Class / Patent application number | Description | Number of patent applications / Date published |
205662000 | With mechanical abrasion or grinding | 17 |
20090260994 | ELECTRO CHEMICAL GRINDING (ECG) QUILL AND METHOD TO MANUFACTURE A ROTOR BLADE RETENTION SLOT - An Electro Chemical Grinding (ECG) quill includes a tool manufactured of a porous tool material having a multitude of pores. An ECG electrolyte is communicated through a hollow tool shank for communication through the porous tool material to manufacture a slot. | 10-22-2009 |
20090314653 | Electrode tool for electrochemical machining and method of manufacturing the same - Disclosed herein is a highly-durable electrode tool for electrochemical machining, which can prevent the corrosion and abrasion of a conductive pattern at the time of electrochemical machining for forming dynamic pressure-generating grooves of a fluid dynamic bearing, and a method of manufacturing the same. The electrode tool for electrochemical machining includes: an electrode substrate on which a conductive pattern is formed to have protrusions corresponding to the fine grooves and to which negative current is applied; a nonconductive insulating layer, covering an entire top surface of the electrode substrate excluding the conductive pattern; and a conductive layer, which is formed on the conductive pattern to protect the conductive pattern, and a top surface of which is the same height as a top surface of the nonconductive insulating layer. | 12-24-2009 |
20100032314 | METHODS AND APPARATUS FOR SELECTIVELY REMOVING CONDUCTIVE MATERIAL FROM A MICROELECTRONIC SUBSTRATE - Methods and apparatuses for selectively removing conductive materials from a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from an electrode pair that includes a first electrode and a second electrode spaced apart from the first electrode. An electrolytic liquid can be directed through a first flow passage to an interface region between the microelectronic substrate and the electrode pair. A varying electrical signal can be passed through the electrode pair and the electrolytic liquid to remove conductive material from the microelectronic substrate. The electrolytic liquid can be removed through a second flow passage proximate to the first flow passage and the electrode pair. | 02-11-2010 |
20100051474 | METHOD AND COMPOSITION FOR ELECTRO-CHEMICAL-MECHANICAL POLISHING - Methods and compositions for electro-chemical-mechanical polishing (e-CMP) of silicon chip interconnect materials, such as copper, are provided. The methods include the use of compositions according to the invention in combination with pads having various configurations. | 03-04-2010 |
20100072076 | SURFACE TREATMENT METHOD FOR HOUSINGS - A surface treatment method for housings, comprising: providing a substrate made of damascus steel; and chemically etching the substrate using inorganic acid solution or inorganic salts solution to give the substrate a patterned appearance. | 03-25-2010 |
20100089768 | Method for the electrochemical removal of a metal coating from a component - The invention relates to a method for the electrochemical removal of a metal coating from a component. According to said method, the component is immersed in an electrolyte solution and a current is passed through the component and a secondary electrode that is in contact with the electrolyte. The current is pulsed with a routine that has a duty cycle >10 to <90%, two current densities between 5 mA/cm | 04-15-2010 |
20100243471 | COMPOSITION, METHOD AND PROCESS FOR POLISHING A WAFER - A composition for use in polishing a wafer is disclosed. The composition includes an aqueous solution of initial components substantially free of loose abrasive particles and having a pH in the range of about 2 to 7, the aqueous solution including at least one polyelectrolyte and a surfactant. In certain embodiments, the wafer polishing composition can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive Chemical Mechanical Polishing (CMP) process. Also disclosed is a CMP method and a process for polishing a wafer using the polishing composition. | 09-30-2010 |
20110147230 | Film Removal - A method of removing coating from a substrate may include contacting a portion of coating on a surface of a substrate to an acid. | 06-23-2011 |
20120012469 | METHOD FOR PRODUCING BORES - In a method for producing bores, a tool connected as a cathode and a workpiece connected as an anode are connected to a voltage source. The workpiece and the tool are connected to one another in an electrically conductive manner via an electrolyte, and an electrical potential difference between the workpiece and the tool is formed at least at times for removing material from the workpiece. Furthermore, the workpiece and the tool are subjected to a relative movement in relation to one another for producing the bore. The potential difference between the workpiece and the tool is formed by a corresponding voltage level in such a way that a gas-vapor envelope which surrounds the tool is formed. | 01-19-2012 |
20130075274 | GRINDING/ELECTROLYSIS COMBINED MULTI-WIRE-SLICING PROCESSING METHOD FOR SILICON WAFERS - A grinding/electrolysis combined multi-wire-slicing processing method for silicon wafers includes the following steps: first, with a metal slicing wire( | 03-28-2013 |
20130134052 | METALLIC COMPONENT FOR HIGH-PRESSURE APPLICATIONS - A metallic component ( | 05-30-2013 |
20150027903 | WELD CLEANING FLUID - The invention relates to a weld cleaning fluid, and method of cleaning weld or discolouration especially on stainless steel. Stainless steel welds, such as those done by TIG welding, require cleaning to remove the resulting surface discolouration and also to passivate the steel. This is often done using an electro-cleaning apparatus with the assistance of electrolyte cleaning fluids. A new cleaning fluid has been developed that has a generally neutral pH, instead of the highly acidic nature of previously used fluids, which avoids environmental and safety issues. The cleaning fluid composition preferably has potassium or sodium orthophosphate salts as the main active ingredient, or similar such salts, and has a pH of around 7. It may also include a sequestering or chelating agent such as a sodium and/or potassium salt of EDTA, and colouring and fragrance. | 01-29-2015 |
20150114845 | TARGETED HEAT EXCHANGER DEPOSIT REMOVAL BY COMBINED DISSOLUTION AND MECHANICAL REMOVAL - This invention relates to compositions and methods for the at least partial dissolution, disruption and/or removal of deposit, such as scale and other deposit, from heat exchanger components. The heat exchanger components can include pressurized water reactor steam generators. In accordance with the invention, elemental metal is added locally to the surface of the deposit and/or anodic or cathodic current is applied locally to the deposit surface to destabilize or weaken the deposit. Subsequently, mechanical stress is applied to the weakened deposit to disrupt and remove the deposit from the surface of the heat exchanger component. | 04-30-2015 |
205663000 | Rotating tool or workpiece | 4 |
20090277802 | Pad-assisted electropolishing - Pad-assisted electropolishing of the substrate is conducted by performing anodic dissolution of metal at a first portion of the substrate and simultaneously mechanically buffing a second portion of the substrate with a buffing pad. Anodic dissolution includes forming a thin liquid layer of electropolishing liquid between the anodic substrate and a cathodic electropolishing head. The location of electrical contacts between the substrate and power supply allow peripheral edge regions of the substrate to be mechanically buffed with the pad. Preferably, a substrate is further planararized using an isotropic material-removal technique. An apparatus includes an electropolishing head that is movable to a position proximate to a first portion of a substrate to form a thin gap, and a buffing pad that mechanically buffs a second portion of the substrate using minimal pressure. | 11-12-2009 |
20100116685 | METHODS AND APPARATUSES FOR ELECTROCHEMICAL-MECHANICAL POLISHING - Methods and apparatuses for removing material from a microfeature workpiece are disclosed. In one embodiment, the microfeature workpiece is contacted with a polishing surface of a polishing medium, and is placed in electrical communication with first and second electrodes, at least one of which is spaced apart from the workpiece. A polishing liquid is disposed between the polishing surface and the workpiece and at least one of the workpiece and the polishing surface is moved relative to the other. Material is removed from the microfeature workpiece and at least a portion of the polishing liquid is passed through at least one recess in the polishing surface so that a gap in the polishing liquid is located between the microfeature workpiece and the surface of the recess facing toward the microfeature workpiece. | 05-13-2010 |
20120228153 | DEVICE, APPARATUS, AND METHOD FOR ABRASIVE ELECTROCHEMICAL FINISHING - A device, apparatus, and method for abrasive electrochemical finishing of an arc flange leaf pack are presented. The device includes: a concave support block having holes to receive securing members; removable first and second end blocks configured to seat at opposite ends of the concave support block; removable first and second face plates attached to opposite sides of the concave support block via the securing members; and a region of space between the removable first and second face plates, the removable first and second end blocks, and the concave support block. | 09-13-2012 |
20140034512 | ELECTROCHEMICAL GRINDING TOOL AND METHOD - An electrochemical grinding tool and method capable of rounding sharp edges that may be prone to cracking, for example, edge regions of cooling slots within dovetail slots of turbine wheels. The electrochemical grinding tool includes a drilling assembly, a conductive bit, and a motor for rotating the conductive bit about an axis thereof. The conductive bit of the electrochemical grinding tool is inserted into a first slot, an electrolyte solution is applied between the conductive bit of the electrochemical grinding tool and a second slot that intersects the first slot, an electrical potential is applied to the conductive bit and the turbine wheel to create a potential gradient between the conductive bit and the edge of the second slot, and material is removed from the edge of the second slot by displacing the conductive bit about and along the edge. | 02-06-2014 |