Class / Patent application number | Description | Number of patent applications / Date published |
338314000 | Resistance element and base formed in layers | 15 |
20090267727 | Thin film resistor element and manufacturing method of the same - In order to provide a thin-film resistor and a manufacturing method thereof capable of restraining reduction of a Q-value of varactor by reducing a parasitic capacitance between the resistor and the substrate, the thin-film resistor includes a semiconductor substrate | 10-29-2009 |
20090284342 | CHIP RESISTOR AND METHOD FOR MANUFACTURING THE SAME - A chip resistor includes a resistor element, a reinforcing member, and a pair of electrodes. The resistor element includes a first surface and a second surface opposite to the first surface. The reinforcing member is bonded to the first surface of the resistor element. The pair of electrodes are formed on the second surface of the resistor element. The resistor element is formed with a slit located between the pair of electrodes. | 11-19-2009 |
20090302993 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A semiconductor device according to the present invention includes: a lower-surface oxidation preventing insulating film formed on a lower surface of a metal resistor element; an upper-surface oxidation preventing insulating film formed on an upper surface of the metal resistor element; and a side-surface oxidation preventing insulating film formed only near a side surface of the metal resistor element by performing anisotropic etching after being deposited on a whole surface of a wafer in a process separated from the lower-surface oxidation preventing insulating film and the upper-surface oxidation preventing insulating film. According to the present invention, it is possible to prevent the increase of the resistance value due to the oxidation of the metal resistor element and also to prevent the increase of the parasitic capacitance between metal wiring layers without complicating the fabrication process. | 12-10-2009 |
20100066483 | RF TERMINATING RESISTOR OF FLANGED CONSTRUCTION - An RF terminating resistor with a flange body, a planar layer structure, an upper face of a substrate, a resistance layer, an input conductor track, and an earth connection conductor track. The input conductor track electrically connected to opposite ends of the resistance layer. The substrate having a contact face, facing away from the layer structure. The flange body being bent around in a direction parallel to a first edge facing the earth conductor track, and a predetermined section bent around in a direction at right angles to this edge. The bent-around section extending in a space between a first plane, defined by the contact face, and a second plane, defined by the upper face, with the substrate abutting on the bent-around section connecting the contact face to the upper face and facing the earth connection conductor track on the upper face. | 03-18-2010 |
20100109834 | GEOMETRIC AND ELECTRIC FIELD CONSIDERATIONS FOR INCLUDING TRANSIENT PROTECTIVE MATERIAL IN SUBSTRATE DEVICES - A substrate device includes a layer of non-linear resistive transient protective material and a plurality of conductive elements that form part of a conductive layer. The conductive elements include a pair of electrodes that are spaced by a gap, but which electrically interconnect when the transient protective material is conductive. The substrate includes features to linearize a transient electrical path that is formed across the gap. | 05-06-2010 |
20110063072 | RESISTOR DEVICE AND METHOD FOR MANUFACTURING SAME - A resistor device includes a resistor plate having a first aperture, a second aperture, a third aperture and a fourth aperture respectively arranged on a first side, a second side, a third side and a fourth side thereof. A first electrode plate is coupled to the first side of the resistor plate and includes a first measurement zone and a second measurement zone disposed at opposite sides of the first aperture; and a second electrode plate is coupled to the third side of the resistor plate and including a third measurement zone and a fourth measurement zone disposed at opposite sides of the third aperture, wherein the first measurement zone and the third measurement zone are disposed at opposite sides of the second aperture, and the second measurement zone and the fourth measurement zone are disposed at opposite sides of the fourth aperture. | 03-17-2011 |
20110273266 | Resistor having parallel structure and method of fabricating the same - There are provided a resistor and a method of fabricating the same. More particularly, there are provided a resistor having a parallel structure capable of easily implementing a resistance value when forming a resistor directly on a wafer during a wafer process, and a method of fabricating the same. | 11-10-2011 |
20120062355 | NANOFLAT RESISTOR - A nanoflat resistor includes a first aluminum electrode ( | 03-15-2012 |
20120200383 | CURRENT SENSING RESISTOR - A resistor device includes a resistor plate and an electrode structure. The electrode structure includes an electrode layer and an auxiliary layer. The electrode layer is disposed at a first face of the resistor plate and includes a first portion and a second portion overlying a first side and a second side of the resistor plate, respectively, and a current path is conducted between the first portion and the second portion through the resistor plate. The auxiliary layer is disposed at a second face of the resistor plate and includes at least a first block and a second block overlying the first side of the resistor plate, and at least a third block overlying the second side of the resistor plate, wherein the first, second and third blocks of the auxiliary layer are separated from one another so that any current flow among the blocks is blocked. | 08-09-2012 |
20130127588 | HIGH FREQUENCY RESISTOR - An ultra wideband frequency compensated resistor and related methodologies for frequency compensation are disclosed. In exemplary configuration, a resistive layer is provided over a substrate, and a frequency compensating structure is provided over at least a portion of the resistive layer and separated therefrom by an insulative layer. In certain embodiments, the insulating layer may be an adhesive that may also be effective to secure a protective cover over the resistive material and supporting substrate. In selected embodiments, the frequency compensating structure corresponds to a plurality of conductive layers, one or more of which may be directly electrically connected to terminations for the resistive material while one or more of the conductive layers are not so connected. | 05-23-2013 |
20140077924 | RF Resistor with Lossy Traces - An RF power resistor includes: a lossy layer; and a dielectric layer. The lossy layer is shaped and/or sized as a transmission line. The lossy layer is made of a lossy material. The dielectric layer is made of a dielectric material. The lossy layer and the dielectric material are located to be adjacent to each other and in contact with each other. | 03-20-2014 |
20140085044 | Resistor and Resistance Element - A resistance element that includes a resistor made of a thin film containing VO | 03-27-2014 |
20140152419 | CHIP RESISTOR, METHOD OF PRODUCING CHIP RESISITOR AND CHIP RESISTOR PACKAGING STRUCTURE | 06-05-2014 |
20140266568 | CURRENT SENSING RESISTOR - A resistor device includes a resistor plate having opposite first and second surfaces; a first metal layer including first and second portions which are disposed on the first surface of the resistor plate at opposite first and second sides, respectively; and a second metal layer including a first sensing pad, a second sensing pad, a first current pad and a second current pad, separate from one another, wherein the first sensing pad and the first current pad are disposed on the first portion of the first metal layer and the second sensing pad and the second current pad are disposed on the second portion of the first metal layer. A protective layer is preferably provided, overlying the resistor plate and the first metal layer uncovered by the second metal layer. | 09-18-2014 |
20140333411 | CHIP RESISTOR AND ELECTRONIC DEVICE - [Object] To provide a chip resistor with which laser irradiation requires no extremely high positional accuracy, and a plating layer provided on a base and adjacent to a resistor element can be connected to an external conductive layer. [Solution] A chip resistor includes a base | 11-13-2014 |