Entries |
Document | Title | Date |
20080198548 | Power Converter - A power converter of the present invention includes at least two power semiconductor modules having a plurality of switching devices, at least two cooling jackets having a coolant path for cooling the plurality of power semiconductor modules and equipped with the power semiconductor modules, a capacitor module interposed between the at least two cooling jackets, and a connector provided in the at least two cooling jackets for connecting the coolant path. | 08-21-2008 |
20080218966 | Mounting Plate for Electronic Components - A mounting plate for electronic components, including cooling conduits that are integrated into a plate body and that are traversed by a coolant, a fixing device for mounting electronic components that are to be cooled being located on the plate body. The mounting plate has the fixing device including at least one first groove with an approximately C-shaped cross-section, which extends in a linear manner in the extension direction of the mounting plate. At least one screw nut is inserted and locked against torsion in the groove in order to form a screw connection with an electronic component. | 09-11-2008 |
20080218967 | Real Time Adaptive Active Fluid Flow Cooling - The present invention is generally directed to an apparatus providing real time adaptive active fluid flow cooling, for cooling an electronic system, an electronic system utilizing the same, and a method for providing real time adaptive active fluid flow cooling. The electronic system consists of a circuit board having a heat generating component, a heat dissipating element mounted to the heat generating component and an apparatus for providing real time adaptive active flow cooling. The apparatus consisting of a plurality of active cooling devices that remove heated air or fluid with ambient air or fluid by propelling an fluid flow stream in a first direction toward the heat dissipating element, and where at least one active cooling device contained in the plurality of active cooling devices propels an fluid flow stream in a second direction toward the heat dissipating element. | 09-11-2008 |
20080259560 | SYSTEM AND APPARATUS FOR DIRECT COOLING OF GRADIENT COILS - A system for cooling a gradient coil assembly of a magnetic resonance imaging (MRI) system includes a gradient coil having a first surface comprising a plurality of conductors and a plurality of inter-turn channels. Each inter-turn channel is located between turns of the plurality of conductors. The system also includes a seal layer applied to the first surface of the gradient coil to seal the inter-turn channels. The inter-turn channels are configured to transport a cooling fluid. Alternatively, at least one cooling tube may be located in the inter-turn channels of the gradient coil in order to transport a cooling fluid. | 10-23-2008 |
20080266787 | On-Chip Interconnect-Stack Cooling Using Sacrificial Interconnect Segments - The present invention relates to an integrated-circuit device and to a method for fabricating an integrated-circuit device with an integrated fluidic-cooling channel. The method comprises forming recesses in a dielectric layer sequence at desired lateral positions of electrical interconnect segments and at desired lateral positions of fluidic-cooling channel segments. A metal filling is deposited in the recesses of the dielectric layer sequence so as to form the electrical interconnect segments and to form a sacrificial filling in the fluidic-cooling channel segments. Afterwards, the sacrificial metal filling is selectively removed from the fluidic-cooling channel segments. | 10-30-2008 |
20080273303 | Electronic circuit modules cooling - A cooling structure for electrical circuit devices having a pair of cooling ducts, each having a coolant passageway therein, and an electrical circuit device housing formed by a pair of spaced apart heat transfer plates each joined to a housing side to provide a sealed housing space. An electrical circuit device is positioned in that sealed housing space and each of the pair of heat transfer plates is positioned adjacent to, and thermally coupled to, a corresponding one of the pair of cooling ducts. An electrically insulative heat transfer material is provided in the sealed housing space so as to be capable of being in contact with the electrical circuit device also therein. | 11-06-2008 |
20080285230 | Electronic Unit with Sealed Coolant Passage - To improve coolant sealing or reduce the risks in the event of leakage for an electronic unit, e.g. an engine control unit, containing electric and/or electronic components which are disposed on an upper side of a thermally conductive electronic base plate and thermally coupled to the base plate, the base plate in turn being thermally coupled to a coolant passage, there is provided a particular configuration and arrangement of the components delimiting a coolant passage. Advantageously, the underside of the base plate can come into direct contact with a coolant (“direct cooling”). By making a ridge running in an annularly closed manner and being formed in one-piece with the base plate, coolant escaping from the coolant passage is prevented from passing directly to the underside of the base plate. Accordingly, the coolant passage may be sealed by a “double sealing arrangement” on the underside of the base plate. | 11-20-2008 |
20080310101 | Double-walled enclosure with improved cooling - In one embodiment, an enclosure for housing electrical components, such as circuit boards or the like, has one or more double-walled sides that distribute a cooling fluid to the electrical components. Each of the double-walled sides has a cavity and the cavities may be coupled together along the sides where the double-walled sides join together. A supply of pressurized fluid, such as air, is supplied to the outside wall of one double-walled side. Openings in the inner walls of the double-walled sides discharge the cooling fluid into the enclosure. The openings are positioned to provide cooling fluid where needed. Nozzles may be placed in the openings to further direct and regulate the flow of the cooling fluid into the enclosure. Baffles may be placed in the cavities to direct/deflect cooling fluid to/from the inner wall openings. The walls may be made of plastic or metal and fabricated with conventional techniques. | 12-18-2008 |
20080310102 | METHODS AND APPARATUS FOR COMPACT ACTIVE COOLING - Methods and apparatus for compact active cooling for missile applications generally comprise a circuit card assembly level closed loop fluid filled cooling system for cooling high power components such as microprocessors. The present invention utilizes a cooling system constrained to a single circuit card assembly providing for a drop in replacement for current passively cooled circuit card assemblies. | 12-18-2008 |
20090103262 | ELECTRONIC APPARATUS - According to one embodiment, an electronic apparatus is provided with first and second heating elements mounted on a circuit board. The first heat pipe includes a first end portion thermally connected to the first heating element and a second end portion thermally connected to a heat radiating section. The second heat pipe includes a first end portion thermally connected to the second heating element, a second end portion thermally connected to the heat radiating section, and a middle portion opposed to the first heating element. A heat conductive member has flexibility and is provided between the middle portion of the second heat pipe and the first heating element so as to thermally connect the middle portion of the second heat pipe to the first heating element. | 04-23-2009 |
20090129011 | Liquid cooled module - A thermal module is provided for absorbing and dissipating heat from a heat generating component. The module comprises a module body, input and output ports, and a channel disposed within the module body. The module body includes a thermally conductive base, a top surface, and a side surface rising from the base toward the top surface. The base is disposable adjacent the heat generating component to facilitate transfer of heat from the heat generating component to the base. The input and output ports are each disposed on the side surface of the body. The channel is encapsulated within the module body and extends from the input port to the output port to define a flow path. The channel is operative to convey a cooling fluid therethrough for absorbing and dissipating the heat from the heat generating component. | 05-21-2009 |
20090168343 | COOLING DEVICE AND ELECTRONIC DEVICE COMPRISING SUCH A COOLING DEVICE - A cooling device using pulsating fluid for cooling of an object ( | 07-02-2009 |
20090213541 | Cooling Plate Assembly with Fixed and Articulated Interfaces, and Method for Producing Same - A cooling plate assembly for transferring heat from electronic components mounted on a circuit board includes both fixed and articulated interfaces. A fixed-gap coldplate is positioned over and in thermal contact with (e.g., through an elastomerically compressive pad thermal interface material) electronic components mounted on the circuit board's top surface. An articulated coldplate is positioned over and in thermal contact with at least one electronic component mounted on the circuit board's top surface. In the preferred embodiments, the articulated coldplate is spring-loaded against one or more high power processor components having power dissipation greater than that of the electronic components under the fixed-gap cooling plate. Thermal dissipation channels in the coldplates are interconnected by flexible tubing, such as copper tubing with a free-expansion loop. In the preferred embodiments, the coldplates and the flexible tubing are connected to define a portion of a single flow loop used to circulate cooling fluid through the coldplates. | 08-27-2009 |
20090244837 | Heat-dissipating module - A heat-dissipating module includes a heat-dissipating member and at least one heat pipe. The heat-dissipating member includes a pillared convexity and an annular groove formed on and surrounding the heat-dissipating member. The at least one heat pipe passes through the annular groove, partially surrounding the convexity and stopped against the convexity. | 10-01-2009 |
20090251857 | SYSTEM INCLUDING AN ELECTRONIC MODULE WITH A HEAT SPREADER - A system including an electronic module with a heat spreader. One embodiment provides a plate including a thermally conductive material and a guiding member arranged along an edge of the plate. The plate and the guiding member of the heat spreader are configured to form, when attached to a first memory module, together with another heat spreader attached to a second memory module or together with a wall of another device, a duct channeling a flow of a coolant. | 10-08-2009 |
20090251858 | Electric power converter and mounting structure of semiconductor device - An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section. | 10-08-2009 |
20090251859 | Electronic power converter and mounting structure of semiconductor device - An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section. | 10-08-2009 |
20090296345 | THERMAL MANAGEMENT DEVICE AND METHOD FOR MAKING THE SAME - A thermal management device suitable for use as an electronic chassis includes a monolithic, monocoque body having integrally formed channels for carrying thermal energy away from a heat source, such as electronic components. The device may be fabricated using additive/subtractive manufacturing processes such as ultrasonic consolidation. | 12-03-2009 |
20100053889 | INVERTER POWER MODULE FOR WITH DISTRIBUTED SUPPORT FOR DIRECT SUBSTRATE COOLING - Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal. | 03-04-2010 |
20100053890 | COOLING SYSTEM FOR AN ELECTRONIC COMPONENT SYSTEM CABINET - An electronic component system cabinet includes a plurality of electronic component system bays, and a plurality of electronic component systems mounted in respective ones of the plurality of electronic component system bays. The electronic component system cabinet further includes a cooling system including a plurality of coolant reservoirs. Each of the plurality of coolant reservoirs is associated with at least one of the plurality of electronic component system bays. The cooling system further includes at least one pump fluidly connected to each of the plurality of coolant reservoirs. The at least one pump is selectively operated to circulate a supply of coolant to each of the plurality of coolant reservoirs. | 03-04-2010 |
20100073871 | EFFICIENT SITE COOLING TECHNOLOGY - A method for providing Electronic Equipment cabinets and shelters with an advanced supplemental cooling system, with the use of “stored coolant” produced during off peak periods as opposed to the use of peak rate power for a typical air conditioner unit, the ability to operate the electronic equipment during periods when primary power is lost and the on-site back up power plant is not sufficient to operate both the electronics and the cooling system, as well as the ability to save the operators money, by load shifting power usage from peak to off peak hours, often at lower utility rates and use alternative green technologies for power, such as wind and solar. | 03-25-2010 |
20100085706 | HELICAL CONDUIT ENABLED FOR CASTING INSIDE A HOUSING - The present disclosure is directed to a fluid-cooled housing for an electric device having an outer surface and an inner surface, the inner surface defining, at least in part, a housing cavity having a longitudinal axis, an end wall continuous with the inner surface. The inner surface having a plurality of core print openings along the longitudinal axis, and a helical conduit integrated within the housing between the outer and inner surfaces along the axis formed from a helical coil core having two or more laterally extending tabs which form the core print in two or more planes. | 04-08-2010 |
20100091457 | COOLING SYSTEM FOR ELECTRONIC STRUCTURAL UNITS - Cooling systems ( | 04-15-2010 |
20100103614 | APPARATUS AND METHOD FOR IMMERSION-COOLING OF AN ELECTRONIC SYSTEM UTILIZING COOLANT JET IMPINGEMENT AND COOLANT WASH FLOW - Apparatus and method are provided for facilitating pumped, immersion-cooling of an electronic system having multiple different types of electronic components. The apparatus includes a container sized to receive the electronic system, a coolant inlet port and a coolant outlet port for facilitating ingress and egress of coolant through the container, and a manifold structure associated with the container. The manifold structure includes a coolant jet plenum with an inlet opening in fluid communication with the coolant inlet port, and one or more jet orifices in fluid communication with the coolant jet plenum. The jet orifices are positioned to facilitate cooling of at least one electronic component of the multiple different types of electronic components by jet impingement of coolant thereon when the electronic system is operatively positioned within the container for immersion-cooling thereof. | 04-29-2010 |
20100134974 | High-Power Ultracapacitor Energy Storage Pack and Method of Use - An energy storage cell pack cradle assembly for holding multiple rows of energy storage cells oriented along a dominant axis of vibration includes a first cradle member including a plurality of energy storage cell body supporting structures including respective holes; a second cradle member including a plurality of energy storage cell body supporting structures including respective holes; and one or more fasteners connecting the first cradle member and the second cradle member together. The energy storage cell body supporting structures are configured to structurally support the energy storage cells, with the energy storage cells oriented along a dominant axis of vibration, by energy storage cell bodies of the energy storage cells with respective electrically conductive terminals extending through the respective holes without structural support of the electrically conductive terminals by the cradle members. | 06-03-2010 |
20100142145 | COOLING JACKET, COOLING UNIT, AND ELECTRONIC APPARATUS - A cooling jacket includes: a flow channel member through which a cooling medium flows, at least a part of which is in contact with an object to be cooled, and which includes a region having a channel cross-sectional area larger than that of any other region; and a projection portion which is provided at a downstream side of the region where the channel cross-sectional area is large. | 06-10-2010 |
20100157526 | Low cost anufacturing of micro-channel heatsink - A cooling device includes a ceramic substrate with a metal layer bonded to an outer planar surface. The cooling device also includes a channel layer bonded to an opposite side of the ceramic substrate and a manifold layer bonded to an outer surface of the channel layer. The substrate layers are bonded together using a high temperature process such as brazing to form a single substrate assembly. A plenum housing is bonded to the single substrate assembly via a low temperature bonding process such as adhesive bonding and is configured to provide extended manifold layer inlet and outlet ports. | 06-24-2010 |
20100157527 | High-Power Ultracapacitor Energy Storage Pack and Method of Use - In an energy storage cell pack including at least one energy storage cell that radiates heat in a longitudinal axial direction outwards, towards opposite electrically conductive and heat conductive terminals, a terminal heat sink includes a receiving section for structurally receiving a terminal of the opposite electrically conductive and heat conductive terminals, and more than one heat conductive cooling fin radiating outwardly from the receiving section, wherein the more than one cooling fin radiates outwardly from the terminal when the receiving section structurally receives the terminal for dissipating heat from the terminal to cool the at least one energy storage cell. | 06-24-2010 |
20100172091 | Cooling apparatus for semiconductor chips - A cooling apparatus for semiconductor chips includes radiation fins formed on the opposite surface of metal base opposite to the surface of metal base, to which an insulator base board mounting semiconductor chips thereon, is disposed. The radiation fins, such as sheet-shaped fins having different lengths are arranged such that the surface area density of the fins becomes higher in the coolant flow direction, whereby the surface area density is the total surface area of radiation fins on a unit surface area of the metal base. As a result, the temperatures of semiconductor chips arranged along the coolant flow direction are closer to each other. | 07-08-2010 |
20100182747 | SEMICONDUCTOR ELEMENT COOLING STRUCTURE - A semiconductor element cooling structure includes a plurality of semiconductor elements, and electrode structure, which has cooling medium channels therein and is electrically connected to the plurality of semiconductor elements. The electrode structure includes an alternating current electrode having the semiconductor elements on each of opposite surfaces, and a plurality of direct current electrodes holding therebetween the alternating current electrode and the semiconductor elements respectively mounted on the opposite surfaces of the alternating current electrode. Each of the alternating current electrode and the direct current electrodes has the cooling medium channels therein. | 07-22-2010 |
20100188813 | Power Converter - The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module. | 07-29-2010 |
20100188814 | Power Converter - The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module. | 07-29-2010 |
20100220444 | CONTROL UNIT - The invention relates to a control unit ( | 09-02-2010 |
20100232105 | System and Method for Supporting a Plurality of Propulsion Energy Storage Cells Within a Vehicle - An energy storage cell pack cradle assembly for holding multiple rows of energy storage cells oriented along a dominant axis of vibration includes a first cradle member including a plurality of energy storage cell body supporting structures including respective holes; a second cradle member including a plurality of energy storage cell body supporting structures including respective holes; and one or more fasteners connecting the first cradle member and the second cradle member together. The energy storage cell body supporting structures are configured to structurally support the energy storage cells, with the energy storage cells oriented along a dominant axis of vibration, by energy storage cell bodies of the energy storage cells with respective electrically conductive terminals extending through the respective holes without structural support of the electrically conductive terminals by the cradle members. | 09-16-2010 |
20100271775 | SYSTEMS AND METHODS FOR SYNTHETIC JET ENHANCED NATURAL COOLING - A method and system for increasing cooling of an enclosure is provided. The component enclosure includes one or more sidewalls defining a volume, the sidewalls are configured to substantially surround a heat generating component positioned within the volume. The component enclosure further includes a synthetic jet assembly positioned adjacent at least one of the sidewalls. The synthetic jet assembly includes at least one synthetic jet ejector having a jet port. The jet port is aligned at least one of perpendicularly, parallelly, and obliquely with a surface of the at least one sidewall. The synthetic jet assembly is configured to direct a jet of fluid through the port at least one of substantially parallel to the surface, perpendicularly onto the surface, and obliquely toward the surface. | 10-28-2010 |
20100284147 | SYSTEM AND METHOD FOR MOUNTING A COOLING DEVICE AND METHOD OF FABRICATION - A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate. | 11-11-2010 |
20100315776 | 3-LEVEL POWER CONVERTER - A 3-level power converter is provided, which is reduced in size of the converter, reduced in floating inductance of each of wirings interconnecting between respective elements, and easily attached with a snubber circuit. The 3-level power converter performs on/off control of first to fourth switching elements | 12-16-2010 |
20100328882 | DIRECT JET IMPINGEMENT-ASSISTED THERMOSYPHON COOLING APPARATUS AND METHOD - Cooling apparatuses and methods are provided for facilitating cooling of an electronic device utilizing a cooling subassembly, a pump and a controller. The cooling subassembly includes a jet impingement structure, and a thermosyphon. The jet impingement structure directs coolant into a chamber of the subassembly onto a surface to be cooled when in a jet impingement mode, and the thermosyphon, which is associated with the chamber, facilitates convective cooling of the surface to be cooled via boiling of coolant within the chamber when in a thermosyphon mode. The controller, which is coupled to the pump to control activation and deactivation of the pump, also controls transitioning between the jet impingement mode and the thermosyphon mode based on a sensed temperature of the electronic device. | 12-30-2010 |
20110002101 | ELECTRONIC ASSEMBLY - An electronic assembly includes a casing structure defining an interior space for receiving at least one electronic component, an exterior space isolated from the interior space and a heat dissipating path along which heat generated by the electronic component is expelled from the interior space to the exterior space. The casing structure includes a first casing part and a would-be coupling unit. The first casing part includes an engagement unit having a bottom seat extending into the interior space and defining at least one flow passage along the heat dissipating path and a first coupling member projecting from the bottom seat. The would-be coupling unit includes a second coupling member coupled to the first coupling member within the interior space. | 01-06-2011 |
20110096496 | POWER ELECTRONICS ASSEMBLY WITH MULTI-SIDED INDUCTOR COOLING - A power electronics assembly is provided. The assembly includes a housing defining at least one cavity and having a fluid passageway extending therethrough, the fluid passageway having first and second portions on respective first and second opposing sides of the at least one cavity, and a plurality of inductors housed within the at least one cavity of the housing such that the first and second portions of the fluid passageway are on first and second opposing sides of each of the plurality of inductors. | 04-28-2011 |
20110141690 | POWER ELECTRONICS SUBSTRATE FOR DIRECT SUBSTRATE COOLING - Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface. | 06-16-2011 |
20110170259 | POWER INVERTERS - Power inverters include a frame and a power module. The frame has a sidewall including an opening and defining a fluid passageway. The power module is coupled to the frame over the opening and includes a substrate, die, and an encasement. The substrate includes a first side, a second side, a center, an outer periphery, and an outer edge, and the first side of the substrate comprises a first outer layer including a metal material. The die are positioned in the substrate center and are coupled to the substrate first side. The encasement is molded over the outer periphery on the substrate first side, the substrate second side, and the substrate outer edge and around the die. The encasement, coupled to the substrate, forms a seal with the metal material. The second side of the substrate is positioned to directly contact a fluid flowing through the fluid passageway. | 07-14-2011 |
20110194247 | POWER CONVERSION APPARATUS - In a power conversion apparatus, electronic components and a cooler are integrated in a frame as an internal unit. The internal unit is fixed within a case through the frame. The frame has such a shape that the electronic components are surrounded by the frame, and includes a first wall section, and second and third wall sections extending from both sides of the first wall section. The cooler includes a coolant introduction tube and a coolant discharge tube. The coolant introduction tube and the coolant discharge tube project outward from to the frame. The first to third wall sections include a support wall section supporting at least one of the coolant introduction tube and the coolant discharge tube, and a frame wall section not supporting the coolant introduction tube and the coolant discharge tube. The thickness of the support wall section is larger than the thickness of the frame wall section. | 08-11-2011 |
20110194248 | POWER CONVERSION APPARATUS - The power conversion apparatus includes electronic components constituting a power conversion circuit, a cooler for cooling at least some of the electronic components, and a case housing the electronic components and the cooler. The at least some of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit . The internal unit including therein the semiconductor modules also includes a control circuit board fitted to board fixing sections formed in the frame so as to project from the frame in the height direction perpendicular to the plane of the frame. Each of the board fixing sections has a board abutment surface at a position closer to the frame than the tips of control terminals of the semiconductor modules formed so as to project in the height direction. | 08-11-2011 |
20110194249 | POWER CONVERSION APPARATUS - A power conversion apparatus includes electronic components configuring a power conversion circuit, a cooler for cooling at least part of the electronic components, and a case housing the electronic components and the cooler. The at least part of the electronic components and the cooler are fixed to and integrated in a frame as an internal unit. The internal unit is fixed within the case through the frame. The frame has such a shape that the at least part of the electronic components is surrounded by the frame from four sides. | 08-11-2011 |
20110205701 | RESIN-SEALED ELECTRONIC CONTROL DEVICE AND METHOD OF FABRICATING THE SAME - Provided is a resin-sealed electronic control device reduced in size, which includes a double-sided mounting board as at least one of a plurality of electronic boards obtained by division so that a large mounting surface with a small plane area is ensured. Each of a first electronic board ( | 08-25-2011 |
20110216502 | POWER MODULES, COOLING DEVICES AND METHODS THEREOF - A jet impingement cooling device may include a jet structure and a target layer. The jet structure may include at least one fluid jet operable to produce an impingement jet of cooling fluid. The target layer may further include a heat receiving surface configured to be coupled to a heat generating device and a jet impingement target surface. The jet impingement target surface may further include at least one target structure having a wavy-fin topology with a fin peak, wherein the fluid jet and the target structure are arranged such that the fin peak of the target structure is aligned with a centerline of the impingement jet of cooling fluid during operation of the jet impingement cooling device. | 09-08-2011 |
20110222239 | COOLING DEVICES, POWER MODULES, AND VEHICLES INCORPORATING THE SAME - A cooling device may include a fluid inlet manifold, a case body, and a fluid outlet manifold that are formed of a molded polymer composite material. The fluid inlet manifold may include a fluid inlet channel and a fluid inlet reservoir. The case body may include a plurality of cooling channels extending from a first surface of the case body to a second surface of the case body. The cooling channels may fluidly couple the first surface of the case body to the fluid inlet reservoir. The fluid outlet manifold may further include a fluid outlet channel and a fluid outlet reservoir. The cooling channels may fluidly couple the second surface of the case body to the fluid outlet reservoir. The fluid inlet channel, cooling channels, and fluid outlet channels may include a cross-section topology. | 09-15-2011 |
20110228474 | ADVANCED MEZZANINE CARD FOR HOSTING A PMC OR XMC - A card assembly is disclosed comprising a carrier host card, an interposer printed wiring board (PWB) situated between the carrier host card and a hosted card, wherein the carrier host card and the interposer printed wiring board (PWB) are configured to have a space there-between. The card assembly further comprising a customized front panel including a first cutout for the carrier host card and a second cutout for said hosted card. | 09-22-2011 |
20110235270 | Power Converter - The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module. | 09-29-2011 |
20110261531 | SWITCHING POWER SUPPLY - A switching power supply has electronic parts that configure a switching circuit. The electronic parts are accommodated in a casing. A seat member is formed unitarily with the casing on which the electronic parts are mounted. A coolant channel is formed through the seat member so as to be open at least at two positions of an outer wall surface of the casing. Coolant that flows through the coolant channel cools the electronic parts mounted on the seat member. | 10-27-2011 |
20110299244 | COOLING MEMBER FOR HEAT CONTAINING DEVICE - A cooling member for withdrawing heat from a heat containing device is disclosed. The cooling member can have a housing with a fluid inlet, a fluid outlet and a plurality of irregular-shaped fins located at least partially therewithin. In addition, a plurality of irregular-shaped and hierarchical branched fluid pathways can be located between the plurality of fins and the housing and/or the plurality of fins can be in physical contact with the heat containing device. | 12-08-2011 |
20120002370 | COOLING DEVICE AND ELECTRONIC DEVICE - A cooling device comprising a thermal diffusing unit operable to radiate heat taken from a heating element, and a heat transporting part, laminated in a thickness direction of the heat diffusing unit and diffused thereby. The thermal diffusing unit has an upper plate, a lower plate opposite thereto, a vapor diffusion path to diffuse an evaporated refrigerant, and a capillary channel to circulate a condensed refrigerant. The heat transporting part has an upper plate, a lower plate opposite thereto, a vapor diffusion path to diffuse an evaporated refrigerant, and a capillary channel to circulate a condensed refrigerant. Either the upper plate or the lower plate is formed with the same member of the lower plate or the upper plate of the heat transporting part. | 01-05-2012 |
20120008280 | Electric Circuit Device, Electric Circuit Module, and Power Converter - The present invention provides an electric circuit device in which it is possible to achieve simultaneously the improvement of cooling performance and reduction in operating loss due to line inductance. The above object can be attained by constructing multiple plate-like conductors so that each of these conductors electrically connected to multiple semiconductor chips is also thermally connected to both chip surfaces of each such semiconductor chip to release heat from the chip surfaces of each semiconductor chip, and so that among the above conductors, a DC positive-polarity plate-like conductor and a DC negative-polarity plate-like conductor are opposed to each other at the respective conductor surfaces. | 01-12-2012 |
20120020020 | OPTICAL INTERCONNECTS IN COOLING SUBSTRATES - Fluid-cooling technology developed for printed circuit boards (PCBs) and electronics assemblies is combined with optical-based interconnect technology, thereby enabling efficient fabrication of PCBs with free-space optical bearers. Since cooling components such as fans and heat sinks are no longer required on the PCB, the PCB is thinner and makes better use of a cooling substrate by also using it to carry optical signals. A card or a backplane supporting a plurality of active components can combine optical signals and cooling aspects in support of those components. | 01-26-2012 |
20120026686 | INFORMATION PROCESSING APPARATUS SYSTEM AND METHOD OF CONTROLLING THE SAME - An information processing apparatus system includes: an information processing apparatus or apparatuses configured to measure the flow rate of coolant flowing from a coolant inflow surface of its enclosure to a coolant outflow surface of the enclosure; and a cooling apparatus configured to form a circulating path of the coolant from the coolant outflow surface to the coolant inflow surface, the cooling apparatus configured to control the discharged amount of the coolant based on the measured flow rate. | 02-02-2012 |
20120039039 | Power Inverter - In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module. | 02-16-2012 |
20120099273 | COOLING OF ELECTRICAL COMPONENTS - The invention concerns a converter as well as a cooling device and a method for cooling at least a first and a second group of electrically interconnected electrical components (SWA | 04-26-2012 |
20120099274 | DEVICES AND METHODS PROVIDING FOR INTRA-DIE COOLING STRUCTURE RESERVOIRS - Devices, systems, and methods for semiconductor die temperature management are described and discussed herein. An IC device is described that includes at least one intra-die cooling structure. In an embodiment, the IC device includes at least one coolant reservoir and at least one coolant channel disposed wholly within integral layers of the semiconductor die. The at least one coolant reservoir includes at least one through-reservoir via. The at least one through-reservoir via may be constructed to provide structural support to the at least one coolant reservoir. The at least one through-reservoir via may also be constructed to provide a path for the transfer of thermal energy, electrical signals, and/or power signals. The at least one through-reservoir via may be constructed to provide any combination of structural support and thermal energy transfer, electrical signal transfer, or power transfer. | 04-26-2012 |
20120127660 | CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME - Cylindrical packages are provided. The cylindrical package includes a cylindrical substrate having a hollow region therein and at least one semiconductor chip mounted on an outer circumference of the cylindrical substrate. Related electronic products and related fabrication methods are also provided. | 05-24-2012 |
20120127661 | DIRECTLY INJECTED FORCED CONVECTION COOLING FOR ELECTRONICS - Electronic circuitry includes a circuit board and at least one component mounted on the circuit board, with the at least one component generating heat while in use. The circuit board includes one or more apertures aligned with one or more respective components, and the electronic circuitry is configured to provide, while in use, a path for coolant fluid to flow through each aperture and past the respective component. | 05-24-2012 |
20120147559 | INTEGRATED CIRCUIT PACKAGE CONNECTED TO AN OPTICAL DATA TRANSMISSION MEDIUM USING A COOLANT - An integrated circuit coupling device includes an integrated circuit package; and an optical data transmission medium connected to the integrated circuit package, and comprising a movable coolant, adapted to remove heat from the integrated circuit package, in operation. | 06-14-2012 |
20120170217 | Power Inverter - In a power inverter, a coolant passage is fixed to a chassis to cool the chassis; the chassis is divided into a first region and a second region by providing the coolant passage in the chassis; a power module is provided in the first region as fixed to the coolant passage; a capacitor module is provided in the second region; and the DC terminal of the capacitor module is directly connected to the DC terminal of the power module. | 07-05-2012 |
20120206877 | CAPACITOR MODULE - Disclosed herein is a capacitor module including at least one capacitor, a cooling case accommodating the capacitor, and a cooling unit disposed in the cooling case and cooling a side surface of the capacitor. | 08-16-2012 |
20120206878 | FLOW PATH STRUCTURE AND ELECTRONIC APPARATUS - The flow path structure includes a flow path introducing fluid from an inlet to an outlet, and a flow velocity control structure provided in a portion between the inlet and the outlet in the flow path to reduce difference in flow velocity that the fluid flowing into the flow path has in a direction intersecting with a flow direction of the fluid. The flow velocity control structure includes, in the direction intersecting with the flow direction, plural flow velocity control members provided alternately with spaces through which the fluid passes. The flow velocity control members have different sizes from each other, the sizes increasing as the flow velocity of the fluid at areas, in the direction intersecting with the flow direction, where the respective flow velocity control members are provided increases. | 08-16-2012 |
20120250252 | ELECTRIC POWER CONVERSION APPARATUS - An electric power conversion apparatus includes first and second electric power conversion devices and a housing. The first and second electric power conversion devices are arranged to overlap each other in an overlap direction. The housing receives both the first and second electric power conversion devices therein. The housing has a partition wall that extends between the first and second electric power conversion devices to partition the housing into first and second parts in which the first and second electric power conversion devices are respectively received. The partition wall has a coolant passage formed therein, thereby allowing a coolant to flow through the coolant passage. | 10-04-2012 |
20120250253 | SEMICONDUCTOR MODULE - A semiconductor module includes an upper arm and a lower arm of an inverter circuit. The upper arm has a switching element and a rectifying device and the lower arm has a switching element and a rectifying device. The upper arm and the lower arm are laminated such that the switching elements overlap each other and the rectifying devices overlap each other. Refrigerant flow paths constituting cooling sections respectively extend along both sides in the lamination direction of the switching elements and the rectifying devices and are folded back at the rectifying device lamination section side. | 10-04-2012 |
20120327596 | THERMAL MANAGEMENT SYSTEM USING A PHASE-CHANGE MATERIAL FOR VEHICLE WITH ELECTRIC TRACTION MOTOR - In an aspect, a phase-change material is used as part of the thermal management system to assist in maintaining a thermal load, such as a battery pack, within a selected temperature range, thereby reducing the consumption of battery power. The phase-change material may be conditioned to an initial state when the vehicle is on-plug and may be used to heat or cool the battery pack directly or indirectly, thereby reducing the use of an electric battery heater. The phase-change material may be used to heat coolant that flows to the thermal load. In another embodiment the phase-change material may be directly within the battery pack in contact with the cells. The phase-change material may be conditioned via the battery circuit heater when the vehicle is on-plug. The phase-change material may also be recharged during vehicle use off-plug using waste heat from the motor circuit thermal load. | 12-27-2012 |
20130010425 | POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate made of a metal material; cooling channels formed to allow a cooling material to flow in an inner portion of the base substrate; an anodized layer formed on an outer surface of the base substrate; a metal layer formed on a first surface of the base substrate having the anodized layer and including circuits and connection pads; and semiconductor devices mounted on the metal layer. | 01-10-2013 |
20130021749 | Power Inverter - A power inverter includes a metallic chassis having a containing space at an inner portion thereof, having a lid on one side in a vertical direction, the other side thereof being enclosed by a bottom, a cooling block of forming a coolant path along a bottom side in the vertical direction of the chassis, and a side portion of the inner portion of the chassis, plural semiconductor modules each incorporating a semiconductor chip for configuring an inverter circuit of converting a direct current power into an alternate current power, and provided with a direct current terminal for making a current flow to the semiconductor chip and a control terminal for controlling an operation of the semiconductor chip to be protruded to an outer portion. | 01-24-2013 |
20130063893 | ENERGY REPOSITORY DISCHARGE SYSTEM FOR CONSTRUCTION MACHINERY - A discharge system of a stored energy for a construction machine is provided, which includes the energy storage, an electric discharge device discharging energy stored in the energy storage, and an energy cooling portion increasing the heat dissipation capacity of the electric discharge device by cooling heat generated in the electric discharge device for a time when the energy stored in the energy storage is discharged to the electric discharge device. Since the heat generated in the electric discharge device is cooled by a cooling device while the energy stored in the energy storage is discharged to the electric discharge device, the heat dissipation capacity of the electric discharge device is increased to shorten the discharge time. Also, the operation period of the cooling device is controlled in proportion to the residual voltage of the energy storage, and thus the cooling efficiency is maximized. | 03-14-2013 |
20130077238 | LIQUID COOLING SYSTEM FOR MODULAR ELECTRONIC SYSTEMS - A system for cooling an integrated circuit of an electronic device includes a cooling body and a shelf that is positioned relative to the cooling body for the device to be reversibly inserted onto the shelf so that the cooling body is in thermal contact with the integrated circuit. The cooling body is cooled by introducing a fluid therein via an input conduit. The hot fluid is received from the cooling body by an output conduit and is cooled for recycling. The housing of the electronic device includes a rearward gap that admits the cooling body into the housing of the electronic device. Preferably, further cooling is provided by forcing a gas to flow past the output conduit. | 03-28-2013 |
20130088833 | FLEXIBLE AIR DUCT FOR EQUIPMENT COOLING - A server cooling system may include, but is not limited to: a server rack; and a flexible duct apparatus, the flexible duct apparatus comprising: a flexible frame; and a fabric portion disposed over at least a portion of the frame, wherein the flexible frame and fabric cooperatively define at least a cooling system aperture and a server aperture. | 04-11-2013 |
20130120934 | Mechanical Heat Pump for an Electrical Housing - A system for transferring heat from an electrical enclosure is provided. An electrical enclosure defines a housing area in which one or more electrical devices are housed. A heat pump extends through the electrical enclosure, the heat pump defining a channel configured to communicate fluid for transferring heat from the one or more electrical devices. The electrical enclosure is substantially sealed from the heat pump channel and from other areas outside the electrical enclosure. | 05-16-2013 |
20130250512 | DEVICE FOR CONDUCTING A COOLING FLUID, AND COOLING SYSTEM FOR COOLING AN ELECTRICAL COMPONENT - The invention relates to a device for conducting a cooling fluid for cooling an electrical component. The device comprises a fluid conducting chamber for conducting the cooling fluid, and an at least partially flexible cover, which seals the fluid conducting chamber in a fluid-tight manner and which forms a heat transmission zone for conducting heat between the cooling fluid and the electrical component. | 09-26-2013 |
20130314870 | HEAT DISSIPATION SYSTEM FOR POWER MODULE - Disclosed herein is a heat dissipation system for a power module, including: a manifold including an inlet and an outlet and formed so as to be opened at a surface thereof contacting a nozzle member; a nozzle member formed at an upper portion of the manifold and including inclined nozzles through which a cooling medium introduced through the inlet of the manifold passes; and a nozzle chamber formed on the nozzle member and forming a spacing space spaced from the nozzle member. | 11-28-2013 |
20130322016 | POWER MANAGEMENT SYSTEMS - Provided are a power management system and method. At least one frame module includes at least one bay and a plurality of first connectors at a rear portion of the at least one bay and at least one power conversion unit positioned in the at least one bay. The at least one power conversion unit includes a plurality of second connectors. Each second connector is removably coupled to a first connector of the plurality of first connectors. The first and second connectors include a combination of high power, cooling, and control connectors. | 12-05-2013 |
20130329362 | Board Cooling Apparatus and Information Equipment - Embodiments of the present invention relate to a board cooling apparatus comprising a shell and a board, where the board and an interior wall of the shell form a closed space, a cooling medium inlet and a cooling medium outlet are disposed on the shell, a separator plate that separates the board into a first part and a second part, a through opening between the first part and the second part, a cooling medium flows into the first part from the cooling medium inlet and then flows into the second part, and flows out from the cooling medium outlet, a flow guiding mechanism that is disposed on the board and configured to divert the cooling medium flowing into the first part from the cooling medium inlet, so as to directly guide part of the cooling medium into the second part. | 12-12-2013 |
20130335918 | POWER CONVERSION APPARATUS WITH GROMMET INSERTED INTO CASING - A power conversion apparatus is equipped with grommets each of which hermetically seals between one of a coolant inlet tube and a coolant outlet tube of a cooler. Each of the grommets has a sealing protrusion and is fit in a cut-out formed in an end of a side wall of a casing with the sealing protrusion pressed against an inner wall of the cut-out. The installation of each of the grommets is achieved by inserting the grommet through the cut-out in a direction from outside to inside the casing so that a portion of the grommet protrudes from the wall into the casing. The visual perception of such protrusion made by an assembly worker, therefore, enables the assembly worker to determine whether the grommet has been installed in place in the cut-out to establish a desired hermetical seal or not. | 12-19-2013 |
20140022727 | Cooling device for electronic components and control apparatus comprising the cooling device - A cooling device for electronic components includes a substantially prismatic body made of a thermally conductive material, which has a pair of substantially planar main outer surfaces and encloses therein at least one circuit for the flow of a cooling fluid. Both main outer surfaces are designed to allow removable attachment of an electronic component to be cooled. A control apparatus incorporating the device. | 01-23-2014 |
20140043757 | ELECTRO-RHEOLOGICAL MICRO-CHANNEL ANISOTROPIC COOLED INTEGRATED CIRCUITS AND METHODS THEREOF - An integrated circuit chip having micro-channels formed in multiple regions of the integrated circuit chip and a method of cooling the integrated circuit chip. The method includes for any region of the multiple regions, allowing a coolant to flow through micro-channels of the region only when a temperature of the region exceed a first specified temperature and blocking the coolant from flowing through the micro-channels of the region when a temperature of the region is below a second specified temperature. | 02-13-2014 |
20140085817 | IMMERSION-COOLING OF SELECTED ELECTRONIC COMPONENT(S) MOUNTED TO PRINTED CIRCUIT BOARD - A method is provided for pumped immersion-cooling of selected electronic components of an electronic system, such as a node or book of a multi-node rack. The method includes providing a housing assembly defining a compartment about the component(s) to be cooled, which is coupled to a first side of a printed circuit board. The assembly includes a first frame with an opening sized to accommodate the component(s), and a second frame. The first and second frames are sealed to opposite sides of the board via a first adhesive layer and a second adhesive layer, respectively. The printed circuit board is at least partially porous to a coolant to flow through the compartment, and the first frame, second frame, and first and second adhesive layers are non-porous with respect to the coolant, and provide a coolant-tight seal to the first and second sides of the printed circuit board. | 03-27-2014 |
20140118932 | COOLING APPARATUS FOR AN ELECTRICAL SUBSTRATE - A cooling apparatus is disclosed. The cooling apparatus comprises a first outer portion comprising a fluid inlet and a first exterior cooling surface. A first fluid-diverting structure is in fluid communication with the fluid inlet. A second outer portion comprises a fluid outlet and a second exterior cooling surface. A second fluid-diverting structure is in fluid communication with the fluid outlet. An electrical substrate is coupled to at least one of the first and second exterior cooling surfaces. An intermediate portion is in a facing relationship with the first and second outer portions. The intermediate portion defines an aperture for transferring a fluid between a first cavity and a second cavity. The first cavity is defined between the first outer portion and the intermediate portion. The second cavity is defined between the second outer portion and the intermediate portion. The fluid absorbs heat from the electrical substrate. | 05-01-2014 |
20140118933 | POWER CONVERTER INCLUDING SEMICONDUCTOR MODULE AND COOLER - A power converter including a semiconductor module; a cooler having a pair of coolant pipes; a casing provided with a pair of openings, housing the semiconductor module and the cooler; and a pair of grommets being fitted to the pair of openings where the pair of coolant pipes are interested into the pair of grommets. | 05-01-2014 |
20140118934 | Power Semiconductor Module and Power Converter Using the Same - A power semiconductor module includes a first package having an upper arm circuit section, a second package having a lower arm circuit section, a metal case having a storage space to store the first package and the second package and an opening connecting with the storage space, and an intermediate connecting conductor to couple the upper arm circuit section with the lower arm circuit section; the case includes a first radiating section and a second radiating section facing the first radiating section through the storage space; the first package is arranged so that the arrangement direction of the first and second packages may be parallel to the respective surfaces facing the first and second radiating sections; and the intermediate connecting conductor couples an emitter side terminal extending from the first package with a collector side terminal extending from the second package in the storage space. | 05-01-2014 |
20140160677 | ELECTRONIC DEVICE COOLING WITH MICROJET IMPINGEMENT AND METHOD OF ASSEMBLY - An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and/or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet. | 06-12-2014 |
20140198449 | COOLING-TYPE SWITCHING ELEMENT MODULE - A cooling type switching element module includes an outer conductor pipe, an inner conductor pipe that transmits electric power in conjunction with the outer conductor pipe, and first and second switching elements. The first switching elements are provided on outer surfaces of the outer conductor pipe, and the second switching elements are provided on outer surfaces of a projecting portion of the inner conductor pipe. A coolant flows within the inner conductor pipe, and outside the outer conductor pipe. The first and second switching elements are cooled from both sides by the coolant flowing within the inner conductor pipe, and by the coolant flowing outside the outer conductor pipe. By employing the above-described structure, it is possible to provide a switching element module having a cooling function, in which improved cooling performance, improved electrical performance, and downsizing are achieved. | 07-17-2014 |
20140198450 | POWER CONVERSION DEVICE - A power conversion device includes a laminated unit, a reactor, a shield, and coolant passages. In the laminated unit, flat-plate semiconductor modules housing semiconductor elements and flat-plate cooling plates are laminated. The shield is interposed between the reactor and electronic components. The coolant passages supply coolant to or discharge coolant from the laminated unit. The coolant passages pass through an interior of the shield. | 07-17-2014 |
20140204532 | PASSIVELY CONTROLLED SMART MICROJET COOLING ARRAY - An impingement cooling system for cooling electronic components includes a nozzle array having a plurality of nozzles in fluid communication with a source of cooling fluid, each nozzle including a deflection structure that deforms above a threshold temperature. A plurality of thermally conductive pins respectively are in thermal contact with the deflection structures and conduct heat from at least one of the electronic components to the deflection structures. When a heated nozzle within the nozzle array reaches a temperature above the threshold temperature due to heat conducted from the respective thermally conductive pin, the deflection structure of the heated nozzle deforms from a closed position to an open position to permit cooling fluid to impinge upon the electronic component. The deflection structure may be a deflection plate formed of a bimetallic material having layers of different thermal expansion coefficients, or a thermally responsive two-way shape memory material. | 07-24-2014 |
20140254093 | SYNTHETIC JET ACTUATOR EQUIPPED WITH ENTRAINMENT FEATURES - A thermal management system ( | 09-11-2014 |
20140268561 | ELECTRONIC EQUIPMENT AND HEAT RECEIVING DEVICE - An electronic equipment includes: a heat generating component; and
| 09-18-2014 |
20140285969 | CAPACITOR MODULE WITH TEMPERATURE SENSOR - In a capacitor module, a capacitor, a seal member that seals the capacitor, an electronic element electrically connected to the capacitor, a temperature sensor that measures a temperature around the capacitor, and a wire member electrically connected to the temperature sensor are provided. A holder holds at least the electronic element, the temperature sensor, and the wire member. The holder is fixed to the seal member while the temperature sensor is located between the electronic element and at least part of the capacitor via the seal member. | 09-25-2014 |
20140285970 | Electric Power Conversion System - There is provided an electric power conversion system. Bus bars | 09-25-2014 |
20140301039 | PACKAGE AND A METHOD OF MANUFACTURING THE SAME - In various embodiments, a package may be provided. The package may include a chip carrier. The package may further include a chip arranged over the chip carrier. The package may also include encapsulation material encapsulating the chip and partially the chip carrier. A coolant receiving recess may be provided over the chip in the encapsulation material, wherein the coolant receiving recess is configured to receive coolant. | 10-09-2014 |
20140340845 | Fluid Cooled Enclosure For Circuit Module Apparatus And Methods Of Cooling A Conduction Cooled Circuit Module - A fluid cooled enclosure includes a fluid conduit that provides a fluid coolant path between sides of a housing. Optionally, the fluid conduit can provide bi-directional fluid coolant paths. In another example, an interface block can be provided with a first interface surface engaging an interface surface of a first end portion of the fluid conduit. In another example, a first end portion of the fluid conduit is fabricated with a first material composition and the interface block is fabricated with a second material composition that has a higher thermal conductivity than the first material composition. In further examples, methods of cooling a conduction cooled circuit module comprise the steps of mounting an interface block to a conduction cooled circuit module, mounting the interface block with respect to the fluid conduit, and cooling the electrical circuits of the conduction cooled circuit module by flowing fluid coolant through the fluid conduit. | 11-20-2014 |
20140368999 | Temperature Control Module For A Socket - A temperature control module for a socket is provided with of an upper docking plate and a lower docking plate. The upper docking plate has a recess for accommodating a socket and two temperature-controlling fluid passages. One end of the passages communicates with the recess, and the other end thereof is connected to a temperature-controlling fluid source. The lower docking plate is disposed under the upper docking plate and covers the recess. A fluid chamber is formed of the recess of the docking plate, the lower docking plate and the socket. The temperature-controlling fluid source outputs a temperature-controlling fluid to the fluid chamber via the temperature-controlling fluid passages for maintaining the socket at a specific temperature. | 12-18-2014 |
20140369000 | TERMINAL UNIT - A terminal unit according to an embodiment of the present invention includes: a case forming the outer shape; and a frame disposed in the case and having a heat dissipation channel, in which the frame includes: a first panel made of a material having high thermal conductivity and disposed in the case; and a second panel made of a material having a high insulating property and combined with the first panel. | 12-18-2014 |
20140376183 | COOLING DEVICE INCLUDING ETCHED LATERAL MICROCHANNELS - In some examples, a cooling system includes a silicon substrate defining a first trench, a second trench, and a plurality of channels extending between the first trench and the second trench. The silicon substrate may define a first surface and a second surface substantially opposite to and substantially parallel to the first surface, and each of the plurality of channels may extend substantially parallel to the surface of the silicon substrate. The cooling system also may include a microelectronic device comprising a heat-generating area. The microelectronic device may be attached to the first surface or the second surface of the silicon substrate. In some examples, the plurality of channels may be etched between the first trench and the second trench. | 12-25-2014 |
20140376184 | SEMICONDUCTOR DEVICE AND COOLER THEREOF - A semiconductor device exhibits low pressure loss and is capable of cooling a plurality of power semiconductor chips evenly. This semiconductor device includes a semiconductor module and a cooler for cooling a power semiconductor element mounted in the semiconductor module. A cooling unit of the cooler has a first header part that has a first bottom surface disposed between a coolant inlet and an end portion of a first substrate on the coolant outlet side and inclined toward a bottom plane of cooling fins so that a coolant supplied from the coolant inlet flows toward the cooling fins; and a second header part that has a second bottom surface inclined from an end portion of the bottom plane of the cooling fins on the coolant outlet side so that the coolant discharged from the cooling fins flows to the coolant outlet. | 12-25-2014 |
20150070841 | COOLING STRUCTURE FOR INVERTER DEVICE - A cooling structure for an inverter ( | 03-12-2015 |
20150092347 | COOLING DEVICE, ELECTRONIC APPARATUS AND METHOD OF ATTACHING COOLING DEVICE - A cooling device includes a cooling member connected with a cooling pipe through which a cooling medium flows, a first fastening mechanism part provided at a first position on the cooling member and configured to fasten the cooling member and a substrate in a state where an electronic part to be cooled is sandwiched between the cooling member and the substrate, and a second fastening mechanism part provided at a second position on the cooling member that is different from the first position, the second position being located at a position where a first load exerted on the cooling member and a second load exerted on the cooling member maintain a balance in the electronic part, the first load being applied by the cooling pipe and the first fastening mechanism part, the second load being applied by the second fastening mechanism part. | 04-02-2015 |
20150103489 | INTEGRATED CIRCUIT CHIP COMPRISING ELECTRONIC DEVICE AND ELECTRONIC SYSTEM - An electronic device includes a substrate wafer made of an insulating material and having an electrical connection network. An integrated circuit chip is mounted to a top side of the substrate wafer. The substrate wafer contains an internal duct. The duct is formed by a covered trench located in the top side of the substrate wafer. The trench contains a thermally conductive material, for example being a fluid. Openings in the top side of the substrate wafer that are offset from the trench permit the making of an electrical connection between the integrated circuit and the electrical connection network. | 04-16-2015 |
20160192534 | COLD PLATE, FORMING IN PARTICULAR A STRUCTURAL PART OF AN ITEM OF EQUIPMENT HAVING HEAT-GENERATING COMPONENTS - A cold plate for cooling heat-generating components, includes two plates extending parallel to each other. A core is sandwiched between the two plates to form a sandwich structure, the core including a set of passages for passing a cooling fluid from a first edge to an opposite second edge of the sandwich structure. First and second fluid-tight joining members are disposed respectively on the first and second opposite edges of the sandwich structure, the first fluid-tight joining member including at least one inlet connector and the second fluid-tight joining member including at least one outlet connector for the passage of the cooling fluid. A method for use of the cold plate in particular as a structural part of an avionics equipment item is also provided. | 06-30-2016 |
20180023568 | ELECTRIC COMPRESSOR | 01-25-2018 |
20180026545 | Electric Power Conversion Device | 01-25-2018 |
20220141992 | POWER MODULE AND POWER ELECTRONICS DEVICE - A power module for an inverter is disclosed. The power module has a base plate with a first base plate side and a second, opposite base plate side, controllable electronic switches arranged on the first base plate side, inputs and outputs, which are electrically connected to the electronic switches. The power module is designed to convert an input voltage applied to the inputs to an output voltage applied to the outputs by the electronic switches. The power module also includes a plurality of cooling devices attached to the second base plate side. The cooling devices each have loops arranged one behind the other. The loops of a first group of cooling devices are inclined with respect to the loops of a second group of cooling devices, and/or the loops of each group of cooling devices protrude from the second base plate side to different distances. | 05-05-2022 |