Class / Patent application number | Description | Number of patent applications / Date published |
361710000 | Details | 75 |
20080212285 | ELECTRONIC EQUIPMENT AND HEAT DISSIPATING DEVICE IN THE ELECTRONIC EQUIPMENT - An electronic equipment includes a chassis, and a heat dissipating device. The chassis includes a sidewall defining an opening therein. The heat dissipating device includes a plate fixed to the sidewall of the chassis, and a plurality of parallel fins perpendicularly projecting from one side of the plate. The fins are exposed out of the chassis from the opening. Each two of the fins defines a channel therebetween, and the plate defines a plurality of vents therein communicating with each of the channels. | 09-04-2008 |
20080218976 | RETENTION MODULE FOR A HEAT SINK - A retention module ( | 09-11-2008 |
20080225492 | Electronic Device and Heat Sink - To provide an electronic device which can prevent that a heat sink constituting a source of the unnecessary radiation of electromagnetic waves with a simple structure. The electronic device which contains the heat sink in the case is constituted. | 09-18-2008 |
20080239674 | MECHANICAL HOUSING - An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing. | 10-02-2008 |
20080247140 | Arrangement having at least one electronic component - The invention relates to an arrangement comprising at least one electronic component ( | 10-09-2008 |
20080253092 | Heat Dissipation System for Photovoltaic Interconnection System - A heat dissipation system for a photovoltaic array interconnection system includes an enclosure and a heat dissipating assembly. The heat dissipating assembly includes a heat dissipating portion and at least one heat emitting electrical component. Each heat emitting electrical component has a heat sink element attached thereto for dissipating heat generated by the heat emitting electrical component. The heat dissipating portion is sufficiently proximate to at least an additional portion of the at least one heat emitting electrical component to further dissipate heat generated by the at least one heat emitting electrical component. The heat dissipating portion includes at least one electrical contact electrically connected to the at least one heat emitting electrical component. The enclosure is configured for receiving at least a portion of the heat dissipating portion and for receiving external power input wiring by electrical contact with the at least one electrical contact. | 10-16-2008 |
20080278915 | CHASSIS MOUNTED HEAT SINK SYSTEM - A heat sink for an electronics enclosure is disclosed. The heat sink comprises a thermal conduction section with an inner surface and an outer surface, the thermal conduction section having an extended profile that tapers from a first end having a first thickness to a second end having a second thickness that is larger than the first thickness. A mounting plate is contiguous with the second end, and the mounting plate is configured to couple the heat sink to a chassis of the electronics enclosure. A thermal interface pad is coupled to the outer surface of the thermal conduction section. | 11-13-2008 |
20080285237 | Finned Heat Sink, Particularly for a Thermoelectric Module - The heat sink, particularly for a thermoelectric module, is of the kind formed of a plurality of first fin plates and second spacer plates, alternately disposed side by side and in contact with one another, and comprises fastening members which extend through the first and second plates for fastening one to the other. Each of said first and second plates has on one side at least a protrusion and on the opposite side at least a recess. The protrusion on one side of said first and second plates engages into the recess on a facing side of said second and first plates, respectively, with a positive fit. The protrusion on one side and the recess on the opposite side of said first and second plates are disposed out of alignment relative to a straight line on the plane of the plates intersecting the axis of the fastening members. | 11-20-2008 |
20080285238 | GROUNDING A HEAT SINK IN THERMAL CONTACT WITH AN ELECTRONIC COMPONENT USING A GROUNDING SPRING HAVING MULTIPLE-JOINTED SPRING FINGERS - A grounding spring for electromagnetic interference (EMI) suppression is interposed between a heat sink and a printed circuit board (PCB). The grounding spring comprises a conductive material having an opening formed at its base through which the heat sink makes thermal contact with an electronic module mounted on the PCB. The base makes electrical contact with a peripheral surface of the heat sink, and multiple-jointed spring fingers extend from the base to make electrical contact with conductive pads on the PCB. During compression, the movement of each spring finger's tip is substantially limited to the z-axis. Accordingly, the final installed location of the tip can be precisely controlled even when the grounding spring must accommodate a wide variety of installed heights of the heat sink relative to the PCB. Preferably, the spring fingers terminate with a concave tip that is less susceptible to sliding off the conductive pads. | 11-20-2008 |
20080298022 | HEAT SINK ASSEMBLY HAVING A LOCKING DEVICE ASSEMBLY - A heat sink assembly comprises a heat sink ( | 12-04-2008 |
20090040729 | HEAT SINK ASSEMBLY - A heat sink assembly includes a heat sink and a clip assembly received in the heat sink. The clip assembly comprises a clip and a movable fastener pivotally connected to the clip via a pair of supporters. Each supporter defines a pivot hole deviated from a center thereof and a retaining slot above the pivot hole. The clip comprises a main body received in the heat sink and two arms extending from the main body and pivotally received in the retaining slots of the supporters. The movable fastener pivotally extends in the pivot holes of the supporters. The movable fastener moves relative to the heat sink and causes rotation of the supporters in a matter such that a distance from the main body of the clip to a bottom of the heat sink is changed, whereby the clip assembly can provide adjustable spring force acting on the heat sink. | 02-12-2009 |
20090040730 | HEAT DISSIPATION DEVICE HAVING A ROTATABLE FASTENER - A heat dissipation device includes a heat sink, a retention module and a rotatable fastener for securing the heat sink to the retention module. The retention module includes two supporting ribs and a positioning block above one of the supporting ribs. The rotatable fastener is rotatably received in the retention module and includes an actuating portion and a pressing portion fastened to the actuating portion. The heat sink rests on the supporting ribs of the retention module with an end thereof being pressed by the positioning block, and an opposite end thereof being pressed by the pressing portion. The rotatable fastener can be rotated to an unlocked position wherein the pressing portion is moved away from the opposite end of the heat sink, so that the heat sink is removable from the retention module. | 02-12-2009 |
20090059535 | Cooling device coated with carbon nanotube and of manufacturing the same - Provided are a cooling device coated with carbon nanotubes and method of manufacturing the same. Carbon nanotubes are dispersively coated on a surface of the cooling device that radiates generated by a predetermined apparatus or component through thermal exchange. Thus, a carbon nanotube structure is formed so that the cooling device can improve in a thermal radiation characteristic and become small-sized. As a result, electronic devices can be downscaled and heat generated by a highly integrated electronic circuit chip can be effectively radiated, thus increasing lifetime and performance of an operating circuit. | 03-05-2009 |
20090059536 | HEAT DISSIPATION ASSEMBLY - A heat dissipation assembly includes a heat sink, a retention module surrounding the heat sink, and a pair of wire clips pivotably attached to the retention module to press the heat sink against an electronic component on a printed circuit board. The retention module includes three walls surrounding a rectangular opening through which the heat sink contacts with the electronic component. Two barbs and two supporting members are formed on the three walls. Each clip includes a pivoting section retained in one supporting member, an abutting section pressing the heat sink toward the electronic component, and a locking section locked with one barb, a connecting section connecting the abutting section with the pivoting section, and a handle formed from the locking section. Each clip is entirely located at a corresponding side of the heat sink. | 03-05-2009 |
20090073660 | COOLING APPARATUS FOR ELECTRONIC DEVICES - In accordance with certain embodiments, a heat sink has a mounting base, a core structure extending outwardly from the mounting base, and a plurality of fins extending outwardly from the core structure in a direction parallel to the mounting base, wherein the core structure is at least partially elongated in the direction parallel to the mounting base toward outer extremities of the plurality of fins. | 03-19-2009 |
20090086438 | LED ELEMENT AND PRINTED CIRCUIT BOARD WITH THE SAME - Disclosed is a printed circuit board (PCB) comprising at least one light emitting diode (LED) element and a PCB body. The LED comprises a heat sink, a light emitting body and two base feet, each base foot comprising a support portion for supporting the light emitting body, an engaging portion and a connecting portion for connecting the support portion to the engaging portion, and the heat sink is disposed under the support portion. The PCB body comprises a first recess portion for disposing the heat sink to increase heat dissipation of the heat sink and two second recess portions for receiving the engaging portions of the base feet to increase heat dissipation of the base feet. | 04-02-2009 |
20090091891 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a package main body having a base portion and a semiconductor device accommodating portion, electric terminals electrically connected to a semiconductor device in the accommodating portion and exposed to an outer surface, and a high heat transfer element disposed in the base portion to extend from a heat generation site corresponding position corresponding to a heat generating site of the semiconductor device to a position in an outside of the heat generation site corresponding position. The base portion is configured by bringing a plurality of thin plates in close contact with each other to bond them integrally, and the high heat transfer element includes at least one combination of fluid passage formed in the base portion and a heat transfer fluid sealed in the passage, or at least one heat pipe. | 04-09-2009 |
20090129026 | Heat sink for semiconductor device and semiconductor module assembly including the heat sink - Provided are a heat sink and a heat sink semiconductor module assembly which may include an improved, cooling function. Each of the heat sinks may include a flat heat sink base having a first surface attached to semiconductor devices and a second surface externally exposed; first fins provided on a portion of the second surface of the heat sink base to which no clip is coupled; and second fins provided on portions of the second surface of the heat sink base to which a clip may be coupled. The semiconductor module assembly may secure the heat sinks to both surfaces of a semiconductor module using the clip. Accordingly, air may flow smoothly through the second fins on the portions to which the clip may be coupled, thereby improving the cooling function of the heat sinks. | 05-21-2009 |
20090141454 | HEAT DISSIPATING MODULE - A heat dissipating module including a first heat sink, a second heat sink, a connector, a pivot and a heat pipe is provided. The first heat sink is disposed on a circuit board and contacts a heat source. The second heat sink has a first pivotal hole and a limiting opening. The connector has a first connecting portion and a second connecting portion. The first connecting portion is fixedly connected to the first heat sink. The second connecting portion has a limiting protrusion and a second pivotal hole corresponding to the first pivotal hole. The pivot passes through the first pivotal hole and the second pivotal hole and is pivotally connected to the connector and the second heat sink. The limiting protrusion protrudes into the limiting opening to limit the rotation angle of the second heat sink relative to the connector. | 06-04-2009 |
20090168359 | HEAT SINK - A heat sink includes a plurality of parallel fins ( | 07-02-2009 |
20090168360 | CLAMP FOR ELECTRICAL DEVICES - An assembly for clamping electrical components against a heat-dissipating surface of a heat sink may include the heat sink, one or more electrical components, two or more springs, and a fastener. Each of the springs may include a first surface, and a second surface opposite the first surface. The second surface of each of the springs may include an attachment region and two contact regions. The attachment region may be between the two contact regions. The second surface of one of the springs may overlap the first surface of another one of the springs. Each of the springs may be positioned to hold the electrical components against the heat dissipating surface of the heat sink. Each of the two contact regions of each of the springs may be positioned to hold the electronic components against the heat-dissipating surface. The fastener may couple the springs together in the attachment region of each of the springs and may further couple the springs to the heat sink. | 07-02-2009 |
20090175006 | HONEYCOMB HEAT DISSIPATING APPARATUS - A honeycomb heat dissipating apparatus made of a composite metal material includes honeycomb cells that are integrally formed by vacuum die casting, and continuous convex and concave distal surfaces disposed around the periphery of the heat dissipating apparatus, and an adjacent surface of each cell is a thin surface, and the heat dissipating apparatus can be in a standalone mode, or combined with other heat dissipating apparatuses. One or more honeycomb heat dissipating apparatuses can be installed on a circuit board or an electronic component of a lamp or an electric appliance, such that the heat dissipating apparatus can dissipate heat quickly by the honeycomb cells without occupying much space. The invention can increase the heat dissipating area for a faster heat dissipating effect and change the stylish appearance to achieve the aesthetic effect. | 07-09-2009 |
20090195990 | Heat sink - The present invention seeks to provide a novel heat sink capable of being effectively produced at a low cost and having excellent heat dissipation performance. The heat sink comprises fins | 08-06-2009 |
20090244849 | HEAT DISSIPATION DEVICE - A heat dissipation device attached to a top surface of an electronic device mounted on a printed circuit board, includes a heat sink and a retainer securing the heat sink onto the electronic device. The retainer includes a frame, a plurality of baffle walls and protrusion posts extending downwardly from the frame. Lower ends of the baffle walls of the retainer extend downwardly through the heat sink and engage with engaging edges of the electronic device. The heat dissipation device is further provided with a plurality of elastic members which respectively surround the protrusion posts of the retainer and are compressed between the retainer and the heat sink, thereby pushing the heat sink downwardly toward the electronic device. | 10-01-2009 |
20090268408 | HEAT SINK ASSEMBLY - A heat sink assembly for an add-on card includes a heat sink and a clip received in the heat sink. The heat sink includes a supporting plate and a first and a second heat absorbing plates extending downwardly from the supporting plate. The first and second heat absorbing plates sandwich first and second heat conductive plates and the add-on card therebetween. The supporting plate is located over and spaced from the add-on card. The clip includes a resisting member, first and second engaging members and first and second pressing members. The resisting member is received in the heat sink and abuts upwardly against the supporting plate of the heat sink. The first and second engaging members engage with the first and second heat absorbing plates, respectively. The pressing members abut downwardly against a clasp clasping the conductive plates and the add-on card together. | 10-29-2009 |
20090268409 | HEAT DISSIPATION ASSEMBLY - A heat dissipation assembly has a containment apparatus preventing unwanted migration of a thermal interface material to surrounding areas on a top surface of a heat sink. The containment apparatus includes a cap correspondingly covering the thermal interface material and an annular frame extending downwardly from a bottom end of the cap and attached to a periphery of a top of the heat sink. The cap includes a ceiling and a plurality of inclined sidewalls extending downwardly and outwardly from edges of the ceiling, thereby forming a protective space within the cap combining with the top surface of the heat sink to enclose the thermal interface material. Two ears extend outwardly from the frame and accommodate opposite ends of an abutting body of a wire clip therein. | 10-29-2009 |
20090279265 | ELECTRONIC DEVICE MOUNTING APPARATUS AND RESONANCE SUPPRESSION METHOD THEREOF - A heat sink plate is mounted on an electronic device for heat radiation of the electronic device. When the fundamental wave or a harmonic wave of the clock signal of the electronic device is coincide with the size of the heat sink plate, the heat sink plate resonates and large clock signal harmonic wave noise is radiated. For suppressing the noise, a dielectric strip is mounted on an edge portion of the heat sink plate. By this dielectric strip, the resonance frequency of the heat sink plate varies so that the resonance can be suppressed. | 11-12-2009 |
20090284929 | HEAT DISSIPATION ASSEMBLY - A heat dissipation assembly ( | 11-19-2009 |
20090303685 | Interface module with high heat-dissipation - This invention relates to an interface module with high heat dissipation, comprising a metal base, an electrical insulation layer with high heat-conductivity and a metal circuit. The electrical insulation layer with high heat-conductivity is provided on the heat absorption end surface of the metal base, and the metal circuit is formed on the electrical insulation layer with high heat-conductivity for the direct mounting of various electronic components such as chip or LED etc. thereon. In this manner, the function of conventional circuit board, heat sink paste and a part or the whole heat sink unit can be substituted by the interface module with high heat-dissipation such that the waste heat generated by electronic component can be transferred out directly through the interface module with high heat-dissipation so as to solve such problem concerned with heat dissipation as heat jamming in the package area. | 12-10-2009 |
20100020501 | HEAT DISSIPATION DEVICE - A heat dissipation device comprises a heat spreader and heat pipe soldered thereon via a heat conducting material. The heat spreader defines a plurality of cavities in an inner side surface thereof, the heat conducting material is received in the cavities, and the heat pipe contacts and is soldered to the inner side surface of the heat spreader. | 01-28-2010 |
20100039776 | MOTOR CONTROLLER - A motor controller which is inexpensive and has high cooling performance by using an extrusion heat sink ( | 02-18-2010 |
20100046172 | ELECTRONICS PACKAGE INCLUDING HEAT SINK IN THE HOUSING AND RELATED METHODS - An electronics package may include a housing and electronic circuitry carried thereby. The housing may include a first metallic material having a first coefficient of thermal expansion (CTE) and having an array of openings therein. The electronics package may also include a thermally conductive body within each of the openings in the array thereof to thereby define a heat sink for the electronic circuitry. Each of the thermally conductive bodies may include a second metallic material having a second CTE substantially different from the first CTE. | 02-25-2010 |
20100046173 | Method and System for Adapting a Mobile Computing Device with a Grounded Metallic Housing - Devices and systems are for adapting a mobile computing device, such as a handheld radio frequency identification (“RFID”) reader, with a grounded metallic housing substrate without impacting the performance of the device. The device includes a heat generating component, and a heat sink in thermal contact with the heat generating component, the heat sink including at least one thermally conductive material. The system includes a mobile computing device including a heat generating component, and a heat sink in thermal contact with the heat generating component, the heat sink including at least one thermally conductive material. | 02-25-2010 |
20100061063 | Process for Preparing Conductive Films and Articles Prepared Using the Process - A free standing film includes: i. a matrix layer having opposing surfaces, and ii. an array of nanorods, where the nanorods are oriented to pass through the matrix layer and protrude an average distance of at least 1 micrometer through one or both surfaces of the matrix layer. A method for preparing the free standing film includes (a) providing an array of nanorods on a substrate, optionally (b) infiltrating the array with a sacrificial layer, (c) infiltrating the array with a matrix layer, thereby producing an infiltrated array, optionally (d) removing the sacrificial layer without removing the matrix layer, when step (b) is present, and (e) removing the infiltrated array from the substrate to form the free standing film. The free standing film is useful as an optical filter, ACF, or TIM, depending on the type and density of nanorods selected. | 03-11-2010 |
20100073884 | LIGHT ENGINE, HEAT SINK AND ELECTRICAL PATH ASSEMBLY - An assembly includes a conductive heat sink, a heat generating device, such as a light emitting diode, mounted on the heat sink, a pair of pins which extend through channels provided through the heat sink, and a pair of sleeves which at least partially surrounds the pins to electrically isolate the pins from the heat sink. The assembly can be used to form a lightbulb. | 03-25-2010 |
20100103624 | HEAT DISSIPATING DEVICE WITH TEMPERATURE DETECTING FUNCTION - A heat dissipating device with a temperature detecting function includes a heat sink module, a temperature detecting unit, a control unit, and a display unit. The heat sink module is configured for dissipating heat for a heat-generating electrical device. The temperature detecting unit is capable of sensing a temperature of the heat sink module, and converting an analog signal of the sensed temperature to a digital signal. The control unit transforms the digital signal to a display signal. The display unit receives the digital signal for displaying the sensed temperature. | 04-29-2010 |
20100118496 | HEAT SINK FOR MODULAR LED FLOOD LIGHT - A heat sink which is adaptable to form a module of a modular luminaire which uses LED light sources. The heat sink may have cooling fins projecting in three directions from a base member and two walls projecting from the base member. Fastener holes are provided as channels extending the length of the heat sink at the base of cooling fins, for example. This configuration enables a novel heat sink having both cooling fins and also structure corresponding to screw holes to be formed by extrusion. One channel may be centered within the heat sink, so that the heat sink can be connected by two opposed fasteners and rotated thereabout to enable minor angular positional adjustment within an associated luminaire. | 05-13-2010 |
20100128442 | HEAT SINK ASSEMBLY - A heat sink assembly includes a printed circuit board, a socket attached on a top surface of the board for receiving a chip, and a heat sink attached onto the chip of the board. The socket includes a plurality of legs integrally extending down from a bottom surface of the socket. The legs contact the top surface of the board to support the socket on the board. The heat sink includes a base, a plurality of fins extending up from the base, and a plurality of legs extending down from the base. | 05-27-2010 |
20100128443 | HEAT DISSIPATING MODULE - A heat dissipating module is mounted on a circuit board. The circuit board includes at least an insertion hole. The heat dissipating module includes a heat sink and at least a fixing element. The heat sink has at least a guiding track, wherein at least an electronic component is attached on the heat sink or the circuit board. The fixing element includes a first fixing part and a second fixing part. The first fixing part is embedded in the guiding track. The second fixing part is partially penetrated through the insertion hole and sustained against a lower surface of the circuit board, thereby facilitating fixing the heat sink on the circuit board. | 05-27-2010 |
20100142152 | FASTENER AND HEAT SINK ASSEMBLY HAVING THE SAME - A fastener includes a fastener post, a sleeve, a nut and an elastic element. The fastener post includes a shaft, a tapered portion and a threaded portion. The sleeve includes a smooth portion and a clamp portion having a number of resilient strips. The nut is threaded onto the threaded portion. The elastic element is disposed around the sleeve and compressed between the nut and an ear of a heat sink to generate a resilient force. The resilient force moves the tapered portion of the fastener post into the sleeve such that the strips of the clamp portion of the sleeve are tilted outwardly to tightly abut against a bottom of a printed circuit board on which the heat sink is mounted. | 06-10-2010 |
20100142153 | HEAT SINK DEVICE WITH A SHIELDING MEMBER - A heat sink device mounted on a circuit board including an electronic component includes a heat sink to dissipate heat generated by the electronic component and a shielding member electrically connecting the circuit board and the heat sink to prevent the electronic component from electromagnetic interference (EMI). The heat sink includes a base, a plurality of heat fins extending upwardly from the base, and a plurality of receiving grooves defined in the base. The plurality of receiving grooves are arranged in rows around the plurality of heat fins. The shielding member includes a plurality of contact plates abutting against the circuit board and a plurality of receiving plates received in the plurality of receiving grooves. | 06-10-2010 |
20100157540 | FIN-TYPE HEAT SINK AND ELECTRONIC DEVICE USING SAME - A heat sink includes two heat spreaders spaced from each other and a plurality of heat dissipation fins connected between the two heat spreaders. The heat dissipation fin is wave-shaped from one of the heat spreaders to the other one of the heat spreaders. The heat dissipation fins are spaced from each other. When a force is applied to two heat spreaders of the heat sink, the heat dissipation fin is resiliently deformed to change a distance between the two heat spreaders. The present disclosure also discloses an electronic device incorporating the heat sink and the heat dissipation fin. | 06-24-2010 |
20100157541 | HEAT SINK AND ELECTRONIC DEVICE USING SAME - An electronic device includes a shell, an electronic component received in the shell, and a heat sink arranged between the electronic component and the shell. The heat sink includes a first heat spreader attaching to the electronic component, a second heat spreader spaced from the first heat spreader, and a plurality of fins between the first and second heat spreaders. Each fin includes a pair of contacting portions, a pair of bending portions and a connecting portion each of which being flat. The contacting portions are respectively connected to the two heat spreaders. The bending portions respectively extend from the contacting portions towards each other. Each bending portion forms a rear end adjacent to the other bending portion. The connecting portion interconnects the rear ends of the bending portions at opposite ends thereof. | 06-24-2010 |
20100172103 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a connecting member and a wire-shaped clip. The base thermally contacts with an electronic component mounted on a printed circuit board. The connecting member encloses the base therein and is secured to a periphery of the base. A plurality of clasps extends upwardly from the connecting member. The clip is clasped by the clasps of the connecting member to be attached thereto. The clip is pressed downwardly to engage with a plurality of hooks of a bracket around the electronic component of the printed circuit board to make the base intimately contact with the electronic component. | 07-08-2010 |
20100177482 | MOUNTING SOCKET THAT DISSIPATES HEAT FROM A NETWORK DEVICE - A socket for mounting a network device is provided. The socket includes a top portion and a bottom portion. The top portion and bottom portion are sized to engage with a network communication device that may be inserted into an interior of the socket from a first side of an installation surface. The top portion and bottom portion may be operable to draw heat away from the network device and release the heat on a second side of the installation surface. | 07-15-2010 |
20100220447 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink in which a plurality of mounting holes are defined, and a plurality of fasteners. Each of the fasteners includes a shaft with one end thereof received in a corresponding mounting hole, a sleeve enclosing the shaft and received in the mounting hole, and a fixture engaging the shaft and pressing the heat sink and a bottom end of the sleeve. The sleeve is filled between the end of the shaft and an inner face of the heat sink defining the mounting hole to perform an engagement of the shaft in the mounting hole of the heat sink, thereby fastening the fasteners to the heat sink. The shaft has a screw extending out of the mounting hole for mounting the heat sink on a printed circuit board. | 09-02-2010 |
20100246136 | HEAT SINK AND ELECTRONIC DEVICE USING THE SAME - A heat sink includes two heat spreaders spaced from each other and a plurality of heat dissipation fins disposed between the heat spreaders. The heat dissipation fin is curved from one of the heat spreaders to the other one of the heat spreaders. A curved air passage is formed between every two adjacent heat dissipation fins. The heat dissipation fin can resiliently deform to change a distance between the heat spreaders. The present disclosure also discloses an electronic device incorporating such a heat sink. The electronic device comprises a shell and an electronic component mounted in the shell. One of the heat spreaders is attached to the electronic component and the other one is attached to the shell. | 09-30-2010 |
20100259900 | HEAT SINK - A heat sink includes a cooling member to dissipate heat, and a fixing member for mounting fasteners. The cooling member includes a base and a number of fins extending from the base. The cooling member and the fixing member are independently formed, and the fixing member is fixed to a bottom of the base of the cooling member via fixing means. | 10-14-2010 |
20100277871 | ELECTRIC POWER CONVERTING APPARATUS - A cooling device for cooling a plurality of switching elements included in each of a converter unit and an inverter unit includes a fin base that serves as a switching element attachment plane on which the switching elements are mounted and a plurality of fins arranged on a plane opposite to the switching element attachment plane. When an electric power converting circuit is a single- or multi-phase bridge circuit including a plurality of sets of legs each formed with a positive-side arm and a negative-side arm, the switching elements constituting the legs of different phases are arranged in a row on the fin base in a traveling direction of a railway electric car. | 11-04-2010 |
20100302738 | VOLTAGE ADJUSTER FOR AC GENERATOR FOR VEHICLE - In a voltage adjuster for a vehicle AC generator which has a cooing member for cooling a circuit portion of the voltage adjuster and in which plural fins of the cooling member are disposed so as to face an air suction hole formed in a case, the cooling member is constructed by assembling a first cooling plate having the same cross-sectional surface in a generating and processing direction and at least a second cooling plate having the same cross-sectional surface in a generating and processing direction and the same cross-sectional surface shape as the first cooling plate, and the fin end surfaces of one cooling plate are abutted on the other cooling plate so as to face the ventilation paths formed by the plural fins of the other cooling plate. | 12-02-2010 |
20110026227 | FREQUENCY CONVERTER ON A MOTOR - A frequency converter includes a housing, which is designed and envisaged for the peripheral assembly on an electric motor. The base of the housing is provided in the middle region on the outside with longitudinal ribs and is connected to heat-producing components of the power circuit of the frequency converter, is provided in outer regions with cooling ribs which are arranged on the outside transversely or obliquely to the longitudinal ribs, and on the inside is connected in a heat-conducting manner to heat-producing components of the input circuit and/or output circuit. | 02-03-2011 |
20110058336 | THERMAL BRIDGE EXTENSIONS FOR A MODULE-CHASSIS INTERFACE - A module for use with an expandable wedge clamp assembly in a chassis channel is provided. The module comprises a first side, a second side, a first extension attached to the first side, and a second extension attached to the second side. The first extension and the second extension are flexible. When the wedge clamp assembly is expanded, the first extension and the second extension flex from a first position to a second position. When the wedge clamp is returned from the expanded position to a relaxed position, the first extension and the second extension return from the second position to the first position. | 03-10-2011 |
20110279980 | HEAT DISSIPATION STRUCTURE FOR LIQUID CRYSTAL TELEVISION - A heat dissipation structure for a liquid crystal television is disclosed. The liquid crystal television includes a front plate and a rear plate. The front plate has a screen and a metal backboard. The heat dissipation structure includes a printed circuit board (PCB) mounted to the metal backboard; a television integrated circuit (IC) chip for controlling operations of the liquid crystal television being attached on the PCB; and one or more heat dissipating posts provided between the PCB and the metal backboard. The heat generated by the television IC chip is dispersed to the metal backboard via the heat dissipating post or posts. | 11-17-2011 |
20110286185 | Inverter device and drive unit using the same - In two systems of three-phase alternating-current inverter devices that drive a motor, power elements on power supply sides of bridge circuits are mounted on unit bases to constitute upper arm units. Power elements on ground sides of the bridge circuits are mounted on unit bases to constitute lower arm units. The upper arm units and the lower arm units are arranged separately on upper surfaces and outside surfaces of heat dissipation blocks of a heat sink. Heats generated by the power elements do not interfere with each other and are emitted to the heat sink, whereby heat dissipation performance of the power elements constituting the bridge circuits is improved. | 11-24-2011 |
20110292610 | HEAT SINK AND ELECTRONIC APPARATUS USING THE SAME - A heat sink includes a bottom plate, a plurality of fins, an extending member, and a heat conduction member. The plurality of fins is fixed on the bottom plate. The extending member extends outward from an end of the bottom plate. The heat conduction member depends from an end of the extending member. | 12-01-2011 |
20120092833 | LED HEAT-CONDUCTING SUBSTRATE AND ITS THERMAL MODULE - An LED heat-conducting substrate and its thermal module wherein the composite heat-conducting substrate is incorporated by multiple heat-conducting wires or fibers and insulating material. Said wires or fibers are arranged at interval, and penetrate the front and rear faces. The wires or fibers are segregated by insulating material. An electrode pad is incorporated onto the front face of the composite heat-conducting substrate, and is electrically connected with the electrode pin of LED unit. A heat-conducting pad is incorporated and kept in contact with the heat sink of the LED component for heat conduction. An insulating layer is incorporated onto the rear face of the composite heat-conducting substrate, and located correspondingly to the electrode pad. The LED heat-conducting substrate and thermal module can be constructed easily for high heat conduction in the thickness direction and high electrical insulation in the direction of plane, enabling quick heat transfer to the heat-sinking component. | 04-19-2012 |
20120140418 | FIXING STRUCTURE FOR HEAT SOURCE ELEMENT AND HEAT CONDUCTING MEMBER, AND METHOD OF FIXING HEAT SOURCE ELEMENT AND HEAT CONDUCTING MEMBER - An electronic device mounted on a circuit board and accommodated in a housing includes a heat source element accommodated in the housing and mounted on the circuit board, and a heat conducting member accommodated in the housing. The heat conducting member is movably mounted on the circuit board. An elastic member fixes the heat source element and the heat conducting member in abutment with each other. The elasticity of the elastic member permits variations in the relative positions of the heat source element and the heat conducting member while maintaining the abutment of the heat source element and the heat conducting member. | 06-07-2012 |
20120195005 | ELECTRONIC UNIT - An electronic unit includes a double-sided substrate having an insulation substrate, a patterned first metal plate bonded on one side of the insulation substrate, and a patterned second metal plate bonded on the other side of the insulation substrate, and also includes a heat radiation member for releasing heat from the double-sided substrate. The heat radiation member is disposed adjacent to one of the first metal plate and the second metal plate generating a larger amount of heat than the other of the first metal plate and the second metal plate. | 08-02-2012 |
20120206882 | Devices Having Anisotropic Conductivity Heatsinks, and Methods of Making Thereof - In accordance with an embodiment of the present invention, a device includes a circuit board with a thermally conductive core layer and a chip disposed over the circuit board. The device further includes a heat sink disposed over the chip. The thermal conductivity of the heat sink along a first direction is larger than a thermal conductivity along a second direction. The first direction is perpendicular to the second direction. The heat sink is thermally coupled to the thermally conductive core layer. | 08-16-2012 |
20120300406 | HEAT RADIATION DEVICE AND ELECTRONIC EQUIPMENT USING THE SAME - Disclosed is a heat radiation device, which is in contact with a first heat-producing component having a higher value of guaranteed temperature and a second heat-producing component having a lower value of guaranteed temperature, and the heat radiation device comprises a metal member provided with a slit. The metal member is divided by the slit to have two heat radiation regions, a first heat radiation region and a second heat radiation region that are loosely coupled with each other in terms of heat conduction. The first heat-producing component is placed in contact with the first heat radiation region, and the second heat-producing component is placed in contact with the second heat radiation region. | 11-29-2012 |
20130003308 | POWER ELECTRONIC DEVICE HAVING HIGH HEAT DISSIPATION AND STABILITY - An insulating body embeds at least one integrated circuit chip and a first and second exposed heat sink exposed on a free surface opposite a mounting surface of the body. An external heat-sink extends above the free surface. The external heat-sink includes a first dissipative portion and a second dissipative portion for contacting the first and second heat-sinks on the free surface, respectively, as well as an insulating portion for electrically insulating the first dissipative portion from the second dissipative portion. The first dissipative portion and the second dissipative portion are symmetrical with respect to the insulating portion. An extension of the external heat-sink may provide a stabilizing element. The extension of the external heat-sink may alternatively thermally and electrically interconnect two insulating bodies, each body embedding at least one integrated circuit chip. | 01-03-2013 |
20130094150 | ELECTRIC POWER CONVERSION DEVICE - Semiconductor element groups constituting a unit are mounted on a cooler heat receiving part | 04-18-2013 |
20130120939 | METHOD AND DEVICE FOR THERMALLY COUPLING A HEAT SINK TO A COMPONENT - A heat sink is thermally coupled to a component with a thermal filler and an intermediate layer applied between the heat sink and the component. The intermediate layer is formed with apertures and the heat sink is pressed against the component with a given force in order for the thermal filler to penetrate the apertures of the intermediate layer. | 05-16-2013 |
20130188317 | HEAT SINK AND ELECTRONIC DEVICE HAVING THE SAME - A heat sink for an electronic device is made of thermally conductive materials and is formed by winding a rod into a helix so as to have a plurality of loops of progressively smaller diameters. With the above-mentioned structure, the heat sink can provide improved heat dissipation and air convection because of large surface area of the rod and no dead angle. | 07-25-2013 |
20130258600 | THERMAL INTERFACE ELEMENT AND ARTICLE INCLUDING THE SAME - An article and method of forming the article is disclosed. The article includes a heat source, a substrate, and a thermal interface element having a plurality of freestanding nanosprings disposed in thermal communication with the substrate and the heat source. The nanosprings of the article include at least one inorganic material and also at least 50% of the nanosprings have a thermal conductivity of at least 1 watt/mK per nano spring. | 10-03-2013 |
20140002994 | THERMAL INTERFACE FOR MULTI-CHIP PACKAGES | 01-02-2014 |
20140036450 | PASSIVE COOLING ENCLOSURE SYSTEM AND METHOD FOR ELECTRONICS DEVICES - An apparatus for passively cooling electronics. The apparatus for passively cooling electronics includes at least one heat sink configured to be thermally coupled to at least one cabinet. When the at least one cabinet is thermally coupled to the at least one heat sink, the at least one heat sink draws heat from the at least one cabinet. | 02-06-2014 |
20140085828 | ELECTRONIC DEVICE WITH HEAT SINK - An electronic device includes a circuit board and a heat sink. A chip is mounted on the circuit board. The heat sink includes a base mounted on the chip and a number of heat-dissipation poles extending up from the base. Each pole defines a through hole extending through the base and a top end of the pole. | 03-27-2014 |
20140362536 | GROUP III NITRIDE BASED FLIP-CHIP INTEGRATED CIRCUIT AND METHOD FOR FABRICATING - A circuit substrate has one or more active components and a plurality of passive circuit elements on a first surface. An active semiconductor device has a substrate with layers of material and a plurality of terminals. The active semiconductor device is flip-chip mounted on the circuit substrate and at least one of the terminals of the device is electrically connected to an active component on the circuit substrate. The active components on the substrate and the flip-chip mounted active semiconductor device, in combination with passive circuit elements, form preamplifiers and an output amplifier respectively. In a power switching configuration, the circuit substrate has logic control circuits on a first surface. A semiconductor transistor flip-chip mounted on the circuit substrate is electrically connected to the control circuits on the first surface to thereby control the on and off switching of the flip-chip mounted device. | 12-11-2014 |
20150362265 | High Thermal Conductivity Materials for Thermal Management Applications - High thermal conductivity materials and methods of their use for thermal management applications are provided. In some embodiments, a device comprises a heat generating unit ( | 12-17-2015 |
20150382509 | COOLING DEVICE AND POWER MODULE EQUIPPED WITH COOLING DEVICE - A cooling device includes a power module incorporating chips that generate heat and having chip arrangement in which a first chip having the largest amount of heat generation and second chips having the second largest amount of heat generation are not adjacent to each other and the first chip is adjacent to any two of third chips having the smallest amount of heat generation, a heat sink, to a base surface of which the power module is closely attached, and flat first and second anisotropic high heat conductors having a thermal conductivity higher than a main body disposed on the surface of the heat sink. The first and second anisotropic high heat conductors are separated into two and disposed under the first chip and under the second chips. | 12-31-2015 |
20160029517 | Silicon-Based Heat Dissipation Device For Heat-Generating Devices - Embodiments of a silicon-based heat dissipation device and a chip module assembly are described. An apparatus may include a silicon-based heat dissipation device, an extended device coupled to the silicon-based heat-dissipation device and heat-generating devices mounted on the silicon-based heat dissipation device. The silicon-based heat dissipation device may include a base portion having a first primary side and a second primary side opposite the first primary side. The silicon-based heat dissipation device may also include a protrusion portion on the first primary side of the base portion and protruding therefrom. The protrusion portion may include multiple fins. The base portion may include a slit opening with a first heat-generating device of the heat-generating devices on a first side of the slit opening and a second heat-generating device of the heat-generating devices on a second side of the slit opening opposite the first side of the slit opening. | 01-28-2016 |
20160192473 | CIRCUIT BOARD - A circuit board includes a first insulating layer having an upper surface on which mounting regions of electronic components and wiring patterns are provided, a metal core provided on the lower surface of the first insulating layer, in such a way as to vertically overlap with the mounting regions, and a second insulating layer provided on the lower surface of the first insulating layer, around the metal core. The lower surface of the metal core is exposed from the second insulating layer, the thermal conductivities of the first insulating layer and the metal core are higher than the thermal conductivity of the second insulating layer, and the hardness of the first insulating layer is higher than the hardness of the second insulating layer. Through holes that penetrate the insulating layers and that connect wiring patterns of the insulating layers are provided. | 06-30-2016 |
20170238441 | POWER CONVERTER | 08-17-2017 |
20180027699 | HEAT DISSIPATION ASSEMBLY | 01-25-2018 |