Class / Patent application number | Description | Number of patent applications / Date published |
228122100 | Metal to nonmetal with separate metallic filler | 30 |
20080230585 | DIFFERENT MATERIALS BONDED MEMBER AND PRODUCTION METHOD THEREOF - A different materials bonded member includes a ceramic base material and a metallic member which are bonded together through an Au solder material. The solder material is disposed on a bonding surface of the ceramic base through a given active metal layer or a given metalized layer and the solder material is heated and melted to form a pre-coat layer adhering to the bonding surface, the metallic member is disposed on a surface of the pre-coat layer through a barrier layer having a given function. A bonded part is formed by solidifying the pre-coat layer after it has been heated and melted under given temperature conditions to bond the ceramic base and the metallic member to one another. | 09-25-2008 |
20080290138 | Method for bonding refractory ceramic and metal - A method is disclosed for mechanically bonding a metal component to a ceramic material, comprising attaching an anchor material to at least a portion of one surface of the metal component, and then applying the ceramic material to at least a portion of the one surface of the metal component, such that after the ceramic material solidifies, the anchor material is substantially embedded in at least a portion of the ceramic material, thereby forming a mechanical bond between the metal component and the ceramic material via the anchor material. Also disclosed is an article comprising a metal component and a ceramic material mechanically bonded thereto through an anchor material attached to at least a portion of the metal component. | 11-27-2008 |
20100127046 | HIGH TEMPERATURE, STABLE SIC DEVICE INTERCONNECTS AND PACKAGES HAVING LOW THERMAL RESISTANCE - A method of forming packages containing SiC or other semiconductor devices bonded to other components or conductive surfaces utilizing transient liquid phase (TLP) bonding to create high temperature melting point bonds using in situ formed ternary or quaternary mixtures of conductive metals and the devices created using TLP bonds of ternary or quaternary materials. The compositions meet the conflicting requirements of an interconnect or joint that can be exposed to high temperature, and is thermally and electrically conductive, void and creep resistant, corrosion resistant, and reliable upon temperature and power cycling. | 05-27-2010 |
20100140330 | Conductive Coatings, Sealing Materials and Devices Utilizing Such Materials and Method of Making - According to one embodiment t of the present invention a method of manufacturing metal-to-ceramic seals comprising the steps of: (a) providing a ferric stainless steel part selected from the group consisting of high temperature stainless steels and high temperature superalloy; (b) providing a ceramic part; (c) providing a braze material in between the ferric stainless steel part and said ceramic part, the braze containing Ag and metal oxide wetting agents; and (d) heating said ferric stainless steel part, braze material, and ceramic part in an oxidizing atmosphere. | 06-10-2010 |
20100288821 | Matrix Drill Bits and Method of Manufacture - A matrix drill bit and method of manufacturing a matrix bit body from a composite of matrix materials is disclosed. Two or more different types of matrix materials may be used to form a composite matrix bit body. A first matrix material may be selected to provide optimum fracture resistance (toughness) and optimum erosion, abrasion and wear resistance for portions of a matrix bit body such as cutter sockets, cutting structures, blades, junk slots and other portions of the bit body associated with engaging and removing formation materials. A second matrix material may be selected to provide desired infiltration of hot, liquid binder material with the first matrix material to form a solid, coherent, composite matrix bit body. | 11-18-2010 |
20140069988 | METHODS OF USING ACTIVE BRAZE TECHNIQUES FOR MAKING HIGH TEMPERATURE RECHARGEABLE BATTERIES - The present disclosure generally relates to methods of using active braze techniques in high temperature rechargeable batteries. In some specific embodiments, the present disclosure relates to a method of sealing a portion of an insulated alpha alumina or spinel collar and a metal ring of a sodium metal halide battery. | 03-13-2014 |
20140209665 | METHOD FOR BONDING HEAT-CONDUCTING SUBSTRATE AND METAL LAYER - A method for bonding a heat-conducting substrate and a metal layer is provided. A heat-conducting substrate, a first metal layer and a preformed layer are provided. The preformed layer is between the heat-conducting substrate and the first metal layer. The preformed layer is a second metal layer or a metal oxide layer. A heating process is performed to the preformed layer in an oxygen-free atmosphere to convert the preformed layer to a bonding layer for bonding the heat-conducting substrate and the first metal layer. The temperature of the heating process is less than or equal to 300° C. | 07-31-2014 |
20150028084 | METHOD FOR CARRYING OUT SOLDER CONNECTIONS IN A TECHNOLOGICALLY OPTIMIZED MANNER - The invention relates to a method for carrying out solder connections in a technologically optimized manner, in particular lead-free solder connections. At least one of the joining partners provides the solder required for the connection. A flux is used in order to activate the solder, and the electric and mechanical connection is carried out by means of a soldering process under the effect of heat and by melting the solder/flux mixture with the inclusion of a subsequent cooling phase. According to the invention, the joining partners and the solder are heated to a temperature below the activation temperature of the solder and the flux in a first temperature treatment phase. Another heating process is then carried out to a temperature above the activation temperature of the flux up to the upper melting range of the solder in a second temperature treatment phase, wherein the solder melts and begins to connect to the respective joining partners. Furthermore, the thermal output previously applied is increased by an additional 5% to 30% in a third temperature treatment phase in order to accelerate the adhesion behavior of the joining partners. | 01-29-2015 |
20160001388 | MANUFACTURING METHOD OF POWER-MODULE SUBSTRATE - A method of manufacturing power-module substrates, after bonding copper-circuit plates 30 at intervals on a ceramic plate 21 having an area in which ceramic substrates can be formed abreast, by dividing the ceramic plate 21 between the copper-circuit plates 30, in which: bonding-material layers 71 of active-metal brazing material having same shapes as outer shapes of the copper-circuit plates 30 are formed on the ceramic plate 21; temporal-stick material 72 including polyethylene glycol as a major ingredient is spread on the copper-circuit plates 30, the bonding-material layers 71 and the copper-circuit plates 30 are temporarily fixed on the ceramic plate 21 in a state of laminating with positioning by the temporal-stick material 72; and a laminated assembly thereof is pressurized in a laminating direction and heated, so that the ceramic plate and the copper-circuit plates are bonded. | 01-07-2016 |
20160016244 | Carbide Wear Surface and Method of Manufacture - A radial bearing having a wear surface with improved wear characteristics comprises a steel support, to which is bonded a metal carbide composite wear surface made by first arranging, within a cavity defined between a steel mold and the steel support, tiles made of microwave sintered, cemented metal carbide, closely packing the voids between the tiles with metal carbide powder, and infiltrating the mold cavity with a metal brazing alloy by subjecting the filled mold to rapid heating. The brazing alloy fills voids between the metal carbide particles, the microwave sintered metal carbide tiles, and the metal support, thereby relatively rapidly consolidating the carbide into a wear layer bonded with the steel support without substantially damaging the properties of the microwave-sintered metal carbide tiles. | 01-21-2016 |
20160152073 | ROLLER STRUCTURE AND METHOD OF USING THE SAME | 06-02-2016 |
20160181123 | METHOD OF PRODUCING BONDED BODY AND METHOD OF PRODUCING POWER MODULE SUBSTRATE | 06-23-2016 |
20160181137 | SUPPORTING UNIT AND SUBSTRATE TREATING APPARATUS INCLUDING THE SAME | 06-23-2016 |
228123100 | Semiconductor-type nonmetallic material | 7 |
20090032570 | Compression bonding device and a mounting method - A compression bonding device has a dam member so that when a pressing head is pressed against an object to be pressed, the bonding part is surrounded by the dam member. Thus, even if the surface of the bonding part bulges by pressing, the bulging part is stopped by the dam member and the surface of the bonding part does not horizontally extend. As a result of the absence of horizontal extension of the bonding part, electric components of the object to be pressed are not subjected to a force that horizontally moves the electric components and the electric components are vertically pressed downward and connected to the terminals of the substrate. Thus, an electric device having high connection reliability is obtained. | 02-05-2009 |
20090236404 | PASTY SILVER PARTICLE COMPOSITION, PROCESS FOR PRODUCING SOLID SILVER, SOLID SILVER, JOINING METHOD, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD - [PROBLEMS] To provide a pasty silver particle composition, which, upon heating, allows silver particles to be easily sintered to form solid silver possessing excellent strength, electric conductivity and thermal conductivity, and a production process of solid silver and the like. [MEANS FOR SOLVING PROBLEMS] A pasty silver particle composition comprising nonspherical silver particles having an average particle diameter of 0.1 to 18 μm and a carbon content of not more than 1.0% by weight and a volatile dispersion medium, wherein, upon heating, the volatile dispersion medium is volatilized and the nonspherical silver particles are sintered to one another to form solid silver. There are also provided a process for producing solid silver comprising heating the pasty silver particle composition, solid silver having excellent strength, electric conductivity and thermal conductivity, a method for joining a metallic member using the pasty silver particle composition, and a production process of a printed wiring board comprising silver wiring. | 09-24-2009 |
20110127314 | BONDING MATERIAL WITH EXOTHERMICALLY REACTIVE HETEROSTRUCTURES - A bonding material including a meltable joining material and a plurality of heterostructures distributed throughout the meltable joining material, the heterostructures comprising at least a first material and a second material capable of conducting a self-sustaining exothermic reaction upon initiation by an external energy to generate heat sufficient to melt the meltable joining material. | 06-02-2011 |
20160016245 | METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE - A method for manufacturing a power module substrate includes a first lamination step of laminating a ceramic substrate and a copper sheet through an active metal material and a filler metal having a melting point of 660° C. or lower on one surface side of the ceramic substrate; a second lamination step of laminating the ceramic substrate and an aluminum sheet through a bonding material on the other surface side of the ceramic substrate; and a heating treatment step of heating the ceramic substrate, the copper sheet, and the aluminum sheet laminated together, and the ceramic substrate and the copper sheet, and the ceramic sheet and the aluminum sheet are bonded at the same time. | 01-21-2016 |
20160113123 | Method for Soldering a Circuit Carrier to a Carrier Plate - A method for soldering a circuit carrier to a carrier plate includes providing a carrier plate having an upper side and a first adjusting device, providing a circuit carrier having an underside and a second adjusting device, providing a solder and placing the circuit carrier onto the carrier plate in such a way that: the underside of the circuit carrier faces the upper side of the carrier plate; the solder is arranged between the carrier plate and the circuit carrier; and the first adjusting device forms a stop for the second adjusting device that limits a displacement of the circuit carrier placed on the carrier plate along the upper side of the carrier plate. After placing the circuit carrier onto the carrier plate, the solder is melted and subsequently cooled down until it solidifies and connects the circuit carrier to the carrier plate in a material-bonding manner at a lower metallization layer. | 04-21-2016 |
20160183384 | ELECTRICAL DEVICES AND METHODS FOR MANUFACTURING SAME | 06-23-2016 |
20160254243 | JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR JOINING ELECTRONIC PART | 09-01-2016 |
228124100 | With treating | 9 |
20080217379 | METHOD FOR COHESIVELY BONDING METAL TO A NON-METALLIC SUBSTRATE - A process for cohesive bonding between a metal surface and a nonmetallic substrate is provided. The non-metallic substrate may comprise a plurality of microfilaments and/or nanofilaments dispersed into and below the surface of the substrate. The application of pressure and laterally-oriented high frequency and low amplitude vibration may allow for diffusion bonding between the metal surface and material of the nanofilaments. Another method includes discharging energy from a bank of capacitors to melt adjoining surfaces of the metal surface and nonmetallic substrate. Additionally, a cohesive bonding method may further comprise converting electrical oscillations of ultrasonic frequency into ultrasonic vibrations which are transmitted to the metal body and/or substrate for fusing the two materials together. | 09-11-2008 |
20080265005 | Brazing process incorporating graphitic preforms - A method for processing a metal component comprising inserting a graphitic preform into an aperture of the metal component, brazing the metal component, and removing at least a portion of the graphitic preform from the aperture with a thermal process in an oxygen-containing atmosphere. | 10-30-2008 |
20110132973 | METHOD OF MANUFACTURING HIGH-HEAT-LOAD EQUIPMENT BY METALLURGICALLY JOINING CARBON MATERIAL WITH COPPER-ALLOY MATERIAL - A method of manufacturing high-heat-load equipment including a carbon material and a copper alloy material which are joined with each other includes; forming a titanium thin layer on a surface of the carbon material; positioning the carbon material so that the titanium thin layer is opposed to the copper alloy material while an interlayer is interposed between the carbon material and the copper alloy material; inserting a brazing material sheet into a space between the carbon material and the interlayer, as well as into a space between the interlayer and the copper alloy material, so as to prepare an assembly of the materials; and subjecting the assembly to a vacuum brazing process and further to an aging process. | 06-09-2011 |
20110309131 | FRICTION STIR WELDING TOOL AND PROCESS FOR WELDING DISSIMILAR MATERIALS - A friction stir welding tool and process for lap welding dissimilar materials are detailed. The invention includes a cutter scribe that penetrates and extrudes a first material of a lap weld stack to a preselected depth and further cuts a second material to provide a beneficial geometry defined by a plurality of mechanically interlocking features. The tool backfills the interlocking features generating a lap weld across the length of the interface between the dissimilar materials that enhances the shear strength of the lap weld. | 12-22-2011 |
20120267421 | METHOD OF JOINING GRAPHITE FIBERS TO A SUBSTRATE - A method of assembling a metallic-graphite structure includes forming a wetted graphite subassembly by arranging one or more layers of graphite fiber material including a plurality of graphite fibers and applying a layer of metallization material to ends of the plurality of graphite fibers. At least one metallic substrate is secured to the wetted graphite subassembly via the layer of metallization material. | 10-25-2012 |
20130175325 | METHOD FOR MAKING A CELLULAR SEAL - A method for making a cellular seal member for a turbine is disclosed. The method includes, in sequence, forming a diffusion aluminide coating on a surface of a cellular seal to form a coated cellular seal. The method also includes brazing the coated cellular seal to a seal substrate. | 07-11-2013 |
20140291385 | CERAMIC CIRCUIT BOARD AND PROCESS FOR PRODUCING SAME - According to one embodiment, a ceramic circuit board includes a ceramic substrate, a copper circuit plate and a brazing material protrudent part. The copper circuit plate is bonded to at least one surface of the ceramic substrate through a brazing material layer including Ag, Cu, and Ti. The brazing material protrudent part includes a Ti phase and a TiN phase by 3% by mass or more in total, which is different from the total amount of a Ti phase and a TiN phase in the brazing material layer that is interposed between the ceramic substrate and the copper circuit plate. The number of voids each having an area of 200 μm | 10-02-2014 |
20140367453 | METHOD FOR ALIGNING PLATE-LIKE MEMBERS AND METHOD FOR MANUFACTURING ELECTRICAL CONNECTING APPARATUS - One plate-like member and the other plate-like member to be aligned with each other are provided with guide holes and guide portions to be received in the guide holes, respectively. The plate-like members are aligned appropriately, and in a state in which this alignment is held, the guide portions are formed on land portions provided on the other plate-like member so as to be aligned with the guide holes. Accordingly, regardless of presence/absence or size of a process error in the guide holes, the guide portions appropriate to the respective guide holes can be formed. Consequently, by aligning the guide portions with the guide holes, the plate-like members can be aligned appropriately without relative fine adjustment between the members. | 12-18-2014 |
20150083787 | METHOD FOR FIXING HEAT RESISTANT COMPONENT ON A SURFACE OF A HEAT EXPOSED COMPONENT - The invention refers to a method for fixing a heat resistant component on a surface of a heat exposed component, by brazing of at least a part of a surface of the heat resistant component limited by a peripheral boundary edge on the surface of the heat exposed component using a molten solder. A first alternative includes:
| 03-26-2015 |
228124500 | Active or reactive filler component | 1 |
20160172713 | METHODS FOR JOINING CERAMIC AND METALLIC STRUCTURES | 06-16-2016 |