Entries |
Document | Title | Date |
20080196928 | Method For the Production of a Functional Constructional Unit, and Functional Constructional Unit - The invention relates to a method for producing a functional assembly as well as a functional assembly. According to the inventive method, at least one first material and a second material which are provided with different properties are applied layer by layer, partially in some parts, so as to create an encapsulation from the first material and a strip conductor structure from the second material, one or several functional units being embedded in the layer structure and being contacted with the strip conductor structure when the materials are applied. The disclosed method makes it possible to carefully structure a unit while offering a great degree of creative freedom. | 08-21-2008 |
20080230258 | PRINTED CIRCUIT BOARD, DESIGN METHOD THEREOF AND MAINBOARD OF TERMINAL PRODUCT - A printed circuit board and a design method thereof are disclosed. The design method includes: wiring signal lines on an area basis at inner layers adjacent to outer surface layers; arranging the outer surface layers with no wiring or few wirings and interconnecting the outer surface layers by way of through vias, so that the outer surface layers function as a primary ground; and setting parameters of a line width and a layer height to control a target impedance value. The printed circuit board includes outer surface layers and two inner layers therebetween. The inner layers adjacent to the outer surface layers are used for arranging signal lines on an area basis; and the outer surface layers are arranged with no wiring or few wirings and are interconnected as a primary ground through vias. The invention also discloses a mainboard of a terminal product using the printed circuit board. | 09-25-2008 |
20090065239 | Printed circuit board and method of manufacturing the same - A printed circuit board on which protective plating has been carried out as surface treatment is provided. The printed circuit board includes a part of a wiring pattern formed with an upper surface and side surfaces of a conductive part including the wiring pattern being exposed on a substrate. Surfaces of exposed parts of the conductive part are covered with the protective plating. | 03-12-2009 |
20090107701 | PRINTED CIRCUIT BOARD HAVING ADHESIVE LAYER AND SEMICONDUCTOR PACKAGE USING THE SAME - A PCB having an adhesive layer and a semiconductor package using the same. The PCB includes a body substrate, a solder resist layer including an open portion that exposes a portion of the body substrate, and an adhesive layer formed on the body substrate in the open portion. The adhesive layer may include a solid die attach film or a liquid adhesive. A semiconductor chip may be attached to the adhesive layer. The semiconductor chip and the PCB may be molded by an encapsulant, thereby substantially covering the semiconductor chip and the PCB with the encapsulant. | 04-30-2009 |
20090133904 | MODULE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a module is provided that can alleviate a decrease in cutting yield. This method includes: a step of mounting, on a wiring board having a plurality of mounting regions enclosed by cutting lines on its upper surface, an electronic component in each of the mounting regions; a step of cutting the wiring board along the cutting lines; a step of forming a sealing resin layer so as to seal the electronic component to cover at least part of upper and side surfaces of the cut wiring board; and a step of cutting the sealing resin layer along cut portions (cutting lines) of the cut wiring board. | 05-28-2009 |
20090139749 | Method For The Preparation Of A Flexible Transducer Unit, The Flexible Transducer Unit So Prepared And An Array Containing Such Flexible Transducer Units - The present invention relates to a method for the preparation of a flexible transducer unit from a wafer containing a plurality of transducer structures comprising a substrate, a metal-oxide layer, at least one mesh structure in said metal-oxide layer and electric wires including at least one first contact pad in said metal-oxide layer. The method includes the steps of: etch the metal-oxide layer to release said mesh; form a sealing layer on the mesh; form a first flexible material layer on the metal-oxide layer; and remove the substantial thickness of the substrate, sufficient to make the transducer structure flexible. Alternatively the first flexible material layer may be formed before the mesh is released. The method may further include the step of forming a second flexible layer in the back side of the wafer. A novel structure of the flexible transducer unit prepared according to the invented method is also disclosed. An array containing a plurality of the flexible transducer units is also disclosed. | 06-04-2009 |
20090145630 | Printed wiring board and method for manufacturing printed wiring board - To provide a printed wiring board and a method for manufacturing the printed wiring board in which circuit widths of a signal transmission circuit and a power supply circuit or the like, which conventionally require to have greatly different circuit widths, are close to each other as much as possible and substantial miniaturization can be achieved. In order to achieve this object, a printed wiring board obtained by etching a metal-clad laminate including a conductive layer and an insulating layer is employed, in which a first circuit and a second circuit having different thicknesses formed in a same reference plane coexist. In addition, it is characterized in that a thicker circuit of the first circuit or the second circuit has a clad-like configuration in which three layers of a first copper layer/a different kind of metal layer/a second copper layer are sequentially stacked. Further, a manufacture of the printed wiring board is characterized in that a clad composite material in which three layers of a first copper layer/a different kind of metal layer/a second copper layer are sequentially stacked is a start material, and selective etching characteristic between the different kind of metal layer and the copper layer is effectively utilized. | 06-11-2009 |
20090173521 | Wired circuit board - A wired circuit board includes a first insulating layer; a first wire formed on the first insulating layer; a second insulating layer formed on the first insulating layer so as to cover the first wire; and a second wire formed on the second insulating layer so as to be arranged in opposed relation to the first wire in a thickness direction. The thickness of the first wire is 1 μm or less and is | 07-09-2009 |
20090200064 | Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport - Method for mounting an electronic component, such as a silicon chip, on a support which consists in: providing an electronic component ( | 08-13-2009 |
20090229862 | MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A plurality of double-sided boards using a film are attached to each other with a paste coupling layer sandwiched therebetween. In the paste coupling layer, a conductive paste is filled into a through hole formed in provisionally hardened resin, which is hardened. At the same time, second wirings are electrically coupled to each other by using the hardened conductive paste filled in the through holes that have been previously formed in the paste coupling layer. Thus, it is possible to provide a thinned multilayer printed wiring board without using an adhesive. | 09-17-2009 |
20090229863 | Conductor Carrier and Arrangement Comprising a Conductor Carrier - A conductor carrier includes a base insulating film, a contact insulating film, at least one first printed conductor and one second printed conductor. The contact insulating film includes at least one first recess and one second recess. The printed conductors are embedded between the two insulating films and each forms a first overlapping region with the first or second recess of the contact insulating film. The conductor carrier also includes an insulating region which separates the first printed conductor from the second printed conductor in an insulating manner due to the contact insulating film being less raised than outside the insulating region, and extends between the first and second recesses of the contact insulating film in a meandering manner. A configuration having the conductor carrier is also provided. | 09-17-2009 |
20090242238 | Buried pattern substrate - A buried pattern substrate includes an insulation layer; a circuit pattern buried in the insulation layer such that a part thereof is exposed at a surface of the insulation layer; and a stud bump buried in the insulation layer such that one end portion is exposed at one surface of the insulation layer, and such that the other end portion is exposed at the other surface of the insulation layer. | 10-01-2009 |
20090255715 | Controlling Impedance and Thickness Variations for Multilayer Electronic Structures - Impedance control, and the uniformity of electrical and mechanical characteristics in electronic packaging are becoming more important as chip and bus speeds increase and manufacturing processes evolve. Current state of the art design and manufacture processes inherently introduce physical dielectric thickness variations into multilayer cross sections. These thickness variations between the ground reference plane(s) and the signal layer(s) inject undesirable characteristic impedance variations and undesirable mechanical variations in thickness and surface topology. Therefore a multilayer structure and a method of manufacture are presented. | 10-15-2009 |
20090277667 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A mounting region is provided at a substantially center of one surface of an insulating layer. A metal layer is provided on the other surface of the insulating layer. A slit is formed to cross a region (an opposite region) of the metal layer that coincides with the mounting region and to divide the metal layer. A plurality of regions (large regions) of the metal layer divided by the slit each include a partial region (small region) of the opposite region. The area of each large region is set corresponding to the area of the small region included therein. Specifically, the small region having the area of A [%] with respect to the whole area of the opposite region is included in the large region having the area of (A±δ) [%] with respect to the whole area of the metal layer. Here, δ is an acceptable error range, and the acceptable error range δ is not more than (A×0.3). | 11-12-2009 |
20090283299 | COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS INCLUDING THE SAME - According to one embodiment, a component-embedded printed circuit board is provided with a built-in component mounted on a component mounting surface of a substrate and enclosed by an insulating layer, an interior pattern layer for heat radiation which is provided on the opposite side of the built-in component from the substrate and radiates heat generated from the built-in component, and an exterior pattern layer for heat radiation connected to the interior pattern layer for heat radiation. | 11-19-2009 |
20100025081 | WIRING SUBSTRATE AND ELECTRONIC COMPONENT DEVICE - A wiring substrate includes a frame-shaped reinforcing plate in which an opening portion is provided in a center portion, an interposer arranged in the opening portion of the reinforcing plate and having such a structure that a wiring layer connected mutually via a through electrode is formed on both surface sides of a substrate respectively, a resin portion filled between a side surface of the interposer and a side surface of the opening portion of the reinforcing plate, and coupling the interposer and the reinforcing plate, and an n-layered (n is an integer of 1 or more) lower wiring layer connected the wiring layer on the lower surface side of the interposer to extend from the interposer to an outer area. | 02-04-2010 |
20100044081 | LAMINATED BODY, METHOD OF MANUFACTURING SUSBTRATE, SUBSTRATE, AND SEMICONDUCTOR DEVICE - A laminated body of the present invention includes a resin layer in which a core portion composed of a fiber base member having a thickness of 25 μm or less is embedded, the resin layer having two surfaces, and the resin layer through which at least one via-hole is adapted to be formed, and a metal layer bonded to at least one of the two surfaces of the resin layer, and the metal layer having at least one opening portion provided so as to correspond to the via-hole to be formed. Further, a method of manufacturing a substrate of the present invention includes preparing the above laminated body, forming the via-hole so as to pass through the resin layer by irradiating a laser beam onto the resin layer, and removing the metal layer from the resin layer after the via-hole is formed. Further, a substrate of the present invention is manufactured by using the above method. Furthermore, a semiconductor device of the present invention includes the above substrate, and a semiconductor element mounted on the substrate. | 02-25-2010 |
20100051324 | DIELECTRIC SUBSTRATE WITH HOLES AND METHOD OF MANUFACTURE - An aspect of the present invention comprises a method of forming holes in a dielectric substrate comprising the steps of applying a layer of photoresist to a dielectric substrate, exposing portions of the photoresist to actinic radiation through a photomask to form a pattern in the photoresist for an array of holes to be etched in the substrate, developing the photoresist, etching the dielectric substrate to form an array of holes, each hole extending at least partially through the dielectric substrate, and removing the excess photoresist. Another aspect of the present invention is a method of simultaneously forming holes in a dielectric substrate some of which extend partially through the substrate and some of which extend completely through the substrate. Other aspects of the present invention are dielectric substrates formed using the methods of the invention. | 03-04-2010 |
20100059253 | LAMINATED GLASS COMPRISING A FIXATION DEVICE INTRODUCED IN A PORTHOLE FOR OBJECTS - In a laminated glass sheet with a fixing device introduced into a through-hole for objects, particularly for antennas, the through-hole is made up of holes of different sizes in two rigid sheets of the lamination, and the fixing device includes at least two parts introduced into the through-hole, pressing against surfaces around the edge of the through-hole, which surfaces are situated one facing the other. The two parts of the fixing device press from both sides against the surfaces around the edge surrounding the smaller hole made in the sheet, in that region of the walls of a smaller hole that exhibits an edge compression stress that is increased by heat treatment by comparison with the remainder of the surface of the sheet. | 03-11-2010 |
20100071935 | SHIELDED FLEXIBLE CIRCUITS AND METHODS FOR MANUFACTURING SAME - A shielded flexible cable having a plurality of shielded electronic circuits in close proximity to one another such that signals transmitted on one of said plurality of shielded electronic circuits do not substantially interfere with signals transmitted on the other of said plurality of electronic circuits comprising a polyimide support member supporting a plurality of etched copper traces on a first side of said polyimide support member and a copper layer on a second side of said polyimide support member. Said polyimide support member is flexible along at least one axis, and said plurality of etched copper traces and said copper layer substantially as flexible as said polyimide support member. | 03-25-2010 |
20100101836 | METHOD OF FORMING HOLE FOR INTERLAYER CONNECTION CONDUCTOR, METHOD OF PRODUCING RESIN SUBSTRATE AND COMPONENT-INCORPORATED SUBSTRATE, AND RESIN SUBSTRATE AND COMPONENT-INCORPORATED SUBSTRATE - A high quality component-incorporated substrate achieves a sufficient connection between an in-plane electrode and an interlayer connection conductor at low cost. A method of forming a hole for an interlayer connection conductor of a resin substrate includes a step of forming an in-plane electrode in a core substrate, a step of forming a light reflective conductor for reflecting a laser beam applied on the in-plane electrode in a later step, a step of forming a resin layer so as to cover the core substrate, the in-plane electrode and the light reflective conductor, and a step of forming a hole for the interlayer connection conductor by removing the resin layer on the light reflective conductor through the use of a laser beam. | 04-29-2010 |
20100108361 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE WIRING SUBSTRATE - A wiring substrate includes a substrate body including first and second surfaces on opposite sides and a substrate side surface; a penetration electrode penetrating through the substrate body; a first wiring pattern on the first surface and including a first pad; a second wiring pattern on the second surface and including a second pad; a first insulating resin layer covering the first wiring pattern except for an area corresponding to the first pad and having a first resin side surface; a second insulating resin layer covering the second wiring pattern except for an area corresponding to the second pad and having a second resin side surface that is flush with the first resin side surface; a notch part encompassing at least apart of the substrate body and having a resin material provided therein. The substrate side surface is located more inward than the first and second resin side surfaces. | 05-06-2010 |
20100147561 | WIRING BOARD WITH LEAD PINS AND METHOD OF PRODUCING THE SAME - A wiring board with lead pins includes: connection pads formed on a wiring board, and lead pins bonded through a conductive material to the connection pads, wherein each of the lead pins has a head portion that is formed in one end of a shaft portion to be larger in diameter than the shaft portion, the head portions are bonded to the connection pads by the conductive material, a face of the wiring board on which the connection pads are formed is resin-sealed by a first resin to be thicker than the head portions, except portions to which the head portions are bonded, and sides of faces of the head portions to which the shaft portions are connected are sealed to be in close contact with the first resin by a second resin. | 06-17-2010 |
20100181100 | COPPER CIRCUIT WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A copper wiring board having fine wiring, and a method for manufacturing the same are provided. The copper wiring board of the present invention is a wiring board comprising an insulating substrate, a plurality of wire trenches formed in the insulating substrate, and wires filled in the wire trenches, wherein when any two of the wires are selected, and cross sections are taken perpendicular to a direction of current flow in the wires, a wire width in one wire cross section is narrower than a wire width in the other wire cross section, and a wire thickness in the one wire cross section is thicker than a wire thickness in the other wire cross section. | 07-22-2010 |
20100206617 | ELECTRICAL ISOLATING STRUCTURE FOR CONDUCTORS IN A SUBSTRATE - A substrate has a first dielectric layer; a first conductive layer on the first dielectric layer; a second dielectric layer on the first conductive layer; an elongated signal conductor embedded within the second dielectric layer; a second conductive layer on the second dielectric layer; a first conductive groove and second conductive groove through the second conductive layer, the second dielectric layer, the first conductive layer and into the first dielectric layer and extending continuously along the length of and on opposing sides of the signal conductor, the grooves having conductive side walls providing an electrical connection between the first conductive layer and the second conductive layer; first and second conductive end walls joining the first groove and second groove; and at least one insulating area through at least one of the first and second conductive layers to provide conductor access. | 08-19-2010 |
20100206618 | Coreless Substrate and Method for Making the Same - The present invention relates to a coreless substrate and a method for making the same. The method for making the coreless substrate includes: (a) providing a carrier and a first conductive layer, wherein the carrier has a first surface and a second surface, and the first conductive layer is disposed on the first surface of the carrier; (b) forming a first embedded circuit on the first conductive layer; (c) forming a first dielectric layer so as to cover the first embedded circuit; (d) removing the carrier; (e) removing part of the first conductive layer so as to form at least one first pad; and (f) forming a first solder mask so as to cover the first embedded circuit and the first dielectric layer and to expose the first pad. Therefore, the coreless substrate of the present invention has high density of layout and involves low manufacturing cost. | 08-19-2010 |
20100230138 | WIRING BOARD - A wiring board includes an insulating board having a top surface arranged to have an electronic component mounted thereto, a conductor pattern formed on the top surface of the insulating board, and a heat emitting layer made of heat-emitting material covering the conductor pattern. The heat-emitting material has an emissivity not less than 0.8 for an electromagnetic wave having a wavelength λ=0.002898/T at a temperature T ranging from 293K to 473K. This wiring board suppresses the temperature rise of the electronic component. | 09-16-2010 |
20100243296 | DIELECTRIC CERAMIC COMPOSITION AND ELECTRONIC COMPONENT USING THE SAME - A dielectric porcelain composition contains a major component represented by a composition formula (BaO.xTiO | 09-30-2010 |
20100243297 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace. | 09-30-2010 |
20100252303 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A circuit board having a removing area is provided. The circuit board includes a first dielectric layer, a first laser resistant structure disposed on the first dielectric layer and located at the periphery of the removing area, a second dielectric layer disposed on the first dielectric layer, a circuit layer disposed on the second dielectric layer, a second laser resistant structure disposed on the second dielectric layer and located at the periphery of the removing area, and a third dielectric layer disposed on the second dielectric layer. The second laser resistant structure is insulated from the circuit layer. There is a gap between the second laser resistant structure and the circuit layer, and the vertical projection of the gap on a first surface overlaps the first laser resistant structure. The third dielectric layer exposes the portion of the circuit layer within the removing area. | 10-07-2010 |
20100252304 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a wiring board for use in mounting of an electronic component includes: forming an outermost wiring layer on a surface side where the electronic component is mounted; forming an insulating layer so as to cover the wiring layer; and forming a concave portion in the insulating layer. The concave portion is formed by removing, using a mask formed in a required shape by patterning, an exposed portion of the insulating layer in a step-like shape until a surface of a pad defined at a portion of the wiring layer is exposed. The concave portion is preferably formed by removing the portion of the insulating layer by sand blast. | 10-07-2010 |
20110011627 | PARTS MADE OF ELECTROSTRUCTURAL COMPOSITE MATERIAL - A rigid structural part made of laminated composite material incorporates electrically conducting cables, the structural part includes at least two structural layers including fibers held in place by a thermosetting or thermoplastic matrix, at least one conducting network layer located between two of the at least two structural layers, the at least one conducting network layer including a network of electrically conducting cables, said electrically conducting cables being arranged throughout said structural part in a substantially regular manner and being electrically insulated from said two structural layers by a dielectric material. The structural part also includes electrical connections, to which electrically conducting cables of the at least one network layer are electrically connected so as to form an electrical network by assembling several structural parts. | 01-20-2011 |
20110030995 | Printed Circuit Board Removing Bonding Sheet Around Signal Transmission Line - There is provided a printed circuit board (PCB) comprising a first ground layer extended in one direction; a first dielectric layer laminated on the first ground layer and extended in the same direction of the first ground layer; a signal transmission line laminated on the first dielectric layer and extended in the same direction of the first dielectric layer; a first bonding sheet disposed above the first dielectric layer; a second bonding sheet disposed above the first dielectric layer, a second dielectric layer disposed above the signal transmission line, the first bonding sheet, and the second bonding sheet; and a second ground layer laminated on the second dielectric layer. | 02-10-2011 |
20110114368 | ELECTRONIC CIRCUIT COMPONENT AND METHOD FOR MANUFACTURING SAME - A small-sized electronic circuit component comprising micro-wiring and a method for manufacturing the same are provided. The electronic circuit component is manufactured by a manufacturing method comprising the steps of forming a recessed portion which is to be a three-dimensional wiring in the surface of an insulating base material of the electronic circuit component comprising the wiring, forming a first metal layer which is to be an electroplated conductive layer on the surface of the insulating base material including the recessed portion, selectively forming a second metal layer which is to be the wiring only in the recessed portion which is to be the wiring, and removing the first metal layer formed on the surface other than in the recessed portion which is to be the wiring. | 05-19-2011 |
20110147050 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board ( | 06-23-2011 |
20110186334 | Apparatus with a Wire Bond and Method of Forming the Same - In some embodiments, a printed circuit board (PCB) comprises a substrate comprising an insulating material. The PCB further comprises a plurality of conductive tracks attached to at least one surface of the substrate. The PCB further comprises a multi-layer coating deposited on the at least one surface of the substrate. The multi-layer coating (i) covers at least a portion of the plurality of conductive tracks and (ii) comprises at least one layer formed of a halo-hydrocarbon polymer. The PCB further comprises at least one electrical component connected by a solder joint to at least one conductive track, wherein the solder joint is soldered through the multi-layer coating such that the solder joint abuts the multi-layer coating. | 08-04-2011 |
20110214903 | FUNCTIONAL PANEL AND METHOD FOR JOINING SAME - There is provided a functional panel that can be joined and disassembled with ease by solving problems with a functional panel including electrical conductors integrally molded therewith, causing occurrence of cracking on the surface thereof, or cracking of a molded unit around the periphery of the electrical conductor, thereby rendering the electrical conductor susceptible to a break when a flexural load, an impact load, and so forth, acts on the functional panel. The functional panel comprises a main body of a panel member, an electrical conductor coated with a semi-cured resin having heat resistance and insulation properties, and a reinforcing fiber having a continuous filament, for fixing the electrical conductor to the main body of the panel member to thereby provide enhancement, and the functional panel is formed by exposing one end, and the other end of the electrical conductor from respective end faces of the panel member formed by integral molding. | 09-08-2011 |
20110220396 | WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A wiring substrate includes a substrate containing a carbon material, a first insulating layer formed over the substrate, an interlayer formed over the first insulating layer, the interlayer including a metal plate having a smaller coefficient of thermal expansion than the first insulating layer while having a greater elastic modulus than the first insulating layer, and a second insulating layer formed over the interlayer. | 09-15-2011 |
20110220397 | ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an electronic component includes forming a resin layer over an underlying layer, pressing a conductor plate including a pattern formed on one major surface thereof against the resin layer, and embedding the pattern in the resin layer, and performing polishing, Chemical Mechanical Polishing, or cutting by the use of a diamond bit on another major surface of the conductor plate until the resin layer appears, and leaving the pattern in the resin layer as a conductor pattern. | 09-15-2011 |
20110232943 | MULTILAYER WIRING BOARD - There is provided a multilayer wiring board, which has a board body formed with two opposite main surfaces and includes a first resin insulating layer, a second resin insulating layer laminated to the first resin insulating layer and a wiring pattern arranged between the first and second resin insulating layers with a first surface of the wiring pattern abutting the first resin insulating layer and a second surface of the wiring pattern abutting the second resin insulating layer. The multilayer wiring board is characterized in that the wiring pattern extends in a plane direction of the board body and is embedded in both of the first and second resin insulating layers. | 09-29-2011 |
20110253422 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board includes: an uppermost wiring layer formed on a prescribed number of underlying wiring layers, a portion of the uppermost wiring layer being exposed and used as a pad for connection with a component to be mounted; and an insulation resin layer covering the uppermost wiring layer, wherein the thickness of the portion of the uppermost wiring layer is larger than that of other portions thereof. | 10-20-2011 |
20110266033 | MULTILAYER BOARD - A multilayer board includes a thermoplastic resin film layer, a pattern layer layered on the thermoplastic resin film layer, and a conductor pattern. The thermoplastic resin film layer is made of a plurality of thermoplastic resin films layered with each other, and has two adhesive layers and an interlayer located between the two adhesive layers. Each of the adhesive layers has an interlayer connector passing through the adhesive layer in a thickness direction. The conductor pattern is located on at least one of the pattern layer and the interlayer at a position opposing to the interlayer connector. | 11-03-2011 |
20110266034 | Preventing breakage of long metal signal conductors on semiconductor substrates - An apparatus includes a volume of insulator disposed over a top surface of a semiconductor substrate, a tube of soft dielectric, and a metal conductor. The insulator has a hardness of more than approximately three gigaPascals (gPa) and the soft dielectric has a hardness of less than three gPa. The tube of soft dielectric and the metal conductor are both embedded within the volume of insulator. The tube defines a central volume and the metal conductor extends in a direction through the central volume for a distance of at least one inch. The metal conductor is encircled by the soft dielectric when the apparatus is viewed in a cross-sectional plane perpendicular to the direction. The metal conductor may include a plurality of bend portions. The metal conductor does not break when the apparatus is temperature cycled over a range from zero to eighty five degrees Celsius. | 11-03-2011 |
20110272178 | SUBSTRATE FOR AN ELECTRICAL DEVICE - Substrate for electrical devices is disclosed. An embodiment for the substrate comprised of an insulator, a conductive element(s) and a conductive material(s), wherein the conductive element embedded in the insulator, and two surfaces of the conductive element exposed to two surfaces of the insulator for electrical connection respectively, wherein the upper surface of conductive element is below the upper surface of insulator and is plated by the conductive material, meanwhile the conductive element include a protruding portion which is protruded the insulator, in this manner, solder balls are not needed, moreover the conductive element can further include an extending portion; the present invention may be capable of affording a thinner electrical device thickness and enhanced reliability. | 11-10-2011 |
20110284268 | FLEXIBLE CIRCUIT COVERFILM ADHESION ENHANCEMENT - Provided is a means of improving the adhesion between a flexible circuit coverfilm and an encapsulant material in an inkjet printer application. | 11-24-2011 |
20110284269 | MULTILAYER WIRING SUBSTRATE - To provide a multilayer wiring substrate which can prevent migration of copper between wiring traces to thereby realize a higher degree of integration, a solder resist layer | 11-24-2011 |
20110284270 | LOW-TEMPERATURE SINTERING CERAMIC MATERIAL AND CERAMIC SUBSTRATE - A low-temperature sintering ceramic material showing little variation in composition after firing, realizing high bending strength in a sintered body, and capable of forming a reliable ceramic substrate showing high peel strength of a surface electrode includes a main constituent ceramic material containing about 48 weight % to about 75 weight % in terms of SiO | 11-24-2011 |
20110290536 | WIRING SUBSTRATE - A wiring substrate includes a wiring layer, and an insulating layer configured to cover the wiring layer, wherein the insulating layer is recognized to have any color in a range from purple to blue. | 12-01-2011 |
20110290537 | MULTILAYER CIRCUIT SUBSTRATE - A multilayer circuit substrate includes a substrate body in turn including a plurality of conductor layers and a plurality of insulating layers that are laminated alternately. The plurality of conductor layers include an uppermost conductor layer that includes a plurality of conductor patterns and a lowermost conductor layer that includes a plurality of conductor patterns. A plurality of semiconductor devices is respectively mounted on the plurality of conductor patterns of the uppermost conductor layer. The plurality of conductor patterns of the lowermost conductor layer includes a plurality of heat releasing patterns. The plurality of heat releasing patterns is respectively provided in one-to-one correspondence with the plurality of semiconductor devices. Each of the heat releasing patterns has an area no less than an area of the corresponding semiconductor device. Each of the heat releasing patterns is connected to the corresponding semiconductor device via a corresponding heat releasing via. | 12-01-2011 |
20110297425 | WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A wiring substrate includes a plurality of insulating layers; and a plurality of wiring layers being alternately laminated, wherein an opening portion is formed in an outermost insulating layer to expose a part of the outermost wiring layer to an outside, a cross-sectional shape of a sidewall of the opening portion is concaved and curved, and the outermost wiring layer has a recess on a side exposed to the outside. | 12-08-2011 |
20110297426 | WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A wiring substrate includes a wiring layer made of copper, an electrode layer made of copper, and an insulating layer arranged adjacent to the electrode layer. The wiring layer is stacked on the electrode layer and the insulating layer. The insulating layer and the wiring layer are stacked with an adhesive layer interposed between the insulating layer and the wiring layer. The electrode layer and the wiring layer are stacked with a copper alloy layer formed adjacent to the adhesive layer and interposed between the electrode layer and the wiring layer. | 12-08-2011 |
20110308840 | WIRING SUBSTRATE - A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles. | 12-22-2011 |
20110315432 | METHOD FOR MANUFACTURING TRANSPARENT ELECTRODE PATTERN AND METHOD FOR MANUFACTURING ELECTRO-OPTIC DEVICE HAVING THE TRANSPARENT ELECTRODE PATTERN - Provided are a method for manufacturing a transparent electrode pattern and a method for manufacturing an electro-optic device having the transparent electrode pattern. The method for manufacturing the transparent electrode pattern includes forming a transparent electrode on a light-transmissive substrate, patterning the transparent electrode by removing a portion of the transparent electrode, and forming an insulating protective layer in an edge region of the patterned transparent electrode through a printing process. In accordance with the method, the insulating protective layer is formed in the edge region of the patterned transparent electrode through the printing process so that an apparatus and method for manufacturing the insulating protective layer can be simplified, resulting in a decrease in manufacturing cost. | 12-29-2011 |
20120000695 | RESIN CIRCUIT BOARD - A resin circuit board includes a layered structure of resin layers and conductor layers, has significantly reduced and minimized warping and distortion, and has a precise shape. A second conductor layer is disposed between a resin layer and a first conductor layer made of a metal. The resin layer and the second conductor layer have a higher thermal expansion coefficient than the first conductor layer such that the thermal expansion coefficient changes gradually, allowing a stress resulting from a difference in thermal expansion coefficient to be relieved. | 01-05-2012 |
20120012366 | POLYAMIC ACID, POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION COMPRISING THE SAME, AND DRY FILM MANUFACTURED FROM THE SAME - The present invention relates to a polyamic acid or polyimide comprising a heat-polymerizable or photo-polymerizable functional group, a photosensitive resin composition comprising the polyamic acid or the polyimide, a photosensitive resin composition being capable of providing a cured film that can be used for patterning at a high resolution and that has an excellent developing property in an alkaline aqueous solution, flexibility, adhesion strength, resistance to welding heat, and pressure cooker test (PCT) resistance, and a dry film prepared from the composition. | 01-19-2012 |
20120018193 | Multi layer circuit board and method of manufacturing the same - There are provided a multi layer circuit board and a method of manufacturing the same. The multi layer circuit board includes each of ceramic boards having wiring patterns formed and stacked thereon; and via electrodes connecting in series the wiring patterns formed in the each of the ceramic boards, wherein one of the via electrodes is formed as a via group including a plurality of via units which connect in parallel one catch pad formed on one ceramic board and another catch pad formed on ceramic boards adjacent to the one ceramic board. Since the ceramic boards are connected through the plurality of via units, the reliability of the electrical connectivity of the via electrode may be improved, and the formation of a void and the protrusion of the via electrode may be prevented. | 01-26-2012 |
20120018194 | MULTILAYER WIRING BOARD AND MANUFACTURING METHOD THEREOF - Disclosed is a manufacturing method of a multilayer wiring board. The multilayer wiring board includes an outer resin insulation layer made of an insulating resin material, containing a filler of inorganic filler and having an outer surface defining a chip mounting area to which an electronic chip is mounted with an underfill material filled in between the outer resin insulation layer and the electronic chip and holes through which conductor parts are exposed. The manufacturing method includes a hole forming step of forming the holes in the outer resin insulation layer by laser processing, a desmear treatment step of, after the hole forming step, removing smears from inside the holes of the outer resin insulation layer, and a filler reducing step of, after the desmear treatment step, reducing the amount of the filler exposed at the outer surface of the outer resin insulation layer. | 01-26-2012 |
20120018195 | Printed circuit board - A printed circuit board including: an inner layer substrate part; a first insulation layer laminated on one surface of the inner layer substrate part; a first pattern buried in one surface of the first insulation layer; a first resin layer laminated on one surface of the first insulation layer to cover the first pattern; and a first via electrically connecting the first pattern with the inner layer substrate part, wherein the first resin layer is made of a material comprising one of Liquid Crystal Polymer (LCP), Polyimide (PI), Polytetrafluoroethylene (PTFE). Polyetheretherketon (PEEK) and a photo solder resist. | 01-26-2012 |
20120031649 | CORELESS LAYER BUILDUP STRUCTURE WITH LGA AND JOINING LAYER - A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging. | 02-09-2012 |
20120031650 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS - A method for manufacturing a semiconductor device that improves the reliability of a metal cap layer and productivity. The method includes an insulation layer step of superimposing an insulation layer( | 02-09-2012 |
20120037403 | Method for Electrically Conductively Connecting Conductor Tracks in Conductor Carriers and System Comprising such Conductor Carriers - A method for electrically conductively connecting conductor tracks in conductor carriers, preferably printed circuit boards or conductor foils is disclosed. A first and second conductor carrier are provided, into which a respective conductor track is embedded, which are exposed at a contact region. For the purpose of fusing the material of the conductor tracks, said material is subjected to punctiform heating via the in the opposite direction to the exposed contact region of the first conductor carrier faces. A connection location of conductor tracks which can be produced cost-effectively and is well protected is provided as a result. | 02-16-2012 |
20120043114 | DEVICE-EMBEDDED FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A device-embedded flexible printed circuit board (FPCB) and a method of manufacturing the device-embedded FPCB are provided. The device-embedded FPCB includes: a first conductive layer; a first insulating layer which is disposed on the first conductive layer and includes at least one bump hole and at least one groove; a first plating layer which is formed in the at least one groove of the first insulating layer; and a device which includes at least one bump which is inserted into the at least one bump hole to be connected to the first conductive layer. | 02-23-2012 |
20120055698 | SINGLE LAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURNING THE SAME - Disclosed herein are a single layer printed circuit board and a method for manufacturing the same. The single layer printed circuit board includes: an insulating layer having a plurality of holes, which are filled with a plating layer to form circuit patterns; a first protection layer stacked on one surface of the insulating layer to protect the circuit patterns formed in the insulating layer, the first protection layer having holes for exposing portions of the plating layer of the insulating layer; and a second protection layer formed on the opposite surface of the surface of the insulating layer, on which the first protection layer is formed, to protect the circuit patterns formed in the insulating layer. According to the present invention, a thin type printed circuit board can be provided. | 03-08-2012 |
20120061126 | PASTE COMPOSITION AND PRINTED CIRCUIT BOARD - A conductor layer is formed on one surface of a base insulating layer. The conductor layer is composed of a pair of rectangular collector portions and drawn-out conductor portions extending in long-sized shapes from the collector portions, respectively. Cover layers are formed on the base insulating layer to cover respective given portions of the conductor layer. A paste composition containing a compound represented by the formula (1) is used as a material for the cover layer. | 03-15-2012 |
20120073861 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A printed circuit board and a manufacturing method of the printed circuit board are disclosed. The printed circuit board includes: a first insulation layer having a first pattern formed thereon; a first trench caved in one surface of the first insulation layer along at least a portion of the first pattern; and a second insulation layer stacked on one surface of the first insulation layer so as to cover the first pattern. The first trench is filled by the second insulation layer. | 03-29-2012 |
20120073862 | Wiring Substrate, Semiconductor Device, and Method for Manufacturing Wiring Substrate - A wiring substrate includes a wiring pattern, which includes an upper surface forming a desired recognition mark, and a solder resist layer, which covers the wiring pattern. The solder resist layer includes a recess that entirely exposes the upper surface of the wiring pattern. The solder resist layer includes a solder resist layer formed at a region corresponding to the recess and a solder resist layer formed outside the recess. The recess entirely exposes the upper surface of the wiring pattern as the recognition mark, and the solder resist layer is formed at portions outside the upper surface of the wiring pattern. | 03-29-2012 |
20120085569 | EMBEDDED STRUCTURE - An embedded structure of circuit board is provided. The embedded structure includes a substrate, a first patterned conductive layer disposed on the substrate and selectively exposing the substrate, a first dielectric layer covering the first patterned conductive layer and the substrate, a pad opening disposed in the first dielectric layer, and a via disposed in the pad opening and exposing the first patterned conductive layer, wherein the outer surface of the first dielectric layer has a substantially even surface. | 04-12-2012 |
20120097429 | PACKAGE SUBSTRATE AND FABRICATION METHOD THEREOF - A package substrate includes: a dielectric layer having two opposite surfaces; a wiring layer embedded in the dielectric layer and exposed from the two opposite surfaces of the dielectric layer, wherein the wiring layer has solder pads, conductive pads and circuit wires electrically connecting the solder pads and the conductive pads; and a first insulating protection layer disposed on one of the two opposite surfaces of the dielectric layer to cover the dielectric layer and the wiring layer and having a plurality of openings for exposing the conductive pads, respectively. The package substrate, by directly using the dielectric layer as a base, provides a package substrate having reduced thickness and lower fabrication costs compared to the prior art. | 04-26-2012 |
20120097430 | PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME - A packaging substrate and a method of fabricating the packaging substrate. The packaging substrate includes: a dielectric layer that has an external contact surface and an opposing chip mounting surface; a circuit layer that is embedded in the dielectric layer and exposed from the external contact surface and the chip mounting surface, the circuit layer having wire-bonding pads, conductive pads, and a circuit that electrically connects the wire-bonding pads and the conductive pads, wherein the widths of the wire-bonding pads, conductive pads, and the circuit narrow gradually from chip mounting surface to the external contact surface; and a first insulating protective layer disposed on the external contact surface of the dielectric layer and covering the dielectric layer and the circuit layer, a plurality of conductive pad openings being formed in the first insulating protective layer for exposing the conductive pads. The dielectric layer is used directly as a foundation of the packaging substrate, thereby providing advantage in miniaturization, simpler fabrication procedure, and thus low cost production. | 04-26-2012 |
20120103663 | WIRING SUBSTRATE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING WIRING SUBSTRATE - A wiring substrate includes a heat sink to dissipate heat generated in an electronic part mounted in an electronic part loading area on a principal surface of the wiring substrate, an encapsulation resin to cover the heat sink, an inner connection terminal having an end face electrically connected to an electrode of the electronic part, and an outer connection terminal electrically connected to the inner connection terminal via a wiring and having an end face for inputting and outputting of a signal with an external device. The encapsulation resin is arranged to cover a part of the wiring, the inner connection terminal except the end face, and the outer connection terminal except the end face. A surface of the heat sink, the end face of the inner connection terminal, and the end face of the outer connection terminal are flush with and exposed to the principal surface. | 05-03-2012 |
20120103664 | MULTILAYERED PRINTED CIRCUIT BOARD, MORE PARTICULARLY FLAME-RESISTANT AND/OR SMOKE-SUPPRESSING MULTILAYERED PRINTED CIRCUIT BOARD - In the case of a multilayered printed circuit board ( | 05-03-2012 |
20120111608 | Wired circuit board - A wired circuit board includes an insulating base layer, a conductive pattern that is laminated on the insulating base layer, and an insulating cover layer that is laminated on the insulating base layer so as to cover the conductive pattern. The conductive pattern includes, when projected in a laminating direction of the insulating base layer, the conductive pattern, and the insulating cover layer, a terminal portion that is exposed from the insulating base layer and the insulating cover layer. The terminal portion includes an exposed surface that is exposed toward an external terminal side. A protruded portion that protrudes toward the contact direction with the external terminal is formed on the exposed surface. | 05-10-2012 |
20120111609 | PRINTED CIRCUIT BOARD HAVING PLATING PATTERN BURIED IN VIA - A printed circuit board having a plating pattern buried in a via. The printed circuit board has: an insulating substrate including an electrically insulating resin; a via hole passing through the insulating substrate; a via including a metal layer formed on an inner wall of the via hole and a filler charged in the via hole; a circuit layer including a circuit pattern buried in the insulating substrate and transmitting an electrical signal; and a plating pattern buried in an end of the filler. | 05-10-2012 |
20120125667 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board includes a first circuit pattern formed on a core substrate; an insulating layer stacked on the core substrate to cover the first circuit pattern and having a uniform surface roughness on a nano scale; a second circuit pattern formed on the insulating layer; and a via pattern electrically connecting the first circuit pattern to the second circuit pattern and penetrating through the insulating layer. | 05-24-2012 |
20120138340 | MULTILAYER SUBSTRATE - A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors. | 06-07-2012 |
20120152595 | Multilayer printed circuit board and method of manufacturing the same - The present invention provides a method of manufacturing a multilayer printed circuit board including: forming a first printed circuit on a base substrate; applying a first insulator on a portion of the first printed circuit; forming a second printed circuit on the first insulator and a connection pattern of the first printed circuit; and applying a second insulator on the base substrate except the second printed circuit. According to the present invention, it is possible to simultaneously electrically connect multilayer printed circuits without a via hole. | 06-21-2012 |
20120160544 | CORELESS LAYER BUILDUP STRUCTURE WITH LGA - A substrate for use in a PCB or PWB board having a coreless buildup layer and at least one metal and at least one dielectric layer. The coreless buildup dielectric layers can consist of at least partially cured thermoset resin and thermoplastic resin. The substrate may also contain land grid array (LGA) packaging. | 06-28-2012 |
20120160545 | CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided is a circuit device in which encapsulating resin to encapsulate a circuit board is optimized in shape, and a method of manufacturing the circuit device. A hybrid integrated circuit device, which is a circuit device according to the present invention includes a circuit board, a circuit element mounted on a top surface of the circuit board, and encapsulating resin encapsulating the circuit element, and coating the top surface, side surfaces, and a bottom surface of the circuit board. In addition, the encapsulating resin is partly recessed and thereby provided with recessed areas at two sides of the circuit board. The providing of the recessed areas reduces the amount of resin to be used, and prevents the hybrid integrated circuit device from being deformed by the cure shrinkage of the encapsulating resin. | 06-28-2012 |
20120168204 | SYSTEM FOR DEPOSITING MICROWIRE - A microcircuit deposition system incorporates a first printing engine for depositing a dielectric on a substrate. A microwire spooling machine houses a microwire spool and incorporates a tension guide to position a microwire trace onto the dielectric layer. A second printing engine trails the microwire spooling machine to deposit a covering dielectric layer over the microwire trace. | 07-05-2012 |
20120168205 | METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD - A printed circuit board and a method for manufacturing the printed circuit board are disclosed. The method can include; providing an insulated layer, in which a first metal layer is formed on one side of the insulated layer; forming a groove on the insulated layer; forming a metallic substance on an inner side of the groove and on another side of the insulated layer; and forming a first circuit pattern on at least one of one side of the insulated layer and the metallic substance formed on the groove by removing a portion of the first metal layer. The present invention provides the printed circuit board having a high efficiency of heat emission by disposing a heat sink in direct contact with a board and the method of manufacturing the printed circuit board. | 07-05-2012 |
20120175152 | HIGH-SPEED SIGNAL TRANSMISSION BOARD - A high-speed signal transmission board includes a first board part including a first ground pattern, a first insulating layer formed on a first surface and a second surface of the first ground pattern, and a first electrically conductive pattern formed on a surface of the first insulating layer; a second board part including a second ground pattern, a second insulating layer formed on a first surface and a second surface of the second ground pattern, and a second electrically conductive pattern formed on a surface of the second insulating layer; and a connecting part connecting the first electrically conductive pattern of the first board part and the second electrically conductive pattern of the second board part with the first board part and the second board part facing each other. | 07-12-2012 |
20120175153 | WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - A wiring substrate includes plural insulating layers including an outermost insulating layer; and plural wiring layers which are alternately laminated between the insulating layers and include outermost wiring layers exposed from the outermost insulating layer and through wirings having electrode pads on end portions of the through wirings and penetrating through the outermost insulating layer, wherein the electrode pads of the through wirings are exposed from the outermost insulating layer, and a part of the outermost wiring layers overlaps the end portions of the through wirings and is connected to the through wirings. | 07-12-2012 |
20120181065 | Multi-Layered Circuit Board Device - A multi-layered circuit board device includes an isolative layer and a wiring layer sequentially provided on a circuit board in a PCB, ceramic, LTCC or aluminum nitride build-up process. Thus, the thickness of the multi-layered circuit board device is small and the density of the multi-layered the circuit board device is high. Furthermore, the structure of the multi-layered circuit board device is simple and the cost of the multi-layered circuit board device is low. The layers are connected to one another in the PCB, ceramic, LTCC or aluminum nitride build-up process without having to use additional alignment target points. | 07-19-2012 |
20120186856 | MULTI-LAYER FLEXIBLE PRINTED CIRCUIT BOARD FOR ELECTRONIC DEVICE - A multi-layer Flexible Printed Circuit Board (FPCB) for an electronic device, in which a plurality of components are provided alternately on a top surface and a bottom surface of a base layer and the components are removed from the other region. The multi-layer FPCB includes a base layer, a first circuit pattern provided on a side region on a top surface of the base layer, a first adhesive layer provided in the first circuit pattern, a second circuit pattern provided on a bottom surface of the base layer and in an other-side region opposite to the side region, a second adhesive layer provided in the second circuit pattern, a first insulating/protecting layer provided on a top surface of the first adhesive layer, and a second insulating/protecting layer provided on a bottom surface of the second adhesive layer. | 07-26-2012 |
20120186857 | METHOD FOR MANUFACTURING WIRING BOARD FOR MOUNTING ELECTRONIC COMPONENT, WIRING BOARD FOR MOUNTING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING WIRING BOARD HAVING AN ELECTRONIC COMPONENT - A method for manufacturing a wiring board for mounting an electronic component, a wiring board for mounting an electronic component, and a method for manufacturing an electronic-component-mounted wiring board are provided. A bonding material paste, which can include solder and an electric insulation material made of a resin, can be placed on chip mount terminal pads and heated to fuse the solder and soften the electric insulation material. Subsequently, the solder is solidified to form solder bumps. Further, the electric insulation material is cured on a surface of each of the solder bumps and a surface of a multilayer board around each of the solder bumps to form an electric insulation surface layer. Accordingly, when a chip is mounted to such wiring boards, the electric insulation surface layer minimizes or eliminates the connection between adjacent solder bumps during re-fusing of the solder. | 07-26-2012 |
20120193126 | METHOD OF FORMING SENSORS AND CIRCUITS ON COMPONENTS - A method for depositing a powder metal onto a surface of the substrate and a substrate with conductive elements provided on a surface of the substrate are disclosed. The conductive elements are formed by cold spray depositing at least one layer of powder metal onto the surface of the substrate to form at least one conductive element on the surface of the article. | 08-02-2012 |
20120193127 | SUSPENSION BOARD WITH CIRCUIT - A suspension board with circuit includes an insulating base layer and a conductive pattern that is laminated on a top surface of the insulating base layer. The conductive pattern includes a wire and a terminal portion that is connected to the wire for being joined by a melted metal. The insulating base layer, in a projected surface when projected in a laminating direction, includes an adjacent region that is adjacent to the terminal portion and a separated region that is separated from the terminal portion so as to sandwich the adjacent region with the terminal portion. The adjacent region is formed to be thinner than the separated region. | 08-02-2012 |
20120193128 | PRINTED CIRCUIT BOARD - Embodiments of the present invention provide a multi layered printed circuit board, PCB, with via holes connecting different signal layers of the PCB. The via holes are connected to pads in the signal layers and are surrounded by anti-pads in the ground layers. In accordance with further embodiments of the invention the pads have a shape wherein a first path, stretching from the center of the pad and substantially in a direction in which adjacent routing channels extend, to a first point located on the edge of the pad, is longer than a second path, stretching from the center of the pad and substantially in a direction towards the adjacent routing channels to a second point located on the edge of the pad. | 08-02-2012 |
20120199380 | PRINTED CIRCUIT BOARD - The present invention concerns a printed circuit board, PCB. The PCB comprises a number of signal layers comprising routing channels and at least one ground layer being adjacent to at least one signal layer. A number of via holes connects different signal layers of the PCB. In the signal layers the via holes are connected to pads and in the ground layers they are be surrounded by anti-pads. The pads are shaped such that at least a part of a via hole connected to the pad is on the outside of, or in close proximity to, the edge of the pad, irrespective of where on the pad the centre of the via hole is positioned. | 08-09-2012 |
20120205142 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate is configured such that each of laminate portions provided above and below a substrate core includes insulating layers and conductor layers stacked alternately. Of the conductor layers of the laminate portions, signal line layers are treated with a silane coupling treatment, which is a surface modification treatment, so that each signal line comprises a flat surface. A roughening treatment is performed on the remaining conductor layers of the laminate portions such that the surfaces of these layers are roughened. This structure provides an advantage when high-frequency signals are transmitted through the signal line layers. That is, when each signal line comprises a flat surface, an increase in conductor loss due to the skin effect can be prevented. In addition, by means of chemical bonding attained through the silane coupling treatment, the reliability of adhesion between the signal line layers and the insulating layer is sufficiently attained. | 08-16-2012 |
20120211265 | FLEXIBLE CIRCUIT ASSEMBLY WITHOUT SOLDER - The present invention provides an electronic assembly. The assembly uses no solder. Components or component packages with I/O leads are mounted on a flexible substrate and encapsulated with an electrically insulating material. Vias connect through the substrate to the components' leads. | 08-23-2012 |
20120217043 | METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD - Disclosed herein is a method of manufacturing a printed circuit board having a buried pattern, including: forming a second insulation layer on a first insulation layer, the second insulation layer having openings for forming a circuit layer; and filling the openings with a conductive metal to form a circuit layer. | 08-30-2012 |
20120228006 | PRINTED CIRCUIT BOARD DESIGN FOR HIGH SPEED APPLICATION - A printed circuit board (PCB) is disclosed. The PCB includes a substrate have a top surface and a bottom surface. A first conductive layer is disposed on the top surface of the substrate. The first conductive layer comprises a first signal net and a second signal net. An outermost insulating layer is disposed on the top surface of the substrate to cover the substrate and the first conductive layer. The outmost insulating layer comprises an opening to expose a portion of the second signal net. And, a second conductive layer is disposed on the outermost insulating layer and substantially covering at least a portion of the first signal net. The second conductive layer is filled into the opening to electrically connect to the second signal net which is able to provide one of a ground potential and a power potential. | 09-13-2012 |
20120228007 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFATURING THE SAME - Disclosed are a printed circuit board including a core substrate including core circuit layers on both sides thereof, a first build-up layer formed on one side of the core substrate, a second build-up layer formed on the other side of the core substrate, and first and second protective layers formed on the first and second build-up layers, respectively, wherein the first build-up layer includes a trench circuit layer as an outermost circuit layer formed by a trench technology, the trench circuit layer is embedded in the first protective layer, and an outermost circuit layer of the second build-up layer is embedded in an outermost insulating layer of the second build-up layer, and a method of manufacturing the printed circuit board. Thanks to the formation of the outermost circuit layer by the trench technology, it is difficult to separate the outermost circuit layer from the outermost insulating layer. | 09-13-2012 |
20120234580 | CIRCUIT BOARD - A multilayer circuit board, comprising: a plurality of printed circuit board layers arranged stacked together; and a conductively plated via; a surface of a through which the via passes comprises a conducting region surrounding a non-conducting region that is substantially centered around a point where the via intersects the surface; a smallest width dimension, e.g. diameter of the non-conducting region is greater than or equal to 4 times the diameter of the via; the via connects a conductive contact pad on one printed circuit board layer to a conductive contact pad on another printed circuit board layer, with the printed circuit board with the non-conducting region lying between the two connected layers; and the largest width dimension of the conductive contact pads on the surfaces of the printed circuit board layers connected by the via are less than the smallest width dimension of the non-conducting region. | 09-20-2012 |
20120247811 | COMPOSITE CIRCUIT BOARD WITH FRACTURABLE STRUCTURE - A composite circuit board with fracturable structure includes a first flat cable and first signal transmission lines formed on the first flat cable. A second flat cable is stacked on and bonded to the first circuit flat cable. The second flat cable includes second signal transmission lines and forms an overlapping segment and a selective breakable segment between which a fracturable structure is formed. The selective breakable segment covers the connection segment of the first flat cable or may be broken off for separation of the flat cables. Some of the second signal transmission lines of the second flat cable are connected through a hole in the first circuit flat cable to the first signal transmission lines of the first flat cable or connected through the hole to the conductive terminals of the connection segment of the first flat cable. | 10-04-2012 |
20120247812 | SEMICONDUCTOR DEVICE WITH POWER SUPPLY LINE SYSTEM OF REDUCED RESISTANCE - A semiconductor device with a power wiring system. The device includes a multi-level wiring structure including a lower-level wiring layer and an upper-level wiring layer over the lower-level wiring layer, and the power wiring system includes a first power supply line and a second power supply line provided as the first-level wiring layer and extending in a first direction in substantially parallel to each other, a third power supply line provided as the upper-level wiring layer and extending in the first direction with overlapping the first power supply line, the first and third power supply lines conveying first and second power voltages, respectively, which are different from each other, and a fourth power supply line provided as the upper-level wiring layer and extending in the first direction with overlapping the second power supply line, the second and fourth power supply lines conveying the second and first power voltages, respectively. | 10-04-2012 |
20120247813 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes preparing a metal sheet having metal members and connectors joining the metal members, forming a structure having core substrates which are connected through the connectors and which have insulation structure portions covering the metal members, respectively, cutting the connectors in the structure such that an independent core substrate having a recessed portion is formed and a respective one of the connectors is removed from the independent core substrate, and covering the recess portion of the independent core substrate with a resin. The covering of the recess portion includes either forming an interlayer insulation layer on a surface of the independent core substrate or forming interlayer insulation layers on opposing surfaces of the independent core substrate. | 10-04-2012 |
20120247814 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a wiring substrate, includes obtaining a laminated body in which a first copper tin alloy layer and a copper layer are arranged in sequence on a first coupling agent layer, on a first insulating resin layer, forming a seed layer on the copper layer, forming a plating resist in which an opening portion is provided on the seed layer, forming a metal plating layer in the opening portion of the plating resist by applying an electroplating that utilizes the seed layer as a plating power feeding path, removing the plating resist, and forming a first wiring layer on the first coupling agent layer by etching the seed layer, the copper layer, and the first copper tin alloy layer while using the metal plating layer as a mask. | 10-04-2012 |
20120255764 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - An embedded printed circuit board and a manufacturing method thereof are provided. The manufacturing method includes a first step of forming a first insulating layer having a seed layer formed on one side thereof and at least. one metal pattern embedded therein and a second step of laminating the first insulating layer and a base substrate with an inner circuit having a second insulating layer interposed between the first insulating layer and the base substrate. Accordingly, a printed circuit board with a circuit embedded in an insulating layer is provided, and thus a high-density and high-reliability printed circuit board can be achieved. Furthermore, since the printed circuit board is manufactured using a mold, a circuit manufacturing process for embedding, a process for forming a seed layer and a complicated process such as surface grinding are omitted so as to simplify the manufacturing process. | 10-11-2012 |
20120261165 | INTERCONNECT DEVICE AND METHOD OF FABRICATING SAME - An interconnect device and a method for fabricating same. An embodiment of the invention includes sequential steps of providing a flexible substrate, forming vias through the flexible substrate, applying a conductive seed layer including first and second portions, applying conductive materials including first and second portions, copper plating the substrate, and then removing the second portions of the conductive seed layer and the conductive materials. | 10-18-2012 |
20120273257 | TRANSPARENT CONDUCTIVE STRUCTURE APPLIED TO A TOUCH PANEL AND METHOD OF MAKING THE SAME - A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent substrate. The transparent conductive unit includes a transparent conductive layer formed on the top surface of the first coating layer. The transparent conductive layer includes a plurality of embedded conductive circuits embedded into the first coating layer and arranged to form a predetermined embedded circuit pattern. The second coating unit includes a second coating layer formed on the top surface of the transparent conductive layer. The second coating layer has a touching surface formed on the top side thereof, and the touching surface allows an external object (such as user's finger, any type of touch pen, or etc.) to touch. | 11-01-2012 |
20120273258 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first signal layer, a first reference layer, a second signal layer, and a third signal layer in that order and includes a first slanted via and a second slanted via. The first signal layer includes an parallel first transmission wire and a second transmission wire. The first and second transmission wires are coupled with each other and cooperatively constitute a first differential pair with an edge-coupled structure. The second signal layer includes a third transmission wire. The third signal layer includes a fourth transmission wire parallel to and coupled with the third transmission wire. The third and fourth transmission wires cooperatively constitute a second differential pair with a broadside-coupled structure. The first slanted via obliquely are interconnected between the first transmission wire and the third transmission wire. The second slanted via obliquely are interconnected between the second transmission wire and the fourth transmission wire. | 11-01-2012 |
20120279758 | TRANSPARENT CONDUCTIVE STRUCTURE APPLIED TO A TOUCH PANEL AND METHOD OF MAKING THE SAME - A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent substrate. The transparent conductive unit includes a transparent conductive layer formed on the top surface of the first coating layer. The transparent conductive layer includes a plurality of embedded conductive circuits embedded therein and arranged to form a predetermined embedded circuit pattern. The second coating unit includes a second coating layer formed on the top surface of the transparent conductive layer to cover the embedded conductive circuits. The second coating layer has a touching surface formed on the top side thereof, and the touching surface allows an external object (such as user's finger or touch pen) to touch. | 11-08-2012 |
20120279759 | TRANSPARENT CONDUCTIVE STRUCTURE APPLIED TO A TOUCH PANEL AND METHOD OF MAKING THE SAME - A transparent conductive structure applied to a touch panel includes a substrate unit, a first coating unit, a transparent conductive unit, and a second coating unit. The substrate unit includes a transparent substrate. The first coating unit includes a first coating layer formed on the top surface of the transparent substrate. The transparent conductive unit includes a transparent conductive layer formed on the top surface of the first coating layer. The transparent conductive layer includes a plurality of conductive circuits arranged to form a predetermined circuit pattern. The second coating unit includes a second coating layer formed on the top surface of the transparent conductive layer. The second coating layer has a touching surface formed on the top side thereof for an external object to touch. The second coating layer is substantially formed by mixing silicon oxide, aluminum oxide, lithium oxide and Teflon. | 11-08-2012 |
20120285730 | UNIVERSAL CHIP CARRIER AND METHOD - A method of fabricating chip carriers suitable for use in packaging integrated circuits and other electronic, electro-mechanical and opto-electronic devices is described. In general, a number of wires (or wires and rods) are arranged in parallel in a wiring fixture. After the wires are positioned, they are encapsulated to form an encapsulated wiring block. The wiring block is then sliced to form a number of discrete panels. Preferably, the various wires are geometrically positioned such that each resulting panel has a large number of device areas defined therein. The encapsulant in each panel effectively forms a substrate and the wire segments in each panel form conductive vias that extend through the substrate. The resulting panels/chip carriers can then be used in a wide variety of packaging applications. | 11-15-2012 |
20120292083 | METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD - The present invention relates to a method of producing a circuit board, comprising: a film-forming step of forming a resin film on the surface of an insulative substrate; a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the resin film on the external surface of the resin film; a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves on the insulative substrate and the surface of the resin film; a film-removing step of removing the resin film; and a plating processing step of electroless-plating the insulative substrate after removal of the resin film, wherein a partial reinforcing structure is formed in a region of the circuit groove in the circuit groove-forming step. | 11-22-2012 |
20120305291 | PRIMER LAYER FOR PLATING PROCESS, LAMINATE FOR WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF, MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF - Disclosed are a primer layer for plating process exhibiting high adhesiveness to an electroless copper plating and capable of coping with high density of wirings of semiconductor packages; a laminate for wiring board having the primer layer and a method for manufacture thereof; and a multilayer wiring board having the primer layer and a method for manufacture thereof. The primer layer is formed of a resin composition including (A) a polyfunctional epoxy resin, (B) an epoxy resin curing agent, and (C) a phenolic hydroxyl group-containing polybutadiene-modified polyamide resin having specified structural units, wherein a blending proportion of the component (C) is 5 parts by mass or more and less than 25 parts by mass based on 100 parts by mass of a total sum of the component (A) and the component (B). | 12-06-2012 |
20120312584 | PACKAGE SUBSTRATE AND FABRICATION METHOD THEREOF - A package substrate includes a core board, a first dielectric layer, a second circuit pattern, a first solder mask and an insulating layer. A first circuit pattern is disposed on a first surface of the core board. The first dielectric layer covers the first circuit pattern. The second circuit pattern is located on the first dielectric layer and the second circuit pattern includes an interconnection circuit pattern within a chip mounting area. The first solder mask covers a portion of the second circuit pattern outside the chip mounting area. The insulating layer covers the chip mounting area and the interconnection circuit pattern. A plurality of embedded bump pads are located on an upper surface of the insulating layer. | 12-13-2012 |
20120325523 | STRUCTURE, WIRING BOARD, AND METHOD OF MANUFACTURING WIRING BOARD - A structure ( | 12-27-2012 |
20130000955 | WIRING BOARD AND MANUFACTURING METHOD OF THE SAME - A wiring board includes a main body, a piercing electrode piercing the main body, a first wiring pattern provided at a first surface side of the main body, the first wiring pattern having a pad being electrically connected to one end of the piercing electrode and being where an electronic component is mounted, and a second wiring pattern provided at a second surface side of the main body, the second surface side being situated at a side opposite to the first surface side, the second wiring pattern having an external connection pad being electrically connected to another end of the piercing electrode. A recess and a resin covering the recess are provided at an external circumferential part of the wiring board to surround the first and second wiring patterns and the piercing electrode, the recess piercing the main body of a part positioned at the external circumferential part. | 01-03-2013 |
20130000956 | HIGH-FREQUENCY CIRCUIT BOARD - A high-frequency circuit board capable of easily forming a bias line whose resonance frequency is sufficiently separated from operating frequency is provided. On a high-frequency circuit board | 01-03-2013 |
20130008698 | MULTILAYER WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE - A multilayer wiring board having via-hole conductors which electrically connects a plurality of wirings arranged in a manner such that an insulating resin layer is placed between the wirings, wherein: the via-hole conductors each include copper, tin, and bismuth, namely, a first metal region including a link of copper particles in plane-to-plane contact with one another, the link electrically connecting the wirings, a second metal region mainly composed of one or more of tin, a tin-copper alloy, and a tin-copper intermetallic compound, and a third metal region mainly composed of bismuth; at least a part of the second metal region is in contact with the surface of the copper particles, the surface excluding the area of the plane-to-plane contact portion of the link; and the Cu, Sn, and Bi in the metal portion are of a composition having a specific weight ratio (Cu:Sn:Bi). | 01-10-2013 |
20130020109 | Package and Manufacturing Method of the Same - Provided are a package including a first conductive layer on a patterned layer, an insulating layer on the patterned layer burying the first conductive layer, a second conductive layer on an outer surface of the insulating layer, and a third conductive layer in the insulating layer electrically connecting the first conductive layer with the second conductive layer. A substrate is formed by printing or coating a paste- or ink-type insulator and conductor on a patterned layer formed on a sapphire wafer. No void is created between the substrate and LED chip, thus enhancing attachment strength. The ceramic-containing insulator is cured at a low temperature, thereby minimizing contraction of and damage to the wafer when the ceramic is fired. Printing methods utilizing viscous paste or ink solves problems with co-planarity of substrate that occur in existing wafer-to-wafer bonding processes and renders several steps of the existing substrate manufacturing process unnecessary. | 01-24-2013 |
20130020110 | METHOD OF MANUFACTURING FILM PRODUCT USING THERMAL ROLL IMPRINTING AND BLADE COATING, AND SECURITY FILM AND FILM INTEGRAL ELECTRIC DEVICE USING THE SAME - An aspect of the present invention provides a method of manufacturing a film product using thermal roll imprinting and blade coating. A method of manufacturing a film product using thermal roll imprinting and blade coating according to an exemplary embodiment of the present invention includes a preparing step of preparing a first transparent film; an imprinting step of transporting the first transparent film between a thermal roll provided with an imprint mask and a support roll to form a groove of a fine pattern on the first transparent film; and a blading step of filling a filling material of a paste state having at least one property of light blocking and conductivity in the groove of the first transparent film by a doctor blade. | 01-24-2013 |
20130025914 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board has wiring board has a first rigid wiring board having an accommodation portion and a conductor, a second rigid wiring board accommodated in the accommodation portion and having a conductor electrically connected to the conductor in the first rigid wiring board, and an insulation layer formed over the first rigid wiring board and the second rigid wiring board. The first rigid wiring board has a wall surface defining the accommodation portion and having a concavo-convex shaped portion, and the second rigid wiring board has a side surface facing against the wall surface of the first rigid wiring board and having a concavo-convex shaped portion such that the concavo-convex shaped portion of the side surface of the second rigid wiring board engages with the concavo-convex shaped portion of the wall surface of the first rigid wiring board. | 01-31-2013 |
20130037309 | TERMINAL-INTEGRATED METAL BASE PACKAGE MODULE AND TERMINAL-INTEGRATED METAL BASE PACKAGING METHOD - The present invention relates to a terminal-integrated package method for a metal base package module that can effectively prevent short-circuit or breakage by not using wire bonding for connection with an external circuit. | 02-14-2013 |
20130037310 | EPOXY RESIN COMPOSITION FOR CIRCUIT BOARD, PREPREG, LAMINATE, RESIN SHEET, LAMINATED BASE MATERIAL FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE - Provided is an epoxy resin composition for a circuit board including an epoxy resin (A); an inorganic filler (B); and a cyclic or cage-shape siloxane compound (C) having at least two Si—H bonds or two Si—OH bonds. | 02-14-2013 |
20130048344 | HIGH FREQUENCY CIRCUIT BOARD - In one embodiment of the present invention, a high frequency circuit board includes a laminate having a top surface with a groove; a semi-rigid cable positioned in the groove of the laminate; and a passivation layer filling the groove; wherein the semi-rigid cable is configured to transmit a high frequency signal, and the semi-rigid cable comprises a central conductor, an outer conductor, and an insulating layer between the central conductor and the outer conductor. | 02-28-2013 |
20130056246 | GLASS PANEL HAVING ULTRASONICALLY INTEGRATED CONDUCTING WIRES - A glazing and a process for manufacturing such a glazing, the glazing integrating a conducting wire, wherein a surface of the glazing includes a substrate made of a polymer material wherein the conducting wire is partly sunken and at the very most flush with the surface of the polymer material, or a substrate made of mineral glass or made of a polymer material onto which the conducting wire is adhesively bonded. The glazing can be applied in a transport vehicle, building trades, street furniture, interior fittings, electrical goods or electronics. | 03-07-2013 |
20130056247 | WIRING METHOD, STRUCTURE HAVING WIRING PROVIDED ON SURFACE, SEMICONDUCTOR DEVICE, WIRING BOARD, MEMORY CARD, ELECTRIC DEVICE, MODULE AND MULTILAYER CIRCUIT BOARD - A wiring method is provided in which an insulating layer is formed on a surface of a semiconductor device | 03-07-2013 |
20130062099 | MULTIPLE LAYER Z-AXIS INTERCONNECT APPARATUS AND METHOD OF USE - A multiple layered apparatus and method for forming a z-axis interconnect is provided. The multiple layered apparatus comprises a protective layer, a dielectric layer, a conductive layer, and a support layer. A method for forming a z-axis interconnect using the multiple layer apparatus resulting in a thinner and less expensive structure for printed circuit board applications. | 03-14-2013 |
20130062100 | CIRCUIT BOARD STRUCTURE - Provided are a circuit board structure and a fabrication method thereof, including the steps of: forming a first circuit layer in a first dielectric layer and exposing the first circuit layer therefrom; forming a second dielectric layer on the first dielectric layer and the first circuit layer, and forming a second circuit layer on the second dielectric layer; forming a plurality of first conductive vias in the second dielectric layer for electrically connecting to the first circuit layer to thereby dispense with a core board and electroplated holes and thus facilitate miniaturization. Further, the first dielectric layer is liquid before being hardened and is formed on the first dielectric layer that enhances the bonding between layers of the circuit board and the structure. | 03-14-2013 |
20130062101 | MULTILAYER WIRING SUBSTRATE, AND MANUFACTURING METHOD FOR MULTILAYER SUBSTRATE - A multilayer wiring board includes inner-layer wiring boards each having wirings on both sides thereof; electrically insulating substrates each having through-holes filled with a conductive paste; | 03-14-2013 |
20130068507 | Multi-Layer Wire Structure for High Efficiency Wireless Communication - A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency. | 03-21-2013 |
20130068508 | CERAMIC PRINTED CIRCUIT BOARD STRUCTURE - A ceramic printed circuit board (PCB) structure includes a ceramic substrate, silver paste layers and nano-enamel layers. A first silver paste layer of the silver paste layers is provided on the ceramic substrate. The other silver paste layers of the silver paste layers and the nano-enamel layer of the nano-enamel layers are interleaved with each other, and each silver paste layer consists of a circuit pattern for electrically connecting a plurality of electrical elements. Each nano-enamel layer except the last nano-enamel layer of the nano-enamel layers consists of an interlayer electrical connection line for electrically connecting two corresponding circuit patterns on two adjacent nano-enamel layers so as to form the ceramic PCB structure with a multilayer of circuit patterns. The working temperature and the electrical insulation are thus greatly improved. | 03-21-2013 |
20130081859 | Multilayer Circuit Board and Manufacturing Method Thereof - A multilayer circuit board is provided, which includes multiple core boards stacked together. The core board includes an insulation layer and at least one conductor layer attached together. The conductor layer includes a circuit. The core board has at least one identification conductor disposed at an edge of at least one conductor layer. The identification conductor forms an identification pattern on a side surface of the core board along a stacking direction of the core boards. The identification patterns of the multiple core boards are different from each other on the side surface of the multilayer circuit board along the stacking direction of the core boards. A manufacturing method of the multilayer circuit board is further provided. | 04-04-2013 |
20130087365 | METHOD FOR MAKING ELECTRICAL STRUCTURE WITH AIR DIELECTRIC AND RELATED ELECTRICAL STRUCTURES - A method has been described for making an electrical structure having an air dielectric and includes forming a first subunit including a sacrificial substrate, an electrically conductive layer including a first metal on the sacrificial substrate, and a sacrificial dielectric layer on the sacrificial substrate and the electrically conductive layer. The method further includes forming a second subunit including a dielectric layer and an electrically conductive layer thereon including the first metal, and coating a second metal onto the first metal of one or more of the first and second subunits. The method also includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate and sacrificial dielectric layer to thereby form the electrical structure having the air dielectric. | 04-11-2013 |
20130092420 | EMBEDDED MULTILAYER PRINTED CIRCUIT BOARD AND METHOD - An embedded multilayer printed circuit board includes first, second and third circuit substrates, and a flexible circuit substrate. The first circuit substrate includes a first base layer and a first electrically conductive layer. The second circuit substrate includes a second base layer and a second circuit layer. The second circuit substrate also defines a receiving hole. The third circuit substrate includes a third circuit layer, a third base layer, a fourth circuit layer, and an electronic element mounted on the third circuit layer. The third circuit layer and the fourth circuit layer are formed on the opposite sides of the third base layer. The electronic element is received in the receiving hole. | 04-18-2013 |
20130098662 | METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD, AND MULTI-LAYER CIRCUIT BOARD - A multi-layer circuit board having a connector portion of an inner layer substrate being exposed, the multi-layer circuit board comprising: an inner layer substrate in which an inner layer circuit is formed, the inner layer circuit including the connector portion; and an outer layer substrate having an outer layer circuit formed on an insulating layer and having a region corresponding to the connector portion peeled off, an inner layer circuit side of the inner layer substrate and an insulating layer side of the outer layer substrate being adhered to one another via an adhesive layer so as to face one another, and a conductor layer other than the connector portion of the inner layer circuit being adhered to the outer layer substrate directly by the adhesive layer. | 04-25-2013 |
20130098663 | TOUCH PANEL SENSOR - A capacitive touch panel sensor in which waviness generated in a film furnished with a transparent electrode pattern can be small. The touch panel sensor according to the present invention includes a first film, a first transparent electrode pattern formed on the first film, a first adhesive layer laminated on the first film so as to cover the first transparent electrode pattern, a second film laminated on the first adhesive layer, a second adhesive layer laminated on the second film, a third film laminated on the second adhesive layer, and a second transparent electrode pattern formed on the third film, wherein Da/Db is 0.5 to 0.9 where a total thickness of the second film and the second adhesive layer is Da, and a distance between the first transparent electrode pattern and the second transparent electrode pattern is Db. | 04-25-2013 |
20130105201 | ELECTRONIC COMPONENT-EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME | 05-02-2013 |
20130105202 | CIRCUIT BOARD STRUCTURE | 05-02-2013 |
20130118780 | WIRELESS TERMINAL WITH REDUCED SPECIFIC ABSORPTION RATE PEAK AND IMPLEMENTATION METHOD THEREOF - The disclosure discloses a wireless terminal with a reduced Specific Absorption Rate (SAR) peak. The wireless terminal comprises a Printed Circuit Board (PCB), wherein a fractal gap is formed at an edge of a metal ground on the PCB to disturb distribution of induced current at the edge of the metal ground. The disclosure also discloses a method for reducing an SAR peak. On the premise of the non-influence on the communication quality of the wireless terminal, the SAR and the production cost can be reduced and the structure space of wireless terminal can be saved by using the wireless terminal and the method. | 05-16-2013 |
20130133928 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a core layer; and a plurality of circuit layers stacked on the core layer, wherein one of the circuit layers includes a mesh pattern and a solid pattern, and another of the circuit layers include a first signal pattern opposite to the mesh pattern and a second signal pattern opposite to the solid pattern, the second signal pattern having a high-speed signal line with a higher speed, as compared with the second signal pattern. | 05-30-2013 |
20130146335 | STRUCTURE WITH A METAL SILICIDE TRANSPARENT CONDUCTIVE ELECTRODE AND A METHOD OF FORMING THE STRUCTURE - Disclosed are embodiments of a structure with a metal silicide transparent conductive electrode, which is commercially viable, robust and safe to use and, thus, optimal for incorporation into devices, such as flat panel displays, touch panels, solar cells, light emitting diodes (LEDs), organic optoelectronic devices, etc. Specifically, the structure can comprise a substrate (e.g., a glass or plastic substrate) and a transparent conducting film on that substrate. The transparent conducting film can comprise a metal silicide nanowire network. For example, in one embodiment, the metal silicide nanowire network can comprise multiple metal silicide nanowires fused together in a disorderly arrangement so that they form a mesh. In another embodiment, the metal silicide nanowire network can comprise multiple metal silicide nanowires patterned so that they form a grid. Also disclosed herein are various different method embodiments for forming such a structure. | 06-13-2013 |
20130146336 | PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF - A packaging substrate is provided, which includes: a core layer having opposite first and second surfaces; two circuit layers formed on the first and second surfaces, respectively; a plurality of conductive through holes penetrating the core layer and electrically connected to the first and second circuit layers; two insulating protection layers disposed on the first and second surfaces of the core layer and the circuit layers; and a carrier attached to one of the insulating protection layers for preventing cracking of the packaging substrate during transportation or packaging. | 06-13-2013 |
20130146337 | MULTI-LAYERED PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A multi-layered printed circuit board and a method of manufacturing the multi-layered printed circuit board are disclosed. The multi-layered printed circuit board in accordance with an embodiment of the present invention includes: an insulation layer; an inner-layer pad disposed inside the insulation layer; an inner-layer circuit wiring disposed inside the insulation layer and formed to be thinner than that of the inner-layer pad; a via connected with the inner-layer pad by penetrating the insulation layer; and an outer-layer circuit wiring formed on an outside surface of the insulation layer. | 06-13-2013 |
20130161073 | METHOD OF MANUFACTURING MULTI-LAYER CIRCUIT BOARD AND MULTI-LAYER CIRCUIT BOARD MANUFACTURED BY USING THE METHOD - A method of manufacturing a multi-layer circuit board includes: forming a first circuit layer on a first surface of a first prepreg; stacking a second prepreg on a first surface of the first circuit layer; and forming at least one of a second or a third circuit layer on at least one of a first surface of the second prepreg and a second surface opposite of the first surface of the first prepreg, wherein, in the stacking of the first prepreg, the first prepreg and the second prepreg are semi-cured. | 06-27-2013 |
20130168134 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes a core substrate, a first conductive pattern formed on the substrate, an insulation structure having a first insulation layer and formed on the substrate such that the first insulation layer covers the first pattern, a second conductive pattern formed on the structure, and a second insulation layer formed on the structure such that the second insulation layer covers the second pattern. The structure has a via conductor connecting the first and second patterns through the first insulation layer, the first insulation layer includes a first layer containing a reinforcing fiber material and a second layer formed on the first layer such that the first layer is on the substrate side and a second layer is on the second insulation layer side, and the second layer is made of an insulating material which is the same material as an insulating material forming the second insulation layer. | 07-04-2013 |
20130168135 | INDIVIDUALLY ADDRESSABLE BAND ELECTRODE ARRAYS AND METHODS TO PREPARE THE SAME - Band electrode arrays, methods of manufacturing, and a method of using are disclosed. The arrays have individually addressable band electrodes such that diffusion layers of the band electrodes overlap. An exemplary method of manufacturing may comprise: a first insulating layer is disposed on a substrate; a first band electrode is disposed on the first insulating layer; a second insulating layer is disposed on the first insulating layer and completely covers the first band electrode; a second band electrode is disposed on the second insulating layer; a third insulating layer is disposed on the second insulating layer and completely covers the second band electrode; the first and second band electrodes are electrically insulated from each other and individually addressable; cross-sectional surfaces of the first and second band electrodes are exposed on the test surface; and these exposed cross-sectional surfaces substantially overlap each other in a direction perpendicular to the substrate. | 07-04-2013 |
20130180762 | Printed Circuit Boards Including Strip-Line Circuitry and Methods of Manufacturing Same - A multi-layer printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a second electrically-insulating layer, and a first electrically-conductive layer disposed between the first and second electrically-insulating layers. The second layer includes a third electrically-insulating layer and a second electrically-conductive layer. The first layer stack and/or the second layer stack include a cut-out area defining a void that extends therethrough. The multi-layer printed circuit board further includes a first signal layer disposed in association with the first electrically-insulating layer of the first layer stack or the third electrically-insulating layer of the second layer stack, a second signal layer disposed in association with the second electrically-insulating layer of the first layer stack, and a device at least partially disposed within the cut-out area and electrically-coupled to the first and second signal layers. | 07-18-2013 |
20130180763 | Printed Circuit Boards Including Strip-Line Circuitry and Methods of Manufacturing Same - A printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a first electrically-conductive layer, and a cut-out area defining a void that extends therethrough. The first electrically-insulating layer includes a first surface and an opposite second surface. The first electrically-conductive layer is disposed on the first surface of the first electrically-insulating layer. The second layer stack includes a second electrically-insulating layer. The second electrically-insulating layer includes a first surface and an opposite second surface. One or more electrically-conductive traces are disposed on the first surface of the second electrically-insulating layer. The printed circuit board further includes a device at least partially disposed within the cut-out area. The device is electrically-coupled to one or more of the one or more electrically-conductive traces disposed on the first surface of the second electrically-insulating layer. | 07-18-2013 |
20130186674 | MULTI-LAYER PRINTED CIRCUIT BOARD (PCB) - Embodiments of the present disclosure relate to the field of printed circuit boards and particularly to a multi-layer printed circuit board. The multi-layer printed circuit board includes at least two inner-layer circuit boards, each of which has a non-circuit pattern area including a welding area. Each welding area has at least one welding hole. Further, at least one prepreg is used to fill between two adjacent inner-layer circuit boards and is melted to fill into the welding hole in a welding process. In the multi-layer printed circuit board according to the embodiments of the disclosure, a welding area is arranged in a non-circuit pattern area, and one or more welding holes are arranged in the welding area so that a prepreg between two inner-layer circuit boards can be melted filling into the welding hole(s) in a welding process, thus enhancing effectively an adhesive force binding the inner-layer circuit boards. | 07-25-2013 |
20130192879 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board has a core substrate including first insulation layers, first conductive patterns formed on the first insulation layers, and first via conductors formed through the first insulation layers and connecting the first conductive patterns, and a buildup layer formed on the core substrate and including second insulation layers, second conductive patterns formed on the second insulation layers, and second via conductors formed through the second insulation layers and connecting the second conductive patterns. Each of the first insulation layers includes an inorganic reinforcing fiber material, each of the second insulation layers does not include an inorganic reinforcing fiber material, and the core substrate includes an inductor having the first conductive patterns and the first via conductors. | 08-01-2013 |
20130192880 | PRINTED WIRING BOARD AND METHOD OF MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes an insulative substrate, a wiring portion which is formed on a surface of the insulative substrate and has a predetermined wiring pattern, an insulative layer which is formed on the wiring portion and on which a part of the wiring layer is exposed as a terminal, a radiator plate provided on another surface of the insulative substrate, and a heat conductive portion which is formed inside the through hole penetrating through the surface and the other surface of the insulative substrate and connected to the wiring portion. | 08-01-2013 |
20130192881 | PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME - Provided is a method for manufacturing a printed circuit board. The method for manufacturing a printed circuit board includes preparing an insulation board, irradiating a laser onto a graytone mask to each a surface of the insulation board, thereby forming a circuit pattern groove and a via hole at the same time, and filling the circuit pattern groove and the via hole to form a buried circuit pattern and the via. Thus, the circuit pattern groove and the via hole may be formed using the graytone mask at the same time without performing a separate process for forming the via hole. Therefore, the manufacturing process may be simplified to reduce the manufacturing costs. | 08-01-2013 |
20130199824 | MICROELECTRONICS DEVICE INCLUDING ANISOTROPIC CONDUCTIVE LAYER AND METHOD OF FORMING THE SAME - A microelectronics device includes a first substrate, first electrodes disposed on the first substrate, an insulating layer covering the first electrodes, the insulating layer including openings on the first electrodes, and an anisotropic conductive film on the insulating layer, the anisotropic conductive film including conductive particles electrically connected to the first electrodes through the openings. | 08-08-2013 |
20130199825 | COMPOSITE BUILD-UP MATERIAL FOR EMBEDDING OF CIRCUITRY - Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding circuitry such as microvias, trenches and pads. The composite build-up materials comprise a carrier layer ( | 08-08-2013 |
20130199826 | Assembling and Packaging a Discrete Electronic Component - An electronic component assembly comprises a printed component structure comprising at least one of a semiconducting ink, an insulating ink and a conducting ink deposited onto a substrate. The component structure defining at least one contact area, with a connecting lead disposed against or adjacent to the contact area. At least one layer of electrically insulating material encloses the component structure. At least one of the substrate and the layer of electrically insulating material comprises packaging material. The component structure can be printed on a substrate such as paper or another soft material, which is secured to a layer of insulating packaging material such as polyethylene. Instead, the substrate can be the insulating packaging material itself. Variations using hard and soft substrates are possible, and various examples of electronic component assembly are disclosed. | 08-08-2013 |
20130206458 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - In a suspension board, a conductor layer having a predetermined pattern is formed on the upper surface of a first insulating layer. The first insulating layer has a thick portion having a large thickness and a thin portion having a small thickness. A reinforcing layer is formed on the upper surface of the first insulating layer so as to overlap with a boundary between the thick portion and the thin portion. | 08-15-2013 |
20130213692 | FABRICATING METHOD OF CIRCUIT BOARD AND CIRCUIT BOARD - A method of fabricating a circuit board includes the following steps. A first and a second patterned conductive layer are plated on the first and the second surface of a core substrate, respectively. A first and a second extending pad are individually plated on a first and a second pad of the first and the second patterned conductive layer, respectively. A first and a second thermal-curing type dielectric layer are individually formed on the first and the second surface to cover the first and the second patterned conductive layer and the first and the second extending pad, respectively. A portion of the first and the second thermal-curing type dielectric layer respectively covering the top of the first and the second extending pad are removed. A protective film covers the second extending pad. The extending pad is removed by an etching process. | 08-22-2013 |
20130213693 | CIRCUIT BOARD, STRUCTURAL UNIT THEREOF AND MANUFACTURING METHOD THEREOF - A circuit board, structural units and a manufacturing method are provided, wherein one or more high temperature lamination processes are conducted for laminating the structural units and form a multi-layered circuit board. | 08-22-2013 |
20130213694 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board. | 08-22-2013 |
20130220674 | Adhesive Composition, Varnish, Adhesive Film and Wiring Film - Provided are an adhesive composition with good storage stability, heat resistance, moisture resistance reliability, and adhesion properties; and a curl- and heat-resistant adhesive film and a wiring film using the adhesive composition. The adhesive composition contains 100 parts by weight of a phenoxy resin (A) having plural alcoholic hydroxyl groups in a side chain of the molecule thereof; 2 to 60 parts by weight of a polyfunctional isocyanate compound (B) having an isocyanate group and at least one functional group selected from vinyl, acrylate, and methacrylate groups in the molecule thereof; and 5 to 30 parts by weight of a maleimide compound (C) having plural maleimide groups in the molecule thereof or/and reaction product thereof, in which a total amount of the components (B) and (C) is from 7 to 60 parts by weight. | 08-29-2013 |
20130248225 | Laser Ablation Technique for Electrical Contact to Buried Electrically Conducting Layers in Diamond - A method of laser ablation for electrical contact to a buried electrically conducting layer in diamond comprising polishing a single crystal diamond substrate having a first carbon surface, implanting the diamond with a beam of 180 KeV followed by 150 KeV C | 09-26-2013 |
20130248226 | PHYSICAL CONTACT LAYER FOR BODY-WORN LEADWARE USING SELECTIVE DEPOSITION - A printed electrical circuit and methods for additively printing electrical circuits. Patterned layers of conductive, insulating, semi-conductive materials, and other materials are print deposited on a flexible or rigid substrate to form electrical circuits. A buffering layer is selectively deposited to cover or encapsulate these materials to comprise a comfort layer that provides a soft and comfortable interface to the skin of a wearer. The comfort layer can be selectively deposited on the same press that the conductive, insulating, semi-conductive materials, and other materials are deposited. Further, the comfort layer is selectively deposited only where it is desired and exactly where it is desired. | 09-26-2013 |
20130248227 | CONDUCTIVE FILM HAVING OXIDE LAYER AND METHOD OF MANUFACTURING THE SAME - Provided are a conductive film and a method of manufacturing the same. The conductive film includes a substrate, a first conductive layer formed on the substrate, and a patterned second conductive layer formed on the first conductive layer. Here, oxide layers are formed on top and side surfaces of the second conductive layer. The conductive film may prevent defects of the conductive layer caused by rapid oxidation or damage to the substrate, and increase emission uniformity. | 09-26-2013 |
20130255999 | METHOD AND APPARATUS FOR PROVIDING A CONDUCTOR INTERFACE FOR A PHOTOVOLTAIC MODULE - Described embodiments provide a conductor interface for a photovoltaic module that includes a raised feature on a bottom surface. Methods of forming such structures are also disclosed, as are photovoltaic modules containing the conductor interface. | 10-03-2013 |
20130256000 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer, a second insulation layer formed on the first insulation layer and the first conductive patterns and having an opening portion, a wiring structure accommodated in the opening portion of the second insulation layer and including an insulation layer and conductive patterns on the insulation layer, second conductive patterns formed on the second insulation layer; and a via conductor formed in the second insulation layer and connecting one of the first conductive patterns and one of the second conductive patterns. | 10-03-2013 |
20130256001 | MULTILAYER FLEXIBLE SUBSTRATE - A multilayer flexible substrate includes a first structural layer including at least one resin sheet including an insulating layer, a wiring conductor provided on a principal surface of the insulating layer, and filled vias disposed in the insulating layer; and a second structural layer provided on a principal surface of a portion of the first structural layer and including at least one resin sheet including an insulating layer, a wiring conductor provided on a principal surface of the insulating layer, and a filled via provided in the insulating layer. The multilayer flexible substrate includes rigid regions and a flexible region that is more flexible than the rigid regions. In the multilayer flexible substrate, the filled via disposed in the flexible region has a higher porosity than the filled via disposed in the second structural layer. | 10-03-2013 |
20130256002 | FLEXIBLE PRINTED WIRING BOARD AND LAMINATE FOR PRODUCTION OF FLEXIBLE PRINTED WIRING BOARD - The flexible printed wiring board according to the present invention includes a first flexible insulating layer, a first conductor wiring laminated on the first insulating layer, a second single-layered insulating layer laminated on the first insulating layer, as it covers the first conductor wiring, and a second conductor wiring laminated on the second insulating layer. The first conductor wiring has a thickness in the range of 10 to 30 μm, a line width in the range of 50 μm to 1 mm, and a line gap in the range of 50 μm to 1 mm. The thickness from the surface of the first conductor wiring to the surface of the second insulating layer is in the range of 5 to 30 μm. The surface waviness of the part of the second insulating layer covering the first conductor wiring is 10 μm or less. | 10-03-2013 |
20130264100 | Wiring Substrate and Method for Manufacturing Wiring Substrate - A method for manufacturing a wiring substrate includes alternately stacking first wiring patterns and first insulative layers on a first surface of a core substrate and alternately stacking second wiring patterns and second insulative layers on a second surface of the core substrate at an opposite side of the first surface. The number of the second insulative layers excluding the outermost second insulative layer differs from the number of the first insulative layers. The method further includes forming a via hole in the outermost first insulative layer to expose a portion of the outermost first wiring pattern, and exposing the outermost second wiring pattern by reducing the outermost second insulative layer in thickness. The method further includes forming a via in the via hole and forming a wiring pattern, which is connected by the via to the outermost first wiring pattern, on the outermost first insulative layer. | 10-10-2013 |
20130264101 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE - There is provided a wiring substrate including: a core substrate including: a first core substrate including: a plate-shaped first glass substrate; and a first through electrode formed through the first glass substrate; a second core substrate including: a plate-shaped second glass substrate; and a second through electrode formed through the second glass substrate, wherein a diameter of the second through electrode is different from that of the first through electrode; and an insulating member encapsulating the first and second core substrates, and a wiring layer formed on at least one surface of the core substrate. The first and second core substrates are arranged to be separated from each other when viewed from a top. | 10-10-2013 |
20130269984 | SOLDERING DEVICE, SOLDERING METHOD, AND SUBSTRATE AND ELECTRONIC COMPONENT PRODUCED BY THE SOLDERING DEVICE OR THE SOLDERING METHOD - Provided are a soldering device and a soldering method which allow for soldering at low cost with high yield and high reliability. The soldering device has: first organic fatty acid-containing solution bath | 10-17-2013 |
20130269985 | RESIN COMPOSITION, AND PROTECTIVE FILM, DRY FILM, CIRCUIT BOARD, AND MULTILAYER CIRCUIT BOARD CONTAINING SAME - A resin composition which is capable of forming a film that has excellent heat resistance and slidability/bendability; a protective film for circuits, which uses the resin composition; and a dry film or the like which comprises the protective film are provided. Other aspects are a circuit board and a multilayer circuit board, each of which has excellent heat resistance and slidability/bendability. Furthermore, a protective film for circuit boards is provided, which is arranged in contact with a circuit of a printed wiring board, and contains a polyoxazolidone resin that has a weight average molecular weight of 3×10 | 10-17-2013 |
20130277092 | JOINING SHEET, ELECTRONIC COMPONENT, AND PRODUCING METHOD THEREOF - A joining sheet contains solder particles, a thermosetting resin, a thermoplastic resin, and a blocked carboxylic acid. | 10-24-2013 |
20130306358 | CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME - Provided is a method of manufacturing a circuit board including preparing a board structural body ( | 11-21-2013 |
20130313002 | MULTILAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a multilayer printed circuit board includes the step as follows: providing a glass wiring substrate, the glass wiring substrate comprising a first electrically conductive pattern, a glass base, and a second electrically conductive pattern, the second electrically conductive pattern comprising a plurality of first solder pads; laminating a first lamination substrate onto the glass wiring substrate, the first lamination substrate comprising a first base layer and a first electrically conductive material layer on the first base layer, such that the first base layer is sandwiched between the first electrically conductive pattern and the first electrically conductive material layer; patterning the first electrically conductive material layer to form a third electrically conductive pattern, and electrically connecting the third electrically conductive pattern to the first electrically conductive pattern, and forming a first solder mask on the glass wiring substrate, thereby obtaining a multilayer printed circuit board. | 11-28-2013 |
20130313003 | MULTILAYER WIRING BOARD - A multilayer wiring board includes a first dielectric layer, a high-frequency signal line formed on a first surface of the first dielectric layer, a ground layer formed on a second surface of the first dielectric layer, and a second dielectric layer covering part of the ground layer. The high-frequency signal line is electrically connectable to a center conductor of a coaxial structure. The second dielectric layer is spaced from an edge of the first dielectric layer to which the coaxial structure is to be connected, so that a ground exposure portion of the ground layer is exposed on the edge of the first dielectric layer. The ground layer is electrically connectable directly to an outer conductor of the coaxial structure at the ground exposure portion. | 11-28-2013 |
20130313004 | PACKAGE SUBSTRATE - A package substrate includes a solder resist layer having a level surface, a circuit pattern buried in the solder resist layer, and a bump protruding from the solder resist layer. | 11-28-2013 |
20130319730 | FABRIC-TYPE MULTILAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A fabric-type multilayer PCB and a manufacturing method thereof are provided. The method electrically connects first and second circuit patterns by compressing the first and second unit circuits with a conductor therebetween to introduce the conductor into an insulating layer, and thus can save on manufacturing cost and achieve more precise junction. Also, the fabric-type multilayer PCB includes a conductor that is formed on a fabric material, and directly joined to the first and second circuit patterns to electrically connect the first and second circuit patterns, and thus enables efficient electrical connection. Moreover, even when a shape is deformed by the torsion of flexible fabrics, an electrical connection can be maintained. | 12-05-2013 |
20130319731 | PRINTED CIRCUIT BOARD OF SEMICONDUCTOR PACKAGE FOR DECREASING NOISE BY ELECTROMAGNETIC INTERFERENCE - A printed circuit board for a semiconductor package which is capable of reducing noise by electromagnetic interference (EMI), including: an upper circuit layer in which a first circuit pattern is formed; an intermediate circuit layer that is disposed below the upper circuit layer and has a second circuit pattern formed therein; a lower circuit layer that is disposed below the intermediate circuit layer and has a third circuit pattern formed therein; an insulating layer disposed between the first and second circuit patterns and between the second and third circuit patterns; vias that vertically connect the first, second and third circuit patterns; and EMI blocking vias that are arranged along edge portions of the first, second and third circuit patterns and are connected to a ground layer. | 12-05-2013 |
20130333923 | MODULATED COMPOSITIONAL AND STRESS CONTROLLED MULTILAYER ULTRATHIN CONFORMAL SiNx DIELECTRICS USED IN NANO DEVICE FABRICATION - A layer of silicon nitride having a thickness from 0.5 nanometers to 2.4 nanometers is deposited on a substrate. A plasma nitridation process is carried out on the layer. These steps are repeated for a plurality of additional layers of silicon nitride, until a predetermined thickness is attained. Such steps can be used to provide a multilayer silicon nitride dielectric formed on a substrate having an upper surface of dielectric material with Cu and other conductors embedded within, and a plurality of steps. The multilayer silicon nitride dielectric has a plurality of individual layers each having a thickness from 0.5 nanometers to 2.4 nanometers, and the multilayer silicon nitride dielectric conformally covers the steps of the substrate with a conformality of at least seventy percent. A multilayer silicon nitride dielectric, and a multilevel back end of line interconnect wiring structure using same, are also provided. | 12-19-2013 |
20130333924 | MULTILAYER ELECTRONIC SUPPORT STRUCTURE WITH INTEGRAL METAL CORE - A laminated multilayer electronic support structure comprising a dielectric with integral vias and feature layers and further comprising a planar metal core characterized by a thickness of less than 100 microns. | 12-19-2013 |
20140000940 | WIRING BOARD | 01-02-2014 |
20140008104 | RESISTANCE-FORMED SUBSTRATE AND METHOD FOR MANUFACTURING SAME - A resistance-formed substrate includes a first insulating layer, a first wiring formed on a first surface of the first insulating layer, a thin-film resistance layer formed on a second surface of the first insulating layer, and a first via-hole conductor. The first via-hole conductor penetrates through the first insulating layer, and is electrically connected to the first wiring and the thin-film resistance layer. The first via-hole conductor includes a metal part including a low-melting point metal and a high-melting point metal, and a paste resin part. The low-melting point metal includes tin and bismuth, and has a melting point of 300° C. or lower. The high-melting point metal includes at least one of copper and silver, and has a melting point of 900° C. or higher. The first via-hole conductor is in contact with the thin-film resistance layer at both the paste resin part and the metal part. | 01-09-2014 |
20140008105 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING CIRCUIT BOARD - A circuit board is formed such that a printed circuit board is connected to an injection molded circuit board. An internal circuit conductor is exposed at conductor part at a printed circuit board mounting part. Through holes are provided in the printed circuit board. The conductor part is formed substantially perpendicular to the circuit board mounting part, and is inserted into a through hole. A female screw part is formed in the vicinity of the conductor part in the printed circuit board mounting part. The female screw part can be screwed together with a bolt, which is a securing member. The printed circuit board is connected to the conductor part by solder. A hole is formed in advance in the vicinity of the solder on the printed circuit board. The bolt passes through the hole and is secured to the female screw part. | 01-09-2014 |
20140020932 | PRINTED CIRCUIT BOARD, MANUFACTURING METHOD THEREFOR, AND METAL-SURFACE TREATMENT LIQUID - The purpose of the present invention is to provide a printed circuit board wherein a resin layer exhibits excellent adhesion and a method for manufacturing said printed circuit board. This printed circuit board is provided with an insulating substrate, metal wiring laid out on said insulating substrate, and an insulating layer disposed on top of said metal wiring. A layer consisting of a thiol compound having at least four functional groups represented by formula (1) is interposed between the metal wiring and the insulating layer at the interface therebetween. | 01-23-2014 |
20140027156 | MULTILAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a method of manufacturing a multilayer type coreless substrate, the method including: (A) preparing a carrier substrate including at least one copper foil formed on one surface or both surfaces of an insulating surface; (B) forming a coreless printed circuit precursor on one surface or both surfaces of the carrier substrate; (C) separating the carrier substrate; (D) performing a polishing cutting process on the coreless printed circuit precursor; and (E) laminating a plurality of other insulating layers on a flat outer surface of the coreless printed circuit precursor, the plurality of other insulating layers sequentially including other circuit layers and other pillars. | 01-30-2014 |
20140027157 | Device and Method for Printed Circuit Board with Embedded Cable - A printed circuit board (PCB) includes a first dielectric layer and a differential cable structure embedded in the dielectric layer. The differential cable structure includes a first inner conductor, a second inner conductor, a dielectric surrounding portions of the first inner conductor and portions of the second inner conductor, and a ground shield surrounding the dielectric. | 01-30-2014 |
20140034357 | PRINTED CIRCUIT BOARD - A printed circuit board disclosed. One embodiment of the present invention provides a printed circuit board that includes: an insulation layer having multiple layers of circuit wirings formed therein; a via formed along a perimeter of the insulation layer and configured for connecting circuit wirings formed on different layers of the insulation layer, the via being formed in such a way that an inside thereof is hollow; and an electromagnetic wave absorbing part contained in the via. | 02-06-2014 |
20140034358 | ELECTRODE PATTERN AND METHOD OF MANUFACTURING THE SAME, PRINTED CIRCUIT BOARD USING ELECTRODE PATTERN AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are an electrode pattern and a method of manufacturing the same, and a printed circuit board applied with the electrode pattern and a method of manufacturing the same. In order to increase a heat dissipation effect, disclosed herein are an electrode pattern including electrode layers with a predetermined pattern; and insulators insulating the electrode layers from each other, in which the insulators are made of metal oxide, a method of manufacturing the same, and a printed circuit board applied with the electrode pattern and a method of manufacturing the same. | 02-06-2014 |
20140034359 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - Disclosed herein is a printed circuit board including a base substrate, a photosensitive insulating layer formed on an upper portion of the base substrate, and a circuit pattern formed to be buried within the photosensitive insulating film. | 02-06-2014 |
20140034360 | CONDUCTIVE MEMBER, PRODUCTION METHOD OF THE SAME, TOUCH PANEL, AND SOLAR CELL - A conductive member containing: a base material; a conductive layer provided on the base material, wherein the conductive layer includes a metallic nanowire having an average short axis length of 150 nm or less and a matrix; and a protective layer including a three-dimensional crosslinked structure represented by the following Formula (I), sequentially in this order, and which has a surface resistivity measured at a surface of the protective layer of 1,000 Ω/□ or less, a production method of the conductive member, and a touch panel and a solar cell, each of which uses the conductive member. The conductive member may provide high resistance against scratches and abrasion, excellent conductivity, excellent transparency, excellent heat resistance, excellent moisture and heat resistance, and excellent bendability. | 02-06-2014 |
20140034361 | CIRCUIT BOARD - A circuit board including a circuit substrate, a dielectric layer, a first conductive layer and a second conductive layer is provided. The circuit substrate has a first surface and a first circuit layer. The dielectric layer is disposed on the circuit substrate and covers the first surface and the first circuit layer. The dielectric layer has a second surface, at least a blind via extended from the second surface to the first circuit layer and an intaglio pattern. The first conductive layer is disposed inside the blind via. The second conductive layer is disposed in the intaglio pattern and the blind via and covers the first conductive layer. The second conductive layer is electrically connected with the first circuit layer through the first conductive layer. | 02-06-2014 |
20140041902 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a printed circuit board, including: a base substrate on which a circuit layer is formed; and multi-layer insulating layers formed in a plurality of layers on the base substrate, including the circuit layer, each of the plurality of layers being formed to have a step structure, wherein the multi-layer insulating layer is formed of heterogeneous materials. | 02-13-2014 |
20140041903 | PRINTED CIRCUIT BOARD STRUCTURE - A printed circuit board structure includes a plurality of circuit layer plates stacked together in which each of the stacked circuit layer plates includes an epoxy resin plate body and a fabric structure completely encapsulated in the epoxy resin plate body, and each circuit layer plate stacked between two circuit layer plates is further provided with filler particles distributed in its epoxy resin plate body, and the two opposite and outermost circuit layer plates thereof have metal soldering pads on the outer surfaces of the epoxy resin plate body thereof, and the two opposite and outermost circuit layer plates do not have the filler particles in its epoxy resin plate body thereof. | 02-13-2014 |
20140041904 | METHOD FOR MAKING A TWO-LAYER CAPACITIVE TOUCH SENSOR PANEL - A method of fabricating a two-layer capacitive touch sensor panel comprising the following steps: a) depositing a first transparent electrically conductive layer on a transparent cover sheet; b) forming a pattern in the transparent electrically conductive layer to create a first set of discrete electrode structures; c) depositing a transparent dielectric layer over the discrete electrode structures; d) depositing a second transparent electrically conductive layer onto the transparent dielectric layer; e) forming a pattern in the transparent electrically conductive layer to create further discrete electrode structures by laser ablation, this pattern either not penetrating or penetrating only part way through the dielectric layer so as to avoid damaging the first set of discrete electrode structures; f) forming electrical connections or vias between the two transparent electrically conductive layers through the dielectric layer; and g) forming electrical connections between the transparent electrically conductive layer(s) and an electrical track or busbar formed at the periphery of the panel.) The method provides a maskless, chemical free way to fabricate a two-layer “cover integrated” sensor. A two-layer capacitive touch sensor panel fabricated by this method is also described | 02-13-2014 |
20140041905 | SURFACES HAVING PARTICLES AND RELATED METHODS - Provided are surfaces comprising particles, which particles may possess, for example, antimicrobial or biosensing properties. Also provided are related methods for fabrication of the inventive articles. Also provided are systems and methods for treating fluids, objects, and targets with the inventive surfaces. | 02-13-2014 |
20140048311 | WIRED CIRCUIT BOARD - A wired circuit board includes a first insulating layer, a conductive pattern formed on its surface at one side in a thickness direction, and a second insulating layer formed on the surface of the first insulating layer at the one side in the thickness direction so as to cover the conductive pattern. An outer end surface of the first insulating layer in a perpendicular direction to the thickness direction is formed to be inclined outwardly gradually from the one side toward the other side in the thickness direction. An outer end surface of the second insulating layer in the perpendicular direction has an end edge at the other side in the thickness direction which is located between both end edges of the outer end surface of the first insulating layer in the perpendicular direction which are located at the one side and the other side in the thickness direction. | 02-20-2014 |
20140048312 | SIGNAL LINE AND CIRCUIT SUBSTRATE - A signal line is a linear conductor provided within a laminated body. A first ground conductor is provided on a positive direction side in a z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in a planar view seen from the z axis direction. A second ground conductor is provided on a negative direction side in the z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in the planar view seen from the z axis direction. Via hole conductors connect the ground conductors to each other. In the first ground conductor, a plurality of opening portions are arranged along the signal line in the planar view seen from the z axis direction. The via hole conductors are provided between the opening portions adjacent to one another, in an x axis direction. | 02-20-2014 |
20140054068 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a core substrate including resin and inorganic fiber, a first buildup layer formed on a first surface of the substrate and including resin insulating layers and first conductive layers, and a second buildup layer formed on a second surface of the substrate on the opposite side of the core substrate with respect to the first surface and including resin insulating layers and second conductive layers. The first conductive layers in the first buildup have sum V | 02-27-2014 |
20140054069 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a center part having a first width and a contact part having a second width, the contact part makes contact with a surface of the core insulating layer, and the first width is larger than the second width. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure. | 02-27-2014 |
20140060893 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer. The via includes a first part, a second part below the first part, and a third part between the first and second parts, and the third part includes a metal different from a metal of the first and second parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure. | 03-06-2014 |
20140069693 | MULTI-LAYER ARTICLE COMPRISING DISCRETE CONDUCTIVE PATHWAYS CONTACTING A CURABLE COMPOSITION COMPRISING BIS-BENZOXAZINE - The present invention deals with a novel multi-layer article useful for preparing flexible printed wiring boards, the multi-layer article comprising discrete conductive pathways contacting a novel curable composition comprising bis-benzoxazine and an amino-functionalized triazine, especially a di-isoimide, and the preparation of encapsulated printed wiring boards, especially flexible printed wiring boards, therefrom. The multi-layer article hereof allows the benefits of bis-benzoxazine as a crosslinkable encapsulant for flexible printed wiring boards to be realized at cure temperatures compatible with existing commercial processes. | 03-13-2014 |
20140069694 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - A circuit board includes a circuit pattern formed on a substrate, a first solder resist layer formed on the circuit pattern, an electroless plating layer formed on the circuit pattern on which the first solder resist layer is opened, and a second solder resist layer formed on the first solder resist layer, and a method for manufacturing the same. According to certain embodiments, it is possible to cover a portion which has vulnerable plating quality due to solder resist residue or insufficient wetting around an edge of an existing solder resist layer by including an additional solder resist layer on a surface-treated plating layer. Further, it is possible to protect an undercut portion under the solder resist layer by forming the additional solder resist layer. | 03-13-2014 |
20140076613 | Method of Electrophoretic Depositing (EPD) a Film on a System and System Thereof - A packaged component and a method for making a packaged component are disclosed. In an embodiment the packaged component includes a component carrier having a component carrier contact and a component disposed on the component carrier, the component having a component contact. The packaged component further includes a conductive connection element connecting the component carrier contact with the component contact, an insulating film disposed directly at least on one of a top surface of the component or the conductive connection element, and an encapsulant encapsulating the component carrier, the component and the enclosed conductive connection elements. | 03-20-2014 |
20140076614 | WIRING SUBSTRATE - A wiring substrate includes a first insulating layer, an adhesion insulating layer formed under the first insulating layer and an outer face of the adhesion insulating layer is made to a roughened face, a first wiring layer formed on the first insulating layer, a second insulating layer formed on the first insulating layer, and in which a first via hole reaching the first wiring layer is provided, a second wiring layer formed on the second insulating layer, and connected to the first wiring layer through the first via hole, a second via hole formed in the adhesion insulating layer and the first insulating layer, and reaching the first wiring layer, and a third wiring layer formed on the outer face of the adhesion insulating layer, and connected to the first wiring layer through the second via hole. | 03-20-2014 |
20140083744 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A printed circuit board includes a first trace layer, a first dielectric layer, a second trace layer, a second dielectric layer, a third trace layer, a third dielectric layer and a fourth trace layer arranged in that order. A cavity is defined in the printed circuit board running through from the fourth trace layer to the second dielectric layer. Portion of the second dielectric layer is exposed in the cavity. Surfaces of the fourth trace layer combining with the second dielectric layer, and surfaces of the second trace layer combining with the first dielectric layer, are all roughened to increase the strength of adhesion. | 03-27-2014 |
20140083745 | WIRING SUBSTRATE - There is provided a wiring substrate. The wiring substrate includes: a first wiring layer; a first insulating layer on the first wiring layer; a first coupling agent layer on the first insulating layer; a first copper/tin alloy layer on the first coupling agent layer; a first via hole formed through the first copper/tin alloy layer, the first coupling agent layer, and the first insulating layer to reach the first wiring layer; a metal catalyst provided on only a sidewall of the first via hole; a seed layer provided on the metal catalyst and formed only on the sidewall of the first via hole; and a metal plating layer formed on the first copper/tin alloy layer and the seed layer and filled in the first via hole to contact the first wiring layer. | 03-27-2014 |
20140083746 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes multiple insulating layers laminated on each other and each including resin and core, the insulating layers having first-surface sides and second-surface sides on the opposite side, respectively, and including multiple first insulating and second insulating layers, multiple first-surface-side conductive layers formed on the first-surface sides of the first insulating layers, respectively, multiple second-surface-side conductive layers formed on the second-surface sides of the second insulating layers, respectively. The insulating layers include one or more insulating layer having the core positioned such that the core is shifted toward the first-surface side from the center in the thickness direction, the insulating layers include a central insulating layer positioned in the center of the insulating layers, and the first-surface-side and second-surface-side conductive layers are formed such that the first-surface side conductive layers have the total area which is set smaller than the total area of the second-surface-side conductive layers. | 03-27-2014 |
20140083747 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes an outermost interlayer resin insulation layer, n outermost conductive layer formed on the outermost interlayer resin insulation layer and including multiple alignment marks, a connection wiring structure connecting the alignment marks, and a solder-resist layer formed on the outermost interlayer resin insulation layer and the outermost conductive layer. The solder-resist layer has openings exposing the alignment marks, respectively, and each of the alignment marks has an electroless plated film formed on each of the alignment marks. | 03-27-2014 |
20140090876 | METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAINED USING THE METHOD, METHOD OF CONNECTING SEMICONDUCTOR CHIPS, THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE, AND METHOD OF PRODUCING THE SAME - A three-dimensional structure in which a wiring and a pad part are provided on a surface is provided. A recessed gutter for wiring and a hole for the pad part having a depth that is greater than a thickness of the recessed gutter for wiring are provided on the surface of the three-dimensional structure. The hole for the pad part is provided in succession with the recessed gutter for wiring. At least a part of a wiring conductor is embedded in the recessed gutter for wiring and in the hole for the pad part. | 04-03-2014 |
20140097004 | METHOD OF MOUNTING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE OBTAINED USING THE METHOD, METHOD OF CONNECTING SEMICONDUCTOR CHIPS, THREE-DIMENSIONAL STRUCTURE IN WHICH WIRING IS PROVIDED ON ITS SURFACE, AND METHOD OF PRODUCING THE SAME - A three-dimensional structure in which a wiring is provided on a surface is provided. At least a part of the surface of the three-dimensional structure includes an insulating layer containing filler. A recessed gutter for wiring is provided on the surface of the three-dimensional structure, and at least a part of a wiring conductor is embedded in the recessed gutter for wiring. | 04-10-2014 |
20140102765 | Multilayer Electronic Structures with Improved Control of Dielectric Thickness - A method of fabricating a multilayer electronic support structure comprising electroplating copper substructures, laying a dielectric pre-preg comprising a polymer resin over the copper substructures, and pressing to pressures of 200 to 600 PSI against a release film having a higher hardness than the resin of the prepreg but a lower hardness than the cured resin, and heating through a curing cycle whilst maintaining pressure. | 04-17-2014 |
20140102766 | MULTI-LAYER TYPE CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a multi-layer type coreless substrate, including: a first insulating layer including at least one first pillar; a plurality of insulating layers laminated on one surface or both surfaces of the first insulating layer, each including at least one circuit layer and at least another pillar connected to the circuit layer; and a plurality of outermost circuit layers contacting a pillar disposed on an outermost insulating layer of the plurality of insulating layers. | 04-17-2014 |
20140102767 | MULTI-LAYER TYPE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein is a multi-layer type printed circuit board, including; a first insulating layer including at least one first pillar; a plurality of insulating layers laminated in a both surfaces direction of the first insulating layer, each including at least one circuit layer and at least another pillar connected to the circuit layer; and a plurality of outermost circuit layers disposed on an outer surface of the outermost insulating layer, while contacting an outermost pillar disposed on an outermost insulating layer among the plurality of insulating layers, wherein the circuit layer and another pillar each formed in a both surfaces direction of the first insulating layer are disposed in a symmetrical form to each other based on the first insulating layer. | 04-17-2014 |
20140102768 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first insulation layer, a first conductive pattern structure formed on the first insulation layer, a wiring structure formed on the first insulation layer and including a second insulation layer and a second conductive pattern structure on the second insulation layer, and a third insulation layer formed on the first insulation layer and the first conductive pattern structure and having first and second openings such that the first opening is exposing at least a portion of a surface of the wiring structure and the second opening is exposing at least a portion of the first conductive pattern structure. The wiring structure includes a third conductive pattern structure forming an outermost layer of the wiring structure and including a mounting pad structure which mounts a semiconductor device. The first opening is formed such that the first opening is exposing pad formation area of the mounting pad structure. | 04-17-2014 |
20140102769 | SYSTEM FOR DEPOSITING MICROWIRE - A microcircuit deposition system incorporates a first printing engine for depositing a dielectric on a substrate. A microwire spooling machine houses a microwire spool and incorporates a tension guide to position a microwire trace onto the dielectric layer. A second printing engine trails the microwire spooling machine to deposit a covering dielectric layer over the microwire trace. | 04-17-2014 |
20140110152 | PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A printed circuit board includes a first outer electrically conductive pattern layer, a first insulation layer, a first inner electrically conductive pattern layer, a connection adhesive sheet, a second inner electrically conductive layer, a second insulation layer, a second outer electrically conductive pattern layer, and a identification mark, which are arranged in that order. The first outer electrically conductive pattern layer includes many first gold fingers. The second outer electrically conductive pattern layer includes many second gold fingers. The blind hole corresponds to the identification mark. The first outer electrically conductive pattern layer, the second outer electrically conductive pattern layer, and the at least one identification mark are simultaneously formed. | 04-24-2014 |
20140110153 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes an insulating resin layer, wirings, and a via-hole conductor. The wirings are disposed through the insulating resin layer therebetween and formed of copper foils. The via-hole conductor penetrates through the insulating resin layer and electrically connects the wirings together. The via-hole conductor includes a resin portion and a metal portion containing copper, tin, and bismuth. The metal portion includes a first metal region including a link of copper particles, a second metal region including, as a main component, at least one of tin, a tin-copper alloy, and a tin-copper intermetallic compound, and a third metal region including bismuth as a main component. The copper particles partially include a plane-to-plane contact with a roughened surface of the copper foil, and the second metal region is partially formed on a surface of the link and on the roughened surface of the copper foil. | 04-24-2014 |
20140110154 | BUS APPARATUS FOR USE WITH CIRCUIT INTERRUPTERS OR OTHER DEVICES - An improved bus apparatus includes a generally rigid substrate and a conductor apparatus. The conductor apparatus includes a number of bus elements that are embedded within the substrate and which are electrically connected with connection elements that each have an end that is situated external to the substrate. Additional connection elements extend through the substrate and are connectable with loads. Circuit interrupters and other devices are connectable with pairs of the connector elements, wherein one connector element is connected with a line and wherein another connector element is connected with a load. The bus apparatus is formed by receiving the bus elements in channels formed in layers of a thermally conductive and electrically insulative material, and the layers are bonded together with the use of a bonding material to cause the bus elements to become laminated within the interior of the substrate. | 04-24-2014 |
20140110155 | FLEXIBLE MULTILAYER SUBSTRATE - A flexible multilayer substrate includes a stacked body including a plurality of stacked resin layers and defining a flexible portion. The stacked body includes an innermost surface that is a surface located inside when the stacked body is bent in use, and an outermost surface that is a surface located outside when the stacked body is bent in use. A plurality of conductor patterns are arranged inside the stacked body to be distributed over a surface of one or more of the plurality of resin layers. A portion located on the innermost surface side with respect to a center plane of the stacked body in a thickness direction is a first portion, and a portion located on the outermost surface side with respect to the center plane is a second portion. An area having a minimum spacing along the longitudinal direction between the conductor patterns arranged in the same plane, in all of the plurality of resin layers, is located in the second portion. | 04-24-2014 |
20140116755 | LAMINATE CIRCUIT BOARD STRUCTURE - A laminate circuit board structure which includes a first circuit metal layer, a first insulation layer, at least one second circuit metal layer, at least one second insulation layer and a support frame is disclosed. The total thickness of the laminate circuit board structure is less than 150 μm. The support frame provided at the outer edge of the co-plane surface formed by the first circuit metal layer and the first insulation layer does not cover the first circuit metal layer, and is formed of at least one metal material. The support frame provides physical support for the entire board structure without influence on the circuit connection so as to prevent the laminate circuit board structure from warping. | 05-01-2014 |
20140124245 | EMBEDDED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A method for manufacturing an embedded printed circuit board includes the following steps. First, a circuit substrate is provided. The circuit substrate includes a base, a first wiring layer, and a second wiring layer. The first wiring layer includes a number of electrode connection wires. Second, an opening is defined in the circuit substrate. The opening passes through the base and the second wiring layer. Third, an anisotropic conductive film is adhered onto the electrode connection wires in the opening. Fourth, an electrical element including many electrodes is provided. Fifth, the electrical element is arranged in the opening, with the electrodes respectively spatially correspond to the electrode connection wires, and each electrode is electrically connected to the corresponding electrode connection wire through the anisotropic conductive film, thereby obtaining an embedded printed circuit board. | 05-08-2014 |
20140124246 | MOLDED PRODUCT AND IN-MOLD TRANSFER FOIL - Provided is a molded product including a primary molded layer, a transfer layer that includes at least a decorating layer and a print layer for foil flow prevention including one of polyester, polyurethane, polyimide and cellulose, or a mixture obtained by combining two or more of polyester, polyurethane, polyimide and cellulose as a main component, and is transferred to a surface of the primary molded layer, the decorating layer and the print layer for foil flow prevention being arranged in increasing order of distance from a side of the primary molded layer, and a secondary molded layer formed on the side of the print layer for foil flow prevention of the transfer layer. | 05-08-2014 |
20140124247 | TRANSPARENT CONDUCTIVE FILM - There is provided a transparent conductive film which comprises: a film substrate; a plurality of transparent conductor patterns formed on the film substrate; and a pressure-sensitive adhesive layer wherein the transparent conductor patterns are embedded. The plurality of transparent conductor patterns respectively have a two-layer structure wherein a first indium tin oxide layer and a second indium tin oxide layer are laminated on the film substrate in this order, and the first indium tin oxide layer has a greater tin oxide content than the second indium tin oxide layer does. The first indium tin oxide layer has a smaller thickness than the second indium tin oxide layer does. | 05-08-2014 |
20140131067 | TRANSPARENT CONDUCTOR AND PREPARATION METHOD THEREOF - A transparent conductor includes a transparent substrate, a conductive mesh, and an insulating protective layer, which are laminated in that order, wherein the conductive mesh is formed on the transparent substrate, and a surface of the insulating protective layer away from the transparent substrate is flat. Such transparent conductor avoids the use of indium tin oxide, thus the cost of the transparent conductors is lower. A method of preparing the transparent conductor is also provided. | 05-15-2014 |
20140131068 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein is a circuit board including: a core layer; first and second layers sequentially stacked on the core layer, wherein prominence-depressions having different sizes are formed on a surface of the first layer in each region of the core layer. | 05-15-2014 |
20140131069 | TOUCH-SENSING ELECTRODE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - The present disclosure provides a touch-sensing electrode structure, which includes a plurality of touch-sensing electrodes. Each of the touch-sensing electrodes includes a main body and a connecting portion connected to an end of the main body; wherein the width of the connecting portion is not less than a half width of the end of the main body. The touch-sensing electrode structure also includes a plurality of signal-transmitting wires, each of which includes a head portion and a tail wire connected to the head portion. The head portions of the signal-transmitting wires is superimposed on the connecting portions and electrically connected to the connecting portions respectively. Furthermore, a method of manufacturing the above touch-sensing electrode structure is also provided. | 05-15-2014 |
20140131070 | TOUCH PANEL STRUCTURE AND MANUFACTURING METHOD THEREOF - A manufacturing method of a touch panel structure includes the following steps. A first conductive layer is formed on a mounting surface of a substrate, and the first conductive layer has multiple first electrodes. A first electrical-insulation layer is formed on the mounting surface of the substrate, and the first electrical-insulation layer covers each of the first electrodes of the first conductive layer. A second conductive layer is formed on the first electrical-insulation layer; the second conductive layer has multiple second electrodes, and each of the second electrodes crisscrosses each of the first electrodes. A second electrical-insulation layer is formed on the first electrical-insulation layer, and the second electrical-insulation layer covers each of the second electrodes of the second conductive layer. | 05-15-2014 |
20140138123 | CIRCUIT STACK STRUCTURE - A circuit stack structure is provided. The circuit stack structure includes a conductor layer having metal wires arranged at intervals, propping portions respectively disposed in a gap between any two of the neighboring metal wires, and a protective layer covering the metal wires and the propping portions. The propping portions are electrically isolated with the metal wires. With supporting by the propping portions, all regions of a top surface of the protective layer corresponding to one of the propping portions are coplanar with all regions of the top surface of the protective layer corresponding to each of the metal wires. | 05-22-2014 |
20140138124 | METHOD OF MANUFACTURING AN ELECTRONIC HIGH-CURRENT CIRCUIT BY MEANS OF GAS INJECTION TECHNOLOGY AND SEALING WITH AN INSULATING POLYMER - An electric circuit, for conducting high current and a process for manufacturing same. The circuit has a carrier body, which has a carrier surface, an insulation layer covering the carrier surface, a strip conductor for conducting current arranged on the insulation layer, and an outer insulation layer. The protective layer has at least one recess to provide an electric contact area to the strip conductor. | 05-22-2014 |
20140138125 | CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, TOUCH PANEL SENSOR SHEET AND SCREEN PRINTING PLATE - Disclosed is a method of manufacturing a circuit board, which includes a stand-by process setting a screen printing plate so as to be opposed with a base, where the screen printing plate has a line pattern formed therethrough, and the line pattern is configured by a plurality of dot-like through-holes discretely pierced and arrayed in a single line; a coating process coating an ink which contains a water-dispersed electroconductive paste onto the surface of the screen printing plate; and an ejection process ejecting ink dots through the dot-like through-holes onto the surface of the base, by pressing the screen printing plate into the base under sliding contact of a squeegee with the surface of the screen printing plate, and allowing the ink dots ejected out from the adjacent through-holes to fuse on the surface of the base, to thereby form a linear ink puddle. | 05-22-2014 |
20140138126 | METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD AND MULTILAYER WIRING BOARD OBTAINED THEREBY - In a method of manufacturing a multilayer board, including: a drilling step for forming a via hole through a pre-preg by laser beam machining, a step of filling the via hole with conductive paste containing a resin component and metal powder, and a step of arranging copper layers or copper layer portions of patterned boards on and under the filled conductive paste and pressing the same, a multilayer printed wiring board superior in conductivity and long-term stability is obtained by using alloying paste as the conductive paste in which at least part of the metal powder is melted and the metal powders adjacent to each other are alloyed, using a pre-preg having a ratio A/B of at least 10 before subjected to preheating, where A is a storage modulus at an inflection point where the storage modulus changes from increasing to decreasing and B is a storage modulus at an inflection point where the storage modulus changes from decreasing to increasing in a temperature profile rising from 60° C. to 200° C., and preheating the pre-preg before the drilling step to reduce the ratio A/B to below 10. | 05-22-2014 |
20140144675 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - An exemplary multi-layer printed circuit board includes a multi-layer substrate with a recess, and a first high density wiring substrate received in the recess. The multi-layer substrate includes a base layer, a first wiring layer arranged on the base layer, first insulating layers, and third wiring layers. The first insulating layers and the third wiring layers are alternately arranged on the first wiring layer, such that there is one first insulating layer sandwiched between each two adjacent wiring layers of the first wiring layer and the third wiring layers. The first high density wiring substrate includes first high density wiring layers and third insulating layers, which are alternately arranged on each other. An outmost first high density wiring layer is exposed outside to define third electrical contact pads corresponding to the first electrical contact pads. | 05-29-2014 |
20140144676 | ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF - The present invention relates to an electronic component embedded substrate including: a first insulating layer including a cavity; an electronic component inserted in the cavity; a first metal pattern formed on a lower surface of the first insulating layer to mount the electronic component thereon and including at least one guide hole for exposing a portion of the external electrode; a second insulating layer formed on the lower surface of the first insulating layer to cover the first metal pattern; a first circuit pattern formed on a lower surface of the second insulating layer; and a first via for electrically connecting the first external electrode exposed through the guide hole and the first circuit pattern, and can improve electrical connectivity between the external electrode and the via even when the size of the external electrode of the electronic component is reduced than before. | 05-29-2014 |
20140151092 | PCB WITH VISIBLE CIRCUIT AND METHOD FOR MAKING AND USING PCB WITH VISIBLE CIRCUIT - A printed circuit board (PCB) with visible circuit includes a circuited substrate, a first and second release films, and a first and second optical clear adhesive (OCA) layers. The first and second release films are pressed onto and are adhered to two opposite surfaces of the circuited substrate via the first and second OCA layers respectively, and the first and second OCA layers are made of polymethyl methacrylate (PMMA). | 06-05-2014 |
20140158407 | PRINTED CIRCUIT BOARD WITH VISIBLE TRIANGULAR SHAPED TRACES - A printed circuit board includes a transparent base layer, a conductive trace layer, and a transparent cover layer. The conductive trace layer is formed on a first surface of the base layer, and includes two conductive pads and a grid-shaped conductive trace pattern. the grid-shaped conductive trace pattern includes a plurality of conductive traces, the conductive traces form a plurality of strips connected one by one, each strip includes a plurality of triangles arranged in a line, each two adjacent triangles in a same strip have a same side, each two adjacent triangles in different strips have a same side, two distal ends of each strip are connected to the two conductive pads respectively. The transparent cover layer s the grid-shaped conductive trace pattern and parts of the first surface without forming the conductive trace layer. | 06-12-2014 |
20140158408 | MULTI-LAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A multi-layer wiring board comprises: a plurality of multi-layer wiring units each having a plurality of printed wiring boards stacked therein via an adhesive layer, the printed wiring board having a wiring layer formed on an insulating base therein and having flexibility, and the wiring layers being connected to each other via a via that penetrates in a stacking direction; and a cable unit connecting between the plurality of multi-layer wiring units and having flexibility, the cable unit configured having a lower insulating base, the wiring layer formed on the lower insulating base and an upper insulating base disposed above the lower insulating base via the adhesive layer, the lower insulating base and the wiring layer correspond to one-layer of the printed wiring board, and the lower and upper insulating bases and the wiring layer being led out from the multi-layer wiring units. | 06-12-2014 |
20140166343 | ELECTRONIC COMPONENT EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED SUBSTRATE - An electronic component embedded substrate and a method of manufacturing an electronic component embedded substrate, The substrate includes a first via passing through a part of an insulating portion of the substrate to an electrode of the electronic component, and a second via passing through a part of the insulating portion to the conductor pattern. The second via has a contact portion with a smaller cross-sectional area than the cross-sectional area of a contact portion of the first via. | 06-19-2014 |
20140166344 | MULTILAYER SUBSTRATE - A multilayer substrate that retains a curved state without causing fluctuations in electrical characteristics includes a main body including a plurality of insulating sheets to be stacked and made of a flexible material. A signal wire extends in the main body. A ground conductor is provided at a positive-direction side in a z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. A ground conductor is provided on a negative-direction side in the z-axis direction relative to the signal wire in the main body, and overlaps the signal line in a plan view seen from the z-axis direction. The state in which the main body is curved so that the signal wire defines an arc is retained by plastic deformation of the ground conductors. | 06-19-2014 |
20140174791 | CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A circuit board and a manufacturing method thereof are provided. A dielectric layer is formed on a substrate, wherein an internal circuit layer is formed on the substrate and the dielectric layer covers the internal circuit layer. A first trench, a second trench and an opening are formed in the dielectric layer. The opening is located below the first trench and connected with the first trench, and a portion of the internal circuit layer is exposed by the opening. A patterned conductive layer is formed on the dielectric layer. The patterned conductive layer covers a portion of the dielectric layer and fills the first trench, the second trench and the opening so as to form a first circuit layer, a second circuit layer and a conductive through via, respectively, wherein the conductive through via is electrically connected with the first circuit layer and the internal circuit layer. | 06-26-2014 |
20140182888 | TOUCH PANEL - A touch panel has a substrate on which a first conductive layer, an insulating layer, a second conductive layer and a protective layer are formed in order. The second conductive layer and the first conductive layer form a touch-sensing area. The protective layer and the substrate have the same refractive index; and the first conductive layer, the insulating layer and the second conductive layer have the same refractive index so that the whole layered structure substantially has a symmetrical distribution of refractive indices, and leading to having optical characteristics of high transmittance and low reflectance. | 07-03-2014 |
20140182889 | MULTILAYERED SUBSTRATE - Disclosed herein is a multilayered substrate including: a second insulating layer having a fine pattern layer formed on an upper surface thereof; and a third insulating layer having a circuit pattern layer formed on an upper surface thereof and formed of a material different from the second insulating layer, the circuit pattern layer having a pattern pitch larger than that of the fine pattern layer, thereby making it possible to solve a warpage problem and perform refinement and improvement in a degree of integration of an inner wiring. | 07-03-2014 |
20140182890 | ELECTRICAL CABLE ASSEMBLY - In accordance with an embodiment, an electrical cable can be configured to electrically connect to contact pads that are carried by a substrate. The electrical cable can include at least one, such as a pair, of electrical signal conductors and at least one, for instance a pair, of electrically conductive drain wires. A drain wire in the electrical cable can define a first surface that is configured to face the signal conductors and a second surface that is opposite the first surface. The drain wire can define a width that is greater than 0.12 mm as measured from the first surface to the second surface along a straight line. At least one auxiliary wire can be attached to at least one drain wire. The auxiliary wire can be configured to attach to the substrate. | 07-03-2014 |
20140182891 | GEOMETRICS FOR IMPROVING PERFORMANCE OF CONNECTOR FOOTPRINTS - In accordance with the various embodiments disclosed herein, an improved electrical connector footprint, such as on printed circuit boards (PCB), is described. For example, antipads can have a variety of sizes and pairs of differential signal traces can define centerlines that are spaced apart from each other. | 07-03-2014 |
20140182892 | PRINTED CIRCUIT BOARD WITH EMBEDDED COMPONENT AND METHOD FOR MANUFACTRUING SAME - A printed circuit board with an embedded component includes a double-sided wiring board, an electronic component, and many conductive pastes. The wiring board includes a first wiring layer, a base layer, a first insulating layer, and a second wiring layer. The base layer has an opening exposing a portion of the second surface of the first insulating layer to the outside. The second wiring layer includes electrical contact pads. The conductive blind vias are formed in the first insulating layer. Each electrical contact pad is electrically connected to an end of the corresponding conductive blind via. The other ends of the conductive blind vias are adjacent to the first surface. A filling through hole is formed in the double-sided wiring board. The conductive pastes are respectively electrically connected to the conductive blind vias. The electronic component is adhered to and electrically connected to the conductive paste. | 07-03-2014 |
20140182893 | PRINTED CIRCUIT BOARD - A printed circuit board (PCB) includes a ground layer, a first layer, a second layer, a connector footprint, and a pair of differential signal lines. The connector footprint comprises first and second bonding pads. The PCB defines a first signal via in a central portion of a space bounded by the first bonding pad, and a second signal via in a central portion of a space bounded by the second bonding pad. A number of first ground vias on the first bonding pad and a number of second ground vias on the second bonding pad are electrically connected to the ground layer. First annular slots surrounding corresponding first ground via are defined in the ground layer. Second annular slots surrounding corresponding second ground vias are defined in the ground layer. Connection slots are defined in the ground layer and communicate between the first annular slots and the second annular slots. | 07-03-2014 |
20140182894 | TOUCH PANEL AND MANUFACTURING METHOD THEREOF - A touch panel is partitioned into a sensing region and a circuit region and the circuit region is positioned around the edges of the sensing region. The touch panel comprises an electrode layer, a first wire layer, a second wire layer and an insulating layer. The electrode layer is disposed in the sensing region. The first wire layer is disposed in the circuit region and electrically connects to the electrode layer. The second wire layer electrically connects to the first wire layer in the circuit region. The insulating layer has a portion being disposed between the first wire layer and the second wire layer in the circuit, and has a plurality of first through holes wherein the first wire layer electrically connects to the second wire layer through the first through holes. The present disclosure also provides a method of manufacturing a touch panel. | 07-03-2014 |
20140182895 | MULTILAYERED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A multilayered substrate and a method of manufacturing the same. The multilayered substrate includes a plurality of wiring layers and reinforcing layers disposed at the outermost portions of both surfaces of the multilayered substrate, respectively, in order to decrease warpage of the multilayered substrate and has wiring patterns optimized depending on a scheme in which external electrodes are formed on an electronic component. | 07-03-2014 |
20140182896 | SUBSTRATE HAVING ELECTRONIC COMPONENT EMBEDDED THEREIN AND METHOD OF MANUFACTURING THE SAME - A substrate having an electronic component embedded therein includes a first insulating layer including a cavity and including first and second circuit patterns provided on upper and lower surfaces thereof, respectively; the electronic component at least partially inserted into the cavity and including an external electrode; a plurality of build-up insulating layers stacked on or beneath the first insulating layer; upper and lower circuit patterns formed on the build-up insulating layers, respectively; and a plurality of vias connecting the external electrode, the upper circuit pattern, the first circuit pattern, the second circuit pattern, and the lower circuit pattern. | 07-03-2014 |
20140182897 | CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A circuit board includes an inorganic material insulating layer, a first circuit pattern layer formed on a surface of the inorganic material insulating layer, a first build-up insulating layer formed on the inorganic material insulating layer and formed of an organic material, and a second circuit pattern layer formed on a surface of the first build-up insulating layer. | 07-03-2014 |
20140202737 | ADHESIVE VARNISH, ADHESIVE FILM AND WIRING FILM - An adhesive varnish includes 100 parts by mass of a component A that includes a phenoxy resin including a plurality of hydroxyl groups in a side chain, 2 to 55 parts by mass of a component B that includes a polyfunctional isocyanate compound including, in a molecule thereof, an isocyanate and at least one of a vinyl group, an acrylate group and a methacrylate group, 5 to 30 parts by mass of a component C that includes a maleimide compound including a plurality of maleimide groups in a molecule thereof or/and a reaction product thereof, a component S1 including a low-boiling point solvent having a boiling point of not more than 100° C., and a component S2 including a high-boiling point solvent having a boiling point of more than 100° C. | 07-24-2014 |
20140202738 | NANOSTRUCTURE TRANSPARENT CONDUCTORS HAVING HIGH THERMAL STABILITY FOR ESD PROTECTION - Disclosed herein are transparent conductors having high thermal capacity and improved protection against electrostatic discharge. | 07-24-2014 |
20140202739 | PRINTED WIRING BOARD HAVING METAL LAYERS PRODUCING EUTECTIC REACTION - A printed wiring board includes a Cu wiring pattern formed on a substrate. A first metal layer is formed on the Cu wiring pattern. A second metal layer is formed on the first metal layer. The first metal layer has a less reactivity with Cu than the second metal layer. The first metal layer and the second metal layer together cause an eutectic reaction. | 07-24-2014 |
20140202740 | Method of Manufacturing Multilayer Wiring Substrate, and Multilayer Wiring Substrate - In a build-up step, a plurality of resin insulation layers and a plurality of conductive layers are alternately laminated in multilayer arrangement on a metal foil separably laminated on a side of a base material, thereby forming a wiring laminate portion. In a drilling step, a plurality of openings are formed in an outermost resin insulation layer through laser drilling so as to expose connection terminals. Subsequently, in a desmear step, smears from inside the openings are removed. In a base-material removing step performed after the build-up step, the base material is removed and the metal foil is exposed. | 07-24-2014 |
20140209356 | MULTILAYER WIRING SUBSTRATE, PROBE CARD, AND METHOD FOR MANUFACTURING MULTILAYER WIRING SUBSTRATE - A multilayer wiring substrate includes a substrate main body and a plurality of wiring lines. The substrate main body includes first and second main surfaces. The plurality of wiring lines extend from the first main surface toward the second main surface side in the substrate main body. The substrate main body includes a plurality of insulator layers laminated on each other. The wiring lines each include via conductors separately provided in the plurality of insulator layers. In at least one of the plurality of wiring lines, a diameter of the via conductor provided in a first insulator layer defining the first main surface of the substrate main body is smaller than a diameter of the via conductor provided in at least one of the plurality of insulator layers other than the first insulator layer. | 07-31-2014 |
20140216788 | DOUBLE-LAYERED TRANSPARENT CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF - A double-layered transparent conductive film includes: a first substrate; a first imprint adhesive layer formed on the first substrate, the first imprint adhesive layer defining a first mesh-shaped groove, the first mesh-shaped groove forming a first mesh; a first conductive layer including conductive material filled in the first mesh-shaped groove; a tackifier layer formed on the first imprint adhesive layer and the first conductive layer; a second substrate formed on the tackifier layer; a second imprint adhesive layer formed on the second substrate, the second imprint adhesive layer defining a second mesh-shaped groove, the second mesh-shaped groove forming a second mesh, wherein one of the first mesh and the second mesh is a regular mesh, the other is a random mesh; and a second conductive layer including conductive material filled in the second mesh-shaped groove. During the lamination, no alignment accuracy is needed, such that the production efficiency is greatly improved. A method of manufacturing the double-layered transparent conductive film is also provided. | 08-07-2014 |
20140238725 | METHOD OF FLATTENING SURFACE OF CONDUCTIVE STRUCTURE AND CONDUCTIVE STRUCTURE WITH FLATTENED SURFACE - A method of flattening surface of conductive structure including a substrate, a dielectric layer on the substrate, and a conductive line formed in the dielectric layer is provided. A surface of the conductive line has a recess. A cover layer is formed on the substrate. A mechanical polishing process is performed to remove a portion of the cover layer. A remaining cover layer fills and levels the recess. | 08-28-2014 |
20140238726 | EXTERNAL MOISTURE BARRIER PACKAGE FOR CIRCUIT BOARD ELECTRICAL COMPONENT - Moisture barrier packages for electrical components mountable to a circuit board include a cover and a base configured to provide a metal to metal joint that hermitically seals an electrical component in an enclosure defined by the cover and the base. The base may include patterned metallizations using circuit board printing techniques that facilitate connection of the electrical component to the circuit board. The base of the moisture barrier package may be configured for surface mounting of the electrical component or through-hole mounting to complete the electrical connection to the board through the base. | 08-28-2014 |
20140238727 | Transparent Conductive Multilayer Electrode And Associated Manufacturing Process - The present invention relates to a multilayer transparent conducting electrode, comprising a substrate layer ( | 08-28-2014 |
20140238728 | Plastic Film having Lines for a Multi-Modal Input Device and Method for Producing - A plastic film for a multi-modal input device has conductors that link a touch module and an operating element. Such input devices, for example, are in central consoles of motor vehicles, dishwashers, washing machines, telephones, or the like. Touch modules and operating element modules are interconnected by the layout of conductors in the form of a geometrically distorted electrical matrix on a single plastic film which forms a carrier for a combined input device. The conductors are electrically insulated from each other, but capacitively coupled to crossover points in the electrical matrix, the crossover points dividing the matrix into at least two areas. Strip conductors extend from the matrix at an edge area of the matrix of the touch module and connected to the operating elements forming a geometrically distorted matrix of conductors on the plastic film. | 08-28-2014 |
20140246224 | SUBSTRATE FOR SUSPENSION, AND PRODUCTION PROCESS THEREOF - The present invention provides a substrate for suspension that includes a first structural part including a metal supporting substrate, an insulating layer, a wiring layer, and a cover layer, and a second structural part formed so as to extend continuously from the first structural part and has no metal supporting substrate. A position of an edge of an upper surface of the insulating layer coincides with a position of an edge of the lower surface of the cover layer or the position of the edge of the upper surface of the insulating layer is positioned on a side closer to the wiring layer than to the position of the edge of the lower surface of the cover layer at a boundary region between the first structural part and the second structural part. | 09-04-2014 |
20140251655 | STABILIZATION AGENTS FOR SILVER NANOWIRE BASED TRANSPARENT CONDUCTIVE FILMS - Boric acid has been found to provide anticorrosion properties when incorporated into silver nanowire containing films. Such compounds may be incorporated into one or more silver nanowire containing layers or in one or more layers disposed adjacent to the silver nanowire containing layers. | 09-11-2014 |
20140251656 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a core structure including a core substrate, and a buildup structure formed on the core structure and including an interlayer insulating layer and a conductive layer. The interlayer insulating layer does not contain inorganic fiber and includes a resin and an inorganic filler, and the conductive layer is formed on the interlayer insulating layer such that the inorganic filler in the interlayer insulating layer is not in contact with the conductive layer. | 09-11-2014 |
20140251657 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Embodiments of the invention provide a printed circuit board, including a base member, an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened, a circuit layer formed on the insulating layer, and a via for connecting the circuit layer formed on one surface of the base member with the circuit layer formed on the other surface of the base member. A method of manufacturing the printed circuit board is also provided. | 09-11-2014 |
20140262444 | CIRCUITRY WITH HIGH ASPECT RATIO TRACES - Imprinting tools and processes for making such tools, circuitry that includes narrow, high aspect ratio traces having reduced parasitic capacitance to adjacent circuit features and processes for making such circuitry using the imprinting tools are described. | 09-18-2014 |
20140262445 | METHODS AND CIRCUIT STRUCTURES FOR MITIGATING VOLTAGE STRESSES ON PRINTED CIRCUIT BOARD (PCB) IN HIGH VOLTAGE DEVICES - A method for mitigating voltage stress on a PCB includes applying AC voltage to a multi-terminal condenser structure of a multi-layered PCB. The terminal condenser structure is formed by overlapping a plurality of conductive traces between board layers of the multi-layered PCB. A corresponding dielectric layer is disposed between the overlapping conductive traces of the board layers. The overlapping conductive traces include a first terminal, a second terminal, a third terminal, and a fourth terminal. The first terminal and the third terminal are disposed on a first layer of the multi-layered PCB, and the second terminal and the fourth terminal are disposed on a bottom layer of the multi-layered PCB. The first terminal and the second terminal are connected to a ground point, and the third terminal and the fourth terminal are connected to the AC voltage. Voltage stresses on the PCB are mitigated utilizing the multi-terminal condenser structure. | 09-18-2014 |
20140262446 | SYSTEMS AND METHODS FOR PROVIDING SURFACE CONNECTIVITY OF ORIENTED CONDUCTIVE CHANNELS - An electrically conductive composite is disclosed that includes a dielectric material having a first side and a second side, conductive particles within the dielectric material layer, and a discontinuous layer of a conductive material on a first side of the dielectric layer. The conductive particles are aligned to form a plurality of conductive paths from the first side to the second side of the dielectric material, and each of the conductive paths is formed of at least a plurality of conductive particles. The discontinuous layer includes a plurality of non-mutually connected portions that cover portions of, but not all of, the first side of the dielectric material such that exposed portions of the underlying first side of the dielectric material remain exposed through the discontinuous layer, yet the discontinuous layer facilitates the electronic coupling together of a plurality of the conductive paths from the first side to the second side of the dielectric material. | 09-18-2014 |
20140262447 | MULTILAYER PRINTED WIRING BOARD FOR MOUNTING SEMICONDUCTOR ELEMENT - A multilayer printed wiring board for mounting a semiconductor element includes a core substrate, a first laminated structure on first surface of the substrate and including a conductive circuit layer on the first surface of the substrate, a resin insulating layer and the outermost conductive circuit layer, and a second laminated structure on second surface of the substrate and including a conductive circuit layer on the second surface of the substrate, a resin insulating layer and the outermost conductive circuit layer. The outermost conductive layer in the first structure has solder pads positioned to mount a semiconductor element and solder bumps formed on the pads, respectively, the outermost conductive layer in the second structure has solder pads positioned to mount a wiring board, and the outermost conductive layers in the first and second structures have thicknesses formed greater than thicknesses of the conductive layers on the surfaces of the substrate. | 09-18-2014 |
20140262448 | HIGH-FREQUENCY SIGNAL LINE, METHOD FOR PRODUCING SAME, AND ELECTRONIC DEVICE - A high-frequency signal line includes a laminate of a plurality of insulator layers, a signal line provided on a first principal surface of one of the insulator layers, a first ground conductor provided on a second principal surface of the insulator layer provided with the signal line, the first ground conductor including openings that overlap with the signal conductor, and a second ground conductor provided in or on the laminate so as to be opposed to the first ground conductor with the signal conductor positioned therebetween. | 09-18-2014 |
20140284082 | TOUCHSCREEN AND CONDUCTIVE LAYER THEREOF - The present invention relates to a conductive layer of a touch screen, the conductive layer is a mesh composed of metal wires, the mesh comprises a plurality of mesh cells, the mesh cell comprises a plurality of mesh edges and nodes formed by connecting two adjacent edges, the conductive layer comprises a sensing region and a wire region which is electrically connected to the sensing region, the sensing region comprises a plurality of first sensing patterns and a plurality of second sensing patterns, the first sensing pattern and the second sensing pattern is adjacent and electrically insulated from each other, the mesh cells in each first sensing pattern are electrically connected with each other, the mesh cells in each second sensing pattern are electrically connected with each other. The present invention further relates to a touch screen. The conductive layer has a structure of metal mesh, which can be manufactured by embossing process, compared to the conventional process which uses ITO as a conductive layer, mesh shape can be one-step formed, the process is simple, the yield is high. And the material cost is greatly reduced using metal instead of ITO, since no etching process is used, the conductive material will not be wasted, and it reduces heavy metal emission in the waste liquid. | 09-25-2014 |
20140284083 | PATTERNED TRANSPARENT CONDUCTORS AND RELATED MANUFACTURING METHODS - A patterned transparent conductor includes a substrate and additives at least partially embedded into at least one surface of the substrate and localized adjacent to the surface according to a pattern to form higher sheet conductance portions. The higher sheet conductance portions are laterally adjacent to lower sheet conductance portions. | 09-25-2014 |
20140290983 | STACKED MULTILAYER STRUCTURE - Disclosed is a stacked multilayer structure, including a first circuit layer having bumps, a plastic film stacked on the first circuit layer to fill up the space among the bumps so as to form a co-plane, and a second circuit layer formed on the co-plane and connected to the first circuit layer. The plastic film includes a glass fiber layer which is embedded and not exposed. The adhesion between plastic film and the second circuit layer is greatly improved because the glass fiber layer of the plastic film filling up the space among the bumps is not deformed and exposed outwards. Therefore, the yield and reliability of the stacked multilayer structure is increased. | 10-02-2014 |
20140290984 | TRANSPARENT CONDUCTIVE FILM - A transparent conductive film includes a substrate, a transparent conductive layer, a lead electrode, and a first connecting wire, the substrate includes a first region and a second region located on the edge of the substrate; the transparent conductive layer is embedded in the first region, the lead electrode is formed on the second region; first connecting wire is formed on the substrate and located between the transparent conductive layer and the lead electrode, thereby the conductive material of the first conductive mesh and that of second conductive mesh are electrically connected; the first connecting is arranged between the transparent conductive layer and the lead electrode for electrically connecting the transparent conductive layer and the lead electrode, which can enhance the electrical connection strength between the transparent conductive layer and the lead electrode, such that the conductivity of the conductive film is great, and the yield is improved. | 10-02-2014 |
20140290985 | EMBEDDED METAL STRUCTURES IN CERAMIC SUBSTRATES - The invention relates to a method for producing a substrate comprising embedded conductive metal structures or metallizations, in particular for use as printed circuit boards. The aim of the invention is to allow the buried metallization of three-dimensional, i.e. curved or angular, substrates in addition to the two-dimensional flat and level, i.e. plate-shaped, substrates. According to the invention, this is achieved in that trenches and/or recesses are dug into the substrate using laser technology, and the metal structures are then produced in the trenches and/or recesses. | 10-02-2014 |
20140299358 | MULTILAYER CIRCUIT SUBSTRATE - A multilayer circuit substrate includes: a first signal line and a first ground conductor formed in a first conductive layer; and a second signal line and a second ground conductor formed in a second conductive layer, the second conductive layer facing the first conductive layer via an insulating layer. The first signal line intersects with the second signal linein a plan view of the multilayer circuit substrate, and a space between the first ground conductor and first signal line is smaller in an intersection area of the first and second signal lines than a space in a non-intersection area, and a space between the second ground conductor and second signal line is smaller in the intersection area than a space in the non-intersection area. | 10-09-2014 |
20140299359 | STRUCTURES WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUFACTURING METHODS - Electrically conductive or semiconducting additives are embedded into surfaces of host materials for use in a variety of applications and devices. Resulting surface-embedded structures exhibit improved performance, as well as cost benefits arising from their compositions and manufacturing processes. | 10-09-2014 |
20140299360 | CONDUCTIVE SHEET AND METHOD FOR FABRICATING THE SAME - In a conductive sheet using a metal nanofiber, metal migration in a visible conductive pattern is eliminated. Also, the intervals of the conductive portion (separate sheet terminal) are shortened. On a substrate ( | 10-09-2014 |
20140311771 | WIRING BOARD - A wiring board includes first insulating layers and second insulating layers formed on a core layer in this order; a third insulating layer and a solder resist layer formed on another surface of the core layer in this order, first wiring layers and second wiring layers formed in the first insulating layers and the second insulating layers, respectively, wherein a first end surface of the first via wiring exposes from the first surface of the outermost first insulating layer to be directly connected with an outermost second wiring layer, the first via wiring and the outermost second wiring layer being separately formed, the first surface of the outermost first insulating layer and the first end surface of the first via wiring are polished surfaces, smooth surfaces and are flush with each other, and the wiring density of the second wiring layers is higher than that of the first wiring layers. | 10-23-2014 |
20140311772 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER CORE SUBSTRATE - A printed wiring board includes: a multilayer core substrate including first and second insulation layers and a double-sided board between the first and second insulation layers. The core substrate has a cylindrical through-hole structure including a cylindrical conductor through the insulation layers and the board, a resin filler filling inside the cylindrical conductor and covering circuits covering the filler at the ends of the cylindrical conductor, respectively. The core substrate includes a conductive layer including a through-hole land around end of the structure such that the land is directly connected to the cylindrical conductor, the land includes a first electroless film, a first electrolytic film, a second electroless film and a second electrolytic film, and the cylindrical conductor includes the second electroless and electrolytic films such that the second electroless film is in contact with the side walls of the first electroless and electrolytic films. | 10-23-2014 |
20140311773 | MULTI-LAYER WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A multi-layer wiring board is configured having stacked therein, in a stacking direction, via an adhesive layer, a plurality of printed wiring bases in each of which a wiring pattern and a via are formed on/in a resin base. A multi-layer wiring board includes a movable portion configured from an elastic member and a void portion, the movable portion being formed in the printed wiring bases and adhesive layer in a periphery of a matrix-shaped plurality of multi-layer wiring portions disposed at a certain interval as viewed in a planar manner, and the movable portion joining the plurality of multi-layer wiring portions such that each of the multi-layer wiring portions is displaceable in the stacking direction and a direction of surfaces of the printed wiring bases. | 10-23-2014 |
20140318829 | PRINTED WIRING BOARDS HAVING THERMAL MANAGEMENT FEATURES AND THERMAL MANAGEMENT APPARATUSES COMPRISING THE SAME - A printed wiring board includes an insulator substrate, an electrical conductor at least partially embedded in the insulator substrate, and a thermal conductor at least partially embedded in the insulator substrate. The printed wiring board also includes a temperature-insensitive component mounting region and a temperature-sensitive component mounting region. The insulator substrate and the thermal conductor are arranged into a targeted heat transfer region proximate to the temperature-sensitive component mounting region and a bulk region at positions spaced apart from the temperature-sensitive component mounting region. | 10-30-2014 |
20140326485 | PRINTED CIRCUIT BOARD WITH SHALLOW SOLDER PAD AND METHOD FOR MANUFACTURING THE SAME - An exemplary printed circuit board includes a base, solder pads, and signal traces. The base includes outer surfaces. The signal traces having a first height relative to the base are formed on the outer surface of the base. The solder pads having a second height relative to the base are formed on the same surface having the signal traces. The first height of the signal trace is greater than the second height of the solder pad. Exemplary methods for manufacturing the printed circuit board are also provided. | 11-06-2014 |
20140332252 | CARRIER SUBSTRATE AND MANUFACTURING METHOD THEREOF - A carrier substrate includes an insulation layer, conductive towers and a circuit structure layer. A diameter of each of the conductive towers is increased gradually from a top surface to a bottom surface, and the conductive towers include first conductive towers and second conductive towers surrounding the first conductive towers. The circuit structure layer is disposed on the insulation layer and includes at least one dielectric layer, at least two circuit layers and first conductive vias. Each of the second conductive towers correspondingly connects to at least two of the first conductive vias, and each of the first conductive towers correspondingly connects to one of the first conductive vias. An interface exists between the first conductive vias and the first and the second conductive towers. | 11-13-2014 |
20140332253 | CARRIER SUBSTRATE AND MANUFACTURING METHOD THEREOF - A carrier substrate includes a dielectric layer, a first circuit layer, an insulation layer, conductive blocks, and a first conductive structure. The dielectric layer has a first surface, a second surface, and blind vias. The first circuit layer is embedded in the first surface and the blind vias extend from the second surface to the first circuit layer. The insulation layer is disposed on the first surface and has a third surface, a fourth surface, and first openings. The first openings expose the first circuit layer and an aperture of each first opening is increased gradually from the third surface to the fourth surface. The conductive blocks fill the first openings and connect with the first circuit layer. The first conductive structure includes conductive vias filling the blind vias and a second circuit layer disposed on a portion of the second surface. | 11-13-2014 |
20140332254 | LASER PATTERNING OF SILVER NANOWIRE - BASED TRANSPARENT ELECTRICALLY CONDUCTING COATINGS - A transparent electrical conductor ( | 11-13-2014 |
20140332255 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Provided are a printed circuit board and a method of manufacturing the same, the printed circuit board according to the present invention, the printed circuit board, including: an insulating substrate having a plurality of circuit pattern grooves formed on a surface thereof; and a plurality of circuit patterns formed by burying the circuit pattern grooves, wherein the circuit patterns protrude as much as a predetermined thickness from an upper surface of the insulating substrate. | 11-13-2014 |
20140338957 | PRINTING CIRCUIT BOARD AND THE APPLICATION THE SAME OF - A Printing Circuit Board is disclosed, a preferred embodiment in accordance with the present invention includes: an insulator, and a trace(s) which is embedded therein, wherein both the upper surface and a portion of the lower surface of said trace exposed out of said insulator, nevertheless, another portion of the lower surface of trace encapsulated by said insulator, in this manner, it is not necessary for said lower surface of trace to be coupled with a solder mask which is for protecting said lower surface of trace, as this result, the advantages of said PCB includes: (1). The cost is saved; (2). The thickness is thinner; and (3). the reliability of said PCB is enhanced. | 11-20-2014 |
20140338958 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A base insulating layer is formed on a suspension body. A lead wire for plating and a wiring trace are integrally formed on the base insulating layer. A cover insulating layer is formed on the base insulating layer to cover the lead wire for plating and the wiring trace. A thickness of a portion of the cover insulating layer above a region of the base insulating layer in which the lead wire for plating is formed is set smaller than the thickness of a portion of the cover insulating layer above other regions of the base insulating layer. | 11-20-2014 |
20140345909 | PRINTED CIRCUIT BOARD STRUCTURE - A printed circuit board structure comprises a base layer, an insulation layer, and a signal layer sandwiched between the base layer and the insulation layer. The insulation layer includes a plurality of conductive regions. The conductive regions are used for providing a current reflowing path. Each of the conductive regions comprises a plurality of empty regions which are spaced from each other. A space inside the empty region is substantially hollow, and spaces between adjacent empty region are filled with cooper. | 11-27-2014 |
20140345910 | METHOD OF FORMING CONDUCTIVE LINE, AND DEVICE COMPRISING THE SAME - The present invention relates to a method for forming a conductive line, and a device comprising the conductive line. The method for forming a conductive line comprises: (A) providing a metal oxide composition which comprises a metal oxide, and a reducing agent; (B) applying the metal oxide composition on a substrate, and curing the metal oxide composition to form an metal oxide layer; and (C) irradiating the metal oxide layer by a light source to occur a chemical reduction reaction between the metal oxide and the reducing agent in the metal oxide layer to proceed to thereby form a conductive line. | 11-27-2014 |
20140345911 | RIGID FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A rigid flexible printed circuit board, having a rigid region and a flexible region, includes, in one embodiment: a base substrate including a portion in the rigid region and a portion in the flexible region; a coverlay formed on the base substrate; a first insulating layer formed on the coverlay and formed in the rigid region; a second insulating layer formed on the first insulating layer; and an outer layer circuit layer formed on the second insulating layer. Also described is a method of manufacturing a rigid flexible printed circuit board having a rigid region and a flexible region. | 11-27-2014 |
20140345912 | ELECTRIC MULTILAYER PRINTED CIRCUIT BOARD - The invention relates to an electric multilayer printed circuit board which satisfies the PICMG specification EXP.O, comprising a first signal layer and a second signal layer. The first signal layer comprises at least one first conductive path ( | 11-27-2014 |
20140345913 | Method and Device of Manufacturing Printed Circuit Board - Provided is a method of manufacturing a printed circuit board, the method including: preparing an insulating substrate including a resin material in which a solid component is impregnated; forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate; forming a plated layer in which the circuit pattern groove is buried; and forming a buried circuit pattern by removing the plated layer until the insulating layer is exposed, wherein the solid component has a diameter of less than 5% to a width of the buried circuit pattern. Thus, as a filler of a predetermined size or less is applied into the insulating layer for forming the circuit pattern, the occurrence of a void due to separation of the filler from a boundary part with the circuit pattern can be reduced, and reliability can be also secured. | 11-27-2014 |
20140353006 | MULTILAYER CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A multilayer circuit board includes a wiring board, a first adhesive sheet, an electronic device, and a second adhesive sheet. The wiring board includes a first wiring layer and a second wiring layer. The first adhesive sheet is adjacent to the first wiring layer. The first adhesive sheet defines a second receiving hole. The second receiving hole and the first receiving hole cooperatively form a receiving cavity. The first adhesive sheet includes a supporting surface. The electronic device is received in the receiving cavity, and includes two electrodes. The second adhesive sheet is adjacent to the second wiring layer, and includes a bottom surface. The third wiring layer is formed on the supporting surface and contacts with the two electrodes. The fourth wiring layer is formed on the bottom surface. | 12-04-2014 |
20140353007 | WIRED CIRCUIT BOARD - A wired circuit board includes a metal supporting layer, a first insulating layer, a conductive pattern, and a second insulating layer. The first and second insulating layers include first and second openings which expose both surfaces of the conductive pattern. The conductive pattern has the surface on the other side thereof in a thickness direction which is exposed through the first opening and configured as a first terminal portion, and the surface on one side thereof in the thickness direction which is exposed through the second opening and configured as a second terminal portion. The metal supporting layer includes a third opening which exposes the first terminal portion and a covering portion of the first insulating layer which covers the conductive pattern continued to the first terminal portion, and a reinforcing portion located on a surface on the other side of the covering portion in the thickness direction. | 12-04-2014 |
20140360759 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a first insulation layer, first conductive patterns formed on the first insulation layer and including first mounting pads positioned to mount a semiconductor element, a wiring structure positioned in the first insulation layer and having a second insulation layer, second conductive patterns formed on the second insulation layer, and second mounting pads connected to the second conductive patterns, and third mounting pads formed on the first insulation layer above the second mounting pads and connected to the second mounting pads such that the third mounting pads are positioned to mount the semiconductor element and form a distance between adjacent first and third mounting pads which is greater than a distance between adjacent first mounting pads. | 12-11-2014 |
20140360760 | WIRING SUBSTRATE AND MANUFACTURING METHOD OF WIRING SUBSTRATE - A wiring substrate includes a core, a first wiring layer formed on a first surface of the core, a second wiring layer formed on a second surface of the core, and an electronic component partially accommodated in the cavity and including a projected portion projected from the first opening of the core. A first insulating layer covers a side surface of the electronic component and the first surface of the core and fills a portion of the cavity. A second insulating layer covers the first insulating layer. A third insulating layer covers the second surface of the core. The remainder of the cavity that is not filled with the first insulating layer is filled with the third insulating layer. | 12-11-2014 |
20140360761 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Provided is a printed circuit board, including a plurality of buried circuit patterns which are formed in an active area; and a plurality of buried dummy patterns which are uniformly formed in a dummy area except the active area. Thus, since when the circuit patterns are formed, the dummy patterns are also uniformly formed, a difference in plating can be reduced. Also, since the dummy patterns are uniformly formed in the dummy area, a difference in grinding between the dummy area and the active area can be reduced, thereby enabling the circuit patterns to be formed in the active area without the occurrence of over-grinding. | 12-11-2014 |
20140367147 | INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, PREPREG AND PRINTED CIRCUIT BOARD - Disclosed herein are an insulating resin composition for a printed circuit board, an insulating film, a prepreg, and a printed circuit board. More specifically, disclosed herein are an insulating resin composition for a printed circuit board including a maleimide resin having three or more maleimide groups, and the like so that a glass transition temperature and a mechanical strength are improved, an insulating film and a prepreg prepared using the insulating resin composition, and a printed circuit board including the insulating film or the prepreg. | 12-18-2014 |
20140367148 | TOUCH PANEL AND MANUFACTURING METHOD THEREOF - Disclosed are an optical member, a display device including the optical member and a method of fabricating the optical member. The display device includes a light source; a wavelength conversion member into which light generated from the light source is incident; and a display panel into which light is incident from the wavelength conversion member. The wavelength conversion member includes a receiving part having a pipe shape; a matrix in the receiving part; and a plurality of wavelength conversion particles disposed in the matrix to convert a wavelength of the light generated from the light source. | 12-18-2014 |
20140374145 | HERMETICALLY-SEALED ELECTRICAL CIRCUIT APPARATUS - Hermetically-sealed electrical circuit apparatus and methods for constructing such apparatus using one or more seal portions. | 12-25-2014 |
20140374146 | METAL NANONETWORK AND METHOD FOR PRODUCING THE SAME, AND CONDUCTIVE FILM AND CONDUCTIVE SUBSTRATE USING METAL NANONETWORK - A metal nanonetwork includes metal nanostructures that are joined by metallic bond. The joined part between the metal nanostructures includes a fillet part. In the joined part between the metal nanostructures, the distance between the central axis of one metal nanostructure and the central axis of another metal nanostructure is smaller than the sum of the radii of both metal nanostructures. The metal nanostructure is a metal nanowire. A first method for producing the metal nanonetwork includes a process of forming an oxide film on the outermost surface of the metal nanostructure, and a process of reducing the oxide film at the joined parts of a plurality of the metal nanostructures to thereby join the metal nanostructures. | 12-25-2014 |
20150008014 | CONDUCTIVE FILM AND PREPARATION METHOD THEREOF - A conductive film includes a transparent insulating substrate and a conductive mesh formed on the transparent insulating substrate, one of them is imprinted to form a meshed-like grooves on a surface thereof, it is simple and quick, having high efficiency; the grooves is printed and filled with metal slurry and sintered to form a conductive mesh, the cost is low; the distance between the lines of the conductive mesh is defined as d | 01-08-2015 |
20150014022 | Device Components With Surface-Embedded Additives And Related Manufacturing Methods - Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes. | 01-15-2015 |
20150014023 | CONDUCTIVE FILM AND TOUCH PANEL INCLUDING THE SAME - A conductive film may be provided that includes a base member, a first hard coating layer formed on a surface of the base member, and a conductive layer formed on the first hard coating layer. The conductive layer may include conductors composed of a nano-material forming a network structure. | 01-15-2015 |
20150027751 | FLEXIBLE CIRCUIT BOARD WITH PLANARIZED COVER LAYER STRUCTURE - A planarized cover layer structure of a flexible circuit board includes an insulation layer bonded through a first adhesive layer to a surface of each one of conductive signal lines laid on a substrate of a flexible circuit board. Separation areas respectively formed between adjacent ones of the conductive signal lines are each formed with a filling layer, so that the filling layer provides the first adhesive layer with a planarization height in the separation areas and the planarization height is substantially equal to the height of the conductive signal lines. The filling layer can alternatively be of a height that is higher than the surface of the conductor layer by a covering height so that the first adhesive layer has a planarization height in the separation areas and the planarization height is substantially equal to the sum of the height of the conductive signal lines and the covering height. | 01-29-2015 |
20150027752 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME - A wiring cover layer is formed on a base insulating layer with a conductor trace sandwiched therebetween. A cover insulating layer is formed on the base insulating layer to cover the wiring cover layer. A terminal cover layer is formed to cover a terminal portion of the conductor trace. A projection of the wiring cover layer projects from an upper surface of the wiring portion to a position above the terminal portion. An end surface of the projection is positioned inward from an end of the cover insulating layer. An insert portion of the terminal cover layer is formed between an upper surface of the terminal portion and a lower surface of the end of the cover insulating layer. A projection of the terminal cover layer is formed between the upper surface of the terminal portion and a lower surface of the projection of the wiring cover layer. | 01-29-2015 |
20150027753 | PANEL STRUCTURE - A panel structure includes a substrate, a decoration layer and a conductive component. The decoration layer is located in a first region and the rest region is a second region. The decoration layer includes a middle portion and a first edge protruding portion located between the middle portion and the second region and thinner than the middle portion. Each the conductive component extends in a first direction towards the first region from the second region and crosses the first edge protruding portion followed by extending in a second direction on the middle portion of the decoration layer, the first direction intersects the second direction, each the conductive component on the first edge protruding portion has a first width, each the conductive component on the middle portion extends in the second direction and has a second width less than the first width. | 01-29-2015 |
20150027754 | RESIN COMPOSITION, LAYERED PRODUCT, MULTILAYER PRINTED WIRING BOARD, MULTILAYER FLEXIBLE WIRING BOARD AND MANUFACTURING METHOD OF THE SAME - A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate in 3 mass % aqueous sodium hydroxide at 45° C. is 0.95 or more after a heat history of 90° C. for 10 minutes with the solution rate before the heat history assumed to be 1, (b) the solution rate in 3 mass % aqueous sodium hydroxide at 45° C. ranges from 0.001 μm/sec to 0.02 μm/sec after the heat history of 180° C. for 60 minutes, (c) a bleed-out amount is 50 mg/m | 01-29-2015 |
20150034364 | FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MAKING SAME - An FPCB includes a flexible base, a wiring layer formed on a top surface of the base, a covering layer formed on the wiring layer, and a shielding layer formed on a portion of the covering layer. The wiring layer includes a grounding line. The covering layer defines an opening to expose the grounding line to the outside. A portion of the shielding layer fills into the opening. The shielding layer is electrically connected to the grounding line through the opening. | 02-05-2015 |
20150034365 | METHOD FOR MANUFACTURING WIRING BOARD AND WIRING BOARD - A method for manufacturing a wiring board includes preparing a wiring board having an insulation layer, a conductive pattern and a solder-resist layer laminated such that the solder-resist layer is covering the conductive pattern and exposing a conductive pad portion of the conductive pattern, applying microwave plasma on the wiring board in a nonoxidative atmosphere such that the wiring board undergoes microwave plasma treatment in the nonoxidative atmosphere, and forming a surface-treatment layer on the conductive pad portion of the conductive pattern after the applying of microwave plasma on the wiring board. | 02-05-2015 |
20150034366 | CIRCUIT BOARD - One aspect of the present invention relates to a circuit board including an insulating base substrate; and a circuit layer that is formed of a conductor and that is provided on the surface of the insulating base substrate, wherein the insulating base substrate has a smooth surface having a surface roughness Ra of 0.5 μm or less, and the conductor is at least partially embedded in a wiring groove formed in the surface of the insulating base substrate. | 02-05-2015 |
20150041183 | CHIP BOARD PACKAGE STRUCTURE - A chip board package structure includes a circuit board part, a chip board part and a solder used to solder the circuit board part and the chip board part. A chip on the chip board part is connected to an electrical circuit by wiring or soldering. A surface treatment metal layer includes at least nickel, palladium and gold formed on part of the surface of the circuit layer on the chip board. A copper-tin intermetallic compound is formed on joints of the second solder and the surface treatment metal layer, and the other part of the circuit layer is directly connected to the solder to form the copper-tin intermetallic compound. In addition to the lower package cost, with the shape feature of the copper-tin intermetallic compound, it is possible to increase the contact area with the solder, thereby improving the reliability of the soldering process and the yield. | 02-12-2015 |
20150041184 | THE PRINTED CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME - A printed circuit board includes: a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a first circuit pattern groove; a first circuit pattern filling the first circuit pattern groove of the first insulating layer; a second insulating layer covering the first circuit pattern and including a second circuit pattern groove at a top surface thereof; and a second circuit pattern filling the second circuit pattern groove of the second insulating layer, wherein the first insulating layer includes a resin material and a filler distributed in the resin material. Accordingly, a total thickness of the PCB can be thinly formed while maintaining the stiffness by separately forming a thin insulating layer without a glass fiber for the buried pattern on the core insulating layer. | 02-12-2015 |
20150041185 | CIRCUIT WITH FLAT ELECTROMAGNETIC BAND GAP RESONANCE STRUCTURE - Circuit with flat electromagnetic band gap resonance structure, includes a plurality of flat units formed at a conductor layer; each flat unit spirally revolves inward from a first end to an internal point following a rotation direction, and spirally revolves outward from the internal point to a second end following an opposite rotation direction. Each flat unit is connected to a ground plane by a conductive stand (e.g., a via) at a connection point, for suppressing noise resonances at certain frequencies, and the frequencies are related to a stub length of each flat unit, and the stub length is related to a route length from the connection point to an end. | 02-12-2015 |
20150047881 | MASKING LAYER FORMED BY APPLYING DEVELOPABLE PHOTOSENSITIVE RESIN COMPOSITIONS ON PANEL STRUCTURE - The invention relates to a masking layer. The masking layer produced by coating a white-color photosensitive resin composition on a peripheral region of a transparent substrate, developing the white-color photosensitive resin composition to obtain a patterned composition layer, coating a gray-color photosensitive resin composition on the cured composition layer and developing the gray-color photosensitive resin composition, so that the gray-color photosensitive resin composition is cured to obtain the masking layer having an optical density (O.D.) of ≧3.5. The masking layer is adapted for use on a touch panel or a flat panel display device. The masking layer shows a white color appearance when viewed from outside and serves as a white color decoration around the peripheral region of the device. The masking layer further comprises a gray colored sub-layer to mask the electrical circuitry disposed beneath the masking layer. | 02-19-2015 |
20150053457 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. According to the preferred embodiment of the present invention, the printed circuit board includes: a glass substrate through which light is not transmitted; a positive photosensitive insulating layer formed on the glass substrate; and a circuit pattern formed on the glass substrate and buried in the positive photosensitive insulating layer. | 02-26-2015 |
20150053458 | INSULATING FILM FOR PRINTED CIRCUIT BOARD AND PRODUCTS HAVING THE SAME - Disclosed herein are an insulating film for a printed circuit board and products having the same. In detail, in the insulating film according to a representative embodiment of the present invention, an insulating material in which a content of an inorganic filler in an insulating layer has a concentration gradient and a printed circuit board using the same may increase fillability of an inner layer circuit and a through hole of the inner layer circuit. | 02-26-2015 |
20150053459 | PATTERNING OF ELECTRICALLY CONDUCTIVE FILMS - Articles and methods of making them, the methods comprising providing a conductive film comprising a first region exhibiting a first conductivity and a second region exhibiting a second conductivity, the first region and the second region each comprising a plurality of conductors, forming a first pattern in the conductive film by exposing the first region of the conductive film to at least a first beam of radiation along a first path having at least one first shape comprising at least one curve, where, after irradiating the first region of the conductive film, the first region of the conductive film exhibits a third conductivity that is less than the second conductivity. | 02-26-2015 |
20150053460 | WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING WIRING BOARD - A wiring board includes first and second insulating layers, first and second through holes, a via, a plane layer, and signal wirings. The first insulating layer covers a first wiring layer. The first through hole opens on a surface of the first insulating layer and exposes a surface of the first wiring layer. The via fills the first through hole. The plane layer is connected to the via and is stacked on the first insulating layer. The second through hole opens on a surface of the plane layer and exposes the surface of the first insulating layer. The second insulating layer at least partially fills the second through hole and covers the plane layer. The signal wirings are stacked on the second insulating layer. The first through hole overlaps the signal wirings in a plan view. The second through hole does not overlap the signal wirings in a plan view. | 02-26-2015 |
20150053461 | PANEL - A panel including a substrate, a plurality of wirings and a protection stacked layer is provided. The substrate has a device area, a bonding area and a wiring area connected between the device area and the bonding area. The wirings extend from the device area to the bonding area through the wiring area. The protection stacked layer extends from a side of the wiring area adjacent to the device area towards a side of the bonding area and is located on the wirings. | 02-26-2015 |
20150060110 | METHODS FOR SHIELDING ELECTRONIC COMPONENTS FROM MOISTURE - Methods for applying a hydrophobic coating to various components within a computing device are disclosed. More specifically, a hydrophobic coating can be applied by a plasma assisted chemical vapor deposition (PACVD) process to a fully assembled circuit board. Frequently, a fully assembled circuit board can have various components such as electromagnetic interference (EMI) shields which cover water sensitive electronics. A method is disclosed for perforating portions of the EMI shields that overlay the water sensitive electronics. Methods of sealing board to board connectors are also disclosed. In one embodiment solder leads of the board to board connectors can be covered by a silicone seal. | 03-05-2015 |
20150068788 | PRINTED WIRING BOARD - A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer. | 03-12-2015 |
20150075843 | MULTILAYER WIRING BOARD - A multilayer wiring board includes a first metal foil wiring layer that has at least two or more layers of metal foil wiring lines and is arranged on a mounting surface side for mounting a surface mount type component, a wire wiring layer that is arranged on an opposite side of the mounting surface, and in which an insulation coating wire is wired, and a first interlayer conduction hole that has a conduction part which electrically connects the metal foil wiring line positioned on a surface of the first metal foil wiring layer to at least one of the metal foil wiring line in an inner layer of the first metal foil wiring layer and the insulation coating wire of the wire wiring layer. A hole diameter of the first interlayer conduction hole varies in a board thickness direction of the multilayer wiring board. | 03-19-2015 |
20150075844 | ARRAY PRINTED CIRCUIT BOARD, METHOD OF REPLACING DEFECTIVE SINGLE PRINTED CIRCUIT BOARD OF THE SAME, AND METHOD OF MANUFACTURING ELECTRONIC APPARATUS USING THE SAME - An array printed circuit board (PCB) is provided in which a defective single PCB may be easily replaced. A method of replacing a defective single PCB and a method of manufacturing an electronic apparatus are also provided. The array PCB may include a plurality of single PCBs. A rail portion may surround the single PCBs. A plurality of tab route portions connect the single PCBs to the rail portion, each of the tab route portions including at least one pair of via electrodes. A test terminal portion may be formed at one side of the rail portion and may include a plurality of test terminals. The at least one pair of via electrodes may include a first via electrode, arranged adjacent to the rail portion and electrically connected to a corresponding test terminal, and a second via electrode arranged adjacent to and electrically connected to a corresponding single PCB. | 03-19-2015 |
20150075845 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - Disclosed herein are a printed circuit board and a method of manufacturing the same. According to a preferred embodiment of the present invention, the printed circuit board includes: a base substrate; an inner layer build-up layer formed on the base substrate and including a first inner layer circuit layer, a second inner layer circuit layer, an inner layer insulating layer, and an inner layer via having a tapered section; and an outer layer build-up layer formed on the inner layer build-up layer and including an outer layer circuit layer, an outer layer insulating layer, and an outer layer via having a rectangular section. | 03-19-2015 |
20150083464 | TRANSPARENT BODY FOR USE IN A TOUCH SCREEN PANEL MANUFACTURING METHOD AND SYSTEM - A process for manufacturing a transparent body for use in a touch screen panel is provided. The process includes: depositing a first transparent layer stack over a transparent substrate, wherein said first transparent layer stack includes at least a first dielectric film with a first refractive index, and a second dielectric film with a second refractive index different from the second the first refractive index; providing a structured transparent conductive film in a manner such that the first transparent layer stack and the transparent conductive film are disposed over the substrate in this order, and wherein the structured transparent conductive film has a sheet resistance of 100 Ohm/square or below; and providing a transparent adhesive onto the structured transparent conductive film configured for attaching the layer stack to the touch screen panel. | 03-26-2015 |
20150083465 | TRANSPARENT CONDUCTIVE SUBSTRATE, AND METHOD FOR MANUFACTURING SAME - A transparent or conductive substrate and its manufacturing method are provided. The transparent or conductive substrate comprises a base substrate capable of light transmission; a transparent electroconductive layer formed by depositing a transparent electroconductive material; and an anti-reflection layer, wherein the anti-reflection layer is formed by using a dry etching method and comprises a plurality of spine-type structures and an anti-reflection structure formed by depositing inorganic particles. | 03-26-2015 |
20150090478 | SILVER THICK FILM PASTE HERMETICALLY SEALED BY SURFACE THIN FILM MULTILAYER - A ceramic substrate comprises a plurality of ceramic sheets, a plurality of inner conductive layers, a plurality of vias, and an upper conductive layer. The ceramic sheets are stacked one on top of another and include a top ceramic sheet. The inner conductive layers include electrically conductive material that forms electrically conductive features on an upper surface of each ceramic sheet excluding the top ceramic sheet. The vias are formed in each of the ceramic sheets with each via being filled with electrically conductive material. The upper conductive layer includes electrically conductive material that forms electrically conductive features on an upper surface of the top ceramic sheet. The upper conductive layer is constructed from a stack of four sublayers. A first sublayer is formed from titanium. A second sublayer is formed from copper. A third sublayer is formed from platinum. A fourth sublayer is formed from gold. | 04-02-2015 |
20150096788 | ECOLOGICAL METHOD FOR CONSTRUCTING CIRCUIT BOARDS - A method for fabrication of a circuit board using the disclosed embodiments relies on a CAD model of a multilayer circuit board with conductive elements defined by layer. A first granular conductive material layer is introduced into a mold. A fusion process element traverses across the mold to fuse selected portions of the first granular conductive material layer forming first layer conductive elements. An additional granular conductive material layer is introduced into the mold over the fused selected portions of the first layer and unfused portions of the first layer. The fusion process element is then traversed across the mold to fuse selected portions of the additional granular conductive material layer forming an additional layer of conductive elements. Unfused granular conductive material is then purged from the fused first conductive elements and additional conductive layer elements. A dielectric material is then infused into a structure formed by the fused first conductive elements and additional conductive layer elements. | 04-09-2015 |
20150096789 | ELECTRONIC COMPONENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to an electronic component embedded printed circuit board and a method for manufacturing the same. | 04-09-2015 |
20150114686 | PRINTED CIRCUIT BOARD - A printed circuit board includes a first dielectric layer, a first ground layer, a second dielectric layer, a first power layer, a first via hole, and a first ground hole. A first signal line is laid on the first dielectric layer. A third signal line is laid on the second dielectric layer. The first and third signal lines are electrically connected to the first via hole. An extending direction of the first signal line on the first dielectric layer is opposite to an extending direction of the third signal line is laid on the second dielectric layer. A first void area is defined in the first ground layer around the first via hole. A second void area is defined in the first power layer around the first via hole. The first ground hole is outside the first void area and the second void area. | 04-30-2015 |
20150114687 | PCB TRACE CONNECTION OF ION SMOKE SENSOR - Embodiments are directed to a method for manufacturing a smoke detector, comprising: manufacturing a substrate that comprises a guard ring configured to surround an ion chamber collector plate pin connection point, a surface mount component connection point, and a trace coupling the ion chamber collector plate pin connection point and the surface mount component connection point, and coupling a surface mount component to the substrate at the surface mount component connection point. | 04-30-2015 |
20150114688 | PRINTED CIRCUIT BOARD - Disclosed herein is a printed circuit board having an improved structure of a dummy part to improve warpage strength of the printed circuit board, the printed circuit board including: a plurality of insulating layers built-up therein, the plurality of insulating layers including copper clad layers; and a product zone and a dummy zone formed at a central part and along an edge part of the insulating layers, respectively, wherein the copper clad layers included in each insulating layer are arranged in the dummy zone at predetermined intervals in a longitudinal direction. | 04-30-2015 |
20150114689 | FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIRING BOARD - A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer formed on first surfaces of the flexible and non-flexible substrates, a second wiring layer embedded in second surfaces of the flexible and non-flexible substrates, a first insulating layer covering the first surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the first surface of the flexible substrate, and a second insulating layer covering the second surfaces of the flexible and non-flexible substrates and having an opening exposing a portion of the second surface of the flexible substrate. The first wiring layer includes non-embedded wirings on the first surfaces of the flexible and non-flexible substrates, and the second wiring layer includes embedded wirings in the second surfaces of the flexible and non-flexible substrates. | 04-30-2015 |
20150114690 | FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIRING BOARD - A flex-rigid wiring board includes a flexible substrate, a non-flexible substrate positioned such that the non-flexible substrate is extending in horizontal direction of the flexible substrate, a first wiring layer on first surface sides of the flexible and non-flexible substrates, a second wiring layer on second surface sides of the flexible and non-flexible substrates, a first insulating layer covering the first sides of the flexible and non-flexible substrates and having an opening exposing a portion of the first side of the flexible substrate, and a second insulating layer covering the second sides of the flexible and non-flexible substrates and having an opening exposing a portion of the second side of the flexible substrate. The first wiring layer includes first conductor pattern on the first side of the flexible substrate, and the second wiring layer includes second conductor pattern extending across the second sides of the flexible and non-flexible substrates. | 04-30-2015 |
20150114691 | CORE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Disclosed herein are a core substrate and a method for manufacturing the same. According to a preferred embodiment of the present invention, a core substrate includes: a porous scaffold formed with a void; an insulating material formed to fill a void of the porous scaffold; and an electronic device embedded into the porous scaffold and the insulating material and having internal electrodes exposed on both surfaces thereof. | 04-30-2015 |
20150122530 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate including a resin insulating layer and multiple conductor layers, a first wiring structure formed on a first surface of the core substrate and including a conductor layer and a resin insulating layer, and a second wiring structure formed on a second surface of the core substrate and including a conductor layer and a resin insulating layer. The core substrate is interposed between the first wiring structure and the second wiring structure such that the resin insulating layers and conductor layers in the core substrate, first wiring structure and second wiring structure are alternately laminated, the resin insulating layer in the first wiring structure has a vol % of resin which is larger than a vol % of resin in the resin insulating layer in the second wiring structure such that a difference in the vol % of resin in the first and second wiring structures is in the range of from 0.5% to 5.0%. | 05-07-2015 |
20150129284 | SHAPED INTNERAL LEADS FOR A PRINTED CIRCUIT SUBSTRATE - A printed circuit substrate may be configured with at least one internal lead designed and shaped to reduce solder bridging. The printed circuit substrate can have a plurality of internal leads that each has a continuously curvilinear boundary that defines an isolation channel. The isolation channel may be configured with a uniform distance that separates a first internal lead from an adjacent second internal lead. | 05-14-2015 |
20150129285 | PACKAGING SUBSTRATE HAVING EMBEDDED THROUGH-VIA INTERPOSER - A packaging substrate having an embedded through-via interposer is provided, including an encapsulant layer, a through-via interposer embedded in the encapsulant layer and having a plurality of conductive through-vias therein, a redistribution layer embedded in the encapsulant layer and formed on the through-via interposer so as to electrically connect with first end surfaces of the conductive through-vias, and a built-up structure formed on the encapsulant layer and the through-via interposer for electrically connecting second end surfaces of the conductive through-vias. As such, the first end surfaces of the conductive through-vias of the through-via interposer are electrically connected to the redistribution layer to thereby be electrically connected to electrode pads of a semiconductor chip having smaller pitches, while the second end surfaces of the conductive through-vias electrically connect with conductive vias of the built-up structure having larger pitches, thereby allowing the packaging substrate to be coupled with the semiconductor chip having high-density circuits. | 05-14-2015 |
20150136446 | PRINTED CIRCUIT BOARD - Embodiments of the invention provide a printed circuit board having a structure in which a plurality of insulating layers having a metal wiring formed on one surface thereof are stacked, wherein a metal layer is interposed in the insulating layers, in order to improve warpage property of the board. | 05-21-2015 |
20150136447 | MULTILAYER WIRING BOARD - A multilayer wiring board has a strip structure comprising a core material in which a ground pattern is disposed on one side of an insulating layer and a strip line is disposed on the other side, a prepreg disposed on the strip line of the core material, and a ground pattern disposed on the prepreg. In this multilayer wiring board, the core material is formed with a high frequency-adaptive base material, and the prepreg is formed with a general-purpose material. | 05-21-2015 |
20150136448 | Flexible Printed Wiring Board and Electronic Apparatus - According to one embodiment, a flexible printed wiring board includes a first conductor layer formed on the first surface of an insulation base, a second conductor layer formed on the second surface of the insulation base, a first insulation layer covering the first conductor layer, and a second insulation layer covering the second conductor layer. The first insulation layer has an opening formed in a position corresponding to a connecting terminal portion to expose the first conductor layer. A metal layer is provided in a region ranging from the connecting terminal portion to a bending presumed portion. The metal layer is positioned behind the opening between the second surface and the second insulation layer to avoid the first conductor layer. | 05-21-2015 |
20150136449 | MULTILAYERED WIRING SUBSTRATE - [Objective] To provide a multilayer wiring substrate in which, even when a core substrate is thinned, the core substrate can reliably accommodate a capacitor. | 05-21-2015 |
20150144379 | METHOD AND SYSTEM FOR PRODUCING A MULTILAYER ELEMENT AND MULTILAYER ELEMENT - A method produces a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material, which is present in accordance with a prescribed pattern, while electrically non-conductive second regions lie between the first regions. | 05-28-2015 |
20150292099 | INTERPOSER AND METHOD FOR PRODUCING THE SAME - An interposer includes a substrate, an electrically-conductive structure, at least one dielectric layer, a redistribution structure and electrode pads. The substrate is made of a ceramic material and has first and second surfaces and via holes. The electrically-conductive structure includes conductive pads, substrate vias disposed in the via holes, and layered electrically-conductive parts. The dielectric layer is disposed on the second surface to cover the layered electrically-conductive parts. The redistribution structure penetrates the dielectric layer and is connected to the layered electrically-conductive parts. The electrode pads are disposed on a surface of the dielectric layer. | 10-15-2015 |
20150305161 | EMBEDDED COMPONENT STRUCTURE AND PROCESS THEREOF - An embedded component structure includes a wiring board, a component and an encapsulant. The wiring board has a front side, a reverse side opposite to the front side, an opening and an interconnection layer. The opening penetrates the wiring board and connects the front side and the reverse side of the wiring board. The interconnection layer is located on the front side of the wiring board and extends toward the opening. The component includes an active surface, a back side opposite to the active side, and a working area located on the active surface. The active surface is connected to the interconnection layer of the wiring board. The encapsulant is filled inside the opening and covers the component, which makes the working area of the component exposed. Besides, a method of the embedded component structure is also provided. | 10-22-2015 |
20150313009 | THIN-FILM MULTI-LAYER MICRO-WIRE STRUCTURE - A thin-film multi-layer micro-wire structure includes a substrate and a layer located on the substrate or forming a part of the substrate. One or more micro-channels are located in the layer. Each micro-channel has a width less than or equal to 20 microns. A cured electrically conductive micro-wire is located only within each micro-channel. The micro-wire has a thickness less than or equal to 20 microns, including silver nano-particles, and having a percent ratio of silver that is greater than or equal to 40% by weight. An electrolessly plated layer is located at least partially within each micro-channel between the micro-wire and the layer surface and in electrical contact with the micro-wire. The plated layer has a thickness less than a thickness of the micro-wire so that the micro-wire and plated layer form the thin-film multi-layer micro-wire. | 10-29-2015 |
20150319851 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A printed circuit board includes, an insulating substrate, a metal conductor which is formed on the insulating substrate, a solder resist coating a part of the metal conductor, a scooped-out portion of the metal conductor formed in the vicinity of an end of the solder resist, and a metal layer coating the scooped-out portion. | 11-05-2015 |
20150327355 | Angle-Adjustable And/Or Angled Printed Circuit Board Structure Having At Least Two Printed Circuit Board Sections And Method For Producing The Same - An angle-adjustable printed circuit board structure having two printed circuit board sections arranged angularly with respect to one another. The printed circuit board structure contains at least one conduction element which is embedded at least predominantly in the printed circuit board structure and which extends between two contact pads and is electrically conductively connected to said contact pads. The two contact pads are situated on different printed circuit board sections. The printed circuit board sections are angle-adjustable and/or angled relative to one another with maintenance of the connections between the contact pads and the at least one conduction element and with bending of the at least one conduction element via a bending edge between the printed circuit board sections. The conduction element has a larger extent along the bending edge than perpendicularly thereto, as viewed in cross section. | 11-12-2015 |
20150327358 | COMPENSATING FOR INTRA-PAIR SKEW IN DIFFERENTIAL SIGNALING - A circuit may be configured to reduce electrical signal degradation. The circuit may include a first trace and a second trace that may be broadside coupled between a first ground plane and a second ground plane. The first and second traces may be configured to carry first and second signals, respectively, of a differential signal. The circuit may also include a first dielectric material disposed between the first trace and the second trace. Further, the circuit may include a second dielectric material disposed between the first trace and the first ground plane and disposed between the second trace and the second ground plane. A difference between a first dielectric constant of the first dielectric material and a second dielectric constant of the second dielectric material may suppress a mode conversion of the differential signal from a differential mode to a common mode. | 11-12-2015 |
20150327363 | PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE - A package substrate includes an inner interlayer, a first conductor layer, a second conductor layer, an outermost interlayer, an outermost conductor layer including first and second pads to mount electronic components, vias including first and second vias such that the first vias are connecting the first conductor layer and first pads and the second vias are connecting the first conductor layer and second pads, and skip vias penetrating through the outermost and inner interlayers such that the skip vias are connecting the outermost and second conductor layers. Sum of insulation distances (t | 11-12-2015 |
20150334825 | EMBEDDED TRACES - A printed circuit board includes a laminate substrate. The laminate substrate includes catalytic core material that resists metal plating except where a surface of the catalytic material is ablated. Metal traces are formed within in trace channels within the laminate substrate. The channels extend below the surface of the catalytic material. | 11-19-2015 |
20150334831 | STRUCTURE FOR MICROELECTRONIC PACKAGING WITH BOND ELEMENTS TO ENCAPSULATION SURFACE - A structure may include bond elements having bases joined to conductive elements at a first portion of a first surface and end surfaces remote from the substrate. A dielectric encapsulation element may overlie and extend from the first portion and fill spaces between the bond elements to separate the bond elements from one another. The encapsulation element has a third surface facing away from the first surface. Unencapsulated portions of the bond elements are defined by at least portions of the end surfaces uncovered by the encapsulation element at the third surface. The encapsulation element at least partially defines a second portion of the first surface that is other than the first portion and has an area sized to accommodate an entire area of a microelectronic element. Some conductive elements are at the second portion and configured for connection with such microelectronic element. | 11-19-2015 |
20150334837 | WIRING BOARD - To provide a wiring board ensuring adhesion strength of a connecting terminal to reduce the connecting terminal from being fallen over or peeled off under fabrication process. The wiring board according to the present invention includes a laminated body where one or more layer of each of an insulating layer and a conductor layer are laminated. The wiring board includes a plurality of connecting terminals formed separately from one another on the laminated body and a filling member filled up between the plurality of connecting terminals. The filling member is filled up to a position lower than a height of the plurality of connecting terminals. The connecting terminals has a cross section with a trapezoidal shape where a width of a first principal surface on a side contacting the laminated body is wider than a width of a second principal surface facing the first principal surface. | 11-19-2015 |
20150334846 | ELECTRONIC COMPONENT MODULE - An electronic component module includes a substrate, an electronic component mounted on the substrate, and a resin sealing portion that seals the electronic component and covers a principal surface of the substrate. The resin sealing portion includes a film-shaped resin layer that covers upper and side surfaces of the electronic component and the principal surface of the substrate, and an embedding resin layer that covers the film-shaped resin layer. The embedding resin layer has a smaller coefficient of linear expansion than that of the film-shaped resin layer. A portion of the film-shaped resin layer covering the side surfaces has a smaller thickness than either of a thickness of a portion of the film-shaped resin layer covering the upper surface and a thickness of a portion of the film-shaped resin layer covering the principal surface. | 11-19-2015 |
20150334850 | METHOD OF MANUFACTURING WIRING SUBSTRATE, AND WIRING SUBSTRATE - A method of manufacturing a wiring substrate according to the present invention includes a step of forming a wiring layer including connection terminals on a first insulating layer; a step of forming a second insulating layer on the wiring layer and on the first insulating layer; a step of forming electrically insulative dummy portions separated from the wiring layer on the first insulating layer through patterning of the second insulating layer; a step of forming a third insulating layer on the wiring layer, on the dummy portions, and on the first insulating layer; and a step of forming openings in the third insulating layer for exposing the connection terminals in such a manner that upper end portions of the connection terminals protrude from the third insulating layer, and lower end portions of the connection terminals are embedded in the third insulating layer. | 11-19-2015 |
20150340771 | TERMINAL CONNECTION STRUCTURE WITH ELEVATED TERMINALS - A terminal connection structure includes a first connection and a second connection connected to each other through an anisotropic conductive film. At least one of the first and second connections comprises terminals arranged side by side at an end of a wiring pattern formed between base and cover insulating layers to expose outside the cover insulating layer, and a support portion protruding relative to a part of the base insulating layer in a surrounding area of a respective one of the terminals. | 11-26-2015 |
20150342029 | COATING SYSTEM WITH ELECTROSTATIC DISCHARGE PROTECTION - A coating system on a substrate for the protection against electrostatic discharge, includes in the following order a) an undercoat on the substrate, b) a non-dissipative synthetic resin layer and c) a dissipative synthetic resin layer having a resistance to ground according to VDE-0100-410 of at least 100 kohm, wherein a grounding device for grounding the coating system is arranged between the dissipative synthetic resin layer and the non-dissipative synthetic resin layer. The coating system can be a floor coating system. In this way, systems having low TVOC emission can be formed. This system structure is also suitable for the simple conversion of existing, purely insulating coating structures into systems with ESD capability, and the system structure can be very easily renewed if renovation is required because of wear. | 11-26-2015 |
20150342039 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an inner conductive-circuit layer, an insulation layer structure including a first insulation layer laminated on inner conductive-circuit layer and a second insulation layer laminated on the first insulation layer, and an outermost conductive-circuit layer laminated on the insulation layer structure and including connection portions such that the connection portions are positioned to mount a component on the insulation layer structure. The second insulation layer is interposed between the first insulation layer and the outermost conductive-circuit layer and has a thickness which is smaller than a thickness of the first insulation layer such that an outer surface of the second insulation layer on an outermost conductive-circuit-layer side is flatter than an inner surface of the second insulation layer on a first insulation-layer side. | 11-26-2015 |
20150342041 | CIRCUIT BOARD - The present disclosure is directed to a circuit board having a first imaged metal layer, a first electrically insulating layer, a second imaged metal layer, a polyimide bondply comprising a polyimide derived from 80 to 90 mole % 3,3′,4,4′-biphenyl tetracarboxylic dianhydride, 10 to 20 mole % 4,4′-oxydiphthalic anhydride and 100 mole % 2,2′-bis(trifluoromethyl) benzidine, a third imaged metal layer, a second electrically insulating layer and a fourth imaged metal layer. | 11-26-2015 |
20150342054 | EMBEDDED CORELESS SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - Embodiments of the invention provide an embedded coreless substrate, and a method for manufacturing the same. According to an embodiment of the present invention, an embedded coreless substrate includes an insulating layer, a conductive pattern including a plurality of circuit pattern layers formed in(on) the insulating layer and a plurality of vias for vertically connecting the circuit pattern layers, and at least one embedded device, which is partially embedded in the insulating layer and an outer circuit pattern layer among the plurality of circuit pattern layers and of which an electrode in an embedded portion is partially or entirely covered with the outer circuit pattern layer to fix the embedded portion, is provided. Further, a method for manufacturing an embedded coreless substrate is provided. | 11-26-2015 |
20150359085 | FLEXIBLE SUBSTRATE - A flexible substrate includes a base layer, a metallic layer, a solder mask layer and an identifying code, the metallic layer is disposed at a first surface of the base layer, the metallic layer comprises a plurality of traces and at least one bottom block used for defining marked position, wherein the traces and the at least one bottom block are covered with the solder mask layer, wherein above the perpendicular direction of the at least one bottom block of the metallic layer, a pre-marked area is defined on an exposing surface of the solder mask layer and by an outlined edge of the at least one bottom block, and the identifying code is formed within the pre-marked area of the solder mask layer. | 12-10-2015 |
20150364405 | WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A wiring substrate includes a first wiring layer including a first wiring part having a first wiring interval and a second wiring part having a second wiring interval wider than the first wiring interval, a metal plane layer formed on a portion of a first insulation layer formed on the first wiring layer, the first wiring part being located below the portion, a second insulation layer formed on the first insulation layer and the metal plane layer and having a first via hole and a second via hole, a second wiring layer formed on the second insulation layer and connected to the first wiring layer via a first via conductor formed in the first via hole, and a third wiring layer formed on the second insulation layer and connected to the metal plane layer via a second via conductor formed in the second via hole. | 12-17-2015 |
20150366051 | Printed Circuit Board - A printed circuit board comprising conductive layers separated by insulation layers of dielectric material, at least one conductive layer being patterned and having at least one signal line embedded in insulation material. The at least one signal line is covered by a dielectric film, followed by a thin conductive layer, whereby the dielectric film covers at least one surface and both sides of the at least one signal line and the thin conductive layer extends, separated by the dielectric film, over the at least one surface of the signal line and at least partially over the height of both sides of the signal line. | 12-17-2015 |
20150372403 | PRINTED CIRCUIT BOARD COMPRISING BLIND PRESS-FIT VIAS - An apparatus comprises a printed circuit board (PCB) having a first surface and a second surface, a plurality of blind press-fit vias penetrating the first surface and extending partially through the PCB toward the second surface, the blind press-fit vias configured to receive press-fit connectors of at least one component to be connected to the PCB, and a plurality of electrical connectors disposed in a region of the second surface opposite the blind press-fit vias and configured to interface with one or more signal processing components disposed on the second surface. | 12-24-2015 |
20150373841 | CORE AND PRINTED CIRCUIT BOARD - A printed circuit board, according to one embodiment, includes: a core having a slope pattern formed on a side surface thereof; a first insulating layer laminated on the core; a second insulating layer laminated on the first insulating layer to cover the side surface of the core; an inner circuit layer and an outer circuit layer respectively formed on the first insulating layer and the second insulating layer; and a solder resist layer laminated on the second insulating layer. | 12-24-2015 |
20150380030 | SUSPENSION BOARD WITH CIRCUIT AND PRODUCING METHOD THEREOF - A suspension board with circuit includes a metal supporting board, an insulating base layer formed on one side of the metal supporting board in a thickness direction thereof, a conductive layer, and an insulating cover layer formed on the one side of the insulating base layer to cover the conductive layer. Either one of the insulating base layer and the insulating cover layer includes an opening extending therethrough in the thickness direction. The conductive layer includes a wire formed on the one side of the insulating base layer, and a connection terminal electrically connected to the wire and exposed from the opening to be capable of electrical connection to an electronic element. The suspension board with circuit further includes a protective layer for protecting the connection terminal exposed from the opening. | 12-31-2015 |
20150382445 | DOUBLE-SIDED FLEXIBLE PRINTED CIRCUIT BOARD INCLUDING PLATING LAYER AND METHOD OF MANUFACTURING THE SAME - Disclosed is a double-sided flexible printed circuit board, including a flexible substrate including at least one via hole and a via formed therein to connect circuit wirings respectively formed on both sides of the substrate; a patterned wiring layer formed by printing a conductive paste composition in a predetermined circuit wiring pattern on each of both sides of the flexible substrate; an electroless metal plating layer formed on the patterned wiring layer; and a metal plating layer additionally formed on the electroless metal plating layer to increase electrical conductivity of a wiring including the patterned wiring layer and the electroless metal plating layer formed on each of both sides of the flexible substrate, wherein the circuit wirings respectively patterned on both sides of the flexible substrate are electrically connected to each other through the via formed in the via hole. Also provided is a method of manufacturing the same. | 12-31-2015 |
20150382446 | FLEXIBLE DISPLAY DEVICE WITH REDUCED BEND STRESS WIRES AND MANUFACTURING METHOD FOR THE SAME - There is provided a flexible display having a plurality of innovations configured to allow bending of a portion or portions to reduce apparent border size and/or utilize the side surface of an assembled flexible display. | 12-31-2015 |
20150382451 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A write wiring trace is formed over insulating layer. A coating layer, being directly in contact with at least a first portion of a surface of the write wiring trace, is formed over the insulating layer to cover the write wiring trace. A connection terminal is formed over the insulating layer to be electrically connected to the write wiring trace and exposed from the coating layer. | 12-31-2015 |
20150382459 | Printed Circuit Board And Method For Fabricating The Same, And Apparatus For Fabricating Printed Circuit Borad - The present disclosure provides a printed circuit board and a method for fabricating the same, and an apparatus for fabricating printed circuit board. The printed circuit board includes a substrate having an upper surface; a first trench in the upper surface of the substrate; a first via formed in the first trench and penetrating through the substrate; and a first conductive layer disposed in the first trench and the first via, the first trench is electrically connect to the first via. A method for fabricating the printed circuit board and an apparatus for fabricating the printed circuit board is also provided. | 12-31-2015 |
20150382460 | PRINTED CIRCUIT BOARD (PCB) WITH WRAPPED CONDUCTOR - A printed circuit board (PCB) includes a wrapped conductor enabling transmission of a radio frequency (RF) signal, the wrapped conductor including a conductor core and a conductive wrap disposed on top and side surfaces of the conductor core. The PCB further includes a top dielectric layer disposed on the conductive wrap of the wrapped conductor, at least partially embedding the wrapped conductor. Resistivity of the conductive wrap is less than resistivity of the conductor core, such that a majority of RF power of the RF signal is propagated through the conductive wrap. | 12-31-2015 |
20160005511 | SLEEVE FOR A POWER CABLE | 01-07-2016 |
20160005685 | WIRING SUBSTRATE - A wiring substrate includes a wiring layer. Metal posts are arranged on the wiring layer. The metal posts are used to mount an electronic component. A protective layer covers a surface of the wiring layer on which the metal posts are arranged. The wiring layer includes a seed layer and a metal plating layer. The metal plating layer has a size that is the same as that of the seed layer in a plan view. The metal posts each include an upper end, which projects from the protective layer, and a lower end, which has a width that is the same as that of the upper end or greater. The protective layer includes a fillet for each metal post. The fillet extends toward an upper end surface of the corresponding metal post and contacts a side surface of the corresponding metal posts. | 01-07-2016 |
20160007448 | S-Shaped Ceramic Feedthrough - An electrical interconnect has a non-planar ceramic substrate with opposing first and second ends. A first conductive layer having first and second opposing sides is disposed within the ceramic substrate with one of the first and second opposing sides exposed at the first end and one of the first and second opposing sides exposed at the second end. The electrical interconnect is useful to join an integrated circuit in a hybrid package to a circuit board in high frequency communication applications. | 01-07-2016 |
20160013125 | INTEGRATED DEVICE COMPRISING COAXIAL INTERCONNECT | 01-14-2016 |
20160014907 | MANUFACTURING METHOD OF SUBSTRATE STRUCTURE, SUBSTRATE STRUCTURE AND METAL COMPONENT | 01-14-2016 |
20160020164 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME - A wiring substrate includes a first outermost conductor layer, a first outermost insulating layer covering the first conductor layer, a second outermost conductor layer formed on opposite side of the first conductor layer, and a second outermost insulating layer covering the second conductor layer. The first insulating layer has first openings such that the first openings are exposing first conductor pads including portions of the first conductor layer, the second insulating layer has second openings such that the second openings are exposing second conductor pads including portions of the second conductor layer, each of the first conductor pads has a first plating layer recessed with respect to outer surface of the first insulating layer, and each of the second conductor pads has a second plating layer formed flush with outer surface of the second insulating layer or having bump shape protruding from the outer surface of the second insulating layer. | 01-21-2016 |
20160021743 | CORELESS PACKAGING SUBSTRATE AND FABRICATION METHOD THEREOF - A coreless packaging substrate is provided, which includes: a dielectric layer having opposite first and second surfaces; a first circuit layer embedded in the dielectric layer and exposed from the first surface of the dielectric layer, wherein the first circuit layer has a plurality of first conductive pads; a plurality of protruding elements formed on the first conductive pads, respectively, wherein each of the protruding elements has contact surfaces to be encapsulated by an external conductive element; a second circuit layer formed on the second surface of the dielectric layer; and a plurality of conductive vias formed in the dielectric layer for electrically connecting the first circuit layer and the second circuit layer. The present invention strengthens the bonding between the first conductive pads and the conductive elements due to a large contact area between the protruding elements and the conductive elements. | 01-21-2016 |
20160021755 | CHIP EMBEDDED SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a chip embedded substrate, which includes a substrate formed by alternately stacking an insulation layer and a circuit layer and an embedded chip equipped with a connection terminal and mounted inside the substrate, wherein the connection terminal is protruded from the insulation layer placed on the outermost layer of the substrate, and a connection surface to be connected to an electronic component is exposed to the outside. | 01-21-2016 |
20160021758 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an insulation layer, a first conductive layer embedded into first surface of the insulation layer, a second conductive layer formed on second surface of the insulation layer, a via conductor penetrating through the insulation layer and electrically connecting the first and second layers, and a solder-resist layer covering the first layer and having an opening structure forming an exposed structure of the first layer. The exposed structure is formed to connect an electronic component to the first layer, and the first layer has a barrier-metal layer and a metal layer on the first layer such that the barrier-metal layer is on surface of the first layer and includes metal different from metal forming the metal layer and that the metal layer is on surface of the barrier-metal layer in the exposed structure and protruding from the first surface of the insulation layer. | 01-21-2016 |
20160021759 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a insulation layer, a first conductive layer embedded into first surface of the insulation layer and having surface exposed on the first surface of the insulation layer, a second conductive layer formed on second surface of the insulation layer and protruding from the second surface of the insulation layer, a via penetrating through the insulation layer and electrically connecting the first and second conductive layers, a solder-resist layer covering the first conductive layer and having an opening structure forming an exposed structure of the first conductive layer, and a metal layer formed on the exposed structure and protruding from the first surface of the insulation layer. The exposed structure of the first conductive layer includes pads positioned to mount an electronic component to the first conductive layer, and the metal layer has a solder layer formed on the metal layer and having a flat surface. | 01-21-2016 |
20160029482 | DEVICE COMPONENTS WITH SURFACE-EMBEDDED ADDITIVES AND RELATED MANUFACTURING METHODS - Active or functional additives are embedded into surfaces of host materials for use as components in a variety of electronic or optoelectronic devices, including solar devices, smart windows, displays, and so forth. Resulting surface-embedded device components provide improved performance, as well as cost benefits arising from their compositions and manufacturing processes. | 01-28-2016 |
20160029492 | STRUCTURE, WIRELESS COMMUNICATION DEVICE AND METHOD FOR MANUFACTURING STRUCTURE - A first resin layer ( | 01-28-2016 |
20160035661 | SUPPORT MEMBER, WIRING SUBSTRATE, METHOD FOR MANUFACTURING WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - A wiring substrate includes a support member, and a wiring member formed on one side of the support member. The support member includes metal foils and at least one resin layer alternately layered, so that one of the metal foils is provided as a first outermost layer on the one side of the support member and another one of the metal foils is provided as a second outermost layer on another side of the support member. The first outermost layer includes thick and thin foils that are peelably adhered. The thick foil contacts the at least one resin layer. One surface of the thin foil faces an outer side of the support member. The wiring member includes wiring layers and an insulating layer alternately layered on the thin foil. The number of the metal foils and the number of the wiring layers are the same. | 02-04-2016 |
20160037624 | FLEXIBLE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - A flexible printed circuit board and a manufacturing method thereof are disclosed. The flexible printed circuit board in accordance with an aspect of the present invention includes: a base board including a flexible region; an inner circuit layer formed on the base board; a flexible laminate laminated on the base board and having a portion thereof removed, the portion having been laminated on the flexible region; and an outer circuit layer formed on the flexible laminate. The flexible laminate is formed by having an adhesive layer, a polyimide layer and a copper foil layer sequentially laminated and is arranged and laminated in such a way that the adhesive layer faces the base board. | 02-04-2016 |
20160037631 | DISPLAY APPARATUS WITH NARROW BEZEL - This disclosure describes a display having a substrate including a surface and a first plurality of routing lines on the surface. Each of the first plurality of routing lines is separated from an adjacent routing line by at least a first distance. The display also includes a interposer that is bonded to the surface. The interposer includes a first interface that connects the first plurality of conductive routing lines with the interposer. The interposer also includes a plurality of interposer routing lines that are connected to the first interface. Each of the plurality of interposer routing lines is separated from an adjacent interposer routing line by at least a second distance where the second distance is less than the first distance. | 02-04-2016 |
20160043025 | PACKAGE SUBSTRATE AND ITS FABRICATION METHOD - This disclosure provides a package substrate and its fabrication method. The package substrate includes: a carrier; a first wiring layer formed on the carrier; a conductive pillar layer having a plurality of metal pillars on the first wiring layer; a molding compound layer formed on the first wiring layer, covering all the first wiring layer and the metal pillars, and exposing one end face of each metal pillar; a second wiring layer formed on the molding compound layer and the exposed end faces of the metal pillars; and a protection layer formed on the second wiring layer. | 02-11-2016 |
20160044780 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes an insulating layer, a first conductor layer embedded into a first surface of the insulating layer and including connecting portions to connect an electronic component, a second conductor layer projecting from a second surface of the insulating layer, a solder resist layer covering the first conductor layer and having an opening structure exposing the connecting portions, a barrier metal layer formed on the connecting portions such that the barrier layer is projecting from the first surface of the insulating layer, and metal posts formed on the barrier layer such that the metal posts are positioned on the connecting portions, respectively. Each metal post has width which is greater than width of a respective connecting portion, and the barrier metal layer includes a metal material which is different from a metal material forming the metal posts and a metal material forming the first conductor layer. | 02-11-2016 |
20160044782 | MULTILAYER WIRING SUBSTRATE, MANUFACTURING METHOD THEREFOR, AND SUBSTRATE FOR PROBE CARD - A multilayer wiring substrate that can realize a higher-density wiring structure is obtained. Provided is a multilayer wiring substrate, where a multilayer body including a first insulating layer and a second insulating layer stacked on the bottom surface of the first insulating layer includes printed wiring electrodes; the printed wiring electrodes are formed by printing with and sintering conductive paste; the printed wiring electrodes respectively include first wiring electrode portions located on the second insulating layer and second wiring electrode portions respectively joined to first wiring electrode portions; and the second wiring electrode portions respectively extend into through holes and, further, are exposed at the top surface of the first insulating layer. | 02-11-2016 |
20160044788 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF - There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer. | 02-11-2016 |
20160044789 | WIRING BOARD WITH CAVITY FOR BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A wiring board with a cavity for a built-in electronic component includes a conductor layer including a conductor circuit layer and a plane layer, and an insulating layer laminated on the conductor layer and having a cavity such that the cavity is forming an exposed portion of the plane layer and formed to mount a built-in electronic component on the exposed portion of the plane layer. The plane layer has a recess structure formed in an outer peripheral portion in the exposed portion of the plane layer. | 02-11-2016 |
20160050755 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - There are provided a printed circuit board including: an insulation layer in which a via hole is formed; vias formed in the via hole; first circuit patterns formed below the insulation layer and electrically connected to the vias; and second circuit patterns formed on the insulation layer to be bonded to the vias; wherein the via has a diameter smaller than that of the via hole, and a method of manufacturing a printed circuit board. | 02-18-2016 |
20160050761 | SUBSTRATE STRUCTURE AND METHOD OF MANUIFACTURING THE SAME - A method of manufacturing a substrate structure is provided. An insulation substrate having an upper surface is provided. A portion of the upper surface of the insulation substrate is irradiated by a first laser beam so as to form a first intaglio pattern. The first laser beam is IR laser beam or fiber laser beam. The first intaglio pattern has a modification surface. A first metal layer is formed on the upper surface of the insulation substrate, and covers the upper surface of the insulation layer and the modification surface of the first intaglio pattern, and fills up the first intaglio pattern. A grinding process is performed on the first metal layer so as to expose the upper surface of the insulation substrate and define a first patterned circuit layer. A first upper surface of the first patterned circuit layer is aligned with the upper surface of the insulation substrate. | 02-18-2016 |
20160062242 | METHOD FOR MANUFACTURING SUBSTRATE HAVING CONCAVE PATTERN, COMPOSITION, METHOD FOR FORMING CONDUCTIVE FILM, ELECTRONIC CIRCUIT AND ELECTRONIC DEVICE - Provided is a method for manufacturing a substrate having a concave pattern to be used for forming a high-definition pattern while suppressing wet-spreading and bleeding of a film-forming ink, provided is a composition to be used for manufacturing the substrate, and provided are a method for forming a conductive film, an electronic circuit, and an electronic device. | 03-03-2016 |
20160064318 | PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE - A package substrate includes an outermost interlayer, an outermost conductive layer including first pads positioned to mount at electronic component and second pads positioned to mount another electronic component, a first conductive layer including first circuits and formed such that the outermost interlayer is on the first conductive layer and that the first circuits are connecting the first and second pads, an inner interlayer formed such that the first conductive layer is on the inner interlayer, a second conductive layer formed such that the inner interlayer is on the second conductive layer, via conductors penetrating through the outermost interlayer and including first via conductors connecting the first conductive layer and the first pads and second via conductors connecting the first conductive layer and the second pads, and third via conductors penetrating through the inner interlayer and positioned such that the first and third via conductors form stacked via conductors. | 03-03-2016 |
20160064319 | WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE - A wiring substrate includes an insulating layer, a wiring layer, a via wiring, and a solder resist layer. The wiring layer includes a pad body that constitutes a part of a pad and a wiring pattern including an upper surface. The pad includes the pad body, a first metal layer formed on an upper surface of the pad body and including an embedded part embedded in the insulating layer and a projecting part including upper and side surfaces and projecting from the upper surface of the insulating layer, and a second metal layer including an upper surface and covering the upper and side surfaces of the projecting part. The upper surface of the pad body and the upper surface of the wiring pattern are on the same plane. The upper surface of the second metal layer is positioned lower than the upper surface of the solder resist layer. | 03-03-2016 |
20160066407 | MICROWIRE CIRCUIT AND DEPOSITION SYSTEM - A microcircuit deposition system incorporates a first printing engine for depositing a dielectric on a substrate. A microwire spooling machine houses a microwire spool and incorporates a tension guide to position a microwire trace onto the dielectric layer. A second printing engine trails the microwire spooling machine to deposit a covering dielectric layer over the microwire trace. | 03-03-2016 |
20160066418 | PART-EMBEDDED CIRCUIT STRUCTURE AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a part-embedded circuit structure includes: forming an inner resist layer with an opening on a base member to expose a portion of the base member; forming an inner wiring layer on the inner resist layer which extends into the opening of the inner resist layer; laminating a dielectric layer on the inner wiring layer; forming an outer wiring layer on the dielectric layer opposite to the inner wiring layer; and removing the base member to expose the inner wiring layer in the opening and the inner resist layer such that a level plane is formed. | 03-03-2016 |
20160066420 | IMPRINTED MICRO-WIRE RIB STRUCTURE - A micro-wire rib structure includes a substrate and a cured layer formed on or over the substrate, the cured layer having a cured-layer surface. A micro-channel is imprinted in the cured layer, the micro-channel having a micro-channel depth, a micro-channel bottom, first and second micro-channel sides, and one or more ribs having opposing rib sides and a rib top defining a rib height less than the micro-channel depth. Each rib is located between the first and second micro-channel sides and extends from the micro-channel bottom toward the cured-layer surface. A cured electrical conductor forming a micro-wire is formed in the micro-channel. The micro-wire extends continuously from the first micro-channel side, over the micro-channel bottom, the rib side(s) and rib top(s) to the second micro-channel side forming a continuous electrical conductor from the first micro-channel side to the second micro-channel side. | 03-03-2016 |
20160066434 | CIRCUIT BOARD AND METHOD OF MANUFACTURING CIRCUIT BOARD - The circuit board provided with a first conductive pattern and a second conductive pattern performed by different types of surface treatments are disclosed. The circuit board in accordance with one embodiment of the present invention forms the first conductive pattern and the second conductive pattern on an insulating layer, wherein the first metal plating layer and the second metal plating layer are formed on the surface of the first conductive pattern, the second metal plating layer is formed on the surface of the second conductive pattern, and the second metal plating layer is made of the material different from that of the first metal plating layer to be exposed to the outside, whereby the pattern pitch is easily reduced, the reduction of the electrical characteristics due to the surface treatment can be minimized and the efficiency of the manufacturing process may be improved. | 03-03-2016 |
20160073516 | INTERPOSER SUBSTRATE AND METHOD OF FABRICATING THE SAME - A method of fabricating an interposer substrate is provided, including: providing a carrier having a first wiring layer and a plurality of conductive pillars disposed on the first wiring layer; forming a first insulating layer on the carrier, with the conductive pillars being exposed from the first insulating layer; forming a second wiring layer on the first insulating layer and the conductive pillars; disposing a plurality of external connection pillars on the second wiring layer; forming a second insulating layer on the first insulating layer, with the external connection pillars being exposed from the second insulating layer; forming at least a trench on the second insulating layer; and removing the carrier. Through the formation of the interposer substrate, which does not have a core layer, on the carrier, a via process is omitted. Therefore, the method is simple, and the interposer substrate thus fabricated has a low cost. The present invention further provides the interposer substrate. | 03-10-2016 |
20160081186 | SUBSTRATE STRUCTURE AND METHOD OF FABRICATING THE SAME - The present invention provides a substrate structure and a method of fabricating the substrate substrure. The method includes: forming a first wiring layer on a first carrier, forming a dielectric layer on the first wiring layer, forming a second wiring layer on the dielectric layer, forming an insulating protection layer on the second wiring layer, forming a second carrier on the insulative protection layer, and remvoing the first carrier. The formation of the second carrier provides the substrate structure with adequate rigidity to avoid breakage or warpage such that the miniaturization requirement can be satisfied. | 03-17-2016 |
20160086879 | PACKAGE SUBSTRATE AND METHOD OF FABRICATING THE SAME - A package substrate includes a substrate body having a first surface and a second surface opposite to the first surface; a first circuit layer formed on the first surface and having first conductive pads; a first dielectric layer formed on the first surface and the first circuit; a second circuit layer formed on the first dielectric layer and having second conductive pads; a third circuit layer formed on the second surface and having third conductive pads; a second dielectric layer formed on the second surface and the third circuit layer; a fourth circuit layer formed on the second dielectric layer and having fourth conductive pads; through holes penetrating through the first and second surfaces, and the first and second dielectric layers; and conductive vias penetrating through the through holes and electrically connected to the first, second, third and fourth conductive pads. | 03-24-2016 |
20160088729 | Multilayer Wiring Substrate - A multilayer wiring substrate includes a number of insulating layers, each insulating layer including a glass ceramic. A number of internal conductor layers are formed between the insulating layers. Via conductors penetrate through the insulating layers and mutually connect the internal conductor layers in different layer locations. Surface conductor layers are formed on an outer surfaces in a lamination direction of the insulating layers. The insulating layers include outside insulating layers and inside insulating layers. A first aspect ratio representing an oblateness and sphericity of an external filler contained in the outside insulating layers is larger than a second aspect ratio representing an oblateness and sphericity of an internal filler contained in the inside insulating layers. A thermal expansion coefficient of the outside insulating layers is smaller than a thermal expansion coefficient of the inside insulating layers. | 03-24-2016 |
20160088732 | TOUCH SENSOR BUILT-IN DISPLAY DEVICE AND TERMINAL CONNECTION STRUCTURE - A terminal connection structure includes plural first connection terminals which are arranged side by side in one direction on a first circuit substrate, and plural second connection terminals which are arranged side by side in the one direction on a second resin circuit substrate overlappingly connected to the first circuit substrate and are respectively connected to the plural first connection terminals. Each of the plural second connection terminals includes plural first wirings extending in a direction crossing the one direction, and a second wiring connected to the plural first wirings and extending in the one direction. The second wiring is provided in a region where the second circuit substrate is overlapped and connected to the first circuit substrate. | 03-24-2016 |
20160088741 | METHOD OF MANUFACTURING A MULTI-LAYER PRINTED CIRCUIT BOARD - A method of manufacturing a multi-layer printed circuit board by bonding together a plurality of circuit board layers, each of which includes a substrate and a conductive circuit pattern on at least one surface of the substrate, includes the steps of: coating the surface of the substrate with a continuous layer of conductive material, masking the layer with a resist, etching away a part of the conductive material so as to obtain the circuit pattern with conductive parts separated by gaps, and filling the gaps with an electrically insulating adhesive material to a level that is at least equal to the thickness of the layer of conductive material. The resist is left on the conductive parts and the adhesive material is selected to be chemically compatible with the resist. | 03-24-2016 |
20160088742 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - A printed circuit board may include: a first circuit layer; a first insulating layer disposed on the first circuit layer; a high-rigidity layer disposed on the first insulating layer; and a second circuit layer disposed on the high-rigidity layer and connected to the first circuit layer by a first via extending through the first insulating layer and the high-rigidity layer, wherein a rigidity of the high-rigidity layer is greater than a rigidity of the first insulating layer. | 03-24-2016 |
20160095212 | TRANSPARENT ELECTRODE AND METHOD FOR MANUFACTURING SAME - The present application relates to a transparent electrode and a method for manufacturing the same. | 03-31-2016 |
20160095215 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A printed wiring board includes a resin insulating layer, and a first conductor layer including a fine wiring pattern and a thick-film wiring pattern. The fine wiring pattern is embedded in the resin insulating layer such that the fine wiring pattern has an exposed surface exposed on a first surface of the resin insulating layer. The thick-film wiring pattern includes an embedded wiring portion and a thick-film wiring portion such that the embedded wiring portion is embedded in the resin insulating layer and the thick-film wiring portion is projecting from the first surface of the resin insulating layer. The embedded wiring portion of the thick-film wiring pattern has a line width which is greater than a line width of the fine wiring pattern. | 03-31-2016 |
20160100481 | ANISOTROPIC CONDUCTIVE FILM, METHOD OF MANUFACTURING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME - There are provided an anisotropic conductive film, a method of manufacturing the same, and a printed circuit board using the same. More specifically, the anisotropic conductive film according to an exemplary embodiment of the present disclosure includes an insulating mattress containing a non-conductive polymer, and a plurality of conductive cylinders formed in a direction from an upper surface to a lower surface of the insulating mattress, containing a conductive polymer. Further, the printed circuit board using the anisotropic conductive film of the present disclosure may prevent open or short between upper circuit patterns and lower circuit patterns, and allow a fine pitch between the circuit patterns, due to the structure of the anisotropic conductive film formed between the substrates. | 04-07-2016 |
20160100487 | MANUFACTURING METHOD AND STRUCTURE OF CIRCUIT BOARD WITH VERY FINE CONDUCTIVE CIRCUIT LINES - A circuit board manufacturing method includes the steps of providing a conductive motherboard; forming a masking layer on the conductive motherboard, and the masking layer having a plurality of recessed portions that form a predetermined circuit pattern; forming a conductive electrode in each recessed portion, and the conductive electrodes together forming a conductive layer; providing a substrate having an adhesive layer provided thereon for sticking to a top of the masking layer and the conductive layer; and separating the substrate, the adhesive layer and the conductive layer from the conductive motherboard and the masking layer to provide a circuit board. The conductive motherboard is repeatedly usable and presents the predetermined circuit pattern through electroforming process, and the circuit pattern can be transferred to the substrate. The whole circuit board manufacturing process is simplified while ensures largely upgraded yield rate of very fine conductive circuit lines on the circuit board. | 04-07-2016 |
20160105950 | Electronic Device Having Structured Flexible Substrates With Bends - A flexible substrate may be provided with an array of holes and conductive traces that extend along the flexible substrate between the holes. The flexible substrate may form part of a display or other component in an electronic device. The conductive traces may be metal traces that have meandering path shapes to resist damage upon bending. A polymer coating may be applied over the metal traces to align a neutral stress plane with the metal traces and to serve as a moisture barrier. The holes may allow the flexible substrate to twist and form a three-dimensional shape as the flexible substrate is bent. A rigid or flexible protective coating may be formed by depositing a liquid polymer precursor on the flexible substrate and curing the liquid polymer precursor. | 04-14-2016 |
20160105954 | SUSPENSION BOARD WITH CIRCUIT - A suspension board with circuit includes a metal supporting board, a first insulating layer including a disposing portion formed at one side in a thickness direction of the metal supporting board, a first conductive layer including a first wire portion formed at the one side of the first insulating layer, a second insulating layer including a covering portion covering the first wire portion, and a second conductive layer including a second wire portion formed at the one side of the second insulating layer and a terminal portion connected to the first or second wire portion. The second insulating layer includes a second terminal supporting portion formed at the other of the terminal portion. The first insulating layer includes a first terminal supporting portion formed at the other side of the second terminal supporting portion. The metal supporting board is not formed at the other side thereof. | 04-14-2016 |
20160105956 | PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME - The present invention provides a printed circuit board includes an insulating member, a first plating layer buried in a bottom region of the insulating member, a second plating layer buried in a top region of the insulating member and a plating via for electrically connecting the first plating layer and the second plating layer by being buried in any one among the top region and the bottom region of the insulating member. | 04-14-2016 |
20160105962 | FLEXIBLE SUBSTRATE AND ELECTRONIC APPARATUS EQUIPPED WITH SAME - A flexible board includes: a base film, on which a wiring pattern is formed; a first cover film, which is located on one surface of the base film; and a second cover film, which is located on the other surface of the base film. The bending portion, which is bent when mounting the flexible board on an electronic apparatus, includes both edges on which the first cover film is formed and a central portion from which the base film is exposed. | 04-14-2016 |
20160105967 | EMBEDDED BOARD AND METHOD OF MANUFACTURING THE SAME - An embedded board includes an insulating layer and an electronic device embedded in the insulating layer. A first circuit pattern is embedded to contact a bottom surface of the insulating layer, and a second circuit pattern protrudes from the bottom surface of the insulating layer. A via is bonded to the device and the second circuit pattern. | 04-14-2016 |
20160105970 | FINE LINE 3D NON-PLANAR CONFORMING CIRCUIT - A method of producing a non-planar conforming circuit on a non-planar surface includes creating a first set of conforming layers. The first set of conforming layers is created by applying an oxide dielectric layer to the surface, applying a conductive material layer to the oxide dielectric layer, applying a resist layer to the conductive material layer, patterning the resist layer according to a desired circuit layout, etching the surface to remove exposed conductive material, and stripping the resist layer. The process may be repeated to form multiple layers of conforming circuits with electrical connections between layers formed by blind microvias. The resulting set of conforming layers can be sealed. | 04-14-2016 |
20160111115 | SUSPENSION BOARD WITH CIRCUIT - A suspension board with circuit includes a metal supporting layer, an insulating base layer on one side thereof in a thickness direction, a conductive pattern disposed on the insulating base layer, an insulating cover layer disposed on the insulating base layer so as to cover the conductive pattern, and a pedestal for supporting a slider which includes a thin pedestal portion. The thin pedestal portion includes a pedestal base layer included in the insulating base layer, a pedestal conductive layer included in the conductive pattern which extends over the pedestal base layer, and a pedestal cover layer included in the insulating cover layer and disposed on the pedestal conductive layer. The conductive pattern includes a first wire placed to extend over the insulating base layer which has a narrower portion, and a dimension of the pedestal conductive layer is 0.5 to 3 times the dimension of the narrower portion. | 04-21-2016 |
20160113110 | PRINTED WIRING BOARD - A printed wiring board includes a substrate, a first conductor layer formed on first surface of the substrate, a second conductor layer formed on second surface of the substrate, a through-hole conductor penetrating through the substrate and connecting the first and second conductor layers, a build-up layer formed on the second surface of the substrate and including conductor layers and insulating layers, and a first insulating layer formed on the first surface of the substrate such that the first insulating layer is covering the first conductor layer on the substrate. The substrate has a cavity penetrating through the first insulating layer and substrate such that the cavity is exposing the build-up layer on the second surface of the substrate, and the substrate and insulating layers in the build-up layer are formed such that difference between thermal expansion coefficients of the substrate and insulating layers is set 15 ppm or less. | 04-21-2016 |
20160113114 | CARRIER SUBSTRATE - A carrier substrate includes a dielectric layer, a first circuit layer, an insulation layer, conductive blocks, and a first conductive structure. The dielectric layer has a first surface, a second surface, and blind vias. The first circuit layer is embedded in the first surface and the blind vias extend from the second surface to the first circuit layer. The insulation layer is disposed on the first surface and has a third surface, a fourth surface, and first openings exposing the first circuit layer. The conductive blocks fill the first openings and connect with the first circuit layer. A top surface of each of the conductive blocks is higher than the third surface of the insulation layer. The first conductive structure includes conductive vias filling the blind vias and a second circuit layer disposed on a portion of the second surface. | 04-21-2016 |
20160118312 | MOLDING COMPOUND SUPPORTED RDL FOR IC PACKAGE - One of the embodiments for a package substrate discloses a molding compound having plurality of metal pillar with middle portion embedded therein; a top end of the metal pillar protrudes above the molding compound; a bottom end of the metal pillar protrudes below the molding compound; a bottom RDL is configured on bottom of the molding compound; the RDL has a plurality of top metal pad and a plurality of bottom metal pad; a density of the plurality of bottom metal pad is higher than the density of the plurality of top metal pad; each metal pillar metal pad is electrically coupled to a corresponding first top metal pad. | 04-28-2016 |
20160120033 | PRINTED WIRING BOARD - A printed wiring board includes a substrate, a first conductor layer formed on first surface of the substrate, a second conductor layer formed on second surface of the substrate, a through-hole conductor penetrating through the substrate and connecting the first and second conductor layers, a build-up layer formed on the second surface of the substrate and including conductor layers, insulating layers and via conductors, and a first insulating layer formed on the first surface the substrate and covering the first conductor layer. The substrate has a cavity penetrating through the first insulating layer and substrate and exposing the build-up layer on the substrate, the via conductors include a lowermost via conductor having a bottom portion exposed at bottom of the cavity, and the bottom portion of the lowermost via conductor is recessed relative to surface of a lowermost insulating layer in the build-up layer at the bottom of the cavity. | 04-28-2016 |
20160128176 | MULTILAYER CIRCUIT BOARD - A multilayer circuit board includes a first substrate and a second substrate in stack. The first substrate is provided with a first pad, a second pad, and a first sub-circuit. The first pad and the second pad are electrically connected to the first sub-circuit. The second substrate has a top surface, a bottom surface, and an opening. The bottom surface of the second substrate is attached to the top surface of the first substrate. The opening extends from the top surface to the bottom surface of the second substrate. The first pad of the first substrate is in the opening of the second substrate; the second pad of the first substrate is not covered by the second substrate. The second substrate further provided with a pad on the top surface and a second sub-circuit electrically connected to the pad of the second substrate. | 05-05-2016 |
20160128180 | MULTI-LAYER PRINTED CIRCUIT BOARDS WITH DIMENSIONAL STABILITY - A multi-layer printed circuit board comprises: a core comprising a core insulation layer and traces formed on two sides of the core insulation layer; a plurality of insulation layers sequentially formed at two sides of the core; and a plurality of trace layers respectively formed between two insulation layers and on the outmost insulation layers; wherein the core insulation layer contains a resin material different from that of the insulation layers, such that the core insulation layer has a dimensional stability superior to that of the insulation layers. | 05-05-2016 |
20160128184 | SUBSTRATE STRUCTURE AND FABRICATION METHOD THEREOF - A method for fabricating a substrate structure is provided, which includes the steps of: disposing at least a strengthening member on a carrier; sequentially forming a first circuit layer and a dielectric layer on the carrier, wherein the strengthening member is embedded in the dielectric layer; forming a second circuit layer on the dielectric layer; removing the carrier; and forming an insulating layer on the first circuit layer and the second circuit layer. The strengthening member facilitates to reduce thermal warping of the substrate structure. | 05-05-2016 |
20160130471 | STRETCHABLE POLYMER THICK FILM COMPOSITIONS FOR THERMOPLASTIC SUBSTRATES AND WEARABLES ELECTRONICS - This invention is directed to stretchable polymer thick film compositions useful for wearable garments. More specifically, the polymer thick film may be used in applications where significant stretching is required, particularly on substrates that can be highly elongated. A particular type of substrate is a thermoplastic polyurethane substrate. | 05-12-2016 |
20160135285 | FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - A flexible printed circuit board includes a substrate, a circuit pattern formed on the substrate, and a protective coating layer formed on the substrate by applying and curing a coating solution to cover and protect the circuit pattern. A method for manufacturing forming a circuit pattern on a substrate and forming a protective coating layer for covering and protecting the circuit pattern by applying a coating solution on the substrate. The circuit pattern may be securely attached to the substrate, and damage and deformation of the circuit pattern due to repeated bending or warping of the substrate may be prevented, ultimately improving operational reliability. | 05-12-2016 |
20160135289 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board include a glass plate, an insulating member penetrating through the glass plate, insulating layers disposed on a first surface and a second surface of the glass plate, and a via through the insulating member. | 05-12-2016 |
20160135291 | PRINTED CIRCUIT BOARD STRUCTURE - A printed circuit board structure includes a main body and a connecting interface. The connecting interface connects and is located at a side of the main body. The connecting interface includes conductive layers and insulation layers. The conductive layers at least include a first, a second, a third, a fourth conductive layer. The insulation layers at least include a first, a second, a third insulation layers. The insulation layers and the conductive layers are alternately disposed. The first insulation layer is located between the first conductive layer and the second conductive layer. The first conductive layer and the second conductive layer are partially overlapped in their orthographic projections on the first insulation layer. The second insulation layer is located between the second conductive layer and the third conductive layer. The third insulation layer is located between the third conductive layer and the fourth conductive layer. | 05-12-2016 |
20160135294 | PREPREG AND METHOD FOR MANUFACTURING THE SAME - A prepreg includes: a core material having a first resin material impregnated therein; and second resin materials laminated above and below the core material and including a non-linear joint interface formed with the first resin material. | 05-12-2016 |
20160143142 | ELEMENT EMBEDDED PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - An element embedded printed circuit board includes: a substrate including an insulation layer, a first circuit layer formed on a first surface of the insulation layer, and a second circuit layer formed on a second surface of the insulation layer; and an element including an electrode part and embedded in the insulation layer, wherein the electrode part is in contact with the first circuit layer. | 05-19-2016 |
20160143149 | SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS - Disclosed is a semiconductor package structure and manufacturing method. The semiconductor package structure includes a first dielectric layer, a second dielectric layer, a component, a patterned conductive layer and at least two conductive vias. The first dielectric layer has a first surface and a second surface opposite the first surface. The second dielectric layer has a first surface and a second surface opposite the first surface. The second surface of the first dielectric layer is attached to the first surface of the second dielectric layer. A component within the second dielectric layer has at least two electrical contacts adjacent to the second surface of the first dielectric layer. The patterned conductive layer within the first dielectric layer is adjacent to the first surface of the first dielectric layer. The conductive vias penetrate the first dielectric layer and electrically connect the electrical contacts with the patterned conductive layer. | 05-19-2016 |
20160150633 | MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR - A printed circuit board includes a plurality of layers including attachment layers and routing layers; and via patterns formed in the plurality of layers, each of the via patterns comprising: dual diameter first and second signal vias forming a differential signal pair, the first and second signal vias being configured to accept contact tails of signal conductors of a connector; dual diameter ground shadow vias adjacent to each of the first and second signal vias, wherein the dual diameter shadow ground vias have a reversed diameter configuration with respect to the dual diameter first and second signal vias; and ground vias configured to accept contact tails of ground conductors of the connector. | 05-26-2016 |
20160150635 | FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME - The flexible printed circuit board includes a base layer, a first circuit layer and a second circuit layer, the first circuit and the second circuit layer formed on both sides of the base layer; conducting holes extending through the base layer and the first copper layer, the conducting holes include annular copper ring embedded in the first circuit layer. A height difference between a surface of the annular copper ring and a surface of the first circuit layer is in a range from 0 to 3 micrometers. A method for manufacturing the flexible printed circuit board is also provided. | 05-26-2016 |
20160150639 | MATING BACKPLANE FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTOR - A printed circuit board includes a plurality of layers including attachment layers and routing layers; first and second signal vias forming a differential signal pair, the first and second signal vias extending through the attachment layers and connecting to respective signal traces on a breakout layer of the routing layers; an antipad of a first type around and between the first and second signal vias in one or more of the attachment layers; and antipads of a second type around the first and second signal vias in at least one routing layer adjacent to the breakout layer. | 05-26-2016 |
20160150643 | CIRCUIT BOARD - A circuit board includes a multi-layer structure, a ceramic member, and a first conductive layer. The multi-layer structure has a thru-hole penetrating two opposite board surfaces thereof. The multi-layer structure includes a plurality of stacked plates and an adhesive connecting any two stacked plates. The ceramic member is arranged in the thru-hole of the multi-layer structure, and a surface of the ceramic member is approximately coplanar with a board surface of the multi-layer structure. The adhesive is adhered on the lateral surface of the ceramic member for connecting the ceramic member and the plates. The first conductive layer is formed on the board surface of the multi-layer structure and the surface of the ceramic member. Thus, the circuit board of the instant disclosure can be applied to a high-heat-generating product and is different from a conventional circuit board. | 05-26-2016 |
20160150651 | CIRCUIT BOARD WITH EMBEDDED PASSIVE COMPONENT AND MANUFACTURING METHOD THEREOF - The present disclosure relates to a semiconductor device substrate and a method for making the same. The semiconductor device substrate includes a first dielectric layer, a second dielectric layer and an electronic component. The first dielectric layer includes a body portion, and a wall portion protruded from a first surface of the body portion. The wall portion has an end. The second dielectric layer has a first surface and an opposing second surface. The first surface of the second dielectric layer is adjacent to the first surface of the body portion. The second dielectric layer surrounds the wall portion. The end of the wall portion extends beyond the second surface of the second dielectric layer. The electronic component includes a first electrical contact and a second electrical contact. At least a part of the electronic component is surrounded by the wall portion. | 05-26-2016 |
20160157340 | CIRCUIT BOARD STRUCTURE WITH EMBEDDED FINE-PITCH WIRES AND FABRICATION METHOD THEREOF | 06-02-2016 |
20160157341 | MULTILAYER CERAMIC SUBSTRATE AND MANUFACTURING THEREOF | 06-02-2016 |
20160157346 | Printed Circuit Board, Ball Grid Array Package and Wiring Method of Printed Circuit Board | 06-02-2016 |
20160163626 | INTERPOSER SUBSTRATE AND METHOD OF FABRICATING THE SAME - The invention provides an interposer substrate and a method of fabricating the same. The method includes: etching a carrier to form a recessed groove thereon; filling a dielectric material in the recessed groove to form a first dielectric material layer, or forming a patterned first dielectric material layer on the carrier; forming a first wiring layer, a first conductive block and a second dielectric material layer on the carrier and the first dielectric material layer sequentially, with the first wiring layer and the first conductive block embedded in the second dielectric material layer; and forming a second wiring layer and a second conductive block on the second dielectric material layer. A coreless interposer substrate having fine pitches is thus fabricated. | 06-09-2016 |
20160163627 | INTERPOSER SUBSTRATE AND METHOD OF FABRICATING THE SAME - An interposer substrate includes a first insulating layer having opposite first and second surfaces; a first wiring layer formed in the first insulating layer, with a surface of the first wiring layer exposed from the first surface; first conductive pillars formed in the first insulating layer; a second wiring layer formed on the second surface; second conductive pillars formed on the second wiring layer; a second insulating layer formed on the second surface and covering the second conductive pillars and the second wiring layer, with end surfaces of the second conductive pillars exposed from the second insulating layer; and immersion tin layers formed on the first wiring layer and the end surfaces of second conductive pillars. The immersion tin layers are used as surface processing layers to be applied to products having ball pads that need to be exposed extensively. A method for fabricating the interposer substrate is also provided. | 06-09-2016 |
20160174365 | WIRING BOARD WITH DUAL WIRING STRUCTURES INTEGRATED TOGETHER AND METHOD OF MAKING THE SAME | 06-16-2016 |
20160174372 | PRINTED WIRING BOARD | 06-16-2016 |
20160174390 | SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF | 06-16-2016 |
20160183373 | HIGH DENSITY AC COUPLING/DC BLOCKING PIN-FIELD ARRAY | 06-23-2016 |
20160192491 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating layer disposed on the substrate and the first circuit layer, a second circuit layer disposed on an upper surface of the insulating layer, and a via configured to connect between the first circuit layer and the second circuit layer, and a lower part of the via is in contact with the upper surface of the substrate. | 06-30-2016 |
20160198563 | CONTACT ARRANGEMENT FOR A MULTI-LAYER CIRCUIT BOARD | 07-07-2016 |
20160198564 | LAYERED BODY WITH SUPPORT SUBSTRATE, METHOD FOR FABRICATING SAME, AND METHOD FOR FABRICATING MULTI-LAYER WIRING SUBSTRATE | 07-07-2016 |
20160198571 | TRANSPARENT ELECTRODE AND MANUFACTURING METHOD THEREOF | 07-07-2016 |
20160200949 | CURABLE ISOBUTYLENE ADHESIVE COPOLYMERS | 07-14-2016 |
20160204053 | SEMICONDUCTOR PACKAGE | 07-14-2016 |
20160205773 | CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME | 07-14-2016 |
20160205779 | Connection Structure of Conductors and Display Apparatus | 07-14-2016 |
20160255715 | CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME | 09-01-2016 |
20160381792 | PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A printed circuit board in accordance with an embodiment includes a core layer, a photo imagable dielectric layer, and an inner circuit layer. The core layer includes a core stiffener layer, a first metal layer formed on an upper surface of the core stiffener layer, and a second metal layer formed on a lower surface of the core stiffener layer. The photo imagable dielectric layer is formed on an upper surface and a lower surface of the core layer. The inner circuit layer is formed on the photo imagable dielectric layer. | 12-29-2016 |
20160381793 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board of the present disclosure includes an insulating layer and a wiring conductor. The wiring conductor is buried in an insulating layer in such a manner as to have a top surface exposed to a surface of the insulating layer. The wiring conductor includes, at a portion buried in the insulating layer, a wiring level difference part or a wiring inclined part having a width larger than a width of the top surface. | 12-29-2016 |
20160381797 | CAPACITOR STRUCTURE AND CAPACITOR USING THE SAME - Embodiments of the present invention provide a capacitor structure. The capacitor structure comprises: a first plurality of metal plates that are vertically disposed with their surfaces being parallel to each other; a second plurality of metal plates that are interdigitated with the first plurality of metal plates with their surfaces being parallel to the surfaces of the first plurality of metal plates; a first port electrically connected to each of the first plurality of metal plates through a first plurality of port connecting strips and via a first port via interconnection; and a second port electrically connected to each of the second plurality of metal plates through a second plurality of port connecting strips and via a second port via interconnection. The first plurality of metal plates is connected together at an end of each of the first plurality of metal plates opposite to the end at which the first port is connected. The second plurality of metal plates is connected together at an end of each of the second plurality of metal plates opposite to the end at which the second port is connected. A direction in which the first plurality of port connecting strips extends is in a certain angle with the direction in which the second plurality of port connecting strips extends. | 12-29-2016 |
20160381810 | FILM COMPOSITE HAVING ELECTRICAL FUNCTIONALITY FOR APPLYING TO A SUBSTRATE - A film composite with electrical functionality for application on a substrate includes at least one conductive structure, a first bonding coat, a film layer and a second bonding coat. The first bonding coat is disposed on an underside of the at least one conductive structure, wherein the first bonding coat has an adhesive effect for application of the at least one conductive structure on the substrate. The second bonding coat is disposed between an upper side of the at least one conductive structure and the film layer. The second bonding coat has an adhesive effect, by which the film layer adheres to the at least one conductive structure. | 12-29-2016 |
20170238428 | CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME | 08-17-2017 |
20190150273 | BACKPLANE FOOTPRINT FOR HIGH SPEED, HIGH DENSITY ELECTRICAL CONNECTORS | 05-16-2019 |
20220141953 | PRINTED CIRCUIT BOARD - A printed circuit board includes: a first insulating layer; a first wiring layer at least partially buried in the first insulating layer; a second insulating layer disposed on an upper surface of the first insulating layer; a second wiring layer at least partially buried in the second insulating layer; and a cavity penetrating through the second insulating layer and a portion of the first insulating layer and exposing a portion of the upper surface of the first insulating layer as a bottom surface of the cavity. The first wiring layer includes a wiring pattern at least partially exposed from the first insulating layer by the cavity, an upper surface of the wiring pattern has a step structure with the upper surface of the first insulating layer exposed by the cavity, and a lower surface of the wiring pattern is coplanar with a lower surface of the first insulating layer. | 05-05-2022 |