Entries |
Document | Title | Date |
20080202798 | TRANSPARENT SUBSTRATE WITH THIN FILM AND METHOD FOR MANUFACTURING TRANSPARENT SUBSTRATE WITH CIRCUIT PATTERN WHEREIN SUCH TRANSPARENT SUBSTRATE WITH THIN FILM IS USED - An object of the invention is to provide a method for manufacturing a transparent substrate provided with a tin oxide thin film which can be satisfactorily patterned even by irradiation with a laser light having low energy because an ablation phenomenon occurs therewith. The invention relates to a method for manufacturing a transparent substrate bearing a circuit pattern, which comprises irradiating a thin-film-attached transparent substrate comprising a transparent substrate having thereon a transparent conductive film having a carrier concentration of 5×10 | 08-28-2008 |
20080210458 | Flexible substrate, multilayer flexible substrate and process for producing the same - A flexible substrate comprises:
| 09-04-2008 |
20080210459 | WARPAGE-PROOF CIRCUIT BOARD STRUCTURE - The invention provides a warpage-proof circuit board structure, including: an inner layer circuit board; at least one dielectric layer formed on at least one surface of the inner layer circuit board; at least one first groove formed in the at least one dielectric layer corresponding in position thereto; a solder mask formed on the surface of the dielectric layer, a second groove formed in the solder mask and corresponding in position to the first groove formed in the dielectric layer; and a metal frame formed in the first and second grooves and protruding from the surface of the solder mask, thereby strengthening the circuit board to prevent it from warping in thermal processing and further using the metal frame as a heat-dissipating means for the package structure. | 09-04-2008 |
20080223603 | Capacitor embedded printed circuit board - A capacitor embedded printed circuit board (PCB), the PCB including: a multilayer polymer capacitor layer where a plurality of polymer sheets is laminated; one or more first inner electrodes and second inner electrodes, separated by one or more of the plurality of polymer sheets and alternately disposed to form a pair; a plurality of first extended electrodes and second extended electrodes connected to the first inner electrodes and second inner electrodes, respectively; one or more insulating layers laminated on one or both surfaces of the multilayer polymer capacitor, where a plurality of conductive patterns and conductive via holes, forming an interlayer circuit are formed; a plurality of first via holes for capacitor, penetrating the multilayer polymer capacitor layer to be connected to the first extended electrodes; and a plurality of second via holes for capacitor, penetrating the multilayer polymer capacitor layer to be connected to the second extended electrodes, wherein the plurality of the first and second extended electrodes are alternately disposed to be opposite to each other. | 09-18-2008 |
20080245552 | PRINTED WIRING BOARD WITH ENHANCED STRUCTURAL INTEGRITY - A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel. | 10-09-2008 |
20080251281 | ELECTRICAL INTERCONNECT STRUCTURE AND METHOD - An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad. | 10-16-2008 |
20080251282 | HIGHLY THERMALLY CONDUCTIVE CIRCUIT SUBSTRATE - A highly thermally conductive circuit substrate includes a metallic substrate, an insulated layer, a first medium layer, and an electrically conductive layer. The insulated layer is formed on a surface of said metallic substrate. The first medium layer is formed on a surface of said insulated layer. The electrically conductive layer is formed on a surface of said first medium layer. | 10-16-2008 |
20080251283 | MOUNTING SUBSTRATE AND ELECTRONIC DEVICE - A mounting substrate includes: a mounting area on which an electronic element is mounted; an electrode forming area on which electrodes are formed and which is formed to surround the mounting area; and a dam member which is formed on a boundary between the mounting area and the electrode forming area so as to block flow out of a filling material being filled between the electronic element and the mounting substrate, into the electrode forming area, wherein recess portions that face the electrodes are formed on an outer peripheral surface of the dam member and a part of the electrodes are formed within the recess portions. | 10-16-2008 |
20080257590 | HIGH THERMAL CONDUCTING CIRCUIT SUBSTRATE AND MANUFACTURING PROCESS THEREOF - A manufacturing process of a high thermal conducting circuit substrate is provided. First, a metal core substrate is provided and then the metal core substrate is etched at different etching speeds. Afterwards, two insulating layers are formed respectively on two sides of the etched metal core substrate. In addition, as an option, two conducting layers are formed respectively on two sides of the metal core substrate and are on top of the insulting layers. The conducting layers are patterned according to designs appropriate for the products. Because the high thermal conducting circuit substrate fabricated as the aforementioned manufacturing process mainly comprises the metal core substrate, it helps to elevate the thermal conduction of the circuit substrate itself. | 10-23-2008 |
20080257591 | PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF - A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other. | 10-23-2008 |
20080257592 | APPARATUS FOR BALANCING POWER PLANE PIN CURRENTS IN A PRINTED WIRING BOARD USING COLLINEAR SLOTS - An apparatus for balancing power plane pin currents in a printed wiring board (PWB) provides for reduction in pin counts required for power plane (including ground plane) connections and/or reduction in requirements for connector current handling per pin. One or more slots are introduced in the metal layer implementing the power plane that alter the current distribution in the power plane. The per-pin current profile for connector pins connected to the power plane is equalized by tuning the length of the slot(s). The slots may be dashed or made internal to the power plane metal layer to avoid weakening the metal layer for laminated multi-layer PWBs and may be shaped around a connector end when the power plane pin allocation is not uniform at the connector ends. The resulting equalization reduces either pin count required for carrying the power plane current or reduces connector pin current requirements. | 10-23-2008 |
20080264679 | Printed Circuit Board With Combined Digital and High Frequency Applications - The invention discloses a PCB ( | 10-30-2008 |
20080277146 | Radiant heat printed circuit board and method of fabricating the same - Disclosed is a radiant heat printed circuit board, which has improved heat-radiating properties and reliability, and a method of fabricating the same. | 11-13-2008 |
20080277147 | Wired circuit board and producing method thereof - A wired circuit board includes a metal supporting board, an insulating layer formed on the metal supporting board, and a conductive pattern formed on the insulating layer. The conductive pattern includes an underlying layer formed on the insulating layer and a conductive layer formed on the underlying layer. The underlying layer is formed with a corroded portion corroded from a side end portion of the conductive layer toward an inner portion thereof. A semiconductive layer is formed on a surface of the insulating layer and on a surface of the conductive pattern. The semiconductive layer is formed so as to come in contact with the metal supporting board and have a cut formed in the corroded portion to interrupt conduction between the semiconductive layer formed on the surface of the insulating layer and the semiconductive layer formed on a surface of the conductive layer. | 11-13-2008 |
20080277148 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD - A metal layer | 11-13-2008 |
20080283279 | Composite Ceramic Substrate - A composite ceramic substrate includes a ceramic substrate having surface-mounted components mounted thereon, external terminal electrodes connecting wiring patterns disposed on the ceramic substrate and surface electrodes of a motherboard, and a convex leg portion made of resin and arranged such that an end surface supports the external terminal electrodes, and the external terminal electrodes are connected to the wiring patterns via a via-hole conductor provided in the leg portion. | 11-20-2008 |
20080283280 | Method for Connecting Printed Circuit Boards - To provide a method for connecting printed circuit boards with high connection reliability, while avoiding the problem of shorting even with a fine pitch. A method for connecting printed circuit boards (PCB) containing metal wiring, or connecting a printed circuit board (PCB) containing metal wiring with a metal lead wire or a metal contact, which method includes a step of thermocompression bonding of an adhesive film with connectors, the adhesive film being composed of an adhesive composition comprising a thermoplastic resin and organic particles, wherein the viscosity decreases as the applied thermocompression force increases at a temperature of 100-250° C. | 11-20-2008 |
20080283281 | Multilayer ceramic substrate - A multilayer ceramic substrate includes a plurality of ceramic layers laminated each other. The plurality of ceramic layers form a bulge and a cavity having such a shape that an opening area of the cavity gradually becomes smaller toward a bottom of the cavity. | 11-20-2008 |
20080296050 | Semiconductor chip mounting board with multiple ports - A semiconductor chip mounting board comprises an insulating substrate and a plurality of input or output ports to be connected to a semiconductor chip for processing a high-frequency signal. The semiconductor chip has on top thereof a chip ground layer structured by a metal layer. The insulating substrate comprises a strip line formed on top thereof and to be connected to the ports, and a cavity, or a recessed space, for embedding the semiconductor chip therein. The substrate further comprises a common ground made of metal and exposed to the bottom face of the cavity, a coplanar line connected to the strip line, triple parallel bonding wires connecting the connecting terminals of the chip and the coplanar line, and embedded conductors embedded at least in portions of an annular groove or annular gap defined between the inner wall surface of the cavity and the side faces of the chip. | 12-04-2008 |
20080302560 | PRINTED WIRING BOARD AND A METHOD OF MANUFACTURING A PRINTED WIRING BOARD - A method of manufacturing a printed wiring board with solder bumps includes forming a solder-resist layer having small and large apertures exposing a respective conductive pad of the printed wiring board, loading a solder ball in each of the small and large apertures using a mask with aperture areas corresponding to the apertures of the solder-resist layer, forming a first bump having a first height, from the solder ball in the small aperture, and a second bump having a second height, from the solder ball in the large aperture, the first height being greater than the second height, and pressing a top of the first bump such that the first height becomes substantially the same as the second height. A multilayer printed wiring board includes a solder-resist layer with apertures of differing sizes and solder bumps having substantially equal volumes but a difference in height no greater than 10 μm. | 12-11-2008 |
20080308303 | Chip carrier substrate and production method therefor - Method for producing a macroporous silicon substrate suitable as a carrier for microelectronic components. Blind holes are produced from a front surface of the substrate. An insulator layer is produced on the front and rear surfaces of the substrate. Selective isotropic etching is performed from the rear surface with uncovering of blind hole ends produced such that respective blind hole walls formed by the insulator layer project from the substrate on the rear surface and are defined in this region only by the insulator layer forming the respective blind hole wall. A further insulator layer is then produced on the surfaces of the substrate. A plurality of the blind holes are then filled with a metal or a metal alloy by introducing the substrate into a melt thereof under pressure in a process chamber containing the melt. The melt is then asymmetrically cooled in the blind holes from the front surface, so that the metal or the alloy contracts toward and lies on a plane with the rear surface of the substrate. Any of the remaining unfilled blind hole ends that project from the substrate are removed. | 12-18-2008 |
20080308304 | Multilayer Wiring Board and Its Manufacturing Method - A multilayer wiring board employs a thin insulating substrate having substantially only resin flow as the compression property effect, and has an any-layer IVH structure where at least one core layer is formed without burying wiring. For sufficiently securing an effective compression amount of the crush-allowance of a conductor, the ratio of the thickness of a cover film to that of the electrical insulating substrate is increased, and a via can be formed in the core layer without burying the wiring in the insulating substrate. Thus, a multilayer wiring board having an any-layer IVH structure that can achieve high-density component mountability and wiring storability in an extremely small thickness can be provided. | 12-18-2008 |
20080308305 | WIRING SUBSTRATE WITH REINFORCING MEMBER - A wiring substrate with a reinforcing member includes: a resin wiring substrate having a substrate principal surface, a substrate rear surface, and substrate side surfaces, forming a rectangular shape having four sides in plan view, and including a resin insulating layer and a conductor layer; and a reinforcing member formed in a rectangular frame shape which surrounds the four sides of the resin wiring substrate, and provided with an inner wall having a depression surface-joined to at least one of the substrate side surfaces, an outer peripheral portion of the substrate principal surface, and an outer peripheral portion of the substrate rear surface. | 12-18-2008 |
20080308306 | SHIFTED SEGMENT LAYOUT FOR DIFFERENTIAL SIGNAL TRACES TO MITIGATE BUNDLE WEAVE EFFECT - An article of manufacture includes a circuit board and a pair of traces on or in the circuit board. The pair of traces includes a first trace and a second trace. The first trace includes a first segment and a second segment continuously joined to the first segment. The first segment coincides with a first longitudinal axis. The second trace includes a first segment that runs alongside the first segment of the first trace. The second trace also includes a second segment that runs alongside the second segment of the first trace. The second segment of the second trace is continuously joined to the first segment of the second trace. The second segment of the second trace coincides with the first longitudinal axis. | 12-18-2008 |
20080314622 | Method Of Fabricating Board Having High Density Core Layer And Structure Thereof - Structure and method of making a board having plating though hole (PTH) core layer substrate and stacked multiple layers of blind vias. More stacking layers of blind vias than conventional methods can be achieved. The fabrication method of the board having high-density core layer includes the following: after the making of the PTH, the filling material filled inside the PTH of the core layer is partially removed until the PTH has reached an appropriate flattened depression using etching; then image transfer and pattern plating are performed to fill and to level the depression portion up to a desired thickness to form a copper pad (overplating) as the core layer substrate is forming a circuit layer; finally using electroless copper deposition and the pattern plating to make the product. | 12-25-2008 |
20080314623 | Printed Circuit Board and Method for Manufacturing the Same - This invention relates to a printed circuit board which comprises a porous sheet or foil composed of a non-conductive material; a circuit pattern composed of a conductive material formed on the porous sheet or foil; and an organic polymer coating as an insulating layer formed by vapor deposition polymerization. | 12-25-2008 |
20080314624 | Component Adapted for Being Mounted on a Substrate and a Method of Mounting a Surface Mounted Device - A supporting component ( | 12-25-2008 |
20080314625 | Printed Circuit Board and Method of Manufacturing the Same - The present invention relates to a method of manufacturing a printed circuit board and to a printed circuit board, the method comprising the steps of: preliminarily forming a plurality of test pattern layers | 12-25-2008 |
20080314626 | ELECTRODED SHEET (eSheet) PRODUCTS - A sheet in an electronic display is composed of a substrate containing an array of wire electrodes. The wire electrodes are preferably electrically connected to patterned transparent conductive electrode lines. The wire electrodes are used to carry the bulk of the current. The wire electrodes are capable of being extended away from the substrate and connected directly to the printed circuit board. The transparent conductive electrode (TCE) is used to spread the charge or voltage from the wire electrode across the pixel. The TCE is a patterned film and must be at least 50% transparent, and, for most applications, is preferably over 90% transparent. In most applications, the electroded surface of the electroded sheet has to be flattened. Use of a thin polymer substrate yields a light, flexible, rugged sheet that may be curved, bent or rolled. | 12-25-2008 |
20090000810 | PRINTED CIRCUIT BOARD - According to one embodiment, there is provided a printed wiring board includes a mounting surface for mounting an electronic component, a first component mounted on the mounting surface, an index portion provided on the mounting surface for defining a mounting position Pa of a second component being mounted on the mounting surface in a process after the first component is mounted, the index portion including two direction positions on the mounting surface, and the second component mounted on the mounting surface based on the index portion. | 01-01-2009 |
20090008133 | Patterned Circuits and Method for Making Same - Provided are patterned circuits with accurately aligned raised features. Also provided are methods for making the circuits using photoresist-on-photoresist patterning. | 01-08-2009 |
20090008134 | Module - A module includes a first multilayer wiring board, a second multilayer wiring board having an upper surface facing a lower surface of the first multilayer wiring board, a component mounted on an upper surface of the first multilayer wiring board, a first terminal electrode provided on the lower surface of the first multilayer wiring board, a second terminal electrode provided on the upper surface of the second multilayer wiring board and connected to the first terminal electrode, and a terminal electrode provided on a lower surface of the second multilayer wiring board. This module is manufactured at a preferable yield rate. | 01-08-2009 |
20090008135 | CIRCUIT SUBSTRATE - A surface treatment process for a substrate is provided. There are a plurality of first conductive patterns on a top surface of the substrate and a plurality of second conductive patterns on a bottom surface of the substrate and a plurality of inner circuits electrically connected with the first conductive patterns and the second conductive patterns. The process includes the following steps. First, a conductive layer is formed on the second conductive patterns. Next, an insulating layer is formed on the conductive layer. After the insulating layer is formed, an anti-oxidizing layer is electroplated on the first conductive patterns using the conductive layer. Next, the insulating layer and the conductive layer are removed in sequence. The surface treatment process of the present invention has the advantage of low fabrication cost and does not need a plating bar to perform the electroplating process or a photolithographic process. | 01-08-2009 |
20090008136 | Multilayered printed circuit board and fabricating method thereof - A multilayered printed circuit board and a method of fabricating the printed circuit board are disclosed. The method of fabricating the multilayered printed circuit board can include: providing a core substrate, which has an outer circuit, and which has a thermal expansion coefficient of 10 to 20 ppm/° C. at −60 to 150° C.; stacking a stress-relieving insulation layer, which has a thermal expansion coefficient of −20 to 6 ppm/° C., on either side of the core substrate; and forming a metal layer on the insulation layer and forming at least one pad and electrically connecting the pad with the outer circuit. This method can provide high reliability, as the stress-relieving insulation layers can prevent bending and warpage, etc., in the board overall. | 01-08-2009 |
20090008137 | Wired circuit board and producing method thererof - A wired circuit board includes a metal supporting board having a depressed portion, a conductive portion embedded in the depressed portion and formed of a material having a higher conductivity than that of the metal supporting board, an insulating layer formed on the metal supporting board so as to cover the conductive portion, and a plurality of wired formed on the insulating layer in mutually spaced-apart relation so as to oppose to the conductive portion. | 01-08-2009 |
20090014205 | PRINTED CIRCUIT BOARD ASSEMBLED PANEL, UNIT SHEET FOR PACKAGING A PRINTED CIRCUIT BOARD, RIGID-FLEXIBLE BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a printed circuit board assembled panel by a simple process with an excellent material yield and a high conforming product rate. Unit printed circuit boards previously manufactured are arranged in a frame in a prescribed relationship. Then, the printed circuit boards are fixed to one another, and the printed circuit board and the frame body are fixed to one another. | 01-15-2009 |
20090020319 | MULTILAYER PRINTED CIRCUIT BOARD - A multilayer printed circuit board is characterized in that circuit boards | 01-22-2009 |
20090020320 | GOLD FINGER OF CIRCUIT BOARD AND FABRICATING METHOD THEREOF - A method for fabricating a gold finger of a circuit board is provided. First, a circuit board having a board edge for cutting is provided. Next, a copper conducting wire pattern is formed on the circuit board. The copper conducting wire pattern includes a plurality of gold finger bodies and a plurality of tie bars. Each tie bar is connected to a corresponding gold finger body, and the tie bars are disposed across the board edge. Thereafter, a surface of each gold finger body is plated with gold, and the tie bars on the board edge are removed by etching. Because the tie bars on the board edge are removed, tear resistance of the gold finger is maintained after cutting the board edge. | 01-22-2009 |
20090025963 | Wired circuit board and production method thereof - A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern | 01-29-2009 |
20090025964 | CIRCUIT SUBSTRATE AND METHOD FOR FABRICATING INDUCTIVE CIRCUIT - A circuit substrate including a laminated layer, an embedded electronic device, at least a circuit structure, and a solder mask layer is provided. The embedded electronic device is disposed within the laminated layer. The circuit structure is disposed on a surface of the laminated layer and is connected between a reference plane and the embedded electronic device. In addition, the solder mask layer is disposed on the surface of the laminated layer and exposes a portion of the circuit structure. The circuit structure has a specific layout by which a circuit trace with an adjustable length can be formed by disconnecting or connecting the exposed portion of the circuit structure. | 01-29-2009 |
20090025965 | Assembly substrate and method of manufacturing the same - The object of the present invention is to provide an assembly substrate which is easily handled and capable of suppressing occurrence of warpage, and offers high productivity and economic efficiency, and its manufacturing method. A work board | 01-29-2009 |
20090032291 | SPIDER CLIP FOR SECURING A CIRCUIT BOARD WITHIN A COMMUNICATIONS MODULE - A clip for securing a component, such as a circuit board, within a communications module is disclosed. The clip may include a flat base with legs extending therefrom and resilient springs disposed at terminal ends of each of the legs. The legs may be configured to frictionally secure the clip to the module. For instance, the legs may secure the clip to a top shell portion of the module. The springs may be configured to resiliently compress against corresponding contact zones on the circuit board when the top shell is mated with a bottom shell of the module such that the circuit board is secured in place within the module. Accordingly, embodiments of the invention enable the quick and simple assembly of modules without the need for fasteners and other time-consuming and/or labor-intensive solutions conventionally implemented to secure circuit boards and other components within the modules. | 02-05-2009 |
20090032292 | PRINTED CIRCUIT BOARD REINFORCEMENT STRUCTURE AND INTEGRATED CIRCUIT PACKAGE USING THE SAME - A printed circuit board reinforcement structure for a printed circuit board receiving a plurality of surface mounting devices, and an integrated circuit package using the same. The structure includes a hard layer having one or more openings formed at areas corresponding to one or more surface mounting devices with a thickness exceeding a predetermined thickness; and a soft layer bonded to a side of the hard layer so that the soft layer can accommodate the protrusion of the surface mounting devices. The structure prevents defects of a printed circuit board, such as deformation, fracture or the like, while substantially reducing the size of a package by applying a reinforcement structure to a thin printed circuit board, thereby reinforcing the rigidity (mechanical strength) of the thin printed circuit board. | 02-05-2009 |
20090038829 | Printed circut board for population with surface-mounted devices and also method therefor - A printed circuit board for population with surface-mounted devices is provided simultaneously with a lead frame, which has a three-dimensional shape and which is surrounded by a plastic. | 02-12-2009 |
20090038830 | SUBSTRATE FOR MOUNTING IC CHIP AND METHOD OF MANUFACTURING THE SAME - A substrate for mounting an IC chip including a printed substrate including a first build-up layer. The first build-up layer including (i) a first conductor layer having first conductor circuits and (ii) a resin insulating layer. The first conductor circuits and the resin insulating layer alternating along a length of the first build-up layer. A low-elasticity resin layer formed on the first build-up layer. A low-thermal-expansion substrate formed of ceramics or silicon, and provided on the low-elasticity resin layer. Through-hole conductors provided through the low-thermal-expansion substrate and the low-elasticity resin layer; and second conductor circuits formed on the low-thermal-expansion substrate. The through-hole conductors electrically connect the first conductor layer and the second conductor circuits provided on the low-thermal-expansion substrate. | 02-12-2009 |
20090038831 | Printed Circuit Board - A printed circuit board includes a main board part, a reserved board part, a connecting part and a groove. The main board part has a first extending circuit. The reserved board part has a second extending circuit corresponding to the first extending circuit. The connecting part connects the main board part and the reserved board part. The groove is located between the main board part and the reserved board part to prevent the first extending circuit from being electrically connected to the second extending circuit. When the reserved board part needs to be removed, the main board part may be separated from the reserved board part by the groove. | 02-12-2009 |
20090044969 | Wired circuit board and connection structure between wired circuit boards - A wired circuit board includes a first wired circuit board and a second wired circuit board disposed to be opposed to the first wired circuit board in the same plane. A first opposed surface of the first wired circuit board facing the second wired circuit board and a second opposed surface of the second wired circuit board facing the first wired circuit board include at least two types of interfitting surfaces extending in different directions so as to mutually interfit the first opposed surface with the second opposed surface. | 02-19-2009 |
20090056983 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween and a first differential pair and a second differential pair each having a positive differential trace and a negative differential trace. The positive differential traces of the two differential pairs are disposed within the first signal layer. The negative differential traces of the two differential pairs are disposed within the second signal layer. The positive differential trace of the first differential pair is defined at the left side of the positive differential trace of the second differential pair. The negative differential trace of the first differential pair is defined at the right side of the negative differential trace of the second differential pair. | 03-05-2009 |
20090056984 | SIGNAL TRANSMISSION STRUCTURE AND LAYOUT METHOD FOR THE SAME - A signal transmission structure is provided. The signal transmission structure includes conduction blocks periodically formed at a power plane, neck blocks connecting adjacent conduction blocks, and openings formed corresponding to the neck blocks at a ground plane for reducing equivalent capacitance between the neck blocks and the ground plane, so as to improve the noise isolation performance. | 03-05-2009 |
20090056985 | Printed circuit board and method of production of an electronic apparatus - A printed circuit board provided with board electrodes, wherein each board electrode is provided with a board electrode base, for carrying by soldering a bottom electrode arranged at a bottom of an electronic device inside from outer edges of the electronic device, arranged inside from the outer edges of the electronic device and a projection projecting out from the board electrode base, narrower in width than the board electrode base, and connected to an interconnect of the printed circuit board. | 03-05-2009 |
20090056986 | INTEGRATED CIRCUIT (IC) CARRIER ASSEMBLY WITH FIRST AND SECOND SUSPENSION MEANS - An integrated circuit (IC) carrier assembly comprises a printed circuit board (PCB), a carrier soldered to the PCB, the carrier comprising a plurality of electrical contact islands surrounding a receiving zone for receiving an IC, a first resilient suspension means interconnecting pairs of adjacent islands, and a second resilient suspension means connecting the islands adjacent to the receiving zone with the receiving zone. | 03-05-2009 |
20090056987 | MULTILAYER CERAMIC ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME - In a method for manufacturing a multilayer ceramic electronic device, a resin introduction portion located outside a vertically projected region of a surface mount electronic device is disposed on a seat portion which includes a non-metallic inorganic powder as a primary component and on which the surface mount electronic device, e.g., a semiconductor element, is mounted, and a resin is supplied to the resin introduction portion so as to fill the resin into the seat portion and a gap between the seat portion and a multilayer ceramic element assembly. Unsintered ceramic base material layers and shrinkage restriction layers arranged to restrict shrinkage of the unsintered ceramic base material layers in a direction substantially perpendicular to a thickness direction of the unsintered ceramic base material layers are laminated and, thereby, an unfired multilayer ceramic element assembly is formed, which does not shrink in a direction substantially perpendicular to a lamination direction in a firing step. | 03-05-2009 |
20090056988 | Multiple chips bonded to packaging structure with low noise and multiple selectable functions - The package includes a substrate, a first chip, a second chip, multiple first bumps and multiple second bumps. The substrate has a first region and a second region. The first region is substantially coplanar with the second region. The first bumps connect the first chip and the second chip. The second bumps connect the first chip and the second region of the substrate, wherein the second chip is over the first region of the substrate. The second bumps have a height greater than that of the first bumps plus the second chip. The substrate does not have an opening accommodating the second chip. The first bumps may be gold bumps or solder bumps. The second bumps may be solder bumps. | 03-05-2009 |
20090065241 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes first and second signal layers sandwiching a dielectric layer therebetween, and a differential pair having two differential traces respectively disposed within the first and second signal layers. Two ground parts are respectively arranged at opposite sides of each of the two differential traces. | 03-12-2009 |
20090065242 | MANUFACTURING METHOD OF PRINTED WIRING BOARD AND PRINTED WIRING BOARD INCLUDING POTTING DAM OBTAINED BY USING MANUFACTURING METHOD - The present invention provides a manufacturing method of a printed wiring board including a potting dam of favorable shape and positional accuracy. The method includes a process A of preparing a substrate comprising a wiring pattern, a process B of providing a resin layer on a surface of the substrate comprising the wiring pattern, a process C of fluidizing the resin layer by heating and deforming the resin layer to obtain a potting dam shape using a press plate comprising a mold shape, and a process D of removing the press plate comprising a mold shape to expose the resin layer comprising a portion with the deformed potting dam shape. When required, a process E of removing unnecessary portions of the resin layer deformed to obtain the potting dam shape can be added after the process D. | 03-12-2009 |
20090084585 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - There is provided a wiring substrate. The wiring substrate includes: a wiring member formed by layering wiring layers and insulating layers; and a frame-like stiffening member having an opening therein. The wiring member is arranged in the opening, and an inner wall of the opening and an outer peripheral side wall of the wiring member are adhered with an adhesive member. | 04-02-2009 |
20090084586 | ASSEMBLY COMPRISING AN ELECTROMAGNETICALLY SCREENED SMD COMPONENT, METHOD AND USE - The disclosure relates to an electronic component assembly including at least one SMD component ( | 04-02-2009 |
20090084587 | WIRING BOARD AND METHOD OF PREVENTING HIGH VOLTAGE DAMAGE - A wiring board is provided to protect an electronic device from static electricity and lightning surge without reducing packaging density. A wiring board is provided with a first wiring pattern ( | 04-02-2009 |
20090090542 | MULTILAYER PRINTED WIRING BOARD - An IC chip for a high frequency region, particularly a packaged substrate in which no malfunction or error occurs even if 3 GHz is exceeded. A conductive layer on a core substrate is formed at a thickness of 30 μm and a conductor circuit on an interlayer resin insulation layer is formed at a thickness of 15 μm. By thickening the conductive layer, the volume of the conductor can be increased and resistance can be reduced. Further, by using the conductive layer as a power source layer, the capacity of supply of power to an IC chip can be improved. | 04-09-2009 |
20090095511 | CIRCUIT BOARD AND METHOD OF PRODUCING THE SAME - The circuit board is capable of tightly bonding a cable layer on a base member even if thermal expansion coefficients of the base member and the cable layer are significantly different. The circuit board comprises: the base member; and the cable layer being laminated on the base member with anchor patterns, which are electrically conductive layers formed on a surface of the base member. | 04-16-2009 |
20090095512 | METHOD FOR PRODUCING A GLASS PLATE WITH A CONDUCTIVE PRINTED WIRE AND GLASS PLATE WITH A CONDUCTIVE PRINTED WIRE - Provided is a process for producing a glass plate with a conductive printed wire, which does not require a screen plate for each model, facilitates adjustments for desired heat generation performance or antenna performance, has an excellent adhesion to a glass plate surface, and minimizes surface roughness. | 04-16-2009 |
20090101395 | PRINTED WIRING BOARD AND ELECTRONIC APPARATUS - A printed wiring board includes: a component mounting region; a plurality of electrode pads arranged at a peripheral edge portion of the component mounting region; a solder resist film that coats the component mounting region; and a plurality of solder bonding faces arranged at a region surrounded by the plurality of electrode pads. The solder resist film and the plurality of solder bonding faces form an island-shaped pattern such that the plurality of solder bonding faces are isolated with each other by the solder resist film. | 04-23-2009 |
20090107705 | METHODS AND SYSTEMS FOR REDUCING NOISE COUPLING IN HIGH SPEED DIGITAL SYSTEMS - Methods and systems for reducing noise coupling in high-speed digital systems. Exemplary embodiments include a method, including etching a plurality of high speed signal traces onto a core insulating layer, forming trenches on respective sides of the plurality of high speed signal traces, thereby removing insulating material adjacent to the plurality of high speed signal traces and forming pedestals having remaining insulating material, the plurality of high speed signal traces disposed on and coupled to the remaining insulating material, coupling pre-preg material on the high speed signal traces, removing the pre-preg material adjacent the trenches, thereby retaining the pre-preg material aligned with the high speed signal traces, and heating and pressing a core layer to the pre-preg layer, and heating and pressing the pre-preg layer to the core insulating layer. | 04-30-2009 |
20090107706 | MULTILAYER PRINTED CIRCUIT BOARD - A multilayer printed circuit board includes a first printed circuit board, a second printed circuit board, an adhesive film, and a function layer. The adhesive film is sandwiched between the first printed circuit board and the second printed circuit board. The function layer is disposed between the first printed circuit board and the second printed circuit board for blocking water from passing therethrough and for screening electromagnetic interference between the first printed circuit board and the second printed circuit board. | 04-30-2009 |
20090114429 | PACKAGING SUBSTRATE HAVING PATTERN-MATCHED METAL LAYERS - A pattern matched pair of a front metal interconnect layer and a back metal interconnect layer having matched thermal expansion coefficients are provided for a reduced warp packaging substrate. Metal interconnect layers containing a high density of wiring and complex patterns are first developed so that interconnect structures for signal transmission are optimized for electrical performance. Metal interconnect layers containing a low density wiring and relatively simple patterns are then modified to match the pattern of a mirror image metal interconnect layer located on the opposite side of the core and the same number of metal interconnect layer away from the core. During this pattern-matching process, the contiguity of electrical connection in the metal layers with a low density wiring may become disrupted. The disruption is healed by an additional design step in which the contiguity of the electrical connection in the low density is reestablished. | 05-07-2009 |
20090126977 | MULTILAYER FILM - This disclosure describes system(s) and/or method(s) enabling contacts for individual nanometer-scale-thickness layers of a multilayer film. | 05-21-2009 |
20090126978 | REFERENCE LAYER OPENINGS - A component having reference layer openings to contribute towards achieving a differential impedance in a circuit, is described herein. | 05-21-2009 |
20090133908 | INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE, METHOD OF MANFACTURING SAME, AND MICROELECTRONIC STRUCTURE CONTAINING SAME - An interconnect structure for a microelectronic device includes an electrically conductive material ( | 05-28-2009 |
20090133909 | Tip Printing and Scrape Coating Systems and Methods for Manufacturing Electronic Devices - Methods are disclosed for manufacturing electronic devices (e.g., transistors, and etc.), solar arrays, optical display arrays, portions of such devices and arrays, and the like. Utilizing a scrape coating and/or a tip printing process, various electronic and solar arrays are manufactured. | 05-28-2009 |
20090139751 | WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - In a wiring substrate having a wiring member | 06-04-2009 |
20090145635 | WIRING SUBSTRATE, MANUFACTURING METHOD OF THE SAME, AND ELECTRONIC COMPONENT DEVICE - A wiring substrate includes (i) a wiring forming region in which wiring layers and an insulating layer are alternately stacked, (ii) an outer periphery region around the wiring forming region, and (iii) a reinforcing structural body having (a) a first reinforcing member continuously extending along said outer periphery region, and (b) a second reinforcing member extending in a thickness direction and being engaged with the first reinforcing member. | 06-11-2009 |
20090145636 | ELECTRONIC COMPONENT MOUNTING PACKAGE - An electronic component mounting package includes a structure (coreless substrate) in which a plurality of wiring layers are stacked one on top of another with insulating layers interposed therebetween and are interconnected through via holes formed in the insulating layers. The entire surface of the coreless substrate, exclusive of pad portions defined at desired positions of the outermost wiring layers thereof, is covered with a molding resin. Further, an interposer is mounted on the side of the electronic component mounting surface of the coreless substrate, and the molding resin is partially filled into a gap between the coreless substrate and the interposer. | 06-11-2009 |
20090145637 | Circuit Board and Image Display Apparatus - In a circuit board disposed in parallel to a fixing plane, a guard spacer (abutting member) is disposed on a multi-layer printed circuit board on the side of the fixing plane to suppress deformation of the multi-layer printed circuit board to prevent short circuit if an impact is applied to the circuit board. The guard spacer may be a dummy electronic component or a plate member. An image display using the circuit board is also disclosed. | 06-11-2009 |
20090145638 | CONDUCTIVE PATTERN FORMATION INK, CONDUCTIVE PATTERN AND WIRING SUBSTRATE - A conductive pattern formation ink which can be stably ejected in the form of liquid droplets and form a conductive pattern having high reliability, a conductive pattern having high reliability, and a wiring substrate provided with the conductive pattern and having high reliability are provided. The conductive pattern formation ink is used for forming a conductive pattern by ejecting the ink in the form of liquid droplets on a surface of a ceramic molded body using a liquid droplet ejecting method, the ceramic molded body being made of a material containing ceramic particles and a binder. The ink contains a water-based dispersion medium, and metal particles dispersed in the water-based dispersion medium, wherein the water-based dispersion medium contains oxygen molecules and nitrogen molecules, and wherein when the water-based dispersion medium is analyzed using a gas chromatography method, a total amount of the oxygen and nitrogen molecules contained in the water-based dispersion medium is 12 ppm or less. | 06-11-2009 |
20090159316 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate is provided. The wiring substrate includes: a core layer in which a gap is formed; and a lamination layer which includes an insulating layer and a wiring layer and which is formed on at least one surface of the core layer. The lamination layer has a thermal expansion coefficient different from that of the core layer. A plurality of mounting regions on which an electronic component is to be mounted are provided on the lamination layer to be spaced from each other. The gap in the core layer is filled with an insulating member having the same material as the insulating layer and surrounds each of the plurality of mounting regions or each of mounting region groups including one or more of the mounting regions. | 06-25-2009 |
20090173522 | INTERPOSER AND METHOD FOR MANUFACTURING INTERPOSER - An interposer having a support substrate, a first insulation layer made of an inorganic material and formed over the support substrate, and a second insulation layer formed over the first insulation layer. The first insulation layer has a first land, a second land and a first wiring electrically connecting the first land and the second land. The second insulation layer has a first pad positioned to load a first electronic component, a second pad positioned to load a second electronic component, a second wiring electrically connected to the second pad, a first via conductor electrically connecting the first land and the first pad, and a second via conductor electrically connecting the second land and the second wiring. The first wiring and second wiring electrically connect the first pad and the second pad, and the second wiring has a lower wiring resistance per unit length than the first wiring. | 07-09-2009 |
20090173523 | MULTILAYER BUILD-UP WIRING BOARD - Mesh holes | 07-09-2009 |
20090188703 | MULTILAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A multilayer wiring board includes a multilayer wiring substrate having a concave portion which accommodates an electronic component. The multilayer wiring substrate has multiple insulation layers, multiple conductive circuits, multiple vias and an electromagnetic shielding layer. The conductive circuits are separated by the insulation layers and electrically connected through the vias. The electromagnetic shielding layer has a roughened surface and formed along one of a bottom surface and side surfaces of the concave portion in the multilayer wiring substrate. | 07-30-2009 |
20090188704 | MOUNTING SUBSTRATE - A mounting substrate includes a substrate, a bonding pad and an induction heating pad. The bonding pad is formed on the substrate, and adhered to a solder ball to mount a semiconductor chip on the substrate. The induction heating pad is disposed adjacent to the bonding pad, the induction heating pad being induction heated by an applied alternating magnetic field to reflow the solder ball. The induction heating pad having a diameter greater than a skin depth in response to the frequency of the applied alternating magnetic field is selectively induction heated in response to a low frequency band of the alternating magnetic field. Accordingly, during a reflow process for a solder ball, the semiconductor chip may be mounted on the mounting substrate to complete a semiconductor package without damaging the mounting substrate, to thereby improve the reliability of the completed semiconductor package. | 07-30-2009 |
20090200066 | BARE MICROELECTRONIC CHIP PROVIDED WITH A RECESS FORMING A HOUSING FOR A WIRE ELEMENT CONSTITUTING A FLEXIBLE MECHANICAL SUPPORT, FABRICATION PROCESS AND MICROSTRUCTURE - A microelectronic chip comprises two parallel main faces and side faces. At least one of the faces comprises a recess provided with at least one electrical connection element and forming a housing for a wire element. The wire element simultaneously constitutes both an electrical connection between the chip and the outside via said connection element and a flexible mechanical support for said chip. | 08-13-2009 |
20090200067 | WIRING SUBSTRATE FOR ELECTRONIC-COMPONENT INSPECTION APPARATUS - A wiring substrate K for an electronic-component inspection apparatus includes a substrate body ( | 08-13-2009 |
20090200068 | SUBSTRATE FOR MOUNTING SEMICONDUCTOR DEVICE - A substrate for mounting a semiconductor device comprises a first and a second group of input and output terminals and common terminals. The substrate further comprises conductive pads that use for inputting and outputting data from and to the semiconductor device, non-conductive pads that no use for inputting and outputting data from and to the semiconductor device, and common pads formed so as to correspond to the common terminals. The second group of input and output terminals are connected to the non-conductive pads and the common terminals are connected to the common pads when the first group of input and output terminals are connected to the conductive pads, while the first group of input and output terminals are connected to the non-conductive pads and the common terminals are connected to the common pads when the second group of input and output terminals are connected to the conductive pads. | 08-13-2009 |
20090200069 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board | 08-13-2009 |
20090229866 | Wiring structure of a substrate - A wiring structure of a substrate adapted to mount a plurality of integrated circuits has a signal wire for connecting the integrated circuits to each other, first and second power supply layers faced to each other, and return path wires arranged generally in parallel to the signal wire. One of the return path wires has opposite terminal ends connected to the first power supply layer (Vcc layer). The other return path wire has opposite terminal ends connected to the second power supply layer (GND layer). | 09-17-2009 |
20090236127 | ELECTRONIC DEVICE - An electronic device comprises a substrate; a wiring pattern which is provided on a front surface of the substrate, and which includes a plurality of connection ends; a circuit component which houses a circuit, and which includes bumps, electrically connected to the circuit, that project from a specific surface of the circuit component, and which is disposed with the specific surface facing the front surface of the substrate; conductive members which electrically connect the bumps of the circuit component and the connection ends of the wiring pattern, and which fix the circuit component to the substrate; and guide sections which are provided on the substrate, and to each of which the conductive member forced out of an interval above the corresponding connection end is guided to prevent the conductive member from reaching a connection end other than the corresponding connection end. | 09-24-2009 |
20090242244 | PRINTED CIRCUIT BOARD - An exemplary PCB includes a first reference layer, a first signal layer, and a second signal layer in that order. A first differential pair is arranged in the first signal layer in an edge-coupled structure referencing the first reference layer. A second differential pair is arranged in the second signal layer in edge-coupled structure. A first ground part and a second ground part are symmetrically arranged at opposite sides of the second differential pair in the second signal layer. The first differential pair is arranged above the first ground part and a projection of the first differential pair onto the second signal layer having an area coincident with the first ground part. The second differential pair references the first and second ground parts. | 10-01-2009 |
20090242245 | MULTI-LAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A multi-layer wiring board without a core substrate includes: a multi-layer laminated structure; first terminals provided on a front surface of the multi-layer laminated structure; second terminals provided on a rear surface of the multi-layer laminated structure; a solder resist which covers the rear surface and which has solder resist openings formed at positions corresponding to the second terminals; a reinforcing plate which is made of a non-metal material and which has reinforcing plate openings formed at positions corresponding to the second terminals; and an adhesive layer interposed between the solder resist and the reinforcing plate to fix the reinforcing plate to the solder resist and which includes adhesive layer openings formed at positions corresponding to the second terminals. A diameter of the solder resist openings and a diameter of the reinforcing plate openings are smaller than that of the adhesive layer openings. | 10-01-2009 |
20090250251 | Circuit Device and Method for Manufacturing the Circuit Device - In a circuit device where a wiring layer, an insulating resin and a circuit element are stacked together in such a manner as to embed a bump structure into the insulating resin, the connection reliability between the bump structure and the circuit element is enhanced. | 10-08-2009 |
20090250252 | PRINTED CIRCUIT BOARD - A first insulating layer is formed on a suspension body and a wiring trace is formed on the first insulating layer. In addition, a ground trace is formed on the first insulating layer so as to extend along the wiring trace on one side of the wiring trace with a spacing therebetween. A second insulating layer is formed on the first insulating layer to cover the wiring trace and the ground trace. On the second insulating layer, a wiring trace is formed at a position above the wiring trace. A third insulating layer is formed on the second insulating layer to cover the wiring trace. The width of the wiring trace is set larger than the width of the wiring trace. At least a partial region of the ground trace and at least a partial region of the wiring trace are opposite to each other with part of the second insulating layer sandwiched therebetween. | 10-08-2009 |
20090255717 | Suspension Board with Circuit and Production Method Thereof - A suspension board with circuit includes an insulating layer formed with a first opening, a conductive layer formed on the insulating layer so as to fill the first opening, a metal thin film formed so as to cover a surface of the conductive layer exposed from the first opening, and be interposed between the conductive layer and the insulating layer, and a metal supporting layer formed with a second opening surrounding the first opening so as to underlie the insulating layer. The metal supporting layer includes a covering portion provided in the second opening so as to cover the first opening. | 10-15-2009 |
20090266588 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board has a core substrate, an interlayer insulation layer formed over the core substrate, conductive layers formed over the core substrate, and a via hole for providing electrical connection between the conductive layers. The conductive layers include a conductive layer formed on the core substrate, and the conductive layer formed on the core substrate has a side face in a form of rounded taper tapering toward the core substrate. | 10-29-2009 |
20090272563 | ELECTRONIC CARRIER BOARD - An electronic carrier board for a chip to be mounted thereon is provided, which includes a body and a plurality of solder pads. The solder pads have carrying surfaces for carrying the chip thereon through conductive bumps. The carrying surfaces of at least two solder pads are oppositely inclined with respect to each other, thereby preventing the conductive bumps mounted on the carrying surfaces from displacement and thereby further preventing two adjacent conductive bumps subject to displacement from coming into short-circuit contact. | 11-05-2009 |
20090272564 | METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD - An object of an aspect of the present invention is to provide a method of producing a circuit board that allows highly accurate preservation of the circuit profile and gives a circuit having a desired depth in preparation of a fine circuit by additive process. | 11-05-2009 |
20090277670 | High Density Printed Circuit Board Interconnect and Method of Assembly - A printed circuit board assembly having an edge joined first and second sub-circuit board is provided. The first sub-circuit board includes an edge with a stair-step profile interconnection wherein each of the stairs on the profile exposes an area of a signal layer. Each exposed portion of the signal layer has a plurality of signal pads thereon. The second sub-circuit board includes an edge with an inverse stair-step profile interconnection. A pad-on-pad connector is positioned in-between and electrically interconnects the respective signal layers on each sub-circuit board. | 11-12-2009 |
20090283302 | Printed circuit board and manufacturing method thereof - Disclosed are a printed circuit board and a manufacturing method thereof. The printed circuit board in accordance with the present invention includes: a circuit laminate, a solder resist laminated on the circuit laminate, a metal support layer formed on the solder resist, a stiffener formed on the metal support layer. | 11-19-2009 |
20090288861 | CIRCUIT BOARD WITH BURIED CONDUCTIVE TRACE FORMED THEREON AND METHOD FOR MANUFACTURING THE SAME - A circuit board with a buried conductive trace formed thereon according to the present invention is provided. A buried conductive trace layer is formed on the surface of a substrate and the pads of the conductive trace layer are plated with a layer of copper so that the pads are heightened to facilitate the subsequent process of molding. | 11-26-2009 |
20090294156 | INTERMEDIATE MULTILAYER WIRING BOARD PRODUCT, AND METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD - An intermediate multilayer wiring board product includes: a stack of a plurality of resin insulating layers, a first conductor layer, and a second conductor layer. The stack includes: a product forming region comprising a plurality of product portions arranged along a major surface of the stack, each of the plurality of product portions to become a product of the multilayer wiring board; and a frame portion surrounding the product forming region. The first conductor layer is formed on at least one of the plurality of resin insulating layers within each of the plurality of product portions. The second conductor layer is formed on at least one of the plurality of resin insulating layers within the frame portion. The frame portion has a plurality of cuts penetrating the frame portion in a thickness direction thereof, the plurality of cuts being arranged at substantially equal intervals. | 12-03-2009 |
20090301766 | Printed circuit board including electronic component embedded therein and method of manufacturing the same - Disclosed herein is a printed circuit board including an electronic component embedded therein, as the electronic component is supported on the metal layer of core substrate, thus supporting and radiation performances are improved, production costs are reduced, and the manufacturing process is simplified. | 12-10-2009 |
20090301767 | Printed circuit board and method of manufacturing the same - Disclosed is a printed circuit board including bumps formed using a conductive paste including carbon nanotubes and a photosensitive binder. A method of manufacturing the printed circuit board is also provided. The printed circuit board includes bumps formed using the conductive paste having carbon nanotubes, and can realize good electrical connection with electronic parts mounted thereon. The bumps can be formed at a fine pitch, thus realizing a circuit layer having a high density. | 12-10-2009 |
20090308640 | Wafer level package and method of manufacturing the same - Provided is a wafer level package including a first substrate that has circuit patterns provided on the top surface thereof and first vias formed therein, the first vias being electrically connected to the circuit patterns; and a second substrate that is bonded to the bottom surface of the first substrate through anodic bonding and has second vias formed therein. | 12-17-2009 |
20090308641 | CHIP HAVING SIDE PROTECTION TERMINAL AND PACKAGE USING THE CHIP - A chip includes a chip body having an upper surface on which an active surface is formed, and at least one side protrusion terminal protruding from a lateral surface of the chip body and electrically connected to the active surface. As a plurality of semiconductor chips or parts may be connected to one another on a single package, a one-chip or one-package of a package is possible and the thickness of the package can be reduced. | 12-17-2009 |
20090308642 | THERMOSETTING RESIN COMPOSITION - A thermosetting resin composition contains, as essential components, (A) an epoxy resin having at least two epoxy groups in its molecule, (B) a thermoplastic polyhydroxy polyether resin having a fluorene skeleton, (C) an epoxy curing agent, and (D) a filler. A dry film is obtained by forming a thin film of the thermosetting resin composition on a supporting base film, and a prepreg is obtained by coating and/or impregnating a sheet-like fibrous base material with the thermosetting resin composition. Since they exhibit excellent adhesiveness to a substrate or a conductor and a cured film of the thermosetting resin composition has a relatively low thermal expansion coefficient and a high glass transition point and exhibits high resistance to heat and the capability of being roughened by a roughening treatment, they are useful as a resin insulating layer of a multilayer printed circuit board. | 12-17-2009 |
20090314525 | Mold for Wiring Substrate Formation and Process for Producing the Same, Wiring Substrate and Process for Producing the Same, Process for Producing Multilayered Laminated Wiring Substrate and Method for Viahole Formation - A process for producing a wiring board is provided, comprising allowing a wiring board-forming mold, which comprises a support base and a mold pattern that is formed in a protruded shape on one surface of the support base wherein the sectional width of the mold pattern on the support base side is larger than the sectional width thereof on the tip side in the same section of the mold pattern, to penetrate into a curing resin layer to transfer the mold pattern, curing the curing resin layer, releasing the laminate from the mold, depositing a conductive metal, and polishing the deposited metal layer that to form a depressed wiring pattern, and a wiring board produced by this process. Further, described is a process for producing a wiring board, comprising bringing a precision mold having a mold pattern on a surface of a mold base into contact with a surface of a metal thin film formed on an organic insulating base, pressing the mold to form a depression having a shape corresponding to the mold pattern of the precision mold in the organic insulating base, thereafter forming a metal plating layer having a thickness larger than the depth of the depression to fill the plating metal in the depression, and then polishing the metal plating layer until the organic insulating base is exposed, to form a wiring pattern, and a wiring pattern produced by this process. | 12-24-2009 |
20090314526 | Resin Film, Adhesive Sheet, Circuit Board, and Electronic Apparatus - The invention relates to a resin film having a high adhesiveness to other materials, an adhesive sheet, a circuit board and an electronic apparatus in which an adhesive layer and the resin film are firmly adhered. A resin film ( | 12-24-2009 |
20090314527 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - To form a conductive region in a prepreg without opening a through hole in a fibrous body. A wiring substrate is provided, including: an organic resin layer and a fibrous body, wherein the fibrous body is impregnated with the organic resin layer; and a wiring with which the fibrous body is impregnated and which is formed by dissolving the organic resin layer. The wiring is exposed on both surfaces of the organic resin layer and penetrates the fibrous body so that the fibrous body is positioned in the through wiring. Further, a semiconductor device is provided by adhering an integrated circuit chip having a bump to the wiring substrate so that the bump is in contact with the wiring. | 12-24-2009 |
20090321112 | RIGID-FLEXIBLE PRINTED CIRCUIT BOARD HAVING A PEELABLE MASK AND METHOD OF MAKING - The invention relates to a method of fabricating a flexible-rigid PCB which includes a flexible circuit substrate and a rigid circuit substrate. The flexible circuit substrate defines a rigid region and an exposed region and has a conductive pattern, such as conductive traces, formed on the exposed region. The method includes the steps of providing the flexible circuit substrate; printing a paste containing epoxy-silicone hybrid materials onto the conductive pattern; curing the paste; and building up the rigid circuit substrate on the rigid region of the flexible circuit substrate. Particularly, the paste having a specific composition is subjected to predetermined conditions of temperature and time in order to transform the paste into a peelable mask with heat resistance, chemical resistance and a contact angle greater than 20 degrees. | 12-31-2009 |
20100000768 | LEAD-EMBEDDED METALLIZED CERAMICS SUBSTRATE AND PACKAGE - A metallized ceramics substrate including: a ceramics body; a wiring pattern formed on one surface of the ceramics body; and a lead electrically-connected to the wiring pattern. The ceramics body has a through-hole, the lead penetrates the through-hole and sticks out from another surface of the ceramics body, and the lead is fixed by filling an electroconductive filler between the lead and the through-hole for keeping airtightness. The metallized ceramics substrate does not cause a problem of interlayer peeling and is excellent in airtightness and electric conductivity. | 01-07-2010 |
20100000769 | COMPOSITE MAGNETIC BODY, METHOD OF MANUFACTURING THE SAME, CIRCUIT BOARD USING THE SAME, AND ELECTRONIC APPARATUS USING THE SAME - There are provided a composite magnetic body exhibiting a sufficiently low magnetic loss at frequencies of several hundreds of megahertz to several gigahertz, and a method of manufacturing the same. The composite magnetic body contains a magnetic powder dispersed in an insulating material. The magnetic powder is in a spherical shape or an elliptic shape. The composite magnetic body has any one of the following characteristics (a) to (c):
| 01-07-2010 |
20100006324 | CURABLE RESIN COMPOSITION, HALOGEN-FREE RESIN SUBSTRATE, AND HALOGEN-FREE BUILD-UP PRINTED WIRING BOARD - In a curable resin composition containing an inorganic filler, the average particle diameter of the inorganic filler is 1 μm or less and the content of the inorganic filler is 50 wt % or less. The curable resin composition can be preferably used for a halogen-free resin substrate and the like having a small load on an environment as a hole-plugging curable resin composition as well as used to provide a hole-plugging build-up printed wiring board having a via-on-via structure (in particular, a stacked via structure) having an excellent crack-resistant property, an excellent insulation/connection reliability, and the like. | 01-14-2010 |
20100006325 | PRINTED WIRING BOARD - A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material. | 01-14-2010 |
20100012356 | PRINTED WIRING BOARD HAVING RECOGNITION MARK - According to one embodiment, a printed wiring board comprises an insulating substrate having a mounting surface, a recognition mark formed on the mounting surface of the insulating substrate, and a plurality of reinforcing patterns formed on the mounting surface of the insulating substrate. The reinforcing patterns extend from an outer periphery of the recognition mark toward outside of the recognition mark and are arranged circumferentially at intervals relative to the recognition mark. Each of the reinforcing patterns has a width less than a width of a part of the outer periphery of the recognition mark connecting adjacent ones of the reinforcing patterns. | 01-21-2010 |
20100012357 | Printed Circuit Board With Improved Via Design - A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape. | 01-21-2010 |
20100018757 | Printed circuit board (PCB) with slot for pass through terminal (PTT), method of drilling a slot in a printed circuit board and printed circuit board assembly with slot and pass through terminal - A printed circuit board assembly comprises a printed circuit board and a pass through terminal. The printed circuit board has a wavy slot extending through the printed circuit board that is clad with a conductive material. The wavy slot has part circular ends and a plurality of cusps along each side of the wavy slot that are formed by a plurality of successive drill cuts through a substrate of the printed circuit board. The pass through connector has a rectangular mounting portion that is disposed in the wavy slot with an interference fit so as to deform the part circular ends of the wavy slot at four locations and the cusps along each side of the wavy slot. | 01-28-2010 |
20100038118 | SUBSTRATE PANEL - A substrate panel primarily comprises a plurality of substrate strips arranged in an array, one or more current input lines, a plurality of cascaded lines connecting between the substrate strips, and a current input buffer gate. Current input lines connect a current input side of the substrate panel to the adjacent substrate strips. The current input buffer gate has a frame around the substrate strips and a plurality of meshes where the frame intersects with the current input lines and the meshes intersect with the cascaded lines with both ends of the meshes connecting to the frame. Therefore, the current can be evenly distributed to each substrate strip during plating processes to improve the issues of different plating thicknesses and different plating roughness caused by different current densities and to protect the internal circuits inside the substrate strips from the damages due to current surges and unstable voltages. | 02-18-2010 |
20100051328 | CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF - A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a composite substrate, a dielectric layer, and a circuit layer. The composite substrate includes a metal substrate doped with non-metal powders and a metal buffer layer. A surface of the metal buffer layer opposite to the other surface of the metal buffer layer in contact with the metal substrate is treated by a polishing process. The dielectric layer is formed on the polished surface of the metal buffer layer, and the circuit layer is formed on the dielectric layer. Alternatively, a barrier layer is interposed between the dielectric layer and the metal buffer layer for preventing a diffusion effect of the metal buffer layer. | 03-04-2010 |
20100051329 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed are a printed circuit board and a method of manufacturing the same. The method in accordance with an embodiment of the present invention includes: forming an electroless plated layer on an insulation layer; and forming a circuit pattern by applying conductive ink on the electroless plated layer through an inkjet method. | 03-04-2010 |
20100051330 | WIRING BOARD AND DISPLAY UNIT - A wiring board formed by mounting an IC chip on a mounting substrate includes a resin substrate and a wiring pattern. The resin substrate includes having a reinforcing material obtained by impregnating glass fibers with a resin and an organic layer provided on a surface of the reinforcing material. The wiring pattern is disposed on a surface of the resin substrate through a coating layer. The IC chip includes a bump electrode for connection with the wiring pattern. The resin substrate includes a fiber exposure portion through which the reinforcing material is exposed, and the IC chip is fixed to the mounting substrate through an ACF adhered to the fiber exposure portion with the connection electrode being connected to the wiring pattern. | 03-04-2010 |
20100059255 | LTCC SUBSTRATE STRUCTURE AND METHOD FOR THE PRODUCTION THEREOF - An LTCC substrate structure with at least one contact element for connecting a wire conductor, which has a first metallization ( | 03-11-2010 |
20100065308 | CONDUCTIVE EMISSIONS PROTECTION - According to one non-limiting embodiment, a low conductive emission substrate includes a plurality of thin high dielectric strength insulating layers separated by a corresponding plurality of conductive layers, wherein one of the plurality of conductive layers is shorted to another one of the plurality of conductive layers. | 03-18-2010 |
20100078201 | LAMINATED BODY, CIRCUIT BOARD INCLUDING LAMINATED BODY, SEMICONDUCTOR PACKAGE AND PROCESS FOR MANUFACTURING LAMINATED BODY - There is provided a laminated body comprising a first resin layer consisting of a first fibrous base material and a resin and a second resin layer consisting of a second fibrous base material and a resin, wherein the first resin layer and the second resin layer are disposed such that the first resin layer and the second resin layer are at least partly positioned in separate regions separated by the center line in a thickness direction of the laminated body; wherein at least one of the first fibrous base material and the second fibrous base material has a bowing region where a bowing region is a region in which a smaller warp/weft crossing angle is less than 90° in the fibrous base material; and wherein in the bowing region, an angle formed by a warp of the first fibrous base material and a warp of the second fibrous base material and an angle formed by a weft of the first fibrous base material and a weft of the second fibrous base material, whichever is larger, is 2° or less. | 04-01-2010 |
20100096169 | Polyamide Resin as Well as Epoxy Resin Composition Using the Same and Use Thereof - The invention provides a phenolic hydroxyl group-containing rubber-modified polyamide resin capable of providing a cured product with excellent heat resistance, adhesion properties, electrically insulating property and flame retardance and having a sufficient flexibility when being shaped into a film, which is characterized by having in its molecule (a) a phenolic hydroxyl group-containing aromatic polyamide segment represented by the following formula (1): | 04-22-2010 |
20100096170 | CIRCUIT BOARD AND LAYOUT METHOD THEREOF - A circuit board includes a signal plane and a ground plane. The signal plane is configured to have a plurality of signal traces arranged thereon. Each of the signal traces includes a plurality of straight line segments. Each line segment extends along a path different from the others. The ground plane includes a plurality of tiles connected in an array. Each tile is formed by ground traces. The straight line segments of each signal trace mapped on the ground plane are arranged at an angle relative to any one ground trace of the tiles. The angle is defined within a range determined by one of ground traces of a tile and an adjacent diagonal line of the tile. A method for laying out such a circuit board is also provided. | 04-22-2010 |
20100101837 | PRINTED CIRCUIT BOARD - A printed circuit board includes a reference layer, at least one first hole defined in the reference layer and adjacent from a first pin in a first column of pins of an electronic component, and at least one second hole defined in the reference layer and adjacent from a second pin of the electronic component. The at least one second hole is defined in the reference layer and opposite to the at least one first hole. The second pin is in a neighboring second column of pins from the first column of pins. A diameter of the at least one first hole is greater than a diameter of the at least one second hole such that a difference in current flowing through the first pin and the second pin is reduced. | 04-29-2010 |
20100101838 | MULTILAYER PRINTED WIRING BOARD - A package substrate free of malfunction or error even with an IC chip in a high frequency range, particularly an IC chip with a frequency exceeding 3 GHz, is provided. A conductor layer | 04-29-2010 |
20100108364 | FLAME RETARDANT COMPOSITIONS - Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a polyphenylene ether, a halogen-free or substantially halogen-free polyepoxide, and one or more phosphorated compounds. Prepregs, laminates, molded articles and printed circuit boards using the compositions are also disclosed. | 05-06-2010 |
20100116528 | PRINTED CIRCUIT BOARD WITH MULTIPLE METALLIC LAYERS AND METHOD OF MANUFACTURING THE SAME - Provided is a printed circuit board (PCB) with multiple metallic layers and a method of manufacturing the PCB to improve adhesion between a metal film and a polymer film, on which a circuit pattern is formed. The PCB includes: a first metal film; a polymer film formed on one surface of the first metal film; and a second metal film, interposed between the first metal film and the polymer film, having a first surface facing the first metal film and a second surface facing the polymer film, wherein the second surface is rougher than the first surface. | 05-13-2010 |
20100132983 | RIGID PRINTED CIRCUIT BOARD, PCB ASSEMBLY, AND PCB MODULE HAVING SAME - An exemplary rigid printed circuit board (PCB) includes a main portion, a supporting portion and a connecting portion. The supporting portion is for supporting electrical elements. The connecting portion includes two end portions and a main body therebetween. The main body is spaced from the main portion and the supporting portion. The two end portions are respectively connected to the main portion and the supporting portion. A PCB assembly and a PCB module using the same are also provided. | 06-03-2010 |
20100132984 | MULTILAYER PRINTED CIRCUIT BOARD - In order to reduce noise propagating from a digital signal circuit to an analog signal circuit, a multilayer printed circuit board includes a first digital signal circuit formed in a first region of a front surface, a first analog signal circuit formed in a second region of the front surface, a second digital signal circuit formed at a back surface corresponding to the first region, a second analog signal circuit formed at the back surface corresponding to the second region; an analog ground circuit formed between the front surface and the back surface to ground the first analog signal circuit and the second analog signal circuit, and a first digital ground circuit arranged between the first digital signal circuit and the analog ground circuit and a second digital ground circuit arranged between the second digital signal circuit and the analog ground circuit to ground the first digital signal circuit and the second digital signal circuit. | 06-03-2010 |
20100147565 | WINDOW BALL GRID ARRAY SUBSTRATE AND ITS PACKAGE STRUCTURE - A window ball grid array substrate and its package structure includes a package substrate with a long slot arranged thereon, wherein the improvement is characterized by the long slot penetrating an end of the package substrate making the package substrate appear to be U-shaped. | 06-17-2010 |
20100147566 | COMPOSITE MULTILAYER WIRING BOARD - Electronic components on a printed wiring board can be protected from the impact force of a fall, whereby the electrical and mechanical reliability of the electronic apparatus components can be greatly improved, and moreover, smaller size, lighter weight, higher functionality, and greater multifunctionality can be achieved. The composite multilayer wiring board of the present invention includes a plurality of intermediate layers each interposed between a plurality of printed wiring boards, at least one of the plurality of intermediate layers being composed of a resin material having a dilatancy characteristic. | 06-17-2010 |
20100155110 | WIRING BOARD - A wiring board of the present invention comprises a plurality of device formation areas each for mounting a semiconductor chip thereon, and two or more slits formed in an area which comes into contact with a molding die when the wiring board is placed in a cavity of the molding die for forming a sealant to collectively cover the plurality of device formation areas. | 06-24-2010 |
20100155111 | MOUNTING STRUCTURE - A mounting structure of the present invention includes: electronic components, a first substrate on which the electronic components are mounted, a first resin for molding at least a part of a surface of the first substrate with the electronic components mounted on the surface, a second substrate on which the first substrate is mounted, connecting members for connecting the first substrate and the second substrate, and a flat reinforcing member disposed on the opposite surface of the second substrate from a surface on which the first substrate is mounted. The reinforcing member is disposed such that the longitudinal direction of the reinforcing member is arranged along the longitudinal direction of the first substrate. | 06-24-2010 |
20100155112 | PRINTED WIRING BOARD AND A METHOD OF PRODUCTION THEREOF - A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other. | 06-24-2010 |
20100155113 | Wired circuit board assembly sheet - A wired circuit board assembly sheet includes a plurality of wired circuit boards spaced to each other, and a plurality of striated portions extending between the respective wired circuit boards along a direction intersecting the lengthwise direction of the wired circuit boards. | 06-24-2010 |
20100155114 | Package for semiconductor devices - To prevent or alleviate the occurrence of stress in the junction portion between the semiconductor element and the semiconductor package for mounting the semiconductor element, so that cracks will not occur even when there is mounted a semiconductor element having a low strength. A package for semiconductor devices is formed as a laminate of many layers including a plurality of conducting layers and insulating resin layers that are alternately laminated one upon the other and having, on one surface of the laminate, a portion for mounting a semiconductor element. The whole region or some region(s) of the insulating resin layers of the laminate, including at least the portion for mounting the semiconductor element and the peripheries thereof, are constituted by a prepreg obtained by impregnating a woven fabric of a liquid crystal polymer with an insulating resin. | 06-24-2010 |
20100163284 | ARRAY, SUBSTRATE, AND DISPLAY DEVICE AND ITS MANUFACTURING METHOD - An array substrate comprises on an insulative substrate, a plurality of display areas to be portions of a plurality of display panels, in which, each display area is constituted with a plurality of pixels arranged in a matrix, and the pixels is constituted with pixel electrodes formed at intersection portions of plural scan wirings and plural signal wirings; a common wiring is formed outside each display area, for applying a reference voltage to the pixels; a plurality of external-connection terminals is formed outside each display area, to be connected with a driver circuit that drives; and comprises connection wirings located so as to intersect a cutting line along which the insulative substrate is to be cut, for connecting the external-connection terminals in one of the display panels on the insulative substrate with a common wiring in another one of the display panels adjacent to the external-connection terminals, wherein the connection wirings are formed in a conductive layer superior in corrosion resistance to the most inferior corrosion-resistance conductive layer among conductive layers constituting the array substrate. | 07-01-2010 |
20100170705 | METHOD FOR PRODUCING POWDER FORSTERITE POWDER, FORSTERITE POWDER, SINTERED FORSTERITE, INSULATING CERAMIC COMPOSITION, AND MULTILAYER CERAMIC ELECTRONIC COMPONENT - A forsterite powder with superior characteristics which can be sintered at a relatively low temperature can be economically produced, when a magnesium source, a silicon source, and copper particles are mixed to prepare a mixed powder containing 300 to 2,000 ppm by weight of the copper particles, and the mixed powder is fired. The magnesium source used is preferably Mg(OH) | 07-08-2010 |
20100175913 | Wired circuit board assembly sheet - A wired-circuit-board assembly sheet includes a plurality of wired circuit boards and a supporting sheet for supporting the wired circuit boards in an aligned state. Each of the wired circuit boards includes a distinguishing mark forming portion to be formed with a distinguishing mark for distinguishing between defectiveness and non-defectiveness of the wired circuit board. The distinguishing mark forming portion is divided by a weir portion for preventing the distinguishing mark from flowing out from the distinguishing mark forming portion. | 07-15-2010 |
20100200279 | ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MOUNTING SUBSTRATE - An electronic component mounting substrate including a support layer made of resin with first and second surfaces, an organic insulation layer on the first surface of the support layer with a first surface on opposite side of the first surface of the support layer and a second surface in contact with the first surface of the support layer, an inorganic insulation layer on the first surface of the organic layer, a conductor on the second surface of the support layer, and a first conductive circuit on the second surface of the organic layer. The inorganic layer has a second conductive circuit and a pad for mounting an electronic component inside the inorganic layer. The organic layer has a via conductor inside the organic layer and connecting the first and second circuits. The support layer has a conductive post inside the support layer and connecting the first circuit and the conductor. | 08-12-2010 |
20100200280 | PRINTED CIRCUIT BOARD UNIT AND SOCKET - A second electrically-conductive terminal, having flexibility, contact with a first electrically-conductive terminal. A second substrate has first and second surfaces. The second surface supports the second electrically-conductive terminal. A third electrically-conductive terminal, having flexibility, is located on the first surface of the second substrate. The third electrically-conductive terminal is connected to the second electrically-conductive terminal. A fourth electrically-conductive terminal contacts with the third electrically-conductive terminal. A third substrate has a surface supporting the fourth electrically-conductive terminal. A frame is interposed between the first substrate and the third substrate. The frame supports the outer periphery of the second substrate. The frame allows relative movement of the second substrate in the direction perpendicular to the first surface of the second substrate. | 08-12-2010 |
20100212939 | MODULE, CIRCUIT BOARD, AND MODULE MANUFACTURING METHOD - A module of the present invention is provided with; a circuit board in which conductors are patterned on an insulating layer, and a functional element that is mounted on the conductor pattern face down via bumps. An aperture section is formed in an area of the circuit board which is the functional element mounting position, which is smaller than, a projected surface of the functional element, and is inside of a region where the bumps are joined with the conductors. A gap between the functional element and the circuit board, and the aperture section are sealed by a sealing resin. | 08-26-2010 |
20100230141 | STRUCTURE OF CONNECTING PRINTED WIRING BOARDS, METHOD OF CONNECTING PRINTED WIRING BOARDS, AND ADHESIVE HAVING ANISOTROPIC CONDUCTIVITY - The invention offers a board-connecting structure that can provide electrodes with a fine pitch and that can combine the insulating property and the connection reliability. The structure of connecting printed wiring boards | 09-16-2010 |
20100230142 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD - Disclosed is a method for producing a printed wiring board having high dimensional stability with high productivity. The production method comprising the steps of: providing a metal laminate in which a metal layer having an inner metal layer portion and a protection layer portion is laminated on at least one side of an insulating resin layer in such a manner that the inner metal layer portion is arranged on the side of the insulating resin layer; forming a via hole on the metal layer and the insulating resin layer; performing blast processing after forming the via hole; and removing the protection layer portion after performing blast processing. | 09-16-2010 |
20100230143 | ELECTRICAL INTERCONNECT STRUCTURE - An electrical structure including a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad. | 09-16-2010 |
20100243298 | CARBON NANOTUBE BASED INTERPOSER - In at least one embodiment, an interposer for a board interconnect system is provided. The interposer comprises a frame and at least one interconnect. The frame receives a substrate. The substrate includes a top side, a bottom side, and a conductive interface. The conductive interface extends through the top side and the bottom side for delivering an electrical signal from an electrical device positioned on the top side therethrough. The at least one interconnect includes a plurality of carbon nanotubes (CNTs) positioned within the frame for contacting the conductive interface of the substrate to deliver the electrical signal to a conductive arrangement of a circuit board. | 09-30-2010 |
20100243299 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board includes a core base material having a penetrating portion, a low-thermal-expansion substrate accommodated inside the penetrating portion of the core base material and having a first surface for mounting a semiconductor element and a second surface on the opposite side of the first surface, a first through-hole conductor provided inside the low-thermal-expansion substrate and provided for electrical connection between the first surface and the second surface of the low-thermal-expansion substrate, a filler filled in a gap between the low-thermal-expansion substrate and an inner wall of the core base material, and a wiring layer formed on at least one of the first surface and the second surface of the low-thermal-expansion substrate and having a resin insulation layer and a conductive layer. The wiring layer has a via conductor connecting the first through-hole conductor and the conductive layer. | 09-30-2010 |
20100252308 | PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF - A printed wiring board including resin insulation layers, and conductive circuits formed between the resin insulation layers such that spaces between the conductive circuits are filled with a resin material of the resin insulation layers. The conductor circuits include a first conductive circuit and a second conductive circuit positioned adjacent to the first conductive circuit, each of the first and second conductive circuits has a trapezoidal cross section, and the first and the second conductive circuits satisfy a formula, 0.10T≦|W | 10-07-2010 |
20100258339 | Varnish and Prepreg, and Substrates Thereof - A varnish includes resin and composite curing agent. The composite curing agent includes curing agent of polyphenylene methylphosphonate resin and curing agent of phenol resin. Glass fabric cloth is dipped into the varnish so as to form a prepreg with better thermal stability, anti-flammability, and low absorbent ability. Furthermore, the composite curing agent can be provided for higher curing rate. | 10-14-2010 |
20100270061 | Floating Metal Elements in a Package Substrate - A plurality of metal elements formed in an electronic package. The electronic package includes an electronic substrate and a plurality of metal elements disposed in a layer of the substrate. The plurality of metal elements do not serve an electrical function in the layer. Also, each of the plurality of metal elements is floating in the layer. In another embodiment, a method for optimizing the design of a package substrate is provided. The method includes identifying a space in a layer of the substrate that is free of metal and forming a plurality of metal elements in the identified space, where the plurality of metal elements do not serve an electrical function. | 10-28-2010 |
20100276184 | MULTILAYER PRINTED BOARD AND METHOD FOR MANUFACTURING THE SAME - Provided is a multilayer printed board | 11-04-2010 |
20100282498 | Method for integration of circuit components into the build-up layers of a printed wiring board - The present invention provides a printed wiring board assembly having active and passive components embedded between the printed wiring board layers and associated fabrication method so as to complete a multilayer printed wiring board to improve the flexibility of circuit layout. | 11-11-2010 |
20100282499 | PRINTED WIRING BOARD, METHOD FOR FORMING THE PRINTED WIRING BOARD, AND BOARD INTERCONNECTION STRUCTURE - A board interconnection structure having a first printed wiring board in which a first conductive circuit is arranged on a first insulating layer, the first conductive circuit having, on an end portion thereof, a first connection terminal in which an upper surface width is narrower than a bottom surface width; a second printed wiring board in which a second conductive layer having a second connection terminal is arranged on a second insulating layer; and a connection layer that forms fillets along longitudinal side surfaces of the first connection terminal, and interconnects the first connection terminal and the second connection terminal. The first connection terminal may have a projection portion. | 11-11-2010 |
20100288540 | THREE-DIMENSIONAL WIRING BOARD - A three-dimensional circuit board includes a lower substrate, a connection layer provided on an upper surface of the lower substrate, and an upper substrate provided on an upper surface of the connection layer. The connection layer exposes a portion of the upper surface of the lower substrate. The connection layer includes an insulating layer having a through-hole, and a via-conductor made of conductive material filling the through-hole. A recess is provided directly above the portion of the upper surface of the lower substrate and is surrounded by a side surface of the upper substrate and a side surface of the connection layer. A portion of the upper surface of the connection layer connected to the side surface of the connection layer inclines in a direction toward the portion of the upper surface of the lower substrate. The portion of the upper surface of the connection layer is provided from the side surface of the connection layer to the via-conductor. A portion of an upper substrate of the upper substrate connected to the side surface of the upper substrate inclines in a direction toward the portion of the upper surface of the lower substrate. The circuit board allows a component to be mounted in the recess efficiently. | 11-18-2010 |
20100294546 | CIRCUIT BOARD AND METHOD FOR A LOW PROFILE WIRE CONNECTION - A printed circuit board includes a first layer including a groove formed therein. The groove extends between opposing face surfaces. A second layer is coupled with one face surface of the first layer. The second layer includes a through hole in communication with the groove of the first layer. A third layer is coupled to other face surface of the first layer opposite the second layer. Portions of the second and third layers cooperate with the groove and forming a cavity with an opening at the edge of the board. The cavity is accessible through the through hole of the second layer. A printed circuit board includes multiple layers which are coupled together. A wire is electronically coupled to the printed circuit board by being inserted into the cavity with solder applied via the through hole. An alternative embodiment utilizes two layers to define the board and cavity. | 11-25-2010 |
20100300732 | MULTI-LAYER PRINTED CIRCUIT BOARD - A multi-layer printed circuit board includes a first trace layer and a second trace layer. The second trace layer and the first trace layer are located on parallel horizontal planes. A first group of traces is laid on the first trace layer. A second group of traces is laid on the second trace layer. The second group of traces and the first group of traces are positioned on up and down positions of the first trace layer and the second trace layer. The first group of traces and the second group of traces extend in different directions. | 12-02-2010 |
20100307798 | UNIFIED SCALABLE HIGH SPEED INTERCONNECTS TECHNOLOGIES - Traditional High Speed Electronic Systems Interconnect experience several bandwidth bottlenecks along the multiplicity of signal paths that limits the information throughput. Here we build upon the cellular interconnect concept of PMTL, the Periodic Micro Transmission Line which was introduced in an earlier patent application, and provide a new type of transmission line VMPL, as the Vertical Micro Transmission Line approach to make all the elements of a high speed interconnect wideband, unified, scalable, and practical for high volume manufacturing. This provides total connectivity improvements from end-to-end of electronic systems that demands higher bandwidth, and increased information throughput, thermal management, and impeccable signal integrity. The technologies introduced here provide solutions for any level of the fan out from chips to systems, in CMOS, or Packages, and PCB's. | 12-09-2010 |
20100307799 | Carrier Structure for Electronic Components and Fabrication Method of the same - A carrier structure for electronic components includes a carrier, an interface layer, insulation paths and a metal layer. The carrier is made of a molded plastic. A reflection cup is formed on the carrier. The carrier is etched, catalyzed and activated, then deposited Ni or Cu by chemical deposition to form an interface layer on it. Afterwards insulation paths are formed on the interface layer by ablating part of the insulation layer employing laser beam radiation, in the followed step, electroplating process is carried out using Cu, Ni, Ag or Au to form a metal layer on the interface layer thereby completing the carrier structure for electronic components. | 12-09-2010 |
20100314160 | LOW LOSS PRE-PREGS AND LAMINATES AND COMPOSITIONS USEFUL FOR THE PREPARATION THEREOF - In accordance with the present invention compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like. | 12-16-2010 |
20100319966 | PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF - A method for fabricating a packaging substrate includes: stacking two metal layers; encapsulating the two metal layers with assistant dielectric layers; forming built-up structures on the assistant dielectric layers, respectively; and separating the built-up structures along the interface between the two metal layers so as to form two packaging substrates. Owing to the adhesive characteristic of the assistant dielectric layers, the two metal layers are unlikely to separate from each other during formation of the built-up structures. But after portions of the dielectric layer around the periphery of the metal layers are cut and removed, the two metal layers can be readily separated from each other. The two metal layers can be patterned to form wiring layers, metal bumps, or supporting structures to avoid waste of materials. A packaging substrate and a fabrication method thereof are provided. | 12-23-2010 |
20110000702 | CIRCUIT BOARD - A signal line ( | 01-06-2011 |
20110005812 | METAL FOIL LAMINATED POLYIMIDE RESIN SUBSTRATE - The present invention relates to a metal foil laminated polyimide resin substrate wherein
| 01-13-2011 |
20110024163 | Print Circuit Board With High Insulated Region, Method Of Manufacturing Thereof, And Print Circuit Board Assembly Thereof - A print circuit board includes: a first surface; a guard plane disposed on an inner layer; a high insulated region formed on the first surface of the board so as to be opposed to the guard plane, the high insulated region being substantially surrounded by one or more first guard patterns; and a quasi-high insulated region formed on the first surface of the board so as to be disposed adjacent to the high insulated region. The quasi-high insulated region is substantially surrounded by at least a part of the one or more first guard patterns and by one or more second guard patterns, in which the one or more first guard patterns and the one or more second guard patterns are each formed by forming one or more trenches in the first surface of the board so as to expose the guard plane on a bottom surface of the trenches. | 02-03-2011 |
20110024164 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A multi-layer printed circuit board including a core structure comprising resin layers and conductor circuits sandwiched by the resin layers, the core structure having a first surface and a second surface on an opposite side of the first surface, a first conductor layer including conductor circuits formed on the first surface of the core structure, and a second conductor layer including conductor circuits formed on the second surface of the core structure. The core structure includes a first via hole and a second via hole, and the first via hole and the second via hole include a metal filling up to the respective top of openings formed in the resin layers, respectively, sandwich one or more conductor circuits in the core structure and are positioned vertically to form a through hole electrically connecting respective ones of the conductor circuits of the first and the second conductor layers. | 02-03-2011 |
20110030999 | METAL CIRCUIT WIRING HAVING ORGANIC RESIN FOR ADHESIVE LAYERS AND METHOD OF MANUFACTURING THE SAME - The invention is to provide a metal circuit wiring having an organic adhesive layer, the metal circuit wirings comprising: an organic adhesive layer formed with a resin selected from the group consisting of acrylic resin, chloroprene rubber and silicone rubber resin; and metal wiring patterns formed with an ink composition including metal nanoparticles, in which the metal wiring exhibits excellent adhesive between metal nano materials and the substrate and electrical property. | 02-10-2011 |
20110042127 | ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - The invention provides an electronic component and a manufacturing method thereof that: can allow electronic components to be mounted on an external substrate at a higher density than before; can adjust the height (level) of a terminal electrode as required and desired, thereby solving problems that would occur in the inspection of the conventional electronic components; and can also improve the yield in the mounting of electronic components, thereby achieving increased productivity. A capacitor | 02-24-2011 |
20110061904 | Display array substrate and method of manufacturing display substrate - A display array substrate according to an aspect of the invention may include: a substrate wafer having cutting grooves curved inward; and a transparent electrode coated over one surface of the substrate wafer, wherein shock, occurring when cutting the substrate wafer, is prevented from being transmitted to the transparent electrode by cutting the substrate wafer along the cutting grooves having a different height from the transparent electrode. | 03-17-2011 |
20110061905 | Printed circuit board and method of manufacturing the same - There is provided a printed circuit board. The printed circuit board may be configured to include: a core layer in which a bending prevention portion of at least two layers is interposed between a plurality of insulating members and includes metal layers having different thermal expansion coefficients is disposed; a circuit pattern that is formed so as to have a desired pattern on at least one of the inside of the core layer and an outer face of the core layer; and an insulating layer that is formed on the core layer and includes an opening portion that exposes the circuit pattern, and a method of manufacturing the printed circuit board. According to the above-described printed circuit board and the method of manufacturing the printed circuit board, by disposing a bending prevention portion inside the printed circuit board, a printed circuit board capable of improving the progress rate and the productivity and a method of manufacturing the printed circuit board can be provided. | 03-17-2011 |
20110067906 | POWER MODULE SUBSTRATE, POWER MODULE, AND METHOD FOR MANUFACTURING POWER MODULE SUBSTRATE - A power module substrate includes: a ceramics substrate composed of AlN, having a top face; a metal plate composed of pure aluminum and joined to the top face of the ceramics substrate with a brazing filler metal including silicon interposed therebetween; and a high concentration section formed at a joint interface at which the metal plate is joined to the ceramics substrate, having a silicon concentration that is more than five times the silicon concentration in the metal plate. | 03-24-2011 |
20110073354 | PRINTED BOARD AND METHOD OF MANUFACTURING PRINTED BOARD - A printed board includes an insulating body that has a flat surface and includes insulating cloth including first fibers and second fibers that cross the first fibers at right angles on the flat surface, and printed wiring including a plurality of signal lines that run parallel to each other and are laid out on the flat surface of the insulating body so that a direction of the signal lines is tilted to a direction of the first or second fibers at an angle which is determined based on board-cutting efficiency of the insulating body and a predetermined delay-time difference between the signal lines. | 03-31-2011 |
20110073355 | INTERPOSER AND ELECTRONIC DEVICE - An interposer for connecting a semiconductor and a circuit board includes an insulating material sheet, a through hole which is formed in the insulating material sheet and an elastic conductive contact which is formed from an elastic conductive sheet and provided in the through hole. | 03-31-2011 |
20110108308 | Packaging Device and Base Member for Packaging - An object of the present invention is to provide a chip-size packaging device at low cost that achieves size reduction, thickness reduction, weight reduction, and further, high reliability, by using a glass substrate with a through electrode. The packaging device according to the present invention is characterized in that a glass substrate ( | 05-12-2011 |
20110120756 | CIRCUIT BOARD, ITS MANUFACTURING METHOD, AND JOINT BOX USING CIRCUIT BOARD - A circuit board includes a foil circuit provided on a synthetic resin plate formed by injection molding, made of a copper foil, and having a pattern different for the circuit board. Anchor pins projecting upward are provided on the resin plate and passed through pinholes made in the foil circuit. The foil circuit is positioned and secured to the resin plate. In a required portion of the resin plate, a terminal insertion hole is provided, and a receiving terminal is secured to the required portion of the terminal insertion hole and connected to the foil circuit. | 05-26-2011 |
20110127072 | SUPPORTING FRAME FOR CIRCUIT BOARD - A circuit board includes a substrate and a supporting frame fixed to, and supporting, the substrate. The supporting frame includes a main body, a pressing supporting portion, two pulling supporting portions and two fixing portions. The main body includes a first arm and a second arm connected to the first arm. The pressing supporting portion extends downwards from a junction of the first arm and the second arm for counterbalancing a downward force applied upon the substrate. The pulling supporting portions respectively extend downwards from distal ends of the first arm and second arm for counterbalancing an upward force applied upon the substrate. The two fixing portions are respectively formed on the first arm and second arm. Each of the fixing portions is located between the pressing supporting portion and one corresponding pulling supporting portion and is closer to the corresponding pulling supporting portion. | 06-02-2011 |
20110132644 | METAL BASE CIRCUIT BOARD - Lifespan of LEDs can be lengthened, and the workability of the printed circuit board during circuit formation and during LED mounting can be improved. | 06-09-2011 |
20110139494 | EMBEDDED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing an embedded wiring board is provided. An activating insulation layer is formed, in which the activating insulation layer includes a plurality of catalyst particles, and covers a first wiring layer. An intaglio pattern and at least one blind via partially exposing the first wiring layer are formed on the activating insulation layer, in which some of the catalyst particles are activated and exposed in the intaglio pattern and the blind via. The activating insulation layer is dipped in a first chemical plating solution, and a solid conductive pillar is formed in the blind via through electroless plating. The activating insulation layer is dipped in a second chemical plating solution after the solid conductive pillar is formed, and a second wiring layer is formed in the intaglio pattern through the electroless plating. Components of the first chemical plating solution and the second chemical plating solution are different. | 06-16-2011 |
20110139495 | CIRCUIT BOARD INCLUDING MASK FOR CONTROLLING FLOW OF SOLDER - A circuit board includes a solder wettable surface and a metal mask configured to restrict solder from flowing outside the solder wettable surface of the circuit board. | 06-16-2011 |
20110147055 | Glass core substrate for integrated circuit devices and methods of making the same - Disclosed are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed. | 06-23-2011 |
20110155426 | EMBEDDED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An embedded circuit board is disclosed including a first copper clad laminate formed with a plurality of cavities and including a plurality of chips having different thicknesses embedded in the cavities, a second copper clad laminate provided in the cavities to allow the first copper clad laminate to level with the chips; and a resin coated copper foil provided on upper surfaces of the first and second copper clad laminates. | 06-30-2011 |
20110168433 | CONTACT EQUIPMENT AND CIRCUIT PACKAGE - Provided is a contact device including a contact array, in which contacts are arranged in a grid, and a plurality of differential wire pairs electrically connected to the contact array, wherein each differential wire pair is connected to a contact pair formed by two adjacent contacts in the contact array, and each contact pair is arranged such that a direction of a straight line connecting the two contacts therein is different from a direction of a straight line connecting the two contacts in a contact pair adjacent thereto. | 07-14-2011 |
20110180308 | SUBSTRATE FOR ELECTRONIC DEVICE, METHOD FOR PRODUCING SAME, ELECTRONIC DEVICE USING SAME, METHOD FOR PRODUCING SAME AND SUBSTRATE FOR ORGANIC LED ELEMENT - Provided is a substrate for an electronic device for providing an electronic device having a long-life and a high reliability in which exfoliation or deterioration of a wiring is inhibited by embedding the wiring therein while maintaining smoothness of the surface. The substrate is a substrate | 07-28-2011 |
20110186336 | SUBSTRATE FOR MOUNTING ELEMENT AND PROCESS FOR ITS PRODUCTION - To provide a substrate for mounting element having sulfurization resistance improved by increasing planarity of the surface of a thick conductor layer. | 08-04-2011 |
20110192637 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A multi-layer printed circuit board includes a core structure including resin layers and conductor circuits sandwiched by the resin layers, the core structure having first and second surfaces, a first conductor layer including conductor circuits on the first surface of the core structure, and a second conductor layer including conductor circuits on the second surface of the core structure. The core structure includes first and via holes, and the first and second via holes include a metal filling up to the respective top of openings in the resin layers, respectively, sandwich one or more conductor circuits in the core structure and are positioned vertically to form a through hole electrically connecting respective ones of the conductor circuits of the first and second conductor layers, and the first and second via holes are deviated from each other in a vertical direction. | 08-11-2011 |
20110209903 | ULTRA-THIN COPPER FOIL WITH CARRIER AND COPPER-CLAD LAMINATE BOARD OR PRINTED CIRCUIT BOARD SUBSTRATE - The invention has as its object to provide an ultra-thin copper foil with a carrier which suppresses occurrence of blistering and is stable in peeling strength, in particular provides an ultra-thin copper foil with a carrier enabling easy peeling of a carrier foil from an ultra-thin copper foil even under a high temperature environment. As means for that, there is provided an ultra-thin copper foil with a carrier comprised of a carrier foil, a release layer, and a copper foil, wherein the release layer is formed by a first release layer disposed on the carrier foil side and a second release layer disposed on the ultra-thin copper foil side, there is a first interface between the carrier foil and the first release layer, a second interface between the ultra-thin copper foil and the second release layer, and a third interface between the first release layer and the second release layer, and the peeling strengths at the interfaces are first interface>third interface, and second interface>third interface. | 09-01-2011 |
20110232947 | Structure of bridging electrode - In a structure of a bridging electrode, the structure of a bridging electrode applied to a capacitive touchpad, the structure comprising: a substrate; a plurality of first electrode blocks disposed on the substrate and electrically connected together in series through a first wire; a plurality of second electrode blocks disposed on the substrate and respectively disposed on two sides of the first wire; and a bridging insulation unit, which is perpendicular to and disposed on the first wire and having a bridging groove; wherein the second electrode blocks connecting electrically together in series through the bridging insulation unit having a second wire. | 09-29-2011 |
20110232948 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes a core substrate having a penetrating hole, a first circuit on a first surface of the substrate, a second circuit on a second surface of the substrate, and a through-hole conductor in the hole connecting the first and second circuits. The hole has first and second opening portions. The first opening portion becomes thinner toward the second surface. The second opening portion becomes thinner toward the first surface. The first opening portion has first and second portions. The second opening portion has first and second portions. The first and second portions of the first opening portion form inner walls bending inward at the boundary between the first and second portions. The first and second portions of the second opening portion form inner walls bending inward at the boundary between the first and second portions. | 09-29-2011 |
20110232949 | Printed Wiring Board Manufacturing Method and Printed Wiring Board - A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings. | 09-29-2011 |
20110247865 | METHOD FOR PRODUCING MULTILAYER WIRING SUBSTRATE AND MULTILAYER WIRING SUBSTRATE - The present invention provides a method for producing a multilayer wiring substrate, including: forming a laminated body having an insulating resin layer and a polymer adhesive layer, on a surface of a first wiring substrate wherein the polymer adhesive layer contains a polymer precursor interacting with a plating catalyst or a precursor thereof, and a reactive group bonding with an adjacent layer on the first wiring substrate side; applying energy to a region outside of a via connection portion on the surface of the laminated body, to form a patterned polymer adhesive layer; applying a plating catalyst or a precursor thereof to the patterned polymer adhesive layer, and carrying out a first electroless plating, to form a second metal wiring on the surface of the patterned polymer adhesive layer; and forming a via by utilizing the patterned second metal wiring as a mask, and subsequently carrying out a desmear treatment. | 10-13-2011 |
20110253428 | CIRCUIT BOARD WITH NOTCHED STIFFENER FRAME - Various embodiments of a semiconductor chip device that include a circuit board and a stiffener frame and methods of fabricating the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a circuit board and coupling a stiffener frame to the circuit board. The stiffener frame includes a first opening that defines an interior wall. The interior wall includes a notch. | 10-20-2011 |
20110253429 | Apparatus with a Multi-Layer Coating and Method of Forming the Same - In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating. | 10-20-2011 |
20110266035 | CONDUCTIVE MEMBER AND METHOD FOR PRODUCING THE SAME - [Object] To provide a conductive member which has a stable contact resistance, is difficult to be separated, and also decreases the inserting and drawing force when used for a connector. | 11-03-2011 |
20110266036 | LAMINATE TYPE CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME - A laminate type ceramic electronic component includes a thick film resistor and an overcoat layer so as to prevent defects such as delamination from being caused and to prevent the thick film resistor from being cracked after laser trimming, even when a method is adopted in which an unfired composite laminate is subjected to firing in such a way that an unfired ceramic laminate, an unfired thick film resistor, and an unfired overcoat layer are each integrally sintered. The unfired overcoat layer includes a glass ceramic material containing a ceramic and glass having substantially the same constituents and compositional ratio as those of the glass contained in the unfired ceramic layer. The respective glass ceramic materials constituting the unfired ceramic layer and the unfired overcoat layer are adjusted so that the ratio of a crystalline phase with a smaller coefficient of thermal expansion than the coefficient of thermal expansion of the fired ceramic layer is higher in the overcoat layer than in the ceramic layer. | 11-03-2011 |
20110272184 | LEAD FRAME AND MANUFACTURING METHOD THEREOF - Disclosed are a lead frame and a method for manufacturing the same. The lead frame includes a copper substrate and a rough copper layer having surface roughness of 110 nm to 300 nm on a surface of the copper substrate. | 11-10-2011 |
20110278050 | NON-DELETERIOUS TECHNIQUE FOR CREATING CONTINUOUS CONDUCTIVE CIRCUITS UPON THE SURFACES OF A NON-CONDUCTIVE SUBSTRATE - A non-deleterious method for producing a continuous conductive circuit upon a non-conductive substrate can begin with the application of a metallic base layer upon a surface of a non-conductive substrate. A circuit pattern can be created within the metallic base layer based upon a circuit design. The metallic base layer comprising the circuit pattern can be physically separated from the remainder of the metallic base layer on the non-conductive substrate. The region of the non-conductive substrate surface that encloses the circuit pattern can be called the plating region. The remainder of the non-conductive substrate surface can be called the non-plating region. A first metal layer can be added upon the metallic base layer. A second metal layer can be added upon the first metal layer of the plating region. The second metal layer can be electrically conductive and restricted from forming on the first metal layer of the non-plating region. | 11-17-2011 |
20110290539 | PRESSURE SENSOR - A pressure sensor includes a sense element port, a support ring and a plurality of interference fit slits to provide a flexible interference fit between the sense element port and the support ring to form a substantially flush lap joint. The sensor also includes an electronics board inside the support ring and attached to planar mounting tabs which provide a stable mounting. Gel flow barriers protect electronics board features from unwanted non-conductive gel. Double-ended symmetrical, tapered contact springs provide manufacturing cost savings and contribute to improved alignment of an interface connector of the sensor. | 12-01-2011 |
20110290540 | Embedded printed circuit board and method of manufacturing the same - Disclosed herein are an embedded printed circuit board and a method of manufacturing the same. The embedded printed circuit board includes: an insulating layer on which a cavity is formed; a chip mounted on the cavity; and a circuit layer formed on the insulating layer, wherein the insulating layer is made of photosensitive compositions including photosensitive monomer and photoinitiator. As a result, the cavity can be formed by selectively using only the insulating layer, thereby making it possible to secure a degree of freedom in the design of the embedded printed circuit board. | 12-01-2011 |
20110303440 | HYBRID HEAT-RADIATING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same. | 12-15-2011 |
20110303441 | BOARD REINFORCING STRUCTURE, BOARD ASSEMBLY, AND ELECTRONIC DEVICE - Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches. | 12-15-2011 |
20110303442 | SUBSTRATE STRIP WITH WIRING AND METHOD OF MANUFACTURING THE SAME - A substrate strip with wiring is provided. The substrate strip includes a plurality of wiring blocks, a carrying substrate, and an adhesive layer. Each of the wiring blocks includes at least one wiring board unit, and each of the wiring board unit includes an insulating layer and a wiring layer disposed on the insulating layer. The carrying substrate has a carrying surface. The adhesive layer is disposed between the carrying surface and the wiring layers, and adheres to the wiring blocks and the carrying substrate. When the adhesive layer is separated from the wiring blocks, the wiring layers are kept on the insulating layers. Further, a manufacturing method for the substrate is provided. | 12-15-2011 |
20110308842 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE WIRING SUBSTRATE - A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged. | 12-22-2011 |
20110315433 | METH0D AND SYSTEM FOR CONNECTING A PLURALITY OF PRINTED CIRCUIT BOARDS TO AT LEAST ONE FRAME OR CARRIER ELEMENT AND PRINTED CIRCUIT BOARD AND FRAME OR CARRIER ELEMENT - In a method and a system for connecting a plurality of printed circuit boards ( | 12-29-2011 |
20120000697 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a substrate having a cavity formed therein; an anodic oxide layer formed by anodizing the substrate; and a circuit layer formed in the cavity. The printed circuit board is advantageous in that, since a circuit layer is formed in a cavity of a substrate, a circuit layer having a thickness necessary for realizing a high-power semiconductor package can be easily formed, and the difficulty of supplying and demanding the raw material of a thick film plating resist can be overcome. Further, the printed circuit board is advantageous in that electrical shorts occurring at the time of forming a thick circuit layer and electrical shorts generated by the compounds remaining after etching can be prevented, thus improving the electrical reliability and stability of a circuit layer. | 01-05-2012 |
20120000698 | SUBSTRATE FOR SUSPENSION, AND PRODUCTION PROCESS THEREOF - A main object of the present invention is to provide a substrate for suspension which is produced at low costs and can sufficiently attain the prevention of damage by electrostatic discharge and restraint of noises. To attain the object, the present invention provides a substrate for suspension, comprising: a metallic substrate, an insulating layer formed on the metallic formed in substrate and having an opening from which the metallic substrate is exposed, a grounding-wiring layer formed on the insulating layer and arranged near the opening, and a ground terminal formed in the opening and contacting the metallic substrate and the grounding-wiring layer, characterized in that the ground terminal is made of a metal having a melting point of 450° C. or lower. | 01-05-2012 |
20120012370 | TRANSPARENT CONDUCTIVE LAMINATE AND TOUCH PANEL THEREWITH - A transparent conductive laminate comprising a transparent film substrate; a transparent conductive thin film provided on one side of the transparent film substrate; and a transparent base substrate bonded to another side of the transparent film substrate with a transparent pressure-sensitive adhesive layer interposed therebetween. The transparent conductive laminate has satisfactory reliability at high temperature and high humidity for touch panels and also has pen input durability and surface pressure durability. | 01-19-2012 |
20120012371 | MANUFACTURING METHOD FOR CIRCUIT BOARD, AND CIRCUIT BOARD - A method of manufacturing circuit boards includes the steps of forming an upper board having an opening, and provided with a circuit and an insulating film layer formed on a surface thereof, forming a lower board provided with a circuit and an insulating film layer formed on a surface thereof, forming an inter-board connecting sheet having a through-hole filled with a conductive paste, and layering the lower board, the inter-board connecting sheet and the upper board together, and applying heat and pressure. The step of forming the lower board includes a step of forming the insulating film layer into a shape leaving a clearance provided between an end of the film layer and any of an end of the opening of the upper board and an end of an opening of the inter-board connecting sheet when these three items are layered together, and the step of applying heat and pressure includes a step of inserting a cushion member into the openings of the inter-board connecting sheet and the upper board and into the clearance. | 01-19-2012 |
20120018198 | ELECTRONIC COMPONENT AND PRINTED WIRING BOARD - An electronic component including a substrate having a surface and one or more trench portions opening on the surface, a capacitor portion having a lower electrode formed on the surface of the substrate and on the wall surface of the trench portion, a dielectric layer formed on the lower electrode, and an upper electrode formed on the dielectric layer, a resin filler filling the space inside the trench portion lined by the upper electrode, an insulation layer formed on the surface of the substrate, a conductive portion formed on the insulation layer and positioned to cover the trench portion, and a via conductor connecting the conductive portion and one of the lower electrode and the upper electrode. | 01-26-2012 |
20120024578 | Organic-Inorganic Nanocomposite Materials And Methods Of Making And Using The Same - The present invention relates to materials comprising organic-inorganic polymeric networks. In some embodiments, the present invention provides an organic-inorganic composite material comprising an inorganic metal oxide matrix interpenetrating with a polymeric phase. Additionally, the present invention provides methods of producing organic-inorganic composite materials. | 02-02-2012 |
20120031653 | Printed Circuit Board made from a Composite Material - Disclosed is a multilayer material in which at least two components are jointed to each other via an adhesive bond. The adhesive bond is formed by an adhesive or bonding layer containing nanofiber material in a matrix that is suitable as an adhesive. | 02-09-2012 |
20120031654 | CAPACITOR STRUCTURE WITH RAISED RESONANCE FREQUENCY - A dual-port capacitor structure includes a first electrode plate having a first opening; a second electrode plate having a second opening; and a third electrode plate, disposed in the first opening of the first electrode plate and the second opening of the second electrode plate. The first electrode plate, the second electrode plate and the third electrode plate locate on the same plane. | 02-09-2012 |
20120037407 | Electronic Apparatus and Method of Manufacturing the Same - It has been found out that, among transparent conductive layers, a zinc oxide layer has a function of preventing diffusion of sodium. An electronic apparatus is obtained which uses the zinc oxide layer as an electrode of the electronic apparatus and also as a diffusion preventing layer for preventing diffusion of sodium from a glass substrate. | 02-16-2012 |
20120061128 | PHOTOSENSITIVE RESIN, CURABLE RESIN COMPOSITION CONTAINING THE SAME, DRY FILM THEREOF, AND PRINTED CIRCUIT BOARD USING THEM - A carboxyl group-containing photosensitive resin is obtained by reacting an α,β-ethylenically unsaturated group-containing monocarboxylic acid (c) with a phenolic compound (a) containing the structure represented by the following general formula (I) and having at least two phenolic hydroxyl groups in its molecule, wherein part or the whole of the phenolic hydroxyl groups being modified into an oxyalkyl group, and further reacting a polybasic acid anhydride (d) with the resultant reaction product; | 03-15-2012 |
20120067625 | SUSPENSION BOARD WITH A CIRCUIT FOR USE IN A HARD DISK DRIVE - A suspension board with a circuit for use in a hard disk drive shows a small change in PSA (attitude angle) relative to a change in humidity and can support a slider including a magnetic head in a stable and highly precise manner. The suspension board with a circuit for use in a hard disk drive includes a substrate made of metal, an undercoat insulating layer provided on the substrate made of metal, a conductive layer provided on the undercoat insulating layer | 03-22-2012 |
20120067626 | PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT BOARD WITH METAL SUPPORT USING THE SAME - A photosensitive resin composition contains a component (A) and at least one of a component (B) and a component (C). In addition, in the circuit board with metal support including: a metal support; a base insulating layer; a conductive layer formed of a wiring circuit pattern; and a cover insulating layer, at least one of the above-mentioned base insulating layer and cover insulating layer is made of the above-mentioned photosensitive resin composition.
| 03-22-2012 |
20120067627 | Circuit Carrier and Method for Producing a Circuit Carrier - A circuit carrier is disclosed that includes a base body having two flat sides and a plurality of narrow sides, a first conductor track applied to a first flat side of the base body, and a leadframe arranged in the interior of the base body. A method for producing the circuit carrier is also disclosed. | 03-22-2012 |
20120073865 | CARRIER MEMBER FOR TRANSMITTING CIRCUITS, CORELESS PRINTED CIRCUIT BOARD USING THE CARRIER MEMBER, AND METHOD OF MANUFACTURING THE SAME - A carrier member for transmitting circuits, which is a component of a coreless printed circuit board having circuit patterns embedded therein, and which can be used to provide a high-density and highly reliable printed circuit board by forming protrusions only on the lower ends of the circuit patterns, a coreless printed circuit board using the carrier member, and methods of manufacturing the carrier member and the coreless printed circuit board. | 03-29-2012 |
20120097434 | ELECTROCONDUCTIVE ELEMENT, ELECTROCONDUCTIVE ELEMENT MANUFACTURING METHOD, WIRING ELEMENT, INFORMATION INPUT DEVICE, DISPLAY DEVICE, AND ELECTRONIC APPARATUS - An electroconductive element includes a substrate having a first wavy surface and a second wavy surface, and an electroconductive layer formed on the first wavy surface, wherein the electroconductive layer forms an electroconductive pattern, and the first wavy surface and the second wavy surface satisfy the following relationship: 0≦(Am1/λm1)<(Am2/λm2)≦1.8. Am1 is a mean amplitude of vibrations of the first wavy surface, Am | 04-26-2012 |
20120097435 | PHOTOSENSITIVE MODIFIED POLYIMIDE RESIN COMPOSITION AND USE THEREOF - Disclosed are: a photosensitive modified polyimide resin composition having photo-fabrication property, which is excellent in the electric properties and adhesion as well as in the heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; a resin film formed from the composition; and a printed circuit board, flexible printed circuit board (FPC) and the like which comprises the film as an insulating protective film and/or interlayer insulation film. The photosensitive modified polyimide resin composition comprises a modified polyimide of a specific structure having a flexible structure such as polycarbonate; a photosensitizer; a curing agent; and a solvent. | 04-26-2012 |
20120118617 | Transparent Conductive Composite Films - A process for the manufacture of a transparent conductive film comprising: (i) a polymeric substrate comprising a polymeric base layer and a polymeric binding layer, wherein the polymeric material of the base layer has a softening temperature T | 05-17-2012 |
20120132460 | LAMINATED WIRING BOARD - In a multilayer wiring board 1, a low resistance silicon substrate | 05-31-2012 |
20120138344 | PRINTED CIRCUIT BOARD - A printed circuit board is constructed from various woven fiberglass fabrics, strengthened and bound together with epoxy resin, and includes a signal layer. The signal layer includes a positive differential signal line and a negative differential signal line laid out in parallel following a zig-zag pattern. A first distance and a second distance is designed at a ratio of 1:7. The first distance is a perpendicular distance between a highest point of the negative differential signal line and a reference line formed by connecting all lowest points of the negative differential signal line. The second distance is a perpendicular distance between a lowest point and an adjacent highest point of the negative differential signal line along the direction of the reference line. | 06-07-2012 |
20120138345 | ADHESIVE COMPOSITION, ADHESIVE FILM AND WIRING FILM USING THE SAME - An adhesive composition comprises 10 to 100 parts by weight of a first maleimide compound having a plurality of maleimide groups in a structure and having a melting temperature of 160° C. or lower and a gelling time at 200° C. of 180 to 350 seconds and/or a second maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 250° C. of 110 to 150 seconds based on 100 parts by weight of a phenoxy resin having a bisphenol S skeleton in a structure. A heat resistant adhesive film formed by coating the adhesive composition on a substrate film, and a wiring film having a conductor wiring layer put between heat resistant adhesive films are also disclosed. | 06-07-2012 |
20120138346 | WIRING BOARD, ELECTRONIC COMPONENT EMBEDDED SUBSTRATE, METHOD OF MANUFACTURING WIRING BOARD, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED SUBSTRATE - A wiring board or an electronic component embedded substrate includes a substrate that includes a resin containing a plurality of fillers; and a via that is electrically connected to at least one interconnect provided to the substrate, wherein the via includes a mix area in which metal is provided between the fillers on an inner radial side with respect to the substrate. A method of manufacturing a wiring board or an electronic component embedded substrate includes preparing a substrate that includes a resin containing a plurality of fillers; forming a via formation hole in the substrate; performing an ashing process on at least an inner wall of the via formation hole; and performing electroless plating an the inner wall of the via formation hole. | 06-07-2012 |
20120160547 | CORELESS LAYER BUILDUP STRUCTURE - A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. | 06-28-2012 |
20120168208 | SYSTEM AND METHOD OF FORMING A MECHANICAL SUPPORT FOR AN ELECTRONIC COMPONENT ATTACHED TO A CIRCUIT BOARD - A system and method for supporting an electronic component attached to a circuit board. Solder paste is applied to a solder pad underneath and aligned with a non-wetting region of an electronic component to form a support formed of solder to prevent electronic component lead flexing. The amount of solder for forming the support and the size of the solder pad are selected to bring the support into contact with, or in close proximity to, the non-wetting region. | 07-05-2012 |
20120168209 | CERAMIC CIRCUIT BOARD AND PROCESS FOR PRODUCING SAME - According to one embodiment, a ceramic circuit board includes a ceramic substrate, a copper circuit plate and a brazing material protrudent part. The copper circuit plate is bonded to at least one surface of the ceramic substrate through a brazing material layer including Ag, Cu, and Ti. The brazing material protrudent part includes a Ti phase and a TiN phase by 3% by mass or more in total, which is different from the total amount of a Ti phase and a TiN phase in the brazing material layer that is interposed between the ceramic substrate and the copper circuit plate. The number of voids each having an area of 200 μm | 07-05-2012 |
20120175155 | Printed Wiring Board And A Method Of Production Thereof - A printed wiring board has an insulating resin substrate having a first surface and a second surface, the insulating resin substrate having one or more penetrating-holes passing through the insulating resin substrate from the first surface to the second surface, a first conductor formed on the first surface of the insulating resin substrate, a second conductor formed on the second surface of the insulating resin substrate, and a through-hole conductor structure formed in the penetrating-hole of the insulating resin substrate and electrically connecting the first conductor and the second conductor. The penetrating-hole has a first portion having an opening on the first surface and a second portion having an opening on the second surface. The first portion and the second portion are connected such that the first portion and the second portion are set off from each other. | 07-12-2012 |
20120186861 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a substrate having an opening portion and having a first surface and a second surface on the opposite side of the first surface, and an electronic component having a third surface and a fourth surface on the opposite side of the third surface and positioned in the opening portion of the substrate such that the third surface faces the same direction as the first surface of the substrate. The electronic component has a curved surface joining the fourth surface and a side surface of the electronic component, and the opening portion of the substrate has a tapered portion formed by a tapered surface of the substrate joining an inner wall of the opening portion and the first surface and tapering from the first surface toward the second surface. | 07-26-2012 |
20120193130 | ELECTRICAL FUNCTIONAL LAYER, PRODUCTION METHOD AND USE THEREOF - Transparent electrically conductive functional layer, production process and use thereof. | 08-02-2012 |
20120199383 | SUBSTRATE FOR PRINTED WIRING AND RESIN COMPOSITION USED THEREFOR - There are provided a substrate for printed wiring excellent in light transmission property, heat resistance, mechanical strength and resistance to thermal coloration; a printed wiring laminate; and a resin composition used to produce the substrate and the laminate. The substrate for printed wiring comprises an aromatic polyether-typed polymer having a glass transition temperature, as measured by differential scanning calorimetry (DSC, heating rate: 20° C./minute), of from 230° C. to 350° C. | 08-09-2012 |
20120205145 | MULTILAYER SUBSTRATE AND MANUFACTURING METHOD THEREOF - A multilayer substrate includes a plurality of stacked thermoplastic resin layers each including an in-plane conductive pattern provided on one principal surface thereof and an interlayer conductive portion arranged to penetrate through the thermoplastic resin layer in a thickness direction. The plurality of thermoplastic resin layers include a first thermoplastic resin layer and a second thermoplastic resin layer, a stacking direction of which is inverted with respect to a stacking direction of the first thermoplastic resin layer. The second thermoplastic resin layer is thicker than the first thermoplastic resin layer. One end in the thickness direction of the interlayer conductive portion provided in the second thermoplastic resin layer is connected with the interlayer conductive portion of the thermoplastic resin layer adjacent to the second thermoplastic resin layer in the thickness direction such that the in-plane conductive pattern is not interposed therebetween. | 08-16-2012 |
20120211266 | WIRING BOARD AND MANUFACTURING METHOD THEREOF - The present invention is to provide a wiring board which can prevent whitening. The wiring board is made of a fiber reinforced resin plate, and has a through hole and a whitening prevention portion. The whitening prevention portion is made only with matrix resin forming the fiber reinforced resin plate, and is integrally formed in the fiber reinforced resin plate. Furthermore, the whitening prevention portion is arranged around the through hole. | 08-23-2012 |
20120211267 | PRINTED CIRCUIT BOARD SUBSTRATE - A printed circuit board substrate includes a metal-clad substrate and a number of N spaced circuit substrates arranged on the metal-clad substrate along an imaginary circle, and N is a natural number greater than 2. The circuit substrates are equiangularly arranged about the center of the circle, and each of the circuit substrates is oriented 360/N degrees with respect to a neighboring printed circuit board. | 08-23-2012 |
20120217046 | CONDUCTIVE SUBSTRATE FOR FORMATION OF LED PACKAGE STRUCTURES THEREON - A plurality of conductive areas is formed on a conductive substrate which includes a frame. Each of the conductive areas includes a lead frame and two electrodes. The frame includes a first side and an opposite second side. The lead frame includes first and second lead frame beams. The first and second lead frame beams extend from the first side toward the second side to connect with the two electrodes. The first and second electrodes extend respectively from the first and second lead frame beams. Each conductive area also includes a supporting portion interconnecting the electrodes and the frame to reinforce the connection between the frame and the conductive area so that the conductive area can sustain a pressure when an insulation shell is injection molded on the conductive area. | 08-30-2012 |
20120217047 | METAL-BASED CIRCUIT BOARD - A metal-based circuit board, which reduces the influence of thermal expansion, is provided having a structure where an insulating layer A having a large coefficient of thermal expansion is sandwiched between insulating layers B having a small coefficient of thermal expansion. Such a structure allows the insulating layers B to contract and expand so as to suppress contraction and expansion of the insulating layer A and thereby reduce the stress in the direction of negating the stress. As a result, while warpage or distortion is suppressed to be minimal, the bonding strength of the upper and the lower layer is maintained, and degree of freedom for circuit design is not impaired, thereby providing a highly reliable circuit structure. | 08-30-2012 |
20120222890 | CONDUCTIVE SUBSTRATE AND PROCESS FOR PRODUCING SAME - Provided are a conductive substrate which can be produced from inexpensive materials at a lower temperature than those for conventional substrates, and a process for producing the conductive substrate. The conductive substrate comprises a substrate ( | 09-06-2012 |
20120222891 | ELECTRONIC DEVICE AND NOISE SUPPRESSION METHOD - A first interconnect substrate includes a first conductor pattern. A second interconnect substrate includes a second conductor pattern. At least a portion of the second conductor pattern is formed in a region opposite the first conductor pattern. At least either the first conductor pattern or the second conductor pattern has a repeated structure. The first conductor pattern and the second conductor pattern constitute at least a portion of an electromagnetic band gap (EBG) structure. | 09-06-2012 |
20120234581 | Percolative Conductive Network and Conductive Polymer Composite - A percolative conductive network includes bundles of carbon nanotubes and clusters of conductive particles arranged on a substrate. A plurality of the bundles include one or more points of contact with at least one adjacent bundle to form a carbon nanotube network, and the clusters of conductive particles separate the bundles in regions between the points of contact. At least a portion of the clusters form conductive pathways between adjacent bundles, and the carbon nanotube network and the conductive pathways define a percolative conductive network on the substrate. | 09-20-2012 |
20120234582 | MUTUAL CAPACITANCE AND MAGNETIC FIELD DISTRIBUTION CONTROL FOR TRANSMISSION LINES - Magnetic field distribution and mutual capacitance control for transmission lines are provided. A first circuit board is fabricated by attaching a reference plane layer to a dielectric material layer, and attaching a first trace to the second surface of the dielectric material. A surface profile of the reference plane layer is modified to decrease a resistance of a return current signal path through the reference plane layer, to reduce a magnetic field coupling between the first trace and a second trace. A second circuit board is fabricated by attaching a reference plane layer to a dielectric material layer, attaching a trace to the dielectric material, and forming a solder mask layer on the dielectric material layer over the trace. An effective dielectric constant of the solder mask layer is modified to reduce or increase a mutual capacitance between the first trace and a second trace on the dielectric material. | 09-20-2012 |
20120234583 | METHOD FOR PRODUCING A CERAMIC COMPONENT, CERAMIC COMPONENT AND COMPONENT ASSEMBLY - The invention relates to a method for producing a ceramic component, a ceramic component, and a component assembly having a ceramic component and a connection component. The method according to the invention for producing a ceramic component ( | 09-20-2012 |
20120241200 | CIRCUIT BOARD, MANUFACTURING METHOD OF CIRCUIT BOARD, SUSPENSION SUBSTRATE, SUSPENSION, DEVICE-MOUNTED SUSPENSION, AND HARD DISK DRIVE - The problem of the present invention is to provide a circuit board comprising a shape retention unit capable of thinning while maintaining mechanical strength. The present invention solves the above-mentioned problem by providing a circuit board comprising a metal supporting substrate, a first insulating layer formed on the above-mentioned metal supporting substrate, and a wiring layer formed on the above-mentioned first insulating layer, wherein an open area is formed in the above-mentioned metal supporting substrate, and the circuit board comprises a shape retention unit having a second insulating layer contacting with the above-mentioned metal supporting substrate and a reinforcing layer formed on the above-mentioned second insulating layer, and bridging the above-mentioned metal supporting substrate divided by the above-mentioned open area. | 09-27-2012 |
20120255765 | ELECTRODE AND METHOD FOR MANUFACTURING THE SAME - Disclosed is an electrode, including a conductive layer containing a conductive component selected from the group consisting of copper, nickel, iron, cobalt, titanium, lead, aluminum, tin, and alloys comprising one of these metals as the principal ingredient thereof, and an oxidation protection layer containing boron oxide, said oxidation protection layer covering the top surface of the conductive layer, or covering both the top surface and the sides of the conductive layer, or covering all locations where the conductive layer has been formed; the electrode being formed by air firing the conductive layer and the oxidation protection layer simultaneously. | 10-11-2012 |
20120261168 | METHOD FOR FABRICATING ELECTRICAL CIRCUITRY ON ULTRA-THIN PLASTIC FILMS - In accordance with the teachings of one embodiment of the present disclosure, a method of forming high-density metal interconnects on flexible, thin-film plastic includes laminating a dry photoresist layer to a substrate. The photoresist-laminated substrate is baked. An assembly is formed by laminating a plastic film to the baked, photoresist-laminated substrate. One or more electrically conductive interconnect layers are processed on a first surface of the laminated plastic film. The processing of the one or more electrically conductive interconnects includes photolithography. The assembly is baked and soaked in a liquid. The processed plastic film is then separated from the substrate. | 10-18-2012 |
20120261169 | INTERCONNECT-USE ELECTRONIC COMPONENT AND METHOD FOR PRODUCING SAME - The present invention enables additional processes required for forming vertical wiring and rewiring in a double face package (DFP) or a wafer level chip size package (WLCSP) to be implemented through use of a component for vertical wiring and rewiring, to thereby simplify the manufacturing process and reduce cost. An electronic component for interconnection is incorporated into an electronic device package in which a circuit element including a semiconductor chip is disposed and which has external electrodes connected to the circuit element via vertical interconnects and horizontal interconnects. This electronic component for interconnection is composed of a wiring substrate which includes horizontal interconnects and vertical interconnects connected to the horizontal interconnects and extending therefrom in a vertical direction; and a support plate to which the wiring substrate having the horizontal interconnects and the vertical interconnects is bonded through use of an adhesive which can be separated with water. | 10-18-2012 |
20120261170 | ELECTRONIC DEVICE HAVING BACKBOARD ASSEMBLY - An electronic device includes a printed circuit board, an electronic element, and a backboard assembly. The printed circuit board defines a plurality of first through holes. The electronic element is mounted on a top surface of the printed circuit board. The backboard is assembly secured to a bottom surface of the printed circuit board. The backboard assembly includes a back plate, an electrically insulative sheet, and a connection element. The electrically insulative sheet defines a plurality of second through holes. The connection element includes a plurality of first engaging structures on a first side thereof to engage with the back plate and a plurality of first clasps on a second side of the connection element opposing to the first side to engage with the electrically insulative sheet. | 10-18-2012 |
20120261171 | ANISOTROPIC CONDUCTIVE FILM, JOINED STRUCTURE, AND CONNECTING METHOD - To provide an anisotropic conductive film, which contains: an electric conductive layer containing Ni particles, metal-coated resin particles, a binder, a polymerizable monomer, and a curing agent; and an insulating layer containing a binder, a monofunctional polymerizable monomer, and a curing agent, wherein the metal-coated resin particles are resin particles each containing a resin core coated at least with Ni. | 10-18-2012 |
20120267149 | METHOD OF MANUFACTURING POWER MODULE SUBSTRATE AND POWER MODULE SUBSTRATE - [Task] To provide a method of manufacturing a power module substrate and a power module substrate in which multilayers of ceramic substrates and metal plates are laminated, the metal plates on both sides of the ceramic substrates can be in a connected state, and, furthermore, separation between the ceramic substrate and the metal plate, cracking in the ceramic substrates, and the like do not easily arise. | 10-25-2012 |
20120273260 | SYSTEMS AND METHODS FOR COMPOSITE STRUCTURES WITH EMBEDDED INTERCONNECTS - A composite interconnect assembly includes a body structure formed from a composite material (e.g., a carbon graphite material) with one or more conductive traces embedded therein (e.g., a copper or copper alloy). One or more contact regions are provided such that the conductive traces are exposed and are configured to mechanically and electrically connect to one or more electronic components. The body structure may have a variety of shapes, including planar, cylindrical, conical, and the like. | 11-01-2012 |
20120273261 | CIRCUIT SUBSTRATE HAVING A CIRCUIT PATTERN AND METHOD FOR MAKING THE SAME - A circuit substrate includes: an insulative substrate formed with a pattern of a recess, the recess being defined by a recess-defining wall that has a bottom wall surface and a surrounding wall surface extending upwardly from the bottom wall surface; a patterned metallic layer structure including at least a patterned active metal layer disposed within the recess, formed on the bottom wall surface of the recess-defining wall, and spaced apart from the surrounding wall surface of the recess-defining wall, the patterned active metal layer containing an active metal capable of initiating electroless plating; and a primary metal layer plated on the patterned metallic layer structure. | 11-01-2012 |
20120279764 | ELECTROLESS PLATING PERFORMANCE OF LASER DIRECT STRUCTURING MATERIALS - Thermoplastic compositions that are capable of being used in a laser direct structuring process to provide enhanced plating performance and good mechanical properties. The compositions of the present invention include a thermoplastic base resin, a laser direct structuring additive and a white pigment. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cell phone antennas and other such communications equipment, medical applications, RFID applications, and automotive applications. | 11-08-2012 |
20120279765 | CIRCUIT BOARD AND METHOD OF MANUFACTURING THEREOF - A method of manufacturing a circuit board includes: forming a first through hole in a core material; forming a first conductive film on an inner wall of the first through hole; forming an insulating layer on both surfaces of the core material and in the first through hole; forming a second through hole in the insulating layer in the first through hole; forming a second conductive film on an inner wall of the second through hole; and forming, on surfaces of the insulating layers formed on the both surfaces of the core material, a signal circuit layer electrically connected to the second conductive film. | 11-08-2012 |
20120305296 | LOW TEMPERATURE CO-FIRED CERAMIC STRUCTURE FOR HIGH FREQUENCY APPLICATIONS AND PROCESS FOR MAKING SAME - Disclosed herein is a multilayer low temperature co-fired ceramic (LTCC) structure comprising a multilayer low temperature co-fired ceramic comprising glass-ceramic dielectric layers with screen printed thick film inner conductors on portions of the layers and with thin film outer conductors deposited on the upper and lower outer surfaces of the LTCC. At least a portion of the thin film outer conductors is patterned in the form of lines and the spacings between the lines are less then 50 μm. Also disclosed is a process for making the LTCC structure. | 12-06-2012 |
20120305297 | METHOD FOR MANUFACTURING SOLDER COLUMN, APPARATUS FOR MANUFACTURING SOLDER COLUMN, AND SOLDER COLUMN - Solder wires are conveyed from insert openings for allowing the solder wires to be inserted toward discharge openings from which the solder wires are discharged and the solder wires project. The projecting wires are cut with first cutting blades and the solder inserted into the insert openings are cut with second cutting blades. This enables fixed cutting stress on a portion of the solder wires to be cut with the first cutting blades and a portion of the solder wires to be cut with the second cutting blades at the same time to prevent deformation of the cut surface of the cut solder wires. Solder columns having a column shape and having a uniform length along a conveying direction thereof can be manufactured. | 12-06-2012 |
20120312587 | PATTERNED CONDUCTIVE ELEMENT - A patterned conductive element includes a substrate having a surface, an adhesive layer located on the surface, and a patterned carbon nanotube layer located on the adhesive layer. Part of the patterned carbon nanotube layer is embedded in the adhesive layer, and the other part of the patterned carbon nanotube layer is exposed from the adhesive layer. | 12-13-2012 |
20120318566 | DISK WITH AN ELECTRICAL CONNECTION ELEMENT - The present invention relates to a disk with an electrical connection element, having a substrate with a first coefficient of thermal expansion, an electrically conductive structure on a region of the substrate, and a connection element with a second coefficient of thermal expansion. | 12-20-2012 |
20120325529 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a first substrate portion including a first feed-through conductor portion in a vertical direction, a second substrate portion provided on the first substrate portion and including a second feed-through conductor portion in a vertical direction of a corresponding part to the first feed-through conductor portion, and a feed-through electrode including the first feed-through conductor portion and the second feed-through conductor portion. | 12-27-2012 |
20130000958 | MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a multilayer ceramic substrate and a method for manufacturing the same. In a method for manufacturing the multilayer ceramic substrate, which has a ceramic laminate including multiple ceramic layers and allowing interconnection between layers through vias respectively formed in the multiple ceramic layers, the method includes: preparing a ceramic laminate in which a void is formed around a via in at least one ceramic layer of multiple ceramic layers; immersing the ceramic laminate in a precipitating bath in which an electrode solution is contained; putting the ceramic laminate out of the precipitating bath after a predetermined period of time, and then removing a nanoparticle film stacked on a surface of a multilayer ceramic substrate; and applying heat to the multilayer ceramic substrate to form nanoparticles filling an inside of the void, after the removing of the nanoparticle film. | 01-03-2013 |
20130008699 | BALL-LIMITING-METALLURGY LAYERS IN SOLDER BALL STRUCTURES - A structure. The structure includes: a first dielectric layer which includes a top dielectric surface; an electrically conductive line on the first dielectric layer; a second dielectric layer on the first dielectric layer and the electrically conductive line; a ball-limiting-metallurgy (BLM) region on the second dielectric layer and the electrically conductive line such that the BLM region is electrically connected to the electrically conductive line; and a solder ball on the BLM region. The BLM region has a characteristic that a length of the longest straight line segment which is parallel to the top dielectric surface and is entirely in the BLM region does not exceed a pre-specified maximum value, wherein the pre-specified maximum value is at most one-half of a maximum horizontal dimension of the BLM region measured in a horizontal direction parallel to the top dielectric surface. | 01-10-2013 |
20130014976 | WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF - [Purpose] To provide a wired circuit board in which it is possible to inhibit a conductive adhesive from leaking to the outside, while inhibiting terminals from being increased in size, and also improve connection reliability. | 01-17-2013 |
20130020111 | SUBSTRATE FOR POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a substrate for a power module package and a method for manufacturing the same, including: a base substrate made of a metal material; an anodized layer formed on the base substrate; and a circuit layer formed on the anodized layer, wherein the anodized layer is formed to correspond to circuit patterns on the circuit layer or is formed to be divided into a plurality of areas. | 01-24-2013 |
20130020112 | WIRED CIRCUIT BOARD - A wired circuit board includes an insulating layer, and a conductive layer formed on the insulating layer. The insulating layer includes a first insulating layer, and a second insulating layer formed on the first insulating layer. The conductive layer includes a first conductive pattern, and a second conductive pattern. The first conductive pattern includes a first connecting portion formed on the first insulating layer and under the second insulating layer, and at least one pair of first terminals configured continuously to the first connecting portion so as to electrically connect to an external electronic element and spaced apart from each other to allow the electronic element to extend therebetween. The second conductive pattern includes a second connecting portion formed on the second insulating layer, and a second terminal configured continuously to the second connecting portion so as to electrically connect to a magnetic head provided on an external slider. | 01-24-2013 |
20130032382 | HERMETIC FEEDTHROUGH - A feedthrough includes a sheet having a hole, where the sheet includes a first material that is a ceramic comprising alumina. The feedthrough further includes a second material substantially filling the hole. The second material is different than the first material and includes platinum and an additive that includes alumina. The first and second materials have a co-fired bond therebetween that hermetically seals the hole. | 02-07-2013 |
20130032383 | THIN FILM ELECTRODE CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; one or more anti-etching metal layers formed in a surface of the ceramic substrate; thin film electrode pattern formed on the anti-etching metal layers; and a plating layer formed on the thin film electrode pattern, wherein respective edge portions of the thin film electrode pattern are contacted with the anti-etching metal layer, and thus, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented and the binding strength of the entire thin film electrode pattern can be enhanced, resulting in securing durability and reliability of the thin film electrode patterns. | 02-07-2013 |
20130032384 | THIN FILM ELECTRODE CERAMIC SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a thin film electrode ceramic substrate and a method for manufacturing the same. The thin film electrode ceramic substrate includes: a ceramic substrate; a thin film electrode pattern formed on the ceramic substrate; and a plating layer formed on the thin film electrode pattern, wherein the plating layer is formed above the thin film electrode pattern and on both lateral surfaces of the thin film electrode pattern. According to the present invention, an undercut defect occurring between the surface of the ceramic substrate and the thin film electrode pattern and between the thin film electrode patterns due to an etchant can be prevented, by forming a plating layer above the thin film electrode pattern or on both lateral surfaces of the thin film electrode pattern, or forming an intaglio type anti-etching metal layer in the surface of the ceramic substrate. | 02-07-2013 |
20130037311 | FUNCTIONALIZATION OF THERMAL MANAGEMENT MATERIALS - A base material or composite material such as graphite, may be combined with another material, such as aluminum oxide or polyimide, to produce a new insulating thermal management material. The base material may be impregnated with another metal to create a composite base material. | 02-14-2013 |
20130048349 | TRANSPARENT CONDUCTIVE FILM AND TOUCH PANEL USING THE SAME - A transparent conductive film includes at least one continuous transparent conductive layer and a number of transparent conductive stripes spaced from each other and extending substantially along a low impedance direction. The transparent conductive stripes are disposed on and electrically contact a surface of the at least one transparent conductive layer. A resistivity of the transparent conductive film in the low impedance direction is less than the resistivity in any other direction. A touch panel includes the transparent conductive film. | 02-28-2013 |
20130048350 | BASE MEMBER - A base member includes: a core layer including: a plate-like body, made of aluminum oxide; and plural linear conductors, which penetrate through the plate-like body in a thickness direction of the plate-like body; a bonding layer, formed on at least one of a first surface and a second surface of the core layer; and a silicon layer or a glass layer, formed on the bonding layer. | 02-28-2013 |
20130056250 | Method for Manufacturing a Double-Sided Printed Circuit Board - Disclosed is a method for manufacturing a double-sided printed circuit board (PCB) having a circuit pattern by printing a conductive paste. According to the method of the present invention, a circuit pattern that is precise and highly conductive can be formed, and a reduction in raw materials and the simplification of processes are made possible. Also, due to the printing of the conductive paste, short-circuit can be prevented even when a conductive layer is bent or exposed to heat or physical impact. | 03-07-2013 |
20130062103 | COMPOSITE STRUCTURE, SOLID FILM, AND METHOD FOR PRODUCING THE COMPOSITE STRUCTURE - In the case where a coating film is formed on a curved outer peripheral surface of a base body from a slurry through a wet process, when pseudoplasticity is imparted to the slurry, the slurry exhibits favorable film formability, and the coating film formed on the curved surface exhibits favorable shape stability. A solid film obtained through solidification of the coating film is formed such that the following relation is satisfied: t | 03-14-2013 |
20130062104 | RESONANT MATERIAL LAYER APPARATUS, METHOD AND APPLICATIONS - A resonant structure and a method for fabricating the resonant structure each include a substrate that includes at least one cavity. The resonant structure and the method for fabricating the resonant structure also include a resonant material layer located and formed over the substrate and at least in-part covering the at least one cavity. The resonant structure may comprise a graphene resonator structure. | 03-14-2013 |
20130068510 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING VIAS AND FINE CIRCUIT AND PRINTED CIRCUIT BOARD MANUFACTURED USING THE SAME - Provided is a method of manufacturing a circuit which includes: (a) providing a substrate made of a conductive material; (b) etching a first surface of the substrate excluding a region in which at least one via is to be formed; (c) etching a region of the etched first surface of the substrate in which an insulated portion of a first circuit is to be formed; (d) stacking a first insulation layer in spaces formed by the etching performed in operations (b) and (c); and (e) grinding a second surface of the substrate to expose the first insulation layer outward along with the first circuit, thereby forming a circuit board. | 03-21-2013 |
20130075136 | RESIN COMPOSITION AND PREPREG, LAMINATE AND CIRCUIT BOARD THEREOF - A resin composition comprises (A) 100 parts by weight of cyanate ester resin; (B) 5 to 25 parts by weight of nitrogen and oxygen containing heterocyclic compound; (C) 5 to 75 parts by weight of polyphenylene oxide resin; and (D) 5 to 100 parts by weight of oligomer of phenylmethane maleimide. By using specific components at specific proportions, the resin composition of the invention offers the features of low dielectric constant and low dissipation factor and can be made into prepreg that may be used in printed circuit board. | 03-28-2013 |
20130075137 | METHOD TO MAKE A MULTILAYER CIRCUIT BOARD WITH INTERMETALLIC COMPOUND AND RELATED CIRCUIT BOARDS - A method is for making a multilayer circuit board from circuit board layers, each including a dielectric layer and conductive traces thereon including a first metal. The method includes forming a through-via in a first circuit board layer, plating the through-via with the first metal, and coating a second metal onto the first metal of the first circuit board layer, the plated through-via, and the first metal. The method also includes aligning the first and second circuit board layers together so that the plated through-via of the first circuit board layer is adjacent a feature on the second circuit board layer, and heating and pressing the aligned first and second circuit board layers so as to laminate the dielectric layers together and form an intermetallic compound of the first and second metals bonding adjacent metal portions together. | 03-28-2013 |
20130081861 | PRINTED CIRCUIT BOARD, MOUNT STRUCTURE THEREOF, AND METHODS OF PRODUCING THESE - A printed circuit board of the present invention includes a base body, a through-hole that penetrates through the base body in the thickness direction, and a through-hole conductor that covers an inner wall of the through-hole. The base body has a fiber layer including a plurality of glass fibers and a resin that covers the plurality of glass fibers. The glass fibers have a groove-shaped concavity on a surface exposed to the inner wall of the through-hole. The concavity is filled with a part of the through-hole conductor. | 04-04-2013 |
20130081862 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Embodiments of the present invention provide a wiring substrate which is excellent in terms of the reliability of connection between the wiring substrate and a semiconductor chip. In some embodiments the wiring substrate comprises a first build-up layer in which resin insulation layers and conductor layers are laminated alternately. The outermost conductor layer can include a plurality of connection terminal portions to which a semiconductor chip is flip-chip connected. The plurality of connection terminal portions can be exposed through openings of a solder resist layer. Each of the connection terminal portions includes a connection region to which a connection terminal of the semiconductor chip is to be connected, and a wiring region which extends in a planar direction from the connection region and which is narrower than the connection region. The surface of the wiring region has a solder wettability lower than that of the surface of the connection region. | 04-04-2013 |
20130098666 | RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD INCLUDING THE SAME - There is provided a resin composition for a printed circuit board, including 100 parts by weight of a liquid crystal oligomer shown in a predetermined Formula; and 10 to 40 parts by weight of a rubber-modified epoxy resin. | 04-25-2013 |
20130112459 | LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE - A laminate body containing at least two glass substrate layers and at least one inner resin composition layer existing between the adjacent two glass substrate layers, wherein the inner resin composition layer comprises an inner resin composition that contains a thermosetting resin and an inorganic filler. A laminate plate containing at least two glass substrate layers and at least one inner cured resin layer existing between the adjacent two glass substrate layers, wherein the inner cured resin layer comprises a cured product of an inner resin composition that contains a thermosetting resin and an inorganic filler. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing the laminate plate, which comprises a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate. | 05-09-2013 |
20130112460 | LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE - A laminate body containing at least one resin composition layer and at least one glass substrate layer, wherein the resin composition layer comprises a resin composition containing a thermosetting resin and an inorganic filler and the glass substrate layer accounts for from 10 to 95% by volume of the entire laminate body. A laminate plate containing at least one cured resin layer and at least one glass substrate layer, wherein the cured resin layer comprises a cured product of a resin composition that contains a thermosetting resin and an inorganic filler and the glass substrate layer accounts for from 10 to 95% by volume of the entire laminate plate. A printed wiring board having the laminate plate and a wiring provided on the surface of the laminate plate. A method for producing the laminate plate comprising a cured resin layer forming step of forming a cured resin layer on the surface of a glass substrate. | 05-09-2013 |
20130112461 | CERAMIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A ceramic substrate includes: a substrate body formed by laminating a plurality of ceramic layers and including a first and second opposing principal surfaces and a peripheral portion having a positioning portion; a first conductor pad formed on the first principal surface; a second conductor pad formed on the second principal surface and having a diameter smaller than that of the first conductor pad. The positioning portion includes first and second through holes that individually pass through respective ceramic layers and are connected to each other in an axial direction. The first through hole passes through the first principal surface. The second through hole passes through the second principal surface and has a cross-sectional area that is smaller than that of the first through hole. At least apart of a peripheral edge of a ceramic layer defining the second through hole is visible through the first through hole. | 05-09-2013 |
20130126217 | EPOXY RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD - Disclosed is an epoxy resin composition comprising: (A) a polymerized compound including, as structural components, phosphaphenanthrene and at least one constituent selected from a structural unit of a phenolic novolak polymer and a structural unit of a phenolic novolak polymer in which a hydrogen atom of a phenolic hydroxyl group is substituted by phosphaphenanthrene; (B) an epoxy resin having two or more epoxy groups in a molecule; and (C) a curing agent that cures the epoxy resin. | 05-23-2013 |
20130126218 | PREPREG, METAL-CLAD LAMINATE, AND PRINTED CIRCUIT BOARD - Provided is a prepreg prepared by impregnating a base material with a resin composition, wherein the resin composition contains aluminum hydroxide having an average particle diameter of 2.5 to 4.5 μm and a glass filler having an average particle diameter of 1.0 to 3.0 μm, a specific gravity of 2.3 to 2.6 g/cm | 05-23-2013 |
20130133932 | METAL PCB HAVING HOLE REFLECTIVE SURFACE AND METHOD FOR MANUFACTURING THE SAME - A metal printed circuit board (PCB) having a hole reflective surface and a method for manufacturing the same, in which a process of forming a reflective surface by performing surface treatment on a metal plate and a process of bonding a PCB having a hole are performed as a single process, thus simplifying the manufacturing process and increasing the applicability of a product. The metal PCB includes a metal plate having a first reflective surface formed on a chip bonding area by surface treatment; a PCB layer stacked on the metal plate and having a hole and a wiring pattern which are formed in the chip bonding area; a second reflective surface formed on the inner side of the hole of the PCB layer; and a dam formed around the hole on the PCB layer. | 05-30-2013 |
20130133933 | TRANSPARENT CONDUCTIVE FILM - A transparent conductive film which comprises: a substrate composed of a non-crystalline polymer film; a first hard coating layer; a first transparent conductor layer; a first metal layer; a second hard coating layer; a second transparent conductor layer; and a second metal layer. The first hard coating layer includes a binder resin and a plurality of particles. And the second hard coating layer includes a binder resin and a plurality of particles. The first metal layer has a plurality of projections on a surface thereof and the second metal layer has a plurality of projections on a surface thereof. | 05-30-2013 |
20130140061 | Touch Window - Disclosed are a technology capable of improving printing properties and a structure of a touch window manufactured by the same. The touch window according to the present invention comprises: a sensing electrode pattern layer formed on a transparent window and including sensing electrodes which are patterned; and wiring parts connected to the sensing electrodes, wherein the touch window further comprises dummy circuit patterns spaced apart from the wiring parts. | 06-06-2013 |
20130140062 | CIRCUIT BOARD STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - A manufacturing method of a circuit board structure includes steps of: providing a circuit board which comprising a metal substrate, a metal layer and a dielectric layer disposed between the metal substrate and the metal layer; forming grooves on the circuit board to expose the metal substrate, the dielectric layer and the metal layer; performing a procedure for connecting metal in the grooves so that the metal substrate and the metal layer being in contact with each other. A structure of circuit board comprises a metal substrate, a dielectric layer and a metal layer. The dielectric layer is formed on the metal substrate, and the metal layer is formed on the dielectric layer; wherein the metal substrate and the metal layer can be in contact with each other at an appropriate position by performing a metal connecting procedure. | 06-06-2013 |
20130140063 | PRINTED CIRCUITS AND METHOD FOR MAKING SAME - A method for making printed circuits and printed circuit boards which includes coating a non-metallized substrate and plating an image of a desired circuit design directly onto the coated substrate without the need to image the circuit design on an intermediate silver halide polyester film or diazo and utilizing existing imaging, developing and etching subtractive techniques in conventional printed circuit board processing. One exemplary embodiment of the method for making printed circuit boards includes coating a non-metallized substrate with a palladium based material including a ferric based solution combined with palladium. | 06-06-2013 |
20130146339 | CIRCUIT BOARD FOR HIGH-CAPACITY MODULES, AND A PRODUCTION METHOD OF THE CIRCUIT BOARD - A circuit board including a substrate having first and second dielectric layers of first and second dielectrics, the second dielectric containing 8 mass % or more of a glass net former component. At least one portion of an inner layer electrode has approximately two principal surfaces parallel to principal surfaces of the circuit board and a thickness of not less than 50 micrometers in a normal direction of the principal surfaces. The inner layer electrode and second dielectric layer contact with each other, and a ratio t/T of sum total thickness t of the second dielectric layer in contact with the inner layer electrode in a normal direction of the principal surface to sum total thickness T of the first dielectric layer in a normal direction of the principal surface is 0.1 or more. | 06-13-2013 |
20130146340 | VIA-HOLED CERAMIC SUBSTRATE, METALIIZED VIA-HOLED CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURING THE SAME - A via-holed ceramic substrate can be manufactured in a simple method by providing a via-holed ceramic substrate comprising: a sintered ceramic substrate; an electroconductive via formed in the sintered ceramic substrate, the electroconductive via having an electroconductive metal closely filled in a through-hole, the electroconductive metal containing a metal (A) having a melting point of 600° C. to 1100° C., a metal (B) having a melting point higher than the melting point of the metal (A), and an active metal; and an active layer formed in the interface between the electroconductive via and the sintered ceramic substrate. | 06-13-2013 |
20130153271 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes a pad exposed from an opening portion of an outermost insulating layer. The pad includes: a first metal layer a surface of which is exposed from the wiring board; a second metal layer provided on the first metal layer and formed of a material effective in preventing a metal contained in a via inside the board from diffusing into the first metal layer; and a third metal layer provided between the second metal layer and the via, and formed of a material harder to be oxidized than that of the second metal layer. The thickness of the third metal layer is relatively thick, and is preferably selected to be three times or greater than a thickness of the second metal layer. A side surface of the third metal layer and a surface of the third metal layer to which the via is to be connected are roughed. | 06-20-2013 |
20130161079 | MULTI-LAYER WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - Embodiments of the presently-disclosed subject matter include a multilayer wiring substrate including a first laminated structure that includes at least one conductive layer and at least one resin insulating layer; a core substrate that includes a reinforced fiber and that is laminated on the first laminated structure; and a second laminated structure that includes at least one conductive layer and at least one resin insulating layer and that is formed on the core substrate; and a plurality of via conductors which penetrate the first laminated structure, the core substrate, and the second laminated structure in the thickness direction, wherein the plurality of via conductors all expand in diameter in one direction, and the reinforced fiber is located above a center of the core substrate in the thickness direction. | 06-27-2013 |
20130168139 | ELASTOMER ADHESIONS - Provided herein are technologies generally relating to creating connections and/or associations. In some examples, the embodiments can relate to a circuit that includes a surface, a first electrical contact that is attached to the surface, a glass substrate, a second electrical contact that is attached to the glass substrate, and at least one elastomer layer. In some embodiments, the elastomer layer can provide or assist in creating a contact between the first electrical contact and the second electrical contact. | 07-04-2013 |
20130168140 | Printed Circuit Board and Method of Manufacturing Same - A method of manufacturing a printed circuit board (PCB) is provided. The method includes defining an area on the PCB to be subjected to a controlled-depth milling. The area includes a warp. The method further includes providing a plurality of positioning holes adjacent to edges of the area of the PCB, installing positioning members in the positioning holes so as to fix the PCB on a flat surface of a table of a milling equipment, and milling the area of the PCB. A PCB is also provided. The PCB includes a controlled-depth area containing patterns and having a surface lower than a surface of the PCB. The PCB further includes a plurality of positioning holes formed adjacent to edges of the controlled-depth area. | 07-04-2013 |
20130168141 | SUBSTRATE WITH THROUGH-ELECTRODE AND METHOD FOR PRODUCING SAME - A method for producing a substrate with through-electrode includes the steps of: forming recesses or through-holes in either one of a silicon substrate and a glass substrate; forming protrusions in the other substrate; laying the silicon substrate and glass substrate on each other so that the protrusions are inserted in the respective recesses or through-holes; and bonding the silicon substrate and the glass substrate to each other. | 07-04-2013 |
20130180765 | LAMINATE BODY, LAMINATE PLATE, MULTILAYER LAMINATE PLATE, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURE OF LAMINATE PLATE - A laminate body containing one or more resin composition layers and two or more glass substrate layers, wherein at least one layer of those resin composition layers is between glass substrate layers, and is a fiber-containing resin composition layer of a composition that contains a thermosetting resin and a fibrous base material. A laminate plate containing one or more cured resin layers and two or more glass substrate layers, wherein at least one layer of those cured resin layers is between glass substrate layers, and is a fiber-containing cured resin layer of the fiber-containing resin composition. A printed wiring board having the above-mentioned laminate plate and a wiring provided on the surface thereof. A method for producing the laminate plate. | 07-18-2013 |
20130180766 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a printed circuit board which includes: a solder pad on which a solder ball is mounted; an insulator formed on the solder pad; and a protrusion formed under the insulator to support the solder ball when mounting the solder ball and can stably mount the solder ball. | 07-18-2013 |
20130180767 | METHOD OF PRODUCTION OF MULTILAYER CIRCUIT BOARD - A method of production of a multilayer circuit board comprising using a curable composition which contains a heat curable resin and curing agent (I) to form an uncured or semicured resin layer on a board (step A), then bringing a curing agent (II) able to substantially to cure the heat curable resin at a temperature at which the curing agent (I) cannot substantially cure the heat curable resin into contact with the surface of the resin layer, then heating the resin layer at a temperature at which the curing agent (I) cannot substantially cure the heat curable resin and the curing agent (II) can substantially cure the heat curable resin (step B), next heating and curing the resin layer at a temperature at which the curing agent (I) can substantially cure the heat curable resin to form an electrical insulating layer (step C). | 07-18-2013 |
20130192882 | WIRING BOARD AND MOUNTING STRUCTURE USING THE SAME - A wiring board of the present invention includes a substrate including a woven fabric formed of a plurality of glass fibers and a resin covering the woven fabric; a plurality of through holes T penetrating through the substrate in a thickness direction thereof; and a plurality of through hole conductors adhered to inner walls of the through holes T respectively. The through holes T include a first through hole and a second through hole, and, in the woven fabric, the number of the glass fibers through which the first through hole penetrates is larger than the number of the glass fibers through which the second through hole penetrates. In the first and second through holes, portions thereof having narrowest widths are surrounded by the woven fabric, and the narrow width portion of the first through hole is smaller than the narrow width portion of the second through hole. | 08-01-2013 |
20130199827 | Mounting Board and Circuit Device Using the Same - A mounting board includes: a core layer made of an insulating resin; a first conductive pattern provided on a front side of the core layer; a second conductive pattern provided on a back side of the core layer; and a via provided between a first electrode for a high current in the first conductive pattern and an external electrode including the second conductive pattern, the external electrode provided so as to correspond to the first electrode, the first conductive pattern and the second conductive pattern having the same film thickness, the via set at a resistance value lower than a resistance value of the first conductive pattern so that the high current flows to the external electrode through the via. | 08-08-2013 |
20130206460 | CIRCUIT BOARD FOR SEMICONDUCTOR DEVICE INSPECTION APPARATUS AND MANUFACTURING METHOD THEREOF - A circuit board for a semiconductor device inspection apparatus can have a small thermal expansion coefficient and high mechanical strength and can be easily manufactured with a reduced manufacturing cost. Furthermore, the circuit board includes a metal base body obtained by stacking and bonding a multiple number of metal plates, each having a through hole formed by an etching, such that the through holes of the metal plates are overlapped with each other to form a through hole; a resin layer formed on surfaces of the metal base body and on an inner wall surface of the through hole of the metal base body; and a conductor pattern formed to be electrically insulated from the metal base body by the resin layer. | 08-15-2013 |
20130213698 | HOLDER FOR SEMICONDUCTOR PACKAGE - A holder includes a main body on which a plurality of circuit lines are laid out. The main body is integrally molded from a plastic material and can be formed thereon with a circuit layout by a specific process, such as a laser activated and chemical plating process. The main body includes a chamber having an opening formed at the top side of the main body, a base surface, and a stepped wall. Each of the circuit lines is arranged on the stepped wall of the chamber stereoscopically. Thus, the holder does not need to make a hole running therethrough to reach electrical connection between surfaces of different heights. Besides, the circuit lines are arranged stereoscopically, so they can extend to the top and bottom sides of the holder. Therefore, the holder can be applied to not only the traditional package but an upside-down package. | 08-22-2013 |
20130213699 | SUBSTRATE WITH BUILT-IN COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A substrate includes a built-in component that suppresses resin flow occurring in the case of thermocompression bonding in a region where vias and wiring conductors are provided and that reduces the occurrence of via defects and wiring-conductor defects. The resin flow occurring in an outer side portion of a frame-shaped electrode is suppressed in the case of thermocompression bonding by encircling the periphery of a built-in component with the frame-shaped electrode. Because of this structure, the occurrence of defects in vias and wiring conductors arranged in an outer side portion of the frame-shaped electrode may be reduced. | 08-22-2013 |
20130213700 | MANUFACTURING METHOD OF ELECTRODE SUBSTRATE - Provided is a manufacturing method of an electrode substrate in which a carbon nanotube is strongly bonded on a base by forming a mixed film of the carbon nanotube and a silicon-based organic and inorganic hybrid polymer. | 08-22-2013 |
20130220679 | COPPER FOIL AND MANUFACTURING METHOD THEREFOR, COPPER FOIL WITH CARRIER AND MANUFACTURING METHOD THEREFOR, PRINTED CIRCUIT BOARD, AND MULTILAYER PRINTED CIRCUIT BOARD - Provided is a copper foil with a carrier capable of realizing wiring at line/space=15 μm/15 μm or less on a printed circuit board on which the copper foil is laminated. Further provided is a printed circuit board or a multilayer printed circuit board capable of realizing fine-pattern wiring at line/space=15 μm/15 μm or less using the copper foil. The copper foil is obtained by forming a release layer and a copper foil in this order on a carrier foil having a surface on which a mean spacing Sm as defined in JIS-B-06012-1994 between irregularities of ridges is 25 μm or more, and peeling off the copper foil from the carrier foil. The copper foil with a carrier is obtained by forming a release layer and a copper foil in this order on a carrier foil that is said copper foil, wherein a spacing between irregularities of ridges on a surface of the carrier foil on which the copper foil is formed is 25 μm or more in a mean spacing Sm as defined in JIS-B-06012-1994. A roughening treatment layer as necessary and a surface treatment layer are formed in this order on a surface of the copper foil. | 08-29-2013 |
20130220680 | PATTERN SUBSTRATE, METHOD OF PRODUCING THE SAME, INFORMATION INPUT APPARATUS, AND DISPLAY APPARATUS - A pattern substrate includes a substrate having a surface on which a first area and a second area are formed, and a pattern layer formed at the first area among the first area and the second area. The pattern layer is a wiring pattern layer or a transparent electrode, the first area has a convex/concave shape where a capillary phenomenon occurs, and the convex/concave shape includes an aggregate of a plurality of structures. | 08-29-2013 |
20130220681 | RESIN COMPOSITION FOR FORMING RECEIVING LAYER, AND RECEIVING SUBSTRATE; PRINTED MATTER, CONDUCTIVE PATTERN, AND ELECTRIC CIRCUIT PRODUCED BY USING THE RESIN COMPOSITION - The present invention provides a resin composition for forming receiving layers that can form a receiving layer having excellent adhesiveness, has a fine-line-forming property and water resistance even when any of a water-based conductive ink and a solvent-based conductive ink is used, and can form a conductive pattern or the like having wet-heat resistance. | 08-29-2013 |
20130220682 | Method of Reducing Electromigration of Silver and Article Made Thereby - A method includes: providing a silver-containing conductive member disposed on a portion of a surface of chemically-strengthened glass, wherein the conductive member comprises silver; disposing a layer comprising a curable polysilazane onto at least a portion of the conductive member and at least a portion of the surface of the chemically-strengthened glass adjacent to the conductive member; and curing the curable polysilazane. Electronic devices prepared according to the method are also disclosed. | 08-29-2013 |
20130228364 | Method And System To Position Carbon Nanotubes Using AC Dielectrophoresis - A method for positioning carbon nanotubes on a substrate, the substrate including a first electrode and a second electrode thereon, the second electrode being positioned oppositely from the first electrode; the method includes: applying a first AC voltage across the first and second electrodes; providing a first resistance in series with the first AC voltage; and introducing a solution including at least one carbon nanotube; wherein, when the first AC voltage is applied through the first resistance across the first and second electrodes, the at least one carbon nanotube attaches to the first and second electrodes. Another aspect of the invention includes providing a metallic area between the first and second electrodes. In an additional aspect of the invention, the substrate includes a third electrode and a fourth electrode thereon, the fourth electrode being positioned oppositely from the third electrode, the third electrode being positioned adjacent to the first electrode; the method further includes: removing the first AC voltage; applying a second AC voltage to the third and fourth electrodes, the second AC voltage causing the first and second electrodes to have a floating potential; and providing a second resistance in series with the second AC voltage; wherein when the first AC voltage is applied across the first and second electrodes, the first AC voltage causes the third and fourth electrodes to have a floating potential, and wherein, when the second AC voltage is applied through the second resistance across the third and fourth electrodes, a second carbon nanotube attaches to the third and fourth electrodes. | 09-05-2013 |
20130233599 | SUBSTRATE FOR POWER MODULE - Disclosed herein is a substrate for a power module. The substrate may include a metal base substrate, an insulating layer formed on the metal base substrate and including a plurality of insulating adhesion layers and a ceramic filler layer formed on a joining interface between the plurality of insulating adhesion layers, and a circuit layer formed on the insulating layer. | 09-12-2013 |
20130233600 | INTEGRATED PLATED CIRCUIT HEAT SINK AND METHOD OF MANUFACTURE - A method of preparing a non-ferrous metal substrate for plating includes providing an anodized layer on an aluminum substrate and electrically isolating the anodized layer from the non-ferrous metal substrate by applying an electrically non-conductive micro-filler to the anodized layer to form a filled region of the anodized layer electrically isolating the anodized layer from the non-ferrous metal substrate. | 09-12-2013 |
20130240252 | 3D-SHAPED COMPONENT WITH A CIRCUIT TRACE PATTERN AND METHOD FOR MAKING THE SAME - A 3D-shaped component includes a 3D-shaped plastic film having a surface, and a circuit trace pattern that is disposed at the surface of the 3D-shaped plastic film, that is embedded in the 3D-shaped plastic film, and that is made from a cured conductive ink. | 09-19-2013 |
20130248229 | ELECTRICAL CONDUCTORS AND METHODS OF MANUFACTURING ELECTRICAL CONDUCTORS - An electrical conductor includes a base substrate of at least one of copper, copper alloy, nickel or nickel alloy and a layered structure applied to the base substrate. The layered structure includes a foil and a graphene layer deposited on the foil. The layered structure is applied to the base substrate after the graphene layer is deposited on the foil. A method of manufacturing the electrical conductor includes providing a base substrate, providing a foil, depositing a graphene layer on the foil to define a layered structure, and depositing the layered structure on the base substrate. | 09-26-2013 |
20130248230 | TOUCH SCREEN PANEL AND TOUCH SCREEN ASSEMBLY INCLUDING THE SAME - The present invention relates to a touch screen panel and a touch screen assembly including the touch screen panel, the touch screen panel including a substrate; a transparent electrode layer formed on the substrate; a plurality of conductive wires electrically connected to the transparent electrode layer; an insulation film formed on the transparent electrode layer; and a plurality of conductive line, each of which is electrically connected to each of the plurality of conductive wires inside the insulation film, extended to an outside of the insulation film and exposed therefrom, whereby a PCB and conductive wires can be improved in electrical reliability. | 09-26-2013 |
20130248231 | GROUND FEATURE FOR DISK DRIVE HEAD SUSPENSION FLEXURES - Various embodiments concern an electrical interconnect of a head suspension. The electrical interconnect can comprise a spring metal layer and a dielectric layer having an aperture with a portion of the spring metal layer being exposed through the dielectric layer within the aperture. The electrical interconnect can further comprise a trace layer disposed on the dielectric layer and extending into the aperture to connect with the spring metal layer. Part of the spring metal layer within the aperture may not be covered by the trace layer. The exposure of the spring metal layer through the aperture can be due to the width of the trace layer being less than the width of the aperture and/or the exposure can be due to expected misregistration. A polymer covercoat can be applied over the aperture to protect the trace layer from corrosion. | 09-26-2013 |
20130256007 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having a cavity, an electronic component positioned in the cavity and having a first-side electrode on one side of the electronic component and a second-side electrode on the opposite side of the electronic component, an insulation layer formed on a surface of the substrate and the electronic component such that the insulation layer covers the electronic component positioned in the substrate, and a conductive layer formed on the surface of the substrate and including linear conductive patterns surrounding an opening of the cavity on the surface of the substrate. The linear conductive patterns include a first linear conductive pattern positioned adjacent to the first-side electrode and a second linear conductive pattern positioned adjacent to the second-side electrode such that the first linear conductive pattern and the second linear conductive pattern are insulated from each other. | 10-03-2013 |
20130269988 | PERIPHERAL CIRCUIT OF TOUCH PANEL AND MANUFACTURING METHOD THEREOF - A method for manufacturing a peripheral circuit of a touch panel includes: printing a radiation curable conductive material on a substrate having a transparent conductive pattern; irradiating the radiation curable conductive material with a radiated ray, in order to cure parts of the radiation curable conductive material; and removing uncured parts of the radiation curable conductive material, in order to form the peripheral circuit. | 10-17-2013 |
20130269989 | PREPREG AND PRINTED CIRCUIT BOARD COMPRISING THE SAME AND MANUFACTURING METHOD PRINTED CIRCUIT BOARD - The present invention relates to a prepreg including an insulating resin composition impregnated into a substrate including a fibrous material and a porous support, and a printed circuit board including the same as an insulating layer. | 10-17-2013 |
20130269990 | CONTACT MAKING ARRANGEMENT FOR CONDUCTORS PROVIDED ON FLAT STRUCTURES, NAMELY PANES OF GLASS - The invention relates to a contacting arrangement for conductors provided on flat structures, namely glass panes, the conductors having a contact point in their connecting section, wherein one end of a connecting cable or another connection device is electrically and mechanically connected with a pad including a conductive fleece or double-sided conductive adhesive tape, wherein the connecting cable configured in this way is introduced into an encasement block which is open at one side and which includes a frame which surrounds the fleece or the conductive adhesive tape and which is provided with adhesive, wherein the surface of the conductive fleece which is laterally defined by the frame is matched to the area of the contact point in order to provide a contact connection between the contact point and the fleece surface through an adhesive joint between the frame and the flat structure, wherein the frame with the encasement element closes off the contact point in sealing fashion towards the ambient and a portion of the frame is usable as a sealing lip for preventing adhesives from spreading out when the glass pane is fitted. | 10-17-2013 |
20130284500 | LAMINATE CIRCUIT BOARD STRUCTURE - A laminate circuit board structure from button up including a substrate, a circuit metal layer, a nanometer plating layer and a cover layer is disclosed. The nanometer plating layer is smooth a thickness of 5-40 nm, and can be directly forming on the outer surface of the circuit metal layer or manufactured by firstly forming the nanometer plating layer on a preforming substrate, then pressing the substrate against the nanometer plating layer, and finally removing the preforming substrate. The junction adhesion between the nanometer plating layer and the cover layer or the substrate is improved by chemical bonding. Therefore it does not need to roughen the circuit metal layer or reserve circuit width for compensation such that the density of the circuit increases and much more dense circuit can be implemented in the substrate with the same area. | 10-31-2013 |
20130284501 | COEFFICIENT OF THERMAL EXPANSION COMPENSATING COMPLIANT COMPONENT - An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame. | 10-31-2013 |
20130284502 | EPOXY RESIN, EPOXY RESIN COMPOUND COMPRISING THE SAME, AND RADIANT HEAT CIRCUIT BOARD USING THE COMPOUND - An epoxy resin compound including an epoxy resin, a hardening agent, and an inorganic filler as a main component is provided. The epoxy resin includes an epoxy resin represented by a chemical formula. Therefore, the epoxy resin having a mesogen structure that increases crystallinity is used, and thus thermal conductivity can be increased. Further, the epoxy resin is used as an insulating material for a printed circuit board, and thus a high radiant heat substrate can be provided. | 10-31-2013 |
20130299215 | ELECTRONIC COMPONENT, ELECTRONIC-COMPONENT-EMBEDDED SUBSTRATE, AND METHOD FOR PRODUCING ELECTRONIC COMPONENT - An electronic component includes a body and first and second external electrodes arranged on an external surface of the body. An edge portion of the first external electrode and an edge portion of the second external electrode face each other on the body. The first and second external electrodes each include a copper-metal-containing layer and a protective copper oxide layer covering the copper-metal-containing layer within the edge portion of the first and second external electrodes, respectively. | 11-14-2013 |
20130299216 | TRANSPARENT ELECTRODE SHEET, METHOD FOR MANUFACTURING TRANSPARENT ELECTRODE SHEET, AND CAPACITIVE TOUCH PANEL USING SUCH TRANSPARENT ELECTRODE SHEET - A transparent electrode sheet includes a transparent support having thereon patterned electrodes, and an absolute value of a difference between a reflection chromaticity of a surface of the electrode of far side from the transparent support and a reflection chromaticity of a surface of the electrode of near side to the transparent support is not more than 2. | 11-14-2013 |
20130313005 | WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE - A wiring substrate includes a resin substrate in which first second through holes are formed, a metallic foil on one surface of the resin substrate coating the through holes and separated into first and second side metallic foils by a border, a first connecting portion formed by a plating film inside the first through hole, a second connecting portion formed by a plating film inside the second through hole, a first slit facing the border and penetrating through the metallic foil and the first connecting portion, a second slit facing the border and penetrating through the metallic foil and the second connecting portion, first and second plating layers on front surfaces of the first and second side metallic foils, bottom surfaces of the first and second connecting portions, and side surfaces inside the first and second slits of the first and second side metallic foils. | 11-28-2013 |
20130319734 | PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a package substrate including: a base substrate; insulation layers formed on upper and lower portions of the base substrate; a first metal layer formed on an upper portion of the insulation layer; a first through-via penetrating through the base substrate, the insulation layer, and the first metal layer and being made of an insulating material; a seed layer formed on upper and lower portions and an inner wall of the first through-via; a second metal layer formed on upper portions of the first metal layer and the seed layer; and a second through-via formed in the seed layer formed at the inner wall of the first through-via and the second metal layer. | 12-05-2013 |
20130319735 | METAL-CLAD LAMINATE AND PRINTED WIRING BOARD - A metal-clad laminate of the present invention comprises an insulating layer, and a metal layer that is present at least on one surface side of the insulating layer. The insulating layer is a laminate of at least three layers: a center layer, a first resin layer that is present on one surface side of the center layer, and a second resin layer that is present on the other surface side of the center layer. The center layer, the first resin layer and the second resin layer each contain a cured product of a respective resin composition. The elastic modulus of the cured product of the resin composition contained in the center layer is lower than the elastic moduli of both the cured product of the resin composition contained in the first resin layer and the cured product of the resin composition contained in the second resin layer. | 12-05-2013 |
20130327561 | BONDING STRUCTURE - A bonding structure includes a substrate, multiple first pads, multiple second pads, an insulation layer and a patterned conductive layer. The substrate has a bonding region and a predetermined-to-be-cut region. The first pads are disposed on the substrate and within the bonding region. The second pads are disposed on the substrate and within the predetermined-to-be-cut region. The insulation layer is disposed on the substrate and covers the first and second pads. The insulation layer has multiple first and second openings respectively exposing parts of the first and second pads. The patterned conductive layer is disposed on the substrate and covers the insulation layer and the parts of the first and second pads exposed out by the first and second openings, in which the patterned conductive layer is electrically connected to the first and second pads via the first and second openings. | 12-12-2013 |
20130327562 | TOUCH PANEL - Disclosed herein is a touch panel. A touch panel | 12-12-2013 |
20130333927 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a printed circuit board, the method including: preparing a base substrate having one surface and the other surface; forming first signal metal layers including a first signal via penetrating the base substrate from one surface to the other surface and first heat dissipation metal layers on the base substrate; and forming a build-up layer on the base substrate by forming second heat dissipation metal layers including second signal metal layers including second signal vias stacked on the first signal via and a heat dissipation via penetrating the base substrate and the build-up layer in the thickness direction. | 12-19-2013 |
20130341074 | METAL NANOWIRE NETWORKS AND TRANSPARENT CONDUCTIVE MATERIAL - Metal nanowires, such as silver nanowires coated on a substrate were fused together to form fused metal nanowire networks that have greatly improved conductivity while maintaining good transparency. Materials formed form the fused metal nanowire networks described herein can have a transparency to visible light of at least about 85% and a sheet resistance of no more than about 100 Ohms/square or a transparency to visible light of at least about 90% and a sheet resistance of no more than about 250 Ohms/square. The method of forming such a fused metal nanowire networks are disclosed that involves exposure of metal nanowires to various fusing agents on a short timescale. When formed into a film, materials comprising the metal nanowire network demonstrate low sheet resistance while maintaining desirably high levels of optical transparency, making them suitable for transparent electrode formation. | 12-26-2013 |
20130341075 | PRINTED CIRCUIT BOARD - Apparatuses and methods include a printed circuit board having a flexible circuit material, a rigid material over the flexible circuit material, and a first opening extending from a top surface of the rigid material to a first circuit layer of the flexible circuit material, and wherein the rigid material acts as a stiffener for the flexible circuit material. | 12-26-2013 |
20140000944 | TOUCH PANEL | 01-02-2014 |
20140000945 | Transparent Components | 01-02-2014 |
20140008108 | PHOSPHORUS-ATOM-CONTAINING OLIGOMER COMPOSITION, CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED CIRCUIT BOARD - A phosphorus-atom-containing oligomer is used as a curing agent for epoxy resin, the phosphorus-atom-containing oligomer being a mixture of a phosphorus-atom-containing compound represented by structural formula (1) below with n representing 0 and a phosphorus-atom-containing oligomer represented by structural formula (1) below with n representing 1 or more: | 01-09-2014 |
20140008109 | METHOD FOR PRODUCING CONDUCTIVE ZINC OXIDE FILM - An objective is to provide a novel preparation method for a conductive ZnO film which realizes large area and mass productions with low costs and low environment loads. The crystal of zinc oxide (ZnO) is deposited on a substrate by a precipitation method using liquidous solution method under the presence of citric acid. The citric acid adsorbs on the surface of (0001) face of ZnO to suppress anisotropic growth to a c axis direction of the crystal in the precipitation reaction and to form dense crystal film on the surface of the substrate. Then, the organic acid incorporated in the film is photo-decomposed by irradiating UV light to the prepared ZnO crystalline film. As the result, carriers trapped by the organic acid is released to the crystalline film so as to provide an adequate conductivity. | 01-09-2014 |
20140020936 | ELECTRODE SENSOR AND METHOD OF FABRICATING THE SAME - Provide are an electrode sensor and a method of fabricating the same. the method may include providing a substrate with a first electrode, forming a resist layer on the substrate to cover the first electrode, patterning the resist layer to expose a portion of the first electrode, forming an insulating layer on the substrate, removing the insulating layer on the resist layer and the resist layer to form a well in the insulating layer, and forming a second electrode in the well to be electrically connected to the first electrode. According to the method, it is possible to prevent the first electrode from being damaged. In addition, the second electrode may be configured have an increased surface area, and thus, the electrode can have low impedance. | 01-23-2014 |
20140034367 | EPOXY RESIN COMPOSITION FOR PRITNED CIRCUIT BOARD, INSULATING FILM, PREPREG, AND MULTILAYER PRINTED CIRCUIT BOARD - Disclosed herein are an epoxy resin composition, an insulating film using the same, and a multilayer printed circuit board; more particularly, an epoxy resin composition including a liquid crystal capable of lowering the coefficient of thermal expansion, improving chemical resistance, and increasing the glass transition temperature, an insulating film or prepreg manufactured by using the epoxy resin composition, and a multilayer printed circuit board including the insulating film or prepreg. | 02-06-2014 |
20140034368 | MULTI-LAYERED PRINTED CIRCUIT BOARD WITH CONDUCTIVE TEST AREAS AS WELL AS METHOD FOR DETERMINING A MISALIGNMENT OF AN INNER LAYER - A multi-layered printed circuit board ( | 02-06-2014 |
20140034369 | WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE, AND METHOD FOR PRODUCING SAME - Provided are a ceramic wiring substrate having a side surface which realizes reliable chucking or hooking; a multi-piece wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the multi-piece wiring substrate array. The wiring substrate is formed of a ceramic material, has a square (rectangular) shape in plan view, and which has a front surface, a back surface, and side surfaces each being located between the front surface and the back surface, wherein each side surface has a belt-like uneven surface including a plurality of alternate and parallel convex portions and concave portions which are formed so as to extend along the front surface, and also has a fracture surface located on a side toward the back surface. | 02-06-2014 |
20140041908 | FLAME RETARDANT FILLERS PREPARED FROM BRIDGED POLYSILSESQUIOXANES - A bridged polysilsesquioxane-based flame retardant filler imparts flame retardancy to manufactured articles such as printed circuit boards (PCBs), connectors, and other articles of manufacture that employ thermosetting plastics or thermoplastics. In an exemplary synthetic method, a bridged polysilsesquioxane-based flame retardant filler is prepared by sol-gel polymerization of a monomer having two or more trialkoxysilyl groups attached to an organic bridging group that contains a fire retardant group (e.g., a halogen atom, a phosphinate, a phosphonate, a phosphate ester, and combinations thereof). Bridged polysilsesquioxane particles formed by sol-gel polymerization of (((2,5-dibromo-1,4-phenylene)bis(oxy))bis(ethane-2,1-diyl))bis(trimethoxysilane), for example, and follow-on sol-gel processing may serve both as a filler for rheology control (viscosity, flow, etc.) and a flame retardant. In an exemplary application, a PCB laminate stack-up includes conductive planes separated from each other by a dielectric material that includes a bridged polysilsesquioxane-based flame retardant filler. | 02-13-2014 |
20140048315 | TOUCH PANEL - Disclosed herein is a touch panel including: a transparent substrate; conductive patterns formed on the transparent substrate such that wavy lines thereof are spaced apart from each other and arranged in parallel with each other, each of the wavy lines having a sine wave form where first peaks and second peaks alternately continue along a length direction thereof; and connecting patterns formed on the transparent substrate, each of the connecting patterns electrically connecting between the wave lines, so that good visibility can be achieved even though electrodes and wirings are disposed in an active area of the transparent substrate, by forming uniform pattern of electrodes and wirings on the transparent substrate. | 02-20-2014 |
20140048316 | EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME - There is provided an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. Also, there is provided a radiant heat circuit board including a metal plate, an insulating layer formed on the metal plate; and a circuit pattern formed on the insulating layer, in which the insulting layer is formed by curing an epoxy resin compound including an epoxy resin including a crystalline epoxy, a curing agent, and an inorganic filler. | 02-20-2014 |
20140048317 | MELTABLE PAINT FILMS AND FABRICS AND METHODS OF MANUFACTURING THEREOF - A fabric which is formed of fibers joined together by at least one of knitting, weaving and felting techniques, which is characterized by having a first non-adhesive solid state and a second adhesive solid state, which occurs subsequent to having passed through an adhesive non-solid state. | 02-20-2014 |
20140054072 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method for manufacturing the same. The printed circuit board includes: a base substrate; an Insulating layer formed on one surface or both surfaces of the base substrate; an electrode layer formed on a top surface of the insulating layer; and an insulating film covering a surface of the insulating layer except for a bonding surface between the electrode layer and the insulating layer so as to secure high dielectric breakdown voltage while keeping high thermal conductivity. | 02-27-2014 |
20140060898 | Thermally-conductive particles in printed wiring boards - A printed wiring board (PWB) can be fabricated with enhanced thermal characteristics that can enable the use of higher performance electronic components and/or a smaller packaging configuration. A substrate layer of the PWB includes a matrix material and optional reinforcing fibers embedded in the matrix material. The matrix material and/or the reinforcing fibers may include thermally-conductive particles such as nanodiamonds that increase the thermal conductivity of the substrate layer. Holes may be formed through the substrate layer for receiving and/or electrically connecting electronic components. The thermally-conductive particles are sized sufficiently small to allow the formation of the holes through the substrate layer using conventional equipment and processes such as drilling. The PWB may also include a protective coating that comprises thermally-conductive particles. The thermally-conductive particles described herein can reduce the need for heavy and bulky metal thermal layers in a manufacturing-friendly manner. | 03-06-2014 |
20140060899 | PREPREG, COPPER CLAD LAMINATE, AND PRINTED CIRCUIT BOARD - Disclosed herein are prepreg, a copper clad laminate (CCL), and a printed circuit board. When a reinforcing member formed of organic fiber including a liquid crystal polymer resin or a super engineering resin and a base resin having the same component as the reinforcing member are used, a coefficient of thermal expansion (CTE) and rigidity may be adjusted. In addition, during an operation of a semiconductor chip mounted on the printed circuit board, the semiconductor chip and the printed circuit board expand and contract due to heat by as much as similar degrees, and thus, the reliability of a solder joint may be enhanced. Moreover, fiber protrusion failure may be prevented compared with a case a via hole is processed by using a CO | 03-06-2014 |
20140060900 | ANCHOR GROUP FOR MONOLAYERS OF ORGANIC COMPOUNDS ON METAL AND COMPONENT PRODUCED THEREWITH BY MEANS OF ORGANIC ELECTRONICS - An anchor group anchors organic dielectric compounds used in the production of organically based capacitors. The capacitors referred to are those that can be produced in a parallel process on a prepeg or other common printed circuit board substrate without additional metallisation on copper. The pre-fabricated capacitor layer can then be built into the printed circuit board, thereby gaining on space and cost for the surface of the printed circuit board. | 03-06-2014 |
20140076616 | LASER DIRECT STRUCTURING MATERIALS WITH IMPROVED PLATING PERFORMANCE AND ACCEPTABLE MECHANICAL PROPERTIES - The disclosure relates to relates to blended thermoplastic compositions, and in one aspect to blended thermoplastic compositions capable of being used in a laser direct structuring process. The present invention also relates to methods of manufacturing these compositions and articles that include these compositions. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present invention. | 03-20-2014 |
20140076617 | Passive Devices in Package-on-Package Structures and Methods for Forming the Same - A device includes a polymer. A device die is disposed in the polymer. A passive device includes three Through Assembly Vias (TAVs) penetrating through the polymer, wherein the TAVs are coupled in series. A Redistribution Line (RDL) is underlying the polymer. The RDL electrically couples a first one of the TAVs to a second one of the TAVs. | 03-20-2014 |
20140083749 | WIRING SUBSTRATE - A wiring substrate is provided with a substrate core including a first main surface, a second main surface, and a through hole. An electronic component is arranged in the through hole. A projection projects from a wall of the through hole toward a connection terminal of the electronic component. An insulator is filled between the wall of the through hole and the electronic component. A first insulation layer covers the electronic component and the first main surface. A second insulation layer covers the electronic component and the second main surface. The electronic component includes an electronic component body and the connection terminal formed on a side of the electronic component body. The connection terminal of the electronic component includes an engagement groove formed by the projection and extending along a direction in which the electronic component is fitted into the through hole. | 03-27-2014 |
20140090877 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND PRINTED WIRING BOARD - A printed wiring board includes an interlayer resin insulation layer, a pad structure formed on the interlayer resin insulation layer and positioned to mount a semiconductor device, and a solder-resist layer formed on the interlayer resin insulation layer and having an opening portion exposing a portion of the pad structure from the solder-resist layer. The opening portion of the solder-resist layer has a bottom surface such that the bottom surface of the opening portion is exposing an upper surface and a portion of a side surface of the pad structure. | 04-03-2014 |
20140090878 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed circuit board has a core substrate, a first conductive pattern on first surface of the substrate, a second conductive pattern on second surface of the substrate, and a through-hole conductor formed of plated material through the substrate such that the conductor is connecting the first and second patterns. The plated material is filling a through hole in the substrate, the substrate includes an insulation layer including inorganic fiber and resin, a first resin layer on one surface of the insulation layer and having the first surface of the substrate, and a second resin layer on the opposite surface of the insulation layer and having the second surface of the substrate, the first and second resin layers do not contain inorganic fiber material, and the sum of thicknesses of the first and second resin layers is set in the range of 20% or less of thickness of the substrate. | 04-03-2014 |
20140097005 | Glass Wiring Board - A glass wiring board is provided that includes a glass substrate and a primer layer. The prime layer is disposed on the glass substrate and includes an intermediate layer and a copper plating layer disposed on the intermediate layer. The intermediate layer includes a resin coupling agent and a metal element dispersed in the resin coupling agent. | 04-10-2014 |
20140102772 | PACKAGING CARRIER AND MANUFACTURING METHOD THEREOF AND CHIP PACKAGE STRUCTURE - A packaging carrier includes an interposer, a dielectric layer and a built-up structure. The interposer has a first surface and a second surface opposite to each other, and a plurality of first pads and second pads located on the first surface and the second surface, respectively. The dielectric layer has a third surface and a fourth surface opposite to each other. The interposer is embedded in the dielectric layer. The second surface of the interposer is not covered by the fourth surface of the dielectric layer, and has a height difference with the fourth surface. The built-up structure is disposed on the third surface of the dielectric layer and electrically connected to the first pads of the interposer. | 04-17-2014 |
20140102773 | ADHESIVELESS COPPER CLAD LAMINATES AND PRINTED CIRCUIT BOARD HAVING ADHESIVELESS COPPER CLAD LAMINATES AS BASE MATERIAL - Adhesiveless copper clad laminates obtained by metallizing excellent in wiring microfabrication ability in processing by semi-additive method, and a printed circuit board using the adhesiveless copper clad laminates excellent in wiring microfabrication ability as a base material are provided. The adhesiveless copper clad laminates include a base metal layer made of an alloy containing nickel and formed on at least one surface of an insulating film without using an adhesive in between, a thin copper layer formed on a front surface of the base metal layer by dry plating, and a copper plating film formed on a front surface of the thin copper layer by electroplating. The copper plating film contains 10 mass ppm to 150 mass ppm of sulfur in a depth range of at least 0.4 μm from the front surface of the copper plating film in a direction toward the insulating film. | 04-17-2014 |
20140110158 | CARBON FIBER SPACECRAFT PANEL WITH INTEGRAL METALLIC FOIL POWER RETURN - An aerospace structure that includes a composite member and a conductive element attached to the composite member wherein the conductive element is configured to conduct electricity across at least a portion of the composite member is provided. The aerospace structure may also include a power distribution system and the conductive element is a part of the power distribution system for the aerospace structure. | 04-24-2014 |
20140116757 | CHIP SUPPORT BOARD STRUCTURE - A chip support board structure which includes at least a metal substrate, a block layer, a paddle, an insulation layer, a circuit layer and a solder resist is disclosed. The circuit layer connects with the paddle. The material of the block layer is different from that of the metal substrate and the block layer is provided between the metal substrate and the paddle such that the shape and the depth of the paddle is maintained constant and the problem of different depth and easily peeling off is avoided, thereby improving the yield rate of the chip support board. | 05-01-2014 |
20140116758 | PLANAR ELECTRONIC DEVICE HAVING A MAGNETIC COMPONENT - A planar electronic device includes a dielectric substrate having a recess. A functional electrical component is disposed within the recess of the substrate. A vent opening extends within the substrate such that the vent opening intersects the recess within a thickness of the substrate. The vent opening is open to atmosphere such that the vent opening fluidly connects the recess to the atmosphere. | 05-01-2014 |
20140116759 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes fixing a lower metal foil on a support plate, forming a lower insulating layer on the lower metal foil, laminating a core metal layer on the lower insulating layer, patterning the core metal layer such that the core metal layer is formed into a core conductive layer, forming an upper insulating layer on the core conductive layer and lower insulating layer, laminating an upper metal foil on the upper insulating layer, removing the plate from the lower foil such that a core substrate including the lower metal foil, lower insulating layer, core conductive layer, upper insulating layer and upper metal foil is formed, and forming on the core substrate a buildup layer including an insulating layer and a conductive layer. The core metal layer has a thickness which is set to be greater than thicknesses of the lower and upper foils. | 05-01-2014 |
20140124249 | PCB BOARD, CORE FOR MANUFACTURING THE PCB BOARD AND METHOD FOR MANUFACTURING THE PCB BOARD - The present invention provides a printed circuit board (PCB) board, a core for manufacturing the PCB board and a method for manufacturing the PCB board. The PCB board is in a shape of a rectangle and comprises a fiber layer formed of interlacedly weaved fiberglasses, a metal layer affixed onto a surface of the fiber layer, and a pair of differential signal traces formed on the metal layer, wherein extending directions of the fiberglasses lie at acute angles with respect to a length direction of the rectangle, and the pair of differential signal traces extends along a width direction or the length direction of the rectangle. The PCB board can effectively reduce the possibility of the skew distortion during the transmitting process of the differential signal through adjusting the angle between the fiberglasses and the edge of the core without adjusting or redesigning the original circuit layout. | 05-08-2014 |
20140124250 | WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A wiring board includes an electric insulating base material including an incompressible member and a thermosetting member; a first wiring and a second wiring formed with the electric insulating base material interposed therebetween; and a via-hole conductor penetrating the electric insulating base material, and electrically connecting the first wiring and the second wiring to each other. The via-hole conductor includes a resin portion and a metal portion. The metal portion includes a first metal region mainly composed of Cu; a second metal region mainly composed of a Sn—Cu alloy; and a third metal region mainly composed of Bi. The second metal region is larger than the first metal region, and larger than the third metal region. | 05-08-2014 |
20140131072 | CONNECTION STRUCTURE FOR A SUBSTRATE AND A METHOD OF FABRICATING THE CONNECTION STRUCTURE - A connection structure for a substrate is provided. The substrate has a plurality of connection pads and an insulation protection layer with the connection pads being exposed therefrom. The connection structure includes a metallic layer formed on an exposed surface of each of the connection pads and extending to the insulation protection layer, and a plurality of conductive bumps disposed on the metallic layer and spaced apart from one another at a distance less than or equal to 80 μm, each of conductive bumps having a width less than a width of each of the connection pads. Since the metallic layer covers the exposed surfaces of the connection pads completely, a colloid material will not flow to a surface of the connection pads during a subsequent underfilling process of a flip-chip process. Therefore, the colloid material will not be peeled off from the connection pads. | 05-15-2014 |
20140131073 | MULTI-LAYER WIRING BOARD - A multi-layer wiring board includes a resin base, a wiring pattern, an adhesive layer, and a via. The wiring pattern includes a land provided on the resin base. The adhesive layer is stacked on the resin base. The via is formed in the adhesive layer and has an end connected to the land. At least a portion of a side surface of the land contacts the via. | 05-15-2014 |
20140131074 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE - A wiring substrate has a frame including a metal material and having a connecting portion, and a piece substrate connected to the connecting portion of the frame and having a metal pattern. The metal pattern of the piece substrate has a contour which is corresponding to an outer edge of the connecting portion of the frame. | 05-15-2014 |
20140131075 | WIRED ELECTRODE OF TOUCH SCREEN PANEL - Disclosed is a wired electrode of touch screen panel for transmitting a touch signal sensed by a signal sensing pattern of touch screen panel to an external driving circuit, wherein the wired electrode formed on a substrate includes at least one curved portion, and a plurality of fine protrusions are formed on an inner surface of a groove of a resin layer on the substrate. The groove is filled with a conductive material to form the wired electrode. | 05-15-2014 |
20140131076 | CERAMIC SUBSTRATE COMPOSITE AND METHOD FOR MANUFACTURING CERAMIC SUBSTRATE COMPOSITE - In the present invention, a ceramic substrate composite comprising, on a ceramic substrate, a conductor pattern composite and an insulating layer is provided. The ceramic substrate composite of the present invention is characterized in that the conductor pattern composite and the insulating layer are provided on the ceramic substrate with each other so that the insulating layer overlaps a part of the conductor pattern composite; and wherein the conductor pattern composite is composed of a conductor portion and an insulating portion that exists locally in the conductor portion, the insulating portion being an insulating material that constitutes the insulating layer. | 05-15-2014 |
20140138127 | CIRCUIT BOARD WITH SIGNAL ROUTING LAYER HAVING CONSISTENT IMPEDANCE - A circuit board includes a dielectric layer and a signal routing layer on the dielectric layer. The signal routing layer includes chip traces, connector traces, and signal traces connected with the chip traces and the connector traces. The dielectric layer includes a signal trace area for arraying the signal traces, a chip trace area for arraying the chip traces, and a connector trace area for arraying the connector traces. The dielectric coefficient of the signal trace area is smaller than the dielectric coefficient of the chip trace area and greater than the dielectric coefficient of the connector trace area. | 05-22-2014 |
20140138128 | Low Loss Pre-Pregs and Laminates and Compositions Useful for the Preparation Thereof - In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, in the multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, in applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like. | 05-22-2014 |
20140144679 | CONDUCTIVE SUBSTRATE COMPRISING CONDUCTIVE PATTERN AND TOUCH PANEL COMPRISING SAME - The present invention relates to a conductive substrate comprising a conductive pattern having an improved concealment property and a touch panel comprising the same, and the conductive substrate according to the present invention comprises: a transparent substrate, and a conductive pattern comprising a conductive line provided on the transparent substrate, wherein the conductive pattern comprises two or more conductive lines spaced from each other in a longitudinal direction of the conductive line, and a distance between nearest-adjacent ends of two or more conductive lines spaced from each other is 15 μm or less. The conductive substrate according to the present invention can more efficiently conceal a metal line comprised in the conductive pattern. | 05-29-2014 |
20140144680 | WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF - A method of producing a wired circuit board includes a first step of preparing a metal supporting layer, a second step of forming, on one side of the metal supporting layer in a thickness direction thereof, an insulating layer having a first opening, and a plurality of terminal formation portions, a third step of forming, on one side of the insulating layer in the thickness direction, a conductive layer having a plurality of terminal portions each corresponding to the plurality of terminal formation portions, a fourth step of partially removing the metal supporting layer to form a second opening and at least one reinforcing metal supporting portion placed between the plurality of terminal formation portions, and a fifth step of removing the plurality of terminal formation portions exposed from the second opening to expose both side surfaces of the plurality of terminal portions in the thickness direction. | 05-29-2014 |
20140151094 | ACTIVE ESTER RESIN, METHOD FOR PRODUCING THE SAME, THERMOSETTING RESIN COMPOSITION, CURED PRODUCT OF THE THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR ENCAPSULATING MATERIAL, PRE-PREG, CIRCUIT BOARD, AND BUILD-UP FILM - A low dielectric constant, a low dielectric loss tangent, and heat resistance are achieved. An active ester resin that has a resin structure produced by reacting a polyfunctional phenolic compound (a1) with a monofunctional aromatic carboxylic acid or its chloride (a2) and an aromatic dicarboxylic acid or its chloride (a3). The polyfunctional phenolic compound (a1) is represented by structural formula (1) below: | 06-05-2014 |
20140151095 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a composite sheet including an insulating material and a glass plate bonded to the insulating material; and a circuit layer formed on the composite sheet. | 06-05-2014 |
20140166345 | TRANSPARENT CONDUCTING GLASS AND METHOD OF MANUFACTURING SAME - A transparent conducting glass includes a glass substrate and a conducting glue. The glass substrate includes a first surface and a second surface opposite to the first surface, and defines a number of strip recesses on the first surface according to a circuit route. The conducting glue is infilled into the strip recesses and forms a circuit for transmitting signals. | 06-19-2014 |
20140166346 | CERAMIC SUBSTRATE, AND METHOD OF MANUFACTURING THE SAME - A ceramic substrate is provided that includes a ceramic substrate main body including a principal surface, a connecting terminal portion disposed on the principal surface of the ceramic substrate main body that is capable of being connected to another component via solder, the connecting terminal portion including a copper layer and a coating metal layer covering a surface of the copper layer; a contact layer of titanium or chromium disposed between the ceramic substrate main body and the connecting terminal portion; and an intermediate layer disposed between the copper layer of the connecting terminal portion and the contact layer, the intermediate layer including one of a titanium-tungsten alloy, a nickel-chromium alloy, tungsten, palladium, and molybdenum. The contact layer and the intermediate layer are set back from a side surface of the copper layer in a substrate plane direction. | 06-19-2014 |
20140174797 | BUILD-UP FILM STRUCTURE, CIRCUIT BOARD MANUFACTURED USING THE SAME, AND METHOD FOR MANUFACTURING CIRCUIT BOARD USING THE SAME - Disclosed herein is a build-up film structure including: a core layer containing a resin and an inorganic filler; a first adhesive layer covering one surface of the core layer and having a smaller content of the inorganic filler than that of the core layer; and a second adhesive layer covering the other surface of the core layer and having a smaller content of the inorganic filler than that of the core layer. | 06-26-2014 |
20140174798 | METAL CORE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a metal core substrate and a method of manufacturing the same. The method of manufacturing a metal core substrate includes: forming a metal layer into which connection bridges are inserted; laminating an insulating layer and a copper foil on an upper surface and a lower surface of the metal layer en bloc; and removing the connection bridges. | 06-26-2014 |
20140182902 | CIRCUIT BOARD WITH SIGNAL ROUTING LAYER HAVING UNIFORM IMPEDANCE - A circuit board comprises a signal routing layer, a first dielectric layer, a second dielectric layer, a third dielectric layer, a first ground layer, a second ground layer, and a third ground layer. The signal routing layer includes chip traces, connector traces, and signal traces connected to components. The first dielectric layer, the first ground layer, the second dielectric layer, the second ground layer, the third dielectric layer, and the third ground layer, in that order, are located at gradually increasing distances from the signal routing layer. The first ground layer corresponds to the chip traces, the second ground layer corresponds to the signal traces, and the third ground layer corresponds to the connector traces. | 07-03-2014 |
20140182903 | RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD - An object is to provide a resin composition that has excellent dielectric properties, that yields a highly heat-resistant cured product, that provides a low viscosity when made into a varnish, and that has a high Tg and a high flame retardancy without containing halogen. The resin composition contains a polyarylene ether copolymer (A) that has an intrinsic viscosity, measured in methylene chloride at 25° C., of 0.03 to 0.12 dL/g and that has an average of 1.5 to 3 phenolic hydroxyl groups in molecular terminal position per molecule, a triphenylmethane-type epoxy resin (B) that has a softening point of 50 to 70° C., and a cure accelerator (C), wherein the content of the polyarylene ether copolymer (A) is 60 to 85 mass parts where the total of the polyarylene ether copolymer (A) and the epoxy resin (B) is 100 mass parts. | 07-03-2014 |
20140196935 | CERAMIC SUBSTRATE AND PROCESS FOR PRODUCING SAME - A ceramic substrate includes a substrate body formed of ceramic and having a pair of surfaces each assuming a rectangular shape as viewed in plane, and a metallization layer formed on the surface of the substrate body and adapted to braze a metal frame thereon. A composite material layer is disposed between the surface of the substrate body and the metallization layer and is formed such that a ceramic portion, a metal portion | 07-17-2014 |
20140202746 | COMPOSITE COPPER WIRE INTERCONNECT STRUCTURES AND METHODS OF FORMING - Various embodiments include interconnect structures and methods of forming such structures. The interconnect structures can include a composite copper wire which includes at least two distinct copper sections. The uppermost copper section can have a thickness of approximately 1 micrometer or less, which inhibits surface roughening in that uppermost section, and helps to enhance cap adhesion with overlying layers. | 07-24-2014 |
20140216794 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes an insulating substrate having a penetrating hole formed through the substrate, a first conductive pattern formed on first surface of the substrate, a second conductive pattern formed on second surface of the substrate on the opposite side of the first surface, and a through-hole conductor formed in the penetrating hole in the substrate such that the conductor is connecting the first conductive pattern on the first surface of the substrate and the second conductive pattern on the second surface of the substrate. The penetrating hole has a first opening portion opening on the first surface of the substrate, a second opening portion opening on the second surface of the substrate and a third opening portion connecting the first and second opening portions, and the third opening portion has the maximum diameter which is greater than the minimum diameters of the first and second opening portions. | 08-07-2014 |
20140216795 | METHOD FOR PRODUCING A MULTILAYER PRINTED CIRCUIT BOARD, ADHESION PREVENTION MATERIAL AND MULTILAYER PRINTED CIRCUIT BOARD AND USE OF SUCH A METHOD - In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region ( | 08-07-2014 |
20140216796 | MULTILAYER WIRING SUBSTRATE - To provide a multilayer wiring board that ensures sufficient close contact strength between a conformal type conductor and a resin insulating layer. A multilayer wiring board includes a multilayered construction where a plurality of resin insulating layers and a plurality of conductor layers are alternately layered. In each of a plurality of via holes formed in the resin insulating layers, a conformal via conductor is formed to electrically connect between the conductor layers. Filling up parts of the resin insulating layers layered at upper layer side inside of the conformal via conductor forms an anchor portion. The lower end side of the anchor portion bulges larger than the upper end side in the radially outward direction of the via hole. | 08-07-2014 |
20140231122 | EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME - An epoxy resin composition having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin composition can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board. | 08-21-2014 |
20140231123 | THERMOPLASTIC LIQUID CRYSTAL POLYMER FILM, AND LAMINATE AND CIRCUIT BOARD USING SAME - To provide a thermoplastic liquid crystal polymer film capable of suppressing change in relative dielectric constant before and after heating, and a laminated and a circuit board using the same. In this film, a change ratio of a dielectric constant (∈ | 08-21-2014 |
20140231124 | BASE MATERIAL FOR FORMING ELECTROCONDUCTIVE PATTERN, CIRCUIT BOARD, AND METHOD FOR PRODUCING EACH - The present invention pertains to: a base material for forming an electroconductive pattern, adapted to form an electroconductive pattern and obtain a circuit board; the circuit board obtained therefrom; and a method for producing each. The base material for forming an electroconductive pattern, adapted to obtain a circuit board, includes a supporter, and a holding region for holding a fluid body for obtaining an electroconductive pattern, the holding region being formed atop one end surface of the supporter and exhibiting a proper wettability for the fluid body. The holding region has at least a first linear group including a plurality of first lines extending in parallel with each other along a first direction, and a second linear group including a plurality of second lines extending in parallel with each other along a second direction, and a grid shape is formed by the first linear group and second linear group. | 08-21-2014 |
20140246225 | TRANSPARENT CONDUCTIVE ELEMENT, INPUT DEVICE, ELECTRONIC APPARATUS, AND MASTER FOR PRODUCING TRANSPARENT CONDUCTIVE ELEMENT - A transparent conductive element having superior visibility includes: a substrate having a surface; and a transparent conductive portion and a transparent insulating portion provided alternately in a planar manner on the surface. At least one of the transparent conductive portion and the transparent insulating portion is a transparent conductive layer having a regular pattern therein. A shape pattern is provided in a boundary portion between the transparent conductive portion and the transparent insulating portion. | 09-04-2014 |
20140251663 | SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES USING PLATING RESIST - A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first plating resist. A through hole extends through the first dielectric layer, the first plating resist, and the second plating resist. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment. | 09-11-2014 |
20140251664 | CIRCUIT SUBSTRATE - In a ceramics substrate comprising a surface layer conductor having a sufficient thickness for a flow of a large current, wherein the conductor is buried in a surface region of the substrate, a crack caused by a temperature change of the substrate is effectively suppressed. In the ceramics substrate comprising the surface layer conductor having the sufficient thickness for the flow of the large current, wherein the conductor is buried in the surface region of the substrate, a shape of a cross section of a part of the surface layer conductor, the part being buried in a base, cut by a plane perpendicular to the surface is configured such that an end portion of the buried part at a side of the surface is wider than an end portion of the buried part at a side opposite to the surface. | 09-11-2014 |
20140262454 | STABILIZATION AGENTS FOR SILVER NANOWIRE BASED TRANSPARENT CONDUCTIVE FILMS - Zinc salts have been found to provide anticorrosion properties when incorporated into silver nanowire containing films. Such salts may be incorporated into one of more silver nanowire containing layers or in one or more layers disposed adjacent to the silver nanowire containing layers. | 09-18-2014 |
20140262455 | SIMULTANEOUS AND SELECTIVE WIDE GAP PARTITIONING OF VIA STRUCTURES USING PLATING RESIST - A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first plating resist. A through hole extends through the first dielectric layer, the first plating resist, and the second plating resist. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment. | 09-18-2014 |
20140262456 | HIGH ASPECT RATIO TRACES, CIRCUITS, AND METHODS FOR MANUFACTURING AND USING THE SAME - High aspect ratio trace circuits and methods of manufacture and use are provided herein. A method may include obtaining a substrate, the substrate having a reservoir for receiving a conductive ink and a plurality of trace voids that are arranged in a pattern, the plurality of trace voids each having a path of fluid connection to the reservoir, filling the reservoir with a conductive ink, placing a cover film over the plurality of trace voids, allowing the conductive ink to fill the plurality of trace voids via capillary action to create a plurality of conductive traces, and allowing the conductive ink in the plurality of conductive traces to dry. | 09-18-2014 |
20140284086 | VIBRATION-PROOF MATERIAL, VIBRATION-PROOF STRUCTURE, AND VIBRATION-PROOF METHOD - A vibration-proof material is obtained by foaming a rubber composition containing an ethylene-propylene-diene rubber. The content ratio of a sulfur atom calculated based on the measurement result of a fluorescent X-ray measurement, based on mass, is 1000 ppm or less and the vibration-proof material has a Young's modulus at 23° C. of 6.0×10 | 09-25-2014 |
20140284087 | CIRCUIT BOARD MADE OF AIN WITH COPPER STRUCTURES - Process for producing a ceramic circuit board with electrical conductor traces and contacting points on a side and with a through-hole contact by successively a) producing an AlN substrate and drilling holes at the locations for the vias, b) filling the holes with an adhesive paste containing copper, tungsten and/or molybdenum or alloys thereof, and c) single-pass overprinting with a second adhesive paste using a first screen-printing operation on a side of the ceramic substrate with the layout of the conductor traces and contact points, d) optionally, fully or partially repeating overprinting with the second adhesive paste, e) stoving the printed ceramic substrate in an oven with N | 09-25-2014 |
20140299365 | FLEXIBLE TOUCH SENSOR WITH FINE PITCH INTERCONNECT - An article includes a multilayer structure, such as, e.g., a touch sensor, having two opposing sides and comprising a central polymeric UV transparent substrate, a transparent conductive layer on each of the two major opposing surfaces of the polymeric substrate, a metallic conductive layer on each transparent conductive layer, and a patterned photoimaging mask on each metallic conductive layer. | 10-09-2014 |
20140311775 | CIRCUIT BOARD STRUCTURE - A circuit board structure includes a circuit board and at least one adsorption strip set on the circuit board. The circuit board defines at least one group of pin holes arranged along a predetermined line to receive a number of pins of an electronic component. The adsorption strip absorbs excess conducting material between adjacent pins during a wave-soldering process. | 10-23-2014 |
20140311776 | PLATING APPARATUS, PLATING METHOD, METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD - A voltage is applied between a stainless steel plate and an electrode such that the stainless steel plate is an anode, whereby a passive film formed at a portion to be plated of the stainless steel plate melts due to the reduction reaction and is removed. Thereafter, a voltage is applied between the stainless steel plate and the electrode such that the stainless steel plate is a cathode, whereby a plating underlayer is formed at the portion to be plated of the stainless steel plate from which the passive film is removed. | 10-23-2014 |
20140311777 | BENT PRINTED CIRCUIT BOARD FOR BACKLIGHT UNIT - Provided is a bent printed circuit board for a backlight unit, including: a metal plate including a first part, a second part extending from the first part, and a bending part formed between the first part and the second part; an insulating layer on the metal plate; and through holes passing through at least one of the metal plate and the insulating layer and placed on the bending part. | 10-23-2014 |
20140318834 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board of the present invention includes a core substrate in which wiring conductors are formed on both surfaces of an insulating plate, and a build-up layer in which a conductor layer is formed on a surface of an insulating resin layer having a higher coefficient of thermal expansion than that of the insulating plate. At least one build-up layer is stacked on one surface or both surfaces of the core substrate. Both surfaces of the insulating plate have different coefficients of thermal expansion. At least one build-up layer is stacked on a surface having a lower coefficient of thermal expansion. No build-up layer is stacked on the opposite surface, or a smaller number of build-up layers than that of the build-up layer formed on the surface having the lower coefficient of thermal expansion is formed on the opposite surface. | 10-30-2014 |
20140318835 | EPOXY RESIN COMPOUND AND RADIANT HEAT CIRCUIT BOARD USING THE SAME - An epoxy resin compound having an epoxy resin, a curing agent, and inorganic filler as main components is provided. The epoxy resin includes an epoxy resin of Chemical Formula. Accordingly, the thermal conductivity of the epoxy resin compound can be increased because the epoxy resin has a mesogen structure that facilitates crystallizability. In addition, a high radiant heat board can be provided by using the above-mentioned epoxy resin as an insulating material for a printed circuit board. | 10-30-2014 |
20140326488 | MICROELECTRONIC DEVICES AND MICROELECTRONIC SUPPORT DEVICES, AND ASSOCIATED ASSEMBLIES AND METHODS - Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes a microfeature workpiece having a side and an aperture in the side. The device can further include a workpiece contact having a surface. At least a portion of the surface of the workpiece contact can be accessible through the aperture and through a passageway extending between the aperture and the surface. Other aspects of the invention are directed toward a microelectronic support device that includes a support member having a side carrying a support contact that can be connectable to a workpiece contact of a microfeature workpiece. The device can further include recessed support contact means carried by the support member. The recessed support contact means can be connectable to a second workpiece contact of the microfeature workpiece. | 11-06-2014 |
20140338962 | GRAPHENE AND HEXAGONAL BORON NITRIDE PLANES AND ASSOCIATED METHODS - Graphene layers, hexagonal boron nitride layers, as well as other materials made of primarily sp2 bonded atoms and associated methods are disclosed. In one aspect, for example, a method of forming a graphene layer is provided. Such a method may include mixing a carbon source with a horizontally oriented molten solvent, precipitating the carbon source from the molten solvent to form a graphite layer across the molten solvent, and separating the graphite layer into a plurality of graphene layers. | 11-20-2014 |
20140345916 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. The printed circuit board according to a preferred embodiment of the present invention includes a base substrate; a through via formed to penetrate through the base substrate; and circuit patterns formed on one side and the other side of the base substrate and formed to be thinner than an inner wall of the through via. | 11-27-2014 |
20140345917 | DOUBLE-SIDED TRANSPARENT CONDUCTIVE FILM AND TOUCH PANEL - Provided are a double-sided transparent conductive film which is good in appearance even when its transparent conductive layers are patterned, and has anti-blocking property, thereby being producible at low costs; a wound body thereof; and a touch panel. The double-sided transparent conductive film includes a base material film, and a base material film, and an optical adjusting layer and a transparent conductive layer which are formed in this order on each of both sides of the base material film, wherein an anti-blocking layer containing particles is formed at least one of: a location between the base material film and one optical adjusting layer; and a location between the base material film and the other optical adjusting layer, the anti-blocking layer has a flat portion and protrusion portions caused by the particles, and a value obtained by subtracting a thickness of the flat portion of the anti-blocking layer from a mode diameter of the particles is larger than a thickness of the optical adjusting layer. | 11-27-2014 |
20140345918 | CONNECTION BOARD, OPTOELECTRONIC COMPONENT ARRANGEMENT AND ILLUMINATION DEVICE - A connection board includes at least one cut-out to fasten the connection board to an installation board and multiple contact surfaces electrically isolated from one another, wherein the contact surfaces electrically connect to one another when the connection board is in a fastened state by a fastener that extends through the cut-out. | 11-27-2014 |
20140353015 | Solder Joint For An Electrical Conductor And A Window Pane Including Same - A solder joint is disposed on an electrical conductor which comprises silver. The solder joint comprises bismuth and tin. The solder joint has a microstructure comprising a bismuth-rich solder bulk and a silver-solder reaction zone. The bismuth-rich solder bulk is disposed adjacent to the silver-solder reaction zone. The solder joint comprises a plurality of bismuth-rich grains formed from bismuth and substantially dispersed throughout at least the bismuth-rich solder bulk of the solder joint. A window pane comprising the solder joint is also disclosed. | 12-04-2014 |
20140353016 | CIRCUIT SUBSTRATE AND METHOD OF FORMING CIRCUIT PATTERN - With a nozzle being moved in one direction to a substrate unit, conductive ink is discharged out of a slit of the nozzle in a belt-like manner to the substrate unit. The conductive ink is discharged in a belt-like manner to the substrate unit on which a liquid-repellent region having a liquid repellency to the conductive ink and a lyophilic region having a lyophilic property to the conductive ink and having the same form as a desired circuit pattern are formed. Thereby, the conductive ink is applied to the lyophilic region, while the conductive ink is repelled at the remaining liquid-repellent region and flows into the lyophilic region. This allows for easier formation of the circuit pattern. | 12-04-2014 |
20140367149 | RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, BUILD-UP FILM, PREPREG AND PRINTED CIRCUIT BOARD - Disclosed herein are an insulating resin composition for a printed circuit board, a build-up film, a prepreg, and a printed circuit board. More specifically, disclosed herein are a build-up film prepared by using a resin composition containing a cage type silsesquioxane instead of the epoxy resin, and a multilayer printed circuit board including the build-up film or a prepreg. | 12-18-2014 |
20140367150 | PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD - The present disclosure relates to a prepreg formed by drying a fabric substrate impregnated with a resin composition by means of heating until the resin composition is in a semi-cured state. The resin composition contains (A) at least one of an epoxy resin having naphthalene skeleton and a phenolic curing agent; and (B) a polymer having structures represented by the following formulae (I) and (II), no unsaturated bond between carbon atoms, an epoxy value ranging from 0.2 to 0.8 ep/kg, and an weight-average molecular weight ranging from 200,000 to 850,000: | 12-18-2014 |
20140367151 | TRANSPARENT ELECTRODE - Disclosed herein is a transparent electrode, including: a colorless transparent polyimide film substrate; and a conductive layer formed on the substrate and including a conductive material containing carbon nanotubes, wherein the conductive layer includes a polymer binder. The transparent electrode is advantageous in that carbon nanotubes strongly adhere to a plastic substrate and the transparent electrode exhibits environmental stability. | 12-18-2014 |
20150008018 | MULTILAYER SUBSTRATE - A multilayer substrate includes a first substrate a second substrate that is stacked on and electrically connected to the first substrate, the second substrate having a different characteristic from a characteristic of the first substrate, a third substrate that is provided on a side of the first substrate, the second substrate being provided on the side of the first substrate, and the third substrate is electrically connected to the second substrate, and a connection member that electrically connects the first substrate and the third substrate to each other while the second substrate is bypassed. | 01-08-2015 |
20150008019 | WIRING BOARD AND MANUFACTURING METHOD THEREOF - A wiring board includes a variable wettability layer situated on a top surface of a support board and containing a material of which a critical surface tension changes by energy given thereto. A conductive layer is situated inside a concave portion formed in the variable wettability layer. The concave portion has opposite side walls formed in tapered surfaces inclining so that a distance between the side walls is reduced toward a bottom of the concave portion in a cross-sectional shape taken along a plane perpendicular to a conducting direction of the conductive layer. Upper edges of the side walls are formed in gently curved surfaces. | 01-08-2015 |
20150014027 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring substrate includes an insulating layer, a pad, and a solder resist layer. The insulating layer has a first surface formed with a first recess portion. The pad is embedded in the first recess portion. The pad includes a second surface and a third surface. The third surface that is located at a lower position than the first surface so as to expose an inner wall surface of the first recess portion. The pad is formed with a second recess portion in a center portion of the third surface. The solder resist layer is provided on the first surface. An adjacent portion of the first surface to a peripheral portion of the first recess portion is smaller in roughness than a region of the first surface peripheral to the adjacent portion of the first surface. | 01-15-2015 |
20150027756 | CIRCUIT BOARD STRUCTURE FOR HIGH FREQUENCY SIGNALS - A circuit board structure for high frequency signals includes a substrate and an electrical conductive circuit layer formed on the substrate. The conductive circuit layer includes circuit patterns and connection pads. The circuit pattern includes a base part with a shape of a rectangular block and a circular top part with a hemispherical shape provided on the base part. The circular top part can be modified by a circular bottom part embedded in the dielectric plastic film. Alternatively, a double layer structure with the circular top and bottom parts is formed such that the surface of the circuit pattern is provided with hemispheres to strengthen the reflection, thereby overcoming the problem of signal concentration due to the rectangular structure or the issue of signal attenuation due to surface roughness. | 01-29-2015 |
20150027757 | PCB HAVING GLASS CORE - Disclosed herein is a printed circuit board (PCB) including a glass core for maintaining sufficient rigidity while maintaining a thin thickness to minimize warpage. The PCB includes a glass core having upper and lower surfaces in which pattern formation grooves and through via holes are formed, a plating layer filled in the pattern formation groves and the through via holes, insulating layers stacked on the upper and lower surfaces of the glass core, and solder resist layers formed on the insulating layers via coating. | 01-29-2015 |
20150027758 | MULTILAYER WIRING SUBSTRATE AND MANUFACTURING METHOD THEREFOR - To provide a multilayer wiring substrate which can reliably prevent removal of a via conductor and which exhibits excellent connection reliability. A multilayer wiring substrate | 01-29-2015 |
20150027759 | CONDUCTIVE ELEMENT AND METHOD OF MANUFACTURING THE SAME, WIRING ELEMENT, AND MASTER COPY - A conductive element includes: a substrate having a first wavy surface, a second wavy surface, and a third wavy surface; a first layer provided on the first wavy surface; and a second layer formed on the second wavy surface. The first and second layers form a conductive pattern portion. The first, second, and third wavy surfaces satisfy the following relationship: | 01-29-2015 |
20150034369 | RESIN COMPOSITION FOR PRINTED WIRING BOARDS - Provided is a resin composition which enables the formation of a roughened surface having a low roughness degree on the surface of an insulation layer in a printed wiring board material when used on the insulation layer regardless of the roughening conditions employed and also enables the formation of a conductive layer having excellent adhesion properties, heat resistance, heat resistance under absorption of moisture, thermal expansion properties and chemical resistance on the roughened surface. A resin composition comprising (A) an inorganic filler that is soluble in an acid, (B) a cyanic acid ester compound and (C) an epoxy resin. | 02-05-2015 |
20150034370 | WHITE COLOR COATING LAYER-FORMED TOUCH SCREEN PANEL AND WHITE COLOR COATING LAYER VACUUM COATING METHOD OF TOUCH SCREEN PANEL - Disclosed is a white costing layer-formed touch screen panel. The coating layer includes a glass substrate, a white coating layers selectively formed on an edge portion of the glass substrate, a black color coating layer selectively formed on an edge portion, and a transparent conductive layer formed on the glass substrate including the edge portion. | 02-05-2015 |
20150034371 | STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAPSULATION SURFACE - A structure may include bond elements having bases joined to conductive elements at a first portion of a first surface and end surfaces remote from the substrate. A dielectric encapsulation element may overlie and extend from the first portion and fill spaces between the bond elements to separate the bond elements from one another. The encapsulation element has a third surface facing away from the first surface. Unencapsulated portions of the bond elements are defined by at least portions of the end surfaces uncovered by the encapsulation element at the third surface. The encapsulation element at least partially defines a second portion of the first surface that is other than the first portion and has an area sized to accommodate an entire area of a microelectronic element. Some conductive elements are at the second portion and configured for connection with such microelectronic element. | 02-05-2015 |
20150041189 | METAL-INSULATOR-METAL CAPACITORS ON GLASS SUBSTRATES - This disclosure provides systems, methods, and apparatus for metal-insulator-metal capacitors on glass substrates. In one aspect, an apparatus may include a glass substrate, with the glass substrate defining at least one via in the glass substrate. A first electrode layer may be disposed over surfaces of the glass substrate, including surfaces of the at least one via. A dielectric layer may be disposed on the first electrode layer. A second electrode layer may be disposed on the dielectric layer, with the dielectric layer electrically isolating the first electrode layer from the second electrode layer. | 02-12-2015 |
20150047882 | Graphitic Substrates with Ceramic Dielectric Layers - Different kinds of printing pastes or inks are utilized in various combinations to develop multiple ceramic dielectric layers on graphitic substrates in order to create effective dielectric ceramic layers that combine good adhesion to both graphitic substrates and printed copper traces, and strong insulating capability. The pastes or inks may comprise a high thermal conductivity powder. | 02-19-2015 |
20150047883 | TRANSPARENT CONDUCTIVE COATINGS ON AN ELASTOMERIC SUBSTRATE - A transparent, conductive article that includes a network of electrically conductive metal traces defining cells that are transparent to light on a self-supporting, elastomeric substrate, as well as a process for forming the article. | 02-19-2015 |
20150047884 | Copper Foil with Carrier, Method of Producing Same, Copper Foil with Carrier for Printed Wiring Board, and Printed Wiring Board - Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 μm, and the ratio L1/D1 of the particle length L1 to the average diameter D1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil. | 02-19-2015 |
20150053466 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A printed circuit board (PCB) and a method for manufacturing the PCB are disclosed. A PCB includes a transparent insulating substrate, a conductive circuit layer | 02-26-2015 |
20150053467 | MULTILAYER SUBSTRATE - Provided is a multilayer substrate that can prevent generation of cracks caused by stress generated due to a difference between the coefficient of linear expansion of electrode pads and that of a ceramic material. An electrode pad arranged on a layer below an outermost component mounting electrode pad has a larger area than an area of the component mounting electrode pad. Similarly, an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad, an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad, and an electrode pad arranged on a layer below a component mounting electrode pad has a larger area than an area of the component mounting electrode pad. | 02-26-2015 |
20150060115 | COPPER CLAD LAMINATE FOR PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - Disclosed herein are a copper clad laminate for a printed circuit board, in which a composite having a glass fibers formed on both sides of a prepreg is disposed between a resin layer of a first resin-coated copper foil (RCC) and a resin layer of a second resin-coated copper foil and having a structure in which the resin layers are symmetric or asymmetric based on the composite, and a manufacturing method thereof. A thickness of the copper clad laminate may be manufactured at the desired thickness or the thickness may be uniformly maintained, such that stabilization of thickness quality may be implemented, the adhesion between the copper foil and the resin may be improved, and warpage may be adjusted when laminating substrates having different upper and lower thermal expansion coefficients. | 03-05-2015 |
20150060116 | CAVITY PACKAGE WITH PRE-MOLDED SUBSTRATE - A cavity package is set forth along with a method of manufacturing thereof. The method comprises applying a selective plating resist to a metallic substrate in a pattern to expose portions for a ring, tie bars, die attach pad and input/output wire bonding pads; elective depositing of metal plating using the selective plating resist; removing the selective metal plating resist; applying a selective etching resist to the substrate; selectively etching portions of the substrate not covered by the selective etching resist; stripping away the selective etching resist; pre-molding a leadframe to the substrate so as to surround the die attach pad portion; etching the tie bars away from the bottom surface of the substrate; attaching a semiconductor device die to the die attach pad; wire bonding the semiconductor device to the input/output wire bonding pads; and attaching a cap to the ring portion of the substrate and the die attach pad to protect the wire bonded semiconductor device die and permit electrical grounding | 03-05-2015 |
20150060117 | FLAT CABLE WITH CONSISTENT IMPEDANCE - A flat cable ( | 03-05-2015 |
20150075847 | METAL-ELECTRODEPOSITED INSULATOR SUBSTRATE AND METHOD OF MAKING THE SAME - A method of making a metal-electrodeposited insulator substrate includes: forming first and second continuous conductor parts of a patterned conductive base layer on a pattern-forming surface of an insulator substrate; subjecting an assembly of the patterned conductive base layer and the insulator substrate to electroplating so as to simultaneously form first and second electroplating parts of a patterned electroplating layer on the patterned conductive base layer; and removing a sacrificial portion of the first continuous conductor part and a sacrificial portion of the first electroplating part from the insulator substrate. | 03-19-2015 |
20150075848 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes multiple insulating layers including first, second, third, fourth and fifth insulation layers laminated in the order of the first, second, third, fourth and fifth insulation layers. The first insulation layer has a first conductor including plating, the second insulation layer has a second conductor including plating, the third insulation layer has a third conductor including conductive paste, the fourth insulation layer has a fourth conductor including plating, the fifth insulation layer has a fifth conductor including plating, and the first conductor, the second conductor, the third conductor, the fourth conductor and the fifth conductor are formed along the same axis and are electrically continuous with each other. | 03-19-2015 |
20150083468 | TEXTURED GLASS SUBSTRATE HAVING ENHANCED OPTICAL PROPERTIES FOR AN OPTOELECTRONIC DEVICE - The invention relates to a glass substrate having enhanced optical properties for optoelectronic devices, wherein said substrate is totally or partially textured, by means of a chemical attack, on at least one of the surfaces thereof with a set of geometric patterns such that the arctangent of the ratio of the mean height of the patterns, R | 03-26-2015 |
20150083469 | WIRING BOARD - A wiring board includes a substrate body provided with a through hole penetrating the substrate body from one surface to another surface; and a through wiring formed in the through hole and including a first metal layer formed on a part of an inner side surface of the through hole at the one surface side, a first wiring layer that covers the first metal layer to fill a part of the through hole at the one surface side, a second metal layer continuously formed on the rest part of the inner side surface of the through hole at the other surface side and on an end portion of the first wiring layer at the other surface side, and a second wiring layer that covers the second metal layer to fill a part of the through hole at the other surface side. | 03-26-2015 |
20150083470 | WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A wiring substrate is provided with a support substrate ( | 03-26-2015 |
20150083471 | COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A combined wiring board includes a metal frame having multiple opening portions, and multiple wiring boards accommodated in the opening portions in the metal frame, respectively. The opening portions in the metal frame have side walls having holding portions such that the holding portions hold the wiring boards in the opening portions in the metal frame, and the metal frame has slit portions adjacent to the holding portions and connecting portions connecting the slit portions to the opening portions. | 03-26-2015 |
20150083472 | METAL CORE SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND CORE PLATE USABLE FOR THE SAME - A metal core substrate is obtained as a result of outline shaping performed on a substrate including a core plate and an insulating layer provided on each of two surfaces of the core plate. At least a part of an outer circumferential edge of the metal core substrate has an insulating structural portion, which includes an end surface of the core plate that is retracted from an end surface of the outer circumferential edge of the metal core substrate and an insulating covering portion that is formed of a resin used to form the insulating layers and covers the end surface of the core plate. Separation portions to be filled with the resin and coupling portions which are to be removed before outline shaping are formed at outline shaping positions of the core plate. At the time of outline shaping, only the resin is present at the outline shaping positions. Thus, outline shaping can be performed without using a die. | 03-26-2015 |
20150090480 | ELECTRONIC COMPONENT PACKAGE AND METHOD FOR FORMING SAME - An electronic component package includes a substrate and dielectric structure. The dielectric structure includes a top surface having a protrusion portion and a lower portion. The protrusion portion is located at first height that is greater than a second height of the lower portion. A conductive bond pad is located over the dielectric structure. A ball bond electrically couples the bond pad and a bond wire. An intermetallic compound located between the ball bond and bond pad is formed of material of the ball bond and bond pad and electrically couples the bond pad to the ball bond. A portion of the bond pad is vertically located between a portion of the lower portion of the top surface of the dielectric structure and the intermetallic compound. No portion of the bond pad is vertically located between at least a portion of the protrusion portion and the intermetallic compound. | 04-02-2015 |
20150096791 | CERAMIC MULTILAYER SUBSTRATE - In a ceramic multilayer substrate formed by stacking and firing a plurality of insulating layers, the insulating layer in an uppermost surface layer includes a ceramic layer, a contraction suppression layer stacked on the ceramic layer, and a surface-layer via conductor penetrating through the ceramic layer and the contraction suppression layer and having a tapered shape gradually tapering toward the lower layer side. The surface-layer via conductor has an end surface that is exposed from the contraction suppression layer forming the surface of the ceramic multilayer substrate, and that is directly connected to a terminal of a component mounted to the surface of the ceramic multilayer substrate. A weight ratio of alumina contained in the contraction suppression layer is set higher than a weight ration of alumina contained in the ceramic layer. | 04-09-2015 |
20150096792 | ELECTRONIC COMPONENT UNIT AND MANUFACTURING METHOD THEREFOR - An electronic component unit includes a substrate including principal surfaces opposing each other and side surfaces between the principal surfaces, and components mounted on the principal surface of the substrate. The side surfaces include first side surfaces formed before the components are mounted and second side surfaces formed after the components are mounted. As viewed from a line normal to the principal surface of the substrate, distances between the first side surfaces and the components are different from distances between the second side surfaces and the components. | 04-09-2015 |
20150101848 | SURFACE-TREATED COPPER FOIL AND COPPER-CLAD LAMINATE PLATE INCLUDING THE SAME, PRINTED CURCUIT BOARD USING THE SAME, AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a surface-treated copper foil, a copper-clad laminate plate including the same, a printed circuit board using the same, and a method for manufacturing the same. In detail, the copper-clad laminate plate according to one implementation embodiment of the present invention includes: carrier; a peel layer formed on the carrier; a copper-clad layer formed on the peel layer; and a surface-treated layer formed on the copper-clad layer, in which the surface-treated layer includes a thiol-based compound. Therefore, the present invention provides a printed circuit board capable of improving an adhesive force between a base and a copper-clad layer without treating a roughed surface by forming the surface-treated layer on the copper-clad layer. | 04-16-2015 |
20150107879 | WIRING SUBSTRATE, MULTI-PIECE WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING SAME - A wiring substrate includes a substrate main body which is formed of a ceramic laminate and has a rectangular shape in plan view, and which has a front surface and a back surface and has four side surfaces, each being located between the front surface and the back surface, and having a groove surface located on a side toward the front surface and a fracture surface located on a side toward the back surface; and a metalized layer which is formed on the front surface of the substrate main body so as to extend along the four side surfaces, and which has a rectangular frame shape in plan view, wherein a horizontal surface of the ceramic laminate of the substrate main body is exposed between the metalized layer and the groove surface of each side surface of the substrate main body. | 04-23-2015 |
20150107880 | MULTILAYER PRINTED CIRCUIT BOARD - Disclosed herein is a multilayer printed circuit board. The multilayer printed circuit board according to the present invention includes: a stack via stacked in an upper portion of a core layer; staggered vias formed at both sides of the stack via and stacked on the core layer; and a solder resist layer stacked in a lower portion of the core layer and stacked on an insulating film except for open regions of the stack via and the staggered vias, such that the plurality of vias formed in the staggered via may increase rigidity to prevent warpage of the multilayer printed circuit board from being generated. | 04-23-2015 |
20150107881 | TOUCH SENSOR WITH ORNAMENT, METHOD OF MANUFACTURING SAME, AND TRANSPARENT CONDUCTIVE SENSOR USED IN SAME - A touch sensor with an ornament includes a transparent substrate with a flat center part and a raised outer rim part, and a film substrate based transparent conductive sensor with a transparent conductive film layer attached to the inner face of the transparent substrate. A transparent conductive film layer circuit of the transparent conductive film layer is formed at the flat center part, and a routing circuit for detecting an electric signal from the transparent conductive film layer circuit and a decorative print layer for concealing the routing circuit are formed at the raised outer rim part. | 04-23-2015 |
20150107882 | CIRCUIT BOARD, ELECTRONIC MODULE AND ILLUMINATING DEVICE HAVING THE CIRCUIT BOARD, AND METHOD FOR MANUFACTURING THE CIRCUIT BOARD - Various embodiments relate to a circuit board, including a base and a heat-conducting layer. The base has a first region and a second region on one side thereof facing the heat-conducting layer, the first region is recessed with respect to the second region, a first insulating layer is accommodated in the first region, a second insulating layer is formed on the second region, and the first insulating layer and the second insulating layer have different thermal conductivities. In addition, various embodiments further relate to an electronic module and an illuminating device including such circuit board. Various embodiments also relate to a method for manufacturing such circuit board. | 04-23-2015 |
20150107883 | PRINTED CIRCUIT BOARD PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A printed circuit board package structure includes a substrate, plural ring-shaped magnetic elements, a support layer, and first conductive layers. The substrate has two opposite first and second surfaces, first ring-shaped recesses, and first grooves. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes. | 04-23-2015 |
20150114693 | INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS MANUFACTURED BY USING THE SAME - Disclosed herein are an insulating resin composition for a printed circuit board, and an insulating film, a prepreg, a copper clad laminate, or a printed circuit board manufactured by using the same. More specifically, the insulating resin composition contains an eucryptite inorganic filler having a negative coefficient of thermal expansion, such that a glass transition temperature and a coefficient of thermal expansion may be improved, and warpage of the insulating film, the prepreg, the copper clad laminate, or the printed circuit board manufactured by using the insulating resin composition for a printed circuit board may be minimized. | 04-30-2015 |
20150114694 | ASSEMBLY OF A CIRCUIT BOARD AND A FLEXIBLE FLAT CABLE, CIRCUIT BOARD, AND ASSEMBLING METHOD FOR A FLEXIBLE FLAT CABLE - An assembly includes a circuit board and a flexible flat cable. The circuit board includes a board body having top, bottom and side faces, and a connection module. The board body is formed with a positioning slot that is formed through the top and bottom faces and that has a first length, and an opening that extends from the side face and that is in spatial communication with the positioning slot. The opening is formed through the top and bottom faces and has a second length shorter than the first length. The flexible flat cable includes a connection unit and a cable main body that has a width greater than the second length. The cable main body is able to pass through the opening, and extends through and is positioned in the positioning slot. | 04-30-2015 |
20150114695 | ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT SERIES, AND CARRIER TAPE - An electronic component package includes a carrier tape in which a plurality of substantially recess-shaped electronic component holding portions are provided in an elongated, narrow base material configured of a resin so that the electronic component holding portions include openings on one surface of the base material and bulge outward on the other surface of the base material, and a cover tape affixed to the one surface of the carrier tape so as to cover the openings in the respective electronic component holding portions. A thickness dimension of a base portion of the electronic component holding portion is smaller than a thickness dimension of the base material. | 04-30-2015 |
20150114696 | CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a core substrate and a method for manufacturing the same. According to a preferred embodiment of the present invention, a core substrate includes: a porous scaffold formed with a void; an insulating material formed to fill a void of the porous scaffold; and an electronic device embedded into the porous scaffold and the insulating material and having external electrodes formed on both surfaces thereof. | 04-30-2015 |
20150114697 | Ceramic Capacitors with Improved Lead Designs - An electronic component is provided with improved thermal stability. The electronic component comprises at least one capacitive element wherein the capacitive element comprises internal electrodes of alternating polarity separated by a dielectric. External terminations with a first external termination of the external terminations are in electrical contact with internal electrodes of a first polarity and a second external termination of the external terminations are in electrical contact with internal electrodes of a second polarity. A first external lead frame is in electrical contact with the first external termination with a conductive bond there between wherein the first external lead frame comprises at least one feature selected from the group consisting of a perforation, a protrusion and an edge indentation. | 04-30-2015 |
20150129287 | CABLE BACKPLANE SYSTEM HAVING STIFFENERS - A cable backplane system includes a backplane having board areas surrounding a connector opening with holes in the board areas along the connector opening. Stiffeners are coupled to corresponding board areas along a front of the backplane. The stiffeners have bores aligned with corresponding holes in the backplane. A cable rack is coupled to the rear of the backplane. The cable rack has a tray with a frame surrounding a raceway and spacers coupled to the tray that hold corresponding cable connectors. The spacers have guide pins extending therefrom that pass through the holes in the backplane into corresponding bores in the stiffeners to position the spacers relative to the stiffeners and the backplane. The cable connectors are received in the connector opening in the backplane and held in position relative to the backplane by the spacers and stiffeners. | 05-14-2015 |
20150129288 | CIRCUIT SUBSTRATE AND METHOD FOR MAKING THE SAME - A circuit substrate includes: a substrate; an insulating coating layered structure formed on the substrate, having top and bottom surfaces, and formed with a patterned recess that is indented inwardly from the top surface, that is disposed above the bottom surface, and that is defined by a recess-defining wall, the recess-defining wall having a bottom wall portion and a surrounding wall portion that extends upwardly from a periphery of the bottom wall portion; and a patterned metallic layered structure including an electroless plating metal layer formed on the bottom wall portion of the recess-defining wall. | 05-14-2015 |
20150129289 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board according to an exemplary embodiment of the present disclosure includes: a substrate; a metal root layer formed by injecting and depositing metal particles into and on the substrate; and a circuit layer formed on the metal root layer. | 05-14-2015 |
20150136450 | TOUCH PANEL AND METHOD OF MANUFACTURING THE SAME - There are provided a touch panel and a method of manufacturing the same. The touch panel includes: a substrate; and a plurality of fine conductive lines, each of the fine conductive lines including a first black layer formed to have a predetermined pattern, a metal layer formed in accordance with the first black layer, and a second black layer formed on the upper and side surfaces of the metal layer. | 05-21-2015 |
20150136451 | ELECTRONIC COMPONENT MODULE - There is provided an electronic component module including: a substrate on which an electronic component is mounted; at least one insulating member coupled to the substrate and having a surface on which a plating layer is formed; and a molded portion covering the electronic component and the at least one insulating member, wherein the insulating member is bonded to the substrate and a metal layer is formed on a bonding surface between the substrate and the insulating member. | 05-21-2015 |
20150136452 | HIGH-WITHSTANDING-VOLTAGE ALUMINA SINTERED COMPACT AND HIGH-WITHSTANDING-VOLTAGE MEMBER - The high-withstanding-voltage member includes an alumina sintered compact containing alumina as a main crystal. Furthermore, the alumina sintered compact exhibits a peak intensity of 5000 or less at a wavelength of about 330 nm when measured by a cathode luminescence method. | 05-21-2015 |
20150136453 | COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A combined wiring board includes a wiring board set having multiple wiring boards and one or more adhesive agent portions such that the wiring boards are connected each other by the adhesive agent portion or adhesive agent portions, and a metal frame having an accommodation opening portion formed to accommodate the wiring board set such that the wiring board set is positioned in the accommodation opening portion of the metal frame. | 05-21-2015 |
20150136454 | COMBINED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A combined wiring board includes multiple wiring boards, and a connected metal frame having multiple metal frames and one or more connecting portions such that the metal frames are connected each other by the connecting portion or connecting portions and have accommodation opening portions formed to accommodate the wiring boards, respectively. | 05-21-2015 |
20150136455 | SHAPE FORMING PROCESS AND APPLICATION THEREOF FOR CREATING STRUCTURAL ELEMENTS AND DESIGNED OBJECTS - A tool provided that individually creates three-dimensional structural elements which are sequentially positioned into formation of a shaped object. | 05-21-2015 |
20150144382 | HIGH SPEED DIFFERENTIAL WIRING IN GLASS CERAMIC MCMS - The embodiments of the present invention relate generally to the fabrication of integrated circuits, and more particularly to a structure and method for fabricating differential wiring patterns in multilayer glass-ceramic (MLC) modules. A structure and method of forming a MLC having layers with staggered, or offset, pairs of lines formed directly on one another are disclosed. In addition, a structure and method of forming a MLC having layers with staggered, or offset, pairs of lines that periodically reverse polarity are disclosed. | 05-28-2015 |
20150144383 | Plug Standards-Compliant Circuit Modules and Connectors - A high speed, high reliability circuit module and connective strategy that is connectively compliant with a receptacle in compliance with the SFF-8639 Specification whether expressing for example a PCIe interface or a high speed SAS interface. The present invention reduces impedance discontinuity by reducing the interconnection length and cross-planar transit found in typical specification compliant connectors. | 05-28-2015 |
20150296613 | WIRING BOARD AND MOUNTING STRUCTURE INCLUDING THE SAME - According to an aspect of the invention, a wiring board includes an inorganic insulating layer and a conductive layer disposed on part of one main surface of the inorganic insulating layer. The part of the one main surface of the inorganic insulating layer includes a plurality of first recessed portions each of which has at least partially circular shape in a plan view. Part of the conductive layer enters into the plurality of first recessed portions. According to the aspect of the invention, it is possible to obtain a wiring board capable of reducing disconnection of the conductive layer and therefore having superior electrical reliability. | 10-15-2015 |
20150313018 | WIRING SUBSTRATE AND PRODUCTION METHOD THEREFOR - A wiring substrate includes an insulation substrate, a through hole, an upper-surface-side land conductor, a lower-surface-side land conductor, and a through hole conductor. The insulation substrate includes a first insulation layer, a second insulation layer, and a glass fiber layer provided between the first and second insulation layers. The through hole has a diameter which decreases from the upper surface of the insulation substrate toward the interior thereof, which becomes smallest at the glass fiber layer, and which increases from the glass fiber layer toward the lower surface of the insulation substrate. The upper-surface-side land conductor and the lower-surface-side land conductor respectively cover the upper-surface-side and lower-surface-side openings of the through hole. The through hole conductor is formed in the through hole. The upper-surface-side opening of the through hole has a diameter larger than that of the lower-surface-side opening of the through hole, and the upper-surface-side land conductor has a diameter larger than that of the lower-surface-side land conductor. | 10-29-2015 |
20150315382 | THERMOPLASTIC COMPOSITION - A thermoplastic composition including a) a1) a thermoplastic resin and a2) a silicon containing rubber and/or b) a polysiloxane-polycarbonate copolymer; and c) a metal (oxy)hydroxide with BET surface area of at least 10 as determined by DIN ISO 9277: 2010. | 11-05-2015 |
20150319849 | COMPONENT FIXING STRUCTURE, CIRCUIT BOARD, AND DISPLAY PANEL - The present invention provides a component securing structure that forms a wiring unit on a TFT glass substrate that is capable of transmitting UV light. A component, such as a driver IC and/or an FPC, is electrically connected to the wiring unit and is secured to the TFT glass substrate by a UV-curable ACF. An opening for transmitting UV light is formed in a light shielding layer of the wiring unit. UV light irradiated from the back side of the TFT glass substrate passes through the opening and directly irradiates the UV-curable ACF. | 11-05-2015 |
20150319850 | Board Integrated Interconnect - In an embodiment, a method includes forming a printed circuit board by depositing a first plurality of layers and forming an interconnect integral to the printed circuit board by depositing a second plurality of layers on at least a portion of the first plurality of layers. The interconnect includes a stabilizing structure and a contact positioned within the stabilizing structure. The stabilizing structure includes a first material and the contact includes a second material that is different than the first material. | 11-05-2015 |
20150319868 | MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a multilayer circuit board includes: forming a first patterned conductive layer on a ceramic substrate, the first patterned conductive layer having a first circuit pattern and a first submount pattern; forming a second patterned conductive layer on the first patterned conductive layer, the second patterned conductive layer having a second circuit pattern and a second submount pattern; forming an insulating layer on the ceramic substrate; and forming a third patterned conductive layer on the insulating layer. The third patterned conductive layer having a third circuit pattern and a third submount pattern. The first, second and third submount patterns are stacked one above another. | 11-05-2015 |
20150351237 | CIRCUIT MATERIALS WITH IMPROVED FIRE RETARDANT SYSTEM AND ARTICLES FORMED THEREFROM - A circuit subassembly, comprising a conductive layer, a dielectric layer is formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition, a low polarity resin, a oxaphosphorinoxide-containing aromatic compound, and an protective adhesive layer disposed between the conductive layer and the dielectric layer, wherein the circuit subassembly has a UL-94 rating of at least V-0. Also disclosed is a composition for a bond ply and a circuit subassembly that further comprises such bond ply. | 12-03-2015 |
20150351241 | Ceramic Wiring Substrate, Semiconductor Device, And Method For Manufacturing Ceramic Wiring Substrate - A ceramic wiring substrate and method for manufacturing the same, the substrate having an up-and-down conduction body which is made by forming a porous structure body from a high melting point metal and then infiltrating a low-resistance metal in an up-and-down conduction hole subsequently formed in a substrate made in a plate shape through sintering a ceramic precursor, the conduction body having a normal composite structure without an abnormally grown particle, a void, a crack and the like and not having a problem of falling off from the substrate, as well as provided a semiconductor device using this substrate. An intermediate layer formed of at least one selected from a group of Mo, W, Co, Fe, Zr, Re, Os, Ta, Nb, Ir, Ru and Hf is formed on an inner surface of the up-and-down conduction hole of the substrate before being provided with the conduction body having the composite structure. | 12-03-2015 |
20150357277 | WIRING SUBSTRATE - To provide a wiring substrate which can reliably prevent progress of cracking in a solder bump, and which exhibits improved reliability. The wiring substrate | 12-10-2015 |
20150359087 | CIRCUIT BOARD HAVING INTERIOR SPACE - A circuit board having an interior space includes a multi-layer structure and a compartmentalized frame embedded in the multi-layer structure. The multi-layer structure has a plurality of plates stacked along a stacking direction and a gel combining any two adjacent plates. The plates include two outer plates and at least one inner plate arranged between the outer plates. The compartmentalized frame defines a predetermined space. The compartmentalized frame is arranged between the outer plates and substantially abuts the outer plates. The compartmentalized frame is arranged in a path of a flowing direction of gel which flows toward the predetermined space to prevent any gel from flowing into the predetermined space. Thus, the circuit board of the instant disclosure is provided with the interior space accurately formed by embedding the compartmentalized frame. | 12-10-2015 |
20150366055 | SUBSTRATE AND TOUCH PANEL MEMBER USING SAME - The present invention aims to provide a substrate having an ITO with a low ITO pattern visibility, which substrate is formed by a method utilizing a simple technique such as coating, printing or the like, and which method is less burdensome from the viewpoints of cost and process; and to provide a touch panel member using the substrate. The present invention provides a substrate including a region where thin layers are laminated on a transparent ground substrate, which thin layers are, in the order mentioned from the upper surface of the substrate: an ITO (Indium Tin Oxide) thin layer (I); an organic thin layer (II) having a film thickness of from 0.01 to 0.4 μm and a refractive index of from 1.58 to 1.85; and a transparent adhesive thin layer (III) having a refractive index of from 1.46 to 1.52. | 12-17-2015 |
20150370374 | METHOD AND APPARATUS FOR FORMING PATTERNS IN COATINGS ON OPPOSITE SIDES OF A TRANSPARENT SUBSTRATE - A method of forming patterns in coatings on opposite sides of a transparent substrate by direct write laser patterning comprising the steps: a) providing a first transparent coating on a first side of the substrate, the first coating being formed of a material having a relatively high laser ablation threshold energy density; b) mounting the substrate on a stage or locating the substrate on a chuck, c) using a first laser beam to form a first pattern in the first transparent coating by laser ablation; d) providing a second transparent coating on the second side of the substrate after formation of said first pattern, the second coating being formed of a material having a relatively low laser ablation or modification threshold energy density; using a second laser beam to form a second pattern in the second transparent coating by laser ablation or modification, the energy density of the second laser beam being lower than that of the first laser beam such that ablation of the second transparent coating is carried out without causing appreciable damage to the first transparent coating. Apparatus arranged to carry out this method and a product formed by the method are also described. | 12-24-2015 |
20150371931 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME - A semiconductor device includes a frame including a first step portion provided in a ring shape in an inner circumference of one main surface of the frame, a second step portion provided in a ring shape in an inner circumference of another main surface of the frame, and an inner wall provided between the first step portion and the second step portion; a terminal leading from the first step portion to outside; a circuit board fitted to the second step portion; and an adhesive resin bonding the second step portion and the circuit board, and contacting the inner wall and the terminal. | 12-24-2015 |
20160007450 | Method for Producing a Printed Circuit Board with MultiLayer Sub-Areas in Sections - A method for producing a printed circuit board ( | 01-07-2016 |
20160007451 | CIRCUIT SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A circuit substrate includes a core substrate having cavity penetrating through the core substrate, a metal block accommodated in the cavity of the core substrate, a first build-up layer including an insulating layer and laminated on first side of the core substrate such that the first build-up layer is covering the cavity on the first side of the core substrate, and a second build-up layer including an insulating layer and laminated on second side of the core substrate such that the second build-up layer is covering the cavity on the second side of the core substrate, and a filling resin filling gap formed between the cavity and block positioned in the cavity of the core substrate. The block has roughened surfaces such that the roughened surfaces are in contact with the insulating layers in the first and second build-up layers on the first and second sides of the core substrate. | 01-07-2016 |
20160016355 | Adaptive Composite Structure Using Shape Memory Alloys - Systems and processes that integrate thermoplastic and shape memory alloy materials to form an adaptive composite structure capable of changing its shape. For example, the adaptive composite structure may be designed to serve as a multifunctional adaptive wing flight control surface. Other applications for such adaptive composite structures include in variable area fan nozzles, winglets, fairings, elevators, rudders, or other aircraft components having an aerodynamic surface whose shape is preferably controllable. The material systems can be integrated by means of overbraiding (interwoven) with tows of both thermoplastic and shape memory alloy materials or separate layers of each material can be consolidated (e.g., using induction heating) to make a flight control surface that does not require separate actuation. | 01-21-2016 |
20160021738 | High Rate Electric Field Driven Nanoelement Assembly on an Insulated Surface - A method for high rate assembly of nanoelements into two-dimensional void patterns on a non-conductive substrate surface utilizes an applied electric field to stabilize against forces resulting from pulling the substrate through the surface of a nanoelement suspension. The electric field contours emanating from a conductive layer in the substrate, covered by an insulating layer, are modified by a patterned photoresist layer, resulting in an increased driving force for nanoelements to migrate from a liquid suspension to voids on a patterned substrate having a non-conductive surface. The method can be used for the production of microscale and nanoscale circuits, sensors, and other electronic devices. | 01-21-2016 |
20160066433 | SUPPORT BODY, METHOD OF MANUFACTURING SUPPORT BODY, METHOD OF MANUFACTURING WIRING BOARD, METHOD OF MANUFACTURING ELECTRONIC COMPONENT, AND WIRING STRUCTURE - A method of manufacturing a support body includes: (a) preparing a support substrate; (b) preparing a metal foil on which a peeling layer is provided; (c) providing an adhesion adjusting layer on the support substrate in a certain region of the support substrate excluding an outer peripheral portion of the support substrate, wherein the adhesion adjusting layer is configured to adjust a contact area between the peeling layer and the support substrate; and (d) providing the metal foil on the support substrate such that the peeling layer provided on the metal foil faces the support substrate via the adhesion adjusting layer. In step (d), the adhesion adjusting layer is adhered to the support substrate, and the peeling layer is adhered to the outer peripheral portion of the support substrate, and is in contact with the adhesion adjusting layer but is not adhered to the adhesion adjusting layer. | 03-03-2016 |
20160081185 | WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF - A wired circuit board includes a wire, and a terminal formed continuously to the wire to be electrically connected to an electronic element at one surface thereof in a thickness direction of the wired circuit board. The terminal includes, at the one surface thereof in the thickness direction, a projecting portion projecting toward one side thereof in the thickness direction, and a covering layer covering one end portion of the projecting portion in the thickness direction. | 03-17-2016 |
20160095222 | Chip Substrate Comprising Cavity with Curved Surfaces - A chip substrate includes conductive portions, an insulation portion and a cavity. The conductive portions are laminated in one direction to constitute the chip substrate. The insulation portion is interposed between the conductive portions to electrically isolate the conductive portions. The cavity is formed on an upper surface of the chip substrate at a predetermined depth in a region including the insulation portion. The cavity is defined by a plurality of continuously-extending curved surfaces having predetermined radii of curvature. | 03-31-2016 |
20160105966 | WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a built-in electronic component includes a substrate having cavity, an insulating layer formed on the substrate such that the insulating layer is covering the cavity, a conductor layer formed on the insulating layer, and an electronic component accommodated in the cavity and including a rectangular cuboid body and terminal electrodes such that each electrode has a metal film form formed on outer surface of the body, and via conductors formed in the insulating layer such that the via conductors are connecting the conductor layer and electrodes. The electrodes are arrayed in a matrix having rows and columns such that adjacent electrodes in row and column directions have the opposite polarities, and the conductor layer includes a line pattern shunting first group of the electrodes in one polarity and a solid pattern shunting second group of the electrodes in the other polarity. | 04-14-2016 |
20160126175 | CIRCUIT SUBSTRATE AND SEMICONDUCTOR PACKAGE STRUCTURE - The invention provides a circuit substrate and a semiconductor package structure. The circuit substrate includes a core substrate having a chip-side surface and a bump-side surface opposite to the chip-side surface. A first through via plug passes through the core substrate. A first conductive line pattern and a second conductive line pattern adjacent to the first conductive line are disposed on the chip-side surface. A pad is disposed on the bump-side surface. The first through via plug is in direct contact with and partially overlapping the first conductive line pattern and the pad. The first conductive line pattern, the second conductive line pattern and the first through via plug are configured to transmit voltage supplies of the same type. | 05-05-2016 |
20160135302 | SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A substrate for mounting an electronic component includes a base material including insulating resin, a first conductor layer formed on first surface of the material, a second conductor layer formed on second surface of the material, and a metal block inserted into a hole penetrating through the first conductor, material and second conductor such that the metal block is fitted in the hole. The material has a bent portion in contact with the metal block in the hole such that the bent portion is bending toward the second conductor, the metal block has surface on first conductor side such that the surface has an outer peripheral portion having a curved-surface shape, and the hole has a first fitting inlet on the first conductor layer side and a second fitting inlet on second conductor side and that the metal block is positioned in contact with the second fitting inlet. | 05-12-2016 |
20160143134 | WIRING BOARD WITH BUILT-IN METAL BLOCK AND METHOD FOR MANUFACTURING THE SAME - A wiring board with built-in metal block includes a substrate having a cavity penetrating through the substrate, a metal block accommodated in the cavity and having first surface, second surface, and side surface connecting outer edges of the first and second surface, filling resin filling gap between inner side surface of the substrate in the cavity and the side surface of the block, a first build-up layer laminated on first surface of the substrate and including an insulating layer such that the first layer is covering the cavity and the first surface of the block, and a second build-up layer laminated on second surface of the substrate and including an insulating layer such that the second layer is covering the cavity and the second surface of the block. The side surface of the block is recessed such that the side surface of the block is forming a groove shape. | 05-19-2016 |
20160143145 | ELECTRICAL DEVICE - An electrical device comprising: a substrate; an electrical circuit formed on the substrate; an electrical component mounted on the substrate; solder physically and electrically joining the electrical circuit and the electrical component; wherein the electrical component comprises an outer electrode comprising (i) 100 parts by weight of a conductive powder comprising a copper-nickel-zinc (Cu—Ni—Zn) alloy powder, and (ii) 1 to 40 parts by weight of an organic polymer. | 05-19-2016 |
20160174380 | EMBEDDED DEVICE, AND PRINTED CIRCUIT BOARD HAVING THE SAME | 06-16-2016 |
20160183362 | PATTERNED METALLIZATION HANDLE LAYER FOR CONTROLLED SPALLING | 06-23-2016 |
20160204054 | PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF | 07-14-2016 |
20160204056 | WIRING BOARD WITH INTERPOSER AND DUAL WIRING STRUCTURES INTEGRATED TOGETHER AND METHOD OF MAKING THE SAME | 07-14-2016 |
20180027652 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF | 01-25-2018 |
20190148853 | CABLE CONNECTOR FOR COAXIAL CABLE ON THICK PRINTED-CIRCUIT BOARD | 05-16-2019 |
20220135793 | THERMOPLASTIC COMPOSITION FOR LASER DIRECT STRUCTURING - A thermoplastic composition including a) 20 to 90 wt. % of a thermoplastic resin, b) 0.1 to 80 wt. % of a laser direct structuring additive and c) 10 to 80 wt. % of ceramic filler particles which do not have a laser direct structuring additive function, wherein at least 80 wt. % of c) is TiO2, wherein the composition has a loss tangent measured at 40 GHz of at most 0.014, wherein the total amount of a), b) and c) is 95 to 100 wt. % with respect to the total composition, wherein the composition further includes f) one or more additives, wherein the total amount of the additives is 0.1 to 5 wt. %, 0.3 to 5 wt. % or 0.3 to 3 wt. % relative to the total weight of the composition. | 05-05-2022 |
20220140505 | HIGH PERFORMANCE CABLE TERMINATION - A cable assembly comprising a connector with a termination that enables high density and high signal integrity. Shields of cables are terminated to a paddle card via a conductive structure attached to a surface of the paddle card. The signal conductors of the cables are terminated to pads on the paddle card that are exposed within openings of the conductive structure. Such a structure creates a ground structure per cable that provides low insertion loss and low crosstalk, even when multiple cables are aligned side by side and terminated in one or more rows. The cables may be drainless, enabling a large number of cables, such as eight cables, to be packed within the width of a paddle card specified in high density standards such as QSFP-DD or OSFP. The cables may nonetheless have large diameter signal conductors, enabling 2.5 or 3 meter assemblies with less than 17 dB insertion loss. | 05-05-2022 |