Class / Patent application number | Description | Number of patent applications / Date published |
228245000 | Preplacing solid filler | 87 |
20080237314 | Method of joining electronic package capable of prevention for brittle fracture - Disclosed is a method of joining electronic package parts, comprising the steps of: reflowing lead-free solders containing alloy elements on top of each of the electronic package parts having a surface treated with copper or nickel; and mounting the surface treated electronic parts on the lead-free solders then reflowing the lead-free solders to generate intermetallic compound between the lead-free solders and the surface treated portion of each of the electronic parts. | 10-02-2008 |
20090008433 | CONDUCTOR BALL MOUNTING APPARATUS, CONDUCTOR BALL MOUNTING METHOD, MASK USED FOR MOUNTING CONDUCTOR BALL, AND MASK MANUFACTURING METHOD - There is provided a conductive ball mounting apparatus. The conductive ball mounting apparatus includes: a conductive ball mounting mask disposed to oppose a substrate having a plurality of pads coated with an adhesive flux, the conductive ball mounting mask having a plurality of ball mounting through holes for mounting each of conductive balls on each of the plurality of pads, the plurality of ball mounting through holes being arranged to oppose to the plurality of pads; and a conductive ball supplying unit for moving or removing the conductive balls on the conductive ball mounting mask by sucking an air on an upper surface side of the conductive ball mounting mask. The conductive ball mounting mask includes through portions formed to block passing of the conductive balls. | 01-08-2009 |
20090014504 | Method of Supplying Paste Solder Material and Metal Mask Therefor - When different paste solder materials are printed to circuit patterns on a substrate, a plurality of metal masks corresponding to kinds of solder materials are used so as to perform printing in a manner corresponding to each of the solder materials, so that the particular solder materials are supplied to particular components in the same flat surface. One of the metal mask is provided with a depression so that the mask does not contact the solder material which has already been printed, and the metal mask is further provided with another depression to reduce an amount of the solder material supplied. | 01-15-2009 |
20090072011 | METHOD OF MOUNTING CONDUCTIVE BALL AND CONDUCTIVE BALL MOUNTING APPARATUS - A method of mounting a conductive ball according to the present invention includes the steps of, disposing a mask on a substrate including connection pads, the mask having opening portions corresponding to the connection pad, supplying conductive balls on the mask, arranging the conductive balls on the connection pad of the substrate through the opening portions of the mask by moving the conductive balls to one end side of the mask by ball moving member (a brush), and removing excess conductive balls remaining on a region of the mask where the opening portions are provided, by bonding the excess conductive balls to a ball removal film (adhesive film). | 03-19-2009 |
20090120999 | HIGH TIN SOLDER ETCHING SOLUTION - A method is provided for the removal of tin or tin alloys from substrates such as the removal of residual tin solder from the molds used in the making of interconnect solder bumps on a wafer or other electronic device. The method is particularly useful for the well-known C4NP interconnect technology and uses an etchant composition comprising cupric ions and HCl. Cupric chloride and cupric sulfate are preferred. A preferred method regenerates cupric ions by bubbling air or oxygen through the etchant solution during the cleaning process. | 05-14-2009 |
20100051673 | METHOD AND DEVICE FOR TRANSFERRING A SOLDER DEPOSIT CONFIGURATION - Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate ( | 03-04-2010 |
20100059576 | TIN ALLOY SOLDER COMPOSITION - A lead-free and solder alloy composition for electronic assembly applications having reduced toxicity. The alloy composition comprises, by weight, about 0.2% to about 1% copper; about 0.001% to about 0.039% nickel; about 0.001% to about 0.039% cobalt; and the balance of tin. The alloy composition has a melting temperature of about 227° C., with superior wetting and mechanical strength making the alloy composition wells suited for electronic circuit board manufacture and lead less component bumping or column arrays, and replacement of conventional tin-lead solders. | 03-11-2010 |
20100089981 | APPARATUS FOR INTERCONNECTING CONNECTION PADS OF A HEAD-GIMBAL ASSEMBLY AND MANUFACTURING METHOD FOR THE HEAD-GIMBAL ASSEMBLY - An apparatus for interconnecting two connection pads in a head-gimbal assembly. The apparatus includes a conveyer for conveying a metallic slug, and a nozzle for ejecting the metallic slug toward the two connection pads. The nozzle includes a receiving portion for receiving the metallic slug from the conveyer, and a straight guide disposed downstream of the receiving portion. The straight guide has a maximum inner diameter that is smaller than a minimum inner diameter of the receiving portion. The apparatus also includes a laser for applying a laser beam from an inlet side of the nozzle to the metallic slug as the metallic slug passes along a path that includes a first portion through said straight guide and a second portion between the straight guide and the two connection pads. The laser is configured to melt the metallic slug for attaching the metallic slug to the two connection pads. | 04-15-2010 |
20110168763 | NANOTUBE MODIFIED SOLDER THERMAL INTERMEDIATE STRUCTURE, SYSTEMS, AND METHODS - An apparatus and system, as well as fabrication methods therefor, may include a thermal intermediate structure with metal decorated carbon nanotubes incorporated in solder. | 07-14-2011 |
20120111928 | SYSTEM AND METHOD FOR BRAZING - Systems and methods are provided for improved brazing. A system includes a gap filling compound (GFC). The GFC includes a brazing alloy. The system also includes a GFC retention screen. The GFC retention screen configured to be disposed over the GFC to retain the GFC within the gap during brazing. The GFC retention screen is also configured to enable gas to escape from the GFC during brazing. | 05-10-2012 |
20130181041 | MANUFACTURING METHOD OF SOLDER TRANSFER SUBSTRATE, SOLDER PRECOATING METHOD, AND SOLDER TRANSFER SUBSTRATE - An adhesive layer forming step of forming an adhesive layer on a surface of a substrate; a solder layer forming step of forming a solder layer on the adhesive layer by loading plural solder powders with in-between spaces; and a filler supplying step of supplying fillers to the in-between spaces of the solder powders that have been formed on the adhesive layer are included. | 07-18-2013 |
20130292457 | SOLDER SHEET AND SMOLDERING METHOD USING THE SAME - Disclosed herein are a solder sheet and a soldering method using the same. The solder sheet includes: a plurality of solder rods arranged to have a uniform height h and an area density N; and a support having an adhesive formed on one surface thereof and supporting the plurality of solder rods such that one end of each of the plurality of solder rods is attached to be perpendicular to the surface on which the adhesive is formed. Solder bumps can be formed on soldering portions of the substrate by using the solder sheet through a single process without a mask, and thus, the process can be simplified, costs can be reduced, and a defect rate can be lowered, thereby enhancing reliability. | 11-07-2013 |
20140284375 | MICROFEATURE WORKPIECES HAVING ALLOYED CONDUCTIVE STRUCTURES, AND ASSOCIATED METHODS - Microfeature workpieces having alloyed conductive structures, and associated methods are disclosed. A method in accordance with one embodiment includes applying a volume of material to a bond pad of a microfeature workpiece, with the volume of material including a first metallic constituent and the bond pad including a second constituent. The method can further include elevating a temperature of the volume of material while the volume of material is applied to the bond pad to alloy the first metallic constituent and the second metallic constituent so that the first metallic constituent is alloyed generally throughout the volume of material. A thickness of the bond pad can be reduced from an initial thickness T1 to a reduced thickness T2. | 09-25-2014 |
20160031027 | Method For Applying Brazing Material To Metal Honeycomb Matrix, Metal Honeycomb Matrix And Manufacturing Method Thereof - A method for applying brazing material to a metal honeycomb matrix is provided. The method comprises the following steps of: a) applying a brazing material in a paste form, i.e., a solder paste, to one end face of the metal honeycomb matrix; b) distributing the solder paste in the metal honeycomb matrix. A metal honeycomb matrix and a method for manufacturing the metal honeycomb matrix are also provided. | 02-04-2016 |
20190143726 | Aluminum Based Solderable Contact | 05-16-2019 |
228246000 | Particular size or shape | 21 |
20080217386 | CONDUCTIVE BALL MOUNTING APPARATUS AND CONDUCTIVE BALL MOUNTING METHOD - In a conductive ball mounting apparatus for mounting one conductive ball on each of a plurality of pads which are provided on a substrate and on which an adhesive is formed, the conductive ball mounting apparatus includes: a conductive ball container for containing a plurality of conductive balls therein and having an opening to pass through the plurality of conductive balls; a substrate holder disposed over the conductive ball container to face the opening, and holding the substrate in such a manner that the plurality of conductive balls and the plurality of pads face each other and the substrate is disposed over the conductive ball container with a space therebetween; and a conductive ball supplying unit for supplying the plurality of conductive balls to the plurality of pads via the opening by moving up the plurality of conductive balls. | 09-11-2008 |
20080237315 | APPARATUS AND METHOD FOR SEMICONDUCTOR WAFER BUMPING VIA INJECTION MOLDED SOLDER - An improved apparatus for filling patterned mold cavities formed on a surface of a mold structure with solder includes an injector head assembly comprising a solder reservoir having a bottom surface with an elongated slot for injecting solder into the mold cavities and a carriage assembly configured to carry and scan the mold structure under the injector head assembly. The mold structure is brought into contact with the solder reservoir bottom surface and a seal is formed between an area of the solder reservoir bottom surface surrounding the elongated slot and the mold structure surface and then the mold structure is scanned under the injector head assembly in a first direction from a starting position to a finish position for filling the mold cavities and in a second direction opposite to the first direction for returning back from the finish position to the starting position. | 10-02-2008 |
20080296355 | Direct ball dispenser - In a method and apparatus for dispensing solder balls, a container having an opening for dispensing solder balls is positioned to enable a flow of the solder balls through the opening. The solder balls have a common configurable solder ball diameter. A proximal opening of a tube is coupled to the opening of the container. A distal opening of the tube is coupled to a nozzle. The nozzle has a nozzle orifice that is configured in accordance with the solder ball diameter to dispense the solder balls into a ball bin. A hopper vibrator is coupled to the nozzle to impart vibration energy to the nozzle, thereby providing a stimulus to the flow. A tool head picks selected ones of the solder balls from the ball bin for an assembly of a semiconductor device. | 12-04-2008 |
20090026250 | METHOD AND APPARATUS FOR LOADING SOLDER BALLS - A solder ball loading apparatus for loading solder balls onto pads of a printed wiring board includes a holding device for holding a printed wiring board having pads and holding a ball array mask having of openings that correspond to pads of the printed wiring board, one or more cylinder members positioned over the holding device such that an opening portion of the cylinder member faces the holding device, the cylinder member gathering solder balls on the surface of the ball array mask under the cylinder member by suctioning air through the opening portion of the cylinder member, and a conveyor mechanism for moving the ball array mask and the printed wiring board relative to the cylinder member such that solder balls gathered under the opening portion of the cylinder member can be loaded onto the pads of the printed wiring board through the openings of the ball array mask held by the holding device. | 01-29-2009 |
20090072012 | APPARATUS AND METHOD FOR ARRANGING MAGNETIC SOLDER BALLS - An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a magnet which is incorporated in the stage and is movable in parallel with a lower surface of the placed and fixed substrate so as to cause a magnetic force to act in an upward direction of the stage; and a mask frame capable of being positioned above the stage. An arranging method using this arranging apparatus is also provided. An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a mask frame capable of being positioned above the stage; and a magnetic generator which is movable above the mask frame and causes a magnetic force to act on the stage. An arranging method using this arranging apparatus is also provided. | 03-19-2009 |
20090108053 | Solder Ball Placement Vacuum Tool - The invention provides apparatus, systems, and methods for positioning solder balls in a desired arrangement on a surface. In preferred embodiments of the invention, a vacuum head body is configured to direct a vacuum force through a vacuum chamber wherein a permeable vacuum plate encloses the vacuum chamber. A stencil adjacent to the vacuum plate includes solder ball niches configured to capture solder balls. The vacuum head may be used to pick up solder balls within the solder ball niches by way of vacuum force, and may be caused to release the solder balls from the solder ball niches by relaxing the vacuum force. According to particular preferred embodiments, the permeable vacuum plate is a porous metallic plate, such as a plate of sintered metal. Preferred embodiments also disclose interchangeable stencils for use with the permeable vacuum plate. | 04-30-2009 |
20090134207 | SOLDER BALL ATTACHMENT RING AND METHOD OF USE - A method of attaching a solder ball to a bonding pad includes disposing flux on the bonding pad, attaching a conductive metal ring to the pad using the flux, and placing the solder ball in the ring. A reflow operation is performed that secures the ring to the pad and melts the solder ball into and around the ring. A solder joint is formed between solder ball and the pad, with the ring secured within the ball. Use of the ring allows for higher stand-off height to be achieved with similar solder ball size, without having to use bigger ball size as in the conventional method, which causes solder ball bridging. With higher stand-off height, better board level reliability performance can be obtained. | 05-28-2009 |
20090159650 | Semiconductor device and automotive AC generator - A semiconductor device includes a semiconductor element, a support member bonded to a first surface of the semiconductor element with a first bonding material and a lead electrode bonded to a second surface of the semiconductor element supported on the support member with a second bonding material, and further including a method of producing the semiconductor device. Respective connecting parts of the support member and the lead electrode are Ni-plated and each of the first and the second bonding material is a Sn solder having a Cu | 06-25-2009 |
20090159651 | CONDUCTIVE BALL MOUNTING METHOD AND SURPLUS BALL REMOVING APPARATUS - A conductive ball mounting method of the present invention, includes a step of, arranging a mask in which an opening portion is provided, on a substrate including a connection pad, arranging a conductive ball on the connection pad through the opening portion of the mask by supplying the conductive ball onto the mask, separating the substrate and the mask, in the step, an extra conductive ball left on the mask drops through the opening portion of the mask, thereby a surplus ball is mounted on the substrate, and removing the surplus ball on the substrate by making the surplus ball adhere onto an adhering head. | 06-25-2009 |
20090200363 | Braze Ring - A braze ring includes a generally annular body and an outer annular channel formed on an outer surface of the body. A method of connecting a straight tubular end to a flared tubular end includes locating a substantially annular braze ring substantially concentrically around the straight tubular end, inserting the straight tubular end into the flared tubular end so that the braze ring engages the flared tubular end, and heating the braze ring so that flux separates from an exterior channel of the braze ring and the separated flux from the exterior channel contacts at least one of a faying surface of the flared tubular end and a faying surface of the straight tubular end. Another braze ring includes a body having a substantially symmetric cross-sectional shape forming an inner channel and an outer channel and flux carried within each of the inner channel and the outer channel. | 08-13-2009 |
20090283575 | TECHNIQUES FOR ARRANGING SOLDER BALLS AND FORMING BUMPS - A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls ale dispensed into the aligned through holes and cavities Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold ale configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed. | 11-19-2009 |
20090294516 | SOLDER BALL LOADING MASK, APPARATUS AND ASSOCIATED METHODOLOGY - A solder ball loading method capable of securely loading solder balls on connection pads includes applying flux on each connection pad group of a printed wiring board flux is not applied to a contact portion between a spacer and the printed wiring board to keep the flux from attaching to the spacer. Because the flux is not attached to the spacer, when the mask is detached from the printed wiring board, the printed wiring board need not be inverted, and damage to the solder resist layer | 12-03-2009 |
20090302095 | TECHNIQUES FOR ARRANGING SOLDER BALLS AND FORMING BUMPS - A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed. | 12-10-2009 |
20090302096 | TECHNIQUES FOR ARRANGING SOLDER BALLS AND FORMING BUMPS - A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed. | 12-10-2009 |
20100127048 | CONDUCTIVE BALL MOUNTING APPARATUS - A conductive ball mounting apparatus for mounting conductive balls by providing an array mask having through holes, into which conductive balls are to enter, above a mounting target placed on a stage, by arranging a ball reservoir having an opening for reserving a plurality of conductive balls, in the bottom, by moving the ball reservoir along the array mask, by dropping the conductive balls into the individual through holes of the array mask, adopts the following means. Firstly, the conductive ball mounting apparatus comprises moving means for moving the array mask and the stage relative to each other in horizontal directions. Secondly, the positions of the conductive balls in the through holes are arranged by finely moving at least one of the array mask and the stage relative to each other in the horizontal directions after the balls were dropped. | 05-27-2010 |
20100270363 | Controlled Application of Solder Blocks to Establish Solder Connections - A method for forming a solder joint to form an electrical interconnection. In accordance with various embodiments, a solid block of solder is placed onto a previously applied layer of solder paste on an underlying electrically conductive pad. The solid block of solder and the layer of solder paste are concurrently reflowed to form a solder joint. In some embodiments, a pick and place machine is used to respectively place the block of solder and a component onto the layer of solder paste, and the hardened solder joint interconnects a terminal of the component to the pad. | 10-28-2010 |
20100270364 | APPARATUS AND METHOD FOR ARRANGING MAGNETIC SOLDER BALLS - An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a magnet which is incorporated in the stage and is movable in parallel with a lower surface of the placed and fixed substrate so as to cause a magnetic force to act in an upward direction of the stage; and a mask frame capable of being positioned above the stage. An arranging method using this arranging apparatus is also provided. An apparatus for arranging magnetic solder balls includes: a stage for placing and fixing the substrate thereon; a mask frame capable of being positioned above the stage; and a magnetic generator which is movable above the mask frame and causes a magnetic force to act on the stage. An arranging method using this arranging apparatus is also provided. | 10-28-2010 |
20110186617 | SOLDER PREFORM - A solder preform has gaps extending from the boundary of preform towards the preform center. During reflow soldering, the gaps close from the center towards the boundary. This allows flux and gasses to escape the interface between the solder and the substrate. Particularly, flux accumulates in the spaces formed by the gaps and is forced to the edge of the solder preform as the gap closes. In further embodiments, channels are formed on one or both surfaces of the solder preform. In addition to further assisting in the escape of gas and flux during reflow, the channels and gaps increase the effectiveness of oxygen purging using inert or reducing gasses in the reflow chamber. Additionally, the channels and gaps increase the effectiveness of vacuum solder. | 08-04-2011 |
20120111929 | SOLDER ROD, SOLDERING OF HOLES, COATING PROCESS - A metallic solder rod is provided. The solder rod includes a stop-off at the end so that the solder cannot drip from an opening. The solder rod includes an inner region and an outer region which at least partially surrounds the inner region wherein the inner region includes a different alloy than the outer region. A process for applying solder to a hole in a substrate is also provided. | 05-10-2012 |
20130119119 | SOLDER SPATTERING SUPPRESSED REFLOW METHOD - A solder spattering suppressed reflow method includes the following steps: (A) preparing a carrier; (B) placing at least one solderable object on the carrier by means of printing, dispensing, mounting or plating; and (C) moving the carrier into an enclosed chamber and carrying out a high-temperature and high-pressure reflow process to have the solderable object heated and melted to bond to the carrier. | 05-16-2013 |
20140061287 | Lead-Free Solder Ball - A lead-free solder ball for electrodes of a BGA or CSP comprising 0.5-1.1 mass % of Ag, 0.7-0.8 mass % of Cu, 0.05-0.08 mass % of Ni, and a remainder of Sn. Even when a printed circuit board to which the solder ball is bonded has Cu electrodes or Au-plated or Au/Pd-plated Ni electrodes, the solder ball has good resistance to drop impacts. The composition may further contain at least one element selected from Fe, Co, and Pt in a total amount of 0.003-0.1 mass % or at least one element selected from Bi, In, Sb, P, and Ge in a total amount of 0.003-0.1 mass %. | 03-06-2014 |
228248100 | Applied in powdered or particulate form | 36 |
20090014505 | BRAZE MATERIALS AND PROCESSES THEREFOR - Braze materials and processes for using braze materials, such as for use in the manufacturing, coating, repair, and build-up of superalloy components. The braze material contains a plurality of first particles of a metallic material having a melting point, and a plurality of second particles comprising at least one nonmetallic material chosen from the group consisting of oxides, carbides, and nitrides of at least one metal. The nonmetallic material is more susceptible to heating by microwave radiation than the metallic material of the first particles, and the nonmetallic material is present in the braze material in an amount sufficient to enable the first particles to completely melt when the first and second particles are subjected to heating by microwave radiation. | 01-15-2009 |
20090057378 | IN-SITU CHIP ATTACHMENT USING SELF-ORGANIZING SOLDER - An in-situ chip attachment process uses a self-organizing solder paste composed of a synthetic resin organic flux and solder particles having a mean diameter that falls between around 0.1 μm and around 10 μm. The process is carried out by blanket depositing the solder paste on a first substrate having a first metal structure, pressing a second substrate having a second metal structure into the solder paste such that the second metal structure is aligned with the first metal structure and a gap exists between the first and second metal structures, heating the solder paste to a reflow temperature for a time duration sufficient to cause the solder particles to coalesce and form an electrical connection between the first and second metal structures. The reflow temperature ranges from around 100° C. to around 500° C. The time duration ranges between around 30 seconds and around 900 seconds. | 03-05-2009 |
20090078746 | BUMP FORMING METHOD AND BUMP FORMING APPARATUS - A method for forming bumps | 03-26-2009 |
20100127049 | SOLDER BALL MOUNTING METHOD AND APPARATUS - The periphery of a mask ( | 05-27-2010 |
20100252616 | CONDUCTIVE COMPOSITIONS CONTAINING BLENDED ALLOY FILLERS - The present invention provides electrically and thermally conductive compositions for forming interconnections between electronic elements. Invention compositions comprise three or more metal or metal alloy particle types and an organic vehicle comprising a flux that is application specific. The first particle type includes a reactive high melting point metal that reacts with a reactive low melting point metal(s) in the other particles to form intermetallic species. The reactive low melting point metal(s) of the invention are provided in two distinct particle forms. The first reactive low melting point metal particle includes a carrier that facilitates the reaction with the reactive high melting point metal. The second reactive low melting point metal particle acts primarily as a source of the reactive low melting point metal. Combination of the three particle types provides several advantages including reduction of the undesirable characteristics of the carrier metal while preserving and, in some embodiments, enhancing, the advantageous facilitation of the metallic reaction. | 10-07-2010 |
20100270365 | SOLDER PASTE COMPOSITION HAVING SOLDER POWDER, FLUX AND METALLIC POWDER - The present invention relates to a solder paste composition used for precoating an electrode surface with solder. A first solder paste composition is contains a solder powder and a flux, and a metallic powder made by metallic species different from metallic species constituting the solder powder and metallic species constituting the electrode surface in a rate of 0.1% by weight or more and 20% by weight or less based on a total amount of the solder powder. When these solder paste compositions are evenly applied onto an electronic circuit substrate for precoating, such a solder that does not generate any swollen portion, solder-lacking portion and variability in a height thereof can be formed irrespective of a shape of a pad. | 10-28-2010 |
20110042447 | COMPOSITE SILVER NANOPARTICLES, COMPOSITE SILVER NANOPASTE, AND PRODUCTION METHOD, PRODUCTION APPARATUS, CONJUGATION METHOD AND PATTERNING METHOD OF THE SAME - A cold formation method of composite silver nanoparticles has been established. Thus, provided are composite silver nanoparticles comprising a silver core, which is made up of aggregated silver atoms and has an average particle diameter of from 1 to 20 nm, and an organic coating layer formed thereon which comprises at least one member selected from an alcohol molecule derivative having 1 to 12 carbon atoms, an alcohol molecule residue or an alcohol molecule; a composite silver nanopaste which contains at least the composite silver nanoparticles and a solvent and/or a viscosity grant agent added thereto; a method of producing the same; an apparatus for producing the same; a method of bonding the same; and a method of patterning the same. The method of producing the composite silver nanoparticles comprising mixing silver salt microparticles with an alcohol solvent in excess to prepare an excess alcoholic solution, reacting the solution in a reaction chamber for a predetermined period of time at a predetermined temperature, and thus forming silver cores from the silver salt at a low temperature by the reducing effect of the alcohol and also forming an organic coating layer derived from the above-described alcohol around the silver cores. | 02-24-2011 |
20110114708 | METAL NANOINK AND PROCESS FOR PRODUCING THE METAL NANOINK, AND DIE BONDING METHOD AND DIE BONDING APPARATUS USING THE METAL NANOINK - Metal nanoink ( | 05-19-2011 |
20110204125 | LOW TEMPERATURE BONDING MATERIAL AND BONDING METHOD - A bonding material comprising metal particles coated with an organic substance having carbon atoms of 2 to 8, wherein the metal particles comprises first portion of 100 nm or less, and a second portion larger than 100 nm but not larger than 100 μm, each of the portions having at least peak of a particle distribution, based on a volumetric base. The disclosure is further concerned with a bonding method using the bonding material. | 08-25-2011 |
20110315747 | SOLDER BALL MOUNTING APPARATUS, SOLDER BALL MOUNTING METHOD, AND METAL BALL MOUNTING APPARATUS - A solder ball mounting apparatus includes a hopper, a mounting head provided at a tip of the hopper, and a pressing pin which is insertable inside the hopper and the mounting head. The mounting head has an inner diameter which restricts movement of solder balls, and when one of the solder balls is supplied to the mounting head through the hopper, the pressing pin presses one of the solder balls, thereby mounting the solder balls one by one on a target member. | 12-29-2011 |
20120153011 | METAL PASTE WITH OXIDIZING AGENTS - A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids. | 06-21-2012 |
20120153012 | METAL PASTE WITH CO-PRECURSORS - A sintering method allows components to be joined to each other in a stable way at a processing temperature of less than | 06-21-2012 |
20120248176 | SOLDER PASTES FOR PROVIDING IMPACT RESISTANT, MECHANICALLY STABLE SOLDER JOINTS - A solder is provided that produces a more impact resistant solder joint that is usable in high-end applications. The solder joint has a strong interconnection that can perform all of the normal functions of a solder joint while being more impact resistant. Furthermore, the solder joint retains its capabilities over the service life of a high-end product such as a computer or a cell phone. The solder meets the requirements of the soldering industry both today and into the future, including but not limited to an ability to be printed or dispensed with standard methods and conformity to health and safety standards. | 10-04-2012 |
20120292377 | APPARATUS FOR ADHERING SOLDER POWDER AND METHOD FOR ADHERING SOLDER POWDER TO ELECTRONIC CIRCUIT BOARD - Disclosed are an apparatus for adhering solder powder to finely adhere the solder powder to an electronic circuit board and a method for adhering solder powder to the electronic circuit board. The apparatus for adhering solder powder includes a container that contains an electronic circuit board and solder powder; a board holding portion provided in the container to hold the electronic circuit board such that a board surface thereof substantially faces a vertical direction; a tilting device which sets an initial position of the container as a tilted position where the container is tilted in a first direction, and which tilts the container from the initial position in a second direction that is opposite to the first direction, and tilts the container back in the first direction; and a vibrating device provided with an eccentric motor provided in the center of a bottom portion of the container which provides vibration to the bottom portion of the container through rotation of a rotating shaft, and control device for setting the rotating shaft of the eccentric motor in the same direction as the tilting direction of the container. | 11-22-2012 |
20130068827 | METHOD OF MANUFACTURING SOLAR CELL ELECTRODE AND CONDUCTIVE PASTE - The present invention relates to a method of manufacturing a solar cell electrode, comprising: preparing a semiconductor substrate having a preformed electrode on a front side, a back side, or both of the front and the back side of the semiconductor substrate; applying a conductive paste onto the preformed electrode, wherein the conductive paste comprises a conductive powder, an amorphous saturated polyester resin with glass transitional temperature (Tg) of 50° C. or lower, and an organic solvent; drying the applied conductive paste; putting a tab electrode on the dried conductive paste; and soldering the tab electrode. | 03-21-2013 |
20130098975 | METHOD AND APPARATUS FOR MOUNTING CONDUCTIVE BALLS - A conductive ball mounting method for mounting conductive balls on a mount using an arraying mask, in which the mount includes mounting positions formed in a predetermined pattern, and the arraying mask is provided above the mount and includes through holes provided in positions corresponding to the mounting positions. The method includes providing a ball suction unit for sucking solder balls, the ball suction unit including a ball holding member capable of holding the conductive balls, sucking up the conductive balls below the ball suction unit, holding the conductive balls on a lower surface of the ball holding member while sucking up the conductive balls, and after the holding the conductive balls, falling the conductive balls held by the ball holding member to the mount. | 04-25-2013 |
20140001243 | SOCKET COVER WITH HEAT FLOW FOR SURFACE MOUNT SOLDER REFLOW | 01-02-2014 |
20140042212 | ELECTRICALLY CONDUCTIVE COMPOSITIONS COMPRISING NON-EUTECTIC SOLDER ALLOYS - Transient liquid phase sintering compositions comprising one or more high melting point metals and one or more low melting temperature alloys are known in the art as useful compositions for creating electrically and/or thermally conductive pathways in electronic applications. The present invention provides transient liquid phase sintering compositions that employ non-eutectic low melting temperature alloys for improved sintering and metal matrix properties. | 02-13-2014 |
20140076959 | SOLDER PASTE PRINT SQUEEGEE AND METHOD OF PRINTING USING THE SAME - Disclosed herein are a solder paste print squeegee and a method of using the same. The solder paste print squeegee includes: a rotation module driven rotatably; a pair of rods coupled with the rotation module in parallel; a squeegee holder coupled with the lower ends of the pair of rods and having a trapezoid shape; and a pair of squeegee blades supported by the squeegee holder. | 03-20-2014 |
20140117070 | METHOD OF FABRICATING A SOLDER-ON-PAD STRUCTURE AND FLIP-CHIP BONDING METHOD USING THE SAME - A method of fabricating a solder-on-pad structure is provided. The method may include providing a substrate with a pad, coating a solder bump maker including a first resin and a solder powder on the substrate, heating the solder bump maker to a temperature lower than a melting point of the solder powder to aggregate the solder powder on the pad, and removing the first resin. | 05-01-2014 |
20140158751 | METHOD AND SYSTEM FOR PRODUCING COMPONENT MOUNTING BOARD - A wiring board on which an electronic component is to be mounted includes a resist having an opening exposing a joint face which is part of the surface of a wiring layer and to which a terminal of the electronic component is to be joined. In the placing step, the electronic component is placed on the wiring board such that the terminal covers the opening entirely and contacts the solder paste applied onto the joint face. Next, the solder paste applied onto the joint face is heated to melt solder and soften thermosetting resin. This allows the solder to gather in a first space within the opening closed with the wiring layer and the electronic component, while allowing the thermosetting resin to gather in a second space formed between a top side of the resist and a lateral side of the electronic component. | 06-12-2014 |
20140252073 | BALL GRID ARRAY MOUNTING SYSTEM AND METHOD - A device for providing a reliable and robust electrical connection of a chip to a board using a plurality of solder balls, the device including a non-rigid body formed of a thermal resistant material having a top side and a bottom side, the bottom side having an adhesive layer; and an array of openings formed in the body, the array of openings arranged in a pattern that matches a pattern of conductive pads on the board, each opening having a circular plan form shape that is sized to enable a single solder ball to be slideably received in the opening, each opening spaced from adjacent openings by a distance that prevents adjacent solder balls from electrically connecting to each other when the solder balls are subjected to a temperature sufficient to reflow the solder ball. | 09-11-2014 |
20140263588 | INTERCONNECT ALLOY MATERIAL AND METHODS - A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion. | 09-18-2014 |
20140263589 | SOLDER BALL PRINTING APPARATUS AND SOLDER BALL PRINTING METHOD - A solder ball printing apparatus fills plural openings formed in a mask with solder balls using a squeegee and prints the solder balls on plural electrode portions formed on a surface of a substrate facing the mask. The solder ball printing apparatus includes: a substrate mounting table on which the substrate is mounted and on the back surface side of which plural hole portions are formed; a print table on which the substrate mounting table is mounted; an XYθ stage which can drive the print table in a horizontal plane; a print table cylinder which can vertically drive the print table; a mask absorption portion which has members that can be fitted into the substrate mounting table; and a mask absorption cylinder which can vertically drive the mask absorption portion. | 09-18-2014 |
20140339291 | Method for Enhancing the Yield Rate of Ball Implanting of a Substrate of an Integrated Circuit - A method is used for implanting solder balls of an integrated circuit by operating a ball implanting machine. The ball implanting machine includes a suction fixture, an evacuating device, two pivoting and inverting devices, a guide plate, a ball carrier, and a substrate. The suction fixture has a plurality of ball grooves. The guide plate has a plurality of guide holes each aligning with a respective one of the ball grooves of the suction fixture. The ball carrier contains a plurality of solder balls. Thus, each of the solder balls is extended through the respective guide hole of the guide plate into the respective ball groove of the suction fixture, so that the solder balls will not protrude outward from the guide plate and will not interfere with or jam each other during movement of the ball carrier. | 11-20-2014 |
20150014399 | CONDUCTIVE PASTE FOR DIE BONDING, AND DIE BONDING METHOD WITH THE CONDUCTIVE PASTE - The present invention provides a conductive paste for die bonding comprising a metal powder and an organic solvent, the metal powder comprising: one or more metal particles selected from a silver powder, a palladium powder, and a copper powder, the metal particles having a purity of 99.9% by mass or higher and an average particle size of 0.01 μm to 1.0 μm; and a coating layer made of gold covering at least part of the metal particles. The conductive paste according to the present invention can suppress the occurrence of defects such as voids in a bonded part when a semiconductor element or the like is die-bonded to a substrate. | 01-15-2015 |
20150021378 | METHOD OF JOINING COMPONENTS USING METAL PASTE WITH OXIDIZING AGENTS - A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids. | 01-22-2015 |
20150053753 | COMPOSITE NANOMETAL PASTE CONTAINING COPPER FILLER AND JOINING METHOD - The present invention addresses the problem of providing a composite nanometal paste which is relatively low in price and is excellent in terms of bonding characteristics, thermal conductivity, and electrical property. | 02-26-2015 |
20150060529 | BALL MOUNTING METHOD AND WORKING MACHINE FOR BOARD - A working machine for a board including a working device that selectively performs work for mounting conductive balls on a circuit board by a ball holder and work for transferring viscous fluid onto the circuit board by transfer pins, and a tray in which the viscous fluid is stored, when the conductive balls are to be mounted on the circuit board, the viscous fluid being transferred onto the circuit board by the transfer pins and the conductive balls having been immersed in the viscous fluid are mounted on the transferred viscous fluid. Accordingly, the conductive balls can be fixed onto the circuit board by the viscous fluid, which is transferred onto the circuit board by the transfer pins, and the viscous fluid that adheres to the conductive balls due to the immersion of the conductive balls in the viscous fluid. | 03-05-2015 |
20150108206 | INDIRECT PRINTING BUMPING METHOD FOR SOLDER BALL DEPOSITION - Some embodiments of the present disclosure relate to an apparatus and method to form a pattern of solder bumps. A solder paste is applied a plate comprising a pattern of holes, where each hole is partially filled by a piston attached to a movable stage. The remainder of the holes are filled by applying a force to the solder paste with a first solder paste application tool. A second solder paste application tool then removes excess paste from the front surface of the plate. The solder paste is then disposed onto a surface of a substrate by moving the movable stage, which fills a larger portion of each hole with a piston, forces the solder paste out of each hole, and forms pattern of solder paste on the surface of the substrate. The pattern of solder paste is then subjected to additional processing to form a pattern of solder bumps. | 04-23-2015 |
20150144683 | SCREEN PRINTER, COMPONENT MOUNTING LINE, AND SCREEN PRINTING METHOD - A screen printer includes a mask, a substrate holding unit that clamps and holds a substrate below the mask by clamping members, a substrate holding unit moving mechanism that moves the substrate holding unit to contact the substrate with a lower surface of the mask, a paste filling unit that fills pattern holes of the mask with a paste, mask suction portions provided in the clamping members which suck the mask contacted with the substrate. The mask suction portions keep sucking the mask when the substrate holding unit moving mechanism moves the substrate in a direction away from the mask to perform plate releasing, and release the suction of the mask in a state in which the mask sucked to the mask suction portions maintains a posture parallel to the substrate after the movement of the substrate is started. | 05-28-2015 |
20160107252 | METHOD AND ARRANGEMENT FOR PRODUCING A THREE-DIMENSIONAL MATERIAL COMPOSITE USING AN EXPANSION BODY - A method and arrangement for producing a three-dimensional material composite using an expansion body includes at least two metal bodies having surface regions resting loosely against one another. The composite is heated to a target temperature and the surface regions are pressed against one another so that an integral connection is established. At least one expansion cavity having a predefined initial volume is arranged in one of the metal bodies or in an additional expansion body resting against one of the metal bodies in such a manner that when the expansion cavity expands, the surface regions to be connected are pressed against one another. A predefined quantity of at least one substance which is gaseous at least at a target temperature is hermetically enclosed in the expansion cavity before the target temperature is reached. | 04-21-2016 |
20160121416 | Solder Ball Jet Nozzle Having Improved Reliability - A solder ball bonding tool includes a nozzle having an inner bore having a plurality of columnar surfaces and interposed retention structures that are positioned within the nozzle to retain a solder ball therein. A projection or projected shape formed by intersecting the retention structures may be generally circular, having a diameter less than the diameter of the solder balls for which the retention structures are positioned to retain. The nozzle may comprise a cemented carbide having less than or equal to a cumulative 4.5% of cobalt and gold serving as a binder. | 05-05-2016 |
20160136763 | BONDING MATERIAL AND BONDING METHOD USING SAME - A bonding material of a silver paste includes: fine silver particles having an average primary particle diameter of 1 to 50 nanometers, each of the fine silver particles being coated with an organic compound having a carbon number of not greater than 8, such as hexanoic acid; silver particles having an average primary particle diameter of 0.5 to 4 micrometers, each of the silver particles being coated with an organic compound, such as oleic acid; a solvent containing 3 to 7% by weight of an alcohol and 0.3 to 1% by weight of a triol; a dispersant containing 0.5 to 2% by weight of an acid dispersant and 0.01 to 0.1% by weight of phosphate ester dispersant; and 0.01 to 0.1% by weight of a sintering aid, such as diglycolic acid, wherein the content of the fine silver particles is in the range of from 5% by weight to 30% by weight, and the content of the silver particles is in the range of from 60% by weight to 90% by weight, the content of the total of the fine silver particles and the silver particles being not less than 90% by weight. | 05-19-2016 |
20160141266 | METHOD OF BONDING WITH SILVER PASTE - A method for bonding with a silver paste includes coating a semiconductor device or a substrate with the silver paste. The silver paste contains a plurality of silver particles and a plurality of bismuth particles. The method further includes disposing the semiconductor on the substrate and forming a bonding layer by heating the silver paste, wherein the semiconductor and the substrate are bonded to each other by the bonding layer. | 05-19-2016 |
20190143461 | Engineered Polymer-Based Electronic Materials | 05-16-2019 |
228249000 | Joint interposed | 15 |
20080302863 | Method and Device for Transferring a Solder Deposit Configuration - Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate ( | 12-11-2008 |
20090039142 | Method for Forming a Solder Mold with Venting Channels and Method for Using the Same - A method for forming a solder mold for transferring solder to a wafer includes etching a plurality of solder cavities into a substrate. A plurality of ventilation channels are etched on the substrate connecting the plurality of solder cavities. | 02-12-2009 |
20090078747 | Anisotropic conductive adhesive composition, anisotropic conductive film comprising the same, and associated methods - An anisotropic conductive adhesive composition includes an acrylic rubber binder having a weight average molecular weight of about 100,000 to about 1,000,000, a first component including at least one of a mono(meth)acrylate compound and a di(meth)acrylate compound, a second component including at least one of a tri(meth)acrylate compound and a compound having more than three (meth)acrylate groups, an organic peroxisde, and conductive particles. The second component is present in an amount of about 1 to about 10% by weight, based on the total weight of the acrylic rubber, the first component, the second component, the organic peroxide, and the conductive particles. | 03-26-2009 |
20100065616 | LEAD SOLDER-FREE ELECTRONICS - A composition may have metal nanoparticles having a diameter of 20 nanometers or less and have a fusion temperature of less than about 220° C. A method of fabricating the metal nanoparticles may include preparing a solvent, adding a precursor with a metal to the solvent, adding a first surfactant, mixing in a reducing agent, and adding in a second surfactant to stop nanoparticle formation. Copper and/or aluminum nanoparticle compositions formed may be used for lead-free soldering of electronic components to circuit boards. A composition may include nanoparticles, which may have a copper nanocore, an amorphous aluminum shell and an organic surfactant coating. A composition may have copper or aluminum nanoparticles. About 30-50% of the copper or aluminum nanoparticles may have a diameter of 20 nanometers or less, and the remaining 70-50% of the copper or aluminum nanoparticles may have a diameter greater than 20 nanometers. | 03-18-2010 |
20100140332 | BRAZING METHOD AND CORRESPONDING DEVICE - The present invention relates to a method of brazing two materials ( | 06-10-2010 |
20120000965 | CONNECTING MATERIAL, METHOD FOR MANUFACTURING CONNECTING MATERIAL AND SEMICONDUCTOR DEVICE - In a connecting material of the present invention, a Zn series alloy layer is formed on an outermost surface of an Al series alloy layer. In particular, in the connecting material, an | 01-05-2012 |
20130134210 | JOINING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - A joining method that allows joining processing to be carried out simultaneously at a plurality of portions without being influenced by a supply time restriction on a joining material, and a semiconductor device manufacturing method using the joining method are provided. A chip and a lead frame are tentatively assembled having a solid solder block interposed therebetween. The solder block is provided with protruding parts that protrude in one direction. The protruding parts are inserted into solder supply ports of the lead frame, whereby the chip and the lead frame are tentatively assembled. Subsequently, the chip and the lead frame are fed into a reflow oven, and the solder block is melted and thereafter solidified. Thus, the chip and the lead frame are joined to each other. | 05-30-2013 |
20140246483 | ALUMINIUM ALLOY SHEET PRODUCT OR EXTRUDED PRODUCT FOR FLUXLESS BRAZING - An aluminium alloy sheet product or extruded product for fluxless brazing, including an aluminium alloy core having on at least one face an aluminium filler clad layer containing 4% to 15% of Si, the filler clad layer having an inner-surface and an outer-surface, the inner-surface is facing the aluminium alloy core and the outer-surface is facing a coating layer of 2 to 45 mg/sq.m of Bi or of a Bi-based alloy. Furthermore, a method of brazing a brazed assembly incorporating at least one member made from the brazing sheet material. | 09-04-2014 |
20140361070 | SOLDER ALLOYS - A solder comprising a bismuth matrix, between about 5-24% copper; and about 0.5-36% tin or antimony or zinc; having a solidus temperature of ≧271° C., a reflow temperature of ≦375° C., and at least one intermetallic composition precipitate comprising copper and at least one of tin, antimony and zinc substantially excluding bismuth formed within the solidus phase. | 12-11-2014 |
20150314396 | LAYERED SOLDER MATERIAL FOR BONDING DISSIMILAR ELECTRODES, AND METHOD FOR BONDING DISSIMILAR ELECTRODES TO ELECTRONIC COMPONENTS - When soldering a package having an electrode on which Ni/Au or Ag—Pd alloy is plated, to a printed circuit board having a Cu electrode or an electrode on which Cu is plated, a solid-phase diffusion layer is formed within a layered solder material for bonding different species of electrodes. The layered solder material is composed of a solder material of Sn—Ag—Cu series or Sn—Sb series and a solder material of Sn—Ag—Cu—Ni series or Sn—Pb series. The electrode on which Ni/Au or Ag—Pd alloy is plated and the Cu electrode or the electrode on which Cu is plated are soldered with the solder material of Sn—Ag—Cu series or Sn—Sb series being attached to the Cu electrode and the solder material of Sn—Ag—Cu—Ni series or Sn—Cu series being attached to the electrode on which Ni/Au or Ag—Pd alloy is plated. This restrains formation of intermetallic compounds and provides high bonding reliability. | 11-05-2015 |
20160031032 | BRAZING WITHOUT TOOLS - A method for assembling a set including an inner wall, a shrouded outer wall and an intermediate element, each presenting substantially circular sections, the shrouded outer wall presenting a shape substantially complementary to a shape of outer and inner surfaces of the intermediate element, and whose inner surface covers the outer surface of the intermediate element. In particular, the method includes a step of placing a brazing sheet, whose melting temperature is lower than melting temperatures of other elements of the set, over an assembly surface in contact with another assembly surface, and a step of heating, by a furnace, a set including the outer or inner walls and the intermediate element between which is interposed a brazing sheet so as to fix the outer or inner wall by brazing on the intermediate element. | 02-04-2016 |
228252000 | Coextensive sheet | 2 |
20110220704 | COMPOSITE SOLDER ALLOY PREFORM - Various embodiments of the invention provide laminate composite preform foils for high-temperature Pb-free soldering applications. The laminate composite preform foil is composed of a high-melting, ductile metal or alloy core layer and a low-melting solder coating layer at either side of the core layer. During soldering, the core metal, liquid solder layer, and substrate metals react and consume the low-melting solder phase to form high-melting intermetallic compound phases (IMCs). The resultant solder joint is composed of a ductile core layer sandwiched by the IMCs layers at substrate sides. The joint has a much higher remelt temperature than the original melting temperature of the initial solder alloy coating, allowing subsequent mounting of packaged devices. | 09-15-2011 |
20150041525 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, HEAT INSULATING LOAD JIG, AND METHOD FOR SETTING UP HEAT INSULATING LOAD JIG - In a heat insulating load jig | 02-12-2015 |
228253000 | Attaching filler to work part | 2 |
20080245847 | Compliant Mold Fill Head with Integrated Cavity Venting and Solder Cooling - A mold fill head includes a solder delivery head and an interface portion having a compliant portion secured to the solder delivery head and a dispensing region associated with the compliant portion. The dispensing region is formed with at least one aperture configured to interface with cavities in a mold plate, the at least one aperture being in fluid communication with the solder delivery head. The compliant portion is configured and dimensioned to urge the dispensing region against the mold plate when held a predetermined distance therefrom and to substantially tolerate variations in flatness of the mold plate, variations in the predetermined distance, and/or variations in an angular orientation of the interface portion and the mold plate. | 10-09-2008 |
20090072013 | NANO-SCALE PARTICLE PASTE FOR WIRING MICROELECTRONIC DEVICES USING INK-JET PRINTING - Nano-scale particle paste may be used for on-die routing and other applications using deposition and inkjet printing. A metal paste is applied to a surface of a die to electrically couple two spaced apart connection points of the die. Alternatively, or in addition, the paste may contain carbon nanotubes. The paste may be used on other surfaces as well. | 03-19-2009 |