which unit memory cells having nonvolatile variable resistive elements and transistors are arranged in a matrix. The memory cells that are targets of a memory operation are selected by first selection lines (word lines), second selection lines (bit lines) and third selection lines (source lines). The method includes steps of selecting one or more first selection lines, selecting a plurality of second selection lines, and applying a compensated voltage in which a change in potential of the third selection lines caused by current flowing into the third selection lines through the second selection lines is compensated in a voltage that is necessary for the memory operation, such that the voltage necessary for the memory operation is applied to all of the selected memory cells. | 12-15-2011 |
20110305071 | CONTINUOUS PROGRAMMING OF NON-VOLATILE MEMORY - A non-volatile storage system connects a signal driver to a first control line that is connected to a first non-volatile storage element, charges the first control line using the signal driver while the signal driver is connected to the first control line, disconnects the signal driver from the first control line while the first control line remains charged from the signal driver, connects the signal driver to a second control line that is connected to a second non-volatile storage element, charges the second control line using the signal driver while the signal driver is connected to the second control line, and disconnects the signal driver from the second control line. Charging the control lines causes the respective non-volatile storage elements to experience a program operation. The disconnecting of the signal driver from the first control line, the connecting the signal driver to the second control line and the charging of the second control line are performed without waiting for the first non-volatile storage element's program operation to complete. | 12-15-2011 |
20110310652 | Variable resistance devices, semiconductor devices including the variable resistance devices, and methods of operating the semiconductor devices - Methods of operating semiconductor devices that include variable resistance devices, the methods including writing first data to a semiconductor device by applying a reset pulse voltage to the variable resistance device so that the variable resistance device is switched from a first resistance state to a second resistance state, and writing second data to the semiconductor device by applying a set pulse voltage to the variable resistance device so that the variable resistance device is switched from the second resistance state to the first resistance state to the second resistance state. The reset pulse voltage is higher than the set pulse voltage, and a resistance in the second resistance state is greater than in the first resistance state | 12-22-2011 |
20110310653 | Memory Cell With Resistance-Switching Layers - A memory device in a 3-D read and write memory includes memory cells. Each memory cell includes a resistance-switching memory element (RSME) in series with a steering element. The RSME has first and second resistance-switching layers on either side of a conductive intermediate layer, and first and second electrodes at either end of the RSME. The first and second resistance-switching layers can both have a bipolar or unipolar switching characteristic. In a set or reset operation of the memory cell, an electric field is applied across the first and second electrodes. An ionic current flows in the resistance-switching layers, contributing to a switching mechanism. An electron flow, which does not contribute to the switching mechanism, is reduced due to scattering by the conductive intermediate layer, to avoid damage to the steering element. Particular materials and combinations of materials for the different layers of the RSME are provided. | 12-22-2011 |
20110310654 | Memory Cell With Resistance-Switching Layers And Lateral Arrangement - A memory device in a 3-D read and write memory includes memory cells. Each memory cell includes a resistance-switching memory element (RSME). The RSME has first and second resistance-switching layers on either side of a conductive intermediate layer, and first and second electrodes at either end of the RSME. The layers can be provided in a lateral arrangement, such as an end-to-end, face-to-face, L-shaped or U-shaped arrangement. In a set or reset operation of the memory cell, an electric field is applied across the first and second electrodes. An ionic current flows in the resistance-switching layers, contributing to a switching mechanism. An electron flow, which does not contribute to the switching mechanism, is reduced due to scattering by the conductive intermediate layer, to avoid damage to the steering element. | 12-22-2011 |
20110310655 | Composition Of Memory Cell With Resistance-Switching Layers - A memory device in a 3-D read and write memory includes memory cells. Each memory cell includes a resistance-switching memory element (RSME) in series with a steering element. The RSME has first and second resistance-switching layers on either side of a conductive intermediate layer, and first and second electrodes at either end of the RSME. The first and second resistance-switching layers can both have a bipolar or unipolar switching characteristic. In a set or reset operation of the memory cell, an ionic current flows in the resistance-switching layers, contributing to a switching mechanism. An electron flow, which does not contribute to the switching mechanism, is reduced due to scattering by the conductive intermediate layer, to avoid damage to the steering element. Particular materials and combinations of materials for the different layers of the RSME are provided. | 12-22-2011 |
20110310656 | Memory Cell With Resistance-Switching Layers Including Breakdown Layer - A memory device in a 3-D read and write memory includes memory cells. Each memory cell includes a resistance-switching memory element (RSME) in series with a steering element. The RSME has a resistance-switching layer, a conductive intermediate layer, and first and second electrodes at either end of the RSME. A breakdown layer is electrically between, and in series with, the second electrode and the intermediate layer. The breakdown layer maintains a resistance of at least about 1-10 MΩ while in a conductive state. In a set or reset operation of the memory cell, an ionic current flows in the resistance-switching layers, contributing to a switching mechanism. An electron flow, which does not contribute to the switching mechanism, is reduced due to scattering by the conductive intermediate layer, to avoid damage to the steering element. Particular materials and combinations of materials for the different layers of the RSME are provided. | 12-22-2011 |
20110310657 | RESISTIVE MEMORY DEVICES INCLUDING SELECTED REFERENCE MEMORY CELLS OPERATING RESPONSIVE TO READ OPERATIONS - A Resistance based Random Access Memory (ReRAM) can include a sense amplifier circuit that includes a first input coupled to a bit line of a reference cell in a first block of the ReRAM responsive to a read operation to a second block. | 12-22-2011 |
20110310658 | Combined Memories In Integrated Circuits - Combined memories in integrated circuits are described, including determining a first requirement for logic blocks, determining a second requirement for memory blocks including a vertical configuration for the memory blocks, and compiling a design for the integrated circuit using the first requirement and the second requirement. The memory blocks may include non-volatile two-terminal cross-point memory arrays. The non-volatile two-terminal cross-point memory arrays can be formed on top of a logic plane. The logic plane can be fabricated in a substrate. The non-volatile two-terminal cross-point memory arrays may be vertically stacked upon one another to form a plurality of memory planes. The memory planes can be portioned into sub-planes. One or more different memory types such as Flash, SRAM, DRAM, and ROM can be emulated by the plurality of memory planes and/or sub-planes. The non-volatile two-terminal cross-point memory arrays can include a plurality of two-terminal memory elements. | 12-22-2011 |
20110317469 | NON-VOLATILE SAMPLER - A non-volatile sampler including a row line for receiving an input signal to be sampled, the row line intersecting a number of column lines, non-volatile storage elements being disposed at intersections between the row line and the column lines; a bias voltage source connected to the column lines, the bias voltage source for selectively applying a bias voltage to at least one of the non-volatile storage elements to cause the at least one of the storage elements to store a sample of the input signal at the instance the bias voltage is applied. | 12-29-2011 |
20110317470 | RECTIFICATION ELEMENT AND METHOD FOR RESISTIVE SWITCHING FOR NON VOLATILE MEMORY DEVICE - A method of suppressing propagation of leakage current in an array of switching devices. The method includes providing a dielectric breakdown element integrally and serially connected to a switching element within each of the switching device. A read voltage (for example) is applied to a selected cell. The propagation of leakage current is suppressed by each of the dielectric breakdown element in unselected cells in the array. The read voltage is sufficient to cause breakdown in the selected cells but insufficient to cause breakdown in the serially connected, unselected cells in a specific embodiment. Methods to fabricate of such devices and to program, to erase and to read the device are provided. | 12-29-2011 |
20110317471 | Nonvolatile stacked nand memory - A memory cell is arranged to enhance the electrical field of the memory element. The memory cell has a metal-oxide memory element, a nonconductive element, and a conductive element. The metal-oxide memory element is in a current path between a first electrode at a first voltage and a second electrode at a second voltage. The nonconductive element is adjacent to the metal-oxide memory element. | 12-29-2011 |
20110317472 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A memory cell array having a 1R structure is composed of nonvolatile variable resistive elements each including a variable resistor formed of a metal oxide film whose resistance changes depending on an oxygen concentration in the film, and first and second electrodes sandwiching the variable resistor. The first electrode and the variable resistor form a rectifier junction through a rectifier junction layer composed of an oxide layer and a layer (oxygen depletion layer) of the metal oxide film having an oxygen concentration lower than a stoichiometric composition. The oxygen moves between the first electrode and the metal oxide film when a voltage is applied, and a thickness of the oxygen depletion layer changes, so that the resistance of the metal oxide film changes and the rectifying properties are provided. A thickness of the oxygen depletion layer is set to allow the variable resistive element to show the sufficient rectifying properties. | 12-29-2011 |
20110317473 | SYSTEM AND METHOD FOR MITIGATING REVERSE BIAS LEAKAGE - The present disclosure includes devices, methods, and systems for programming memory, such as resistance variable memory. One embodiment can include an array of resistance variable memory cells, wherein the resistance variable memory cells are coupled to one or more data lines, a row decoder connected to a first side of the array, a column decoder connected to a second side of the array, wherein the second side is adjacent to the first side, a gap located adjacent to the row decoder and the column decoder, and clamp circuitry configured to control a reverse bias voltage associated with one or more unselected memory cells during a programming operation, wherein the clamp circuitry is located in the gap and is selectively coupled to the one or more data lines. | 12-29-2011 |
20120002457 | SEMICONDUCTOR MEMORY DEVICE AND CONTROL METHOD OF THE SAME - According to one embodiment, a semiconductor memory device includes a plurality of memory cell arrays each includes a plurality of memory cells, the plurality of memory cell arrays being stacked on a semiconductor substrate to form a three-dimensional structure, and a data input/output circuit includes a first address buffer and a second address buffer configured to store a first address and a second address of the plurality of memory cells, and a controller configured to perform control to time-divisionally output the first address and the second address to a first address bus and a second address bus in data input/output. | 01-05-2012 |
20120002458 | RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device includes: a cell array having multiple layers of mats laminated thereon, each of the mats having word lines and bit lines intersecting each other as well as resistance change type memory cells arranged at intersections thereof, each of the mats further having therein a reference cell and a reference bit line connected to the reference cell, the reference cell set to a state of a certain resistance value; a selection circuit configured to select a word line in each mat of the cell array, and select a bit line intersecting a selected word line and the reference bit line at the same time; and a sense amplifier configured to sense data by comparing respective cell currents of a selected memory cell on the selected bit line and the reference cell on the reference bit line. | 01-05-2012 |
20120008366 | RESTIVE MEMORY USING SiGe MATERIAL - A resistive memory device includes a first electrode; a second electrode having a polycrystalline semiconductor layer that includes silicon; a non-crystalline silicon structure provided between the first electrode and the second electrode. The first electrode, second electrode and non-crystalline silicon structure define a two-terminal resistive memory cell. | 01-12-2012 |
20120008367 | RESISTANCE CHANGE TYPE MEMORY - According to one embodiment, a resistance change type memory includes a memory cell and a capacitor which are provided on a semiconductor substrate. The memory cell includes a resistance change type memory and a select transistor. The resistance change type storage element changes in resistance value in accordance with data to be stored. The select transistor includes a first semiconductor region provided in the semiconductor substrate, and a gate electrode facing the side surface of the first semiconductor region via a gate insulating film. The capacitor includes a second semiconductor region provided in the semiconductor substrate, a capacitor electrode facing the side surface of the second semiconductor region, and a first capacitor insulating film provided between the second semiconductor region and the capacitor electrode. | 01-12-2012 |
20120008368 | Semiconductor device having single-ended sensing amplifier - A semiconductor device includes a bit line, a memory cell coupled to the bit line, the memory cell being configured such that a current flowing there the memory cell is varied in accordance with information stored M the memory cell, a first transistor coupled at a control electrode thereof to the bit line, a second transistor coupled to the bit line and supplied at a control electrode thereof with a first control signal, a global bit line, and a third transistor coupled in series with the first sistor between a node and the global bit line, the third transistor supplied at a control electrode thereof with a second control signal. | 01-12-2012 |
20120008369 | MEMORY ELEMENT AND DRIVE METHOD FOR THE SAME, AND MEMORY DEVICE - A memory element capable of increasing capacity with an improvement of distribution of resistance in the high-resistance state, a drive method therefor, and a memory device are provided. The memory element includes first and second electrodes, and a plurality of resistance change elements electrically connected in series between the first and second electrodes, whose resistance values are reversibly changeable in response to application of a voltage to the first and second electrodes, and changeable to the same resistance state relative to the voltage application. | 01-12-2012 |
20120008370 | MEMORY ELEMENT AND MEMORY DEVICE - A memory element and a memory device with improved controllability over resistance change by applied voltage are provided. The memory element includes a first electrode, a memory layer, and a second electrode in this order. The memory layer includes a resistance change layer provided on the first electrode side, and an ion source layer provided on the second electrode side and is higher in resistance value than the resistance change layer. A resistance value of the resistance change layer is changeable in response to a composition change by applied voltage to the first and second electrodes | 01-12-2012 |
20120008371 | SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device includes: a memory cell array having memory cells positioned at respective intersections between a plurality of first wirings and a plurality of second wirings, each of the memory cells having a rectifier element and a variable resistance element connected in series; and a control circuit selectively driving the first and second wirings. The plurality of first wirings that are specified and selectively driven at the same time by one of a plurality of address signals are separately arranged with other first wirings interposed therebetween within the memory cell array when a certain potential difference is applied to a selected memory cell positioned at an intersection between the first and second wirings by the control circuit. | 01-12-2012 |
20120008372 | RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device includes: a memory cell array with memory cells arranged therein, the memory cell having a variable resistance element for storing a rewritable resistance value; a reference cell formed of the same memory cells as those set in a high resistance state in the memory cell array, the reference cell being trimmed with selection of the number of parallel-connected memory cells to have a reference current value used for detecting data in the memory cell array; and a sense amplifier configured to compare a cell current value of a memory cell selected in the memory cell array with the reference current value of the reference cell. | 01-12-2012 |
20120008373 | CAPACITIVE DISCHARGE METHOD FOR WRITING TO NON-VOLATILE MEMORY - A memory system includes a substrate, control circuitry on the substrate, a three dimensional memory array (above the substrate) that includes a plurality of memory cells with reversible resistance-switching elements, and circuits for limiting the SET current for the reversible resistance-switching elements. The circuits for limiting the SET current provide a charge on one or more bit lines that is not sufficient to SET the memory cells, and then discharge the bit lines through the memory cells in order to SET the memory cells. | 01-12-2012 |
20120008374 | Data Storage Using Read-Mask-Write Operation - Method and apparatus for writing data to a storage array, such as but not limited to an STRAM or RRAM memory array, using a read-mask-write operation. In accordance with various embodiments, a first bit pattern stored in a plurality of memory cells is read. A second bit pattern is stored to the plurality of memory cells by applying a mask to selectively write only those cells of said plurality corresponding to different bit values between the first and second bit patterns. | 01-12-2012 |
20120014160 | Non-Volatile Re-Programmable Memory Device - A memory device including a non-volatile re-programmable memory cell is provided. In connection with various example embodiments, the memory cell is a single resistor located between a first and second node. The resistor stores different resistance states corresponding to different resistance values set by SiCr-facilitated migration. The SiCr-facilitated migration occurs in response to energy presented between the first and second nodes. The application of a signal to a first node of the memory cell resistor forces the migration of elements along the memory cell resistor to set the resistance value of the memory cell resistor. The application of a second signal of approximately equal strength to the second node reverses the change and resistance and returns the memory cell to the previous resistance level. In some implementations the resistor is made of SiCr. | 01-19-2012 |
20120014161 | Memristive Negative Differential Resistance Device - A memristive Negative Differential Resistance (NDR) device includes a first electrode adjacent to a memristive matrix, the memristive matrix including an intrinsic semiconducting region and a highly doped secondary region, a Metal-Insulator-Transition (MIT) material in series with the memristive matrix, and a second electrode adjacent to the MIT material. | 01-19-2012 |
20120014162 | SEMICONDUCTOR MEMORY DEVICE FEATURING SELECTIVE DATA STORAGE IN A STACKED MEMORY CELL STRUCTURE - A semiconductor device including: a first memory cell including a non-volatile first variable resistance element that stores data by varying a resistance value and a selection transistor that selects the first variable resistance element; a first memory layer provided with more than one such first memory cell arranged in a plane; a second memory cell including a non-volatile second variable resistance element that stores data by varying a resistance value and a selection diode that selects the second variable resistance element; and a second memory layer provided with more than one such second memory cell arranged in a plane; wherein more than one such second memory layer is stacked over the first memory layer. | 01-19-2012 |
20120014163 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF DRIVING THE SAME - A semiconductor memory device includes a memory cell array where a plurality of memory cells are arranged in a matrix, each of the memory cells serially connecting a two-terminal type memory element and a transistor for selection, a first voltage applying circuit that applies a write voltage pulse to a bit line, and a second voltage applying circuit that applies a precharge voltage to a bit line and a common line. In writing the memory cell, after the second voltage applying circuit has both terminals of the memory cell previously precharged to the same voltage, the first voltage applying circuit applies the write voltage pulse to one terminal of the writing target memory cell via the bit line, and while the write voltage pulse is applied, the second voltage applying circuit maintains the application of the precharge voltage to the other terminal of the memory cell via the common line. | 01-19-2012 |
20120014164 | RESISTANCE-CHANGE MEMORY AND METHOD OF OPERATING THE SAME - According to one embodiment, a resistance-change memory includes a memory element in which its variable resistance state corresponds to data to be stored therein, a pulse generation circuit which generates a first pulse, a second pulse, a third pulse, and a fourth pulse, the first pulse having a first amplitude which changes the resistance state of the memory element from a high- to a low-resistance state, the third pulse having a third amplitude smaller than the first amplitude to read data in the memory element, the fourth pulse having a fourth amplitude between the first amplitude and the third amplitude, and a control circuit which controls the operations of the memory element and the pulse generation circuit. The control circuit supplies the fourth pulse to the memory element after supplying the first pulse to the memory element. | 01-19-2012 |
20120014165 | OPTIMIZED SOLID ELECTROLYTE FOR PROGRAMMABLE METALLIZATION CELL DEVICES AND STRUCTURES - A microelectronic programmable structure suitable for storing information and array including the structure and methods of forming and programming the structure are disclosed. The programmable structure generally includes an ion conductor and a plurality of electrodes. Electrical properties of the structure may be altered by applying energy to the structure, and thus information may be stored using the structure. | 01-19-2012 |
20120014166 | RESISTIVE MEMORY - The present disclosure includes resistive memory devices and systems having resistive memory cells, as well as methods for operating the resistive memory cells. One memory device embodiment includes at least one resistive memory element, a programming circuit, and a sensing circuit. For example, the programming circuit can include a switch configured to select one of N programming currents for programming the at least one resistive memory element, where each of the N programming currents has a unique combination of current direction and magnitude, with N corresponding to the number of resistance states of the at least one memory element. In one or more embodiments, the sensing circuit can be arranged for sensing of the N resistance states. | 01-19-2012 |
20120014167 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprising: a memory cell array in which memory cells each containing a variable resistive element and a rectifier element connected in series are arranged at intersections of a plurality of first wirings and a plurality of second wirings; and a control circuit for selectively driving said first wirings and said second wirings; wherein said control circuit applies a first voltage to said selected first wiring, and changes said first voltage based on the position of said selected memory cell within said memory cell array to apply a second voltage to said selected second wiring, so that a predetermined potential difference is applied to a selected memory cell arranged at the intersection between said selected first wiring and said selected second wiring. | 01-19-2012 |
20120014168 | Dual Stage Sensing for Non-Volatile Memory - A method and apparatus for accessing a non-volatile memory cell. In some embodiments, a memory block provides a plurality of memory cells arranged into rows and columns. A read circuit is configured to read a selected row of the memory block by concurrently applying a control voltage to each memory cell along the selected row and, for each column, using a respective local sense amplifier and a column sense amplifier to successively differentiate a voltage across the associated memory cell in said column to output a programmed content of the row. | 01-19-2012 |
20120014169 | NON-VOLATILE DATA-STORAGE LATCH - One embodiments of the present invention is directed to a single-bit memory cell comprising transistor-based bit latch having a data state and a memristor, coupled to the transistor-based bit latch, in which the data state of the transistor-based bit latch is stored by a store operation and from which a previously-stored data state is retrieved and restored into the transistor-based bit latch by a restore operation. Another embodiment of the present invention is directed to a single-bit memory cell comprising a master-slave flip flop and a slave flip flop, and a power input, a memristor, a memory-cell power input, a first memory-cell clock input, a second memory-cell clock input, a memory-cell data input, a memory-cell data output, and two or more memory-cell control inputs. | 01-19-2012 |
20120020140 | RESISTIVE MEMORY CELL AND OPERATION THEREOF, AND RESISTIVE MEMORY AND OPERATION AND FABRICATION THEREOF - A resistive memory cell is described, including a first electrode, a high-resistance ferroelectric material layer and a second electrode. The ferroelectric material layer has a first interface with the first electrode and has a second interface with the second electrode, wherein the second interface is not parallel with the first interface. A method of operating the resistive memory cell is also described, including applying between the first electrode and the second electrode a series of voltages, which has positive polarity and negative polarity alternately and has descending absolute values, to form in the ferroelectric material layer at least one domain wall with low resistance. | 01-26-2012 |
20120020141 | Variable-resistance memory device and its driving method - A variable-resistance memory device includes: a memory cell including a memory element being variable in resistance in accordance with a polarity of an application voltage applied to the memory element in a set or reset operation and an access transistor connected to the memory element in series between first and second common lines; and a driving circuit including a first path transistor connected between a first supply line for supplying a first voltage and the first common line as well as a second path transistor connected between a second supply line for supplying a second voltage and the first common line. | 01-26-2012 |
20120020142 | RESISTIVE MEMORY - Provided is a semiconductor resistive memory device. The resistive memory device includes a plurality of unit cells. A source line and a data input/output line of the unit cells may be selectively connected to have a substantially same voltage level for equalization when the unit cells are in inactive or unselected state. The equalization may decrease current consumption and protect write error, and protect leakage current. | 01-26-2012 |
20120020143 | Array Operation Using A Schottky Diode As A Non Ohmic Selection Device - A two-terminal memory cell including a Schottky metal-semiconductor contact as a selection device (SD) allows selection of two-terminal cross-point memory array operating voltages that eliminate “half-select leakage current” problems present when other types of non-ohmic devices are used. The SD structure can comprise a “metal/oxide semiconductor/metal” or a “metal/lightly-doped single layer polycrystalline silicon.” The memory cell can include a two-terminal memory element including at least one conductive oxide layer (e.g., a conductive metal oxide—CMO, such as a perovskite or a conductive binary oxide) and an electronically insulating layer (e.g., yttria-stabilized zirconia—YSZ) in contact with the CMO. The SD can be included in the memory cell and configured electrically in series with the memory element. The memory cell can be positioned in a two-terminal cross-point array between a pair of conductive array lines (e.g., a bit line and a word line) across which voltages for data operations are applied. | 01-26-2012 |
20120026776 | MEMORY RESISTOR HAVING PLURAL DIFFERENT ACTIVE MATERIALS - Methods and means related to memory resistors are provided. A memristor includes at least two different active materials disposed between a pair of electrodes. The active materials are selected to exhibit respective and opposite changes in electrical resistance in response to changes in oxygen ion content. The active materials are subject to oxygen ion reconfiguration under the influence of an applied electric field. An electrical resistance of the memristor is thus adjustable by way of applied programming voltages and is non-volatile between programming events. | 02-02-2012 |
20120026777 | Variable-resistance memory device - Disclosed herein is a variable-resistance memory device including: a memory-cell array employing a plurality of memory cells each including a storage element having a resistance varying in accordance with the direction of a voltage applied to the storage element and including an access transistor connected in series to the storage element between a bit line and a source line; and a voltage supplying circuit for setting a read voltage used for reading out the resistance of the storage element on a selected bit line connected to the memory cell serving as a read object in an operation to supply the read voltage to the selected bit line. | 02-02-2012 |
20120026778 | SEMICONDUCTOR STORAGE DEVICE - A semiconductor memory device includes: a memory cell array including multiple first lines, multiple second lines crossing the first lines, and memory cells arranged at intersections between the first lines and the second lines and including variable resistive elements; and a control circuit which controls resistance values of the variable resistive elements in a way that a cell voltage is applied to the memory cell arranged at an intersection between a selected first line and a selected second line by applying first and second voltages to the selected first and second lines, respectively. The control circuit applies a voltage gradually raised or lowered from a first initial voltage as the first voltage to the selected first line, and a pulsing voltage as the second voltage to the selected second line. The second voltage includes a voltage pulse which is raised from a second initial voltage to turn the memory cell into a non-selected state to a voltage to turn the memory cell into a selected state, is kept at the raised voltage to thereby cause a cell current to flow into the memory cell, and is lowered to the second initial voltage when the cell current that increases while the voltage of the memory cell is rising with a change in the first voltage reaches a predetermined compliance current. | 02-02-2012 |
20120026779 | NONVOLATILE MEMORIES AND RECONFIGURABLE CIRCUITS - A nonvolatile memory according to an embodiment includes at least one memory cell including: a variable resistance memory comprising one end connected to a first terminal, and the other end connected to a second terminal, a drive voltage being applied to the first terminal; and a diode comprising a cathode connected to the second terminal, and an anode connected to a third terminal, a ground potential being applied to the third terminal. An output of the memory cell is output from the second terminal, the output of the memory cell depends on a resistance state of the variable resistance memory. | 02-02-2012 |
20120026780 | Conductive Metal Oxide Structures In Non Volatile Re Writable Memory Devices - A memory cell including a memory element comprising an electrolytic insulator in contact with a conductive metal oxide (CMO) is disclosed. The CMO includes a crystalline structure and can comprise a pyrochlore oxide, a conductive binary oxide, a multiple B-site perovskite, and a Ruddlesden-Popper structure. The CMO includes mobile ions that can be transported to/from the electrolytic insulator in response to an electric field of appropriate magnitude and direction generated by a write voltage applied across the electrolytic insulator and CMO. The memory cell can include a non-ohmic device (NOD) that is electrically in series with the memory element. The memory cell can be positioned between a cross-point of conductive array lines in a two-terminal cross-point memory array in a single layer of memory or multiple vertically stacked layers of memory that are fabricated over a substrate that includes active circuitry for data operations on the array layer(s). | 02-02-2012 |
20120026781 | RESISTIVE MEMORY AND METHOD - A memory device includes a multi gate field effect transistor (MuGFET) having a fin with a contact area. A programmable memory element abuts the fin contact area. | 02-02-2012 |
20120033479 | MODIFICATION OF LOGIC BY MORPHOLOGICAL MANIPULATION OF A SEMICONDUCTOR RESISTIVE ELEMENT - An electronic device includes a substrate with a resistive element located thereover. The resistive element includes a semiconductor region. A read module is configured to determine a resistance of the resistive element. A programming module is configured to cause a current to flow through the semiconductor region. The current is sufficient to induce a change of morphology of at least a portion of the semiconductor region. | 02-09-2012 |
20120033480 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device according to the embodiment comprises a memory cell array including first line, second line crossing the first line, and memory cell containing variable resistance element provided on the intersection of the first and second lines; a data write unit operative to cause the variable resistance element to make a transition from a first resistance to a second resistance different from the first resistance; and a resistance state detection unit including an abnormality detection circuit operative to detect a transition of the resistance of the variable resistance element to a third resistance when the data write unit causes the variable resistance element to make the transition from the first resistance to the second resistance (where the third resistancethe first resistance>the second resistance). | 02-09-2012 |
20120033481 | Memory Element With A Reactive Metal Layer - A memory cell including conductive oxide electrodes is disclosed. The memory cell includes a memory element operative to store data as a plurality of resistive states. The memory element includes a layer of a conductive metal oxide (CMO) (e.g., a perovskite) in contact with an electrode that may comprise one or more layers of material. At least one of those layers of material can be a conductive oxide (e.g., a perovskite such as LaSrCoO | 02-09-2012 |
20120033482 | Bit Set Modes for a Resistive Sense Memory Cell Array - Various embodiments of the present invention are generally directed to a method and apparatus for providing different bit set modes for a resistive sense memory (RSM) array, such as a spin-torque transfer random access memory (STRAM) or resistive random access memory (RRAM) array. In accordance with some embodiments, a group of RSM cells in a non-volatile semiconductor memory array is identified for application of a bit set operation. A bit set value is selected from a plurality of bit set values each separately writable to the RSM cells to place said cells in a selected resistive state. The selected bit set value is thereafter written to at least a portion of the RSM cells in the identified group. | 02-09-2012 |
20120039109 | Memory Cells, Non-Volatile Memory Arrays, Methods Of Operating Memory Cells, Methods Of Reading To And Writing From A Memory Cell, And Methods Of Programming A Memory Cell - In one aspect, a method of operating a memory cell includes using different electrodes to change a programmed state of the memory cell than are used to read the programmed state of the memory cell. In one aspect, a memory cell includes first and second opposing electrodes having material received there-between. The material has first and second lateral regions of different composition relative one another. One of the first and second lateral regions is received along one of two laterally opposing edges of the material. Another of the first and second lateral regions is received along the other of said two laterally opposing edges of the material. At least one of the first and second lateral regions is capable of being repeatedly programmed to at least two different resistance states. Other aspects and implementations are disclosed. | 02-16-2012 |
20120039110 | SEMICONDUCTOR MEMORY DEVICE - A memory-cell array that includes a first line, a second line intersecting the first line, and a memory cell including a variable resistive element provided in the intersection of the first and the second lines; a data-write unit configured to apply a voltage pulse to the memory cell through the first and the second lines, the voltage pulse to set and/or reset data; and a detector unit configured to compare a cell current that flows through the memory cell by the voltage pulse at the time of setting and/or resetting the data with a reference current generated from the initial value of the cell current, and to control the data-write unit in accordance with a result of comparison. | 02-16-2012 |
20120039111 | POLARITY DEPENDENT SWITCH FOR RESISTIVE SENSE MEMORY - A memory unit includes a resistive sense memory cell configured to switch between a high resistance state and a low resistance state upon passing a current through the resistive sense memory cell and a semiconductor transistor in electrical connection with the resistive sense memory cell. The semiconductor transistor includes a gate element formed on a substrate. The semiconductor transistor includes a source contact and a bit contact. The gate element electrically connects the source contact and the bit contact. The resistive sense memory cell electrically is connected to the bit contact. The source contact is more heavily implanted with dopant material then the bit contact. | 02-16-2012 |
20120039112 | Hierarchical Cross-Point Array of Non-Volatile Memory - A method and apparatus for reading data from a non-volatile memory cell. In some embodiments, a cross-point array of non-volatile memory cells is arranged into rows and columns. A selection circuit is provided that is capable of activating the first block of memory cells while deactivating the second block of memory cells. Further, a read circuit is provided that is capable of reading a logical state of a predetermined memory cell in the first block of memory cells with a reduced leak current by programming a first resistive state to the block selection elements corresponding to the first block of memory cells while programming a second resistive state to the block selection elements corresponding to the second block of memory cells. | 02-16-2012 |
20120039113 | THREE DIMENSIONALLY STACKED NON VOLATILE MEMORY UNITS - A memory unit including a first transistor spanning a first transistor region in a first layer of the memory unit; a second transistor spanning a second transistor region in a second layer of the memory unit; a first resistive sense memory (RSM) cell spanning a first memory region in a third layer of the memory unit; and a second RSM cell spanning a second memory region in the third layer of the memory unit, wherein the first transistor is electrically coupled to the first RSM cell, and the second transistor is electrically coupled to the second RSM cell, wherein the second layer is between the first and third layers, wherein the first and second transistor have an transistor overlap region, and wherein the first memory region and the second memory region do not extend beyond the first transistor region and the second transistor region. | 02-16-2012 |
20120044742 | VARIABLE RESISTANCE MEMORY ARRAY ARCHITECTURE - Memory devices, memory arrays, and methods of operation of memory arrays are disclosed. In one such memory device, a parallel selection architecture includes a control element, such as a selection transistor, in parallel with a variable resistance memory cell. Biasing of the selection transistor enables access to the memory cell for reading, programming, and/or erasing. Programming and erasing of the memory cell is accomplished through a change of resistance of the memory cell. | 02-23-2012 |
20120044743 | CIRCUIT AND SYSTEM OF USING A POLYSILICON DIODE AS PROGRAM SELECTOR FOR RESISTIVE DEVICES IN CMOS LOGIC PROCESSES - Polysilicon diodes fabricated in standard CMOS logic technologies can be used as program selectors for a programmable resistive device, such as electrical fuse, contact/via fuse, anti-fuse, or emerging nonvolatile memory such as MRAM, PCM, CBRAM, or RRAM. The diode can be constructed by P+/N+ implants on a polysilicon as a program selector. By applying a high voltage to a resistive element coupled to the P terminal of a diode and switching the N terminal of a diode to a low voltage for proper time, a current flows through a resistive element may change the resistance state. On the polysilicon diode, the spacing and doping level of a gap between the P+ and N+ implants can be controlled for different breakdown voltages and leakage currents. The Silicide Block Layer (SBL) can be used to block silicide formation on the top of polysilicon to prevent shorting. If the resistive element is a polysilicon electrical fuse, the fuse element can be merged with the polysilicon diode in one piece to save area. | 02-23-2012 |
20120044744 | PROGRAMMABLY REVERSIBLE RESISTIVE DEVICE CELLS USING POLYSILICON DIODES - Polysilicon diodes fabricated in standard CMOS logic processes can be used as program selectors for reversible resistive devices such as PCRAM, RRAM, CBRAM, or other memory cells. The reversible resistive devices have a reversible resistive element coupled to a diode. The diode can be constructed by P+/N+ implants on a polysilicon as a program selector. By applying a voltage or a current between a reversible resistive element and the N-terminal of a diode, the reversible resistive device can be programmed into different states based on magnitude, duration, voltage-limit, or current-limit in a reversible manner. On the polysilicon diode, the spacing and doping level of a gap between the P- and N-implants can be controlled for different breakdown voltages and leakage currents. The Silicide Block Layer (SBL) can be used to block silicide formation on the top of polysilicon to prevent shorting. | 02-23-2012 |
20120044745 | REVERSIBLE RESISTIVE MEMORY USING POLYSILICON DIODES AS PROGRAM SELECTORS - Embodiments of reversible resistive memory cells using polysilicon diodes are disclosed. The programmable resistive devices can be fabricated using standard CMOS logic processes to reduce cell size and cost. In one embodiment, polysilicon diodes can be used as program selectors for reversible resistive memory cells that can be programmed based on magnitude, duration, voltage-limit, or current-limit of a supply voltage or current. These cells are PCRAM, RRAM, CBRAM, or other memory cells that have a reversible resistive element coupled to a polysilicon diode. The polysilicon diode can be constructed by P+/N+ implants on a polysilicon substrate as a program selector. The memory cells can be used to construct a two-dimensional memory array with the N-terminals of the diodes in a row connected as a wordline and the reversible resistive elements in a column connected as a bitline. By applying a voltage or a current to a selected bitline and to a selected wordline to turn on the diode, a selected cell can be programmed into different states reversibly based on magnitude, duration, voltage-limit, or current-limit. The data in the reversible resistive memory can also be read by turning on a selected wordline to couple a selected bitline to a sense amplifier. The wordlines may have high-resistivity local wordlines coupled to low-resistivity global wordlines through conductive contact(s) or via(s). | 02-23-2012 |
20120044746 | CIRCUIT AND SYSTEM OF USING A JUNCTION DIODE AS PROGRAM SELECTOR FOR RESISTIVE DEVICES - Junction diodes fabricated in standard CMOS logic technologies can be used as program selectors for a programmable resistive device, such as electrical fuse, contact/via fuse, anti-fuse, or emerging nonvolatile memory such as MRAM, PCM, CBRAM, or RRAM. The diode can be constructed by P+ and N+ active regions on an N well as the P and N terminals of the diode. By applying a high voltage to the P terminal of a diode and switching the N terminal of a diode to a low voltage for proper duration of time, a current flows through a resistive element in series with the program selector may change the resistance state. The P+ active region of the diode can be isolated from the N+ active region in the N well by using dummy MOS gate, SBL, or STI isolations. If the resistive element is an interconnect fuse based on CMOS gate material, the resistive element can be coupled to the P+ active region by an abutted contact such that the element, active region, and metal can be connected in a single rectangular contact. | 02-23-2012 |
20120044747 | REVERSIBLE RESISTIVE MEMORY USING DIODES FORMED IN CMOS PROCESSES AS PROGRAM SELECTORS - Junction diodes fabricated in standard CMOS logic processes can be used as program selectors for reversible resistive memory cells that can be programmed based on magnitude, duration, voltage-limit, or current-limit of a supply voltage or current. These cells are PCM, RRAM, CBRAM, or other memory cells that have a reversible resistive element coupled to a diode. The diode can be constructed by P+ and N+ active regions on an N well as the P and N terminals of the diode. The memory cells can be used to construct a two-dimensional memory array with the N terminals of the diodes in a row connected as a wordline and the reversible resistive elements in a column connected as a bitline. By applying a voltage or a current to a selected bitline and to a selected wordline to turn on the diode, a selected cell can be programmed into different states reversibly based on magnitude, duration, voltage-limit, or current-limit. The data in the reversible resistive memory can also be read by turning on a selected wordline to couple a selected bitline to a sense amplifier. The wordlines may have high-resistivity local wordlines coupled to low-resistive global wordlines through conductive contact(s) or via(s). | 02-23-2012 |
20120044748 | Sensing Circuit For Programmable Resistive Device Using Diode as Program Selector - A sensing circuit for programmable resistive device using diode as program selector is disclosed. The sensing circuit can have a reference and a sensing branch. In one embodiment, each branch can have a first type of MOS with the source coupled to a first supply voltage, the drain coupled to the drain of a second type of MOS, which can have the gate coupled to a bias supply voltage. The sources of the second type of MOS in the reference and sensing branches can be coupled to a reference resistor and a programmable resistance element, respectively, and they are further coupled to a second supply voltage through their diodes. The gate of the first type of MOS in the sensing branch can be coupled to the gate of the first type of MOS in the reference branch, which can have the drain coupled to the gate. The resistance difference between the reference resistor and the programmable resistive element can be sensed through the drain of the first type of MOS in the sensing branch into a logic level. | 02-23-2012 |
20120044749 | VARIABLE RESISTANCE NONVOLATILE STORAGE DEVICE AND METHOD OF FORMING MEMORY CELL - A variable resistance nonvolatile storage device which includes (i) a semiconductor substrate ( | 02-23-2012 |
20120044750 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a cell array having a plurality of first wirings and a plurality of second wirings intersecting each other and memory cells disposed at intersections between the plurality of first wirings and the plurality of second wirings. The semiconductor memory device further includes a control circuit for selectively driving the plurality of first wirings and the plurality of second wirings. The control circuit applies a first voltage for a first operation to a first select wiring and applies a second voltage for a second operation different from the first operation to a second select wiring and applies a third voltage for the first and second operation to a third select wiring. The first operation is completed before the second operation is completed. The control circuit applies a fourth voltage for a third operation to a forth select wiring before the second operation is completed. | 02-23-2012 |
20120044751 | BIPOLAR RESISTIVE-SWITCHING MEMORY WITH A SINGLE DIODE PER MEMORY CELL - According to various embodiments, a resistive-switching memory element and memory element array that uses a bipolar switching includes a select element comprising only a single diode that is not a Zener diode. The resistive-switching memory elements described herein can switch even when a switching voltage less than the breakdown voltage of the diode is applied in the reverse-bias direction of the diode. The memory elements are able to switch during the very brief period when a transient pulse voltage is visible to the memory element, and therefore can use a single diode per memory cell. | 02-23-2012 |
20120057390 | MEMORY ARRAY WITH WRITE FEEDBACK - A memory array with write feedback includes a number of row lines intersecting a number of column lines, a memory element connected between one of the row lines and one of the column lines, an electrical condition supply to be selectively applied to one of the row lines; and a feedback control loop to control an electrical condition supplied by the electrical condition supply. A method for setting the state of a memory element within a memory array includes applying an electrical condition to the memory element within the memory array, sensing a resistive state of the memory element, and controlling the electrical condition based on the sensed resistive state to cause the memory element to reach a target resistance. | 03-08-2012 |
20120057391 | Memory Cells, Memory Cell Programming Methods, Memory Cell Reading Methods, Memory Cell Operating Methods, and Memory Devices - Embodiments disclosed include memory cell operating methods, memory cell programming methods, memory cell reading methods, memory cells, and memory devices. In one embodiment, a memory cell includes a wordline, a first bitline, a second bitline, and a memory element. The memory element is electrically connected to the wordline and selectively electrically connected to the first bitline and the second bitline. The memory element stores information via a resistive state of the memory element. The memory cell is configured to convey the resistive state of the memory element via either a first current flowing from the first bitline through the memory element to the wordline or a second current flowing from the wordline through the memory element to the second bitline. | 03-08-2012 |
20120057392 | High Density Non-Volatile Information StorageHigh Density Non-Volatile information Storage - The present invention provides for a composition comprising a nanostructure comprising a semiconductor component and a metallic component, with the proviso that when the semiconductor component is Ge the metallic component is not Te. The nanostructure can be in one of two types of structures: (1) a segregated structure, and (2) a mixed structure. In the segregated structure, the semiconductor component and the metallic component are spatially separate, such as in a lobe-lobe structure, poly-lobe structure, or a core-shell structure. In some embodiments, the lobe-lobe structure comprises a metallic component lobe and a semiconductor component lobe. The composition can be used in a memory device. | 03-08-2012 |
20120057393 | Reading A Phase Change Memory - A phase change memory cell may be read by driving a current through the cell higher than its threshold current. A voltage derived from the selected column may be utilized to read a selected bit of a phase change memory. The read window or margin may be improved in some embodiments. A refresh cycle may be included at periodic intervals. | 03-08-2012 |
20120057394 | Securing Non Volatile Data In An Embedded Memory Device - The various embodiments of the invention relate generally to semiconductors and memory technology. More specifically, the various embodiment and examples of the invention relate to memory devices, systems, and methods that protect data stored in one or more memory devices from unauthorized access. The memory device may include third dimension memory that is positioned on top of a logic layer that includes active circuitry in communication with the third dimension memory. The third dimension memory may include multiple layers of memory that are vertically stacked upon each other. Each layer of memory may include a plurality of two-terminal memory elements and the two-terminal memory elements can be arranged in a two-terminal cross-point array configuration. At least a portion of one or more of the multiple layers of memory may include an obfuscation layer configured to conceal data stored in one or more of the multiple layers of memory. | 03-08-2012 |
20120063192 | THREE-DEVICE NON-VOLATILE MEMORY CELL - A three-device non-volatile memory cell includes a first resistive device, a second resistive device connected to the first resistive device in a mutual complementary manner, and a third resistive device connected to both said first resistive device and said second resistive device in a mutual complementary manner. A memory array includes a set of read lines intersecting a set of bit lines, a set of program lines intersecting said bit lines, memory cells disposed at intersections between the intersecting set of bit lines. Each of the memory cells includes a program resistive device connected to one of the program lines, a read resistive device connected to one of the read lines, and a bit resistive device connected to one of the bit lines and connected to the program device and the read device in a mutual complementary manner. | 03-15-2012 |
20120063193 | MULTI-LEVEL RESISTANCE CHANGE MEMORY - According to one embodiment, a multi-level resistance change memory includes a memory cell includes first and second resistance change films connected in series, and a capacitor connected in parallel to the first resistance change film, a voltage pulse generating circuit generating a first voltage pulse with a first pulse width to divide a voltage of the first voltage pulse into the first and second resistance change films based on a resistance ratio thereof, and generating a second voltage pulse with a second pulse width shorter than the first pulse width to apply a voltage of the second voltage pulse to the second resistance change film by a transient response of the capacitor, and a control circuit which is stored multi-level data to the memory cell by using the first and second voltage pulses in a writing. | 03-15-2012 |
20120063194 | SEMICONDUCTOR MEMORY DEVICE HAVING STACKED STRUCTURE INCLUDING RESISTOR-SWITCHED BASED LOGIC CIRCUIT AND METHOD OF MANUFACTURING THE SAME - Semiconductor memory device having a stacking structure including resistor switch based logic circuits. The semiconductor memory device includes a first conductive line that includes a first line portion and a second line portion, wherein the first line portion and the second line portion are electrically separated from each other by an intermediate region disposed between the first and second line portions, a first variable resistance material film that is connected to the first line portion and stores data, and a second variable resistance material film that controls an electrical connection between the first line portion and the second line portion. | 03-15-2012 |
20120063195 | Reconfigurable Multi-level Sensing Scheme for Semiconductor Memories - A method for sensing at least one parameter indicative of a logical state of a multi-level memory cell includes the steps of: measuring the parameter of the multi-level memory cell; comparing the measured parameter of the multi-level memory cell with a prescribed reference signal, the reference signal having a value which varies as a function of time; and storing a time value corresponding to a point in time at which the reference signal is substantially equal to the measured parameter of the multi-level memory cell, the stored time value being indicative of a sensed logical state of the multi-level memory cell. | 03-15-2012 |
20120063196 | RESISTIVE MEMORY DEVICE AND METHOD OF CONTROLLING REFRESH OPERATION OF RESISTIVE MEMORY DEVICE - A resistive memory device comprises a memory cell array comprising a plurality of memory units. The memory device performs a refresh read operation to check a condition of each of the memory units. Then, it determines whether to refresh each memory unit based on data read by performing the refresh read operation, and refreshes the memory unit according to a result of the determination. The refresh read operation uses a reference resistance with a smaller margin from a resistance distribution than a normal read operation. | 03-15-2012 |
20120063197 | SWITCHABLE JUNCTION WITH AN INTRINSIC DIODE FORMED WITH A VOLTAGE DEPENDENT RESISTOR - A switchable junction ( | 03-15-2012 |
20120063198 | Methods Of Forming Memory Cells And Methods Of Forming Programmed Memory Cells - In some embodiments, a memory cell includes a transistor gate spaced from a channel region by gate dielectric; a source region on one side of the channel region; and a drain region on an opposing side of the channel region from the source region. The channel region has phase change material adjacent the drain region. In some embodiments, the phase change material may be adjacent both the source region and the drain region. Some embodiments include methods of programming a memory cell that has phase change material adjacent a drain region. An inversion layer is formed within the channel region adjacent the gate dielectric, with the inversion layer having a pinch-off region within the phase change material adjacent the drain region. Hot carriers (for instance, electrons) within the pinch-off region are utilized to change a phase within the phase change material. | 03-15-2012 |
20120063199 | SEMICONDUCTOR DEVICE - A semiconductor device having a nonvolatile variable resistor, includes: a resistance value conversion circuit unit configured to convert a resistance value of the nonvolatile variable resistor into a potential or a current and which outputs the converted potential or current; a comparison circuit unit configured to compare the output from the resistance value conversion circuit unit and a potential or current at a node of a portion within the semiconductor device; and a resistance value changing circuit unit configured to change the resistance value of the nonvolatile variable resistor based on the comparison results from the comparison circuit unit. | 03-15-2012 |
20120063200 | Dual Ported Non Volatile FIFO With Third Dimension Memory - A FIFO with data storage implemented with non-volatile third dimension memory cells is disclosed. The non-volatile third dimension memory cells can be fabricated BEOL on top of a substrate that includes FEOL fabricated active circuitry configured for data operations on the BEOL memory cells. Other components of the FIFO that require non-volatile data storage can also be implemented as registers or the like using the BEOL non-volatile third dimension memory cells so that power to the FIFO can be cycled and data is retained. The BEOL non-volatile third dimension memory cells can be configured in a single layer of memory or in multiple layers of memory. An IC that includes the FIFO can also include one or more other memory types that are emulated using the BEOL non-volatile third dimension memory cells and associated FEOL circuitry configured for data operations on those memory cells. | 03-15-2012 |
20120063201 | NONVOLATILE MEMORY ELEMENT, PRODUCTION METHOD THEREFOR, DESIGN SUPPORT METHOD THEREFOR, AND NONVOLATILE MEMORY DEVICE - A nonvolatile memory element which can be initialized at low voltage includes a variable resistance layer ( | 03-15-2012 |
20120069624 | REACTIVE METAL IMPLATED OXIDE BASED MEMORY - Methods, devices, and systems associated with oxide based memory can include a method of forming an oxide based memory cell. Forming an oxide based memory cell can include forming a first conductive element, forming an oxide over the first conductive element, implanting a reactive metal into the oxide, and forming a second conductive element over the oxide. | 03-22-2012 |
20120069625 | RESISTANCE CHANGE ELEMENT AND RESISTANCE CHANGE MEMORY - According to one embodiment, a resistance change element includes a first film provided on a first electrode side, a second film provided on a second electrode side, a barrier film sandwiched between the first film and the second film, and metal impurities added in the first or second film, the metal impurities migrating between the first and second films bi-directionally according to a direction of a first electric field generated between the first and second electrodes. The resistance change element has a first resistance state when the metal impurities are present in the first film, and the resistance change element has a second resistance state different from the first resistance state when the metal impurities are present in the second film. | 03-22-2012 |
20120069626 | SEMICONDUCTOR MEMORY DEVICE - The invention provides a semiconductor memory device including a variable resistance element capable of decreasing a variation of a resistance value of stored data due to a large number of times of switching operations and capable of performing a stable writing operation. The device has a circuit that applies a reforming voltage pulse to a memory cell including a variable resistance element of a degraded switching characteristic and a small read margin due to a large number of times of application of a write voltage pulse, to return each resistance state of the variable resistance element to an initial resistance state. By applying the reforming voltage pulse, the variable resistance element can recover at least one resistance state from a variation from the initial resistance state, and can recover the switching characteristic. Accordingly, there is obtained a semiconductor memory device in which a reduction of a read margin is suppressed. | 03-22-2012 |
20120069627 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes: a memory cell array including plural first lines, plural second lines, and plural memory cells each including a variable resistance element; a first decoder connected to at least one ends of the plurality of first lines and configured to select at least one of the first lines; at least one pair of second decoders connected to both ends of the plurality of second lines and configured such that one of the pair of second decoders is selected for selecting the second lines according to a distance between the one of the first lines selected by the first decoder and the both ends of the second lines; and a voltage application circuit configured to apply a certain voltage between the first line and the second line selected by the first decoder and the second decoder. | 03-22-2012 |
20120069628 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF CONTROLLING THE SAME - According to one embodiment, a nonvolatile semiconductor memory device comprises a memory cell which includes a variable resistance element and a current-limiting element that has a nonlinear current-voltage characteristic and a driver which changes the resistance of the variable resistance element by causing a first current to flow in the memory cell. In addition, the nonvolatile semiconductor memory device further comprises a detection module which detects a change in the resistance of the memory cell based on the magnitude of the first current and a current supplying module which causes a second current to flow in the detection module in place of the first current. | 03-22-2012 |
20120069629 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes a first reference cell being arranged in a first cell array, and a plurality of first fuse cells being arranged in the first cell array. The first reference cell and the plurality of first fuse cells are arranged on the same row or column. | 03-22-2012 |
20120069630 | WRITE VERIFY METHOD FOR RESISTIVE RANDOM ACCESS MEMORY - Write verify methods for resistance random access memory (RRAM) are provided. The methods include applying a reset operation voltage pulse across a RRAM cell to change a resistance of the RRAM cell from a low resistance state to a high resistance state and applying a forward resetting voltage pulse across the RRAM cell if the RRAM cell has a high resistance state resistance value less than a selected lower resistance limit value. The method also includes applying a reverse resetting voltage pulse across the RRAM cell if the RRAM cell has a high resistance state resistance values is greater than a selected upper resistance limit value. The reverse resetting voltage pulse has a second polarity being opposite the first polarity. | 03-22-2012 |
20120069631 | MEMORY ELEMENT AND MEMORY DEVICE - A memory device of a resistance variation type, in which data retaining characteristic at the time of writing is improved, is provided. The memory device includes: a plurality of memory elements in which a memory layer is provided between a first electrode and a second electrode so that data is written or erased in accordance with a variation in electrical characteristics of the memory layer; and pulse applying means applying a voltage pulse or a current pulse selectively to the plurality of memory elements. The memory layer includes an ion source layer including an ionic-conduction material and at least one kind of metallic element, and the ion source layer further contains oxygen. | 03-22-2012 |
20120069632 | CURRENT CONTROL, MEMORY ELEMENT, MEMORY DEVICE, AND PRODUCTION METHOD FOR CURRENT CONTROL ELEMENT - Provided is a current steering element that can prevent write didturb even when an electrical pulse with different polarities is applied and that can cause a large current to flow through a variable resistance element. The current steering element includes a first electrode ( | 03-22-2012 |
20120069633 | NONVOLATILE STORAGE DEVICE AND METHOD FOR WRITING INTO THE SAME - The nonvolatile storage device includes a variable resistance element ( | 03-22-2012 |
20120075906 | Resistance Based Memory Having Two-Diode Access Device - A resistance-based memory has a two-diode access device. In a particular embodiment, a method includes biasing a bit line and a sense line to generate a current through a resistance-based memory element via a first diode or a second diode. A cathode of the first diode is coupled to the bit line and an anode of the second diode is coupled to the sense line. | 03-29-2012 |
20120075907 | RESISTOR STRUCTURE FOR A NON-VOLATILE MEMORY DEVICE AND METHOD - A non-volatile resistive switching memory device. The device includes a first electrode, a second electrode, a switching material in direct contact with a metal region of the second electrode, and a resistive material disposed between the second electrode and the switching material. The resistive material has an ohmic characteristic and a resistance substantially the same as an on state resistance of the switching device. The resistive material allows for a change in a resistance of the switching material upon application of voltage pulse without time delay and free of a reverse bias after the voltage pulse. The first voltage pulse causes a programming current to flow from the second electrode to the first electrode. The resistive material further causes the programming current to be no greater than a predetermined value. | 03-29-2012 |
20120075908 | Resistive Random Access Memory and Verifying Method Thereof - A resistive random access memory (RRAM) and a verifying method thereof are provided. The RRAM comprises at least one resistive memory cell. The resistive memory cell comprises a resistive memory element and a transistor, wherein one terminal of the resistive memory element is coupled to a first terminal of the transistor. The verifying method comprises the following steps: Whether the resistive memory cell passes verification is determined. During a first time period and under the circumstance that the resistive memory cell fails to pass verification, a reference voltage is applied to the other terminal of the resistive memory element and a voltage pulse is applied to a second terminal of the transistor according to a voltage signal to write a reverse voltage to the resistive memory cell. | 03-29-2012 |
20120075909 | SEMICONDUCTOR MEMORY DEVICE - Provided is a semiconductor memory device that is capable of stably programming with desirable controllability to a desired electric resistance state in a random access programming action and is provided with a variable resistance element. Regardless of a resistance state of a variable resistance element of a memory cell that is a target of a writing action (erasing and programming actions), an erasing voltage pulse for bringing the resistance state of the variable resistance element to an erased state having a lowest resistance value is applied. Thereafter, a programming voltage pulse for bringing the resistance state of the variable resistance element to a desired programmed state is applied to the variable resistance element of the programming action target memory cell. By always applying the programming voltage pulse after having applied the erasing voltage pulse, a plurality of programming voltage pulses being sequentially applied can be avoided. | 03-29-2012 |
20120075910 | SEMICONDUCTOR INTEGRATED CIRCUIT - According to one embodiment, a semiconductor integrated circuit includes first and second resistance change type memory element and first and second switches. The first resistance change type memory element includes a first terminal connected to a first power supply and a second terminal connected to a first node. The second resistance change type memory element includes a third terminal connected to the first node and a fourth terminal connected to a second power supply. The first switch includes one end of a first current path connected to a first program power supply and the other end of the first current path connected to the first node. The second switch includes one end of a second current path connected to the first node and the other end of the second current path connected to a second program power supply. | 03-29-2012 |
20120075911 | SEMICONDUCTOR MEMORY DEVICE - Regardless of a resistance state of a variable resistance element of a memory cell that is a target of a writing action (erasing and programming actions), an erasing voltage pulse for bringing the resistance state of the variable resistance element to an erased state having a lowest resistance value is applied. Thereafter, a programming voltage pulse for bringing the resistance state of the variable resistance element to a desired programmed state is applied to the variable resistance element of the programming action target memory cell. By always applying the programming voltage pulse after having applied the erasing voltage pulse, a plurality of programming voltage pulses being sequentially applied can be avoided. Further, the memory cell array is constituted of even-numbers of subbanks, and the application of the erasing voltage pulse in one subbank and the application of the programming voltage pulse in the other subbank are alternately performed. | 03-29-2012 |
20120075912 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a three-dimensional cell array block in which a plurality of cell array layers are stacked, each of the cell array layers including a plurality of first lines, a plurality of second lines configured to intersect the first lines, and a plurality of memory cells disposed at each of intersections of the first and second lines and each including a variable resistance element configured to store an electrically rewritable resistance value as data in a nonvolatile manner, and a reading control circuit for reading data from the memory cells under a condition set in respective groups to which one or more cell array layers having a common electric property of the memory cells belong. | 03-29-2012 |
20120075913 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes: a memory cell array which has a plurality of first lines, a plurality of second lines intersecting the plurality of first lines and a plurality of memory cells which store an electrically rewritable resistance value as data in a non-volatile manner; a first decoder which is connected to one ends of the plurality of first lines and selects the first lines; a second decoder which is connected to the plurality of second lines and selects the second lines; and a voltage applying circuit which is connected to one of the first and second decoders and which applies a predetermined voltage between the first and second lines selected by the first and second decoders. The second decoder sequentially selects the second lines in a direction from the other ends to the one ends of the first lines. | 03-29-2012 |
20120075914 | Low Read Current Architecture For Memory - A low read current architecture for memory. Bit lines of a cross point memory array are allowed to be charged by a selected word line until a minimum voltage differential between a memory state and a reference level is assured. | 03-29-2012 |
20120075915 | SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device includes a memory cell array having memory cells positioned at respective intersections between a plurality of first wirings and a plurality of second wirings, each of the memory cells having a rectifier element and a variable resistance element connected in series, and a control circuit selectively driving the first and second wirings. The control circuit applies a first voltage to the selected first wiring and applies a second voltage to the selected second wiring to apply a certain potential difference to a selected memory cell positioned at a intersection between the selected first and second wirings, and brings at least one of nonselected first wirings into a floating state. | 03-29-2012 |
20120075916 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile-semiconductor-memory-device including a cell array having a plurality of MATs (unit-cell-array) disposed in a matrix, the MATs each include a plurality of first lines, a plurality of second lines crossing the first lines, and memory cells being connected between the first and second lines. The device further includes a first and second drive circuit selecting the first and second lines connected to the memory cells of each MAT that are accessed, and driving the selected first and second lines to write or read data. The memory cells form a page by being connected to each first line selected from the MATs. The device also includes a data latch latching the write or the read data in units of pages, where the first and second drive circuit drive the first and second lines multiple times to write or read data for one page in and out of the cell array. | 03-29-2012 |
20120081944 | CROSSBAR ARRAY MEMORY ELEMENTS AND RELATED READ METHODS - Apparatus and related fabrication and read methods are provided for crossbar memory elements. An exemplary crossbar memory element includes a crossbar array structure including a set of access lines, unswitched resistance elements coupled electrically in series between the set of access lines and a reference voltage node, and switched resistance elements coupled electrically in series between the first set of access lines and the reference voltage node. To read from a selected access line, the switched resistance element associated with that access line is enabled while the remaining switched resistance elements are disabled. | 04-05-2012 |
20120081945 | MEMORY ARRAY WITH GRADED RESISTANCE LINES - A memory array with graded resistance lines includes a first set of lines intersecting a second set of lines. A line from one of the sets of lines includes a graded resistance along a length of the line. | 04-05-2012 |
20120081946 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes a memory cell array for storing user data provided by arranging memory cells each having a variable resistive element having a first electrode, a second electrode, and a variable resistor made of a metal oxide sandwiched between the first and second electrodes. The first and second electrodes are formed of a conductive material forming ohmic junction with the variable resistor and a conductive material forming non-ohmic junction with the variable resistor, respectively. The variable resistor changes between two or more different resistance states by applying a voltage between the electrodes. The resistance state after being changed is maintained in a nonvolatile manner. The variable resistive elements of all memory cells in the memory cell array are set to the highest of the two or more different resistance states in an unused state before the memory cell array is used to store the user data. | 04-05-2012 |
20120081947 | METAL-INSULATOR-METAL-INSULATOR-METAL (MIMIM) MEMORY DEVICE - The present memory device includes first and second electrodes, first and second insulating layers between the electrodes, the first insulating layer being in contact with the first electrode, the second insulating layer being in contact with the second electrode, and a metal layer between the first and second insulating layers. Further included may be a first oxide layer between and in contact with the first insulating layer and the metal layer, and a second oxide layer between and in contact with the second insulating layer and the metal layer. | 04-05-2012 |
20120087171 | SEMICONDUCTOR MEMORY DEVICE INCLUDING VARIABLE RESISTANCE ELEMENTS AND MANUFACTURING METHOD THEREOF - A semiconductor memory device with a variable resistance element includes a plurality of active areas isolated from one another by an isolation layer formed in a substrate, a plurality of word lines crossing over the plurality of active areas, an auxiliary source line disposed between two selected word lines and commonly connected to at least two active areas among the plurality of active areas between the two selected word lines, and a plurality of contact plugs each connected to a corresponding active area. | 04-12-2012 |
20120087172 | SEMICONDUCTOR MEMORY AND SYSTEM - A semiconductor memory includes a real memory cell including a selection transistor and a resistance variable element which are connected in series between a first voltage line and a second voltage line through a connection node, a real amplification transistor having a gate connected to the connection node, a source connected to a reference voltage line, and a drain connected to a real read line, and a sense amplifier to determine a logic held in the real memory cell by receiving a voltage of the real read line varied with a voltage generated in the connection node by resistance dividing between a source/drain resistance of the selection transistor, and the resistance variable element, the selection transistor receiving a read control voltage at the gate thereof. | 04-12-2012 |
20120087173 | MEMORY ELEMENT, STACKING, MEMORY MATRIX AND METHOD FOR OPERATION - Disclosed is a memory element, a stack, and a memory matrix in which the memory element can be used. Also disclosed is a method for operating the memory matrix, and to a method for determining the true value of a logic operation in an array comprising memory elements. The memory element has at least a first stable state 0 and a second stable state 1. By applying a first write voltage V | 04-12-2012 |
20120087174 | Two Terminal Re Writeable Non Volatile Ion Transport Memory Device - A memory using mixed valence conductive oxides is disclosed. The memory includes a mixed valence conductive oxide that is less conductive in its oxygen deficient state and a mixed electronic ionic conductor that is an electrolyte to oxygen and promotes an electric field effective to cause oxygen ionic motion. | 04-12-2012 |
20120087175 | Asymmetric Write Current Compensation - An apparatus and method for compensating for asymmetric write current in a non-volatile unit cell. The unit cell comprises a switching device and an asymmetric resistive sense element (RSE), such as an asymmetric resistive random access memory (RRAM) element or an asymmetric spin-torque transfer random access memory (STRAM) element. The RSE is physically oriented within the unit cell relative to the switching device such that a hard direction for programming the RSE is aligned with an easy direction of programming the unit cell, and an easy direction for programming the RSE is aligned with a hard direction for programming the unit cell. | 04-12-2012 |
20120092919 | Resistive Memory Element and Use Thereof - A resistive memory element that includes an element body and at least a pair of electrodes opposed to each other with at least a portion of the element body interposed therebetween. The element body is made of an oxide semiconductor as a polycrystalline body, which has a composition represented by the general formula: Ti | 04-19-2012 |
20120092920 | Resistive Memory Element and Use Thereof - A resistive memory element that includes an element body and at least a pair of electrodes opposed to each other with at least a portion of the element body interposed therebetween. The element body is made of an oxide semiconductor which has a composition represented by the general formula: (Ba | 04-19-2012 |
20120092921 | SEMICONDUCTOR DEVICE - A technique for increasing rewriting current without increasing a power supply voltage and also reducing location dependency inside a memory array of a resistive state after the rewriting is provided in a resistance change memory in which the resistance value of a memory cell changes between logical values “1” and “0”. In the resistance change memory, bit lines are formed into a layered structure, the bit line select switches for connecting to the global bit line are provided at both ends of the local bit line, and a control method of the bit line select switches is changed in the writing and the reading, thereby realizing the optimum array configurations for each of them. More specifically, in the writing and the reading, two current paths are provided in parallel by turning ON the bit line select switches simultaneously. | 04-19-2012 |
20120099362 | MEMORY ARRAY WITH METAL-INSULATOR TRANSITION SWITCHING DEVICES - A memory array with Metal-Insulator Transition (MIT) switching devices includes a set of row lines intersecting a set of column lines and a memory element disposed at an intersection between one of the row lines and one of the column lines. The memory element includes a switching layer in series with an MIT material. A method of accessing a target memory element within a memory array includes applying half of an access voltage to a row line connected to the target memory element, the target memory element comprising a switching layer in series with an MIT material, and applying an inverted half of the access voltage to a column line connected to the target memory element. | 04-26-2012 |
20120099363 | RESISTANCE CHANGE TYPE MEMORY - According to one embodiment, a resistance change type memory includes a first bit line extending in a first direction, a first word line extending in a second direction, a first bipolar transistor which is a first drive type and has a first emitter, a first base, and a first collector, a second bipolar transistor which is a second drive type different from the first drive type and has a second emitter, a second base, and a second collector, and a first memory element which has first and second terminals and in which a change in resistance state thereof is associated with data. The first terminal is connected to the first and second emitters, the second terminal is connected to the first bit line, and the first and second bases are connected to the first word line. | 04-26-2012 |
20120099364 | RESISTIVE MEMORY DEVICES, INITIALIZATION METHODS, AND ELECTRONIC DEVICES INCORPORATING SAME - A resistive memory device and method of initialization are provided. The resistive memory device includes a first group of resistive memory cells connected between bit lines and a first plate and a second group connected between bit lines and a second plate. First and second initialization voltages are respectively applied to the first and second plates outside a normal path associated with a normal operation of the resistive memory cells. | 04-26-2012 |
20120099365 | THREE DIMENSIONAL PROGRAMMABLE RESISTANCE MEMORY DEVICE WITH A READ/WRITE CIRCUIT STACKED UNDER A MEMORY CELL ARRAY - A programmable resistance memory device includes a semiconductor substrate, at least one cell array, in which memory cells are arranged formed above the semiconductor substrate. Each of the memory cells has a stack structure of a programmable resistance element and an access element, the programmable resistance element storing a high resistance state or a low resistance state determined due to the polarity of voltage application in a non-volatile manner. The access element has such a resistance value in an off-state in a certain voltage range that is ten time or more as high as that in a select state. A read/write circuit is formed on a semiconductor substrate as underlying the cell array for data reading and data writing in communication with the cell array. | 04-26-2012 |
20120099366 | MULTI-RESISTIVE INTEGRATED CIRCUIT MEMORY - A capacitor for use in integrated circuits comprises a layer of conductive material. The layer of conductive material including at least a first portion and a second portion, wherein the first portion and the second portion are arranged in a predetermined pattern relative to one another to provide a maximum amount of capacitance per semiconductor die area. | 04-26-2012 |
20120099367 | CROSS POINT VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE - A cross point variable resistance nonvolatile memory device includes memory cells having the same orientation for stable characteristics of all layers. Each memory cell ( | 04-26-2012 |
20120106234 | Semiconductor Memory Having Both Volatile and Non-Volatile Functionality Including Resistance Change Material and Method of Operating - Semiconductor memory is provided wherein a memory cell includes a capacitorless transistor having a floating body configured to store data as charge therein when power is applied to the cell. The cell further includes a nonvolatile memory comprising a resistance change element configured to store data stored in the floating body under any one of a plurality of predetermined conditions. A method of operating semiconductor memory to function as volatile memory, while having the ability to retain stored data when power is discontinued to the semiconductor memory is described. | 05-03-2012 |
20120113706 | MEMRISTORS BASED ON MIXED-METAL-VALENCE COMPOUNDS - A memristor ( | 05-10-2012 |
20120120709 | Transistor Driven 3D Memory - A nonvolatile memory device with a first conductor extending in a first direction and a semiconductor element above the first conductor. The semiconductor element includes a source, a drain and a channel of a field effect transistor (JFET or MOSFET). The nonvolatile memory device also includes a second conductor above the semiconductor element, the second conductor extending in a second direction. The nonvolatile memory device also includes a resistivity switching material disposed between the first conductor and the semiconductor element or between the second conductor and the semiconductor element. The JFET or MOSFET includes a gate adjacent to the channel, and the MOSFET gate being self-aligned with the first conductor. | 05-17-2012 |
20120120710 | MEMORY SYSTEM WITH REVERSIBLE RESISTIVITY-SWITCHING USING PULSES OF ALTERNATRIE POLARITY - A memory system includes a plurality of non-volatile storage elements that each comprise a diode (or other steering device) in series with reversible resistance-switching material. One or more circuits in the memory system program the non-volatile storage elements by changing the reversible resistance-switching material of one or more non-volatile storage elements to a first resistance state. The memory system can also change the reversible resistance-switching material of one or more of the non-volatile storage elements from the first resistance state to a second resistance state by applying one or more pairs of opposite polarity voltage conditions (e.g., pulses) to the respective diodes (or other steering devices) such that current flows in the diodes (or other steering devices) without operating the diodes (or other steering devices) in breakdown condition. | 05-17-2012 |
20120120711 | MEMORY SYSTEM WITH REVERSIBLE RESISTIVITY-SWITCHING USING PULSES OF ALTERNATRIE POLARITY - A memory system includes a plurality of non-volatile storage elements that each comprise a diode (or other steering device) in series with reversible resistance-switching material. One or more circuits in the memory system program the non-volatile storage elements by changing the reversible resistance-switching material of one or more non-volatile storage elements to a first resistance state. The memory system can also change the reversible resistance-switching material of one or more of the non-volatile storage elements from the first resistance state to a second resistance state by applying one or more pairs of opposite polarity voltage conditions (e.g., pulses) to the respective diodes (or other steering devices) such that current flows in the diodes (or other steering devices) without operating the diodes (or other steering devices) in breakdown condition. | 05-17-2012 |
20120120712 | FORMING METHOD FOR VARIABLE RESISTANCE NONVOLATILE MEMORY ELEMENT, AND VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE - An optimum forming method of performing a forming for a variable resistance element to maximize an operation window of the variable resistance element is provided. The forming method is used to initialize a variable resistance element ( | 05-17-2012 |
20120120713 | Asymmetric Write Current Compensation Using Gate Overdrive for Resistive Sense Memory Cells - Apparatus and associated method for asymmetric write current compensation for resistive sense memory (RSM) cells, such as but not limited to spin-torque transfer random access memory (STRAM) or resistive random access memory (RRAM) cells. In accordance with some embodiments, an RSM cell includes an RSM element coupled to a switching device. The switching device has a plurality of terminals. A control circuit compensates for asymmetric write characteristics of the RSM cell by limiting a range of voltage differentials across the terminals so as to be equal to or less than a magnitude of a source voltage applied to the switching device, thereby providing bi-directional write currents of substantially equal magnitude through the RSM element. | 05-17-2012 |
20120120714 | MEMORY RESISTOR HAVING MULTI-LAYER ELECTRODES - Methods and means related to memory resistors are provided. A memristor includes two multi-layer electrodes and an active material layer. One multi-layer electrode forms an Ohmic contact region with the active material layer. The other multi-layer electrode forms a Schottky barrier layer with the active material layer. The active material layer is subject to oxygen vacancy profile reconfiguration under the influence of an applied electric field. An electrical resistance of the memristor is thus adjustable by way of applied programming voltages and is non-volatile between programming events. | 05-17-2012 |
20120127778 | MEMORY DEVICE - A memory device includes: a transistor array having transistors; and memory elements provided, one for each of the transistors. The transistor array includes a substrate having diffusion layers on a surface thereof, parallel word lines on the substrate, parallel first bit lines provided in a direction perpendicular to the word lines, bit contact electrodes between the adjacent two word lines and connecting the first bit lines and the diffusion layers, and node contact electrodes at an opposite side to the bit contact electrodes with the two word lines in between and connected to the diffusion layers. The memory elements have lower electrodes connected to the node contact electrodes, memory layers on the lower electrodes and having resistance values reversibly changing by voltage application, and parallel second bit lines extending in the same direction as that of the first bit lines on the memory layers. | 05-24-2012 |
20120127779 | Re-writable Resistance-Switching Memory With Balanced Series Stack - A re-writable resistance-switching memory cell includes first and second capacitors in series. The first and second capacitors may have balanced electrical characteristics to allow nearly concurrent, same-direction switching. The first capacitor has a first bipolar resistance switching layer between first and second conductive layers, and the second capacitor has a second bipolar resistance switching layer between third and fourth conductive layers. The first and third conductive layers are made of a common material, and the second and fourth conductive layers are made of a common material. In one approach, the first and second bipolar resistance switching layers are made of a common material and have common thickness. In another approach, the first and second bipolar resistance switching layers are made of materials having different dielectric constants, but their thickness differs in proportion to the difference in the dielectric constants, to provide a common capacitance per unit area. | 05-24-2012 |
20120127780 | MEMORY RESISTOR ADJUSTMENT USING FEEDBACK CONTROL - Apparatus and methods related to memory resistors are provided. A feedback controller applies adjustment signals to a memristor. A non-volatile electrical resistance of the memristor is sensed by the feedback controller during the adjustment. The memristor is adjusted to particular values lying between first and second limiting values with minimal overshoot. Increased memristor service life, faster operation, lower power consumption, and higher operational integrity are achieved by the present teachings. | 05-24-2012 |
20120140544 | SEMICONDUCTOR MEMORY APPARATUS AND METHOD OF DRIVING THE SAME - A semiconductor memory apparatus includes a resistive memory cell configured to be applied with a command voltage pulse with a different voltage level, depending upon an input command, and a feedback unit coupled between one end and the other end of the resistive memory cell, and configured to detect whether an amount of current which passes through the resistive memory cell reaches a target level and selectively form a pull-down current path for limiting an amount of current which the resistive memory cell passes, wherein the feedback unit controls the target level according to the command voltage pulse. | 06-07-2012 |
20120140545 | SEMICONDUCTOR DEVICE AND METHOD OF SENSING DATA OF THE SEMICONDUCTOR DEVICE - In one example embodiment, the semiconductor device includes a memory cell array having at least one memory cell disposed in a region at which at least one bit line and at least one word line cross. A sensing unit senses data stored in the at least one memory cell. The sensing unit includes a connection control unit configured to control a connection between the at least one bit line and a sensing line based on a control signal, the control signal having a voltage level that varies based on a value of data being sensed by the sensing unit. | 06-07-2012 |
20120140546 | Multi-Bit Resistance-Switching Memory Cell - A non-volatile storage apparatus comprises a set of Y lines, a set of X lines and a plurality of memory cells in communication with the set of X lines and the set of Y lines. Each memory cell of the plurality of memory cells includes a resistance element in a static resistance condition and two or more reversible resistance-switching elements. The resistance element in the static resistance condition and the two or more reversible resistance-switching elements are connected to different Y lines of the set of Y lines. The resistance element in the low resistance state and the two or more reversible resistance-switching elements are connected to a common X line of the set of X lines. One or multiple bits of data are programmed into a particular memory cell of the plurality of memory cells by causing current flow between Y lines connected to the particular memory cell. | 06-07-2012 |
20120140547 | Multi-Bit Resistance-Switching Memory Cell - A non-volatile storage apparatus comprises a set of Y lines, a set of X lines and a plurality of memory cells in communication with the set of X lines and the set of Y lines. Each memory cell of the plurality of memory cells includes a resistance element in a static resistance condition and two or more reversible resistance-switching elements. The resistance element in the static resistance condition and the two or more reversible resistance-switching elements are connected to different Y lines of the set of Y lines. The resistance element in the low resistance state and the two or more reversible resistance-switching elements are connected to a common X line of the set of X lines. One or multiple bits of data are programmed into a particular memory cell of the plurality of memory cells by causing current flow between Y lines connected to the particular memory cell. | 06-07-2012 |
20120140548 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, semiconductor memory device includes: semiconductor substrate; parallel first lines stacked on substrate; parallel second lines intersecting first lines; memory cell array including memory cells at intersections of first and second lines and each including variable resistance element and selecting element series-connected together; first control circuit provided in second region of substrate adjoining first region immediately under array; second control circuit provided in first region of substrate; and dummy lines formed in same layer as second lines, such that they intersect first lines in region above first control circuit. First control circuit applies first voltage to selected first line. Second control circuit applies second voltage lower than first voltage to selected second line, and to dummy lines, third voltage by which potential difference applied to memory cells at intersections of selected first line and dummy lines becomes lower than on-voltage of selecting element. | 06-07-2012 |
20120140549 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a memory cell array including first and second mutually crossing lines and electrically erasable programmable memory cells arranged at intersections of the first and second lines, each memory cell containing a variable resistor operative to nonvolatilely store the resistance thereof as data and a first non-ohmic element operative to switch the variable resistor; and a clamp voltage generator circuit operative to generate a clamp voltage required for access to the memory cell and applied to the first and second lines. The clamp voltage generator circuit has a temperature compensation function of compensating for the temperature characteristic of the first non-ohmic element. | 06-07-2012 |
20120147655 | NON-VOLATILE MEMORY DEVICE AND METHOD FOR PROGRAMMING THE SAME - A non-volatile memory device and a method for programming the same are disclosed. The method for programming the non-volatile memory device includes generating a simultaneous write current based on a program address in such a manner that bit line write cells corresponding to memory cells coupled to the same bit line from among memory cells to be programmed can be simultaneously programmed, and providing the simultaneous write current to the bit line write cells by simultaneously enabling the bit line write cells. | 06-14-2012 |
20120147656 | MEMORY ELEMENT AND MEMORY DEVICE - A memory element and a memory device having the stable switching characteristics with the characteristics of data retention remaining favorable are provided. The memory element includes a first electrode, a memory layer, and a second electrode in this order. The memory layer includes an ion source layer provided on the second electrode side, a resistance change layer provided between the ion source layer and the first electrode, and a barrier layer provided between the resistance change layer and the first electrode, and having conductivity higher than that of the resistance change layer. | 06-14-2012 |
20120147657 | PROGRAMMING REVERSIBLE RESISTANCE SWITCHING ELEMENTS - A storage system and method for operating the storage system that uses reversible resistance-switching elements is described. Techniques are disclosed herein for varying programming conditions to account for different resistances that memory cells have. These techniques can program memory cells in fewer attempts, which can save time and/or power. Techniques are disclosed herein for achieving a high programming bandwidth while reducing the worst case current and/or power consumption. | 06-14-2012 |
20120147658 | SYSTEM OF MEASURING A RESISTANCE OF A RESISTIVE MEMORY DEVICE - A system for measuring a resistance of a memory cell in a resistive memory device can include a pulse generator configured to apply a data write pulse and a resistance read pulse to the resistive memory device with a delay time. A connecting member can be connected between the pulse generator and the resistive memory device. A test measurement device can be connected to the resistive memory device outputting a pulse waveform and a data-processing member can be configured to determine the resistance of the resistive memory device using the pulse waveform and an internal resistance of the test measurement device. | 06-14-2012 |
20120147659 | Bidirectional Non-Volatile Memory Array Architecture - Method and apparatus for transferring data in a memory. A semiconductor memory includes a plurality of memory cells each having a resistive sense element (RSE) in series with a switching device. A conductive word line extends in a first direction adjacent the memory cells and is connected to a gate structure of each of the switching devices. A plurality of conductive bit lines extend in a second direction adjacent the memory cells, each bit line providing a connection node that interconnects a respective pair of the memory cells. A control circuit senses a programmed state of a selected memory cell by setting each of the bit lines on a first side of the selected memory cell to a first voltage level, setting each of the remaining bit lines on an opposing second side of the selected memory cell to a second voltage level, and setting the word line to a third voltage level. | 06-14-2012 |
20120147660 | Preservation Circuit And Methods To Maintain Values Representing Data In One Or More Layers Of Memory - Circuitry and methods for restoring data in memory are disclosed. The memory may include at least one layer of a non-volatile two-terminal cross-point array that includes a plurality of two-terminal memory elements that store data as a plurality of conductivity profiles and retain stored data in the absence of power. Over a period of time, logic values indicative of the stored data may drift such that if the logic values are not restored, the stored data may become corrupted. At least a portion of each memory may have data rewritten or restored by circuitry electrically coupled with the memory. Other circuitry may be used to determine a schedule for performing restore operations to the memory and the restore operations may be triggered by an internal or an external signal or event. The circuitry may be positioned in a logic layer and the memory may be fabricated over the logic layer. | 06-14-2012 |
20120155146 | RESISTANCE-CHANGE MEMORY - According to one embodiment, a resistance-change memory includes memory cells between a bit line and a source line, each of the memory cells including a memory element and a cell transistor having a gate connected to a word line, an n-channel transistor having a gate to which a first control voltage is applied, and a current path connected to the bit line, and a p-channel transistor having a gate to which a second control voltage is applied, and a current path connected to the source line. When the memory cell is read, the potential of the bit line is controlled by the first control voltage, and the potential of the source line is controlled by the second control voltage. | 06-21-2012 |
20120155147 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes a memory cell array including memory cells each provided at individual intersection between a first wiring and a second wiring, the memory cell comprising a variable resistive element, and predetermined numbers of the memory cells shearing the same first wiring to configure a page; a first control circuit configured to select a page subjected to data-writing, and to supply a constant voltage to the first wiring belonging to the selected page; a writing-voltage generating circuit configured to generate plural kinds of writing voltages for programming a resistance of the variable resistive element to one of three or more values based on a write-in data specifying three or more values; and a second control circuit configured to select the page subjected to data-writing, and to supply the writing voltages to predetermined numbers of the respective second wirings belonging to the selected page. | 06-21-2012 |
20120155148 | RESISTANCE CHANGE MEMORY DEVICE - A resistance change memory device including: a cell array having a resistance change type of memory cells disposed at the cross-points of word lines and bit lines, the resistance value of the memory cell being reversibly settable; a word line driver circuit configured to apply a selecting drive voltage to one selected in the word lines; and a bit line driver circuit configured to drive multiple bit lines in such a manner that a set mode and a reset mode are set simultaneously for multiple memory cells selected by the selected word line, the set mode being for changing a selected memory cell from a first resistance state into a second resistance state while the reset mode is for changing a selected memory cell from the second resistance state into the first resistance state. | 06-21-2012 |
20120155149 | SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device includes: a cell array including a plurality of first wirings, a plurality of second wirings intersecting the first wirings, and memory cells positioned at intersecting portions between the first wirings and the second wirings, each of the memory cells having a series circuit of a non-ohmic element and a variable resistance element; a control circuit configured to apply a control voltage, which is necessary for the variable resistance element to transit from a low resistance state to a high resistance state, to the memory cells through the first wirings and the second wirings; and a bias voltage application circuit configured to apply a bias voltage, which suppresses a potential variation caused by the transition of the variable resistance element from the low resistance state to the high resistance state, to one end of the variable resistance element. | 06-21-2012 |
20120163065 | Spatial Correlation of Reference Cells in Resistive Memory Array - The present disclosure relates to methods of selectively placing a reference column or reference row in a memory array. The method includes measuring a resistance state resistance value for a plurality of variable resistive memory cells within a memory array and mapping a location of each measured variable resistive memory cell to form a map of the resistance state resistance values for a plurality of variable resistive memory cells within a memory array. Then a column or row is selected to be a reference column or reference row based on the map of the resistance state resistance value for a plurality of variable resistive memory cells within a memory array, to minimize read operation errors, and forming a variable resistive memory cell memory array. | 06-28-2012 |
20120163066 | SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device includes: a memory cell array including memory cells, each of the memory cells having a variable resistance element; and a control circuit configured to apply a control voltage, which is necessary for the variable resistance element to transit a resistance state, to a selected memory cell. When applying the control voltage plural times, the control circuit operates to set a value of the control voltage applied in a first control voltage application operation to be substantially equal to a minimum value of distribution of the voltage values of all the memory cells in the memory cell array required to transit the resistance state of the variable resistance element from a high resistance state to a low resistance state. The control circuit operates to perform a plurality of control voltage application operations by increasing the value of the control voltage by a certain value. | 06-28-2012 |
20120170352 | THERMO PROGRAMMABLE RESISTOR BASED ROM - An integrated circuit is formed having an array of memory cells located in the dielectric stack above a semiconductor substrate. Each memory cell has an adjustable resistor and a heating element. A dielectric material separates the heating element from the adjustable resistor. The heating element alters the resistance of the resistor by applying heat thereto. The magnitude of the resistance of the adjustable resistor represents the value of data stored in the memory cell. | 07-05-2012 |
20120170353 | NONVOLATILE MEMORY DEVICE AND METHOD FOR PROGRAMMING THE SAME - A method for programming a nonvolatile memory device according to the present invention includes a step of detecting an excessively low resistance cell from among a plurality of memory cells ( | 07-05-2012 |
20120176830 | VARIABLE RESISTANCE MEMORY DEVICES USING READ MIRROR CURRENTS - A nonvolatile memory device includes a variable resistance memory element and a read circuit coupled to the variable resistance memory element at a first signal node and configured to provide a read current to the variable resistance memory element via the first signal node, to a provide a mirror current at a second signal node responsive to the cell current and to generate an output signal indicative of a state of the variable resistance memory element responsive to a voltage at the second signal node. | 07-12-2012 |
20120176831 | Resistive Random Access Memory With Low Current Operation - A memory cell in a 3-D read and write memory device has two bipolar resistance-switching layers with different respective switching currents. A low current resistance-switching layer can be switched in set and reset processes while a high current resistance-switching layer remains in a reset state and acts as a protection resistor to prevent excessively high currents on the low current resistance-switching layer. The low and high current resistance-switching layers can be of the same material such as a metal oxide, where the layers differ in terms of thickness, doping, leakiness, metal richness or other variables. Or, the low and high current resistance-switching layers can be of different materials, having one or more layers each. The high current resistance-switching layer can have a switching current which is greater than a switching current of the low current resistance-switching layer by a factor of at least 1.5 or 2.0, for instance. | 07-12-2012 |
20120176832 | Access Signal Adjustment Circuits and Methods for Memory Cells In a Cross-Point Array - Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to generate access signals to facilitate memory operations in scaled arrays of memory elements, such as memory implemented in third dimensional memory technology formed BEOL directly on top of a FEOL substrate that includes data access circuitry. In at least some embodiments, a non-volatile memory device can include a cross-point array having resistive memory elements disposed among word lines and subsets of bit lines, and an access signal generator. The access signal generator can be configured to modify a magnitude of a signal to generate a modified magnitude for the signal to access a resistive memory element associated with a word line and a subset of bit lines. The modified magnitude can be a function of the position of the resistive memory element in the cross-point array. | 07-12-2012 |
20120176833 | ELECTRONIC DEVICE WITH A PROGRAMMABLE RESISTIVE ELEMENT AND A METHOD FOR BLOCKING A DEVICE - One or more embodiments relate to an electronic device comprising a circuitry and a programmable resistive element. The programmable resistive element comprises a first and a second state, wherein the programmable resistive element is configured to allow switching from the second state into the first state in response to a signal comprising at least a predefined level. The circuitry is configured to provide signals up the predefined level, wherein the circuitry is configured to provide a switch signal to the programmable resistive element, wherein the switch signal causes switching from the first into the second state. | 07-12-2012 |
20120176834 | VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE - Each of basic array planes has a first via group that interconnects only even-layer bit lines in the basic array plane, and a second via group that interconnects only odd-layer bit lines in the basic array plane, the first via group in a first basic array plane and the second via group in a second basic array plane adjacent to the first basic array in a Y direction are adjacent to each other in the Y direction, and the second via group in the first basic array plane and the first via group in the second basic array plane are adjacent to each other in the Y direction, and the second via group in the second basic array plane is disconnected from a second global line when connecting the first via group in the first basic array plane to a first global line. | 07-12-2012 |
20120182783 | PROGRAMMING AN ARRAY OF RESISTANCE RANDOM ACCESS MEMORY CELLS USING UNIPOLAR PULSES - Subject matter disclosed herein relates to a memory device, and more particularly to programming a non-volatile memory device. | 07-19-2012 |
20120182784 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device according to an embodiment comprises a memory cell array configured from a plurality of row lines and column lines that intersect one another, and from a plurality of memory cells disposed at each of intersections of the row lines and column lines and each including a variable resistance element. Where a number of the row lines is assumed to be N, a number of the column lines is assumed to be M, and a ratio of a cell current flowing in the one of the memory cells when a voltage that is half of the select voltage is applied to the one of the memory cells to a cell current flowing in the one of the memory cells when the select voltage is applied to the one of the memory cells is assumed to be k, a relationship M | 07-19-2012 |
20120182785 | MEMORY UNIT AND METHOD OF OPERATING THE SAME - A memory unit includes memory cells each having a memory element and a transistor, word lines and first and second bit lines, and a drive section. In performing setting operation for a first memory element located on one word line and in performing resetting operation for a second memory element located on the one word line, the drive section applies a given word line electric potential to the one word line, and sets an electric potential of a bit line on a lower electric potential side out of the first and the second bit lines corresponding to the first memory element to a value higher than a value of an electric potential of a bit line on the lower electric potential side corresponding to the second memory element by an amount of given electric potential difference. | 07-19-2012 |
20120182786 | BIDIRECTIONAL RESISTIVE MEMORY DEVICES USING SELECTIVE READ VOLTAGE POLARITY - A memory device includes a memory cell array including a plurality of memory cells, each including a bidirectional variable resistance element and an input/output circuit configured to determine a polarity for a read voltage to be applied to a selected memory cell among the plurality of memory cells and to apply the read voltage with the determined polarity to the selected memory cell. The input/output circuit may include a polarity determination circuit configured to determine the polarity responsive to a determination mode signal and a driver circuit configured to apply the read voltage with the determined polarity to the selected memory cell. | 07-19-2012 |
20120182787 | CROSS-POINT MEMORY DEVICES, ELECTRONIC SYSTEMS INCLUDING CROSS-POINT MEMORY DEVICES AND METHODS OF ACCESSING A PLURALITY OF MEMORY CELLS IN A CROSS-POINT MEMORY ARRAY - Memory devices comprise a plurality of memory cells, each memory cell including a memory element and a selection device. A plurality of first (e.g., row) address lines can be adjacent (e.g., under) a first side of at least some cells of the plurality. A plurality of second (e.g., column) address lines extend across the plurality of row address lines, each column address line being adjacent (e.g., over) a second, opposing side of at least some of the cells. Control circuitry can be configured to selectively apply a read voltage or a write voltage substantially simultaneously to the address lines. Systems including such memory devices and methods of accessing a plurality of cells at least substantially simultaneously are also disclosed. | 07-19-2012 |
20120188813 | VERIFICATION ALGORITHM FOR METAL-OXIDE RESISTIVE MEMORY - Memory devices and methods for operating such devices are described which can effectively program the metal-oxide memory elements in an array, while also avoiding applying unnecessarily high voltage pulses. Programming operations described herein include applying a lower voltage pulse across a metal-oxide memory element to establish a desired resistance state, and only applying a higher voltage pulse when the lower voltage pulse is insufficient to program the memory element. In doing so, issues associated with applying unnecessarily high voltages across the memory element can be avoided. | 07-26-2012 |
20120195099 | CHANGING A MEMRISTOR STATE - A method of changing a state of a memristor having a first intermediate layer, a second intermediate layer, and a third intermediate layer positioned between a first electrode and a second electrode includes applying a first pulse having a first bias voltage across the memristor, wherein the first pulse causes mobile species to flow in a first direction within the memristor and collect in the first intermediate layer thereby causing the memristor to enter into an intermediate state and applying a second pulse having a second bias voltage across the memristor, in which the second pulse causes the mobile species from the first intermediate layer to flow in a second direction within the memristor and collect in the third intermediate layer, wherein the flow of the mobile species in the second direction causes the memristor to enter into a fully changed state. | 08-02-2012 |
20120195100 | SEMICONDUCTOR DEVICE AND METHOD OF CONTROLLING SEMICONDUCTOR DEVICE - Provided is a semiconductor device including: a memory cell having a variable resistance device; and a control unit that controls a voltage applied to the memory cell, wherein the variable resistance device includes a lower electrode contains a first metal material, an upper electrode containing a second metal material, and an insulating film containing oxygen, the first metal material has a normalized oxide formation energy higher than that of the second metal material, and the control unit applies a positive voltage to the upper electrode at the time of an operation of increasing a resistance value of the insulating film and an operation of decreasing the resistance value thereof, and applies a positive voltage to the lower electrode at the time of an operation of reading out the resistance value of the insulating film. | 08-02-2012 |
20120195101 | RESISTANCE-CHANGING MEMORY DEVICE - A resistance-changing memory device has a cell array having memory cells, each of which stores as data a reversibly settable resistance value, a sense amplifier for reading data from a selected memory cell in the cell array, and a voltage generator circuit which generates, after having read data of the selected memory cell, a voltage pulse for convergence of a resistive state of this selected memory cell in accordance with the read data. | 08-02-2012 |
20120201069 | MEMORY UNIT AND METHOD OF OPERATING THE SAME - A memory unit includes memory elements and a drive section. In executing a first operation out of the first operation for changing resistance state of the memory element from one resistance state out of low resistance state and high resistance state to the other resistance state and a second operation for changing the resistance state of the memory element from the other resistance state to the one resistance state, the drive section performs stepwise operation, in which the drive section repeatedly performs, at least one time, a step in which strong stress application step for applying a stress for performing the first operation to the memory element as the drive target relatively strongly is performed and subsequently weak stress application step for applying a stress for performing the second operation to the memory element as the drive target relatively weakly is performed, and subsequently performs the strong stress application step. | 08-09-2012 |
20120201070 | NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND DATA WRITING METHOD THEREFOR - A nonvolatile semiconductor storage device includes first and second intersecting wires; a electrically rewritable memory cell disposed at each intersection of the first second wires, including a variable resistor for memorizing a resistance value as data in a nonvolatile manner and a rectifying device are connected in series; and a control circuit which applies a voltage necessary for writing of data to the first and second wires. The control circuit precharges a non-selected second wire to a standby voltage larger than a reference voltage prior to programming a variable resistor connected to selected first and second wires by supplying the reference voltage to a non-selected first wire and the selected second wire, applying to the selected first wire a program voltage for programming of the selected variable resistor and applying to the non-selected second wire a control voltage which prevents the rectifying device from turning ON. | 08-09-2012 |
20120212994 | MEMORY APPARATUS - A memory apparatus includes: a plurality of memory cells which includes a first resistance change element; and a read-out circuit which determines the size of a resistance value of the first resistance change element by comparing the resistance state of a memory cell selected among the plurality of memory cells to the resistance state of a reference memory cell, wherein the reference memory cell includes a second resistance change element, a resistance value of the second resistance change element with respect to an applied voltage is smaller than that in a high resistance state of the first resistance change element, and the second resistance change element shows the same resistance change characteristic as the first resistance change element. | 08-23-2012 |
20120218806 | Memory Cells, Methods of Forming Memory Cells, and Methods of Programming Memory Cells - Some embodiments include methods in which a memory cell is formed to have programmable material between first and second access lines, with the programmable material having two compositionally different regions. A concentration of ions and/or ion-vacancies may be altered in at least one of the regions to change a memory state of the memory cell and to simultaneously form a pn diode. Some embodiments include memory cells having programmable material with two compositionally different regions, and having ions and/or ion-vacancies diffusible into at least one of the regions. The memory cell has a memory state in which the first and second regions are of opposite conductivity type relative to one another. | 08-30-2012 |
20120218807 | RESISTIVE MEMORY SENSING METHODS AND DEVICES - The present disclosure includes resistive memory sensing methods and devices. One such method includes performing a voltage based multiple pass sensing operation on a group of cells coupled to a selected conductive line of an array of resistive memory cells. The voltage based multiple pass sensing operation can include providing an indication of those cells of the group that conduct at least a threshold amount of current responsive to one of a number of different sense voltages successively applied to the selected conductive line during each of a corresponding number of the multiple passes, and for each successive pass of the multiple passes, disabling data lines corresponding to those cells determined to have conducted the threshold amount of current in association with a previous one of the multiple passes. | 08-30-2012 |
20120218808 | MEMORY ELEMENT AND MEMORY DEVICE - There are provided a memory element and a memory device with improved repetition characteristics during operations at a low voltage and current. The memory element includes a first electrode, a memory layer, and a second electrode in this order. The memory layer includes a resistance change layer disposed on the first electrode side, and an ion source layer disposed on the second electrode side, and having a resistivity of 2.8 mΩcm or higher but lower than 1 Ωcm. | 08-30-2012 |
20120218809 | STORAGE APPARATUS AND OPERATION METHOD FOR OPERATING THE SAME - A storage apparatus includes: a plurality of storage elements configured to have the resistance state thereof changed in accordance with an applied voltage; and a drive portion configured to perform a resistance change operation and a read operation, the resistance change operation involving writing or erasing information to or from the storage elements by changing the resistance state thereof, the read operation involving reading the information from the storage elements; wherein the drive portion includes an amplifier configured to output a read signal upon execution of the read operation, a constant current load, and a control portion configured to perform the resistance change operation and a direct verify operation on the storage elements, the direct verify operation involving carrying out, subsequent to the resistance change operation, the read operation for verifying whether the writing or erasing of the information to or from the storage elements has been normally accomplished. | 08-30-2012 |
20120218810 | Methods Of Reading And Using Memory Cells - Some embodiments include methods of reading memory cells. The memory cells have a write operation that occurs only if a voltage of sufficient absolute value is applied for a sufficient duration of time; and the reading is conducted with a pulse that is of too short of a time duration to be sufficient for the write operation. In some embodiments, the pulse utilized for the reading may have an absolute value of voltage that is greater than or equal to the voltage utilized for the write operation. In some embodiments, the memory cells may comprise non-ohmic devices; such as memristors and diodes. | 08-30-2012 |
20120224408 | THREE DIMENSIONAL MEMORY SYSTEM WITH COLUMN PIPELINE - A monolithic three dimensional array of non-volatile storage elements is arranged in blocks. The non-volatile storage elements are connected to bit lines and word lines. The bit lines for each block are grouped into columns of bit lines. The columns of bit lines include top columns of bit lines that are connected to selection circuits on a top side of a respective block and bottom columns of bit lines that are connected to selection circuits on a bottom side of the respective block. Programming of data is pipelined between two or more columns of bit lines in order to increase programming speed. One embodiment of the programming process includes selectively connecting two columns of bit lines to a set of one or more selection circuits, using the one or more selection circuits to selectively connect one of the two columns of bit lines to one or more signal sources, programming non-volatile storage elements for the column of bit lines that is currently connected to the one or more signal sources, and changing one of the columns of bit lines connected to the set of one or more selection circuits while another column of bit lines is being programmed. | 09-06-2012 |
20120224409 | THREE DIMENSIONAL MEMORY SYSTEM WITH PAGE OF DATA ACROSS WORD LINES - A three dimensional monolithic memory array of non-volatile storage elements includes a plurality of word lines and a plurality of bit lines. The plurality of bit lines are grouped into columns. One page of data is stored across multiple word lines by programming non-volatile storage elements connected to one column of bit lines and multiple word lines while maintaining the selection of the one column of bit lines. In one embodiment, programming non-volatile storage elements includes selectively connecting bit lines to sense amplifiers using selection circuits that include a storage device, a select circuit connected to the storage device and one or more level shifters providing two or more interfaces to the respective selection circuit. | 09-06-2012 |
20120224410 | THREE DIMENSIONAL MEMORY SYSTEM WITH INTELLIGENT SELECT CIRCUIT - A three dimensional monolithic memory array of non-volatile storage elements includes a plurality of word lines and a plurality of bit lines. The plurality of bit lines are grouped into columns. Performing memory operation on the non-volatile storage elements includes selectively connecting bit lines to sense amplifiers using selection circuits that include a storage device, a select circuit connected to the storage device and one or more level shifters providing two or more interfaces to the respective selection circuit. | 09-06-2012 |
20120224411 | NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND FORMING METHOD - According to one embodiment, a control unit multiple-selects a first line for every N lines from a plurality of first lines. N is an integer greater than or equal to one. The control unit sets the multiple-selected first lines to a selection potential, and fixes potentials of non-selected first lines at least adjacent to the multiple-selected first lines at a first timing. The control unit causes the multiple-selected first lines to be in a floating state at a second timing after the first timing. The control unit selects one second line from the plurality of second lines and sets the one second line to a forming potential at a third timing after the second timing. | 09-06-2012 |
20120224412 | SEMICONDUCTOR STORAGE DEVICE AND TEST METHOD THEREOF - A memory includes memory cells each storing data according to a change in a resistance state, and reference cells referred to in order to detect data stored in the memory cells. Sense amplifiers compare reference data in the reference cells with data in the memory cells to detect the data in the memory cells. A counter counts a number N | 09-06-2012 |
20120224413 | Non-Volatile Storage System Using Opposite Polarity Programming Signals For MIM Memory Cell - A reversible resistance-switching metal-insulator-metal (MIM) stack is provided which can be set to a low resistance state with a first polarity signal and reset to a higher resistance state with a second polarity signal. The first polarity signal is opposite in polarity than the second polarity signal. In one approach, the MIM stack includes a carbon-based reversible resistivity switching material such as a carbon nanotube material. The MIM stack can further include one or more additional reversible resistivity switching materials such as metal oxide above and/or below the carbon-based reversible resistivity switching material. In another approach, a metal oxide layer is between separate layers of carbon-based reversible resistivity switching material. | 09-06-2012 |
20120230080 | Variable Resistance Device, Semiconductor Device Including The Variable Resistance Device, And Method Of Operating The Semiconductor Device - According to an example embodiment, a method of operating a semiconductor device includes applying a first voltage to the variable resistance device so as to change a resistance value of the variable resistance device from a first resistance value to a second resistance value that is different from the first resistance value, sensing first current flowing through the variable resistance device to which the first voltage is applied, determining a second voltage used to change the resistance value of the variable resistance device from the second resistance value to the first resistance value based on a distribution of the sensed first current, and applying the determined second voltage to the variable resistance device. | 09-13-2012 |
20120230081 | CELL-STATE MEASUREMENT IN RESISTIVE MEMORY - Apparatus and method for measuring the state of a resistive memory cell. A bias voltage controller applies a bias voltage to the cell and controls the level of the bias voltage. A feedback signal generator senses cell current due to the bias voltage and generates a feedback signal (S | 09-13-2012 |
20120230082 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF RESETTING THE SAME - A nonvolatile semiconductor memory device includes: a plurality of memory cell arrays stacked on a semiconductor substrate and including a plurality of first wires, a plurality of second wires and memory cells disposed at intersections of the first wires and the second wires and having a rectifier element and a variable resistive element are connected in series; and a control circuit configured to selectively drive the first wires and the second wires. The control circuit executes a resetting operation to change a state of the variable resistive element from a low resistance state to a high resistance state. At a time of executing the resetting operation, the control circuit increases a pulse voltage to be applied to the variable resistive element to a first voltage, and then decreases the pulse voltage to a second voltage lower than the first voltage and higher than the ground voltage. | 09-13-2012 |
20120230083 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprising: a memory cell array in which memory cells each containing a variable resistive element and a rectifier element connected in series are arranged at intersections of a plurality of first wirings and a plurality of second wirings; and a control circuit for selectively driving said first wirings and said second wirings; wherein said control circuit applies a first voltage to said selected first wiring, and changes said first voltage based on the position of said selected memory cell within said memory cell array to apply a second voltage to said selected second wiring, so that a predetermined potential difference is applied to a selected memory cell arranged at the intersection between said selected first wiring and said selected second wiring. | 09-13-2012 |
20120230084 | APPARATUS FOR VARIABLE RESISTIVE MEMORY PUNCHTHROUGH ACCESS METHOD - Variable resistive punchthrough access methods are described. The methods include switching a variable resistive data cell from a high resistance state to a low resistance state by passing a write current through the magnetic tunnel junction data cell in a first direction. The write current is provided by a transistor being electrically coupled to the variable resistive data cell and a source line. The write current passes through the transistor in punchthrough mode. | 09-13-2012 |
20120230085 | FORMING METHOD OF PERFORMING FORMING ON VARIABLE RESISTANCE NONVOLATILE MEMORY ELEMENT, AND VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE - In forming, an automatic forming circuit ( | 09-13-2012 |
20120236623 | SENSING RESISTIVE STATES - A memory device capable of being sensed with an oscillating signal includes a first terminal of a memristive element connected to an oscillating signal supply, and a second terminal of the memristive element connected to sensing circuitry, the sensing circuitry to determine an attenuation of an oscillating signal from the oscillating signal supply. A crossbar array includes a first set of parallel lines selectively connected to an oscillating signal supply, a second set of parallel lines intersecting the first set of parallel lines, the second set of parallel lines selectively connected to sensing circuitry, memristive memory elements being disposed at crosspoints between the first set of parallel lines and the second set of parallel lines, in which a memory controller of the crossbar array is to determine a resistive state of one of the memory elements by determining, with the sensing circuitry, an attenuation of an oscillating signal produced by the oscillating signal supply. | 09-20-2012 |
20120236624 | Balanced Method for Programming Multi-Layer Cell Memories - Improved methods for programming multi-level metal oxide memory cells balance applied voltage and current to provide improved performance. Set programming, which transitions the memory cell to a lower resistance state, is accomplished by determining an appropriate programming voltage and current limit for the objective resistance state to be achieved in the programming and then applying a pulse having the determined set electrical characteristics. Reset programming, which transitions the memory cell to a higher resistance state, is accomplished by determining an appropriate programming voltage and optionally current limit for the state to be achieved in the programming and then applying a pulse having the determined electrical characteristics. The algorithm used to determine the appropriate set or reset programming voltage and current values provides for effective programming without stressing the memory element. The electrical characteristics for programming pulses may be stored in a data table used in a table look up algorithm. | 09-20-2012 |
20120236625 | MEMORY ELEMENT AND MEMORY DEVICE - There are provided a memory element and a memory device with improved writing and erasing characteristics during operations at a low voltage and a low current. The memory element includes a first electrode, a memory layer, and a second electrode in this order. The memory layer includes a resistance change layer provided on the first electrode side, an ion source layer provided on the second electrode side, an intermediate layer provided between the resistance change layer and the ion source layer, and a barrier layer provided at least either between the ion source layer and the intermediate layer, or between the intermediate layer and the resistance change layer, and the barrier layer containing a transition metal or a nitride thereof. | 09-20-2012 |
20120236626 | MEMORY CELL - The object of the present invention is a non-volatile memory cell ( | 09-20-2012 |
20120236627 | MULTI-LEVEL MEMORY DEVICES AND METHODS OF OPERATING THE SAME - The present invention provides a multi-level memory device and method of operating the same. The device comprises a memory structure in which a distribution density of resistance levels around its minimum value is higher than that around its maximum value. | 09-20-2012 |
20120236628 | VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE - In a nonvolatile memory device, basic array planes ( | 09-20-2012 |
20120243292 | MEMORY DEVICE - According to one embodiment, a memory device includes a first electrode including a crystallized Si | 09-27-2012 |
20120243293 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell includes a variable resistance element and a capacitor connected in series between first and second conductive lines, and a control circuit applying one of first and second voltage pulses to the memory cell. The capacitor is charged by a leading edge of one of the first and second voltage pulses, and discharged a trailing edge of one of the first and second voltage pulses. The control circuit makes waveforms of the trailing edges of the first and second voltage pulses be different, changes a resistance value of the variable resistance element from a first resistance value to a second resistance value by using the first voltage pulse, and changes the resistance value of the variable resistance element from the second resistance value to the first resistance value by using the second voltage pulse. | 09-27-2012 |
20120243294 | RESISTANCE-CHANGE MEMORY - According to one embodiment, a resistance-change memory includes bit lines, word lines, a memory cell array including memory cells arranged at intersections between the bit lines and the word lines, each of the memory cells including a variable-resistance element and a diode, a control circuit configured to apply a reverse bias to the diode, and to write data to a selected memory cell, and a current limiting circuit configured to limit a current flowing to the selected memory cell in a write. The current limiting circuit controls the current flowing to the selected memory cell not to exceed a second compliance current obtained by adding a leakage current from an unselected memory cell to a predetermined first compliance current. | 09-27-2012 |
20120243295 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF CONTROL THEREIN - A nonvolatile semiconductor memory device comprises a memory cell array, a control circuit, a current limiting circuit and a current suppression circuit. The memory cell array has a first line, a second line, and a memory cell arranged therein, the memory cell being connected between the first line and the second line and including a variable resistance element. The control circuit is configured to apply, via the first line and the second line, a voltage required in operation of the memory cell. The current limiting circuit is connected to the first line and configured to limit a current flowing in the memory cell to a certain limit value. The current suppression circuit is configured connectable to the second line and configured to suppress a current flowing in the second line according to a kind of operation on the memory cell. | 09-27-2012 |
20120243296 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes: plural word lines extending in a first direction; first to third bit lines extending in a second direction that intersects with the first direction; plural variable resistance elements each having a first terminal connected to either one of the first and third bit lines; plural active areas extending in a direction oblique to the first direction while intersecting with the first to third bit lines; plural select transistors provided on the active areas and each having a gate connected to a corresponding one of the word lines, and a current path whose one end is connected to a second terminal of a corresponding one of the variable resistance elements; and plural contact plugs each connecting the other end of the current path of a corresponding one of the select transistors to the second bit line. | 09-27-2012 |
20120243297 | RESISTANCE CHANGE TYPE MEMORY - According to one embodiment, a resistance change type memory includes first to third bit lines, a word line and a memory cell connected to the first to third bit lines and the word line. The memory cell includes a first transistor and a first memory element between the first and third bit lines, a second transistor and a second memory element between the second and third bit lines. Control terminals of the first and second transistors are connected to the word line. The resistance states of the first and second memory elements change to the first or second resistance state in accordance with a write pulse. | 09-27-2012 |
20120243298 | METHOD AND APPARATUS PROVIDING A CROSS-POINT MEMORY ARRAY USING A VARIABLE RESISTANCE MEMORY CELL AND CAPACITANCE - The invention relates to a method and apparatus providing a memory cell array in which each resistance memory cell is connected in series to a capacitive element. Access transistors are not necessary to perform read and write operations on the memory cell. In one exemplary embodiment, the capacitive element is a capacitor. | 09-27-2012 |
20120250393 | SEMICONDUCTOR MEMORY DEVICE AND CONTROLLING METHOD THEREOF - According to one embodiment, a semiconductor memory device includes a memory cell array in which memory cells each including at least a rectification element and a variable resistance element, which are connected in series, a peripheral circuit, a sense amplifier configured to sense the memory cells via the peripheral circuit, and a control circuit configured to control operations of the memory cell array and the sense amplifier. The control circuit is configured to boost a potential of a selected bit line, which is one of a first even bit line and a first odd bit line of a first side, by charge sharing of a second even bit line and a second odd bit line which are nonselected bit lines and physically neighbor the first even bit line or the first odd bit line of the first side, which is connected to a selected one of the memory cells. | 10-04-2012 |
20120250394 | RESISTANCE CHANGE MEMORY - According to one embodiment, a resistance change memory includes a memory cell including a resistance change element and a stacked layer structure which are connected in series, a control circuit configured to control a first operation of changing the resistance change element from a first resistance value to a second resistance value lower than the first resistance value, and a voltage pulse generating circuit configured to generate a first voltage pulse to be applied to the memory cell in the first operation. The stacked layer structure includes two conductive layers and an insulating layer formed between the two conductive layers. Amplitude of the first voltage pulse is in a first voltage area in which the stacked layer structure functions as a capacitor. The first voltage pulse satisfies Ron×C10-04-2012 | |
20120250395 | SELECTOR TYPE ELECTRONIC DEVICE - An electronic device includes a first electrode, a second electrode and a solid electrolyte having a base of an ion conducting material. The device remains in the highly resistive state for as long as a first threshold voltage between the first electrode and the second electrode is not reached. The device switches from the state of high resistance to the state of low resistance when the potential difference between the first electrode and the second electrode is equal to or greater than the first threshold voltage. The device switches from the state of low resistance to the state of high resistance when the potential difference between the first electrode and the second electrode equal to or greater than this first threshold voltage is removed and as it decreases it reaches a second positive voltage threshold strictly lower than the first threshold voltage. | 10-04-2012 |
20120250396 | VERTICALLY STACKED FIELD PROGRAMMABLE NONVOLATILE MEMORY AND METHOD OF FABRICATION - A memory cell is provided that includes a steering element, and a non-volatile state change element coupled in series with the steering element. The steering element and state change element are disposed in a vertically-oriented pillar. Other aspects are also provided. | 10-04-2012 |
20120257436 | SEMICONDUCTOR INTERGRATED CIRCUIT AND OPERATING METHOD THEREOF - A semiconductor integrated circuit includes a variable resistive element, a current supply unit and a control signal generating unit. The resistance of the variable resistive element is changed depending on current flowing therethrough. The current supply unit controls the current in response to a control signal. The control signal generating unit generates the control signal by sensing the change in the resistance of the variable resistive element. | 10-11-2012 |
20120257437 | SEMICONDUCTOR DEVICE - A semiconductor device includes first and second interconnects, a variable resistance element that may assume a first resistance value or a second resistance value in response to the current flowing therein, and second transistors connected between the first and second interconnects in series with each other on both sides of the variable resistance element, and a power supply circuit unit that delivers the power supply to a control electrode of the first transistor. The power supply circuit unit supplies the power of a first power supply when the variable resistance element is to make transition to the first resistance value and the power supply circuit unit supplies the power of a second power supply when the variable resistance element is to make transition to the second resistance value, thereby allowing transitioning of the resistance values of the variable resistance element | 10-11-2012 |
20120257438 | CONTEMPORANEOUS MARGIN VERIFICATION AND MEMORY ACCESS FOR MEMORY CELLS IN CROSS POINT MEMORY ARRAYS - Circuitry for restoring data values in re-writable non-volatile memory is disclosed. An integrated circuit includes a memory access circuit and a sensing circuit configured to sense a data signal during a read operation to at least one two-terminal non-volatile cross-point memory array. Each memory array includes a plurality of two-terminal memory elements. A plurality of the memory arrays can be fabricated over the substrate and vertically stacked on one another. Further, the integrated circuit can include a margin manager circuit configured to manage a read margin for the two-terminal memory elements substantially during the read operation, thereby providing for contemporaneous read and margin determination operations. Stored data read from the two-terminal memory elements may have a value of the stored data restored (e.g., re-written to the same cell or another cell) if the value is not associated with a read margin (e.g., a hard programmed or hard erased state). | 10-11-2012 |
20120262980 | RANDOM ACCESS MEMORY WITH CMOS-COMPATIBLE NONVOLATILE STORAGE ELEMENT AND PARALLEL STORAGE CAPACITOR - Systems, methods, and memory device with row lines and column lines arranged in a matrix configuration with a memory cell coupled to one of the column lines and one of the row lines. The memory cell includes a storage capacitor with a first plate coupled to a storage node, a CMOS-compatible non-volatile storage element having a node coupled to the storage node and configured to hold a charge corresponding to a binary value, and an access transistor coupled to the storage node. The access transistor includes a word line gate, a first node, and a second node, the word line gate being coupled to the one of the plurality of row lines, the first node being coupled to the one of the plurality of column lines, the second node being coupled to the storage node and to said node of the CMOS-compatible non-volatile storage element. | 10-18-2012 |
20120262981 | DATA RETENTION STRUCTURE FOR NON-VOLATILE MEMORY - A data retention structure in a memory element that stores data as a plurality of conductivity profiles is disclosed. The memory element can be used in a variety of electrical systems and includes a conductive oxide layer, an ion impeding layer, and an electrolytic tunnel barrier layer. A write voltage applied across the memory element causes a portion of the mobile ions to move from the conductive oxide layer, through the ion impeding layer, and into the electrolytic tunnel barrier layer thereby changing a conductivity of the memory element, or the write voltage causes a quantity of the mobile ions to move from the electrolytic tunnel barrier layer, through the ion impeding layer, and back into the conductive oxide layer. The ion impeding layer is operative to substantially stop mobile ion movement when a voltage that is less than the write voltage is applied across the memory element. | 10-18-2012 |
20120268980 | NONVOLATILE VARIABLE RESISTIVE ELEMENT AND NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A large-capacity and inexpensive nonvolatile semiconductor memory device that prevents a leak current and is operated at high speed is implemented with a nonvolatile variable resistive element. A memory cell array includes the nonvolatile variable resistive elements each including a variable resistor composed of a metal oxide film to cause a resistance change according to an oxygen concentration in the film, an insulation film formed on the variable resistor, first and second electrodes to sandwich the variable resistor, and a third electrode opposite to the variable resistor across the insulation film. A writing operation is performed by applying a voltage to the third electrode to induce an electric field having a threshold value or more, in a direction perpendicular to an interface between the variable resistor and the insulation film, and a resistance state of the variable resistor is read by applying a voltage between the first and second electrodes. | 10-25-2012 |
20120268981 | SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD - In a semiconductor device including a memory cell array formed of memory cells using a storage element by a variable resistor and a select transistor, a buffer cell is arranged between a sense amplifier and the memory cell array and between a word driver and the memory cell array. The resistive storage element in the memory cell is connected to a bit-line via a contact formed above the resistive storage element. Meanwhile, in the buffer cell, the contact is not formed above the resistive storage element, and a state of being covered with an insulator is kept upon processing the contact in the memory cell. By such a processing method, exposure and sublimation of a chalcogenide film used in the resistive storage element can be avoided. | 10-25-2012 |
20120275210 | NON-VOLATILE STORAGE SYSTEM WITH DUAL BLOCK PROGRAMMING - A non-volatile storage system is disclosed that includes a plurality of blocks of non-volatile storage elements, a plurality of word lines connected to the blocks of non-volatile storage elements such that each word line is connected to adjacent blocks of non-volatile storage elements, a plurality of bit lines connected to the blocks of non-volatile storage elements, multiple sets of word lines drivers such that each set of word line drivers is positioned between two adjacent blocks for driving word lines connected to the two adjacent blocks, global data lines, local data lines in selective communication with the bit lines, one or more selection circuits that selectively connect the global data lines to selected local data lines and connect unselected local data lines to one or more unselected bit line signals and control circuitry in communication with the one or more selection circuits and the global data lines. The control circuitry concurrently programs non-volatile storage elements of two adjacent blocks by applying programming signals on word lines connected to the two adjacent blocks and applying programming signals on appropriate bit lines via the global data lines and the one or more selection circuits. | 11-01-2012 |
20120275211 | Reconfigurable Crossbar Memory Array - A two-dimensional array of switching devices comprises a plurality of crossbar tiles. Each crossbar tile has a plurality of row wire segments intersecting a plurality of column wire segments, and a plurality of switching devices each formed at an intersection of a row wire segment and a column wire segment. The array has a plurality of lateral latches disposed in a plane of the switching devices. Each lateral latch is linked to a first wire segment of a first crossbar tile and a second wire segment of a second crossbar tile opposing the first wire segment. The lateral latch is operable to close or open to form or break an electric connection between the first and second wire segments. | 11-01-2012 |
20120275212 | Self-Body Biasing Sensing Circuit for Resistance-Based Memories - A resistance based memory sensing circuit has reference current transistors feeding a reference node and a read current transistor feeding a sense node, each transistor has a substrate body at a regular substrate voltage during a stand-by mode and biased during a sensing mode at a body bias voltage lower than the regular substrate voltage. In one option the body bias voltage is determined by a reference voltage on the reference node. The substrate body at the regular substrate voltage causes the transistors to have a regular threshold voltage, and the substrate body at the body bias voltage causes the transistors to have a sense mode threshold voltage, lower than the regular threshold voltage. | 11-01-2012 |
20120281452 | RESISTIVE RANDOM MEMORY CELL AND MEMORY - The present disclosure provides a resistive random memory cell and a resistive random memory. The resistive random memory cell comprises an upper electrode, a resistive layer, an intermediate electrode, an asymmetric tunneling barrier layer, and a lower electrode. The upper electrode, the resistive layer, and the intermediate electrode constitute a resistive storage portion. The intermediate electrode, the asymmetric tunneling barrier layer, and the lower electrode constitute a selection portion. The resistive storage portion and the selection portion share the intermediate electrode. The selection portion may be disposed above or under the resistive storage portion. The asymmetric tunneling barrier layer comprises at least two materials having different barrier heights, and is configured for rectifying forward tunneling current and reverse tunneling current flowing through the resistive random memory cell. The present disclosure uses the asymmetric tunneling barrier layer for rectifying, so as to enable selection of the resistive random memory cell. The method for manufacturing the asymmetric tunneling barrier layer does not involve doping or high-temperature annealing processes, and the thickness of the asymmetric tunneling barrier layer is relatively small, which helps 3D high-density integration of the resistive random memory. | 11-08-2012 |
20120281453 | VARIABLE RESISTANCE NONVOLATILE STORAGE DEVICE - The variable resistance nonvolatile storage device includes a memory cell ( | 11-08-2012 |
20120281454 | Method and Apparatus for Decoding Memory - A thin-film memory may include a thin-film transistor-free address decoder in conjunction with thin-film memory elements to yield an all-thin-film memory. Such a thin-film memory excludes all single-crystal electronic devices and may be formed, for example, on a low-cost substrate, such as fiberglass, glass or ceramic. The memory may be configured for operation with an external memory controller. | 11-08-2012 |
20120287697 | SEMICONDUCTOR STORAGE DEVICE - A semiconductor storage device crystallizes variable resistive element material layers arranged on side surfaces of multiple semiconductor layers in a stacked structure concurrently by applying a first current to any one of semiconductor layers in the stacked structure, and thereafter applies a second current to semiconductor layers other than a semiconductor layer to which the first current was applied. | 11-15-2012 |
20120287698 | Using a Bit Specific Reference Level to Read a Memory - A voltage derived from accessing a selected bit using one read current may be utilized to read a selected bit of an untriggered phase change memory after the read current is changed. As a result, different reference voltages may be used to sense the state of more resistive versus a less resistive selected cells. The resulting read. window or margin may be improved in some embodiments. | 11-15-2012 |
20120294063 | MEMORY ELEMENT AND MEMORY DEVICE - There are provided a memory element and a memory device excellently operating at a low current, and having the satisfactory retention characteristics. The memory element includes a first electrode, a memory layer, and a second electrode in this order. The memory layer includes a resistance change layer disposed on the first electrode side, and being in a single- or multi-layer structure including a layer containing a highest percentage of tellurium (Te) as an anionic component, and an ion source layer disposed on the second electrode side, and containing a metallic element and one or more chalcogen elements including tellurium (Te), sulfur (S), and selenium (Se) with aluminum (Al) of 27.7 atomic % or more but 47.4 atomic % or less. | 11-22-2012 |
20120294064 | VARIABLE-RESISTANCE MEMORY DEVICE AND ITS OPERATION METHOD - Disclosed herein is a variable-resistance memory device including a first common line; a second common line; a storage element connected between the first common line and the second common line to serve as a storage element whose resistance changes in accordance with a voltage applied to the storage element; and a driving control circuit. | 11-22-2012 |
20120294065 | VARIABLE RESISTANCE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME - According to an example embodiment, a variable resistance memory device includes a lower electrode that includes a spacer-shaped first sub lower electrode and a second sub lower electrode covering a curved sidewall of the first sub lower electrode. The second sub lower electrode extends upward to protrude above the top of the first sub lower electrode. The lower electrode includes an upward-tapered shape. | 11-22-2012 |
20120300530 | MEMORY CELL OPERATION - Methods, devices, and systems associated with memory cell operation are described. One or more methods of operating a memory cell include charging a capacitor coupled to the memory cell to a particular voltage level and programming the memory cell from a first state to a second state by controlling discharge of the capacitor through a resistive switching element of the memory cell. | 11-29-2012 |
20120300531 | Current Writing Circuit for a Resistive Memory Cell Arrangement - A current writing circuit for a resistive memory cell arrangement is provided. The current writing circuit comprises a first current source; a first reference potential terminal; a first switch configured to switch between the first current source and the first reference potential terminal during a write operation; a second current source; a second reference potential terminal; and a second switch configured to switch between the second reference potential terminal when the first switch is switched to the first current source, and the second current source when the first switch is switched to the first reference potential terminal, during the write operation, wherein the first current source and the second current source are of the same polarity. Further embodiments relate to a memory cell arrangement and a method of writing into a target resistive memory cell of a resistive memory cell arrangement. | 11-29-2012 |
20120300532 | METHOD OF FORMING PROCESS FOR VARIABLE RESISTIVE ELEMENT AND NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - A method of a forming process for a variable resistive element, which is performed in short time comparable to the pulse forming and a writing current in a switching action is the same level as that of the DC forming, is provided. In the forming process, a variable resistive element is changed by voltage pulse application from an initial high resistance state just after produced to a variable resistance state where the switching action is performed. The forming process includes a first step of applying a first pulse having a voltage amplitude lower than a threshold voltage at which the resistance of the variable resistive element is lowered, to between both electrodes of the variable resistive element, and a second step of applying a second pulse having a voltage amplitude having the same polarity as the first pulse and not lower than the threshold voltage, thereto after the first step. | 11-29-2012 |
20120300533 | NONVOLATILE MEMORY CELL OPERATING BY INCREASING ORDER IN POLYCRYSTALLINE SEMICONDUCTOR MATERIAL - A memory cell is provided that includes a first conductor, a second conductor, and a semiconductor junction diode between the first and second conductors. The semiconductor junction diode is not in contact with a material having a lattice mismatch of less than 12 percent with the semiconductor junction diode. In addition, no resistance-switching element having its resistance changed by application of a programming voltage by more than a factor of two is disposed between the semiconductor junction diode and the first conductor or between the semiconductor junction diode and the second conductor. Numerous other aspects are provided. | 11-29-2012 |
20120300534 | HIGH DENSITY MEMORY DEVICE - A method of operating a memory device having a dielectric material layer, a transition metal oxide layer and a set of electrodes each formed over a substrate, includes applying a voltage across the set of electrodes producing an electric field across the transition metal oxide layer enabling the transition metal oxide layer to undergo a metal-insulation transition (MIT) to perform a read or write operation on memory device. | 11-29-2012 |
20120300535 | NON-VOLATILE MEMORY DEVICE ION BARRIER - An ion barrier layer made from a dielectric material in contact with an electronically insulating layer is operative to prevent mobile ions transported into the electronically insulating layer from passing through the ion barrier layer and into adjacent layers during data operations on a non-volatile memory cell. A conductive oxide layer in contact with the electronically insulating layer is the source of the mobile ions. A programming data operation is operative to transport a portion of the mobile ions into the electronically insulating layer and an erase data operation is operative to transport the mobile ions back into the conductive oxide layer. When the portion is positioned in the electronically insulating layer the memory cell stores data as a programmed conductivity profile and when a substantial majority of the mobile ions are positioned in the conductive oxide layer the memory cell stores data as an erased conductivity profile. | 11-29-2012 |
20120307546 | NON-VOLATILE MEMORY CELL INCLUDING A RESISTIVITY CHANGE MATERIAL - A non-volatile memory cell including a resistivity change material configured to reversibly change state between at least two stable states having different electrical resistances and conformed such that transformation from one state to another is obtained by controlling the temperature increase or decrease of the resistivity change material, wherein the resistivity change material has an ohmic component R | 12-06-2012 |
20120307547 | RESISTIVE MEMORY DEVICES AND MEMORY SYSTEMS HAVING THE SAME - A nonvolatile memory device includes an array of resistive memory cells and a write driver, which is configured to drive a selected bit line in the array with a reset current pulse, which is responsive to a first external voltage input through a first terminal/pad of the memory device during a memory cell reset operation. The write driver is further configured to drive the selected bit line in sequence with a first set current pulse, which is responsive to the first external voltage, and a second set current pulse, which is responsive to a second external voltage input through a second terminal/pad of the memory device during a memory cell set operation. | 12-06-2012 |
20120314477 | Array voltage regulating technique to enable data operations on large cross-point memory arrays with resistive memory elements - Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to preserve states of memory elements in association with data operations using variable access signal magnitudes for other memory elements, such as implemented in third dimensional memory technology. In some embodiments, a memory device can include a cross-point array with resistive memory elements. An access signal generator can modify a magnitude of a signal to generate a modified magnitude for the signal to access a resistive memory element associated with a word line and a subset of bit lines. A tracking signal generator is configured to track the modified magnitude of the signal and to apply a tracking signal to other resistive memory elements associated with other subsets of bit lines, the tracking signal having a magnitude at a differential amount from the modified magnitude of the signal. | 12-13-2012 |
20120314478 | RESISTIVE MEMORY DEVICE AND SENSING MARGIN TRIMMING METHOD THEREOF - A resistive memory device and a sensing margin trimming method are provided. The resistive memory device includes a memory cell array and a trimming circuit. The memory cell array has a plurality of resistive memory cells. The trimming circuit generates a trimming signal according to a characteristic distribution shift value of the resistive memory cells. With the inventive concept, although a characteristic distribution of memory cells is varied, an erroneous read operation is minimized or reduced by securing a sensing margin stably. Accordingly, a fabrication yield of the resistive memory device is bettered. | 12-13-2012 |
20120314479 | MEMORY ELEMENT AND MEMORY DEVICE - A memory element includes: a memory layer disposed between a first electrode and a second electrode. The memory layer includes: an ion source layer containing one or more metallic elements, and one or more chalcogen elements of tellurium (Te), sulfur (S), and selenium (Se); and a resistance change layer disposed between the ion source layer and the first electrode, the resistance change layer including a layer which includes tellurium and nitrogen (N) and is in contact with the ion source layer. | 12-13-2012 |
20120314480 | SEMICONDUCTOR MEMORY DEVICE - In a semiconductor memory device using a variable resistive element made of a metal oxide for storing information, a voltage amplitude of a writing voltage pulse for changing the variable resistive element to a high resistance state is set within a voltage range in which the resistance value of the high resistance state after the change increases with time. The voltage amplitude is set within the voltage range in which the resistance value of the high resistance state after the change increases toward a predetermined peak with increase in voltage amplitude. When a data error is detected by the ECC circuit, it is estimated that the data that should be in the low resistance state changes to the high resistance state, and the variable resistive elements of all memory cells from which the error is detected are written to the low resistance state to correct the error bit. | 12-13-2012 |
20120314481 | CELL-STATE MEASUREMENT IN RESISTIVE MEMORY - Apparatus and method for measuring the state of a resistive memory cell. A bias voltage controller applies a bias voltage to the cell and controls the level of the bias voltage. A feedback signal generator senses cell current due to the bias voltage and generates a feedback signal (S | 12-13-2012 |
20120320658 | NONVOLATILE STATIC RANDOM ACCESS MEMORY CELL AND MEMORY CIRCUIT - A non-volatile static random access memory (NVSRAM) cell including a static random access circuit, first storage device, a second storage device, and a switch unit is provided. The static random access circuit has a first terminal and a second terminal respectively having a first voltage and a second voltage. Stored data in the first storage device and the second storage device are determined by the first voltage and the second voltage. The first storage device and the second storage device respectively have a first connection terminal and a second connection terminal. The switch unit is respectively coupled to the second connection terminals of the first storage device and the second storage device, and is controlled by a switching signal of a switch line to conduct the first storage device and the second storage device to a same bit line or a same complementary bit line. | 12-20-2012 |
20120320659 | RESISTANCE-CHANGE MEMORY DEVICE AND METHOD OF OPERATING THE SAME - Disclosed herein is a resistance-change memory device including a bit line; a voltage supplying layer; a memory element connected between the bit line and the voltage supplying layer, a resistance value of the memory element being changed in accordance with an applied voltage; and a drive controlling circuit causing a first current to flow through the bit line and causing a second current smaller than the first current to flow through the bit line, thereby controlling a resistance decreasing operation in which the memory element is made to transit from a high resistance state to a low resistance state by using the second current. | 12-20-2012 |
20120320660 | WRITE AND ERASE SCHEME FOR RESISTIVE MEMORY DEVICE - A method for programming a two terminal resistive memory device, the method includes applying a bias voltage to a first electrode of a resistive memory cell of the device; measuring a current flowing through the cell; and stopping the applying of the bias voltage if the measured current is equal to or greater than a predetermined value. | 12-20-2012 |
20120320661 | METHOD OF PROGRAMMING VARIABLE RESISTANCE ELEMENT AND NONVOLATILE STORAGE DEVICE - A method includes applying a first polarity writing voltage pulse to a metal oxide layer to change its resistance state from high to low into a write state, applying a second polarity erasing voltage pulse different from the first polarity to the metal oxide layer to change its resistance state from low to high into an erase state, and applying an initial voltage pulse having the second polarity to the metal oxide layer before first application of the writing voltage pulse, to change an initial resistance value of the metal oxide layer. R | 12-20-2012 |
20120320662 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device in accordance with an embodiment comprises a plurality of first, second lines, a plurality of memory cells, and a control circuit. The plurality of second lines extend so as to intersect the first lines. The plurality of memory cells are disposed at intersections of the first, second lines, and each includes a variable resistor. The control circuit is configured to control a voltage applied to the memory cells. The control circuit applies a first pulse voltage to the variable resistor during a forming operation. In addition, the control circuit applies a second pulse voltage to the variable resistor during a setting operation, the second pulse voltage having a polarity opposite to the first pulse voltage. Furthermore, the control circuit applies a third pulse voltage to the variable resistor during a resetting operation, the third pulse voltage having a polarity identical to the first pulse voltage. | 12-20-2012 |
20120327701 | MEMORY ARRAY ARCHITECTURE WITH TWO-TERMINAL MEMORY CELLS - A non-volatile memory device includes a word line extending along a first direction; a bit line extending along a second direction; a memory unit having a read transistor coupled to the bit line, at least one two-terminal memory cell, and a select transistor, the two-terminal memory cell having a first end coupled to the word line and a second end coupled to a gate of the read transistor. The second end of the two-terminal memory cell is coupled to a common node shared by a drain of the select transistor and the gate of the read transistor. | 12-27-2012 |
20120327702 | NONVOLATILE MEMORY ELEMENT AND NONVOLATILE MEMORY DEVICE - A nonvolatile memory element includes: a first electrode layer; a second electrode layer; and a variable resistance layer which is placed between the electrode layers, and whose resistance state reversibly changes between a high resistance state and a low resistance state based on a polarity of a voltage applied between the electrode layers. The variable resistance layer is formed by stacking a first oxide layer including an oxide of a first transition metal and a second oxide layer including an oxide of a second transition metal which is different from the first transition metal. At least one of the following conditions is satisfied: (1) a dielectric constant of the second oxide layer is larger than a dielectric constant of the first oxide layer; and (2) a band gap of the second oxide layer is smaller than a band gap of the first oxide layer. | 12-27-2012 |
20130003437 | Multilayer Cross-Point Memory Array Having Reduced Disturb Susceptibility - A multi-layer cross-point memory array comprises one or more word line (WL) layers, one or more bit line (BL) layers interleaved with the one or more WL layers, and a plurality of memory layers, each memory layer disposed between an adjacent WL layer and an adjacent BL layer, and each memory layer including memory elements configured between cross-points of WLs and BLs of the adjacent WL and BL layers. Memory elements in successive memory layers of the memory array are configured with opposing orientations, so that half-selected memory elements arising during times when data operations are being performed on selected memory elements in the memory array are subjected to stress voltages of a polarity of which they are least susceptible to being disturbed. The memory elements can be discrete re-writeable non-volatile two-terminal memory elements that are fabricated as part of a BEOL fabrication process used to fabricate the memory array. | 01-03-2013 |
20130003438 | THERMAL MANAGEMENT APPARATUSES WITH TEMPERATURE SENSING RESISTIVE RANDOM ACCESS MEMORY DEVICES AND METHODS THEREOF - An apparatus includes one or more temperature sensing and memory devices each having one or more memristors. A controller device is coupled to the temperature sensing and memory devices A processing device is coupled to the controller device and includes at least one of hardware logic configured to be capable of implementing or a processor coupled to a memory and configured to execute programmed instructions stored in the memory comprising: issuing a record instruction and a write instruction with a write address to the controller device to record the write time for the memristor at the write address to transition from one of the first and second states to the other states; receiving from the controller device the recorded time; determining and providing a temperature of the memristor at the write address based on the received. | 01-03-2013 |
20130003439 | NONVOLATILE VARIABLE RESISTANCE MEMORY ELEMENT WRITING METHOD, AND NONVOLATILE VARIABLE RESISTANCE MEMORY DEVICE - A method of writing data to a variable resistance element ( | 01-03-2013 |
20130003440 | Single Device Driver Circuit to Control Three-Dimensional Memory Element Array - A memory device includes diode plus resistivity switching element memory cells coupled between bit and word lines, single device bit line drivers with gates coupled to a bit line decoder control lead, sources/drains coupled to a bit line driver, and drains/sources coupled to bit lines, single device word line drivers with gates coupled to a word line decoder control lead, sources/drains coupled to a word line driver output, and drains/sources coupled to word lines, a first bleeder diode coupled between a bit line and a first bleeder diode controller, and a second bleeder diode coupled between a word line and a second bleeder diode controller. The first bleeder diode controller connects the first bleeder diode to low voltage in response to a bit line decoder signal. The second bleeder diode controller connects the second bleeder diode to high voltage in response to a word line decoder signal. | 01-03-2013 |
20130010520 | MEMORY DEVICE AND FABRICATING METHOD THEREOF - According to one embodiment, a memory device includes first interconnects, second interconnects, and a first memory cell. The first memory cell is located in an intersection of one of the first interconnects and one of the second interconnects. The first memory cell includes a first multilayer structure and a first variable resistance layer, the first multilayer structure including a first electrode, a first selector, and a first insulator which are stacked. The first selector and the first variable resistance layer are electrically connected in series between the one of the first interconnect and the one of the second interconnect. The first variable resistance layer is formed on a portion of a side surface of the first insulator to cover the portion without covering a residual portion. | 01-10-2013 |
20130010521 | SYSTEMS AND METHODS FOR ROW-WIRE VOLTAGE-LOSS COMPENSATION IN CROSSBAR ARRAYS - Embodiments of the present invention are directed systems and methods for reading the resistance states of crossbar junctions of a crossbar array. In one aspect, a system includes one or more sense amplifiers ( | 01-10-2013 |
20130010522 | NONVOLATILE MEMORY DEVICE AND METHOD FOR PROGRAMMING NONVOLATILE MEMORY ELEMENT - A nonvolatile memory device ( | 01-10-2013 |
20130010523 | MEMORY SYSTEM WITH DATA LINE SWITCHING SCHEME - A storage system includes a three-dimensional memory array that has multiple layers of non-volatile storage elements grouped into blocks. Each block includes a subset of first selection circuits for selectively coupling a subset of array lines (e.g. bit lines) of a first type to respective local data lines. Each block includes a subset of second selection circuits for selectively coupling a subset of the respective local data lines to global data lines that are connected to control circuitry. To increase the performance of memory operations, the second selection circuits can change their selections independently of each other. | 01-10-2013 |
20130010524 | MEMORY CELL - Methods, and circuits, are disclosed for operating a programmable memory device. One method embodiment includes storing a value as a state in a first memory cell and as a complementary state in a second memory cell. Such a method further includes determining the state of the first memory cell using a first self-biased sensing circuit and the complementary state of the second memory cell using a second self-biased sensing circuit, and comparing in a differential manner an indication of the state of the first memory cell to a reference indication of the complementary state of the second memory cell to determine the value. | 01-10-2013 |
20130010525 | REACTIVE METAL IMPLATED OXIDE BASED MEMORY - Methods, devices, and systems associated with oxide based memory can include a method of forming an oxide based memory cell. Forming an oxide based memory cell can include forming a first conductive element, forming an oxide over the first conductive element, implanting a reactive metal into the oxide, and forming a second conductive element over the oxide. | 01-10-2013 |
20130010526 | MULTI-LEVEL MEMORY CELL - Some embodiments include a memory device and methods of forming the same. The memory device can include an electrode coupled to a memory element. The electrode can include different materials located at different portions of the electrode. The materials can create different dielectrics contacting the memory elements at different locations. Various states of the materials in the memory device can be used to represent stored information. Other embodiments are described. | 01-10-2013 |
20130010527 | RESISTIVE MEMORY - The present disclosure includes resistive memory devices and systems having resistive memory cells, as well as methods for operating the resistive memory cells. One memory device embodiment includes at least one resistive memory element, a programming circuit, and a sensing circuit. For example, the programming circuit can include a switch configured to select one of N programming currents for programming the at least one resistive memory element, where each of the N programming currents has a unique combination of current direction and magnitude, with N corresponding to the number of resistance states of the at least one memory element. In one or more embodiments, the sensing circuit can be arranged for sensing of the N resistance states. | 01-10-2013 |
20130010528 | SENSING RESISTANCE VARIABLE MEMORY - The present disclosure includes devices and methods for operating resistance variable memory. One device embodiment includes an array of memory cells wherein a number of the cells are commonly coupled to a select line, the number cells including a number of data cells programmable within a number of target threshold resistance (R | 01-10-2013 |
20130010529 | NONVOLATILE MEMORY ELEMENT, MANUFACTURING METHOD THEREOF, NONVOLATILE MEMORY DEVICE, AND DESIGN SUPPORT METHOD FOR NONVOLATILE MEMORY ELEMENT - A nonvolatile memory element includes a variable resistance layer located between a lower electrode and an upper electrode and having a resistance value that reversibly changes based on electrical signals applied between these electrodes. The variable resistance layer includes at least two layers: a first variable resistance layer including a first transition metal oxide; and a second variable resistance layer including a second transition metal oxide and a transition metal compound. The second transition metal oxide has an oxygen content atomic percentage lower than an oxygen content atomic percentage of the first transition metal oxide, the transition metal compound contains either oxygen and nitrogen or oxygen and fluorine, and the second transition metal oxide and the transition metal compound are in contact with the first variable resistance layer. | 01-10-2013 |
20130010530 | METHOD FOR DRIVING NON-VOLATILE MEMORY ELEMENT, AND NON-VOLATILE MEMORY DEVICE - Provided is a method for driving a non-volatile memory element in which a variable resistance element including a first electrode, a second electrode, and a variable resistance layer capable of reversibly changing between a high resistance state and a low resistance state with application of electrical signals having different polarities is connected in series with a current steering element having bidirectional rectifying characteristics with respect to an applied voltage. After the non-volatile memory element is manufactured, the resistance value of the variable resistance layer is reduced from a resistance value in the initial resistance state higher than that in the high resistance state by applying, to the non-volatile memory element, a voltage pulse having the polarity identical to that of the voltage pulse for changing the variable resistance layer from the low resistance state to the high resistance state in the normal operations. | 01-10-2013 |
20130016552 | SEMICONDUCTOR MEMORY DEVICE FEATURING SELECTIVE DATA STORAGE IN A STACKED MEMORY CELL STRUCTURE - A semiconductor device including: a first memory cell including a non-volatile first variable resistance element that stores data by varying a resistance value and a selection transistor that selects the first variable resistance element; a first memory layer provided with more than one such first memory cell arranged in a plane; a second memory cell including a non-volatile second variable resistance element that stores data by varying a resistance value and a selection diode that selects the second variable resistance element; and a second memory layer provided with more than one such second memory cell arranged in a plane; wherein more than one such second memory layer is stacked over the first memory layer. | 01-17-2013 |
20130021834 | MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - A memory device includes a plurality of memory elements, each having a first electrode, a second electrode, and a memory layer between the first electrode and the second electrode. The plurality of memory layers are in a dotlike pattern. Two adjacent first electrodes share a same memory layer. | 01-24-2013 |
20130021835 | RESISTIVE RAM, METHOD FOR FABRICATING THE SAME, AND METHOD FOR DRIVING THE SAME - A resistive random access memory (ReRAM) includes a first electrode, a threshold switching layer formed over the first electrode and configured to perform a switching operation according to an applied voltage, a resistance change layer formed over the threshold switching layer, and configured to perform a resistance change operation, and a second electrode formed over the resistance change layer, wherein the threshold switching layer comprises a stoichiometric transition oxide while the resistance change layer comprises a non-stoichiometric transition metal oxide. | 01-24-2013 |
20130021836 | MEMORY ARCHITECTURE AND CELL DESIGN EMPLOYING TWO ACCESS TRANSISTORS - An improved memory array architecture and cell design is disclosed. In one embodiment, a memory array for an integrated circuit may comprise a plurality of memory cells. Each of the memory cells may comprise a material capable of holding a logic state and two access transistors coupled to the material. The two access transistors may be configured to access the logic state of the material, and may be independently selectable by two word lines of a plurality of word lines parallel to a first dimension. | 01-24-2013 |
20130021837 | CROSS POINT NON-VOLATILE MEMORY CELL - A memory system includes an X line, a first Y line, a second Y line, a semiconductor region of a first type running along the X line, first switching material and a first semiconductor region of a second type between the first Y line and the semiconductor region of the first type, second switching material and a second semiconductor region of the second type between the second Y line and the semiconductor region of the first type, and control circuitry. The control circuitry changes the programming state of the first switching material to a first state by causing a first current to flow from the second Y line to the first Y line through the first switching material, the second switching material, the semiconductor region of the first type, the first semiconductor region of the second type and the second semiconductor region of the second type. | 01-24-2013 |
20130021838 | METHOD OF INSPECTING VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE AND VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE - A method of inspecting a variable resistance nonvolatile memory device detecting a faulty memory cell of a memory cell array employing a current steering element, and a variable resistance nonvolatile memory device are provided. The method of inspecting a variable resistance nonvolatile memory device having a memory cell array, a memory cell selection circuit, and a read circuit includes: determining that a current steering element has a short-circuit fault when a variable resistance element is in a low resistance state and a current higher than or equal to a predetermined current passes through the current steering element, when the resistance state of the memory cell is read using a second voltage; and determining whether the variable resistance element is in the low or high resistance state, when the resistance state of the memory cell is read using a first voltage. | 01-24-2013 |
20130028003 | NONVOLATILE MEMORY DEVICE HAVING A CURRENT LIMITING ELEMENT - Embodiments of the invention generally include a method of forming a nonvolatile memory device that contains a resistive switching memory element that has an improved device switching performance and lifetime, due to the addition of a current limiting component disposed therein. In one embodiment, the current limiting component comprises at least one layer of resistive material that is configured to improve the switching performance and lifetime of the formed resistive switching memory element. The electrical properties of the formed current limiting layer, or resistive layer, are configured to lower the current flow through the variable resistance layer during the logic state programming steps (i.e., “set” and “reset” steps) by adding a fixed series resistance in the formed resistive switching memory element found in the nonvolatile memory device. | 01-31-2013 |
20130028004 | REFRESHING MEMRISTIVE SYSTEMS - A method for operating a circuit ( | 01-31-2013 |
20130028005 | RESISTIVE MEMORY ARRAY AND METHOD FOR CONTROLLING OPERATIONS OF THE SAME - A resistive memory and a method for controlling operations of the resistive memory are provided. The resistive memory has a first memory layer, a second memory layer and a medium layer. Each of the first memory layer and the second memory layer is used to store data. The medium layer is formed between the first memory layer and the second memory layer. The method comprises at least a step of measuring a resistance between the first memory layer and the second memory layer, and determining which one of a first state, a second state and a third state is a state of the resistive memory according to the measured resistance. A resistive memory array including an array of the above resistive memory units, word lines and bit lines is also described, wherein the word (bit) lines are coupled to the first (second) memory layers. | 01-31-2013 |
20130033919 | NONVOLATILE MEMORY SYSTEM AND PROGRAM METHOD THEREOF - A nonvolatile memory system and a program method thereof are provided. The nonvolatile memory system includes a nonvolatile memory cell array, an input/output (I/O) control circuit configured to control a program or read operation for the nonvolatile memory cell array; and a controller configured to store an equation representing a resistance-current (R-I) curve for resistance states of memory cells included in the nonvolatile memory cell array, apply an initial program current calculated based on the equation, calculate the equation based in on a resistance of a memory cell subjected to the initial program current, predict a reprogram current based on the equation obtained from the calculation, and control the I/O control circuit. | 02-07-2013 |
20130033920 | IONIC DEVICES CONTAINING A MEMBRANE BETWEEN LAYERS - A device contains a first layer ( | 02-07-2013 |
20130033921 | SEMICONDUCTOR DEVICE - A semiconductor device using resistive random access memory (ReRAM) elements and having improved tamper resistance is provided. The semiconductor device is provided with a unit cell which stores one bit of cell data and a control circuit. The unit cell includes n ReRAM elements (n being an integer of 2 or larger). At least one of the ReRAM elements is an effective element where the cell data is recorded. In reading the cell data, the control circuit at least selects the effective element and reads data recorded thereon as the cell data. | 02-07-2013 |
20130033922 | RESISTIVE-SWITCHING DEVICE CAPABLE OF IMPLEMENTING MULTIARY ADDITION OPERATION AND METHOD FOR MULTIARY ADDITION OPERATION - The present disclosure provides a resistive-switching device capable of implementing multiary addition operation and a method for implementing multiary addition operation using the resistive-switching device. The resistive-switching device has a plurality of resistance values each corresponding to a respective data value stored by the resistive-switching device and ranging from a high resistance value to a low resistance value. The data value stored by the resistive-switching device is increased by ‘1’ successively with a series of set pulses having a same pulse width and a same voltage amplitude being applied thereto. The data value stored by the resistive-switching device is set to ‘0’ with a reset pulse being applied thereto, and meanwhile a data value stored by a higher-bit resistive-switching device is increased by ‘1’ with a set pulse being applied thereto. In this way, multiary addition operation is implemented. The operation of the resistive-switching device can implement data storage and the multiary addition operation simultaneously, and thus substantially simplifies the circuit structure. As a result, the data storage can be integrated with calculation. | 02-07-2013 |
20130033923 | CIRCUIT FOR CONCURRENT READ OPERATION AND METHOD THEREFOR - A non-volatile memory device includes an array of memory units, each having resistive memory cells and a local word line. Each memory cell has a first and a second end, the second ends are coupled to the local word line of the corresponding memory unit. Bit lines are provided, each coupled to the first end of each resistive memory cell. A plurality of select transistors is provided, each associated with one memory unit and having a drain terminal coupled to the local word line of the associated memory unit. First and second global word lines are provided, each coupled to a control terminal of at least one select transistor. First and second source lines are provided, each coupled to a source terminal of at least one select transistor. The memory device is configured to concurrently read out all resistive memory cells in one selected memory unit in a read operation. | 02-07-2013 |
20130039118 | SEMICONDUCTOR MEMORY DEVICE HAVING DIODE CELL STRUCTURE - A semiconductor memory device comprises a memory cell, first and second voltage generating circuits generating first and second voltages, and a control circuit. A memory element and a diode included in the memory cell are connected in series between first and second lines. The first voltage has no temperature dependence, and the second voltage has a temperature dependence opposite to that of a forward voltage of the diode. The control circuit detects a resistance state of the memory element in accordance with a change in current flowing in the memory cell in a state where the first/second voltage is applied to the first/second in a read operation of the memory cell. | 02-14-2013 |
20130039119 | MEMORY CELL THAT INCLUDES MULTIPLE NON-VOLATILE MEMORIES - A system and method to read and write data at a memory cell that includes multiple non-volatile memories is disclosed. In a particular embodiment, a memory device includes a plurality of memory cells. At least one of the memory cells includes a first non-volatile memory including a first resistive memory element and a second multi-port non-volatile memory including a second resistive memory element. Each of the first non-volatile memory and the second non-volatile memory is accessible via multiple ports. | 02-14-2013 |
20130044532 | LOW TEMPERATURE BEOL COMPATIBLE DIODE HAVING HIGH VOLTAGE MARGINS FOR USE IN LARGE ARRAYS OF ELECTRONIC COMPONENTS - A crystalline semiconductor Schottky barrier-like diode sandwiched between two conducting electrodes is in series with a memory element, a word line and a bit line, wherein the setup provides voltage margins greater than 1V and current densities greater than 5×10 | 02-21-2013 |
20130044533 | MEMORY ARRAY WITH CO-PLANAR WAVEGUIDE BASED MEMORY ELEMENT SELECTION - A memory array with co-planar waveguide based memory selection includes a first set of parallel conductive lines placed perpendicular to a second set of parallel conductive lines, memory elements disposed at intersections between the first set of conductive lines and the second set of conductive lines, and selection circuitry to apply an reading electrical condition to a selected one of the conductive lines and to ground conductive lines adjacent to the selected conductive line to form a co-planar waveguide. | 02-21-2013 |
20130044534 | FORMING METHOD OF PERFORMING FORMING ON VARIABLE RESISTANCE NONVOLATILE MEMORY ELEMENT, AND VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE - A forming method of a variable resistance nonvolatile memory element capable of lowering a forming voltage and preventing variations of the forming voltage depending on variable resistance elements. The forming method is for initializing a variable resistance element, including a step (S | 02-21-2013 |
20130044535 | REFERENCE CELL CIRCUIT AND VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE INCLUDING THE SAME - Included are reference cells each including a variable resistance element which reversibly changes between a predetermined low resistance state LR and a predetermined high resistance state HR according to an application of an electric signal, a comparator which compares resistance values of the reference cells, a pulse generation circuit which generates an electric signal for setting the reference cells to LR or HR, and a control circuit which controls operations where application of the generated electric signal to one of the reference cells corresponding to a comparison result of the comparator and application of a new electric signal generated by the pulse generation circuit to one of the reference cells corresponding to a new comparison result of the comparator are repeated, and then one of the reference cells corresponding to a final comparison result of the comparator is connected to an output terminal. | 02-21-2013 |
20130051121 | SWITCHABLE TWO-TERMINAL DEVICES WITH DIFFUSION/DRIFT SPECIES - Various embodiments of the present invention are directed to nanoscale electronic devices that provide nonvolatile memristive switching. In one aspect, a two-terminal device ( | 02-28-2013 |
20130051122 | VARIABLE-RESISTANCE MEMORY DEVICE AND DRIVING METHOD THEREOF - A variable-resistance memory device includes a memory array section including a main memory cell employing a storage element having a resistance increasing and decreasing in a reversible manner in accordance with application of a signal set at one of different polarities to the opposite ends of the storage element, and a reference cell section including a reference cell provided with a storage element having a resistance increasing and decreasing in a reversible manner in accordance with application of a signal set at one of different polarities to the opposite ends of the storage element and generating a reference current used for recognizing data of the main memory cell. The direction of an applied current serving as the reference current is set in accordance with the resistance state of the reference cell. | 02-28-2013 |
20130051123 | RESISTANCE CHANGE MEMORY DEVICE AND CURRENT TRIMMING METHOD THEREOF - A resistance change memory device includes an array of resistance change memory cells, and a writing circuit configured to reset a selected memory cell to a high resistance state by supplying a RESET current to the selected memory cell in the array of resistance change memory cells in a program operation mode, wherein a level of the RESET current depends on a distribution of initial RESET currents for the array of resistance change memory cells. | 02-28-2013 |
20130051124 | Resistive Memory Device and Test Systems and Methods for Testing the Same - A resistive memory device and a system and method for testing the resistive memory device are provided. The resistive memory device includes a plurality of bit lines comprising at least one dummy bit line to which a plurality of resistive memory cells are connected, a conducting wire connected to the dummy bit line, a first switching element positioned between the dummy bit line and an external device outside the resistive memory device, and a second switching element positioned between the conducting wire and the external device. Accordingly, the operational reliability of the resistive memory device may be increased. | 02-28-2013 |
20130051125 | METHOD OF OPERATING SEMICONDUCTOR DEVICE INCLUDING VARIABLE RESISTANCE DEVICE - According to an example embodiment, a method of operating a semiconductor device having a variable resistance device includes: applying a first voltage to the variable resistance device to change a resistance value of the variable resistance device from a first resistance value to a second resistance value that is different from the first resistance value; sensing a first current flowing through the variable resistance device to which the first voltage is applied; determining a second voltage used for changing the variable resistance device from the second resistance value to the first resistance value, based on a dispersion of the sensed first current; and applying the determined second voltage to the variable resistance device. | 02-28-2013 |
20130058152 | METHOD, SYSTEM, AND DEVICE FOR PHASE CHANGE MEMORY SWITCH WALL CELL WITH APPROXIMATELY HORIZONTAL ELECTRODE CONTACT - Embodiments disclosed herein may include depositing a storage component material over and/or in a trench in a dielectric material, including depositing the storage component material on approximately vertical walls of the trench and a bottom of the trench. Embodiments may also include etching the storage component material so that at least a portion of the storage component material remains on the approximately vertical walls and the bottom of the trench, wherein the trench is contacting an electrode and a selector such that storage component material on the bottom of the trench contacts the electrode. | 03-07-2013 |
20130058153 | SEMICONDUCTOR DEVICES INCLUDING VARIABLE RESISTANCE ELEMENTS AND METHODS OF OPERATING SEMICONDUCTOR DEVICES - In a method of operating a semiconductor device, a resistance value of a variable resistance element is changed from a first resistance value to a second resistance value by applying a first voltage to the variable resistance element; and a first current that flows through the variable resistance element is sensed. A second voltage for changing the resistance value of the variable resistance element from the second resistance value to the first resistance value is modulated based on a dispersion of the first current, and the first voltage is re-applied to the variable resistance element based on a dispersion of the first current. | 03-07-2013 |
20130058154 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a plurality of first memory cells, at least one of second memory cells, and a control circuit. The plurality of first memory cells are accessed during normal operation, wherein the first memory cell includes a first variable resistance element. The second memory cell is not accessed during the normal operation but accessed at a time of test operation. The second memory cell includes a second variable resistance element practically identical to the first variable resistance element. The control circuit performs forming on the second memory cell at the time of the test operation. | 03-07-2013 |
20130064000 | SEMICONDUCTOR STORAGE DEVICE INCLUDING MEMORY CELLS CAPABLE OF HOLDING DATA - According to one embodiment, a semiconductor storage device includes first cells, first bit and first word, and first sense. The first cells are capable of holding 2-level or higher-level data. The first bit and first word are capable of selecting the first cells. The first sense detects a first current. The first sense includes a first supply unit, a first accumulation unit, a detector, and a counter. The first supply unit supplies a second current when the data is read. The first accumulation unit accumulates an amount of charge. The detector detects the potential the amount of charge. The counter counts output from the detector. The counter includes a second supply unit, a second accumulation unit, and a sensing unit. The second supply unit charges a first node. The second accumulation unit accumulates a charge. The sensing unit detects the amount of charge of the second accumulation unit. | 03-14-2013 |
20130064001 | RESISTANCE CHANGE NONVOLATILE MEMORY DEVICE, SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING RESISTANCE CHANGE NONVOLATILE MEMORY DEVICE - To provide a resistance change nonvolatile memory device performing a stable switching operation at a low cost. The resistance change nonvolatile memory device has a first wiring, an interlayer insulating layer formed thereon, a second wiring formed thereon, and a resistance change element formed between the first wiring and the second wiring. The interlayer insulating layer between the first wiring and the second wiring has a hole having a width not greater than that of the first wiring. The resistance change element is in contact with the first wiring and has a lower electrode at the bottom of the hole, a resistance change layer thereon, and an upper electrode thereon. They are formed inside the hole. The first wiring contains copper and the lower electrode contains at least one metal selected from the group consisting of ruthenium, tungsten, cobalt, platinum, gold, rhodium, iridium, and palladium. | 03-14-2013 |
20130064002 | RESISTANCE CHANGE NONVOLATILE MEMORY DEVICE, SEMICONDUCTOR DEVICE, AND METHOD OF OPERATING RESISTANCE CHANGE NONVOLATILE MEMORY DEVICE - A resistance change nonvolatile memory device includes with a first electrode, a resistance change portion provided on the first electrode, and a second electrode provided on the resistance change portion. The resistance change portion is equipped with a resistance change layer provided on the first electrode and undergoing a change in resistance with an applied voltage and a stable layer provided on the resistance change layer and forming a filament. The resistance change layer and the stable layer are made of metal oxides different from each other. The oxide formation energy of the resistance change layer is higher than that of the stable layer. The resistance change layer has such a film thickness as to permit the resistance of the resistance change portion in an Off state to fall within a range determined by the film thickness. | 03-14-2013 |
20130070511 | SELECT DEVICES FOR MEMORY CELL APPLICATIONS - Select devices for memory cell applications and methods of forming the same are described herein. As an example, one or more memory cells comprise a a select device structure including a two terminal select device having a current-voltage (I-V) profile associated therewith, and a non-ohmic device in series with the two terminal select device. The combined two terminal select device and non-ohmic device provide a composite I-V profile of the select device structure that includes a modified characteristic as compared to the I-V profile, and the modified characteristic is based on at least one operating voltage associated with the memory cell. | 03-21-2013 |
20130070512 | NON-VOLATILE MEMORY DEVICE - A non-volatile memory device includes a memory cell including a resistance variable device and a switching unit for controlling a current flowing through the resistance variable device; a read reference voltage generator configured to generate a reference voltage according to a skew occurring in the switching unit; and a sense amplifier configured to sense a voltage corresponding to the current that flows through the resistance variable device based on the reference voltage. | 03-21-2013 |
20130070513 | METHOD AND APPARATUS FOR DIRECT BACKUP OF MEMORY CIRCUITS - An integrated circuit employs at least one active memory circuit and at least one memory state backup circuit wherein the at least one memory state backup circuit includes at least one passive variable resistance memory cell and at least one passive variable resistance memory cell interface that are used to backup data from the active memory circuit to the PVRM cell. Data is then placed back into the active memory circuit from the PVRM cell during a restore operation. The PVRM cell interface is operative to read the PVRM cell in response to a restore signal. PVRM cell interface control logic is operative to remove power to the PVRM cell after backup of the data to the PVRM cell from the active memory circuit. A PVRM cell (e.g., a bit cell) is added to each memory circuit that stores state information on an integrated circuit. | 03-21-2013 |
20130070514 | INTEGRATED CIRCUIT WITH ON-DIE DISTRIBUTED PROGRAMMABLE PASSIVE VARIABLE RESISTANCE FUSE ARRAY AND METHOD OF MAKING SAME - An integrated circuit employs a plurality of functional blocks, such as but not limited to, processors (e.g., cores), and an on-die distributed programmable passive variable resistance memory array configured to provide configuration information for each of the plurality of functional blocks. A corresponding sub-portion of the on-die distributed programmable passive variable resistance memory array is fabricated in layers above each respective plurality of functional blocks. The on-die distributed programmable passive variable resistance memory array is used as either non-volatile prepackage configuration information store, or a non-volatile post-package configuration information store that may allow dynamic changing of hardware configuration of the functional blocks both during normal operation and prior to die packaging. A method for making the same is also disclosed. | 03-21-2013 |
20130070515 | METHOD AND APPARATUS FOR CONTROLLING STATE INFORMATION RETENTION IN AN APPARATUS - A method and apparatus for controlling state information retention determines at least a state information save or restore condition for at least one processing circuit such as one or more CPU or GPU cores or pipelines, in an integrated circuit. In response to determining the state information save or restore condition, the method and apparatus controls either or both of saving or restoring of state information for different virtual machines operating on the processing circuit, into corresponding on-die persistent passive variable resistance memory. The state information save or restore condition is a virtual machine level state information save or restore condition. State information for each of differing virtual machines is saved or restored from differing on-die passive variable resistance memory cells that are assigned on a per-virtual machine basis. | 03-21-2013 |
20130070516 | VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE AND DRIVING METHOD THEREOF - A highly-reliable variable resistance nonvolatile memory device capable of a stable operation and a driving method of the variable resistance nonvolatile memory device are provided. | 03-21-2013 |
20130070517 | Resistance Change Memory - A resistance change memory includes a first conductive line extending in a first direction, a second conductive line extending in a second direction which is crossed to the first direction, a cell unit including a memory element and a rectifying element connected in series between the first and second conductive lines, and a control circuit which is connected to both of the first and second conductive lines. The control circuit controls a voltage to change a resistance of the memory element between first and second values reversibly. The rectifying element is a diode including an anode layer, a cathode layer and an insulating layer therebetween. | 03-21-2013 |
20130077379 | SEMICONDUCTOR MEMORY DEVICE, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE - In a case where a DRAM and a ReRAM are mounted together, a manufacturing cost thereof is reduced while maintaining performance of a capacitance element and a variable resistance element. A semiconductor memory device includes a variable resistance element and a capacitance element. The variable resistance element has a cylinder type MIM structure with a first depth, and is designed for a variable resistance type memory. The capacitance element has a cylinder type MIM structure with a second depth deeper than the first depth, and is designed for a DRAM. | 03-28-2013 |
20130077380 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes a memory cell array including cells provided at each of intersections of first and second lines and each having a variable resistance element and a first diode connected in series; a first line control circuit for supplying voltages to the first lines; and a second line control circuit for supplying voltages to the second lines, the cells each having one of the second lines connected to an anode side of the first diode and one of the first lines connected to a cathode side of the first diode, and the memory cell array including a second diode inserted in each of the second lines between the second line control circuit and the cells and each having a side of the second line control circuit as an anode and a side of the cells as a cathode. | 03-28-2013 |
20130077381 | HIGHLY INTEGRATED PROGRAMMABLE NON-VOLATILE MEMORY AND MANUFACTURING METHOD THEREOF - A highly integrated programmable non-volatile memory and a manufacturing method thereof are provided. More particularly, a memory device including an antifuse and a diode, or a variable resistor and a diode, an operation method thereof, and a manufacturing method of a plurality of memory cells capable of increasing the integration density by utilizing a vertical space are provided. The highly integrated programmable non-volatile memory includes first stepped cells and second stepped cells formed to have different heights. The first stepped cells are formed on a horizontal plane with a high height, and the second stepped cells are formed on a horizontal plane with a low height. | 03-28-2013 |
20130077382 | HYBRID MEMORY DEVICE, SYSTEM INCLUDING THE SAME, AND METHOD OF READING AND WRITING DATA IN THE HYBRID MEMORY DEVICE - A hybrid memory device is provided. The hybrid memory device includes a DRAM, a non-volatile memory and a control circuit. The control circuit selects one of output data of the DRAM and output data of the non-volatile memory according to a mode selecting signal and output the selected data. The control circuit outputs data requested to be output from the DRAM when the data requested to be output is in the DRAM, and may output the data requested to be output from the non-volatile memory when the data requested to be output is in the non-volatile memory. Accordingly, the hybrid memory device has a high speed in a read and write operation, and has low power consumption. | 03-28-2013 |
20130077383 | Writing Circuit for a Resistive Memory Cell Arrangement and a Memory Cell Arrangement - A writing circuit for a resistive memory cell arrangement is provided, the resistive memory cell arrangement including a plurality of resistive memory cells. The writing circuit includes a controlled voltage source including a plurality of pass transistors, wherein each pass transistor includes a first source/drain terminal, a second source/drain terminal and a gate terminal, and wherein the first source/drain terminal is configured to be electrically coupled to a power supply line and the second source/drain terminal is configured to be electrically coupled to a bit line associated with a resistive memory cell of the plurality of resistive memory cells, and a plurality of switches, wherein each switch is configured to control the gate terminal of the pass transistor, wherein the controlled voltage source is configured to supply a voltage to the resistive memory cell for a write operation. Further embodiments provide a resistive memory cell arrangement. | 03-28-2013 |
20130077384 | CROSS POINT VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE AND METHOD OF READING THEREBY - A cross point variable resistance nonvolatile memory device including: a cross point memory cell array having memory cells each of which is placed at a different one of cross points of bit lines and word lines; a word line decoder circuit that selects at least one of the memory cells from the memory cell array; a read circuit that reads data from the selected memory cell; an unselected word line current source that supplies a first constant current; and a control circuit that controls the reading of the data from the selected memory cell, wherein the control circuit controls the word line decoder circuit, the read circuit, and the unselected word line current source so that when the read circuit reads data, the first constant current is supplied to an unselected word line. | 03-28-2013 |
20130088909 | CROSS-POINT MEMORY COMPENSATION - The apparatuses and methods described herein may operate to measure a voltage difference between a selected access line and a selected sense line associated with a selected cell of a plurality of memory cells of a memory array. The voltage difference may be compared with a reference voltage specified for a memory operation. A selection voltage(s) applied to the selected cell for the memory operation may be adjusted responsive to the comparison, such as to dynamically compensate for parasitic voltage drop. | 04-11-2013 |
20130088910 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - A non-volatile semiconductor memory device according to an embodiment includes a memory cell array including first lines, second lines, and memory cells each including a variable resistor and each connected between one of the first lines and one of the second lines, and a control circuit configured to perform a voltage application operation of applying a first voltage to a selected first line connected to a selected memory cell and applying a second voltage having a voltage value lower than the first voltage to a selected second line connected to the selected memory cell. The control circuit is configured to select the voltage value of the second voltage from among a plurality of different voltage values and output the second voltage. | 04-11-2013 |
20130088911 | SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR DEVICE - A semiconductor memory device includes a writing circuit and a reading circuit. The writing circuit executes a setting action for converting a resistance of a variable resistance element to a low resistance by applying current from one end side to the other end side of a memory cell via the variable resistance element, and a resetting action for converting the resistance to a high resistance by applying current from the other end side to the one end side via the variable resistance element. The reading circuit executes a first reading action for reading a resistance state of the variable resistance element by applying current from one end side to the other end side of the memory cell via the variable resistance element, and a second reading action for reading the resistance state by applying current from the other end side to the one end side via the variable resistance element. | 04-11-2013 |
20130094275 | STABILIZATION OF RESISTIVE MEMORY - The present disclosure includes apparatuses and methods including stabilization of resistive memory. A number of embodiments include applying a programming signal to a resistive memory cell, wherein the programming signal includes a first portion having a first polarity and a second portion having a second polarity, wherein the second polarity is opposite the first polarity. | 04-18-2013 |
20130094276 | APPARATUSES AND METHODS FOR DETERMINING STABILITY OF A MEMORY CELL - Examples described include apparatuses and methods for determining stability of memory cells. Resistance variable memory cells may be used. Once a memory cell is placed in a low or high resistance state responsive to set or reset pulses, the stability of the state may be determined, such as by providing another pulse to the memory cell or otherwise stressing the cell. The another pulse may be of an opposite polarity to the set or reset pulses already applied. If the memory cell is no longer in the target state after providing the another pulse, additional set or reset pulses may be applied to achieve a stable state. | 04-18-2013 |
20130094277 | RESISTIVE MEMORY APPARATUS, LAYOUT STRUCTURE, AND SENSING CIRCUIT THEREOF - Provided is a resistive memory apparatus including a plurality of memory areas each including a main memory cell array coupled to a plurality of word lines and a reference cell array coupled to a plurality of reference word lines. Each of the memory areas shares a bit line driver/sinker with an adjacent memory area. | 04-18-2013 |
20130094278 | Non-Volatile Memory Cell Containing an In-Cell Resistor - A non-volatile memory cell includes a first electrode, a steering element, a metal oxide storage element located in series with the steering element, a dielectric resistor located in series with the steering element and the metal oxide storage element, and a second electrode. | 04-18-2013 |
20130094279 | SEMICONDUCTOR DEVICE - A semiconductor device is provided with a lower-layer circuit including a transistor formed over a semiconductor substrate, and a memory cell array formed in an interconnection layer above the semiconductor substrate. Respective memory cells of the memory cell array are provided with a variable resistor element formed in the interconnection layer serving as a memory element. The memory cell array includes a first region directly underneath the memory cells, the first region being a region where a via for electrical coupling with the memory cell is not formed. The lower-layer circuit is disposed in such a way as to overlap at least a part of the first region. | 04-18-2013 |
20130094280 | Semiconductor Memory Having Both Volatile and Non-Volatile Functionality Comprising Resistive Change Material and Method of Operating - A semiconductor memory cell including a capacitorless transistor having a floating body configured to store data as charge therein when power is applied to the cell, and a non-volatile memory comprising a bipolar resistive change element, and methods of operating. | 04-18-2013 |
20130094281 | METHOD FOR MEASURING DATA RETENTION CHARACTERISTIC OF RESISTIVE RANDOM ACCESS MEMORY DEVICE - A method for measuring data retention characteristic of an RRAM device includes: a) controlling a temperature of a sample stage to maintain the RRAM device at a predetermined temperature; b) setting the RRAM device to a high-resistance state or a low-resistance state; c) measuring data retention time by applying a predetermined voltage to the RRAM device so that a resistive state failure of the RRAM device occurs; d) repeating the steps a)-c) to perform a plurality of measurements; e) calculating a resistive state failure probability F(t) of the RRAM device from the data retention time in the plurality of measurements; and f) fitting the resistive state failure probability F(t), and calculating predicted data retention time t | 04-18-2013 |
20130100725 | SYSTEM AND METHOD FOR MRAM HAVING CONTROLLED AVERAGABLE AND ISOLATABLE VOLTAGE REFERENCE - A memory has a plurality of non-volatile resistive (NVR) memory arrays, each with an associated reference voltage generating circuit coupled by a reference circuit coupling link to a reference line, the reference coupled to a sense amplifier for that NVR memory array. Reference line coupling links couple the reference lines of different NVR memory arrays. Optionally, different ones of the reference coupling links are removed or opened, obtaining respective different average and isolated reference voltages on the different reference lines. Optionally, different ones of the reference circuit coupling links are removed or opened, obtaining respective different averaged voltages on the reference lines, and uncoupling and isolating different reference circuits. | 04-25-2013 |
20130100726 | MULTI-LEVEL MEMORY CELL WITH CONTINUOUSLY TUNABLE SWITCHING - The present disclosure provides a data storage device that includes multi-level memory cells. The data storage device may include circuitry configured to write data to the multi-level memory cell. The write circuitry may include compliance circuitry configured to implement continuously tunable switching. The write circuitry may be configured to select a compliance mode for the switching, the compliance mode being selected from the group comprising current compliance and voltage compliance. | 04-25-2013 |
20130100727 | OVERWRITING A MEMORY ARRAY - A data storage system including a memory array including a plurality of memory devices programmable in greater than two states. A read/write control module may overwrite data in the memory array without violating a constraint during the overwrite process. The memory array may be an m×n memory array. | 04-25-2013 |
20130107604 | Method for Forming Resistive Switching Memory Elements with Improved Switching Behavior | 05-02-2013 |
20130107605 | PERFORMING FORMING PROCESSES ON RESISTIVE MEMORY | 05-02-2013 |
20130107606 | NONVOLATILE LATCH CIRCUIT, NONVOLATILE FLIP-FLOP CIRCUIT, AND NONVOLATILE SIGNAL PROCESSING DEVICE | 05-02-2013 |
20130107607 | Bipolar Resistive-Switching Memory with a Single Diode Per Memory Cell | 05-02-2013 |
20130114325 | NON-VOLATILE RANDOM ACCESS MEMORY COUPLED TO A FIRST, SECOND AND THIRD VOLTAGE AND OPERATION METHOD THEREOF - A non-volatile random access memory (NV-RAM) and an operation method thereof are provided. The NV-RAM includes a latch unit, a switch, and a first to fourth non-volatile memory elements. First terminals of the first and the third non-volatile memory elements respectively couple to a first voltage and a second voltage. A second terminal of the first non-volatile memory element and a first terminal of the second non-volatile memory element are coupled to a first terminal of the latch unit. A second terminal of the third non-volatile memory element and a first terminal of the fourth non-volatile memory element are coupled to a second terminal of the latch unit. Second terminals of the second and the fourth non-volatile memory element are coupled to a first terminal of the switch. A second terminal of the switch is coupled to a third voltage. | 05-09-2013 |
20130114326 | SEMICONDUCTOR MEMORY APPARATUS AND TEST CIRCUIT THEREFOR - Disclosed is a semiconductor memory apparatus, including: a memory cell array configured to include a plurality of memory cells; a switching unit configured to be coupled to data input and output pads and control a data transfer path of data applied to the data input and output pads in response to a test mode signal; a write driver configured to drive data transferred from the switching unit and write the data in the memory cell array at a normal mode; and a controller configured to transfer the data from the switching unit to the memory cell at a test mode. | 05-09-2013 |
20130114327 | VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE - A variable resistance nonvolatile memory device including memory cells provided at cross-points of first signal lines and second signal lines, each memory cell including a variable resistance element and a current steering element connected to the variable resistance element in series, the variable resistance nonvolatile memory device including a write circuit, a row selection circuit, and a column selection circuit, wherein the write circuit: sequentially selects blocks in an order starting from a block farthest from at least one of the row selection circuit and the column selection circuit and finishing with a block closest to the at least one of the row selection circuit and the column selection circuit; and performs, for each of the selected blocks, initial breakdown on each memory cell included in the selected block. | 05-09-2013 |
20130114328 | Low-Complexity Electronic Circuit and Methods of Forming the Same - An electronic circuit such as a latch or a sequencer includes a plurality of transistors, all of the transistors being either NMOS transistors or PMOS transistors, and dissipates less than or approximately the same amount of power as an equivalent CMOS circuit. | 05-09-2013 |
20130114329 | Multilayer Memory Array - A multilayer crossbar memory array includes a number of layers. Each layer includes a top set of parallel lines, a bottom set of parallel lines intersecting the top set of parallel lines, and memory elements disposed at intersections between the top set of parallel lines and the bottom set of parallel lines. A top set of parallel lines from one of the layers is a bottom set of parallel lines for an adjacent one of the layers. | 05-09-2013 |
20130121056 | APPARATUSES AND OPERATION METHODS ASSOCIATED WITH RESISTIVE MEMORY CELL ARRAYS WITH SEPARATE SELECT LINES - The present disclosure includes methods and apparatuses that include resistive memory. A number of embodiments include a first memory cell coupled to a data line and including a first resistive storage element and a first access device, a second memory cell coupled to the data line and including a second resistive storage element and a second access device, an isolation device formed between the first access device and the second access device, a first select line coupled to the first resistive storage element, and a second select line coupled to the second resistive storage element, wherein the second select line is separate from the first select line. | 05-16-2013 |
20130121057 | RESISTOR THIN FILM MTP MEMORY - An integrated circuit is formed having an array of memory cells located in the dielectric stack above a semiconductor substrate. Each memory cell has two adjustable resistors and two heating elements. A dielectric material separates the heating elements from the adjustable resistors. One heating element alters the resistance of one of the resistors by applying heat thereto to write data to the memory cell. The other heating element alters the resistance of the other resistor by applying heat thereto to erase data from the memory cell. | 05-16-2013 |
20130121058 | CIRCUIT AND METHOD FOR CONTROLLING WRITE TIMING OF A NON-VOLATILE MEMORY - A circuit and a method for controlling the write timing of a non-volatile memory are provided. The method includes the following steps. First, a resistance state switching of at least one memory cell of the non-volatile memory executing a writing operation is monitored to output a control signal. The memory cell stores data states with different resistance states. A write timing is input to the memory cell through a timing control line. Next, the write timing is generated based on a clock signal and the control signal. The write timing is enabled at the beginning of a cycle of the clock signal, and is disabled when the memory cell finishes the resistance state switching. | 05-16-2013 |
20130121059 | MULTI-VALUED LOGIC DEVICE HAVING NONVOLATILE MEMORY DEVICE - A multi-valued logic device having an improved reliability includes a conversion unit configured to convert a multi level signal into a plurality of partial signals; and a plurality of nonvolatile memory devices configured to individually store the plurality of partial signals, wherein a number of bits of each of the plurality of partial signals individually stored in the plurality of nonvolatile memory devices is less than the number of bits of the multi level signal. | 05-16-2013 |
20130121060 | NON-VOLATILE MEMORY ELEMENTS AND MEMORY DEVICES INCLUDING THE SAME - Non-volatile memory elements, memory devices including the same, and methods for operating and manufacturing the same may include a memory layer between a first electrode and a second electrode spaced apart from the first electrode. The memory layer may include a first material layer and a second material layer, and may have a resistance change characteristic due to movement of ionic species between the first material layer and the second material layer. At least the first material layer of the first and second material layers may be doped with a metal. | 05-16-2013 |
20130121061 | NONVOLATILE MEMORY CELL COMPRISING A DIODE AND A RESISTANCE-SWITCHING MATERIAL - A method is provided for programming a memory cell in a memory array. The memory cell includes a resistivity-switching layer of a metal oxide or nitride compound, and the metal oxide or nitride compound includes exactly one metal. The method includes programming the memory cell by changing the resistivity-switching layer from a first resistivity state to a second programmed resistivity state, wherein the second programmed resistivity state stores a data state of the memory cell. Numerous other aspects are provided. | 05-16-2013 |
20130121062 | REWRITING A MEMORY ARRAY - A method for rewriting a memory array ( | 05-16-2013 |
20130121063 | MEMORY DEVICE, SEMICONDUCTOR STORAGE DEVICE, METHOD FOR MANUFACTURING MEMORY DEVICE, AND READING METHOD FOR SEMICONDUCTOR STORAGE DEVICE - A memory device that can prevent degradation in characteristics of a diode and the destruction due to the miniaturization includes: a substrate; first electrodes, a second electrode, and a third electrode that are stacked above the substrate; a variable resistance layer between the first and second electrodes; and a non-conductive layer between the second and third electrodes. The variable resistance layer includes a high-concentration variable resistance layer closer to the first electrodes, and a low-concentration variable resistance layer closer to the second electrode and having an oxygen concentration lower than that of the high-concentration variable resistance layer. The second and third electrodes and the non-conductive layer comprise the diode, and the first and second electrodes and the variable resistance layer comprise variable resistance elements, a total number of which is equal to that of the first electrodes. | 05-16-2013 |
20130128649 | MEMORY CELLS, SEMICONDUCTOR DEVICES INCLUDING SUCH CELLS, AND METHODS OF FABRICATION - Memory cells are disclosed, which cells include a cell material and an ion-source material over the cell material. A discontinuous interfacial material is included between the cell material and the ion-source material. Also disclosed are fabrication methods and semiconductor devices including the disclosed memory cells. | 05-23-2013 |
20130128650 | DATA-MASKED ANALOG AND DIGITAL READ FOR RESISTIVE MEMORIES - An analog read circuit measures the resistance of each of a plurality of bits in an array of resistive memory elements. Data stored within a latch determines whether to selectively enable the analog read circuit. In an alternate embodiment, a sense amplifier is coupled to the latch and the array, and the data stored in the latch determines whether to selectively enable the sense amplifier. | 05-23-2013 |
20130128651 | NONVOLATILE MEMORY DEVICE - According to one embodiment, a nonvolatile memory device includes a first conductive unit, a second conductive unit, and a memory layer. The memory layer is provided between the first conductive unit and the second conductive unit. The memory layer is capable of reversibly transitioning between a first state with a low resistance and a second state with a higher resistance than the first state due to a current supplied via the first conductive unit and the second conductive unit. The memory layer has a chalcopyrite structure. | 05-23-2013 |
20130128652 | Device for Storing a Frequency and Method for Storing and Reading Out a Frequency - The disclosure relates to a device for storing a frequency, wherein the device comprises (i) a comparator having an input, an output, a supply voltage input, and a supply voltage output, and (ii) a memristor connected between the input and the comparator and the output of the comparator. | 05-23-2013 |
20130128653 | RESISTIVE RADOM ACCESS MEMORY DEVICE, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR OPERATING THE SAME - A resistive random access memory device, a method for manufacturing the resistive random access memory device, and a method for operating the resistive random access memory device are disclosed. The resistive random access memory device includes a resistive switching memory element including two electrodes and a layer of variable-resistance material between the two electrodes, wherein the layer of variable-resistance material exhibits bipolar resistive switching behavior; and a Schottky diode including a metal layer and a p-doped semiconductor layer which contact each other, wherein the metal layer of the Schottky diode is coupled to one of the two electrodes of the resistive switching memory element. The present disclosure provides the resistive random access memory device operating in bipolar resistive switching scheme. | 05-23-2013 |
20130128654 | NONVOLATILE MEMORY ELEMENT, METHOD OF MANUFACTURING NONVOLATILE MEMORY ELEMENT, METHOD OF INITIAL BREAKDOWN OF NONVOLATILE MEMORY ELEMENT, AND NONVOLATILE MEMORY DEVICE - A nonvolatile memory element includes a current steering element which bidirectionally rectifies current in response to applied voltage and a variable resistance element connected in series with the current steering element. The current steering element includes an MSM diode and an MSM diode which are connected in series and each of which bidirectionally rectifies current in response to applied voltage. The MSM diode and the MSM diode include a lower electrode, a first current steering layer, a first metal layer, a second current steering layer, and an upper electrode which are stacked in this order. The current steering element has a breakdown current which is larger than an initial breakdown current which flows in the variable resistance element at the time of initial breakdown. | 05-23-2013 |
20130135919 | SEMICONDUCTOR STORAGE DEVICE - According to one embodiment, a semiconductor storage device includes a stripe, a sense amplifier, a global signal line, and a controller. Blocks are in the stripe. The blocks are formed in a first direction. Each of blocks is made a read unit of data and includes a memory cell capable of holding the data provided along a row and a column. The sense amplifier is provided just under each of the blocks, and reads the data. The global signal line is formed so as to penetrate through the stripe in the first direction, and transfers the data read from the block to the sense amplifier. The controller controls a value of a reference current applied to the sense amplifier according to positional relationship between each area in which the sense amplifier is arranged and the block, which is made a read target of the data, out of the blocks. | 05-30-2013 |
20130135920 | ACCESS SIGNAL ADJUSTMENT CIRCUITS AND METHODS FOR MEMORY CELLS IN A CROSS-POINT ARRAY - Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to generate access signals to facilitate memory operations in scaled arrays of memory elements, such as memory implemented in third dimensional memory technology formed BEOL directly on top of a FEOL substrate that includes data access circuitry. In at least some embodiments, a non-volatile memory device can include a cross-point array having resistive memory elements disposed among word lines and subsets of bit lines, and an access signal generator. The access signal generator can be configured to modify a magnitude of a signal to generate a modified magnitude for the signal to access a resistive memory element associated with a word line and a subset of bit lines. The modified magnitude can be a function of the position of the resistive memory element in the cross-point array. | 05-30-2013 |
20130135921 | SEMICONDUCTOR MEMORY DEVICE - A first ReRAM unit having a resistance change layer is provided between a first access transistor configuring the SRAM and a first bit line, and a second ReRAM unit having a resistance change layer is provided between a second access transistor and a second bit line. When a low potential (L=0V) is held at a first storage node and a high potential (H=1.5V) is held at a second storage node at the end of a normal operation period of the SRAM, the first ReRAM unit is set to ON state (ON), and the second ReRAM unit is set to OFF state (OFF); accordingly, the retained data of the SRAM is written in to the ReRAM units. When the SRAM returns to the normal operation again, data corresponding to the storage nodes are written back and the ReRAM units are both set to ON state (reset). | 05-30-2013 |
20130135922 | Floating Source Line Architecture for Non-Volatile Memory - A method and apparatus for writing data to a non-volatile memory cell, such as an STRAM memory cell or an RRAM memory cell. In some embodiments, a plurality of N non-volatile memory cells, where N is a greater than two, are connected to a common floating source line. A write circuit is adapted to program a selected memory cell of the plurality to a selected data state by passing a write current of selected magnitude through the selected memory cell and concurrently passing a portion of the write current in parallel through each of the remaining N−1 memory cells of the plurality via the common floating source line. | 05-30-2013 |
20130141960 | METHODS AND SYSTEMS FOR OPERATING MEMORY ELEMENTS - Methods and systems for measuring the resistance of multiple memory elements are disclosed. The memory elements may be multi-bit memory and through precise measurement of resistance of the multi-bit memory elements, determination of how many and which memory elements fall into specific memory ranges can be accomplished. Furthermore, storage and/or display of this information may allow for the creation of resistance distribution histograms for modeling of one or more memory arrays. | 06-06-2013 |
20130148405 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF PERFORMING BURN-IN TEST ON THE SAME - A semiconductor memory device includes a cell array having a plurality of memory cells, each memory cell including a resistive element and a cell transistor between a bit line and a source line, and a source line voltage supply unit configured to supply, in a normal mode, a reference source line voltage to the source line, and in a test mode, a first source line voltage to the source line when data in a first state is recorded and a second source line voltage to the source line when data in a second state is recorded, the first source line voltage being lower than the reference source line voltage, and the second source line voltage being higher than the reference source line voltage. | 06-13-2013 |
20130148406 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND READ METHOD FOR THE SAME - A cross point nonvolatile memory device capable of suppressing sneak-current-caused reduction in sensitivity of detection of a resistance value of a memory element is provided. The device includes perpendicular bit and word lines; a cross-point cell array including memory cells each having a resistance value reversibly changing between at least two resistance states according to electrical signals, arranged on cross-points of the word and bit lines; an offset detection cell array including an offset detection cell having a resistance higher than that of the memory cell in a high resistance state, the word lines being shared by the offset detection cell array; a read circuit (a sense amplifier) that determines a resistance state of a selected memory cell based on a current through the selected bit line; and a current source which supplies current to the offset detection cell array in a read operation period. | 06-13-2013 |
20130148407 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND READ METHOD FOR THE SAME - A nonvolatile semiconductor memory device includes: word lines; bit lines formed so as to three-dimensionally cross the word lines; and a cross-point cell array including cells each provided at a corresponding one of three-dimensional cross-points of the word lines and the bit lines. The cells include: a memory cell including a memory element that operates as a memory by reversibly changing in resistance value between at least two states based on an electrical signal; and an offset detection cell having a constant resistance value that is higher than the resistance value of the memory element in a high resistance state which is a state of the memory element when operating as the memory. | 06-13-2013 |
20130148408 | METHOD OF PROGRAMMING VARIABLE RESISTANCE NONVOLATILE MEMORY ELEMENT - A method of programming a variable resistance nonvolatile memory element that removes a defect in a resistance change, ensures an operation widow, and stably sustains a resistance change operation, the method including: applying, when the detect in the resistance change occurs in the variable resistance nonvolatile memory element, a recovery voltage pulse at least once to the variable resistance nonvolatile memory element, the recovery voltage pulse including: a first recovery voltage pulse that has an amplitude greater than amplitudes of a normal high resistance writing voltage pulse and a low resistance writing voltage pulse; and a second recovery voltage pulse that is the low resistance writing voltage pulse following the first recovery voltage pulse. | 06-13-2013 |
20130148409 | CIRCUIT AND SYSTEM OF USING FINFET FOR BUILDING PROGRAMMABLE RESISTIVE DEVICES - Junction diodes or MOS devices fabricated in standard FinFET technologies can be used as program selectors or One-Time Programmable (OTP) element in a programmable resistive device, such as interconnect fuse, contact/via fuse, anti-fuse, or emerging nonvolatile memory such as MRAM, PCRAM, CBRAM, or RRAM. The MOS or diode can be built on at least one fin structure or at least one active region that has at least one first active region and a second active region. The first and the second active regions can be isolated by a dummy MOS gate or silicide block layer (SBL) to construct a diode. | 06-13-2013 |
20130148410 | NON-VOLATILE VARIABLE CAPACITIVE DEVICE INCLUDING RESISTIVE MEMORY CELL - A non-volatile variable capacitive device includes a capacitor defined over a substrate, the capacitor having an upper electrode and a resistive memory cell having a first electrode, a second electrode, and a switching layer provided between the first and second electrodes. The resistive memory cell is configured to be placed in a plurality of resistive states according to an electrical signal received. The upper electrode of the capacitive device is coupled to the second electrode of the resistive memory cell. The resistive memory cell is a two-terminal device. | 06-13-2013 |
20130155755 | RESISTIVE MEMORY APPARATUS - A resistive memory apparatus includes a sensing voltage generation unit and a memory cell. The sensing voltage generation unit configured to drive a sensing node to a voltage with a predetermined level in response to a reference voltage and a voltage of the sensing node. The memory cell is connected with the sensing node and configured to change a magnitude of current flowing through the sensing node according to a resistance value thereof. | 06-20-2013 |
20130155756 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a cell array including plural MATs (unit cell arrays) arranged in matrix, each MAT containing a plurality of first lines, a plurality of second lines intersecting the plurality of first lines, and a plurality of memory cells connected at intersections of the first and second lines between both lines, each memory cell containing an electrically erasable programmable variable resistive element of which resistance is nonvolatilely stored as data; and a plurality of write/erase circuits connected to the MATs and operative to execute data write or erase to the memory cells inside the MATs in accordance with input data. A part of the plurality of write/erase circuits writes data to memory cells inside a corresponding MAT while another part of the plurality of write/erase circuits erases data from memory cells inside a corresponding MAT at the same time. | 06-20-2013 |
20130155757 | Drive Method for Memory Element, and Storage Device Using Memory Element - A memory element includes an insulating substrate; a first electrode and a second electrode on the insulating substrate; and an inter-electrode gap portion that causes a change in resistance value between the first and second electrodes. Applied to the memory element from a pulse generating source is a first voltage pulse for shifting from a predetermined low-resistance state to a predetermined high-resistance state, and a second voltage pulse for shifting from the high-resistance state to the low-resistance state through a series-connected resistor, by which current flowing to the memory element after the change to a low resistance value is reduced. When shifting from the high to the low-resistance state, a voltage pulse is applied such that an electrical resistance between the pulse generating source and the memory element becomes higher than the electrical resistance shifting from the low to the high-resistance state. | 06-20-2013 |
20130163308 | METHOD OF PROGRAMMING VARIABLE RESISTANCE ELEMENT, METHOD OF INITIALIZING VARIABLE RESISTANCE ELEMENT, AND NONVOLATILE STORAGE DEVICE - Programming a variable resistance element includes: a writing step of applying a writing voltage pulse to transition metal oxide comprising two stacked metal oxide layers to decrease resistance of the metal oxide, each metal oxide layer having different oxygen deficiency; and an erasing step of applying an erasing voltage pulse, of different polarity than the writing pulse, to the metal oxide to increase resistance of the metal oxide. |Vw | 06-27-2013 |
20130163309 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a memory cell array configured of at least a first portion and a second portion each including a plurality of memory cells each with a variable resistor which stores an electrically rewritable resistance value as a data, and a control circuit which controls a first operation including selected one of operations to erase, write and read the data in the first portion and a second operation including selected one of operations to erase, write and read the data in the second portion, the first operation and the second operation being performed in temporally overlapped relation with each other. | 06-27-2013 |
20130163310 | RESISTIVE MEMORY - A memory device includes an upper conductive layer, a lower conductive layer, and a resistive, optical or magnetic matrix positioned between the upper and lower conductive layers. | 06-27-2013 |
20130170278 | RESISTIVE RANDOM ACCESS MEMORY CELL AND RESISTIVE RANDOM ACCESS MEMORY MODULE - A resistive random access memory (RRAM) cell including a first electrode, a second electrode, and a plurality of repeated sets of layers is provided. Each of the sets of layers includes a resistance-changing layer, a barrier layer, and an ionic exchange layer between the resistance-changing layer and the barrier layer, wherein a thickness of each of the resistance-changing layer, the barrier layer and the ionic exchange layer exceeds a Fermi wavelength, and the thickness each of the resistance-changing layer and ionic exchange layer are less than an electron mean free path. Further, a RRAM module including the aforesaid RRAM cell and a switch is also provided. | 07-04-2013 |
20130170279 | Current Writing Circuit for a Resistive Memory Cell Arrangement - A current writing circuit for a resistive memory cell arrangement is provided. The current writing circuit comprises a first current source; a first reference potential terminal; a first switch configured to switch between the first current source and the first reference potential terminal during a write operation; a second current source; a second reference potential terminal; and a second switch configured to switch between the second reference potential terminal when the first switch is switched to the first current source, and the second current source when the first switch is switched to the first reference potential terminal, during the write operation, wherein the first current source and the second current source are of the same polarity. Further embodiments relate to a memory cell arrangement and a method of writing into a target resistive memory cell of a resistive memory cell arrangement. | 07-04-2013 |
20130170280 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device according to the embodiment comprises memory cells each having asymmetrical voltage-current characteristics, wherein the memory cell has a first state, and a second state and a third state of higher resistances than that in the first state, wherein the memory cell, (1) in the second state, makes a transition to the first state on application of a first voltage of the first polarity, (2) in the first state, makes a transition to the second state on application of a second voltage of the second polarity, (3) in the first state, makes a transition to the third state on application of a third voltage of the second polarity (the third voltage07-04-2013 | |
20130170281 | VARIABLE RESISTANCE MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME - A variable resistance memory device includes a semiconductor substrate having an active area defined by an isolation layer extending in one direction, a gate line extending in another direction crossing the isolation layer through the isolation layer and the active area, a protective layer located over the gate line, a contact plug positioned in a partially removed space of the active area between the protective layers, and a variable resistance pattern coupled to a part of the contact plug. | 07-04-2013 |
20130170282 | VARIABLE RESISTANCE MEMORY DEVICE - A variable resistance memory device includes: first and second structures that each include a first electrode, a second electrode, and a variable resistance material layer interposed between the first and second electrodes and configured to switch between different resistance states depending on a voltage applied across the variable resistance material layer; and a material layer interposed between the first and second structures and configured to pass a bidirectional current according to a voltage applied across the material layer. The first and second structures are symmetrical with respect to the material layer. | 07-04-2013 |
20130170283 | LOW FORMING VOLTAGE NON-VOLATILE STORAGE DEVICE - A three-dimensional array of memory elements that reversibly change a level of electrical conductance in response to a voltage difference being applied across them. Memory elements are provided across a plurality of planes positioned different distances above a semiconductor substrate. Bit lines to which the memory elements of all planes are connected are oriented vertically from the substrate and through the plurality of planes. The memory elements can be set to a low resistance state and reset to a high resistance state during standard operation by biasing appropriate voltages on the word lines and bit lines. Prior to standard operation, the memory elements undergo a forming operation, during which current through the bit lines is limited. A forming voltage is applied to the memory elements during forming with a polarity such that the bit line acts as a cathode and the word line acts as an anode, with the cathode having a lower electron injection energy barrier to the switching material than the anode. | 07-04-2013 |
20130170284 | Arrays Of Vertically Stacked Tiers Of Non-Volatile Cross Point Memory Cells, Methods Of Forming Arrays Of Vertically Stacked Tiers Of Non-Volatile Cross Point Memory Cells, And Methods Of Reading A Data Value Stored By An Array Of Vertically Stacked Tiers Of Non-Volatile Cross Point Memory Cells - An array of vertically stacked tiers of non-volatile cross point memory cells includes a plurality of horizontally oriented word lines within individual tiers of memory cells. A plurality of horizontally oriented global bit lines having local vertical bit line extensions extend through multiple of the tiers. Individual of the memory cells comprise multi-resistive state material received between one of the horizontally oriented word lines and one of the local vertical bit line extensions where such cross, with such ones comprising opposing conductive electrodes of individual memory cells where such cross. A plurality of bit line select circuits individually electrically and physically connects to individual of the local vertical bit line extensions and are configured to supply a voltage potential to an individual of the global horizontal bit lines. Other embodiments and aspects are disclosed. | 07-04-2013 |
20130170285 | Drive Method for Memory Element and Storage Device Using Memory Element - In a drive method for a memory element that includes an insulating substrate, a first electrode and a second electrode provided on the insulating substrate, and an inter-electrode gap portion provided between the first electrode and the second electrode and having a gap of the order of nanometers where a phenomenon of a change in resistance value between the first and second electrodes occurs, and that can perform a transition from a predetermined low-resistance state to a predetermined high-resistance state and a transition from the high-resistance state to the low-resistance state, a current pulse is applied to the memory element by a constant current circuit upon the transition from the high-resistance state to the low-resistance state. | 07-04-2013 |
20130176766 | STATEFUL NEGATIVE DIFFERENTIAL RESISTANCE DEVICES - A stateful negative differential resistance device includes a first conductive electrode and a second conductive electrode. The device also includes a first material with a reversible, nonvolatile resistance that changes based on applied electrical energy and a second material comprising a differential resistance that is negative in a locally active region. The first material and second material are sandwiched between the first conductive electrode and second conductive electrode. A method for using a stateful NDR device includes applying programming energy to the stateful NDR device to set a state of the stateful NDR device to a predetermined state and removing electrical power from the stateful NDR device. Power-up energy is applied to the stateful NDR device such that the stateful NDR device returns to the predetermined state. | 07-11-2013 |
20130176767 | STORAGE ELEMENT READING USING RING OSCILLATOR - Methods and apparatus are provided for use with data storage elements. A ring oscillator is coupled to a selected element within an array such that a feedback loop is defined. A period at oscillation for the ring oscillator is compared to a reference value. A data value stored within the selected element is determined accordingly. Stored data values remain essentially unaltered when accessed and read by way of the ring oscillator. Memory arrays having memristor or other storage elements can be used according to the present teachings. | 07-11-2013 |
20130182486 | MEMORY CELLS HAVING A COMMON GATE TERMINAL - Arrays of memory cells having a common gate terminal and methods of operating and forming the same are described herein. As an example, an array of memory cells may include a group of memory cells each having a resistive storage element coupled to a select device. Each select device includes a first terminal, a second terminal, and a gate terminal, where the gate terminal is common to each memory cell of the group. | 07-18-2013 |
20130182487 | PROGRAMMABLE METALLIZATION CELL WITH TWO DIELECTRIC LAYERS - A programmable metallization device comprises a first electrode and a second electrode, and a first dielectric layer, a second dielectric layer, and an ion-supplying layer in series between the first and second electrodes. In operation, a conductive bridge is formed or destructed in the first dielectric layer to represent a data value. During read, a read bias is applied that is sufficient to cause formation of a transient bridge in the second dielectric layer, and make a conductive path through the cell if the bridge is present in the first dielectric layer. If the bridge is not present in the first dielectric layer during the read, then the conductive path is not formed. Upon removal of the read bias voltage any the conductive bridge formed in the second dielectric layer is destructed while the conductive bridge in the corresponding other first dielectric layer, if any, remains. | 07-18-2013 |
20130182488 | NON-VOLATILE SEMICONDUCTOR MEMORY AND DATA PROCESSING METHOD IN NON-VOLATILE SEMICONDUCTOR MEMORY - A non-volatile semiconductor memory according to an embodiment includes: a data storage unit including a memory cell array and a writing circuit; an encoder that directs the writing circuit to write write data to the memory cell array; a writing determining circuit that determines whether the writing of the write data to the memory cell array within a predetermined number of writing operations fails or succeeds, inverts the write data to generate new write data when the writing of the write data fails, and directs the writing circuit to write the new write data to the memory cell array; a switching circuit that inverts read data which is read from the memory cell to generate new read data when the writing determining circuit determines that the writing of the write data fails; and a decoder that decodes the read data into the information data. | 07-18-2013 |
20130188413 | APPARATUSES AND METHODS FOR READING AND/OR PROGRAMMING DATA IN MEMORY ARRAYS HAVING VARYING AVAILABLE STORAGE RANGES - Apparatuses and methods are disclosed, including methods for reading data from and programming data to an array of memory cells having varying available storage ranges. One such method involves determining a position of a determined value of a parameter within an available storage range of a selected memory cell of an array of memory cells. | 07-25-2013 |
20130188414 | VARIABLE RESISTANCE NONVOLATILE MEMORY ELEMENT WRITING METHOD AND VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE - A variable resistance nonvolatile memory element writing method of, by applying a voltage pulse to a memory cell including a variable resistance element, reversibly changing the variable resistance element between a first resistance state and a second resistance state according to a polarity of the applied voltage pulse is provided. The variable resistance nonvolatile memory element writing method includes applying a first preliminary voltage pulse and subsequently applying the first voltage pulse to the variable resistance element to change the variable resistance element from the second resistance state to the first resistance state, the first preliminary voltage pulse being smaller in voltage absolute value than the second threshold voltage and different in polarity from the first voltage pulse. | 07-25-2013 |
20130188415 | Discrete Three-Dimensional Memory Comprising Off-Die Read/Write-Voltage Generator - The present invention discloses a discrete three-dimensional memory (3D-M). Its 3D-M arrays are located on at least one 3D-array die, while its read/write-voltage generator (V | 07-25-2013 |
20130201750 | VARIABLE RESISTANCE MEMORY DEVICE AND RELATED METHOD OF OPERATION - A variable resistance memory device comprises a variable resistance memory cells and a read/write circuit configured to provide a program voltage to the variable resistance memory cell, and further configured to adjust a compliance current flowing through the variable resistance memory cell in successive loops of a program operation. | 08-08-2013 |
20130208527 | MEMORY CELL, A METHOD FOR FORMING A MEMORY CELL, AND A METHOD FOR OPERATING A MEMORY CELL - A memory cell is provided, the memory cell including a first two-terminal memory element; a second two-terminal memory element; a controller circuit configured to program the first two-terminal memory element to one or more states and the second two-terminal memory element to one or more states, wherein a state of the first two-terminal memory element and a state of the second two-terminal memory element are interdependent; and a measuring circuit configured to measure a difference signal between a first two-terminal memory element signal associated with the state of the first two-terminal memory element and a second two-terminal memory element signal associated with the state of the second two-terminal memory element. | 08-15-2013 |
20130208528 | RESISTIVE MEMORY AND RELATED METHOD OF OPERATION - A resistive memory device comprises a memory cell array comprising a plurality of memory cells connected to a plurality of word lines and a plurality of bit lines, a row selector connected to the plurality of word lines, and a column selector connected to the plurality of bit lines. In a program or erase operation, the row selector provides a selected word line with program or erase pulse and a verification pulse in each of multiple program loops, wherein the verification pulse has a substantially fixed level through the program loops and the program or erase pulse has a negative value that decreases incrementally between successive program loops. | 08-15-2013 |
20130208529 | VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE AND DRIVING METHOD THEREOF - A highly-reliable variable resistance nonvolatile memory device capable of a stable operation and a driving method of the variable resistance nonvolatile memory device are provided. A variable resistance nonvolatile memory device includes a memory cell array, a memory cell selection circuit, a write circuit, and a read circuit. The write circuit sets a variable resistance element of another memory cell different from a faulty memory cell and located on at least one of a bit line and a word line that includes the faulty memory cell to a second high resistance state where a resistance value is higher than a resistance value in a first low resistance state, by applying a second high-resistance write pulse to the other memory cell. | 08-15-2013 |
20130208530 | RESISTIVE MEMORY DEVICE, OPERATING METHOD, AND MEMORY SYSTEM - A resistive memory device includes a plurality of first switches that connect word lines to a ground line in response a first switch control signal and a plurality of second switches that connect a plurality of global bit lines to a plurality of local bit lines corresponding to the plurality of global bit lines in response to a second switch control signal. | 08-15-2013 |
20130208531 | NONVOLATILE MEMORY DEVICE AND METHOD OF WRITING DATA TO NONVOLATILE MEMORY DEVICE - A resistance variable layer changes: to a second resistance state in such a manner that its resistance value stops decreasing when an interelectrode voltage reaches a negative first voltage; to a first resistance state in such a manner that its resistance value starts increasing when the interelectrode voltage reaches a positive second voltage which is equal in absolute value to the first voltage; to the first resistance state in such a manner that the resistance variable layer flows an interelectrode current such that the interelectrode voltage is maintained at a third voltage higher than the second voltage, when the interelectrode voltage reaches the third voltage; and to the first resistance state in such a manner that its resistance value stops increasing when the interelectrode current reaches a first current in a state where the interelectrode voltage is not lower than the second voltage and lower than the third voltage. | 08-15-2013 |
20130215666 | VARIABLE RESISTANCE MEMORY DEVICE AND RELATED METHOD OF OPERATION - A method of operating a variable resistance memory device comprises determining a level of an access voltage based on a number of rows or columns of a cell array, and supplying the access voltage having the determined level to the cell array. | 08-22-2013 |
20130215667 | Circuits And Techniques To Compensate Data Signals For Variations Of Parameters Affecting Memory Cells In Cross-Point Arrays - Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to implement circuits configured to compensate for parameter variations that affect the operation of memory elements, such as memory elements based on third dimensional memory technology. In at least some embodiments, an integrated circuit includes a cross-point array comprising memory elements disposed among word lines and bit lines, where a parameter can affect the operating characteristics of a memory element. The integrated circuit further includes a data signal adjuster configured to modify the operating characteristic to compensate for a deviation from a target value for the operating characteristic based on the parameter. In some embodiments, the memory element, such as a resistive memory element, is configured to generate a data signal having a magnitude substantially at the target value independent of variation in the parameter. | 08-22-2013 |
20130215668 | MULTILEVEL PHASE CHANGE MEMORY OPERATION - Methods, devices, and systems associated with multilevel phase change memory cells are described herein. One or more embodiments of the present disclosure include operating a phase change memory device by placing a phase change memory cell in a reset state and applying a selected programming pulse to the phase change memory cell in order to program the cell to one of a number of intermediate states between the reset state and a set state associated with the cell. The selected programming pulse includes an uppermost magnitude applied for a particular duration, the particular duration depending on to which one of the number of intermediate states the memory cell is to be programmed. | 08-22-2013 |
20130215669 | RESISTANCE CHANGE MEMORY CELL CIRCUITS AND METHODS - The gate of the access transistor of a 1 transistor 1 resistor (1T1R) type RRAM cell is biased relative to the source of the access transistor using a current mirror. Under the influence of a voltage applied across the 1T1R cell (e.g., via the bit line), the RRAM memory element switches from a higher resistance to a lower resistance. As the RRAM memory element switches from the higher resistance to the lower resistance, the current through the RRAM cell switches from being substantially determined by the higher resistance of the RRAM device (while the access transistor is operating in the linear region) to being substantially determined by the saturation region operating point of the access transistor. | 08-22-2013 |
20130223125 | DECODING SCHEME FOR BIPOLAR-BASED DIODE THREE-DIMENSIONAL MEMORY REQUIRING BIPOLAR PROGRAMMING - A system and method for operating a bipolar memory cell array including a bidirectional access diode. The system includes a column voltage. The column voltage switch includes column voltages and an output electrically coupled to the bidirectional access diode. The column voltages include at least one write-one column voltage and at least one write-zero column voltage. The system also includes a row voltage switch. The row voltage switch includes row voltages and an output electrically coupled to the bidirectional access diode. The row voltages include at least one write-one row voltage and at least one write-zero row voltage. The system further includes a column decoder and a row decoder electrically coupled to a select line of the column voltage switch and row voltage switch, respectively. The system includes a write driver electrically coupled to the select lines of the row and column switches. | 08-29-2013 |
20130223126 | RESISTIVE MEMORY DEVICE AND MEMORY SYSTEM INCLUDING THE SAME - A resistive memory device includes a memory cell array and control logic. The memory cell array includes multiple memory cells connected to multiple word lines and multiple bit lines. The control logic is configured to provide a bit line voltage to at least one selected bit line of the multiple bit lines and to provide the bit line voltage to unselected word lines of the multiple word lines. | 08-29-2013 |
20130223127 | VERTICAL RESISTANCE MEMORY DEVICE AND A READ METHOD THEREOF - A read method of a vertical resistance memory device including resistance memory cells arranged in a three-dimensional array includes selecting a block from a plurality of blocks, applying a read voltage to a word line selected from word lines of the block, applying a sensing reference voltage to bit lines sharing the plurality of blocks, applying a string selection voltage to a string selection transistor through a string selection line selected from a plurality of string selection lines of the block, wherein the string selection line is connected to a gate of the string selection transistor; and determining a memory state of a memory cell selected from the plurality of resistance memory cells by the word line and the string selection line based on a current flowing through the memory cell, wherein the word line is connected through a corresponding horizontal electrode to the memory cell. | 08-29-2013 |
20130223128 | VERTICAL RESISTANCE MEMORY DEVICE AND A PROGRAM METHOD THEREOF - A method of programming a vertical resistance memory device including a plurality of resistance memory cells arranged in a plurality of blocks includes a step of selecting a block from the plurality of blocks, a step of applying a set voltage to a word line selected from word lines, wherein the selected word line is connected through a corresponding horizontal electrode to a resistance memory cell to be programmed, a step of applying a set-inhibition voltage to unselected word lines of the word lines, a step of applying a bit voltage to a bit line selected from bit lines, wherein the selected bit line is electrically connected to the resistance memory cell via a string selection transistor selected from string selection transistors; and a step of applying a bit-inhibition voltage to unselected bit lines of the bit lines. | 08-29-2013 |
20130223129 | MEASURING ELECTRICAL RESISTANCE - In at least one embodiment, a method includes applying an input voltage external to a semiconductor chip to a first circuit of the semiconductor chip to generate an output voltage external to the semiconductor chip. The first circuit is electrically coupled to a resistive device. A logic state of the resistive device is determined based on a logic state of the external output voltage | 08-29-2013 |
20130223130 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a cell array having a plurality of first wirings and a plurality of second wirings intersecting each other and memory cells disposed at intersections between the plurality of first wirings and the plurality of second wirings. The semiconductor memory device further includes a control circuit for selectively driving the plurality of first wirings and the plurality of second wirings. The control circuit applies a first voltage for a first operation to a first select wiring and applies a second voltage for a second operation different from the first operation to a second select wiring and applies a third voltage for the first and second operation to a third select wiring. The first operation is completed before the second operation is completed. The control circuit applies a fourth voltage for a third operation to a forth select wiring before the second operation is completed. | 08-29-2013 |
20130223131 | METHOD FOR DRIVING VARIABLE RESISTANCE ELEMENT, AND NONVOLATILE MEMORY DEVICE - A driving method for driving a variable resistance element and a nonvolatile memory device, which achieves stable storage operation. In a low resistance write process, a low resistance writing voltage pulse having the negative polarity is applied once to a variable resistance layer included in a variable resistance element while in a high resistance write process, a high resistance writing voltage pulse having the positive polarity is applied more than twice to the same variable resistance layer. Here, when a voltage value of one of the high resistance writing voltage pulses is VH | 08-29-2013 |
20130223132 | CIRCUIT AND METHOD FOR READING A RESISTIVE SWITCHING DEVICE IN AN ARRAY - A read circuit for sensing a resistive state of a resistive switching device in a crosspoint array has an equipotential preamplifier connected to a selected column line of the resistive switching device in the array to deliver a read current while maintaining the selected column line at a reference voltage near a biasing voltage applied to unselected row lines of the array. The read circuit includes a reference voltage generation component for generating the reference voltage for the equipotential preamplifier. The reference voltage generation component samples the biasing voltage via the selected column line and adds a small increment to a sampled biasing voltage to form the reference voltage. | 08-29-2013 |
20130223133 | CROSS POINT VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE AND METHOD OF WRITING THEREBY - A cross point variable nonvolatile memory device includes a memory cell array including: first memory cells (e.g., part of a memory cell array) having a common word line; and second memory cells (e.g., another part of the memory cell array or a compensation cell unit). When a predetermined memory cell among the first memory cells is written to by changing the predetermined memory cell to a first resistance state, a word line write circuit supplies a first voltage or a first current to a selected word line, a first bit line write circuit supplies a third voltage or a third current to one bit line of the first memory cells, and a second bit line write circuit supplies the third voltage or the third current to A bit line or lines of the second memory cells. | 08-29-2013 |
20130223134 | METHOD AND CIRCUIT FOR SWITCHING A MEMRISTIVE DEVICE IN AN ARRAY - A method of switching a memristive device in a two-dimensional array senses a leakage current through the two-dimensional array when a voltage of half of a switching voltage is applied to a row line of the memristive device. A leakage compensation current is generated according to the sensed leakage current, and a switching current ramp is also generated. The leakage compensation current and the switching current ramp are combined to form a combined switching current, which is applied to the row line of the memristive device. When a resistance of the memristive device reaches a target value, the combined switching current is removed from the row line. | 08-29-2013 |
20130229850 | SEMICONDUCTOR STORAGE DEVICE AND METHOD OF CONTROLLING DATA THEREOF - A semiconductor storage device includes a memory cell array, and a control circuit. The memory cell array has memory cells including variable resistive elements disposed at intersections of a plurality of first lines and a plurality of second lines. The control circuit performs a set pulse applying operation, and a cure pulse applying operation. The set pulse applying operation applies a set pulse to a variable resistive element so as to cause the variable resistive element to transition from a high resistance state to a low resistance state. The cure pulse applying operation applies a cure pulse to the variable resistive element. The cure pulse has a polarity that is opposite of a polarity of the set pulse, and is larger than the set pulse. | 09-05-2013 |
20130229851 | SEMICONDUCTOR STORAGE DEVICE AND DATA CONTROL METHOD THEREOF - In a memory cell array, memory cells each including a variable resistance element are arranged at crossing portions between a plurality of first wiring and a plurality of second wirings. A control circuit executes a set operation, a reset operation, and a training operation. In the set operation, a set pulse is applied to the variable resistance element to change the variable resistance element from a high resistance state to a low resistance state. In the reset operation, a reset pulse having an opposite polarity to the polarity of the set pulse is applied to the variable resistance element to change the variable resistance element from the low resistance state to the high resistance state. In the training operation, the set pulse and the reset pulse are continuously applied to the variable resistance element. | 09-05-2013 |
20130229852 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes a semiconductor substrate, a plurality of memory cells, a plurality of wires, and a control circuit. The control circuit allows a first current to change a state to flow on a selected cell by applying a first potential difference between a pair of wires that sandwich the selected cell selected from the plurality of memory cells with respect to the semiconductor substrate vertically, and allows a second current lower than the first current to flow on an non-selected cell in the same direction as the direction of the first current by applying a second potential difference between a pair of wires that sandwich the non-selected cell connected to a wire shared with the selected cell on a different layer from the selected cell. | 09-05-2013 |
20130229853 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, a semiconductor memory device includes a plurality of cell array blocks and a control circuit. The control circuit sets a selected bit line to have 0 volt, applies a first electric potential which is higher than 0 volt to a selected word line, applies a second electric potential which is higher than 0 volt and lower than the first electric potential to non-selected word lines other than the selected word line, applies a third electric potential which is 0 volt or more and lower than the second electric potential to a non-selected bit line adjacent to the selected bit line in an adjacent cell array block, applies the second electric potential to non-selected bit lines other than the non-selected bit line to which the third electric potential is applied, and changes a resistance status of the resistance variable film of the selected memory cell. | 09-05-2013 |
20130229854 | SEMICONDUCTOR MEMORY DEVICE - A memory cell array includes memory cells disposed at intersections of first lines and second lines, and each having a rectifying element and a variable resistance element connected in series. A control circuit, when performing an operation to change retained data, applies a first voltage to a selected first line and applies a second voltage to a selected second line; furthermore, applies a third voltage to a non-selected first line; and, moreover, applies a fourth voltage larger than the third voltage to a non-selected second line. An absolute value of a difference between the third voltage and the fourth voltage is set smaller than an absolute value of a difference between the first voltage and the second voltage by an amount of an offset voltage. A value of the offset voltage increases as the absolute value of the difference between the first and second voltages increases. | 09-05-2013 |
20130229855 | RESISTIVE MEMORY DEVICE HAVING DEFINED OR VARIABLE ERASE UNIT SIZE - Disclosed is a resistive memory device that simultaneously erases memory cells connected to selected word line(s) included in an erase unit. The erase unit includes fewer word lines than are included in a memory block of the resistive memory device. However, erase verification may nonetheless be performed on a block basis. | 09-05-2013 |
20130229856 | CIRCUITS AND TECHNIQUES TO COMPENSATE MEMORY ACCESS SIGNALS FOR VARIATIONS OF PARAMETERS IN MULTIPLE LAYERS OF MEMORY - Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to implement circuits configured to compensate for parameter variations in layers of memory by adjusting access signals during memory operations. In some embodiments, memory cells are based on third dimensional memory technology. In at least some embodiments, an integrated circuit includes multiple layers of memory, a layer including sub-layers of semiconductor material. The integrated circuit also includes an access signal generator configured to generate an access signal to facilitate an access operation, and a characteristic adjuster configured to adjust the access signal for each layer in the multiple layers of memory. | 09-05-2013 |
20130235646 | SEMICONDUCTOR MEMORY DEVICE - A memory cell array is configured as an arrangement of memory cells disposed at intersections of a plurality of first lines and a plurality of second lines formed so as to intersect one another, each of the memory cells comprising a variable resistance element. A control circuit selectively drives the first lines and the second lines. The variable resistance element is configured by a transition metal oxide film. An electrode connected to the variable resistance element includes a polysilicon electrode configured from polysilicon. A block layer is formed between the polysilicon electrode and the variable resistance element. | 09-12-2013 |
20130235647 | RESISTIVE RANDOM ACCESS MEMORY(ReRAM) DEVICE - The resistive random access memory (ReRAM) device includes a first amplifier configured to amplify a sensing current corresponding to data sensed in a memory cell, and a second amplifier configured to store the sensing current amplified by the first amplifier, and amplify electric charges when storing the amplified sensing current. | 09-12-2013 |
20130235648 | RESISTIVE MEMORY DEVICE AND RELATED METHOD OF OPERATION - A resistive memory device comprises a resistive memory cell, and a read/program circuit configured to program the resistive memory cell from a first state to a second state. The read/program circuit reads a resistance in the first state of the resistive memory cell and adjusts a compliance current supplied to the resistive memory cell according to the read resistance during the program operation. | 09-12-2013 |
20130235649 | DIRECT RELATIVE MEASUREMENT OF MEMORY DURABILITY - Disclosed is a memory including a plurality of resistive change memory cells, including at least a first group and a second group of the memory cells and a comparison circuit configured to conduct a direct relative comparison of a remaining endurance of the first group of memory cells to a remaining endurance of the second group of memory cells. | 09-12-2013 |
20130235650 | Arrays Of Vertically Stacked Tiers Of Non-Volatile Cross Point Memory Cells, Methods Of Forming Arrays Of Vertically Stacked Tiers Of Non-Volatile Cross Point Memory Cells, And Methods Of Reading A Data Value Stored By An Array Of Vertically Stacked Tiers Of Non-Volatile Cross Point Memory Cells - An array of vertically stacked tiers of non-volatile cross point memory cells includes a plurality of horizontally oriented word lines within individual tiers of memory cells. A plurality of horizontally oriented global bit lines having local vertical bit line extensions extend through multiple of the tiers. Individual of the memory cells comprise multi-resistive state material received between one of the horizontally oriented word lines and one of the local vertical bit line extensions where such cross, with such ones comprising opposing conductive electrodes of individual memory cells where such cross. A plurality of bit line select circuits individually electrically and physically connects to individual of the local vertical bit line extensions and are configured to supply a voltage potential to an individual of the global horizontal bit lines. Other embodiments and aspects are disclosed. | 09-12-2013 |
20130235651 | METHOD AND CIRCUIT FOR SWITCHING A MEMRISTIVE DEVICE - A method of switching a memristive device applies a current ramp of a selected polarity to the memristive device. The resistance of the device during the current ramp is monitored. When the resistance of the memristive device reaches the target value, the current ramp is removed. | 09-12-2013 |
20130242637 | Memelectronic Device - A memelectronic device may have a first and a second electrode spaced apart by a plurality of materials. A first material may have a memory characteristic exhibited by the first material maintaining a magnitude of an electrically controlled physical property after discontinuing an electrical stimulus on the first material. A second material may have an auxiliary characteristic. | 09-19-2013 |
20130242638 | RESISTANCE-CHANGE TYPE NON-VOLATILE SEMICONDUCTOR MEMORY - A memory cell is formed with a resistance variable element, which is interposed between first and second electrodes and can store resistance changes representing 2 or more different values, and first and second cell transistors having source terminals thereof connected to the first electrode, and gates thereof to a word line. A drain of the first cell transistor is connected to a bit line, and a drain of the second cell transistor is connected to a data line. The second electrode is connected to a source line. During a read operation, the first and second cell transistors are kept in an ON state, and a current is supplied from the bit line to the source line through the memory cell. Data is read according to the electrical potential difference between the data line and the source line. | 09-19-2013 |
20130242639 | MEMORY DEVICE AND DRIVING METHOD THEREOF - Even in a circuit which always needs power supply, with a structure in which power supply is stopped in a period which does not need power supply, power consumption at the time of writing data to a memory device included in the circuit is reduced. A volatile memory portion and a nonvolatile memory portion are provided in the memory device included in the circuit which always needs power supply. As a memory element for storing data stored in the volatile memory portion which is included in the nonvolatile memory portion, a variable resistance memory element whose resistance value can be varied depending on voltage applied between both end terminals thereof is used. | 09-19-2013 |
20130242640 | Methods and Systems for Resistive Change Memory Cell Restoration - A resistive change memory device includes a first conductive line, a second conductive line, and a resistive change memory cell that includes a resistive memory element coupled between the first conductive line and the second conductive line. The resistive change memory device also includes control circuitry to apply, via the first conductive line and the second conductive line, a first biasing condition to the resistive change memory cell for a reset operation and a second biasing condition to the resistive change memory cell for a restore operation. The restore operation is performed to counteract a decrease in resistance of the resistive memory element for a reset state of the resistive change memory cell. At least one of a voltage, current, and duration of the second biasing condition is greater than a corresponding voltage, current, or duration of the first biasing condition. | 09-19-2013 |
20130242641 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a plurality of variable resistance memory cells; a plurality of bit lines each of which is connected to one end of each of the plurality of variable resistance memory cells; a common source line that is connected to the other ends of the plurality of variable resistance memory cells in common; a source line driver that supplies a potential to the common source line; and a controller that variably controls a current supplied to the common source line by the source line driver. | 09-19-2013 |
20130242642 | VARIABLE RESISTANCE NONVOLATILE MEMORY ELEMENT WRITING METHOD - A variable resistance nonvolatile memory element writing method according to the present disclosure includes: (a) changing a variable resistance layer to a low resistance state by applying, to a second electrode, a first voltage which is negative with respect to a first electrode; and (b) changing the variable resistance layer to a high resistance state. Step (b) includes: (i) applying, to the second electrode, a second voltage which is positive with respect to the first electrode; and (ii) changing the variable resistance layer to the high resistance state by applying, to the second electrode, a third voltage, which is negative with respect to the first electrode and is smaller than the absolute value of a threshold voltage for changing the variable resistance layer from the high resistance state to the low resistance state, after the positive second voltage is applied in step (i). | 09-19-2013 |
20130250649 | SEMICONDUCTOR DEVICE AND METHOD FOR CONTROLLING THE SAME - According to one embodiment, a semiconductor memory device includes a plurality of first interconnects which extend in a first direction and are arranged in a second direction perpendicular to the first direction, a plurality of second interconnects which extend in the second direction and are arranged in the first direction, and a plurality of first storage modules which are formed in regions where the first interconnects and the second interconnects cross. The semiconductor memory device further comprises a first interconnect control module which supplies a voltage to the first interconnects, detects a first current flowing in the first interconnects, and outputs a first voltage corresponding to the first current, a reference voltage generator module which generates a second voltage based on a second current, and a regulator which generates a third voltage based on the first voltage and the second voltage. | 09-26-2013 |
20130250650 | SEMICONDUCTOR DEVICE AND METHOD FOR CONTROLLING THE SAME - According to one embodiment, a semiconductor memory device includes a plurality of first interconnects which extend in a first direction and are arranged in a second direction perpendicular to the first direction, a plurality of second interconnects which extend in the second direction and are arranged in the first direction, and memory cells formed in regions where the first wring lines and the second interconnects cross. The semiconductor memory device further includes a plurality of first drivers which apply voltages to the first interconnects, respectively, and a second driver which applies a voltage to the first drivers. | 09-26-2013 |
20130250651 | MULTI-FUNCTION RESISTANCE CHANGE MEMORY CELLS AND APPARATUSES INCLUDING THE SAME - Various embodiments comprise apparatuses having a number of memory cells including drive circuitry to provide signal pulses of a selected time duration and/or amplitude, and an array of resistance change memory cells electrically coupled to the drive circuitry. The resistance change memory cells may be programmed for a range of retention time periods and operating speeds based on the received signal pulse. Additional apparatuses and methods are described. | 09-26-2013 |
20130250652 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF CONTROLLING THE SAME - According to an embodiment, a semiconductor memory device comprises: a memory cell array configured having a plurality of memory cell mats, the memory cell mats including a plurality of first lines, second lines, and memory cells, and the memory cell mats being stacked such that the first and second lines are shared alternately by each of the memory cell mats; and a peripheral circuit. Each of the memory cells has a variable resistance characteristic and a current rectifying characteristic. An orientation from an anode toward a cathode of all the memory cells is identical. The peripheral circuit applies to one of the first line and the second line connected to an anode side of the selected memory cell a selected bit line voltage, and applies to the other a selected word line voltage. | 09-26-2013 |
20130250653 | DRIVING METHOD OF SEMICONDUCTOR STORAGE DEVICE AND SEMICONDUCTOR STORAGE DEVICE - A memory includes storage elements, a signal holding part and a sense amplifier. A driving-method includes a read operation for reading target data stored in a first storage element of the storage elements. In the read operation, the signal holding part holds a first voltage according to the target data. First sample data of a first logic is written to the first storage element. The signal holding part holds a second voltage according to the first sample data. Second sample data of a second logic opposite to the first logic is written to the first storage element. The signal holding part holds a third voltage according to the second sample data. The sense amplifier compares a read signal based on the first voltage with a reference signal generated based on the second and third voltages to detect a logic of the target data stored in the first storage element. | 09-26-2013 |
20130250654 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - A non-volatile semiconductor memory device includes a cell array layer including a first wire, a memory cell, and a second wire, and a control circuit. When performing set operation for setting the memory cell to a low resistance state, until a resistance value of the memory cell becomes lower than a predetermined resistance value, the control circuit repeating: applying a first voltage for setting to the memory cell; and a verify read verifying that the resistance value of the memory cell has become lower than the predetermined resistance value. After the verify read, the control circuit applies a second voltage having a different polarity from the first voltage to the memory cell before applying the first voltage that follows. | 09-26-2013 |
20130250655 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - A non-volatile semiconductor memory device includes a memory cell array including a first wire, a second wire crossing the first wire, and a memory cell connected to both the wires at a crossing portion of the first wire and the second wire, the memory cell including a variable resistance element storing data in a non-volatile manner by a resistance value, and a control circuit setting the variable resistance element in first or second resistance state by application of first or second voltage to the memory cell and reading data from the memory cell by application of third voltage to the memory cell. The control circuit applies to the memory cell at predetermined timing weak write voltage causing the variable resistance element to be held in the first resistance state and the second resistance state. | 09-26-2013 |
20130250656 | RESISTANCE-VARIABLE MEMORY DEVICE - A memory device includes a first electrode, a second electrode, a third electrode, a first variable resistance layer between the first electrode and the third electrode, and a second variable resistance layer between the second electrode and the third electrode. The first, second, and third electrodes, and the first and second variable resistance layers are formed of materials that cause the first variable resistance layer to transition from a high resistance state to a low resistance state when a voltage is applied across the first and second electrodes and maintain the high resistance state when the voltage is cut off, and cause the second variable resistance layer to transition from a high resistance state to a low resistance state when the voltage is applied across the first and second electrodes and transition from the high resistance state to the low resistance state when the voltage is cut off. | 09-26-2013 |
20130250657 | System and Method for Writing Data to an RRAM Cell - A resistive RAM device includes a bit line, a word line, an RRAM cell coupled to the word line and to the bit line, a write driver and a disable circuit. The write driver is coupled to the bit line. The disable circuit stops a write operation performed by the write driver on a respective RRAM cell when a predefined condition on the bit line is achieved. The predefined condition depends on a mode of operation of the RRAM cell. | 09-26-2013 |
20130250658 | NONVOLATILE MEMORY ELEMENT AND NONVOLATILE MEMORY DEVICE - A nonvolatile memory device includes: a first electrode; a second electrode; and a variable resistance layer which includes: a first oxide layer including a first metal oxide; a second oxide layer located between and in contact with the first oxide layer and a second electrode including a second metal oxide and having a degree of oxygen deficiency lower than a degree of oxygen deficiency of the first oxide layer; and a local region located in the first oxide layer and the second oxide layer, having contact with the second electrode and no contact with the first electrode, and having a degree of oxygen deficiency higher than the degree of oxygen deficiency of the second oxide layer and different from the degree of oxygen deficiency of the first oxide layer. | 09-26-2013 |
20130258752 | STACK MEMORY APPARATUS - A stack memory apparatus is provided. The stack memory apparatus includes a semiconductor substrate, and a plurality of memory cells, each including a switching element and a variable resister connected in parallel, stacked on the semiconductor substrate. The plurality of memory cells is configured to be connected to each other in series. | 10-03-2013 |
20130258753 | MEMORY DEVICES AND METHODS HAVING ADAPTABLE READ THRESHOLD LEVELS - A method can include determining at least one use characteristic for the memory cells comprising a solid electrolyte, the use characteristic corresponding to a number of times the memory cells have been programmed to at least one impedance level; and adjusting a read threshold level for the memory cells based on at least the use characteristic, the read threshold level determining data values stored in the memory cells in a read operation. | 10-03-2013 |
20130258754 | VARIABLE RESISTANCE MEMORY PROGRAMMING - Some embodiments include a device having memory elements and methods of storing information into the memory elements. Such methods can include increasing a temperature of a portion of a memory element for a time interval during an operation to change a resistance state of the memory element. After the time interval, the methods can include decreasing the temperature of the portion of the memory element. Decreasing the temperature can be performed using a signal having a first negative slope and a second negative slope. Other embodiments are described. | 10-03-2013 |
20130265816 | SEMICONDUCTOR MEMORY DEVICE AND MEMORY CELL VOLTAGE APPLICATION METHOD - A semiconductor memory device comprises a plurality of parallel word lines, a plurality of parallel bit lines formed crossing the plurality of word lines, and a plurality of memory cells arranged at intersections of the word lines and the bit lines. Each memory cell has one end connected to the word line and the other end connected to the bit line. The device also comprises a drive circuit operative to selectively apply a voltage for data read/write across the word line and the bit line. It further comprises a sense amplifier circuit connected to the plurality of bit lines and operative to read/write data stored in the memory cell. The device also comprises a bit-line drive auxiliary circuit operative to selectively adjust the potentials on the plurality of bit lines based on data read out of the memory cell by the sense amplifier circuit. | 10-10-2013 |
20130272053 | APPARATUSES AND METHODS FOR PROVIDING SET AND RESET VOLTAGES AT THE SAME TIME - Apparatuses and methods are described, such as those involving driver circuits that are configured to provide reset and set voltages to different variable state material memory cells in an array at the same time. Additional apparatuses, and methods are described. | 10-17-2013 |
20130279237 | READING CIRCUIT FOR A RESISTIVE MEMORY CELL - A reading circuit for a resistive memory cell is provided, the circuit including a current source, a precharge switch, a comparator circuit including a first input node (in-node), and a second in-node, the precharge switch configured to couple the current source to the first in-node to apply a precharge voltage during a first reading time period, and to decouple the current source during a second reading time period, the comparator circuit configured to operate during a third reading time period, a memory cell access switch to enable a current flow at least partially during the second and the third reading time periods through a memory cell, the comparator circuit configured to compare a voltage at the first in-node with a reference voltage at the second in-node and to determine a programming state of the memory cell based on the voltage at the first in-node during the third reading time period. | 10-24-2013 |
20130279238 | PROGRAMMING AN ARRAY OF RESISTANCE RANDOM ACCESS MEMORY CELLS USING UNIPOLAR PULSES - Subject matter disclosed herein relates to a memory device, and more particularly to programming a non-volatile memory device. | 10-24-2013 |
20130279239 | Memory Cells, Methods of Forming Memory Cells, and Methods of Programming Memory Cells - Some embodiments include methods in which a memory cell is formed to have programmable material between first and second access lines, with the programmable material having two compositionally different regions. A concentration of ions and/or ion-vacancies may be altered in at least one of the regions to change a memory state of the memory cell and to simultaneously form a pn diode. Some embodiments include memory cells having programmable material with two compositionally different regions, and having ions and/or ion-vacancies diffusible into at least one of the regions. The memory cell has a memory state in which the first and second regions are of opposite conductivity type relative to one another. | 10-24-2013 |
20130279240 | HETERO-SWITCHING LAYER IN A RRAM DEVICE AND METHOD - A non-volatile memory device structure includes first electrodes comprising conductive silicon-containing material, a plurality of resistive switching material stacks comprising first resistive switching material and second resistive switching material overlying the first electrode, wherein the first resistive switching material comprises a first resistance switching voltage and the second resistive switching material comprises a second resistance switching voltage less than the first amplitude, second electrodes comprising metal material overlying and electrically coupled to the plurality of resistive switching material stacks, wherein a plurality of memory elements are formed from the first plurality of electrodes, the plurality of resistive switching material stacks, and the second plurality of electrodes. | 10-24-2013 |
20130286711 | BLOCKING CURRENT LEAKAGE IN A MEMORY ARRAY - A method for blocking current leakage through defective memory cells in a memory array is provided. The memory cells include access devices and programmable resistance memory elements. The method includes identifying addresses of defective memory cells in the memory array, and applying a modifying bias condition to modify the defective memory cells at the identified addresses. The modifying bias condition causes the defective memory cells to transform into a current blocking condition. The method also includes storing the identified addresses in a redundancy table of addresses. An automatic test system includes a device tester adapted to identify addresses of defective memory cells in a memory array in an integrated circuit under test, and to apply a modifying bias condition to modify the defective memory cells at the identified addresses. | 10-31-2013 |
20130286712 | BIPOLAR SWITCHING MEMORY CELL WITH BUILT-IN "ON" STATE RECTIFYING CURRENT-VOLTAGE CHARACTERISTICS - A memory array is disclosed having bipolar current-voltage (IV) resistive random access memory cells with built-in “on” state rectifying IV characteristics. In one embodiment, a bipolar switching resistive random access memory cell may have a metal/solid electrolyte/semiconductor stack that forms a Schottky diode when switched to the “on” state. In another embodiment, a bipolar switching resistive random access memory cell may have a metal/solid electrolyte/tunnel barrier/electrode stack that forms a metal-insulator-metal device when switched to the “on” state. Methods of operating the memory array are also disclosed. | 10-31-2013 |
20130286713 | PHASE CHANGE MEMORY ADAPTIVE PROGRAMMING - Some embodiments include methods and apparatus having a module configured to program a memory cell using a signal to cause the memory cell to have a programmed resistance value, to adjust a programming parameter value of the signal if the programmed resistance value is outside a target resistance value range, and to repeat at least one of the programming and the adjusting if the programmed resistance value is outside the target resistance value range, the signal including a different programming parameter value each time the programming is repeated. | 10-31-2013 |
20130286714 | DATA WRITE METHOD FOR WRITING DATA TO NONVOLATILE MEMORY ELEMENT, AND NONVOLATILE MEMORY DEVICE - Provided is a data write method for writing data to a nonvolatile memory element, the data write method including: a first application step of applying a first voltage pulse for changing a resistance state of the nonvolatile memory element from a first state to a second state; a second application step of applying a second voltage pulse which has a same polarity as the first voltage pulse and a voltage value of which has a smaller absolute value than the first voltage pulse; a determination step of determining whether the resistance state of the nonvolatile memory element is the second state; and a third application step of applying a third voltage pulse for changing the resistance state of the nonvolatile memory element from the first state to the second state when it is determined that the resistance state of the nonvolatile memory element is not the second state. | 10-31-2013 |
20130294144 | Method for Bit-Error Rate Testing of Resistance-based RAM Cells Using a Reflected Signal - A testing method is described for performing a fast bit-error rate (BER) measurement on resistance-based RAM cells, such MTJ cells, at the wafer or chip level. Embodiments use one or more specially designed test memory cells fabricated with direct electrical connections between the two electrodes of the cell and external contact pads (or points) on the surface of the wafer (or chip). In the test setup the memory cell is connected an impedance mismatched transmission line through a probe for un-buffered, fast switching of the cell between the high and low resistance states without the need for CMOS logic to select and drive the cell. The unbalanced transmission line is used generate signal reflections from the cell that are a function of the resistance state. The reflected signal is used to detect whether the test cell has switched as expected. | 11-07-2013 |
20130294145 | SWITCHING DEVICE STRUCTURES AND METHODS - Switching device structures and methods are described herein. A switching device can include a vertical stack comprising a material formed between a first and a second electrode. The switching device can further include a third electrode coupled to the vertical stack and configured to receive a voltage applied thereto to control a formation state of a conductive pathway in the material between the first and the second electrode, wherein the formation state of the conductive pathway is switchable between an on state and an off state. | 11-07-2013 |
20130294146 | RESISTIVE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME - A resistive memory device according to an embodiment includes a plurality of word lines extended and formed in a first direction; a global word line signal line extended substantially in the first direction, formed substantially in a layer substantially identical with the word lines, and interposed substantially between a designated number of the word lines; a plurality of bit lines extended and formed in a second direction tilted at an angle with the first direction; a plurality of normal cells connected substantially between the word line and the bit line; and a plurality of dummy cells connected substantially between the global word line signal line and the bit line. | 11-07-2013 |
20130294147 | RESISTANCE CHANGE MEMORY - A memory includes memory cells each includes a resistance change element and a diode, and each memory cell between one of row lines and one of column lines, a first decoder which selects one of the row lines as a selected row line, a second decoder which selects one of the column lines as a selected column line, a voltage pulse generating circuit which generates a voltage pulse, a voltage pulse shaping circuit which makes a rise time and a fall time of the voltage pulse longer, and a control circuit which applies the voltage pulse outputting from the voltage pulse shaping circuit to unselected column lines except the selected column line, and which applies a fixed potential to unselected row lines except the selected row line, in a data writing to a memory cell which is provided between the selected row line and the selected column line. | 11-07-2013 |
20130294148 | RESISTIVE MEMORY SENSING METHODS AND DEVICES - The present disclosure includes resistive memory sensing methods and devices. One such method includes performing a voltage based multiple pass sensing operation on a group of cells coupled to a selected conductive line of an array of resistive memory cells. The voltage based multiple pass sensing operation can include providing an indication of those cells of the group that conduct at least a threshold amount of current responsive to one of a number of different sense voltages successively applied to the selected conductive line during each of a corresponding number of the multiple passes, and for each successive pass of the multiple passes, disabling data lines corresponding to those cells determined to have conducted the threshold amount of current in association with a previous one of the multiple passes. | 11-07-2013 |
20130301334 | METHODS, ARTICLES AND DEVICES FOR PULSE ADJUSTMENTS TO PROGRAM A MEMORY CELL - Embodiments disclosed herein may relate to adjusting an aspect of a programming pulse for one or more memory cells, such as based at least in part on one or more detected programmed resistance values for the one or more memory cells. | 11-14-2013 |
20130301335 | ARCHITECTURE, SYSTEM AND METHOD FOR TESTING RESISTIVE TYPE MEMORY - Example embodiments include a method for massive parallel stress testing of resistive type memories. The method can include, for example, disabling one or more internal analog voltage generators, configuring memory circuitry to use a common plane voltage (VCP) pad or external pin, connecting bit lines of the memory device to a constant current driver, which works in tandem with the VCP pad or external pin to perform massive parallel read or write operations. The inventive concepts include fast test setup and initialization of the memory array. The data can be retention tested or otherwise verified using similar massive parallel testing techniques. Embodiments also include a memory test system including a memory device having DFT circuitry configured to perform massive parallel stress testing, retention testing, functional testing, and test setup and initialization. | 11-14-2013 |
20130301336 | PERMUTATIONAL MEMORY CELLS - Various embodiments comprise apparatuses having at least two resistance change memory (RCM) cells. In one embodiment, an apparatus includes at least two electrical contacts coupled to each of the RCM cells. A memory cell material is disposed between pairs of each of the electrical contacts coupled to each of the RCM cells. The memory cell material is capable of forming a conductive pathway between the electrical contacts with at least a portion of the memory cell material arranged to cross-couple a conductive pathway between select ones of the at least two electrical contacts electrically coupled to each of the at least two RCM cells. Additional apparatuses and methods are described. | 11-14-2013 |
20130301337 | Resistive Devices and Methods of Operation Thereof - In one embodiment, a method of operating a resistive switching device includes applying a signal comprising a pulse on a first terminal of a two terminal resistive switching device having the first terminal and a second terminal. The resistive switching device has a first state and a second state. The pulse includes a first ramp from a first voltage to a second voltage over a first time period. The first time period is at least 0.1 times a total time period of the pulse. | 11-14-2013 |
20130301338 | HYBRID RESISTIVE MEMORY DEVICES AND METHODS OF OPERATING AND MANUFACTURING THE SAME - Hybrid resistive memory devices and methods of operating and manufacturing the same, include at least two resistive memory units. At least one of the at least two resistive memory units is a resistive memory unit configured to operate in a long-term plasticity state. | 11-14-2013 |
20130301339 | SEMICONDUCTOR MEMORY DEVICE - A control circuit controls a voltage applied to a memory cell array. A first electrode contacts to a first surface of a variable resistance element, while a second electrode contacts to a second surface of the variable resistance element. The first electrode is configured by a metal, and the second electrode is configured by a P type semiconductor. The control unit, when performing a setting operation of a memory cell, applies a voltage such that a current flows in a direction from the first electrode toward the second electrode. | 11-14-2013 |
20130301340 | ERASING METHOD OF RESISTIVE RANDOM ACCESS MEMORY - An erase method of a resistive random access memory which includes a plurality of cell strings, each having a plurality of memory cells and a string selection transistor, includes applying a first voltage to bit lines connected with string selection transistors of the plurality of cell strings, applying a turn-on voltage to at least one string selection line selected from string selection lines connected with the string selection transistors, applying a turn-off voltage to unselected string selection lines of the string selection lines, applying a second voltage to at least one word line selected from word lines connected with memory cells of the plurality of cell strings, and floating unselected word lines of the word lines. | 11-14-2013 |
20130301341 | HERETO RESISTIVE SWITCHING MATERIAL LAYER IN RRAM DEVICE AND METHOD - A non-volatile memory device includes a first electrode, a resistive switching material stack overlying the first electrode. The resistive switching material stack comprising a first resistive switching material and a second resistive switching material. The second resistive switching material overlies the first electrode and the first resistive switching material overlying the second resistive switching material. The first resistive switching material is characterized by a first switching voltage having a first amplitude. The second resistive switching material is characterized by a second switching voltage having a second amplitude no greater than the first switching voltage. A second electrode comprising at least a metal material physically and electrically in contact with the first resistive switching material overlies the first resistive switching material. | 11-14-2013 |
20130301342 | MEMORY ELEMENT, STACKING, MEMORY MATRIX AND METHOD FOR OPERATION - Disclosed is a memory element, a stack, and to a memory matrix in which the memory element can be used. Also disclosed is a method for operating the memory matrix, and to a method for determining the true value of a logic operation in an array comprising memory elements. The memory element has at least a first stable state 0 and a second stable state 1. By applying a first write voltage V | 11-14-2013 |
20130308367 | STRUCTURE AND METHOD FOR FORMING CONDUCTIVE PATH IN RESISTIVE RANDOM-ACCESS MEMORY DEVICE - An array and forming method for resistive-RAM (RRAM) devices provides for the simultaneous selection of multiple bit cells and the simultaneous forming of the RRAM resistive elements within the selected bit cells. The bit cells each include a resistive element and a transistor and are arranged vertically along vertical bit lines. The resistive elements of the bit cells are coupled to source lines that are parallel to word lines and perpendicular to the vertical bit lines. The bit lines are maintained at different biases. A high voltage is applied to one of the source lines coupled to adjacent resistive elements of bit cells disposed along more than one vertical bit line. When the associated transistors are turned on by a sufficiently high gate voltage, the desired RRAM resistive elements along one of the bit lines are formed without stressing other bit cells of the array. | 11-21-2013 |
20130308368 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprises a plurality of memory layers arranged in multilayer, each memory layer including a cell array, the cell array containing a plurality of first parallel lines, a plurality of second parallel lines arranged crossing the first lines, and a plurality of memory cells connected at intersections of the first lines and the second lines; a pulse generator operative to generate pulses required for data access to the memory cell; and a control means operative to control the pulse generator such that the pulse output from the pulse generator has energy in accordance with the memory layer to which the access target memory cell belongs. | 11-21-2013 |
20130308369 | SWITCHING DEVICE HAVING A NON-LINEAR ELEMENT - Method for a memory including a first, second, third and fourth cells include applying a read, program, or erase voltage, the first and second cells coupled to a first top interconnect, the third and fourth cells coupled to a second top interconnect, the first and third cells coupled to a first bottom interconnect, the second and fourth cells are to a second bottom interconnect, each cell includes a switching material overlying a non-linear element (NLE), the resistive switching material is associated with a first conductive threshold voltage, the NLE is associated with a lower, second conductive threshold voltage, comprising applying the read voltage between the first top and the first bottom electrode to switch the NLE of the first cell to conductive, while the NLEs of the second, third, and the fourth cells remain non-conductive, and detecting a read current across the first cell in response to the read voltage. | 11-21-2013 |
20130308370 | MEMORY DEVICE AND SYSTEM WITH IMPROVED ERASE OPERATION - A memory device includes a memory cell array including a plurality of memory blocks, each memory block including a plurality of memory cells, a plurality of word lines coupled to rows of the plurality of memory cells, a plurality of bit lines coupled to columns of the plurality of memory cells, and a control unit controlling an erase operation so that erase data is simultaneously written in the plurality of memory cells corresponding to an erase unit. A first erase mode may include a first erase unit and a first erase data pattern. A second erase mode may include a second erase unit and a second erase pattern. At least one of the first and second erase units and the first and second erase data patterns are different. | 11-21-2013 |
20130308371 | METHOD FOR READING DATA FROM NONVOLATILE STORAGE ELEMENT, AND NONVOLATILE STORAGE DEVICE - Provided is a method for reading data from a variable resistance nonvolatile storage element, where the operation for reading data is less susceptible to a fluctuation phenomenon of resistance values in reading the data. The method includes: detecting a current value I | 11-21-2013 |
20130314972 | RESISTOR THIN FILM MTP MEMORY - An integrated circuit is formed having an array of memory cells located in the dielectric stack above a semiconductor substrate. Each memory cell has two adjustable resistors and two heating elements. A dielectric material separates the heating elements from the adjustable resistors. One heating element alters the resistance of one of the resistors by applying heat thereto to write data to the memory cell. The other heating element alters the resistance of the other resistor by applying heat thereto to erase data from the memory cell. | 11-28-2013 |
20130314973 | Memory Cells, Methods of Programming Memory Cells, and Methods of Forming Memory Cells - Some embodiments include methods of programming a memory cell. A plurality of charge carriers may be moved within the memory cell, with an average charge across the moving charge carriers having an absolute value greater than 2. Some embodiments include methods of forming and programming an ionic-transport-based memory cell. A stack is formed to have programmable material between first and second electrodes. The programmable material has mobile ions which are moved within the programmable material to transform the programmable material from one memory state to another. An average charge across the moving mobile ions has an absolute value greater than 2. Some embodiments include memory cells with programmable material between first and second electrodes. The programmable material includes an aluminum nitride first layer, and includes a second layer containing a mobile ion species in common with the first layer. | 11-28-2013 |
20130314974 | Bipolar Resistive-Switching Memory with a Single Diode Per Memory Cell - According to various embodiments, a resistive-switching memory element and memory element array that uses a bipolar switching includes a select element comprising only a single diode that is not a Zener diode. The resistive-switching memory elements described herein can switch even when a switching voltage less than the breakdown voltage of the diode is applied in the reverse-bias direction of the diode. The memory elements are able to switch during the very brief period when a transient pulse voltage is visible to the memory element, and therefore can use a single diode per memory cell. | 11-28-2013 |
20130314975 | METHOD FOR PROGRAMMING NONVOLATILE MEMORY ELEMENT, METHOD FOR INITIALIZING NONVOLATILE MEMORY ELEMENT, AND NONVOLATILE MEMORY DEVICE - A method for programming a nonvolatile memory element includes: decreasing a resistance value of a variable resistance element in an initial state, by applying an initialization voltage pulse to a series circuit in which a load resistor having a first resistance value is connected in series with the variable resistance element and a MSM diode; applying, after the decreasing, a write voltage pulse to the series circuit after the resistance value of the variable resistance element is changed to a second resistance value lower than the first resistance value; and applying, after the decreasing, an erase voltage pulse to the series circuit after the resistance value of the variable resistance element is changed to a third resistance value lower than the first resistance value. | 11-28-2013 |
20130322152 | CIRCUITRY INCLUDING RESISTIVE RANDOM ACCESS MEMORY STORAGE CELLS AND METHODS FOR FORMING SAME - A method of forming a circuitry includes providing a substrate comprising a plurality of die. Each die includes a plurality of resistive random access memory (RRAM) storage cells. The method further includes concurrently initializing substantially all of the RRAM storage cells on the same wafer. Initializing can include applying a voltage potential across the RRAM storage cells. | 12-05-2013 |
20130322153 | NON-VOLATILE MEMORY CROSSPOINT REPAIR - A device for use with a memory cross-point array of elements, each of which comprises a selection device in series with a state-holding device, in one embodiment includes a controller, configured to apply at least one voltage and/or current pulse to a selected one or more of the elements, said selected one or more of the elements including a partially- or completely-shorted selection device, so that said partially- or completely-shorted selection device passes enough current so as to damage its corresponding state-holding device and place said corresponding state-holding device in a highly resistive state, while any other selection device that is not partially- or completely-shorted passes less current so that the state-holding device corresponding to said other selection device remains unaffected. Additional systems and methods are also presented. | 12-05-2013 |
20130322154 | SENSE AMPLIFIER CIRCUITRY FOR RESISTIVE TYPE MEMORY - Example embodiments include a resistive type memory current sense amplifier circuit including differential output terminals, first and second input terminals, pre-charge transistors, and current modulating transistors coupled directly to the pre-charge transistors. The pre-charge configuration provides high peak currents to charge the bit line and reference line during a “ready” or “pre-charge” stage of operation of the current sense amplifier circuit. The current modulating transistors are configured to operate in a saturation region mode during at least a “set” or “amplification” stage. The current modulating transistors continuously average a bit line current and a reference line current during the “set” or “amplification” stage, thereby improving noise immunity of the circuit. During a “go” or “latch” stage of operation, a logical value “0” or “1” is latched at the differential output terminals based on positive feedback of a latch circuit. | 12-05-2013 |
20130322155 | VARIABLE RESISTANCE MEMORY DEVICE AND DATA STORAGE DEVICE INCLUDING THE SAME - A variable resistance memory device includes memory cells arranged at a region where word lines and bit lines cross each other, control logic configured to generate a command flag indicative of a program operation mode in response to a program command provided from an external device and configured to control the program operation of the memory cells based on the command flag and a write driver configured to be activated in response to the flag command and configured to supply a program current to the memory cells. | 12-05-2013 |
20130322156 | READ MEASUREMENT OF RESISTIVE MEMORY CELLS - A method for read measurement of resistive memory cells having s≧2 programmable cell-states includes applying to each cell at least one initial voltage and making a measurement indicative of cell current due to the initial voltage; determining a read voltage for the cell in dependence on the measurement; applying the read voltage to the cell; making a read measurement indicative of cell current due to the read voltage; and outputting a cell-state metric dependent on the read measurement; wherein the read voltages for cells are determined in such a manner that the cell-state metric exhibits a desired property. | 12-05-2013 |
20130322157 | READ MEASUREMENT OF RESISTIVE MEMORY CELLS - A method for read measurement of resistive memory cells having s≧2 programmable cell-states includes applying to each cell at least one initial voltage and making a measurement indicative of cell current due to the initial voltage; determining a read voltage for the cell in dependence on the measurement; applying the read voltage to the cell; making a read measurement indicative of cell current due to the read voltage; and outputting a cell-state metric dependent on the read measurement; wherein the read voltages for cells are determined in such a manner that the cell-state metric exhibits a desired property. | 12-05-2013 |
20130322158 | Memory Cells, Memory Cell Constructions, and Memory Cell Programming Methods - Some embodiments include memory cells including a memory component having a first conductive material, a second conductive material, and an oxide material between the first conductive material and the second conductive material. A resistance of the memory component is configurable via a current conducted from the first conductive material through the oxide material to the second conductive material. Other embodiments include a diode comprising metal and a dielectric material and a memory component connected in series with the diode. The memory component includes a magnetoresistive material and has a resistance that is changeable via a current conducted through the diode and the magnetoresistive material. | 12-05-2013 |
20130329483 | FILAMENTARY MEMORY DEVICES AND METHODS - Apparatus, devices, systems, and methods are described that include filamentary memory cells. Mechanisms to substantially remove the filaments in the devices are described, so that the logical state of a memory cell that includes the that includes the removable filament can be detected. Additional apparatus, systems, and methods are described. | 12-12-2013 |
20130329484 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE OF VARIABLE RESISTIVE TYPE - Disclosed herein is a device that includes: a memory including a variable resistive memory cell including first and second terminals, a variable resistive memory element coupled between the first and second terminals, and a select transistor coupled between the second terminal and a first voltage line; and a capacitor circuit configured to be connected to the first terminal of the variable resistive memory cell when the select transistor is selected to be conductive between the second terminal and the first voltage line, the first terminal of the variable resistive memory cell being increased in voltage by the capacitor circuit to change a resistivity of the variable resistive memory element from a first level to a second level that is smaller than the first level. | 12-12-2013 |
20130329485 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE INCLUDING VARIABLE RESISTANCE ELEMENT - According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array and a control circuit. The memory cell array include the memory cells each including a variable resistance element in which a reset current flowing in a reset operation is smaller than a set current flowing in a set operation by not less than one order of magnitude. The control circuit performs the reset operation and the set operation for the memory cells. The control circuit performs the reset operation for all memory cells being in the low resistance state and connected to selected first interconnections and selected second interconnections. | 12-12-2013 |
20130336041 | Structure and Method for a Forming Free Resistive Random Access Memory with Multi-Level Cell - The present disclosure provides one embodiment of a method for operating a multi-level resistive random access memory (RRAM) cell having a current-controlling device and a RRAM device connected together. The method is free of a “forming” step and includes setting the RRAM device to one of resistance levels by controlling the current-controlling device to one of current levels. The setting the RRAM device includes applying a first voltage to a top electrode of the RRAM device and applying a second voltage to a bottom electrode of the RRAM device. The second voltage is higher than the first voltage. | 12-19-2013 |
20130336042 | RESISTIVE MEMORY DEVICE AND MEMORY APPARATUS AND DATA PROCESSING SYSTEM HAVING THE SAME - A resistive memory device operable with low power consumption and a memory apparatus and data processing system including the same are provided. The resistive memory includes a chalcogenide compound containing 10 to 60 wt % (atomic weight) of selenium (Se) or tellurium (Te). | 12-19-2013 |
20130336043 | RESISTANCE CHANGE MEMORY AND FORMING METHOD OF THE RESISTANCE CHANGE DEVICE - A resistance change memory has a resistance change device and a control circuit for controlling application of voltage to the resistance change device. The resistance change device has a first electrode, a second electrode, and a resistance change layer interposed between the first electrode and the second electrode. A material for the second electrode includes one of members selected from the group consisting of W, Ti, Ta, and nitrides thereof. During forming of the resistance change device, the control circuit performs a second forming treatment succeeding to a first forming treatment. The first forming treatment includes application of voltage such that the potential of the first electrode is higher than the potential of the second electrode. The second forming treatment includes application of voltage such that the potential of the second electrode is higher than the potential of the first electrode. | 12-19-2013 |
20130336044 | SEMICONDUCTOR MEMORY DEVICE - According to one embodiment, there is provided a semiconductor memory device including a memory cell. The memory cell includes a first driving transistor, a first load transistor, a first read transfer transistor, a first write transfer transistor, a second driving transistor, a second load transistor, a second read transfer transistor, a second write transfer transistor, and one or more variable resistance elements. The one or more variable resistance elements has resistance that changes depending on a direction of a bias applied to both terminals. The one or more variable resistance elements are arranged in at least one of a portion between a first storage node and a first write transfer transistor and a portion between a second storage node and a second write transfer transistor. | 12-19-2013 |
20130343114 | PROGRAMMED-STATE DETECTION IN MEMRISTOR STACKS - A method for programmed-state detection in memristor stacks includes applying a first secondary switching voltage across a memristor stack to produce a first programmed-state-dependent secondary switching response in a memristor in the memristor stack. The programmed-state-dependent secondary switching response results in a detectable change in the electrical resistance of the memristor stack. The method also includes measuring a first electrical resistance of the memristor stack and inferring the programmed state of the memristor stack from the measured electrical resistance. | 12-26-2013 |
20130343115 | RESISTANCE MEMORY CELL AND OPERATION METHOD THEREOF - A resistance memory cell is provided and includes a first electrode, a tungsten metal layer, a metal oxide layer, and a second electrode. The tungsten metal layer is disposed on the first electrode. The metal oxide layer is disposed on the tungsten metal layer. The second electrode includes a first connection pad, a second connection pad, and a bridge portion electrically connected between the first connection pad and the second connection pad. The bridge portion is disposed on the metal oxide layer or surrounds the metal oxide layer. The resistance memory cell adjusts a resistivity of the metal oxide layer through a first current path, passing through the metal oxide layer and the tungsten metal layer, or a second current path extending from the first connection pad to the second connection pad. | 12-26-2013 |
20140003122 | SEMICONDUCTOR MEMORY STRUCTURE AND CONTROL METHOD THEREOF | 01-02-2014 |
20140003123 | LOW POWER PHASE CHANGE MEMORY CELL | 01-02-2014 |
20140003124 | SENSE AMPLIFIER CIRCUITRY FOR RESISTIVE TYPE MEMORY | 01-02-2014 |
20140003125 | Resistive Devices and Methods of Operation Thereof | 01-02-2014 |
20140003126 | CIRCUIT ARRANGMENT AND A METHOD OF WRITING STATES TO A MEMORY CELL | 01-02-2014 |
20140003127 | SEMICONDUCTOR MEMORY DEVICE | 01-02-2014 |
20140003128 | SEMICONDUCTOR MEMORY DEVICE | 01-02-2014 |
20140003129 | SEMICONDUCTOR MEMORY APPARATUS AND METHOD OF OPERATING USING THE SAME | 01-02-2014 |
20140003130 | RESISTANCE-CHANGE MEMORY | 01-02-2014 |
20140009996 | STORAGE CONTROL DEVICE, STORAGE DEVICE, INFORMATION PROCESSING SYSTEM, AND PROCESSING METHOD THEREOF - There is provided a storage control device including a read processing unit that reads data and inversion state information indicating whether the data is in an inverted state or a non-inverted state from a specific region of a memory cell array that stores the data and the inversion state information with first intensity in association, and a write processing unit that writes data obtained by inverting the data and a state obtained by changing a state indicated by the inversion state information to an opposite state in the specific region with second intensity that is different from the first intensity. | 01-09-2014 |
20140009997 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device including a memory cell array including a memory cell layer containing plural memory cells operative to store data in accordance with different resistance states; and an access circuit operative to make access to the memory cells, the memory cell changing the resistance state from a first resistance state to a second resistance state on application of a voltage of a first polarity, and changing the resistance state from the second resistance state to the first resistance state on application of a voltage of a second polarity, the access circuit applying voltages, required for access to the memory cell, to first and second lines connected to a selected memory cell, and bringing at least one of the first and second lines connected to non-selected memory cells into the floating state to make access to the selected memory cell. | 01-09-2014 |
20140016396 | Adaptive Reading And Writing Of A Resistive Memory - An adaptive reading and programming method is presented for resistive memory. The core operating principle is to cause a change in the conductance of a resistive memory cell and measure the magnitude of the change. The magnitude of change can be used to determine the logic state of the resistive memory cell. The proposed methods are evaluated in simulation programs with integrated circuit emphasis and a hand analysis model is extracted to help explain the sources of power and energy consumption. | 01-16-2014 |
20140016397 | NONVOLATILE MEMORY DEVICE AND WRITE METHOD THEREOF - A nonvolatile memory device includes a memory cell array including a plurality of memory cells, and a data comparison write unit connected with the memory cell array and configured to support a comparison write operation. The nonvolatile memory device further includes control logic configured to selectively execute the comparison write operation based on a comparison between an access number of the memory cell array and a reference number. | 01-16-2014 |
20140016398 | NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME - A non-volatile semiconductor storage device includes memory cells, each of which is arranged at an intersection between a first wiring and a second wiring intersecting each other. Each of the memory cells includes: a first electrode layer; a plurality of variable resistance layers laminated on the first electrode layer and functioning as variable resistance elements; a second electrode layer formed between the variable resistance layers; and a third electrode layer formed on the top one of the variable resistance layers. Each of the variable resistance layers is composed of a material containing carbon. | 01-16-2014 |
20140022832 | OPERATING METHOD OF A NONVOLATILE MEMORY DEVICE - An operating method of a multi-bit-per-cell nonvolatile memory device, e.g., first and second variable resistance memory cells connected to one of word lines. The operating method may include receiving first to fourth data sequentially, providing a first program current to the first variable resistance memory cell to program the first and second data to the first variable resistance memory cell, and providing a second program current to the second variable resistance memory cell to program the third and fourth data to the second variable resistance memory cell after verifying whether an actual resistance of the programmed first variable resistance memory cell is within an intended resistance distribution. | 01-23-2014 |
20140022833 | STORAGE APPARATUS AND OPERATION METHOD FOR OPERATING THE SAME - A storage apparatus includes: a plurality of storage elements configured to have the resistance state thereof changed in accordance with an applied voltage; and a drive portion configured to perform a resistance change operation and a read operation, the resistance change operation involving writing or erasing information to or from the storage elements by changing the resistance state thereof, the read operation involving reading the information from the storage elements; wherein the drive portion includes an amplifier configured to output a read signal upon execution of the read operation, a constant current load, and a control portion configured to perform the resistance change operation and a direct verify operation on the storage elements, the direct verify operation involving carrying out, subsequent to the resistance change operation, the read operation for verifying whether the writing or erasing of the information to or from the storage elements has been normally accomplished. | 01-23-2014 |
20140029327 | BIPOLAR RESISTIVE SWITCH HEAT MITIGATION - A heat mitigated bipolar resistive switch includes a BRS matrix sandwiched between first and second electrodes and a heat mitigator. The BRS matrix is to support bipolar switching of a conduction channel formed between the first and second electrodes through BRS matrix. The heat mitigator is to reduce heat in the BRS matrix generated during bipolar switching. The heat mitigator includes one or both of a parallel-connected NDR element to limit current flowing in the BRS matrix and a high thermal conductivity material to conduct the generated heat away from the BRS matrix above a predetermined elevated temperature. | 01-30-2014 |
20140029328 | Storing Data in a Non-volatile Latch - Storing data in a non-volatile latch may include applying a bias voltage to a memristor pair in electrical communication with at least one logic gate and applying a gate voltage to a transmission gate to allow an input voltage to be applied to the at least one logic gate where the input voltage is greater than the bias voltage and the input voltage determines a resistance state of the memristor pair. | 01-30-2014 |
20140029329 | WORD LINE SELECTION CIRCUIT AND ROW DECODER - A first exemplary aspect of the present invention is a word line selection circuit where address decode signals composed of a power supply voltage and a first voltage lower than a ground voltage are input, and that a word line selection signal composed of the first voltage and a second voltage higher than the power supply voltage is output not via a level shift circuit according to the address decode signals. | 01-30-2014 |
20140029330 | METHOD FOR DRIVING NONVOLATILE MEMORY ELEMENT, AND NONVOLATILE MEMORY DEVICE - A method for driving a nonvolatile memory element includes: a writing step of changing a variable resistance layer to a low resistance state, by applying a writing voltage pulse having a first polarity; and an erasing step of changing the variable resistance layer to a high resistance state, by applying an erasing voltage pulse having a second polarity different from the first polarity, wherein in the writing step, a first input and output terminal of a field effect transistor is a source terminal of the transistor, and when a pulse width of the writing voltage pulse is PWLR and a pulse width of the erasing voltage pulse is PWHR, PWLR and PWHR satisfy a relationship of PWLR01-30-2014 | |
20140036568 | RERAM DEVICE STRUCTURE - A resistive random access memory (ReRAM) device can comprise a first metal layer and a first metal-oxide layer on the first metal layer. The first metal-oxide layer comprises the first metal. A second metal layer can comprise a second metal over and in physical contact with the first metal-oxide layer. A first continuous non-conductive barrier layer can be in physical contact with sidewalls of the first metal layer and sidewalls of the first metal-oxide layer. A second metal-oxide layer can be on the second metal layer. The second metal-oxide layer can comprise the second metal layer. A third metal layer can be over and in physical contact with the second metal-oxide layer. The first and second metal-oxide layers, are further characterized as independent storage mediums. | 02-06-2014 |
20140036569 | RESISTIVE MEMORY DEVICE - A resistive memory device includes a first cell array configured to store data, a second cell array configured to share column lines of the first cell array, a first error correction cell array configured to store an error correction code that corresponds to the data to be stored in the first cell array, and a second error correction cell array configured to share column lines of the first error correction cell array. | 02-06-2014 |
20140036570 | OPERATING METHOD FOR MEMORY DEVICE AND MEMORY ARRAY AND OPERATING METHOD FOR THE SAME - An operating method for a memory device and a memory array and an operating method for the same are provided. The operating method for the memory device comprises following steps. A memory device is made being in a set state. A method for making the memory device being in the set state comprises applying a first bias voltage to the memory device. The memory device in the set state is read. A method for reading the memory device in the set state comprises applying a second bias voltage to the memory device. A recovering bias voltage is applied to the memory device. The step for applying the recovering bias voltage is performed after the step for applying the first bias voltage or the step for applying the second bias voltage. | 02-06-2014 |
20140036571 | SEMICONDUCTOR MEMORY DEVICE AND OPERATION METHOD THEREOF - A semiconductor memory device according to an embodiment includes a control circuit configured to apply a first voltage to a selected first line, apply a second voltage to a selected second line, and apply a third voltage and a fourth voltage to a non-selected first line and a non-selected second line in a setting operation, respectively. The control circuit includes a detection circuit configured to detect a transition of a resistance state of a selected memory cell using a reference voltage. The control circuit is configured to execute a read operation in which the control circuit applies the third voltage to the selected first line and the non-selected first line, applies the second voltage to the selected second line, and applies the fourth voltage to the non-selected second line, and set the reference voltage based on a voltage value of the selected second line. | 02-06-2014 |
20140036572 | METHOD FOR DRIVING NONVOLATILE STORAGE ELEMENT, AND NONVOLATILE STORAGE DEVICE - Provided is a method for driving a variable resistance nonvolatile storage element that can improve the information holding capability. The method includes: determining whether or not a current that flows through the nonvolatile storage element is larger than or equal to a first verify level IRL (Verify); determining whether or not a current that flows through the nonvolatile storage element is smaller than or equal to a second verify level IRH (Verify); and determining that the nonvolatile storage element is in the second resistance state when the current that flows through the nonvolatile storage element is smaller than a current reference level Iref, and determining that the nonvolatile storage element is in the first resistance state when the current is larger than the current reference level Iref, the current reference level Iref satisfying (IRL (Verify)+IRH (Verify))/202-06-2014 | |
20140036573 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a memory cell array having a plurality of memory cells arranged in a matrix, each memory cell being configured such that a variable resistance element and a selection transistor are connected in series. A set operation for a memory cell (an operation of converting the resistance of the variable resistance element to a low resistance) is performed by applying a set voltage pulse for a longer time than that for a reset operation (an operation of converting the resistance of the variable resistance element to a high resistance) while limiting, using the selection transistor, an electric current flowing in the set operation to a certain low electric current, and by simultaneously applying the set voltage pulse to the plurality of memory cells. | 02-06-2014 |
20140036574 | METHOD FOR NONDESTRUCTIVELY READING RESISTIVE MEMORY ELEMENTS - A method for reading out a memory element comprises a series connection. of at least two memory cells A and B each have a stable state A0 or B0 having higher resistance and a stable state A1 or B1 having lower electrical resistance. An electrical variable of the series circuit is measured and an electrical variable is selected for this measurement, to which the memory cell A in state A0 makes a different contribution than the memory cell B in state B0 and/or to which the memory cell A instate A1 makes a different contribution than the memory cell B in state B1. The two state combinations A1 and B0 or A0 and B1 then result in differing values for the electrical variable that is measured by way of the series circuit. These state combinations can thus be distinguished from each other without having to change the logic state of the memory element during reading. | 02-06-2014 |
20140036575 | VARIABLE RESISTANCE MEMORY DEVICE AND RELATED METHOD OF OPERATION - A variable resistance memory device comprises a variable resistance memory cell, a switch that selectively passes a write voltage to an input terminal of the variable resistance memory cell, and a trigger circuit that controls the switch to cut off the write voltage from the input terminal upon determining that the variable resistance memory cell is programmed to a target state by detecting voltage fluctuation of the one side of variable resistance memory cell. | 02-06-2014 |
20140036576 | ELECTRONIC DEVICES CONTAINING SWITCHABLY CONDUCTIVE SILICON OXIDES AS A SWITCHING ELEMENT AND METHODS FOR PRODUCTION AND USE THEREOF - In various embodiments, electronic devices containing switchably conductive silicon oxide as a switching element are described herein. The electronic devices are two-terminal devices containing a first electrical contact and a second electrical contact in which at least one of the first electrical contact or the second electrical contact is deposed on a substrate to define a gap region therebetween. A switching layer containing a switchably conductive silicon oxide resides in the gap region between the first electrical contact and the second electrical contact. The electronic devices exhibit hysteretic current versus voltage properties, enabling their use in switching and memory applications. Methods for configuring, operating and constructing the electronic devices are also presented herein. | 02-06-2014 |
20140043886 | SENSING MEMORY ELEMENT LOGIC STATES FROM BIT LINE DISCHARGE RATE THAT VARIES WITH RESISTANCE - A digital memory element has a sense circuit latch to read the value stored in a bit cell. Before addressing a word line, the bit lines are precharged. During the read operation, a bit line is coupled to a supply voltage through a bit cell memory element that has different resistances at logic states “0” and “1.” A reference bit line is coupled to the supply voltage through a comparison resistance value, especially a resistance between high and low resistance of the memory element in the two logic states. Voltages on the bit line and reference bit line ramp toward a switching threshold at rates related to the resistance values. The first line to discharge to switching threshold voltage sets the sense circuit latch. | 02-13-2014 |
20140043887 | WRITE DRIVER CIRCUIT, SEMICONDUCTOR APPARATUS USING THE SAME, AND MEMORY SYSTEM - A write driver circuit includes a write control unit and a write driver. The write control unit is configured to generate a write control current according to data to be stored. The write driver is configured to generate a write current for writing the data into a memory cell, in response to the write control current and an address signal, wherein the write driver changes the magnitude of the write current according to the write control current and the address signal. | 02-13-2014 |
20140050009 | MULTI-PORT MAGNETIC RANDOM ACCESS MEMORY (MRAM) - A memory array is organized into rows and columns of resistive elements and is disclosed to include a resistive element to be read or to be written thereto. Further, a first access transistor is coupled to the resistive element and to a first source line and a second access transistor is coupled to the resistive element and to a second source line, the resistive element being coupled at one end to the first and second access transistors and at an opposite end to a bit line. The memory array further has other resistive elements that are each coupled to the bit line. The resistive element is written to while one or more of the other resistive elements are being read. | 02-20-2014 |
20140050010 | SEMICONDUCTOR MEMORY DEVICE AND FILE MEMORY SYSTEM - According to an embodiment, a semiconductor memory device has: a memory cell array formed by stacking through insulation layers a plurality of memory mats which each have a plurality of first lines, a plurality of second lines and a plurality of resistance varying memory cells provided at intersection portions of the pluralities of first lines and second lines; and an accessing circuit which applies voltages to the memory cell array. A number of the first lines included in the memory mat is greater than a number of the second lines. When the accessing circuit accesses the selected memory cell, the accessing circuit selects a plurality of first lines and a second line connected to selected memory cells to which the accessing circuit needs to be connected and judges data stored in the selected memory cells according to currents flowing to the selected memory cells. | 02-20-2014 |
20140050011 | STORAGE UNIT AND DRIVING METHOD - There is provided a storage unit including: a storage device configured to store a resistance state, the resistance state being changeable between a first state and a second state; and a driving section, when setting the resistance state to the first state, applying a first pulse having a first polarity to the storage device, the driving section, when setting the resistance state to the second state, applying a second pulse having a second polarity to the storage device, then temporarily applying a third pulse having the first polarity, and applying the second pulse again, the first polarity and the second polarity differing from each other. | 02-20-2014 |
20140050012 | PROGRAMMABLE VOLATILE/NON-VOLATILE MEMORY CELL - The invention concerns a memory device comprising at least one memory cell comprising: a first transistor ( | 02-20-2014 |
20140050013 | NONVOLATILE MEMORY ELEMENT AND NONVOLATILE MEMORY DEVICE - A nonvolatile memory element includes: a first electrode; a second electrode; and a variable resistance layer comprising a metal oxide positioned between the first electrode and the second electrode. The variable resistance layer includes: a first oxide layer having a resistivity ρ | 02-20-2014 |
20140050014 | DRIVING METHOD OF VARIABLE RESISTANCE ELEMENT AND NON-VOLATILE MEMORY DEVICE - A method of driving a variable resistance element comprises: before a first write step is performed, applying an initial voltage pulse of a first polarity to change a resistance value of a metal oxide layer from a resistance value corresponding to an initial state of the metal oxide layer to another resistance value; wherein when the resistance value corresponding to the initial state is R0, the resistance value corresponding to a write state is RL, the resistance value corresponding to an erase state is RH, another resistance value is R2, a maximum value of the current flowing when the initial voltage pulse is applied is IbRL, a maximum value of the current flowing when the write voltage pulse is applied is IRL, and a maximum value of the current flowing when the erase voltage pulse is applied is IRH, R0>RH>R2≧RL, and |IRL|>|IbRL| are satisfied. | 02-20-2014 |
20140050015 | NONVOLATILE STORAGE DEVICE AND METHOD FOR WRITING INTO THE SAME - The nonvolatile storage device includes a variable resistance element and a write circuit which writes data into the variable resistance element, wherein the variable resistance element has a property of changing from a first resistance state to a second resistance state when a pulse of a first voltage is applied to the variable resistance element, and changing from the second resistance state to the first resistance state when a pulse of a second voltage is applied to the variable resistance element, and the write circuit applies, to the variable resistance element, at least the pulse of the first voltage, a pulse of a third voltage, and the pulse of the first voltage in this order, when the variable resistance element is caused to change from the first resistance state to the second resistance state. | 02-20-2014 |
20140056053 | UNIPOLAR MEMORY DEVICES - Electronic apparatus, systems, and methods can include a resistive memory cell having a dielectric structured as an operably variable resistance region between an oxygen source and an oxygen sink. The dielectric, oxygen source, and an oxygen sink can be structured as a field driven unipolar memory element with respect to generation and healing of a filament in the dielectric. Additional apparatus, systems, and methods are disclosed. | 02-27-2014 |
20140056054 | RESISTIVE MEMORY DEVICE AND PROGRAMMING METHOD THEREOF - A method for programming a resistive memory device includes: programming a resistive memory; generating a verification data based on comparison result of a voltage, which is generated from a current flowing through the resistive memory, and a verification reference voltage which is higher than a read reference voltage used for a normal read operation; and deciding whether to end a program operation based on the verification data. | 02-27-2014 |
20140056055 | VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE, AND ACCESSING METHOD FOR VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE - A variable resistance nonvolatile memory device includes: bit lines in layers; word lines in layers formed at intervals between the layers of the bit lines; a memory cell array including basic array planes and having memory cells formed at crosspoints of the bit lines in the layers and the word lines in the layers; global bit lines provided in one-to-one correspondence with the basic array planes; and sets provided in one-to-one correspondence with the basic array planes, and each including a first selection switch element and a second selection switch element, wherein memory cells connected to the same word line are successively accessed in different basic array planes, and memory cells are selected so that voltages applied to the word line and bit lines are not changed and a direction in which current flows through the memory cells is the same. | 02-27-2014 |
20140056056 | METHOD FOR READING DATA FROM NONVOLATILE MEMORY ELEMENT, AND NONVOLATILE MEMORY DEVICE - A method for reading data from a nonvolatile memory element including a first electrode, a second electrode, and a variable resistance layer which includes a local region having a higher degree of oxygen deficiency than a surrounding region, the method including: applying a third voltage pulse between the first electrode and the second electrode, the third voltage pulse having a voltage with an absolute value smaller than absolute values of voltages of the first voltage pulse and the second voltage pulse; and reading the resistance state of the variable resistance layer by applying a fourth voltage pulse between the first electrode and the second electrode after the applying of a third voltage pulse, the fourth voltage pulse having a voltage with an absolute value smaller than the absolute values of the voltages of the first voltage pulse and the second voltage pulse. | 02-27-2014 |
20140063897 | NON-VOLATILE MEMORY INCLUDING REFERENCE SIGNAL PATH - Some embodiments include apparatuses and methods having a first memory element and a first select component coupled to the first memory element, a second memory element and a second select component coupled to the second memory element, and an access line shared by the first and second select components. At least one of the embodiments can include a circuit to generate a signal indicating a state of the second memory element based on a first signal developed from a first signal path through the first memory element and a second signal developed from a second signal path through the second memory element. | 03-06-2014 |
20140063898 | SYSTEMS, METHODS AND DEVICES FOR PROGRAMMING A MULTILEVEL RESISTIVE MEMORY CELL - Embodiments disclosed herein may relate to programming a multi-level memory cell with programming pulse sequences that comprise forward-biased and reverse-biased programming pulses. | 03-06-2014 |
20140063899 | METHODS, DEVICES AND SYSTEMS USING OVER-RESET STATE IN A MEMORY CELL - Memory cells, devices and methods are disclosed, including those that involve applying a waveform to a resistive memory cell to program the memory cell to an over-reset state representing a logic value. | 03-06-2014 |
20140063900 | APPARATUS AND METHOD FOR DETECTING REFLOW PROCESS - Circuitry and method for detecting occurrence of a reflow process to an embedded storage device are disclosed. A temperature sensing device includes a resistor, a temperature sensor, and a comparator. The first terminal of the resistor is coupled to a voltage source, and the second terminal of the resistor is coupled to both the first terminal of the temperature sensor and the first input of the comparator. The second terminal of the temperature sensor is grounded and the second input of the comparator is coupled to a reference voltage. The resistance state of the temperature sensor changes from a first resistance state to a second resistance state when the temperature surrounding the temperature sensor reaches a threshold. The comparator generates an output based on the resistance changes of the temperature sensor. The generated output may indicate whether a reflow process has occurred to the embedded storage device. | 03-06-2014 |
20140063901 | MEMORY DEVICES, CIRCUITS AND, METHODS THAT APPLY DIFFERENT ELECTRICAL CONDITIONS IN ACCESS OPERATIONS - A memory device can include a plurality of memory elements programmable between different impedance states; and circuits configured to apply first electrical conditions to one group of memory elements and second electrical conditions, different from the first electrical conditions, to another group of memory elements to vary a speed of an access operation to the different groups of memory elements. | 03-06-2014 |
20140063902 | MEMORY DEVICES, CIRCUITS AND, METHODS THAT APPLY DIFFERENT ELECTRICAL CONDITIONS IN ACCESS OPERATIONS - A memory device can include a plurality of physical blocks that each include a number of memory elements programmable between at least two different impedance states, the memory elements being subject to degradation in performance; and bias circuits configured to applying healing electrical conditions to at least one spare physical block that does not contain valid data; wherein the healing electrical conditions are different from write operation electrical conditions, and reverse degradation of the memory elements of the at least one spare physical block. | 03-06-2014 |
20140063903 | RESISTIVE RANDOM ACCESS MEMORY, CONTROLLING METHOD AND MANUFACTURING METHOD THEREFOR - A resistive random access memory (RRAM), a controlling method for the RRAM, and a manufacturing method therefor are provided. The RRAM includes a first electrode layer; a resistance switching layer disposed on the first electrode layer; a diffusion metal layer disposed on the resistance switching layer; and a second electrode layer disposed on the diffusion metal layer, wherein at least one extension electrode is disposed in the resistance switching layer. | 03-06-2014 |
20140063904 | VARIABLE RESISTANCE MEMORY DEVICE AND OPERATING METHOD THEREOF - An operating method of a variable resistance memory device including a pre-read step which may include the steps of: reading a first reference cell using a first reference voltage; reading a second reference cell using a second reference voltage; and setting a third reference voltage based on the first and second reference voltages; and a main read step of reading a selected memory cell using the third reference voltage. | 03-06-2014 |
20140063905 | SEMICONDUCTOR MEMORY DEVICE CAPABLE OF MEASURING WRITE CURRENT AND METHOD FOR MEASURING WRITE CURRENT - A method for measuring a write current of a semiconductor memory device includes the steps of: programming initial data into memory cells which are to be programmed substantially at the same time; determining whether the memory cells are programmed into the same state or not; inputting test data when the memory cells are programmed into the same state; setting write current paths of the memory cells by comparing the initial data and the test data; and measuring a write current consumed when the test data are programmed into the memory cells. | 03-06-2014 |
20140063906 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device according to an embodiment comprises: a memory cell array including a plurality of memory cells provided at each of intersections of a plurality of first lines and a plurality of second lines; | 03-06-2014 |
20140063907 | SEMICONDUCTOR MEMORY DEVICE - This semiconductor memory device comprises: a memory cell array configured as an arrangement of memory cells disposed at intersections of a plurality of first lines disposed substantially in parallel and a plurality of second lines disposed to intersect the first lines, each of the memory cells including a variable resistance element; and a control circuit configured to control the memory cell array. The control circuit is configured to change a voltage value of a resetting verify voltage applied for confirming completion of the resetting operation according to a degree of change of resistance of the memory cell when performing the resetting operation to change the memory cell from a low-resistance state to a high-resistance state. | 03-06-2014 |
20140063908 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device according to an embodiment comprises: a memory cell array including memory cells, each of the memory cells disposed at each of intersections of first lines and second lines and including a variable resistor; and a control circuit configured to apply a first voltage to a selected first line and to apply a second voltage having a voltage value which is smaller than that of the first voltage to a selected second line, such that a selected memory cell is applied with a first potential difference required in an operation of the selected memory cell. The control circuit is configured such that when the first potential difference is applied a plurality of times to a plurality of the selected memory cells to execute the operation, the number of selected memory cells simultaneously applied with the first potential difference can be changed. | 03-06-2014 |
20140063909 | NONVOLATILE MEMORY ELEMENT, NONVOLATILE MEMORY DEVICE, AND WRITING METHOD FOR USE IN NONVOLATILE MEMORY ELEMENT - In a nonvolatile memory element, when a voltage value of an electric pulse has a relationship of V2>V1>0 V>V3>V4 and a resistance value of a variable resistance layer has a relationship of R3>R2>R4>R1, the resistance value of the variable resistance layer becomes: R2, when the electric pulse having a voltage value of V2 or greater is applied between electrodes; R4, when the electric pulse having a voltage value of V4 or smaller is applied between the electrodes; R3, when the resistance value of the variable resistance layer is R2 and the electric pulse having a voltage value of V3 is applied between the electrodes; and R1, when the resistance value of the variable resistance layer is R4 and the electric pulse having a voltage value of V1 is applied between the electrodes. | 03-06-2014 |
20140063910 | DATA VERIFICATION DEVICE AND A SEMICONDUCTOR DEVICE INCLUDING THE SAME - A semiconductor device includes a data verification device. The data verification device includes a data storage unit for storing data to be input to a memory region in response to a first or second control signal, an input data verifier for deactivating an output of a sense amplifier in response to the first control signal and transmitting the input data stored in the data storage unit to an external pad, and a sense-amplifier verifier for transmitting the input data stored in the data storage unit to the sense amplifier upon in response to the second control signal. | 03-06-2014 |
20140063911 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING SAME - A nonvolatile semiconductor memory device according to an embodiment comprises: a memory cell array including a plurality of memory layers; and a control unit configured to control a voltage applied to the memory cell array. Each of the memory layers comprises a first line and a second line, and further includes a memory cell disposed between the first line and the second line and including a variable resistance element. The control unit is configured to, when executing a forming operation on the memory cell array, execute the forming operation sequentially on the plurality of memory layers. The forming operation is executed sequentially on the memory layers in ascending order of a magnitude of a non-selected current flowing in a non-selected memory cell during the forming operation. | 03-06-2014 |
20140063912 | NON-VOLATILE MEMORY DEVICE - According to an embodiment, a non-volatile memory device includes a first conductive layer, a second conductive layer, and a resistance change layer provided between the first conductive layer and the second conductive layer. The resistance change layer is capable of making a transition between a low-resistance state and a high-resistance state, and includes an oxide containing at least one of hafnium (Hf) and zirconium (Zr), at least one selected from the group consisting of barium (Ba), lanthanum (La), gadolinium (Gd) and lutetium (Lu), and nitrogen (N). | 03-06-2014 |
20140063913 | NON-VOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A non-volatile memory device includes: a memory cell array including a plurality of memory cells each including a variable resistance element and a first current steering element; and a current steering element parameter generation circuit. The current steering element parameter generation circuit includes: a third line placed between a substrate and a second interlayer dielectric; a fourth line placed above the second interlayer dielectric; and a second current steering element which is connected between the third line and the fourth line without the variable resistance element being interposed therebetween when the variable resistance element is removed between the third line and the fourth line and has the same non-linear current steering characteristics as the first current steering element. | 03-06-2014 |
20140063914 | VARIABLE RESISTANCE MEMORY DEVICES AND ERASE VERIFYING METHODS THEREOF - An erase verifying method includes applying a first voltage to a plurality of word lines connected to a memory cell block, and applying a second voltage less than the first voltage to a plurality of bit lines connected to the memory cell block. The method includes sensing bit line currents flowing through the plurality of bit lines, and comparing the sensed bit line currents with a reference current. The method also includes determining that the memory cell block has been sufficiently erased by a first erase operation if each of the sensed bit line currents is less than the reference current. | 03-06-2014 |
20140071733 | MULTI-PORT MEMORY DEVICES AND METHODS HAVING PROGRAMMABLE IMPEDANCE ELEMENTS - A memory device can include at least two ports for transferring data to and from the memory device; and plurality of memory cells, each memory cell including at least one element programmable between different impedance states, and a plurality of access devices, each access device providing a current path between the element and a different one of the ports. | 03-13-2014 |
20140071734 | RESISTANCE-CHANGE MEMORY - According to one embodiment, a resistance-change memory includes a memory cell and a control circuit. The memory cell includes a first electrode, a second electrode, and a variable resistance layer which is disposed between the first electrode and the second electrode. The control circuit sets a current flowing through the memory cell to a first upper limit and applies a first voltage to the memory cell in a first write, and after the first write, the control circuit sets the current flowing through the memory cell to a second upper limit and applies a second voltage to the memory cell in a second write. | 03-13-2014 |
20140078808 | Embedded Nonvolatile Memory Elements Having Resistive Switching Characteristics - Provided are nonvolatile memory assemblies each including a resistive switching layer and current steering element. The steering element may be a transistor connected in series with the switching layer. Resistance control provided by the steering element allows using switching layers requiring low switching voltages and currents. Memory assemblies including such switching layers are easier to embed into integrated circuit chips having other low voltage components, such as logic and digital signal processing components, than, for example, flash memory requiring much higher switching voltages. In some embodiments, provided nonvolatile memory assemblies operate at switching voltages less than about 3.0V and corresponding currents less than 50 microamperes. A memory element may include a metal rich hafnium oxide disposed between a titanium nitride electrode and doped polysilicon electrode. One electrode may be connected to a drain or source of the transistor, while another electrode is connected to a signal line. | 03-20-2014 |
20140078809 | NONVOLATILE LATCH CIRCUIT, NONVOLATILE FLIP-FLOP CIRCUIT, AND NONVOLATILE SIGNAL PROCESSING DEVICE - A nonvolatile latch circuit according to the present invention includes: a latch operating unit in which outputs of cross-coupled connected inverter circuit and inverter circuit are connected via a series circuit which includes a transistor, a variable resistance element, and a transistor in this order, and store and restore in a latch state are controlled by control terminals of the transistors; and a comparator circuit which compares a signal obtained by amplifying the value of the sum of potentials at both ends of the variable resistance element with the logic state of the latch operating unit, wherein writing to and reading from the variable resistance element are repeated until an output of the comparator circuit indicates that normal write operation has been performed. | 03-20-2014 |
20140078810 | LOADLESS VOLATILE/NON-VOLATILE MEMORY CELL - The invention concerns a memory device comprising at least one memory cell comprising: first and second transistors ( | 03-20-2014 |
20140078811 | VARIABLE RESISTANCE NONVOLATILE MEMORY ELEMENT WRITING METHOD AND VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE - Provided is a method of writing to a variable resistance nonvolatile memory element which is capable of both improving retention characteristics and enlarging a window of operation. In the method of writing, to write “1” data (LR), first a weak HR writing process is performed in which a weak HR writing voltage pulse set for changing the variable resistance nonvolatile memory element to an intermediate resistance state is applied and, subsequently, a LR writing process is performed in which a LR writing voltage pulse set for changing the variable resistance nonvolatile memory element from the intermediate resistance state to a LR state is applied. | 03-20-2014 |
20140078812 | METHODS OF OPERATING VARIABLE RESISTANCE MEMORY DEVICES AND RELATED VARIABLE RESISTANCE MEMORY DEVICES SO OPERATING - A method of operating a resistive non-volatile memory can be provided by applying a forming voltage across first and second electrodes of a selected memory cell in the variable resistance non-volatile memory device during an operation to the selected memory cell. The forming voltage can be a voltage level that is limited to less than a breakdown voltage of an insulation film included in selected memory cell between a variable resistance film and one of first electrode. Related devices and materials are also disclosed. | 03-20-2014 |
20140078813 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device includes a memory cell array including memory cells having a variable resistance element provided at intersections of crossing first and second lines, the memory cell array including third lines, fourth and fifth lines, and first and second diodes; and a control circuit which, when the memory cells include a selected memory cell, a selected first line connected to the selected memory cell and an unselected first line, and a selected second line connected to the selected memory cell and an unselected second line, supplies a first voltage to the selected first line, and supplies a second voltage to the unselected first line, and when the third lines include a selected third line electrically connected to the selected second line via one of the fourth line and a first diode, supplies a third voltage to the selected fourth line. | 03-20-2014 |
20140078814 | CROSSPOINT NONVOLATILE MEMORY DEVICE AND METHOD OF DRIVING THE SAME - The nonvolatile memory device includes a control circuit that controls a sense amplification circuit and a writing circuit. The control circuit changes a value of at least one of (a) a load current and (b) a forming pulse current or a forming pulse voltage, according to a total number of sneak current paths formed by memory cells each including a variable resistance element in a second resistance state having a low resistance value except a selected memory cell in a memory cell array. | 03-20-2014 |
20140085964 | SEMICONDUCTOR STORAGE DEVICE - A control circuit controls memory operations such that, in a first rewriting operation in which a resistance state of a variable resistance element is changed from a first state to a second state, a first voltage pulse is applied to both terminals of a memory cell while limiting the amount of current flowing through the variable resistance element to a value smaller than or equal to a certain small amount of current, in a second rewriting operation in which the resistance state of the variable resistance element is changed from the second state to the first state, a second voltage pulse is applied to both terminals of the memory cell, and, in a reading operation in which the resistance state stored in the variable resistance element is read, a third voltage pulse is applied to both terminals of the memory cell. | 03-27-2014 |
20140092666 | LOW VOLTAGE EMBEDDED MEMORY HAVING CONDUCTIVE OXIDE AND ELECTRODE STACKS - Low voltage embedded memory having conductive oxide and electrode stacks is described. For example, a material layer stack for a memory element includes a first conductive electrode. A conductive oxide layer is disposed on the first conductive electrode. The conductive oxide layer has a plurality of oxygen vacancies therein. A second electrode is disposed on the conductive oxide layer. | 04-03-2014 |
20140092667 | Data storage in memory array with less than half of cells in any row and column in low-resistance states - A method of storing data in a memory array with less than half of memory elements in any row and column in a low-resistance state. The data are arranged in a first portion of an encoding array. High-resistance values are entered in a second portion. A codeword is selected from a covering code for each row in which too many entries have low-resistance values. The selected codeword is used to reduce the number of low-resistance values in that row. A codeword is selected for each column in which too many entries have low-resistance values and the codeword is used to reduce the number of such values in that column. The process is repeated until no row and no column has too many low-resistance values. The array entries are stored in corresponding memory elements. | 04-03-2014 |
20140092668 | RESISTIVE SWITCHING DEVICES AND MEMORY DEVICES INCLUDING THE SAME - A resistive switching device includes a first material layer between a first electrode and a second electrode. The first material layer has a first region and a second region parallel to the first region. The first region corresponds to a conducting path formed in the first material layer, and is configured to switch from a low-resistance state to a high-resistance state in response to an applied voltage that is greater than or equal to a first voltage. The second region is configured to switch to a first resistance value that is less than a resistance value of the first region in the high-resistance state when the applied voltage is greater than or equal to a second voltage. The first region remains constant or substantially constant when the second region has the first resistance value. | 04-03-2014 |
20140092669 | NON-VOLATILE VARIABLE RESISTIVE ELEMENT, CONTROLLING DEVICE AND STORAGE DEVICE - A non-volatile variable resistive element according to an embodiment comprises a first electrode including a first metal, a second electrode including a second metal, a third electrode placed opposite to the first and second electrodes, and a variable resistive layer placed between the first and second electrodes and the third electrode, a resistance of the variable resistive layer reducing when at least either one of the first metal and the second metal is diffused into the variable resistive layer and the resistance of the variable resistive layer rising when at least either one of the first metal and the second metal diffused into the variable resistive layer is collected by the first electrode or the second electrode. | 04-03-2014 |
20140092670 | NON-VOLATILE RESISTIVE MEMORY DEVICES AND METHODS FOR BIASING RESISTIVE MEMORY STRUCTURES THEREOF - The disclosed technology relates to a non-volatile resistive memory device and a method of using the same. In one aspect, the memory device comprises a plurality of memory cells interconnected by a plurality of bit lines, a plurality of word lines, a plurality of source lines and a plurality of form lines. The memory device further comprises a memory controller connected to and configured to apply voltages to the bit lines, the word lines, the source lines and the form lines. In addition, each of the memory cells comprises a cell selecting transistor and a resistive memory element serially connected to a drain-source path of the cell selecting transistor. Furthermore, each of the memory cells comprises a boosting capacitor configured to provide a boosting a voltage to an internal node formed at a connection point between the resistive memory element and the cell selecting transistor. | 04-03-2014 |
20140092671 | CROSS-POINT VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE - A cross-point memory device including memory cells each includes: a variable resistance element that reversibly changes at least between a low resistance state and a high resistance state; and a current steering element that has nonlinear current-voltage characteristics, and the cross-point memory device comprises a read circuit which includes: a reference voltage generation circuit which comprises at least the current steering element; a differential amplifier circuit which performs current amplification on an output voltage in the reference voltage generation circuit; a feedback controlled bit line voltage clamp circuit which sets the low voltage side reference voltage to increase with an output of the differential amplifier circuit; and a sense amplifier circuit which determines a resistance state of a selected memory cell according to an amount of current flowing through the selected memory cell. | 04-03-2014 |
20140098593 | DRIFT ACCELERATION IN RESISTANCE VARIABLE MEMORY - The present disclosure includes apparatuses and methods including drift acceleration in resistance variable memory. A number of embodiments include applying a programming signal to the resistance variable memory cell to program the cell to a target state, subsequently applying a pre-read signal to the resistance variable memory cell to accelerate a drift of a resistance of the programmed cell, and subsequently applying a read signal to the resistance variable memory cell. | 04-10-2014 |
20140098594 | CROSS POINT VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE - Each memory cell is formed at a different one of cross points of bit lines extending in an X direction and formed in a plurality of layers and word lines extending in a Y direction. In a multilayer cross point structure in which a plurality of vertical array planes sharing the word lines are aligned in the Y direction each for a group of bit lines aligned in a Z direction, even and odd layer bit line selection switch elements switch connection and disconnection between a global bit line and the commonly-connected even layer bit line and the commonly-connected odd layer bit line, respectively. Each of the even and odd layer bit line selection switch elements has both a bit line selection function and a current limiting function in low resistance writing. | 04-10-2014 |
20140098595 | NON-VOLATILE MEMORY DEVICE - A non-volatile memory device includes: a memory cell array including a plurality of memory cells each including a first variable resistance element and a first current steering element and a parameter generation circuit including a reference cell including a second variable resistance element and a second current steering element having the same current density-voltage characteristic as that of the first current steering element, wherein a conductive shorting layer for causing short-circuiting between the electrodes is formed on the side surfaces of the second variable resistance element. | 04-10-2014 |
20140104922 | APPARATUSES, CIRCUITS, AND METHODS FOR BIASING SIGNAL LINES - Apparatuses, circuits, and methods are disclosed for biasing signal lines in a memory array. In one such example the memory array includes a signal line coupled to a plurality of memory cells and is configured to provide access to the plurality of memory cells responsive to a biasing condition of the signal line. The memory array also includes a signal line driver coupled to the signal line, the signal line driver configured to provide a biasing signal to the signal line and to provide a preemphasis in the biasing signal responsive to a control signal. The control signal is responsive to an operating condition. | 04-17-2014 |
20140104923 | RESISTIVE MEMORY DEVICES AND METHODS OF OPERATING THE SAME - Resistive memory driving methods are provided. The methods may include applying an operating voltage set according to a mode of operation to a selected word line among the plurality of word lines and a selected bit line among the plurality of bit lines within a line delay period. | 04-17-2014 |
20140104924 | APPARATUS AND METHOD FOR REPAIRING RESISTIVE MEMORIES AND INCREASING OVERALL READ SENSITIVITY OF SENSE AMPLIFIERS - A memory includes a module and a demultiplexer. The module is configured to monitor outputs of sense amplifiers. Each of the outputs of the sense amplifiers is configured to be in a first state or a second state. The module is configured to determine that two or more of the outputs of the sense amplifiers are in a same state. The same state is the first state or the second state. The module is configured to output the state of the two or more outputs of the sense amplifiers. The demultiplexer is configured to provide the state of the two or more outputs of the sense amplifiers to a latch. | 04-17-2014 |
20140104925 | CROSS-POINT VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE AND READING METHOD FOR CROSS-POINT VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE - A cross-point variable resistance nonvolatile memory device comprises: a memory cell array; a column decoder and pre-charge circuit which pre-charges a selected word line to a first voltage in a period P | 04-17-2014 |
20140104926 | SYSTEMS AND METHODS FOR READING RESISTIVE RANDOM ACCESS MEMORY (RRAM) CELLS - A system including a resistive random access memory cell connected to a word line and a bit line and a pre-charge circuit configured to pre-charge the bit line to a first voltage with the word line being unselected. A driver circuit selects the word line at a first time subsequent to the bit line being charged to the first voltage. A comparator compares a second voltage on the bit line to a third voltage supplied to the comparator and generates an output based on the comparison. A latch latches the output of the comparator and generates a latched output. A pulse generator generates a pulse after a delay subsequent to the first time to clock the latch to latch the output of the comparator and generate the latched output. The latched output indicates a state of the resistive random access memory cell. | 04-17-2014 |
20140104927 | CONFIGURING RESISTIVE RANDOM ACCESS MEMORY (RRAM) ARRAY FOR WRITE OPERATIONS - A system includes a resistive random access memory cell and a driver circuit. The resistive random access memory cell includes a resistive element and a switching element, and has a first terminal connected to a bit line and a second terminal connected to a word line. The driver circuit is configured to apply, in response to selection of the resistive random access memory cell using the word line, a first voltage of a first polarity to the bit line to program the resistive random access memory cell to a first state by causing current to flow through the resistive element in a first direction, and a second voltage of a second polarity to the bit line to program the resistive random access memory cell to a second state by causing current to flow through the resistive element in a second direction. | 04-17-2014 |
20140104928 | METHOD AND APPARATUS FOR FORMING A CONTACT IN A CELL OF A RESISTIVE RANDOM ACCESS MEMORY TO REDUCE A VOLTAGE REQUIRED TO PROGRAM THE CELL - A cell of a resistive random access memory including a resistive element and an access device. The resistive element includes (i) a first electrode and (ii) a second electrode. The access device is configured to select and deselect the cell. The access device includes (i) a first terminal connected to a first contact and (i) a second terminal connected to a second contact. The second contact is connected to the second electrode of the resistive element via a third contact. The third contact includes (i) a first surface in contact with the second contact and (ii) a second surface in contact with the second electrode. The first surface defines a first surface area, and the second surface defines a second surface area. The first surface area is greater than the second surface area. | 04-17-2014 |
20140104929 | METHOD AND APPARATUS MANAGING WORN CELLS IN RESISTIVE MEMORIES - A method and apparatus for management worn resistive memory cells are presented. A normal read mode or worn memory cell detecting mode are used depending on the wear state of a resistive memory cell. A detection reference point is changed upon wear indication to detect the resistance of the resistive memory cell. The resistance of the resistive memory cell is detected using the changed detection reference point to determine whether or not the resistive memory cell is worn by comparing the detected resistance to a wear reference level. | 04-17-2014 |
20140104930 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprises a memory cell array including plural memory cells provided at the intersections of plural first lines and plural second lines; and a write circuit. The write circuit, on execution of a write operation, executes a first step of applying a voltage across the first and second lines connected to a data-write-targeted, selected memory cell, and a different voltage across the first and second lines connected to a data-write-untargeted, unselected memory cell of the plural memory cells and, after execution of the first step, executes a second step of applying a voltage, required for data write, across the first and second lines connected to the selected memory cell, and bringing at least one of the first and second lines connected to the unselected memory cell into the floating state. | 04-17-2014 |
20140104931 | NONVOLATILE MEMORY DEVICE AND METHOD OF PERFORMING FORMING THE SAME - A nonvolatile memory device including a control unit configured to read resistance value information for each of memory cells as initial resistance value information and store it temporarily before a voltage pulse for forming is applied, to set resistance value information as a threshold value serving as a target for completion of the forming, the resistance value information being obtained by multiplying the initial resistance value information by a predetermined coefficient, and to repeat application of the voltage pulse for forming and reading of the resistance value information until a resistance value indicated by the resistance value information on the memory cell becomes lower than a resistance value indicated by the threshold value. | 04-17-2014 |
20140104932 | Memory Cells, Non-Volatile Memory Arrays, Methods Of Operating Memory Cells, Methods Of Writing To And Writing From A Memory Cell, And Methods Of Programming A Memory Cell - In one aspect, a method of operating a memory cell includes using different electrodes to change a programmed state of the memory cell than are used to read the programmed state of the memory cell. In one aspect, a memory cell includes first and second opposing electrodes having material received there-between. The material has first and second lateral regions of different composition relative one another. One of the first and second lateral regions is received along one of two laterally opposing edges of the material. Another of the first and second lateral regions is received along the other of said two laterally opposing edges of the material. At least one of the first and second lateral regions is capable of being repeatedly programmed to at least two different resistance states. Other aspects and implementations are disclosed. | 04-17-2014 |
20140104933 | SEMICONDUCTOR MEMORY - Provided is a semiconductor memory in which it is easier to read a read margin when an ambient temperature changes. The semiconductor memory includes: a memory cell including a first variable resistance element having variable electric resistance; a first reference cell including a second variable resistance element having variable electric resistance, and serving as a point of reference for a magnitude of electric resistance of the memory cell; and a second reference cell serving as a point of reference for a magnitude of electric resistance of the first reference cell, in which a first temperature coefficient of the first variable resistance element and a second temperature coefficient of the second variable resistance element have the same polarity. | 04-17-2014 |
20140112052 | Memory Programming Methods And Memory Systems - Memory programming methods and memory systems are described. One example memory programming method includes first applying a first signal to a memory cell to attempt to program the memory cell to a desired state, wherein the first signal corresponds to the desired state, after the first applying, determining that the memory cell failed to place in the desired state, after the determining, second applying a second signal to the memory cell, wherein the second signal corresponds to another state which is different than the desired state, and after the second applying, third applying a third signal to the memory cell to program the memory cell to the desired state, wherein the third signal corresponds to the desired state. Additional method and apparatus are described. | 04-24-2014 |
20140112053 | Write driver in sense amplifier for resistive type memory - Example embodiments include a level shifting write driver in a sense amplifier for a resistive type memory. The write driver may include a cross-coupled latch circuit, a first output section, a second output section, and an input section. The first output section includes one or more first driving transistors to drive a first current through the first output section and not through the cross-coupled latch. The second output section includes one or more second driving transistors configured to drive a second current through the second output section and not through the cross-coupled latch. The current flows of the outputs sections are isolated from the latch circuit. In some embodiments, no two PMOS type transistors are serially connected, thereby reducing the consumption of die area. In some embodiments, a single control signal is used to operate the write driver. | 04-24-2014 |
20140112054 | CROSSPOINT NONVOLATILE MEMORY DEVICE AND FORMING METHOD THEREOF - A sense amplification circuit includes a sneak current compensating load current supply unit that selectively switches a load current among load currents having different current amounts and supplies the load current to a bit line selected by a column selection circuit. The sense amplification circuit outputs ‘L’ level when a current amount of the load current is more than a reference current amount, and outputs ‘H’ level when the current amount is less than the reference current amount. A control circuit adjusts the current amount to a predetermined current amount that causes the sense amplification circuit to output ‘H’ level. After the adjustment, the control circuit performs control to supply the load current having the predetermined current amount and controls the writing unit to keep the application until the sense amplification circuit outputs ‘L’ level. | 04-24-2014 |
20140112055 | VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE AND METHOD OF WRITING THEREBY - Provided is a variable resistance nonvolatile memory device that achieves, in multi-bit simultaneous writing for increasing a writing speed, writing with little variation caused by positions of memory cells in multi-bit simultaneous writing. The variable resistance nonvolatile memory device includes bit lines, word lines, memory cells, a first write circuit (e.g., a write circuit ( | 04-24-2014 |
20140112056 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND WRITE METHOD FOR THE SAME - A nonvolatile semiconductor memory device includes word lines, bit lines, a cross-point cell array including cells, each of which includes memory cells and at least one offset detection cell, a word line selection circuit, a bit line selection circuit, a write control circuit, a current sensing circuit which detects a current and converts it into an electrical signal, wherein a write control circuit adjusts a write electrical signal for causing a second write current higher than a first write current to flow through the memory cell. | 04-24-2014 |
20140112057 | APPARATUS AND METHOD FOR REFORMING RESISTIVE MEMORY CELLS - A memory includes an array of memory cells, a first module and a second module. The first module is configured to compare a first state of a memory cell with a reference. The memory cell is in the array of memory cells. The second module is configured to, subsequent to a read cycle or a write cycle of the memory cell and based on the comparison, reform the memory cell to adjust a difference between the first state and a second state of the memory cell. | 04-24-2014 |
20140112058 | RESISTANCE MEMORY CELL - A resistance memory includes a resistance memory cell having a resistance memory element and a two-terminal access device in series. The two-terminal access device affects the current-voltage characteristic of the resistance memory cell. The resistance memory additionally includes a circuit to apply across the resistance memory cell a set pulse having a set polarity to set the resistance memory cell to a low-resistance state that is retained after application of the set pulse, a reset pulse having a reset polarity, opposite to the set polarity, to reset the resistance memory cell to a high-resistance state that is retained after application of the reset pulse, and a read pulse of the reset polarity and smaller in magnitude than the reset pulse to determine the resistance state of the resistance memory cell without changing the resistance state of the resistance memory cell. | 04-24-2014 |
20140112059 | HIGH-RELIABILITY HIGH-SPEED MEMRISTOR - A memristor has a first electrode, a second electrode parallel to the first electrode, and a switching layer disposing between the first and second electrodes. The switching layer contains a conduction channel and a reservoir zone. The conduction channel has a Fermi glass material with a variable concentration of mobile ions. The reservoir zone is laterally disposed relative to the conduction channel, and functions as a source/sink of mobile ions for the conduction channel In the switching operation, under the cooperative driving force of both electric field and thermal effects, the mobile ions are moved into or out of the laterally disposed reservoir zone to vary the concentration of the mobile ions in the conduction channel to change the conductivity of the Fermi glass material. | 04-24-2014 |
20140119094 | NONVOLATILE MEMORY DEVICE USING RESISTANCE MATERIAL AND METHOD OF DRIVING THE NONVOLATILE MEMORY DEVICE - Provided is a nonvolatile memory device using a resistance material and a method of driving the nonvolatile memory device. The nonvolatile memory device comprises a resistive memory cell which stores multiple bits; a sensing node; a clamping unit coupled between the resistive memory cell and the sensing node and provides a clamping bias to the resistive memory cell; a compensation unit which provides a compensation current to the sensing node; a sense amplifier coupled to the sensing node and senses a change in a level of the sensing node; and an encoder which codes an output value of the sense amplifier in response to a first clock signal. The clamping bias varies over time. The compensation current is constant during a read period. | 05-01-2014 |
20140119095 | NONVOLATILE MEMORY DEVICE USING VARIABLE RESISTANCE MATERIAL AND METHOD FOR DRIVING THE SAME - The nonvolatile memory device using a variable resistance material and a method for driving the same are provided. A first clamping unit connected between a resistance memory cell and a first sensing node to provide a first clamping bias to the resistance memory cell. The first clamping bias changes over time. A first compensation unit provides a compensation current to the first sensing node. A first sense amplifier is connected to the first sensing node to sense a level change of the first sensing node. In response to if first data stored in the resistance memory cell, an output value of the first sense amplifier transitions to a different state after a first amount of time from a time point from where the first clamping bias starts. In response to second data that is different from the first data stored in the resistance memory cell, the output value of the first sense amplifier transitions to the different state after a second amount of time that is different from the first amount of time from the time point from where the first clamping bias starts. | 05-01-2014 |
20140119096 | SEMICONDUCTOR MEMORY APPARATUS, PROGRAM METHOD AND SYSTEM - Disclosed are a semiconductor memory apparatus, and a program method and a program system. The semiconductor memory apparatus includes a memory cell array including a plurality of resistive memory cells; and a control block configured to control at least one of a initial voltage magnitude and an initial voltage applying time in an incremental step pulse programming (ISPP) mode for the plurality of memory cells to be variable based on digital code values reflecting resistance states of the plurality of resistive memory cells. Therefore, even in the case of the worst cell, since the incremental step of the ISPP may be minimized, the writing time may be reduced, and further, unnecessary current consumption may be reduced. | 05-01-2014 |
20140119097 | RESISTANCE-BASED MEMORY HAVING TWO-DIODE ACCESS DEVICE - A resistance-based memory includes a two-diode access device. In a particular embodiment, a method includes biasing a bit line with a first voltage. The method further includes biasing the sense line with a second voltage. Biasing the bit line and biasing the sense line generates a current through a resistance-based memory element and through one of a first diode and a second diode. A cathode of the first diode is coupled to the bit line and an anode of the second diode is coupled to the sense line. | 05-01-2014 |
20140119098 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device according to the embodiment comprises memory cells each having asymmetrical voltage-current characteristics, wherein the memory cell has a first state, and a second state and a third state of higher resistances than that in the first state, wherein the memory cell, (1) in the second state, makes a transition to the first state on application of a first voltage of the first polarity, (2) in the first state, makes a transition to the second state on application of a second voltage of the second polarity, (3) in the first state, makes a transition to the third state on application of a third voltage of the second polarity (the third voltage05-01-2014 | |
20140126267 | VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE - Provided is a variable resistance element (Rij) the resistance state of which is reversibly changed by applying electrical signals of different polarities; and a current steering element (Dij) in which a first current is larger than a second current, the first current being a current which flows when a voltage of the first polarity having a first value is applied, the first value being less than a predetermined voltage value and having an absolute value greater than zero, the second current being a current which flows when a voltage of the second polarity having an absolute value which is the first value is applied, the second polarity being different from the first polarity, in which Rij and Dij are connected in series such that the polarity of a voltage to be applied to Dij is the second polarity when the resistance state of Rij is changed to high resistance state. | 05-08-2014 |
20140126268 | METHOD OF DRIVING NONVOLATILE MEMORY ELEMENT AND NONVOLATILE MEMORY DEVICE - A method of driving a nonvolatile memory element including a variable resistance element having a state reversibly changing between low and high resistance states by an applied electrical signal and a transistor serially connected to the variable resistance element. The method including: setting the variable resistance element to the low resistance state by applying a first gate voltage to a gate of the transistor and applying a first write voltage negative with respect to a first electrode; and changing a resistance value of the transistor obtained in a low-resistance write operation, when a value of current passing through the variable resistance element in the setting of the low resistance state or a resistance value of the nonvolatile memory element in the case where the variable resistance element is in the low resistance state is outside a predetermined range. | 05-08-2014 |
20140126269 | RESISTIVE MEMORY - A memory device includes an upper conductive layer, a lower layer, and a resistive, optical or magnetic matrix positioned between the upper and lower layers. | 05-08-2014 |
20140126270 | SEMICONDUCTOR MEMORY DEVICE - A memory cell array includes memory cells disposed at intersections of first lines and second lines, and each having a rectifying element and a variable resistance element connected in series. A control circuit, when performing an operation to change retained data, applies a first voltage to a selected first line and applies a second voltage to a selected second line; furthermore, applies a third voltage to a non-selected first line; and, moreover, applies a fourth voltage larger than the third voltage to a non-selected second line. An absolute value of a difference between the third voltage and the fourth voltage is set smaller than an absolute value of a difference between the first voltage and the second voltage by an amount of an offset voltage. A value of the offset voltage increases as the absolute value of the difference between the first and second voltages increases. | 05-08-2014 |
20140133213 | RESISTIVE RANDOM ACCESS MEMORY DEVICE AND OPERATING METHOD THEREOF - A resistive random access memory (RRAM) device and operating method are disclosed herein. The RRAM device includes at least one RRAM cell and a control circuit. The RRAM cell includes a bottom electrode, an amorphous Indium-Gallium-Zinc-Oxide (a-IGZO) layer, a Ti layer and a top electrode. The a-IGZO layer is disposed on the bottom layer. The Ti layer is disposed on the a-IGZO layer. The top electrode is disposed on the Ti layer. The control circuit is configured to provide at least one electrical signal to the RRAM cell, so as to change the resistance value of the RRAM cell. | 05-15-2014 |
20140133214 | RESISTIVE MEMORY DEVICE AND METHOD FOR DRIVING THE SAME - A resistive memory device includes a plurality of memory cells, each of which is configured to store a normal data, a first reference data corresponding to a first resistance state and a second reference data corresponding to a second resistance state, a data copy unit configured to temporarily store the normal data read from a selected memory cell and generate a copied cell current based on the stored normal data, a mirroring block configured to temporarily store the first and second reference data read from the selected memory cell, and to generate a first reference current and a second reference current based on the stored first and second reference data, respectively, and a sensing unit configured to sense the stored normal data based on the copied cell current and the first reference current and the second reference current. | 05-15-2014 |
20140133215 | RESISTOR THIN FILM MTP MEMORY - An integrated circuit is formed having an array of memory cells located in the dielectric stack above a semiconductor substrate. Each memory cell has two adjustable resistors and two heating elements. A dielectric material separates the heating elements from the adjustable resistors. One heating element alters the resistance of one of the resistors by applying heat thereto to write data to the memory cell. The other heating element alters the resistance of the other resistor by applying heat thereto to erase data from the memory cell. | 05-15-2014 |
20140133216 | SYSTEM AND METHOD FOR MRAM HAVING CONTROLLED AVERAGABLE AND ISOLATABLE VOLTAGE REFERENCE - A memory has a plurality of non-volatile resistive (NVR) memory arrays, each with an associated reference voltage generating circuit coupled by a reference circuit coupling link to a reference line, the reference coupled to a sense amplifier for that NVR memory array. Reference line coupling links couple the reference lines of different NVR memory arrays. Optionally, different ones of the reference coupling links are removed or opened, obtaining respective different average and isolated reference voltages on the different reference lines. Optionally, different ones of the reference circuit coupling links are removed or opened, obtaining respective different averaged voltages on the reference lines, and uncoupling and isolating different reference circuits. | 05-15-2014 |
20140140122 | ARRAY VOLTAGE REGULATING TECHNIQUE TO ENABLE DATA OPERATIONS ON LARGE CROSS-POINT MEMORY ARRAYS WITH RESISTIVE MEMORY ELEMENTS - Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to preserve states of memory elements in association with data operations using variable access signal magnitudes for other memory elements, such as implemented in third dimensional memory technology. In some embodiments, a memory device can include a cross-point array with resistive memory elements. An access signal generator can modify a magnitude of a signal to generate a modified magnitude for the signal to access a resistive memory element associated with a word line and a subset of bit lines. A tracking signal generator is configured to track the modified magnitude of the signal and to apply a tracking signal to other resistive memory elements associated with other subsets of bit lines, the tracking signal having a magnitude at a differential amount from the modified magnitude of the signal. | 05-22-2014 |
20140140123 | PRESERVATION CIRCUIT AND METHODS TO MAINTAIN VALUES REPRESENTING DATA IN ONE OR MORE LAYERS OF MEMORY - Circuitry and methods for restoring data in memory are disclosed. The memory may include at least one layer of a non-volatile two-terminal cross-point array that includes a plurality of two-terminal memory elements that store data as a plurality of conductivity profiles and retain stored data in the absence of power. Over a period of time, logic values indicative of the stored data may drift such that if the logic values are not restored, the stored data may become corrupted. At least a portion of each memory may have data rewritten or restored by circuitry electrically coupled with the memory. Other circuitry may be used to determine a schedule for performing restore operations to the memory and the restore operations may be triggered by an internal or an external signal or event. The circuitry may be positioned in a logic layer and the memory may be fabricated over the logic layer. | 05-22-2014 |
20140140124 | RESISTIVE MEMORY DEVICE HAVING SELECTIVE SENSING OPERATION AND ACCESS CONTROL METHOD THEREOF - A method of controlling a read operation of a resistive memory device is provided which includes activating at least one of a plurality of word lines in response to a first command; after receiving a second command, sensing data of a memory cell, corresponding to a selected page, from among all memory cells connected with the activated word line through a corresponding bit line sense amplifier; and outputting the sensed data as read data according to a sensing output control signal. | 05-22-2014 |
20140140125 | SEMICONDUCTOR DEVICE AND CONTROL METHOD FOR SEMICONDUCTOR DEVICE - A semiconductor device is provided with the variable resistance element, and a control circuit that controls a resistance state of the variable resistance element by controlling current between a first end and a second end of the variable resistance element. The control circuit causes the variable resistance element to change from a first resistance state to a second resistance state by having a first current flow from the first end to the second end of the variable resistance element. In addition, after a second current smaller than the first current is made to flow from the first end to the second end of the variable resistance element, the control circuit causes the variable resistance element to change from the second resistance state to the first resistance state by having a third current flow from the second end to the first end thereof. | 05-22-2014 |
20140146592 | LOW VOLTAGE EMBEDDED MEMORY HAVING CATIONIC-BASED CONDUCTIVE OXIDE ELEMENT - Low voltage embedded memory having cationic-based conductive oxide elements is described. For example, a material layer stack for a memory element includes a first conductive electrode. A cationic-based conductive oxide layer is disposed on the first conductive electrode. The cationic-based conductive oxide layer has a plurality of cation vacancies therein. A second electrode is disposed on the cationic-based conductive oxide layer. | 05-29-2014 |
20140146593 | Method And Structure For Resistive Switching Random Access Memory With High Reliable And High Density - The present disclosure provides a resistive random access memory (RRAM) structure. The RRAM structure includes a bottom electrode on a substrate; a resistive material layer on the bottom electrode, the resistive material layer having filament features with a filament ratio greater than about 0.5; and a top electrode on the resistive material layer. | 05-29-2014 |
20140146594 | DESIGNING METHOD OF NON-VOLATILE MEMORY DEVICE, MANUFACTURING METHOD OF NON-VOLATILE MEMORY DEVICE, AND NON-VOLATILE MEMORY DEVICE - A method of designing a cross-point non-volatile memory device including memory elements arranged in (N×M) matrix, each of the memory elements including a variable resistance element and a bidirectional current steering element connected in series with the variable resistance element, the method comprises the step of: when an absolute value of a low-resistance state writing voltage is VR and an absolute value of a current flowing through the variable resistance element having changed to a low-resistance state by application of the low-resistance state writing voltage to both ends of the variable resistance element in a high-resistance state is I | 05-29-2014 |
20140146595 | CIRCUIT FOR CONCURRENT READ OPERATION AND METHOD THEREFOR - A non-volatile memory device includes an array of memory units, each having resistive memory cells and a local word line. Each memory cell has a first and a second end, the second ends are coupled to the local word line of the corresponding memory unit. Bit lines are provided, each coupled to the first end of each resistive memory cell. A plurality of select transistors is provided, each associated with one memory unit and having a drain terminal coupled to the local word line of the associated memory unit. First and second global word lines are provided, each coupled to a control terminal of at least one select transistor. First and second source lines are provided, each coupled to a source terminal of at least one select transistor. The memory device is configured to concurrently read out all resistive memory cells in one selected memory unit in a read operation. | 05-29-2014 |
20140146596 | PHASE CHANGE MEMORY ADAPTIVE PROGRAMMING - Some embodiments include methods and apparatus having a module configured to program a memory cell using a signal to cause the memory cell to have a programmed resistance value, to adjust a programming parameter value of the signal if the programmed resistance value is outside a target resistance value range, and to repeat at least one of the programming and the adjusting if the programmed resistance value is outside the target resistance value range, the signal including a different programming parameter value each time the programming is repeated. | 05-29-2014 |
20140153313 | System and Methods Using a Multiplexed Reference for Sense Amplifiers - A sense amplifier system includes a first path, a second path, a memory cell, a first reference cell, a second reference cell, and a switch component. The switch component is configured to switch connections between the first and second reference cells and the first and second paths according to a sampling phase and an amplification phase. | 06-05-2014 |
20140153314 | SYSTEM AND A METHOD FOR DESIGNING A HYBRID MEMORY CELLWITH MEMRISTOR AND COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR - The embodiments herein relates to a hybrid non-volatile memory cell system and architecture for designing integrated circuits. The system comprises CMOS access transistor connected to a memristor which stores a data based on a resistance. The system has a word line for accessing the hybrid memory and two bit lines carrying data of mutually opposite values for transferring a data from the memory. The two terminals of the transistor are connected respectively to a first terminal of the memristor and to a first bit line. The gate terminals of the transistors are coupled together to form a word line. The access transistors control the two bit lines during a read and write operation. A control logic performs a read and write operation with the hybrid memory cells. The memory architecture prevents a power leakage during data storage and controls a drift in a state during a read process. | 06-05-2014 |
20140153315 | SEMICONDUCTOR MEMORY APPARATUS, REFRESH METHOD AND SYSTEM - Disclosed are a semiconductor memory apparatus, and refresh method and system. The semiconductor memory apparatus includes: a memory cell array including a plurality of resistive memory cells; and a control block configured to control at least one of a mode and a schedule of a refresh operation for the plurality of memory cells to be variable based on digital code values reflecting resistance states of the plurality of resistive memory cells. Therefore, the refresh of the resistive memory is efficiently performed, and as a result, performance deterioration may be minimized, and a lifespan of the device may be extended. | 06-05-2014 |
20140153316 | Methods of Reading and Using Memory Cells - Some embodiments include methods of reading memory cells. The memory cells have a write operation that occurs only if a voltage of sufficient absolute value is applied for a sufficient duration of time; and the reading is conducted with a pulse that is of too short of a time duration to be sufficient for the write operation. In some embodiments, the pulse utilized for the reading may have an absolute value of voltage that is greater than or equal to the voltage utilized for the write operation. In some embodiments, the memory cells may comprise non-ohmic devices; such as memristors and diodes. | 06-05-2014 |
20140153317 | SILICON-BASED NANOSCALE RESISTIVE DEVICE WITH ADJUSTABLE RESISTANCE - A non-volatile solid state resistive device that includes a first electrode, a p-type poly-silicon second electrode, and a non-crystalline silicon nanostructure electrically connected between the electrodes. The nanostructure has a resistance that is adjustable in response to a voltage being applied to the nanostructure via the electrodes. The nanostructure can be formed as a nanopillar embedded in an insulating layer located between the electrodes. The first electrode can be a silver or other electrically conductive metal electrode. A third (metal) electrode can be connected to the p-type poly-silicon second electrode at a location adjacent the nanostructure to permit connection of the two metal electrodes to other circuitry. The resistive device can be used as a unit memory cell of a digital non-volatile memory device to store one or more bits of digital data by varying its resistance between two or more values. | 06-05-2014 |
20140153318 | CIRCUIT AND METHOD FOR READING A RESISTIVE SWITCHING DEVICE IN AN ARRAY - A read circuit for sensing a resistance state of a resistive switching device in a crosspoint array utilizes an equipotential preamplifier connected to a selected column line of the resistive switching device in the array. The equipotential preamplifier delivers a sense current while maintaining the selected column line at a reference voltage near a biasing voltage applied to unselected row lines of the array. The read circuit has a reference current source for generating a sense reference current, and a current comparator connected to evaluate the sense current delivered by the equipotential preamplifier against the sense reference current and generating an output signal indicative of the resistance state of the resistive switching device. | 06-05-2014 |
20140160831 | Nonvolatile Memory Devices Using Variable Resistive Elements and Related Driving Methods Thereof - Driving methods of a nonvolatile memory device are provided. The driving method includes providing a start pulse adjusted based on a previous write operation to a resistive memory cell to write data, verifying whether the data has accurately been written using the start pulse, and executing a write operation on the resistive memory cell by an incremental one-way write method or a decremental one-way write method according to the verify result. Related nonvolatile memory devices are also provided. | 06-12-2014 |
20140160832 | SEMICONDUCTOR DEVICE - A method for sensing data in a resistive memory device including a sense amplifier with an input coupled to a bitline through a capacitor includes activating a word line to form a current path through a resistive memory cell to the bitline, precharging the bitline to a first precharge voltage and precharging the input of the sense amplifier to a second precharge voltage between the first precharge voltage and the decision threshold of the sense amplifier, disabling, after a first predetermined period of time, precharge of the bit line and precharge of the input of the sense amplifier, and latching data at an output of the sense amplifier after a second predetermined period of time. | 06-12-2014 |
20140160833 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes a memory cell array, a plurality of reference cell arrays, a plurality of word lines, a plurality of bit lines, a plurality of reference word lines, a plurality of reference bit lines each being provided for an associated one of the reference cell arrays, and equalizing transistors each of which is provided between the plurality of reference bit lines and receives an associated one of independent control signals, and a potential of one of the plurality of reference bit lines and a plurality of one of the plurality of bit lines are input to a sense amplifier. | 06-12-2014 |
20140169062 | Methods of Manufacturing Embedded Bipolar Switching Resistive Memory - Non linear current response circuits can be used in embedded resistive memory cell for reducing power consumption, together with improving reliability of the memory array. The non linear current response circuits can include two back to back leaky PIN diodes, two parallel anti-directional PIN diodes, two back to back Zener-type metal oxide diodes, or ovonic switching elements, along with current limiting resistor for standby power reduction at the low voltage region. Also, the proposed embedded ReRAM implementation methods based upon 1T2D1R scheme can be integrated into the advanced FEOL process technologies including vertical pillar transistor and/or 3D fin-shaped field effect transistor (FinFET) for realizing a highly compact cell density. | 06-19-2014 |
20140169063 | METHOD AND APPARATUS FOR READING VARIABLE RESISTANCE MEMORY ELEMENTS - In some embodiments, detecting resistance in a resistive memory cell may be done using a pulse edge. For example, a pulse may be applied through a resistive memory data cell and another through a reference delay circuit to determine which path has the larger delay in order to determine the resistive state of the data cell in question. | 06-19-2014 |
20140169064 | REGULATOR, VOLTAGE GENERATOR AND SEMICONDUCTOR MEMORY DEVICE - A regulator includes a variable resistance unit coupled between an input node to which a pumping voltage is inputted and a control node and configured to adjust resistance of the variable resistance unit in response to a control signal varied depending on a target voltage, a voltage output unit configured to adjust the pumping voltage according to potential of the control node and output the adjusted pumping voltage, and a regulation unit configured to control the potential of the control node according to the adjusted pumping voltage, to output the target voltage. The regulator adjusts the resistance of an internal resistor according to the target voltage, thereby reducing current consumption. | 06-19-2014 |
20140169065 | HIGH VOLTAGE GENERATING CIRCUIT FOR RESISTIVE MEMORY APPARATUS - A high voltage generating circuit for a resistive memory apparatus is provided. The high voltage generating circuit includes a capacitor spaced from a semiconductor substrate and electrically insulated from the semiconductor substrate. A switching device, which is electrically connected to the capacitor, is electrically insulated from the semiconductor substrate. | 06-19-2014 |
20140169066 | RESISTIVE MEMORY SENSING - The present disclosure includes apparatuses and methods for sensing a resistive memory cell. A number of embodiments include performing a sensing operation on a memory cell to determine a current value associated with the memory cell, applying a programming signal to the memory cell, and determining a data state of the memory cell based on the current value associated with the memory cell before applying the programming signal and a current value associated with the memory cell after applying the programming signal. | 06-19-2014 |
20140169067 | RESISTANCE MEMORY DEVICE AND MEMORY APPARATUS AND DATA PROCESSING SYSTEM - A resistance memory device and a memory apparatus and data processing apparatus having the same are provided. The resistance memory device includes a pair of electrode layers and a variable resistance layer interposed between the pair of electrode layers. The variable resistance layer includes at least one variable resistance material layer and a piezoelectric material layer coupled to the at least one variable resistance material layer. | 06-19-2014 |
20140169068 | NONVOLATILE MEMORY DEVICE HAVING VARIABLE RESISTIVE ELEMENTS AND METHOD OF DRIVING THE SAME - A method is provided for driving a nonvolatile memory device. The method includes selecting first write drivers based on a predetermined current, performing a first program operation on resistive memory cells corresponding to the first write drivers, verifying whether the resistive memory cells have passed or failed in the first program operation and sorting information regarding failed bit memory cells that failed in the first program operation, selecting second write drivers based on the sorted failed bit memory cell information, and performing a second program operation on resistive memory cells corresponding to the second write drivers. | 06-19-2014 |
20140169069 | Resistive Memory Device, System Including the Same and Method of Reading Data in the Same - A resistive memory device includes a memory cell array, a memory interface and a read sensing circuit. The memory cell array includes a plurality of resistive memory cells coupled to a plurality of wordlines and a plurality of bitlines. The memory interface is configured to communicate with a memory controller. The read sensing circuit is coupled to the bitlines and includes at least one sensing node. The read sensing circuit performs a precharge operation to precharge the at least one sensing node between a first time point of receiving an active command through the memory interface and a second time point of receiving a read command through the memory interface, and senses data stored in the resistive memory cells to provide read data. | 06-19-2014 |
20140169070 | HETEROJUNCTION OXIDE NON-VOLATILE MEMORY DEVICES - A memory device includes a first metal layer and a first metal oxide layer coupled to the first metal layer. The memory device includes a second metal oxide layer coupled to the first metal oxide layer and a second metal layer coupled to the second metal oxide layer. The formation of the first metal oxide layer has a Gibbs free energy that is lower than the Gibbs free energy for the formation of the second metal oxide layer | 06-19-2014 |
20140177315 | Multi-Level Memory Array Having Resistive Elements For Multi-Bit Data Storage - A resistor array for multi-bit data storage without the need to increase the size of a memory chip or scale down the feature size of a memory cell contained within the memory chip is provided. The resistor array incorporates a number of discrete resistive elements to be selectively connected, in different series combinations, to at least one memory cell or memory device. In one configuration, by connecting each memory cell or device with at least one resistor array, a resistive switching layer found in the resistive switching memory element of the connected memory device is capable of being at multiple resistance states for storing multiple bits of digital information. During device programming operations, when a desired series combination of the resistive elements within the resistor array is selected, the resistive switching layer in the connected memory device can be in a desired resistance state. | 06-26-2014 |
20140177316 | NON-VOLATILE MEMORY SYSTEM WITH RESET VERIFICATION MECHANISM AND METHOD OF OPERATION THEREOF - A method of operation of a non-volatile memory system includes: providing a resistive storage element having a high resistance state and a low resistance state; coupling an analog multiplexer to the resistive storage element for applying a bias voltage; and switching between a verification bias and a read bias through the analog multiplexer for increasing a read margin between the high resistance state and the low resistance state. | 06-26-2014 |
20140177317 | NON-VOLATILE MEMORY SYSTEM WITH POWER REDUCTION MECHANISM AND METHOD OF OPERATION THEREOF - A method of operation of a non-volatile memory system including: providing a resistive storage element having a transformation layer; activating a write driver, coupled to the resistive storage element, for applying a bias voltage to the transformation layer; monitoring a resistance of the resistive storage element by a sense amplifier; and detecting a conductive thread, formed in the transformation layer, by the sense amplifier for reducing a level of the bias voltage. | 06-26-2014 |
20140177318 | Hybrid Memory - A two-switch hybrid memory cell device includes a storage node connected between one terminal of a first switch and a gate of a second switch. The device also includes a resistive switching device connected to the storage node. The resistive switching device is to act as a capacitance by being set to a high resistive state when the memory cell is in a dynamic mode. | 06-26-2014 |
20140177319 | NONVOLATILE MEMORY APPARATUS - A nonvolatile memory apparatus includes a sensing voltage generation unit, a memory cell, a current copy unit and a data sensing unit. The sensing voltage generation unit provides a sensing voltage with a constant level, to a sensing node. The memory cell receives the sensing voltage from the sensing node. The current copy unit generates copied current with substantially the same magnitude as sensing current which flows through the memory cell. The data sensing unit senses the copied current and generates a multi-bit data output signal. | 06-26-2014 |
20140177320 | RESISTIVE MEMORY DEVICE AND WRITE METHOD THEREOF - A method writes data in a resistive memory device in which paths for performing write operations to record first-state data and second-state data are controlled to cause current to flow in opposing directions in a resistive memory cell whose switching type has been determined. The method includes performing a write operation in a predetermined direction when writing the first-state data and second-state data, making a determination with respect to success in target data through verification, and attempting an additional write operation through a path reversed from a write path of corresponding data according to a result of the determination. | 06-26-2014 |
20140177321 | NONVOLATILE MEMORY DEVICE AND RELATED OPERATING METHOD - A method is for driving a nonvolatile memory device, where the nonvolatile memory device includes a memory cell array composed of resistance memory cells. The method includes electrically connecting a clamping circuit, a line resistor and a selected one of the resistance memory cells in series between a sensing node and a ground. The method further includes adjusting at least one of a clamping voltage of the clamping circuit and a resistance of the line resistor according to a relative location of the selected one of the resistance memory cells within the memory cell array, and applying a read current to the sense node and sensing a voltage of the sense node to read a data stored in the selected one of the resistance memory cells. | 06-26-2014 |
20140177322 | SEMICONDUCTOR MEMORY APPARATUS, VERIFY READ METHOD AND SYSTEM - Disclosed are a semiconductor memory apparatus, and verify read method and system. The semiconductor memory apparatus includes a memory cell array including a plurality of resistive memory cells; and a control block controlling a resistance state of the memory cell to be discriminated based on a digital code value of at least 2 bits or more reflecting the resistance states of the plurality of resistive memory cells. Therefore, data of the memory is discriminated by analyzing distribution of the digital code values to monitor a characteristic of a current memory cell array and read the data having reliability. | 06-26-2014 |
20140185357 | Barrier Design for Steering Elements - Steering elements suitable for memory device applications can have low leakage currents at low voltages to reduce sneak current paths for non selected devices, and high leakage currents at high voltages to minimize voltage drops during device switching. In some embodiments, the steering element can include a first electrode, a second electrode, and a graded dielectric layer sandwiched between the two electrodes. The graded dielectric layer can include a varied composition from the first electrode to the second electrode. Graded energy level at the top and/or at the bottom of the band gap, which can be a result of the graded dielectric layer composition, and/or the work function of the electrodes can be configured to suppress tunneling and thermionic current in an off-state of the steering element and/or to maximize a ratio of the tunneling and thermionic currents in an on-state and in an off-state of the steering element. | 07-03-2014 |
20140185358 | RESISTIVE RANDOM ACCESS MEMORY WITH NON-LINEAR CURRENT-VOLTAGE RELATIONSHIP - Providing for fabrication, construction, and/or assembly of a resistive random access memory (RRAM) cell is described herein. The RRAM cell can exhibit a non-linear current-voltage relationship. When arranged in a memory array architecture, these cells can significantly mitigate sneak path issues associated with conventional RRAM arrays. | 07-03-2014 |
20140185359 | MEMORY DEVICE - According to one embodiment, a memory device includes n (n being an integer of 2 or more) resistance change films being series connected to each other. Each of the resistance change films is a superlattice film in which a plurality of pairs of a first crystal layer made of a first compound and a second crystal layer made of a second compound are alternately stacked. Average composition of the entire resistance change film or arrangement pitch of the first crystal layers and the second crystal layers are mutually different among the n resistance change films. | 07-03-2014 |
20140185360 | WRITE METHOD FOR WRITING TO VARIABLE RESISTANCE NONVOLATILE MEMORY ELEMENT AND VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE - A write method for writing to a variable resistance nonvolatile memory element, comprising applying a set of strong recovery-voltage pulses at least once to the variable resistance nonvolatile memory element when it is determined that the resistance state of the variable resistance nonvolatile memory element fails to change to a second resistance state, remaining in a first resistance state, the set of strong recovery-voltage pulses including pulses: (1) a first strong recovery-voltage pulse which has a greater amplitude than a normal second voltage for changing the resistance state to the first resistance state, and has the same polarity as the second voltage; and (2) a second strong recovery-voltage pulse which follows the first strong recovery-voltage pulse and has a longer pulse width than the pulse width of the normal first voltage for changing the resistance state to the second resistance state, and has the same polarity as the first voltage. | 07-03-2014 |
20140185361 | NON-VOLATILE RANDOM ACCESS MEMORY DEVICE AND DATA READ METHOD THEREOF - A nonvolatile random access memory device includes a plurality of memory cells configured to store data therein, a plurality of reference cells separate from the memory cells, the reference cells each configured to output a corresponding reference cell signal, and a read/write circuit. The read/write circuit is configured to generate from the reference cell signals a reference signal which is variable to have a plurality of different reference levels. The read/write circuit is further configured to identify, in response to the reference signal, a logic state among a first logic state and a second logic state for each of one or more selected memory cells, and to output read data corresponding to the identified logic state. | 07-03-2014 |
20140185362 | SYSTEM AND METHOD FOR PERFORMING MEMORY OPERATIONS ON RRAM CELLS - A resistive RAM (RRAM) device has a bit line, a word line, a source line carrying a bias voltage that is a substantially static and non-negative voltage, an RRAM cell, and a bit line control coupled to the bit line circuit. The RRAM cell includes a gate node coupled to the word line, a bias node coupled to the source line, and a bit line node coupled to the bit line. The bit line control circuit is configured to generate non-negative command voltages to perform respective memory operations on the RRAM cell. | 07-03-2014 |
20140192585 | Resistive Random Access Memory Cell Having Three or More Resistive States - Provided are resistive random access memory (ReRAM) cells, each having three or more resistive states and being capable of storing multiple bits of data, as well as methods of fabricating and operating such ReRAM cells. Such ReRAM cells or, more specifically, their resistive switching layer have wide range of resistive states and are capable of being very conductive (e.g., about 1 kOhm) in one state and very resistive (e.g., about 1 MOhm) in another state. In some embodiments, a resistance ratio between resistive states may be between 10 and 1,000 even up to 10,000. The resistive switching layers also allow establishing stable and distinct intermediate resistive states that may be assigned different data values. These layers may be configured to switching between their resistive states using fewer programming pulses than conventional systems by using specific materials, switching pluses, and resistive state threshold. | 07-10-2014 |
20140192586 | Resistive Random Access Memory Cells Having Variable Switching Characteristics - Provided are resistive random access memory (ReRAM) cells forming arrays and methods of operating such cells and arrays. The ReRAM cells of the same array may have the same structure, such as have the same bottom electrodes, top electrodes, and resistive switching layers. Yet, these cells may be operated in a different manner. For example, some ReRAM cells may be restively switched using lower switching voltages than other cells. The cells may also have different data retention characteristics. These differences may be achieved by using different forming operations for different cells or, more specifically, flowing forming currents in different directions for different cells. The resulting conductive paths formed within the resistive switching layers are believed to switch at or near different electrode interfaces, i.e., within a so called switching zone. In some embodiments, a switching zone of a ReRAM cell may be changed even after the initial formation. | 07-10-2014 |
20140192587 | THERMODYNAMIC BIT FORMED OF TWO MEMRISTORS - A thermodynamic bit apparatus, method and system. A thermodynamic bit is a device that returns a true or false state with a probability that depends on its internal state, which can be controlled via the application of positive feedback. A thermodynamic bit can include two or more memristors connected in series. A forward bias can be applied to the thermodynamic bit to read the state of the thermodynamic bit. A negative feedback can be applied to the thermodynamic bit during application of a forward bias to the thermodynamic bit. Also, a reverse bias can be applied to the thermodynamic bit to refresh or reinforce the state of the thermodynamic bit. | 07-10-2014 |
20140192588 | Nonvolatile Memory Device and Read Method Thereof - A nonvolatile memory device is provided which includes a main area including main cells connected to word lines and main bit lines; a reference area including reference cells connected to the word lines and reference bit lines and programmed using the same write condition as that of the main area; a reference sense amplifier circuit configured to read data written at the reference area through the reference bit lines at a read operation; and control logic configured to control the reference sense amplifier circuit such that data written at the reference area is shifted with a weight scheme and then read, the data written at the reference area being used as a read reference value of the main area at a read operation. | 07-10-2014 |
20140192589 | REDUCED DIFFUSION IN METAL ELECTRODE FOR TWO-TERMINAL MEMORY - Providing for two-terminal memory that mitigates diffusion of external material therein is described herein. In some embodiments, a two-terminal memory cell can comprise an electrode layer. The electrode layer can be at least in part permeable to ionically or chemically reactive material, such as oxygen or the like. The two-terminal memory can further comprise a diffusion mitigation material disposed between the electrode layer and external material. This diffusion mitigation material can be selected to mitigate or prevent diffusion of the undesired element(s) or compound(s), to mitigate or avoid exposure of such element(s) or compound(s) to the electrode layer. Accordingly, degradation of the two-terminal memory as a result of contact with the undesired element(s) or compound(s) can be mitigated by various disclosed embodiments. | 07-10-2014 |
20140198556 | NONVOLATILE MEMORY DEVICE USING VARIABLE RESISTIVE ELEMENT AND MEMORY SYSTEM HAVING THE SAME - A nonvolatile memory device, which has an improved read reliability through a refresh operation, and a memory system, are provided. The nonvolatile memory device includes a resistive memory cell, a reference resistor corresponding to the resistive memory cell, a reference sense amplifier electrically connected to the reference resistor and configured to change a transition time of an output value of the reference resistor, and a refresh request signal generator configured to output the refresh request signal for the resistive memory cell when the transition time of an output value of the reference resistor is in a preset refresh requiring period. | 07-17-2014 |
20140198557 | READ CIRCUIT AND NON-VOLATILE MEMORY USING THE READ CIRCUIT - A read circuit includes a current load circuit configured to supply a load current from a power source to a first input and a second input; a first discharge circuit configured to discharge potential of the first and second inputs to a ground level; an equalization circuit configured to equalize the potential of the first and second inputs; a differential circuit configured to receive the first and second inputs as differential inputs, and to output a first output and a second read output as differential outputs; and a second discharge circuit configured to discharge potential of the first and second read outputs to the ground level. | 07-17-2014 |
20140198558 | Non-Volatile Storage System Using Opposite Polarity Programming Signals For MIM Memory Cell - A reversible resistance-switching metal-insulator-metal (MIM) stack is provided which can be set to a low resistance state with a first polarity signal and reset to a higher resistance state with a second polarity signal. The first polarity signal is opposite in polarity than the second polarity signal. In one approach, the MIM stack includes a carbon-based reversible resistivity switching material such as a carbon nanotube material. The MIM stack can further include one or more additional reversible resistivity switching materials such as metal oxide above and/or below the carbon-based reversible resistivity switching material. In another approach, a metal oxide layer is between separate layers of carbon-based reversible resistivity switching material. | 07-17-2014 |
20140198559 | CIRCUIT AND METHOD FOR READING A RESISTIVE SWITCHING DEVICE IN AN ARRAY - A read circuit for sensing a resistance state of a resistive switching device in a crosspoint array utilizes a transimpedance equipotential preamplifier connected to a selected column line of the resistive switching device in the array. The equipotential preamplifier delivers a sense current while maintaining the selected column line at a reference voltage near a biasing voltage applied to unselected row lines of the array. A reference resistor is selectively connected to the equipotential preamplifier for setting a reference current, wherein the equipotential preamplifier is set to produce a preamplifier output voltage having a magnitude depending on whether the sense current is smaller or greater than the reference current. A voltage comparator is connected to the equipotential preamplifier to compare the preamplifier output voltage with a setup reference voltage and generate a comparator output voltage indicative of the resistance state of the resistive switching device. | 07-17-2014 |
20140204650 | NONVOLATILE RESISTIVE MEMORY DEVICE AND WRITING METHOD - A writing method for a resistive nonvolatile memory device includes writing data to a resistive nonvolatile memory cell using an up/down write pulse signal when the data is first data type, and writing data to the resistive nonvolatile memory cell using only one of an up write pulse signal and a down write pulse signal when the data is second data type. | 07-24-2014 |
20140204651 | READING A MEMORY ELEMENT WITHIN A CROSSBAR ARRAY - A method for reading a memory element within a crossbar array includes switching a column line connected to a target memory element of the crossbar array to connected to an input of a current mirror; applying an error voltage to unselected rows of the crossbar array; applying a sense voltage to a row line connected to the target memory element; and outputting a current with said current mirror. | 07-24-2014 |
20140204652 | RESISTIVE MEMORY DEVICE - A resistive memory device includes memory cell array blocks, a reference cell array block, two first and second sink transistors, and a word line. Each of the memory cell array blocks includes a row line, and the reference cell array block includes a reference row line. One of the first sink transistors is disposed between one end of the row line and a ground and the other of the first sink transistors is disposed between an opposite end of the row line and the ground. One of the second sink transistors is disposed between one end of the reference row line and the ground and the other of the second sink transistors is disposed between an opposite end of the reference row line and the ground. The word line is coupled to gates of the first and second sink transistors. | 07-24-2014 |
20140204653 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes: a plurality of word lines extending in a first direction; first to third bit lines extending in a second direction that intersects with the first direction; a plurality of variable resistance elements each having a first terminal connected to either one of the first and third bit lines; a plurality of active areas extending in a direction oblique to the first direction while intersecting with the first to third bit lines; a plurality of select transistors provided on the active areas and each having a gate connected to a corresponding one of the word lines, and a current path whose one end is connected to a second terminal of a corresponding one of the variable resistance elements; and a plurality of contact plugs each connecting the other end of the current path of a corresponding one of the select transistors to the second bit line, wherein each of the active areas includes two select transistors sharing a diffusion region, the variable resistance elements includes a first variable resistance element group and a second variable resistance element group, the first variable resistance element group including variable resistance elements aligned in the second direction below the first bit line, and each disposed between adjacent two of the word lines, the second variable resistance element group including variable resistance elements aligned in the second direction below the third bit line, and each disposed between adjacent two of the word lines, and the contact plugs are aligned in the second direction below the second bit line, and are each disposed between adjacent two of the word lines. | 07-24-2014 |
20140211534 | LOCALLY ACTIVE MEMRISTIVE DEVICE - A method to operate an integrated circuit includes operating a locally active memristive device in a locally reactive region of an operating domain where the device exhibits inductor-like behavior, such as a phase shift where a voltage across the device leads a current through the device. | 07-31-2014 |
20140211535 | MITIGATION OF INOPERABLE LOW RESISTANCE ELEMENTS IN PROGRAMABLE CROSSBAR ARRAYS - A programmable crossbar array includes a layer of row conductors and a layer of column conductors with the row conductors crossing over the column conductors to form junctions. Programmable crosspoint devices are sandwiched between a row conductor and a column conductor at a junction. Each programmable crosspoint device includes a data element with a first programming threshold and a control element with a second programming threshold, in which the second programming threshold is greater than the first programming threshold. A method for mitigating shorts in a programmable crossbar array is also provided. | 07-31-2014 |
20140211536 | INLINE FUSES IN PROGRAMMABLE CROSSBAR ARRAYS - A programmable crossbar array with inline fuses includes a layer of row lines and a layer of column lines with the row lines crossing over the column lines to form junctions and resistive memory elements sandwiched between row lines and a column lines at the junctions. Inline fuses are located in either the row lines, column lines or both. The inline fuses are interposed between the support circuitry and the resistive memory elements. A method for mitigating shorts in a crossbar array is also provided. | 07-31-2014 |
20140211537 | RESISTANCE-BASED RANDOM ACCESS MEMORY - A resistance-based random access memory circuit includes a first data line, a second data line, a plurality of memory cells, a first driving unit, and a second driving unit. The memory cells are arranged one following another in parallel with the first and second data lines. Each of the memory cells are coupled between the first data line and the second data line. The first driving unit is coupled with first ends of the first and second data lines. The first driving unit is configured to electrically couple one of the first data line and the second data line to a first voltage node. The second driving unit is coupled with second ends of the first and second data lines. The second driving unit is configured to electrically couple the other one of the first data line and the second data line to a second voltage node. | 07-31-2014 |
20140211538 | RESISTIVE MEMORY DEVICE COMPRISING SELECTIVELY DISABLED WRITE DRIVER - A nonvolatile memory device comprises a resistive memory cell, a write driver configured to write data to the resistive memory cell during a write period comprising a plurality of loops, and a sense amplifier configured to verify whether the data is correctly written to the resistive memory cell in each of the loops. Where the sense amplifier verifies that the data is correctly written in a k-th loop among the loops, the write driver is disabled from a (k+1)-th loop to an end of the write period. | 07-31-2014 |
20140211539 | SEMICONDUCTOR MEMORY DEVICE - A control circuit is configured to perform, when a plurality of variable resistance elements connected to a selected first wiring line are selected, a read operation to sense a voltage of the selected first wiring line. The control circuit is configured to adjust, according to the voltage of the selected first wiring line sensed in the read operation, a voltage to be applied to the selected first wiring line in a reset operation or a set operation. The reset operation is an operation to increase resistance of a variable resistance element. The set operation is an operation to decrease resistance of a variable resistance element. | 07-31-2014 |
20140211540 | METHOD AND APPARATUS FOR READ MEASUREMENT OF A PLURALITY OF RESISTIVE MEMORY CELLS - A method for read measurement of a plurality N of resistive memory cells having a plurality K of programmable levels. The method includes a step of applying a first read voltage to each of the plurality N of resistive memory cells and, at each of the plurality N of resistive memory cells, measuring a first read current due to the applied first read voltage, determining a respective second read voltage based on the first read current measured at the plurality N of resistive memory cells and a target read current determined for the plurality N of resistive memory cells for each of the plurality N of resistive memory cells, and applying the respective determined second read voltage to the plurality N of resistive memory cells for obtaining a second read current for each of the plurality N of resistive memory cells. | 07-31-2014 |
20140211541 | READ MEASUREMENT OF A PLURALITY OF RESISTIVE MEMORY CELLS - A method for read measurement of a plurality N of resistive memory cells having a plurality M of programmable levels is suggested. The method includes a step of reading back from a number of reference cells to obtain a reading back parameter, a step of determining an actual read voltage for the N memory cells based on the obtained reading back parameter for obtaining a target read current at a following read measurement, and, a step of applying the determined actual read voltage to the N memory cells at the following read measurement. | 07-31-2014 |
20140211542 | Memory Element With a Reactive Metal Layer - A memory cell including conductive oxide electrodes is disclosed. The memory cell includes a memory element operative to store data as a plurality of resistive states. The memory element includes a layer of a conductive metal oxide (CMO) (e.g., a perovskite) in contact with an electrode that may comprise one or more layers of material. At least one of those layers of material can be a conductive oxide (e.g., a perovskite such as LaSrCoO | 07-31-2014 |
20140211543 | APPARATUSES AND METHODS INCLUDING SUPPLY CURRENT IN MEMORY - Some embodiments include apparatuses and methods having first conductive lines, second conductive lines, a memory array including memory cells, each of the memory cells coupled between one of the first conductive lines and one of the second conductive lines. At least one of such apparatuses and methods can include a module configured to cause a first current from a first current source and a second current from a second current source to flow through a selected memory cell among the memory cells during an operation of storing information in the selected memory cell. Other embodiments including additional apparatuses and methods are described. | 07-31-2014 |
20140211544 | APPARATUS TO STORE DATA AND METHODS TO READ MEMORY CELLS - Apparatus to store data and methods to read memory cells are disclosed. A disclosed example method involves, during a read cycle of a memory cell, applying a current across the memory cell to read a content of the memory cell. During a subsequent read cycle of the memory cell, a subsequent current is applied across the memory cell in the opposite direction to read the content of the memory cell. | 07-31-2014 |
20140219001 | APPLYING A BIAS SIGNAL TO MEMORY CELLS TO REVERSE A RESISTANCE SHIFT OF THE MEMORY CELLS - Data is written to cells of a resistance-based, non-volatile memory. An activity metric is tracked since the writing of the data to the cells. In response to the activity metric satisfying a threshold, a bias signal is applied to the cells to reverse a resistance shift of the cells. | 08-07-2014 |
20140219002 | METHOD AND APPARATUS FOR ADAPTIVE TIMING WRITE CONTROL IN A MEMORY - A bit line, which is coupled to a resistive element of a memory cell is set to a first voltage level. The memory cell may be an MRAM cell or an RRAM cell. The resistive element is configured to have a first resistance in a first state of the memory cell and a second resistance in a second state of the memory cell. A source line, which is selectively coupled to the memory cell by an access transistor, is set to a second voltage level. A word line signal is asserted to apply a first bias voltage across the resistive element. The applied first bias voltage initiates a write operation at the memory cell. The word line signal is deasserted after a variable time duration based on a detection, during the write operation, of a current through the resistive element. | 08-07-2014 |
20140219003 | Temperature Based Logic Profile for Variable Resistance Memory Cells - A data storage device may generally be constructed and operated with at least one variable resistance memory cell having a first logic state threshold that is replaced with a second logic state threshold by a controller. The first and second logic states respectively corresponding to a predicted resistance shift that is based upon an operating temperature profile. | 08-07-2014 |
20140219004 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A memory cell array comprises memory cells disposed at intersections of a plurality of first lines disposed in parallel and a plurality of second lines disposed intersecting the first lines. The memory cell includes a variable resistance element. | 08-07-2014 |
20140219005 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF CONTROLLING DATA THEREOF - A control circuit is configured to perform a state determination operation to sense voltages of a plurality of first wiring lines, the voltages changing based on current flowing from the first wiring lines to a plurality of second wiring lines via a plurality of variable resistive elements. Then, the control circuit is configured to adjust voltages to be applied to the first and second wiring lines in a reset operation or a set operation based on the voltages of the first wiring lines sensed in the state determination operation. | 08-07-2014 |
20140219006 | ACCESS SIGNAL ADJUSTMENT CIRCUITS AND METHODS FOR MEMORY CELLS IN A CROSS-POINT ARRAY - Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to generate access signals to facilitate memory operations in scaled arrays of memory elements, such as memory implemented in third dimensional memory technology formed BEOL directly on top of a FEOL substrate that includes data access circuitry. In at least some embodiments, a non-volatile memory device can include a cross-point array having resistive memory elements disposed among word lines and subsets of bit lines, and an access signal generator. The access signal generator can be configured to modify a magnitude of a signal to generate a modified magnitude for the signal to access a resistive memory element associated with a word line and a subset of bit lines. The modified magnitude can be a function of the position of the resistive memory element in the cross-point array. | 08-07-2014 |
20140233298 | APPARATUS AND METHODS FOR FORMING A MEMORY CELL USING CHARGE MONITORING - Apparatuses and methods of forming a memory cell is described. In one such method, a forming charge applied to a memory cell, such as a Resistive RAM (RRAM) memory cell, is monitored to determine the progress of the forming the cell. If the cell is consuming charge too slowly, a higher voltage can be applied. If the cell is consuming charge too quickly, a lower voltage can be applied. The charge may be monitored by charging a capacitor to a certain level, then monitoring the discharge rate of the capacitor though the cell. The monitoring may use comparators to measure the charge. The monitoring may also use an analog to digital converter to perform the monitoring. | 08-21-2014 |
20140233299 | Set/Reset Algorithm Which Detects And Repairs Weak Cells In Resistive-Switching Memory Device - A resistance-switching memory cell is programmed in a set or reset operation which tests the stability of the cell. A first programming phase using program voltages which increase in magnitude or duration until a program verify test is passed. A stability test phase is then performed to evaluate a stability of the memory cell. The stability test phase determines whether the memory cell is weak and likely to transition out of the set or reset state by applying one or more disturb pulses and performing one or more stability verify tests. The disturb pulses can have a reduced magnitude or duration compared to the program voltages. If the stability test phase indicates the memory cell is not stable, a second programming phase is performed. If the stability test phase indicates the memory cell is stable, the operation is concluded. | 08-21-2014 |
20140233300 | APPARATUSES AND OPERATION METHODS ASSOCIATED WITH RESISTIVE MEMORY CELL ARRAYS WITH SEPARATE SELECT LINES - The present disclosure includes methods and apparatuses that include resistive memory. A number of embodiments include a first memory cell coupled to a data line and including a first resistive storage element and a first access device, a second memory cell coupled to the data line and including a second resistive storage element and a second access device, an isolation device formed between the first access device and the second access device, a first select line coupled to the first resistive storage element, and a second select line coupled to the second resistive storage element, wherein the second select line is separate from the first select line. | 08-21-2014 |
20140233301 | RESISTIVE SWITCHING FOR NON VOLATILE MEMORY DEVICE USING AN INTEGRATED BREAKDOWN ELEMENT - A method of suppressing propagation of leakage current in an array of switching devices. The method includes providing a dielectric breakdown element integrally and serially connected to a switching element within each of the switching device. A read voltage (for example) is applied to a selected cell. The propagation of leakage current is suppressed by each of the dielectric breakdown element in unselected cells in the array. The read voltage is sufficient to cause breakdown in the selected cells but insufficient to cause breakdown in the serially connected, unselected cells in a specific embodiment. Methods to fabricate of such devices and to program, to erase and to read the device are provided. | 08-21-2014 |
20140241032 | METHODS AND APPARATUSES USING A TRANSFER FUNCTION TO PREDICT RESISTANCE SHIFTS AND/OR NOISE OF RESISTANCE-BASED MEMORY - Two or more workload indicators affecting a memory cell of a resistance-based, non-volatile memory are measured. The two or more workload indicators are applied to a transfer function that predicts a resistance shift and/or resistance noise variance in response to the two or more workload indicators. A result of the transfer function is applied to shift and/or determine a threshold resistance used for at least one of a program operation and a read operation affecting the memory cell. An error rate of the memory cell is reduced as a result. | 08-28-2014 |
20140241033 | Management of Variable Resistance Data Storage Device - Various embodiments may generally be directed to a variable resistance data storage device and a method of managing the device. A data storage device may have at least a controller configured to re-characterize at least one variable resistance memory cell in response to an identified variance from a predetermined resistance threshold. | 08-28-2014 |
20140241034 | Resistive Switching Random Access Memory Structure and Method To Recreate Filament and Recover Resistance Window - The present disclosure provides one embodiment of a method for operating a resistive random access memory (RRAM) cell. The method includes performing a forming operation to the RRAM cell with a forming voltage; performing a number of set/reset operation cycles to the RRAM cell; and performing a recreating process to the RRAM cell to recover RRAM resistance by applying a recreating voltage. Each of the number of set/reset operation cycles includes a set operation with a set voltage. The recreating voltage is greater than the set voltage. | 08-28-2014 |
20140241035 | RERAM FORMING WITH RESET AND ILOAD COMPENSATION - FORMING reversible resistivity-switching elements is described herein. The FORMING voltage may be halted if the current through the memory cell reaches some reference current. The reference current may depend on how many groups of memory cells have been FORMED. This can help to increase the accuracy of determining when to halt the FORMING voltage. After the FORMING voltage is applied, a RESET voltage may be applied to those memory cells that have a resistance that is lower than a reference resistance to raise the resistance of those memory cells. By raising the resistance, the leakage current of these memory cells when other groups are programmed may be less. This, in turn, helps to prevent FORMING of the other groups from slowing down. A reason why this helps to prevent the slowdown is that the FORMING voltage may be kept near a desired level. | 08-28-2014 |
20140241036 | MEMORY SYSTEM - A memory system according to the embodiment comprises a cell array of unit cell arrays each including memory cells; and an access circuit, wherein the memory cell changes from a first resistance state to a second resistance state on application of a first polarity voltage, and changes from the second resistance state to the first resistance state on application of a second polarity voltage, the access circuit provides the first and second lines connected to an access-targeted memory cell with access potentials, and brings at least one of the first and second lines connected to an access-untargeted memory cell into a floating state to make access to the access-targeted memory cell, the unit cell array includes first spare lines to provide redundancy for the first lines, and an alignment of the first lines includes a certain number of the first spare lines arranged in a certain cycle. | 08-28-2014 |
20140241037 | SEMICONDUCTOR MEMORY DEVICE - A memory cell array includes first wiring lines, and second wiring lines, the first and second wiring lines intersecting, and memory cells disposed in the intersections of the first and second wiring lines, the memory cells including a variable resistance element. A control circuit controls voltages of selected first and second wiring lines. The first wiring lines are arranged at a first pitch in a first direction perpendicular to a substrate and extend in a second direction parallel to the substrate. The second wiring lines are arranged at a second pitch in the second direction and extend in the first direction. The control circuit is configured to change voltages applied to a selected first wiring line according to the positions of the selected first wiring lines in the first direction. | 08-28-2014 |
20140241038 | SEMICONDUCTOR DEVICE AND METHOD OF CONTROLLING SEMICONDUCTOR DEVICE - A memory cell is included which has a selection transistor and a variable resistance device connected to a bit line through the selection transistor. The variable resistance device includes a first electrode which has a first metal material and is connected to the selection transistor, a second electrode which has a second metal material different from the first metal material, and an insulating film which is provided between the first electrode and the second electrode, has a third metal material different from the first metal material and the second metal material, and has oxygen. The second metal material has a greater normalized oxide formation energy than the first metal material. | 08-28-2014 |
20140241039 | ELECTRONIC DEVICE AND METHOD FOR OPERATING THE SAME - An electronic device including a semiconductor memory. The semiconductor memory includes a plurality of variable resistance elements; a plurality of read voltage application terminals configured to supply different levels of read voltages to respective one ends of the plurality of variable resistance elements; and an analog-to-digital conversion unit configured to generate multi-bit digital data corresponding to a total current which is acquired by summing currents flowing through the plurality of variable resistance elements. | 08-28-2014 |
20140241040 | ELECTRONIC DEVICE - An electronic device comprising a semiconductor memory unit that may include a variable resistance element configured to be changed in a resistance value thereof in response to current flowing through both ends thereof, a toggle data generation unit configured to generate toggle data of which logic value toggles with a predetermined cycle, in a first mode for testing reliability of the variable resistance element, a data transfer line configured to transfer data inputted from an outside, and a driving unit configured to flow current which is changed in its direction with the predetermined cycle, through the variable resistance element in response to the toggle data in the first mode, and flow current through the variable resistance element in a direction determined in response to the data of the data transfer line, in a second mode in writing date into or reading data from the variable resistance element. | 08-28-2014 |
20140241041 | REFERENCE COLUMN OF SEMICONDUCTOR MEMORY, AND ELECTRONIC DEVICE INCLUDING THE SAME - A reference column of a semiconductor memory includes a reference bit line; a reference source line; and first to N | 08-28-2014 |
20140241042 | ELECTRONIC DEVICE AND METHOD FOR OPERATING THE SAME - An electronic device including a semiconductor memory. The semiconductor memory includes a cell array divided into at least two regions each of which includes a plurality of memory cells each including a transistor and a resistance variable element; a write driver circuit configured to supply write current to a memory cell selected among memory cells in the cell array; and a back bias voltage supply unit configured to supply back bias voltages with different levels to the regions in the cell array. | 08-28-2014 |
20140241043 | ELECTRONIC DEVICE AND METHOD FOR OPERATING ELECTRONIC DEVICE - An electronic device comprising a semiconductor memory unit that may include a plurality of data transfer lines; a plurality of columns including a plurality of memory cells; at least one redundancy column including a plurality of redundancy memory cells and configured to replace at least one column among the plurality of columns; a repair select information generation unit configured to store a column address of the at least one column to be replaced among the plurality of columns and generate a plurality of repair select information in response to the stored column address; and a plurality of repair selection units connected with data transfer lines corresponding to them among the plurality of data transfer lines, columns corresponding to them among the plurality of columns and the at least one redundancy column, and each configured to electrically connect a column selected among a column corresponding to it and the at least one redundancy column, to a data transfer line corresponding to it, in response to repair select information corresponding to it among the plurality of repair select information. | 08-28-2014 |
20140241044 | STRUCTURE OF A SWITCHING DEVICE IN AN ARRAY - A switching device has a bottom conductor, a top conductor, and a device body formed between the top and bottom conductors. The device body has a switching layer that is switchable by means of current passed through the device body and between the top and bottom conductors. A lower via connects the bottom conductor to the device body. The width of the lower via is smaller than a width of the device body. | 08-28-2014 |
20140247644 | Resistive Memory Reset - A resistive memory cell includes a switch and a resistive switching device. The switch includes a first terminal connected to a select line and a gate terminal connected to a word line. The resistive switching device is connected between a second terminal of the switch and a bit line. The resistive switching device is resettable by having a positive bias applied to the word line and a negative bias applied to the bit line. | 09-04-2014 |
20140247645 | NONVOLATILE MEMORY DEVICE AND RELATED METHOD FOR REDUCING ACCESS LATENCY - A nonvolatile memory device comprises a memory core comprising a plurality of variable resistance memory cells, an input/output (I/O) circuit configured to receive a first packet signal and a second packet signal in sequence, the first and second packet signals collectively comprising information for a memory access operation, and further configured to initiate a core access operation upon decoding the first packet signal and to selectively continue or discontinue the core access operation upon decoding the second packet signal, and a read circuit configured to perform part of the core access operation in response to the first packet signal before the second packet signal is decoded. | 09-04-2014 |
20140247646 | NONVOLATILE MEMORY DEVICE HAVING MULTIPLE READ CIRCUITS AND USING VARIABLE RESISTIVE MATERIALS - A nonvolatile memory device includes a memory array having multiple nonvolatile memory cells, a first read circuit and a second read circuit. The first read circuit is configured to read first data from the memory array during a first read operation and to provide one or more protection signals indicating a victim period during the first read operation. The second read circuit is configured to read second data from the memory array during a second read operation and to provide one or more check signals indicating an aggressor period during the second read operation. | 09-04-2014 |
20140247647 | ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME - Electronic devices having semiconductor elements and methods for fabricating such devices including, a method for fabricating an electronic device including a semiconductor memory, which includes: forming a sacrificial layer on a substrate including a first region and a second region; selectively etching the sacrificial layer and the substrate of the first region to form a trench; forming a first gate that fills a part of the trench in the first region; forming a gate protection layer on the first gate to fill the remaining part of the trench; removing the sacrificial layer of the first region to form a grooved portion surrounded by the gate protection layer; forming a conductive plug to cover the grooved portion; removing the sacrificial layer of the second region; and forming a second gate on the substrate of the second region. | 09-04-2014 |
20140247648 | ELECTRONIC DEVICE - An electronic device includes a first electrode, a second electrode spaced apart from the first electrode, a resistance variable element interposed between the first electrode and the second electrode, and a conductor arranged at least one of a first side and a second side of the resistance variable element to apply an electric field to the resistance variable element while being spaced apart from the resistance variable element, the first side facing the second side. | 09-04-2014 |
20140247649 | Bipolar Resistive-Switching Memory with a Single Diode Per Memory Cell - According to various embodiments, a resistive-switching memory element and memory element array that uses a bipolar switching includes a select element comprising only a single diode that is not a Zener diode. The resistive-switching memory elements described herein can switch even when a switching voltage less than the breakdown voltage of the diode is applied in the reverse-bias direction of the diode. The memory elements are able to switch during the very brief period when a transient pulse voltage is visible to the memory element, and therefore can use a single diode per memory cell. | 09-04-2014 |
20140254236 | MEMORY STATE SENSING BASED ON CELL CAPACITANCE - A memory cell and method for operating a memory cell including a bidirectional access device and memory element electrically coupled in series. The bidirectional access device includes a tunneling capacitance. The memory element programmable to a first and second state by application of a first and second write voltage opposite in polarity to one another. The memory element has a lower capacitance in the first state than the second state. A read unit senses a transient read current due to a voltage drop upon application of a read voltage. Determining if the memory element is the first or second state is based on whether the read current is greater or less than a sense threshold. The sense threshold is based on a capacitance ratio between the first and second state. | 09-11-2014 |
20140254237 | Method for Operating RRAM Memory - Methods for operating memory are disclosed. A method includes applying a select word line voltage to a word line node of a first resistive random access memory (RRAM) cell; applying a first programming voltage to a source line node of the first RRAM cell; and setting the first RRAM cell comprising applying a second programming voltage to a bit line node of the first RRAM cell. The first programming voltage is greater than zero volts, and the second programming voltage is greater than the first programming voltage. Other disclosed methods include concurrently setting and resetting RRAM cells. | 09-11-2014 |
20140254238 | SENSING DATA IN RESISTIVE SWITCHING MEMORY DEVICES - Structures and methods of operating a resistive switching memory device are disclosed herein. In one embodiment, a resistive switching memory device can include: (i) a plurality of resistive memory cells, where each of the resistive switching memory cells is configured to be programmed to a low resistance state by application of a first voltage in a forward bias direction, and to be erased to a high resistance state by application of a second voltage in a reverse bias direction; and (ii) a sensing circuit coupled to at least one of the plurality of resistive memory cells, where the sensing circuit is configured to read a data state of the at least one resistive memory cell by application of a third voltage in the forward bias direction or the bias reverse direction. | 09-11-2014 |
20140254239 | ELECTRONIC DEVICE COMPRISING A SEMICONDUCTOR MEMORY UNIT - Devices and methods based on disclosed technology include, among others, an electronic device capable of improving a signal transfer characteristic and a method for fabricating the same. Specifically, an electronic device in one implementation includes a plurality of buried gates formed in a substrate, open parts formed in the substrate on both sides of the buried gate, isolation layers each formed between a sidewall of the open part and a sidewall of the buried gate, source/drain regions formed in the substrate under the respective open parts, and contact plugs buried in the respective open parts. | 09-11-2014 |
20140254240 | METHOD OF PROGRAMMING A NON-VOLATILE RESISTIVE MEMORY - A method for pre-programming a matrix of resistive non-volatile memory cells, the cells including a dielectric material between two conducting electrodes and being initially in an original resistive state, the dielectric material being electrically modified to bring a cell from the original state to another resistive state wherein the resistance of the cell is at least twice and preferably at least ten times lower than the resistance of the cell in the original state. The method includes, prior to mounting a component containing the matrix on a support, programming the matrix by electrically bringing cells from the original state to the other state, leaving the other cells in their original state, and after mounting the component, applying to all the cells an intermediate voltage, to keep in the original state the cells in this state and returning or keeping to/in another state the cells not in the original state. | 09-11-2014 |
20140254241 | SEMICONDUCTOR DEVICE AND INFORMATION READING METHOD - A semiconductor device includes; a memory device configured to take a plurality of resistance states that are distinguishable from one another; a bias application section configured to apply, in a bias application period, a bias signal to the memory device; and a determination section configured to determine a resistance state of the memory device on the basis of a detection signal, in which the detection signal is generated in the memory device to which the bias signal is applied. The bias application section sets a length of the bias application period in accordance with a resistance value of the memory device, when the resistance state determined by the determination section is predetermined one of the resistance states. | 09-11-2014 |
20140254242 | NON-VOLATILE STORAGE SYSTEM BIASING CONDITIONS FOR STANDBY AND FIRST READ - Methods for reducing power consumption of a non-volatile storage system and reducing first read latency are described. The non-volatile storage system may include a cross-point memory array. In some embodiments, during a standby mode, the memory array may be biased such that both word lines and bit lines are set to ground. During transition of the memory array from the standby mode to a read mode, a selected word line comb may be set to a read voltage while the unselected word lines and the bit lines remain at ground. During the read mode, memory cells connected to the selected bit lines and the selected word line comb may be sensed while the selected bit lines are biased to a selected bit line voltage equal to or close to ground and the unselected bit lines are left floating after initially being set to ground. | 09-11-2014 |
20140254243 | ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor memory includes a substrate configured to include a plurality of active regions which are defined by isolation layers extending in a first direction and word lines extending in a second direction intersecting the first direction; source line contacts configured to be alternately disposed over the active regions arranged in the first and second directions and disposed over each of the active regions arranged in a third direction intersecting the first and second directions; source lines configured to extend in the third direction while being coupled to the source line contacts; contacts configured to be disposed over each of the active regions over which the source line contacts are not disposed; variable resistance elements configured to be disposed over each of the contacts; bit line contacts configured to be disposed over each of the variable resistance elements; and bit lines configured to extend in a fourth direction intersecting the first to third directions while being coupled to the bit line contacts. | 09-11-2014 |
20140254244 | Resistive Random Access Memory (RERAM) and Conductive Bridging Random Access Memory (CBRAM) Cross Coupled Fuse and Read Method and System - By arranging both a conductive and non-conductive resistive memory cell in a cross coupled arrangement to facilitate reading a data state the memory cells can have very small differences in their resistance values and still read correctly. This allows both of the memory cells' resistances to change over time and still have enough difference between their resistances to read the desired data state that was programmed. A pair of ReRAM or CBRAM resistive memory devices are configured as a one bit memory cell and used to store a single data bit wherein one of the resistive memory devices is in an ERASE condition and the other resistive memory devices of the pair is in a WRITE condition. Reading the resistance states of the resistive memory device pairs is accomplished without having to use a reference voltage or current since a trip-point is between the conductive states thereof. | 09-11-2014 |
20140254245 | HYBRID NON-VOLATILE MEMORY DEVICE - A hybrid non-volatile memory device includes a non-volatile random access memory (NVRAM) having an array of magnetic memory elements, the NVRAM being bit-accessible. The hybrid non-volatile device further includes a non-volatile page-mode memory (PMM) made of resistive memory and organized into pages, the non-volatile PMM being page-accessible. Further included in the hybrid non-volatile memory device is a direct memory access (DMA) engine that is coupled to the NVRAM and the non-volatile PMM and transfers data between the NVRAM and the non-volatile PMM during a DMA operation. | 09-11-2014 |
20140268988 | RESISTIVE MEMORY CELL - The present invention discloses a resistive memory cell, including a unipolar type RRAM and a MOS transistor as a selection transistor serially connected to the unipolar type RRAM, wherein the MOS transistor is fabricated over a partial depletion SOI substrate and provides a large current for program and erase of the RRAM by using an intrinsic floating effect of the SOI substrate. The present invention utilizes a floating effect of a SOI device, in which under the same width/length ratio, a MOS transistor over a SOI substrate can provide larger source/drain current than a MOS transistor over a bulk silicon, so that the area occupied by the selection transistor is reduced, which is advantageous to the integration of the RRAM array. | 09-18-2014 |
20140268989 | RESISTIVE NON-VOLATILE MEMORY - A multi-bit NVM cell includes a storage unit having resistive elements, such as phase change resistive elements. The NVM cell may be configured as a single port or dual port multi-bit cell. The NVM cell includes primary and secondary cell selectors. The primary selector selects the multi-bit cell while the secondary selector selects a bit within the multi-bit cell. A plurality of storage units can be commonly coupled to a primary selector, facilitating high density applications. | 09-18-2014 |
20140268990 | STACKABLE NON-VOLATILE MEMORY - A multi-bit NVM cell includes a storage unit having resistive elements, such as phase change resistive elements. The NVM cell may be configured as a single port or dual port multi-bit cell. The NVM cell includes a cell selector. The cell selector selects the multi-bit cell. When appropriate signals are applied to the NVM cell, the cell selector selects an appropriate resistive element of the storage unit. A plurality of storage units can be commonly coupled to the cell selector, facilitating high density applications. | 09-18-2014 |
20140268991 | CHALCOGENIDE MATERIAL AND METHODS FOR FORMING AND OPERATING DEVICES INCORPORATING THE SAME - Embodiments disclosed herein may relate to a memory cell comprising a chalcogenide material mixture having a chalcogenide composition and a metallic glass-forming composition. | 09-18-2014 |
20140268992 | Memory Cells, Memory Systems, and Memory Programming Methods - Memory cells, memory systems and methods are described. In one embodiment, a memory cell includes electrodes and a memory element, and a first electrically conductive structure is formed within dielectric material providing the memory element in a low resistance state as a result of a first voltage of a first polarity being applied across the electrodes. Additionally, the first electrically conductive structure is removed from the dielectric material providing the memory element in a high resistance state as a result of a second voltage of a second polarity, which is opposite to the first polarity, being applied across the electrodes. A permanent and irreversible electrically conductive structure is formed within the dielectric material providing the memory element in the low resistance state as a result of a third voltage of the second polarity and having an increased potential compared with the second voltage being applied across the electrodes. | 09-18-2014 |
20140268993 | Nonvolatile resistive memory element with an oxygen-gettering layer - A nonvolatile resistive memory element includes an oxygen-gettering layer. The oxygen-gettering layer is formed as part of an electrode stack, and is more thermodynamically favorable in gettering oxygen than other layers of the electrode stack. The Gibbs free energy of formation (ΔfG°) of an oxide of the oxygen-gettering layer is less (i.e., more negative) than the Gibbs free energy of formation of an oxide of the adjacent layers of the electrode stack. The oxygen-gettering layer reacts with oxygen present in the adjacent layers of the electrode stack, thereby preventing this oxygen from diffusing into nearby silicon layers to undesirably increase an SiO | 09-18-2014 |
20140268994 | Write-Time Based Memristive Physical Unclonable Function - A physical unclonable function (PUF) device consisting of a hybrid CMOS-memristor circuit that leverages variations in the required write-time of a memristor. Variations in the time required to write, or SET, a memristor from a high to low resistance state arise from variability in physical parameters such as the memristor thickness. When applying a SET voltage across the memristor for the nominal minimum SET time, variability leads to a situation where the memristor will actually SET to the low resistance state only 50% of the time. When the device does not SET it will remain in the high resistance state. Since the to resistance state of the memristor corresponds to reading either a logic 1 or logic 0 on the output of the circuit, the write-time based memristive PUF produces a digital signature directly corresponding to the fabrication process-induced physical variations of an integrated circuit. | 09-18-2014 |
20140268995 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME - A semiconductor device includes: a vertical electrode provided over a substrate; a variable resistance layer provided at least a sidewall of the vertical electrode; a plurality of horizontal electrodes extending from the sidewall of the vertical electrode and having the variable resistance layer interposed; a transition metal oxide layer provided (i) between the vertical electrode and the variable resistance layer or (ii) between the plurality of horizontal electrodes and the variable resistance layer; and a threshold voltage switching layer provided in the transition metal oxide layer and selectively between the vertical electrode and the any of the plurality of horizontal electrodes. | 09-18-2014 |
20140268996 | VARIABLE RESISTANCE MEMORY DEVICE AND METHOD OF DRIVING THE SAME - A variable resistance memory device and a driving method thereof are provided. The variable resistance memory device includes a base layer and a pillar-shaped gate electrode formed on the base layer and extending substantially perpendicular to a surface of the base layer. A current transfer layer is formed to surround the pillar-shaped gate electrode. A variable resistance layer formed in an outer portion of the current transfer layer. A blocking layer blocks a path of current flowing through the current transfer layer based on a voltage applied voltage to the pillar-shaped gate electrode, and diverts the current flowing through the current transfer layer to the variable resistance layer. | 09-18-2014 |
20140268997 | PROGRAMMING TWO-TERMINAL MEMORY CELLS WITH REDUCED PROGRAM CURRENT - Providing for programming a two-terminal memory cell array with low sneak path current is described herein. Groups of two-terminal memory cells can be arranged into blocks or sub-blocks, along sets of bitlines and local wordlines. Further, groups of local wordlines within a given sub-block can be electrically isolated from bitlines outside the sub-block. A programming signal can be applied to the two-terminal memory cells from an associated local wordline thereof. Sneak path currents can be mitigated or avoided with respect to bitlines outside a particular sub-block, or on non-selected wordlines of the sub-block. This can significantly reduce a magnitude of combined sneak path current within the sub-block in response to the programming operation. | 09-18-2014 |
20140268998 | RRAM WITH DUAL MODE OPERATION - A two-terminal memory cell comprises a dual mode of operation in a unipolar mode and bipolar mode for a programming or On-state and for an erase or Off-state of the cell. The two-terminal memory cell is field programmable and can be flexibly designed or integrated into existing architecture. The two-terminal memory comprises a first electrode layer and a second electrode layer with a switching layer disposed between that has an electrical insulator material. A semiconductor layer is disposed between the switching layer and at least one of the first electrode or the second electrode. The switching layer generates a conductive path that is configured to be in a program state and an erase state, based on a bipolar mode and a unipolar mode. | 09-18-2014 |
20140268999 | SEMICONDUCTOR STORAGE DEVICE - According to one embodiment, provided is a semiconductor storage device that includes a control circuit to control the voltage that is applied to the memory cell. The control circuit is configured to execute a reset operation that applies a reset voltage of a first polarity to a selected memory cell that is connected to a selected first wire and a selected second wire during a reset operation. The control circuit is configured to execute a cancel operation that applies a cancel voltage of a second polarity that is opposite to the first polarity to an unselected memory cell and at the same time can execute a verify operation that reads out the state of the selected memory cell by applying a readout voltage of the second polarity to the selected memory cell. The cancel voltage and the readout voltage are the same voltage value. | 09-18-2014 |
20140269000 | SEMICONDUCTOR STORAGE DEVICE - According to one embodiment, a semiconductor storage device includes multiple memory cells that include a variable resistance element and a control circuit to control the voltage that is applied to the memory cell. The control circuit is configured so that, during the set operation in which the variable resistance element is changed to the set state, a set voltage of a first polarity is applied to the select memory cell. The control circuit is configured so that, during the reset operation in which the variable resistance elements are changed to the reset state, and a cancel voltage of the first polarity is applied to an unselected memory cell to which voltage that is less than the reset voltage was applied. The voltage value and the voltage application time of the set voltage and the voltage value and the voltage application time of the cancel voltage have a set relationship. | 09-18-2014 |
20140269001 | AMORPHOUS SILICON RRAM WITH NON-LINEAR DEVICE AND OPERATION - A non-volatile memory device includes a resistive switching device having a first electrode, a second electrode, and a resistive switching element, wherein the resistive switching element comprises a silicon material disposed in an overlapping region between the first electrode and the second electrode, wherein the second electrode comprises at least a metal material physically and electrically in contact with the resistive switching material, wherein the resistive switching element is characterized by a resistance depending on an electric field in the resistive switching element, and a non-linear device coupled between the first electrode and the resistive switching element , wherein the non-linear device is configured to conduct electric current when a voltage greater than a first voltage is applied to the second electrode, wherein the resistive switching device is configured to change from a first state to a second state in response to the first voltage. | 09-18-2014 |
20140269002 | TWO-TERMINAL MEMORY WITH INTRINSIC RECTIFYING CHARACTERISTIC - Providing for two-terminal memory having an inherent rectifying characteristic(s) is described herein. By way of example, the two-terminal memory can be a resistive switching device having one or more “on” states and an “off” state, to facilitate storage of digital information. A conductive filament can be electrically isolated from an electrode of the two-terminal memory by a thin tunneling layer, which permits a tunneling current for voltages greater in magnitude than a positive rectifying voltage or a negative rectifying voltage. The two-terminal memory cell can therefore have high resistance to small voltages, mitigating leakage currents in an array of the two-terminal memory cells. In addition, the memory cell can be conductive above a rectifying voltage, enabling reading of the memory cell in response to a suitable read bias, and erasing of the memory cell in response to a suitable negative erase bias. | 09-18-2014 |
20140269003 | MEMORY CELL WITH VOLATILE AND NON-VOLATILE STORAGE - The invention concerns a non-volatile memory element comprising: first and second transistors ( | 09-18-2014 |
20140269004 | Method for Improving Data Retention of ReRAM Chips Operating at Low Operating Temperatures - Programming a resistive memory structure at a temperature well above the operating temperature can create a defect distribution with higher stability, leading to a potential improvement of the retention time. The programming temperature can be up to 100 C above the operating temperature. The memory chip can include embedded heaters in the chip package, allowing for heating the memory cells before the programming operations. | 09-18-2014 |
20140269005 | ELECTRONIC DEVICES HAVING SEMICONDUCTOR MEMORY UNITS AND METHOD FOR FABRICATING THE SAME - The disclosed technology provides an electronic device and a fabrication method thereof. An electronic device according to an implementation of the disclosed technology may include: a first interlayer insulating layer formed over a substrate; first and second contact plugs passing through the first interlayer insulating layer to contact the substrate and alternately arranged to cross each other; a variable resistance element formed over the first interlayer insulating layer and coupled to the first contact plug; a second interlayer insulating layer formed over an entire structure including the first interlayer insulating layer; a third contact plug passing through the second interlayer insulating layer so as to be coupled to the variable resistance element, and a fourth contact plug passing through the second interlayer insulating layer so as to be contacted to the second contact plug; and conductive lines coupled to the third contact plug and the fourth contact plug, respectively. | 09-18-2014 |
20140269006 | FAST READ SPEED MEMORY DEVICE - A memory device includes an array of resistive memory cells. Each resistive memory cell in the array includes a first resistive memory element, a second resistive memory element electrically coupled with the first resistive memory element at a common node between a first terminal of the first resistive memory element and a first terminal of the second resistive memory element, and a transistor comprising a gate electrically coupled with the common node. | 09-18-2014 |
20140269007 | COMPLEMENTARY METAL OXIDE OR METAL NITRIDE HETEROJUNCTION MEMORY DEVICES WITH ASYMMETRIC HYSTERESIS PROPERTY - A resistive memory device is disclosed. The resistive memory device comprises one or more metal oxide layers. The resistive memory device displays a property of asymmetric hysteresis loop formation when positive and negative electrical biases are applied across the device. | 09-18-2014 |
20140269008 | NON-VOLATILE MEMORY USING BI-DIRECTIONAL RESISTIVE ELEMENTS - A memory cell includes a first bidirectional resistive memory element (BRME), and a second BRME, a first storage node, and a second storage node . A resistive memory write to the cell includes placing the first BRME and the second BRME in complementary resistive states indicative of the value being written. During a subsequent restoration operation, the value as written in the first BRME and second BRME is written to the first storage node and the second storage node while a wordline connected to the memory cell is deasserted. | 09-18-2014 |
20140286077 | RESISTANCE CHANGE TYPE MEMORY - According to one embodiment, a resistance change type memory includes a first and a second bit lines, a memory cell connected between the first and second bit lines and including a variable resistance element as a memory element and a first select element including a first control terminal connected to a word line, and an auxiliary circuit connected to the first bit line and including a second select element including a second control terminal connected to a control line. When data is read from the memory cell, a first current in a read current supplied to the first bit line is supplied to the memory element and the first select element, and a second current in the read current is supplied to the second select element. | 09-25-2014 |
20140286078 | RESISTANCE CHANGE MEMORY - According to one embodiment, a memory includes a resistance change element connected between first and second conductive lines, a write buffer which writes data in the resistance change element by flowing a write current to the resistance change element through the first and second conductive lines in a writing, a current/voltage converter which converts the write current into a sense voltage, the converter provided in the write buffer, the write buffer being non-activated when the sense voltage is larger than a first threshold value. | 09-25-2014 |
20140286079 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF CONTROLLING THE SAME - A control circuit, on selecting a memory cell as a selected memory cell to perform a write operation, before executing the write operation, applies a first voltage to the selected memory cell via a first line and a second line to perform a first read operation. The control circuit, when judged that a result of the first read operation does not match write data intended to be written, executes the write operation. The control circuit, when judged that a result of the first read operation matches write data intended to be written, omits a voltage application operation for the write operation. | 09-25-2014 |
20140286080 | RESISTANCE CHANGE MEMORY - According to one embodiment, a resistance change memory includes the following configuration. A first inverter includes first input and first output terminals and first and second voltage terminals. A second inverter includes second input and second output terminals and third and fourth voltage terminals. The second input terminal is connected to the first output terminal. The second output terminal is connected to the first input terminal. First and second transistors are connected to the first and second output terminals, respectively. Third and fourth transistors are connected to the first and third voltage terminals, respectively. A fifth transistor is connected between the first voltage terminal and the first memory cell. A sixth transistor is connected to the third voltage terminal. A controller turns on the first and second transistors, after turning off the fifth and sixth transistors. | 09-25-2014 |
20140286081 | RESISTANCE CHANGE MEMORY - According to one embodiment, a resistance change memory includes a memory cell, a sense amplifier and a global bit line. The memory cell is disposed at a location where a local bit line and a word line intersect each other. The memory cell is connected to both the local bit line and the word line. The sense amplifier reads data stored on the memory cell by supplying a read current to the memory cell. The global bit line is connected between the local bit line and the sense amplifier. The global bit line feeds the read current supplied by the sense amplifier to the local bit line. The sense amplifier charges the global bit line, before the local bit line and the global bit line are connected to each other. | 09-25-2014 |
20140286082 | MEMORY DEVICE - According to one embodiment, a memory device includes a memory cell, a sense amplifier, and a resistor. The sense amplifier includes a first input and a second input, outputs a signal in accordance with a difference between the first and second inputs, and is selectively coupled at a second input to the memory cell. The resistor is in a first path between the first input of the sense amplifier and a ground node. | 09-25-2014 |
20140293674 | RRAM, and Methods of Storing and Retrieving Information for RRAM - Some embodiments include methods of storing and retrieving data for an RRAM array. The array is subdivided into a plurality of memory bits, with each memory bit having at least two memory cells. A memory bit is programmed by simultaneously changing resistive states of all memory cells within the memory bit. The memory bit is read by determining summed current through all memory cells within the memory bit. Some embodiments include RRAM having a plurality of memory cells. Each of the memory cells is uniquely addressed through a bitline/wordline combination. Memory bits contain multiple memory cells coupled together, with the coupled memory cells within each memory bit being in the same resistive state as one another. | 10-02-2014 |
20140293675 | NONVOLATILE SEMICONDUCTOR DEVICE AND METHOD FOR DRIVING SAME - According to one embodiment, a nonvolatile memory device includes: a memory cell array including first wirings, second wirings, and a memory cell connected between the first wirings and the second wirings; and a control circuit unit configured to select a selected memory cell from the memory cells, perform a first operation of changing a resistance state of the selected memory cell between a first resistance state and a second resistance state, and determine whether the first operation has been properly performed or not and perform retry operation such as applying a retry pulse when the first operation has not been properly performed. The control circuit unit regards the selected memory cell as excessive retry operation and inhibits the selected memory cell in accordance with the number of times of the excessive retry operation when the number of times of the retry operation is over k times. | 10-02-2014 |
20140293676 | PROGRAMMABLE IMPEDANCE MEMORY ELEMENTS AND CORRESPONDING METHODS - A memory element programmable between different impedance states can include a first electrode; a switching layer formed in contact with the first electrode and including at least one metal oxide; and a buffer layer in contact with the switching layer. A buffer layer can include a first metal, tellurium, a third element, and a second metal distributed within the buffer layer. A second electrode can be in contact with the buffer layer. | 10-02-2014 |
20140293677 | ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME - An electronic device includes a semiconductor memory, the semiconductor memory including: a substrate configured to comprise a plurality of line patterns which are extended in a second direction, and a plurality of pillar patterns which protrude perpendicular to the line patterns and are arranged in the second direction and in a first direction crossing the second direction; a source line configured to be formed between the line patterns, to be coupled to the line patterns disposed at both sides of the source line, and to be extended in the second direction; a word line configured to be in contact with sidewalls of the pillar patterns arranged in the first direction, and to be extended in the first direction; an interconnection line configured to be disposed over the pillar patterns, and to be extended in the first direction so as to be coupled to the pillar patterns arranged in the first direction; variable resistance elements configured to be disposed over the interconnection line, and to be positioned between the pillar patterns which are adjacent to each other in the first direction; and a bit line configured to be disposed over the variable resistance elements, and to be extended in the second direction so as to be coupled to the variable resistance elements arranged in the second direction. | 10-02-2014 |
20140293678 | Volatile/Non-Volatile Floating Electrode Logic/Memory Cell - A resistive floating electrode device (RFED) provides a logic cell or non-volatile storage or dynamic or static random access memory on an extremely compact matrix with individual cells scalable to the minimum available lithographic feature size regime by providing atomic switches connected in anti-parallel relationship, preferably with a common inert electrode. Programming is facilitated by limiting current to a compliance current level in order to maintain an OB state from which the cell can be written to either the 0 or 1 state. A perfecting feature of the invention provides for selective operation of a cell as a diode or in a volatile or non-volatile storage mode within the same memory array. A series connection of three or more RFEDs in accordance with the invention having different ON state currents, OFF state currents and reset currents can be used as adaptive, neural or chaotic logic cells. | 10-02-2014 |
20140301127 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE INCLUDING THE SAME - A semiconductor device includes a first conductive layer, a second conductive layer spaced from the first conductive layer, a variable resistance layer interposed between the first and second conductive layers, and an impurity-doped layer provided over a side surface of the variable resistance layer. The variable resistance layer has a smaller width than the first and the second conductive layers. | 10-09-2014 |
20140301128 | 3D VARIABLE RESISTANCE MEMORY DEVICE HAVING JUNCTION FET AND DRIVING METHOD THEREOF - A 3D variable resistance memory device having a junction FET and a driving method thereof are provided. The variable resistance memory device includes a semiconductor substrate and a string selection switch formed on the semiconductor substrate. A channel layer is formed on the column string selection switch. A plurality of gates stacked along a length of the channel layer and each of the gates contacts an outer side of the channel layer. A variable resistance layer is formed on an inner side of the channel layer, and contacts the channel layer. | 10-09-2014 |
20140301129 | WRITING METHOD OF VARIABLE RESISTANCE NON-VOLATILE MEMORY ELEMENT AND VARIABLE RESISTANCE NON-VOLATILE MEMORY DEVICE - A writing method of a variable resistance non-volatile memory element comprises determining, in a first determination step, whether or not a resistance state of the variable resistance non-volatile memory element does not switch to a first resistance state and remains in a second resistance state, when a pulse of a second voltage is applied to the variable resistance non-volatile memory element; and when it is determined that the resistance state of the variable resistance non-volatile memory element does not switch to the first resistance state and remains in the second resistance state in the first determination step, applying, in a recovery step, at least once to the variable-resistance non-volatile memory element a recovery voltage pulse set composed of two pulses which are a first recovery voltage pulse which has the same polarity as that of the first voltage and a second recovery voltage pulse which has the same polarity as that of the second voltage, has a greater amplitude than the second voltage, and is applied subsequently to the first recovery voltage pulse. | 10-09-2014 |
20140301130 | VERTICAL CROSS POINT RERAM FORMING METHOD - Methods for forming non-volatile storage elements in a non-volatile storage system are described. In some embodiments, a plurality of forming operations may be performed in which non-volatile storage elements located near the far end of a plurality of word line fingers associated with a word line comb are formed prior to forming other non-volatile storage elements. In one example, non-volatile storage elements may be formed in each of the plurality of word line fingers in parallel and in an order that forms non-volatile storage elements in each of the plurality of word line fingers that are located near the far ends of the plurality of word line fingers before forming other non-volatile storage elements. Each non-volatile storage element that is formed during a forming operation may be current limited while a forming voltage is applied across the non-volatile storage element. | 10-09-2014 |
20140301131 | MULTIPLE LAYER FORMING SCHEME FOR VERTICAL CROSS POINT RERAM - Methods for forming non-volatile storage elements in a non-volatile storage system are described. In some embodiments, during a forming operation, a cross-point memory array may be biased such that waste currents are minimized or eliminated. In one example, the memory array may be biased such that a first word line comb is set to a first voltage, a second word line comb interdigitated with the first word line comb is set to the first voltage, and selected vertical bit lines are set to a second voltage such that a forming voltage is applied across non-volatile storage elements to be formed. In some embodiments, a memory array may include a plurality of word line comb layers and a forming operation may be concurrently performed on non-volatile storage elements on all of the plurality of word line comb layers or a subset of the plurality of word line comb layers. | 10-09-2014 |
20140301132 | STORAGE CONTROL DEVICE, STORAGE DEVICE, INFORMATION PROCESSING SYSTEM, AND PROCESSING METHOD THEREOF - Provided is a storage control device including a history information holding unit configured to hold history information in a predetermined data area of a memory cell holding either a first value or a second value for each bit, the history information indicating which mode of a first mode or a second mode is employed upon a previous write operation, the first mode setting all bits to the first value and then setting any bit to the second value, the second mode setting all bits to the second value and then setting any bit to the first value, and a bitwise operation unit configured to perform a write operation in the second mode if the history information indicates the first mode and to perform a write operation in the first mode if the history information indicates the second mode. | 10-09-2014 |
20140307499 | BOOSTER CIRCUIT - A booster circuit configured to boost a supplied voltage and provide a booster circuit output includes: an oscillator circuit configured to generate a clock signal; a charge pump circuit configured to provide a charge pump output by boosting the supplied voltage with the use of the clock signal; a detection circuit configured to detect a voltage of the booster circuit output and output a detection signal; and an output circuit configured to connect and disconnect the charge pump output to and from the booster circuit output. The oscillator circuit controls activation and deactivation of an output of the oscillator circuit in accordance with the detection signal, and the output circuit controls disconnection of the output circuit in accordance with the detection signal. | 10-16-2014 |
20140313812 | SEMICONDUCTOR DEVICE, AND MICROPROCESSOR, PROCESSOR, SYSTEM, DATA STORAGE SYSTEM AND MEMORY SYSTEM INCLUDING THE SEMICONDUCTOR DEVICE - A semiconductor device includes: a write current generator configured to generate a write current corresponding to a write reference voltage in a write mode and to have a negative feedback structure. The semiconductor device may further comprise a variable resistance device configured to have a resistance value that varies with the write current. | 10-23-2014 |
20140313813 | SEMICONDUCTOR MEMORY DEVICE AND OPERATION METHOD THEREOF - This semiconductor memory device comprises: a memory cell array including plural bit lines, plural word lines intersecting the plurality of bit lines, and memory cells provided at intersections of the plural bit lines and the plural word lines; and a control unit operative to control a voltage applied to the bit line and the word line. The control unit, when performing a certain operation consecutively on a plurality of the memory cells, selects a first bit line selected from among the plural bit lines and a first word line selected from among the plural word lines to perform a first operation on a first memory cell. Then, in a subsequent second operation following this first operation, selects a second bit line different from the first bit line and a second word line different from the first word line to select a second memory cell. | 10-23-2014 |
20140313814 | PERFORMING FORMING PROCESSES ON RESISTIVE MEMORY - The present disclosure includes apparatuses and methods for performing forming processes on resistive memory. A number of embodiments include applying a formation signal to the storage element of a resistive memory cell, wherein the formation signal includes a first portion having a first polarity and a first amplitude, a second portion having a second polarity and a second amplitude, wherein the second polarity is opposite the first polarity and the second amplitude is smaller than the first amplitude, and a third portion having the first polarity and a third amplitude that is smaller than the first amplitude. | 10-23-2014 |
20140313815 | WORD LINE SELECTION CIRCUIT AND ROW DECODER - A first exemplary aspect of the present invention is a word line selection circuit where address decode signals composed of a power supply voltage and a first voltage lower than a ground voltage are input, and that a word line selection signal composed of the first voltage and a second voltage higher than the power supply voltage is output not via a level shift circuit according to the address decode signals. | 10-23-2014 |
20140313816 | SELECT DEVICE FOR CROSS POINT MEMORY STRUCTURES - The present disclosure provides a memory cell that includes a resistive memory element disposed between a first conductor and a second conductor, the first conductor and the second conductor configured to activate the resistive memory element. The memory cell also includes a backward diode disposed in series with the memory element between the memory element and either the first conductor or the second conductor. | 10-23-2014 |
20140321191 | RESISTANCE VARIABLE MEMORY SENSING - The present disclosure includes apparatuses and methods for sensing a resistance variable memory cell. A number of embodiments include programming a memory cell to an initial data state and determining a data state of the memory cell by applying a programming signal to the memory cell, the programming signal associated with programming memory cells to a particular data state, and determining whether the data state of the memory cell changes from the initial data state to the particular data state during application of the programming signal. | 10-30-2014 |
20140321192 | RESISTANCE VARIABLE MEMORY SENSING - The present disclosure includes apparatuses and methods for sensing a resistance variable memory cell. A number of embodiments include circuitry to apply a programming signal to a memory cell in the array, the programming signal associated with programming resistance variable memory cells to a particular data state, and detect a change in resistance of the memory cell to determine if a data state of the memory cell changes from an initial data state to a different data state during application of the programming signal. | 10-30-2014 |
20140321193 | 3D VARIABLE RESISTANCE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - A variable resistance memory device includes a plurality of cell gate electrodes extending in a first direction, wherein the plurality of cell gate electrodes are stacked in a second direction that is substantially perpendicular to the first direction. A gate insulating layer surrounds each cell gate electrode of the plurality of cell gate electrodes and a cell drain region is formed on two sides of the each cell gate electrode of the plurality of cell gate electrodes. A channel layer extends in the second direction along the stack of the plurality of cell gate electrodes, and a variable resistance layer contacting the channel layer. | 10-30-2014 |
20140321194 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND CONTROL METHOD THEREOF - This nonvolatile semiconductor memory device comprises a memory cell array including a plurality of bit lines, a plurality of word lines intersecting the plurality of bit lines, and memory cells provided at intersections of the plurality of bit lines and the plurality of word lines, and further comprises a control unit for controlling a voltage applied to the bit lines and word lines. The memory cell includes a variable resistance element and a rectifier element. The control unit provides a first potential difference to a selected memory cell via a selected bit line and a selected word line, and then provides a second potential difference to the selected memory cell via the selected bit line and the selected word line, the second potential difference being for erasing a residual charge. | 10-30-2014 |
20140321195 | CURRENT GENERATOR FOR NONVOLATILE MEMORY DEVICE AND WRITE AND/OR READ CURRENTS CALIBRATING METHOD USING THE SAME - A write and/or read current generator for nonvolatile memory device, especially for Spin Transfer Torque Magnetoresistive Random Access Memory (STT-MRAM), may include a current supplying circuit which changes a level of a sample current, determines a resistance state change current of a sample bit cell based on a feedback signal obtained through the sample bit cell whose resistance state is changed according to a level of the sample current. The current supplying circuit may calibrate a write and/or read current of a memory cell in response to a sample current applied at a point of time when a resistance state of the sample bit cell is switched into another resistance state. A calibration circuit may generate the feedback signal indicating a resistance area of a predetermined resistance range to which a resistance state of the sample bit cell belongs. The calibration circuit may compare a sample voltage output from the sample bit cell with a voltage on predefined high resistance bit cell to output a first output voltage. The calibration circuit may compare the sample voltage with a voltage on predefined low resistance bit cell to generate a second output voltage. The calibration circuit may compare the first and second output voltages to generate the feedback signal. | 10-30-2014 |
20140321196 | VARIABLE RESISTANCE NONVOLATILE MEMORY DEVICE AND METHOD FOR WRITING INTO THE SAME - In a method for writing into a variable resistance nonvolatile memory device according to one aspect of the present disclosure, a verify write operation of newly applying a voltage pulse for changing a resistance state is performed on a variable resistance element which does not satisfy a determination condition for verifying that the resistance state has been changed despite application of a voltage pulse for changing the resistance state, and the determination condition in the verify write operation is relaxed when an average number of times of verify write operation, having already been performed on all or part of a plurality of variable resistance elements that are targets for write operation, exceeds a predetermined number of times. | 10-30-2014 |
20140321197 | DRIVING METHOD OF NON-VOLATILE MEMORY ELEMENT AND NON-VOLATILE MEMORY DEVICE - In a driving method of a non-volatile memory element, the polarity of a write voltage pulse applied to change a variable resistance layer from a high-resistance state to a low-resistance state is such that an input/output terminal which is more distant from the variable resistance element becomes a source terminal, and when a first write voltage pulse is applied to change the variable resistance layer in the high-resistance state to the low-resistance state, a first gate voltage is applied to a gate terminal, while when a second write voltage pulse which is greater in absolute value of voltage than the first write voltage pulse is applied to change the variable resistance layer in an excess-resistance state to the low-resistance state, a second gate voltage which is smaller in absolute value than the first gate voltage is applied to the gate terminal. | 10-30-2014 |
20140321198 | Memory Devices and Related Methods - A resistive memory device. Implementations may include an array of memory cells including resistive memory elements which are coupled to isolation transistors and which may include a magnetic tunnel junction. A decoder decodes input address information to select a row of the array. A binarizer coupled to the memory array assigns binary weights to outputs of the memory array output through bit lines coupled to the memory cells. A summer sums the binary weighted outputs, and a quantizer generates an output digital code corresponding to data stored in a plurality of memory cells during a prior program cycle. The outputs of the memory array may be currents or voltages. In implementations multiple arrays of memory cells may be utilized and their respective outputs combined to form higher bit outputs, such as eight bit, twelve bit, sixteen bit, and so forth. | 10-30-2014 |
20140328107 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - A non-volatile semiconductor memory device includes a memory cell array including a first wire, a second wire crossing the first wire, and a memory cell connected to both the wires at a crossing portion of the first wire and the second wire, the memory cell including a variable resistance element storing data in a non-volatile manner by a resistance value, and a control circuit setting the variable resistance element in first or second resistance state by application of first or second voltage to the memory cell and reading data from the memory cell by application of third voltage to the memory cell. The control circuit applies to the memory cell at predetermined timing weak write voltage causing the variable resistance element to be held in the first resistance state and the second resistance state. | 11-06-2014 |
20140328108 | WRITE AND ERASE SCHEME FOR RESISTIVE MEMORY DEVICE - A method for programming a two terminal resistive memory device, the method includes applying a bias voltage to a first electrode of a resistive memory cell of the device; measuring a current flowing through the cell; and stopping the applying of the bias voltage if the measured current is equal to or greater than a predetermined value. | 11-06-2014 |
20140328109 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device according to an embodiment comprises a memory cell array configured from a plurality of row lines and column lines that intersect one another, and from a plurality of memory cells disposed at each of intersections of the row lines and column lines and each including a variable resistance element. Where a number of the row lines is assumed to be N, a number of the column lines is assumed to be M, and a ratio of a cell current flowing in the one of the memory cells when a voltage that is half of the select voltage is applied to the one of the memory cells to a cell current flowing in the one of the memory cells when the select voltage is applied to the one of the memory cells is assumed to be k, a relationship M | 11-06-2014 |
20140328110 | NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - A non-volatile semiconductor memory device includes a cell array layer including a first wire, a memory cell, and a second wire, and a control circuit. When performing set operation for setting the memory cell to a low resistance state, until a resistance value of the memory cell becomes lower than a predetermined resistance value, the control circuit repeating: applying a first voltage for setting to the memory cell; and a verify read verifying that the resistance value of the memory cell has become lower than the predetermined resistance value. After the verify read, the control circuit applies a second voltage having a different polarity from the first voltage to the memory cell before applying the first voltage that follows. | 11-06-2014 |
20140334221 | RESISTANCE CHANGE MEMORY - According to one embodiment, a memory includes memory cells between first conductive lines and second conductive lines. A control circuit is configured to apply a first potential to a first end of a selected first conductive line connected to the selected memory cell among the first conductive lines and first ends of unselected second conductive lines not connected to the selected memory cell among the second conductive lines, apply a second potential larger than the first potential to a first end of a selected second conductive line connected to the selected memory cell among the second conductive lines, apply third potentials smaller than the second potential to first ends of unselected first conductive lines not connected to the selected memory cell among the first conductive lines respectively, and change values of the third potentials based on an address of the selected first conductive line. | 11-13-2014 |
20140334222 | LOW READ CURRENT ARCHITECTURE FOR MEMORY - A low read current architecture for memory. Bit lines of a cross point memory array are allowed to be charged by a selected word line until a minimum voltage differential between a memory state and a reference level is assured. | 11-13-2014 |
20140334223 | APPARATUSES AND METHODS FOR DETERMINING STABILITY OF A MEMORY CELL - Examples described include apparatuses and methods for determining stability of memory cells. Resistance variable memory cells may be used. Once a memory cell is placed in a low or high resistance state responsive to set or reset pulses, the stability of the state may be determined, such as by providing another pulse to the memory cell or otherwise stressing the cell. The another pulse may be of an opposite polarity to the set or reset pulses already applied. If the memory cell is no longer in the target state after providing the another pulse, additional set or reset pulses may be applied to achieve a stable state. | 11-13-2014 |
20140340956 | MEMORY DEVICE AND METHOD OF CONTROLLING MEMORY DEVICE - According to one embodiment, a memory device includes a semiconductor layer connected between a first conductive line and one end of a third conductive line, resistance change elements connected between second conductive lines and the third conductive line respectively, a select FET having a select gate electrode, and using the semiconductor layer as a channel, and a control circuit executing a write/erase of at least one of the resistance change elements, and executing a recovering operation which adjusts a threshold voltage shift of the select FET after the write/erase. | 11-20-2014 |
20140347910 | READING MEMORY ELEMENTS WITHIN A CROSSBAR ARRAY - A method for reading the state of a memory element within a crossbar memory array includes storing a first electric current sensed from a half-selected target memory element within the crossbar memory array; and outputting a final electric current based on the stored first electric current and a second electric current sensed from the target memory element when the target memory element is fully selected. | 11-27-2014 |
20140347911 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device according to an embodiment comprises a memory cell block that includes a memory cell array, the memory cell array including: a plurality of first lines; a plurality of second lines intersecting the plurality of first lines; and a memory cell that is provided at each of intersections of the plurality of first lines and the plurality of second lines and includes a variable resistance element, the memory cell array further including a protective resistance film that is provided respectively at each of the intersections of the plurality of first lines and the plurality of second lines and that is connected in series with the memory cell and ohmically contacts the memory cell, and the protective resistance film being configured from a material having a resistivity of 1˜100 Ω·cm. | 11-27-2014 |
20140347912 | SENSE AMPLIFIER LOCAL FEEDBACK TO CONTROL BIT LINE VOLTAGE - Methods for precharging bit lines using closed-loop feedback are described. In one embodiment, a sense amplifier may include a bit line precharge circuit for setting a bit line to a read voltage prior to sensing a memory cell connected to the bit line. The bit line precharge circuit may include a first transistor in a source-follower configuration with a first gate and a first source node electrically coupled to the bit line. By applying local feedback from the first source node to the first gate, the bit line settling time may be reduced. In some cases, a first voltage applied to the first gate may be determined based on a first current drawn from the first bit line. Thus, the first voltage applied to the first gate may vary over time depending on the conductivity of a selected memory cell connected to the bit line. | 11-27-2014 |
20140347913 | RESISTIVE SWITCHING MEMORY DEVICE AND METHOD FOR OPERATING THE SAME - A resistive switching memory device and a method for operating the same are disclosed. The device includes a plurality of resistive switching memory units arranged in a matrix, each of which includes a switching element and a resistive switching device, and the switching element being connected to a word line at its control terminal, to the resistive switching device at one terminal, and to a bit line at the other terminal; a word line decoder adapted to decode an input address signal to switch on the switching element in at least one of resistive switching memory units; and a driving circuit adapted to apply a voltage pulse whose front edge changes slowly across the resistive switching device by the bit line synchronously with the switching-on of the switching element. Using the scheme of the above embodiments, the durability characteristic of the resistive switching device can be improved, such as degradation of high-low resistance value window and the failure of the device with transition times can be reduced. | 11-27-2014 |
20140347914 | MULTI-FUNCTION RESISTANCE CHANGE MEMORY CELLS AND APPARATUSES INCLUDING THE SAME - Various embodiments comprise apparatuses including drive circuitry to provide signal pulses of a selected time duration and/or amplitude to a number of memory cells. The memory cells may include an array of resistance change memory cells to be electrically coupled to the drive circuitry. The resistance change memory cells may be programmed for a range of retention time periods and operating speeds based on the received signal pulse. Additional apparatuses and methods are described. | 11-27-2014 |
20140355329 | METHOD AND APPARATUS FOR COMMON SOURCE LINE CHARGE TRANSFER - A method and apparatus for charge transfer comprising a resistive random access memory (ReRAM) cell, coupled to a common source voltage line (CSL) for controlling state of the ReRAM cell, and a charge transfer circuit, coupled to the memory cell through the CSL and a charge consumption circuit, for transferring charge from the CSL to the charge consumption circuit when the state of the memory cell is modified. | 12-04-2014 |
20140355330 | INTEGRATED CIRCUIT - An integrated circuit that does not involve increase in power consumption or decrease in switching probability that occur when a latch circuit using STT-MTJ device, etc. of the prior art is operated at high speed is provided. The integrated circuit | 12-04-2014 |
20140355331 | MULTI-LEVEL MEMORY CELL WITH CONTINUOUSLY TUNABLE SWITCHING - The present disclosure provides a data storage device that includes multi-level memory cells. The data storage device may include circuitry configured to write data to the multi-level memory cell. The write circuitry may include compliance circuitry configured to implement continuously tunable switching. The write circuitry may be configured to select a compliance mode for the switching, the compliance mode being selected from the group comprising current compliance and voltage compliance. | 12-04-2014 |
20140362633 | Memory Devices and Memory Operational Methods - Memory devices and memory operational methods are described. One example memory system includes a common conductor and a plurality of memory cells coupled with the common conductor. The memory system additionally includes access circuitry configured to provide different ones of the memory cells into one of a plurality of different memory states at a plurality of different moments in time between first and second moments in time. The access circuitry is further configured to maintain the common conductor at a voltage potential, which corresponds to the one memory state, between the first and second moments in time to provide the memory cells into the one memory state. | 12-11-2014 |
20140362634 | OXIDE BASED MEMORY - Methods, devices, and systems associated with oxide based memory are described herein. In one or more embodiments, a method of forming an oxide based memory cell includes forming a first electrode, forming a tunnel barrier, wherein a first portion of the tunnel barrier includes a first material and a second portion of the tunnel barrier includes a second material, forming an oxygen source, and forming a second electrode. | 12-11-2014 |
20140369107 | STRUCTURES FOR RESISTANCE RANDOM ACCESS MEMORY AND METHODS OF FORMING THE SAME - Memory cells and methods of forming the same and devices including the same. The memory cells have first and second electrodes. An amorphous semiconductor material capable of electronic switching and having a first band gap is between the first and second electrodes. A material is in contact with the semiconductor material and having a second band gap, the second band gap greater than the first band gap. | 12-18-2014 |
20140369108 | SYSTEM AND A METHOD FOR DESIGNING A HYBRID MEMORY CELL WITH MEMRISTOR AND COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR - The embodiments herein relates to a hybrid non-volatile memory cell system and architecture for designing integrated circuits. The system comprises CMOS access transistor connected to a memristor which stores a data based on a resistance. The system has a word line for accessing the hybrid memory and two bit lines carrying data of mutually opposite values for transferring a data from the memory. The two terminals of the transistor are connected respectively to a first terminal of the memristor and to a first bit line. The gate terminals of the transistors are coupled together to form a word line. The access transistors control the two bit lines during a read and write operation. A control logic performs a read and write operation with the hybrid memory cells. The memory architecture prevents a power leakage during data storage and controls a drift in a state during a read process. | 12-18-2014 |
20140376297 | DATA ENCODING FOR NON-VOLATILE MEMORY - A data storage device includes a memory and a controller. Mapping circuitry is configured to apply a mapping to received data to generate mapped data to be stored in storage elements. The mapping is configured to reduce average write time by mapping at least one incoming data value into a mapped value such that no transitions of storage elements from a second state to a first state are used for storing the mapped value into the storage elements. | 12-25-2014 |
20140376298 | DATA ENCODING FOR NON-VOLATILE MEMORY - A data storage device includes a memory and a controller. Mapping circuitry is configured to apply a mapping to received data to generate mapped data to be stored in storage elements. The mapping is configured to reduce average write time by mapping at least one incoming data value into a mapped value such that no transitions of storage elements from a second state to a first state are used for storing the mapped value into the storage elements. The mapping of the received data to the mapped data does not depend on the states of the storage elements prior to the writing of the mapped data. | 12-25-2014 |
20140376299 | METHODS AND CIRCUITS FOR BULK ERASE OF RESISTIVE MEMORY - A resistive random access memory integrated circuit for use as a mass storage media and adapted for bulk erase by substantially simultaneously switching all memory cells to one of at least two possible resistive states. Bulk switching is accomplished by biasing all bottom electrodes within an erase area to a voltage lower than that of the top electrodes, wherein the erase area can comprise the entire memory array of the integrated circuit or else a partial array. Alternatively the erase area may be a single row and, upon receiving the erase command, the row address is advanced automatically and the erase step is repeated until the entire array has been erased. | 12-25-2014 |
20140376300 | DIFFERENTIAL BIT CELL - A differential bit cell includes two memory elements that are configured to have different states. Each of the two memory elements is connected to a respective switching element. Each of these switching elements may have process variances, which may result in a degradation of read and/or write margins. To mitigate the effect of such variances, another switching element is coupled to the two memory elements and their respective switching elements in a manner that couples the aforementioned switching elements in a parallel fashion. In this way, the mismatch effects between the switching elements can be negated during read operations. During programming operations, such a configuration allows for the programming of both memory elements to different states with a single current pulse and also reduces the effective resistance of the programming path. | 12-25-2014 |
20140376301 | MEMORY ELEMENT AND MEMORY DEVICE - A memory element includes: a memory layer disposed between a first electrode and a second electrode. The memory layer includes: an ion source layer containing one or more metallic elements, and one or more chalcogen elements of tellurium (Te), sulfur (S), and selenium (Se); and a resistance change layer disposed between the ion source layer and the first electrode, the resistance change layer including a layer which includes tellurium and nitrogen (N) and is in contact with the ion source layer. | 12-25-2014 |
20140376302 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a cell array including plural MATs (unit cell arrays) arranged in matrix, each MAT containing a plurality of first lines, a plurality of second lines intersecting the plurality of first lines, and a plurality of memory cells connected at intersections of the first and second lines between both lines, each memory cell containing an electrically erasable programmable variable resistive element of which resistance is nonvolatilely stored as data; and a plurality of write/erase circuits connected to the MATs and operative to execute data write or erase to the memory cells inside the MATs in accordance with input data. A part of the plurality of write/erase circuits writes data to memory cells inside a corresponding MAT while another part of the plurality of write/erase circuits erases data from memory cells inside a corresponding MAT at the same time. | 12-25-2014 |
20140376303 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE INCLUDING VARIABLE RESISTANCE ELEMENT - According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array and a control circuit. The memory cell array include the memory cells each including a variable resistance element in which a reset current flowing in a reset operation is smaller than a set current flowing in a set operation by not less than one order of magnitude. The control circuit performs the reset operation and the set operation for the memory cells. The control circuit performs the reset operation for all memory cells being in the low resistance state and connected to selected first interconnections and selected second interconnections. | 12-25-2014 |
20140376304 | RESISTANCE CHANGE MEMORY CELL CIRCUITS AND METHODS - The gate of the access transistor of a 1 transistor 1 resistor (1T1R) type RRAM cell is biased relative to the source of the access transistor using a current mirror. Under the influence of a voltage applied across the 1T1R cell (e.g., via the bit line), the RRAM memory element switches from a higher resistance to a lower resistance. As the RRAM memory element switches from the higher resistance to the lower resistance, the current through the RRAM cell switches from being substantially determined by the higher resistance of the RRAM device (while the access transistor is operating in the linear region) to being substantially determined by the saturation region operating point of the access transistor. | 12-25-2014 |
20150009744 | NON-VOLATILE MEMORY DEVICE - The invention concerns a memory device comprising: a first memory cell comprising a first resistive non-volatile data storage element programmable to store a first bit of data; and a second memory cell comprising a second resistive non-volatile data storage element programmable to store a second bit of data; wherein said first resistive element is configured to have a first data retention duration, and said second resistive element is configured to have a second data retention duration different from said first data retention duration. | 01-08-2015 |
20150009745 | HIGH OPERATING SPEED RESISTIVE RANDOM ACCESS MEMORY - Providing for resistive random access memory (RRAM) having high read speeds is described herein. By way of example, a RRAM memory can be powered at one terminal by a bitline, and connected at another terminal to a gate of a transistor having a low gate capacitance (relative to a capacitance of the bitline). With this arrangement, a signal applied at the bitline can quickly switch the transistor gate, in response to the RRAM memory being in a conductive state. A sensing circuit configured to measure the transistor can detect a change in current, voltage, etc., of the transistor and determine a state of the RRAM memory from the measurement. Moreover, this measurement can occur very quickly due to the low capacitance of the transistor gate, greatly improving the read speed of RRAM. | 01-08-2015 |
20150016176 | MEMORY STORAGE CIRCUIT AND METHOD OF DRIVING MEMORY STORAGE CIRCUIT - A memory storage circuit includes a volatile memory portion, a control portion, and a non-volatile memory portion. The volatile memory portion includes a first node and a second node to store a pair of complementary logic data. The control portion includes a first transistor and a second transistor. Gate electrodes of the first and second transistors are coupled to receive a store signal, and first electrodes of the first and second transistors are coupled to receive a control signal. The non-volatile memory portion includes a first resistive memory element and a second resistive memory element to store the pair of complementary logic data. The first resistive memory element is coupled between a second electrode of the first transistor and the first node, and the second resistive memory element is coupled between a second electrode of the second transistor and the second node. | 01-15-2015 |
20150016177 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device according to an embodiment comprises: a memory cell array including a plurality of memory cells provided one at each of intersections of a plurality of first lines and a plurality of second lines and each storing data by a data storing state of a filament; and a control circuit configured to execute a write sequence that writes data to the memory cell, the write sequence including: a setting operation that applies a setting pulse having a first polarity to the memory cell; and a removing operation that applies a removing pulse having a second polarity opposite to the first polarity to the memory cell; and the control circuit, during execution of the write sequence, is configured to repeatedly execute the setting operation until the memory cell attains a desired data storing state, and then to execute the removing operation. | 01-15-2015 |
20150016178 | All around electrode for novel 3D RRAM applications - A resistive switching memory device can include three or more electrodes interfacing a switching layer, including a top electrode, a bottom electrode, and a side electrode. The top and bottom electrodes can be used for forming conductive filaments and for reading the memory device. The side electrode can be used to control the resistance state of the switching layer. | 01-15-2015 |
20150023089 | RESISTANCE VARIABLE ELEMENT METHODS AND APPARATUSES - Apparatus and methods are disclosed, including a method that performs a first operation on a first resistance variable element using a common source voltage, a first data line voltage and a first control gate voltage, and then performs a second operation on a second resistance variable element using the common source voltage, a second data line voltage and a second control gate voltage. Additional apparatus and methods are described. | 01-22-2015 |
20150029779 | ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME - This technology provides an electronic device and a method of fabricating the same. An electronic device in accordance with an implementation of this document includes semiconductor memory, and the semiconductor memory includes a lower electrode, a variable resistance element over the lower electrode, an upper electrode disposed over the variable resistance element and including metal, and a metal compound layer configured to surround a side of the upper electrode. The metal compound layer includes a compound of the metal of the upper electrode. | 01-29-2015 |
20150029780 | TWO-TERMINAL REVERSIBLY SWITCHABLE MEMORY DEVICE - A memory using mixed valence conductive oxides is disclosed. The memory includes a mixed valence conductive oxide that is less conductive in its oxygen deficient state and a mixed electronic ionic conductor that is an electrolyte to oxygen and promotes an electric field effective to cause oxygen ionic motion. | 01-29-2015 |
20150036412 | NONVOLATILE MEMORY DEVICE AND SEMICONDUCTOR SYSTEM USING THE SAME - Provided is a nonvolatile memory device including a resistive memory cell and semiconductor system using the same that is capable of setting the reference resistance value using resistance values of a plurality of memory cells. The nonvolatile memory device comprises one or more column lines, two or more row lines, a plurality of memory cells configured to be connected to the column lines and each of the row lines, and a reference resistance setting unit configured to enable a subset or all of the column lines and row lines and to set a reference resistance value. | 02-05-2015 |
20150036413 | RESISTIVE MEMORY ELEMENT BASED ON OXYGEN-DOPED AMORPHOUS CARBON - The present invention is notably directed to a resistive memory element comprising a resistively switchable material coupled to two conductive electrodes, wherein the resistively switchable material is an amorphous compound comprising carbon and oxygen. Moreover, the carbon and oxygen stoichiometric ratio can be within a range of 1:0.30 to 1:0.80. | 02-05-2015 |
20150036414 | SHARED-GATE VERTICAL-TFT FOR VERTICAL BIT LINE ARRAY - A non-volatile storage device comprises: a substrate; a monolithic three dimensional array of memory cells; word lines connected to the memory cells; global bit lines; vertical bit lines connected to the memory cells; and a plurality of double gated vertically oriented select devices. The double gated vertically oriented select devices are connected to the vertical bit lines and the global bit lines so that when the double gated vertically oriented select devices are activated the vertical bit lines are in communication with the global bit lines. Each double gated vertically oriented select device has two gates that are offset from each other with respect to distance to the substrate. Both gates for the double gated vertically oriented select device need be in an “on” condition for the double gated vertically oriented select devices to be activated. | 02-05-2015 |
20150036415 | NON-VOLATILE MEMORY CELL - The invention concerns a memory device comprising: a memory cell having at least one resistive memory element ( | 02-05-2015 |
20150043266 | ENHANCED TEMPERATURE RANGE FOR RESISTIVE TYPE MEMORY CIRCUITS WITH PRE-HEAT OPERATION - Example embodiments include devices, systems, and methods for enhancing an operating temperature range for resistive type memory devices. After powering up the resistive type memory die, the die temperature of the resistive type memory die is sensed. If the sensed die temperature is less than a predefined temperature threshold, one or more heaters proximately disposed to one or more memory cells of the resistive type memory die are enabled. The heaters are disabled responsive to the sensed die temperature being greater than a predefined temperature threshold. Memory write operations are enabled responsive to the sensed die temperature being greater than the predefined temperature threshold. After enabling the memory write operations, an enabled state of the memory write operations is maintained until the resistive type memory die is powered down. If the die temperature happens to fall below the predefined temperature threshold at a later time, additional heat is produced. | 02-12-2015 |
20150043267 | VARIABLE RESISTANCE MEMORY DEVICE AND A VARIABLE RESISTANCE MEMORY SYSTEM INCLUDING THE SAME - A variable resistance memory system includes a variable resistance memory device including a memory cell array including first and second areas; and a memory controller configured to control the variable resistance memory device. The first area includes first variable resistance memory cells including a first variable resistance material layer and the second area includes second variable resistance memory cells including a second variable resistance material layer having a metallic doping concentration higher than a metallic doping concentration of the first variable resistance material layer. The first variable resistance memory cells are used as storage and the second variable resistance memory cells are used as a buffer memory. | 02-12-2015 |
20150043268 | PHASE CHANGE MEMORY DEVICE HAVING MULTI-LEVEL AND METHOD OF DRIVING THE SAME - A phase change memory device having a multi-level and a method of driving the same are presented. The disclosed phase change memory device includes variable resistors and shifting units. The variable resistors are interchanged into set and reset states in response to an applied current. The shifting units, which are connected to the variable resistors, shift resistance distribution in the set and reset state of the variable resistors by a predetermined level. | 02-12-2015 |
20150049536 | ELECTRONIC DEVICE - Provided an electronic device including a semiconductor memory unit. The semiconductor memory unit includes: a plurality of storage cells each including a variable resistance element of which resistance is changed in response to a current flowing across the variable resistance element and a selecting element coupled to one end of the variable resistance element; a plurality of word lines corresponding to the respective storage cells and each coupled to a selecting element of a corresponding storage cell; a first line coupled to one ends of the plurality of storage cells; a second line coupled to the other ends of the plurality of storage cells; a voltage adjuster configured to adjust the voltage levels of back bias voltages of the selecting elements of the plurality of storage cells; and an access control unit electrically coupled to the first and second lines and passing an access current to a selected storage cell among the plurality of storage cells. | 02-19-2015 |
20150049537 | ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME - An electronic device includes a semiconductor device that includes: a substrate including a switching element having a buried gate electrode; a buried decoupling capacitor having a line width same as a line width of the buried gate electrode; and a variable resistance element, electrically coupled to the switching element, formed over the substrate. | 02-19-2015 |
20150049538 | STORAGE CONTROL DEVICE, STORAGE DEVICE, INFORMATION PROCESSING SYSTEM, AND STORAGE CONTROL METHOD - Provided is a storage control device including: a detection unit which detects a first timing for performing a first rewriting process of performing only a first operation from among the first operation and a second operation, in a memory cell array in which each bit transitions to a first storage state by the first operation and transitions to a second storage state by the second operation; and a request unit which makes a request for the first rewriting process with respect to the memory cell array, when the first timing is detected. | 02-19-2015 |
20150055396 | RESISTANCE CHANGE MEMORY - According to one embodiment, a resistance change memory includes a first memory cell, a word line, a first bit line, first and second inverters, first to sixth MOS transistors, and a control circuit. The first transistor is connected to the first output terminal of the first inverter. The second transistor is connected to the second output terminal of the second inverter. The fifth transistor has a first current path whose one end is connected to the first voltage terminal of the first inverter. The sixth transistor has a second current path whose one end is connected to the third voltage terminal of the second inverter. The control circuit makes the first and second transistors a cutoff state by a first signal and makes the fifth and sixth transistors the cutoff state by a second signal in a standby state. | 02-26-2015 |
20150055397 | ELECTRONIC DEVICE - An electronic device including a semiconductor memory. The semiconductor memory includes a bit line; a source line; a plurality of resistive memory cells among which a selected memory cell forms a current path between the bit line and the source line; a read current supply unit configured to supply read current to the bit line in a read operation; a sense amplifier configured to generate read data in response to a voltage level of the bit line in the read operation; and a variable switch element configured to flow current from the source line to a ground terminal in the read operation, and be decreased in its resistance value as a voltage level of the source line is high. | 02-26-2015 |
20150055398 | SEMICONDUCTOR INTEGRATE CIRCUIT - Provided is a semiconductor integrated circuit according to an exemplary aspect of the present invention including a data transmitting circuit that transmits data in parallel through a plurality of signal lines and a data receiving circuit that receives the data. The data transmitting circuit includes a plurality of data output circuits that output the data in a data transmission mode or set an output to a high impedance state in a HiZ mode, a plurality of data selection circuits that select one of the data and fixed data and output the selected data to the data output circuits, and a control circuit that controls the data output circuits to output the fixed data during a period between a time when a mode is switched from the HiZ mode to the data transmission mode and a time when the data output circuits start to output the data. | 02-26-2015 |
20150063002 | MEMORY SYSTEM - A memory system according to the embodiment comprises a cell array including a unit cell array, the unit cell array containing plural first lines, plural second lines intersecting the plural first lines, and plural memory cells provided at the intersections of the plural first lines and the plural second lines and operative to store data in accordance with different resistance states; and an access circuit operative to execute a write sequence of changing the resistance state for writing data in the memory cell, wherein the access circuit, on the write sequence, executes a first step of changing all memory cells provided at the intersections of access first lines and the access and fault second lines to the high resistance state, and a second step of changing all or part of access cells connected to the access second line to the low resistance state. | 03-05-2015 |
20150063003 | SEMICONDUCTOR DEVICE - A semiconductor device including: a resistive memory element; a data line electrically coupled to the resistive memory element; a control line; a power supply line; and a control circuit including a first constant current element, a first transistor, and a second transistor. In the control circuit, the first transistor has a gate coupled to the data line, one of a source and a drain coupled to the first constant current element, and the other one of the source and the drain coupled to the power supply line. The second transistor has a gate coupled to one of the source and the drain of the first transistor, one of a source and a drain coupled to the data line, and the other one of the source and the drain coupled to the control line. | 03-05-2015 |
20150063004 | METHOD AND APPARATUS FOR REFORMING A MEMORY CELL OF A MEMORY - A memory including a memory cell and first and second modules. The memory cell has first and second states, where the second state is different than the first state. The first module, subsequent to an initial forming of the memory cell and subsequent to a read cycle or a write cycle of the memory cell, determines a first difference between the first state and a first predetermined threshold or a second difference between the first state and the second state. The second module, subsequent to the first module determining the first difference or the second difference, reforms the memory cell to reset and increase the first difference or the second difference. The second module, during the reforming of the memory cell, applies a first voltage to the memory cell. The first voltage is greater than a voltage applied to the memory cell during the read cycle or the write cycle. | 03-05-2015 |
20150070965 | FET LOW CURRENT 3D ReRAM NON-VOLATILE STORAGE - Non-volatile storage devices having reversible resistance storage elements are disclosed herein. In one aspect, a memory cell unit includes one or more memory cells and a transistor (e.g., FET) that is used to control (e.g., limit) current of the memory cells. The drain of the transistor may be connected to a first end of the memory cell. If the memory cell unit has multiple memory cells then the drain may be connected to a node that is common to a first end of each of the memory cells. The source of the transistor is connected to a common source line. The gate of the transistor may be connected to a word line. The same word line may connect to the transistor gate of several (or many) different memory cell units. A second end of the memory cell is connected to a bit line. | 03-12-2015 |
20150070966 | METHOD OF OPERATING FET LOW CURRENT 3D RE-RAM - Operating ReRAM memory is disclosed herein. The memory cells may be trained prior to initially programming them. The training may help to establish a percolation path. In some aspects, a transistor limits current of the memory cell when training and programming. A higher current limit is used during training, which conditions the memory cell for better programming. The non-memory may be operated in unipolar mode. The memory cells can store multiple bits per memory cell. A memory cell can be SET directly from its present state to one at least two data states away. A memory cell can be RESET directly to the state having the next highest resistance. Program conditions, such as pulse width and/or magnitude, may depend on the state to which the memory cell is being SET. A higher energy can be used for programming higher current states. | 03-12-2015 |
20150070967 | MEMORY SYSTEM AND METHOD OF MANUFACTURING MEMORY SYSTEM - A memory system according to the embodiment comprises a cell array including plural unit cell arrays stacked, each unit cell array containing plural first lines, plural second lines intersecting the plural first lines, and plural memory cells provided at the intersections of the plural first lines and the plural second lines; and an access circuit operative to write data in the memory cell, wherein the access circuit partly has a first part formed at the same height as that of a certain unit cell array in the stacking direction of the plural unit cell arrays and on the periphery of the certain unit cell array. | 03-12-2015 |
20150070968 | MEMORY DEVICE HAVING A TUNNEL BARRIER LAYER IN A MEMORY CELL, AND ELECTRONIC DEVICE INCLUDING THE SAME - An electronic device includes a semiconductor memory. The semiconductor memory includes a plurality of first lines extending in a first direction, a plurality of second lines extending in a second direction crossing the first direction, a resistance variable layer interposed between the first lines and the second lines, a tunnel barrier layer interposed between the resistance variable layer and the first lines, and an intermediate electrode layer interposed between the resistance variable layer and the tunnel barrier layer. The tunnel barrier layer and the intermediate electrode layer overlap with at least two neighboring intersection regions of the first lines and the second lines. | 03-12-2015 |
20150070969 | RESISTANCE CHANGE TYPE MEMORY - According to one embodiment, a resistance change type memory includes a memory cell including a first resistance change element as a memory element; a reference cell including a second resistance change element and a first element having a resistance value which is not higher than a resistance range of the first and second resistance change elements; and a read circuit including a first input terminal connected to the memory cell, and a second input terminal connected to the reference cell. | 03-12-2015 |
20150070970 | RESISTANCE CHANGE MEMORY AND TEST METHOD OF THE SAME - According to one embodiment, a resistance change memory includes a memory cell array, an address counter, a word line driver, a power supply circuit, and a write driver. Memory cells include resistive storage elements and cell transistors. The power supply circuit generates a stress voltage different from a power supply voltage used to write data into the memory cells in a normal operation. The write driver applies the stress voltage across first bit and source lines to pass a stress current through the memory cell selected by a first word line. The write driver applies the stress voltage across second bit and source lines to pass the stress current through the memory cell selected by a second word line. | 03-12-2015 |
20150070971 | RESISTANCE CHANGE MEMORY - According to one embodiment, a resistance change memory includes the following structure. A memory cell includes a resistance change element and a transistor. A sense amplifier reads data stored in the memory cell. A control circuit controls the reading by the sense amplifier, and outputs a first signal to control the start of precharging of the bit line, a second signal to control a cell current running through the memory cell, and a third signal to control the start of the activation of the sense amplifier. A second word line has an interconnect structure similar to that of the first word line. A monitor circuit detects a first signal delay in the second word line, and outputs the first signal to the sense amplifier in accordance with the first signal delay. | 03-12-2015 |
20150070972 | Memory Sense Amplifiers and Memory Verification Methods - Memory sense amplifiers and memory verification methods are described. According to one aspect, a memory sense amplifier includes a first input coupled with a memory element of a memory cell, wherein the memory element has different memory states at different moments in time, a second input configured to receive a reference signal, modification circuitry configured to provide a data signal at the first input from the memory element having a plurality of different voltages corresponding to respective ones of different memory states of the memory cell at the different moments in time, and comparison circuitry coupled with the modification circuitry and configured to compare the data signal and the reference signal at the different moments in time and to provide an output signal indicative of the memory state of the memory cell at the different moments in time as a result of the comparison to implement a plurality of verify operations of the memory states of the memory cell at the different moments in time. | 03-12-2015 |
20150078063 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device according to an embodiment comprises a memory cell and a control circuit, the control circuit performing write of data to the memory cell. The memory cell includes a second resistance varying layer sandwiched between a first resistance varying layer and a third resistance varying layer. The second resistance varying layer has a resistance value which is smaller than that of the other resistance varying layers. The control circuit applies to the memory cell a first voltage pulse, and then applies to the memory cell a second voltage pulse that has a rise time which is shorter than that of the first voltage pulse. | 03-19-2015 |
20150078064 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF PERFORMING SETTING OPERATION IN SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device comprises: a plurality of first lines; a plurality of second lines extending to intersect the first lines; a plurality of memory cells disposed respectively at intersections of the first and second lines and including a variable resistance element; and a control circuit configured to control a voltage applied to the memory cell. The control circuit is configured able to, during a setting operation that changes the memory cell to a set state, execute the setting operation such that a setting voltage is applied to a selected memory cell connected to a selected first line and a selected second line. The control circuit is configured able to change a voltage application time of the setting voltage according to a state of change of the selected memory cell during the setting operation to execute an additional setting operation that applies the setting voltage to the selected memory cell. | 03-19-2015 |
20150078065 | NON-VOLATILE RESISTIVE MEMORY CELL - The invention more particularly relates to a resistive memory cell comprising a first and a second metal electrodes and a solid electrolyte positioned between the first and the second metal electrodes, with the solid electrolyte comprising a commutation layer in contact with the first electrode and a dielectric layer, with said resistive memory cell being able to be electrically modified so as to switch from a first resistive state to a second resistive state (state LRS) wherein the resistance (R | 03-19-2015 |
20150085558 | DEVICE AND METHOD FOR FORMING RESISTIVE RANDOM ACCESS MEMORY CELL - A device and method for forming resistive random access memory cell are provided. The method includes: providing a first voltage to a first word line connected to a first RRAM cell to form the first RRAM cell; and providing a negative voltage to a second word line connected to a second RRAM cell that shares a first source line and a first bit line with the first RRAM cell. An exemplary device includes: a first RRAM cell, a second RRAM cell, a first voltage source and a charge pump circuit. The first RRAM cell is connected to a first word line. The second RRAM cell is connected to a second word line. The first voltage source provides a first voltage to the first word line to form the first RRAM cell. The charge pump circuit provides a negative voltage to the second word line. | 03-26-2015 |
20150085559 | ELECTRONIC DEVICE AND METHOD FOR FABRICATING THE SAME - According to embodiments, a semiconductor memory may include: a variable resistance pattern disposed over a substrate and extended in a first direction; first and second structures including a plurality of interlayer dielectric layers and a plurality of conductive layers which are alternately stacked over the substrate, and contacted with one side surface and the other side surface of the variable resistance pattern, respectively, wherein the first stacked structure has a line shape extended in a first direction and the second stacked structure has a pillar shape; and a pillar-shaped conductive pattern contacted with one side surface of the second stacked structure, which is not contacted with the variable resistance pattern. | 03-26-2015 |
20150085560 | RERAM MEMORY CONTROL METHOD AND DEVICE - A method of controlling an array of ReRAM cells including programmable-resistance storage elements, including: during a standby period, applying a non-zero standby voltage between electrodes of the storage elements of each cell of the array. | 03-26-2015 |
20150085561 | SEMICONDUCTOR DEVICE AND WRITE METHOD - A semiconductor device includes a memory cell array including a plurality of first and second memory cells each comprising a variable resistance element that establishes an electrical resistance that changes in response to an application of a write voltage after a forming voltage has been applied, the first memory cell to which the forming voltage is applied, and the second memory cell to which the forming voltage is not applied, and the second memory cell being configured to store one of first and second logic values constituting first information, the first and second logic values being different from each other. | 03-26-2015 |
20150085562 | RESISTANCE CHANGE MEMORY - A resistance change memory includes a first conductive line extending in a first direction, a second conductive line extending in a second direction which is crossed to the first direction, a cell unit including a memory element and a rectifying element connected in series between the first and second conductive lines, and a control circuit which is connected to both of the first and second conductive lines. The control circuit controls a voltage to change a resistance of the memory element between first and second values reversibly. The rectifying element is a diode including an anode layer, a cathode layer and an insulating layer therebetween. | 03-26-2015 |
20150092469 | SYSTEM AND METHOD TO TRIM REFERENCE LEVELS IN A RESISTIVE MEMORY - A system and method to trim reference levels in a resistive memory is disclosed. In a particular embodiment, a resistive memory includes multiple sets of reference cells. The resistive memory also includes a reference resistance measurement circuit. A first set of reference cells is accessible by the reference resistance measurement circuit to measure a first effective reference resistance corresponding to the first set of reference cells. A second set of reference cells is accessible by the reference resistance measurement circuit to measure a second effective reference resistance corresponding to the second set of reference cells. The resistive memory also includes a trimming circuit configured to set a reference resistance based on the measured first effective resistance and the measured second effective resistance. | 04-02-2015 |
20150092470 | CONFIGURABLE REFERENCE CURRENT GENERATION FOR NON VOLATILE MEMORY - This disclosure relates to generating a reference current for a memory device. In one aspect, a non-volatile memory device, such as a phase change memory device, can determine a value of a data digit, such as a bit, stored in a non-volatile memory cell based at least partly on the reference current. The reference current can be generated by mirroring a current at a node that is biased by a voltage bias. A configurable resistance circuit can have a resistance that is configurable. The resistance of the configurable resistance circuit can be in series between the node and a resistive non-volatile memory element. In some embodiments, a plurality of non-volatile memory elements can each be electrically connected in series between the resistance of the configurable resistance circuit and a corresponding selector. | 04-02-2015 |
20150092471 | MEMORY CELLS BREAKDOWN PROTECTION - A method is disclosed that includes the operations outlined below. A first voltage is applied to a gate of an access transistor of each of a row of memory cells during a reset operation, wherein a first source/drain of the access transistor is electrically connected to a first electrode of a resistive random access memory (RRAM) device in the same memory cell. An inhibition voltage is applied to a second electrode of the RRAM device or to a second source/drain of the access transistor of each of a plurality of unselected memory cells when the first voltage is applied to the gate of the access transistor. | 04-02-2015 |
20150092472 | ELECTRONIC DEVICES HAVING SEMICONDUCTOR MEMORIES - Provided is an electronic device including a semiconductor memory which includes a cell array region having a first variable resistance element and a peripheral circuit region having a decoupling capacitor, the decoupling capacitor including a bottom electrode, a dielectric layer pattern, and a top electrode. The cell array region may include: a first gate; a first contact over the first gate; a second contact over an active region at one side of the first gate; and the first variable resistance element over the second contact, and the peripheral circuit region may include: a second gate formed of the same material at the same level as the first gate; the bottom electrode disposed over the second gate and formed at the same level as the first contact; and the dielectric layer pattern and the top electrode disposed over the bottom electrode. | 04-02-2015 |
20150092473 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device according to an embodiment includes: a memory cell array including a plurality of first lines, a plurality of second lines, and memory cells disposed at each of intersections of the first lines and the second lines; and a control circuit configured to apply a first voltage to a selected first line, apply a second voltage having a voltage value which is smaller than that of the first voltage to a selected second line, and apply a third voltage and a fourth voltage to a non-selected first line and a non-selected second line, respectively. The control circuit is configured to apply a fifth voltage to one of the non-selected first lines that is adjacent to the selected first line, and apply a sixth voltage to one of the non-selected second lines that is adjacent to the selected second line. | 04-02-2015 |
20150092474 | RESISTIVE MEMORY DEVICE, METHOD OF FABRICATING THE SAME, AND MEMORY APPARATUS AND DATA PROCESSING SYSTEM HAVING THE SAME - A resistive memory device capable of implementing a multi-level cell, a method of fabricating the same, and a memory apparatus and data processing system including the same are provided. The resistive memory device includes a lower electrode, a first phase-change material layer formed over the lower electrode, a second phase-change material layer formed to surround an outer sidewall of the first phase-change material layer, and an upper electrode formed over the first phase-change material layer and the second phase-change material layer. | 04-02-2015 |
20150098264 | RESISTIVE MEMORY APPARATUS, OPERATING METHOD THEREOF, AND SYSTEM HAVING THE SAME - A resistive memory apparatus includes a memory unit including a resistive memory cell array, a voltage generation unit suitable for receiving a radio frequency (RF) signal, and converting the RF signal into a direct current (DC) voltage, and a control unit suitable for controlling a refresh operation to be performed on the resistive memory cell array, wherein the boosted DC voltage is used as an operation voltage for the refresh operation. | 04-09-2015 |
20150098265 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device according to an embodiment includes a control circuit configured to cause data to be stored in a memory cell by setting the memory cell to be included in one of resistance value distributions. The control circuit is configured to set a first resistance value distribution and a second resistance value distribution, the second resistance value distribution having a resistance value larger than that of the first resistance value distribution, and to set a second width to be larger than a first width, the second width being a width between a second upper limit value of the second resistance value distribution and a second lower limit value of the second resistance value distribution, and the first width being a width between a first upper limit value of the first resistance value distribution and a first lower limit value of the first resistance value distribution. | 04-09-2015 |
20150103581 | MEMORY DEVICE, METHOD OF CONTROLLING MEMORY DEVICE, AND MEMORY SYSTEM - A memory device according to an embodiment comprises a data processing circuit that includes: a data write pre-processing circuit that processes input data to generate first intermediate data; a data write processing circuit that sequentially sets a voltage difference between a selected row line and a selected global bit line based on the first intermediate data; a data read processing circuit that detects a current flowing in the selected global bit line or a voltage of the selected global bit line and sequentially generates second intermediate data from a result of that detection; and a data read post-processing circuit that processes the second intermediate data to generate output data, the data write pre-processing circuit and the data read post-processing circuit having a correcting function that corrects a difference that may occur between the input data and the output data. | 04-16-2015 |
20150103582 | SEMICONDUCTOR MEMORY DEVICE - This semiconductor memory device comprises a memory cell array that includes: a plurality of first lines; a plurality of second lines intersecting the plurality of first lines; a plurality of memory cells each disposed at an intersection of the plurality of first lines and the plurality of second lines and including a variable resistance element; and a select transistor respectively connected to an end of the plurality of first lines. The select transistor includes a gate electrode, a gate insulating film, and a conductive layer. Moreover, one end of that conductive layer is connected to the end of the first line, and a non-linear resistance layer configured from a non-linear material is connected between the first line and the conductive layer. | 04-16-2015 |
20150103583 | VARIABLE RESISTANCE ELEMENT, SEMICONDUCTOR DEVICE HAVING VARIABLE RESISTANCE ELEMENT, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND PROGRAMMING METHOD USING VARIABLE RESISTANCE ELEMENT - This variable resistance element is provided with a variable resistance film, a first electrode, which is disposed in contact with one surface of the variable resistance film, and a second electrode, which is disposed in contact with the other surface of the variable resistance film. The first and the second electrodes have corner portions, respectively, and the distance between the corner portions of the first and the second electrodes is set equal to the shortest distance between the first and the second electrodes. Furthermore, the variable resistance element has a third electrode, which is disposed on the one surface of the variable resistance film. | 04-16-2015 |
20150109849 | DEVICE AND METHOD FOR SETTING RESISTIVE RANDOM ACCESS MEMORY CELL - A device and method for setting a resistive random access memory cell are provided. An exemplary method includes: providing a set current to a bit line of the RRAM cell by a current source. An exemplary device includes: a first RRAM cell and a current source. The first RRAM cell is connected to a first word line. The current source selectively connected to the first bit line. The current source selectively provides a current to the first bit line of the first RRAM cell to set the first RRAM cell. | 04-23-2015 |
20150109850 | MEMORY DEVICES - A device is disclosed that includes an I/O memory block. The I/O memory block includes memory cells, bit lines and a source line. The number of the formed bit lines is at least 4. The bit lines and the source line are electrically connected to the memory cells. In the I/O memory block, the source line and the bit lines are configured to provide logical data to the memory cells. | 04-23-2015 |
20150109851 | MEMORY DEVICE AND ACCESS METHOD - A memory device includes multiple bit lines extending in a first direction, multiple word lines extending in a second direction crossing the first direction, and multiple memory cells each coupled to corresponding two word lines and corresponding two bit lines. Each memory cell includes a memory element configured to store information on the basis of changes in resistance and two select transistors. One terminal of the memory element is coupled to one of the two bit lines corresponding to the memory cell; the other terminal is coupled to respective drains of the select transistors; respective sources of the select transistors are coupled to the other bit line; a gate of one of the select transistors is coupled to one of the two word lines corresponding to the memory cell; and a gate of the other is coupled to the other word line. | 04-23-2015 |
20150117086 | WRITE PULSE WIDTH SCHEME IN A RESISTIVE MEMORY - A resistive memory array includes a controller, a test reset driver coupled to the controller, a test write driver also coupled to the controller, and a test read sense amplifier also coupled to the controller. The resistive memory array also includes a set of test resistive memory elements representing a resistive memory macro. The test resistive memory elements are coupled to the test reset driver, the test write driver and the test read sense amplifier. A change in the state of one of the test resistive memory elements represents a change in the state of a set of corresponding elements in the resistive memory macro. | 04-30-2015 |
20150117087 | SELF-TERMINATING WRITE FOR A MEMORY CELL - A programmable impedance based memory device includes a programmable impedance element, read circuitry configured to determine a resistance of the programmable impedance element during a write operation; and, write circuitry configured to change the resistance of the programmable impedance element as part of performing the write operation, wherein the write circuitry is further configured to terminate the write operation based on the read circuitry detecting that the resistance of the programmable impedance element has passed a threshold value. | 04-30-2015 |
20150117088 | NON-VOLATILE MEMORY DEVICE - According to one embodiment, a non-volatile memory device includes: first memory cell regions including first wirings extending in a first direction, second wirings extending in a second direction crossing the first direction, and first memory cells provided between the first wirings and the second wirings and being capable of changing resistance state; and second memory cell regions including third wirings extending in the first direction, fourth wirings extending in the second direction crossing the first direction, and second memory cells provided between the third wirings and the fourth wirings and being capable of changing resistance state, the second memory cell region having a smaller area than the first memory cell region in top view. | 04-30-2015 |
20150117089 | SEMICONDUCTOR MEMORY DEVICE AND MEMORY SYSTEM - A semiconductor memory device according to an embodiment includes a memory cell array and a control circuit. The memory cell array includes first lines and second lines intersecting each other, a third line commonly connecting to the first lines, memory cells disposed at intersections of the first lines and the second lines, respectively. The control circuit is configured to execute a state determining operation detecting a voltage of the third line, and adjust a voltage applied to the first lines and the second lines during a resetting operation or a setting operation based on a result of the state determining operation. The resetting operation raises a resistance value of the variable resistance element. The setting operation lowers the resistance value of the variable resistance element. | 04-30-2015 |
20150117090 | THREE-TERMINAL SYNAPSE DEVICE AND METHOD OF OPERATING THE SAME - A three-terminal synapse device may include a drain layer formed on a substrate, a gate layer formed on the drain layer, a source layer vertically stacked on the substrate and facing the drain layer and the gate layer. First and second vertical insulating layers may be formed between the source layer and a stack including the drain layer and the gate layer. The first and second vertical insulating layers have different ion mobilities from each other. The first and second vertical insulating layers may cover side surfaces of the drain layer and the gate layer. The ion mobility of the second vertical insulating layer may be greater than that of the first vertical insulating layer. | 04-30-2015 |
20150124515 | NONVOLATILE MEMORY DEVICE AND METHOD FOR TESTING NONVOLATILE MEMORY DEVICE USING VARIABLE RESISTANCE MATERIAL - A method for testing a nonvolatile memory device includes: monitoring a first resistance dispersion and a second resistance dispersion of a nonvolatile memory device, determining a lower test bias level and an upper test bias level that are disposed on opposite sides of a reference bias level, calculating the number of first fail bits generated in the first resistance dispersion based on the lower test bias level and the number of second fail bits generated in the second resistance dispersion based on the upper test bias level, determining a selected reference bias level using the number of the first fail bits and the number of the second fail bits, and trimming the reference bias level to the selected bias level. | 05-07-2015 |
20150124516 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device according to an embodiment includes a memory cell array including memory cells, the memory cells each configured having a current rectifier element and a variable resistance element connected in series therein. Each of the memory cells has formed on a side surface thereof: a first insulating film provided on a side surface of the current rectifier element and the variable resistance element and having a composition ratio of a non-silicon element to silicon which is a first value; a silicon oxide film provided on a side surface of the first insulating film; and a second insulating film provided on a side surface of the silicon oxide film and having a composition ratio of a non-silicon element to silicon which is a second value. The first value is smaller than the second value. | 05-07-2015 |
20150124517 | APPARATUS AND METHODS FOR FORMING A MEMORY CELL USING CHARGE MONITORING - Apparatus and methods of forming a memory cell are described. In one such method, a forming charge applied to a memory cell, such as a Resistive RAM (RRAM) memory cell, is monitored to determine the progress of the forming the cell. If the cell is consuming charge too slowly, a higher voltage can be applied. If the cell is consuming charge too quickly, a lower voltage can be applied. The charge may be monitored by charging a capacitor to a certain level, then monitoring the discharge rate of the capacitor though the cell. The monitoring may use comparators to measure the charge. The monitoring may also use an analog to digital converter to perform the monitoring. | 05-07-2015 |
20150124518 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device comprises a cell array including a plurality of first lines, a plurality of second lines intersecting the plurality of first lines, and a plurality of memory cells arranged in matrix and connected at intersections of the first and second lines between both lines, each memory cell containing a serial circuit of an electrically erasable programmable variable resistive element of which resistance is nonvolatilely stored as data and a non-ohmic element; and a plurality of access circuits operative to simultaneously access the memory cells physically separated from each other in the cell array. | 05-07-2015 |
20150124519 | CIRCUITRY INCLUDING RESISTIVE RANDOM ACCESS MEMORY STORAGE CELLS AND METHODS FOR FORMING SAME - A method of forming a circuitry includes providing a substrate comprising a plurality of die. Each die includes a plurality of resistive random access memory (RRAM) storage cells. The method further includes concurrently initializing substantially all of the RRAM storage cells on the same wafer. Initializing can include applying a voltage potential across the RRAM storage cells. | 05-07-2015 |
20150124520 | RESISTIVE RANDOM ACCESS MEMORY CELL STRUCTURE WITH REDUCED PROGRAMMING VOLTAGE - A cell of a resistive random access memory including (i) a resistive element and (ii) a switch. The resistive element includes (i) a first electrode, and (ii) a second electrode. The switch includes (i) a first terminal connected to a first contact, and (i) a second terminal connected to a second contact. The second contact is connected to the second electrode of the resistive element via a third contact. The third contact has a shape including a first surface and a second surface that is opposite to the first surface. The shape of the third contact tapers inward from the first surface towards the second surface. | 05-07-2015 |
20150131360 | VERTICAL 1T-1R MEMORY CELLS, MEMORY ARRAYS AND METHODS OF FORMING THE SAME - Vertical 1T-1R memory cells, memory arrays of vertical 1T-1R memory calls, and methods of forming such memory cells and memory arrays are described. The memory cells each include a vertical transistor and a resistivity-switching element coupled in series with and disposed above or below the vertical transistor. The vertical transistor includes a controlling electrode coupled to a word line that is above or below the vertical transistor. The controlling electrode is disposed on a sidewall of the vertical transistor. Each vertical transistor includes a first terminal coupled to a bit line, a second terminal comprising the controlling electrode coupled to a word line, and a third terminal coupled to the resistivity-switching element. | 05-14-2015 |
20150131361 | MEMORY DEVICE - A device includes a storage region, and a resistive-read-access-memory-based (RRAM-based or ReRAM-based) non-volatile storage array is disclosed herein. The storage region includes a first storage array and a second storage array. The first storage array includes a plurality of first storage cells. The second storage array includes a plurality of second storage cells. The second storage cells are configured to be in place of the first storage cells. The RRAM-based non-volatile storage array is configured to record at least one corresponding relationship between the first storage cells and the second storage cells. | 05-14-2015 |
20150131362 | MEMORY CELLS WITH RECTIFYING DEVICE - Memory devices and methods described are shown that provide improvements, including improved cell isolation for operations such as read and write. Further, methods and devices for addressing and accessing cells are shown that provide a simple and efficient way to manage devices with multiple cells associated with each access transistor. Examples of multiple cell devices include phase change memory devices with multiple cells associated with each access transistor. | 05-14-2015 |
20150131363 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE INCLUDING VARIABLE RESISTANCE ELEMENT - According to one embodiment, a nonvolatile semiconductor memory device includes a memory cell array and a control circuit. The memory cell array include the memory cells each including a variable resistance element in which a reset current flowing in a reset operation is smaller than a set current flowing in a set operation by not less than one order of magnitude. The control circuit performs the reset operation and the set operation for the memory cells. The control circuit performs the reset operation for all memory cells being in the low resistance state and connected to selected first interconnections and selected second interconnections. | 05-14-2015 |
20150138871 | MEMORY STRUCTURE AND OPERATION METHOD THEREFOR - Provided is an operation method applicable to a resistive memory cell including a transistor and a resistive memory element. The operation method includes: in a programming operation, generating a programming current flowing through the transistor and the resistive memory element so that a resistance state of the resistive memory element changes from a first resistance state into a second resistance state; and in an erase operation, generating an erase current from a well region of the transistor to the resistive memory element but keeping the erase current from flowing through the transistor, so that the resistance state of the resistive memory element changes from the second resistance state into the first resistance state. | 05-21-2015 |
20150138872 | ELECTRONIC DEVICE INCLUDING A MEMORY AND METHOD FOR FABRICATING THE SAME - An electronic device includes a semiconductor memory unit. The semiconductor memory unit includes first lines extending along a first direction; second lines extending along a second direction that intersects with the first direction; a silicon-added metal oxide layer disposed in each intersection region of the first lines and the second lines; a metal oxide layer that is disposed alternately with the silicon-added metal oxide layer in the first direction and that is disposed in a region between two adjacent second lines and over a corresponding one of the first lines over which the silicon-added metal oxide layer is disposed; and a silicon oxide layer that is disposed alternately with the silicon-added metal oxide layer in the second direction and that is disposed in a region between two first lines and under a corresponding one of the second lines under which the silicon-added metal oxide layer is disposed. | 05-21-2015 |
20150138873 | SILICON BASED NANOSCALE CROSSBAR MEMORY - The present application describes a crossbar memory array. The memory array includes a first array of parallel nanowires of a first material and a second array of parallel nanowires of a second material. The first and the second array are oriented at an angle with each other. The array further includes a plurality of nanostructures of non-crystalline silicon disposed between a nanowire of the first material and a nanowire of the second material at each intersection of the two arrays. The nanostructures form a resistive memory cell together with the nanowires of the first and second materials. | 05-21-2015 |
20150138874 | ARRAY VOLTAGE REGULATING TECHNIQUE TO ENABLE DATA OPERATIONS ON LARGE MEMORY ARRAYS WITH RESISTIVE MEMORY ELEMENTS - Embodiments of the invention relate generally to semiconductors and memory technology, and more particularly, to systems, integrated circuits, and methods to preserve states of memory elements in association with data operations using variable access signal magnitudes for other memory elements, such as implemented in third dimensional memory technology. In some embodiments, a memory device can include a cross-point array with resistive memory elements. An access signal generator can modify a magnitude of a signal to generate a modified magnitude for the signal to access a resistive memory element associated with a word line and a subset of bit lines. A tracking signal generator is configured to track the modified magnitude of the signal and to apply a tracking signal to other resistive memory elements associated with other subsets of bit lines, the tracking signal having a magnitude at a differential amount from the modified magnitude of the signal. | 05-21-2015 |
20150138875 | STABILIZATION OF RESISTIVE MEMORY - The present disclosure includes apparatuses and methods including stabilization of resistive memory. A number of embodiments include applying a programming signal to a resistive memory cell, wherein the programming signal includes a first portion having a first polarity and a second portion having a second polarity, wherein the second polarity is opposite the first polarity. | 05-21-2015 |
20150146472 | Memory Systems and Memory Programming Methods - Memory systems and memory programming methods are described. According to one aspect, a memory system includes program circuitry configured to provide a program signal to a memory cell to program the memory cell from a first memory state to a second memory state, detection circuitry configured to detect the memory cell changing from the first memory state to the second memory state during the provision of the program signal to the memory cell to program the memory cell, and wherein the program circuitry is configured to alter the program signal as a result of the detection and to provide the altered program signal to the memory cell to continue to program the memory cell from the first memory state to the second memory state. | 05-28-2015 |
20150146473 | RESISTIVE MEMORY APPARATUS AND WRITE-IN METHOD THEREOF - A resistive memory apparatus and a write-in method thereof are provided. The memory controller provides unselected bit-lines and unselected word-lines both not coupled to a selected resistive memory cell respectively with a first bit-line voltage and a first word-line voltage in one of a setting duration and a resetting duration, wherein the first bit-line voltage is equal to a product of a writing-in voltage V | 05-28-2015 |
20150146474 | MEMORY DEVICE AND METHOD OF CONTROLLING MEMORY DEVICE - According to one embodiment, a memory device includes a plurality of global column lines arranged in parallel and extending in a first direction; a plurality of row lines extending in a second direction which is perpendicular to the first direction; a plurality of column lines in a two-dimensional arrangement, which extend in a third direction which is perpendicular to the first direction and the second direction; and a memory cell array including a plurality of memory cells arranged at intersections between the row lines and the column lines. | 05-28-2015 |
20150294704 | ELECTRONIC DEVICE - Provided is an electronic device including a semiconductor memory unit. The semiconductor memory unit may include one or more storage cells for storing data, and each of the storage cells includes: a first resistance variable element having a first resistance value when a first value is stored therein, and having a second resistance value when a second value is stored therein; and a second resistance variable element having the second resistance value when the first value is stored therein, and having the first resistance value when the second value is stored therein. | 10-15-2015 |
20150294705 | ELECTRONIC DEVICE - A semiconductor memory unit includes first to N | 10-15-2015 |
20150294719 | NON-VOLATILE MEMORY SYSTEM WITH RESET VERIFICATION MECHANISM AND METHOD OF OPERATION THEREOF - A method of operation of a non-volatile memory system includes: providing a resistive storage element having a high resistance state and a low resistance state; coupling an analog multiplexer to the resistive storage element for applying a bias voltage; and switching between a verification bias and a read bias through the analog multiplexer for increasing a read margin between the high resistance state and the low resistance state. | 10-15-2015 |
20150302923 | GLOBAL BIT LINE PRE-CHARGE CIRCUIT THAT COMPENSATES FOR PROCESS, OPERATING VOLTAGE, AND TEMPERATURE VARIATIONS - A memory array includes wordlines, local bitlines, two-terminal memory elements, global bitlines, and local-to-global bitline pass gates and gain stages. The memory elements are formed between the wordlines and local bitlines. Each local bitline is selectively coupled to an associated global bitline, by way of an associated local-to-global bitline pass gate. During a read operation when a memory element of a local bitline is selected to be read, a local-to-global gain stage is configured to amplify a signal on or passing through the local bitline to an amplified signal on or along an associated global bitline. The amplified signal, which in one embodiment is dependent on the resistive state of the selected memory element, is used to rapidly determine the memory state stored by the selected memory element. The global bit line and/or the selected local bit line can be biased to compensate for the Process Voltage Temperature (PVT) variation. | 10-22-2015 |
20150302925 | ELECTRONIC DEVICE INCLUDING SEMICONDUCTOR MEMORY AND OPERATION METHOD THEREOF - Disclosed is an electronic device including a semiconductor memory. The semiconductor memory includes a bit line, a source line, a plurality of resistive memory cells among which a selected resistive memory cell forms a current path between the bit line and the source line, a sense amplifier suitable for sensing data of the bit line in an active operation, a latch suitable for latching data sensed by the sense amplifier in the active operation, a write control unit suitable for comparing data latched in the latch with write data in a write operation, and a write driver suitable for driving the bit line and the source line based on a comparison result of the write control unit and the write data in the write operation. | 10-22-2015 |
20150310910 | Multi-Level Memory Array Having Resistive Elements for Multi-Bit Data Storage - A resistor array for multi-bit data storage without the need to increase the size of a memory chip or scale down the feature size of a memory cell contained within the memory chip is provided. The resistor array incorporates a number of discrete resistive elements to be selectively connected, in different series combinations, to at least one memory cell or memory device. In one configuration, by connecting each memory cell or device with at least one resistor array, a resistive switching layer found in the resistive switching memory element of the connected memory device is capable of being at multiple resistance states for storing multiple bits of digital information. During device programming operations, when a desired series combination of the resistive elements within the resistor array is selected, the resistive switching layer in the connected memory device can be in a desired resistance state. | 10-29-2015 |
20150310912 | ELECTRONIC DEVICE - An electronic device includes semiconductor memory, which includes a memory cell block including first and second cell arrays and a column control block. The first cell array includes a word line, a first bit line, and a first variable resistance layer disposed between the word line and the first bit line. The second cell array includes the word line, a second bit line crossing the word line and the first bit line, and a second variable resistance layer disposed between the word line and the second bit line. The first and second variable resistance layers include different materials. The column control block supplies a first write bias for switching a resistance state of the first variable resistance layer to the first bit line and a second write bias for switching a resistance state of the second variable resistance layer to the second bit line. | 10-29-2015 |
20150310915 | Memory Cell Retention Enhancement Through Erase State Modification - A method of controlling a resistive memory cell is provided. A resistance threshold value is defined for the memory cell, wherein a circuit identifies the cell as erased if a detected resistance of the cell is above the resistance threshold and identifies the cell as programmed if the detected resistance is below the resistance threshold value. A filament is formed across an electrolyte switching region of the cell by applying an electrical charge, wherein the cell having the formed filament has a first resistance. The cell is then erased to an erased state having a second resistance greater than the first resistance. The cell is then programmed to a quasi-erased state having a third resistance between the first and second resistances, and above the resistance threshold value such that the cell is identified by the circuit as erased. The cell may then be maintained in the quasi-erased state. | 10-29-2015 |
20150318039 | NONVOLATILE MEMORY APPARATUS - A nonvolatile memory apparatus includes a sensing voltage generation unit, a memory cell, a current copy unit and a data sensing unit. The sensing voltage generation unit provides a sensing voltage with a constant level, to a sensing node. The memory cell receives the sensing voltage from the sensing node. The current copy unit generates copied current with substantially the same magnitude as sensing current which flows through the memory cell. The data sensing unit senses the copied current and generates a multi-bit data output signal. | 11-05-2015 |
20150318041 | RESISTIVE RAM, METHOD FOR FABRICATING THE SAME, AND METHOD FOR DRIVING THE SAME - A resistive random access memory (ReRAM) includes a first electrode, a threshold switching layer formed over the first electrode and configured to perform a switching operation according to an applied voltage, a resistance change layer formed over the threshold switching layer, and configured to perform a resistance change operation, and a second electrode formed over the resistance change layer, wherein the threshold switching layer comprises a stoichiometric transition oxide while the resistance change layer comprises a non-stoichiometric transition metal oxide. | 11-05-2015 |
20150318471 | STORAGE DEVICE AND STORAGE UNIT - There are provided a storage device and a storage unit capable of improving retention performance of an intermediate resistance value in writing at a low current, and a storage device and a storage unit capable of reducing random telegraph noise. A storage device of one embodiment of the present technology includes a first electrode, a storage layer, and a second electrode in this order, and the storage layer includes: an ion source layer including one or more kinds of chalcogen elements selected from tellurium (Te), sulfur (S), and selenium (Se), and one or more kinds of transition metal elements selected from Group 4 elements, Group 5 elements, and Group 6 elements of the periodic table; and a resistance change layer including boron (B) and oxygen (O). A storage device of another embodiment of the present technology includes the above-described ion source layer and a resistance change layer including one or more kinds of transaction metal elements selected from Group 4 elements, Group 5 elements, and Group 6 elements of the periodic table, and oxygen (O). | 11-05-2015 |
20150325289 | APPARATUSES AND METHODS FOR BI-DIRECTIONAL ACCESS OF CROSS-POINT ARRAYS - The disclosed technology generally relates to apparatuses and methods of operating the same, and more particularly to cross point memory arrays and methods of accessing memory cells in a cross point memory array. In one aspect, an apparatus comprises a memory array. The apparatus further comprises a memory controller configured to cause an access operation, where the access operation includes application of a first bias across a memory cell of the memory array for a selection phase of the access operation and application of a second bias, lower in magnitude than the first bias, across the memory cell for an access phase of the access operation. The memory controller is further configured to cause a direction of current flowing through the memory cell to be reversed between the selection phase and the access phase. | 11-12-2015 |
20150325290 | DATA OPERATIONS IN NON-VOLATILE MEMORY - A method includes receiving an in-place refresh command to refresh data at a particular location in a non-volatile memory. The method also includes re-writing the data into the particular location of the non-volatile memory to refresh the data at the particular location in response to the in-place refresh command. | 11-12-2015 |
20150325294 | RESISTIVE MEMORY AND ASSOCIATED OPERATION METHOD - A resistive memory includes a resistive memory cell, a main transistor and an auxiliary transistor. The drain of the main transistor and the drain of the auxiliary transistor are coupled to one end of the resistive memory cell. When the resistive memory cell is programmed, the main transistor is turned on and the auxiliary transistor is turned off. When the resistive memory cell is erased, the main transistor and the auxiliary transistor are turned on. | 11-12-2015 |
20150325296 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE - A nonvolatile semiconductor memory device according to an embodiment comprises: a memory cell array including a plurality of memory cells provided one at each of intersections of a plurality of first lines and a plurality of second lines and each storing data by a data storing state of a filament; and a control circuit configured to execute a write sequence that writes data to the memory cell, the write sequence including: a setting operation that applies a setting pulse having a first polarity to the memory cell; and a removing operation that applies a removing pulse having a second polarity opposite to the first polarity to the memory cell; and the control circuit, during execution of the write sequence, is configured to repeatedly execute the setting operation until the memory cell attains a desired data storing state, and then to execute the removing operation. | 11-12-2015 |
20150332745 | STORAGE DEVICE, MEMORY CELL, AND DATA WRITING METHOD - A memory cell ( | 11-19-2015 |
20150332761 | MEMORY DEVICE AND METHOD OF CONTROLLING MEMORY DEVICE - According to one embodiment, a memory device includes a plurality of global column lines arranged in parallel and extending in a first direction; a plurality of row lines extending in a second direction which is perpendicular to the first direction; a plurality of column lines in a two-dimensional arrangement, which extend in a third direction which is perpendicular to the first direction and the second direction; and a memory cell array including a plurality of memory cells arranged at intersections between the row lines and the column lines. | 11-19-2015 |
20150332763 | RESISTIVE MEMORY STRUCTURE FOR SINGLE OR MULTI-BIT DATA STORAGE - A resistive memory structure comprises at least one resistive memory element configured to store one or more bits of data and a circuit electrically connected to the resistive memory element for use in performing at least one of a read or write operation on the at least one resistive memory element. The circuit includes a resistor electrically connected in series to the resistive memory element thereby forming a voltage divider and electrical node therebetween, and an interpretation circuit electrically connected to the electrical node formed between the resistive memory element and the resistor. The interpretation circuit is configured to interpret a voltage at the electrical node and to determine a resistive state of the resistive memory element based on the voltage at the electrical node. | 11-19-2015 |
20150332764 | METHOD FOR DETERMINING PROGRAMMING PARAMETERS FOR PROGRAMMING A RESISTIVE RANDOM ACCESS MEMORY - A method for determining programming parameters for programming a resistive random access memory switching from an OFF state to an ON state, the method including determining retention curves representing the increase in the ON state resistance as a function of time, for a given programming temperature and a given current limitation; determining a retention failure time for each of the retention curves; determining curves representing the decrease in the retention failure time as a function of the programming temperature, for a given current limitation; for at least one given programming temperature, determining, from the curves representing the decrease in the retention failure time, a current limiting value to be applied to the resistive random access memory in order to obtain a target retention failure time. | 11-19-2015 |
20150332765 | MEMORY DEVICE, METHOD OF CONTROLLING MEMORY DEVICE, AND MEMORY SYSTEM - A memory device according to an embodiment comprises a data processing circuit that includes: a data write pre-processing circuit that processes input data to generate first intermediate data; a data write processing circuit that sequentially sets a voltage difference between a selected row line and a selected global bit line based on the first intermediate data; a data read processing circuit that detects a current flowing in the selected global bit line or a voltage of the selected global bit line and sequentially generates second intermediate data from a result of that detection; and a data read post-processing circuit that processes the second intermediate data to generate output data, the data write pre-processing circuit and the data read post-processing circuit having a correcting function that corrects a difference that may occur between the input data and the output data. | 11-19-2015 |
20150332791 | ELECTRONIC DEVICE AND METHOD FOR OPERATING ELECTRONIC DEVICE - An electronic device comprising a semiconductor memory unit that may include a plurality of data transfer lines; a plurality of columns including a plurality of memory cells; at least one redundancy column including a plurality of redundancy memory cells and configured to replace at least one column among the plurality of columns; a repair select information generation unit configured to store a column address of the at least one column to be replaced among the plurality of columns and generate a plurality of repair select information in response to the stored column address; and a plurality of repair selection units connected with data transfer lines corresponding to them among the plurality of data transfer lines, columns corresponding to them among the plurality of columns and the at least one redundancy column, and each configured to electrically connect a column selected among a column corresponding to it and the at least one redundancy column, to a data transfer line corresponding to it, in response to repair select information corresponding to it among the plurality of repair select information. | 11-19-2015 |
20150340087 | NONVOLATILE RANDOM ACCESS MEMORY - According to one embodiment, a resistance change memory includes the following configuration. A first inverter includes first input and first output terminals and first and second voltage terminals. A second inverter includes second input and second output terminals and third and fourth voltage terminals. The second input terminal is connected to the first output terminal. The second output terminal is connected to the first input terminal. First and second transistors are connected to the first and second output terminals, respectively. Third and fourth transistors are connected to the first and third voltage terminals, respectively. A fifth transistor is connected between the first voltage terminal and the first memory cell. A sixth transistor is connected to the third voltage terminal. A controller turns on the first and second transistors, after turning off the fifth and sixth transistors. | 11-26-2015 |
20150340090 | NON-VOLATILE SRAM WITH MULTIPLE STORAGE STATES - Technologies are generally described herein for a non-volatile static random access memory device with multiple storage states. In some examples, the multi-storage state non-volatile random access memory device has two or more memory cells. Each memory cell may include a pair of programmable resistive devices that may be dynamically programmed to configure the memory cell in a particular logic state. | 11-26-2015 |
20150340187 | ELECTRICALLY RESETTABLE FUSE DEVICE - An integrated circuit is provided that includes an electrically resettable fuse device. The electrically resettable fuse device has a plurality of resettable fuse modules coupled in parallel. Each resettable fuse module including a fuse element characterized by a first and a second impedance states. The plurality of resettable fuse modules are configured such that when the fuse element is in the first impedance state, and a current flowing through each fuse element in a first direction exceeds a current limit, the fuse element enters into the second impedance state. When the fuse element is in the second impedance state and, in response to a global reset signal and a local reset signal, a current is applied to the fuse element in a second direction opposite the first direction, the fuse element is reset to the first impedance state. | 11-26-2015 |
20150347896 | ELECTRONIC COMPARISON SYSTEMS - An electronic comparison system includes input stages that successively provide bits of code words. One-shots connected to respective stages successively provide a first bit value until receiving a bit having a non-preferred value concurrently with an enable signal, and then provide a second, different bit value. An enable circuit provides the enable signal if at least one of the one-shots is providing the first bit value. A neural network system includes a crossbar with row and column electrodes and resistive memory elements at their intersections. A writing circuit stores weights in the elements. A signal source applies signals to the row electrodes. Comparators compare signals on the column electrodes to corresponding references using domain-wall neurons and store bit values in CMOS latches by comparison with a threshold. | 12-03-2015 |
20150348623 | APPARATUSES AND METHODS FOR DETECTING WRITE COMPLETION FOR RESISTIVE MEMORY - Described are apparatuses and methods for improving resistive memory energy efficiency and reliability. An apparatus may include a resistive memory cell coupled to a conductive line. The apparatus may further include a driver coupled to the conductive line to drive current for the resistive memory cell during a write operation. The resistance of the driver may be selectively increased for two or more time periods during the write operation for detecting a voltage change on the conductive line. The current for the write operation may be turned off when the voltage change is detected to improve resistive memory energy efficiency and reliability. | 12-03-2015 |
20150348624 | METHOD FOR IMPROVING SENSING MARGIN OF RESISTIVE MEMORY - A method in a resistive memory device includes configuring two or more memory cells in a column of the array sharing the same bit line and the same source line to operate in parallel as a merged memory cell; programming the resistance of the merged memory cell in response to the write data, the resistance of the two or more resistive memory cells in the merged memory cell being programmed simultaneously; and reading the programmed resistance value of the merged memory cell, the programmed resistance of the two or more memory cells in the merged memory cell being read simultaneously. | 12-03-2015 |
20150348625 | RESISTANCE CHANGE TYPE MEMORY - A resistance change type memory includes a memory cell including a first resistance change element as a memory element; a reference cell including a second resistance change element and a first element having a resistance value which is not higher than a resistance range of the first and second resistance change elements; and a read circuit including a first input terminal connected to the memory cell, and a second input terminal connected to the reference cell. | 12-03-2015 |
20150349026 | ELECTRONIC MEMORY USING MEMRISTORS AND CROSSBARS - A memory system comprising a plurality of layers of spaced-apart row electrodes, each having a dorsal and a ventral side, a plurality of layers of spaced-apart column electrodes, each having a dorsal and a ventral side is, and a plurality of layers of spaced-apart memristors arranged so that each of the row electrodes and each of the column electrodes is in contact with at least one memristor on the dorsal side thereof and with at least one memristor on the ventral side thereof. | 12-03-2015 |
20150357033 | ACCESSING A RESISTIVE MEMORY STORAGE DEVICE - Embodiments of the present disclosure describe a device and methods of accessing the device. The device can include a plurality of memory cells, each cell including a plurality of resistive memory components each designed to store data as resistance and an access transistor configured to control access to the plurality of resistive memory components. A wordline is configured to enable access to the set of resistor memory components by enabling the access transistor. A plurality of bitlines are each connected to a respective and different set of resistive memory components from each of the plurality of memory cells. A bitline controller is configured to access the plurality of resistive memory components by applying a first voltage to a first set of the plurality of bitlines and a second voltage to a second set of bitlines. | 12-10-2015 |
20150357035 | RESISTIVE MEMORY DEVICE IMPLEMENTING SELECTIVE MEMORY CELL REFRESH - A resistive memory device implements a selective refresh operation in which only memory cells with reduced sense margin are refreshed. In some embodiments, the selective refresh operation introduces a sense margin guardband so that a memory cell having programmed resistance that falls within the sense margin guardband will be refreshed during the read operation. The selective refresh operation is performed transparently at each read cycle of the memory cells and only memory cells with reduced sense margins are refreshed. | 12-10-2015 |
20150357036 | REFERENCE CURRENT GENERATION IN RESISTIVE MEMORY DEVICE - A resistive memory device incorporates a reference current generation circuit to generate a reference current for the sense amplifier that is immune to variation in the resistance of the reference resistive memory cells. In some embodiments, the reference current generation circuit uses reference resistive memory cells configured in the low resistance state only. The reference current generation circuit generates the reference current by combining a reference cell current and a bias current. The bias current is regulated by a feedback circuit in response to changes in the reference current to maintain the reference current at a substantially constant value and having a current value being an average of the cell currents for a resistive memory cell in the high resistance state and the low resistance state. | 12-10-2015 |
20150357037 | HIGH VOLTAGE GENERATING CIRCUIT FOR RESISTIVE MEMORY APPARATUS - A high voltage generating circuit for a resistive memory apparatus is provided. The high voltage generating circuit includes a capacitor spaced from a semiconductor substrate and electrically insulated from the semiconductor substrate. A switching device, which is electrically connected to the capacitor, is electrically insulated from the semiconductor substrate. | 12-10-2015 |
20150364174 | WORD LINE DRIVER CIRCUIT AND RESISTANCE VARIABLE MEMORY APPARATUS HAVING THE SAME - A world line driver circuit according to an embodiment includes a driving unit configured to output a sub word line driving signal in response to a word line select signal and a main word line driving signal, a transmission unit configured to transmit the sub word line driving signal to a word line in response to a first enable signal, and a precharge unit configured to precharge a potential of the word line. | 12-17-2015 |
20150364187 | ON-CHIP RESISTANCE MEASUREMENT CIRCUIT AND RESISTIVE MEMORY DEVICE INCLUDING THE SAME - A resistive memory device may include a resistive cell array and an on-chip resistance measurement circuit. The resistive cell array may include a plurality of resistive memory cells. The on-chip resistance measurement circuit may be configured to generate a first current and a second current greater or less than the first current based on a cell current corresponding to a cell resistance of a first memory cell of the resistive memory cells, and to generate first and second digital signals based on the first and second current, respectively. | 12-17-2015 |
20150364188 | MEMORY DEVICE READING AND CONTROL - A method of reading a memory device that includes a memory cell that stores data of at least two bits includes determining whether a cell resistance level is no greater than a threshold resistance level. If the cell resistance level is smaller than or equal to the threshold resistance level, then the data is read based on a first factor that is inversely proportional to the cell resistance level. If the cell resistance level is greater than the threshold resistance level, then the data is read based on a second factor that is proportional to the cell resistance level. | 12-17-2015 |
20150364190 | REFRESH OF A MEMORY AREA OF A NON-VOLATILE MEMORY UNIT - A method for carrying out a refresh of a memory area of a non-volatile memory unit of an embedded system includes refreshing the memory area when a refresh-triggering criterion is satisfied, a check being performed at predefined time intervals to determine whether the refresh-triggering criterion is satisfied, the embedded system being automatically activated and the check being performed if the embedded system is deactivated following the expiration of any of the predefined time intervals. | 12-17-2015 |
20150364192 | DATA RECORDING METHOD AND NON-VOLATILE STORAGE DEVICE - A data recording method according to an aspect of the present disclosure includes recording data in memory cells on the basis of whether each memory cell is in an initial state or a variable state. The recording step includes (A) applying a forming stress to a selected memory cell in the initial state, and (B) setting a resistance value of the selected memory cell to within a first resistance range by (b1) applying a first correction signal to the selected memory cell if the resistance value of the selected memory cell is greater than a first reference value, and (b2) applying a second correction signal to the selected memory cell if the resistance value of the selected memory cell is smaller than a second reference value. | 12-17-2015 |
20150364682 | Complementary resistance switch, contact-connected polycrystalline piezo- or ferroelectric thin-film layer, method for encrypting a bit sequence - Disclosed is a complementary resistor switch ( | 12-17-2015 |
20150371706 | Memory Systems and Memory Programming Methods - Memory systems and memory programming methods are described. According to one aspect, a memory system includes program circuitry configured to provide a program signal to a memory cell to program the memory cell from a first memory state to a second memory state, detection circuitry configured to detect the memory cell changing from the first memory state to the second memory state during the provision of the program signal to the memory cell to program the memory cell, and wherein the program circuitry is configured to alter the program signal as a result of the detection and to provide the altered program signal to the memory cell to continue to program the memory cell from the first memory state to the second memory state. | 12-24-2015 |
20150371721 | MEMORY DEVICE - A device includes a storage region, and a resistive-read-access-memory-based (RRAM-based or ReRAM-based) non-volatile storage array is disclosed herein. The storage region includes a first storage array and a second storage array. The first storage array includes a plurality of first storage cells. The second storage array includes a plurality of second storage cells. The second storage cells are configured to be in place of the first storage cells. The RRAM-based non-volatile storage array is configured to record at least one corresponding relationship between the first storage cells and the second storage cells. | 12-24-2015 |
20150380085 | RESISTIVE MEMORY DEVICE AND METHOD OF WRITING DATA - A method of writing data in a resistive memory device having a memory cell array divided into first and second tiles includes; performing a first simultaneous write operation by performing a set write operation performed on resistive memory cells of the first tile while simultaneously performing a reset write operation on resistive memory cells of the second tile in response to the write command, and performing a second simultaneous write operation by performing a reset write operation on resistive memory cells of the first tile while simultaneously performing a set write operation on resistive memory cells of the second tile in response to the write command. | 12-31-2015 |
20150380086 | RESISTIVE MEMORY DEVICE AND METHOD OF OPERATING THE RESISTIVE MEMORY DEVICE - In operating a resistive memory device including a number of memory cells, a write pulse is applied to each of the plurality of memory cells such that each of the memory cells has a target resistance state between a first reference resistance and a second reference resistance higher than the first reference resistance. The resistance of each of the memory cells is read by applying a verify pulse to each of the plurality of memory cells. A verify write current pulse is applied to each of the memory cells that has resistance higher than the second reference resistance, and a verify write voltage pulse is applied to each of the memory cells that has resistance lower than the first reference resistance. | 12-31-2015 |
20150380643 | HIGH-RELIABILITY HIGH-SPEED MEMRISTOR - A memristor has a first electrode, a second electrode parallel to the first electrode, and a switching layer disposing between the first and second electrodes. The switching layer contains a conduction channel and a reservoir zone. The conduction channel has a Fermi glass material with a variable concentration of mobile ions. The reservoir zone is laterally disposed relative to the conduction channel, and functions as a source/sink of mobile ions for the conduction channel. In the switching operation, under the cooperative driving force of both electric field and thermal effects, the mobile ions are moved into or out of the laterally disposed reservoir zone to vary the concentration of the mobile ions in the conduction channel to change the conductivity of the Fermi glass material. | 12-31-2015 |
20160005461 | SENSING A NON-VOLATILE MEMORY DEVICE UTILIZING SELECTOR DEVICE HOLDING CHARACTERISTICS - Providing for improved sensing of non-volatile resistive memory to achieve higher sensing margins, is described herein. The sensing can leverage current-voltage characteristics of a volatile selector device within the resistive memory. A disclosed sensing process can comprise activating the selector device with an activation voltage, and then lowering the activation voltage to a holding voltage at which the selector device deactivates for an off-state memory cell, but remains active for an on-state memory cell. Accordingly, very high on-off ratio characteristics of the selector device can be employed for sensing the resistive memory, providing sensing margins not previously achievable for non-volatile memory. | 01-07-2016 |
20160005463 | RESISTIVE MEMORY DEVICE, RESISTIVE MEMORY, AND OPERATING METHOD OF THE RESISTIVE MEMORY DEVICE - An operating method for a resistive memory device includes; applying a bias control voltage to a memory cell array of the resistive memory device, measuring leakage current that occurs in the memory cell array in response to the applied bias control voltage to generate a measuring result, generating a control signal based on the measuring result, and adjusting a level of the bias control voltage in response to the control signal. | 01-07-2016 |
20160005464 | COUNTER FOR WRITE OPERATIONS AT A DATA STORAGE DEVICE - A data storage device includes a resistive random access memory (ReRAM). A method includes storing data in the ReRAM by performing a first number of write operations to a storage region of the ReRAM. The storage region is tracked by a counter. The method further includes incrementing a value of the counter a second number of times responsive to storing the data in storage region. The second number is less than the first number. | 01-07-2016 |
20160005793 | MEMORY ELEMENT WITH A REACTIVE METAL LAYER - A memory cell including conductive oxide electrodes is disclosed. The memory cell includes a memory element operative to store data as a plurality of resistive states. The memory element includes a layer of a conductive metal oxide (CMO) (e.g., a perovskite) in contact with an electrode that may comprise one or more layers of material. At least one of those layers of material can be a conductive oxide (e.g., a perovskite such as LaSrCoO | 01-07-2016 |
20160005964 | SILICON BASED NANOSCALE CROSSBAR MEMORY - The present application describes a crossbar memory array. The memory array includes a first array of parallel nanowires of a first material and a second array of parallel nanowires of a second material. The first and the second array are oriented at an angle with each other. The array further includes a plurality of nanostructures of non-crystalline silicon disposed between a nanowire of the first material and a nanowire of the second material at each intersection of the two arrays. The nanostructures form a resistive memory cell together with the nanowires of the first and second materials. | 01-07-2016 |
20160012884 | MEMORY SYSTEM AND METHOD OF OPERATION OF THE SAME | 01-14-2016 |
20160012885 | Resistive Devices and Methods of Operation Thereof | 01-14-2016 |
20160012886 | NON-VOLATILE MEMORY CELL UTILIZING VOLATILE SWITCHING TWO TERMINAL DEVICE AND A MOS TRANSISTOR | 01-14-2016 |
20160012890 | RESISTIVE MEMORY DEVICE AND METHOD OF OPERATING THE SAME | 01-14-2016 |
20160012891 | CONCURRENT READ AND WRITE OPERATIONS IN A SERIAL FLASH DEVICE | 01-14-2016 |
20160019951 | RESISTIVE MEMORY DEVICE, RESISTIVE MEMORY SYSTEM, AND METHOD OF OPERATING RESISTIVE MEMORY DEVICE - A resistive memory device includes a memory cell array including a plurality vertically stacked layers having one layer designated as an interference-free layer and another layer designated as an access prohibited layer, wherein the interference-free layer and the access prohibited layer share a connection with at least one signal line and access operations directed to memory cells the access prohibited layer are prohibited. | 01-21-2016 |
20160019952 | INTRINSIC VERTICAL BIT LINE ARCHITECTURE - Methods for reducing leakage currents through unselected memory cells of a memory array during a memory operation are described. In some cases, the leakage currents through the unselected memory cells of the memory array may be reduced by setting an adjustable resistance bit line structure connected to the unselected memory cells into a non-conducting state. The adjustable resistance bit line structure may comprise a bit line structure in which the resistance of an intrinsic (or near intrinsic) polysilicon portion of the bit line structure may be adjusted via an application of a voltage to a select gate portion of the bit line structure that is not directly connected to the intrinsic polysilicon portion. The intrinsic polysilicon portion may be set into a conducting state or a non-conducting state based on the voltage applied to the select gate portion. | 01-21-2016 |
20160019953 | SETTING CHANNEL VOLTAGES USING A DUMMY WORD LINE - Methods for reducing leakage currents through unselected memory cells of a memory array during a memory operation are described. In some cases, the leakage currents through the unselected memory cells of the memory array may be reduced by setting an adjustable resistance bit line structure connected to the unselected memory cells into a non-conducting state. The adjustable resistance bit line structure may comprise a bit line structure in which the resistance of an intrinsic (or near intrinsic) polysilicon portion of the bit line structure may be adjusted via an application of a voltage to a select gate portion of the bit line structure that is not directly connected to the intrinsic polysilicon portion. The intrinsic polysilicon portion may be set into a conducting state or a non-conducting state based on the voltage applied to the select gate portion. | 01-21-2016 |
20160019955 | MEMORY DEVICE - According to one embodiment, a memory device includes a memory cell, a sense amplifier, and a resistor. The sense amplifier includes a first input and a second input, outputs a signal in accordance with a difference between the first and second inputs, and is selectively coupled at a second input to the memory cell. The resistor is in a first path between the first input of the sense amplifier and a ground node. | 01-21-2016 |
20160019957 | REDUCING DISTURB WITH ADJUSTABLE RESISTANCE BIT LINE STRUCTURES - Methods for reducing leakage currents through unselected memory cells of a memory array during a memory operation are described. In some cases, the leakage currents through the unselected memory cells of the memory array may be reduced by setting an adjustable resistance bit line structure connected to the unselected memory cells into a non-conducting state. The adjustable resistance bit line structure may comprise a bit line structure in which the resistance of an intrinsic (or near intrinsic) polysilicon portion of the bit line structure may be adjusted via an application of a voltage to a select gate portion of the bit line structure that is not directly connected to the intrinsic polysilicon portion. The intrinsic polysilicon portion may be set into a conducting state or a non-conducting state based on the voltage applied to the select gate portion. | 01-21-2016 |
20160019959 | NONVOLATILE MEMORY DEVICE AND METHOD OF CONTROLLING THE SAME - A nonvolatile memory device comprises a memory cell comprising a variable resistance element connected between a couple of wirings and a control circuit applying a voltage between the couple of wirings connected to the memory cell. In data rewriting, the control circuit repeats a first voltage application step of applying a first write voltage between the couple of wirings and a first verify step of applying a first voltage lower than the first write voltage between the couple of wirings and comparing a cell current through the cell with a first threshold current, the steps repeated until a magnitude relation of the cell current and the first threshold current satisfies a first condition. If the first condition is satisfied, the circuit performs a second voltage application step of applying a second write voltage between the couple of wirings. | 01-21-2016 |
20160019960 | OPERATION MODES FOR ADJUSTABLE RESISTANCE BIT LINE STRUCTURES - Methods for reducing leakage currents through unselected memory cells of a memory array during a memory operation are described. In some cases, the leakage currents through the unselected memory cells of the memory array may be reduced by setting an adjustable resistance bit line structure connected to the unselected memory cells into a non-conducting state. The adjustable resistance bit line structure may comprise a bit line structure in which the resistance of an intrinsic (or near intrinsic) polysilicon portion of the bit line structure may be adjusted via an application of a voltage to a select gate portion of the bit line structure that is not directly connected to the intrinsic polysilicon portion. The intrinsic polysilicon portion may be set into a conducting state or a non-conducting state based on the voltage applied to the select gate portion. | 01-21-2016 |
20160019961 | CONTROLLING ADJUSTABLE RESISTANCE BIT LINES CONNECTED TO WORD LINE COMBS - Methods for reducing leakage currents through unselected memory cells of a memory array during a memory operation are described. In some cases, the leakage currents through the unselected memory cells of the memory array may be reduced by setting an adjustable resistance bit line structure connected to the unselected memory cells into a non-conducting state. The adjustable resistance bit line structure may comprise a bit line structure in which the resistance of an intrinsic (or near intrinsic) polysilicon portion of the bit line structure may be adjusted via an application of a voltage to a select gate portion of the bit line structure that is not directly connected to the intrinsic polysilicon portion. The intrinsic polysilicon portion may be set into a conducting state or a non-conducting state based on the voltage applied to the select gate portion. | 01-21-2016 |
20160019962 | RESISTANCE CHANGE MEMORY CELL CIRCUITS AND METHODS - The gate of the access transistor of a 1 transistor 1 resistor (1T1R) type RRAM cell is biased relative to the source of the access transistor using a current mirror. Under the influence of a voltage applied across the 1T1R cell (e.g., via the bit line), the RRAM memory element switches from a higher resistance to a lower resistance. As the RRAM memory element switches from the higher resistance to the lower resistance, the current through the RRAM cell switches from being substantially determined by the higher resistance of the RRAM device (while the access transistor is operating in the linear region) to being substantially determined by the saturation region operating point of the access transistor. | 01-21-2016 |
20160019963 | AUTO-TRACKING UNSELECTED WORD LINE VOLTAGE GENERATOR - Methods for reducing leakage currents through unselected memory cells of a memory array during a memory operation are described. In some cases, the leakage currents through the unselected memory cells of the memory array may be reduced by setting an adjustable resistance bit line structure connected to the unselected memory cells into a non-conducting state. The adjustable resistance bit line structure may comprise a bit line structure in which the resistance of an intrinsic (or near intrinsic) polysilicon portion of the bit line structure may be adjusted via an application of a voltage to a select gate portion of the bit line structure that is not directly connected to the intrinsic polysilicon portion. The intrinsic polysilicon portion may be set into a conducting state or a non-conducting state based on the voltage applied to the select gate portion. | 01-21-2016 |
20160019980 | ELECTRONIC DEVICE - An electronic device comprising a semiconductor memory unit that may include a variable resistance element configured to be changed in a resistance value thereof in response to current flowing through both ends thereof, a toggle data generation unit configured to generate toggle data of which logic value toggles with a predetermined cycle, in a first mode for testing reliability of the variable resistance element, a data transfer line configured to transfer data inputted from an outside, and a driving unit configured to flow current which is changed in its direction with the predetermined cycle, through the variable resistance element in response to the toggle data in the first mode, and flow current through the variable resistance element in a direction determined in response to the data of the data transfer line, in a second mode in writing date into or reading data from the variable resistance element. | 01-21-2016 |
20160027488 | RESISTIVE MEMORY DEVICE, MEMORY SYSTEM INCLUDING THE SAME AND METHOD OF READING DATA FROM THE SAME - A resistive memory device may include first and second resistive memory cells, a reference current generator, and first and second bitline sense amplifiers. The reference current generator may be configured to apply the first and second reference currents to a first common node. A total reference current of the first reference current and the second reference current provided to the first common node may be divided into a first sensing current and a second sensing current by the first common node. The first and second sensing currents may be provided to the first and second bitline sense amplifiers by the first common node, respectively. The first and second bitline sense amplifiers may be configured to sense first data of the first resistive memory cell and second data of the second resistive memory cell based on the first and second sensing currents, respectively. | 01-28-2016 |
20160027505 | 3D VARIABLE RESISTANCE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - A variable resistance memory device includes a plurality of cell gate electrodes extending in a first direction, wherein the plurality of cell gate electrodes are stacked in a second direction that is substantially perpendicular to the first direction, A gate insulating layer surrounds each cell gate electrode of the plurality of cell gate electrodes and a cell drain region is formed on two sides of the each cell gate electrode of the plurality of cell gate electrodes A channel layer extends in the second direction along the stack of the plurality of cell gate electrodes, and a variable resistance layer contacting the channel layer. | 01-28-2016 |
20160027506 | RESISTIVE MEMORY DEVICE CAPABLE OF INCREASING SENSING MARGIN BY CONTROLLING INTERFACE STATES OF CELL TRANSISTORS - Memory systems can include a memory device having an array of nonvolatile memory cells therein, which is electrically coupled to a plurality of bit lines and a plurality of word lines. The nonvolatile memory cells may include respective nonvolatile resistive devices electrically coupled in series with corresponding cell transistors. A controller is also provided, which may be coupled to the memory device. The controller can be configured to drive the memory device with signals that support dual programming of: (i) the nonvolatile resistive devices; and (ii) interface states within the cell transistors, during operations to write data into the memory device. | 01-28-2016 |
20160027507 | NONVOLTILE RESISTANCE MEMORY AND ITS OPERATION THEREOF - A memory cell and the associated array circuits are disclosed. The memory array circuit includes a plurality of memory units, in which each of the memory units includes a storage device and a field-effect transistor. The storage device includes a top electrode, a bottom electrode and an oxide-based dielectric layer. The top electrode is formed by metal or metallic oxide dielectrics and connected to a word line. The bottom electrode is formed by metal, and the oxide-based dielectric layer is placed between the top electrode and the bottom electrode. The field-effect transistor includes a gate terminal connected to the bottom electrode, a source terminal connected to a ground line, and a drain terminal connected to a bit line. The resistance of the storage device is configured to be adjusted according to a first voltage applied to the word line and a second voltage applied to the bit line. | 01-28-2016 |
20160027508 | RESISTIVE MEMORY DEVICE AND OPERATION - A method of operating a resistive memory device including a plurality of memory cells comprises determining whether to perform a refresh operation on memory cells in a memory cell array; determining a resistance state of each of at least some of the memory cells; and performing a re-writing operation on a first memory cell having a resistance state from among a plurality of resistance states that is equal to or less than a critical resistance level. | 01-28-2016 |
20160027510 | MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A method of operating a memory device, which includes of memory cells respectively arranged in regions where first signal lines and second lines cross each other, includes determining a plurality of pulses so that each of the plurality of pulses that are sequentially applied to a selected memory cell among the plurality of memory cells is changed according to a number of times of executing programming loops. In response to the change of the plurality of pulses, at least one of a first inhibit voltage and a second inhibit voltage is determined so that a voltage level of at least one of the first and second inhibit voltages that are respectively applied to unselected first and second signal lines connected to unselected memory cells among the plurality of memory cells is changed according to the number of times of executing the programming loops. | 01-28-2016 |
20160027844 | NAND-type Resistance Random Access Memory Circuit And Operation Thereof - A high density NAND-type nonvolatile resistance random access storage circuit and its operations are disclosed herein. A unit memory cell of the circuit includes a field effect transistor (FET) with a resistance changeable component connected to its gate electrode. The field effect transistor is an n-channel field effect transistor or a p-channel field effect transistor. By applying the voltage or current between the top electrode of the resistive random access component and the FET drain or source electrode, more than two stable states can be maintained such that these states can be drawn from the FET drain or source electrode. The NAND circuit includes the above unit cell as a center to form a multi-bit memory. The circuit consists of multi-bit memories connected in series, has a NAND logic gate function, and forms output of this NAND circuit which can be drawn in a form of series output. | 01-28-2016 |
20160035416 | NONVOLATILE MEMORY DEVICE AND METHOD FOR DRIVING SAME - According to one embodiment, a nonvolatile memory device includes: a first interconnection layer; a second interconnection layer; an ion source provided between the first interconnection layer and the second interconnection layer; a resistance layer provided between the ion source and the first interconnection layer; and a control circuit writing multi-value data in the resistance layer by changing a setting voltage to be applied between the first interconnection layer and the second interconnection layer when performing a setting operation of writing data in the resistance layer, and the control circuit reading the multi-value data based on reading voltage to be applied between the first interconnection layer and the second interconnection layer when performing a reading operation of reading the multi-value data. | 02-04-2016 |
20160035417 | MEMORY DEVICE AND METHOD OF OPERATING THE MEMORY DEVICE - A memory device and a method of operating the memory device are provided for performing a read-retry operation. The method of operating the memory device includes starting a read-retry mode, reading data of multiple cell regions using different read conditions, and setting a final read condition for the cell regions according to results of data determination operations on data read from the cell regions. | 02-04-2016 |
20160035419 | RECONFIGURABLE CIRCUIT AND METHOD OF PROGRAMMING THE SAME - A reconfigurable circuit according to an embodiment includes: first wiring lines; second wiring lines crossing the first wiring lines; resistive change elements disposed in intersection regions of the first and second wiring lines, each of the resistive change elements including a first terminal connected to the one of the first wiring lines and a second terminal connected to the one of the second wiring lines, and being switchable between a low-resistance state and a high-resistance state; a first control circuit controlling a voltage to be applied to the first wiring lines; a second control circuit controlling a voltage to be applied to the second wiring lines; and current limiting elements corresponding to the second wiring lines, and controlling current flowing through the resistive change elements connected to the corresponding second wiring line. | 02-04-2016 |
20160035789 | Method Of Manufacturing Semiconductor Device And Semiconductor Device Having Unequal Pitch Vertical Channel Transistors - A semiconductor device comprises a set of selection transistors, such as in a three-dimensional memory structure or stack having resistance change memory cells arranged along vertical bit lines. Each selection transistor has a non-shared control gate and a shared control gate. The transistor bodies may have an unequal pitch and a common height. Some of the transistor bodies can be misaligned with the vertical bit lines to fit the transistors to the stack. A method for programming the three-dimensional memory structure includes forming one or two channels in a transistor body to provide a current to selected memory cells. Programming can initially use one channel and subsequently use two channels based on a programming progress. A method for fabricating a semiconductor device includes etching a gate conductor material so that shared and non-shared control gates have a common height. | 02-04-2016 |
20160042787 | APPARATUS AND METHOD FOR STORAGE DEVICE READING - According to an example, a method for storage device reading may include receiving an input signal indicative of a period of oscillation of a ring oscillator coupled to a storage device of a plurality of storage devices, and measuring the period of oscillation of the ring oscillator by a time-to-digital circuit. The method for storage device reading may further include determining a value of data stored in the storage device based on the measurement. | 02-11-2016 |
20160042788 | WRITE DRIVER, RESISTANCE VARIABLE MEMORY APPARATUS INCLUDING THE SAME, AND OPERATION METHOD - A write driver is configured to determine a magnitude and an application time of a pre-emphasis current pulse in response to control codes generated according to parasitic components on a path from a write driver to a program target cell and a resistance value of the program target cell, and supply a preset program current to a memory circuit block by adding a pre-emphasis current to the preset program current in a program mode. | 02-11-2016 |
20160042789 | MULTIPLE LAYER FORMING SCHEME FOR VERTICAL CROSS POINT RERAM - Methods for forming non-volatile storage elements in a non-volatile storage system are described. In some embodiments, during a forming operation, a cross-point memory array may be biased such that waste currents are minimized or eliminated. In one example, the memory array may be biased such that a first word line comb is set to a first voltage, a second word line comb interdigitated with the first word line comb is set to the first voltage, and selected vertical bit lines are set to a second voltage such that a forming voltage is applied across non-volatile storage elements to be formed. In some embodiments, a memory array may include a plurality of word line comb layers and a forming operation may be concurrently performed on non-volatile storage elements on all of the plurality of word line comb layers or a subset of the plurality of word line comb layers. | 02-11-2016 |
20160042811 | RESISTIVE MEMORY DEVICE AND OPERATING METHOD THEREOF - A resistive memory device includes a memory cell array that includes a plurality of memory layers stacked in a vertical direction. Each of the plurality of memory layers includes a plurality of memory cells disposed in regions where a plurality of first lines and a plurality of second lines cross each other. A bad region management unit defines as a bad region a first memory layer including a bad cell from among the plurality of memory cells and at least one second memory layer. | 02-11-2016 |
20160043137 | RESISTIVE MEMORY DEVICE WITH ZERO-TRANSISTOR, ONE-RESISTOR BIT CELLS INTEGRATED WITH ONE-TRANSISTOR, ONE-RESISTOR BIT CELLS ON A DIE - A resistive memory array includes an array of one-transistor, one-resistor (1T1R) bit cells on a die. The resistive memory array also includes an array of zero-transistor, one-resistor (0T1R) bit cells arranged with the array of 1T1R bit cells on the same die. | 02-11-2016 |
20160049193 | METHOD FOR DYNAMICALLY ACCESSING AND PROGRAMMING RESISTIVE CHANGE ELEMENT ARRAYS - Methods for dynamically programming and dynamically reading one or more resistive change elements within a resistive change element array are disclosed. These methods include first pre-charging all of the array lines within a resistive change element array simultaneously and then grounding certain array lines while allowing other array lines to float in order to direct discharge currents through only selected cells. In this way, resistive change elements within resistive change element arrays made up of 1-R cells—that is, cells without in situ selection circuitry—can be reliably and rapidly accessed and programmed. | 02-18-2016 |
20160049194 | APPARTUSES AND METHODS FOR SENSING USING AN INTEGRATION COMPONENT - The present disclosure includes apparatuses and methods for sensing a resistance variable memory cell. A number of embodiments include circuitry to provide a programming signal to a memory cell in the array, the programming signal associated with programming the memory cell to a particular data state; and determine, via an integration component, if a data state of the memory cell changes to a different data state responsive to the programming signal being provided. | 02-18-2016 |
20160049196 | Memory with specific driving mechanism applied on source line - An embodiment of the invention provides a memory. The memory includes a plurality of word lines, a plurality of bit lines, a plurality of source lines and a memory cell array. The memory cell array has a plurality of memory cells disposed at the intersections of the word and bit lines to form a matrix of rows and columns, wherein each memory cell comprises a resistive memory device and a transistor. The source lines are each disposed between two word lines, wherein each source line is coupled to source terminals of the transistors. When a RESET operation is applied to a selected memory cell, the voltage level of the source line is pulled up to a first voltage level, and when another operation is applied to the selected memory cell, the source line is grounded. | 02-18-2016 |
20160049197 | Memory Devices Including a Plurality of Layers and Related Systems - A memory device is provided including a cell region including at least one cell layer, each cell layer including multiple first lines and multiple second lines; and a control region including at least one control layer. The at least one control layer includes multiple circuit regions for performing a memory operation on the cell region. The multiple first lines include at least one first signal line through which a first signal from a first circuit region of the control layer is transmitted to a second circuit region of the control layer. | 02-18-2016 |
20160055904 | MEMORY DEVICE HAVING CROSS POINT ARRAY STRUCTURE, MEMORY SYSTEM, AND METHOD OF OPERATING MEMORY DEVICE - In a method of operating a memory device having a cross point array structure, the memory device includes multiple tiles, and each of the tiles includes memory cells of multiple layers. The method includes accessing, in a first tile, multiple memory cells of a first layer disposed in a region where at least one first line and at least one second line cross each other, accessing, in the first tile, multiple memory cells of a second layer disposed in a region where at least one first line and at least one second line cross each other, and accessing, after the memory cells of the multiple layers of the first tile are accessed, multiple memory cells included in a second tile. Related memory devices and memory systems are also discussed. | 02-25-2016 |
20160055905 | Nonvolatile Memory Device with Reduced Coupling Noise and Driving Method Thereof - Provided are nonvolatile memory devices and a driving method of the nonvolatile memory devices. The nonvolatile memory devices may include a plurality of memory banks, a read global bit line shared by the plurality of memory banks, a write global bit line shared by the plurality of memory banks, a read circuit connected with the read global bit line and performing a read operation, and a discharge control circuit connected with the write global bit line and primarily discharging the write global bit line during an initialization interval after a power-up operation. | 02-25-2016 |
20160055906 | OPERATION METHOD OF RESISTIVE RANDOM ACCESS MEMORY CELL - An operation method of a resistive random access memory (RRAM) cell is provided, wherein the RRAM cell includes a variable impedance element and a switch element connected in series. The operation method includes the following steps. When the switch element is turned-on, a writing signal is provided to the variable impedance element to set an impedance of the variable impedance element. In a first period, the writing signal is set to a first writing voltage level to transmit a first electrical energy to the variable impedance element. In a second period, a second electrical energy is transmitted to the variable impedance element by the writing signal. The second period is subsequent to the first period, the first electrical energy and the second electrical energy are greater than zero, and the second electrical energy is smaller than the first electrical energy. | 02-25-2016 |
20160056374 | LOW VOLTAGE EMBEDDED MEMORY HAVING CATIONIC-BASED CONDUCTIVE OXIDE ELEMENT - Low voltage embedded memory having cationic-based conductive oxide elements is described. For example, a material layer stack for a memory element includes a first conductive electrode. A cationic-based conductive oxide layer is disposed on the first conductive electrode. The cationic-based conductive oxide layer has a plurality of cation vacancies therein. A second electrode is disposed on the cationic-based conductive oxide layer. | 02-25-2016 |
20160064072 | 3D VARIABLE RESISTANCE MEMORY DEVICE HAVING JUNCTION FET AND DRIVING METHOD THEREOF - A 3D variable resistance memory device having a junction FET and a driving method thereof are provided. The variable resistance memory device includes a semiconductor substrate and a string selection switch formed on the semiconductor substrate. A channel layer is formed on the column string selection switch. A plurality of gates stacked along a length of the channel layer and each of the gates contacts an outer side of the channel layer. A variable resistance layer is formed on an inner side of the channel layer, and contacts the channel layer. | 03-03-2016 |
20160064074 | SEMICONDUCTOR DEVICE AND INFORMATION READING METHOD - A semiconductor device including a memory device configured to take a plurality of resistance states that are distinguishable from one another; a bias application section configured to apply, in a bias application period, a bias signal to the memory device; and a determination section configured to determine a resistance state of the memory device on the basis of a detection signal, in which the detection signal is generated in the memory device to which the bias signal is applied. The bias application section sets a length of the bias application period in accordance with a resistance value of the memory device, when the resistance state determined by the determination section is predetermined one of the resistance states. | 03-03-2016 |
20160064077 | MEMORY CELL WITH NON-VOLATILE DATA STORAGE - The invention concerns a memory cell comprising first and second resistive elements ( | 03-03-2016 |
20160064452 | MEMORY DEVICE - A memory device according to an embodiment includes a memory element; and a transistor including a semiconductor layer and a plurality of gates, wherein the plurality of gates include: a first set of gates, the gates being disposed in a manner to sandwich the semiconductor layer, and a second set of gates, the gates being disposed in a manner to sandwich the semiconductor layer, the gates included in the first set is disposed in a manner to separate from the gates included in the second set in a direction along a side surface of the semiconductor layer. | 03-03-2016 |
20160064660 | Methods of Using A Two Terminal Multi-Layer Thin Film Resistance Switching Device With A Diffusion Barrier - An electric-pulse-induced-resistance change device (EPIR device) is provided which is a resistance switching device. It has a buffer layer inserted between a first active resistance switching layer and a second active resistance switching layer, with both active switching layers connected to electrode layers directly or through additional buffer layers between the active resistance switching layers and the electrodes. This device in its simplest form has the structure: electrode-active layer-buffer layer-active layer-electrode. The second active resistance switching layer may, in the alternative, be an ion donating layer, such that the structure becomes: electrode-active layer-buffer layer-ion donating layer-electrode. The EPIR device is constructed to mitigate the retention challenge. | 03-03-2016 |
20160071567 | RESISTANCE CHANGE MEMORY - According to one embodiment, a resistance change memory includes a memory cell, a reference voltage generating circuit, a first transistor and a sense amplifier. The memory cell includes a resistance change element. The reference voltage generating circuit generates a reference adjustment voltage. The first transistor provides a reference current in accordance with the reference adjustment voltage. The sense amplifier compares a cell current flowing through the memory cell with the reference current flowing through the first transistor. | 03-10-2016 |
20160071588 | DEVICE AND METHOD FOR WRITING DATA TO A RESISTIVE MEMORY - The invention relates to a resistive memory ( | 03-10-2016 |
20160071589 | DEVICE AND METHOD FOR WRITING DATA TO A RESISTIVE MEMORY - The invention relates to a resistive memory including resistive elements, the resistance of each resistive element being capable of alternating between a high value and a low value, the memory further including a device for switching the resistance of at least one selected resistive element between the high and low values. The device includes a first circuit capable of circulating a first current through a first reference resistive component (R | 03-10-2016 |
20160072493 | CURRENT COMPARATOR AND ELECTRONIC DEVICE INCLUDING THE SAME - A current comparator may include a current comparison block configured to compare current flowing through first and second input terminals; a first current control unit configured to control current flowing through the first input terminal in response to a voltage of a first node; a second current control unit configured to control current flowing through the second input terminal in response to a voltage of a second node; a first driving unit configured to drive the first node with a first voltage higher than a read voltage in a non-comparison period, and drive the first node with the read voltage in a comparison period; and a second driving unit configured to drive the second node with a second voltage higher than a reference voltage in the non-comparison period, and drive the second node with the reference voltage in the comparison period. | 03-10-2016 |
20160078933 | SEMICONDUCTOR INTEGRATED CIRCUIT - According to one embodiment, a semiconductor integrated circuit includes a memory cell including first and second electrodes and a resistance change film therebetween, and a control circuit controlling a potential difference between the first and second electrodes. The control circuit reversibly changes the memory cell to a first resistive state by applying a first potential to the first electrode and by applying a second potential smaller than the first potential to the second electrode. The control circuit reversibly changes the memory cell to a second resistive state by applying a third potential to the first electrode and by applying a fourth potential smaller than the third potential to the second electrode. | 03-17-2016 |
20160078934 | 1T-1R ARCHITECTURE FOR RESISTIVE RANDOM ACCESS MEMORY - A memory device includes an array of resistive memory cells wherein each pair of resistive memory cells includes a first switching element electrically coupled in series to a first resistive memory element and a second switching element electrically coupled in series to a second resistive memory element. A source of the first switching element and a source of the second switching element receive a common source line signal. | 03-17-2016 |
20160078935 | SEMICONDUCTOR INTEGRATED CIRCUIT - A semiconductor integrated circuit includes: first and second wiring lines; resistive change memories disposed intersection regions of the first and second wiring lines; and a control circuit controlling the first and second drivers to select one of the first wiring lines and one of the second wiring lines, the control circuit changing a resistance of the selected one of the resistive change memories from the first resistive state to the third resistive state, and then changing the resistive state of the selected one of the resistive change memories from the third resistive state to the second resistive state. | 03-17-2016 |
20160078937 | RESISTIVE MEMORY DEVICE AND CONTROL METHOD THEREOF - A resistive memory device is provided. A first cell is coupled to a word line, a first bit line and a source line. A second cell is coupled to the word line, a second bit line and the source line. A control circuit controls the levels of the word line, the first bit line and the source line to execute a set operation for the first cell and execute a reset operation for the second cell. After the set and the reset operations, the resistance of the first cell is less than the resistance of the second cell. During the execution of the set operation, the control circuit asserts the level of the source line at a pre-determined level. During the execution of the reset operation, the control circuit asserts the level of the source line at the pre-determined level. | 03-17-2016 |
20160079523 | LOW VOLTAGE EMBEDDED MEMORY HAVING CONDUCTIVE OXIDE AND ELECTRODE STACKS - Low voltage embedded memory having conductive oxide and electrode stacks is described. For example, a material layer stack for a memory element includes a first conductive electrode. A conductive oxide layer is disposed on the first conductive electrode. The conductive oxide layer has a plurality of oxygen vacancies therein. A second electrode is disposed on the conductive oxide layer. | 03-17-2016 |
20160086661 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device including a memory cell array including a memory cell layer containing plural memory cells operative to store data in accordance with different resistance states; and an access circuit operative to make access to the memory cells, the memory cell changing the resistance state from a first resistance state to a second resistance state on application of a voltage of a first polarity, and changing the resistance state from the second resistance state to the first resistance state on application of a voltage of a second polarity, the access circuit applying voltages, required for access to the memory cell, to first and second lines connected to a selected memory cell, and bringing at least one of the first and second lines connected to non-selected memory cells into the floating state to make access to the selected memory cell. | 03-24-2016 |
20160086664 | RESISTIVE MEMORY DEVICES - Electronic apparatus, systems, and methods can include a resistive memory cell having a structured as an operably variable resistance region between two electrodes and a metallic barrier disposed in a region between the dielectric and one of the two electrodes. The metallic barrier can have a structure and a material composition to provide oxygen diffusivity above a first threshold during program or erase operations of the resistive memory cell and oxygen diffusivity below a second threshold during a retention state of the resistive memory cell. Additional apparatus, systems, and methods are disclosed. | 03-24-2016 |
20160087201 | RESISTIVE RANDOM ACCESS MEMORY CELL STRUCTURE - A system including a resistive element of a memory cell and a device to access the resistive element of the memory cell. The resistive element includes (i) a first electrode, and (ii) a second electrode. The device includes (i) a first terminal connected to a first contact, and (i) a second terminal connected to a second contact. One or more of the first contact and the second contact of the device is respectively connected to one or more of the first electrode and the second electrode of the resistive element via a third contact. A size of the third contact decreases from the one or more of the first contact and the second contact of the device to the one or more of the first electrode and the second electrode of the resistive element of the memory cell. | 03-24-2016 |
20160093373 | APPARATUS AND METHODS FOR SENSING HARD BIT AND SOFT BITS - A method is provided for reading a memory cell of a nonvolatile memory system. The method includes generating a hard bit and N soft bits for the memory cell in a total time corresponding to a single read latency period and N+1 data transfer times. | 03-31-2016 |
20160093374 | METHODS AND APPARATUS FOR VERTICAL CROSS POINT RE-RAM ARRAY BIAS CALIBRATION - Methods for operating a non-volatile storage system are described. The non-volatile storage system includes a plurality of bit lines, a plurality of word line combs each comprising a plurality of word lines, and a plurality of resistance-switching memory elements. Each resistance-switching memory element is coupled between one of the bit lines and one of the word lines. The method includes calibrating a plurality of bias voltages for the word lines and bit lines based on estimates of data values stored in the resistance-switching memory elements. | 03-31-2016 |
20160093376 | RESISTIVE MEMORY DEVICE AND METHOD OF OPERATING THE SAME TO REDUCE LEAKAGE CURRENT - A method of operating a memory device includes determining a value of an operating current flowing through a selected first signal line, to which a selection voltage is applied, from among a plurality of first signal lines; dividing an array of memory cells into n blocks, n being an integer greater than 1, based on the value of the operating current; and applying inhibit voltages having different voltage levels corresponding to the n blocks to unselected ones of second signal lines included in the n blocks. Each of the unselected second signal lines is a pathway through which leakage current may potentially flow due to the operating current flowing through the selected first signal line and a memory cell addressed by the unselected second signal line and the selected first signal line. | 03-31-2016 |
20160093402 | MEMORY WITH DISTRIBUTED REPLACEMENT WORD LINES - A memory includes a plurality of replacement word lines interspersed among the plurality of word lines. The memory also includes a word line control circuit configured to apply different voltages to different word lines of the plurality of word lines based on positions of the word lines, and to replace a defective word line of the plurality of word lines with a replacement word line. | 03-31-2016 |
20160093674 | MEMORY DEVICE - According to one embodiment, a memory device includes a first active area, formed on the substrate, which extends in a third direction. The memory device also includes three gate electrodes, provided on the first active area, which extend in a second direction intersecting the third direction. The memory device also includes at least two or more upper-layer interconnects and at least two or more lower-layer interconnects, provided on the first active area, which extend in a first direction intersecting the second direction and the third direction. The memory device also includes first transistors of three, each of them is provided at the intersection point between the first active area and the three gate electrodes. The memory device also includes the first transistors of three are one device isolation transistor and two cell transistors. | 03-31-2016 |
20160099049 | RESISTIVE MEMORY DEVICE, RESISTIVE MEMORY SYSTEM, AND OPERATING METHOD THEREOF - A method for operating a memory device includes sensing a change in temperature of the memory device, adjusting a level of a reference current for a read operation, and reading data from memory cells of the memory device based on the adjusted level of the reference current. The level of the reference current is adjusted from a reference value to a first value when the temperature of the memory device increases and is adjusted from the reference value to a second value when the temperature of the memory device decreases. A difference between the reference value and the first value is different from a difference the reference value and the second value. | 04-07-2016 |
20160099051 | RESISTANCE CHANGE MEMORY AND FORMING METHOD OF THE RESISTANCE CHANGE DEVICE - A resistance change memory has a resistance change device and a control circuit for controlling application of voltage to the resistance change device. The resistance change device has a first electrode, a second electrode, and a resistance change layer interposed between the first electrode and the second electrode. A material for the second electrode includes one of members selected from the group consisting of W, Ti, Ta, and nitrides thereof. During forming of the resistance change device, the control circuit performs a second forming treatment succeeding to a first forming treatment. The first forming treatment includes application of voltage such that the potential of the first electrode is higher than the potential of the second electrode. The second forming treatment includes application of voltage such that the potential of the second electrode is higher than the potential of the first electrode. | 04-07-2016 |
20160099052 | RESISTIVE MEMORY DEVICE, RESISTIVE MEMORY SYSTEM, AND OPERATING METHOD THEREOF - A method for operating a memory device includes sensing a temperature of the resistive memory device, setting a level of a set voltage or current for writing to a memory cell based on the temperature, setting a level of a reset voltage for reset writing to the memory cell based on the temperature, and performing a write operation on the memory cell based on the level of the set voltage or current and the level of the reset voltage. The memory device may be a resistive memory device. | 04-07-2016 |
20160099409 | ULTRATHIN FILM RESISTIVE MEMORY DEVICES - Provided are thin resistive devices and related methods, the devices featuring a resistance-switchable active layer having a thickness in the range of from about 1 to about 5 nm and an insulating layer surmounting the resistance-switchable active layer, the insulating layer having a thickness in the range of from about 0.5 nm to about 5 nm. | 04-07-2016 |
20160104531 | WRITABLE DEVICE BASED ON ALTERNATING CURRENT - A nonvolatile memory device is writable to a high resistance state and a low resistance state. The nonvolatile memory device may be heated to at least a threshold temperature, based on application of an alternating current (AC) signal, and may be written based on application of a voltage bias. | 04-14-2016 |
20160111151 | RESISTANCE VARIABLE MEMORY APPARATUS, READ/WRITE CIRCUIT UNIT AND OPERATION METHOD THEREOF - A resistance variable memory apparatus may include a memory cell array. The resistance variable memory apparatus may include a read/write circuit unit. The read/write circuit unit may be configured for being controlled so that a reference value for the last verification operation has a different level from reference values for verification operations excluding the last verification operation, while a preset number of program and verification (PNV) cycles are performed in response to a write command for the memory cell array. | 04-21-2016 |
20160111152 | METHOD FOR CAPACITIVELY READING RESISTIVE MEMORY ELEMENTS AND NONVOLATILE, CAPACITIVELY READABLE MEMORY ELEMENTS FOR IMPLEMENTING THE METHOD - A method for reading out a non-volatile memory element having at least two stable states 0 and 1. This memory element comprises at least one resistive memory cell, which encodes the two states 0 and 1 into a state HRS having higher electrical resistance and a state LRS having lower electrical resistance. In the two states 0 and 1, the memory element has differing capacitances C | 04-21-2016 |
20160111153 | METHOD FOR PROGRAMMING SWITCHING ELEMENT - In order to realize a switching element that is highly reliable and can be highly integrated, in a method for programming a switching element of the present invention, programming of the switching element is performed by increasing or decreasing a resistance value R of a resistive-change film by applying a first pulse voltage to a first electrode or a second electrode, a measurement of the resistance value R is performed, verification in which it is determined whether or not the measured resistance value R is equal to a desired value is performed, and reprogramming of the switching element is performed by applying a second pulse voltage whose polarity is the same as that of the first pulse voltage to the same electrode to which the first pulse voltage is applied on the basis of the resistance value R when the resistance value R is not equal to the desired value. | 04-21-2016 |
20160111155 | NONVOLATILE SEMICONDUCTOR STORAGE DEVICE AND REWRITING METHOD THEREOF - A bitwise bidirectionally rewritable nonvolatile semiconductor storage device capable of performing a high-speed data rewrite, while enhancing endurance characteristics and data-retention characteristics of a memory cell. To achieve high-speed generation of rewrite-bit information indicating that a data rewrite is needed or not, the structure employs a logic circuit corresponding to the number of change patterns of write conditions and concurrently compares between read-out data RO of memory at the start of the data rewrite and prepared write data DIN. After an electrical data rewrite of the memory, the data rewrite is verified based on the rewrite-bit information stored in an internal buffer circuit. This protects an already-rewritten memory cell from unnecessary additional rewrite. | 04-21-2016 |
20160111156 | MEMORY CIRCUIT AND METHOD OF PROGRAMMING MEMORY CIRCUIT - A method includes applying a first voltage setting to a memory cell for a first period of time in response to a command for programming a first logical state to the memory cell, obtaining a first stored logical state of the memory cell after the applying the first voltage setting operation, and if the first stored logical state differs from the first logical state, applying a second voltage setting to the memory cell. | 04-21-2016 |
20160111157 | METHOD FOR READING A THIRD-DIMENSIONAL EMBEDDED RE-WRITEABLE NON-VOLATILE MEMORY AND REGISTERS - A non-volatile register includes register logic connected with first and second ends of a memory element. The register logic is positioned below the memory element. The memory element may be a two-terminal memory element configured to store data as a plurality of conductivity profiles that can be non-destructively determined by applying a read voltage across the two terminals. New data can be written to the two-terminal memory element by applying a write voltage of a predetermined magnitude and/or polarity across the two terminals. The two-terminal memory element retains stored data in the absence of power. A reference element including a structure that is identical or substantially identical to the two-terminal memory element may be used to generate a reference signal for comparisons during read operations. | 04-21-2016 |
20160111639 | SELECT DEVICE FOR MEMORY CELL APPLICATIONS - The present disclosure includes select devices and methods of using select device for memory cell applications. An example select device includes a first electrode having a particular geometry, a semiconductor material formed on the first electrode and a second electrode having the particular geometry with formed on the semiconductor material, wherein the select device is configured to snap between resistive states in response to signals that are applied to the select device. | 04-21-2016 |
20160118114 | RESISTIVE MEMORY DEVICE, RESISTIVE MEMORY SYSTEM AND METHOD OF OPERATING THE RESISTIVE MEMORY DEVICE - A method of operating a resistive memory device and a resistive memory system including a resistive memory device is for a resistive memory device including a plurality of bit lines and at least one dummy bit line. The method of operating the resistive memory device includes detecting a first address accompanying a first command, generating a plurality of inhibit voltages for biasing non-selected lines, and providing to a first dummy bit line a first inhibit voltage selected from among the plurality of inhibit voltages based on a result of detecting the first address. | 04-28-2016 |
20160118117 | RESISTIVE MEMORY DEVICE, RESISTIVE MEMORY SYSTEM, AND METHOD OF OPERATING RESISTIVE MEMORY DEVICE - A method of operating a resistive memory device having a plurality of word lines and a plurality of bit lines includes selecting one or more first memory cells connected to a first bit line, selecting one or more second memory cells connected to a second bit line, and simultaneously performing a reset write operation on the first and second memory cells using a first write driver. | 04-28-2016 |
20160118118 | Memory Cells, Methods of Forming Memory Cells, and Methods of Programming Memory Cells - Some embodiments include methods in which a memory cell is formed to have programmable material between first and second access lines, with the programmable material having two compositionally different regions. A concentration of ions and/or ion-vacancies may be altered in at least one of the regions to change a memory state of the memory cell and to simultaneously form a pn diode. Some embodiments include memory cells having programmable material with two compositionally different regions, and having ions and/or ion-vacancies diffusible into at least one of the regions. The memory cell has a memory state in which the first and second regions are of opposite conductivity type relative to one another. | 04-28-2016 |
20160118119 | Memory Programming Methods and Memory Systems - Memory programming methods and memory systems are described. One example memory programming method includes first applying a first signal to a memory cell to attempt to program the memory cell to a desired state, wherein the first signal corresponds to the desired state, after the first applying, determining that the memory cell failed to place in the desired state, after the determining, second applying a second signal to the memory cell, wherein the second signal corresponds to another state which is different than the desired state, and after the second applying, third applying a third signal to the memory cell to program the memory cell to the desired state, wherein the third signal corresponds to the desired state. Additional method and apparatus are described. | 04-28-2016 |
20160118120 | RESISTIVE MEMORY SYSTEM, DRIVER CIRCUIT THEREOF AND METHOD FOR SETTING RESISTANCE THEREOF - A resistive memory system, a driver circuit thereof and a method for setting resistances thereof are provided. The resistive memory system includes a memory array, a row selection circuit, a first control circuit and a second control circuit. The memory array has a plurality of resistive memory cells. The row selection circuit is used for activating the resistive memory cells. The first control circuit and the second control circuit are coupled to the resistive memory cells. When each of resistive memory cells is set, the first control circuit and the second control circuit respectively provide a set voltage and a ground voltage to the each of resistive memory cells to form a set current, and the set current is clamped by at least one of the first control circuit and the second control circuit. | 04-28-2016 |
20160118581 | HETEROJUNCTION OXIDE NON-VOLATILE MEMORY DEVICE - A memory device includes a first metal layer and a first metal oxide layer coupled to the first metal layer. The memory device includes a second metal oxide layer coupled to the first metal oxide layer and a second metal layer coupled to the second metal oxide layer. The formation of the first metal oxide layer has a Gibbs free energy that is lower than the Gibbs free energy for the formation of the second metal oxide layer | 04-28-2016 |
20160125927 | APPARATUS FOR LOW POWER WRITE AND READ OPERATIONS FOR RESISTIVE MEMORY - Described are apparatuses for improving resistive memory energy efficiency. An apparatus performs data-driven write to make use of asymmetric write switch energy between write0 and write1 operations. The apparatus comprises: a resistive memory cell coupled to a bit line and a select line; a first pass-gate coupled to the bit line; a second pass-gate coupled to the select line; and a multiplexer operable by input data, the multiplexer to provide a control signal to the first and second pass-gates or to write drivers according to logic level of the input data. An apparatus comprises circuit for performing read before write operation which avoids unnecessary writes with an initial low power read operation. An apparatus comprises circuit to perform self-controlled write operation which stops the write operation as soon as bit-cell flips. An apparatus comprises circuit for performing self-controlled read operation which stops read operation as soon as data is detected. | 05-05-2016 |
20160125937 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING A LEAKAGE CURRENT SENSING UNIT AND METHOD OF OPERATING THE SAME - A semiconductor integrated circuit device configured for sensing a pure leakage current of a cell array and improving a read error is disclosed. The semiconductor integrated circuit device may include a leakage current sensing unit configured for sensing a pure leakage current of a cell array, and a determination circuit unit configured for comparing a voltage level of the input node with a reference voltage and for determining a state of read data while in a read mode. Whereby an output current may be compared with a read current of the cell array at the input node, and the output current may include the summation of the pure leakage current and a reference current. | 05-05-2016 |
20160125939 | RESISTIVE MEMORY DEVICE AND OPERATING METHOD - Provided are a resistive memory device including a plurality of memory cells, and a method of operating the resistive memory device. The resistive memory device includes a sensing circuit connected to a first signal line, to which a memory cell is connected, the sensing circuit sensing data stored in the memory cell based on a first reference current; and a reference time generator for generating a reference time signal that determines a time point when a result of the sensing is to be output, based on the first reference current. | 05-05-2016 |
20160125940 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE INCLUDING A LEAKAGE CURRENT SENSING UNIT AND METHOD OF OPERATING THE SAME - A semiconductor integrated circuit device and a system including the same, configured for sensing a pure leakage current of a cell array and improving a read error is disclosed. The system a controller and a memory configured to interface with the controller. The memory includes a semiconductor integrated circuit device includes a leakage current sensing unit configured to sense a pure leakage current of a cell array according to a command of the controller; and a determination circuit unit configured to compare a voltage level of an input node with a reference voltage and determine a state of read data while in a read mode. The voltage level of the input node is decided by comparing an output current and a read current and the output current is decided by summing the pure leakage current and a reference current. | 05-05-2016 |
20160125941 | RESISTIVE CHANGE ELEMENT ARRAYS USING RESISTIVE REFERENCE ELEMENTS - Methods for dynamically programming and dynamically reading one or more resistive change elements within a resistive change element array are disclosed. These methods include first pre-charging all of the array lines within a resistive change element array simultaneously and then grounding certain array lines while allowing other array lines to float in order to direct discharge currents through only selected cells. In this way, resistive change elements within resistive change element arrays made up of 1-R cells—that is, cells without in situ selection circuitry—can be reliably and rapidly accessed and programmed. | 05-05-2016 |
20160125942 | RESISTIVE MEMORY DEVICE AND OPERATING METHOD - A method of operating a memory device includes; applying a pre-write voltage to a selected memory cell by applying a first voltage to a first signal line connected to the selected memory cell and a second voltage to a second signal line connected to the selected memory cell during a first set writing interval, wherein a level of the first voltage is higher than a level of the second voltage, and thereafter, applying a write voltage to the selected memory cell by applying a third voltage having a level lower than the level of the first voltage and higher than the level of the second voltage to the first signal line during a second set writing interval. | 05-05-2016 |
20160133320 | SENSE AMPLIFIER INCLUDING A SINGLE-TRANSISTOR AMPLIFIER AND LEVEL SHIFTER AND METHODS THEREFOR - Methods are provided for use with a memory array that includes a selected memory cell coupled to a selected word line and a selected bit line, with the selected word line biased at a read voltage. The method include coupling a sense amplifier to the selected bit line, the sense amplifier including a capacitor integrator, a single-transistor amplifier and a level shifter, maintaining the selected bit line at a voltage of substantially 0V using the single-transistor amplifier and the level shifter, and integrating a selected bit line current on the capacitor integrator. | 05-12-2016 |
20160133321 | Memory Devices and Related Methods - A resistive memory device. Implementations may include an array of memory cells including resistive memory elements which are coupled to isolation transistors and which may include a magnetic tunnel junction. A decoder decodes input address information to select a row of the array. A binarizer coupled to the memory array assigns binary weights to outputs of the memory array output through bit lines coupled to the memory cells. A summer sums the binary weighted outputs, and a quantizer generates an output digital code corresponding to data stored in a plurality of memory cells during a prior program cycle. The outputs of the memory array may be currents or voltages. In implementations multiple arrays of memory cells may be utilized and their respective outputs combined to form higher bit outputs, such as eight bit, twelve bit, sixteen bit, and so forth. | 05-12-2016 |
20160133323 | MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A method is for operating a memory device including a plurality of memory cells disposed in regions where a plurality of first signal lines and a plurality of second signal lines cross each other. The method includes applying an initial voltage to the plurality of first signal lines, floating the plurality of first signal lines to which the initial voltage is applied, applying a second inhibit voltage to the plurality of second signal lines, and increasing voltage levels of the plurality of first signal lines to a first inhibit voltage level via capacitive coupling between the plurality of first signal lines which are floated and the plurality of second signal lines to which the second inhibit voltage is applied. | 05-12-2016 |
20160133324 | SHAPED DATA ASSOCIATED WITH AN ERASE OPERATION - A method includes, in a data storage device including a resistive memory, receiving an erase command to erase a portion of the resistive memory. The method further includes sending shaped data to be stored at the portion of the resistive memory responsive to the erase command. | 05-12-2016 |
20160133325 | LOW FORMING VOLTAGE NON-VOLATILE STORAGE DEVICE - A three-dimensional array of memory elements that reversibly change a level of electrical conductance in response to a voltage difference being applied across them. The memory elements can be set to a low resistance state and reset to a high resistance state during standard operation by biasing appropriate voltages on the word lines and bit lines. Prior to standard operation, the memory elements undergo a forming operation, during which current through the bit lines is limited. A forming voltage is applied to the memory elements during forming with a polarity such that a higher voltage is applied to anodes and a lower voltage to cathodes. | 05-12-2016 |
20160133343 | ELECTRONIC DEVICE AND METHOD FOR OPERATING ELECTRONIC DEVICE - An electronic device comprising a semiconductor memory unit that may include a plurality of data transfer lines; a plurality of columns including a plurality of memory cells; at least one redundancy column including a plurality of redundancy memory cells and configured to replace at least one column among the plurality of columns; a repair select information generation unit configured to store a column address of the at least one column to be replaced among the plurality of columns and generate a plurality of repair select information in response to the stored column address; and a plurality of repair selection units connected with data transfer lines corresponding to them among the plurality of data transfer lines, columns corresponding to them among the plurality of columns and the at least one redundancy column, and each configured to electrically connect a column selected among a column corresponding to it and the at least one redundancy column, to a data transfer line corresponding to it, in response to repair select information corresponding to it among the plurality of repair select information. | 05-12-2016 |
20160141027 | RESISTANCE VARIABLE MEMORY APPARATUS, READ CIRCUIT UNIT AND OPERATION METHOD THEREFOR - A resistance variable memory apparatus may include: a memory cell array; and a read circuit unit configured to receive a cell current, generate a digital code by repeating a cyclic analog-to-digital conversion (ADC) process a designated number of times, generate read data from the digital code, and output the generated read data during a normal read mode for the memory cell array, and to generate test data corresponding to the cell current and output the generated test data during a test read mode for the memory cell to array. | 05-19-2016 |
20160141030 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device has at least one memory cell using a resistance variable element, and a control circuit which controls writing to and reading from the memory cell. Operations by the control circuit include a first writing operation, a second writing operation, and a rewriting operation. The first writing operation is a writing operation for applying a first voltage of a first polarity to the memory cell. The second writing operation is a writing operation for applying a second voltage of a second polarity opposite to the first polarity to the memory cell. The rewriting operation is a writing operation for, when the first writing operation fails, further executing a second A writing operation for applying the second voltage of the second polarity to the memory cell and a first A writing operation for applying the first voltage of the first polarity to the memory cell. | 05-19-2016 |
20160148664 | TAMPER-RESISTANT NON-VOLATILE MEMORY DEVICE - A non-volatile memory device includes a memory cell array including memory cells, each having a resistance value reversibly transitioning among resistance value ranges in a variable state in accordance with application of different electrical signals, a control circuit that, in operation, receives a control signal, a read circuit that, in operation, obtains pieces of resistance value information each relating to the resistance value of one of the memory cells in accordance with the control signal, and an arithmetic circuit that, in operation, calculates a binary reference value based on at least a part of the pieces of resistance value information. In operation, the read circuit selectively assigns, based on the binary reference value, one of two values to each of the pieces of resistance value information. | 05-26-2016 |
20160148678 | CROSS-POINT MEMORY DEVICE INCLUDING MULTI-LEVEL CELLS AND OPERATING METHOD THEREOF - A method of operating a cross-point memory device, having an array of multilevel cells, includes performing a first reading operation with respect to the multilevel cells through a plurality of sensing operations to determine a first state and performing a second reading operation with respect to the multilevel cells through a plurality of sensing operations to determine a second state. A difference between a level of a first voltage used in a first sensing operation and a level of a second voltage used in a second sensing operation in the first reading operation is different from a difference between a level of a third voltage used in a first sensing operation and a level of a fourth voltage used in a second sensing operation in the second reading operation. | 05-26-2016 |
20160148679 | TAMPER-RESISTANT NON-VOLATILE MEMORY DEVICE - A non-volatile memory device includes a memory cell array including memory cells, a read circuit that, in operation, obtains pieces of resistance value information each relating to the resistance value of one of the memory cells, an arithmetic circuit that, in operation, calculates a binary reference value based on at least a part of the pieces of resistance value information, and a data adjustment circuit. In operation, the read circuit assigns, based on the binary reference value, 0 or 1 to each of the pieces of resistance value information. In operation, the data adjustment circuit determines whether to adjust the binary reference value, in accordance with a difference between the numbers of pieces of digital data “0” and digital data “1” in the pieces of digital data. | 05-26-2016 |
20160148680 | TAMPER-RESISTANT NON-VOLATILE MEMORY DEVICE - A non-volatile memory device includes a memory cell array including memory cells, each having a resistance value reversibly transitioning among resistance value ranges, a read circuit that, in operation, obtains pieces of resistance value information each relating to the resistance value of one of the memory cells, an arithmetic circuit that, in operation, calculates a binary reference value based on at least a part of the pieces of resistance value information, and a write circuit. In operation, the read circuit selectively assigns, based on the binary reference value, one of two values to each of the pieces of resistance value information. In operation, the write circuit performs a first write operation on a memory cell corresponding to one of the two values among the memory cells. | 05-26-2016 |
20160148681 | PARALLEL FORMING OF MEMORY CELLS - A method of parallel forming of memory cells, and an apparatus including a memory and a multiplexer. The memory has an array of memory cells and bit lines, wherein each of the bit lines is associated with a plurality of the memory cells. The multiplexer has a plurality of outputs coupled to a plurality of the respective bit lines. The multiplexer is configured to select in parallel a plurality of the bit lines by applying a forming bias voltage, detect formation of one or more memory cells associated with the selected bit lines, and disconnect from the forming bias voltage any formed memory cells. | 05-26-2016 |
20160148682 | MEMORY DEVICE REDUCING TEST TIME AND COMPUTING SYSTEM INCLUDING THE SAME - A memory device includes memory cell array and an address decoder. The memory cell array includes a normal memory region and a redundant memory region. The normal memory region operates in response to data signal and plurality of normal memory region signals. The redundant memory region operates in response to data signal and plurality of redundant memory region signals. The address decoder includes normal memory region signal generator and redundant memory region signal generator. The normal memory region signal generator activates first normal memory region signals and redundant memory region signal generator activates first redundant memory region signal simultaneously when address decoder operates in test mode. First normal memory region signals correspond to an address signal and are included in plurality of normal memory region signals. A first redundant memory region signal corresponds to an address signal and is included in the plurality of redundant memory region signals. | 05-26-2016 |
20160148683 | RESISTIVE MEMORY DEVICE AND METHOD OF OPERATING THE SAME - A memory device includes a memory cell array having multiple memory cells arranged respectively in regions where first signal lines cross second signal lines. The memory device further includes a decoder having multiple line selection switch units connected respectively to the of first signal lines. Each of the multiple line selection switch units applies a bias voltage to a first signal line corresponding to each of the multiple line selection switch units in response selectively to a first switching signal and a second switching signal, voltage levels of which are different from each other in activated states. | 05-26-2016 |
20160148684 | RESISTIVE RANDOM ACCESS MEMORY AND MANUFACTURING AND CONTROL METHODS THEREOF - A high-reliability resistive random access memory (RRAM). A memory cell of a memory cell array is controlled via a word line, a bit line and a source line. The control unit of the RRAM has a word line decoder, a bit line decoder, and a source line decoder and switch circuit. The word line decoder, the bit line decoder and the source line decoder respectively control the voltage applied to the word line, the voltage applied to the bit line, and the voltage applied to the source line. The switch circuit is switched between a first state and a second state to operate the bit line decoder to apply a voltage to the bit line to read the memory cell and to operate the source line decoder to apply a voltage to the source line to read the memory cell alternately. | 05-26-2016 |
20160148685 | RESISTIVE MEMORY WITH PROGRAM VERIFY AND ERASE VERIFY CAPABILITY - A resistive non-volatile memory cell is programmed. A programming voltage is applied to a first terminal of the resistive non-volatile memory cell. Sensing, during the applying the programming voltage, determines if the resistive non-volatile memory cell has been programmed. Current is limited through the resistive non-volatile memory cell to a first magnitude. After a predetermined time, if the sensing has not detected that the resistive non-volatile memory cell has been programmed, the current through the resistive non-volatile memory cell is limited to a second magnitude greater than the first magnitude. The resistive non-volatile memory cell is also erased. | 05-26-2016 |
20160148687 | DEVICES AND METHODS FOR WRITING TO A MEMORY CELL OF A MEMORY - A method for writing to a memory is disclosed. The method includes generating a write current that flows to a memory cell of the memory, generating a mirror current that mirrors the write current, and inhibiting application of a write voltage to the memory cell of the memory based on the mirror current. A device that performs the method is also disclosed. A memory that includes the device is also disclosed. | 05-26-2016 |
20160149130 | Two Stage Forming of Resistive Random Access Memory Cells - Provided are memory cells, such as resistive random access memory (ReRAM) cells, each cell having multiple metal oxide layers formed from different oxides, and methods of manipulating and fabricating these cells. Two metal oxides used in the same cell have different dielectric constants, such as silicon oxide and hafnium oxide. The memory cell may include electrodes having different metals. Diffusivity of these metals into interfacing metal oxide layers may be different. Specifically, the lower-k oxide may be less prone to diffusion of the metal from the interfacing electrode than the higher-k oxide. The memory cell may be formed to different stable resistive levels and then resistively switched at these levels. Each level may use a different switching power. The switching level may be selected a user after fabrication of the cell and in, some embodiments, may be changed, for example, after switching the cell at a particular level. | 05-26-2016 |
20160155499 | MEMORY DEVICES | 06-02-2016 |
20160155500 | RESISTIVE MEMORY DEVICES AND METHODS OF CONTROLLING THE SAME | 06-02-2016 |
20160155501 | METHOD OF PROGRAMMING A RESISTIVE RANDOM ACCESS MEMORY | 06-02-2016 |
20160155502 | Method for Operating a Conductive Bridging Memory Device | 06-02-2016 |
20160155505 | RESISTIVE MEMORY AND REPAIRING METHOD THEREOF | 06-02-2016 |
20160163384 | PAGE PROGRAMMING SEQUENCES AND ASSIGNMENT SCHEMES FOR A MEMORY DEVICE - Embodiments of the invention are directed towards a memory device comprising a plurality of wordlines each coupled to a row of memory cells in a subtile of the memory device, a plurality of level one column select circuits coupled to each cell in a plurality of groups of cells in a subtile, a plurality of level two column select circuits coupled to each of the plurality of groups of cells in the subtile, a common bit line coupled to the plurality of level one column select circuits and the plurality of level two column select circuits, the common bit line also coupled to a sense and program circuit, wherein the sense and program circuit addresses each first cell in each of the groups of cells to form a single page of memory. | 06-09-2016 |
20160163981 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF CONTROLLING THE SAME - According to one embodiment, a semiconductor memory device includes a plurality of first wirings, a plurality of second wirings, a variable resistance layer, a first barrier insulating layer, and a second barrier insulating layer. The first wirings are disposed at predetermined pitches in a first direction intersecting with a substrate. The second wirings are disposed at predetermined pitches in a second direction intersecting with the first direction. The second wirings are formed to extend in the first direction. The variable resistance layer is disposed between the first wiring and the second wiring. The variable resistance layer is disposed at a position where the first wiring intersects with the second wiring. The first barrier insulating layer is disposed between the first wiring and the variable resistance layer. The second barrier insulating layer is disposed between the second wiring and the variable resistance layer. | 06-09-2016 |
20160172024 | Non-Volatile SRAM With Multiple Storage States | 06-16-2016 |
20160172025 | ACCESS SIGNAL ADJUSTMENT CIRCUITS AND METHODS FOR MEMORY CELLS IN A CROSS-POINT ARRAY | 06-16-2016 |
20160172026 | SEMICONDUCTOR MEMORY DEVICES HAVING SEPARATE SENSING CIRCUITS AND RELATED SENSING METHODS | 06-16-2016 |
20160172028 | RESISTIVE MEMORY DEVICE INCLUDING COLUMN DECODER AND OPERATING METHOD THEREOF | 06-16-2016 |
20160172030 | METHODS, ARTICLES AND DEVICES FOR PULSE ADJUSTMENTS TO PROGRAM A MEMORY CELL | 06-16-2016 |
20160172031 | Memory Systems and Memory Programming Methods | 06-16-2016 |
20160172032 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF CONTROLLING SEMICONDUCTOR MEMORY DEVICE | 06-16-2016 |
20160172033 | STORAGE DEVICE WRITE PULSE CONTROL | 06-16-2016 |
20160172059 | APPARATUS FOR BOOSTING SOURCE-LINE VOLTAGE TO REDUCE LEAKAGE IN RESISTIVE MEMORIES | 06-16-2016 |
20160172420 | SEMICONDUCTOR DEVICE WITH A STOICHIOMETRIC GRADIENT | 06-16-2016 |
20160181320 | ELECTRONIC DEVICE | 06-23-2016 |
20160181517 | Geometrically Enhanced Resistive Random Access Memory (RRAM) Cell And Method Of Forming Same | 06-23-2016 |
20160189771 | APPARATUSES AND METHODS FOR SENSING USING AN INTEGRATION COMPONENT - The present disclosure includes apparatuses and methods for sensing a resistance variable memory cell. A number of embodiments include circuitry to provide a programming signal to a memory cell in the array, the programming signal associated with programming the memory cell to a particular data state; and determine, via an integration component, if a data state of the memory cell changes to a different data state responsive to the programming signal being provided. | 06-30-2016 |
20160189772 | SYSTEM AND A METHOD FOR DESIGNING A HYBRID MEMORY CELL WITH MEMRISTOR AND COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR - The embodiments herein relates to a hybrid non-volatile memory cell system and architecture for designing integrated circuits. The system comprises CMOS access transistor connected to a memristor which stores a data based on a resistance. The system has a word line for accessing the hybrid memory and two bit lines carrying data of mutually opposite values for transferring a data from the memory. The two terminals of the transistor are connected respectively to a first terminal of the memristor and to a first bit line. The gate terminals of the transistors are coupled together to form a word line. The access transistors control the two bit lines during a read and write operation. A control logic performs a read and write operation with the hybrid memory cells. The memory architecture prevents a power leakage during data storage and controls a drift in a state during a read process. | 06-30-2016 |
20160189773 | APPARATUS TO STORE DATA AND METHODS TO READ MEMORY CELLS - Apparatus to store data and methods to read memory cells are disclosed. A disclosed example method involves, during a read cycle of a memory cell, applying a current across the memory cell to read a content of the memory cell. During a subsequent read cycle of the memory cell, a subsequent current is applied across the memory cell in the opposite direction to read the content of the memory cell. | 06-30-2016 |
20160189776 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF CONTROLLING THE SAME - A nonvolatile semiconductor memory device includes: a memory cell array; and a control circuit that controls a voltage applied to this memory cell array. The memory cell array includes: a first wiring line; a second wiring line intersecting the first wiring line; and a memory cell disposed at an intersection of these lines and including a variable resistance element. In a rewrite operation of the memory cell, the control circuit repeatedly perform a pulse application operation and a verify operation, the pulse application operation applying a pulse voltage to the memory cell, and the verify operation applying a first voltage to the memory cell to determine whether the rewrite operation has been completed or not. The control circuit is configured to, in a read operation from the memory cell, apply a second voltage to the memory cell. The second voltage has a voltage value larger than the first voltage. | 06-30-2016 |
20160196873 | SEMICONDUCTOR MEMORY | 07-07-2016 |
20160196874 | RESISTIVE RANDOM-ACCESS MEMORY CELLS | 07-07-2016 |
20160203859 | SEMICONDUCTOR INTEGRATED CIRCUIT | 07-14-2016 |
20160203860 | LOOK-UP TABLE CIRCUIT AND NONVOLATILE MEMORY DEVICE | 07-14-2016 |
20160203861 | Memory Cells, Memory Systems, and Memory Programming Methods | 07-14-2016 |
20160203862 | MEMORY DEVICE AND ACCESS METHOD | 07-14-2016 |
20160203867 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE | 07-14-2016 |
20160254048 | SENSE AMPLIFIER LOCAL FEEDBACK TO CONTROL BIT LINE VOLTAGE | 09-01-2016 |
20160254051 | Memory Systems and Memory Programming Methods | 09-01-2016 |
20160379695 | DIGITALLY TRIMMABLE INTEGRATED RESISTORS INCLUDING RESISTIVE MEMORY ELEMENTS - Embodiments include a resistor, coupled on a signal path, that includes one or more resistive memory elements, such as one or more magnetic tunnel junctions (Mils). The resistance of the resistive memory elements may be digitally trimmable to adjust a resistance of the resistor on the signal path. The resistor may be incorporated into an analog or mixed signal circuit to pass an analog signal on the signal path. Other embodiments may be described and claimed. | 12-29-2016 |
20160379708 | MEMORY DEVICE - According to one embodiment, a memory device includes a sense amplifier including a first input node and a second input node, a first path including a memory cell to be selectively connected to the first input node, and a second path including a reference cell to be selectively connected to the second input node, and is configured to change an input value at the second input node in accordance with the state of the memory cell. | 12-29-2016 |
20160379710 | 2T-1R ARCHITECTURE FOR RESISTIVE RAM - A memory device includes a plurality of resistive memory cells and a plurality of word lines. Each resistive memory cell includes a resistive memory element, a first switching element electrically coupled in series with the resistive memory element, and a second switching element electrically coupled in series with the first switching element. The first switching element and the second switching element in each resistive memory cell is coupled to different ones of the word lines. | 12-29-2016 |
20160379711 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND ITS OPERATION PROGRAM - According to one embodiment, an operation program of a nonvolatile semiconductor memory device includes: a first step for determining whether data has been sufficiently written to all of a plurality of addresses to which data is to be written; and a second step for writing data to an address to which data has not been sufficiently written among the plurality of addresses to which data is to be written and not writing data to an address to which data has been sufficiently written. The first step and the second step are repeated a predetermined number of times. | 12-29-2016 |
20170236581 | METHOD AND APPARATUS FOR READING RRAM CELL | 08-17-2017 |
20180025767 | METHOD AND SYSTEM FOR DETERMINING MARKET ESTIMATES WITH MARKET BASED MEASURES | 01-25-2018 |
20180025778 | NON-VOLATILE MEMORY DEVICE | 01-25-2018 |
20180025779 | Nonvolatile Nanotube Switches and Systems Using Same | 01-25-2018 |
20180025790 | REDUNDANT COLUMN OR ROW IN RESISTIVE RANDOM ACCESS MEMORY | 01-25-2018 |
20190147949 | MEMORY SYSTEM | 05-16-2019 |
20190147950 | METHOD FOR PROGRAMMING RESISTIVE MEMORY CELL AND NONVOLATILE MEMORY DEVICE THEREOF | 05-16-2019 |