Class / Patent application number | Description | Number of patent applications / Date published |
228244000 | Feeding unfused filler into fusing contact with work part | 6 |
20080302862 | CONCAVE FACE WIRE BOND CAPILLARY AND METHOD - An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the capillary and a concave surface extending therefrom to the intersection with the radius extending from the external tip diameter of the working tip. | 12-11-2008 |
20090145950 | DISPENSING SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS - A method for mounting a semiconductor chip onto a substrate comprises the steps of positioning a solder dispenser over the substrate and passing a length of solder wire through the solder dispenser to the substrate. The feeding of the wire to the substrate in a feeding direction is controlled with a wire feeder. The solder dispenser is moved relative to the substrate with a positioning device along at least one of two orthogonal axes that are substantially perpendicular to the feeding direction contemporaneously with feeding the solder wire to the surface of the substrate to dispense a line of molten solder onto the substrate. The semiconductor chip is then mounted onto the molten solder that has been dispensed onto the substrate. | 06-11-2009 |
20100116871 | INJECTION MOLDED SOLDER METHOD FOR FORMING SOLDER BUMPS ON SUBSTRATES - A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified. | 05-13-2010 |
20110101076 | REFLOW BONDING METHOD AND METHOD OF MANUFACTURING HEAD SUSPENSION - A reflow bonding method easily bonds first and second wiring members together by reflowing solder arranged on at least one of first and second bonding parts that are defined on the first and second wiring members, respectively. The method includes positioning the first and second wiring members so that the first and second bonding parts face each other with the solder interposed between them and heating and pressing one of the first and second bonding parts from behind with a pressing face of a heater chip so that the first and second bonding parts lie one on another and so that the solder is heated and reflows to bond the first and second wiring members together | 05-05-2011 |
20120067941 | TUNER STRUCTURE SOLDERING METHOD FOR IMPROVING VOLTAGE DIFFERENCE - A tuner structure soldering method for improving voltage difference, comprising the following steps: preparing the tuner structure, wherein the tuner structure comprises a frame and a communication connector with a fitting portion preinstalled on the frame; putting a tin ring around the fitting portion; | 03-22-2012 |
20130248586 | BRAZING ALLOYS AND METHODS OF BRAZING - A brazing alloy is provided in the form of a wire, rod or preform, and is made of, in weight percent: 3-7.5% P, 0.1-1.9% Zn, 0-74.7% Ag, 0-80% Au, 0-10% Sn, 0-5% Ni, 0-3% each of Si, Mn, Li, and Ge, and the balance copper in an amount of at least 21.7%. In additional embodiments, Zn may be present in an amount of 0.6-1.9%. A method of torch brazing is also provided. The method includes forming the alloy into a wire or rod, placing the tip of the wire or rod in contact with a surface of a joint, heating the joint surface using a torch flame, and contacting the tip of the wire or rod to the heated joint surface to melt and flow the alloy onto the joint surface and into the joint under capillary action. | 09-26-2013 |