Class / Patent application number | Description | Number of patent applications / Date published |
174259000 | Adhesive/bonding | 65 |
20080230262 | ELECTRICALLY STABLE COPPER FILLED ELECTRICALLY CONDUCTIVE ADHESIVE - An electronic device including electronic circuit structures formed with an electrically conductive adhesive (ECA) with low and stable contact resistance including at least one melt-processable reactive resin, at least one reactive diluent, at least one rheological additive, at least one curing agent, at least one organic acid catalyst, and copper particles. The ECA is useful for filling vias, and bonding together components of electronic circuit structures. | 09-25-2008 |
20090056994 | Methods of Treating a Surface to Promote Metal Plating and Devices Formed - Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules. | 03-05-2009 |
20090056995 | ADHESIVE SHEET, METAL-LAMINATED SHEET AND PRINTED WIRING BOARD - The adhesive sheet contains a substrate film and an adhesive layer formed at least on one surface of the substrate film. The substrate film is made of a polyimide film showing a degree of curl after a heat treatment at 300° C. of not more than 10%. The adhesive sheet of the present invention can be used for electronic parts and the like exposed to high temperature particularly because warpage and distortion thereof caused by a high temperature treatment are suppressed, and can improve quality and yield of electronic parts and the like. | 03-05-2009 |
20090095516 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET FOR USE IN WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD - The present invention provides a double-sided pressure-sensitive adhesive tape or sheet for use in wiring circuit board, which includes a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition containing an acrylic polymer as a main component, in which the double-sided pressure-sensitive adhesive tape or sheet has an amount of total outgas of 250 μg/g or less and a diffusion amount of toluene of 10 μg/g or less. The double-sided pressure-sensitive adhesive tape or sheet has a small generating amount of VOC as well as excellent punching processing property and anti-repulsion property. | 04-16-2009 |
20090095517 | DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE OR SHEET FOR WIRING CIRCUIT BOARD AND WIRING CIRCUIT BOARD - The present invention provides a double-sided pressure-sensitive adhesive tape or sheet for wiring circuit board, which includes a pressure-sensitive adhesive layer formed by a pressure-sensitive adhesive composition, wherein the pressure-sensitive adhesive composition contains an acrylic polymer as a main component and further contains an electrically conductive filler in a proportion of 5 to 100 parts by weight with respect to 100 parts by weight of a total solid in the pressure-sensitive adhesive composition except the electrically conductive filler. The double-sided pressure-sensitive adhesive tape or sheet is excellent in adhesiveness, electrically conducting property and anti-repulsion property, and thus can be advantageously used for wiring circuit board. | 04-16-2009 |
20090200072 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - The wiring substrate | 08-13-2009 |
20090211792 | Flexible Printed Circuit Assembly With Reduced Dielectric Loss - A flexible printed circuit assembly with a fluorocarbon dielectric layer and an adhesive layer with reduced thickness. The flexible printed circuit assembly includes a first dielectric layer and a signal trace disposed on the first dielectric layer. An adhesive layer with a thickness smaller than a height of the signal trace is disposed on the first dielectric layer, so that only a portion of a side surface of the signal trace is covered. A second dielectric layer made of fluorocarbon is disposed on the adhesive layer, covering a remaining portion of the side surface of the signal trace and a top surface of the signal trace. | 08-27-2009 |
20090242249 | BONDING MATERIAL, ELECTRONIC COMPONENT, BONDING STRUCTURE AND ELECTRONIC DEVICE - A bonding material that has a melting temperature of 270° C. or higher and that does not contain lead is inexpensively provided. An electronic element and an electrode of an electronic component are bonded using a bonding material containing an alloy that contains Bi as the main component and that contains 0.2 to 0.8 wt % Cu and to 0.2 wt % Ge. | 10-01-2009 |
20090242250 | POLYIMIDE FILM, METHOD FOR PRODUCTION THEREOF, POLYIMIDE-METAL LAMINATED PRODUCT, AND CIRCUIT BOARD - Disclosed is a polyimide film produced by heating a self-supporting film of a polyimide precursor solution onto which a solution containing an aluminum chelate compound and, optionally, a nonionic surfactant and/or an aluminum alcoholate compound having at least one alkoxy group is applied to effect imidization. | 10-01-2009 |
20090260862 | CIRCUIT MODIFICATION DEVICE FOR PRINTED CIRCUIT BOARDS - An electronic circuit modification apparatus to repair or modify portions of a printed circuit board comprises an adhesive layer, an insulating layer formed over the adhesive layer, and a plurality of electrically-conductive traces having an electrically-conductive bonding layer formed thereupon. The electrically-conductive bonding layer is configured to mechanically mount and electrically couple to a lead of an electrical component. At least one masking layer is positioned to electrically isolate the plurality of electrically-conductive traces, one from another. | 10-22-2009 |
20090266592 | CIRCUIT BOARD AND METHOD FOR JOINTING CIRCUIT BOARD - A circuit board in which end faces ( | 10-29-2009 |
20090288864 | CABLE HAVING ESD DISSIPATIVE ADHESIVE ELECTRICALLY CONNECTING LEADS THEREOF - A cable in one embodiment comprises a plurality of leads; and an electrostatically dissipative adhesive operatively electrically coupling the leads together, the adhesive comprising a mixture of an adhesive material and electrically conductive particles intermixed with the adhesive material. A method in one embodiment comprises applying an electrostatically dissipative adhesive to exposed leads of a cable for operatively electrically coupling the leads together, the adhesive comprising a mixture of an adhesive material and electrically conductive particles intermixed with the adhesive material. Additional embodiments are presented. | 11-26-2009 |
20090314533 | ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION - An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition. | 12-24-2009 |
20100006329 | SEALING MATERIAL AND MOUNTING METHOD USING THE SEALING MATERIAL - A sealing material is provided, upon mounting semiconductor devices and/or electronic components which are relatively weak on a circuit board, which shows sealing characteristics that enables itself to seal the semiconductor devices and/or electronic components and connections therebetween with low stress and high reliability; and suitable repairability that enables merely semiconductor devices and/or electronic components which were determined to be off-specification after being sealed to be repaired with ease. The sealing material contains at least (a) a heat-curable resin component and (b) a hardener component therefor, and is characterized in that, once the sealing material is cured by being heated, the cured material has a glass transition temperature (Tg) in a temperature range of from −80° C. to 50° C. | 01-14-2010 |
20100012362 | RESIN COMPOSITION, RESIN FILM, COVER LAY FILM, INTERLAYER ADHESIVE, METAL-CLAD LAMINATE AND MULTILAYER PRINTED CIRCUIT BOARD - The present invention provides a resin composition for use as an adhesive material of a printed circuit board, comprising a polyimide siloxane resin. The present invention also provides a resin composition, a resin film, a cover lay film, an interlayer adhesive, a metal-clad laminate and a multilayer printed circuit board, in which flowing out during heating/pressing is prevented and which provide excellent adhesion strength. The present invention also provides a resin composition, a resin film, a cover lay film, an interlayer adhesive, a metal-clad laminate and a multilayer printed circuit board, which exhibit excellent heat resistance. | 01-21-2010 |
20100025094 | EPOXY RESIN COMPOSITION FOR PRINTED WIRING BOARD, RESIN COMPOSITION VARNISH, PREPREG, METAL CLAD LAMINATE, PRINTED WIRING BOARD AND MULTILAYER PRINTED WIRING BOARD - An epoxy resin composition for printed wiring board, characterized by containing (A) an epoxy resin component containing an epoxy resin (A-1) having nitrogen and bromine atoms in the same molecule, (B) a phenolic curing agent component containing a phenol resin (B-1), and (C) a curing accelerator component containing an imidazole-silane compound (C-1). | 02-04-2010 |
20100044088 | CONDUCTIVE ADHESIVE - Conductive adhesives, which do not have the problem of migration in conductive metals upon application of a voltage and which exhibit low resistance values, are provided. | 02-25-2010 |
20100051338 | ADHESION ASSISTING AGENT-BEARING METAL FOIL, PRINTED WIRING BOARD, AND PRODUCTION METHOD OF PRINTED WIRING BOARD - The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers. | 03-04-2010 |
20100101844 | MULTI-PIECE BOARD AND FABRICATION METHOD THEREOF - A fabrication method for a multi-piece board includes: checking whether pieces (printed wiring boards) are defect-free or not; forming a first recess in a joint portion between a defective piece and a frame; forming a first fitting portion at the frame by separating the defective piece; cutting out a defect-free piece having a second fitting portion from another board; forming a second recess in the second fitting portion; fitting the second fitting portion into the first fitting portion; flattening a joint portion; and filling an adhesive in a third recess which is formed by the first recess and the second recess, and curing the adhesive to adhere the frame and the defect-free piece. | 04-29-2010 |
20100101845 | Electronic Device and Manufacturing Method for Electronic Device - An electronic device manufacturing method includes: setting a solder material on electrodes of a first circuit assembly; setting a resin having a flux action on one surface of a second circuit assembly so as to entirely cover solder bumps formed on the one surface of the second circuit assembly; setting the second circuit assembly on the first circuit assembly via the resin so that the solder material set on the electrodes of the first circuit assembly and the solder bumps of the second circuit assembly are put into contact with each other; and applying thermal energy to connecting portions between the solder material and the solder bumps and to the resin. By carrying out these processes, an electronic device in which the first circuit assembly and the second circuit assembly are joined together and in which their junction portions are sealed by the resin is manufactured. As a result, in the electronic device, junction reliability can be improved. | 04-29-2010 |
20100116533 | ADHESIVE FILM, CONNECTING METHOD, AND JOINED STRUCTURE - An adhesive film including a first adhesive layer containing a first main resin component and dispersed conductive particles, and a second adhesive layer containing a second main resin component and adhering to the first adhesive layer, each of the adhesive layers containing a secondary resin component, wherein the first main resin component has a glass transition temperature higher than that of the secondary resin component, and the second main resin component has a glass transition temperature higher than that of the secondary resin component and lower than that of the first main resin component, and a reaction peak temperature of each of the adhesive layers is lower than the glass transition temperature of the first main resin component and higher than the glass transition temperature of the second main resin component, and is a temperature at which a calorific value of the adhesive layer is maximum during temperature rise. | 05-13-2010 |
20100132990 | Device Built By Joining A Plurality Of Layers - In a method of manufacturing a multilayer device exposed surfaces of a first and second layer are joined together. Before joining a depression is created in the exposed surface of a layer and raw material, such as electrically conductive material, for forming an electric circuit is deposited in the depression, typically filling the depression. Excess material is mechanically removed before the layers are joined. In this way conductor tracks may be created between layers. When adjacent fluid chambers are provided, separated by one of the layers, the depression with the material in it makes it possible realize a sensor device with a reduced separation between the chambers. | 06-03-2010 |
20100147571 | COMPONENT HAVING A METALIZED CERAMIC BASE - Components having a ceramic base the surface of which is covered in at least one area by a metalized coating, wherein the material on the surface of the ceramic base is chemically and/or crystallographically and/or physically modified with or without addition of suitable reactants across the entire surface or on partial surfaces of the metalized areas and forms at least one nonporous or porous layer, joined to the ceramic base, that has the same or different thickness of at least 0.001 nanometers, the layer containing at least one homogeneous or heterogeneous new material. | 06-17-2010 |
20100155123 | HALOGEN-FREE PREPREG AND RESIN FOR PREPARING THE SAME - A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant, and a solvent. A halogen-free prepreg is also provided, including a glass fabric cloth and a halogen-free resin layer on the glass fabric. The halogen-free resin layer is made from the foregoing halogen-free resin. | 06-24-2010 |
20100163289 | PRINTED WIRING BOARD, METHOD OF MANUFACTURING PRINTED WIRING BOARD, AND METHOD OF CONNECTING PRINTED WIRING BOARD - A printed wiring board including: an insulated substrate; a conductive circuit provided on one side of this insulated substrate; a cover layer covering the insulated substrate and the conductive circuit; and a conductive particle buried in this cover layer, wherein the conductive particle is buried in the cover layer so that the conductive particle contacts the conductive circuit and protrudes from the cover layer; and the conductive particle serves as an electric contact point. | 07-01-2010 |
20100193228 | EPOXY RESIN COMPOSITION - An epoxy resin composition containing an epoxy resin and a thermal cationic polymerization initiator not only can reduce the amount of fluorine ions generated during thermal cationic polymerization to improve electrolytic corrosion resistance but also is excellent in low-temperature rapid curability. The epoxy resin composition uses a sulfonium borate complex represented by the formula (1) as the thermal cationic polymerization initiator. | 08-05-2010 |
20100206623 | NONCONDUCTIVE ADHESIVE COMPOSITION AND FILM AND METHODS OF MAKING - To provide a nonconductive adhesive film, for electrically connecting a flexible printed circuit board to a circuit board, which is superior in both storage stability and curability and which suppresses the formation of air bubbles at the time of press bonding. A nonconductive adhesive film substantially comprising a heat-curable epoxy resin, a latent curing agent, and organic elastic fine particles of an average particle size of approximately 1 μm or less, a film being formed by aggregation of the organic elastic fine particles, is provided. | 08-19-2010 |
20100212945 | BOND HEAD ASSEMBLY AND SYSTEM - An inductive thermal bonding system includes at least one inductive bonding or heating member containing a magnetic E-shaped inductive core and a coil bounding a central member of the E-shaped inductive core. A rigid cover plate allows high and predictable temperature rate-of-change during use and reduced thermal cycling time without risk of detriment. Adaptive solid copper pads on multiplayer bonding regions minimize bonding errors and improve reliability. A cooling system is provided for adaptively cooling both the bond head and the bonded stack. Single and paired inductive heating members may be employed, and may also be alternatively controlled and positioned to aid generation of multiplayer bonding subassemblies distant from an edge of a multiplayer sheet construct. | 08-26-2010 |
20100294550 | BONDING MATERIAL, ELECTRONIC COMPONENT AND BONDED STRUCTURE - A bonding material containing 2 to 10.5% by weight of Cu, 0.02 to 0.2% by weight of Ge and 89.3 to 97.98% by weight of Bi has heat resistance of up to 275° C. and superior wettability, and a bonding material containing 2 to 10.5% by weight of Cu, 0.02 to 0.2% by weight of Ge, 0.02 to 0.11% by weight of Ni and 89.19 to 97.96% by weight of Bi has more superior heat resistance. | 11-25-2010 |
20100294551 | ADHESIVE FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION METHOD USING THE SAME, AND CIRCUIT CONNECTED STRUCTURE - There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection. | 11-25-2010 |
20100307805 | CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THE SAME - The circuit connecting material of the invention is a circuit connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and second circuit electrode laid facing each other, the circuit connecting material comprising a curing agent that generates free radicals, a radical polymerizing substance and a compound containing secondary thiol group. The circuit connecting material of the invention is capable of low-temperature rapid curing and has excellent storage stability. | 12-09-2010 |
20100319972 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed circuit board having a connection terminal which includes: an insulating substrate including first and second surfaces, and an end surface along an outline normal to an insertion direction of the connection terminal; at least one lead wiring layer formed on the first surface of the insulating substrate; an insulating protection film covering the lead wiring layer; at least one lead terminal layer constituting an end portion of the lead wiring layer, the lead terminal layer being formed into a strip, and having an end surface along the outline; a reinforcement body adhered on the second surface of the insulating substrate at a backside position of the lead terminal layer; wherein a distance between an outer surface of the lead terminal layer and an outer surface of the reinforcement body on the outline side is smaller than a distance therebetween on the lead wiring layer side. | 12-23-2010 |
20100326714 | PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD FABRICATION METHOD, AND ELECTRONIC DEVICE INCLUDING PRINTED CIRCUIT BOARD - A printed circuit board include: a printed circuit board main body having a mounting area on a first surface of the printed circuit board main body and a recess being provided at a recess area on a second surface that is a back side of the first surface of the printed circuit board main body, the electronic component being mounted on the mounting area, the recess area being provided to correspond to the mounting area; and a thermal expansion control element being placed in the recess and having a smaller thermal expansion coefficient than the printed circuit board main body. | 12-30-2010 |
20110061916 | WIRING BOARD AND MANUFACTURING METHOD THEREOF - A wiring board includes a substrate having a surface made of an insulating resin. An adhesion layer is formed on the substrate. A wiring layer is formed on the adhesion layer. The adhesion layer is formed by a nitrided NiCu alloy containing nitrogen therein. A nitrogen content of the nitrided NiCu alloy is within a range from 1 atoms % to 5 atoms %. | 03-17-2011 |
20110100690 | ELECTRICALLY CONDUCTIVE BODY AND PRINTED WIRING BOARD AND METHOD OF MAKING THE SAME - An electrically conductive body includes: a first electrically conductive material; a second electrically conductive material; and a bonding material bonding the first electrically conductive material to the second electrically conductive material at least for electric conduction. The bonding material is made of a metallic structure containing copper-tin based intermetallic compound phases and tin-bismuth phases, the copper-tin based intermetallic compound phases being continuous between the first electrically conductive material and the second electrically conductive material, the tin-bismuth phases being surrounded by the copper-tin based intermetallic compound phases. | 05-05-2011 |
20110139500 | ELECTRICAL CONNECTING METHOD AND ELECTRICALLY CONNECTED CONNECTION STRUCTURE - A method of connecting a flexible flat cable and a board is provided, which includes the steps of preparing the flexible flat cable having a first connection terminal composed of a plurality of exposed flat type conductors; preparing the board having a second connection terminal composed of a plurality of conductors; aligning each of the first and second connection terminals and placing an adhesive film on the first connection terminal; and thermocompressionally bonding the first and second connection terminals by heating and fusing the adhesive film while applying a pressure to the adhesive film, thereby sealing the first and second connection terminals, bringing each flat type conductor of the first connection terminal and the corresponding conductor of the second connection terminal into direct contact to form an electrical connection, and insulating adjacent ones of the plurality of flat type conductors of the first connection terminal by the adhesive film. | 06-16-2011 |
20110192639 | NOVEL SULFONIUM BORATE COMPLEX - A novel sulfonium borate complex that is capable of reducing the amount of fluorine ions generated during thermal cationic polymerization, and is capable of providing a thermal cationic polymerizable adhesive with low-temperature fast curing properties is represented by a structure represented by the formula (1). | 08-11-2011 |
20110226515 | TEXTILE-TYPE ELECTRONIC COMPONENT PACKAGE, METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MOUNTING THE SAME ON TEXTILE - A textile-type electronic component package includes a textile base; a textile-type electronic component and a plurality of conductive patterns having end contact points formed on the top surface of the textile base; a thermoplastic adhesive formed on the bottom surface of the textile base; a plurality of mounting pads formed on the thermoplastic adhesive and facing the conductive patterns, respectively; and a plurality of via-hole-type coupling parts penetrating end contact points of the conductive patterns, the textile base, and the thermoplastic adhesive, and electrically coupling the mounting pads and the conductive patterns, wherein the via-hole-type coupling parts includes a bunch of via-holes filled with a conductive polymer. | 09-22-2011 |
20110247867 | ADHESIVE FOR BONDING CIRCUIT MEMBERS, CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION - An adhesive for bonding and securing a semiconductor chip to a circuit board and electrically connecting the electrodes of the two, and containing an adhesive resin composition and an inorganic filler being contained in an amount of 10 to 200 parts by weight of 100 parts by weight of the adhesive resin composition. | 10-13-2011 |
20110253436 | ELECTROCHEMICAL DEVICE AND MANUFACTURING METHOD THEREOF, CIRCUIT BOARD AND HOUSING TRAY | 10-20-2011 |
20110303447 | LOW PROFILE TAPE STRUCTURES - Electronic devices may include electronic device structures such substrates, structures with cavities, and housing structures. Tape may be used to seal components to the surface of a substrate or within a cavity. The tape may have a nonstick polymer layer such as a layer of parylene and one or two layers of adhesive. The nonstick layer may be formed in a pattern so that some of the layer of adhesive is uncovered by the nonstick layer. The nonstick layer may be oriented so that the adhesive is interposed between the nonstick layer and a sealed component or may be oriented so that the nonstick layer is interposed between the adhesive layer and the sealed component. The component that is sealed by the tape may be an electrical component such as a dome switch or other mechanical or electrical component. | 12-15-2011 |
20110303448 | Pb-Free Sn-Ag-Cu-Al or Sn-Cu-Al Solder - A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag | 12-15-2011 |
20120043125 | CIRCUIT BOARDS, METHODS OF FORMING THE SAME AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME - Provided is a method of forming a circuit board including an adhesion portion. The method may include forming a mask pattern including an opening on a board; performing a surface treatment process at a bottom of the opening; combining a linker with the surface on which a surface treatment process is performed; and forming a metal pattern combined with the linker in the opening. | 02-23-2012 |
20120043126 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same, including: forming a protective layer on which a cover film is stacked on a base substrate; exposing the protective layer on which the cover film is stacked to photosensitize the protective layer and photodegrade the cover film; and developing the photodegraded cover film and the photosensitized protective layer to form an opening exposing a pad unit of a circuit layer which is an outermost layer of the base substrate on the protective layer, whereby the productivity of the printed circuit board can be improved without performing a process of separating a cover film. | 02-23-2012 |
20120055705 | DOPO-DERIVED FLAME RETARDANT AND EPOXY RESIN COMPOSITION - This invention relates to 9,10-Dihydro-9-Oxa-10-Phosphaphenantrene-10-oxide derived additive flame-retardants, which are useful in epoxy resin compositions. The epoxy resin compositions may be used in making prepregs or laminates for printed wiring boards and composite materials. | 03-08-2012 |
20120073869 | CONDUCTIVE ADHESIVE, AND CIRCUIT BOARD AND ELECTRONIC COMPONENT MODULE USING THE SAME - A conductive adhesive includes 10 to 90 wt % of Sn—Bi system solder powder and the remainder of an adhesive containing organic acid, and the Sn—Bi system solder powder is composed of solder particles having a particle size L | 03-29-2012 |
20120080219 | METHOD OF MANUFACTURING ELECTRONIC DEVICE AND ELECTRONIC DEVICE - A method of manufacturing an electronic device in which an electronic component is flip-chip mounted on a circuit board, the method includes supplying, on an electrode of the circuit board or a terminal of the electronic component, a first resin material of a thickness smaller than a gap between the circuit board and the electronic component, after supplying the first resin material, connecting the terminal to the electrode by melting a solder material disposed on the electrode or the terminal at a first temperature with keeping the terminal in contact with the electrode, after connecting the terminal to the electrode, filling the gap between the circuit board and the electronic component with a second resin material, and heating the second resin material at a second temperature lower than the first temperature. | 04-05-2012 |
20120111622 | Double-Sided Pressure-Sensitive Adhesive Tape or Sheet For Use In Wiring Circuit Board And Wiring Circuit Board Having The Double-Sided Pressure-Sensitive Ahesive Tape - The present invention relates to a double-sided pressure-sensitive adhesive tape or sheet for use in a wiring circuit board, which includes a pressure-sensitive adhesive layer formed of a pressure-sensitive adhesive composition comprising an acrylic polymer and a tackifier resin containing a phenolic hydroxyl group; and a release liner comprising a releasing treatment layer formed of a silicone release agent. The double-sided pressure-sensitive adhesive tape or sheet of the invention has a good adhesiveness and, even after a high-temperature step, it is capable of exerting an excellent anti-repulsion property. Further, since the release liner can be easily peeled off even after the high-temperature step, the workability is excellent and the productivity is improved. | 05-10-2012 |
20120186865 | PASTE COMPOSITION AND PRINTED CIRCUIT BOARD - A conductor layer is formed on one surface of a base insulating layer. The conductor layer includes a collector portion, and a drawn-out conductor portion extending in an elongated shape from the collector portion. A cover layer is formed on the base insulating layer to cover a predetermined portion of the conductor layer. A material for the cover layer includes a paste composition containing a compound expressed by the formula (1). | 07-26-2012 |
20120292087 | METHOD FOR SOLDERING SURFACE-MOUNT COMPONENT AND SURFACE-MOUNT COMPONENT - The melting of die-bonding solder material is prevented even when soldering a surface-mount component formed using the die-bonding solder material on a printed circuit board using a mounting solder material. | 11-22-2012 |
20120305302 | MOUNTING STRUCTURE OF ELECTRONIC COMPONENT - Electrode protective films | 12-06-2012 |
20120325535 | PRINTED WIRING BOARD ENCAPSULATED BY ADHESIVE LAMINATE COMPRISING A DI-ISOIMIDE, AND PROCESS FOR PREPARING SAME - The present invention deals with a flexible printed wiring board in the form of a printed wiring board wherein the conductive elements are fully encapsulated by an epoxy adhesive comprising a novel aromatic di-isoimide chemical compound. The conductive elements are thereby protected. The flexible printed wiring board is readily cured at a temperature in the range of 100 to 250° C. However, before curing, by virtue of the latent cure feature of the epoxy adhesive, the adhesive component of the printed wiring board has an extended shelf life, and avoids premature curing during processing. | 12-27-2012 |
20130020118 | RESIN COMPOSITION FOR ADHESIVE, ADHESIVE CONTAINING RESIN COMPOSITION FOR ADHESIVE, ADHESIVE SHEET CONTAINING RESIN COMPOSITION FOR ADHESIVE, AND PRINTED WIRING BOARD INCLUDING ADHESIVE OR ADHESIVE SHEET AS ADHESIVE LAYER - Provided is a resin composition for an adhesive comprising a polyurethane resin containing a carboxyl group, having specific range of an acid value having specific range of a number average molecular weight and having specific range of a glass transition temperature a polyester resin having specific range of a number average molecular weight and having specific range of a glass transition temperature; an epoxy resin containing a nitrogen atom; and an epoxy resin having a dicyclopentadiene skeleton, in which a content rate of the polyurethane resin to a sum of the polyurethane resin and the polyester resin is 70 to 95 percent by mass, a content rate of the total epoxy resin contained in the resin composition to the sum of the polyurethane resin and the polyester resin is 5 to 30 percent by mass. | 01-24-2013 |
20130025921 | METHOD FOR MANUFACTURING CIRCUIT BOARD USING ELECTRICALLY CONDUCTIVE PARTICLES AND CIRCUIT BOARD MANUFACTURED BY THE METHOD - An exemplary method for manufacturing a circuit board includes, firstly, obtaining an insulating substrate, liquid heat-curable adhesive and electrically conductive particles. The electrically conductive particles are added into the liquid heat-curable adhesive. The electrically conductive particles in the heat-curable adhesive are activated by electrical discharge. Secondly, the liquid heat-curable adhesive having activated electrically conductive particles are spread on the insulating substrate to form a heat-curable adhesive layer on the insulating substrate. Thirdly, the heat-curable adhesive layer are exposed to the mid-infrared light by using a photo-mask, the photo-mask has a pattern corresponding to a desired circuit pattern of the circuit board. The electrically conductive particles relocated themselves one by one to form the circuit pattern under irradiation by the mid-infrared light. Finally, the heat-curable adhesive layer are hardening. | 01-31-2013 |
20130037314 | BONDING MATERIAL, BONDED PORTION AND CIRCUIT BOARD - Disclosed is a solder material which enables to realize a lower mounting temperature when an electronic component is mounted. Also disclosed are a solder paste and a conductive adhesive. Specifically disclosed is a solder material having a basic composition composed of Sn, Bi and In. This solder material may further contain at least one metal selected from the group consisting of Cu, Ge and Ni. A solder paste which enables to realize a low-temperature mounting can be obtained by blending a flux component into the solder material. A conductive adhesive which enables to realize a low-temperature mounting can be obtained by blending a resin component into the solder material. | 02-14-2013 |
20130068514 | FLIP-CHIP CARRIER AND FABRICATING METHOD OF MPS-C2 PACKAGE UTILIZED FROM THE SAME - Disclosed are a flip-chip carrier having individual pad masks (IPMs) and a fabricating method of a MPS-C2 package utilized from the same. The flip-chip carrier primarily comprises a substrate and a plurality of the IPMs. The substrate has a top surface and a plurality of connecting pads on the top surface. The IPMs cover the corresponding connecting pads in one-on-one alignment where each IPM consists of a photo-sensitive adhesive layer on the corresponding connecting pad and a pick-and-place body pervious to light formed on the photo-sensitive adhesive layer. After the photo-sensitive adhesive layers are irradiated by light penetrating through the pick-and-place bodies, the pick-and-place bodies can be pulled out by a pick-and-place process to expose the connecting pads from an encapsulant. The issues of solder bridging and package warpage can easily be solved in conventional MPS-C2 packages. | 03-21-2013 |
20130118789 | FIXING METAL BRACKET FOR COMPONENT MOUNTED ON CIRCUIT BOARD - A fixing metal bracket for a component mounted on a circuit board, includes a solder bonding plate section to be solder-fixed on a surface of a circuit board with a cream solder, and a component fixing section to be fixed to a component mounted on the circuit board. An annular through-groove is formed on the solder bonding plate section at a position surrounding a central area thereof. An island-shaped portion at the inside of the through-groove is separated from a peripheral portion at the outside of the through-groove while the connection part is remained. A step is formed on a solder bonding face of the connection part. Pure Sn plating is applied to the solder bonding face of the island-shaped portion and whisker resistance plating is applied to a surface of a portion other than the island-shaped portion. | 05-16-2013 |
20130220687 | WAFER PROCESS BODY, WAFER PROCESSING MEMBER, WAFER PROCESSING TEMPORARY ADHESIVE MATERIAL, AND METHOD FOR MANUFACTURING THIN WAFER - Disclosed is a wafer process body, a temporary adhesive layer is formed on a supporting body, and a wafer having a circuit-formed front surface and a to-be-processed back surface is stacked on the temporary adhesive layer, wherein the temporary adhesive layer is provided with a first temporary adhesive layer including a non-aromatic saturated hydrocarbon group-containing organopolysiloxane layer (A) which is adhered to the front surface of the wafer so as to be detachable and a second temporary adhesive layer comprised of a thermosetting-modified siloxane polymer layer (B) which is stacked on the first temporary adhesive layer and adhered to the supporting body so as to be detachable. Thus, temporary adhesion of a wafer with a supporting body may become easy, process conformity with the TSV formation process and with the wafer-back surface-wiring process may become high, and removal may be done easily, with high productivity. | 08-29-2013 |
20130299223 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed are a printed circuit board and a method for manufacturing the same. The method for manufacturing the printed circuit board includes forming a base circuit board including a cavity circuit pattern in a cavity region on upper and lower portions of a substrate and internal circuit layers outside the cavity region, forming a cavity separation layer on the cavity circuit pattern, forming at least one pair of an insulating layer and a circuit layer on the base circuit board, cutting the insulating layer and the cavity separation layer provided on an etch stop pattern by controlling a focal length of a laser beam such that the laser beam reaches a surface of the base circuit board, and removing the insulating layer by separating the cavity separation layer to form the cavity. The cavity separation layer is formed on the cavity circuit pattern, and the resultant structure is cut to the cavity separation layer by using a laser so that the insulating layer is separated. Accordingly, the insulating layer in the cavity is easily removed. | 11-14-2013 |
20140048320 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method for manufacturing the same, the printed circuit board including an adhesion promoter (AP) film for enhancing adhesive strength, interposed between a circuit pattern and an insulating layer above a substrate, the AP film containing any one of a first polymer, a second polymer, and an organic compound. According to the method for manufacturing the printed circuit board, there can be provided a printed circuit board having a fine circuit pattern by using the AP film having a low roughness value and having improved adhesive strength with respect to the circuit pattern. | 02-20-2014 |
20140216801 | METHOD OF MANUFACTURING COMPONENT-EMBEDDED SUBSTRATE AND COMPONENT-EMBEDDED SUBSTRATE MANUFACTURED BY THE SAME - A method of manufacturing a component-embedded substrate comprises forming an adhesive layer on a metal layer formed on a supporting plate, and mounting an electric or electronic component on the adhesive layer, wherein the component includes a component main body and a protrusion that protrudes beyond the component main body toward the adhesive layer, the adhesive layer includes a first adhesive body and a second adhesive body, the first adhesive body is formed only at a position corresponding to the protrusion, the second adhesive body is formed in an area corresponding to the whole of the surface of the component facing the adhesive layer after the first adhesive body is cured, and the component is mounted with the protrusion aligned with the first adhesive body in the component mounting step. | 08-07-2014 |
20140318840 | STACKED STRUCTURE AND MANUFACTURING METHOD OF THE SAME - An embodiment of a stacked structure includes: a first substrate that includes a first electrode; a second substrate that includes a second electrode; and an adhesive resin material that is provided between the first substrate and the second substrate and includes a plurality of conductive vias, the plurality of conductive vias electrically connecting the first electrode and the second electrode. | 10-30-2014 |
20150021075 | SURFACE-MOUNTING SUBSTRATE - A surface mounting substrate for surface mounting an electronic part using a lead-free solder includes a joint portion of the substrate to which the electronic parts is joined; and a stress relaxation portion formed in a vicinity of the joint portion of the substrate. | 01-22-2015 |
20150136461 | SOLDER ALLOY, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD - A solder alloy of a tin-silver-copper solder alloy, containing tin, silver, antimony, bismuth, copper, and nickel, and substantially does not contain germanium, relative to the total amount of the solder alloy, the silver content is more than 1.0 mass % and less than 1.2 mass %, the antimony content is 0.01 mass % or more and 10 mass % or less, and the bismuth content is 0.01 mass % or more and 3.0 mass % or less. | 05-21-2015 |
20160088731 | CAPACITORS FOR MULTILAYER PRINTED CIRCUIT BOARDS - A capacitor in a multilayer printed circuit board is described. The capacitor may include a via of a via-in-pad type and a dielectric mixture filled in the via of the via-in-pad type. The via may be disposed under an integrated circuit contact pad of the multilayer printed circuit board. The dielectric mixture may include a nanoparticle-sized dielectric powder mixed with an adhesive material. | 03-24-2016 |