Class / Patent application number | Description | Number of patent applications / Date published |
356237400 | On patterned or topographical surface (e.g., wafer, mask, circuit board) | 59 |
20080204735 | APPARATUS AND METHOD FOR MEASURING STRUCTURES ON A MASK AND OR FOR CALCULATING STRUCTURES IN A PHOTORESIST RESULTING FROM THE STRUCTURES - An apparatus ( | 08-28-2008 |
20080204736 | Defect Inspection Method and Defect Inspection Apparatus - Provided are a defect inspection apparatus having a large range for receiving light scattering from fine defects while securing a sufficiently large signal strength; and a defect inspection method for the same. The defect inspection apparatus includes: a stage part capable of traveling relative to optical systems with a substrate to be inspected mounted on the stage part; an illumination optical system for illuminating an inspection area on the substrate; a detection optical system for detecting light coming from the inspection area on the substrate; an image sensor for converting, to a signal, an image which is formed on the image sensor by the detection optical system; a signal processor for detecting defects by processing the signal from the image sensor; and a plane reflecting mirror, arranged between the detection optical system and the substrate, for transmitting the light, which comes from the substrate, to the detection optical system. | 08-28-2008 |
20080225282 | Beam delivery system for laser dark-field illumination in a catadioptric optical system - A method and apparatus for inspecting a specimen are provided. The apparatus comprises a primary illumination source, a catadioptric objective exhibiting central obscuration that directs light energy received from the primary illumination source at a substantially normal angle toward the specimen, and an optical device, such as a prism or reflective surface, positioned within the central obscuration resulting from the catadioptric objective for receiving further illumination from a secondary illumination source and diverting the further illumination to the specimen. The method comprises illuminating a surface of the specimen at a variety of angles using a primary illumination source, illuminating the surface using a secondary illumination source, the illuminating by the secondary illumination source occurring at a substantially normal angle of incidence; and imaging all reflected, scattered, and diffracted light energy received from the surface onto a detector. | 09-18-2008 |
20080278717 | CONTAMINATION-INSPECTING APPARATUS AND DETECTION CIRCUIT - The detection part has: a subtraction module for calculating correction data from data of detection systems when a reference-voltage generation module applies a reference voltage to the detection systems; a data-holding module for holding the correction data; an addition module for making a correction of detection data; a comparison module for comparing the detection data with switching data; and a selector for switching data of the detection systems including data subjected to the correction according to the output of the comparison module. | 11-13-2008 |
20080285021 | WAFER INSPECTING METHOD AND DEVICE - A wafer inspecting method including the steps of scanning the surface of a wafer along a street by using a line sensor having a plurality of elements arranged in a line, and determining a deposited condition of foreign matter on the surface of the wafer near electrodes formed on both sides of the street according to image information obtained by the above scanning step. By the use of the linear sensor, it is possible to efficiently determine whether or not the electrodes are good. | 11-20-2008 |
20080285022 | Visual inspection apparatus - A visual inspection apparatus includes: a first substrate holding portion that holds a substrate so that a top surface is observable; a second substrate holding portion that holds the substrate so that a bottom surface is observable; a first substrate holding portion moving mechanism that moves the first substrate holding portion; a second substrate holding portion moving mechanism that moves the second substrate holding portion; and a control device that controls the first substrate holding portion moving mechanism and the second substrate holding portion moving mechanism so that the position of the substrate when observing the top surface of the substrate in the first substrate holding portion substantially matches the position of the substrate when observing the bottom surface of the substrate in the second substrate holding portion. | 11-20-2008 |
20080297781 | WAFER SURFACE INSPECTION APPARATUS AND WAFER SURFACE INSPECTION METHOD - A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles. | 12-04-2008 |
20080297782 | WAFER SURFACE INSPECTION APPARATUS AND WAFER SURFACE INSPECTION METHOD - A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles. | 12-04-2008 |
20080304054 | Method for Analyzing an Integrated Circuit, Apparatus and Integrated Circuit - A method for analyzing an integrated circuit (IC) comprising a plurality of semiconductor devices is disclosed. The method comprises the steps of forming a diffraction lens ( | 12-11-2008 |
20080316474 | Optical Apparatus and an Observation Apparatus Having the Same For Observing Micro Particles - Disclosed is an optical device for illuminating a chip having a sample provided thereto with a beam in an apparatus for observing the sample. The optical device comprises a light source; and a first reflector reflecting the beam of the light source to allow the reflected beam to be incident on the chip at an inclined angle. In addition, the invention provides an apparatus for observing micro particles having the optical device. When the light of the light source is incident on the sample at an incline angle according to the optical device of the invention, it is possible to maximize a transmittancy of the light. Accordingly, the light emitted from the sample is clearer and a clear image can be thus obtained. | 12-25-2008 |
20090002695 | Method and Apparatus for Reviewing Defect - The present invention provides an apparatus and a method for reviewing a defect with high throughput by detecting the defect to be reviewed with high sensitivity, comprising: an optical microscope; a correction means; and a scanning electron microscope which reviews the defect existed on the sample; wherein the optical microscope has: an optical height detection system which optically detects a vertical position of an upper surface of the sample placed on the stage; an illumination optical system which illuminates the defect with light; an image detection optical system which converges and detects reflected light or scattered light generated from the defect illuminated by the illumination optical system to obtain an image signal; and a focus adjusting means which adjusts a focus position of the optical microscope based on the vertical position of the upper surface of the sample, which is detected by the optical height detection system. | 01-01-2009 |
20090046280 | MASK DEFECT INSPECTION DATA GENERATING METHOD, MASK DEFECT INSPECTION METHOD AND MASK PRODUCTION METHOD - According to a mask defect inspection data generating method, a distance between inspection areas neighboring in a predetermined direction is calculated based on inspection area control information defined in photomask inspection data. It is determined whether or not the calculated distance between inspection areas is less than a predetermined distance. When it is determined that the distance between inspection areas is less than a predetermined distance, the inspection area is combined to produce an optimization inspection area. The produced optimization inspection area information is defined in inspection layout data for making a reference in die-to-database defect inspection. | 02-19-2009 |
20090059216 | DEFECT INSPECTION METHOD AND DEFECT INSPECTION APPARATUS - A defect inspection apparatus comprises: a stage which scans a sample in a horizontal plane; an illumination optical system which illuminates light at an oblique angle with respect to a normal of a sample surface, and illuminates light in a linear form on the sample at an angle inclined to a direction perpendicular to the scanning direction of the stage; a front scattered light detection optical system which is disposed in the same orientation as the scanning direction, positioned at an elevation angle where a specular reflection light from a pattern parallel to the scanning direction is not spatially detected, and detects scattered light from a region illuminated in the linear form; an image sensor detecting an image formed by the front scattered light detection optical system; and an image processing unit performing a comparison operation of the image detected by the image sensor, thereby determining a defect candidate. | 03-05-2009 |
20090091751 | MULTICHIP CCD CAMERA INSPECTION SYSTEM - In one embodiment, a surface inspection system comprises a radiation source that emits a broadband radiation beam, a radiation directing assembly to target radiation onto a surface of an object, the radiation directing assembly comprising a radiation collection assembly to collect radiation reflected from the surface of the object, the radiation collection assembly comprising at least one multi-chip detector array assembly positioned within a field of view of the inspection system. | 04-09-2009 |
20090103079 | APPARATUS AND METHOD FOR INSPECTING DEFECT IN OBJECT SURFACE - An aspect of the invention provides a defect inspection apparatus being able to accurately inspect a micro foreign matter or defect at a high speed for an inspection target substrate in which a repetitive pattern and a non-repetitive pattern are mixed. | 04-23-2009 |
20090116004 | Surface Inspection System with Improved Capabilities - Pixel intensities indicative of scattered radiation from portions of the inspected surface surrounding a location of a potential anomaly are also stored so that such data is available for quick review of the pixel intensities within a patch on the surface containing the location of the potential anomaly. Where rotational motion is caused between the illumination beam and the inspected surface, signal-to-noise ratio may be improved by comparing the pixel intensities of pixels at corresponding positions on two different surfaces that are inspected, where corresponding pixels at the same relative locations on the two different surfaces are illuminated and scattered radiation therefrom collected and detected under the same optical conditions. | 05-07-2009 |
20090122304 | Apparatus and Method for Wafer Edge Exclusion Measurement - A substrate illumination and inspection system provides for illuminating and inspecting a substrate particularly the substrate edge. The system uses a light diffuser with a plurality of lights disposed at its exterior or interior for providing uniform diffuse illumination of a substrate. An optic and imaging system exterior of the light diffuser are used to inspect the plurality of surfaces of the substrate including specular surfaces. An automatic defect characterization processor is provided. | 05-14-2009 |
20090122305 | DETECTION CIRCUIT AND FOREIGN MATTER INSPECTION APPARATUS FOR SEMICONDUCTOR WAFER - In a foreign matter inspection apparatus for a semiconductor wafer, a PMT which detects reflection light, an amplifier which amplifies a signal detected by the PMT and in which response characteristics of amplification are controlled by a control signal, an A/D converter which converts the signal amplified by the amplifier into a predetermined code and outputs the code, a control circuit which generates a control signal based on information of the semiconductor wafer having a correlation with the reflection light, and a data processing circuit which detects a foreign matter on the semiconductor wafer based on the code output from the A/D converter are provided. | 05-14-2009 |
20090168055 | Semiconductor Manufacturing Peripheral Verification Tool - Apparatus and methods for verification of the dimensions of a semiconductor manufacturing peripheral are disclosed, in which the peripheral, e.g., a wafer cassette, is positioned between, and is enveloped by, an emitter housing and an opposing receiver housing adapted for emitting and receiving, respectively, light from a selected portion of the electromagnetic spectrum, preferably infrared. The measured light is used to verify the dimensions of the target peripheral in comparison with a pre-selected standard. | 07-02-2009 |
20090168056 | PATTERN FORMATION DEVICE - A pattern formation device is for forming a pattern on a substrate includes first and second foreign matter detection sensors. Each of the first and second foreign matter detection sensors includes a light projecting unit and a light receiving unit disposed across a transport path of the substrate from the first light projecting unit. The light projecting unit is configured and arranged to emit a detection light along an upper surface of the substrate. The light receiving unit being configured and arranged to receive the detection light to detect foreign matter on the substrate based on an amount of the detection light received by the light receiving unit. The light projecting units of the first and second foreign matter detection sensors are disposed on opposite sides of the transport path. | 07-02-2009 |
20090207406 | PARTICLE INSPECTION APPARATUS, EXPOSURE APPARATUS, AND DEVICE MANUFACTURING METHOD - A particle inspection apparatus includes an irradiation unit configured to apply a light beam onto front and back surfaces of an object to be inspected, first and second detection units configured to detect scattering light from the surfaces, a calculation unit configured to conduct a particle inspection on the surfaces on the basis of outputs from the detection units, and a control unit configured to control the irradiation unit, the detection units, and the calculation unit. The irradiation unit can selectively apply the beam onto the front or back surface. The control unit causes the calculation unit to conduct the particle inspection on the inspection surface on which the light beam is selectively applied, on the basis of outputs made by the detection unit corresponding to simultaneous application and selective application of the light beam. | 08-20-2009 |
20090257053 | High Numerical Aperture Catadioptric Objectives Without Obscuration and Applications Thereof - Disclosed are high numerical (NA) catadioptric objectives without a central obscuration, and applications thereof. Such objectives can operate through a wide spectral bandwidth of radiation, including deep ultraviolet (DUV) radiation. Importantly, refractive elements in the catadioptric objectives can be manufactured from a single type of material (such as, for example, CaF | 10-15-2009 |
20090262340 | OPTICAL EXTERIOR INSPECTION APPARATUS AND METHOD - An inspected object (e.g., a reticle) is stored in an immersion cassette filled with a liquid having a specific refraction factor. An inspection beam is irradiated toward the inspected object, which is subjected to precise positioning, via an objective lens while being refracted by the liquid, thus producing a reflected inspection beam reflected by the inspected object and a transmitted inspection beam transmitted through the inspected object. Image processing is performed based on at least one of the reflected inspection beam and the transmitted inspection beam, thus producing an inspected image of the inspected object. The inspected image is compared with a prescribed circuit pattern so as to inspect the existence and nonexistence of foreign matter or structural defects on the exterior of the inspected object. Thus, it is possible to secure an adequate focal depth of the objective lens while achieving a high resolution in imaging the inspected object. | 10-22-2009 |
20100020316 | INSPECTION APPARATUS, EXPOSURE APPARATUS, AND METHOD OF MANUFACTURING DEVICE - An inspection apparatus includes a projecting unit, a first receiving unit, a second receiving unit, and a controller. The projection unit is configured to project linear light on a surface of an object. The first and second receiving units are configured to receive scattered light of the projected linear light. The controller is configured to scan the projecting unit, the first and second receiving units and determine the present or absence of a foreign substance on the surface based on intensity distribution signals output from the first and second receiving units. | 01-28-2010 |
20100053603 | Surface inspection apparatus and surface inspection method - A surface inspection apparatus includes an illuminating part illuminating an edge part of a substrate from a direction deviated from a direction of normal line of the edge part by an angle being predetermined, the edge part being inclined and the substrate being an inspection target, an imaging optics forming an image from a diffracted light from a captured area of the edge part as a dark field image, an imaging part capturing the dark field image obtained by the imaging optics, and a detecting part detecting a defect based on whether or not a striated image appears on the dark field image corresponding to the edge part obtained by the imaging part. | 03-04-2010 |
20100073671 | ALIGNMENT MARK AND DEFECT INSPECTION METHOD - A defect inspection method is disclosed. A first type defect inspection system is used to perform a first defect inspection by aligning to an alignment mark on a wafer as a reference point for the first defect inspection. A fabrication process is performed on the wafer thereafter, and a second defect inspection is performed by using a second type defect inspection system to align the alignment mark on the wafer as the reference point for the second defect inspection. | 03-25-2010 |
20100103409 | METHOD AND APPARATUS FOR DETECTING DEFECTS - An inspection apparatus projects a laser beam on the surface of a SOI wafer and detects foreign matter on and defects in the surface of the SOI wafer by receiving scattered light reflected from the surface of the SOI wafer. The wavelength of the laser beam used by the inspection apparatus is determined so that a penetration depth of the laser beam in a Si thin film may be 10 nm or below to detect only foreign matter on and defects in the outermost surface and not to detect foreign matter and defects in a BOX layer. Only the foreign matter on and defects in the outermost surface layer can be detected without being influenced by thin-film interference by projecting the laser beam on the surface of the SOI wafer and receiving scattered light rays. | 04-29-2010 |
20100208250 | Producing method of wired circuit board - A producing method of a wired circuit board includes the steps of applying light from above the wired circuit board toward the wired circuit board, and sensing pattern reflected light which is the light reflected by a conductive pattern, table reflected light which is the light reflected by a support table via an insulating layer exposed from the conductive pattern, and foreign-matter reflected light which is the light reflected by a foreign matter present on the insulating layer to inspect the conductive pattern and the foreign matter based on a contrast therebetween. A reflectance of the table reflected light is in a range of 30 to 70%, and a reflectance of the foreign-matter reflected light is in a range of not more than 10%. | 08-19-2010 |
20100238434 | FOREIGN SUBSTANCE INSPECTION APPARATUS - A foreign substance inspection apparatus includes an irradiating unit and first and second detecting units. The irradiating unit is configured to emit irradiating light to be obliquely incident on a surface to be inspected to form a linear irradiation region on the surface to be inspected. The first and second detecting units are arranged on the same side as that provided with the irradiating unit with respect to the surface to be inspected, and they are configured to detect scattered light caused by a foreign substance on the surface to be inspected. The first and second detecting units are arranged at opposite positions with respect to a plane containing the linear irradiation region. | 09-23-2010 |
20100253938 | OPTICAL INSPECTION METHOD AND OPTICAL INSPECTION APPARATUS - In the conventional contaminant particle/defect inspection method, if the illuminance of the illumination beam is held at not more than a predetermined upper limit value not to give thermal damage to the sample, the detection sensitivity and the inspection speed being in the tradeoff relation with each other, it is very difficult to improve one of the detection sensitivity and the inspection speed without sacrificing the other or improve both at the same time. The invention provides an improved optical inspection method and an improved optical inspection apparatus, in which a pulse laser is used as a light source, and a laser beam flux is split into a plurality of laser beam fluxes which are given different time delay to form a plurality of illumination spots. The scattered light signal from each illumination spot is isolated and detected by using a light emission start timing signal for each illumination spot. | 10-07-2010 |
20100259751 | DEFECTS INSPECTING APPARATUS AND DEFECTS INSPECTING METHOD - An inspecting apparatus and method including first and second illuminating units for illuminating a surface of a specimen to be inspected with different incident angles and first and second detecting optical units arranged at different elevation angle directions to the surface of the specimen for detecting images of the specimen illuminated by the first and second illuminating units. | 10-14-2010 |
20100271627 | Defect Inspection Method and Defect Inspection Apparatus - Provided are a defect inspection apparatus having a large range for receiving light scattering from fine defects while securing a sufficiently large signal strength; and a defect inspection method for the same. The defect inspection apparatus includes: a stage part capable of traveling relative to optical systems with a substrate to be inspected mounted on the stage part; an illumination optical system for illuminating an inspection area on the substrate; a detection optical system for detecting light coming from the inspection area on the substrate; an image sensor for converting, to a signal, an image which is formed on the image sensor by the detection optical system; a signal processor for detecting defects by processing the signal from the image sensor; and a plane reflecting mirror, arranged between the detection optical system and the substrate, for transmitting the light, which comes from the substrate, to the detection optical system. | 10-28-2010 |
20100271628 | METHOD AND APPARATUS FOR DETECTING DEFECTS - A method and apparatus for detecting defects are provided for detecting harmful defects or foreign matter with high sensitivity on an object to be inspected with a transparent film, such as an oxide film, by reducing noise due to a circuit pattern. The apparatus for detecting defects includes a stage part on which a substrate specimen is put and which is arbitrarily movable in each of the X-Y-Z-θ directions, an illumination system for irradiating the circuit pattern with light from an inclined direction, and an image-forming optical system for forming an image of an irradiated detection area on a detector from the upward and oblique directions. With this arrangement, diffracted light and scattered light caused on the circuit pattern through the illumination by the illumination system is collected. Furthermore, a spatial filter is provided on a Fourier transform surface for blocking the diffracted light from a linear part of the circuit pattern. The scattered and reflected light received by the detector from the specimen is converted into an electrical signal. The converted electrical signal of one chip is compared with that of the other adjacent chip. If these signals are not identical to each other, the foreign matter is determined to exist on the specimen in detection. | 10-28-2010 |
20110075137 | DEFECT INSPECTION SYSTEM - In a defect inspection system using a plurality of detectors such as an upright detector and an oblique detector, if illumination light and wafer height are adjusted to the detection field of view of one detector, a defocused image is detected by other remaining detectors, resulting in degradation of the detection sensitivity. The present invention solves this problem. | 03-31-2011 |
20110149276 | Method of Detecting a Particle and a Lithographic Apparatus - A detector detects radiation from a mask to form an image, but the focal plane of the image is in front of the mask. Any particles arranged on the mask will be in focus. However, the pattern on the mask will be out of focus. It is therefore possible to detect the existence and location of particles on a mask having an arbitrary pattern. The depth of field of the detector is small and the focal plane is no further from the surface of the patterning device than two times the depth of field. | 06-23-2011 |
20120002196 | System For Monitoring Foreign Particles, Process Processing Apparatus And Method Of Electronic Commerce - A system for monitoring foreign matter includes a manufacturing line having plural process processing apparatuses, a production management system which manages the processing of workpieces in the manufacturing line, plural optical heads which monitor foreign matter in relation to at least one of the workpieces, and which provide an output signal indicative thereof, and at least one image signal processing unit provided in a lesser number than a number of the plural optical heads for processing the output signal therefrom. | 01-05-2012 |
20120092657 | METHOD OF DEFECT INSPECTION AND DEVICE OF DEFECT INSPECTION - A method of inspecting defects and a device inspecting defects of detecting defects at high sensitivity and high capture efficiency even on various patterns existing on a wafer. In the device of inspecting defects, an illumination optical system is formed of two systems of a coherent illumination of a laser | 04-19-2012 |
20120133929 | INSPECTION METHOD AND INSPECTION APPARATUS - The present invention provides an inspection apparatus and inspection method. The inspection apparatus includes a stage mechanism for supporting an object under inspection. A spatial filter is provided in the detection optical system to inspect the object. A printer is used to print the results of the spatial filter. The spatial filter can be provided in the form of a Fourier transformed image. | 05-31-2012 |
20120188536 | IMPRINT APPARATUS, DETECTION METHOD, ARTICLE MANUFACTURING METHOD, AND FOREIGN PARTICLE DETECTION APPARATUS - The present invention provides an imprint apparatus for performing an imprint process of transferring a pattern onto a substrate by curing a resin on the substrate while the resin is in contact with a mold, and removing the mold from the cured resin, including a detection unit configured to detect a foreign particle existing on the substrate, wherein the detection unit includes an obtaining unit configured to irradiate a surface of the substrate with light, and obtain light from the surface of the substrate, and a specification unit configured to specify a shot region where a foreign particle existing on the substrate is positioned, based on the light obtained by the obtaining unit. | 07-26-2012 |
20120194809 | METHOD AND APPARATUS FOR DETECTING DEFECTS - A method and apparatus for detecting defects are provided for detecting defects or foreign matter on an object to be inspected. The apparatus includes a movable stage for mounting a specimen, an illumination system for irradiating a circuit pattern with light from an inclined direction, and an image-forming optical system for forming an image of an irradiated detection area on a detector from the upward and oblique directions. With this arrangement, diffracted light and scattered light caused on the circuit pattern through the illumination by the illumination system is collected. A spatial filter is provided on a Fourier transform surface for blocking the diffracted light from a linear part of the circuit pattern. The scattered and reflected light received by the detector is converted into an electrical signal. The converted electrical signal of one chip is compared with that of the other adjacent chip. | 08-02-2012 |
20120242984 | SURFACE DEFECT INSPECTION APPARATUS AND SURFACE DEFECT INSPECTION METHOD - A surface defect inspection apparatus includes a light source that emits light to a first position on a surface of a target at an angle inclined with respect to the surface of the target, a first photodetector that detects first reflected light of the light from the light source, the first reflected light being reflected at the first position, a second photodetector that detects second reflected light of the light from the light source, the second reflected light being reflected at a second position, the second position being closer to the light source than the first position and being separated from the surface of the target by a given distance, and a determining unit that determines whether or not foreign matter is present on the surface of the target on a basis of detection results obtained from the first photodetector and the second photodetector. | 09-27-2012 |
20130010290 | SURFACE INSPECTION DEVICE AND SURFACE INSPECTION METHOD - There are provided a surface inspection device and a surface inspection method which can inspect a surface of a test object with uniform detection sensitivity. A surface inspection device includes a test object moving stage, a lighting device, an inspection coordinate detection device, a light detector, an A/D converter, and a foreign object/defect determination unit. The lighting device is configured to change a dimension of a light spot in a circumferential direction based on a position of the light spot in a radial direction obtained by the inspection coordinate detection device. The density of irradiation light intensity of the light spot is made constant while the light spot is being moved for scanning between an outer peripheral portion and a central portion on the test object. | 01-10-2013 |
20130050689 | Large Particle Detection For Multi-Spot Surface Scanning Inspection Systems - The illumination power density of a multi-spot inspection system is adjusted in response to detecting a large particle in the inspection path of an array of primary illumination spots. At least one low power, secondary illumination spot is located in the inspection path of an array of relatively high power primary illumination spots. Light scattered from the secondary illumination spot is collected and imaged onto one or more detectors without overheating the particle and damaging the wafer. Various embodiments and methods are presented to distinguish light scattered from secondary illumination spots. In response to determining the presence of a large particle in the inspection path of a primary illumination spot, a command is transmitted to an illumination power density attenuator to reduce the illumination power density of the primary illumination spot to a safe level before the primary illumination spot reaches the large particle. | 02-28-2013 |
20130107248 | ENHANCED DEFECT SCANNING | 05-02-2013 |
20130194569 | SUBSTRATE INSPECTION METHOD - A substrate inspection apparatus for inspecting a substrate, on which a measurement object is formed, is shown. The substrate inspection method includes measuring a substrate, on which a measurement object is formed, generating a plane equation of the substrate, and acquiring a region of the measurement object formed on the substrate. After, by considering a height of measurement object a region of the measurement object is converted into a substrate plane by plane equation,. Then, the measurement object is inspected based on a region of the measurement object converted into a substrate plane by plane equation and a region of the measurement object by reference data. Therefore, an offset value of a measurement object is acquired according to a tilted pose of the substrate, and a distortion of measurement data is compensated by using the offset value, to improve a measurement credibility of a measurement object. | 08-01-2013 |
20130258329 | Inspection Apparatus, Inspection Method and Program for Inspection - In a first platen gap, a light emitting amount is decided to obtain a light receiving amount for inspection as a first light emitting amount for inspection. Subsequently, in a second platen gap, a light emitting amount is decided to obtain a light receiving amount for inspection as a second light emitting amount for inspection. An inspection on dot forming is performed, using a smaller light emitting amount for inspection between the first and second light emitting amounts for inspection, and using the platen gap in which the smaller light emitting amount for inspection is decided. | 10-03-2013 |
20130258330 | EVALUATION SUBSTRATE, DEFECT EXAMINATION METHOD AND DEFECT DETECTION DEVICE - The present invention provides an evaluation substrate for evaluating a foreign object defect included in an organic material, a defect examination method and defect detection device. The evaluation substrate of the present invention includes a substrate, a first film arranged on the substrate, and a second film arranged on the first film, wherein a film containing an organic material is formed on the second film; the first film being set lower than an etching rate of the second film with respect to an etchant used in etching the second film, the first film having the same or a smaller detection lower limit value of an optically detectable defect than a detection lower limit value of a defect of the second film; and a thickness of the second film being set to a value near an optically measured lowest or minimum Haze value. | 10-03-2013 |
20130293879 | DEFECT INSPECTION METHOD AND DEVICE THEREFOR - To process a signal from a plurality of detectors without being affected by a variation in the height of a substrate, and to detect more minute defects on the substrate, a defect inspection device is provided with a photoelectric converter having a plurality of rows of optical sensor arrays in each of first and second light-collecting/detecting unit and a processing unit for processing a detection signal from the first and the second light-collecting/detecting unit to determine the extent to which the positions of the focal points of the first and the second light-collecting/detecting unit are misaligned with respect to the surface of a test specimen, and processing the detection signal to correct a misalignment between the first and the second light-collecting/detecting unit, and the corrected detection signal outputted from the first and the second light-collecting/detecting unit are combined together to detect the defects on the test specimen. | 11-07-2013 |
20130308125 | METHOD FOR CHARACTERIZING A STRUCTURE ON A MASK AND DEVICE FOR CARRYING OUT SAID METHOD - A method is provided for characterizing a mask having a structure, comprising the steps of: —illuminating said mask under at least one illumination angle with monochromatic illuminating radiation, so as to produce a diffraction pattern of said structure that includes at least two maxima of adjacent diffraction orders, —capturing said diffraction pattern, —determining the intensities of the maxima of the adjacent diffraction orders, —determining an intensity quotient of the intensities. A mask inspection microscope for characterizing a mask in conjunction with the performance of the inventive method is also provided. | 11-21-2013 |
20140002814 | OBSERVATION DEVICE AND OBSERVATION METHOD | 01-02-2014 |
20140104604 | DISTINGUISHING FOREIGN SURFACE FEATURES FROM NATIVE SURFACE FEATURES - Provided herein is an apparatus, including a photon detector array; and a processing means configured for processing photon-detector-array signals corresponding to a first set of photons scattered from surface features of an article focused in a first focal plane and a second set of photons scattered from surface features of an article focused in a second focal plane, wherein the processing means is further configured for distinguishing foreign surface features of the article from foreign native features of the article. | 04-17-2014 |
20140118728 | DETECTION APPARATUS, LITHOGRAPHY APPARATUS, METHOD OF MANUFACTURING ARTICLE, AND DETECTION METHOD - The present invention provides a detection apparatus for detecting a foreign particle on a substrate, including a plate having a first pattern on a first face, a second pattern laid out on a second face different from the first face, a driving mechanism configured to bring the substrate and the plate into contact with each other, a measurement unit configured to measure a relative position deviation between the first pattern and the second pattern in a state in which the substrate and the plate are in contact with each other, and a processing unit configured to execute processing for detecting a foreign particle on the substrate based on the position deviation measured by the measurement unit. | 05-01-2014 |
20140218724 | Optical Inspector - An optical inspector includes a radiating source, a time varying beam reflector, a telecentric scan lens, a separating minor, and a first and second detector. The radiating source is configured to irradiate a first position on the time varying beam reflector with a source beam. The time varying beam reflector directs the source beam to the telecentric scan lens, which in turn directs the source beam to a sample. The telecentric scan lens directs specular reflection and near specular scattered radiation to the time varying beam reflector. The specular reflection is directed by the separating mirror to the first detector. The near specular scattered radiation is not reflected by the separating minor and propagates to the second detector. In response, the optical inspector determines the total reflectivity, the surface slope, or the near specular scattered radiation intensity of the sample. | 08-07-2014 |
20140333921 | INSPECTION METHOD AND INSPECTION APPARATUS - The field of view of an objective lens is divided into two areas, and a transmission image of a photomask and a composite image obtained by optically synthesizing a transmission image and a reflection image of the photomask are picked up in parallel. A drop image generated at an edge portion of a pattern portion in the composite image is deleted by limiter processing or masking processing, or is deleted by using primary-differentiated signals of a composite image signal and a transmission image signal. | 11-13-2014 |
20150022806 | DEFECT INSPECTION METHOD AND ITS DEVICE - To increase the illumination efficiency by facilitating the change of the incident angle of illumination light with a narrow illumination width according to an inspection object and enabling an illumination region to be effectively irradiated with light, provided is a defect inspection method for obliquely irradiating a sample mounted on a table that is moving continuously in one direction with illumination light, collecting scattered light from the sample obliquely irradiated with the illumination light, detecting an image of the surface of the sample formed by the scattered light, processing a signal obtained by detecting the image formed by the scattered light, and extracting a defect candidate, wherein the oblique irradiation of the light is implemented by linearly collecting light emitted from a light source, and obliquely projecting the collected light onto the surface of the sample, thereby illuminating a linear region on the surface of the sample. | 01-22-2015 |
20150055127 | Particulate Contamination Measurement Method and Apparatus - A particulate contamination measurement method and apparatus are discussed. The method, for example, comprises pressing a measurement surface ( | 02-26-2015 |
20150062570 | INSPECTING APPARATUS AND INSPECTING METHOD - According to one embodiment, an inspecting apparatus is provided with a contact position obtaining unit and an inspection status determining unit. The contact position obtaining unit obtains, by using an inspection result of whether there is a particle on an inspection surface of a holding object and coordinate information of a convex portion in an electrostatic chuck holding mechanism, a contact position of the inspection surface with the convex portion. The inspection status determining unit determines whether a size of the particle adhering to a contact region with the convex portion of the inspection surface is within an allowable range by using a first determining criterion value and determines whether the size of the particle adhering to a non-contact region with the convex portion of the inspection surface is within an allowable range by using a second determining criterion value larger than the first determining criterion value. | 03-05-2015 |
20160047755 | OPTICAL MEASURING APPARATUS AND METHOD FOR MEASURING PATTERNED SAPPHIRE SUBSTRATE - An optical measuring apparatus with a light source, an optical fiber connector, an optical probe, a plurality of optical fibers and an imaging processor is provided. The light source emits a first light beam. The optical fiber connector is disposed adjacent to the light source. The optical probe is disposed adjacent to the fiber connector and opposite the light source. The optical fibers are utilized to connect the light source, the optical fiber connector and the optical probe. The imaging processor is disposed on the same side as the light source, and is connected with the optical fiber connector. | 02-18-2016 |
20160091436 | METHOD AND SYSTEM FOR OPTICAL MEASUREMENTS - The present disclosure includes a method for optical measurements. The method includes providing a substrate with a structure for optical measurement on the substrate; and illuminating a light spot on the structure for optical measurement to obtain a measured light scattering spectrum. The method also includes performing a first matching process to obtain a plurality of matching standard optical scattering spectra and a plurality of first matching degrees, each standard optical scattering spectrum corresponding to one first matching degree; obtaining a plurality of combined optical scattering spectra based on the plurality of matching standard optical scattering spectra; and performing a second matching process to obtain a plurality second matching degree, each corresponding to one combined optical scattering spectrum. | 03-31-2016 |