Class / Patent application number | Description | Number of patent applications / Date published |
219121850 | Method | 78 |
20080230525 | LASER ABLATION USING MULTIPLE WAVELENGTHS - In laser micromachining and laser defect repair of a first material, a first set of one or more laser wavelengths is selected in accordance with the first material's absorption characteristics and is combined and delivered concurrently with a second set of one or more laser wavelengths which is selected in accordance with the absorption characteristics of a second material generated by and remaining from the ablating interaction of the first material with the first set of laser wavelengths. The concurrent presence of the second set of one or more laser wavelengths removes the residual second material. | 09-25-2008 |
20080237207 | Nozzle for a Laser Machining Device - A laser machining nozzle having at least one supply chamber for the laser beam and for a processing gas has a cavity arranged in the region of the orifice of the gas supply chamber, which cavity is open in the direction towards the workpiece to be machined, this opening having a wedge-shaped edge. | 10-02-2008 |
20080272097 | METHODOLOGY OF IMPROVING THE MANUFACTURABILITY OF LASER ANNEAL - A method of laser annealing a workpiece for reduction of warpage, slip defects and breakage, the method comprising (a) moving a workpiece through a laser beam in a x-axis first direction, (b) moving the workpiece in a y-axis second direction, (c) moving the workpiece through a laser beam in a minus x-axis first direction and repeating (a)-(c) until the workpiece is fully annealed in two successive laser annealing iterations. | 11-06-2008 |
20090001063 | LASER PROCESSING MACHINE WITH LASER PROCESSING NOZZLE ADJUSTMENT - A laser processing machine includes a laser that outputs a laser beam, a laser processing head including a nozzle that defines a nozzle bore, a beam guidance and focusing system for directing the laser beam through the nozzle bore of the laser processing head, an illumination system that produces a light beam that is directed at the nozzle bore of the nozzle such that the light beam completely illuminates the nozzle bore, a light detector at the nozzle bore that views light that exits the nozzle bore, and an evaluation system that receives the output of the light detector and automatically determines the separation between a center of the laser beam when the laser beam is focused at the nozzle and a center of the nozzle based on the light detector output. | 01-01-2009 |
20090008373 | Laser Processing Method - A laser processing method which can prevent an object to be processed from being cut along a line to cut from a modified region acting as a cutting start point when separating a suction table and a holding member from each other is provided. An expandable tape | 01-08-2009 |
20090045182 | PULSED LASER ANNEAL SYSTEM ARCHITECTURE - Embodiments of the present invention provide method and apparatus for annealing semiconductor substrates. One embodiment of the present invention provides a semiconductor processing chamber comprising a first substrate support configured to support a substrate, a second substrate support configured to support a substrate, a shuttle coupled to the first substrate support and configured to move the first substrate support between a processing zone and a first loading zone, wherein the processing zone having a processing volume configured to alternately accommodating the first substrate support and the second substrate support. | 02-19-2009 |
20090107968 | Method For Heating Components - The invention relates to a method for heating a machining area of a structural component, particularly a gas turbine component, prior to and/or during and/or after a machining or processing of the component on the machining area. According to the invention, the machining area ( | 04-30-2009 |
20090114630 | Minimization of surface reflectivity variations - Apparatuses and methods are provided for processing a surface of a substrate. The substrate may have a surface pattern that exhibits directionally and/or orientationally different reflectivities relative to radiation of a selected wavelength and polarization. The apparatus may include a radiation source that emits a photonic beam of the selected wavelength and polarization directed toward the surface at orientation angle and incidence angle selected to substantially minimize substrate surface reflectivity variations and/or minimize the maximum substrate surface reflectivity during scanning. Also provided are methods and apparatuses for selecting an optimal orientation and/or incidence angle for processing a surface of a substrate. | 05-07-2009 |
20090120918 | Apparatus and Method for Manufacturing Absorption Pad - Disclosed are an apparatus and a method for manufacturing an absorption pad used for picking up a package or a strip during a semiconductor manufacturing process. The apparatus includes a workpiece transfer device on which a workpiece is mounted, a laser generator installed above the workpiece transfer device while being spaced apart from the workpiece transfer device by a predetermined distance, a driving unit for moving the workpiece transfer device and the laser generator relative to each other, and a controller for controlling the laser generator. It is possible to precisely form patterns having various sizes and shapes according to use of the absorption pad and the size of the package. Processing conditions for the workpiece are standardized, so that the processing time and manufacturing cost for the absorption pad are minimized. | 05-14-2009 |
20090127241 | Thin plate formation method, thin plate and suspension correction apparatus, and correction method - Laser beam irradiation areas are provided in a load curve portion and an angle adjustment portion of a suspension. The laser beam irradiation areas are oriented in a direction in which the suspension is to be bent. A laser beam having a predetermined length and a predetermined shape is irradiated onto each laser beam irradiation area. | 05-21-2009 |
20090166343 | Method for Producing Surfaces and Materials by Laser Ablation - The invention relates to a laser ablation coating method, where the laser ablation is carried out in a space with 10 | 07-02-2009 |
20090230105 | Continuous Furnace with Coupled Laser for the Surface Treatment of Materials - The present invention relates to a continuous kiln coupled to a laser by a conventional optical means that allows for surface treatment of a part, such that it is possible to achieve temperatures of up to 3000° C. on the surface of the part while the remainder of the part is at a substantially lower temperature. The part in the kiln is heated to a temperature on the order of 500° C. and a laser beam bundle is applied to the part via an opening in the kiln. The laser beam scans a line perpendicular to the direction of movement of the part such that the entire surface is scanned by means of the mechanical advance of the part. The scanning may extend beyond the lateral ends of the part. The kiln may comprise different zones with independent temperature controls for successfully achieving desired values, both for heating and cooling. | 09-17-2009 |
20090261084 | Laser Dicing Sheet and Manufacturing Method For Chip Body - An object of the present invention is to provide a laser dicing sheet which is capable of preventing cutting of dicing sheet by laser beam, damage of the chuck table and fusion of the dicing sheet to the chuck table. | 10-22-2009 |
20090266803 | Process Chamber and Method for Processing a Material by a Directed Beam of Electromagnetic Radiation, in Particular for a Laser Sintering Device - A process chamber for a processing of a material by means of a directed beam of electromagnetic radiation is provided, which comprises an optical element ( | 10-29-2009 |
20090266804 | COMBINATION EXTRUSION AND LASER-MARKING SYSTEM, AND RELATED METHOD - A combination extrusion and laser marking system and corresponding method are provided for creating an extruded article with a surface graphic image. The system includes an extruder, a laser, and a controller or encoder. The extruder is operable to pass an extrudable material through a die and discharge an extrudate having a markable surface. The laser is operable with the extruder for forming an image on the markable surface of the extrudate discharged from the extruder. The encoding system is operable to measure a rate of speed at which the extrudate is discharged from the extruder and provide a feedback signal for controlling operation of the laser. The combination may further include an ink printer to form an additional image on the extruded article. | 10-29-2009 |
20090283509 | METHOD FOR PRODUCING LARGE-SIZED SHELL SEGMENTS AS WELL AS SHELL SEGMENT - The invention relates to a method for producing shell segments with a particularly large length extend for forming a fuselage cell of an aircraft, comprising the following steps:
| 11-19-2009 |
20090294424 | SELF-SEEDED SINGLE-FREQUENCY LASER PEENING METHOD - A method of operating a laser to obtain an output pulse having a single wavelength, comprises inducing an intracavity loss into a laser resonator having an amount that prevents oscillation during a time that energy from the pump source is being stored in the gain medium. Gain is built up in the gain medium with energy from the pump source until formation of a single-frequency relaxation oscillation pulse in the resonator. Upon detection of the onset of the relaxation oscillation pulse, the intracavity loss is reduced, such as by Q-switching, so that the built-up gain stored in the gain medium is output from the resonator in the form of an output pulse at a single frequency. An electronically controllable output coupler is controlled to affect output pulse characteristics. The laser acts a master oscillator in a master oscillator power amplifier configuration. The laser is used for laser peening. | 12-03-2009 |
20100000979 | Method and device for controlling the power transmitted by a laser to a reference point, soldering device and method - In accordance with said control method, the transmission of the laser beam is periodically interrupted with the aid of means for masking the laser beam placed between the reference point and a source of the laser beam. Moreover, the transmission power of the source of the laser beam is varied between the minimum and maximum values, such that the emission times of the source of the laser beam at the minimum power substantially coincide with the masking times of the laser beam via the masking means. Preferably, the minimum value is at least equal to 10% and the maximum value at most equal to 90% of a maximum emission power of the source of the laser beam. | 01-07-2010 |
20100006550 | METHOD FOR MINIMIZING SAMPLE DAMAGE DURING THE ABLATION OF MATERIAL USING A FOCUSED ULTRASHORT PULSED LASER BEAM WHEREIN THE SLOPE OF FLUENCE BREAKDOWN IS A FUNCTION OF THE PULSE WIDTH - In one aspect the invention provides a method for laser induced breakdown of a material with a pulsed laser beam where the material is characterized by a relationship of fluence breakdown threshold (Fth) versus laser beam pulse width (T) that exhibits an abrupt, rapid, and distinct change or at least a clearly detectable and distinct change in slope at a predetermined laser pulse width value. The method comprises generating a beam of laser pulses in which each pulse has a pulse width equal to or less than the predetermined laser pulse width value. The beam is focused above the surface of a material where laser induced breakdown is desired. The region of least confusion (minimum beam waist or average spot size) is above the surface of the material in which laser induced breakdown is desired since the intensity of the beam falls off in the forward direction, preferably the region of the beam at or within the surface is between the region of least confusion and sufficient to remove material and the minimum intensity necessary for laser induced breakdown of the material to be removed, most preferably the region of minimum intensity is disposed at the surface of the material to be removed. The beam may be used in combination with a mask in the beam path. The beam or mask may be moved in the x, y, and Z directions to produce desired features. The technique can produce features smaller than the spot size and Rayleigh range due to enhanced damage threshold accuracy in the short pulse regime. | 01-14-2010 |
20100018957 | LASER MARKING - There are described compositions and methods for the laser marking of products or their packaging. The compositions comprise transition metal oxides, saccharides and/or flame-retardant agents, optionally with other additives, dispersed in a carrier. | 01-28-2010 |
20100102046 | Laser Machining Medical Devices With Localized Cooling - Laser machining a tubular construct comprising a polymer layer to form a stent pattern in the construct with localized cooling of the machined surface to reduce or prevent heat transfer to uncut polymer of the polymer layer is disclosed. | 04-29-2010 |
20100108653 | METHOD FOR IMPROVING RESIDUAL STRESS IN TUBULAR BODY AND APPARATUS FOR IMPROVING RESIDUAL STRESS IN TUBULAR BODY - An object is to provide a method and an apparatus for improving a residual stress in a tubular body, which are enabled to improve the residual stress reliably by clearly defining controlling rage for treatment conditions without depending on an installation state and configuration of the tubular body. When an outer-circumferential surface of a welded portion of a cylindrical tubular body ( | 05-06-2010 |
20100116801 | LASER PROCESSING APPARATUS AND LASER PROCESSING METHOD - A laser processing apparatus according to the present invention includes a laser oscillator that emits a continuous-wave or pulsed-wave laser beam for heat processing or a pulsed-wave laser beam for surface treatment, an incident optical system that causes the laser beam emitted from the laser oscillator to enter an optical fiber, a condenser lens that condenses the laser beam emitted from the optical fiber, and a processing unit that moves close to a processing object by carrying the condenser lens and irradiates a surface of the processing object with a laser beam, in which the laser oscillator emits the laser beam for the heat processing when performing the heat processing and emits the laser beam for the surface treatment when performing a pre-treatment or a post-treatment for the heat processing. | 05-13-2010 |
20100155382 | Method for Machining Valve Mechanism Component Member - A surface machining method to be adopted when machining a valve mechanism component member is provided so as to manufacture a product assuring a specific pulsation-reducing effect over an extended period of time with a high level of reliability. A plurality of recesses | 06-24-2010 |
20100224605 | RAPID PROTOTYPING DEVICE AND METHOD WITH INDIRECT LASER EXPOSURE - It is desirable for the production of workpieces, which are sometimes produced by a rapid prototyping method, to be further automatable. To this end a device is provided having a laser for generating a laser beam in order to set a material, and a workpiece support which can be exposed directly to the laser. There is also provided an optical instrument for redirecting and deviating the laser beam so that the workpiece support can also be exposed indirectly to the laser. Material can therefore also be cured more easily in undercuts of workpiece blanks. | 09-09-2010 |
20100230392 | OPTICAL FEEDTHROUGH FOR MEDICAL DEVICES - In general, the disclosure is directed toward transmitting radiant energy across a boundary of a medical device via an optical feedthrough. A system for transmitting radiant energy across a boundary of a medical device includes a first functional module of a medical device, a second functional module of the medical device, an optical feedthrough assembly coupled to the first functional module, and a radiant energy source that emits a beam through the optical feedthrough assembly to perform a manufacturing process on the first functional module and the second functional module. | 09-16-2010 |
20100243629 | METHOD FOR MANUFACTURING GRAIN-ORIENTED ELECTROMAGNETIC STEEL SHEET WHOSE MAGNETIC DOMAINS ARE CONTROLLED BY LASER BEAM IRRADIATION - There is provided a method for manufacturing a grain-oriented electromagnetic steel sheet whose iron losses are reduced by laser beam irradiation, capable of improving the iron losses in both the L-direction and the C-direction while easily ensuring high productivity. The method for manufacturing a grain-oriented electromagnetic steel sheet reduces iron losses by scanning and irradiating a grain-oriented electromagnetic steel sheet with a continuous-wave laser beam condensed into a circular or elliptical shape at constant intervals in a direction substantially perpendicular to a rolling direction of the grain-oriented electromagnetic steel sheet, wherein when an average irradiation energy density Ua is defined as Ua=P/(Vc×PL) (mJ/mm | 09-30-2010 |
20100243630 | Method for patterning the zinc oxide front electrode layer of a photovoltaic module - For patterning a front electrode layer ( | 09-30-2010 |
20100288741 | METHOD FOR HEATING A PLATE WITH A LIGHT STREAM - The invention relates to a method for heating a wafer ( | 11-18-2010 |
20100301028 | METHOD AND APPARATUS FOR HYBRID RESOLUTION FEEDBACK OF A MOTION STAGE - A method and apparatus is presented for obtaining high resolution positional feedback from motion stages | 12-02-2010 |
20100320181 | MINERAL PROCESSING - The present invention concerns itself with a dry, free of toxic chemicals, and thus, environmentally safe, mineral processing technique. It uses ore elements' specific heat differences as the basis for separating valuable minerals from ores. No EPA approval, no environmental pit and no expensive monitoring are required in order to practice the teachings of the present invention. Furthermore, the technique described herein is economically attractive since it is a low cost approach to mineral processing. | 12-23-2010 |
20110000899 | CONNECTING PIECE, MULTI-AXIS MACHINING CENTER, ELASTICITY CONTROL METHOD - A connecting piece for a tool of a multi-axis machining center has a support on the machining center side, a holder at the tool side and a pushing device which elastically pushes the holder into a defined position against the support. The pushing force of the pushing device can be varied during the operation of the machining center. | 01-06-2011 |
20110042364 | METHOD FOR DETERMINING LASER SHOCK PEENING APPROACH ACCESSIBILITY - A method for determining accessibility of a tool to an object is provided. The method provides for selecting one or more sections on the object to be laser shock peened, selecting a region of interest on the one or more sections and determining a set of feasible solutions to access the selected region of interest on each of the one or more sections via use of an accessibility system. Systems and computer programs that afford functionality of the type defined by this method may be provided by the present technique. | 02-24-2011 |
20110062129 | CARDIAC LEAD COIL STRIPPING - An implantable lead may have a distal assembly including a coupler, a terminal pin and a conductive member rotatably secured to both the coupler and the terminal pin. The conductive member may include a coating that is at least partially removed before securing the conductive member to the coupler and the terminal pin. The coating may be removed in a process combining, in sequence, an IR laser and a UV laser. | 03-17-2011 |
20110073577 | ELECTRONIC COMPONENT LEAD MANUFACTURING METHOD AND MANUFACTURING DEVICE - An electronic component lead manufacturing method includes irradiating a first laser beam to a second layer with a solder wettability higher than a first layer, the second layer being laminated on the outside of the first layer of the lead used by the electronic component, and exposing the first layer from the second layer based on the irradiating of the first laser beam, and forming a projecting part near a region irradiated by a second laser beam by irradiating the second laser beam to the exposed first layer. | 03-31-2011 |
20110132886 | Laser Peening Process and Apparatus Using a Liquid Erosion-Resistant Opaque Overlay Coating - The invention relates to a method and apparatus for improving properties of a solid material by providing shockwaves there through. Laser shock processing is used to provide the shockwaves. The method includes applying a liquid energy-absorbing overlay, which is resistant to erosion and dissolution by the transparent water overlay and which is resistant to drying to a portion of the surface of the solid material and then applying a transparent overlay to the coated portion of the solid material. A pulse of coherent laser energy is directed to the coated portion of the solid material to create a shockwave. Advantageously, at least a portion of the unspent energy-absorbing overlay can be reused in situ at a further laser treatment location and/or recovered for later use. | 06-09-2011 |
20110155709 | LASER PROCESSING APPARATUS AND PROCESSING METHOD EMPLOYED THEREIN - A laser processing apparatus | 06-30-2011 |
20110215075 | METHOD AND DEVICE FOR TREATING A SURFACE - A method for treating a surface is disclosed. According to some aspects, the method includes ejecting matter from the surface by projecting an ejection agent on the surface. The ejection agent is selected from gases, fluids in supercritical state, solid materials in divided form,. solid materials in a as vector and electromagnetic radiation. The method includes trapping the ejected matter in one or several pieces of an aerogel situated on trajector of the ejected matter. A device for car in out this method as well as the use of an aerogel to trap the matter ejected from a surface during a treatment of that surface are also disclosed. The method may be applied in fields including cleaning, satinizing, polishing, deburring, etching, marking, pre-adhesion surface preparation metallization enameling, painting or varnishing operations are done, in particular electronics, microelectronics, optics, optoelectronics, bijouterie, jewelry, and the restoration of art and antiques. | 09-08-2011 |
20110215076 | LASER ABLATION TECHNIQUE - A method of manufacturing a shaped part, the method including: (I) providing a partially consolidated porous part that has been made from a powder; (II) permeating the porous part with a volatile liquid (e.g. water, ethanol), so that the liquid is present in the pores of the porous part; and (V) forming the shaped part by applying a laser beam to a spot on the surface of the liquid-permeated part to cause the volatile liquid to heat in the spot region, causing the powder particles to separate in the spot region, so that a portion of the part is ablated in the spot region. The porous part may be made from metallic or ceramic powder and has been partially consolidated for integrity, but is ablated by this lower energy, liquid-assisted laser process, prior to further strengthening. The method allows bespoke, complex shaped parts such as aerospace parts or medical implants to be made inexpensively, especially shaped titanium parts. | 09-08-2011 |
20110240619 | PULSE LASER PROCESSING DEVICE - Provide a pulse laser processing device which facilitates stable microfabrication of the surface of a large target processing material, and an increase in the speed of microfabrication. The pulse laser processing device includes a reference clock oscillating circuit which generates a clock signal, a laser oscillator which emits a pulse laser beam synchronized with the clock signal, a laser scanner which scans a pulse laser beam only in a one-dimensional direction in synchronization with the clock signal, a stage on which the target processing material can be placed and which moves in a direction orthogonal to the one-dimensional direction, and a pulse picker which is provided on an optical path between the laser oscillator and laser scanner and which switches pass and block of the pulse laser beam in synchronization with the clock signal. | 10-06-2011 |
20110278271 | SYSTEM AND METHOD FOR LASER SHOCK PEENING - A system for laser shock peening includes a laser positioned to direct a laser pulse at a first side of a work piece and a coupler on a second side of the work piece. The system further includes a Doppler shift detector positioned to measure a velocity of the coupler. A method for laser shock peening includes depositing an amount of energy from a laser pulse into a first side of a work piece and transmitting a pulse having a first frequency at a second side of the work piece. The method further includes receiving a reflected pulse having a second frequency from the second side of the work piece and determining the velocity of the work piece based on the difference between the first frequency and the second frequency. | 11-17-2011 |
20110290770 | METHOD FOR PREVENTING CRACK FORMATION AND FOR SLOWING DOWN THE ADVANCEMENT OF A CRACK IN METAL AIRCRAFT STRUCTURES BY MEANS OF LASER SHOCK RAYS - The present invention provides a method for preventing the forming of cracks and slowing the crack propagation in metallic airplane structural parts by laser shock peening with the following steps: Providing an airplane structural part having a crack; irradiating a first surface area of the airplane structural part close to the crack with a first pulsed laser beam having a first wavelength and a first pulsation frequency, wherein energy of the first laser beam is absorbed by the airplane structural part and a shock wave runs through the airplane structural part, which creates compressive prestressings in the airplane structural part. | 12-01-2011 |
20120061361 | METHOD OF DIVIDING WORKPIECE - A method of dividing a workpiece includes: forming a pre-machining alteration region in the inside of a region in which no device is formed; detecting the position of the pre-machining alteration region on through infrared imaging by imaging means, to thereby recognize a deviation between the pre-machining alteration region and a planned dividing line as machining position correction information; and forming a main machining alteration region by utilizing the machining position correction information, whereby the workpiece can be accurately divided along the planned dividing lines into individual devices. | 03-15-2012 |
20120074111 | FLUX-CORED WIRE FOR WELDING DIFFERENT MATERIALS, METHOD FOR LASER WELDING OF DIFFERENT MATERIALS AND METHOD FOR MIG WELDING OF DIFFERENT MATERIALS - There are provided a flux-cored wire for welding different materials, a method for laser welding of different materials and a method for MIG welding of different materials which can improve tensile shear strength of a welded joint portion and peeling strength of a welded portion interface in welding aluminum or an aluminum alloy material and a steel material. The flux-cored wire has a cylindrical sheath comprising an aluminum alloy which contains Si in an amount of 1.5 to 2.5% by mass and Zr in an amount of 0.05 to 0.25% by mass, with the remainder being aluminum and inevitable impurities, and a flux filling inside this sheath and containing cesium fluoride in an amount of 20 to 60% by mass, and the packing fraction of the flux being 5 to 20% by mass of the total mass of the wire. | 03-29-2012 |
20120097653 | Laser Refining Apparatus and Laser Refining Method - (Problem to be solved) | 04-26-2012 |
20120132631 | ADDITIVE LAYER FABRICATION METHOD - A selective layer melting or other additive layer fabrication method in which powdered material is fused by heating it with a pulsed laser, the pulses being modulated whilst the laser is traversing the substrate so as to control the thickness and/or width of the layer being formed. Initial layers of the fabrication structure may be formed more thickly than subsequent layers, e.g. by means of a CW laser, to reduce distortion. This aspect of the invention may be employed independently of the use of a pulsed laser to form the subsequent layers. | 05-31-2012 |
20120223062 | Minimization of Surface Reflectivity - Apparatuses and methods are provided for processing a surface of a substrate. The substrate may have a surface pattern that exhibits directionally and/or orientationally different reflectivities relative to radiation of a selected wavelength and polarization. The apparatus may include a radiation source that emits a photonic beam of the selected wavelength and polarization directed toward the surface at orientation angle and incidence angle selected to substantially minimize substrate surface reflectivity variations and/or minimize the maximum substrate surface reflectivity during scanning. Also provided are methods and apparatuses for selecting an optimal orientation and/or incidence angle for processing a surface of a substrate. | 09-06-2012 |
20120234809 | LASER PROCESSING METHOD FOR NONLINEAR CRYSTAL SUBSTRATE - A laser processing method for a nonlinear crystal substrate having a plurality of crossing division lines which includes the step of applying a pulsed laser beam to a work surface of the nonlinear crystal substrate along the division lines to thereby form a plurality of laser processed grooves on the work surface along the division lines. The pulse width of the pulsed laser beam is set to 200 ps or less and the repetition frequency of the pulsed laser beam is set to 50 kHz or less. | 09-20-2012 |
20120234810 | LASER ANNEALING APPARATUS AND LASER ANNEALING METHOD - The present invention provides an efficient heat treatment such as activation treatment of impurities on a substrate such as a thick silicon wafer with large heat capacity by laser annealing. | 09-20-2012 |
20120241427 | PREDICTIVE LINK PROCESSING - A method of processing material of device elements by laser interaction is disclosed. According to one aspect, the method includes generating a pulsed laser processing output along a laser beam axis, the output including a plurality of laser pulses triggered sequentially at times determined by a pulse repetition rate. A trajectory relative to locations of device elements to be processed is generated. A position of one or more designated device elements relative to an intercept point position on the trajectory at one or more laser pulse times is determined, and a laser beam is deflected based on the predicted position within a predetermined deflection range. According to some aspects, the predetermined deflection range may correspond to a compass rose or cruciform field shape. As a result, a deflection accuracy for laser processing may be improved. | 09-27-2012 |
20120285937 | Laser Induced Extra-Planar Elicitation - Disclosed herein is a method of controlled laser deformation. A substrate is provided that is transparent to the laser energy. At least a portion of the substrate is coated with a release layer that absorbs the laser energy. A component to be deformed is attached to the release layer opposed to the substrate. A source of laser energy is directed through the substrate and into a portion of the release layer, which vaporizes the portion of the release layer by absorption of the laser energy, and releases a portion of the component from the substrate. This deforms the portion of the component away from the substrate by the vaporization of the release layer such that at least one edge of the component is no longer in contact with the release layer or substrate, and leaving a second portion of the component still attached to non-vaporized release layer. | 11-15-2012 |
20120325789 | SEALING MATERIAL AND PASTE MATERIAL USING SAME - Provided is a sealing material suitable for laser sealing, which enhances long-term reliability of an OLED display and the like. The sealing material comprises 80 to 99.7 mass % of an inorganic powder containing SnO-containing glass powder and 0.3 to 20 mass % of a pigment and is used for laser sealing. | 12-27-2012 |
20130026147 | METHOD OF TREATING AN AEROFOIL - A method of imparting deep compressive residual stress to an aerofoil, the method involves determining a stress map for the aerofoil for stress generated by Foreign Object (FOD) impact, a stress map for the aerofoil of high cycle fatigue, a stress map for the aerofoil of low cycle fatigue and determining a combined stress map by combining the stress map of FOD impact, the stress map of high cycle fatigue and the stress map of low cycle fatigue. A zone is then defined on the aerofoil from the combined stress map for receiving the deep residual compressive stress, and compressive residual stress imparted to the defined zone. | 01-31-2013 |
20130068741 | LASER HARDENED SURFACE FOR WEAR AND CORROSION RESISTANCE - A method of laser hardening comprises irradiating a surface of a component with a laser beam to form a first band of irradiated material, irradiating the surface of the component with the laser beam to form a second band of irradiated material that overlaps the first band of irradiated material, where the first band and the second band have a pitch to width ratio of between about 0.5 and about 0.78. | 03-21-2013 |
20130068742 | LASER MACHINING DEVICE AND LASER MACHINING METHOD - A laser machining device | 03-21-2013 |
20130075377 | LASER CRYSTALLIZATION OF THIN FILMS ON VARIOUS SUBSTRATES AT LOW TEMPERATURES - A method and system are provided for crystallizing thin films with a laser system. The method includes obtaining a thin film comprising a substrate and a target layer that contains nano-scale particles and is deposited on the substrate. The heat conduction between the target layer and the substrate of the thin film is determined based on thermal input from the laser system to identify operating parameters for the laser system that cause crystallization of the nano-scale particles of the target layer in an environment at near room temperature with the substrate remaining at a temperature below the temperature of the target layer. The laser system is then operated with the determined operating parameters to generate a laser beam that is transmitted along an optical path to impinge the target layer. The laser beam is pulsed to create a localized rapid heating and cooling of the target layer. | 03-28-2013 |
20130119030 | METHOD AND APPARATUS FOR HEAT TREATING THE WAFER-SHAPED BASE MATERIAL OF A SOLAR CELL, IN PARTICULAR A CRYSTALLINE OR POLYCRYSTALLINE SILICON SOLAR CELL - A method and an apparatus for heat treating a wafer-shaped base material of a solar cell, in particular of a crystalline or polycrystalline silicon solar cell, wherein the device comprises at least one laser light source ( | 05-16-2013 |
20130119031 | LASER LIFT-OFF METHOD AND LASER LIFT-OFF APPARATUS - A substrate is separated from a material layer formed on the substrate without generating cracks in the material layer formed on the substrate. In order to separate the material layer from the substrate at a boundary between the substrate ( | 05-16-2013 |
20130126493 | SPALLING WITH LASER-DEFINED SPALL EDGE REGIONS - Laser ablation can be used to form a trench within at least a blanket layer of a stressor layer that is atop a base substrate. A non-ablated portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can also be used to form a trench within a blanket material stack including at least a plating seed layer. A stressor layer is formed on the non-ablated portions of the material stack and one portion of the stressor layer has an edge that defines the edge of the material layer region to be spalled. Laser ablation can be further used to form a trench that extends through a blanket stressor layer and into the base substrate itself. The trench has an edge that defines the edge of the material layer region to be spalled. | 05-23-2013 |
20130161301 | DEVICE TO IMPROVE IRON LOSS PROPERTIES OF GRAIN ORIENTED ELECTRICAL STEEL SHEET AND METHOD FOR IMPROVING IRON LOSS PROPERTIES OF GRAIN ORIENTED ELECTRICAL STEEL SHEET - A device reduces dust for safely preventing laser-irradiation capacity from decreasing due to contamination and reliably reducing iron loss of a grain oriented electrical steel sheet. The device improves iron loss properties of a grain oriented electrical steel sheet by irradiating its surface with laser to reduce iron loss, wherein, distance between a laser beam emission port and a laser irradiation point is L (mm); laser irradiation angle formed by a line linking the emission port and the irradiation point with respect to a direction vertical to the sheet is θ (°); and L≧50, the emission port is positioned such that L and θ satisfy: | 06-27-2013 |
20130180969 | LASER SHOCK PEENING APPARATUSES AND METHODS - Methods and apparatuses for processing materials to enhancing the material's surface strength, improving the material's cyclic and thermal stability of microstructures, and extend the material's fatigue performance. Embodiments include laser shock peening at material temperatures that are moderately elevated (from the material's perspective) above room temperature. Alternate embodiments include laser shock peening at very cold (cryogenic) material temperatures. Still further embodiments include laser shock peening while covering the surface of the material being processed with an active agent that interacts with the laser energy and enhances the pressure exerted on the surface. | 07-18-2013 |
20130193125 | LASER PROCESSING MACHINE AND LASER PROCESSING METHOD - A laser processing machine includes a work head, a plate-like work working table for processing a plate-like work, a rod-like work working table including a rod-like work holder for processing a rod-like work, and a work area in which the work head is movably provided. The plate-like work working table is provided movably from one side of the work area into the work area. The rod-like work working table is provided movably from another side of the work area into the work area that is opposite side of the one side. According to the laser processing machine, when switching over between a processing of a plate-like work and a processing of a rod-like work, it is needed only to move/evacuate the plate-like work working table and the rod-like work working table to/from the work area, so that the switching-over operation can be easily done. | 08-01-2013 |
20130213946 | LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS - A laser processing method of applying a laser beam to a workpiece having a plurality of members, thereby forming a laser processed groove on the workpiece. The laser processing method includes the steps of setting a plurality of processing conditions respectively corresponding to a plurality of different materials forming the plurality of members constituting the workpiece, detecting the wavelengths of plasma lights generated by applying the laser beam to the plurality of members constituting the workpiece, selecting any suitable one of the processing conditions corresponding to any one of the members corresponding to the wavelength of plasma lights detected above, and applying the laser beam under the processing condition selected above. | 08-22-2013 |
20130248504 | HEAT TREATMENT APPARATUS FOR HEATING SUBSTRATE BY LIGHT IRRADIATION - The temperature of a semiconductor wafer is raised by light irradiation heating performed by halogen lamps. An infrared ray emitted from the semiconductor wafer whose temperature has been raised transmits through an infrared-transparent window made of silicon, and then is detected by an infrared camera. The infrared camera two-dimensionally detects the temperature of an entire surface of the semiconductor wafer. Based on a result of the detection obtained by the infrared camera, a temperature drop region having a relatively low temperature among the region of the semiconductor wafer is irradiated with laser light emitted from a laser light emission part. Accordingly, without rotating the semiconductor wafer, a temperature distribution can be made uniform with a high accuracy throughout the entire surface of the semiconductor wafer. | 09-26-2013 |
20140103019 | METHODS FOR SCANNING TUBES ON LASER CUTTING MACHINES - Methods are provided which comprise the steps of: a) emitting through the cutting head of the laser cutting machine a focused laser beam that does not cut or etch the material of the tube; b) moving the cutting head along a given scanning direction; and c) while the cutting head is moving along the scanning direction, detecting through suitable sensors the radiation reflected or emitted by the tube and establishing point by point, on the base of the signal provided by these sensors, the presence or absence of the material of the tube. | 04-17-2014 |
20140202999 | FORMING A STRUCTURE - Apparatus and a method of forming a structure ( | 07-24-2014 |
20140209585 | Machine and Method for the Material Processing of Workpieces by Way of a Laser Beam - The invention relates to a machine for material processing with a laser beam, in particular laser welding. It is comprised of a machine guided protective housing with an outlet opening surrounding the laser beam that is pointed at the material during processing. | 07-31-2014 |
20140346157 | METHOD TO CONTROL THE ENVIRONMENT IN A LASER PATH - A method of controlling the environment intermediate a laser head and a targeted portion of a bore wall to remove solid material at the wall includes running an umbilical into the bore to position the head, irradiating the targeted portion of the wall using laser light, sensing a light spectrum resulting from irradiation of the solid material, comparing the sensed light spectrum to a light spectrum corresponding to favorable irradiation of the solid material, adjusting the rate of introduction of a laser-compatible material to displace laser-incompatible materials from the laser light path to obtain more favorable irradiation of the solid material. The method enable the conservation of the source of the laser-compatible material or improved irradiation of the solid material for solid removal by using the laser to cut, heat, fracture or melt the solid material. | 11-27-2014 |
20150014289 | LASER-INDUCED PLASMA DEBURRING - Processes and corresponding or associated arrangements for removal of a burr from a workpiece, particularly micromachined workpieces, involving irradiating a plasma plume source material with a laser beam to generate a plasma plume. The plasma plume at least in part impacts the burr disposed on the workpiece to at least in part remove the burr from the workpiece. In select embodiments, the plasma plume source material can be a part of the workpiece or a non-workpiece sacrificial material. | 01-15-2015 |
20150346483 | FLAT-FIELD SCANNING LENSES, SYSTEMS, AND METHODS - Flat-field laser scanning lenses, systems, and methods with configurable focal length provide focus height accommodation. Lens elements are located by group at respective positions. Focal length configuration may be fixed, may be set, and may be adjusted. Systems include one or more beam deflectors configured to receive an input beam and deflect the input at scan angles, and a controller configured to generate scanning commands. The controller may be responsive to lens adjustments to direct the scanned beam to predetermined points in the scan field at multiple focus height settings. Methods include adjusting the focus height of a laser processing system with a lens focal length adjustment, and may include scaling scanning position commands to correlate commanded scan field positions with scan field positions at a focus height, adjusting the lens focal length in response to a sensor input, and sequentially focusing the lens at multiple workpiece heights. | 12-03-2015 |
20160001395 | Sequencing of Multi-Pass Laser Shock Peening Applications - A method for laser shock peening (LSP) a workpiece is disclosed. The method may include identifying a geometry of the workpiece, determining a number of applications of LSP upon a first side and a second side of the workpiece, and sequencing the applications among the first side and the second side to minimize distortion. | 01-07-2016 |
20160059353 | SURFACE STRUCTURING OF METALS - A method of treating a metallic surface comprising exposing the surface to laser pulses at an energy density below the threshold for ablation of bulk material from the metallic surface; maintaining the exposure until a multiplicity of pores form in the surface. | 03-03-2016 |
20160114434 | Determining A Focus Position Of A High-Energy Beam - An apparatus includes a focusing element arranged to focus a high-energy beam on a workpiece, an image detector for recording at least one image of an area to be monitored on the surface of the workpiece and/or the reference contour; imaging optics arranged to (a) receive process radiation radiation through the focusing element, from an area of the workpiece and/or the reference contour to be monitored, in the form of a first monitoring beam that is non-coaxial with the high-energy beam between the workpiece and the imaging optics and (b) redirect the first monitoring beam to the image detector to provide the at least one image of the area to be monitored and/or the reference contour; and an evaluation device operable to determine the focus position of the high-energy beam based on the at least one recorded image. | 04-28-2016 |
20160139403 | OPTICAL APPARATUS, PROCESSING APPARATUS, AND ARTICLE MANUFACTURING METHOD - An optical apparatus is provided. The apparatus comprises a rotatable reflecting member including a first reflecting surface and a second reflecting surface, an optical system configured to sequentially reflect, by a plurality of reflecting surfaces included therein, light reflected by the first reflecting surface and cause the light to be incident on the second reflecting surface, and an adjusting device configured to change a rotation angle of the reflecting member to adjust an optical path of light that is reflected by the second reflecting surface and exits the second reflecting surface. | 05-19-2016 |
20160147075 | Device and Method for Laser Material Processing - A device for projecting a laser beam onto a workpiece includes at least one first optical element, at least one second optical element, and at least one third optical element. The at least one first optical element is configured to project the laser beam onto the at least one second, in particular diffractive, optical element. The at least one second optical element is configured to convert an intensity profile of the laser beam. The at least one third optical element is configured to project the laser beam onto the workpiece. The device is configured such that a diameter of the laser beam on the workpiece can be varied while maintaining the intensity profile with a stationary workpiece. | 05-26-2016 |
20160151862 | Device for laser processing of a surface of a workpiece or for post-treatment of a coating on the outside or the inside of a workpiece | 06-02-2016 |
20160158884 | Determining Deviations of an Actual Position of a Laser Machining Head from a Desired Position - Implementations of the present disclosure include methods, systems, and computer-readable storage mediums for determining a deviation between an actual position and a desired position of a laser machining head of a laser machining machine. Implementations include actions of selecting at least two different machining positions of the laser machining head, in which a laser beam emitted by the laser machining head is directed onto a desired position of a workpiece, moving the laser machining head into a first selected machining position and forming a through-opening into the workpiece at or around the desired position by operation of the laser beam, moving the laser machining head into a second selected machining position and detecting radiation generated by an interaction between the laser beam and the workpiece, and determining whether there is a deviation between an actual position of the laser machining head and the desired position based on the detected radiation. | 06-09-2016 |
20160167168 | TOOL AND METHOD FOR REMOVING GAS HYDRATES FROM THE SURFACE OF SUBSEA OIL AND GAS EXPLORATION AND PRODUCTION EQUIPMENT THROUGH LASER RADIATION | 06-16-2016 |