Entries |
Document | Title | Date |
20080204968 | MULTILAYER CAPACITOR - In a multilayer capacitor including a capacitor body, first capacitor portions and a second capacitor portion are arranged in the direction of lamination. While a resonant frequency of the first capacitor portions is set to be greater than a resonant frequency of the second capacitor portion so that the first capacitor portions contribute to low impedance, an ESR per layer of the second capacitor portion is set to be greater than an ESR per layer of the first capacitor portions so that the second capacitor portion contributes to high ESR. Further, a combined ESR of the first capacitor portions is set to be substantially equal to a combined ESR of the second capacitor portion. | 08-28-2008 |
20080204969 | MULTILAYER CAPACITOR - In a multilayer capacitor including a capacitor body, first capacitor portions and a second capacitor portion are arranged in the direction of lamination. While a resonant frequency of the first capacitor portions is set to be greater than a resonant frequency of the second capacitor portion so that the first capacitor portions contribute to low ESL, an ESR per layer of the second capacitor portion is set to be greater than an ESR per layer of the first capacitor portions so that the second capacitor portion contributes to high ESR. Furthermore, a combined ESR of the first capacitor portions is set to be less than or greater than a combined ESR of the second capacitor portion. | 08-28-2008 |
20080218935 | Ultra Low Temperature Fixed X7R And BX Dielectric Ceramic Composition And Method Of Making - Multilayer ceramic chip capacitors which satisfy X7R and BX requirements and which are compatible with silver-palladium internal electrodes are made in accordance with the invention. The capacitors exhibit desirable dielectric properties (high capacitance, low dissipation factor, high insulation resistance), excellent performance on highly accelerated life testing, and very good resistance to dielectric breakdown. The dielectric layers comprise a lead-free and cadmium-free barium titanate base material doped with other metal oxides such oxides of zinc, boron, bismuth, cerium, tungsten, copper, manganese, neodymium, niobium, silver, barium, silicon and nickel in various combinations. The dielectric ceramic materials herein can be sintered together (fired) at less than 1000° C. with an inner electrode having more than 80 wt % Ag and less than 20 wt % Pd to form a multilayer ceramic capacitor (MLCC). | 09-11-2008 |
20080239616 | MULTILAYER CAPACITOR ARRAY - A multilayer capacitor array comprises a capacitor body having rectangular first and second main faces opposing each other. In the capacitor body having a dielectric characteristic, first inner electrodes are arranged in a first region, second inner electrodes are arranged in a second region, and third and fourth inner electrodes are arranged so as to extend over the first and second regions. Each of the third inner electrodes opposes at least one of the first inner electrodes and at least one of the second inner electrodes. Each of the fourth inner electrodes opposes at least one of the first inner electrodes and at least one of the second inner electrodes. The third inner electrodes are adjacent to the fourth inner electrodes, respectively. | 10-02-2008 |
20080239617 | MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT - A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked. | 10-02-2008 |
20080253059 | LAND GRID FEEDTHROUGH LOW ESL TECHNOLOGY - Disclosed are apparatus and methodology for providing land grid feedthrough capacitor designs having broad applicability to signal and power filtering technologies. Such capacitor designs provide characteristics for use in decoupling applications involving both signal level and power level environments. Low equivalent series inductance (ESL) is provided by current cancellation techniques involving opposite current flow in power or signal and ground current paths through the device. | 10-16-2008 |
20080273286 | GUARD RING DEVICE RECEIVING DIFFERENT VOLTAGES FOR FORMING DECOUPLING CAPACITOR AND SEMICONDUCTOR DEVICE HAVING THE SAME - A semiconductor device in which a decoupling capacitor is formed by supplying different power levels to a guard ring device is disclosed. The semiconductor device includes a guard ring, having conductive rings, which surrounds a memory chip. The conductive rings are stacked in a multiplayer structure, and insulation layers are formed between the conductive rings. Voltages of different levels are applied to adjacent conductive rings. | 11-06-2008 |
20080278886 | Increasing the capacitance of a capacitive device by micromasking - Capacitive coupling devices and methods of fabricating a capacitive coupling device are disclosed. The coupling device could include a stack of layers forming electrodes and at least one insulator. The insulator could include a a region of doped silicon. The silicon could be doped with a species selected from Ce, Cr, Co, Cu, Dy, Er, Eu, Ho, Ir, Li, Lu, Mn, Pr, Rb, Sm, Sr, Tb, Tm, Yb, Y, Ac, Am, Ba, Be, Cd, Gd, Fe, La, Pb, Ni, Ra, Sc, Th, Hf, Tl, Sn, Np, Rh, U, Zn, Ag, and Yb in relief and forming roughnesses relative to the neighbouring regions of the same level in the stack. The electrodes and the insulator form conformal layers above the doped silicon region. | 11-13-2008 |
20080310074 | MULTILAYER CAPACITOR - A multilayer capacitor comprises a capacitor body, first and second inner electrodes, and first and second terminal electrodes. A first terminal electrode is arranged on a first surface of the capacitor body which is parallel to a first direction, and connected to the first inner electrode. A second terminal electrode is connected to the second inner electrode. The first inner electrode has a first main electrode portion including a first no-capacity generating region and a first capacity generating region, and a first lead electrode portion. In a second direction, the first terminal electrode is set smaller than the first surface, while the first lead electrode portion is set smaller than the first main electrode portion. The first no-capacity generating region and the first lead electrode portion overlap each other in the second direction when seen in the first direction. | 12-18-2008 |
20090021886 | MULTILAYER STRIP LINE CAPACITIVE ELEMENT - The capacitive element of the present invention includes a plurality of cylindrical metal pieces having different sizes, which are disposed in multiple layers surrounding a strip-shaped metal piece. A dielectric film and a conductive material layer are located between the metal piece innermostly located among the plurality of cylindrical metal pieces, and the strip-shaped metal piece, and between adjoining cylindrical metal pieces. Further, the dielectric film and the conductive material layer are laminated and disposed at positions symmetric with respect to the side wall of respective cylindrical metal piece. | 01-22-2009 |
20090021887 | MULTI-LAYER CAPACITOR AND WIRING BOARD HAVING A BUILT-IN CAPACITOR - A capacitor capable of decoupling in a wide frequency band is obtained. A circuit in which capacitors having different capacitances are combined can be formed without increasing the number of components. Part of a first penetrating electrode or second penetrating electrode is cut by removing a cut portion. A penetrating electrode having a cut portion reduces the number of internal electrodes that are conductively connected, so that a capacitance to be extracted is small. The capacitance to be extracted can be adjusted, depending on which of layers of internal electrodes the cut portion is formed in. | 01-22-2009 |
20090034152 | FEEDTHROUGH CAPACITOR AND METHOD FOR PRODUCING FEEDTHROUGH CAPACITOR - In a feedthrough capacitor, a signal internal electrode layer is so arranged that an opposed portion opposed to a ground internal electrode layer is provided with a projection projecting toward a ground electrode, when viewed from a direction of a stack of dielectric layers. Therefore, if a gap amount G is abnormal between an end face with the ground electrode thereon and the signal internal electrode layer, the projection comes in contact with the ground electrode and a short circuit occurs between the ground electrode and terminal electrodes. This feedthrough capacitor thus permits easy detection of abnormality of the gap amount G, based on the presence/absence of a short-circuit failure. | 02-05-2009 |
20090040684 | CREATION OF CAPACITORS EQUIPPED WITH MEANS TO REDUCE THE STRESSES IN THE METAL MATERIAL OF THEIR LOWER STRUCTURES - The method for forming the microelectronic device having at least one two or three dimensional capacitor includes creating, on a substrate, a plurality of components and a number of superimposed metal interconnection levels. An insulating layer is formed above a metal interconnection level, and a horizontal metal zone of a next metal interconnection level in which one or more of the insulating blocks created from this insulating layer are incorporated is formed therein. The zone is designed to form a lower structural part of the capacitor. | 02-12-2009 |
20090059466 | METAL-INSULATOR-METAL CAPACITOR AND METHOD FOR MANUFACTURING THE SAME - A metal-insulator-metal (MIM) capacitor capable of achieving an enhancement in the reliability of a semiconductor device, and a method for manufacturing the same are disclosed. The disclosed MIM capacitor includes a metal-insulator-metal (MIM) capacitor which may include a first insulating film, a first metal layer formed over the first insulating film and a first capacitor insulating film formed over the first metal layer. A second metal layer may be formed over a portion of the first capacitor insulating film and second capacitor insulating film may be formed over the second metal layer. A third metal layer may be formed over a portion of the second capacitor insulating film and a nitride film may be formed over the third metal layer. A multilayer insulating film may be formed over the entire upper surface of the resulting structure. First and second metal lines may be formed in contact holes extending through the first capacitor insulating film, the second capacitor insulating film, and the nitride film after extending through the multilayer insulating film. | 03-05-2009 |
20090080139 | STRUCTURE OF EMBEDDED CAPACITOR - The embedded capacitor of the present invention contains a power plate, a ground plate, and a dielectric layer vertically sandwiched between the power and ground plates. Both the power and ground plates are divided laterally into a number of smaller plates with appropriate gaps therebetween; and, as such, cracks in the dielectric layers are limited to happen between gaps only. The smaller plates are then electrically connected by connectors in the gaps. The connectors for the power plate and the connectors for the ground plate are not vertically overlapped so that they do not appear simultaneously at the two ends of the cracks simultaneously. | 03-26-2009 |
20090086403 | MULTILAYER CAPACITOR - There is provided a multilayer capacitor including an inner connecting conductor of at least one polarity; a plurality of first and second outer electrodes formed on a surface of the body, wherein the inner connecting conductor is connected to a corresponding one of the outer electrodes having identical polarity, a corresponding one of the inner electrodes having identical polarity to the inner connecting conductor includes a plurality of groups each including at least one of the inner electrodes, wherein the inner electrodes of the respective groups are connected to the outer electrodes having identical polarity that are different from one another for each of the groups and electrically connected to the inner connecting conductor through the connected outer electrode. | 04-02-2009 |
20090128985 | MULTILAYER CAPACITOR - A first internal electrode includes a first lead portion and a second lead portion. A second internal electrode includes a third lead portion and a fourth lead portion. A third internal electrode includes a main electrode portion and a fifth lead portion. A fourth internal electrode includes a main electrode portion and a sixth lead portion. A joint portion between the main electrode portion and the fifth lead portion of the third internal electrode is located between an edge on the first side face side and an edge on the second side face side in a capacitance forming region when viewed from an opposing direction of the third and fourth side faces. A joint portion between the main electrode portion and the sixth lead portion of the fourth internal electrode is located between an edge on the first side face side and an edge on the second side face side in a capacitance forming region when viewed from the opposing direction of the third and fourth side faces. | 05-21-2009 |
20090135542 | GLASS COMPOSITION, DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR EMBEDDED LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE USING THE SAME - Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBi | 05-28-2009 |
20090141420 | Packaged Capacitive Device And Methods Of Making The Same - Packaged capacitive devices are described having electrical interconnects of electrodes which possess efficient electrical contact between current collectors, electrical isolation of electrodes, and/or electrochemical stability, while minimizing the mechanical stress and strain applied to the electrodes, in part, due to the use of a compliant layer. The packaged capacitive devices are adaptable to a wide range of electrode diameters and electrode stack lengths. | 06-04-2009 |
20090154055 | MULTILAYER CAPACITOR - In a capacitor body of a multilayer capacitor, one second capacitor portion is sandwiched between two first capacitor portions. An ESR is controlled by setting a width of lead portions of third and fourth internal electrodes disposed in the second capacitor portion to be less than that of lead portions of first and second internal electrodes disposed in the first capacitor portions and by changing ratios between the first and second capacitor portions in the width of the lead portions and in the number of stacked internal electrodes. In the first capacitor portions, current paths from the internal electrodes to an external terminal electrode are widely distributed so that the first capacitor portions have a relatively low ESL, and accordingly, the ESL of the entire multilayer capacitor is reduced. | 06-18-2009 |
20090168294 | CAPACITOR - A capacitor according to an embodiment can include a first dielectric layer; a first metal layer disposed below the first dielectric layer; a second dielectric layer disposed below the first metal layer; a second metal layer disposed below the second dielectric layer; a third dielectric layer disposed below the second metal layer; and a third metal layer disposed below the third dielectric layer and electrically connected to the first metal layer. | 07-02-2009 |
20090168295 | MULTILAYER CAPACITOR HAVING HIGH ESR - A first inner electrode has a first main electrode, a first lead conductor, a first coupling conductor, and a second lead conductor A second inner electrode has a second main electrode, a third lead conductor, and a second coupling conductor. A third inner electrode has a third main electrode, and a fourth lead conductor. The third inner electrode is connected to only a first connection conductor. In the extending direction of the first and third lead conductors, the first and second coupling conductors have a length shorter than the lengths of the first and third lead conductors and of the first and second main electrodes, respectively. The second inner electrode is adjacent to at least one of the first and third inner electrodes so as to sandwich the insulating layer | 07-02-2009 |
20090168296 | THROUGH-TYPE MULTILAYER CAPACITOR ARRAY - A multilayer capacitor array comprises a capacitor body, and two first signal terminal electrodes, two second signal terminal electrodes, two grounding terminal electrodes, one first outer connecting conductor, and one second outer connecting conductor. The capacitor body includes first and, second signal inner electrodes, and first to third grounding inner electrodes. The first signal inner electrode is arranged to oppose the first or third grounding inner electrode with at least one insulator layer therebetween, while the second signal inner electrode is arranged to oppose the second or third grounding inner electrode with at least one insulator layer therebetween. The first and second signal inner electrodes, and first and second grounding inner electrodes are connected to the first and second signal terminal electrodes, and first and second outer connecting conductors, respectively. The third grounding inner electrode is connected to the grounding terminal electrodes and the first and second outer connecting conductors. | 07-02-2009 |
20090185326 | FILM CAPACITOR - A film capacitor comprises a wound body, a first terminal part electrically connected to one end of the wound body, and a second terminal part electrically connected to the other end of the wound body. The wound body is structured by winding into a laminate a first film laminate formed of a laminate of dielectric films and having therein a floating electrode and a second film laminate formed of a laminate of first and second metal films sandwiching the first film laminate and dielectric films and having therein a floating electrode. Each of the floating electrodes is composed of integrated small electrodes independent of each other. | 07-23-2009 |
20090195960 | Electronic Device and Production Method Thereof - Electronic device | 08-06-2009 |
20090195961 | METHOD AND DEVICE FOR STORING ELECTRICITY IN QUANTUM BATTERIES - Quantum Batteries (super capacitors) which by a new quantum effect “virtual photon resonance” can store electrical energy as a pure electrical battery in ranges up to 15 MJ/kg and more. The battery is basically a capacitor composed of insulating matrix material with either dispersed nanocrystal particles of Rutile TiO | 08-06-2009 |
20090201625 | CONDUCTIVE STRUCTURE HAVING CAPACITOR - A three-dimensional conductive structure has a first electrode and a second electrode of a capacitor structure, and thereby defines a capacitor space. At least a signal line is further included in the capacitor space where both the first electrode and the second electrode can cross and detour round the signal line. Therefore, the signal line can go directly through the capacitor space for transferring various signals without making a detour to avoid the whole capacitor structure. | 08-13-2009 |
20090207550 | ELECTRICAL FEEDTHROUGH COMPONENT AND METHOD FOR ITS PRODUCTION - An electrical component that is surface mountable includes a base body having first inner electrodes and second inner electrodes. A first outer electrode extends along the base body in a first direction, and a through connection extends along the base body in a second direction that is different from the first direction. The first inner electrodes are electrically connected to the first outer electrode. The second inner electrodes are electrically interconnected via the through connection. | 08-20-2009 |
20090207551 | DIELECTRIC CERAMIC AND MULTILAYER CERAMIC CAPACITOR USING THE SAME - A dielectric ceramic is provided which is can be stably used for a multilayer ceramic capacitor even at a high temperature of approximately 175° C. The dielectric ceramic includes a perovskite type compound represented by the composition formula (B | 08-20-2009 |
20090219666 | Dielectric Ceramic, Manufacturing Method Thereof, And Multilayer Ceramic Capacitor - A dielectric ceramic whose primary crystal grains | 09-03-2009 |
20090231779 | MULTILAYER CAPACITOR AND MOUNTED STRUCTURE THEREOF - In a multilayer capacitor, widths of lead conductors of internal electrode and widths of lead conductors of internal electrode in an ESR control section are smaller than any one of widths of internal electrode and widths of internal electrode in a capacitance section. This narrows cross sections of the conductor portions connecting between the internal electrodes and the external electrodes, so as to her increase ESR. The widths of the respective lead conductors in the ESR control section are wider than widths of respective lead conductors in the capacitance section. This effectively prevents open failure and improves a yield of products. | 09-17-2009 |
20090237859 | METHOD FOR MANUFACTURING MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND MONOLITHIC CERAMIC ELECTRONIC COMPONENT - In a method for manufacturing a monolithic ceramic electronic component, metal thin-films to be processed into internal electrodes are formed on green ceramic sheets and include first metal particles and second metal particles that are more oxidizable than the first metal. The internal electrodes are formed in a firing step such that the second metal particles located near the interfaces between the metal thin-films and the green ceramic sheets are selectively oxidized and the second metal particles located in inner portions of the metal thin-films are deposited outside the metal thin-films and oxidized such that oxide layers including the oxidized second metal particles are formed along the interfaces and the first metal particles are sintered such that the first metal particles grow along the oxide layers. | 09-24-2009 |
20090244803 | MULTILAYER CHIP CAPACITOR - A multilayer chip capacitor includes a capacitor body including a first capacitor part and a second capacitor part, first and second external electrodes respectively formed on first and second longer side faces of the capacitor body, and third and fourth external electrodes respectively formed on first and second shorter side faces of the capacitor body. The first capacitor part includes first and second internal electrodes of opposite polarity, and the second capacitor part includes third and fourth internal electrodes of opposite polarity. The first to fourth internal electrodes each have one lead. The first to fourth external electrodes are respectively connected to the leads of the first to fourth internal electrodes. A series resonance frequency of the first capacitor part is different from that of the second capacitor part. Equivalent series resistance (ESR | 10-01-2009 |
20090244804 | C0G MULTI-LAYERED CERAMIC CAPACITOR - A dielectric ceramic composition in a multilayer ceramic capacitor with a composition of formula: | 10-01-2009 |
20090244805 | DIELECTRIC CERAMIC A ND MULTILAYER CERAMIC CAPACITOR - Provided is a dielectric ceramic in which, while achieving a dielectric constant ε of 500 or more, a breakdown voltage higher than 90 kV/mm can be obtained and which is suitable for constituting dielectric ceramic layers of a multilayer ceramic capacitor for medium-to-high voltage application. As the dielectric ceramic constituting dielectric ceramic layers of the multilayer ceramic capacitor, a dielectric ceramic including, as a main component, (Ba | 10-01-2009 |
20090257169 | STACKED CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREOF - In order to avoid the capacitors in a stacked capacitor structure suiting a miniaturization process from collapsing to cause a short-circuit, separated reinforced structures are used and disposed at the outer-sidewalls of the capacitor, which not only reduces the space occupied by the reinforced structure to increase the surface areas of the upper electrode and the lower electrode of the capacitor, but also allows the capacitor to be deflected but collapse-proof and there are more spaces between the capacitors, so as to solve the filling difficulty problem due to a too small filling space in a successive process of depositing conductive material into the filling space. | 10-15-2009 |
20090279227 | Multi Layer Chip Capacitor, and Method and Apparatus for Manufacturing the Same - The present invention carries out the vacuum deposition by setting a deposition angle between a single mask set including a shadow mask having a plurality of slits and a deposition source to form a lower terminal layer, a dielectric layer, an inner electrode layer, and an upper terminal layer at once under a vacuum state generated once, or adjusts slit patterns by relatively moving upper and lower mask sets that respectively include shadow masks having a plurality of slits and face each other to form a lower terminal layer, a dielectric layer, an inner electrode layer, and an upper terminal layer at once under a vacuum state generated once. | 11-12-2009 |
20090279228 | MULTILAYER CHIP CAPACITOR - A multilayer chip capacitor includes a capacitor body provided by a stack of a plurality of dielectric layers, a plurality of internal electrodes disposed in the capacitor body such that the internal electrodes of opposite polarities are alternately disposed to face each other with the dielectric layer interposed between each facing set of the internal electrodes, and a plurality of external electrodes disposed on an outer face of the capacitor body and electrically connected with the internal electrode. Each of the plurality of internal electrodes includes a main electrode part, and at least one lead extending from the main electrode part to a side face of the capacitor body and connected to a corresponding one of the external electrodes. The lead extends to the corresponding external electrode to be inclined with respect to the main electrode part thereof. | 11-12-2009 |
20090296310 | CHIP CAPACITOR PRECURSORS, PACKAGED SEMICONDUCTORS, AND ASSEMBLY METHOD FOR CONVERTING THE PRECURSORS TO CAPACITORS - A capacitive precursor ( | 12-03-2009 |
20090303655 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A ceramic electronic component includes a ceramic body and a plurality of external electrodes disposed at a surface of the ceramic body. The external electrodes include a plating layer containing glass particles each coated with a metal film. The plating layer is formed by co-deposition of a plating metal and the metal-coated glass particles. | 12-10-2009 |
20090303656 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING MONOLITHIC CERAMIC ELECTRONIC COMPONENT - A monolithic ceramic electronic component includes a laminate including a plurality of stacked ceramic layers and a plurality of internal electrodes extending between the ceramic layers and also includes external electrodes disposed on the laminate. The internal electrodes are partly exposed at surfaces of the laminate and are electrically connected to each other with the external electrodes. The external electrodes include first plating layers and second plating layers. The first plating layers are in direct contact with the internal electrodes. The second plating layers are located outside the first plating layers and contain glass particles dispersed therein. | 12-10-2009 |
20090323253 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MAKING THE SAME - A multilayer ceramic electronic component includes external terminal electrodes that are formed by depositing metal plating films on exposed portions of internal conductors embedded in a ceramic body, depositing a copper plating films that cover the metal plating films and make contact with the ceramic body around the metal plating films, and heat-treating the ceramic body to generate a copper liquid phase, an oxygen liquid phase, and a copper solid phase between the copper plating films and the ceramic body. The mixed phase including these phases forms a region at which a copper oxide is present in a discontinuous manner inside the copper plating film at least at the interfaces between the ceramic body and the copper plating films. The copper oxide securely attaches the copper plating films to the ceramic body and enhances the bonding force of the external terminal electrodes. | 12-31-2009 |
20100002356 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT - A monolithic ceramic electronic component includes a dummy electrode having a dummy body portion and an internal electrode having an extended portion, in which the conductor density of the dummy body portion is less than the conductor density of the extended portion of an internal electrode. With this configuration, the fixing strength of an external terminal electrode to a ceramic element assembly is improved, and undesirable deformation caused by a dummy conductor provided in a monolithic ceramic electronic component is prevented. | 01-07-2010 |
20100008017 | LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic electronic component includes first internal electrodes and second internal electrodes that overlap each other through ceramic layers, each of the first and second internal electrodes having first and second effective portions, first and second connecting portions, and first and second extended portions whose film thickness is greater than that of the first and second connecting portions and which are exposed at the outer surface of a ceramic element assembly. When distances from side surfaces of the ceramic assembly on which first and second external electrodes are provided to the inner edges of the first and second extended portions are defined as L | 01-14-2010 |
20100014210 | DIELECTRIC CERAMIC MATERIAL AND MONOLITHIC CERAMIC CAPACITOR - A dielectric ceramic material is composed of a perovskite compound represented by ABO | 01-21-2010 |
20100020464 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME - A method for producing a multilayer ceramic electronic component includes a plating step including depositing a plating material on the ends of internal electrodes exposed at a predetermined surface of a laminate to form plating deposits primarily composed of a specific metal and growing the plating deposits so as to connect the plating deposits to each other to form a continuous plated layer. The specific metal primarily defining the plated layer is different from a metal defining the internal electrodes. The same or substantially the same metal as the metal defining the internal electrodes is present throughout the plated layer. | 01-28-2010 |
20100020465 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - In a method for manufacturing a monolithic ceramic electronic component, when an inner conductor is formed by printing an electrically conductive paste, a smear may be generated in an opening of the inner conductor at a side of the opening near to a position from which printing is started in a printing direction. The smear may cause an unwanted contact between the inner conductor and a via conductor, which is a conductor extending through the opening and having a potential different from that of the inner conductor, and cause a short-circuit. The inner conductor is printed in such a manner that the center of each of the via conductors is deviated from the center of the opening in the direction in which the electrically conductive paste is printed. With this structure, even if the smear is generated in the opening, the probability that the inner conductor contact the via conductor and cause a short-circuit is minimized. | 01-28-2010 |
20100020466 | ARRAY TYPE MULTI-LAYER CERAMIC CAPACITOR AND PRODUCTION METHOD THEREOF - A method of producing an array type multi-layer ceramic capacitor is disclosed, comprising: forming dielectric films, forming dielectric sheets on which internal electrodes and interelectrode dielectrics formed on the same plane as the internal electrodes are printed simultaneously by spraying ink intended for internal electrodes and ink intended for dielectrics onto the dielectric film via a plurality of inkjet printer heads, stacking and compressing the dielectric sheets, cutting the stacked dielectric sheet to include a plurality of internal electrodes on the same plane as the dielectric sheet, and sintering the cut dielectric sheets. The array type multi-layer ceramic capacitor according to the invention can solve the problem of interlayer gaps by printing the dielectrics and internal electrodes simultaneously, and can solve the contact problem by printing the internal electrode and the external electrode as a single body. | 01-28-2010 |
20100039749 | ULTRA BROADBAND CAPACITOR - Disclosed are apparatus and methodology for inexpensive realization of one or more secondary capacitors within a monolithic body that already includes a first, larger capacitor to provide ultra wideband structures. Alternating layers of electrodes are provided with arm portions that embrace portions of adjacent electrode layers so as to create additional coupling effects within the capacitor structure thereby producing multiple additional equivalent capacitor structures within the device. | 02-18-2010 |
20100046135 | ELECTRIC ELEMENT - An electric element comprises a dielectric layers, conductive plates, anode electrodes, and cathode electrodes. The conductive plates and the conductive plates are alternately laminated in the width direction of the electric element. The anode electrodes are connected to each of the conductive plates with a predetermined distance. The cathode electrodes are connected to each of the conductive plates with a predetermined distance. The electric element is mounted on a substrate in a manner where the bottom surface makes contact with the substrate. The anode electrode is connected to a first signal line that has a width substantially equal to that of the electric element disposed on the substrate. The anode electrode is connected to a second signal line that has a width substantially equal to that of the electric element disposed on the substrate. | 02-25-2010 |
20100046136 | Metal capacitor and manufacturing method thereof - A metal capacitor in which an electric conductivity is significantly improved by applying a metal material for an electrolyte and a manufacturing method thereof is provided. The capacitor includes: a terminal increase-type metal member comprising a groove forming portion; a metal oxide layer being formed on the terminal increase-type metal member; an insulating layer being formed on the terminal increase-type metal member; a plurality of main electrode layers being formed in a groove forming portion; a plurality of conductive connecting layers being formed on the plurality of main electrode layers and the insulating layer; a first lead terminal being selectively connected to the first and the second electrode withdrawing portions of the terminal increase-type metal member; a second lead terminal being connected to the main electrode layer of the terminal increase-type metal member; and a sealing member sealing the terminal increase-type metal member connected to the first and the second lead terminals to externally expose the first and the second lead terminals. | 02-25-2010 |
20100046137 | GLASS CERAMIC COMPOSITION, GLASS CERAMIC SINTERED BODY, AND MULTILAYER CERAMIC ELECTRONIC DEVICE - A glass ceramic composition is provided which can be fired at a temperature of 1,000° C. or less to form a sintered body having a low relative dielectric constant, a small temperature coefficient of resonant frequency, a small change in capacitance before and after a loading test, a high Qf value, high electrical insulating reliability, and a high flexural strength. A glass ceramic composition forming glass ceramic layers laminated to each other in a multilayer ceramic substrate is also provided. The glass ceramic composition includes a first ceramic powder containing forsterite as a primary component; a second ceramic powder containing SrTiO | 02-25-2010 |
20100061035 | Capacitative element - Disclosed herein is a capacitative element, including: a first electrode formed on a substrate; and a second electrode provided so as to sandwich a dielectric between the first electrode and the second electrode and so as to surround the first electrode on four sides along a surface of the substrate. | 03-11-2010 |
20100085681 | DIELECTRIC CERAMIC COMPOSITION AND LAMINATED CERAMIC CAPACITOR - There is provided a dielectric ceramic composition that is a dielectric ceramic material used for a laminated ceramic capacitor; that can be co-fired with internal electrodes mainly composed of Ni at a temperature of 1300° C. or less; and that has a high dielectric constant, good temperature characteristics of capacitance in a range of −55 to 175° C., and a high resistivity ρ at 175° C. The dielectric ceramic composition includes a main component represented by a composition formula (1−a) (K | 04-08-2010 |
20100091424 | METHOD FOR REDUCING SIDEWALL ETCH RESIDUE - A method for fabricating a semiconductor device is provided. The method comprising forming a first layer over a substrate and a second layer over the first layer. A patterned masking layer is subsequently provided over the second layer and a patterned second layer with outwardly tapered sidewalls is formed by isotropically etching exposed portions of the second layer. A patterned first layer is the formed by etching the first layer in accordance with the patterned second layer. | 04-15-2010 |
20100091425 | ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME - The present invention provides an electronic component which can reduce the size of a capacitor and the number of constitutional parts of the capacitor without using a case. The electronic component of the present invention includes a capacitor element, an outer package made of a norbornene resin covering the capacitor element, and external connection terminal portions electrically connected to the capacitor element and protruded from the outer package. | 04-15-2010 |
20100091426 | MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A method is used to manufacture a multilayer electronic component including a multilayer composite including internal electrodes having ends that are exposed at a predetermined surface of the multilayer composite. In the method, the exposed ends of the internal electrodes are coated with a metal film primarily composed of at least one metal selected from the group consisting of Pd, Au, Pt and Ag and having a thickness of at least about 0.1 μm by immersing the multilayer composite in a liquid containing a metal ion or a metal complex. Then, a continuous plating layer is formed by depositing a plating metal on the ends of the internal electrodes exposed at the predetermined surface of the multilayer composite, and subsequently growing the deposits of the plating metal so as to be connected to each other. Thus, exposed ends of the internal electrodes are electrically connected to each other. | 04-15-2010 |
20100097739 | Capacitor Comprising Flex Crack Mitigation Voids - A ceramic multilayer surface-mount capacitor with inherent crack mitigation void patterning to channel flex cracks into a safe zone, thereby negating any electrical failures. | 04-22-2010 |
20100103586 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a rectangular dielectric body having ceramic layers and multiple first internal electrodes and second internal electrodes alternatively arranged in between each two adjacent ceramic layers and respectively terminating in a respective contact in such a manner that the contacts of the first internal electrodes and the contacts of the second internal electrodes are respectively disposed at two diagonal corners of the dielectric body, and multiple terminal electrodes respectively bonded to the two diagonal corners of the dielectric body and respectively electrically connected with the contacts of the first internal electrodes and the contacts of the second internal electrodes. By means of arranging the terminal electrodes on the two diagonal corners to extend the electrode pitch, the multilayer ceramic capacitor prevents an electric arc effect or electrical fire caused by a surge voltage, eliminating the risk of a short circuit or other accidental events. | 04-29-2010 |
20100134950 | CAPACITOR - A capacitor includes a substrate, a plurality of first storage electrodes, a plurality of second storage electrodes, a first supporting layer pattern, a dielectric layer and a plate electrode. A plurality of contact pads is formed I the substrate. The first storage electrodes are arranged along lines parallel with a first direction and electrically connected to the contact pads, respectively. The second storage electrodes are respectively stacked on the first storage electrodes. The first supporting layer pattern extends in a direction parallel with the first direction between adjacent second storage electrodes and makes contact with the adjacent second storage electrodes to support the second storage electrodes. The dielectric layer is formed on the first and second storage electrodes. The plate electrode is formed on the dielectric layer. | 06-03-2010 |
20100157505 | Multilayer Electrical Component - A multilayer electrical component is presented having at least one base body, which includes a stack of dielectric layers and electrode layers arranged one upon the other, wherein the multilayer component additionally has a resistor and a decoupling layer, wherein the decoupling layer chemically isolates the resistor from at least one portion of a multilayer element. | 06-24-2010 |
20100177457 | Interdigital capacitor with Self-Canceling Inductance - An interdigital capacitor is provided with self-canceling inductance. The capacitor is made of a first metal layer including a first set of fingers connected to a first terminal, and a second set of fingers interdigitated between the first set. A second metal layer including a third set of fingers is connected to a second terminal, and a fourth set of fingers interdigitated between the third set. Each finger in the first set is connected to an overlying finger in the fourth set with at least one via. Each finger in the second set is connected to an overlying finger in the third set with at least one via. The second terminal overlies the first terminal. | 07-15-2010 |
20100208410 | NICKEL POWDER OR ALLOY POWDER HAVING NICKEL AS MAIN COMPONENT, METHOD FOR MANUFACTURING THE POWDER, CONDUCTIVE PASTE AND LAMINATED CERAMIC CAPACITOR - Provided is a multi-layered ceramic capacitor including an internal electrode, the surface of which is smoothened and in which electrode breakage can be reliably prevented. Also provided are a conductive paste and a nickel powder or an alloy powder containing nickel as a main component, which are used in the multi-layered ceramic capacitor, and a method for manufacturing the powder. The nickel powder or the alloy powder containing nickel as a main component of the present invention has a spherical shape, a mean particle diameter D | 08-19-2010 |
20100232084 | ELECTRIC ELEMENT AND ELECTRIC CIRCUIT - Each of the plurality of conductive plates is formed on a principal surface of each of stacked dielectric layers. Side anode electrodes are connected to positive electrodes of conductive plates, while side cathode electrodes are connected to cathodes of conductive plates. Anode electrodes are connected to the side anode electrodes. Cathode electrodes are connected to the side cathode electrodes. By passing DC currents through the positive conductive plates and cathode conductive plates so as to flow in the opposite directions, effective inductance of the positive conductive plates becomes smaller than its self-inductance. Consequently, the inductance is reduced, thereby lowering impedance. | 09-16-2010 |
20100238603 | Capacitor structure - In a capacitor structure and method of forming the same, a first electrode, a second electrode, and a first insulation layer are sequentially formed on a substrate. The first and second electrodes and the first insulation layer are covered with a second insulation layer on the substrate. A first plug is in contact with the second electrode through the second insulation layer. A second plug is in contact with the first electrode through the first and second insulation layer. A third insulation layer is formed on the second insulation layer. Third and fourth comb-shaped electrodes are formed in the third insulation layer. The third electrode is contact with the first plug and the fourth electrode is contact with the second plug while facing the third electrode. Thus, the teeth of the comb-shaped electrodes are alternately arranged and spaced apart in the third insulation layer. | 09-23-2010 |
20100271750 | CAPACITOR STRUCTURE - A capacitor structure is provided. The capacitor structure comprises a plurality of parallel conductive line levels and a plurality of vias. Each conductive line level comprises first conductive lines parallel to each other and second conductive lines parallel to each other. Also, the first conductive lines on different conductive line levels are aligned to each other and the second conductive lines on different conductive line levels are aligned to each other so as to form first conductive line co-planes and second conductive line co-planes. The vias are located on the conductive line co-planes and between the conductive line levels for connecting the conductive lines on the neighboring conductive line levels. The vias, on a height level of each of the conductive line co-planes, are arranged only on one of the neighboring conductive line co-planes. | 10-28-2010 |
20100271751 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - In a multilayer ceramic electronic component, in an exposed area defined by exposed portions of a plurality of internal conductors, an area ratio of exposed portions in an end section of the exposed area is smaller than that of exposed portions in a center section of the exposed area. | 10-28-2010 |
20100321858 | MULTILAYER CAPACITORS AND METHODS FOR MAKING THE SAME - A capacitor device may include a first electrode, a second electrode, a third electrode, a first dielectric layer, and a second dielectric layer. The first electrode may be coupled with a first terminal of the capacitor device. The second electrode is under the first electrode and may be coupled with a second terminal of the capacitor device. The second electrode may be electrically isolated from the first electrode. The third electrode is under the first electrode and the second electrode and may be electrically isolated from the second electrode and electrically coupled with the first electrode. The first dielectric layer has a first dielectric constant and may be sandwiched between the first electrode and the second electrode. The second dielectric layer may have a second dielectric constant and may be sandwiched between the second electrode and the third electrode. In one embodiment, the second dielectric constant is at least five times larger than the first dielectric constant. | 12-23-2010 |
20100328841 | WATER PURIFICATION DEVICE - Improved flow through capacitors (FTC) and methods for purifying aqueous solutions are disclosed. For example, FTC electrodes that are activated with a poly-electrolyte are disclosed. | 12-30-2010 |
20100328842 | MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - In a method for manufacturing a multilayer electronic component, after a plating layer for forming an external electrode is formed on an end surface of a laminate, conditions for heat-treating the laminate are set such that interdiffusion layers have ends which face internal electrodes and which are spaced from the end surface of the laminate at a distance of about 0.5 μm to about 1.9 μm. | 12-30-2010 |
20110019333 | DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR - A dielectric ceramic which is capable of achieving a laminated ceramic capacitor with high reliability, in particular, favorable lifetime characteristics in a load test, even when a dielectric ceramic layer is reduced in thickness, contains one of Ba(Ti, Mn)O | 01-27-2011 |
20110019334 | MULTILAYER CERAMIC CAPACITOR - Disclosed is a multilayer ceramic capacitor which is formed by alternately laminating (i) dielectric layers composed of a dielectric ceramic and (ii) internal electrode layers. The dielectric ceramic is composed of crystal grains mainly composed of barium titanate, while containing predetermined amounts of magnesium, vanadium, manganese and terbium, and at least one rare earth element selected from yttrium, dysprosium, holmium and erbium. In an x-ray diffraction chart of the dielectric ceramic, the diffraction intensity of the (200) plane indicating cubic barium titanate is higher than the diffraction intensity of the (002) plane indicating tetragonal barium titanate. The dielectric ceramic has a Curie temperature of 110-120° C. | 01-27-2011 |
20110032655 | MULTILAYER CAPACITOR ARRAY MOUNTING STRUCTURE - A multilayer capacitor array | 02-10-2011 |
20110032656 | FILM CAPACITOR AND METHOD OF PRODUCING THE SAME - A film capacitor is provided which has a smaller size and improved capacity while securing a sufficient withstand voltage. The film capacitor comprising a basic element | 02-10-2011 |
20110032657 | Energy Conditioner With Tied Through Electrodes - The application discloses energy conditioners that include A, B, and G master electrodes in which the A and B electrodes include main body electrodes with conductive paths that cross inside the energy conditioner and which has A and B tabs at one end of the main body electrodes conductively tied together and A and B tabs at another end of the main body electrodes conductively tied together, and the application also discloses novel assemblies of mounting, contacting, integrating those energy conditioners with conductive connection structures. | 02-10-2011 |
20110090615 | CAPACITOR TO BE INCORPORATED IN WIRING SUBSTRATE, METHOD FOR MANUFACTURING THE CAPACITOR, AND WIRING SUBSTRATE - A wiring substrate in which a capacitor is provided, the capacitor comprising a capacitor body including a plurality of dielectric layers and internal electrode layers provided between the different dielectric layers, wherein said capacitor body has, in at least one side face of said capacitor body, recesses extending in a thickness direction of said capacitor body from at least one of a first principal face of said capacitor body and a second principal face positioned on the side opposite to the first principal face. | 04-21-2011 |
20110090616 | INTEGRATED CIRCUIT AND METHOD INCLUDING STRUCTURING A MATERIAL - A method of making an integrated circuit including structuring a material. The method includes providing an arrangement of three-dimensional bodies. The material is arranged between the bodies and structured directed radiation. The projection pattern of the three-dimensional bodies is transferred into the material. The structured material connects at least two of the three-dimensional bodies. | 04-21-2011 |
20110110012 | BIPOLAR LAYERED TYPE ELECTRIC DOUBLE LAYER CAPACITOR - There is provided a bipolar layered type electric double layer capacitor capable of suppressing upsizing of the capacitor unit and enhancing sealability of adjacent capacitor cells. The present invention relates to a bipolar layered type electric double layer capacitor including a multi-layered type body comprising a plurality of capacitor cells | 05-12-2011 |
20110110013 | STACKED ELECTRIC DOUBLE LAYER CAPACITOR - A stacked electric double layer capacitor includes a capacitor unit, an aluminum laminate film, and a current collector terminal. The capacitor unit includes a pressure plate, and a current collector plate arranged inside the pressure plate. The aluminum laminate film wraps the capacitor unit, and includes a periphery that defines and surrounds a hole at a side surface of the capacitor unit. The current collector terminal is L-shaped, and includes a contact portion in contact with the current collector plate, and a terminal portion arranged perpendicular to the contact portion, wherein at least a part of the terminal portion is exposed through the hole of the aluminum laminate film, and connected to an external circuit, and the terminal portion is heat-welded to the aluminum laminate film. | 05-12-2011 |
20110110014 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - Changes in states giving rise to electrode breakage and ball formation are made less likely during firing step for sintering the laminated body, and the improvement in DC bias characteristics is achieved in laminated ceramic electronic components with a laminated body which has internal electrodes, even when ceramic layers and the internal electrodes are reduced in thickness. The laminated body is divided into a large grain region in which the ceramic has a relatively large grain diameter and a small grain region in which the ceramic has a relatively small grain diameter. The large grain region is located outside the small grain region, and a boundary surface between the large grain region and the small grain region is located inside the outer surface of the laminated body while surrounding a section in which the internal electrodes are present in the laminated body. In order to obtain the laminated body, a heat treatment is carried out in the firing step with a temperature profile in which the average rate of temperature increase from room temperature to the maximum temperature is 40° C./second or more. | 05-12-2011 |
20110116209 | CAPACITOR AND METHOD FOR FABRICATING THE SAME - A capacitor includes a lower electrode, a first dielectric layer formed over the lower electrode, a second dielectric layer formed over the first dielectric layer, wherein the second dielectric layer includes an amorphous high-k dielectric material, a third dielectric layer formed over the second dielectric layer, and an upper electrode formed over the third dielectric layer. The third dielectric layer can be thicker than the first dielectric layer. | 05-19-2011 |
20110116210 | CAPACITOR AND ITS MANUFACTURING METHOD - A method for manufacturing a capacitor includes the steps of: sequentially laminating, on a substrate, a lower electrode layer, a dielectric layer and an upper electrode layer; forming a patterned mask layer on the upper electrode layer; patterning at least the upper electrode layer and the ferroelectric layer using the mask layer as a mask; removing the mask layer; and conducting a plasma treatment to contact plasma with an exposed surface of the dielectric layer. | 05-19-2011 |
20110128665 | Ceramic Capacitors for High Temperature Applications - A ceramic capacitor having a ceramic dielectric layer positioned between a first electrode layer and a second electrode layer and methods of manufacturing the same are provided. The ceramic dielectric layer includes a niobium doped barium titanate, a sodium bismuth titanate, and barium zirconate. The niobium doped barium titanate is present in an amount such that the ceramic dielectric layer includes from about 5% by weight to about 50% by weight barium titanate and from about 0.1% by weight to about 2% by weight niobium. The sodium bismuth titanate is present in the ceramic dielectric layer in an amount from about 25% by weight to about 75% by weight, and the barium zirconate is present in an amount from about 5% by weight to about 30% by weight. | 06-02-2011 |
20110141653 | ENERGY CONDITIONER WITH TIED THROUGH ELECTRODES - The application discloses energy conditioners that include A, B, and G master electrodes in which the A and B electrodes include main body electrodes with conductive paths that cross inside the energy conditioner and which has A and B tabs at one end of the main body electrodes conductively tied together and A and B tabs at another end of the main body electrodes conductively tied together, and the application also discloses novel assemblies of mounting, contacting, integrating those energy conditioners with conductive connection structures. | 06-16-2011 |
20110141654 | NICKEL POWDER OR ALLOY POWDER COMPRISING NICKEL AS MAIN COMPONENT, METHOD FOR PRODUCING THE SAME, CONDUCTIVE PASTE AND LAMINATED CERAMIC CAPACITOR - There are provided a nickel powder or an alloy powder comprising nickel as a main component, in which the nickel powder or the alloy powder has an average particle size D | 06-16-2011 |
20110149465 | ELECTRIC DOUBLE LAYER CAPACITOR AND METHOD FOR MANUFACTURING THE SAME - An electric double layer capacitor | 06-23-2011 |
20110170228 | DIELECTRIC CERAMIC COMPOSITION AND MONOLITHIC CERAMIC CAPACITOR - There is provided a dielectric ceramic composition suitable for, for example, a car-mounted monolithic ceramic capacitor used in a high-temperature environment. It is represented by the composition formula: 100(Ba | 07-14-2011 |
20110188169 | Electric double layer capacitor cell, electric double layer capacitor package having the same, and methods of manufacturing the same - There are provided an electric double layer capacitor cell, an electric double layer capacitor package having the same, and methods of manufacturing the same. An electric double layer capacitor cell according to an aspect of the invention may include: a plurality of electric double layer capacitor unit cells stacked upon each other, wherein each of the plurality of electric double layer capacitor unit cells includes first and second current collectors having first and second lead terminal portions, respectively, first and second electrodes provided on the first and second current collectors, respectively, and a separator provided between the first and second electrodes, and the first and second electrode lead terminal portions each are combined into one to provide first and second bonding portions being connected to external terminals provided to apply electricity to the electric double layer capacitor unit cells. | 08-04-2011 |
20110194228 | DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR - To increase the dielectric constant of a dielectric ceramic containing ABO | 08-11-2011 |
20110235233 | ELECTRONIC DEVICE AND METHOD FOR PRODUCING ELECTRONIC DEVICE - To provide electronic device and method for producing electronic device having high mechanical strength. | 09-29-2011 |
20110267738 | MULTI-LAYER CERAMIC CAPACITOR AND PRODUCTION METHOD THEREOF - The present invention relates to a multi-layer ceramic capacitor printed simultaneously with internal electrode and external electrode by employing an inkjet printing. A method for manufacturing the multi-layer ceramic capacitor comprising first external electrode, dielectric, internal electrode and second external electrode prints simultaneously the first external electrode; the internal electrode which is connected with the first external electrode and formed at an invaginated portion of the dielectric invaginated to allow one side to be opened at one portion; and the second external electrode which is formed integrally with the internal electrode by employing an inkjet printing. According to the present invention, a method for manufacturing the multi-layer ceramic capacitor resolves contact problems by printing integrally the internal electrode and the external electrode and reduces the manufacturing process. | 11-03-2011 |
20110292564 | POWER STORAGE DEVICE AND METHOD FOR MANUFACTURING THE SAME - To provide a method for forming an electrode for a storage battery, including the step of: forming a metal layer which is over a current collector and has an edge portion; and forming a crystalline silicon layer, which is over the etched metal layer and includes a silicon whisker, as an active material layer by a low pressure chemical vapor deposition (LPCVD) method in which heating is performed with the use of a deposition gas containing silicon. | 12-01-2011 |
20110292565 | CAPACITOR STRUCTURE - A capacitor structure includes a plurality of conductive line levels located over the substrate. Each of the conductive line levels includes a first conductive line and a second conductive line. The first conductive lines in the conductive line levels form a first conductive line co-plane and the second conductive lines in the conductive line levels form a second conductive line co-plane. A first conductive end is electrically connected to the first conductive lines on the conductive line levels. A second conductive end is electrically connected to the second conductive lines on the conductive line levels. A plurality of vias are located between the neighboring conductive line levels and placed on only one of the first and second conductive line co-planes on a same level. | 12-01-2011 |
20110299220 | Electrical Multi-Layered Component and Circuit Arrangement Comprising the Same - An electrical multi-layered component includes a monolithic base member that has a plurality of ceramic layers and electrode layers disposed one on top of the other in alternating fashion. The base member includes two end surfaces opposite to one another and two side surfaces opposite to one another. The multi-layered component includes a plurality of external electrodes and a plurality of internal electrodes (designed into the electrode layers. The internal electrodes at least partially overlap and form overlap areas. Each internal electrode is associated with a respective external electrode. At least one first internal electrode extending from an end surface overlaps with at least one second internal electrode ( | 12-08-2011 |
20110310526 | CAPACITORS WITH HIGH ENERGY STORAGE DENSITY AND LOW ESR - Electrostatic capacitors with high capacitance density and high-energy storage are implemented over conventional electrolytic capacitor anode substrates using highly conformal contact layers deposited by atomic layer deposition. Capacitor films that are suitable for energy storage, electrical and electronics circuits, and for integration onto PC boards endure long lifetime and high-temperature operation range. | 12-22-2011 |
20110317327 | Multi-layered ceramic capacitor - There is provided a multi-layered ceramic capacitor with reduced internal resistance by forming internal electrode groups including internal electrodes having different lengths. The multi-layered ceramic capacitor of the present invention includes a sintered ceramic body part in which cover layers are provided on both surfaces thereof as an outermost layer and a plurality of ceramic layers are stacked therebetween, first and second external electrodes each formed on an outer surface of the sintered ceramic body part, a plurality of first and second internal electrode groups adjacent to each other in a stacking direction of the plurality of ceramic layers, having the ceramic layer therebetween, and including 2N or 2N+1 (N is an integer number larger than 1) internal electrodes electrically connected to the first and second external electrodes, wherein the 2N or 2N+1 (N is an integer number larger than 1) internal electrodes are disposed to face at least one internal electrode of other adjacent internal electrode groups. A length of each internal electrode has a pyramid shape. | 12-29-2011 |
20120002346 | Metalized film capacitor - Disclosed is a metalized film capacitor having excellent safety preservation ability and an excellent withstand voltage at high temperatures. This capacitor has a structure for which a split electrode section wherein a split electrode is formed by spliting a metalized film along the longitudinal direction by means of plural insulating slits, and a non-split electrode section for which a vapor-deposited electrode is continuous in the longitudinal direction, are arranged alternately in the film width direction of the metalized film, with each split electrode being connected to the non-split electrode section by a fuse formed between the ends of adjacent insulating slits; and has a structure for which three rows or more of split electrode sections, which are split by means of insulating slits that are aligned in the longitudinal direction of the film, are arranged in the width direction, with each split electrode that forms a split electrode section being connected to an adjacent split electrode by a fuse, and the area of a split electrode in the center of the film being smaller than the area of a split electrode arranged on the outer side. | 01-05-2012 |
20120014034 | HIGH POWER DENSITY CAPACITOR AND METHOD OF FABRICATION - A ductile preform for making a drawn capacitor includes a plurality of electrically insulating, ductile insulator plates and a plurality of electrically conductive, ductile capacitor plates. Each insulator plate is stacked vertically on a respective capacitor plate and each capacitor plate is stacked on a corresponding insulator plate in alignment with only one edge so that other edges are not in alignment and so that each insulator plate extends beyond the other edges. One or more electrically insulating, ductile spacers are disposed in horizontal alignment with each capacitor plate along the other edges and the pattern is repeated so that alternating capacitor plates are stacked on alternating opposite edges of the insulator plates. A final insulator plate is positioned at an extremity of the preform. The preform may then be drawn to fuse the components and decrease the dimensions of the preform that are perpendicular to the direction of the draw. | 01-19-2012 |
20120019978 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a plurality of first reinforcement layers. The plurality of first reinforcement layers are arranged in a first outer layer portion so as to extend in the length direction and in the width direction, and are stacked in the thickness direction. The volume proportion of the plurality of first reinforcement layers in a region of the ceramic body in which the plurality of first reinforcement layers are provided is greater than the volume proportion of the first and second internal electrodes in an effective portion. | 01-26-2012 |
20120033342 | STACKED FILM CAPACITOR AND METHOD OF PRODUCING THE SAME - A stacked film capacitor including a resin protective film having excellent durability is provided which can stably secure desired properties. The stacked film capacitor includes a capacitor element | 02-09-2012 |
20120039014 | LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - In a laminate type ceramic electronic component, when an external electrode for a laminated ceramic capacitor is formed directly by plating onto a surface of a component main body, the film that is directly plated may have a low fixing strength with respect to the component main body. As the external electrode, a first plating layer composed of a Ni—P plating film with a P content rate of about 9 weight % or more is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no P is formed on the first plating layer. Preferably, the first plating layer is formed by electroless plating, whereas the second plating layer is formed by electrolytic plating. | 02-16-2012 |
20120039015 | LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - In a laminate type ceramic electronic component, when an external electrode is formed directly by plating onto a surface of a component main body, the plating film that is to serve as the external electrode may have a low fixing strength with respect to the component main body. In order to prevent this problem, an external electrode includes a first plating layer composed of a Ni—B plating film and is first formed such that a plating deposition deposited with the exposed ends of respective internal electrodes as starting points is grown on at least an end surface of a component main body. Then, a second plating layer composed of a Ni plating film containing substantially no B is formed on the first plating layer. Preferably, the B content of the Ni—B plating film constituting the first plating layer is about 0.1 wt % to about 6 wt %. | 02-16-2012 |
20120057268 | ELECTRONIC COMPONENT - In an electronic component, a first external electrode includes a first side surface electrode provided on a first side surface and a substantially rectangular first principal surface electrode that is connected to the first side surface electrode and provided on a principal surface so as to be in contact with a first corner of the principal surface. A second external electrode includes a second side surface electrode that is connected to a capacitor conductor and provided on a second side surface and a substantially rectangular second principal surface electrode that is connected to the second side surface electrode and provided on the principal surface so as to be in contact with a second corner, which is located opposite to the first corner, the second principal surface electrode facing the first principal surface electrode in an x-axis direction, in which long sides of the principal surface extend. | 03-08-2012 |
20120069487 | STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME - [Problem to be Solved] | 03-22-2012 |
20120075766 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - In a multilayer ceramic electronic component, dummy electrodes are located in margin regions. In a region between an extension line of a side of a facing portion of an internal electrode facing a side surface of an element body and a side of an extending portion of the internal electrode facing the side surface, the dummy electrode is arranged not to extend to the extension line of the side facing the side surface. The dummy electrode includes a plurality of electrode pieces linearly extending in the direction parallel or substantially parallel to the side surface. | 03-29-2012 |
20120075767 | Method for Producing a Metal-Insulator-Metal Capacitor for Use in Semiconductor Devices - Methods of manufacturing metal-insulator-metal capacitor structures, and the metal-insulator-metal capacitor structures obtained, are disclosed. In one embodiment, a method includes providing a substrate, forming on the substrate a first metal layer comprising a first metal, and using atomic layer deposition with an H | 03-29-2012 |
20120075768 | DIELECTRIC CERAMIC COMPOSITION AND MANUFACTURING METHOD THEREOF, AND CERAMIC ELECTRONIC DEVICE - Dielectric ceramic composition comprising a compound having perovskite-type crystal structure and Y-oxide, and the compound is shown by a general formula ABO | 03-29-2012 |
20120081832 | Chip Capacitor Precursors - A capacitive precursor includes electrically conductive material layers stacked on a substrate. The electrically conductive layers provide first and second patterns. The patterns each include overlaying areas free of the electrically conductive material. The first pair of areas overlay areas of the second pattern having the electrically conductive material and the second pair of areas overlay areas of the first pattern having the electrically conductive material. Dielectric layers are interposed between neighboring electrically conductive material layers for electrical isolation. One or more capacitive precursors can be dropped onto or into a board and during assembly of a packaged semiconductor device and have electrically conducting layers associated with its respective plates connected together to form a capacitor during assembly using conventional assembly steps. | 04-05-2012 |
20120099241 | MULTILAYER CERAMIC ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME - Disclosed are a multilayer ceramic electronic component and a method of manufacturing the same. There is provided a multilayer ceramic electronic component, including: a ceramic main body in which a plurality of dielectric layers having an average thickness of 1 μm or less are stacked; and inner electrode layers formed on the dielectric layers and having connectivity of 90% or more expressed by the following Equation, wherein the ratio of the thickness of the inner electrode layer to the thickness of the dielectric layer is between 0.8:1 and 1.3:1. The Equation is as follows. | 04-26-2012 |
20120106025 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor and a method of manufacturing the same. There is provided a multilayer ceramic capacitor, including: a ceramic body having a plurality of dielectric layers stacked therein and including a first side and a second side opposite to each other and a third side and a fourth side connected to the first side and the second side; and inner electrode layers formed on the dielectric layers, including electrode drawing parts exposed to the first side or the second side and an electrode main part, and having a length between the electrode main part and the third side of 100 μm or less and a ratio of a length between the electrode drawing part and the third side to the length between the electrode main part and the third side of between 1.2:1 and 1.7:1. The multilayer ceramic capacitor may have improved reliability by suppressing cracks occurring in the ceramic laminate due to thermal impact during a sintering or mounting process. | 05-03-2012 |
20120113560 | MULTILAYER CAPACITOR HAVING LOW EQUIVALENT SERIES INDUCTANCE AND CONTROLLED EQUIVALENT SERIES RESISTANCE - In a capacitor body of a multilayer capacitor, one second capacitor portion is sandwiched between two first capacitor portions. An ESR is controlled by setting a width of lead portions of third and fourth internal electrodes disposed in the second capacitor portion to be less than that of lead portions of first and second internal electrodes disposed in the first capacitor portions and by changing ratios between the first and second capacitor portions in the width of the lead portions and in the number of stacked internal electrodes. In the first capacitor portions, current paths from the internal electrodes to an external terminal electrode are widely distributed so that the first capacitor portions have a relatively low ESL, and accordingly, the ESL of the entire multilayer capacitor is reduced. | 05-10-2012 |
20120127626 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - Disclosed are a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes a ceramic body having a plurality of dielectric layers stacked on top of each other, at least one internal electrode formed on a corresponding one of the plurality of dielectric layers and having uneven portions formed at an edge thereof, the internal electrode having a connectivity of between 0.7 and 0.9, which is defined by an equation below, and an external electrode formed on an outer surface of the ceramic body and connected with the internal electrode, | 05-24-2012 |
20120140375 | CONDUCTIVE PASTE FOR INNER ELECTRODE AND MULTILAYER CERAMIC ELECTRONIC COMPONENT HAVING THE SAME - Disclosed are a conductive paste for an inner electrode and a multilayer ceramic electronic component having the same. There is provided a conductive paste for an inner electrode, including: a conductive metal powder for manufacturing the inner electrode for multilayer ceramic electronic component; an organic binder including at least one selected from a group consisting of acryl-based resin, butyral-based resin, and a cellulose-based resin to disperse the conductive metal powder; and a solvent including eucalyptol. | 06-07-2012 |
20120140376 | Manufacturing Method For Laminated Ceramic Capacitor, and Laminated Ceramic Capacitor - A method of manufacturing a laminated body in a raw state for a laminated ceramic capacitor, which includes dielectric ceramic layers containing a dielectric ceramic raw material powder for and internal electrodes, in which a heat treatment is carried out in accordance with a temperature profile in which the average rate of temperature rise is 40° C./second or more from room temperature to a maximum temperature. The dielectric ceramic raw material powder contains a BaTiO | 06-07-2012 |
20120147514 | CERAMIC PASTE COMPOSITION FOR MULTILAYER CERAMIC CAPACITOR, MULTILAYER CERAMIC CAPACITOR COMPRISING THE SAME, AND METHODS OF MANUFACTURING THE SAME - There are provided a ceramic paste composition for a multilayer ceramic capacitor (MLCC), a multilayer ceramic capacitor comprising the same, and methods of manufacturing the same. The ceramic paste composition for the MLCC includes: a ceramic powder, a first phosphate ester-based dispersant and a second dispersant salt-bonded by a fatty acid and an alkyl amine; a binder including polyvinyl butyral and ethyl cellulose; and a solvent. The ceramic paste composition ceramic powder has a small average particle-diameter and the ceramic powder in the paste has excellent dispersibility. | 06-14-2012 |
20120147515 | MULTILAYER CERAMIC CONDENSER AND METHOD OF MANUFACTURING THE SAME - Disclosed are a multilayer ceramic condenser and a method of manufacturing the same. The method includes printing a plurality of stripe-type inner electrode patterns in parallel on ceramic green sheets; forming a laminate by staking the ceramic green sheets having the plurality of stripe-type inner electrode patterns printed thereon; cutting the laminate in order to have a structure in which first and second inner electrode patterns are alternately stacked; and forming a first side part and a second side part by applying ceramic slurry in order to cover the sides of the laminate to which the first and second inner electrode patterns are exposed. | 06-14-2012 |
20120147516 | MULTILAYER CERAMIC CONDENSER AND METHOD FOR MANUFACTURING THE SAME - Disclosed are a multilayer ceramic condenser and a method for manufacturing the same. There is provided a multilayer ceramic condenser including: a multilayer main body in which a plurality of dielectric layers including a first side, a second side, a third side, and a fourth side are stacked; a first cover layer and a second cover layer forming the plurality of dielectric layers; a first dielectric layer disposed between the first cover layer and the second cover layer and printed with a first inner electrode pattern drawn to the first side; a second dielectric layer alternately stacked with the first dielectric layer and printed with a second inner electrode pattern drawn to the third side; and a first side portion and a second side portion each formed on the second side and the fourth side opposite to each other. | 06-14-2012 |
20120147517 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There are provided a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor according to the embodiment of the present invention includes a capacitor body in which inner electrodes including a first electrode material and dielectric layers are alternately stacked; a diffusion barrier layer formed on an outer surface of the capacitor body to be electrically connected to the inner electrodes, including the first electrode material, and having a thickness of 1 μm to 10 μm; and a first outer electrode layer formed to cover the diffusion barrier layer and including a second electrode material having a lower reactivity to oxygen than the first electrode material. | 06-14-2012 |
20120147518 | Manufacturing Method for Laminated Ceramic Capacitor, and Laminated Ceramic Capacitor - A method for manufacturing a laminated ceramic capacitor by firing a laminated body which includes dielectric ceramic layers containing a dielectric ceramic raw material powder and internal electrodes. The firing is carried out in accordance with a temperature profile in which the average rate of temperature rise is 40° C./second or more from room temperature to a maximum temperature. The dielectric ceramic raw material powder contains a BaTiO | 06-14-2012 |
20120154975 | Thin film capacitors - A system that incorporates teachings of the present disclosure may include, for example, a first solid electrode, a second electrode separated into subsections, and a dielectric medium separating the subsections from the first solid electrode, where the subsections of the second electrode include a first group of subsections and a second group of subsections, where the first group of subsections are connectable with a first terminal for receiving an input signal, and where the second group of subsections is connectable with a second terminal for providing an output signal. Other embodiments are disclosed. | 06-21-2012 |
20120154976 | CONDUCTIVE PASTE COMPOSITION FOR INNER ELECTRODE, LAMINATED CERAMIC ELECTRONIC PART USING THE SAME AND MANUFACTURING METHOD THEREOF - There are provided a conductive paste composition for an inner electrode, and a laminated ceramic electronic part and a manufacturing method thereof using the conductive paste composition. The conductive paste composition includes metal powder coated with an organosilica compound formed by polymerization of an organosilane compound having a structure of R | 06-21-2012 |
20120162852 | DECOUPLING DEVICE - A decoupling device including a lead frame and at least one capacitor unit assembly is provided. The lead frame includes a cathode terminal portion and at least two opposite anode terminal portions located at two ends of the cathode terminal portion. The two anode terminal portions are electrically connected with each other through a conductive line. The capacitor unit assembly includes multiple capacitor elements. The multiple capacitor elements of the capacitor unit assembly is connected in parallel, arrayed on the same plane and disposed on the lead frame. Each capacitor element has a cathode portion and an anode portion opposite to each other. The cathode portion of the capacitor element is electrically connected with the cathode terminal portion. The anode portion of the capacitor element is electrically connected with the anode terminal portion. When multiple capacitor unit assemblies exists, the capacitor unit assemblies are arrayed in a stacked way. | 06-28-2012 |
20120162853 | MULTILAYER CAPACITOR - A multilayer capacitor which can control ESR in a wide frequency band is provided. In a multilayer capacitor | 06-28-2012 |
20120162854 | MULTILAYER CERAMIC CAPACITOR - The present invention relates to a multilayer ceramic capacitor which is superior in stability of temperature characteristic of specific permittivity and has a high specific permittivity and a high reliability. Said multilayer ceramic capacitor is characterized in that the dielectric layers include BTZ based dielectric ceramic composition, in which Ti is substituted by 1 to 8 mol % of Zr with respect to Ti, as a main component, dielectric particles constituting the BTZ based dielectric ceramic composition substantially do not have shell structures, and Curie temperature of the BTZ based dielectric ceramic composition is higher than a temperature range of the multilayer ceramic capacitor used. | 06-28-2012 |
20120170169 | DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR - A dielectric ceramic which is suitable for use in a laminated ceramic capacitor under a high-temperature environment, such as encountered in, for example, automobile use has a composition represented by the composition formula: (1−x) (Ba | 07-05-2012 |
20120188681 | MULTILAYER CAPACITOR - A multilayer capacitor comprises a capacitor element body, a first terminal electrode connected to a first inner electrode, a second terminal electrode connected to a second inner electrode, a third terminal electrode connected to a third inner electrode, and a fourth terminal electrode connected to a fourth inner electrode. The capacitor element body includes therewithin a first capacitor unit having first and second inner electrodes stacked adjacent to each other through a dielectric layer and a second capacitor unit having third and fourth inner electrodes stacked adjacent to each other through a dielectric layer. The first and second terminal electrodes have high resistance layers exhibiting electrical resistances higher than those of the third and fourth terminal electrodes. | 07-26-2012 |
20120194963 | ELECTRONIC COMPONENT AND SUBSTRATE MODULE - A multilayered body includes capacitor conductors and an internal conductor, which together define a capacitor. A first external electrode is connected to one of the capacitor conductors via a set of lead electrodes. A second external electrode is connected to the other capacitor conductor via another set of lead electrodes. The internal conductor faces the capacitor conductors. | 08-02-2012 |
20120194964 | ELECTRONIC COMPONENT FABRICATION METHOD USING REMOVABLE SPACERS - An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes. | 08-02-2012 |
20120200983 | Multilayer Capacitor - A first inner electrode is integrally provided with a first terminal connection part connected to a first terminal electrode and a first linking connection part connected to a first linking electrode. A second inner electrode is integrally provided with a second terminal connection part connected to a second terminal electrode and a second linking connection part connected to a second linking electrode. A third inner electrode is integrally provided with a third linking connection part connected to the first linking electrode. A fourth inner electrode is integrally provided with a fourth linking connection part connected to the second linking electrode. The third inner electrode is adjacent to the first and fourth inner electrodes in a laminating direction of the plurality of dielectric layers. The first and fourth inner electrodes overlap the third inner electrode as seen in the laminating direction of the plurality of dielectric layers. | 08-09-2012 |
20120212877 | CAPACITOR STRUCTURE - The disclosure relates generally to capacitor structures and more particularly, to capacitor structures having interdigitated metal fingers. Metal finger capacitors may have at least one layer, the at least one layer including: a first set of fingers, wherein each finger of the first set includes an end integrally connected to a bus segment of a first bus; a second set of fingers interdigitated with the first set of fingers, wherein each finger of the second set includes an end integrally connected to a bus segment of a second bus; an in port integrally connected to the first bus and an out port integrally connected to the second bus; and wherein a width of the first and second bus is non-uniform across a length of the first and second bus. | 08-23-2012 |
20120218677 | ELECTRODE SINTERED BODY, MULTILAYER ELECTRONIC DEVICE, INTERNAL ELECTRODE PASTE, A MANUFACTURING METHOD OF ELECTRODE SINTERED BODY AND A MANUFACTURING METHOD OF MULTILAYER ELECTRONIC DEVICE - An object of the present invention is to provide an electrode sintered body wherein shrinkage is prohibited and conductivity is good. An electrode sintered body including intermetallic compound comprising nickel and aluminum is provided. And then an internal electrode paste, which can inhibit shrinkage of an internal electrode layer, is manufactured by raising sintering temperature of conducting particle materials constituting internal electrode sheet to be internal electrode layers after firing. Further, a high-function multilayer electronic device using electrode paste for internal electrodes is manufactured. | 08-30-2012 |
20120224296 | Z-DIRECTED CAPACITOR COMPONENTS FOR PRINTED CIRCUIT BOARDS - A Z-directed capacitor component for insertion into a printed circuit board while allowing electrical connection to internal conductive planes contained within the PCB. In one embodiment the Z-directed capacitor component utilizes semi-cylindrical metallic sheets. In another embodiment, stack annular metallic disks are used. The Z-directed capacitor component mounts within the thickness of the PCB allowing other components to be mounted over it. The body may contain one or more conductors and may include one or more surface channels or wells extending along at least a portion of the length of the body. Methods for mounting Z-directed components are also provided. | 09-06-2012 |
20120236460 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - Disclosed are a multilayer ceramic capacitor and a method of manufacturing the same. According to an exemplary embodiment of the present invention, there is provided a method of manufacturing a multilayer ceramic capacitor, including: preparing a plurality of dielectric layers including a first ceramic powder and a first binder; applying an electrode paste including a conductive powder and a second binder to the plurality of dielectric layers to form a plurality of first inner electrode patterns and second inner electrode patterns exposed to different surfaces of the plurality of dielectric layers; forming a multilayer body by stacking the plurality of dielectric layers; and applying ceramic slurry including a second ceramic powder and a solvent without compatibility with the first binder or the second binder to at least one surface of the multilayer body to form a margin part. | 09-20-2012 |
20120250216 | SEMICONDUCTOR CERAMIC AND A MULTILAYER SEMICONDUCTOR CERAMIC CAPACITOR - A purpose of the present invention is to provide a multilayer semiconductor ceramic capacitor, which makes coexistence of a high dielectric property and a high insulating resistance of a semiconductor ceramic possible by improving insulating property of the semiconductor ceramic component. In order to achieve such object, BaTiO | 10-04-2012 |
20120250217 | MONOLITHIC CERAMIC CAPACITOR - A monolithic ceramic capacitor includes a ceramic sintered body including a plurality of stacked ceramic layers, and first and second inner electrodes alternately arranged inside the ceramic sintered body to oppose each other in a stacking direction of the ceramic layers with the ceramic layers interposed between the adjacent first and second inner electrodes. Among the ceramic layers, a number N of the ceramic layers disposed between the first inner electrodes and the second inner electrodes is at least 232. A proportion of volume occupied by the first and second inner electrodes in the ceramic sintered body is at least about 0.37. A size of each of side gap portions is about 40 μm or less. | 10-04-2012 |
20120257322 | MONOLITHIC CERAMIC CAPACITOR - A monolithic ceramic capacitor having a large capacity and high reliability includes a ceramic sintered body including a plurality of stacked ceramic layers, and first and second inner electrodes and alternately disposed inside the ceramic sintered body to be opposed to each other in a stacking direction of the ceramic layers with one of the ceramic layers being interposed between the adjacent first and second inner electrodes. The ceramic sintered body includes a first portion in which the first and second inner electrodes are opposed to each other, and a second portion positioned outside the first portion. A ratio (Ic/Ia) of c-axis peak intensity (Ic) to a-axis peak intensity (Ia) measured with an XRD analysis of the one of the ceramic layers is about 2 or more. | 10-11-2012 |
20120257323 | CIRCUIT MODULE - A circuit module includes a multilayer substrate including built-in capacitors and external components mounted on the surface of the multilayer substrate. On the surface of a dielectric layer, an auxiliary electrode is provided. The auxiliary electrode is electrically connected to a capacitor electrode via a via electrode passing through the dielectric layer. On the surface of a dielectric layer, a capacitor electrode is arranged so as to face the capacitor electrode and the auxiliary electrode connected to the capacitor electrode. The auxiliary electrode is arranged in an area in which the capacitor electrodes overlap each other as viewed from a lamination direction. | 10-11-2012 |
20120257324 | MULTILAYER CAPACITORS, METHOD FOR MAKING MULTILAYER CAPACITORS - The invention provides a stacked capacitor configuration comprising subunits each with a thickness of as low as 20 microns. Also provided is combination capacitor and printed wire board wherein the capacitor is encapsulated by the wire board. The invented capacitors are applicable in micro-electronic applications and high power applications, whether it is AC to DC or DC to AC, or DC to DC. | 10-11-2012 |
20120262836 | CERAMIC CAPACITOR AND METHODS OF MANUFACTURE - A capacitor includes a pair of electrodes and a metalized dielectric layer disposed between the pair of electrodes, in which the metalized dielectric layer has a plurality of metal aggregates distributed within a dielectric material. The distribution is such that a volume fraction of metal in the metalized dielectric layer is at least about 30%. Meanwhile, the plurality of metal aggregates are separated from one another by the dielectric material. A method for forming a metal-dielectric composite may include coating a plurality of dielectric particles with a metal to form a plurality of metal-coated dielectric particles and sintering the plurality of metal-coated dielectric particles at a temperature of at least about 750° C. to about 950° C. to transform the metal coatings into discrete, separated metal aggregates. Contrary to conventional techniques of separating electrodes by a dielectric tape, this inventive system and method demonstrates that a metalized dielectric layer may be formed in-situ during sintering. | 10-18-2012 |
20120262837 | LAMINATED CAPACITOR - In a laminated capacitor, one additional first internal electrode layer, which has its edge connected to the first external electrode as do the first internal electrode layers, is provided to one of the five first internal electrode layers so as to face one another via the second dielectric layer having a thickness smaller than the thickness of the first dielectric layer and not contributing to the formation of capacity, and one additional second internal electrode layer, which has its edge connected to the second external electrode as do the second internal electrode layers, is provided to one of the five second internal electrode layers so as to face one another via the third dielectric layer having a thickness smaller than the thickness of the first dielectric layer and not contributing to the formation of capacity. | 10-18-2012 |
20120268859 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor including: a ceramic body including dielectric layers and internal electrodes stacked between the dielectric layers; and a pair of external electrodes each fixed to first and second surfaces of the ceramic body, facing each other, and connected to the internal electrodes, wherein the ceramic body has a third surface facing a printed circuit board and each of the pair of external electrodes includes mounting parts extended onto the third surface and having a preset length by which they are mounted on the printed circuit board and wherein connection parts between the pair of external electrodes and the mounting parts have a convexly curved shape having a size equal to or smaller than a preset corner radius. | 10-25-2012 |
20120268860 | MULTILAYER CERAMIC CAPACITOR CAPABLE OF CONTROLLING EQUIVALENT SERIES RESISTANCE - There is provided a multilayer ceramic capacitor capable of controlling equivalent series resistance (ESR) characteristics. The multilayer ceramic capacitor includes: a ceramic laminate including dielectric layers and a plurality of internal electrodes having different polarities and alternately stacked between the dielectric layers; and external electrodes formed on both sides of the ceramic laminate, wherein each of the internal electrodes includes a main electrode and a lead for connecting the main electrode to the external electrode, and an equivalent series resistance (ESR) value is determined by adjusting a ratio of a width to a length of the lead, whereby the ESR characteristics of the multilayer ceramic capacitor may be controlled. | 10-25-2012 |
20120275080 | TAPERED VIA AND MIM CAPACITOR - A chip capacitor and interconnecting wiring is described incorporating a metal insulator metal (MIM) capacitor, tapered vias and vias coupled to one or both of the top and bottom electrodes of the capacitor in an integrated circuit. A design structure tangibly embodied in a machine readable medium is described incorporating computer readable code defining a MIM capacitor, tapered vias, vias and wiring levels in an integrated circuit. | 11-01-2012 |
20120275081 | MULTI-LAYERED CAPACITOR AND MANUFACTURING METHOD THEREOF - A multi-layered capacitor includes a capacitor element in which a plurality of dielectric layers are multi-layered, and which comprises a first inner electrode and a second inner electrode that are alternately formed on neighboring dielectric layers of the plurality of dielectric layers, a first external electrode and a second external electrode which are formed on an outside surface of the capacitor element to be electrically connected to the first inner electrode and the second inner electrode, respectively, and a deformation suppressing electrode which is formed on the outside surface of the capacitor element and separated from the first external electrode and the second external electrode to be electrically isolated from the first inner electrode and the second inner electrode. | 11-01-2012 |
20120287553 | METHOD FOR FABRICATING A DRAM CAPACITOR HAVING INCREASED THERMAL AND CHEMICAL STABILITY - A method for fabricating a dynamic random access memory (DRAM) capacitor includes forming a first electrode film. The first electrode film comprises a conductive binary metal compound and a dopant. The dopant may have a uniform or non-uniform concentration within the first electrode film. A high-k dielectric film is formed over the first electrode film. A second electrode film is formed over the dielectric film. The second electrode film comprises a conductive binary metal compound and a dopant. The dopant may have a uniform or non-uniform concentration within the second electrode film. The dopants and their distribution are chosen so that the crystal structure of the surface of the electrode is not degraded if the electrode is to be used as a templating structure for subsequent layer formation. Additionally, the dopants and their distribution are chosen so that the work function of the electrodes is not degraded. | 11-15-2012 |
20120293908 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND MOUNTING STRUCTURE THEREOF - A monolithic ceramic electronic component includes a first internal electrode including a first region extending to a first end surface and having a relatively large dimension in a width direction and a second region located at the side closer to a front end than is the first region and having a relatively small dimension in a width direction, wherein d | 11-22-2012 |
20120293909 | HIGH DIELECTRIC FILM - The present invention provides a high dielectric film comprising: a film-forming resin (A); and inorganic particles (B), wherein the film-forming resin (A) contains a vinylidene fluoride resin (a1), an amount of the inorganic particles (B) is not less than 0.01 parts by mass and less than 10 parts by mass for each 100 parts by mass of the film-forming resin (A), and the inorganic oxide particles (B) is at least one selected from the group consisting of: (B1) inorganic oxide particles of a metallic element of Group 2, 3, 4, 12, or 13 of the Periodic Table, or inorganic oxide composite particles of these; (B2) inorganic composite oxide particles represented by formula (1): | 11-22-2012 |
20120300360 | CAPACITOR ELEMENT AND CAPACITOR DEVICE HAVING THE SAME - A capacitor forming unit according to one embodiment includes a dielectric plate with a plurality of through holes; a first conductor film formed on an upper surface of the dielectric plate; a first insulator film formed on the front end portion of the upper surface of the dielectric plate; a second conductor film formed on a lower surface of the dielectric plate; a second insulator film formed on the rear end portion of the lower surface of the dielectric plate; first electrode rods disposed in some of the through holes; and second electrode rods disposed in the remaining through holes where the first electrode rods are not disposed. The first electrodes are electrically connected to the first conductor film and electrically insulated from the second conductor film. The second electrode rods are electrically connected to the second conductor film and are electrically insulated from the first conductor film. | 11-29-2012 |
20120300361 | MULTILAYER CAPACITOR AND METHOD FOR MANUFACTURING THE SAME - In a multilayer capacitor, a first dielectric layered product including a first body principal face is formed to be thicker than a second dielectric layered product including a second body principal face in a stacking direction thereof. A first external electrode and a second external electrode extend only to the first body principal face from a first body end face and a second body end face. Alternatively, the first external electrode and the second external electrode extend at least to the first body principal face from the first body end face and the second body end face and extend also to at least one of the second body principal face, a first body lateral face, and a second body lateral face. | 11-29-2012 |
20120307414 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor, including: a multilayer body having a plurality of dielectric layers and a plurality of internal electrode layers alternately laminated; wherein each internal electrode layer has a width gradually decreases from a center thereof towards both ends thereof in a length direction; and when a width of each internal electrode layer at the ends thereof in the length direction is defined as a minimum width L | 12-06-2012 |
20120307415 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a multilayer ceramic electronic component and a method for manufacturing the same. The multilayer ceramic electronic component includes a multilayer body in which dielectric layers and internal electrode layers are alternately stacked and external electrodes, wherein a portion in the internal electrode layers positioned in a marginal portion in which vertically neighboring internal electrode layers in the multilayer body is not overlapped with each other has a thickness thicker than that of a portion of the internal electrode layer positioned in an overlapped portion in which the vertically neighboring internal electrode layers are overlapped with each other, such that an accumulated stepped height difference in the marginal portion is reduced. | 12-06-2012 |
20120320493 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - There are provided a multilayer ceramic electronic component and a manufacturing method thereof. The multilayer ceramic electronic component includes: a body part including internal electrodes and dielectric layers and having at least one connection surface to which a portion of the internal electrodes are exposed; external electrodes coupled to the connection surface to thereby be electrically connected to the internal electrodes; and protective layers provided on the connection surface so as to shield at least portions of the internal electrodes exposed at the connection surface, wherein a width of an exposed part of the internal electrode shielded by the protective layer has 0.8 to 0.9 of that of an overall width of the internal electrode. | 12-20-2012 |
20120327551 | ENERGY STORAGE DEVICE AND MANUFACTURING METHOD THEREOF, AND UNIT CELL FOR ENERGY STORAGE DEVICE - An energy storage device includes a plurality of unit cells stacked therein, each of the unit cells including a cell body, a positive terminal disposed at one side of the cell body, and a negative terminal disposed in the cell body to form a constant rotation angle with the positive terminal with reference to a center of the cell body, wherein the plurality of cell units are stacked in such a manner that another unit cell is rotated as much as the constant rotation angle with reference to one unit cell. Temperature distribution, that is, heat distribution in the energy storage device can be kept even, and heat transmission efficiency between the terminals and the external air can be improved and thus cooling efficiency can be improved. Also, a resistance value is reduced by improving a cooling function so that performance and reliability of a product can be improved. | 12-27-2012 |
20130027839 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; and first and second inner electrode layers formed within the ceramic body, wherein, when a thickness of the dielectric layer is defined as td and a maximum thickness and a minimum thickness of the first or second inner electrode layer are defined as tmax and tmin, respectively, td≦0.6 μm and (tmax−tmin)/td<0.30 are satisfied. According to the present invention, a large-capacity multilayer ceramic electronic component capable of improving withstand voltage characteristics and having excellent reliability can be realized by improving uniformity in the thickness of the inner electrode layers. | 01-31-2013 |
20130038979 | MULTILAYER CAPACITOR - A multilayer capacitor that can suppress electrostrictive vibration without material constraint and with applicability to various structures, including general-purpose structures. A multilayer capacitor has: an element body formed of dielectric ceramic; and a plurality of internal electrodes disposed inside the element body such that the internal electrodes are stacked with ceramic layers sandwiched therebetween. The multilayer capacitor is provided with a capacitor area which includes the plurality of internal electrodes and a first suppression area and a second suppression area for reducing electrostriction caused by the plurality of internal electrodes so as to suppress noise. The first suppression area is adjacent to the capacitor area and the thickness of the second suppression area is determined according to the arrangement of the plurality of internal electrodes. | 02-14-2013 |
20130038980 | INNER ELECTRODE, AND MULTILAYERED CERAMIC CAPACITOR COMPRISING THE INNER ELECTRODE - Disclosed herein are inner electrodes of a multilayered ceramic capacitor including metal powders including graphene layers formed on a surface thereof and a multilayered ceramic capacitor including the inner electrodes. An exemplary embodiment of the present invention can include metal powders including graphene layers formed on a surface thereof as inner electrode materials of a multilayered ceramic capacitor to more effectively prevent necking of the metal powders than the related art including only dielectric ceramic powders, thereby increasing necking temperature and necking and control inner electrode shrinkage, thereby reducing a thickness of the inner electrode and defects such as short/cracks, and the like, of the inner electrode. Therefore, it is possible to provide the multilayered ceramic capacitor with excellent reliability by minimizing a difference in shrinkage between the dielectric layer and the inner electrodes. | 02-14-2013 |
20130038981 | CAPACITOR AND METHOD OF MANUFACTURING CAPACITOR - A method of manufacturing a capacitor includes forming, above a first metal foil, a first dielectric film of a ceramic material containing barium oxide by blowing dry ceramic particles to the first metal foil from a nozzle, forming, in the first dielectric film, a first via conductor connected to the first metal foil and a second via conductor connected to the first metal foil, forming, above the first dielectric film, a first electrode pattern connected to the first via conductor, and patterning the first metal foil to form a second electrode pattern connected to the second via conductor. | 02-14-2013 |
20130044404 | Titanium-Based High-K Dielectric Films - This disclosure provides (a) methods of making an oxide layer (e.g., a dielectric layer) based on titanium oxide, to suppress the formation of anatase-phase titanium oxide and (b) related devices and structures. A metal-insulator-metal (“MIM”) stack is formed using an ozone pretreatment process of a bottom electrode (or other substrate) followed by an ALD process to form a TiO | 02-21-2013 |
20130058002 | PACKAGE TYPE MULTI LAYER THIN FILM CAPACITOR FOR HIGH CAPACITANCE - Provided is a package type multilayer thin film capacitor for a high capacitance, including: a capacitance block | 03-07-2013 |
20130063858 | NANOSTRUCTURED DIELECTRIC MATERIALS FOR HIGH ENERGY DENSITY MULTILAYER CERAMIC CAPACITORS - A multilayer ceramic capacitor, having a plurality of electrode layers and a plurality of substantially titanium dioxide dielectric layers, wherein each respective titanium dioxide dielectric layer is substantially free of porosity, wherein each respective substantially titanium dioxide dielectric layer is positioned between two respective electrode layers, wherein each respective substantially titanium dioxide dielectric layer has an average grain size of between about 200 and about 400 nanometers, wherein each respective substantially titanium dioxide dielectric layer has maximum particle size of less than about 500 nanometers. Typically, each respective substantially titanium dioxide dielectric layer further includes at least one dopant selected from the group including P, V, Nb, Ta, Mo, W, and combinations thereof, and the included dopant is typically present in amounts of less than about 0.01 atomic percent. | 03-14-2013 |
20130063859 | LOW INDUCTANCE INTEGRAL CAPACITOR ASSEMBLY - The invention provides an integral high-voltage capacitor assembly that yields very low self inductance and provides voltage and current multiplication. The capacitor assembly has two or four capacitors connected in series, with each capacitor made up of a stack of capacitor cells ( | 03-14-2013 |
20130070385 | STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A stacked structure includes: first and second electrode parts, and a dielectric layer. The first electrode part has a first strip portion and a plurality of first plate portions extending from a side edge of the first strip portion. The second electrode part has a second strip portion and a plurality of second plate portions extending from a side edge of the second strip portion. The first and second electrode parts are arranged such that the first and second plate portions are stacked. The first plate portions face the second plate portions and the second strip portion. The second plate portions face the first plate portions and the first strip portion. The dielectric layer is placed between the first plate portions and adjacent ones of the second plate portions, between the first plate portions and the second strip portion, and between the second plate portions and the first strip portion. | 03-21-2013 |
20130070386 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including a lamination main body including a plurality of inner electrodes. When T | 03-21-2013 |
20130094118 | MULTILAYERED CERAMIC ELECTRONIC COMPONENT - There is provided multilayered ceramic electronic component having a 0603 size or less, the multilayered ceramic electronic component including: a ceramic body including a plurality of internal electrodes and dielectric layers disposed between the internal electrodes; and external electrodes disposed on outer surfaces of the ceramic body and electrically connected to the internal electrodes, wherein when a region in which the internal electrodes are overlapped is defined as an active region in a cross section of a central portion in a length direction of the ceramic body, taken in width and thickness directions thereof, the entire area of the cross section taken in the width and thickness directions is defined as At, and an area of the active region is defined as Aa, the following equation is satisfied: 65%≦Aa/At≦90%. | 04-18-2013 |
20130094119 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor, including: a multilayer body in which a plurality of dielectric layers are stacked in a thickness direction; and inner electrode layers formed within the multilayer body and including first and second inner electrodes disposed to be opposed to each other; wherein a ratio (MA | 04-18-2013 |
20130100576 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a high voltage and high capacitance multilayer ceramic electronic component having enhanced reliability, including: a ceramic body; a first layer including conductive patterns; and a second layer including a floating pattern, wherein the sum of the number of the first and second layers is 100 or more, the ceramic body has first and second external electrodes formed on outer surfaces thereof, and a ratio of a length of the floating pattern to a length of the ceramic body is 0.7 to 0.9, and a ratio of a length of the overlapped portion to the length of the floating pattern is 0.5 to 0.95, in a cross section taken in a length direction in which the first and second external electrodes are connected to and extended from the ceramic body and a stacking direction of the first and second layers. | 04-25-2013 |
20130107417 | MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME | 05-02-2013 |
20130107418 | DIELECTRIC CERAMIC COMPOSITION AND LAMINATED CERAMIC ELECTRONIC COMPONENT | 05-02-2013 |
20130120898 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There are provided a multilayer ceramic electronic component and a method of manufacturing the same. The multilayer ceramic electronic component includes: a ceramic body including a dielectric layer; first and second internal electrodes disposed within the ceramic body to face each other, while having the dielectric layer interposed therebetween; and first external electrodes electrically connected to first and second internal electrodes and second external electrodes formed on the first external electrodes, wherein the first and second external electrodes include a conductive metal and a glass, and when the second external electrodes are divided into three equal parts in a thickness direction, an area of the glass in central parts thereof with respect to an area of the central parts is 30 to 80%. Therefore, sealing properties of a chip is improved, whereby a multilayer ceramic electronic component having improved reliability may be implemented. | 05-16-2013 |
20130120899 | MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; and a plurality of first and second internal electrodes each including a body part formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes including first and second lead parts extended from one surfaces of the body parts to be exposed through one surface of the ceramic element, respectively, wherein inside connection portions between the body parts and the first and second lead parts are curvedly formed, and have a curvature radius of 30 to 100 μm. | 05-16-2013 |
20130135787 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including: a ceramic body including dielectric layers; and first and second inner electrodes disposed to face each other with the dielectric layer interposed therebetween within the ceramic body, the first and second inner electrodes being alternately laminated with a difference in printing widths therebetween, wherein a difference ratio between the printing widths of the first and second inner electrodes is 20 to 80%. According to embodiments of the present invention, a multilayer ceramic electronic component having excellent reliability and withstand voltage characteristics may be realized, by reducing the occurrence of cracking through a reduction in the influence of step height while securing high capacitance. | 05-30-2013 |
20130135788 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - There are provided a multilayer ceramic electronic component comprising: a ceramic main body including a dielectric layer and having first and second main faces, third and fourth side faces opposed in a length direction, and fifth and sixth faces opposed in a width direction; first and second internal electrodes; and one or more first external electrodes formed on the fifth face and one or more second external electrodes formed on the sixth face, wherein the first and second external electrodes have an average thickness ranging from 3 μm to 30 μm, and when at least one of the first and second external electrodes is divided into three equal parts in a thickness direction, an area of glass in central area portions thereof is 35% to 80% of the total areas of the central area portions. | 05-30-2013 |
20130148256 | LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic electronic component includes a laminated body including a plurality of stacked ceramic layers and a plurality of internal electrodes arranged along interfaces between the ceramic layers, and an external electrode located on an outer surface of the laminated body. In the laminated ceramic electronic component, the ceramic layers have a composition including a main constituent of a barium titanate-based compound and Bi | 06-13-2013 |
20130148257 | METHOD OF MANUFACTURING PEROVSKITE POWDER, PEROVSKITE POWDER MANUFACTURED BY THE SAME AND MULTILAYER CERAMIC ELECTRONIC COMPONENT - There are provided a method of manufacturing perovskite powder, and perovskite powder and a multilayer ceramic electronic component manufactured thereof. The manufacturing method includes: washing metal oxide hydrate to remove impurities therefrom; adding pure water and an acid or a base to the metal oxide hydrate to prepare a metal oxide sol; mixing the metal oxide sol with a metal salt to form perovskite particle nuclei; and conducting grain growth of the perovskite particle nuclei by hydrothermal treatment to produce perovskite powder. The method of manufacturing perovskite powder and the perovskite powder manufactured by the same have advantages such as excellent crystallinity, reduced generation of fine powder, and favorable dispersion properties. | 06-13-2013 |
20130163143 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including: a ceramic body having dielectric layers and first and second internal electrodes alternately stacked therein; and first and second external electrodes electrically connected to the first and second internal electrodes and formed at both ends of the ceramic body, wherein the ceramic body includes an effective layer contributing to capacitance formation and a protective layer provided on at least one of upper and lower surfaces of the effective layer, the protective layer including one or more step absorbing layers provided at both ends thereof, so that the multilayer ceramic electronic component can have excellent reliability by reducing defects such as electrode spreading, cracks, delamination and the like. | 06-27-2013 |
20130170094 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor, including: a multilayer body having a plurality of dielectric layers and a plurality of internal electrode layers alternately laminated; wherein each internal electrode layer has a width gradually decreases from a center thereof towards both ends thereof in a length direction; and when a width of each internal electrode layer at the ends thereof in the length direction is defined as a minimum width L | 07-04-2013 |
20130182367 | METHOD FOR FORMING RUTILE TITANIUM OXIDE AND THE STACKING STRUCTURE THEREOF - A method for forming a stacking structure, including forming a ruthenium oxide layer over a substrate; forming a praseodymium oxide layer over the ruthenium oxide layer; and forming a titanium oxide layer over the praseodymium oxide layer; wherein the titanium oxide layer has a rutile phase with the existence of the praseodymium oxide layer underneath. The oxide layers are deposited by a plurality of atomic layer deposition cycles using ruthenium precursor, praseodymium precursor, titanium precursor, and ozone. | 07-18-2013 |
20130182368 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - There is provided a multilayer ceramic electronic component including: a ceramic main body; a plurality of internal electrodes; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a thickness direction is Tc and a thickness of the external electrodes at a point spaced apart from a central portion of a capacitance formation region in a thickness direction by a distance equal to 25% of a thickness (S) of the capacitance formation region is T | 07-18-2013 |
20130182369 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - A multilayer ceramic electronic component includes: a ceramic main body; a plurality of internal electrodes laminated within the ceramic main body; and external electrodes formed on outer surfaces of the ceramic main body and electrically connected to the internal electrodes, wherein an average thickness of the external electrodes is 10 μm or less, and when a thickness of the external electrodes in a central portion of the ceramic main body in a width direction is Tc and a thickness of the external electrodes at a lateral edge of a printed surface region of the internal electrodes is T | 07-18-2013 |
20130182370 | CAPACITOR - A capacitor includes an anode made of metal, a first dielectric layer formed on a surface of the anode, a cathode made of metal, and a second dielectric layer formed on a surface of the cathode. The first dielectric layer contains an oxide of the metal forming the anode. The second dielectric layer contains an oxide of the metal forming the cathode. The anode and the cathode are stacked such that the first and second dielectric layers face each other. | 07-18-2013 |
20130182371 | CAPACITOR AND METHOD OF MANUFACTURING THE SAME - Provided are a capacitor and a method of manufacturing the same. A first capacitor unit and a second capacitor unit are alternately stacked to three layers or more to form a stacked body, collector lead parts of the first capacitor units are connected to contact each other, collector lead parts of the second capacitor units are connected to contact each other, and the collector lead parts of the stacked body are stacked such that side surfaces thereof form a stepped shape. | 07-18-2013 |
20130188292 | CERAMIC COMPOSITION AND A LAMINATED CERAMIC ELECTRONIC COMPONENT INCLUDING THE SAME THEREOF - [Problems] To provide a ceramic composition that retains a high insulation resistance after being fired in a reductive atmosphere to form a laminated body. | 07-25-2013 |
20130194715 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There are provided a multilayer ceramic electronic component and a method of manufacturing the same. Here, an average diameter (D | 08-01-2013 |
20130194716 | SOLID STATE ENERGY STORAGE DEVICES - Described in this patent application are devices for energy storage and methods of making and using such devices. In various embodiments, blocking layers are provided between dielectric material and the electrodes of an energy storage device. The block layers are characterized by higher dielectric constant than the dielectric material. There are other embodiments as well. | 08-01-2013 |
20130194717 | DIELECTRIC CERAMIC, STACK CERAMIC ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THESE - A dielectric ceramic enabling low-temperature firing and exhibiting good dielectric characteristics, and a stack ceramic electronic component using the same are provided. The dielectric ceramic containing (Ba | 08-01-2013 |
20130194718 | LAMINATED CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING LAMINATED CERAMIC CAPACITOR - Provided is a laminated ceramic capacitor having excellent lifetime characteristics in a high-temperature loading test. It includes a laminated body including a plurality of stacked dielectric layers including crystal grain and crystal grain boundaries, and a plurality of internal electrodes and external electrodes. The laminated body contains, as its main constituent, a perovskite-type compound containing Ba and Ti and optionally Ca, and further contains a rare-earth element R, and Mn, Mg, V, and Si With respect to 100 parts by mol the Ti, the total parts by mol content (100×m) of Ba and Ca is 0.950≦m<1.000, the contents in terms of parts by mol is 0.3≦R≦2.5, 0.05≦Mn≦0.5, 0.5≦Mg≦2.0, 0.05≦V≦0.25, 0.5≦Si≦3.0, and further, the molar ratio x of Ca/(Ba+Ca) is 0≦x≦0.01, and the existence of the rare-earth element R in a position of 4 nm inner from a surface of the crystal grain is 20% or more. | 08-01-2013 |
20130201600 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a ceramic body, a plurality of internal electrodes provided in the ceramic body and including ends exposed on a surface of the ceramic body; a glass coating layer covering a portion of the surface of the ceramic body on which the internal electrodes are exposed; and an electrode terminal provided directly on the glass coating layer and including a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The internal electrodes project from the surface of the ceramic body into the glass coating layer without passing through the glass coating layer. The metal powder particles define conduction paths electrically connecting the internal electrodes with the electrode terminal. | 08-08-2013 |
20130201601 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE SAME - A ceramic electronic component includes a ceramic body, a glass coating layer, and an electrode terminal. The ceramic body includes a plurality of internal electrodes whose ends are exposed on the surface of the ceramic body. The glass coating layer covers a portion of the ceramic body on which the internal electrodes are exposed. The electrode terminal is provided directly on the glass coating layer. The electrode terminal includes a plating film. The glass coating layer is made of a glass medium in which metal powder particles are dispersed. The metal powder particles define conduction paths that electrically connect the internal electrodes with the electrode terminal. | 08-08-2013 |
20130201602 | LAMINATED CERAMIC CAPACITOR - A laminated ceramic capacitor includes multiple dielectric layers, internal electrodes having Cu as the primary component and embedded between the dielectric layers, and external electrodes. The dielectric layers contain a primary component comprised of a CaZrO | 08-08-2013 |
20130208398 | METHOD OF MANUFACTURING MULTILAYER CERAMIC CAPACITOR AND MULTILAYER CERAMIC CAPACITOR - A rectangular or substantially rectangular parallelepiped chip including first and second end surfaces and first and second side surfaces is produced by cutting a mother block along a first direction in a portion where, of conductive layers that are adjacent to each other in a stacking direction, a first one is present and a second one is not present and cutting of the mother block along a second direction in a portion where, of the conductive layers that are adjacent to each other in the stacking direction, the second one is present and the first one is not present. A first internal electrode formed from the first conductive layer is exposed at the first end and side surfaces and not exposed at either of the second end and side surfaces. A second internal electrode formed from the second conductive layer is exposed at the second end and side surfaces and not exposed at either of the first end and side surfaces. | 08-15-2013 |
20130208399 | LAMINATED CERAMIC ELECTRONIC COMPONENT - In a laminated ceramic capacitor, a cylindrical ceramic part of its ceramics includes, in a manner not exposed to the surface of the ceramics, a cylinder-shaped high-void-ratio part which has a void ratio higher than the void ratio in the cylindrical ceramic part other than the hjigh-void-ratio part and which has two layered parts facing the left and right sides of each layered conductor, respectively, as well as two layered parts facing the outer surfaces of the two outermost layered conductors, respectively. The laminated ceramic electronic component inhibits cracking of its sintered chip. | 08-15-2013 |
20130215552 | LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - A laminated electronic component includes a laminate formed by alternately layering multiple internal electrodes and dielectrics, with the internal electrodes alternately exposed on the respective end faces of the laminate and two sets of external electrodes formed on them, wherein the external electrodes have a cermet layer that is film-formed by the sputtering method. Stable ESR (Equivalent Series Resistance) can be set over a wide range by changing the composition and film thickness of the cermet layer. In addition, ESR can be added that ensures low temperature coefficient and resistance to the impact of humidity change. | 08-22-2013 |
20130222968 | DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR USING THE SAME - A dielectric ceramic that includes a sintered body of BaTiO | 08-29-2013 |
20130222969 | DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC DEVICE - A dielectric ceramic composition comprising a compound shown by a general formula {A | 08-29-2013 |
20130222970 | DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC DEVICE - Dielectric ceramic composition comprising a compound shown by a general formula {A | 08-29-2013 |
20130222971 | LAMINATED CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING LAMINATED CERAMIC CAPACITOR - As a dielectric ceramic constituting dielectric layers of a laminated ceramic capacitor, a dielectric ceramic is used which contains, as its main constituent, a perovskite-type compound containing Ca and Zr and optionally containing Sr, Ba, and Ti, and further contains Si, Mn, and Al, and when the total content of Zr and Ti is regarded as 100 parts by mol, the total content (100×m) of Ca, Sr, and Ba meets 1.002≦m≦1.100 in terms of parts by mol, the Si content n meets 0.5≦n≦10 in terms of parts by mol, the Mn content u meets 0.5≦u≦10 in terms of parts by mol, and the Al content w meets 0.02≦w≦4 in terms of parts by mol, m and n satisfying −0.4≦100(m−1)−n≦3.9. | 08-29-2013 |
20130222972 | LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic capacitor with a laminated body including a plurality of stacked ceramic layers and internal electrodes located between the ceramic layers. The laminated body has a pair of mutually opposed principal surfaces extending in the direction in which the ceramic layers extend, a pair of mutually opposed side surfaces and a pair of mutually opposed end surfaces which respectively extend in directions orthogonal to the principal surfaces. The internal electrodes are 0.4 μm or less in thickness, and are located in an area defined by a width-direction gap of 30 μm or less interposed with respect to each of the pair of side surfaces and an outer layer thickness of 35 μm or less interposed with respect to each of the pair of principal surfaces. | 08-29-2013 |
20130229748 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including: a ceramic body having external electrodes; and internal electrodes disposed between ceramic layers within the ceramic body, the ceramic body having a width smaller than a length thereof and the number of laminated internal electrodes being 250 or more, wherein when the thickness of the ceramic layer is denoted by T | 09-05-2013 |
20130235508 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including: a multilayer body having a dielectric layer; and a plurality of internal electrode layers provided in the multilayer body, and having ends exposed to at least one face of the multilayer body, wherein, a ratio of T | 09-12-2013 |
20130242456 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - A multilayer ceramic electronic component includes a ceramic main body having internal electrodes laminated therein; and external electrodes formed on ends of the ceramic main body in a length direction, wherein each external electrode includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and when Tc is thickness of a cover layer, Te is thickness of the internal electrode, Td is distance between neighboring internal electrodes, L | 09-19-2013 |
20130242457 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including: a ceramic main body having internal electrodes laminated therein; and external electrodes formed on both ends of the ceramic main body in a length direction thereof, wherein each of the external electrodes includes a first layer formed on the ceramic main body and including a conductive metal, and a second layer formed on the first layer and including a conductive resin, and when Tc is a thickness of a cover layer of the ceramic main body, L | 09-19-2013 |
20130242458 | MONOLITHIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING MONOLITHIC ELECTRONIC COMPONENT - A monolithic electronic component includes a laminate including a plurality of stacked insulating layers and a plurality of internal electrodes which extend between the insulating layers and which have end portions exposed at predetermined surfaces of the laminate, first plating layers disposed on the predetermined surfaces of the laminate, and second plating layers disposed on the first plating layer. The first plating layers are made of a metal different from that used to make the internal electrodes. The first plating layers are formed by electroless plating. The second plating layers are formed by electroplating. | 09-19-2013 |
20130242459 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer having an average thickness of 0.6 μm or less; and first and second inner electrode layers within the ceramic body, disposed to face each other with the dielectric layer interposed therebetween, wherein the dielectric layer includes contact dielectric grains in contact with the first or second inner electrode layer and non-contact dielectric grains not in contact with the first or second inner electrode layer, and, when an average thickness of the dielectric layer is defined as td and an average diameter of the contact dielectric grains is defined as De, De/td≦0.35 is satisfied. The multilayer ceramic electronic component has improved continuity of the inner electrode layer, large capacitance, extended accelerated lifespan and excellent reliability. | 09-19-2013 |
20130250472 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - A multilayer ceramic electronic component includes a ceramic main body having internal and floating electrode layers laminated therein and spaced apart from each other; and external electrodes formed on ends of the ceramic main body and including a first layer including a conductive metal and a second layer formed on the first layer and including a conductive resin. When Tc is thickness of a cover layer, G is gap between internal electrodes, L | 09-26-2013 |
20130250473 | Asymmetric High Voltage Capacitor - An improved multi-layered ceramic capacitor, and method of making the multi-layered ceramic capacitor, is described. The capacitor has an active area comprising first layers and second layers in alternating parallel arrangement with dielectric there between. The first layer comprises a first active electrode and a first floating electrode in a common plane and the second layer comprises a second active electrode and a second floating electrode in a second common plane. At least one shield layer is adjacent to an outermost first layer of the first layers wherein the shield layer has a first projection and the first layers have a second projection wherein the first projection and the second projection are different. | 09-26-2013 |
20130250474 | ELECTRONIC COMPONENT - An electronic component includes a laminate including a plurality of insulating layers that are laminated on each other. A capacitor conductor is embedded in the laminate and includes an exposed portion exposed between the insulating layers at a predetermined surface of the laminate. An external electrode is provided on the predetermined surface by direct plating so as to cover the exposed portion. An outer edge of the external electrode is spaced away from the exposed portion by about 0.8 μm or more. | 09-26-2013 |
20130258544 | THIN FILM CAPACITOR - A thin film capacitor includes an under electrode, a plurality of dielectric body layers and a plurality of internal electrode layers that are alternately laminated on the under electrode, the internal electrode layers respectively including protrusion parts that each protrude from the dielectric body layers viewed in the lamination direction, and connection electrodes to which at least a portion of each of the protrusion parts contacts. Assuming that protrusion amounts of the protrusion parts of the internal electrode layers that are connected to the same connection electrode are regarded as L, a protrusion amount L | 10-03-2013 |
20130258545 | THIN FILM CAPACITOR - A thin film capacitor includes two or more of dielectric body layers that are alternately laminated on an under-electrode, and internal electrode layers that are laminated between the dielectric body layers, and are exposed off the dielectric body layer, and a connection electrode that is electrically connected to the internal electrode layers via the exposed portion of the internal electrode layers, A relationship between an average grain size D of crystal grains in the internal electrode layers and an average grain size d of crystal grains in the connection electrode is D>d. | 10-03-2013 |
20130258546 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - There are provided a multilayer ceramic electronic component and a fabrication method thereof. The multilayer ceramic component includes a ceramic main body in which internal electrodes and dielectric layers are alternately laminated; external electrodes formed on outer surfaces of the ceramic main body; intermediate layers formed on the external electrodes and including one or more selected from the group consisting of nickel, copper, and a nickel-copper alloy; and plating layers formed on the intermediate layers, whereby infiltration of a plating solution can be prevented. | 10-03-2013 |
20130258547 | CERAMIC POWDER AND MULTI-LAYER CERAMIC CAPACITOR - A ceramic powder that contains, as a main composition, barium titanate powder having a perovskite structure with an average particle size (median size) of 200 nm or smaller as measured by SEM observation, wherein the barium titanate powder is such that the percentage of barium titanate particles having twin defects in the barium titanate powder is 13% or more as measured by TEM observation and that its crystal lattice c/a is 1.0080 or more. The ceramic powder has a wide range of optimum sintering temperatures and thus offers excellent productivity and is particularly useful in the formation of thin dielectric layers of 1 μm or less. | 10-03-2013 |
20130258548 | CERAMIC POWDER AND MULTI-LAYER CERAMIC CAPACITOR - A ceramic powder that contains, as a main composition, barium titanate powder having a perovskite structure with an average particle size (median size) of 200 nm or smaller as measured by SEM observation, wherein the the barium titanate powder is such that the percentage of barium titanate particle having twin defects in the barium titanate powder is less than 10% as measured by TEM observation and that its crystal lattice c/a is 1.0075 or more. The ceramic powder is particularly useful in the formation of thin dielectric layers of 1 μm or less and can be used to manufacture MLCCs having both desired capacity and longevity traits. | 10-03-2013 |
20130279070 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a first internal electrode that includes a first opposed section and a first extraction section. The first opposed section is opposed to a second internal electrode with a ceramic layer interposed therebetween. The first extraction section is located closer to a first end surface than the first opposed section. The first extraction section includes a first thick section. The first thick section is thicker than a first central section of the first opposed section. The first opposed section includes a first base end section opposed to a second tip section of the second internal electrode closer to the first end surface, with the ceramic layer interposed therebetween, and the first base end section includes a first thin section. The first thin section is thinner than the first central section. | 10-24-2013 |
20130279071 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT - Solder-repellent portions are each arranged so as to extend over all or substantially all of a portion of a corresponding one of outer electrodes provided on a corresponding one of end surfaces of a monolithic ceramic electronic component and partially on portions of the outer electrode provided over two side surfaces of the monolithic ceramic electronic component. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to the end surfaces and portions of the outer electrode provided on portions of the two side surfaces. Thus, expansion and contraction that occur as a result of application of an AC voltage is not transmitted or is not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are significantly reduced or prevented. | 10-24-2013 |
20130279072 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT - When a monolithic ceramic electronic component is viewed from either one of end surfaces thereof, an outer electrode includes a solder-repellent portion and a solder-receivable portion. The solder-repellent portion covers the central portion of an end surface of a ceramic laminate body. The solder-receivable portion includes portions disposed on two opposing sides of the solder-repellent portion. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to a portion around the central portion of the end surface. Thus, expansion and contraction that occur as a result of application of an AC voltage are not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are reduced. | 10-24-2013 |
20130279073 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A ceramic electronic component includes a ceramic element assembly and external electrodes. The external electrodes are disposed on the ceramic element assembly. The external electrodes include an underlying electrode layer and a first Cu plating film. The underlying electrode layer is disposed on the ceramic element assembly. The first Cu plating film is disposed on the underlying electrode layer. The underlying electrode layer includes a metal that is diffusible in Cu and a ceramic bonding material. The metal that is diffusible in Cu is diffused in at least a surface layer in the underlying electrode layer side of the first Cu plating film. | 10-24-2013 |
20130286535 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including: a ceramic body formed by laminating dielectric layers having an average thickness of 0.7p or less; external electrodes formed on external surfaces of the ceramic body; and internal electrodes respectively disposed on the dielectric layer so as to have a gap formed therebetween, wherein, when a narrowest gap between the internal electrode edges adjacent to one another is denoted by Gmin, 10 μm≦Gmin≦60 μm is satisfied. | 10-31-2013 |
20130294006 | CONDUCTIVE RESIN COMPOSITION, MULTILAYER CERAMIC CAPACITOR HAVING THE SAME AND METHOD OF MANUFACTURING THE SAME - There is provided a conductive resin composition including epoxy resin, copper powder particles, and non-nitrogen-based hardeners. | 11-07-2013 |
20130294007 | MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor exhibits superior life characteristics in a high temperature load test despite the use of very thin dielectric layers. As a dielectric ceramic constituting a dielectric layer of the multilayer ceramic capacitor, a perovskite-type compound is used and contains Ba and Ti (a portion of Ba can be replaced with at least one of Ca and Sr, and a portion of Ti can be replaced with Zr) as a main component, and including La within the range of 2-6 parts by mole, Mg within the range of 3-5 parts by mole, and Mn within the range of 1.5-3 parts by mole in a case where a total content of Ti and Zr is 100 parts by mole. | 11-07-2013 |
20130301184 | CONDUCTIVE PASTE COMPOSITION FOR INTERNAL ELECTRODE, MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THE SAME - There are provided a conductive paste composition for an internal electrode, a multilayer ceramic electronic component including the same, and a method of manufacturing the same, the conductive paste composition including: a metal powder; and an additive including at least one selected from glutamic acid, amino acids, thiols, and hydrocarbons. | 11-14-2013 |
20130301185 | MULTILAYERED CERAMIC ELEMENTS - Disclose herein are multilayered ceramic elements having a structure in which an inner electrode layer and a dielectric layer are alternately multilayered, wherein the inner electrode layer may include inhibitors in the amount of 3 to 12 wt % with respect to a weight of metal powders, and an average particle size of the inhibitors may have a size of about 30% with respect to an average particle size of dielectric base metals. According to the exemplary embodiments of the present invention, it is possible to manufacture the elements with excellent reliability by increasing the capacity of the multilayered ceramic elements by controlling the particle size and the added quantity of the inhibitors included in the inner electrode layers that is squeezed out during firing at high temperature. | 11-14-2013 |
20130301186 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including: a ceramic body including a dielectric layer; and first and second inner electrode layers formed within the ceramic body, wherein, when a thickness of the dielectric layer is defined as td and a maximum thickness and a minimum thickness of the first or second inner electrode layer are defined as tmax and tmin, respectively, td≦0.6 μm and (tmax−tmin)/td<0.30 are satisfied. According to the present invention, a large-capacity multilayer ceramic electronic component capable of improving withstand voltage characteristics and having excellent reliability can be realized by improving uniformity in the thickness of the inner electrode layers. | 11-14-2013 |
20130308246 | MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF - A multilayered ceramic electronic component includes: a ceramic element having a plurality of dielectric layers laminated therein; first inner electrodes formed on the dielectric layers disposed in upper and lower portions in the ceramic element, the width of a portion of each of the first inner electrodes exposed from one end face of the ceramic element being less than that of a portion thereof disposed within the ceramic element; and second inner electrodes formed on the dielectric layers disposed in the middle portion in the ceramic element, the width of a portion of each of the second inner electrodes exposed from one end face of the ceramic element being equal to that of a portion thereof disposed within the ceramic element. | 11-21-2013 |
20130314838 | Capacitive Device and Method for Fabricating the Same - A capacitive device includes a first capacitor including a first wiring layer, a first dielectric film, a first conductive layer, a first insulating layer on the first capacitor, a second capacitor on the first insulating layer including a second conductive layer, a second dielectric film, and a third conductive layer, a second insulating layer on the second capacitor, a second wiring layer on the second insulating layer including first and second connection wires, a first via connecting the first wiring layer to the second conductive layer, a second via connecting the third conductive layer to the second wiring layer, a third via connecting the first connection wire to the first conductive layer, and a fourth via connecting the second connection wire to the first wiring layer. | 11-28-2013 |
20130314839 | FILM CAPACITOR ELEMENT, FILM CAPACITOR, AND METHOD OF PRODUCING THE FILM CAPACITOR ELEMENT - A film capacitor element including a base dielectric film layer | 11-28-2013 |
20130314840 | CONDUCTIVE PASTE FOR INNER ELECTRODE AND MULTILAYER CERAMIC ELECTRONIC COMPONENT HAVING THE SAME - Disclosed are a conductive paste for an inner electrode and a multilayer ceramic electronic component having the same. There is provided a conductive paste for an inner electrode, including: a conductive metal powder for manufacturing the inner electrode for multilayer ceramic electronic component; an organic binder including at least one selected from a group consisting of acryl-based resin, butyral-based resin, and a cellulose-based resin to disperse the conductive metal powder; and a solvent including eucalyptol. | 11-28-2013 |
20130314841 | Laminated Ceramic Capacitor - A laminated ceramic capacitor that includes dielectric layers stacked adjacent one another to form a laminated body; internal electrodes arranged between the dielectric layers; external electrodes along surfaces of the laminated body and connected to the internal electrodes; and a covering layer covering at least portions of sections of the laminated body between the laminated body and edges of the external electrodes. The external electrodes include a silver-containing layer containing at least Ag as its main constituent. The dielectric layers and the covering layer 30 contain, as their main constituent, a perovskite compound represented by a chemical formula ABO | 11-28-2013 |
20130321976 | NICKEL NANOPARTICLE, METHOD OF PREPARING THE SAME, AND MULTILAYER CERAMIC CAPACITOR USING THE SAME - There is provided a method of preparing a nickel nanoparticle, the method including: forming an aqueous solution by mixing water and a solution containing a hydroxyl group; forming a mixed liquid by adding carboxylic acid to the aqueous solution at a ratio of 10 to 20 wt % with regard to the solution containing a hydroxyl group; and adding a nickel salt to the mixed liquid and stirring the mixed liquid. | 12-05-2013 |
20130321977 | MULTILAYERED CERAMIC COMPONENT - Disclosed herein is a multilayered ceramic component having a structure in which internal electrode layers and dielectric layers are alternately multilayered, wherein the internal electrode layer includes 0.01 to 12 wt % of common material based on weight of metal powders, and an average particle size of the common material is within 30% of an average particle size of the metal powders. According to the first exemplary embodiment of the present invention, the particle size and the added amount of common material squeezed out from the internal electrode layer at the time of firing at a high temperature are controlled, thereby making it possible to improve the connectivity of the internal electrode. | 12-05-2013 |
20130321978 | MULTILAYERED CERAMIC COMPONENT - Disclosed herein is a multilayered ceramic component having a structure in which internal electrode layers and dielectric layers are alternately multilayered, wherein the internal electrode layer includes 0.01 to 12 wt % of common material based on weight of metal powders, and an average particle size of the common material is 30 to 50% of an average particle size of a dielectric base material included in the dielectric layer. According to the first exemplary embodiment of the present invention, the particle size and the added amount of the common material squeezed out from the internal electrode layers at the time of firing thereof at a high temperature are controlled, thereby making it possible to improve the capacity and the reliability of the internal electrode. | 12-05-2013 |
20130329336 | CONDUCTIVE PASTE COMPOSITION FOR EXTERNAL ELECTRODE AND MULTILAYER CERAMIC ELECTRONIC COMPONENT FABRICATED USING THE SAME - There are provided a conductive paste composition for an external electrode and a multilayer ceramic electronic component fabricated using the same, the conductive paste composition for an external electrode including: a conductive metal powder; and a resin mixture including at least one resin selected from a group consisting of an epoxy-based resin and a phenoxy-based resin, and a polyvinyl formal resin. | 12-12-2013 |
20130335879 | DOUBLE-SIDED ADHESIVE TAPE OR SHEET, AND ADHEREND PROCESSING METHOD - The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet, containing a heat-releasable pressure-sensitive adhesive layer containing a heat-expandable microsphere on one side of a substrate and a pressure-sensitive adhesive layer for temporary fixing on another side of the substrate, in which the pressure-sensitive adhesive layer for temporary fixing has a shear pressure-sensitive adhesive strength of 2.0 N/200 mm | 12-19-2013 |
20130342956 | LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic electronic component has electrode layers stacked with ceramic layers, where the thickness of each electrode layer is controlled to 0.5 μm or less and the average size of crystal grains constituting the electrode layer is controlled to 0.1 μm or less. The occurrence of structural defects in the laminated ceramic electronic component can be suppressed and high continuity of the electrode layers stacked with the ceramic layers is ensured. | 12-26-2013 |
20130342957 | DIELECTRIC CERAMIC, METHOD OF MANUFACTURING DIELECTRIC CERAMIC, AND MULTILAYER CERAMIC CAPACITOR - A dielectric ceramic whose primary component is an ABO | 12-26-2013 |
20130342958 | MULTILAYER CERAMIC CAPACITOR, DIELECTRIC CERAMIC, MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITOR - A dielectric ceramic that can be sintered at a sufficiently low temperature and has a desired specific resistance at a high temperature, and a multilayer ceramic electronic component (a multilayer ceramic capacitor and the like) using the dielectric ceramic are provided. The multilayer ceramic capacitor includes a multilayer body having a plurality of laminated dielectric ceramic layers, and a plurality of internal electrodes at interfaces between the dielectric ceramic layers; and external electrodes | 12-26-2013 |
20140002949 | MULTILAYER CERAMIC ELECTRONIC COMPONENT | 01-02-2014 |
20140002950 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME | 01-02-2014 |
20140002951 | MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF | 01-02-2014 |
20140002952 | Leadless Multi-Layered Ceramic Capacitor Stacks | 01-02-2014 |
20140002953 | DOUBLE-SIDED ADHESIVE TAPE OR SHEET, AND ADHEREND PROCESSING METHOD | 01-02-2014 |
20140009864 | LAMINATED CERAMIC CAPACITOR - A laminated ceramic capacitor has multiple layered dielectric ceramic layers of a dielectric ceramic constituted by primary phase grains whose primary component is BaTiO | 01-09-2014 |
20140016241 | LAMINATED CAPACITOR - In a laminated capacitor, one additional first internal electrode layer, which has its edge connected to the first external electrode as do the first internal electrode layers, is provided to one of the five first internal electrode layers so as to face one another via the second dielectric layer having a thickness smaller than the thickness of the first dielectric layer and not contributing to the formation of capacity, and one additional second internal electrode layer, which has its edge connected to the second external electrode as do the second internal electrode layers, is provided to one of the five second internal electrode layers so as to face one another via the third dielectric layer having a thickness smaller than the thickness of the first dielectric layer and not contributing to the formation of capacity. | 01-16-2014 |
20140022689 | MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayered ceramic electronic component including: a ceramic body including a dielectric layer and having first and second main surfaces, third and fourth end surfaces, and fifth and sixth side surfaces; internal electrodes disposed to face each other in the ceramic body and having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the external electrodes include first external electrodes formed from the third or fourth end surface to the first and second main surfaces, and second external electrodes formed from the third or fourth end surfaces to the first and second main surfaces on the first external electrodes, having a length shorter than a length to which the first external electrodes are formed on the first and second main surfaces, and containing an epoxy resin. | 01-23-2014 |
20140022690 | MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME - There is provided a multilayered ceramic electronic component including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on at least one of the dielectric layers and alternately exposed through both ends of the ceramic body in a stacking direction of the ceramic body; an a step compensation cover including a ceramic material having a viscosity higher than that of a ceramic material included in the ceramic body and formed on at least one of an upper surface and a lower surface of the ceramic body. | 01-23-2014 |
20140022691 | MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF THE SAME - There is provided a multilayered ceramic electronic component including: a ceramic body in which a plurality of dielectric layers are multilayered; a plurality of first and second internal electrode layers formed on at least one surfaces of the dielectric layers and alternately exposed through both ends of the ceramic body in a length direction thereof; first and second adhesive layers formed on both ends of the ceramic body, electrically connected the exposed first and second internal electrodes and formed of a conductive paste; and first and second external electrode layers formed on surfaces of the first and second adhesive layers and formed of a glass-free conductive paste. | 01-23-2014 |
20140022692 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD OF FABRICATING THE SAME - There are provided a laminated ceramic electronic component and a method of fabricating the same. The laminated ceramic electronic component include a ceramic body including a dielectric layer; and first and second internal electrodes disposed to face each other, having the dielectric layer interposed therebetween within the ceramic body, wherein the ceramic body includes an active layer that is a capacitance forming part and a cover layer that is a non-capacitance forming part formed on at least one of a top surface and a bottom surface of the active layer, and when a thickness of the ceramic body is t and a thickness of the cover layer is T, T≦t×0.05 is satisfied and when an average particle diameter of a dielectric grain in the active layer is Da and an average particle diameter of a dielectric grain in the cover layer is Dc, 0.7≦Dc/Da≦1.5 is satisfied. | 01-23-2014 |
20140022693 | CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a ceramic electronic component, including: a ceramic body including a plurality of internal electrodes; a first external electrode layer electrically connected to the internal electrodes and formed on external surfaces of the ceramic body; a second external electrode layer including nickel (Ni), formed on the first external electrode layer; a metal coating layer including tin (Sn), formed on external surfaces of the first external electrode layer and the second external electrode layer; and a diffusion layer formed between the first and second external electrode layers and the metal coating layer. | 01-23-2014 |
20140022694 | METHOD FOR MANUFACTURING HIGH PERFORMANCE MULTILAYER CERAMIC CAPACITORS - The invention relates to a method for manufacturing a high performance multi layer ceramic capacitor, comprising the steps of: a) providing a substrate having a first edge and a second edge arranged opposite to the first edge, b) depositing a bottom electrode layer onto the substrate using a thick-film and/or thin-film deposition method such that the electrode layer extends all the way from the first edge towards the second edge of the substrate such that a trench free of the bottom electrode layer is provided adjacent in between the deposited bottom electrode layer and the second edge of the substrate, d) depositing a high-k dielectric ceramic layer onto the electrode layer using a thick-film and/or thin-film deposition method such that the high-k dielectric ceramic layer extends all the way to the first edge and to the second edge of the substrate, f) depositing a low-k dielectric layer comprising silicon nitride, silicon dioxide and/or aluminum oxide onto the high-k dielectric ceramic layer using a thin-film deposition method such that the low-k dielectric layer extends all the way to the first edge and to the second edge of the substrate, h) depositing another electrode layer onto the low-k dielectric layer using a thick-film and/or thin-film deposition method such that the another electrode layer extends all the way to the first edge and to the second edge of the substrate, j) etching the capacitor for cutting a trench through the another electrode layer and through the low-k dielectric layer deposited during steps f) and h) such that the trench is arranged distant to second edge of the substrate, m) cutting the capacitor on both edge sides through the extension of the trenches perpendicular to the extension of the substrate, and n) metalizing both cuffed sides of the capacitor by using a thick-film deposition method. | 01-23-2014 |
20140022695 | Electrical Multilayer Component - An electrical multilayer component includes a stack composed of functional layers and also a first and a second external contact. The external contacts are arranged on side surfaces of the stack. Internal electrodes of a first type are directly electrically conductively connected to the first external contact and internal electrodes of a second type directly electrically conductively connected to the second external contact. An internal electrode of the first type and an internal electrode of the second type partly overlap. An internal electrode of the first type and an internal electrode of the second type are arranged in a manner spaced apart from one another in an identical plane. | 01-23-2014 |
20140022696 | ELECTRONIC COMPONENT - A laminate body includes a plurality of ceramic layers and capacitor conductors embedded in the laminate body so as to be opposed to each other via one of the ceramic layers. The capacitor conductors are made of an Al-based material, and the capacitor conductors include narrow portions, respectively, which function as fuse elements. The narrow portions have an average width smaller than an average width of portions of the capacitor conductors other than the narrow portions. As a result, the electronic component has an improved capability to protect its function as a capacitor when a short circuit occurs between capacitor conductors. | 01-23-2014 |
20140029157 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component including: a ceramic main body including a dielectric layer and internal electrodes disposed to face each other, while having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the external electrodes include first external electrodes formed on outer surfaces of the ceramic main body and second external electrodes formed outwardly of the first external electrodes, and protective layers including one or more of an oxide layer and a glass layer are formed between the first external electrodes and the second external electrodes. | 01-30-2014 |
20140029158 | ELECTRONIC COMPONENT - In an electronic component, capacitor conductors include linear portions parallel or substantially parallel to a lower surface of a laminate, and lead-out portions led out respectively from the linear portions to the lower surface. Outer electrodes are disposed on the lower surface and cover exposed portions where the lead-out portions are exposed at the lower surface, respectively. At least one of the linear portions includes a groove, which is recessed in a direction away from the lower surface, in a region thereof overlapping with the corresponding outer electrode when looking at the electronic component in a plan view from a z-axis direction. | 01-30-2014 |
20140036407 | DIELECTRIC CERAMIC, MULTI-LAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A dielectric ceramic is formed with sintered grains constituting the dielectric have an average grain size of 0.2 to 1.0 gm and an oxygen defect concentration of 0.2 to 0.5%. An acceptor element is added to the dielectric ceramic by no more than 0.5 mol per 100 mol of the primary component of BaTiO | 02-06-2014 |
20140036408 | CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There are provided a ceramic electronic component and a method of manufacturing the same. The ceramic electronic component includes: a ceramic element; and an internal electrode layer formed within the ceramic element, having a thickness of 0.5 μm or less, and including a non-electrode region formed therein, wherein an area ratio of the non-electrode region to an electrode region of the internal electrode layer, in a cross section of the internal electrode layer is between 0.1% and 10%, and the non-electrode region includes a ceramic component. | 02-06-2014 |
20140043720 | MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND FABRICATING METHOD THEREOF - There is provided a multilayered ceramic electronic component including: a multilayered body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on the dielectric layers so as to be alternately exposed through end surfaces; a minimum margin indicating part formed on an L-direction margin part on which the first or second internal electrode is not formed on the dielectric layer and indicating a minimum size of the L-direction margin part, the L-direction minimum margin indicating part being inserted on the ceramic sheet, whereby a multilayered ceramic electronic component having high capacitance while reducing a defect and having excellent reliability may be implemented. | 02-13-2014 |
20140043721 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There are provided a multilayer ceramic electronic component and a method of manufacturing the same, the multilayer ceramic electronic component, including: a ceramic body including a plurality of dielectric layers laminated therein, each dielectric layer having an average thickness of 0.65 μM or less; internal electrodes disposed to face each other while having each dielectric layer interposed therebetween in the ceramic body; and external electrodes electrically connected to the internal electrodes, wherein, when td denotes the average thickness of each of the dielectric layers and te denotes an average thickness of each of the internal electrodes, te/td≦0.77 is satisfied. | 02-13-2014 |
20140043722 | LAMINATED CERAMIC CAPACITOR - laminated ceramic capacitor which has favorable moisture resistance includes an inner layer section that has dielectric ceramic layers and internal electrodes stacked alternately, and outer layer sections formed outside the inner layer section. The dielectric ceramic layers have a perovskite-type compound including a main constituent containing Ca and Zr, and an additive containing Si and Mn. The average grain size in the dielectric ceramic layers constituting the outer layer sections is smaller than the average grain size in the dielectric ceramic layers constituting the inner layer section. The Si/Mn molar ratio in the dielectric ceramic near the interfaces between the internal electrodes and the dielectric ceramic layers is ≦15. | 02-13-2014 |
20140043723 | CAPACITOR COMPONENT AND CAPACITOR COMPONENT MOUNTING STRUCTURE - Laminated ceramic capacitors include ceramic layers and inner electrodes that are alternately laminated. The inner electrodes are laminated in the same lamination direction, and a first outer electrode and a second outer electrode are electrically connected to the inner electrodes. In a mounting process, the laminated ceramic capacitors are mounted on a mounting surface such that the inner electrodes are perpendicular or substantially perpendicular to the mounting surface. | 02-13-2014 |
20140049872 | METAL-OXIDE-METAL CAPACITOR ABLE TO REDUCE AREA OF CAPACITOR ARRAYS - A metal-oxide-metal (MOM) capacitor able to reduce area of capacitor arrays is revealed. The MOM capacitor mainly includes at least three parallel conducting layers. Each parallel conducting layer consists of a first conductive plate, a second conductive plate disposed around the first conductive plate. There is a preset distance between the first conductive plate and the second conductive plate. The first conductive plates are electrically connected by at least one first via while the second conductive plates are electrically connected by at least one second via. Thereby, while being applied to capacitor arrays, the second conductive plates of the two adjacent MOM capacitors are connected together and shared with each other, so as to significantly reduce area of the capacitor array, improve circuit density and further optimize the layout efficiency of the chip design. | 02-20-2014 |
20140055909 | Vertical Stack Approach in Low Profile Aluminum Solid Electrolytic Capacitors - An improved capacitor and method of making an improved capacitor is set forth. The capacitor has planer anodes with each anode comprising a fusion end and a separated end and the anodes are in parallel arrangement with each anode in direct electrical contact with all adjacent anodes at the fusion end. A dielectric is on the said separated end of each anode wherein the dielectric covers at least an active area of the capacitor. Spacers separate adjacent dielectrics and the interstitial space between the adjacent dielectrics and spacers has a conductive material in therein. | 02-27-2014 |
20140063683 | CONDUCTIVE PASTE FOR EXTERNAL ELECTRODE, MULTILAYER CERAMIC ELECTRONIC COMPONENT MANUFACTURED BY USING THE SAME AND MANUFACTURING METHOD THEREOF - There are provided a conductive paste for an external electrode including: 100 parts by weight of a conductive metal particle; 5 to 30 parts by weight of a base resin; and 0.5 to 10 parts by weight of a spherical cross-linked polymer. | 03-06-2014 |
20140063684 | CONDUCTIVE PASTE COMPOSITION FOR EXTERNAL ELECTRODE, MULTILAYERED CERAMIC COMPONENT INCLUDING THE SAME AND MANUFACTURING METHOD THEREOF - There is provided conductive paste composition for an external electrode including: a first metal powder particle having a spherical shape and formed of a fine copper; and a second metal powder particle coated on a surface of the first metal powder particle and having a melting point lower than that of the copper. | 03-06-2014 |
20140063685 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including: a ceramic body including dielectric layers; first and second internal electrodes disposed to face each other within the ceramic body with the dielectric layer interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the ceramic body includes a capacitance forming part contributing to capacitance formation and a non-capacitance forming part provided on at least one of upper and lower surfaces of the capacitance forming part, and when the capacitance forming part is divided into three areas in a thickness direction of the ceramic body, a difference in continuity between internal electrodes in a middle area of the three areas and internal electrodes in upper and lower areas thereof is 1% to 5%. | 03-06-2014 |
20140063686 | DIELECTRIC COMPOSITION HAVING HIGH DIELECTRIC CONSTANT, MULTILAYERED CERAMIC CONDENSERS COMPRISING THE SAME, AND METHOD OF PREPARING FOR MULTILAYERED CERAMIC CONDENSERS - A dielectric composition having a high dielectric constant, multi layered ceramic condensers comprising the same, and a method of preparing for multi layered ceramic condensers. The dielectric composition includes: a compound represented by general formula (Ba | 03-06-2014 |
20140071586 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer; first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween within the ceramic body; and first and second external electrodes formed on external surfaces of the ceramic body and electrically connected to the first and second internal electrodes, wherein, when the dielectric layer is divided into three areas in a thickness direction of the ceramic body, an average size of dielectric grains in a middle area is different from that of dielectric grains in upper and lower areas, and when T | 03-13-2014 |
20140078641 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - A laminated body is divided into a large grain region and a small grain region. The large grain region is located outside the small grain region, and a boundary surface between the regions is located inside the outer surface of the laminated body while surrounding a section in which internal electrodes are present in the laminated body. To obtain the laminated body, firing is carried out with a profile in which the average rate of increase from room to the maximum temperature is 40° C./second or more. | 03-20-2014 |
20140078642 | LAMINATED CERAMIC CAPACITOR AND PRODUCING METHOD FOR LAMINATED CERAMIC CAPACITOR - A laminated ceramic capacitor having high electrostatic capacitance and excellent lifetime characteristics, even when in a high electric field intensity employs a dielectric ceramic including crystal grains and crystal grain boundaries which contains, as its main constituent, a perovskite-type compound including Ba, Ca, and Ti, and further contains Mg, R (Y, La, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, and/or Yb), and Zr, such that when the laminated body is dissolved, the contents in terms of parts by mol are Ca: 3 to 15 parts by mol, Mg: 0.01 to 0.09 parts by mol, R: 2.5 to 8.4 parts by mol, and Zr: 0.05 to 3.0 parts by mol with respect to 100 parts by mol of Ti, and there is Ca at least at the centers of the crystal grains. | 03-20-2014 |
20140085767 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including a ceramic body having first and second side surfaces opposing each other and third and fourth end surfaces connecting the first and second side surfaces, first and second internal electrodes formed in the ceramic body and having one ends exposed to the first and second side surfaces and the third end surface or exposed to the first and second side surfaces and the fourth end surface, first and second external electrodes formed on an outer side of the ceramic body and electrically connected to the first and second internal electrodes, and a plating layer partially formed on certain regions of the first and second external electrodes, wherein a polymer layer is additionally formed on the ceramic body on regions of upper portions of the first and second external electrodes on which the plating layer is not formed. | 03-27-2014 |
20140085768 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor, whose CR product can be prevented from dropping with certainty even at a thickness of 1.0 μm or less, includes multiple unit capacitors wherein a part constituted by two adjacent internal electrode layers in the laminating direction and one dielectric layer present between the two internal electrode layers is defined as a unit capacitor. The capacitances of the unit capacitors arranged in the laminating direction exhibit a distribution that gradually increases from both ends in the laminating direction toward the inside, while gradually decreasing from the two apexes of increase toward the center in the laminating direction. | 03-27-2014 |
20140085769 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor has multiple laminated dielectric ceramic layers made of a dielectric ceramic, internal electrodes formed between the dielectric ceramic layers, and external electrodes electrically connected to the internal electrodes, wherein generation of cracks in the dielectric layer due to expansion of the internal electrode is suppressed by causing ceramic grains having a crystal axis ratio c/a higher than that of the ceramic grains constituting the dielectric layer to be present in non-contiguous parts of the internal electrodes between the dielectric ceramic layers, and by harnessing the stress-mitigating effect of domain switching involving these ceramic grains. | 03-27-2014 |
20140092522 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor. The capacitor includes: a multilayer body having a dielectric layer; and first and second internal electrodes disposed in the multilayer body, the dielectric layer being disposed between the first and second internal electrodes, wherein, in a cross-section taken in a width-thickness direction of the multilayer body, an offset portion is defined as a portion where adjacent first and second internal electrodes do not overlap with each other, and a ratio (t1/td) of a width t1 of the offset portion to a thickness td of the dielectric layer is 1 to 10. | 04-03-2014 |
20140098454 | MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayered ceramic electronic component including: a ceramic body having first and second main surfaces opposing each other and first and second end surfaces opposing each other and including dielectric layers; internal electrodes disposed to face each other and having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the external electrodes include first external electrodes formed of nickel (Ni) on portions of the first and second main surfaces while covering the entirety of the first and second end surfaces of the ceramic body; and second external electrodes formed of copper (Cu) on outer surfaces of the first external electrodes. | 04-10-2014 |
20140098455 | DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC ELECTRONIC COMPONENT MANUFACTURED USING THE SAME - There are provided a dielectric composition and a multilayer ceramic electronic component manufactured using the same, the dielectirc composition including dielectric grains having a perovskite structure represented by ABO | 04-10-2014 |
20140098456 | ELECTRONIC COMPONENT - An electronic component includes a capacitor having a desired capacitance value and a laminate including a plurality of laminated insulating material layers. Land electrodes are provided on a bottom surface of the laminate. Internal conductors face the land electrodes, respectively, across the insulating material layer within the laminate, have areas larger than those of the land electrodes, respectively, and contain the land electrodes, respectively, when seen in a planar view from a z-axis direction. A capacitor conductor is provided on the positive direction side of the capacitor conductors in the z-axis direction and faces the capacitor conductors. | 04-10-2014 |
20140104747 | Internally Overlapped Conditioners - The application discloses novel internal structures of energy conditioners, assemblies of external structures of energy conditioners and mounting structure, and novel circuits including energy conditioners having A, B, and G master electrodes. | 04-17-2014 |
20140118881 | CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a capacitor, including: a first substrate: a first capacitance generation part formed on the first substrate; a protective layer formed on the first capacitance generation part; a second capacitance generation part formed on the protective layer; and a second substrate formed on the second capacitance generation part. | 05-01-2014 |
20140126104 | MULTILAYERED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - There is provided a multilayered ceramic electronic component including: a ceramic body including dielectric layers having an average thickness of 0.6 μm or less; and first and second internal electrodes, wherein the ceramic body includes a capacitance formation part and a non-capacitance formation part provided on at least one surface of upper and lower surfaces of the capacitance formation part, and when the capacitance formation part is divided into three regions in a thickness direction of the ceramic body, in a central region among the three regions, dielectric grains have an average particle size of 150 nm or less, and the number of dielectric grains per layer is 4 or more, and in upper and lower regions, dielectric grains have an average particle size of 200 nm or less, respectively, and the number of dielectric grains per layer is 3 or more. | 05-08-2014 |
20140133063 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT - In a monolithic ceramic electronic component, given that an interval between outer-layer dummy conductors adjacent to each other in an outer layer portion is d1, and that an interval between first and second inner electrodes adjacent to each other in an inner layer portion is d2, 1.7d2≦d1 is satisfied. By reducing a density of the outer-layer dummy conductors in the outer layer portion on that condition, pressing of the inner electrodes through the outer-layer dummy conductors is relieved in a pressing step before firing. As a result, a distance between the inner electrodes can be prevented from being locally shortened. It is hence possible to effectively reduce and prevent degradation of reliability of the monolithic ceramic electronic component, e.g., a reduction of BDV. | 05-15-2014 |
20140139970 | MULTILAYER CAPACITOR - An element body has a substantially rectangular parallelepiped shape whose length in a longitudinal direction and length in a width direction are larger than a length in a height direction. The element body has first and second principal faces opposed to each other in the height direction, first and second side faces opposed to each other in the width direction, and third and fourth side faces opposed to each other in the longitudinal direction. A plurality of internal electrodes are alternately arranged in the element body so as to be opposed to each other in the height direction. Each internal electrode has a main electrode portion and a leading portion. Each of a plurality of terminal electrodes has a first electrode portion arranged on the first principal face, and a second electrode portion arranged on the first side face and connected to the leading portion of each corresponding internal electrode. | 05-22-2014 |
20140139971 | Sintering of High Temperature Conductive and Resistive Pastes onto Temperature Sensitive and Atmospheric Sensitive Materials - An method of forming a metal foil coated ceramic and a metal foil capacitor is provided in a method of making a metal foil coated ceramic comprising providing a metal foil; applying a ceramic precursor to the metal foil wherein the ceramic precursor comprises at least one susceptor and a high dielectric constant oxide and an organic binder, and sintering the ceramic precursor with a high intensity, high pulse frequency light energy to form the metal foil ceramic. | 05-22-2014 |
20140146436 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - Multilayer ceramic electronic component includes: a ceramic body including dielectric layers and having first and second main surfaces, first and second side surfaces, and first and second end surfaces; a first internal electrode including a capacitance forming portion having an overlap region for forming capacitance and a first lead-out portion extended from the capacitance forming portion to be exposed to the first side surface; a second internal electrode alternately stacked with the first internal electrode, having the dielectric layer interposed therebetween, insulated from the first internal electrode, and having a second lead-out portion extended from the capacitance forming portion to be exposed to the first side surface; first and second external electrodes connected to the first and second lead-out portions, respectively; an insulation layer. | 05-29-2014 |
20140146437 | MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT - There is provided a multi-layered ceramic electronic component including a ceramic body including a dielectric layer, first and second internal electrodes disposed within the ceramic body so as to face each other, having the dielectric layer interposed therebetween, and a first external electrode electrically connected to the first internal electrodes and a second external electrode electrically connected to the second internal electrodes, wherein the first and second external electrodes include a conductive metal and glass and further include a second phase material occupying an area of 1 to 80% with respect to an area of glass in the first and second external electrodes. | 05-29-2014 |
20140146438 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - In a multilayer ceramic electronic component, when a region of a ceramic body in layers where neither of a first internal electrode and a second internal electrode is provided as viewed in a direction in which a plurality of ceramic layers are stacked on one another is defined as a non-effective layer region, a dummy lead-through conductor is arranged in the non-effective layer region so as to lead to at least two locations on portions of superficies of the ceramic body and be electrically connected to a second external electrode. When a conductive medium is brought into contact with one of a plurality of exposed edges of the dummy lead-through conductor, a current is also applied to the other exposed edges. | 05-29-2014 |
20140153154 | MULTI-LAYERED CERAMIC ELECTRONIC COMPONENT - There is provided a multi-layered ceramic electronic component including: a ceramic body including a dielectric layer and having first and second main surfaces, first and second side surfaces, and first and second end surfaces; a first internal electrode having an overlapping region to form a capacitance formation part and exposed to the first and second side surfaces, and including a first lead-out part; a second internal electrode alternately multi-layered with the first internal electrode to be exposed to the first and second side surfaces, and insulated from the first internal electrode, and including the second lead-out part; first and second external electrodes; and insulation layers formed on the first and second side surfaces, the first and second lead-out parts being regions in which the first and second internal electrodes are not overlapped with each other. | 06-05-2014 |
20140153155 | MONOLITHIC CAPACITOR - A monolithic capacitor includes a laminated body including stacked dielectric layers and substantially in the shape of a rectangular parallelepiped, and including a first surface being a mounting surface, a second surface opposite to the first surface, opposing third and fourth surfaces orthogonal to the first and second surfaces, and opposing fifth and sixth surfaces orthogonal to the first to fourth surfaces; capacitor electrodes disposed in the laminated body and each including a capacitive portion and a lead portion extending therefrom to at least one surface of the laminated body, the capacitive portions facing each other with dielectric layers interposed therebetween; and first and second outer electrodes disposed on at least one surface of the laminated body and connected to the lead portions. A gap between the first surface and the capacitive portions is greater than a gap between the second surface and the capacitive portions. | 06-05-2014 |
20140160615 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - A multilayer ceramic electronic component including: a ceramic main body including a dielectric layer and having first and second main surfaces opposing one another, first and second lateral surfaces opposing one another, and first and second end surfaces opposing one another; a first internal electrode formed within the ceramic main body, including a capacitance formation part having an overlap region to form capacitance and a first lead out portion extending from the capacitance formation part so as to be exposed to the first lateral surface; a second internal electrode alternately laminated together with the first internal electrode, having a second lead out portion extending from the capacitance formation part so as to be exposed to the first lateral surface; first and second external electrodes; and insulating layers. | 06-12-2014 |
20140160616 | MULTILAYERED CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayered ceramic capacitor including: a ceramic body; a plurality of first and second internal electrodes having first and second lead-out portions overlapped with each other, respectively, and exposed to one surface of the ceramic body; first and second external electrodes formed on one surface of the ceramic body and electrically connected to the first and second lead-out portions, respectively; and an insulating layer formed on one surface of the ceramic body to cover exposed portions of the first and second lead-out portions, wherein the first lead-out portion has a first overlap increase part of which a forward edge has an inclined surface, and the second lead-out portion has a second overlap increase part of which a forward edge has an inclined surface. | 06-12-2014 |
20140160617 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor, and a method of manufacturing the same, the multilayer ceramic capacitor including: a ceramic body; a first internal electrode; a second internal electrode; a first external electrode; a second external electrode; and an insulating layer. | 06-12-2014 |
20140160618 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes alternately formed on the plurality of dielectric layers and including first and second lead-out parts having an overlap area exposed to one surface of the ceramic body, respectively; first and second external electrodes formed on one surface of the ceramic body and electrically connected to the first and second lead-out parts, respectively; and a first insulating layer formed on one surface of the ceramic body to cover exposed portions of the first and second lead-out parts, wherein the first and second lead-out parts are formed to have concave-convex portions alternating with each other in the overlap area therebetween. | 06-12-2014 |
20140160619 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including a ceramic body including dielectric layers, and having first and second main surfaces, first and second side surfaces and first and second end surfaces; first and second internal electrodes having overlap regions forming a capacitance part, the first internal electrodes having a first lead out portion to be exposed to the first side surface, and being alternately laminated with the second internal electrodes while being insulated therefrom, the second internal electrodes having a second lead out portion; first and second external electrodes connected to the first and second lead out portions, respectively; and an insulating layer formed on the first side surface, wherein a length of the first lead out portion is longer than that of the second lead out portion and the capacitance part has different distances from the first side surface. | 06-12-2014 |
20140160620 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including: a ceramic body having first and second main surfaces, first and second side surfaces, and first and second end surfaces; a first block including first and second internal electrodes having overlap regions which form a capacitance part; one or more second blocks each including third and fourth internal electrodes having overlap regions which form a capacitance part; a first external electrode connected to the first and third lead out portions and a second external electrode connected to the second and fourth lead out portions; and an insulating layer formed on the first side surface of the ceramic body, wherein the second blocks are disposed on upper and lower parts of the first block. | 06-12-2014 |
20140160621 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic capacitor includes a ceramic body; first and second internal electrodes including first and second body parts overlapped with each other and first and second lead-out parts having an overlap region and exposed to one surface of the ceramic body; first and second external electrodes formed on one surface of the ceramic body; and an insulating layer formed on one surface of the ceramic body, wherein first and second connection surfaces extended from end portions of the first and second body parts to end portions of the first and second lead-out parts are inclined, and when half of length of the internal electrode is defined as A and length from a center of the ceramic body to a starting point of the connection surface is defined as B, B/A satisfies 0.03≦B/A≦0.90. | 06-12-2014 |
20140160622 | STACKED-TYPE MULTILAYER CERAMIC ELECTRONIC COMPONENT, STACKED-TYPE MULTILAYER CERAMIC ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING THE SAME - There is provided a stacked-type multilayer ceramic electronic component including: a ceramic body, a plurality of first and second internal, and first and second external electrodes formed on both surfaces of the ceramic element opposing one another; and first and second metal frames disposed to face one another and allowing the first and second external electrodes of the ceramic body to be attached thereto, respectively, wherein two or more ceramic bodies are attached between the first and second metal frames in a length direction of the first and second metal frames with an interval therebetween, and the respective ceramic bodies have different levels of capacitance. | 06-12-2014 |
20140160623 | MULTILAYER POLYMER DIELECTRIC FILM - A multilayer polymer dielectric film includes a stack of coextruded, alternating first dielectric layers and second dielectric layers that receive electrical charge. The first dielectric layers include a first polymer material and the second dielectric layers include a second polymer material different from the first polymer material. The first polymer material has a permittivity greater than the second polymer material. The second polymer material has a breakdown strength greater than the first polymer material. Adjoining first dielectric layers and second dielectric layers define an interface between the layers that delocalizes electrical charge build-up in the layers. The stack has substantially the crystallographic symmetry before and during receiving electrical charge. | 06-12-2014 |
20140160624 | Multi-Layered Ceramic Capacitor with Soft Leaded Module - An improved capacitor utilizing stacked MLCC's is provided. The capacitor comprising at least one MLCC sandwiched between a first lead and a second lead. Each lead comprises at least one integral lead crimp. | 06-12-2014 |
20140160625 | MULTILAYER CERAMIC DEVICE - Disclosed herein is a multilayer ceramic device including a device body having lateral surfaces and circumferential surfaces connecting the lateral surfaces, an internal electrode disposed in a length direction of the device body within the device body, an external electrode having a front portion covering the lateral surface and a band portion extending from the front portion to cover a portion of the circumferential surface, and a reinforcement pattern extending from the lateral surface toward the interior of the device body and having a length longer than a width of the band portion. | 06-12-2014 |
20140160626 | Laminated Ceramic Capacitor - A laminated ceramic capacitor that includes a laminated body that has dielectric ceramic layers including crystal grains and crystal grain boundaries and has internal electrode layers; and external electrodes on the surface of the laminated body and electrically connecting the internal electrode layers exposed at the surfaces of the laminated body. When a direct-current voltage is applied to the laminated ceramic capacitor, the voltage/current curve has a critical point dividing the curve into a first area on the lower-voltage side and a second area on the higher-voltage side, an electric field obtained by dividing the critical voltage at the critical point by the thickness of one of the dielectric ceramic layers when the voltage (V)/current (I) characteristics are measured at 25° C. is 10 V/μm or more, and the voltage/current curve has a slope of 3 or less in the second area. | 06-12-2014 |
20140168849 | MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING THE SAME - There is provided a multilayer ceramic capacitor including: a ceramic body; an active layer including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body, disposed vertically on upper and lower surfaces of the ceramic body and forming capacitance; an upper cover layer formed upwardly of the active layer; a lower cover layer formed downwardly of the active layer and having a thickness greater than that of the upper cover layer; and first and second external electrodes covering both end surfaces of the ceramic body, wherein the active layer includes a first block in which a first region I and a second region II formed, and a second block in which a third region III, and a fourth region IV formed. | 06-19-2014 |
20140177126 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including: a ceramic body; a plurality of first and second internal electrodes including first and second body portions and first and second lead out portions, respectively; first and second external electrodes formed on one surface of the ceramic body, respectively; and an insulating layer formed on one surface of the ceramic body and covering exposed portions of the first and second lead out portions, wherein inner connection portions between the first and second body portion and the first and second lead out portions may have a concave curved surface, respectively. | 06-26-2014 |
20140177127 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - There is provided a multilayer ceramic electronic component including: a ceramic body including a plurality of dielectric layers; and a plurality of first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween within the ceramic body and having different widths, wherein three or more of the plurality of first and second internal electrodes form a single block, the blocks are iteratively laminated, and when the longest distance between the uppermost internal electrode and the lowermost internal electrode, among the plurality of first and second internal electrodes | 06-26-2014 |
20140177128 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including: a ceramic body; a plurality of first internal electrodes formed within the ceramic body; a plurality of second internal electrodes alternately laminated together with the first internal electrodes with the dielectric layer interposed therebetween, insulated from the first internal electrodes, wherein a distance between the plurality of first internal electrodes | 06-26-2014 |
20140177129 | MULTILAYER CERAMIC CAPACITOR, MANUFACTURING METHOD OF THE SAME, AND CIRCUIT BOARD WITH MULTILAYER CERAMIC CAPACITOR MOUNTED THEREON - There is provided a multilayer ceramic capacitor including: a ceramic body including a dielectric layer; a first internal electrode having a first non-pattern portion and a first pattern portion having one end exposed to one or more of surfaces of the ceramic body; a second internal electrode having an overlap region with the first pattern portion with the dielectric layer interposed therebetween and having a second non-pattern portion and a second pattern portion having one end exposed to one or more of surfaces of the ceramic body; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively, wherein the first and second pattern portions have a metal oxide region having a predetermined width from an exposed end portion of a region thereof not connected to the first or the second external electrode, among exposed end portions, toward a central portion thereof, respectively. | 06-26-2014 |
20140177130 | DIELECTRIC COMPOSITION, AND MULTILAYERED CERAMIC CAPACITOR INCLUDING THE SAME AS DIELECTRIC LAYER - Disclosed herein are a dielectric composition including a compound represented by the following Chemical Formula A | 06-26-2014 |
20140185182 | SEMICONDUCTOR DEVICE WITH RUTILE TITANIUM OXIDE DIELECTRIC FILM - A capacitor structure includes a first electrode on a substrate; a TiO2 dielectric layer directly on the first electrode, wherein the TiO2 dielectric layer has substantially only rutile phase; and a second electrode on the TiO2 dielectric layer. Template layer, seed layer or pretreated layer is not required between the first electrode and the TiO2 dielectric layer. Besides, impurity doping is not required for the TiO2 dielectric layer. | 07-03-2014 |
20140185183 | DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR USING THE SAME - There is provided a multilayer ceramic capacitor, including: a ceramic body including dielectric layers; first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween within the ceramic body; a first external electrode electrically connected to the first internal electrodes; and a second external electrode electrically connected to the second internal electrodes, wherein the dielectric layer includes 40 to 99 wt % of barium titanate (BaTiO | 07-03-2014 |
20140185184 | MULTILAYER CERAMIC CAPACITOR AND MOUNTING BOARD THEREFOR - A multilayer ceramic capacitor includes: a ceramic body having dielectric layers laminated in a thickness direction, the dielectric layers having a greater width than a length; an active layer in which capacitance is formed, by including first and second internal electrodes alternately exposed to end surfaces of the ceramic body opposite to each other in a length direction with the dielectric layer interposed therebetween; upper cover layer; lower cover layers being thicker than the upper cover layer; and first and second external electrodes, wherein, when half of thickness of the ceramic body is denoted by A, thickness of the lower cover layer is denoted by B, half of thickness of the active layer is denoted by C, and thickness of the upper cover layer is denoted by D, 1.042≦(B+C)/A≦1.537 is satisfied. | 07-03-2014 |
20140185185 | METHOD FOR MANUFACTURING CERAMIC ELECTRONIC COMPONENT, AND CERAMIC ELECTRONIC COMPONENT - A raw ceramic portion is formed on each of first and second lateral surfaces of a raw ceramic body. The raw ceramic portions contain ceramic particles and more of at least one constituent selected from Ba, Mg, Mn, and a rare-earth element between the ceramic particles than the ceramic section of the raw ceramic body in terms of total amount. The raw ceramic body is fired with the raw ceramic portions thereon. In this way, a ceramic electronic component is obtained that has a main body left after the raw ceramic body is fired with the raw ceramic portions thereon. | 07-03-2014 |
20140192453 | CONDUCTIVE RESIN COMPOSITION, MULTILAYER CERAMIC CAPACITOR HAVING THE SAME, AND METHOD OF MANUFACTURING THE MULTILAYER CERAMIC CAPACITOR - There is provided a conductive resin composition including 10 to 50 wt % of a gel type silicon rubber such as polydimethylsiloxane (PDMS), and 50 to 90 wt % of conductive metal powder particles. | 07-10-2014 |
20140198427 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor whose external electrodes are each provided with a solder non-adhesion film made of material to which solder does not adhere, in a manner continuously covering the entire surface of the end face, and optionally the entire surface of the curved face thereof. The multilayer ceramic capacitor, with certainty, allows for suppression of noise accompanying electrostriction. | 07-17-2014 |
20140204502 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including a ceramic body including dielectric layers, first and second internal electrodes formed within the ceramic body and disposed to face each other, having the dielectric layer interposed therebetween, first and second electrode layers disposed on outer surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively, a conductive resin layer disposed on the first and second electrode layers and containing copper powder, a nickel plating layer disposed on an outer portion of the conductive resin layer, and a copper-nickel alloy layer disposed between the conductive resin layer and the nickel plating layer and having a thickness of 1 to 10 nm. | 07-24-2014 |
20140204503 | ELECTRICAL DEVICE - An electrical device having at least one functional element that includes a ceramic body, on which a first electrical contact layer and a second electrical contact layer are applied to two opposite-lying side faces, respectively, and the functional element is arranged between a first contact strip and a second contact strip, wherein the first contact strip and the second contact strip comprise several contact pins, respectively, and wherein the first contact layer electrically contacts at least one contact pin of the first contact strip and the second contact layer electrically contacts at least one contact pin of the second contact strip. | 07-24-2014 |
20140211367 | MULTILAYER CERAMIC CAPACITOR - With a multilayer ceramic capacitor whose average grain size of the dielectric grains present at the outermost layer position P | 07-31-2014 |
20140211368 | MULTILAYER CAPACITOR, TAPING MULTILAYER CAPACITOR SERIES, AND MOUNTING STRUCTURE OF MULTILAYER CAPACITOR - A multilayer capacitor that achieves reduced acoustic noise includes a capacitor body including a capacitance generating portion, a first outer layer portion, and a second outer layer portion. First and second internal electrodes are provided in the capacitance generating portion. The first outer layer portion is located between the capacitance generating portion and a first principle surface. The second outer layer portion is located between the capacitance generating portion and a second principle surface. The second outer layer portion is thicker than the first outer layer portion. At least one of a concave portion and a convex portion is provided on the second principle surface. | 07-31-2014 |
20140211369 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT - A monolithic ceramic electronic component includes a component body and outer electrodes. The component body includes a plurality of stacked ceramic layers and a plurality of inner electrodes which extend between the ceramic layers, which contain Ni, and which include exposed ends exposed on predetermined surfaces of the component body. The outer electrodes are electrically connected to the exposed ends of the inner electrodes and are formed on the predetermined surfaces of the component body by plating. The inner electrodes include Mg—Ni coexistence regions where Mg and Ni coexist. | 07-31-2014 |
20140233147 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including a ceramic body including dielectric layers; a plurality of internal electrodes stacked within the ceramic body, and external electrodes formed on external surfaces of the ceramic body and electrically connected to the internal electrodes, wherein the external electrodes include a metal layer and a conductive resin layer formed on the metal layer, the conducive resin layer containing a copper powder and an epoxy resin, the copper powder including a first copper powder having a content of 10 wt % or more and a particle diameter of 2 μm or greater and a second copper powder having a content of 5 wt % or more and a particle diameter of 0.7 μm or smaller, the first copper powder being a mixture of spherical powder particles and flake type powder particles. | 08-21-2014 |
20140233148 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including: a ceramic body having internal electrodes formed therein; external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes; and buffer layers formed on contact surfaces between the internal electrodes and the external electrodes, among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the internal electrode is denoted by Te, a number of laminated internal electrodes is denoted by N, a thickness of the buffer layer is denoted by t, and a width of a margin of the ceramic body in a length direction of the ceramic body is denoted by L, Te≦0.6 μm, N>200, and 3 μm≦t08-21-2014 | |
20140233149 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including a ceramic body having internal electrodes formed therein, external electrodes formed on external surfaces of the ceramic body and connected to the internal electrodes, and a buffer layer formed on surfaces of contact between the internal electrodes and the external electrodes among external surfaces of the ceramic body, in an interior direction of the ceramic body, wherein when a thickness of the external electrode is denoted by T, a thickness of the buffer layer is denoted by t, a thickness of an active region is denoted by T | 08-21-2014 |
20140233150 | MULTILAYER CERAMIC DEVICE - Disclosed herein is a multilayer ceramic device including: a device body having side surfaces spaced apart from each other and circumferential surfaces connecting the side surfaces to each other; internal electrodes disposed in a length direction of the device body in the device body; external electrodes having a front surface portion covering the side surfaces and a band portion extended from the front surface portion and covering portions of the circumferential surfaces; and crack guide patterns disposed in the device body and guiding a progress direction of a crack generated from the circumferential surfaces so that the crack is directed toward the side surface, wherein the crack guide pattern includes: a first metal pattern; and a second metal pattern disposed to be closer to the circumferential surface as compared with the first metal pattern and having gaps. | 08-21-2014 |
20140233151 | ELECTRONIC COMPONENT FABRICATION METHOD USING REMOVABLE SPACERS - An electronic component and method for manufacture thereof is disclosed. A plurality of electrodes are positioned in stacked relation to form an electrode stack. The stack may include as few as two electrodes, but more may be used depending on the number of subcomponents desired. Spacing between adjacent electrodes is determined by removable spacers during fabrication. The resulting space between adjacent electrodes is substantially filled with gaseous matter, which may be an actual gaseous fill, air, or a reduced pressure gas formed through evacuation of the space. Further, adjacent electrodes are bonded together to maintain the spacing. A casing is formed to encapsulate the stack, with first and second conducting surfaces remaining exposed outside the casing. The first conducting surface is electrically coupled to a first of the electrodes, and the second conducting surface is electrically coupled to a second of the electrodes. | 08-21-2014 |
20140240895 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic capacitor includes a ceramic body having dielectric layers laminated therein; an active layer including first and second internal electrodes alternately exposed through end surfaces of the ceramic body having the dielectric layer interposed therebetween; upper and lower cover layers formed above and below the active layer; first and second external electrodes formed on end surfaces of the ceramic body, respectively; first and second dummy patterns extended from the first and second external electrodes into margin portions of the active layer in a length direction, respectively; and first and second dummy electrodes opposing each other in a length direction within the upper and lower cover layers, the first and second dummy electrodes being extended inwardly from the first and second external electrodes. | 08-28-2014 |
20140240896 | DIELECTRIC CERAMIC COMPOSITION AND AN ELECTRONIC DEVICE THEREOF - A multilayer ceramic composition showing good characteristics, even when electric intensity on dielectric layers is high and a stacked number of a multilayer ceramic capacitor is increased, and an electronic device thereof. Said composition comprises: a perovskite compound ABO | 08-28-2014 |
20140240897 | MULTILAYER CERAMIC DEVICE - Disclosed herein is a multilayer ceramic device, including a device body having a plurality of dielectric sheets stacked on one another, the device body having spaced-apart sides and circumferential surfaces connecting the sides; internal electrodes formed on the dielectric sheets; an external electrode having a front portion to cover the sides and a band portion to extend from the front portion to cover parts of the circumferential surfaces; and a reinforcement pattern having a plurality of metal patterns arranged facing one another between the internal electrodes and the circumferential surfaces, wherein a distance between the metal patterns may be smaller than thicknesses of the dielectric sheets on which the internal electrodes are formed. | 08-28-2014 |
20140254062 | Multi layer Smectite Capacitor (MLSC) - Multilayer smectite capacitor (MLSC) provided with a new dielectric film, and a first electric and second electrode formed sandwiching it and facing each other, wherein has dielectric film. The dielectric film in this capacitor is smectite, and either or both of said first electrode and second electrode contain at least one metal selected from group consisting of Cu, Ni. Thin internal conductors are each placed between the smectite dielectric layer and arranged in parallel. The smectite dielectric layers have a thickness of about 0.6 to less than 2 micrometer. The internal conductors have a thickness of about 0.2 to 0.4 micrometer. | 09-11-2014 |
20140254063 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes ceramic grains forming a dielectric layer of the multilayer ceramic capacitor, which ceramic grains contain a coarse ceramic grain SPr having a coarse grain size Dcoa that satisfies the condition of Tmin Dcoa Tmax where Tmax is the maximum thickness of the dielectric layer and Tmin is the minimum thickness of the dielectric layer. The multilayer ceramic capacitor is capable of inhibiting deterioration of capacitance and capacity-temperature characteristics even when the internal electrode layer is made thin. | 09-11-2014 |
20140268484 | DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME - A dielectric ceramic composition includes: a base material powder Ba | 09-18-2014 |
20140268485 | CONDUCTIVE PASTE FOR EXTERNAL ELECTRODES AND MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME - There are provided a conductive paste for external electrodes and a multilayer ceramic electronic component using the same. The conductive paste includes a conductive metal powder including conductive metal particles; and a conductive amorphous metal powder including amorphous metal particles having a(Si, B)-b(Li, K)-c(V, Mn) in which a+b+c=100, 20≦a≦60, 10≦b≦40, and 2≦c≦25 are satisfied. | 09-18-2014 |
20140268486 | ELECTRONIC COMPONENT - An electronic component includes a laminated capacitor and a substrate-type terminal on which the laminated capacitor is mounted, with an viscoelastic resin located in a space between the laminated capacitor and the substrate-type terminal. The substrate-type terminal includes a substrate body, component connecting electrodes to mount the laminated capacitor are located on a component mounting surface of the substrate body, and external connecting electrodes to be connected to a circuit board are located on a substrate mounting surface of the substrate body. | 09-18-2014 |
20140268487 | ELECTRONIC COMPONENT, SUBSTRATE-TYPE TERMINAL INCLUDED THEREIN, AND ELECTRONIC COMPONENT MOUNTED STRUCTURE - A substrate-type terminal includes a first major surface with a first mounting electrode and a second mounting electrode. The substrate-type terminal includes a second major surface with a first connecting electrode and a second connecting electrode. The substrate-type terminal includes a first slit located between the first mounting electrode and the first connecting electrode, as seen in a plane, and penetrating the terminal from the first major surface to the second major surface, and a second slit located between the second mounting electrode and the second connecting electrode, as seen in a plane, and penetrating the terminal from the first major surface to the second major surface. | 09-18-2014 |
20140268488 | MONOLITHIC CAPACITOR - A monolithic capacitor includes a multilayer body including a plurality of stacked dielectric layers, first and second capacitor electrodes inside the multilayer body, and outer electrodes on at least one surface of the multilayer body. The first and second capacitor electrodes are arranged perpendicularly or substantially perpendicularly to first and second surfaces of the multilayer body. The first capacitor electrode includes a capacitor portion opposed to the second capacitor electrode with the dielectric layer interposed therebetween, a lead portion connected to one outer electrode, and an intermediate portion not opposed to the second outer electrode. The second capacitor electrode includes a capacitor portion opposed to the first capacitor electrode with the dielectric layer interposed therebetween, and a lead portion connected to the other outer electrode. The intermediate portion is arranged in a gap area that is surrounded, when viewed in a stacking direction of the dielectric layers, by imaginary lines extending from inner exposed ends of the lead portions in a direction interconnecting the first and second surfaces of the multilayer body, by the capacitor portions, and by the first surface. | 09-18-2014 |
20140268489 | DIELECTRIC CERAMIC AND LAMINATED CERAMIC CAPACITOR - A laminated ceramic capacitor which has a long high temperature load life, small variations in life, large capacitance, high electrical insulation property, and favorable capacitance temperature characteristics, even when high strength electric field is applied while reducing the thickness of dielectric ceramic layers uses a dielectric ceramic represented by the formula: 100(Ba | 09-18-2014 |
20140285946 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - There are provided a multilayer ceramic electronic component and a manufacturing method thereof, such that a high capacitance multilayer ceramic electronic component having excellent reliability through the suppression of crack generation due to a step portion and an increase in an overlapped area may be provided. | 09-25-2014 |
20140285947 | LOW-HEIGHT MULTILAYER CERAMIC CAPACITOR - A low-height multilayer ceramic capacitor offering excellent flexure strength meets the condition “t | 09-25-2014 |
20140285948 | LAMINATED CERAMIC CAPACITOR - A laminated ceramic capacitor having a laminated body composed of a plurality of ceramic layers for inner layers; a plurality of internal electrodes at the interfaces between the plurality of ceramic layers for inner layers; and a plurality of ceramic layers for outer layers, provided on the top and bottom so as to sandwich the plurality of ceramic layers for inner layers. The ceramic layers for inner layers are composed of a material containing a multiple oxide including an alkaline-earth metal. The ceramic layers for outer layers respectively have TiO | 09-25-2014 |
20140293500 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, first and second external electrodes; first and second internal electrodes formed to be spaced apart from each other; and a first floating electrode disposed alternately with the first and second internal electrodes in the ceramic body in a thickness direction and having both end portions thereof overlapped with the first and second internal electrodes, respectively, wherein the first floating electrode is disposed so that a length of portion of the first internal electrode overlapped with one end portion of the first floating electrode and a length of portion of the second internal electrode overlapped with the other end portion of the first floating electrode in the ceramic body are different. | 10-02-2014 |
20140293501 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers stacked therein, a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to both end surfaces of the ceramic body, and first and second external electrodes formed on the both end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively, wherein the second internal electrode includes a lead-out portion exposed to one end surface of the ceramic body and a capacitance formation portion overlapped with the first internal electrode, the capacitance formation portion has a length and a width smaller than those of the first internal electrode, and a connection portion connecting the lead-out portion and the capacitance formation portion of the second internal electrode to each other is forced to have a bottleneck shape. | 10-02-2014 |
20140293502 | DIELECTRIC CERAMIC COMPOSITION AND MULTI-LAYER CERAMIC CAPACITOR COMPRISING THE SAME - A dielectric ceramic composition including a base material represented by (Ba | 10-02-2014 |
20140293503 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT - A monolithic ceramic electronic component includes an outer electrode including a first plating layer formed directly on a component body by electroless plating so as to cover an exposed portion distribution region including exposed portions of a plurality of inner electrodes and a second plating layer formed by electrolytic plating so as to cover the first plating layer. An amount of extension of the first plating E1 and an amount of extension of the second plating E2 satisfy the relationship E1/(E1+E2)≦20%, where E1 represents a distance from an edge of the exposed portion distribution region to an edge of the first plating layer, and E2 represents a distance from the edge of the first plating layer to an edge of the second plating layer. | 10-02-2014 |
20140293504 | HIGH ENERGY DENSITY STORAGE DEVICE - A device and method for providing electrical energy storage of high specific energy density. The device contains a plurality of layers of high dielectric constant material, such as Barium Titanate or Hexagonal Barium Titanate, sandwiched between electrode layers made up of a variety of possible conducting materials. The device includes additional insulating layers, such as Diamond Like Carbon Coating, between the electrodes that provide for very high breakdown voltages. Layers are created by a variety of methods and assembled to form the device that is the High Energy Density Storage Device. | 10-02-2014 |
20140301012 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including: a ceramic body having first and second side surfaces opposite to each other, and third and fourth end surfaces connecting the first and second side surfaces; a plurality of internal electrodes formed in the ceramic body and having one ends thereof exposed to the third or fourth end surface; and first and second side margin parts formed from the first and second side surfaces to respective edges of the internal electrodes, the first and second side margin parts having an average thickness of 18 μm or less, wherein when a boundary surface between a cover layer and the first or second side margin part in the ceramic body is divided into two regions in a thickness direction of the ceramic body, a region adjacent to the internal electrode is S1, and a porosity of S1 is P1, 1≦P1≦20 is satisfied. | 10-09-2014 |
20140301013 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including a ceramic body having first and second side surfaces facing each other, and third and fourth end surfaces connecting the first and second side surfaces, a plurality of internal electrodes formed in the ceramic body and having one ends thereof exposed to the third end surface or the fourth end surface, and a first side margin part and a second side margin part formed such that an average thickness thereof from the first and second side surfaces to edges of the internal electrodes is 18 μm or less. | 10-09-2014 |
20140301014 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including a ceramic body having first and second side surfaces facing each other, and third and fourth end surfaces connecting the first and second side surfaces, a plurality of internal electrodes formed in the ceramic body and having one ends thereof exposed to the third end surface or the fourth end surface, and first and second side margin parts formed from the first and second side surfaces to edges of the internal electrodes, wherein in a width direction of the ceramic body, both edges of the internal electrodes include oxide regions, the oxidation regions of an internal electrode contributing to capacitance formation except for uppermost and lowermost internal electrodes among the internal electrodes have a maximum length Lmax of 3 μm or less, and a standard deviation in length is 1 μm or less. | 10-09-2014 |
20140301015 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including a ceramic body having first and second side surfaces and third and fourth end surfaces, a plurality of internal electrodes and having one ends exposed to the third or fourth end surface, and first and second side margin parts formed so that an average thickness from the first and second side surfaces to edges of the internal electrodes is 18 μm or less, wherein when the first or second side margin part is divided into two regions by a virtual line obtained by connecting mid points of distances between the edges of the internal electrodes and points at which lines extended from the internal electrodes contact the first or second side surface, when a region adjacent to the internal electrodes is defined as S1 and a porosity of S1 is defined as P1, P1 is in a range of 1 to 20 (1≦P1≦20). | 10-09-2014 |
20140301016 | CAPACITOR COMPONENT - The invention relates to a capacitor component having a first integrated capacitor (C | 10-09-2014 |
20140301017 | Capacitor Device for a Conductor Loop - The embodiments relate to a capacitor device for a conductor loop in a device for the in-situ production of heavy oil and bitumen from oil-sand deposits, characterized by a housing and a capacitor unit arranged therein to compensate for the inductive voltage drop along the conductor loop, wherein there are two connection interfaces, wherein each connection interface is designed for mechanical and electrically conductive connection between the capacitor unit and a conductor element of the conductor loop. | 10-09-2014 |
20140307362 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING BOARD THEREFOR - There are provided a multilayer ceramic electronic component and a mounting board therefor, the multilayer ceramic electronic component, including a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W | 10-16-2014 |
20140313634 | DIELECTRIC COMPOSITION, MULTILAYER CERAMIC CAPACITOR USING THE SAME, AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITOR - A dielectric composition includes a base main component including Ba and Ti and an accessory component, wherein a ratio of domain width/grain size of the dielectric composition is in the range of 0 to 0.2, a multilayer ceramic capacitor using the same, and a method for manufacturing a multilayer ceramic capacitor. It is possible to provide a dielectric composition that can implement a higher dielectric constant and good high temperature withstand voltage characteristics in the same grain size condition. It is expected that this effect can be effectively applied to the development of ultra high capacity MLCCs having a thin dielectric by implementing the same capacity while increasing the thickness of the dielectric than the case of applying the conventional dielectric material. | 10-23-2014 |
20140328004 | CAPACITOR AND METHOD TO MANUFACTURE THE CAPACITOR - One aspect is a capacitor, having a multitude of parallel insulator layers in one stack direction, made of an electrically non-conducting material, a multitude of conductor layers alternatingly stacked with the insulator layers in the direction of the stack made from a conductive material and at least one contact body. A least some of the conductor layers are connected to one another in a conductive manner via the contact body. The contact body extends through breaks form several insulator layers, where at least the insulator layers are made of a sintered material. | 11-06-2014 |
20140334062 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME - There are provided a multilayer ceramic electronic component and a board for mounting the same. The multilayer ceramic electronic component includes: a hexahedral ceramic body including dielectric layers and satisfying T/W>1.0 when a width thereof is defined as W and a thickness thereof is defined as T; first and second internal electrodes stacked to face one another, with the dielectric layer interposed therebetween, within the ceramic body; and insulating layers formed on both lateral surfaces of the ceramic body and having a thickness less than that of the ceramic body, wherein when the sum of the width of the ceramic body and widths of the insulating layers is defined as Wb, 0.90≦W/Wb≦0.97 is satisfied. | 11-13-2014 |
20140334063 | VERTICAL METAL INSULATOR METAL CAPACITOR - A method of forming a capacitor comprises forming a first electrode of the capacitor over a substrate. The first electrode includes a bottom conductive plane and a plurality of first vertical conductive structures on the bottom conductive plane. The method also comprises forming an insulating structure over the first electrode. The method further comprises forming a second electrode of the capacitor over the insulating structure. The second electrode includes a top conductive plane and a plurality of second vertical conductive structures under the top conductive plane. The first vertical conductive structures of the plurality of first vertical conductive structures and the second vertical conductive structures of the plurality of second vertical conductive structures are interlaced with each other. | 11-13-2014 |
20140340815 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There are disclosed a multilayer ceramic capacitor and a method of manufacturing the same. The multilayer ceramic capacitor includes: a ceramic body having a first side and a second side opposed to each other and having a third side and a fourth side connecting the first side to the second side, a plurality of inner electrodes formed within the ceramic body, and outer electrodes formed on the third side and the fourth side and electrically connected to the inner electrodes. A distance from distal edges of the inner electrodes to the first side or the second side of the ceramic body is 30 μm or less. | 11-20-2014 |
20140347782 | Composite Laminated Ceramic Electronic Component - A composite laminated ceramic electronic component that includes co-fired low dielectric-constant ceramic layers and high dielectric-constant ceramic layers. The low dielectric-constant ceramic layers and high dielectric-constant ceramic layers are each composed of a glass ceramic containing: a first ceramic composed of MgAl | 11-27-2014 |
20140347783 | CONDUCTIVE PASTE ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT - A conductive paste includes a metal powder, a glass frit containing a Si component, and an organic vehicle. The metal powder has a flat shape with a ratio a/b of a maximum length a to a maximum thickness b of 2.5 or more, a molar content of SiO | 11-27-2014 |
20140362492 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component, including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, having respective ones of the dielectric layers interposed therebetween, and being placed alternately to the left and to the right in a width direction of the ceramic body to be offset from one another, when the ceramic body is viewed in a width-thickness cross-sectional direction; and first and second external electrodes formed on the end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. | 12-11-2014 |
20140368967 | MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON - There is provided a multilayer ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; upper and lower cover layers; first and second external electrodes, wherein 0.75×W≦T≦1.25×W, 0.081≦b/(a×(W−b))≦2.267, and 0.267≦c/L≦0.940 are satisfied, where T denotes a thickness of the ceramic body, a denotes a thickness of the lower cover layer, b denotes a width of the first or second internal electrode, L denotes a length of the ceramic body, c denotes a distance between outer edges of the first and second external electrodes, and d denotes a distance between inner edges of the first and second external electrodes. | 12-18-2014 |
20140368968 | MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON - A multilayer ceramic capacitor may include: a ceramic body including dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; an active layer configured to form capacitance by including first and second internal electrodes disposed to face each other with the dielectric layer interposed therebetween and alternately exposed to the first or second side surface; and a first external electrode disposed on the first side surface and electrically connected to the first internal electrodes and a second external electrode disposed on the second side surface and electrically connected to the second internal electrodes. When length of the ceramic body is L and length of the first and second external electrodes in the length direction of the ceramic body is L1, 0.2≦L1/L≦0.96 is satisfied. | 12-18-2014 |
20140368969 | Three-Dimensional Laminated Wiring Substrate - A three-dimensional laminated wiring substrate is provided and includes a plurality of wiring substrates disposed on top of each other. Each of the plurality of wiring substrates includes an insulating film and a conductor pattern. The insulating film is disposed along a surface to provide a three-dimensional surface. The conductor pattern is disposed on and extending along the three-dimensional surface. | 12-18-2014 |
20140376150 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component including, a ceramic body including dielectric layers, internal electrodes disposed in the ceramic body to face each other with the dielectric layers interposed therebetween, and having an average thickness of 1.0 μm or less, and external electrodes formed on outer surfaces of the ceramic body and electrically connected to the internal electrodes, wherein at least one of the internal electrodes is formed of only a conductive metal. | 12-25-2014 |
20140376151 | METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MULTILAYER CERAMIC ELECTRONIC COMPONENT MANUFACTURED THEREBY - There is provided a method of manufacturing a multilayer ceramic electronic component, the method including: preparing a ceramic multilayer body by stacking and sintering ceramic green sheets having internal electrodes formed thereon; determining whether or not a distance d | 12-25-2014 |
20140376152 | LAMINATED CERAMIC CAPACITOR - The laminated ceramic capacitor has a laminate block made of alternately laminated ceramic dielectric layers and internal electrodes, a pair of cover layers, laminated on top and bottom of the laminate block, ceramic bodies formed on both side faces of the laminate block, and a pair of external electrodes that are electrically connected to the internal electrodes, wherein the average grain size of the ceramic dielectric grains constituting the ceramic body is smaller than the average grain size of the ceramic dielectric grains constituting the ceramic dielectric layer in the laminate block. | 12-25-2014 |
20140376153 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor including: a ceramic body; first and second internal electrodes provided within the ceramic body and including lead-out portions exposed to a first surface of the ceramic body and having an overlapping area, the overlapping area being exposed to the first surface of the ceramic body; external electrodes formed on the first surface of the ceramic body and connected to the respective lead-out portions; and an insulation layer formed on the first surface of the ceramic body and on third and fourth surfaces thereof connected to the first surface, wherein the lead-out portions have a predetermined interval from the third or fourth surface of the ceramic body. | 12-25-2014 |
20140376154 | METALLIZED FILM CAPACITOR AND CASE MOLD TYPE CAPACITOR INCLUDING SAME - A metallized film capacitor includes first and second metal electrodes, a dielectric film disposed between the first and second metal electrodes, and first and second external electrodes which are connected to the first and second metal electrodes, respectively. At least one of the first metal electrode and the second metal electrode comprises magnesium. The magnesium is distributed unevenly in the at least one of the first metal electrode and the second metal electrode. | 12-25-2014 |
20140376155 | Ceramic Electronic Component - A ceramic electronic component wherein outer electrode is placed over both end portions of a ceramic body. A first coating mainly containing Ni and a second coating containing Sn, solder, or the like are placed on a surface of the outer electrode. The outer electrode includes an end-surface portion and a side-surface turnover portion. The outer electrode includes a glass layer which is placed in a region within at least 5 μm in linear distance L from a covering end portion of the side-surface turnover portion in a direction toward the end-surface portion so as to be in contact with the ceramic body and which contains, at least, Si. The average thickness t of the glass layer is 3 μm to 10 μm. The content of a Si component is 11% by weight or more (preferably 40% by weight or less). | 12-25-2014 |
20150009604 | Dielectric Ceramic Material and Multilayer Ceramic Capacitor Using the Same - A dielectric ceramic material comprises a primary component of barium titanate (BaTiO | 01-08-2015 |
20150016013 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor including, a ceramic body; a plurality of first and second internal electrodes disposed to be alternately exposed through first and second side surfaces facing each other in a width direction; and first and second external electrodes formed on the surfaces of the ceramic body in the width and thickness directions, wherein when a length of the ceramic body is defined as L, a width of the ceramic body is defined as W, a thickness of the ceramic body is defined as h, and a length of the first or second external electrode is defined as B, a ratio L/W of the length to the width of the ceramic body satisfies 1.4≦L/W≦2.1, and a relationship B×h/L between the thickness and the width of the ceramic body and the length of the first or second external electrode satisfies B×h/L≦1.27. | 01-15-2015 |
20150016014 | MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF - There is provided a multilayer ceramic capacitor including, a ceramic body having a plurality dielectric layers stacked therein and a groove portion recessed inwardly in a lower surface thereof in a width direction, a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed through both end surfaces of the ceramic body, having the dielectric layers therebetween, and first and second external electrodes respectively formed on both end portions of the ceramic body and electrically connected to the first and second internal electrodes, respectively. | 01-15-2015 |
20150016015 | MULTI-LAYERED CAPACITOR - Disclosed herein is a multi-layered capacitor including: a multi-layered body which includes a capacity part formed by multi-layering a dielectric layer and an internal electrode and a cover part formed by multi-layering the dielectric layer; and a pair of external terminals disposed on both sides of the multi-layered body, in which the cover part is formed by multi-layering a first dielectric layer made of a ferroelectric material and a second dielectric layer made of a paraelectric material, thereby implementing thinness, miniaturization, and high capacity and increasing durability. | 01-15-2015 |
20150016016 | ARRAY-TYPE MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING BOARD THEREFOR - An array-type multilayer ceramic electronic component includes a ceramic body in which a plurality of dielectric layers are stacked in a length direction; a plurality of capacitor parts having different capacitances and including a plurality of first and second internal electrodes disposed with predetermined intervals therebetween in the length direction to be alternately exposed to both side surfaces of the ceramic body, having dielectric layers therebetween; and a plurality of first and second external electrodes disposed with predetermined intervals therebetween in the length direction and disposed on both side surfaces of the ceramic body. The plurality of respective capacitor parts include different amounts of internal electrodes stacked therein. | 01-15-2015 |
20150016017 | DIELECTRIC COMPOSITION AND MULTI-LAYERED CERAMIC CAPACITOR - A dielectric composition may include a first dielectric powder; and a second dielectric powder having an average grain size smaller than that of the first dielectric powder and included in the dielectric composition in an amount of 0.01 to 1.5 parts by weight based on 100 parts by weight of the first dielectric powder, and a multilayer ceramic capacitor formed using the same. A multilayer ceramic capacitor may include: a ceramic body including dielectric layers; first and second internal electrodes disposed in the ceramic body to face each other with the respective dielectric layers interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, respectively. The dielectric layers are formed of a dielectric composition including a first dielectric powder and a second dielectric powder having an average grain size smaller than that of the first dielectric powder and included in the dielectric composition in an amount of 0.01 to 1.5 parts by weight based on 100 parts by weight of the first dielectric powder. | 01-15-2015 |
20150016018 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - External electrodes, electrically connected to exposed portions of internal electrodes, are arranged on end surfaces of a ceramic main body of a laminated ceramic capacitor. Alloy layers of a metal contained in internal electrodes, and a metal contained in external electrodes, are arranged at the boundaries between external electrodes, and the ceramic main body and internal electrodes. Plating layers are provided on surfaces of external electrodes. A ceramic electronic component having a reduced ESR is thus provided. | 01-15-2015 |
20150016019 | MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD - A multilayer ceramic electronic component to be embedded in a board may include: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, respectively, with at least one of the dielectric layers interposed therebetween; and first and second external electrodes disposed on the end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. Each of the first and second external electrodes includes a first external electrode layer containing a glass component and disposed on the end surface of the ceramic body and a second external electrode layer being glass-free and covering the first external electrode layer. | 01-15-2015 |
20150016020 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a multilayer ceramic electronic component, including: a ceramic body formed by laminating dielectric layers having an average thickness of 0.7 μm or less; external electrodes formed on external surfaces of the ceramic body; and internal electrodes respectively disposed on the dielectric layer so as to have a gap formed therebetween, wherein, when a narrowest gap between the internal electrode edges adjacent to one another is denoted by Gmin, 10 μm≦Gmin≦60 μm is satisfied. | 01-15-2015 |
20150022940 | CONDUCTIVE PASTE COMPOSITION FOR EXTERNAL ELECTRODE AND MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING THE SAME - There is provided a conductive paste composition for an external electrode, the conductive paste composition including a polymer resin, spherical first conductive metal particles included in the polymer resin and being hollow in at least a portion thereof, and second conductive metal particles of a flake shape included in the polymer resin and being hollow in at least a portion thereof. | 01-22-2015 |
20150022941 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component includes a ceramic body including a dielectric layer; and an internal electrode formed in the ceramic body, wherein on a cross-section of the ceramic body in a width-thickness direction, a thickness Te of the internal electrode satisfies 0.1 μm≦Te≦1.0 μm, and when the internal electrode is divided into three regions including a central region and both edge regions in a width direction of the ceramic body and a ratio of an actual total length of the internal electrode corresponding to the sum of lengths of electrode portions to an ideal total length of the internal electrode is defined as connectivity S of the internal electrode, connectivity of the internal electrode in the edge regions satisfies 75%≦S≦98%, and a ratio of connectivity of the internal electrode in the edge regions to connectivity of the internal electrode in the central region is 0.9 to 0.98. | 01-22-2015 |
20150022942 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic capacitor includes a ceramic body; an active layer including a plurality of first and second internal electrodes alternately exposed to both end surfaces of the ceramic body with a dielectric layer interposed therebetween; upper and lower cover layers formed on upper and lower surfaces of the active layer; and first and second external electrodes formed on the end surfaces of the ceramic body, wherein when a thickness of the ceramic body is defined as T, a thickness of the active layer is defined as S, a thickness of the lower cover layer is defined as C, and a distance from an end of a lowermost internal electrode in a length direction to an end of a band portion of an external electrode close to the end of the lowermost internal electrode is defined A, 0.25≦S/T≦0.75 and 3≦A/C≦10 are satisfied. | 01-22-2015 |
20150022943 | MULTILAYER CERAMIC CAPACITOR TO BE EMBEDDED IN BOARD, METHOD OF MANUFACTURING THE SAME, AND METHOD OF MANUFACTURING BOARD HAVING MULTILAYER CERAMIC CAPACITOR EMBEDDED THEREIN - There is provided a multilayer ceramic capacitor to be embedded in a board, including: a ceramic body; first and second internal electrodes alternately exposed through end surfaces of the ceramic body; first and second external electrodes formed on end surfaces of the ceramic body; and first and second plating layers enclosing the first and second external electrodes, wherein when distance from one end of bands of the first or second external electrode to the other end thereof is ‘A’ and distance between points at which a virtual line drawn from a point vertically spaced apart from a surface of the first or second plating layer at a point ½×A from one end of the bands inwardly of the ceramic body by 3 μm in length direction of the ceramic body intersects points on the surface of the first or second plating layer is ‘B,’ B/A≧0.6. | 01-22-2015 |
20150022944 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component including a ceramic body including dielectric layers, internal electrodes formed in the ceramic body and including pores, and first and second external electrodes formed on both end portions of the ceramic body, wherein in a cross section of the ceramic body in length and thickness directions, when a thickness of the internal electrode is to and a thickness of the pore is tp, 0.41≦tp/te≦0.86 is satisfied. | 01-22-2015 |
20150022945 | MULTILAYER CERAMIC CAPACITOR, BOARD HAVING THE SAME MOUNTED THEREON, AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including: a ceramic body including a plurality of dielectric layers; a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to the third and fourth end surfaces, having the dielectric layers interposed therebetween; and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the first and second external electrodes include: first and second conductive glass layers; first and second conductive resin layers containing copper and an epoxy; and first and second insulating layers. | 01-22-2015 |
20150022946 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including: a ceramic body including a plurality of dielectric layers laminated in a width direction, first and second external electrodes formed on the first main surface of the ceramic body to be spaced apart from each other, third and fourth external electrodes formed on the second main surface of the ceramic body to be spaced apart from each other, a capacitor unit including a plurality of first and second internal electrodes disposed to face each other with the dielectric layers interposed therebetween within the ceramic body and electrically connected to the first to fourth external electrodes, and at least one equivalent serial resistance (ESR) control layer interposed within the ceramic body to be perpendicular to the mounting surface. | 01-22-2015 |
20150022947 | Capacitors For High Voltage Charge and High Current Discharge Rates - A capacitor including: a first conductive plate; a second conductive pate arranged parallel to the first conductive plate to define a spacing between a surface of the first conductive plate and an opposing surface of the second conductive plate; a dielectric material disposed in the plate; and a capacitor lead connected to one of the first and second conductive plates at a connection region; wherein a thickness of the space is varied in the connection region. | 01-22-2015 |
20150029637 | DIELECTRIC COMPOSITION FOR LOW-TEMPERATURE SINTERING, MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING THE SAME, AND METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT - There is provided a dielectric composition for low-temperature sintering including BaTiO | 01-29-2015 |
20150036262 | MULTILAYER CERAMIC ELECTRONIC DEVICE - A multilayer ceramic electronic device comprising a lamination in which an internal electrode layer | 02-05-2015 |
20150036263 | Multilayered Ceramic Capacitor with Improved Lead Frame Attachment - A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat. | 02-05-2015 |
20150043124 | MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREOF - There is provided a multilayer ceramic capacitor, including a ceramic body, a plurality of first and second internal electrodes, and first and second external electrodes, wherein the first and second external electrodes include first and second internal layers including first and second internal head portions and first and second internal bands formed on both main surfaces of the ceramic body, and first and second external layers including first and second external head portions and first and second external bands formed on the first and second internal bands and having a distance shorter than a distance of the first and second internal bands, the first and second external layers having viscosity higher than that of the first and second internal layers. | 02-12-2015 |
20150043125 | MULTILAYER CERAMIC ELECTRONIC PART, BOARD HAVING THE SAME MOUNTED THEREON, AND MANUFACTURING METHOD THEREOF - A multilayer ceramic electronic part may include: a ceramic body; an active layer including a plurality of first and second internal electrodes disposed to be alternately exposed to both end surfaces of the ceramic body, having the dielectric layer therebetween; an upper cover layer formed on an upper portion of the active layer; a lower cover layer formed on a lower portion of the active layer and having a thickness thicker than that of the upper cover layer; and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the first and second external electrodes include: first and second conductive layers extended from both end surfaces of the ceramic body onto upper and lower main surfaces thereof; and first and second insulation layers formed on the first and second conductive layers disposed on both end surfaces of the ceramic body. | 02-12-2015 |
20150049412 | MULTILAYER CERAMIC CAPACITOR, METHOD OF MANUFACTURING THE SAME, AND PRESSING PLATE FOR MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor, including: a ceramic body including a plurality of dielectric layers stacked therein; first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having each of the dielectric layers disposed therebetween; and first and second external electrodes formed on the end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively, wherein a difference in rigidity between upper and lower portions of the ceramic body is 4% or less. | 02-19-2015 |
20150049413 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a ceramic main body including an inner layer portion including third ceramic layers and a plurality of inner electrodes arranged at interfaces between the third ceramic layers, and first and second outer layer portions respectively including first and second ceramic layers, the first and second ceramic layers being arranged vertically so as to sandwich the inner layer portion. The third ceramic layers and the first and second outer layer portions contain a perovskite-type compound represented by ABO | 02-19-2015 |
20150055273 | LAMINATE-TYPE CERAMIC ELECTRONIC COMPONENT - A laminate-type ceramic electric component such as laminated ceramic capacitor which has excellent mechanical strength and also has thermal shock resistance at the same time is provided. A laminate-type ceramic electronic component comprises an inner layer part, in which dielectric layers comprising ABO | 02-26-2015 |
20150062774 | DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME - There are provided a dielectric ceramic composition and a multilayer ceramic capacitor including the same. The dielectric ceramic composition according to embodiments of the present disclosure includes a base powder represented by xSrTiO | 03-05-2015 |
20150062775 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor highly useful in suppressing noise in a mounted state includes a capacitor body of a multilayer ceramic capacitor. The capacitor body integrally has: a capacitive part constituted by multiple internal electrode layers stacked in the height direction via dielectric layers; a top protective part made of a dielectric and positioned on the top side of the top internal electrode layer among the multiple internal electrode layers; and a bottom protective part made of a dielectric and positioned on the bottom side of the bottom internal electrode layer among the multiple internal electrode layers; wherein the thickness Tc of a bottom protective part is greater than the thickness Tb of a top protective part so that the capacitive part is disproportionately positioned in the upper side of the capacitor body in its height direction. | 03-05-2015 |
20150070816 | CAPACITOR FABRICATION USING NANO MATERIALS - A multi-layer capacitor includes an anode, a cathode, a dielectric material, a first endcap, and a second endcap. The anode and cathode are formed of one or more layers of interlaced conductive material. The dielectric material is interposed between each of the layers of the anode and the cathode. The first and second endcaps configured to interconnect each of the layers of the anode and cathode, respectively. The endcaps are formed of conductive nano material. A method of forming an endcap of a capacitor configured to interconnect one or more layers of conductive material includes the step of applying conductive nano material to exposed conductive surfaces of at least one of an anode and a cathode of the one or more layers of conductive material. The method also includes the step of exposing the nano material to a source of energy effective to initiate self-sintering of the nano material. | 03-12-2015 |
20150070817 | MULTI-LAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A multi-layer ceramic capacitor has a structure where the dispersion, nd, of average grain size of the dielectric grains constituting the dielectric layer (a value (D90/D10) obtained by dividing D90 which is a grain size including 90% cumulative abundance of grains by D10 which is a grain size including 10% cumulative abundance of grains) is smaller than 4. | 03-12-2015 |
20150070818 | INKJET INK, PRINTING METHOD, AND CERAMIC ELECTRONIC COMPONENT - An inkjet ink that contains a functional particle having a BET-equivalent particle diameter of 50 to 1000 nm, a rheology-controlling particle having a BET-equivalent particle diameter of 4 to 40 nm, and an organic vehicle. The ink has a viscosity of 1 to 50 mPa·s at a shear rate of 1000 s | 03-12-2015 |
20150077898 | MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic capacitor including a ceramic body including a plurality of dielectric layers, a plurality of first and second internal electrodes disposed in the ceramic body to be alternately exposed to first and second end surfaces of the ceramic body, having the dielectric layer therebetween, first and second electrode layers electrically connected to the first and second internal electrodes, respectively, a conductive resin layer formed on the first and second electrode layers and in regions of the ceramic body adjacent to the first and second electrode layers, and a coating layer formed between a portion of an outer surface of the ceramic body on which the conductive resin layer is to be formed and the conductive resin layer. | 03-19-2015 |
20150085422 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic capacitor includes a ceramic body including dielectric layers; first and second internal electrodes facing each other while having the dielectric layer disposed therebetween, and alternately exposed to end surfaces of the ceramic body; first and second external electrodes electrically connected to the first and second internal electrodes, wherein each of the first and second external electrodes includes a first external electrode layer formed of material containing copper and glass and extending from an end surface of the ceramic body to portions of main and side surfaces of the ceramic body; a second external electrode layer formed of material containing glass, disposed on the first external electrode layer, and being shorter than the first external electrode layer to expose portion of the first external electrode layer; and a third external electrode layer formed of material containing copper and glass and covering the first and second external electrode layers. | 03-26-2015 |
20150092316 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic electronic component includes a ceramic body including internal electrodes and dielectric layers, and an electrode layer disposed on at least one surface of the ceramic body and electrically connected to the internal electrodes. A conductive resin layer containing metal particles and a base resin is disposed on the electrode layer. When a weight ratio of metal to carbon in a surface portion of the conductive resin layer is defined as A, and a weight ratio of metal to carbon in an internal portion of the conductive resin layer is defined as B, A is greater than B. | 04-02-2015 |
20150098165 | CONDUCTIVE PASTE, MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING SAME - A conductive paste that includes a (meth)acrylic resin serving as a binder resin, an organic solvent, and a metal powder. The (meth)acrylic resin has a glass transition point Tg in the range of −60° C. to 120° C., a hydroxyl group content in the range of 0.01% to 5% by weight per molecule, an acid value in the range of 1 to 50 mgKOH/g, and a weight-average molecular weight in the range of 10,000 to 350,000 Mw. | 04-09-2015 |
20150098166 | DIELECTRIC COMPOSITION AND MULTILATER CERAMIC ELECTRONIC COMPONENT MANUFACTURED USING THE SAME - There are provided a dielectric composition and a multilayer ceramic electronic component manufactured using the same, the dielectric composition including a dielectric grain having a perovskite structure represented by ABO | 04-09-2015 |
20150103465 | ULTRA THIN FILM CAPACITOR AND MANUFACTURING METHOD THEREOF - Disclosed herein are an ultra thin film capacitor and a manufacturing method thereof. According to an exemplary embodiment of the present invention, there is provided an ultra thin film capacitor including: a substrate; a dielectric unit formed of thin film dielectric layers alternately stacked with a plurality of internal electrode layers on the substrate; an internal electrode unit formed of the plurality of internal electrode layers alternately stacked with the thin film dielectric layers in the dielectric unit on the substrate, the internal electrode layer including first electrode layers and a second electrode layer made of material having a specific resistance lower than that of the first electrode layer; and via electrodes formed at both sides of the internal electrode unit on the substrate and each being electrically connected alternately with the stacked internal electrode layers. Further, the manufacturing method thereof is proposed. | 04-16-2015 |
20150103466 | Ceramic Multi-Layered Capacitor - A ceramic multi-layer capacitor includes a main body, which has ceramic layers arranged along a layer stacking direction to form a stack, and first and second electrode layers arranged between the ceramic layers. The multi-layer capacitor also includes a first external contact-connection arranged on a first side surface of the main body and electrically conductively connected to the first electrode layers, and a second external contact-connection arranged on a second side surface ( | 04-16-2015 |
20150103467 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic capacitor includes a multilayer body including a plurality of stacked dielectric layers including a dielectric ceramic that includes a plurality of crystal grains and a plurality of internal electrodes disposed at a plurality of interfaces between the dielectric layers, and external electrodes. The multilayer body includes a Ba and Ti containing perovskite compound, La, Mg, Mn and Al, and satisfies conditions such that in a case in which a content of Ti is set to 100 molar parts, a fraction of each content of La, Mg, Mn and Al relative to the content of Ti is such that La is about 0.2 to about 1.2 molar parts, Mg is about 0.1 molar part or less, Mn is about 1.0 to about 3.0 molar parts and Al is about 0.5 to about 2.5 molar parts, and an average number of crystal grains included in each of the dielectric layers in the stacking direction is one or more to three or less. | 04-16-2015 |
20150109717 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic capacitor includes a multilayer body including a plurality of stacked dielectric layers including a dielectric ceramic that includes a plurality of crystal grains and a plurality of internal electrodes disposed at a plurality of interfaces between the dielectric layers, and external electrodes. The multilayer body includes a Ba and Ti containing perovskite compound, La, Mg and Mn, and satisfies conditions such that in a case in which a content of Ti is set to 100 molar parts, a fraction of each content of La, Mg and Mn relative to the content of Ti is such that La is about 1.2 to about 6.0 molar parts, Mg is about 0.5 to about 5.0 molar parts and Mn is about 1.0 to about 3.0 molar parts, and an average number of crystal grains included in each of the dielectric layers in the stacking direction is one or more to three or less. | 04-23-2015 |
20150116894 | PLZT CAPACITOR ON GLASS SUBSTRATE - A lead-lanthanum-zirconium-titanate (PLZT) capacitor on a substrate formed of glass. The first metallization layer is deposited on a top side of the substrate to form a first electrode. The dielectric layer of PLZT is deposited over the first metallization layer. The second metallization layer deposited over the dielectric layer to form a second electrode. The glass substrate is advantageous as glass is compatible with an annealing process used to form the capacitor. | 04-30-2015 |
20150116895 | CONDUCTIVE PASTE COMPOSITION FOR EXTERNAL ELECTRODE, MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME, AND MANUFACTURING METHOD THEREOF - There are provided a conductive paste composition for an external electrode, a multilayer ceramic electronic component using the same, and a manufacturing method thereof, and more specifically, a conductive paste composition for an external electrode, allowing for decreased blister and glass beading defects by improving a removal of residual carbon at low temperature before necking between metal particles is generated and the metal particles are densified during a firing process of the external electrode, a multilayer ceramic electronic component using the same, and a manufacturing method thereof. | 04-30-2015 |
20150116896 | MONOLITHIC CERAMIC CAPACITOR - A monolithic ceramic capacitor includes an element body including a multilayer portion including a plural conductor layers and plural ceramic dielectric layers alternately stacked in a thickness direction. The element body is divided in the thickness direction into thickness-direction first and outer layer portions made of the ceramic dielectric layers, and a thickness-direction inner layer portion including the multilayer portion. The element body bulges to the outer side at a center portion in a length direction, and center portions in the length direction of the plural conductor layers are curved to the outer side. The thickness of a portion of the first outer layer portion adjacent to a first extension portion is larger than the thickness of a center portion thereof, and the thickness of a portion of the second outer layer portion adjacent to a second extension portion is larger than the thickness of a center portion thereof. | 04-30-2015 |
20150116897 | ELECTRONIC COMPONENT - In an electronic component, a first terminal electrode is disposed on a first side surface and extends to a second principal surface. A second terminal electrode is disposed on a second side surface and extends to the second principal surface. A third terminal electrode is disposed on a third side surface and extends to the second principal surface. A fourth terminal electrode is disposed on a fourth side surface and extends to the second principal surface. Maximum values of thicknesses of portions located on the second principal surface of the third and fourth terminal electrodes are smaller than maximum values of thicknesses of portions located on the second principal surface of the first and second terminal electrodes. | 04-30-2015 |
20150116898 | MONOLITHIC CERAMIC CAPACITOR - A monolithic ceramic capacitor includes an element body having therein a multilayer portion formed of a plurality of conductor layers and a plurality of ceramic dielectric layers alternately stacked in a thickness direction; and a first outer electrode and a second outer electrode provided on an outer portion of the element body. The element body is divided in the thickness direction into a thickness-direction first outer layer portion, a thickness-direction second outer layer portion, and a thickness-direction inner layer portion located between the thickness-direction first outer layer portion and the thickness-direction second outer layer portion and including the multilayer portion. A first conductor layer and a second conductor layer, which are outermost layers among the plurality of conductor layers, have lower conductor densities than any of conductor densities of the other conductor layers. | 04-30-2015 |
20150116899 | ELECTRONIC COMPONENT - An electronic component has dimensions (length×width×thickness) of about 0.6 mm to about 1.0 mm×about 0.3 mm to about 0.5 mm×about 0.07 mm to about 0.15 mm. An area of a triangle defined by a first hypothetical straight line being in contact with the top of a portion of an outer electrode positioned on a first main surface at a center in the width direction and extending in the length direction, a second hypothetical straight line being in contact with the top of a portion of the outer electrode positioned on the first end surface at the center in the width direction and extending in the thickness direction, and a third hypothetical straight line being in contact with the outer electrode at the center in the width direction and being inclined at about 45° with respect to the first and second hypothetical straight lines is about 450 μm | 04-30-2015 |
20150116900 | LAMINATED ELECTRONIC COMPONENT MANUFACTURING METHOD, AND LAMINATED ELECTRONIC COMPONENT - In a method of manufacturing a laminated electronic component, a position of a second green sheet with respect to a first green sheet is determined such that an overall width of a first portion printed on the first green sheet and a second portion printed on the second green sheet becomes substantially equal to a width of the first portion or a width of the second portion. | 04-30-2015 |
20150116901 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a first fired electrode layer disposed on top of a ceramic body. The first fired electrode layer includes first to fifth portions that are separate from each other. The first portion is disposed on top of a first end surface. The second portion is disposed on top of a first principal surface. The third portion is disposed on top of a second principal surface. The fourth portion is disposed on top of a first side surface. The fifth portion is disposed on top of a second side surface. | 04-30-2015 |
20150116902 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOTHER CERAMIC MULTILAYER BODY - A multilayer ceramic electronic component includes a ceramic body, first and second outer electrodes, and a plurality of first and second inner electrodes opposing each other across ceramic layers in a lamination direction of the ceramic body. At least two inner electrodes among the plurality of first and second inner electrodes include bent portions on lead-out regions as portions on which the plurality of first inner electrodes and the plurality of second inner electrodes do not oppose each other across the ceramic layers in the lamination direction, and vertexes of the bent portions of the inner electrodes adjacent in the lamination direction are at different positions in a lead-out direction. | 04-30-2015 |
20150116903 | COMPOSITE SHEET, MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING THE MULTILAYER CERAMIC ELECTRONIC COMPONENT - A composite sheet includes a ceramic green sheet having a lengthwise direction and a conductor film printed on the ceramic green sheet. The conductor film has a shape that has a longitudinal dimension extending in the lengthwise direction and a lateral dimension perpendicular or substantially perpendicular to the longitudinal direction. The conductor film includes a plurality of thickness-varied regions arranged in a row or a plurality of rows extending in the lengthwise direction while being dispersed in the lengthwise direction. The thickness-varied regions have a thickness that is different from a thickness of a portion of the conductor film excluding the thickness-varied regions. | 04-30-2015 |
20150124371 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor may have low equivalent series inductance (ESL), in which via electrodes are opposed to each other diagonally and be off-centered from positions corresponding to center points of external electrodes, so that a distance between the via electrodes is significantly reduced and a current path is reduced. | 05-07-2015 |
20150124372 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A multilayer ceramic electronic component including: a ceramic body having a plurality of dielectric layers stacked therein; active layers including a plurality of first and second internal electrodes formed to be alternately exposed to both end surfaces of the ceramic body with the dielectric layers interposed therebetween; and first and second external electrodes formed on the both end surfaces of the ceramic body and electrically connected to the first and second internal electrodes, respectively. The active layers may include a first active layer including a ferroelectric layer and a second active layer including a paraelectric layer, the first and second active layers being alternately stacked. | 05-07-2015 |
20150131199 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A multilayer ceramic electronic component may include a ceramic body having a plurality of dielectric layers stacked in the ceramic body; a plurality of active layers including first and second internal electrodes disposed to be alternately exposed to the end surfaces of the ceramic body with the dielectric layers interposed between the first and second internal electrodes; and dummy layers disposed between the active layers. | 05-14-2015 |
20150131200 | CERAMIC MATERIAL AND CAPACITOR COMPRISING THE CERAMIC MATERIAL - A ceramic material for capacitors uses multilayer technology of the general formula: Pb | 05-14-2015 |
20150131201 | LAMINATED CERAMIC CAPACITOR - A laminated ceramic capacitor is characterized in that when the section constituted by two internal electrode layers positioned adjacent to each other in the laminating direction and one dielectric layer present between the two internal electrode layers is considered a unit capacitor, then the respective capacitances of the unit capacitors arranged in the laminating direction are distributed in such a way the capacitance at the center in the laminating direction is lower than the capacitances at both ends in the laminating direction. The laminated ceramic capacitor is resistant to deterioration of insulation resistance. | 05-14-2015 |
20150131202 | CERAMIC ELECTRONIC COMPONENT - The present invention is ceramic electronic component with metal terminals comprising a chip component of approximately parallelepiped shape having a pair of terminal electrodes, and a pair of metal terminal parts provided in accordance with said terminal electrodes. The terminal electrode is formed by wrapping around a part of side faces from an end face of the chip component. The metal terminal part comprises a connecting part connecting to the terminal electrode and including a connecting face extending approximately parallel to the end face, plurality of joint parts connecting to the connecting part and including a joint face extending in a different direction of the connecting face, and plurality of mounting parts connecting to the joint parts and including a mounting part upper face extending approximately parallel to any one of the side faces which is different direction of the joint face by taking predetermined spaces. | 05-14-2015 |
20150146340 | MULTILAYER CERAMIC CAPACITOR INCLUDING AT LEAST ONE SLOT - An apparatus includes a two-terminal MLCC. The two-terminal MLCC includes a conductive layer, where the conductive layer includes at least one slot. The apparatus may also include a second conductive layer that includes at least one slot and an insulating layer that separates the two conductive layers. In one example, a first (e.g., positive) terminal of the two-terminal MLCC is formed by a first set of plates, where each plate in the first set includes at least one slot. A second (e.g., negative) terminal of the two-terminal MLCC is formed by a second set of plates, where each plate in the second set also includes at least one slot. The first set of plates and the second set of plates are interleaved, and each pair of plates is separated by an insulating layer. | 05-28-2015 |
20150146341 | ALD dielectric films with leakage-reducing impurity layers - A thin sub-layer (<15 Å) of an impurity is formed under, over, or inside a thicker layer (˜30-100 Å) of a high-k (k>12) host material. The sub-layer may be formed by atomic layer deposition (ALD). The layer and sub-layer are annealed to form a composite dielectric layer. The host material crystallizes, but the crystalline lattice and grain boundaries are disrupted near the impurity sub-layer, impeding the migration of electrons. The impurity may be a material with a lower dielectric constant than the high-k material, added in such a small relative amount that the composite dielectric is still high-k. Metal-insulator-metal capacitors may be fabricated by forming the composite dielectric layer between two electrodes. | 05-28-2015 |
20150146342 | Multi-Layer Component Having an External Contact and Method for Producing a Multi-Layer Component Having an External Contact - A multi-layer component has a base body that has a stack made of dielectric layers and internal electrode layers. An external contact is in electrical contact with the electrode layers. The external contact has a first layer and a second layer, where the first layer and the second layer are burned-in. | 05-28-2015 |
20150146343 | CAPACITIVE STRUCTURE - The invention relates to a capacitive structure comprising: first and second components, at least one component comprising a plurality of capacitive layers of a dielectric, each layer arranged between electrodes of different polarity, wherein the first and second components are arranged in a stack separated by a stress reducing layer having a supporting structure with an open mesh in which air acts to reduce the transmissibility of cracks through the stress reducing layer. | 05-28-2015 |
20150146344 | CERAMIC CAPACITOR FOR SUPPRESSING HIGH-FREQUENCY NOISE - According to an embodiment, first and second internal electrode layers are alternatively interposed between dielectric layers to form a laminated capacitor. The first internal electrode layer have a first base portion connected to a first external electrode, and is extended from the first base portion toward a second external electrode. The second internal electrode layer have a base portion connected to the second external electrode, and is extended from the second external electrode toward the first external electrode. The second internal electrode layer is formed in a deformation pattern which allows a path length greater than a length between the first and the second external electrode so that an open stub producing an open stub resonance is formed. | 05-28-2015 |
20150146345 | Methods for Forming Electrically Precise Capacitors, and Structures Formed Therefrom - High precision capacitors and methods for forming the same utilizing a precise and highly conformal deposition process for depositing an insulating layer on substrates of various roughness and composition. The method generally comprises the steps of depositing a first insulating layer on a metal substrate by atomic layer deposition (ALD); (b) forming a first capacitor electrode on the first insulating layer; and (c) forming a second insulating layer on the first insulating layer and on or adjacent to the first capacitor electrode. Embodiments provide an improved deposition process that produces a highly conformal insulating layer on a wide range of substrates, and thereby, an improved capacitor. | 05-28-2015 |
20150294792 | Multi-Layer Capacitor and Method for Producing a Multi-Layer Capacitor - A multi-layer capacitor has dielectric layers and electrode layers arranged therebetween. The multi-layer capacitor has a number of segments that are connected to one another. At least one relief region is provided between the segments. The invention furthermore provides a method for producing such a multi-layer capacitor. | 10-15-2015 |
20150299046 | DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR CONTAINING THE SAME - A dielectric ceramic composition may include a base powder represented by (1−x)BaTiO | 10-22-2015 |
20150299047 | DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR CONTAINING THE SAME - A dielectric ceramic composition may include a base powder represented by (1−a)[(1−x)BaTiO | 10-22-2015 |
20150299048 | DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR CONTAINING THE SAME - A dielectric ceramic composition may include: a base powder represented by BaTiO | 10-22-2015 |
20150310989 | MULTI-LAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A multi-layer ceramic capacitor is constituted by ceramic dielectric layers alternately laminated with conductive layers, wherein the ceramic dielectric layers are sintered in such a way that core-shell grains having a core-shell structure are mixed with uniform solid-solution grains resulting from uniform progression of the solid solution process. Such multi-layer ceramic capacitor is characterized in that the area ratio of the core-shell grains to all sintered grains constituting the ceramic dielectric layer is 5 to 15% and that the average grain size of all sintered grains including the core-shell grains and uniform solid-solution grains is 0.3 to 0.5 μm. | 10-29-2015 |
20150310991 | MULTI-LAYERED CERAMIC CAPACITORS - This application relates to multi-layered ceramic capacitors (MLCC) that can be surface mounted, include multiple terminals, and handle multiple voltages. The MLCC can include electrode and dielectric layers that are stacked in parallel to a printed circuit board (PCB) on which the MLCC can be attached. A set of primary conductive pads can be formed on the bottom of the MLCC in order to create a conductive interface between the PCB and the MLCC. Secondary conductive pads are formed on the side of the MLCC, and can extend perpendicular to the PCB. The secondary conductive pads are created by stacking internal electrode plates together and connecting them electrically and mechanically to each another. This arrangement provides for multiple voltages and electrical connections at the MLCC while reducing reverse piezoelectric and/or electro-striction noise. | 10-29-2015 |
20150311275 | EMBEDDED SHEET CAPACITOR - A multilayer capacitor is provided that includes a plurality of vias configured to receive interconnects from a die. | 10-29-2015 |
20150318109 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic electronic component may include: a plurality of active parts including a plurality of dielectric layers and a plurality of internal electrodes that are alternately disposed, the plurality of active parts being stacked; an interlayer margin part disposed between the active parts adjacent to each other and containing magnesium; an upper cover part disposed on an upper portion of an uppermost active part among the plurality of active parts and containing magnesium; and a lower cover part disposed on a lower portion of a lowermost active part among the plurality of active parts and containing magnesium, wherein the upper and lower cover parts and the interlayer margin part include magnesium-nickel oxide layers formed on interfaces thereof adjacent to the active parts. | 11-05-2015 |
20150318110 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - A multilayer ceramic electronic component may include: a ceramic body including an active part in which dielectric layers and internal electrodes are alternately disposed, an upper cover part disposed on an upper portion of the active part, and a lower cover part disposed on a lower portion thereof; a first dummy electrode disposed between a central portion of the upper or lower cover part in a length direction and one end surface of the cover part in the length direction; and a second dummy electrode disposed between the central portion of the upper or lower cover part in the length direction and the other end surface of the cover part in the length direction, and spaced apart from the first dummy electrode. | 11-05-2015 |
20150318111 | PASTE FOR EXTERNAL ELECTRODE, MULTILAYER CERAMIC ELECTRONIC COMPONENT, AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic electronic component may include: a ceramic body including a plurality of dielectric layers; internal electrodes disposed in the ceramic body and having one ends exposed to outer surfaces of the ceramic body; and external electrodes disposed on the outer surfaces of the ceramic body to be connected to the respective one ends of the internal electrodes and containing a conductive metal and a conductive ceramic powder. | 11-05-2015 |
20150325371 | MULTILAYER CAPACITOR AND USAGE METHOD THEREFOR - A multilayer capacitor includes a multilayer body including a dielectric layer, first through third inner electrodes, and first and second capacitor sections, and first through third outer electrodes on surfaces of the multilayer body. The first capacitor section is electrically connected between the first and second outer electrodes. The second capacitor section is electrically connected between the second and third outer electrodes. The first, second, and third inner electrodes are connected to the first, second, and third outer electrodes, respectively. The first and third inner electrodes oppose each other with the dielectric layer therebetween, thus defining the first capacitor section. The second and third inner electrodes oppose each other with the dielectric layer therebetween, thus defining the second capacitor section. | 11-12-2015 |
20150325373 | MULTILAYER CERAMIC CAPACITOR - There is provided a multilayer ceramic capacitor in which an increase in conductor resistance at an end of an internal electrode layer is suppressed, and in which a gap between the internal electrode layer and a dielectric layer is reduced. A multilayer ceramic capacitor includes a stacked body including dielectric layers and internal electrode layers alternately laminated; and an external electrode disposed on an end surface of the stacked body and connected to the internal electrode layers, the internal electrode layers each including a connection electrode portion connected to the external electrode, and an internal electrode portion which is connected to the connection electrode portion and extends toward an inner side of the stacked body, a ratio of a material having a melting point higher than that of a conductive material being higher in the connection electrode portion than in the internal electrode portion. | 11-12-2015 |
20150325377 | LAMINATED CERAMIC ELECTRONIC COMPONENT - A laminated ceramic electronic component includes a ceramic body, first and second inner electrodes within the ceramic body and including opposed portions opposed to each other in the thickness direction of the ceramic body, a first terminal electrode electrically connected to the first inner electrode, and a second terminal electrode electrically connected to the second inner electrode. The widthwise distance between first widthwise edges and second widthwise edges of the first and second terminal electrodes are smaller, in plan view, than widths of the first and second inner electrodes at the opposed portions. | 11-12-2015 |
20150332855 | MULTILAYER FILM - The present invention aims to provide a multilayer film which can increase the capacitance. The present invention relates to a multilayer film including a first electrode layer, a resin substrate, a second electrode layer, and a dielectric layer stacked in the order set forth. The dielectric layer includes a vinylidene fluoride/tetrafluoroethylene copolymer (A). The copolymer (A) satisfies a mole ratio (vinylidene fluoride)/(tetrafluoroethylene) of 97/3 to 60/40. | 11-19-2015 |
20150340155 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a ceramic body and external electrodes provided on opposite end surfaces of the ceramic body. The ceramic body includes an inner layer portion including a plurality of ceramic layers defining inner layers and a plurality of first and second internal electrodes each disposed at an interface of adjacent ones of the ceramic layers defining the inner layers, outer layer portions sandwiching the inner layer portion in a direction in which the layers are stacked, and side margin portions sandwiching the inner layer portion and the outer layer portions in a widthwise direction. The side margin portion includes pores that decrease in number along a direction from inside to outside of the ceramic body. | 11-26-2015 |
20150340156 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a ceramic body, and external electrodes on opposite side surfaces of the ceramic body. The ceramic body includes an inner layer portion including a plurality of ceramic layers, and first and second internal electrodes each arranged at interfaces between the ceramic layers defining the inner layer portion, and also includes outer layer portions arranged on an upper surface and a lower surface of the inner layer portion. The ceramic layers defining the inner layer portion include as a main component a perovskite-type compound containing Ba and Ti. The amount of Mg contained in the ceramic layers defining the inner layer portion preferably is 0 to about 0.4 part by mole per 100 parts by mole of Ti, for example. The thickness of the ceramic layers defining the inner layer portion preferably is not more than about 0.55 μm, for example. | 11-26-2015 |
20150348713 | CERAMIC ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME - A ceramic electronic component which is easily downsized, has reduced difficulty in handling, and is hardly chipped in a chip; and a method for producing the ceramic electronic component. The method includes the steps of: forming an uncured ceramic pattern which forms a ceramic layer after firing and has a circular plane shape by applying a ceramic slurry, which contains a ceramic material, to a predetermined location one time or a plurality of times repeatedly using a non-contact-type printing device such as an ink-jet printer; and forming uncured internal electrode patterns which form internal electrodes after firing and each have a circular plane shape by applying an electrode paste, which contains an internal electrode material, to a predetermined location one time or a plurality of times repeatedly using an ink-jet printer. | 12-03-2015 |
20150357120 | VERTICAL CAPACITORS WITH SPACED CONDUCTIVE LINES - A capacitor structure includes a first metal layer including a first plurality of horizontally-spaced neutral conductive lines positioned horizontally between a first plurality of horizontally-spaced high voltage conductive lines. The capacitor structure further includes a second metal layer including a second plurality of horizontally-spaced neutral conductive lines positioned horizontally between a second plurality of horizontally-spaced high voltage conductive lines. The capacitor structure further includes a third metal layer positioned vertically below the first metal layer and above the second metal layer, the third metal layer including a third plurality of horizontally-spaced neutral conductive lines positioned horizontally between a first plurality of horizontally-spaced low voltage conductive lines. The first plurality of low voltage lines are positioned vertically between the first and second plurality of neutral lines. | 12-10-2015 |
20150364256 | CONDUCTIVE RESIN PASTE AND CERAMIC ELECTRONIC COMPONENT - A conductive resin paste that includes a conductive component and a resin component, where the conductive component includes at least Ag and Cu, and the proportion of the Ag to the total amount of the Ag and Cu included in the conductive component falls within the range of 11.6 mass % to 28.8 mass %. As the conductive component, an Ag-coated Cu powder is used which has a Cu powder with a surface at least partially coated with Ag. | 12-17-2015 |
20150364257 | WOUND/STACKED CERAMIC FILM CAPACITORS, METHOD FOR MAKING CERAMIC FILM CAPACITORS - The invention provides a process for making ceramic film capacitors, the process comprising supplying a flexible substrate, depositing a first electrode on a first region of the flexible substrate, wherein the first electrode defines a first thickness, overlaying the first electrode with a dielectric film; and depositing a second electrode on the ceramic film, wherein the second electrode defines a second thickness. Also provided is a capacitor comprising flexible substrate, a first electrode deposited on said flexible substrate, a dielectric overlaying the first electrode; and a second electrode deposited on said dielectric. | 12-17-2015 |
20150364258 | LAMINATED CAPACITOR AND LAMINATED CAPACITOR SERIES AND LAMINATED CAPACITOR MOUNTED BODY INCLUDING CAPACITOR - In a laminated capacitor, a distance between an inner internal electrode at a first principal surface side, from a pair of internal electrodes that sandwich an effective dielectric layer located closest to a second principal surface side in a first sub-electrostatic capacitance portion, and a second principal surface is smaller than or equal to a distance between an internal electrode located closest to the second principal surface side in a main electrostatic capacitance portion and the inner internal electrode. | 12-17-2015 |
20150364259 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor that includes dielectric layers made mainly of a perovskite compound containing Ba and Ti and optionally Zr and Hf, and inner electrodes having an average thickness of approximately 0.5 μm or less. The Mg content of the dielectric layers is approximately in the range of 0≦Mg≦0.4 (parts by mole) based on a total of 100 parts by mole of Ti, Zr, and Hf. The proportion of Mg-containing defects in the inner electrodes is approximately 20% or more. | 12-17-2015 |
20150364261 | LAMINATED CAPACITOR MOUNTED STRUCTURE - A mounted structure includes a laminated capacitor, a wiring substrate, and a joint material. The laminated capacitor includes a body with dielectric layers and internal electrode layers alternately stacked, and an external electrode connected to the internal electrode layers. The body includes a side surface coated with a side surface coating portion of the external electrode. The joint material is joined to the side surface coating portion and a land provided on the wiring substrate so as to cover the outer surfaces thereof. The outer end portion of the thickest portion of the joint material covering the side surface coating portion is located farther outside an outer end of the land in a direction perpendicular or substantially perpendicular to a side surface of the body. | 12-17-2015 |
20150371778 | Capacitor Arrangement - A capacitor arrangement includes at least one ceramic multilayer capacitor with a main body having ceramic layers and first and second electrode layers arranged therebetween. The capacitor also has a first external contact and a second external contact on mutually opposite side surfaces. The first external contact is electrically conductively connected to the first electrode layers and the second external contact is electrically conductively connected to the second electrode layers. A contact arrangement includes two metallic contact plates, between which the at least one ceramic multilayer capacitor is arranged. The first and second external contacts are electrically conductively connected in each case to one of the metallic contact plates. | 12-24-2015 |
20150371779 | MULTI-LAYERED CAPACITOR AND MANUFACTURING METHOD FOR THE SAME - A multi-layered capacitor and a method of manufacturing the same are disclosed. The multi-layered capacitor in accordance with an aspect of the present invention includes: a laminate structure having a plurality of unit structures laminated therein, the plurality of unit structures each including a substrate, a lower electrode film formed over the substrate, a dielectric film formed over the lower electrode film and an upper electrode film formed over the dielectric film; a first external electrode formed on one surface of the laminate structure and configured to be electrically connected with the lower electrode film; and a second external electrode formed on the other surface of the laminate structure and configured to be electrically connected with the upper electrode film, wherein the dielectric film has a circular grooved formed on an upper surface thereof, and wherein the upper electrode film is formed to have an upper surface thereof to correspond to the upper surface of the dielectric film. | 12-24-2015 |
20150373852 | MULTILAYER CERAMIC CAPACITOR AND BOARD FOR MOUNTING OF THE SAME - A multilayer ceramic capacitor may include three external electrodes disposed on a mounting surface of a ceramic body and spaced apart from each other, and first and second lead-out portions extended from a first internal electrode so as to be exposed through the mounting surface of the ceramic body and spaced apart from each other in a length direction of the ceramic body have one or more space portions, respectively, and a board for mounting thereof is provided. | 12-24-2015 |
20150380161 | MULTILAYER CERAMIC ELECTRONIC COMPONENT TO BE EMBEDDED IN BOARD, MANUFACTURING METHOD THEREOF AND PRINTED CIRCUIT BOARD HAVING THE SAME EMBEDDED THEREIN - A multilayer ceramic electronic component may include: a ceramic body including dielectric layers and having first and second main surfaces opposing each other, first and second side surfaces opposing each other, and first and second end surfaces opposing each other; first and second internal electrodes alternately exposed to the end surfaces with the dielectric layer interposed therebetween; and first and second external electrodes including connection portions disposed on the end surfaces and connected to the internal electrodes and band portions extended to portions of the main surfaces. The connection portions and the band portions are formed of a conductive thin film, and a width of the band portion may be greater than a distance between an end of the first internal electrode and the second end surface or a distance between an end of the second internal electrode and the first end surface. | 12-31-2015 |
20150380164 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes an electronic component body, an inner electrode, and an outer electrode. The outer electrode includes a fired electrode layer and first and second plated layers. The fired electrode layer is disposed on the electronic component body. The first plated layer is disposed on the fired electrode layer. The thickness of the first plated layer is about 3 μm to about 8 μm, for example. The first plated layer contains nickel. The second plated layer is disposed on the first plated layer. The thickness of the second plated layer is about 0.025 μm to about 1 μm, for example. The second plated layer contains lead. | 12-31-2015 |
20150380166 | MULTILAYER CERAMIC CONDENSER AND METHOD OF MANUFACTURING THE SAME - Disclosed are a multilayer ceramic condenser and a method of manufacturing the same. The method includes printing a plurality of stripe-type inner electrode patterns in parallel on ceramic green sheets; forming a laminate by staking the ceramic green sheets having the plurality of stripe-type inner electrode patterns printed thereon; cutting the laminate in order to have a structure in which first and second inner electrode patterns are alternately stacked; and forming a first side part and a second side part by applying ceramic slurry in order to cover the sides of the laminate to which the first and second inner electrode patterns are exposed. | 12-31-2015 |
20150380167 | THIN FILM TYPE CAPACITOR ELEMENT AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a thin film type capacitor element, including: a body part formed by stacking a plurality of dielectric layers; a first internal electrode provided in the body part and including a first non-plated region; a second internal electrode including a second non-plated region; a first via formed in the first non-plated region; and a second via formed in the second non-plated region. | 12-31-2015 |
20160002111 | DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME - A dielectric ceramic composition may include a base material main ingredient and an accessory ingredient. The accessory ingredient contains one or more selected from a group consisting of oxides and carbonates of one or more elements among Bi, Li, and Cu. When the accessory ingredient contains Bi, a content of Bi may be 0.1 to 1.0 part by mole, based on 100 parts by mole of the base material main ingredient, when the accessory ingredient contains Li, a content of Li may be 0.1 to 1.0 part by mole, based on 100 parts by mole of the base material main ingredient, and when the accessory ingredient contains Cu, a content of Cu may be 0.1 to 1.0 part by mole, based on 100 parts by mole of the base material main ingredient. | 01-07-2016 |
20160003737 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - A multilayer ceramic capacitor includes a laminated body including laminated ceramic layers, and first and second internal electrodes extending along interfaces between the ceramic layers. External electrodes are located on outer surfaces of the laminated body. Phosphor is disposed on portions of outer surfaces of the laminated body containing no external electrodes. | 01-07-2016 |
20160005541 | DIELECTRIC CERAMIC COMPOSITION, STACKED CERAMIC CAPACITOR USING THE SAME, AND METHOD OF MANUFACTURING THE SAME - A stacked ceramic capacitor that includes a ceramic body formed by stacking dielectric ceramic layers and internal electrodes mainly composed of Ni; and an external electrode formed on an outer surface of ceramic body. The dielectric ceramic layers are formed by using a dielectric ceramic composition that includes a main ingredient expressed by (K | 01-07-2016 |
20160005543 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a laminated body including an inner layer portion including ceramic dielectric layers and internal electrodes, and outer layer portions including ceramic dielectric layers. External electrodes connected to the internal electrodes are provided on both ends of the laminated body. The main constituent of the inner layer portion is a perovskite-type compound represented by ABO | 01-07-2016 |
20160020023 | METAL POWDER, METHOD FOR PRODUCING THE SAME, CONDUCTIVE PASTE INCLUDING METAL POWDER, AND MULTILAYER CERAMIC ELECTRONIC COMPONENT - A method for producing a metal powder that includes a first step of uniformly arranging a metal compound on a metal particle, and a second step of converting the metal compound uniformly arranged on the metal particle into a complex metal compound. In the first step, a solution that contains at least one metal element and at least one group 4 element different from the metal element is prepared, the solution being adjusted to have a pH of 5 or less. The prepared solution is mixed with a reductant solution to coprecipitate the metal and the metal compound, thereby producing a slurry that contains a metal powder containing the metal combined with the metal compound. In the second step, a solution or a powder containing at least one second metal element is added to the slurry to convert the metal compound into the complex metal compound. | 01-21-2016 |
20160020025 | DIELECTRIC CERAMIC AND MULTILAYER CERAMIC CAPACITOR - A dielectric ceramic that contains Al and Si, as well as a barium titanate-based compound having a perovskite type crystal structure as a primary component. The total molar amount of Al and Si is 2 to 4 parts by mole with respect to 100 parts by mole of Ti, and the content ratio of Al with respect to the total molar amount is 0.2 or less (excluding 0) on the molar ratio basis. The dielectric ceramic may also contain at least one specific rare earth element Re, such as Gd, Tb, or Dy. | 01-21-2016 |
20160020026 | Energy Storage Device and Method of Production Thereof - The present invention relates generally to the fields of electrical engineering and electronics. More specifically, the present invention relates to passive components of electrical circuitry and more particularly to energy storage devices and method of production thereof. | 01-21-2016 |
20160020028 | CERAMIC ELECTRONIC COMPONENT - In a ceramic electronic component, when a distance between a first end surface and an edge of a portion of a first baked electrode layer disposed on a second principal surface in a length direction is A, a distance between the first end surface and an effective region in the length direction is B, and a distance between the first end surface and an edge of a portion of a first resin-containing electrode layer disposed on the second principal surface in the length direction is C, A | 01-21-2016 |
20160020029 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT - A multilayer ceramic electronic component includes a multilayer body including ceramic layers and inner electrode layers, the inner electrode layers being disposed on interfaces between the ceramic layers, and an outer electrode on an external surface of the multilayer body and electrically connected to first end portions of the inner electrode layers exposed to the external surface of the multilayer body. Each of the ceramic layers includes a thin portion with a continuously reducing thickness near the first end portion. Each inner electrode layer includes a thick portion near a connection with the outer electrode, the thick portion having a thickness continuously increasing toward the connection on a first side in accordance with a shape of the thin portion in the ceramic layer. A distance between a second end portion in the inner electrode layer not joined to the outer electrode, and the thick portion adjacent to the second end portion is equal to or longer than an interlayer distance between the inner electrode layers. | 01-21-2016 |
20160024346 | CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - A ceramic electronic component that includes a ceramic element, and a coating film and external electrodes that are provided on the surface of the ceramic element. The coating film is selectively formed on the surface of the ceramic element by applying, to the ceramic electronic component, a resin-containing solution containing at least one anion of a sulfuric acid, a sulfonic acid, a carboxylic acid, a phosphoric acid, a phosphoric acid, and a hydrofluoric acid. | 01-28-2016 |
20160027580 | PLZT Capacitor On Glass Substrate - A lead-lanthanum-zirconium-titanate (PLZT) capacitor on a substrate formed of glass. The first metallization layer is deposited on a top side of the substrate to form a first electrode. The dielectric layer of PLZT is deposited over the first metallization layer. The second metallization layer deposited over the dielectric layer to form a second electrode. The glass substrate is advantageous as glass is compatible with an annealing process used to form the capacitor. | 01-28-2016 |
20160027583 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - A multilayer ceramic electronic component may include: a ceramic body in which a plurality of internal electrodes and a plurality of dielectric layers are stacked in a thickness direction; and an external electrode including an electrode layer disposed on an outer surface of the ceramic body to be connected to the internal electrodes, a conductive resin layer disposed on the electrode layer and containing metal particles and a base resin, and a plating layer disposed on the conductive resin layer. | 01-28-2016 |
20160027584 | CAPACITOR COMPONENT - A capacitor component includes an element assembly, a first external electrode, and a second external electrode. The element assembly includes first and second internal electrode layers, a first connecting conductive layer extending along a fifth outer surface of the element assembly and connected to each of the first internal electrode layers, a first covering insulating layer covering the first connecting conductive layer, a second connecting conductive layer extending along a sixth outer surface of the element assembly and connected to each of the second internal electrode layers, and a second covering insulating layer covering the second connecting conductive layer. Only a portion of the first internal electrode layers are extended to the third outer surface and connected to the first external electrode, and only a portion of the internal electrode layers are extended to the fourth outer surface and connected to the second external electrode. | 01-28-2016 |
20160027585 | CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - A ceramic electronic component that includes a ceramic element, and baked electrodes on a surface of the ceramic element. A resin film is formed at boundary sites between the ceramic element and the baked electrodes. The resin film includes a resin, and a cationic element that is a constituent element of the glass component in the baked electrodes. | 01-28-2016 |
20160027586 | MULTILAYER CAPACITOR, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE USING THE SAME - Disclosed herein are a multilayer capacitor, a method for manufacturing the same, and an electronic device using the same. A multilayer capacitor including internal electrodes stacked in a dielectric so as to be spaced apart from each other, alternately connected to external electrodes formed on both sides of the dielectric, and formed so that width sizes of connection sections connected to the external electrodes are decreased as compared with those of overlapped sections overlapped with each other while vertically neighboring to each other in at least portions of a stacked structure is suggested. In addition, an electronic device using the multilayer capacitor and a method for manufacturing the multilayer capacitor are suggested. | 01-28-2016 |
20160027587 | THIN-FILM DIELECTRIC AND THIN-FILM CAPACITOR ELEMENT - The present invention provides a thin-film dielectric having a higher dielectric constant than usual ones and not requiring a special single crystal substrate, and also provides a large-capacity thin-film capacitor element using the thin-film dielectric. | 01-28-2016 |
20160027593 | COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME - A composite electronic component includes an insulation sheet, a tantalum capacitor including a body part containing a sintered tantalum powder and a tantalum wire of which a portion is embedded in the body part, and disposed on the insulation sheet, a multilayer ceramic capacitor including a ceramic body in which a plurality of dielectric layers and internal electrodes are alternately disposed and first and second external electrodes disposed on a lower surface of the ceramic body, and disposed on the insulation sheet, and a molded part enclosing the tantalum capacitor and the multilayer ceramic capacitor, the internal electrodes including a lead-out portion led out to the lower surface of the ceramic body. | 01-28-2016 |
20160035489 | MULTI-LAYERED ALUMINUM OXIDE CAPACITOR - The present invention relates to a multi-layered aluminum oxide capacitor comprising an aluminum substrate; a plurality of aluminum oxide layer formed in at least a portion of on both sides or one side of the substrate with respect to the aluminum substrate; and a plurality of electrode layers formed on the aluminum oxide layers. According to the present invention, manufacturing process is more simplified since Al | 02-04-2016 |
20160035490 | COMPOSITE OXIDE-COATED METAL POWDER, PRODUCTION METHOD THEREFOR, CONDUCTIVE PASTE USING COMPOSITE OXIDE-COATED METAL POWDER, AND MULTILAYER CERAMIC ELECTRONIC COMPONENT - A method for producing a composite oxide-coated metal powder that includes a first step of coating a metal powder with a metal oxide by a hydrolysis reaction of a water-soluble metal compound in an aqueous solvent, and a second step of turning the metal oxide into a composite oxide. In the first step, the water-soluble metal compound containing a tetravalent metal element dissolved in a solvent including at least water is added to a slurry including the metal powder dispersed in the solvent to deposit the metal oxide containing the tetravalent metal element and produce a metal oxide-coated metal powder slurry. In the second step, a solution or powder containing at least one divalent element is added to the metal oxide-coated metal powder slurry to react the metal oxide present on the surface of the metal powder with the divalent element, thereby providing the composite oxide-coated metal powder. | 02-04-2016 |
20160035492 | MULTILAYER CERAMIC CAPACITOR - In some embodiments, a multilayer ceramic capacitor | 02-04-2016 |
20160039711 | CONDUCTIVE PASTE AND MULTILAYER CERAMIC ELECTRONIC COMPONENT - A conductive paste for forming external electrodes for a multilayer ceramic electronic component. The paste contains a glass composition containing (a) BaO, (b) at least one of SrO and CaO, (c) ZnO, (d) B | 02-11-2016 |
20160042864 | MULTILAYER CERAMIC CAPACITOR - Disclosed herein is a multilayer ceramic capacitor including: a ceramic body in which internal electrodes and dielectric layers are alternately stacked; a pair of external electrodes covering both end portions of the ceramic body; and a moisture resistant protective film formed on surfaces of the dielectric layers between the pair of external electrodes and having a hydrophobic functional group. | 02-11-2016 |
20160042865 | MULTI-LAYER CERAMIC CAPACITOR - The present invention relates to a multi-layer ceramic capacitor which includes a ceramic body on which an inner electrode and a dielectric layer are alternately stacked, a crack prevent layer formed on both sides of the ceramic body and an external electrode covering both ends of the ceramic body on which the crack prevention layer is formed. | 02-11-2016 |
20160042866 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor that has alternately stacked dielectric layers containing, as their main constituent, a barium titanate based compound that has a perovskite-type crystal structure; and internal electrode layers with electrode defects. The internal electrode layers are 0.6 μm or less in thickness. The electrode defects have electrode defects containing an Al—Si based oxide mainly containing Al and Si. The number of the electrode defects containing the Al—Si based oxide is 30% or more in number ratio to the total number of electrode defects in the internal electrodes. | 02-11-2016 |
20160042867 | MULTILAYER CERAMIC CAPACITOR AND MANUFACTURING METHOD THEREFOR - A multilayer ceramic capacitor having a multilayer ceramic element with internal electrodes opposed to each other and dielectric ceramic layers interposed therebetween, and external electrodes on a surface of the multilayer ceramic element and electrically connected to the internal electrodes. The external electrodes contain a first non-precious metal as a first conductive component, and glass containing BaO and/or SrO, where a total content of the BaO and/or the SrO is 34 mol % or more. The internal electrodes have a second non-precious metal different from the first non-precious metal included in the external electrodes. A glass layer is formed at interfacial parts between the ceramic layers and the external electrodes, and a diffusion length thereof is within a range of 1 μm to 5 μm from joint interfaces between the external electrodes and the internal electrodes at the joints. | 02-11-2016 |
20160042868 | CERAMIC ELECTRONIC COMPONENT - In an embodiment of a ceramic electronic component, an external electrode | 02-11-2016 |
20160042870 | HIGH ENERGY DENSITY STORAGE DEVICE - A device and method for providing electrical energy storage of high specific energy density. The device contains one or more layers of high dielectric constant material, such as Barium Titanate or Hexagonal Barium Titanate, sandwiched between electrode layers made up of a variety of possible conducting materials. The device includes additional insulating layers including carbon, such as carbon formed into diamond or a diamond-like arrangement for providing between the electrodes and the dielectric layer to provide for very high breakdown voltages. The layers can be created by a variety of methods including laser deposition and assembled to form a capacitor device provides the high energy density storage. | 02-11-2016 |
20160049242 | MULTILAYER CERAMIC ELECTRONIC COMPONENT INCLUDING A PAIR OF SIDE OUTER ELECTRODES AND A CENTER ELECTRODE - A multilayer ceramic electronic component includes a multilayer ceramic element with first through sixth surfaces, a center outer electrode located between a first-side outer electrode and a second-side outer electrode on the multilayer ceramic element. A first plated film is provided on the center outer electrode, second plated films are provided on the first-side outer electrode and the second-side outer electrode, respectively, and a thickness of each of the second plated films is greater than a thickness of the first plated film. | 02-18-2016 |
20160049244 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a multilayer unit, thickness-direction first and second outer layer sections, and length-direction first and second outer layer sections. A dimension of the thickness-direction second outer layer section is greater than a dimension of the thickness-direction first outer layer section. The thickness-direction second outer layer section includes an inner portion and an outer portion. A composition ratio of Si to Ti in a ceramic dielectric layer included in the outer portion is higher than that in the inner portion. A Si content ratio is higher in a boundary portion between the outer portion and the inner portion. A relationship expressed by T | 02-18-2016 |
20160049245 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a multilayer unit, thickness-direction first and second outer layer sections, length-direction first and second outer layer sections, and width-direction first and second outer layer sections. A dimension of the thickness-direction second outer layer section is greater than a dimension of the thickness-direction first outer layer section. The thickness-direction second outer layer section includes an inner portion and an outer portion. A composition ratio of Si to Ti in a ceramic dielectric layer included in the outer portion is higher than that in the inner portion. A boundary portion between the outer portion and the inner portion has a larger Si content than the outer portion. The inner portion has a higher composition ratio of Mn to Ti than the outer portion. Each of minimum dimensions in the length direction of the length-direction first and second outer layer sections is greater than both dimensions in the width direction of the width-direction first and second outer layer sections. | 02-18-2016 |
20160049246 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a multilayer unit, thickness-direction first and second outer layer sections, and length-direction first and second outer layer sections. A dimension of the thickness-direction second outer layer section is greater than a dimension of the thickness-direction first outer layer section. The thickness-direction second outer layer section includes an inner portion and an outer portion. A composition ratio of Si to Ti in a ceramic dielectric layer included in the outer portion is higher than that in the inner portion. A Si content ratio is higher in a boundary portion between the outer portion and the inner portion. The inner portion has a higher composition ratio of Mn to Ti than the outer portion. Both of minimum dimensions in the length direction of the length-direction first and second outer layer sections are greater than a dimension in the thickness direction of the thickness-direction first outer layer section. | 02-18-2016 |
20160049247 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a multilayer unit, thickness-direction first and second outer layer sections, and width-direction first and second outer layer sections. A dimension of the thickness-direction second outer layer section is greater than a dimension of the thickness-direction first outer layer section. The thickness-direction second outer layer section includes an inner portion and an outer portion. A composition ratio of Si to Ti in a ceramic dielectric layer included in the outer portion is higher than that in the inner portion. A Si content ratio is higher in a boundary portion between the outer portion and the inner portion. A relationship expressed by T | 02-18-2016 |
20160049249 | MULTILAYER CAPACITOR AND INSTALLATION STRUCTURE OF MULTILAYER CAPACITOR - In a multilayer capacitor, both a dimension in a thickness direction of a first terminal electrode on the first end surface and a dimension in the thickness direction of a second terminal electrode on the second end surface are greater than a minimum distance in the thickness direction between a first effective portion of a first inner electrode and a second main surface and a minimum distance in the thickness direction between a second effective portion of a second inner electrode and the second main surface. | 02-18-2016 |
20160049250 | MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME - There are provided a multilayer ceramic capacitor and a board having the same. The multilayer ceramic capacitor may include: three external electrodes disposed on a mounting surface of a ceramic body to be spaced apart from each other and connected to lead portions of internal electrodes, wherein an interval between adjacent lead portions is 500.7 μm or less, widths of one-side margin portions of the external electrodes in a length direction of the ceramic body that are not in contact with the corresponding lead portions are 20.2 μm or more. | 02-18-2016 |
20160049251 | FOLDING TYPE CAPACITOR COMPRISING THROUGH HOLE - A folding type capacitor includes a metal substrate wherein a through hole penetrates an inside thereof; at least one dielectric layer formed on a surface of the metal substrate and an inner peripheral surface of the through hole; and an electrode layer formed on the at least one dielectric layer, wherein the metal substrate has bending portions whose surfaces are facing each other. Thus, manufacturing process is more simplified since Al | 02-18-2016 |
20160049253 | MULTILAYER CAPACITOR AND INSTALLATION STRUCTURE OF MULTILAYER CAPACITOR - In a multilayer capacitor, both a minimum distance in a thickness direction between a first effective portion of a first inner electrode and a second main surface and a minimum distance in the thickness direction between a second effective portion of a second inner electrode and the second main surface are shorter than any of a dimension in the thickness direction of a first extending portion of the first inner electrode, a dimension in the thickness direction of a second extending portion of the first inner electrode and a dimension in the thickness direction of the third extending portion of the second inner electrode. | 02-18-2016 |
20160049254 | MULTILAYER CERAMIC CAPACITOR - A multilayer body includes an inner layer portion having a dimension in a stacking direction greater than a dimension of the inner layer portion in a width direction, a second outer layer portion including an outer portion including a second principle surface and an inner portion disposed adjacent to both of the outer portion and the inner layer portion, a dimension of the outer portion in the stacking direction being greater than a dimension of the inner portion, and a composition ratio of Si relative to Ti in the outer portion is greater than that in the inner portion. | 02-18-2016 |
20160049255 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a body and at least two outer electrodes. The body includes first and second main surfaces, an inner layer portion and first and second outer layer portions. In the inner layer portion, dielectric layers and conductive layers are alternately stacked on each other. The second outer layer portion includes an outer portion and an inner portion. A boundary region adjacent to the inner portion in the outer portion inclines toward the first main surface. | 02-18-2016 |
20160049256 | MULTILAYER CERAMIC CAPACITOR, MULTILAYER CERAMIC CAPACITOR SERIES INCLUDING THE SAME, AND MULTILAYER CERAMIC CAPACITOR MOUNT BODY INCLUDING THE SAME - A body of a multilayer ceramic capacitor includes an inner layer portion and first and second outer layer portions sandwiching the inner layer portion therebetween. The inner layer portion includes an area extending from a conductive layer positioned closest to a first main surface to a conductive layer positioned closest to a second main surface in the stacking direction. The height of the body is smaller than the width of the body. The height of the inner layer portion is smaller than the width of the inner layer portion. The first outer layer portion includes a dielectric layer positioned closest to the first main surface. The second outer layer portion includes a dielectric layer positioned closest to the second main surface, and is thicker than the first outer layer portion. The total height of the first and second outer layer portions is smaller than the height of the inner layer portion. | 02-18-2016 |
20160049257 | ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT - An electronic component comprises an element body and an outer electrode. The element body has a pair of end faces opposing each other, a pair of main faces opposing each other while extending so as to connect the pair of end faces to each other, and a pair of side faces opposing each other while extending so as to connect the pair of main faces to each other. The outer electrode is formed on the end face side of the element body and covers a portion of the main and side faces adjacent to the end face. At least a surface of an electrode portion of the outer electrode located on the side face side thereof is covered with an insulating layer. | 02-18-2016 |
20160049258 | ELECTRICITY STORAGE DEVICE, PROCESS FOR PRODUCING THE SAME, AND DEVICE FOR PRODUCING THE SAME - An electricity storage device constituted by a stack of a plurality of electricity storage elements superposed on each other and two external electrodes formed on respective opposite side surfaces of the stack, wherein each of the plurality of electricity storage elements has a basic unit obtained by alternately superposing at least one electricity storage film and a plurality of internal electrode films on each other, and two protective films which have an electrical insulation property and which are superposed on respective opposite surfaces of the basic unit as seen in a direction of superposition of the at least one electricity storage film and the plurality of internal electrode films, and the two external electrodes are formed so as to bridge corresponding side surfaces of adjacent ones of the plurality of electricity storage elements. | 02-18-2016 |
20160055933 | DIELECTRIC COMPOSITION FOR LOW-TEMPERATURE SINTERING, MULTILAYER CERAMIC ELECTRONIC COMPONENT CONTAINING THE SAME, AND METHOD OF MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT - There are provided a dielectric composition for low-temperature sintering and a multilayer ceramic electronic component manufactured using the dielectric composition and the dielectric composition may contains: BaTiO | 02-25-2016 |
20160055974 | FILM CAPACITOR - A film capacitor having: a stack of at least one dielectric resin film formed of polypropylene and a plurality of vapor-deposited metal films which are superposed on each other such that the at least one dielectric film and the plurality of vapor-deposited metal films are alternately arranged; and two external electrodes formed on a pair of side surfaces of the stack; wherein cover films are formed of a polyolefin-based hot-melt resin on a pair of side surfaces of the stack other than the side surfaces on which the two external electrodes are formed, such that the cover films cover entireties of those side surfaces and are fusion-bonded to end faces of the at least one dielectric film exposed at those side surfaces. | 02-25-2016 |
20160064146 | CAPACITOR - The present invention relates to a capacitor. The capacitor includes a substrate; a dielectric layer formed on the substrate; and an electrode layer comprising a first electrode layer and a second electrode layer formed on the dielectric layer, wherein the first electrode layer and the second electrode layer are separated from each other, and at least a portion of the first electrode layer and at least a portion of the second electrode layer are disposed on a same surface. With this configuration, applying the electricity becomes easy, and since the first and the second electrode layers function as the electrodes being charged with different polarity electrical charges respectively, manufacturing thereof becomes easy, and the structure thereof is simple. | 03-03-2016 |
20160071647 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor that contains at least one kind of a first element that forms a covalent hydride with hydrogen (except for an element generating a hydride having a boiling point of less than 125° C.) and a second element that forms a hydride in a boundary region with hydrogen between an outermost plating layer constituting an external electrode and a dielectric layer constituting a ceramic element body. | 03-10-2016 |
20160071648 | Electronic Component and Method for the Passivation Thereof - An electronic component has a main body. The main body includes a porous material having surface pores at a surface of the main body. A passivation liquid is arranged in the surface pores. A method of forming an electronic component is also disclosed as is a method of passivating a body. | 03-10-2016 |
20160071649 | LAMINATED CERAMIC CAPACITOR - A ceramic capacitor having dielectric ceramic layers that include Ba, Re (Re is at least one of La, Ce, Pr, Nd, and Sm), Ti, Zr, M (M is at least one of Mg, Al, Mn, and V), Si, and optionally Sr, where at least some of the Ba, Re, Ti, and Zr and optionally Sr are in the form of a perovskite compound. Respective amounts, expressed as parts by mol, of the elements of the dielectric ceramic layers satisfy, with respect to a total of 100 of the Ti amount and the Zr amount, 0≦a≦20.0 where a is the Sr amount; 0.5≦b≦10.0 where b is the Re amount; 46≦c≦90 where c is the Zr amount; 0.5≦d≦10.0 where d is the M amount; 0.5≦e≦5.0 where e is the Si amount; and 0.990≦m≦1.050 where m is a ratio of a total of the Ba amount, the Sr amount, and the Re amount, to the total of the Ti amount and the Zr amount. | 03-10-2016 |
20160086732 | COMPOSITION FOR CERAMIC SUBSTRATES AND CERAMIC CIRCUIT COMPONENT - A composition for ceramic substrates that includes a mixture of borosilicate glass powder and ceramic powder. The borosilicate glass powder contains 4% to 8% by weight B | 03-24-2016 |
20160086733 | MULTILAYER CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING SAME - A multilayer ceramic capacitor that includes a layered body in which dielectric layers and internal electrode layers are layered alternately, an external electrode on a surface of the layered body and a plating layer on a surface of the external electrode. The external electrode contains Cu, and a protective layer containing Cu | 03-24-2016 |
20160086735 | DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR COMPRISING THE SAME - There are provided a dielectric ceramic composition comprising ceramic dielectrics and a multilayer ceramic capacitor including the same. The dielectrics have grains of a core-shell structure, and when a diameter of a core is defined as D | 03-24-2016 |
20160090325 | DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR USING THE SAME - The present invention relates to a dielectric ceramic composition, method for preparing the same, and electronic device using the same. According to the present invention, there is provided a dielectric ceramic composition which allows use of a nickel internal electrode, sintering under a reducing atmosphere, and having 1000 or higher dielectric constant while providing excellent dc-bias properties and reliability which is close to paraelectric property. The composition of the present invention can generate high effective capacity under high DC voltage, have strong resistance against electrostatic discharge (ESD) damage, and be used for preparing an electronic device having low acoustic noise. | 03-31-2016 |
20160093436 | CAPACITOR AND METHOD OF MANUFACTURING THE SAME - Provided is a capacitor, which includes a first electrode including aluminum, a second electrode facing the first electrode, and a first dielectric layer interposed between the first electrode and the second electrode, including aluminum oxide, and having multiple pores defined in a surface of the first dielectric layer in contact with the second electrode. | 03-31-2016 |
20160093437 | MULTILAYER CERAMIC CAPACITOR AND MOUNTED STRUCTURE WITH MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a ceramic body which is unlikely to be cracked. A dimension in a length direction L is referred to as L0. A distance in the length direction L is referred to as L1 between an end in the length direction L of a portion of a first external electrode located on a first principal surface and an end of a second internal electrode closer to the first end surface. The ratio L1/L0 is about 0.05 to about 0.35. | 03-31-2016 |
20160093439 | ELECTRONIC COMPONENT - An electronic component includes an electronic element including two outer electrodes on surfaces thereof and a board terminal including a board main body and two mounting electrodes. The board main body has electrical insulating properties and a first principal surface. The two mounting electrodes are disposed on the first principal surface and electrically coupled to the two outer electrodes, respectively. The electronic element is mounted on the first principal surface side. The two outer electrodes are partially disposed outside an outer edge of the board terminal when viewed from the first principal surface side. The height from an end of each of the two outer electrodes opposite the board terminal to an end of the board terminal opposite the electronic element is not greater than a larger dimension of the width of the electronic element and the width of the board terminal. | 03-31-2016 |
20160093440 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes an external electrode that is unlikely to be peeled. First and second external electrodes each include base layers provided over a ceramic body and including a metal and glass, and Cu plated layers provided over the base layers. The multilayer ceramic capacitor includes a reactive layer. The reactive layer contains about 5 atomic % to about 15 atomic % of Ti, about 5 atomic % to about 15 atomic % of Si, and about 2 atomic % to about 10 atomic % of V. | 03-31-2016 |
20160093442 | MULTILAYER CERAMIC CAPACITOR - In a multilayer ceramic capacitor in which an outer electrode is arranged on a ceramic element body to be electrically connected to an inner electrode, the outer electrode includes a metal electrode layer on the ceramic element body, and a conductive resin layer on the metal electrode layer. When a dielectric layer between a pair of the inner electrodes adjacent in a stacking direction among a plurality of the inner electrodes extending to one of a pair of end surfaces of the ceramic element body is an inter-electrode dielectric layer, a gap extends a direction connecting the adjacent inner electrodes sandwiching the inter-electrode dielectric layer at a position near or adjacent to at least the one of the end surfaces. | 03-31-2016 |
20160093443 | CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR - A ceramic electronic component includes an electronic component ceramic main body and internal electrodes disposed within the electronic component main body. The internal electrodes include through holes passing through the internal electrodes in the thickness direction. Ceramic columns are disposed in the through holes and connect the ceramic on one side of the internal electrodes and the ceramic on the other side thereof. An area ratio of the ceramic columns to ends of the internal electrodes located within the electronic component main body is greater than an area ratio of ceramic columns to central portions of the internal electrodes. | 03-31-2016 |
20160099106 | CERAMIC ELECTRONIC COMPONENT - A ceramic electronic component includes a laminated body including ceramic layers and conductor layers stacked alternately; and first and second external electrodes provided on portions of the laminated body. Each of the first and second external electrodes includes a sintered metal layer provided on the laminated body, a conductive resin layer covering the sintered metal layer, and a plated layer covering the conductive resin layer. The maximum length of the sintered metal layer provided on the second principal surface is shorter than the maximum length of the sintered metal layer provided on each of the first and second side surfaces. | 04-07-2016 |
20160099108 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor has a capacitor body of laminate structure and a pair of external electrodes, and shaped roughly as a rectangular solid defined by length L, width W, and height H. This multilayer ceramic capacitor is such that the width W and height H meet the condition of “1.10≦H/W≦1.70.” | 04-07-2016 |
20160099109 | FILM CAPACITOR - A film capacitor includes a stacked body formed by stacking metalized films in each of which a metal electrode is formed on a surface of a dielectric film, at least one of the dielectric films containing a high thermal conductive filler; and external electrodes formed at electrode forming ends provided at opposed positions in the stacked body. The stacked body includes a high thermal conductive portion in which a content of the high thermal conductive filler in the at least one dielectric film is relatively high, and a low thermal conductive portion in which the content of the high thermal conductive filler in the at least one dielectric film is relatively low, or the high thermal conductive filler is not contained. The high thermal conductive portion is provided to continuously extend from an inside of the stacked body to a side portion other than the electrode forming ends. | 04-07-2016 |
20160099110 | CONDUCTIVE PASTE FOR EXTERNAL ELECTRODE, MULTILAYER CERAMIC ELECTRONIC COMPONENT USING THE SAME, AND MANUFACTURING METHOD THEREOF - A conductive paste for an external electrode, a multilayer ceramic electronic component using the same, and a manufacturing method of a multilayer ceramic electronic component are provided. The conductive paste for an external electrode includes first conductive particles containing a metal, second conductive particles formed of ceramic particles coated with silver (Ag), and a thermosetting resin. | 04-07-2016 |
20160099111 | MULTILAYER CERAMIC CAPACITOR - In a multilayer ceramic capacitor, a ceramic body includes dielectric layers and inner electrodes stacked in a stacking direction, outer electrodes on the ceramic body and connected to the plurality of inner electrodes. When viewing a first cross section of the ceramic body parallel or substantially parallel to first and second side surfaces of the ceramic body and having the plurality of inner electrodes exposed, a connection proportion is about 30% to about 70% and is a proportion of a number of the inner electrodes connected to the outer electrodes to a number of all of the plurality of inner electrodes exposed at the first cross section, and when the first cross section is viewed, glass is present between one of the inner electrodes not connected to each of the outer electrodes, and each of the outer electrodes. | 04-07-2016 |
20160104552 | CONDUCTIVE RESIN COMPOSITION AND MULTILAYER CERAMIC CAPACITOR HAVING THE SAME - There is provided a conductive resin composition including epoxy resin, copper powder particles, and non-nitrogen-based hardeners. | 04-14-2016 |
20160104575 | MULTILAYER CERAMIC CAPACITOR - In a multilayer ceramic capacitor, SG represents an average of a distance between end portions of inner electrodes in a width direction and side surfaces of a ceramic body, OT represents an average of a distance between inner electrodes closest to main surfaces and the main surfaces, ET | 04-14-2016 |
20160104576 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - There is provided a multilayer ceramic electronic component including: a ceramic body in which internal electrodes and dielectric layers containing a barium titanate-based compound containing calcium (Ca) are alternately stacked; and external electrodes disposed on outer surfaces of the ceramic body and electrically connected to the internal electrodes. The dielectric layer includes interfacial portions adjacent to the internal electrodes and a central portion disposed between the interfacial portions, the interfacial portion having a calcium (Ca) concentration higher than that of the central portion. | 04-14-2016 |
20160104577 | ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - An electronic component of a multi-layered structure includes a laminate formed by stacking a plurality of ceramic bodies and an external electrode made of a conductive resin for connecting each ceramic body. | 04-14-2016 |
20160104578 | MULTI-LAYER CERAMIC CAPACITOR - The present invention relates to a multi-layer ceramic capacitor which includes a ceramic main body formed by stacking internal electrodes and dielectric layers alternately and an external electrode formed by stacking a coating layer and a plating layer on both ends of the ceramic main body sequentially, wherein the coating layer includes conductive metal powder and a(Si, B)-b(Li, K)-c(Ba, Ca)-d(Mn, V, Zn)-e(Ti, Sn, Zr, Al) component of glass frit (herein, 20≦a≦60, 10≦b≦35, 2≦c≦30, 2≦d≦20 and 0.5≦e≦30 mol %, a+b+c+d=100 mol %). | 04-14-2016 |
20160111210 | MULTILAYER CERAMIC DEVICE HAVING A CRACK GUIDE PATTERN - Disclosed herein is a multilayer ceramic device. The multilayer ceramic device according to an exemplary embodiment of the present invention includes: a device body having sides which are spaced apart from each other and a circumferential surface which connects the sides; an internal electrode disposed in a longitudinal direction of the device body within the device body; an external electrode having a front part which covers the sides and a band part which extends from the front part to cover a portion of the circumferential surface; and a crack guide pattern disposed within the device body and guiding a progress direction of cracks occurring at the circumferential surface to the sides, wherein the crack guide pattern includes: a metal pattern; and an oxide layer formed on a surface of the metal pattern. | 04-21-2016 |
20160111211 | THIN FILM CAPACITOR - A thin film capacitor comprising
| 04-21-2016 |
20160111212 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT - When a monolithic ceramic electronic component is viewed from either one of end surfaces thereof, an outer electrode includes a solder-repellent portion and a solder-receivable portion. The solder-repellent portion covers the central portion of an end surface of a ceramic laminate body. The solder-receivable portion includes portions disposed on two opposing sides of the solder-repellent portion. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to a portion around the central portion of the end surface. Thus, expansion and contraction that occur as a result of application of an AC voltage are not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are reduced. | 04-21-2016 |
20160111213 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor that is highly resistant to insulation degradation under high-temperature load includes an inner ceramic layer that has a composition mainly composed of a perovskite-type compound containing Ba and Ti, at least one of Nb and Ta, contains Mn and Al, and optionally contains Mg and a rare-earth element that is at least one of Y, Gd, Tb, Dy, Ho, and Er, with a content of Ti being 100 parts by mole, and (a) a total of Nb and Ta is from about 0.2 to about 1.5 part by mole, (b) Mg is not more than about 0.2 part by mole including 0 part by mole, (c) Mn is from about 1.0 to about 3.5 parts by mole, (d) Al is from about 1.0 to about 4.0 parts by mole, and (e) the rare-earth element is not more than about 0.05 part by mole including 0 part by mole. Furthermore, an average number of particles per one layer of the inner ceramic layer is not more than 3. | 04-21-2016 |
20160111216 | CHIP COMPONENT - A chip component includes: a ceramic body including a capacitance forming part in which first and second dielectric layers are alternately disposed; and external electrodes disposed on both end surfaces of the ceramic body, wherein the capacitance forming part includes first and second internal electrodes spaced apart from each other on the first dielectric layers and exposed to the end surfaces of the ceramic body to thereby be connected to the external electrodes; and floating electrodes disposed on the second dielectric layers and overlapped with portions of the first and second internal electrodes, the ceramic body includes protective parts disposed between upper and lower surfaces thereof and the capacitance forming part and having third dielectric layers on which first and second dummy electrodes exposed to the end surfaces of the ceramic body are disposed, and the protective parts include third dummy electrodes disposed between the first and second dummy electrodes. | 04-21-2016 |
20160111217 | LAMINATED CERAMIC CAPACITOR - As a dielectric ceramic constituting dielectric layers of a laminated ceramic capacitor, a dielectric ceramic is used which contains, as its main constituent, a perovskite-type compound containing Ca and Zr and optionally containing Sr, Ba, and Ti, and further contains Si, Mn, and Al, and when the total content of Zr and Ti is regarded as 100 parts by mol, the total content (100×m) of Ca, Sr, and Ba meets 1.002≦m≦1.100 in terms of parts by mol, the Si content n meets 0.5≦n≦10 in terms of parts by mol, the Mn content u meets 0.5≦u≦10 in terms of parts by mol, and the Al content w meets 0.02≦w≦4 in terms of parts by mol, m and n satisfying −0.4≦100(m−1)−n≦3.9. | 04-21-2016 |
20160118187 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes: a ceramic body; first and second internal electrodes disposed so as to be alternately exposed to both end surfaces of the ceramic body with each of dielectric layers; first and second external electrodes formed so as to be extended onto portions of one main surface of the ceramic body, respectively; third and fourth external electrodes formed on both side surfaces of the ceramic body, respectively, so as to be extended onto portions of both main surfaces of the ceramic body, respectively; an intermitting part connecting the third and fourth external electrodes to one another; first and second land patterns formed so as to be connected to the first and third external electrodes, respectively; and a third land pattern formed so as to be connected to both of the second and fourth external electrodes. | 04-28-2016 |
20160118188 | MULTILAYER CERAMIC CAPACITOR AND METHOD FOR PRODUCING THE SAME - A dielectric ceramic that forms dielectric ceramic layers of a multilayer ceramic capacitor contains a Ba and Ti containing perovskite compound, Ca, R (R denotes a rare earth element, such as La), M (M denotes Mn or the like), and Si. The Ca content ranges from 0.5 to 2.5 molar parts, the R content ranges from 0.5 to 4 molar parts, the M content ranges from 0.5 to 2 molar parts, and the Si content ranges from 1 to 4 molar parts, based on 100 molar parts of Ti. In perovskite crystal grains, the Ca diffusion depth is 10% or less of the average grain size of the crystal grains, and the Ca concentration in a Ca diffusion region is 0.2 to 5 molar parts higher than the Ca concentration near the center of each of the crystal grains. | 04-28-2016 |
20160118191 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a ceramic multilayer body including dielectric ceramic layers and inner electrodes laminated with the dielectric ceramic layers interposed therebetween, wherein the dielectric ceramic layers include a perovskite compound containing Ba and Ti, and the inner electrodes (a) contain Ni as a main component, (b) include segregation with the perovskite compound containing Ba and Ti, which is scattered in the inner electrodes and embedded in the inner electrodes, in amount equal to or higher than about 2%, and (c) include columnar segregation with the perovskite compound containing Ba and Ti, which penetrates through the inner electrodes from one main surface side to the other main surface side, in an amount equal to or lower than about 5%, or do not include the columnar segregation. Further, an average thickness of the inner electrodes is equal to or smaller than about 0.4 μm. | 04-28-2016 |
20160118193 | ELECTRONIC COMPONENT - An electronic component comprises an element body, an external electrode, and an insulating resin coating layer. The element body has a pair of end faces opposed to each other, a pair of principal faces extending so as to connect the pair of end faces and opposed to each other, and a pair of side faces extending so as to connect the pair of principal faces and opposed to each other. The external electrode is formed so as to cover at least a partial region of the principal face and/or a partial region of the side face and has a plating layer comprised of Sn or an Sn alloy. The insulating resin coating layer covers at least the portion of the external electrode formed so as to cover the side face. | 04-28-2016 |
20160126012 | MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a multilayer ceramic capacitor includes stacking dielectric sheets on which internal electrode patterns are printed, to form a multilayer body, forming additional dielectric sheets on portions of opposite side surfaces of the multilayer body, and sintering the multilayer body to form a ceramic body in which internal electrodes are disposed. Here, the additional dielectric sheets form attachment parts on the opposite side surfaces of the ceramic body by the sintering of the multilayer body. | 05-05-2016 |
20160126014 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic electronic component includes an inner layer part comprising dielectric layers and internal electrodes that are alternately disposed; and cover parts disposed on upper and lower surfaces of the inner layer part. The cover parts contain a nickel metal. | 05-05-2016 |
20160126016 | FILM CAPACITOR - A film capacitor includes metalized films in each of which a metal electrode is formed on a surface of a dielectric film, the metalized films being stacked in a thickness direction. The dielectric film includes a high dielectric layer that has a relatively high content of a high dielectric filler, and a low dielectric layer that has a relatively low content of the high dielectric filler or that does not contain the high dielectric filler. The low dielectric layer is provided in at least one of a position between the high dielectric layer and the metal electrode, and a position on an opposite side of the high dielectric layer from the metal electrode. | 05-05-2016 |
20160133384 | MULTILAYER ELECTRONIC COMPONENT - A multilayer electronic component includes a ceramic body including a plurality of dielectric layers, a plurality of capacitor parts disposed in the ceramic body, including a plurality of internal electrodes alternately exposed to both end surfaces of the ceramic body in a length direction of the ceramic body, and having different capacitances, and first and second external electrodes formed on both end surfaces of the ceramic body in the length direction of the ceramic body and connected to the plurality of internal electrodes, wherein the plurality of capacitor parts include three or more capacitor parts and connected in parallel with each other. | 05-12-2016 |
20160133385 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT - Solder-repellent portions are each arranged so as to extend over all or substantially all of a portion of a corresponding one of outer electrodes provided on a corresponding one of end surfaces of a monolithic ceramic electronic component and partially on portions of the outer electrode provided over two side surfaces of the monolithic ceramic electronic component. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to the end surfaces and portions of the outer electrode provided on portions of the two side surfaces. Thus, expansion and contraction that occur as a result of application of an AC voltage is not transmitted or is not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are significantly reduced or prevented. | 05-12-2016 |
20160141103 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - A multilayer ceramic capacitor includes a ceramic element body including internal electrodes therein. External electrodes are provided on end surfaces of the ceramic element body and electrically connected to exposed portions of respective ones of the internal electrodes. Each of the external electrodes includes a sintered metal layer, a conductive resin layer, and a plating layer. In a cross section including a first interface between the sintered metal layer and the conductive resin layer, the sintered metal layer includes a plurality of recesses each including an inlet extending along the first interface and an inner portion extending from the first interface into the sintered metal layer, each of the recesses having a shape in which a dimension of the inner portion is larger than a dimension of the inlet measured along the first interface, and in a cross section including a second interface between the conductive resin layer and the plating layer, a number of the metal particles exposed from the conductive resin layer in a portion of the second interface with a length of about 1 mm is 50 to 250. | 05-19-2016 |
20160141104 | THREE-TERMINAL CAPACITOR - A three terminal capacitor includes a capacitor element including first through sixth surfaces, first-side and second-side outer electrodes, a center outer electrode between the first-side and second-side outer electrodes, and conductor layers. The conductor layers include a pair of outermost conductor layers that are respectively nearest to the fifth and sixth surfaces, and thicknesses of the pair of outermost conductor layers are greater than a thickness of a center conductor layer nearest to a center of the capacitor element in a width direction. | 05-19-2016 |
20160141105 | THREE-TERMINAL CAPACITOR - A three-terminal capacitor includes a capacitor element including first through sixth surfaces, first-side and second-side outer electrodes, a center outer electrode between the first-side and second-side outer electrodes, and conductor layers within the capacitor element. A height H | 05-19-2016 |
20160155569 | MULTILAYER CAPACITOR AND MANUFACTURING METHOD FOR SAME | 06-02-2016 |
20160155570 | MULTILAYER CERAMIC CAPACITOR AND METHOD FOR PRODUCING MULTILAYER CERAMIC CAPACITOR | 06-02-2016 |
20160155571 | LAMINATED CERAMIC CAPACITOR AND METHOD FOR MANUFACTURING LAMINATED CERAMIC CAPACITOR | 06-02-2016 |
20160163453 | MULTILAYER CERAMIC CAPACITOR - A ceramic body includes outer layer portions of about 15 μm or more and about 25 μm or less in thickness outside an inner layer portion where internal electrodes are stacked with dielectric ceramic layers interposed therebetween, the inner layer portion includes inner cover electrodes opposed to the internal electrode located outermost in the stacking direction with the dielectric ceramic layers interposed therebetween, the outer layer portions include outer cover electrodes opposed to the inner cover electrodes with the dielectric ceramic layers interposed therebetween, the inner cover electrodes have a coverage of about 75% or more and about 100% or less, the outer cover electrodes have a coverage of about 50% or more and about 70% or less, and boundary layers containing Mg and Mn are provided at the boundaries between the outer cover electrodes and the dielectric ceramic layers located outside the electrodes. | 06-09-2016 |
20160163454 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes an element body, a first terminal electrode, a second terminal electrode, a plurality of first internal electrode groups, and a plurality of second internal electrode groups. The plurality of first internal electrode groups each include a first number of first internal electrodes connected to the first terminal electrode and arranged in the first direction inside the element body. The plurality of second internal electrode groups each include a second number of second internal electrodes connected to the second terminal electrode and arranged in the first direction inside the element body. The first internal electrode groups and the second internal electrode groups are arranged alternately in the first direction. One of first internal electrodes included in each of the first internal electrode groups and one of second internal electrodes included in each of the second internal electrode groups are opposed to each other. | 06-09-2016 |
20160163455 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes an element body, a first terminal electrode, a second terminal electrode, and a plurality of internal electrodes. The plurality of internal electrodes include a plurality of first internal electrodes, a plurality of second internal electrodes, a plurality of third internal electrodes, and a plurality of fourth internal electrodes. The element body includes a plurality of first and second regions. The first regions are located between the first internal electrodes opposed with each other. The second regions are located between the first internal electrodes opposed to each other through the third internal electrodes, and between the second internal electrodes opposed to each other through the fourth internal electrodes. The first regions and the second regions are alternately located in the first direction. | 06-09-2016 |
20160163457 | DIELECTRIC CERAMIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME - There is provided a dielectric ceramic composition including a base powder, wherein the base powder includes: a first major component represented by BaTiO | 06-09-2016 |
20160163458 | CERAMIC DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR CONTAINING THE SAME - A ceramic dielectric composition contains a base material powder represented by one or more of (Ca | 06-09-2016 |
20160163459 | THREE-TERMINAL CAPACITOR - A capacitor element includes first through sixth surfaces, a first-side outer electrode at a first end portion of the first surface and on portions of the third, fifth, and sixth surfaces, a second-side outer electrode at a second end portion of the first surface and on portions of the fourth, fifth, and sixth surfaces, a center outer electrode at a portion of the first surface between the first-side outer electrode and the second-side outer electrode and on portions of the fifth and sixth surfaces, and two outermost conductor layers of first and second conductor layers are disposed at both outermost ends in the width direction, a first of the two outermost conductor layers next to one of the first conductor layers with an inner dielectric layer therebetween is connected to the center outer electrode, and a second of the pair of outermost conductor layers next to one of the second conductor layers with an inner dielectric layer therebetween is connected to the first-side outer electrode and the second-side outer electrode. | 06-09-2016 |
20160168036 | LOW-TEMPERATURE SINTERING DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR FORMED THEREOF | 06-16-2016 |
20160172107 | DIELECTRIC CERAMIC COMPOSITION, DIELECTRIC MATERIAL AND MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME | 06-16-2016 |
20160172108 | MULTILAYER CERAMIC ELECTRONIC COMPONENT | 06-16-2016 |
20160172109 | MULTILAYER CERAMIC CAPACITOR | 06-16-2016 |
20160172110 | MULTILAYER CERAMIC ELECTRONIC COMPONENT | 06-16-2016 |
20160181016 | MULTILAYER CERAMIC ELECTRONIC COMPONENT | 06-23-2016 |
20160181018 | MULTILAYER FILM CAPACITOR | 06-23-2016 |
20160181019 | MULTILAYER CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME | 06-23-2016 |
20160189865 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor has a laminate including dielectric layers laminated alternately with internal electrode layers of different polarities, wherein the dielectric layer contains ceramic grains having Ba, Ti, and X (wherein X represents at least one type of element selected from the group consisting of Mo, Ta, Nb, and W) and a variation in the concentration distribution of X above in the ceramic grain is within ±5%. The multilayer ceramic capacitor can offer excellent service life characteristics even when the thickness of the dielectric layer is 0.8 μm or less, as well as excellent bias characteristics. | 06-30-2016 |
20160189867 | THROUGH-TYPE MULTILAYER CERAMIC CAPACITOR - In an embodiment, a through-type multilayer ceramic capacitor | 06-30-2016 |
20160189868 | MULTILAYER CERAMIC CAPACITOR - In an embodiment, a capacitor body | 06-30-2016 |
20160194248 | DIELECTRIC CERAMIC COMPOSITION, DIELECTRIC MATERIAL AND MULTILAYER CERAMIC CAPACITOR INCLUDING THE SAME | 07-07-2016 |
20160196917 | MULTILAYER CERAMIC ELECTRONIC COMPONENT | 07-07-2016 |
20160196919 | CERAMIC GREEN SHEET, METHOD FOR MANUFACTURING MULTILAYER CERAMIC CAPACITOR, AND MULTILAYER CERAMIC CAPACITOR | 07-07-2016 |
20160196922 | MULTILAYER CERAMIC ELECTRONIC COMPONENT | 07-07-2016 |
20160203911 | SURFACE-TREATED METAL POWDER, AND METHOD FOR PRODUCING SAME | 07-14-2016 |
20160203912 | Ceramic Multi-Layer Capacitor Based on BaTi(1-y)ZryO3 | 07-14-2016 |
20160254093 | STRUCTURAL CAPACITOR AND METHOD FOR MAKING THE SAME | 09-01-2016 |
20160254094 | CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME | 09-01-2016 |
20160379758 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a multilayer body and a pair of outer electrodes on end surfaces of the multilayer body. The multilayer body includes a stack of ceramic layers and inner electrodes electrically connected to the outer electrodes. Each of the pair of outer electrodes includes an underlying electrode layer on a surface of the multilayer body, an intermediate metal layer on a surface of the underlying electrode layer, and a conductive resin layer on a surface of the intermediate metal layer. The underlying electrode layer contains Ni, and the intermediate metal layer contains a Cu—Ni—Sn alloy. | 12-29-2016 |
20170236644 | METHODS AND SYSTEMS TO MINIMIZE DELAMINATION OF MULTILAYER CERAMIC CAPACITORS | 08-17-2017 |
20170236645 | MULTILAYER CERAMIC CAPACITOR | 08-17-2017 |
20190148068 | MULTILAYER CAPACITOR | 05-16-2019 |
20190148072 | HIGH-DENSITY METAL-INSULATOR-METAL CAPACITORS | 05-16-2019 |
20190148076 | MULTILAYER CERAMIC ELECTRONIC PART AND METHOD OF MANUFACTURING THE SAME | 05-16-2019 |
20220139616 | MULTILAYER CAPACITOR AND METHOD OF MANUFACTURING THE SAME - A multilayer capacitor includes a body including a stack structure in which a plurality of dielectric layers are stacked and a plurality of internal electrodes stacked with respective dielectric layers interposed therebetween, external electrodes disposed on external surfaces of the body and connected to the internal electrodes, and an insulating layer covering a surface of the body. One of the external electrodes includes a metal layer connected to the insulating layer, and the insulating layer includes an oxide of a metal component of the metal layer. | 05-05-2022 |
20220139623 | DIELECTRIC COMPOSITION AND MULTILAYER CAPACITOR INCLUDING THE SAME - There are provided a dielectric composition and a multilayer capacitor including the same. The dielectric composition contains: barium titanate (BaTiO | 05-05-2022 |
20220139625 | MULTILAYER CAPACITOR - A multilayer capacitor includes a body including a multilayer structure in which a plurality of dielectric layers are stacked in a first direction and a plurality of internal electrodes stacked with the dielectric layer interposed therebetween and external electrodes formed outside the body and connected to the internal electrodes. The body includes an active portion and a side margin portion covering the active portion and opposing each other in a second direction, and 105-05-2022 | |
20220139627 | MULTILAYER CERAMIC ELECTRONIC COMPONENT - A multilayer ceramic electronic component includes a ceramic body including pluralities of first and second internal electrodes alternately disposed to face each other with respective dielectric layers interposed therebetween. First and second external electrodes are disposed on external surfaces of the ceramic body and are respectively electrically connected to the first and second external electrodes. A first dummy electrode is disposed in a margin portion of the ceramic body adjacent the first internal electrode in a third direction, and a second dummy electrode is disposed in a margin portion of the ceramic body adjacent the second internal electrode in the third direction. A distance (Ld) between the first and second dummy electrodes in a second direction, and a length (Lm) of each margin portion between one of the first and second internal electrodes and an external surface of the ceramic body in the second direction, satisfy Ld≤Lm. | 05-05-2022 |
20220139629 | ELECTRONIC COMPONENT - An electronic component includes at least one first multilayer capacitor and at least one second multilayer capacitor alternatively laminated in a first direction perpendicular to one surface of the first multilayer capacitor, such that an external electrode of the first multilayer capacitor is connected to an external electrode of the second multilayer capacitor. In the first multilayer capacitor, a plurality of internal electrodes are laminated in a first direction, and in the second multilayer capacitor, a plurality of internal electrodes are laminated in a second direction perpendicular to the first direction. | 05-05-2022 |
20220139633 | MULTILAYER CERAMIC CAPACITOR PACKAGE - A multilayer ceramic capacitor package accommodating multilayer ceramic capacitors includes a carrier tape that is elongated and includes recess pockets at equal or substantially equal intervals in a longitudinal direction, a cover tape that is elongated and attached to the carrier tape to cover an opening of each of the pockets, and the multilayer ceramic capacitors respectively accommodated in the pockets. In the multilayer ceramic capacitor package, in adjacent multilayer ceramic capacitors, a difference in densities of surfaces on an opening side of the pockets is about 0% or more and about 4% or less. | 05-05-2022 |