Entries |
Document | Title | Date |
20080202726 | Fastening structure for combining heat conducting pipe and fins - A fastening structure of a heat conducting pipe and a plurality of fins is provided in a cooler containing a plurality of fins. Each of the surfaces of the fins includes at least a through hole and a through slot connecting to the through hole. The heat conducting pipe penetrates through the through holes of the fins. The drifts located at the end portion of the mold pressing piece are allowed to pass through the through slots to stamp the connection positions on surface of the heat conducting pipe for shaping the indentation portions. The indentation portions compress the heat conducting pipe to be combined tightly with the through holes so that the fins and the heat conducting pipe are combined tightly for strengthening the combination of the fins and the heat conducting pipe effectively, and preventing the heat conducting pipe from being damaged so as to raise the quality and heat conductivity of the products. | 08-28-2008 |
20080210404 | COOLING DEVICE WITH RINGED FINS - A cooling device includes a heat-conducting base, two fin sets, and a heat pipe. The two fin sets are respectively constructed by a metallic stripe that is periodically folded and is arranged as a ring type. The heat pipe has a heated section that is thermally connected to the heat-conducting base, and a condensing section that is extended from the heat-conducting base is further formed as a flat shape, on which two oppositely flat faces are formed. The two flat faces of the condensing section of the heat pipe are respectively contacted closely with the two fin sets by being sandwiched therein. In such case, the contact area between the condensing section of heat pipe and the fin sets is enhanced, thus that the heat-conducting effect is promoted significantly. | 09-04-2008 |
20080216990 | HEAT DISSIPATION DEVICE WITH A HEAT PIPE - A heat dissipation device comprises at least two heat pipes ( | 09-11-2008 |
20080216991 | COOLING DEVICE FOR INFORMATION EQUIPMENT - A cooling device for an information equipment, comprises a heat receiving member composed of a base member thermally connected to a heat generating element, and a casing member, which are defined therebetween a closes space in which a coolant can flow, the base member is integrally incorporated with fins in a predetermined zone of its planar surface on the side remote from the heat generating element thermally connected to the base member, and the base member has a thickness which is thinner in the zone where the fins are formed than in the other zone where no fins are formed. With this configuration, the heat receiving member which can enhance the heat-exchanging performance of a liquid cooling system, can be manufactured at a low cost. | 09-11-2008 |
20080216992 | HEAT DISSIPATING DEVICE - A heat dissipating comprising: a plurality of fins; an upper side and a lower side of each fin being folded with folding sheets; each of two sides of each sheet being protruded with a buckling ear; the buckling ear having a T shape; a hole being formed on the folding sheet and being located behind the buckling ear; the shape of the hole being corresponding to that of the buckling ear; a tenon being formed at two lateral walls of the hole and a middle section of the tenon being protruded with a semi-round section. In assembly, the buckling ears of one fin are buckled to the holes of another fin so as to assembly two fins together; the tenon serves to buckle the buckling ear to the hole; more fins are assembled by the same way; the heat dissipating device can be assembled to a computer central processing unit. | 09-11-2008 |
20080216993 | HEAT DISSIPATING DEVICE - A heat dissipating device comprises a plurality of fins; an upper side and a lower side of each fin being folded with folding sheets; each of two sides of each sheet being protruded with a buckling ear; the buckling ear being formed by a round sheet and a support plate; the support plate being connected to the round sheet; a hole being formed on the folding sheet and being located behind the buckling ear; a tenon being formed at two lateral walls of the hole and a middle section of the tenon being protruded with a semi-round section. In assembly, the buckling ears of one fin are buckled to the holes of another fin so as to assembly two fins together; the tenon serves to buckle the buckling ear to the hole; more fins are assembled by the same way. | 09-11-2008 |
20080223551 | MANUFACTURING METHOD OF FIN UNIT - In a manufacturing method of a fin unit for a heat sink for dissipating a heat from a heat source, the fin unit includes a plurality of fins radially arranged about its center axis, and a fin supporting portion connecting inner ends of the fins and supporting the fins. First, metal is heated. The heated metal is extruded and/or drawn through a die to obtain a metal body. One of the die and the metal body obtained through the die is rotated relative to the other about a center axis of a die hole of the die. The metal body is then cut, thereby obtaining the fin unit. | 09-18-2008 |
20080236788 | Thermosiphon for laptop computer - A heat exchanger assembly for cooling an electronic element includes an oblong condensing tube extending between ends to define an upper chamber downwardly bowed through an upwardly extending arc and a lower chamber upwardly bowed through a downwardly extending arc for dissipating heat. A continuous sheet extends in v-shaped fins between and engaging said arcs of said chambers. The internal fins extend from a center axis of the tube to reverse bends defining the opposite ends of the tube. A continuous sheet extending in sinuous corrugations extends around the exterior of the endless loop between opposite sides of a heat transfer area, which receives the electronic element. | 10-02-2008 |
20080236789 | High performance compact thermosiphon with integrated boiler plate - A thermosiphon cooling assembly includes a plurality of hairpin condenser tubes that extend into openings of a boiling chamber for collection of refrigerant vapor from a boiler housing. The distal ends of the tubes extend into the chamber from a cover the least distance midway between the ends of the boiler housing and increase in distance in opposite directions toward the ends. The hairpin tubes are in groups with each tube in a group having the same length and the groups having respectively different lengths and at least one group includes more than one tube. | 10-02-2008 |
20080236790 | Thermosiphon for laptop computer - A heat exchanger assembly is provided including a multi-function boiling chamber having a top wall and a bottom wall parallel to the top wall and a first side wall and a second side wall both extending inwardly from the bottom wall to the top wall and a pair of end walls closing the chamber. First and second condensing tubes attached to the first and second side walls, respectively, of the boiling chamber have an elongated width presenting an upper surface and a lower surface and extend in opposite respective directions to distal ends of the tubes at an inclined angle relative to the bottom wall of the boiling chamber. The condensing tubes include a plurality of channels across the width and extending from the boiling chamber to the distal end of the tube. A tank disposed at each of the distal ends of the condensing tubes is in fluid communication with the channels tubes. Upper air fins extending upwardly in a plane containing the top wall of the boiling chamber and lower air fins extending downwardly in a plane containing the bottom wall of the boiling chamber engage the respective upper and lower surfaces of both condensing tubes between the respective side walls of the boiling chamber and a position adjacent the respective distal ends of the condensing tubes. | 10-02-2008 |
20080236791 | HEAT SINK WITH ANGLED FINS - A heat sink with angled fins comprising a first set of fins forming air channels, a second set of fins forming air channels and a heat sink base coupled to the first set of fins and the second set of fins. The first set of fins and the second set of fins are separated by a region along a length of the heat sink base. The fins in the first set of fins are at a first angle with respect to the length of the heat sink base and the fins in the second set of fins are at a second angle with respect to the length of the heat sink base. | 10-02-2008 |
20080251237 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a fin assembly ( | 10-16-2008 |
20080257527 | HEAT SINK ASSEMBLY HAVING A FIN ALSO FUNCTIONING AS A SUPPORTING BRACKET - A heat sink assembly ( | 10-23-2008 |
20080271875 | RE-WORKABLE HEAT SINK ATTACHMENT ASSEMBLY - A re-workable heat dissipation assembly may include a non-removable adhesive layer. A first interposer layer may be adhered to a device via the non-removable adhesive layer. A removable adhesive layer may be adhered to the first interposer layer. A heat dissipation assembly may be adhered to the removable adhesive layer. Use of an interposer layer and a removable adhesive layer in combination with a non-removable adhesive layer, provides a high performance heat dissipation assembly while enabling re-working of the assembly following initial manufacture. | 11-06-2008 |
20080277094 | MINIATURE HEAT-DISSIPATING FAN DEVICE - A miniature heat-dissipating fan device is disclosed, which comprises: a frame; a shaft, pivotally connected to the frame; at least a planar coil, each being received in the frame and formed in a wave winding manner; at least a permanent magnet, each being connected to the shaft while being positioned about parallel to the at least one planar coil for enabling the generation of an alternating multipolar magnetic field; a plurality of blades, being disposed at positions corresponding to the at least one permanent magnet while centering around the axis of the shaft in a centrifugal manner; and at least a magnetically permeable back iron, disposed at a side of the at least one planar coil and being structured with a geometrical shape matching to the wave winding planar coil; wherein the plural blades are integrated with the at least one permanent magnet for enabling the same to rotate with the at least one permanent magnet synchronously. In an exemplary embodiment of the invention, the planar coil is structured with at least a hollowed area, each having a Hall-effect sensor embedded therein. With the aforesaid device, not only it can be structured as a thin-type device with improved convection efficiency, but also the magnetic flux density is increased. | 11-13-2008 |
20080289798 | HEAT DISSIPATION DEVICE WITH HEAT PIPES - A heat dissipation device adapted for dissipating heat from a heat-generating device includes a heat pipe assembly and a fin set. The heat pipe assembly is adapted for absorbing heat from the heat-generating device, and includes a plurality of bending heat pipes each having a top face and a bottom face. The fin set thermally engaged with the heat pipe assembly includes a plurality of fins and has a bottom surface cooperatively formed by bottom edges of the fins. The heat pipes of the heat pipe assembly are juxtaposed with each other; the top faces of the heat pipes are thermally attached to the bottom surface of the fin set; the bottom faces of the heat pipes are positioned level with each other to form a contacting surface for contacting with the heat generating device. | 11-27-2008 |
20080289799 | HEAT DISSIPATION DEVICE WITH A HEAT PIPE - A heat dissipation device includes a plurality of first fins and second fins, a flattened heat pipe and a base plate. The first fins include a first face at a bottom thereof. The second fins are sandwiched between the first fins and have a second face at a bottom thereof. The heat pipe includes a first section, a second section and a connecting section connecting the first section with the second section. The first section and the second section thermally contact the second face of the second fins. The connecting section thermally contacts the first face of the first fins. The base plate has a bottom surface adapted for contacting a heat-generating electronic component, and a top surface contacting the second face of the second fins and the first section and the second section of the heat pipe. | 11-27-2008 |
20080295993 | HEAT DISSIPATION APPARATUS WITH HEAT PIPES - A heat dissipation apparatus adapted for removing heat from a heat-generating electronic component, includes a conducting core, a plurality of conducting arms, a plurality of fins and a heat pipe assembly. The conducting core comprises a heat-absorbing portion contacting with the heat-generating electronic component. The conducting arms extend radially and outwardly from the conducting core. The fins extend outwardly from the respective conducting arms. Each of the heat pipes comprises an evaporating section thermally attached to the heat-absorbing portion of the conducting core and at least one condensing section thermally coupled to the respective conducting arm. | 12-04-2008 |
20080295994 | Heat-dissipating fin assembly and assembling method thereof - A heat-dissipating fin assembly including a first fin and a second fin is provided. Each of the first fin and the second fin respectively includes a body, a bending part and a connecting part. The bending part is bent from an end of the body to form a turning portion along a predetermined direction. The connecting part, located near a turning portion of the bending part from the end of the body, extends opposite to the predetermined direction. When the first fin is connected to the second fin, the connecting part of the first fin is connected with the second fin. Also, an assembling method of the heat-dissipating fin assembly is provided. | 12-04-2008 |
20080295995 | HEAT SINK AND MANUFACTURING METHOD THEREOF - A heat sink includes a plurality of heat dissipation fins. Each of the heat dissipation fins includes a sheet body, at least one bent part, and at least one first combined part. The bent part is formed from a terminal end of the sheet body. The first combined part protrudes from the bent part along a direction opposite to the bent direction of the bent part. A manufacturing method of the heat sink is also disclosed. | 12-04-2008 |
20080302506 | HEAT SINK - A heat sink includes first and second fin sets. The first fin set includes a plurality of fins each having a flange extending perpendicularly from an edge thereof and oriented in a same first direction. The flanges engage with each other in succession through locking parts formed thereon. The second fin set includes a plurality of fins each having a flange extending perpendicularly from an edge thereof and oriented in a same second direction toward the first direction. The flanges engage of the second fins with each other in succession through locking parts formed thereon. One of the flanges of an outmost one of the fins of the first fin set and one of the flanges of an outmost one of the fins of the second fin set are extended toward to and engaged with each other. | 12-11-2008 |
20080302507 | Adjustable cooling apparatus - An adjustable cooling apparatus to disperse heat generated by an electronic device mainly includes a heat transfer portion attached to the electronic device to transfer heat generated by the electronic device and a heat dispersing portion to receive the heat from the heat transfer portion and disperse the heat. The heat transfer portion and the heat dispersing portion are coupled through a toggle mechanism such that the heat dispersing portion can be tilted relative to the heat transfer portion at an angle which is adjustable. The cooling apparatus is mounted onto the electronic device through a base. The base has a turning mechanism coupling with the heat transfer portion so that the cooling apparatus is swivelable in a desired direction relative to the electronic device. An air fan is fastened to the heat dispersing portion to drive airflow to pass through the heat dispersing portion to improve cooling efficiency. | 12-11-2008 |
20080302508 | HEAT-DISSIPATING DEVICE WITH HIGH HEAT-DISSIPATING EFFICIENCY - A heat-dissipating device includes a planar plate, a cap-like cover, a finned structure, and a discharge pipe. The cap-like cover includes a base wall, and a surrounding wall that interconnects the planar plate and the base wall, that cooperates with the planar plate and the base wall to define an inner space thereamong, and that defines an inlet. The finned structure includes a plurality of partitioning plates that form a continuous meandering fluid path, and a plurality of heat-dissipating fins that are disposed in the meandering fluid path. The discharge pipe is connected to the surrounding wall of the cap-like cover, is in fluid communication with the second compartment, and has an open end disposed adjacent to the base wall of the cap-like cover. | 12-11-2008 |
20080302509 | HEAT SINK AND MODULAR HEAT SINK - A modular heat sink including a first heat sink and a second heat sink is disclosed. The first heat sink includes a first base having a female connecting part and a first fin assembly disposed on the first base. The second heat sink is connected to the first heat sink and includes a second base having a male connecting part for coupling the female connecting part and a second fin assembly disposed on the second base. The male connecting part is coupled with the female connecting part. | 12-11-2008 |
20080302510 | Plasma-driven cooling heat sink - A plasma-driven cooling device generates and drives a plasma-driven gas flow to cool down electronic devices. The plasma-driven cooling device comprises electrodes, dielectric pieces, and heat sink fins. The voltages applied on the electrodes coupled with dielectric pieces and heat sink fins induce the gas flow, which is used to cool down heat sources. A magnetic circuit may be coupled with plasma-drive gas flow to enhance the cooling. | 12-11-2008 |
20080314554 | HEAT DISSIPATION DEVICE WITH A HEAT PIPE - A heat dissipation device with a heat pipe includes a base for thermally engaging with an electronic device, a first fin assembly and a second fin assembly arranged on the base, and a heat pipe thermally connecting the first and second fin assemblies with the base. The first fin assembly has a first contacting face defining two grooves and the second assembly has a second contacting face facing to the first contacting face defining two grooves. The heat pipe includes an evaporation section thermally connecting with the base and the first and second fin assemblies, a first condensation section and a second condensation section respectively thermally engaging in the grooves of the first contacting face of the first fin assembly and the second contacting face of the second fin assembly. | 12-25-2008 |
20080314555 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a first fin group located above the base, at least one heat pipe connecting the base and the first fin group and first and second fans located at two opposite sides of the first fin group. Each of the first and second fans is oriented with an acute angle to the base. Outlet and inlet of the first and second fans are oriented towards the base and the first fan produces cooling air to blow towards the first fin group and the base and the second fan draws heated air away from the first fin group and the base. | 12-25-2008 |
20080314556 | HEAT DISSIPATION DEVICE HAVING A FAN FOR DISSIPATING HEAT GENERATED BY AT LEAST TWO ELECTRONIC COMPONENTS - A heat dissipation device for at least two heat-generating electronic components, includes a base, a fin set and a plurality of heat pipes. The base includes a supporting frame and at least two plates attached to a bottom of the frame for contacting with the at least two heat-generating electronic components. The fin set includes a plurality of fins on the base. The heat pipes respectively and thermally connect the at least two plates and the fin set together. A single fan is attached to the heat dissipation device for generating an airflow through the fin set to dissipate heat in the fin set absorbed from the at least two heat-generating electronic components. | 12-25-2008 |
20080314557 | THERMOELECTRIC DEVICE AND HEAT SINK ASSEMBLY WITH REDUCED EDGE HEAT LOSS - An assembly that includes one or more thermoelectric devices and a heat sink and that corrects the problem of an uneven heating effect across the area occupied by the devices due to a lateral heat loss at the edges of the devices or other anomalies among the devices is constructed with a heat sink that contains voids in the slab or flat surface that is in thermal contact with the thermoelectric devices. The voids are located at or within the periphery of the area that is directly aligned with the thermoelectric devices and are concentrated in regions relatively close to the periphery, leaving an area in the center of the slab that is either void-free or of a relatively low void density. | 12-25-2008 |
20080314558 | SYSTEM AND METHOD FOR USING A FLEXIBLE COMPOSITE SURFACE FOR PRESSURE-DROP FREE HEAT TRANSFER ENHANCEMENT AND FLOW DRAG REDUCTION - A flexible composite sheet (FCS) comprising a membrane, a substrate coupled to the membrane, and a plurality of ridges coupled between the membrane and the substrate, wherein a vibratory motion is induced from the flow to at least one segment of a membrane spanning a distance s, wherein the vibratory motion is reflected from at least one segment of the membrane to the flow, and wherein a reduction in fluctuations is caused in the flow pressure gradient and freestream velocity U at all frequencies except around f, where f≈U/s. When coupled to a heat exchanger fin, the FCS can enhance heat transfer without enhancing flow pressure drop. The FCS has other flow control applications, such as a drag reduction when coupled to an aircraft wing. | 12-25-2008 |
20090000768 | HEAT DISSIPATION DEVICE - A heat dissipation device for at least two heat-generating electronic components, includes a base for contacting with the heat-generating electronic components, a first fin set arranged on one part of the base, a second fin set arranged on another part of the base and at least a heat pipe sandwiched between the base and the first and second fin sets. The first fin set includes a plurality of fins defining a plurality of air passages therebetween. The second fin set includes a plurality of fins. Every two neighboring fins define therebetween an air passage communicating with a corresponding air passage of the first fin set. A channel which is parallel to and has a width larger than that of the air passages of the first and second fin sets is defined in a middle of the second fin set. | 01-01-2009 |
20090014154 | Passive Thermal Management System - A traditional passive thermal management system can only be used effectively in a single orientation because it relies on the buoyancy of the heated air to create natural convection. A passive thermal management system is provided which includes means for transferring heat away from a heat source ( | 01-15-2009 |
20090020262 | HEAT DISSIPATION DEVICE WITH CLIP FOR MOUNTING A FAN TO A HEAT SINK THEREOF - A clip is capable of engaging with a heat sink for securing a fan to the heat sink. The clip includes a mounting plate, a supporting plate, a spring fastener and a spring positioning plate. The supporting plate extends from the mounting plate. The spring fastener extends from the supporting plate and spaced from the mounting plate for pressing the fan toward the heat sink. The spring positioning plate extends from the mounting plate. The mounting plate is horizontally inserted into the heat sink and the spring positioning plate is V-shaped and resiliently engaged in a V-shaped receiving space of the heat sink, thereby securing the clip to the heat sink. | 01-22-2009 |
20090025906 | COOLER DEVICE - A cooler device includes a metal base member and a plurality of metal radiation fins. The metal base member has parallel locating grooves; the metal radiation fins are fastened to one another in a stack by respective hooked portions thereof or by means of closed-end heat tubes, the metal radiation fins each having backwardly curved and crimped bottom mounting portions respectively fitted into the locating grooves of the metal base and fixedly secured thereto by means of compacting the locating grooves of the metal base member without electroplating or using solder paste or bonding means. | 01-29-2009 |
20090025907 | FLUID CIRCUIT HEAT TRANSFER DEVICE FOR PLURAL HEAT SOURCES - A heat sink or heat transfer device particularly for integrated circuits, uses a phase change working fluid in a cyclic flow path having at least one evaporator that serves multiple heat sources. The evaporator can be an integral vessel made of thermally conductive material to which the multiple heat sources are coupled, preferably at evaporation points that are placed on opposite sides of a fluid reservoir for the liquid phase of the working fluid that feeds the evaporation points via capillary flow through a wicking material. | 01-29-2009 |
20090032217 | APPARATUS FOR SPREADING HEAT OVER A FINNED SURFACE - An apparatus for spreading heat over a plurality of fins is provided. The apparatus includes a heat dissipating member composed of metal and having a plurality of fins on a first side of the heat dissipating member. The apparatus also includes a plurality of strips of thermal material having a thermal conductivity in a direction parallel to the heat dissipating member higher than a thermal conductivity of the heat dissipating member, the plurality of strips disposed on a side of the heat dissipating member opposite of the first side and configured to spread heat along the heat dissipating member. | 02-05-2009 |
20090032218 | APPARATUS FOR TRANSFERRING BETWEEN TWO HEAT CONDUCTING SURFACES - An apparatus for transferring heat between two surfaces is provided. The apparatus includes a first support plate, a sheet of thermal material adjacent the first support plate, and a second support plate adjacent the sheet of thermal material, wherein the sheet of thermal material is disposed between the first support plate and the second support plate. The apparatus also includes at least one bolt inserted through each of the first support member, the sheet of thermal material, and the second support plate, the at least one bolt configured to be secured into a chassis. Finally, at least one spring is disposed between a shoulder of the at least one bolt and the second support plate. | 02-05-2009 |
20090032219 | RESILIENT CLIP AND THERMAL MODULE USING THE SAME - A thermal module includes a centrifugal blower ( | 02-05-2009 |
20090032220 | CLIP MODULE AND HEAT DISSIPATION DEVICE HAVING THE SAME - A clip module and a heat dissipation device having the same are disclosed, wherein the heat dissipation device is suitable to dissipate the heat for a heat source on a circuit board. The heat dissipation device includes a retention module, a heat sink and a clip module. The retention module is provided on the circuit board and around the heat source, and the heat sink is provided on the heat source. The clip module includes a body, a fastener fastened to the retention module and a pressing structure. The pressing structure includes a first triangle block and a second triangle block which is slidably provided on two adjacent surfaces of the first triangle block, and the fastener is pivotally provided at the second triangle block. | 02-05-2009 |
20090032221 | COOLER DEVICE - A cooler device includes a metal base member and a plurality of metal radiation fins. The metal base member has parallel locating grooves; the metal radiation fins are fastened to one another in a stack by respective hooked portions thereof, the metal radiation fins each having backwardly curved and crimped bottom mounting portions respectively fitted into the locating grooves of the metal base and fixedly secured thereto by means of compacting the locating grooves of the metal base member without electroplating or using solder paste or bonding means. | 02-05-2009 |
20090038776 | COOLER MODULE - A cooler module includes a heat sink formed of a stack of radiation fins each having a plurality of double-step mounting holes for allowing quick mounting of the radiation fins by fitting the annular outer step portions of the double-step mounting holes of one radiation fin tightly into the annular inner step portions of the double-step mounting holes of another radiation fin, a base block tightly fastened to the bottom side of the heat sink, a plurality of heat pipes tightly fitted into the double-step mounting holes of the radiation fins to reinforce engagement between the respective annular outer step portions with the corresponding annular inner step portions and tightly fitted into the bottom wall of the base block to secure the heat sink and the base block firmly together. | 02-12-2009 |
20090038777 | HEAT SINK AND MANUFACTURING METHOD THEREOF - In a heat sink and the manufacturing method thereof, the heat sink includes heat dissipation fins and heat pipes, and the heat dissipation fins have through holes for the heat pipes to pass through. The heat dissipating fins also have a notch formed at the peripheral of the through hole and communicating with the through hole, and openings formed at two sides of the notch, respectively. According to the manufacturing method, after the heat pipe is assembled with the heat dissipating fin, press strips pass through the openings and are pressed inwardly to reduce the notch to make the notch and the heat pipe plastically deformed. Finally the press strips are removed. | 02-12-2009 |
20090044927 | THERMAL MODULE AND FIN UNIT THEREOF - A thermal module includes a centrifugal fan ( | 02-19-2009 |
20090050293 | Sheet-combined thermal-dissipating device - A sheet-combined thermal-dissipating device has a plurality of thermal-dissipating sheets, which are connected with each other. Each of the thermal-dissipating sheets includes a connecting portion, at least one thermal-dissipating fin and a plurality of sub-thermal-dissipating fins. The connecting portions of the thermal-dissipating sheets are connected with each other. The thermal-dissipating fin is extended outwardly from the connecting portion, and the thickness of the connecting portion is greater than that of the thermal-dissipating fin. The sub-thermal-dissipating fins are extended outwardly from at least one side of the thermal-dissipating fin. | 02-26-2009 |
20090050294 | Evaporation-enhanced thermal management devices, systems, and methods of heat management - Briefly described, embodiments of this disclosure include heat management devices, heat management systems, methods of heat management, and the like. | 02-26-2009 |
20090056910 | Fluid cooled cabinet for electronic equipment - An electronic equipment cabinet is provided, which includes an enclosure defining an interior space. A support is disposed with the interior space and is configured to receive electronic equipment. The bottom portion defines a base plenum configured for at least one heat exchanger, which is in fluid communication with a low temperature fluid supply and a high temperature fluid return. A closed loop gas flow distribution pathway includes a first plenum communicating with the base plenum and configured to direct a low temperature gas to the support, and a second plenum configured to receive a high temperature gas flow from the support and direct the high temperature gas flow to the base plenum. A temperature sensor is disposed with the enclosure to sense the temperature of the high temperature gas flow within the enclosure. | 03-05-2009 |
20090065174 | Heat sink for an electrical device and method of manufacturing the same - A heat sink for an electrical device has a frame and at least one fin. The frame has an inner chamber. The fin is mounted in the inner chamber of the frame to separate the inner chamber of the frame into at least two channels. Therefore, heat generated from any electrical element connected to or mounted on the heat sink will transfer evenly to the heat sink. The heat sink not only dissipates heat evenly, but also provides multiple channels to dissipate heat by convection. Because the heat sink only has one frame, assembly of an electrical device is easy and quick. | 03-12-2009 |
20090065175 | FIN-TYPE HEAT SINK FOR ELECTRONIC COMPONENT - One embodiment exemplarily described herein can be generally characterized as a heat sink for an electronic component. The heat sink may include a main body thermally contactable to an electronic component; at least one fin thermally contacted with the main body; and a confining member. The at least one fin and the confining member may be cooperatively engaged such that the at least one fin is moveable between a first position relative to a longitudinal axis of the main body and a second position relative to the longitudinal axis of the relative to the main body. | 03-12-2009 |
20090065176 | THERMAL INTERFACE - Various embodiments include apparatus and method having a heat source, a thermal management device, and an interface disposed between the thermal management device and the heat source. The interface includes nanostructures to facilitate heat transfer and adhesion between the heat source and the thermal management device. | 03-12-2009 |
20090071624 | HEAT SINK - A heat sink adapted for removing heat from a plurality of LEDs, includes a heat-conducting member, a plurality of conducting arms extending radially and outwardly from a periphery of the heat-conducting member and a plurality of outer fins perpendicularly extending from at least a lateral side of each of the conductive arms. The outer fins are spaced from and surround the heat-conducting member. Outer faces of outermost ones of the outer fins are used for thermal connection with the LEDs, whereby heat generated by the LEDs is absorbed by the heat sink. A plurality of spaces is defined between the outer fins, the heat-conducting member and the conducting arms and through bottom and top of the heat sink, whereby the heat absorbed by the heat sink can be easily dissipated to surrounding atmosphere along a vertical direction. | 03-19-2009 |
20090101307 | HEAT SINK SYSTEM AND ASSEMBLY - A heat sink system with reduced airborne debris clogging, for cooling power electronics, the heat sink system including a heat sink having a plurality of fins, a housing configured to direct air flow around the side, top, and/or bottom of the heat sink and then through the fins of the heat sink at a back of the heat sink, and an inlet airway passage formed between a wall of the housing and said side, top, and/or bottom of the finned heat sink to allow air to pass within the housing, wherein said side, top, and/or bottom of the heat sink comprises at least one of said plurality of fins disposed directly in contact with the inlet airway passage. | 04-23-2009 |
20090107653 | HEAT DISSIPATION DEVICE WITH HEAT PIPES - A heat dissipation device includes a base for contacting with an electronic device, a fin set thermally contacting the base, a first heat pipe and a second heat pipe connecting the base and the fin set. The fin set has a bottom larger than the base and an upper portion apart from the bottom thereof. The first heat pipe has a flat top face thermally contacting the bottom of the fin set, comprising a first transferring portion thermally engaging with the base, and a second transferring portion extending from the first transferring portion and projecting beyond the base. The second heat pipe comprises an evaporation portion thermally engaging with the base, and a condensation portion extending from the evaporation portion and engaging with the upper portion of the fin set. | 04-30-2009 |
20090107654 | HEAT DISSIPATION MODULE AND BASE AND MANUFACTURING METHOD THEREOF - The present invention provides a heat dissipation module, a base thereof and a manufacturing method thereof. The heat dissipation module includes the base having a bottom, a plurality of guiding columns and a plurality of fins. The bottom and the guiding columns are formed as a single piece, and the fins are tightly fitted on the guiding columns. | 04-30-2009 |
20090107655 | SEMICONDUCTOR COOLING APPARATUS - A semiconductor cooling apparatus having a tank forming body and semiconductor power device mounting substrates is disclosed. The tank forming body includes a first outer plate, a second outer plate, a middle plate, a first inner fin, and a second inner fin. The middle plate is brazed to the outer periphery of the first outer plate and the outer periphery of the second outer plate. The first inner fin is brazed to the first outer plate. A first cooling medium passage is defined between the first outer plate and the first inner fin. A second cooling medium passage is defined between the first inner fin and the middle plate. The second inner fin is brazed to the second outer plate. A third cooling medium passage is defined between the second inner fin and the middle plate. A fourth cooling medium passage is defined between the second outer plate and the second inner fin. The middle plate has a plurality of through holes through which a second cooling medium passage and a third cooling medium passage communicate with each other. Each one of the mounting substrates includes a first surface on which a semiconductor power device is mounted and a second surface brazed to one of the first outer plate and the second outer plate. | 04-30-2009 |
20090120611 | HEAT DISSIPATION MODULE - A heat dissipation module includes a cooling base, at least a guide heat pipe and a cooling fin set. The cooling base provides at least a circular recess and at least a receiving groove. The guide heat pipe is placed in the circular recess. The cooling fin set is joined to the cooling base and provides a lower folding side at each cooling fin thereof and the folding side has at least a concave upward portion corresponding to the circular recess. The receiving groove is disposed at two end sides of the circular recess for receiving solder, soldering paste, solder club or bonding agent. Therefore, when the cooling fin set and the guide heat pipe are joined to the cooling base, the receiving groove is capable of speeding up the joint and preventing abnormal phenomena such as incomplete soldering, creating clearance and excessive solder. | 05-14-2009 |
20090120612 | HEAT DISSIPATION DEVICE FOR LIGHT EMITTING DIODE MODULE - A heat dissipation device includes a heat sink and an LED module attached to the heat sink. The heat sink includes a base and a plurality of fins mounted on the base. A plurality of channels is defined between the fins of the heat sink and slits are defined in two opposite side edges of the base. The slits extend through the base and corresponding fins and cross with corresponding channels. A plurality of grooves is defined in the fins opposite to the LED module. Each of the grooves interconnects corresponding two aligned slits. | 05-14-2009 |
20090120613 | HEAT SINK - A heat sink includes a heat conductive portion, a plurality of fins and at least one connecting portion. The fins and connecting portion are disposed around the heat conductive portion. The connecting portion is disposed between the fins and has a fixed part. The fixed part is disposed at one side of the connecting portion and is used for connecting with a fastener. | 05-14-2009 |
20090126905 | High reliability cooling system for LED lamps using dual mode heat transfer loops - In one aspect, a cooling device for an LED chip mounted on a heat sink includes an enclosed tube in contact with the heat sink. The tube includes a vacuum section surrounded by a plurality of cooling fins and a liquid-filled section surrounded by a plurality of cooling fins. The liquid-filled section is in contact with the heat sink. In another aspect, an apparatus includes a heat sink, an LED chip mounted on the heat sink, and an enclosed tube in contact with the heat sink. The tube includes a vacuum section surrounded by a plurality of cooling fins and a liquid-filled section surrounded by a plurality of cooling fins. The liquid-filled section is in contact with the heat sink. | 05-21-2009 |
20090133852 | COOLING APPARATUS FOR ELECTRONIC EQUIPMENT - A cooling apparatus for use in electronic equipment, being small in sizes and simple in the structures thereof, for achieving an increasing cooling capacity, comprises: a heat receiving member, which is thermally connected with a heat generating body, and which is configured to receive heat by means of a coolant flowing within an inside thereof; and a heat radiating member, which is configured to radiate the heat received within the heat receiving member, wherein the heat receiving member has a plate-like heat receiving base body, which is thermally connected with the heat generating body, and a heat receiving case body, which covers over the heat receiving base body, wherein the body members are joined with, so as to define a sealed space for running the coolant therein. The heat receiving base body is a plate-like member, being made of a metallic material, and being formed with fins, as a unit, for building up flow passages of the coolant, on a plane thereof on a side opposite to a plane, which is thermally connected with the heat generating body. The heat receiving case body is formed with a flow inlet and a flow outlet for running the coolant therein and out, on an upper surface or a side surface thereof, and a plural number of flange-like attaching portions extending nearly perpendicular to the side surface at a lower end portion of the side surface, as a unit. And, the heat receiving member is held opposite to the heat generating body of the electronic equipment, and is thermally connected with the heat generating body, by pressing the heat receiving member onto the heat generating body through an elastic deformation within the attaching portions of the heat receiving case body and the heat receiving case body, thereby achieving the thermal connection therebetween. | 05-28-2009 |
20090139691 | HEAT DISSIPATION APPARATUS - A heat dissipating apparatus includes a heat sink and a fan attached to a top of the heat sink. The heat sink includes a thermally conductive base having a top surface, and a plurality of spaced thermally conductive fins extending from the top surface thereof. The fan includes a frame and at least two impellers rotatably installed inside the frame. Each of the at least two impellers slopes toward a center of the frame. Thus when airflow from the at least two impellers is blown toward the heat sink, a part of the airflow directly flows toward an inner region of the heat sink. | 06-04-2009 |
20090139692 | Heat radiating fin - A heat radiating fin includes a flat body having a front side and a rear side, a plurality of protruded portions formed on the front side of the flat body, and a plurality of recessed portions correspondingly formed on the rear side of the flat body behind the protruded portions. The protruded portions on the flat body of a first heat radiating fin are partially extendable into corresponding recessed portions on the flat body of a second heat radiating fin located before the first one, allowing the first and the second heat radiating fins to be easily and stably stacked. | 06-04-2009 |
20090145580 | Heat sink and a method of manufacturing the heat sink - A heat sink includes a base plate and a plurality of thin-sheet fins. The base plate has a plurality of recesses and protruding ribs formed between every two recesses. The protruding ribs are spaced by the respective recesses with an equal space. Each thin-sheet fin comprises a folded engaging portion and a dissipating portion connecting with the engaging portion. The engaging portion has a first extending portion and a second extending portion parallel to the first extending portion and connecting with the first extending portion. The engaging portions are inserted into the recesses of the base plate and abut against a bottom of the recesses. | 06-11-2009 |
20090145581 | Non-linear fin heat sink - A non-linear fin heat sink is provided for dissipating/removing heat uniformly from a device, where the heat generation is non-uniform over that device, while also providing a small and relatively lightweight heat sink. The heat sink has extended surface protrusions that are optimally shaped in recognition of convective heat transfer, conductive heat transfer, and flow resistance allowing the heat sink to offset the temperature rise of a coolant media and provide enhanced cooling for the coolant temperature, deliver optimized cooling efficiency per the local physical properties of the coolant media, be used with a fluid for effectuating heat transfer; either liquid coolant, gas coolant or a combination thereof. Furthermore the heat sink features turbulence enhancement of the coolant stream by a pin array through which coolant stream passes, such fin array featuring a non-linear shape, spacing, and height pattern to provide optimal cooling while simultaneously reducing volume and flow resistance. | 06-11-2009 |
20090151896 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink and a wire clip. The heat sink has a base plate and a plurality of parallel fins arranged on the base plate. The heat sink defining a plurality lengthways channels between every two neighboring fins and a plurality of transverse channels perpendicular to the lengthways channels. The clip comprises a main body spanning on the base plate of the heat sink and two latching legs extending contrary from two opposite ends of the main body. The main body comprises a pressing section received in the lengthways channels and two pivoting sections extending from two opposite ends of the pressing section and received in the transverse channels. The two latching legs are located at the two opposite sides of the heat sink. | 06-18-2009 |
20090151897 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a fin group mounted on a top surface of the base, and a plurality of fasteners secured on the base. Each fastener includes a bolt extending through the base, and an elastic sleeve engaging with the bolt under the base. The sleeve defines a hole and the hole has a configuration such that the sleeve securely clasp the bolt. The bolt extends through the base and engages in the hole of the sleeve. | 06-18-2009 |
20090151898 | HEAT SINK - A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are juxtaposed with each other at a central position thereof, and partially spaced from each other at two opposite end positions thereof. | 06-18-2009 |
20090151899 | Cooling apparatus - A cooling apparatus includes a base, a plurality of first heat pipes, a plurality of second heat pipes, a plurality of first heat conducting columns and a plurality of second heat conducting columns. Each of the first heat pipes and the second heat pipes respectively has a heat-absorbing terminal. The heat-absorbing terminals of the first heat pipes are disposed on the base spaced at intervals. The heat-absorbing terminals of the second heat pipes are stacked above the heat-absorbing terminals of the first heat pipes spaced at intervals. Each of the first heat conducting columns is installed between the heat-absorbing terminals of the two adjacent first heat pipes. Each of the second heat conducting columns is installed between the heat-absorbing terminals of the two adjacent second heat pipes. Thereby, the heat conducting area is increased within the base, and the cooling efficiency of the cooling apparatus is enhanced. | 06-18-2009 |
20090151900 | HEAT SINK - A heat sink includes a thermal conductive base panel that has a plurality of heat dissipation columns of any of a variety of configurations perpendicularly upwardly extending from the top wall, and radiation fins mounted on the heat dissipation columns at different elevations, each radiation fin having a plurality of mounting through holes respectively press-fitted onto the heat dissipation columns. The base panel may be provided with a fan and/or heat pipes to enhance heat dissipation efficiency. | 06-18-2009 |
20090151901 | Fin and Heat Sink - A fin is penetrated through by a heat pipe. The fin includes a fin body and a plurality of positioning protrusions. The fin body has an accommodating hole penetrated by the heat pipe. The positioning protrusions are formed at the circumference of the accommodating hole for holding against the heat pipe, so that a gap is provided between the heat pipe and the circumference of the accommodating hole. | 06-18-2009 |
20090165996 | RETICULATED HEAT DISSIPATION WITH COOLANT - Embodiments described herein may include example embodiments of methods, apparatuses, devices, and/or systems for heat dissipation with coolant. | 07-02-2009 |
20090165997 | HEAT SINK - A heat sink for dissipation heat for an electronic components ( | 07-02-2009 |
20090165998 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a fin group located at a top of the base, a heat pipe connecting with the base and the fin group, a fan located at a top of the fin group, and a fan holder. The fan holder includes a securing portion mounted between the base and the fin group, a mounting portion extending from the securing portion. The mounting portion of the fan holder is located at a top of and spaced from the fin group and the fan is mounted on the mounting portion. | 07-02-2009 |
20090165999 | HEAT SINK - A heat sink includes a plurality of fins. Each of fins includes a body having two locking members at a top portion and a lower portion thereof respectively. Each of the locking members includes two parallel clasping plates. The two clasping plates of one of the fins clasp the main body of another fin adjacent said one fin, thereby interlocking the fins together. | 07-02-2009 |
20090166000 | HEAT SINK WITH HEAT PIPES - A heat sink adapter for cooling an electronic component includes a lower plate, an upper plate, an upper fin set and a lower fin set respectively fixed on the upper plate and the lower plate, and a plurality of heat pipes sandwiched between the upper plate and the lower plate. The lower plate includes a panel contacting the heat pipes, two sidewalls extending upwardly from the panel and separated from the heat pipes, and two flanges extending oppositely from the two sidewalls and soldered on the upper plate. The heat pipes are S-shaped and juxtaposed and directly contact with each other from beginning to end. | 07-02-2009 |
20090178782 | Heat Exchanger and a Method of Manufacturing it - In order to manufacture a heat exchanger comprising a metal base ( | 07-16-2009 |
20090188647 | Heat Sink - A heat sink is disposed on a heat source and is made by thermal conductive material. In the heat sink is defined a vacuum airtight space. A thermal conductive material and a volatile liquid are filled in the airtight space, and a plurality of radiating fins is equidistantly arranged on an outer surface of the heat sink. Such arrangements can perform a heat exchange quickly and efficiently, and the shape of the heat sink can be changed freely. | 07-30-2009 |
20090194254 | HEAT DISSIPATION DEVICE FOR LED LAMP - A heat dissipation device adapted for removing heat from LED modules of an LED lamp includes a plurality of heat sinks, a plurality of fin sets and a plurality of heat pipes extending through the fin sets and thermally connecting the heat sinks and the fin sets together. The heat sinks each have a base plate with a bottom surface which is kept in contact with corresponding LED modules and a plurality of fins arranged on a top surface of the base plate. Each of the fin sets consists of a plurality of flakes and defines a plurality of air passages between the flakes. Air can flow through the heat dissipation device from a place thereunder to a place thereabove via the air passages between the flakes of the fin sets. | 08-06-2009 |
20090194255 | COOLER DEVICE - A cooler device includes a base panel, which has multiple mounting grooves on the top wall and multiple locating grooves on the bottom wall, a radiation fin module formed by stacking up multiple radiation fins, each radiation fin having multiple mounting through holes and a root portion that is respectively riveted to the mounting grooves of the base panel, and multiple U-shaped heat pipes, each heat pipe having a first extension arm respectively and tightly fitted into the mounting through holes of the radiation fins and a second extension arm respectively and tightly fitted into the locating groove of the base panel and kept in flush with the bottom wall of the base panel for direct contact with a CPU or the like to transfer heat energy from the CPU or the like to the radiation fins for quick dissipation. | 08-06-2009 |
20090199997 | HEAT EXCHANGER DEVICE AND METHOD FOR HEAT REMOVAL OR TRANSFER - Systems and methods for a forced-convection heat exchanger are provided. In one embodiment, heat is transferred to or from a thermal load in thermal contact with a heat conducting structure, across a narrow air gap, to a rotating heat transfer structure immersed in a surrounding medium such as air. | 08-13-2009 |
20090205807 | INSTALLATION FINS AND INSTALLATION STRUCTURE OF FINS AND A HEAT SINK WITH MOVING FINS INSERTED BETWEEN COOLING FINS - A radiator fin of a heat sink has a shape of a portion of a circle with a small radius which is not overlapped with a circle with a large radius when two circles with different radiuses are overlapped with each other such that centers of the two circles are in a single circle, as a cross sectional shape. An arrangement of radiator fins of a heat sink on a radiator plate, includes at least two radiator fins provides to at least one radiator plate such that centers of inner and outer arcs of circles forming the radiator fins are on a reference line, and an outer arc of one of two adjacent radiator fins moves within a track of an inner arc of the other radiator fin or an inner arc of one radiator fin moves out of a track of an outer arc of the other radiator fin. | 08-20-2009 |
20090211729 | Heat sink structure - A heat sink is used for dissipating thermal energy generated by an electronic component of an electronic device. The heat sink includes a contact base and a fin base. The contact base is attached on the electronic component to transfer thermal energy, and the fin base is pivotally connected to the contact base to transfer thermal energy with the contact base. The fin base has a plurality of fins, and rotates relative to the contact base. A center of gravity of the fin base deviates from a rotation axis. When the electronic device is moved, due to the deviated center of gravity, the fin base rotates to make the fins disturb the air inside the electronic device. | 08-27-2009 |
20090211730 | HEAT DISSIPATION DEVICE HAVING A BRACKET - A heat dissipation device includes a first heat sink, a second heat sink far away from the first heat sink, a heat pipe transferring heat from the first heat sink to the second heat sink and a bracket for reinforcing the heat dissipation device. The bracket includes a first end attached to the first heat sink and a second end attached to the second heat sink. The second end defines a through hole receiving the heat pipe therethrough. The second end has a supporting portion and a clasping portion from an edge of the through hole. The supporting portion and the clasping portion are spaced from each other and firmly clasp the heat pipe. The clasping portion is bent to abut against the heat pipe and urge the heat pipe toward the supporting portion. | 08-27-2009 |
20090218073 | COOLING FIN - A cooling fin provides at least a projection part and at least a slot is disposed at lateral sides for the airflow producing turbulent flows while passing through the slot and creating eddy currents at the periphery of the cooling fin. Therefore, the cold air, which flows between a plurality of cooling fins, can stagnate longer time for carrying more heat outward and enhancing the heat dissipation efficiency greatly. | 09-03-2009 |
20090218074 | SYSTEM AND METHOD FOR ACTIVE COOLING UTILIZING A RESONANT SHEAR TECHNIQUE - An active cooling assembly is described. One embodiment of the active cooling assembly includes a fin configured to enable convective heat transfer to an airflow passing over the fin. A boundary layer accumulates between the fin and the airflow, and the boundary layer includes a region of heated air attached to a side of the fin. The embodiment also includes a blade configured to oscillate proximate to the fin to shear the boundary layer that accumulates between the fin and the airflow. The region of heated air is sheared from the side of the fin so that the impedance attributable to the boundary layer of the convective heat transfer from the fin to the airflow is reduced. The fin is coupled to a stationary arm, and the blade is coupled to a swing arm. The swing arm and a spring are driven at a resonant frequency by an actuator. | 09-03-2009 |
20090236076 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a fin group located on the base, a first heat pipe and a second heat pipe. The fin group includes a first fin group, a second fin group arranged on the first fin group and a third fin group arranged on the second fin group. The first heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion sandwiched between the first fin group and the second fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion. The second heat pipe includes an evaporating portion sandwiched between the base and the first fin group, a condensing portion located between the second fin group and the third fin group, and a connecting portion interconnecting the evaporating portion and the condensing portion thereof. | 09-24-2009 |
20090236077 | HEAT DISSIPATION DEVICE - A heat dissipation device for dissipating heat generated by an electronic component includes a base, a pair of fin groups and heat pipes connecting the base with the fin groups. The base is used for thermally contacting with the electronic component. The fin groups includes a plurality of fins located over the base. Each of the heat pipes includes an evaporating portion received in the base, a condensing portion extending spirally and upwardly from an end of the evaporating portion through a corresponding fin group. The fins of each fin group is so arranged that each fin group has an arch-shaped profile. The condensing portions in each fin group are parallel to each other. A fan is mounted over the fin groups. | 09-24-2009 |
20090236078 | HEAT-DISSIPATING DEVICE - A heat-dissipating device is used for dissipating heat from a plurality of heat sources. The heat-dissipating device includes a plurality of elongated thermally conductive elements each having an end adapted to thermally contact a respective one of the heat sources, and a fin structure connected to the thermally conductive elements. | 09-24-2009 |
20090242168 | HEAT SINK ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME - A heat sink assembly includes a base, a fin group and a heat pipe connecting with the base and the fin group. The fin group includes a plurality of fins. Each of the fins defines a recess at a lower portion thereof. The heat pipe includes an evaporating portion extending through the base and a condensing portion extending through the fin group. The base is interferentially fitted into the recesses of the fins. The base, the fin group and the heat pipe directly and intimately connect with each other. The recess and the base have correspondingly T-shaped profiles. Each fin forms a bended flange defining the recess. The bended flange intimately contacts with the base and the evaporating portion of the heat pipe. | 10-01-2009 |
20090242169 | HEAT-DISSIPATING DEVICE WITH CURVED VAPOR CHAMBER - A heat-dissipating device includes a vapor chamber shown as a flat long plate, a heat-dissipating plate superposed on the vapor chamber, and a first fin set. The middle portion of the vapor chamber is designed as a heated section, two sides of which respectively have a condensing section. Two curvedly extending sections are respectively disposed between the heated section and the condensing sections. Each condensing section is extended to a higher position of the heated section through the bending of each extending section. The heat-dissipating plate is horizontally attached onto the two condensing sections, thus that a section-differential space formed between the heat-dissipating plate and the heated section accommodates the first fin set thermally contacted with the heated section of the vapor chamber. | 10-01-2009 |
20090242170 | Cooling Fins for a Heat Pipe - According to one embodiment, a cooling apparatus has a number of cooling fins that are coupled to a heat pipe. The heat pipe has a hollow cavity that is at least partially filled with a refrigerant. Each of the cooling fins has a hollow cavity that is fluidly coupled to the hollow cavity of heat pipe such that the refrigerant may flow between the hollow cavity of the heat pipe and hollow cavities of the cooling fins. | 10-01-2009 |
20090250195 | HEAT SINK AND COOLER - A heat sink includes a plurality of fins. The fins are formed to serve as partition walls of flow paths of a coolant. The fins are formed such that the coolant flows along a surface thereof. A merge space is formed to allow the coolant in the flow paths separated by the fins to merge. The merge space is formed in the flow paths formed by the fins. | 10-08-2009 |
20090255649 | Radiating fin - A radiating fin has a flat surface and two rearward extended flanges formed along two opposite edges of the flat surface. The flat surface is formed with a plurality of openings, through which airflow can flow to carry away heat absorbed by the radiating fin. A lug is inward extended from one side of each of the openings adjacent to the flange to locate in the same plane as the flat surface, and a catch in the form of a frame is rearward extended from each of the openings with two lateral sides of the catch spaced from two lateral ends of the lug. When a second radiating fin is connected to a front side of a first radiating fin, the lugs on the first radiating fin are caught in the catches on the second radiating fin, bringing the two radiating fins to firmly assemble together. | 10-15-2009 |
20090260778 | LOW PROFILE HEAT SINK FOR SEMICONDUCTOR DEVICES - A heat sink for cooling a heat-generating device includes a base and a cooling section coupled thereto for cooling the device. The cooling section includes a plurality of flow tubes, each flow tube having an inlet, an outlet, and a bounding wall that defines a closed fluid flow path from the inlet to the outlet. Each of the flow tubes includes a central axis that is substantially parallel to a reference plane of the heat-generating device. The flow tubes may be arranged in a layered stack and include a bounding wall that has a thickness that decreases with increasing distance in the layered stack. The flow tubes may also include a cross-sectional area that decreases with increasing distance in the layered stack. Furthermore, the bounding wall of the flow tubes may have a non-planar configuration in a direction generally parallel to the central axis. | 10-22-2009 |
20090260779 | HEAT DISSIPATION DEVICE HAVING AN IMPROVED FIN STRUCTURE - A heat dissipation device for dissipating heat from an electronic element, includes a base plate for absorbing heat from the heat-generating component, a fin unit located above the base plate and having a plurality of fins stacked together, and at least a heat pipe having an evaporating section thermally engaging with the base plate and a pair of condensing sections extending through the fins. Each of the fins has a plurality of parallel and protruding flanges on a top face thereof. The protruding flanges of the fins are of equal height and parallel to short sides of the fins. Each protruding flange has a length equal to that of the short sides of the fins. A distance between two neighboring ones of the protruding flanges located between the condensing sections is the same. The protruding flanges are provided for increasing a heat dissipation area of the fin. | 10-22-2009 |
20090266512 | HEAT DISSIPATION DEVICE HAVING FASTENER ASSEMBLIES FOR ATTACHMENT THEREOF TO A HEAT-GENERATING COMPONENT - A fastener assembly for securing a heat sink to a printed circuit board, includes a sleeve, a bolt inserted into the sleeve and a resilient component surrounding the bolt. The sleeve comprises a hollow body, a bottom plate at a bottom thereof and an engaging cylinder extending downwardly from the bottom plate. The engaging cylinder has inner thread and a deformable latching protrusion projecting radially outwardly. The bolt includes a shaft, a head and a threaded part for threadedly engaging with a retainer of the printed circuit board. The head is received in the sleeve above the bottom plate. The shaft is received in the through hole of the sleeve whilst the threaded part is held beneath the engaging cylinder of the sleeve. The resilient component is compressed between the head of the bolt and the bottom plate of the sleeve. | 10-29-2009 |
20090266513 | HEAT DISSIPATION DEVICE - A heat dissipation device adapted for removing heat from a heat-generating electronic device, includes a base, a first fin unit arranged on a top surface of the base. The base includes a base plate, a spreader and a heat pipe group sandwiched between the base plate and the spreader. The base plate defines therein an opening. The heat pipe group has an inserting protrusion and a receiving recession opposing the inserting protrusion. The inserting protrusion protrudes upwardly from a top surface of the heat pipe group and is embedded in the opening of the base plate. The receiving recession recesses upwardly from a bottom surface of the heat pipe group and receives therein the spreader. | 10-29-2009 |
20090266514 | HEAT EXCHANGE DEVICE - A heat exchange device comprises a base and a plurality of fins. The plurality of fins are in thermal contact with the base to allow heat transport from the base to the fins. Further, the fins comprise at least one respective channel containing a working fluid. The fins are arranged in at least a first and a second row. The rows can be laterally displaced with respect to each other. Further, the first row and second row may be staggered with respect to each other. | 10-29-2009 |
20090277607 | Heat sink memory chip - A heat sink for chips includes two heat dispensing units and each heat dispensing unit includes multiple fins between which passages are defined. Each heat dispensing unit includes a flat surface defined in an inside thereof and a heat conducting member is connected to the flat surface. The chip is in contact between the two heat conducting members so that the heat generated from the chip is contacted to the heat conducting members and the fins and escapes to the air. | 11-12-2009 |
20090283243 | HEAT DISSIPATION DEVICE - A securing structure of a heat dissipation device for an electronic component includes a fastener and a securing arm. The fastener includes a bolt and a spring surrounding the bolt. The bolt includes a main portion, a bottom fixing portion and a top head portion. An aperture extends inwardly from a free end of the securing arm with a width not smaller than the main portion and smaller than the fixing portion. The main portion of the bolt is received in the aperture with the spring compressed between an upper surface of the securing arm and the head portion, and the fixing portion abutting a lower surface of the securing arm. An engaging portion extends perpendicularly from the securing arm around the aperture and engages with the fastener to hold the fastener in the aperture of the securing arm. | 11-19-2009 |
20090288806 | Heat Radiating Unit - A heat radiating unit in the form of a heat sink includes a contact section arranged on a central portion of an end face of the heat sink for contacting with a heat source, and having more than one extension plate outward extended therefrom; a first heat-dissipating section composed of multiple curved radiation fins outward extended from two opposite sides of the contact section to provided increased heat radiating areas; and a second heat-dissipating section composed of multiple straight fins outward extended from another two opposite sides of the contact section and outer surfaces of the extension plates. The contact section conducts heat generated by the heat source to the first and second heat-dissipating sections, through which airflow produced by a cooling fan flows to carry the heat away from the heat sink in multiple directions to achieve enhanced heat-dissipating effect. | 11-26-2009 |
20090288807 | BLOWERLESS HEAT EXCHANGER BASED ON MICRO-JET ENTRAINMENT - A blowerless heat exchanger apparatus based on micro-jet entrainment is disclosed. The heat exchanger apparatus incorporates a number of fins regularly spaced apart from each other and parallel to each other, thus letting air currents flow in the space defined between them. A dense array of micro-jet nozzles can be fabricated on the fins surface pointing to the flow direction of the air movement in order to induce increase airflow. The air from an air compressor delivers sufficient airflow on the fins surface utilizing micro-jets entrainment. The micro-jet entrainment confirms strong turbulent around the micro-jets and suggests significant heat transfer enhancement. The turbulence from the micro-jets enhance the heat transfer coefficient, potentially by an order of magnitude, therefore allowing much larger fin spacing and leads to huge reduction of flow resistance and overall power consumption. | 11-26-2009 |
20090301689 | Fastening device and heat-dissipating module having the same - The invention discloses a fastening device for fasten a heat sink onto a base board. The fastening device comprises a first fastening member, a second fastening member and a third fastening member. When assembling the fastening device to the base board, the second fastening member has to be pivoted with the third fastening member first. Afterwards, the first fastening member is attached to the base board. Finally, the second and third fastening members, which have been assembled, are engaged with the first fastening member, so as to press the heat sink tightly. Accordingly, the heat sink will be fastened on the base board easily and stably. | 12-10-2009 |
20090301690 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a substrate, a fin assembly located on the substrate, a plurality of heat pipes connecting the substrate and the fin assembly, and a fan fixed on the substrate by a securing device. The securing device includes a holder fixed to the substrate and a plurality of elastic fasteners. The fasteners secure the fan onto the holder and each includes a sandwiched portion sandwiched between the fan and the holder to segregate the fan from the holder. | 12-10-2009 |
20090308572 | APPARATUS FOR ACCEPTING A SELF-DRILLING SCREW - An apparatus for accepting a self-drilling screw is provided. The apparatus comprises a base structure having at least one channel. The at least one channel has a first side, a second side, and a bottom, forming a generally ‘u’ shaped cross section, wherein the first side and the second side are a distance apart such that threads of a self-drilling screw engage with both the first side and the second side when the screw is inserted into the channel. | 12-17-2009 |
20090308573 | HEAT DISSIPATION DEVICE - A heat dissipation device used for dissipating heat from an electronic device mounted on a printed circuit board (PCB), includes a heat sink contacting with the electronic device, a locking device mounted on the heat sink and securing the heat sink onto the PCB. The locking device comprises a supporting plate extending through the heat sink, two arms respectively and slidably fixed on two opposite ends of the supporting plate and two fastening devices respectively slidably fixed to the two arms. The two arms can move along a first direction about the heat sink, and the two fastening devices can move along a second direction about the arms, thereby aligning the two fastening devices with two through holes defined in the printed circuit board, respectively. | 12-17-2009 |
20090308574 | HEAT SINK ASSEMBLY - A heat sink assembly includes a base and a mounting apparatus. The base defines a stepped hole. A step is formed in the stepped hole. A cutout is defined on an edge of the base and communicates with the stepped hole. The mounting apparatus includes a bolt and a spring. The bolt defines a groove at a portion of the bolt to form an engaging portion thereof. The engaging portion passes through the cutout. The step engages in the groove of the bolt. The spring is retained around the bolt, received in the stepped hole, and abuts against the step to retain the bolt in the stepped hole. | 12-17-2009 |
20090308575 | HEAT DISSIPATION MODULE - The present invention relates a heat dissipation module applied to a microprocessor or light-emitting diodes. The heat dissipation module is provided with at least one heat-conducting column, on at least one end of which an outwardly extending expanded element is provided and on the periphery of which a heat-dissipating element is provided. In such manner, when the heat dissipation module is used for heat dissipation of a microprocessor, the area in contact with a heat source is enlarged by the expanded element, with rapid heat dissipation through the heat-conducting column and the heat-dissipating element. Moreover, when the heat dissipation module is used for light-emitting diodes, the expanded element can increase the heat dissipation area and the number of light-emitting diodes positioned to accelerate heat dissipation. | 12-17-2009 |
20090314465 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a fin group mounted on a top of the base, a fan mounted on a top of the fin group, a hollow fan duct mounted on the fan and a thermoelectric cooler secured on the fan duct. The thermoelectric cooler includes a cooling module having the Peltier effect and extending through a sidewall of the fan duct, and a heat sink enclosed by the fan duct and thermally contacting with the cooling module. The cooling module has a cold surface located at an inner side of the fan duct, and the heat sink thermally contacts with the cold surface of the cooling module. An airflow generated by the fan first flows through the heat sink and then reaches the fin group via the fan. | 12-24-2009 |
20090314466 | HEAT DISSIPATION APPARATUS HAVING HEAT PIPES INSERTED THEREIN - A heat dissipation apparatus includes a heat sink and a pair of first heat pipes. The heat sink includes a pair of first fin assemblies staggered with a pair of second fin assemblies. The first and second fin assemblies each define a receiving groove therein. The second fin assemblies each further defines an opening communicating with the receiving groove of a corresponding second fin assembly. The first heat pipes each include an evaporation section and a condensation section. A portion of the condensation section of each of the first heat pipes is inserted into the receiving groove of each of the first fin assemblies. The other portion of the condensation section of each of the first heat pipes is received in the receiving groove of each of the second fin assemblies through the opening. | 12-24-2009 |
20090321046 | FLOW DIVERTERS TO ENHANCE HEAT SINK PERFORMANCE - A heat sink includes a base and fins attached to the base. A flow diverter is in contact with the base or at least one of the fins and is configured to disturb a laminar flow region of a fluid flowing adjacent to at least one of the fins or the base. | 12-31-2009 |
20090321047 | AIR GUIDING STRUCTURE - An air guiding structure includes a plurality of fins capable of swinging, an actuation member connected to each fin, and a memory deformable element connected to the outermost fin. When the memory deformable element is at a normal temperature, the fins remain at a normal angle; when deforming because of heat, the memory deformable element pulls the fins to swing. Further, the actuation member drives each fin to rotate to a working angle, and thus the air exhaustion direction is changed according to the temperature effect. | 12-31-2009 |
20090321048 | HEAT DISSIPATION ASSEMBLY - A heat dissipation assembly has a containment apparatus preventing unwanted migration of a thermal interface material to surrounding areas on a bottom surface of a heat sink. The heat sink includes a base and a plurality of fins extending from the base. The base defines two elongated grooves at two opposite lateral sides thereof, respectively. The containment apparatus includes a plate located below the thermal interface material and an annular frame extending upwardly from edges of the plate and attached to a periphery of the base of the heat sink. The frame defines two inserting ribs projecting inwardly from inner walls thereof and correspondingly inserting into the grooves of the base. | 12-31-2009 |
20090321049 | Radiating fin - A radiating fin includes a main body, on which at least one reinforcing section is formed. The reinforcing section is sunken into a first side of the main body and correspondingly protruded from an opposite second side of the main body. With the reinforcing section formed on the main body, the radiating fin can have largely enhanced structural strength and increased heat-radiating area. | 12-31-2009 |
20090321050 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink and a heat pipe. The heat sink includes a first fin assembly and two second fin assemblies located on two opposite sides of the first fin assembly respectively. The heat pipe includes an evaporator section, a first condenser section and a second condenser section extending from two opposite ends of the evaporator section in the same directions, and a third condenser section extending from a free end of the second condenser section towards a free end of the first condenser section. The third condenser section extends through the first fin assembly. The first condenser section interconnects one of the second fin assemblies to the first fin assembly. The second condenser section interconnects the other second fin assembly to the first fin assembly. | 12-31-2009 |
20100000715 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base, a sleeve coupling with the base, and a fastener engaging with the base and the sleeve. The base defines a hole extending therethrough. The sleeve includes a first portion coupling with the hole of the base and a second portion extending from an end of the first portion. The second portion is located at a first side of the base. The fastener includes a body portion extending through the sleeve and the base, a head portion and a foot portion formed at two ends of the body portion, respectively. The head portion is located at the first side of the base. A spring member is compressed between the head portion and the second portion. A compressed length of the spring member is adjustable by adjusting a coupling length of the first portion with the hole of the base. | 01-07-2010 |
20100000716 | HEAT DISSIPATION DEVICE HAVING A CLIP - A heat dissipation device removing heat from a heat generating electronic device on a printed circuit board includes a base, a plurality of fins attached to the base and a clip for mounting the base and the fins onto the heat generating electronic device. Each of the fins defines a closed through hole therein. The holes of the fins cooperatively define a channel. The clip includes a locking beam extending through the channel of the fins and two fasteners engaging the locking beam mounting the base and the fins onto the heat generating electronic device. | 01-07-2010 |
20100018669 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink having a first fin unit and a second fin unit adjoining each other. The first fin unit includes a plurality of parallel stacked first fins each including a main body and two flanges extending perpendicularly from two opposite sides of the main body. The second fin unit includes a plurality of parallel stacked second fins each including a main body and two flanges extending perpendicularly from two opposite sides of the main body. The first fin unit and the second fin unit are arranged back-to-back. The main body of an outmost first fin adjacent to the second fin unit abuts the main body of an outmost second fin adjacent to the first fin unit. An interval between two neighboring first fins is smaller than that between two neighboring second fins. | 01-28-2010 |
20100018670 | Heat Sink Assembly - A heat sink assembly mount is provided. Generally the invention has a frame clip and a spring clip. The frame clip has one or more inwardly extending tabs and two or more vertically extending side portions. The one or more tabs are sized to fit over and removably couple to a heat producing device. The distance between the two or more vertically extending side portions is sized to hold a base portion of a heat sink and prevent horizontal motion of the heat sink. The spring clip couples to the frame clip and has a spring bias sized to produce a vertical force that presses the heat sink against a heat producing device. | 01-28-2010 |
20100025012 | HEAT SINK ASSEMBLY - A heat sink assembly includes a base, a fin group located at a top of the base, a heat pipe connecting the base with the fin group, a fan mounted on a side of the fin group and a supporting bracket mounted on the base and supporting the fan. The supporting bracket includes a mounting portion secured on the base and a pair of supporting arms extending from the mounting portion and fixed to the fan. Four screws extend through the fan to threadedly engage with the fin group. Lower two of the screws also extend through the supporting arms of the supporting bracket whereby the supporting bracket also connects with the fan. | 02-04-2010 |
20100025013 | HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a plurality of parallel fins, a heat pipe extending through the fins, and a guiding structure formed on each of the fins. An airflow channel is formed between every two neighboring fins for an airflow flowing therethough. The guiding structure is formed for guiding the airflow to flow to the heat pipe. A space is defined within the guiding structure and has a width decreasing gradually along a flowing direction of the airflow. An opening is defined in the guiding structure for communicating airflow at two opposite sides of each fin. A height of the guiding structure decreases gradually from the opening towards other sides of the guiding structure. | 02-04-2010 |
20100025014 | HEAT DISSIPATING DEVICE AND FIN ASSEMBLY THEREOF - A fin assembly includes a plurality of fins interconnected together. Each of the fins includes a main body defining a plurality of openings and a plurality of locking units formed on the main body beside the plurality of openings, respectively. Each of the locking units includes an extension tab, a locking tab and a connecting tab. An engaging hole is defined in the extension tab. The locking tab forms an elastically deformable finger thereon. A locking tab of a fin is received in a corresponding opening of an adjacent fin. A free end of the locking tab of the fin resists on a connecting tab of the adjacent fin. A finger of the fin is engaged into an engaging hole of the adjacent fin. | 02-04-2010 |
20100032135 | HEAT DISSIPATION DEVICE - A heat dissipation device ( | 02-11-2010 |
20100032136 | COOLER MODULE - A cooler module formed of a heat sink and a cooling fan is disclosed. A heat receiving base member of the heat sink has a flat bottom center contact surface and a plurality of bottom sloping surfaces (or one tapered bottom surface) obliquely upwardly extended from the border of the flat bottom center contact surface to the border of the heat receiving base member for spreading heat in all directions rapidly and evenly. | 02-11-2010 |
20100038056 | High performance compact heat exchanger - A high performance compact heat exchanger includes a base plate with evaporator channels for cooling a heat source adjacent to the base plate. A condenser is connected to the base plate and includes fins with channels therein for the coolant. A pump delivers the coolant to the evaporator channels of the base plate after passing through the fins of the condenser. | 02-18-2010 |
20100038057 | HEAT DISSIPATION DEVICE - A heat dissipation device for cooling an electronic device mounted on a printed circuited board, comprises a heat spreader contacting the electronic device, a fin assembly comprising a plurality of fins, a supporting bracket contacting the heat spreader and supporting the fin assembly, and a heat pipe extending through the fin assembly and the supporting bracket and attached to the heat spreader, wherein a lowermost fin of the fin assembly has a plurality of clasps extending near two opposite ends thereof and towards the supporting bracket. The clasps are bent to press against a bottom of the supporting bracket after the clasps extend through the supporting bracket. | 02-18-2010 |
20100044009 | ANNULAR HEAT DISSIPATING DEVICE - An annular heat dissipating device, comprises an annular body; a periphery of the annular body being formed with a plurality of trenches and recesses; which are alternatively arranged. an inner middle area of the annular body having a seat plate for installing at least one heat source; a plurality of heat dissipated fins being arranged in the recesses which are annularly arranged around an outer periphery of the annular body; each fin being inserted into the recess. In assembly by punching, a shaping mold punches a trench between two fins so that two lateral wall of the trench will be pressed and deform; and then the fin in the recess tightly adheres to the outer periphery of the annular body. | 02-25-2010 |
20100051230 | FAN HOLDER - A fan holder used to secure a fan to a heat dissipation device, includes a main body for mounting the fan thereon, a pair of blocking wings and a pair of baffle walls extending from the main body to define a space for receiving the fan therein. The blocking wings each include a pair of locking protrusions engaging in the fan to prevent the fan from moving vertically. The baffle walls each includes a pair of blocking flanges fittingly received in cutouts defied in the fan to prevent the fan from moving horizontally along a lateral direction of the fan holder. The baffle walls engage with front and rear sides of the fan for preventing the fan from moving along a front-to-rear direction. | 03-04-2010 |
20100051231 | HEAT DISSIPATION APPARATUS HAVING A HEAT PIPE INSERTED THEREIN - A heat dissipation apparatus includes a heat sink and a heat pipe thermally connecting with the heat sink. The heat sink includes a plurality of radial fins. Each of the fins defines a receiving hole therein, and extends out a flange around the receiving hole. A height of the flange increases outwardly in a direction away from a center of the heat sink. The heat pipe includes an evaporation section and an arcuate condensation section. The condensation section of the heat pipe extends through the receiving hole, and is attached to the flanges of the heat sink. | 03-04-2010 |
20100051232 | HEAT DISSIPATION APPARATUS INCORPORATING A FAN - A heat dissipation apparatus includes a heat sink and a fan. The heat sink includes a plurality of radial first and second fins. The first and second fins each include a main body and an extension arm extending upwardly from the main body. The main bodies and the extension arms cooperatively form a space therebetween for securely receiving the fan therein. Each extension arm defines an engaging groove communicating with the space. A height of the extension arm of each second fin is less than that of the extension arm of each first fin. A fixing recess is defined over the extension arms of the second fins. The fan includes a frame extending downwardly out a plurality of legs and radially out a fixing arm. The legs have hooks engaging in the engaging grooves, and the fixing arm is fixed in the fixing recess. | 03-04-2010 |
20100059202 | HEAT DISSIPATION DEVICE - A heat dissipation device cooling an electronic device comprises a conductive plate, a heat spreader received in the conductive plate and contacting the electronic device, a heat pipe connecting the conductive plate and the heat spreader, and an elastic member mounted on the conductive plate and pushing the heat spreader and the heat pipe in the heat spreader downwardly toward the electronic device. | 03-11-2010 |
20100059203 | HEAT DISSIPATION DEVICE - A heat dissipation device for an electronic component includes a heat sink thermally contacting the electronic component and a label member fixed on the heat sink for providing information. The heat sink includes a base and a plurality of fins extending upwardly from a top surface of the base. Two engaging portions protrude from two spaced fins, towards each other. Two flanges angle outwardly from two opposite lateral sides of the label member and clasp the two engaging portions of the heat sink, respectively. | 03-11-2010 |
20100065247 | COOLING MECHANISM FOR ELECTRONIC DEVICES - A cooling mechanism for cooling a enclosed cabinet of electronic device, which comprises a heat-conducting plate having accommodating grooves at one side. Vapor chambers disposed within accommodating grooves of the heat-conducting plate. And a cooling fin set which is arranged on an arbitrary side of the heat-conducting plate to compose a heat exchanger. Part of the heat exchanger is disposed outside of the cabinet to conduct heat inside of the cabinet to outside. | 03-18-2010 |
20100065248 | HEAT SINK - A heat sink includes a rib section and a plurality of radiating fins spaced on a top face of the rib section. The radiating fins are perpendicularly protruded from the top face of the rib section and orthogonally extended across the rib section with a near middle bottom portion of each of the radiating fins in contact with the top face of the rib section, such that two lateral portions of each of the spaced radiating fins are outward protected from two opposite sides of the rib section to define two comb-shaped air paths. Cold air can flow to spaces below the comb-shaped air paths, and hot air carrying the heat radiated from the radiating fins can upward flow through the comb-shaped air paths and diffused outward as a result of natural air convection around the heat sink. Therefore, the heat sink can have largely upgraded heat dissipation efficiency. | 03-18-2010 |
20100065249 | HEAT SINK - A heat sink includes a radiating base being provided on one face with perpendicularly extended radiating fins, and on another opposite face with a protruded seat. Two opposite lateral sides of the radiating base are outward extended, from two upper longitudinal edges of the protruded seat. A first space is formed between any two adjacent ones of the radiating fins, and at least one through hole is formed on the radiating base to communicate the first spaces with spaces formed below the radiating base at two outer sides the protruded seat. The heat sink is mounted to a heat-producing element. Ambient cold air can flow downward and enter the spaces below the radiating base, and then flow upward through the at least one through hole into the first spaces to carry away heat transferred to the radiating fins and thereby upgrade the heat dissipation efficiency of the heat sink. | 03-18-2010 |
20100071875 | HEAT DISSIPATION DEVICE AND CENTRIFUGAL FAN THEREOF - A centrifugal fan includes a housing and a plurality of blades received in the housing. The housing includes a base wall and a sidewall surrounding the base wall. The sidewall defines a first air outlet and a second air outlet adjacent to the first air outlet. An elongated air guiding plate is located between the first air outlet and the second air outlet. The air guiding plate includes an outer end away from the blades and an inner end adjacent to the blades. A height of the inner end of the air guiding plate in an axial direction of the centrifugal fan is smaller than a height of the outer end of the air guiding plate. | 03-25-2010 |
20100084116 | Structure of heat sink - An improved structure of a heat sink is disclosed. The heat sink is composed of a ring body, fins and a bottom plate. The fins are radially arranged on the ring body. The bottom plate is fixed in the ring body for being placed a heat source. The heat sink can effectively dissipate the heat from the heat source. | 04-08-2010 |
20100089549 | EXHAUST DEVICE - An exhaust device applied to an electronic device is described. Memory deformable elements of the exhaust device are heated to shrink, and meanwhile, guide vanes located on an air outlet are driven to rotate and swing back and forth between a left outlet position and a right outlet position, such that the exhaust device reciprocatively changes an outlet position without requiring any external power. | 04-15-2010 |
20100096106 | CLIP AND HEAT SINK ASSEMBLY HAVING THE SAME - A heat sink assembly includes a heat sink and a clip. The heat sink includes a base and a fin extending upwardly from the base. The clip is mounted on the fin and can be removed therefrom by moving upwardly along a height direction of the fin. The clip includes a resisting part contacting with a side of the fin, two locking parts respectively connected to two ends of the resisting part for securing the heat sink to a printed circuit board, and two stopping parts engaging with two opposites ends and an opposite side of the fin for preventing the clip from moving along widthwise and thickness directions of the fin. The two stopping parts are connected to the resisting part and located between the two locking parts. | 04-22-2010 |
20100096107 | HEAT DISSIPATION DEVICE - A heat dissipation device for removing heat from an electronic device and electronic components, includes a base plate in contact with the electronic device, a first fin set and a second fin set mounted on the base plate. The first fin set includes a plurality of first fins perpendicularly arranged on the base plate. The second fin set includes a plurality of second fins attached to a lateral side of the first fin set and perpendicular to both the first fins and the base plate. A fan is mounted on tops of the first fin set and the second fin set to cover both of them. Air generated by the fan flows through the first and second fin sets to cool the electronic components mounted on orthogonally neighboring sides of the heat dissipation device. | 04-22-2010 |
20100101756 | LIQUID-COOLING DEVICE - A liquid-cooling device for an electronic component includes a heat exchanger, a fin set, a plurality of heat pipes and a fan fastened to a front side of the fin set. The heat exchanger defines a sealed chamber and has two inclined faces facing opposite to each other on a top thereof, and has heat exchanging members in the sealed chamber. An outlet and an inlet are respectively formed on the two inclined faces and in fluidic communication with the sealed chamber. The fin set includes spaced fins laminated together. Each heat pipe includes a semicircular evaporating portion embedded in a bottom surface of the heat exchanger and a round condensing portion extending upwardly and received in the fin set. The fan is located above the heat exchanger and behind the inlet and outlet of the heat exchanger. | 04-29-2010 |
20100101757 | HEAT DISSIPATION DEVICE - A heat dissipation device removing heat from an electronic device includes a base plate, a fin set in thermal connection with the base plate, a fixing member and two fans. The fixing member includes a driving part coupled to a top of the fin set, two mounting parts located at two opposite sides of a circumference of the fin set and two connecting arms extending outwardly from the driving part and connecting with the two mounting parts. The two fans, respectively mounted on the two mounting parts of the fixing member and located at two opposite sites of the circumference of the fin set, are driven to rotate around the circumference of the fin set by the driving part and generate two streams of airflow which flow through the fin set that are non-intersecting. | 04-29-2010 |
20100101758 | HEAT DISSIPATION DEVICE WITH FAN - A heat dissipation device includes a heat sink, a fan mounted on a top side of the heat sink and an engaging member mounted on the heat sink. The engaging member includes an engaging portion and an elastic member. The engaging portion includes an extending portion and a pressing portion extending from an end of extending portion. The extending portion is slidably mounted on a fin of the heat sink. The elastic member is positioned around the extending portion and sandwiched between the fin and the pressing portion. The elastic member is compressed and offers a resilient force pushing the pressing portion to move towards the fan and press a side of the fan. | 04-29-2010 |
20100108292 | Heat sink system with fin structure - A heat sink apparatus includes a heat conductive base plate and a plurality of fins in thermal communication with the heat conductive base plate. The plurality of fins is configured to form a plurality of curved and branching channels extending radially on the base plate. At least two of the plurality of fins are configured with a gap between them to trip a gas boundary layer formed on a first one of the at least two fins, when a gas boundary layer is present. | 05-06-2010 |
20100116462 | HEAT DISSIPATION SYSTEM - A heat dissipation system comprises a printed circuit board and at least a heat dissipation device mounted on the printed circuit board for dissipating heat generated by an electronic member mounted on the printed circuit board. The at least a heat dissipation device comprises a base, a plurality of fins extending upwardly from the base and an air guiding member located at a corner of the base. These fins are spaced from each other to define a plurality of heat exchange passages. Non-fins are disposed at a side of the base to define a cooling air passage. The cooling air passage is parallel to the heat exchange passages of the fins. The air guiding member is located in the cooling air passage for controlling open and close of the cooling air passage. | 05-13-2010 |
20100122796 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a heat absorbing base, a heat conductive core, two fin assemblies and two heat pipes. The heat conductive core is attached to the heat absorbing base, and includes an elliptical, cylindrical body having an elliptical, cylindrical side surface. The two fin assemblies are located at two opposite sides of a major axis of the heat conductive core, respectively, and attached to the side surface of the heat conductive core. The two heat pipes connect the two fin assemblies with the heat absorbing base, respectively, transferring heat from the heat absorbing base to the fin assemblies. | 05-20-2010 |
20100126697 | HEAT SINK MODULE - A heat sink module includes a heat transfer tube, a plurality of radiation fins respectively riveted to locating grooves around the periphery of the heat transfer tube, and a heat transfer panel fastened to the bottom side of the heat transfer tube and the radiation fin set and kept in contact with a heat source, such as a CPU or a light emitting unit of a LED lamp for transferring heat from the heat source to the radiation fins for quick dissipation. | 05-27-2010 |
20100132918 | Cooling fan housing assembly - A cooling fan housing assembly for assembling to a heat sink includes a boosting portion and a connecting portion extended from the boosting portion. The connecting portion includes a first part and a second part for covering on and fixing to the heat sink. The second part of the connecting portion is provided with at least one hooking section for firmly hooking to the heat sink, so that a cooling fan supported on the cooling fan housing assembly can be quickly assembled to the heat sink without the risk of producing vibration during the operation of the cooling fan. Therefore, the cooling fan housing assembly not only reduces assembling labor and time and manufacturing cost, but also enables stable operation of the cooling fan. | 06-03-2010 |
20100132919 | HEAT SINK - A heat sink includes a plurality of metal fins interconnected together. Each metal fin includes a main plate, a flange extending forwardly from the main plate and an interlocking unit formed on the flange. The interlocking unit includes an engaging ear and a hook. The ear extends rearwards from a rear edge of the flange and defines a locking hole therein. The flange defines a cutout adjacent to a front edge thereof. The cutout is aligned with the ear and recessed rearwards from the front edge of the flange. The hook extends forwardly from the flange and is located within the cutout. The ear of a fin is engaged in the cutout of an adjacent rear fin. The hook of the adjacent rear fin is engaged in the locking hole of the engaging ear of the fin. | 06-03-2010 |
20100139888 | HEAT SPREADER AND HEAT DISSIPATION DEVICE USING SAME - A heat dissipation fan includes a fan frame, a bearing assembly, a stator and a rotor. The fan frame includes a base and a central tube. The central tube includes an open top end and an open bottom end. The base defines a receiving concave at a bottom surface thereof. The receiving concave communicates with the central hole. A top wall is formed by the base over the concave. A sidewall is formed between the top wall and the bottom surface of the base and surrounds the concave. A plurality of first locking units extend from the top wall into the receiving concave. The bearing assembly includes an oil sealing cover for sealing the open bottom end of the central tube. The oil sealing cover includes a plurality of second locking units which are detachably interlocked with the first locking units to mount the oil sealing cover to the base. | 06-10-2010 |
20100147490 | APPARATUS AND METHOD FOR PROVIDING IN SITU COOLING OF COMPUTER DATA CENTERS DURING SERVICE CALLS - An apparatus and method for cooling electronic components housed in a computer rack while performing maintenance operations is provided. The apparatus, in one embodiment, comprises a heat exchange assembly disposed within an outlet door cover of the computer rack, having one or more perforations. One or more air moving device(s) are also disposed on the outlet door and activated by an activator when the door is opened such that the devices when activated force hot air into the heat exchanger. Cool air is then exhausted through a planar containment plate having a plurality of edges. The plate is secured to top of the outlet door along one of its edges. | 06-17-2010 |
20100147491 | HEAT DISSIPATION DEVICE HAVING A FAN HOLDER FOR ATTACHMENT OF A FAN - A heat dissipation device includes a heat sink, a fan and a fan holder attaching the fan to the heat sink. The heat sink includes a base and a plurality of fins. The fan includes a frame and four engaging flanges at a periphery thereof. The fan holder includes a supporting board supporting the fan thereon, a plurality of spaced retaining plates extending downwardly from a periphery edge of the supporting board and clasping the fins, two locking sheets extending upwardly from two diagonal corners of the supporting board and two locking poles extending upwardly from another two diagonal corners of the supporting board. The locking sheets abut against lateral sides of two engaging flanges of the fan. The locking poles are engagingly received in another two engaging flanges of the fan. | 06-17-2010 |
20100155022 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink, a fan mounted on a side of the heat sink, and an engaging portion pivotally engaging with the heat sink and connecting the fan and the heat sink. The fan includes a bracket. A mounting plate with a mounting hole is formed by the bracket. The engaging portion includes a pivot portion pivotally engaging with the heat sink and a pressing portion extending from the pivot portion. A protruded portion extends downwardly from a bottom surface of the pressing portion. The pressing portion presses the mounting portion of the bracket of the fan and the protruded portion engages in the mounting hole of the mounting portion. | 06-24-2010 |
20100155023 | HEAT DISSIPATION APPARATUS HAVING HEAT PIPES INSERTED THEREIN - A heat dissipation apparatus includes a base, a heat sink on the base, two heat pipes thermally connecting the base and the heat sink and a fan mounted in the heat sink. The heat sink comprises a first fin group placed on the base and a second fin group located on the first fin group. Each heat pipe comprises an evaporation section connected to the base, a condensation section and an adiabatic section interconnecting the evaporation section and the condensation section. The condensation sections of the heat pipes are sandwiched between the first and second fin groups and surround the fan. | 06-24-2010 |
20100163210 | COOLING BOX FOR COMPONENTS OR CIRCUITS - A cooling box for electric or electronic components, consisting of a material, wherein the cooling box is non-electrically conductive or practically non-electrically conductive, is configured in one piece or multiple pieces and has a cavity that is enclosed by the material, wherein cavity being closed or provided with at least one opening. | 07-01-2010 |
20100170657 | Integrated blower diffuser-fin heat sink - An air-cooled heat exchange device for cooling an object such as an electronic device generating heat during use. The device includes a toroidal electric motor with a centrifugal blower for directing air flow in a downward and outward direction, a heat sink positioned to receive the air flow from the blower; and a spiral diffuser as part of the heat sink, the diffuser having vanes for directing the air flow spirally over the heat sink. The vanes may include microfabricated vibrating reeds and a plurality of microfabricated dimples on at least some of the vanes. | 07-08-2010 |
20100181046 | RING HEAT DISSIPATING DEVICE FORMED BY PUNCHING AND RIVETING THROUGH A SHAPING MOLD - A ring heat dissipating device is mainly assembled by a ring body, a bottom plate arranged inside the ring body, and a plurality of heat dissipating fins arranged outside the ring body. The bottom plate is punched by a mold so that the bottom plate is fixed to a predetermined position inside the ring body. The heat dissipating fins are inserted into slots on an outer surface of the ring body. After trenches between the slots are punched and deformed, the heat dissipating fins are tightly riveted by the deformed trenches. | 07-22-2010 |
20100212862 | Cooling structure for a housing - A cooling structure for a housing is located on the side board of the housing. The side board has a through hole. The cooling structure for a housing includes a cooling device and a fan device. The cooling device includes a cooling chip, a cooler and a heater. The cooling chip is located on the through hole of the side board, and has a cold end and a hot end. The cold end of the cooling chip is connected with the cooler. The hot end of the cooling chip is connected with the heater. The surface area of the heater is larger than ⅓ surface area of the side board. The fan device is located at one side of the side board, and corresponds to the heater. Thereby, the cooling device of the cooling chip is used for lowering the temperature in the housing. | 08-26-2010 |
20100212863 | HEAT DISSIPATION DEVICE HAVING A FAN HOLDER - A heat dissipation device includes a fin group, a fan and two fan holders fixing the fan onto a front side of the fin group. The fin group defines two elongated slots in two opposite lateral side thereof and two receiving grooves in two opposing inner faces of each elongated slot. The receiving grooves have openings defined at a top of the fin group. Each fan holder has a main plate attached to a lateral side of the fin group and a locking plate connected to an inner side of the main plate and being inserted into the two receiving grooves of a corresponding elongated slot from the openings at the top of the fin group. | 08-26-2010 |
20100212864 | PACKAGED HEAT DISSIPATING ASSEMBLY FOR AN INTERMEDIATE BUS CONVERTER - A packaged heat dissipating assembly for an intermediate bus converter (IBC) has a frame being mounted on and around the IBC and a heat sink being mounted on the frame. The packaged heat dissipating assembly is easily detached from the IBC. Therefore, a broken bus converter module (BCM) or heat sink is easily replaced separately. Consequently, heat dissipating designs and maintenance of a server or communication equipment is facilitated and maintenance costs of the IBC and the server or communication equipment are lowered. | 08-26-2010 |
20100218915 | Structure of LED Radiator - The improved structure of LED radiator comprises a radiator comprising with a better heat-dissipating plate bended through the machine as plurality of continuously arranged bottom area, side areas and top area. The length of the top area and the bottom area is the same. The top and the bottom areas are respectively vertical with the side area. The length of each side area is longer than each top and bottom area. | 09-02-2010 |
20100224344 | Vibration Proof Structure Of Fan - A vibration proof structure of a fan is provided. The vibration proof structure includes a frame, a plurality of buffer members, and a plurality of rigid rods. The frame is adapted for assembling with a blade assembly. The buffer members are assembled to the frame. The rigid rods are assembled inside the buffer members, respectively. Each of the rigid rods comprises an axially penetrated through hole. After the fan is secured to the object to which the fan is desired to be assembled, the vibration caused in the operation of the fan can be effectively absorbed by the buffer members, and thus the noises can be eliminated. | 09-09-2010 |
20100230074 | HEAT DISSIPATION APPARATUS - A heat dissipation apparatus includes a base with a bottom surface contacting a heat source, and a fin assembly disposed on a top surface of the base. The fin assembly includes a first heat dissipation member, and a second heat dissipation member symmetric with respect to a centerline of the fin assembly. Each heat dissipation member comprises a plurality of parallel fins vertically disposed on a top surface of the base, and a heat pipe passing through the plurality of parallel fins. | 09-16-2010 |
20100236754 | Airflow guider for use in heat sink - An airflow guider includes a plate-like member having a stop portion extending transversely, a rear inclined guiding portion extending downward rearward toward a first side from a top edge of the stop portion, a front inclined guiding portion extending slantwise forward toward the first side from the stop portion, and at least one fixture for installing the airflow guider to a heat sink. In light of the structure, the airflow guider can be coordinately installed to various kinds of heat sinks and provide additional thermal dissipation. | 09-23-2010 |
20100236755 | HEAT DISSIPATION DEVICE - A heat dissipation device adapted for removing heat from heat-generating components includes a plurality of first fins spaced from each other and connected to the heat-generating components in thermal relationship and a plurality of second fins alternately arranged with the first fins. Each second fin is wave-shaped and has a plurality of flat first engaging portions formed at wave crests thereof and a plurality of flat second engaging portions formed at wave troughs thereof. The first engaging portions are attached to a rear side of one of two first fins neighboring to each second fin. The second engaging portions are attached to a front side of another one of the two neighboring first fins. | 09-23-2010 |
20100236756 | THERMAL MODULE - A thermal module includes a heat spreader adapted for attaching to a heat-generating component, a fin unit, a heat pipe, and a securing structure for firmly pressing the heat pipe against the heat-generating component. The heat pipe includes an evaporation section attaching to the heat spreader and a condensation section attaching to the fin unit. The securing structure includes a mounting plate and a pair of bolts. Each bolt defines an annular notch in a middle thereof. The mounting plate includes a press portion and a pair of arms respectively extending from two opposite lateral sides of the press portion. A securing hole is defined in each of the arms. A plurality of tabs extend into each securing hole and snaps into the notch of a corresponding bolt with two ends of the corresponding bolt located at upper and lower sides of the securing hole. | 09-23-2010 |
20100243204 | HEAT RADIATING UNIT FOR ADAPTER - A heat radiating unit for adapter includes at least one receiving portion and a heat radiating portion. The receiving portion has at least one receiving space for receiving at least one adapter therein. The heat radiating portion includes a plurality of radiating fins, which are extended from an outer surface of the receiving portion in directions opposite to the receiving portion. With the heat radiating unit for adapter, heat produced by an adapter disposed in the receiving space can be transferred to and dissipated from the heat radiating portion to achieve good heat dissipation effect while largely increasing the usable life and power transmission efficiency of the adapter. | 09-30-2010 |
20100243205 | INTEGRATED THERMAL SYSTEM FOR COOLING MULTIPLE SEPARATE COMPONENTS OF AN ELECTRONIC DEVICE - The invention broadly contemplates an integrated thermal system that is capable of simultaneously cooling multiple, separate heat generating components of an electronic device. The integrated thermal system according to one embodiment of the invention takes the form of a CPU heat sink designed to intelligently maximize available airflow, utilizing multidirectional airflow cooling of a plurality of heat generating components on the motherboard. The heat sink is designed such that airflow provided by a single fan is captured and directed to nearby/adjacent components, thus cooling these components. The invention thus provides an integrated cooling solution and removes the need for multiple cooling systems/solutions. | 09-30-2010 |
20100243206 | HEAT SINK AND LATCH MECHANISM THEREOF - A latch mechanism includes a press portion, two connection portions, and two latch portions. The two connection portions are connected to opposite ends of the press portion correspondingly. Each connection portion includes two connectors. First ends of the two connectors are connected together to form a coupling end to connected to a corresponding end of the press portion. Each latch portion is selectively connected to the second end of one of the two connectors of a corresponding connection portion. | 09-30-2010 |
20100243207 | THERMAL MODULE - A thermal module comprises a flat heat spreader, a fin unit arranged above the heat spreader and a plurality of solid poles interconnecting the heat spreader with the fin unit. The heat spreader defines a chamber therein. A working fluid is filled in the chamber. A wick structure is received in the chamber and attached to an inner wall of the heat spreader surrounding the chamber. The fin unit comprises a plurality of fins stacked together. | 09-30-2010 |
20100258270 | HEAT SINKS WITH DISTRIBUTED AND INTEGRATED JET COOLING - A heat sink with distributed jet cooling is provided. The heat sink includes a base for thermal connection to at least one heated object, an array of fins thermally coupled to the base, and at least one multi-orifice synthetic jet or multiple single orifice jets disposed on a side of the array of fins. A heat sink with distributed and integrated jet cooling is also provided and includes a base and an array of fins. Respective ones of at least a subset of the fins comprise a synthetic jet configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink with distributed and integrated jet cooling is provided and includes a base, an array of fins and multiple synthetic jets coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins. | 10-14-2010 |
20100258271 | HEAT DISSIPATION DEVICE HAVING A FAN DUCT THEREON - A heat dissipation device includes a heat sink, a fan placed on a top of the heat sink for providing an airflow through the heat sink and a fan duct located at a side of the heat sink. The heat sink includes a plurality of upwardly extending first fins and a plurality of laterally extending second fins located below the first fins. A plurality of first airflow channels are defined in the adjacent first fins and a plurality of second airflow channels are defined in the adjacent second fins. The fan duct guides a significant part of the airflow produced by the fan to the second airflow channels from a lateral side of the heat sink to have a sufficient contact with the second fins of the heat sink. | 10-14-2010 |
20100258272 | HEAT DISSIPATION DEVICE HAVING FAN HOLDER FOR ATTACHMENT OF A FAN - A heat dissipation device includes a heat sink, a fan and a holding frame securing the fan onto the heat sink. The holding frame is mounted on a top of the heat sink and has four beams located around the top of the heat sink and defines an opening in a central part thereof corresponding to the heat sink. The holding frame has two air-guiding plates extending inwardly and downwardly from two inner edges of two opposite beams to two opposite lateral sides of the heat sink. The fan is mounted on the holding frame and covers the opening and the two air-guiding plates of the holding frame. | 10-14-2010 |
20100258273 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a base and a fin group placed on the base and a plurality of heat pipes thermally connecting the base and the fin group together. The base includes a substrate and a conducting plate attached to a bottom of the substrate. The heat pipes include evaporating sections and condensing sections extending upwardly from the evaporating sections and through the fin group. The evaporating sections are wholly accommodated in the substrate and in contact with the conducting plate. | 10-14-2010 |
20100288470 | HEAT DISSIPATION DEVICE - A heat dissipation device includes a plate, a protrusion to divide a top of the plate into a number of mounting areas, and a number of heat sinks selectively received on the number of mounting areas. | 11-18-2010 |
20100294462 | HEAT SINK AND HEAT-DISSIPATING FINS OF THE SAME - A heat sink and heat-dissipating fins have wave-shaped folds. The heat sink includes a plurality of heat-dissipating fins that are radially connected together to form a ring. The inside of the heat-dissipating fins is formed with an accommodating space for allowing a heat-generating element to be disposed therein. The heat-dissipating fin is a metallic piece with its one side bent vertically to form a fold. The fold is bent continuously to form a wave shape. Via the wave-shaped folds, the user can grip the heat-dissipating fins easily. Further, the rigidness and strength of the fold can be increased. | 11-25-2010 |
20100294463 | HEAT DISSIPATION DEVICE HAVING A FAN THEREON - A heat dissipation device includes a heat sink and a blower. The heat sink has a base and a plurality of fins formed on the base. The blower includes a frame and an impeller rotatably secured to the frame. The frame faces and is secured to the base of the heat sink to define an airflow passage between the base of the heat sink and the blower. An airflow inlet is defined through the frame of the blower. Another airflow inlet is defined through the base of the heat sink. An airflow produced by the blower passes through the airflow passage via the airflow inlets and then blows towards channels defined between the fins of the heat sink. | 11-25-2010 |
20100314073 | HEAT DISSIPATION DEVICE AND CLIP ASSEMBLY THEREOF - A heat dissipation device includes a heat sink, a positioning member and a wire clip. The heat sink includes a base and a plurality of fins. Two of the fins each form a hook. The positioning member includes a seat and two positioning arms each forming two opposite fingers. A receiving groove is defined under the seat, and a positioning slot is defined through a central portion of the seat. The seat is laterally sandwiched between the two fins and vertically sandwiched between the base and the hooks. Each of the two fins is sandwiched between the two fingers. The wire clip includes a resisting portion forming a protrusion and two clipping arms. The resisting portion rests on the base and is received in the receiving groove. The protrusion is received in the positioning slot. | 12-16-2010 |
20110011562 | FRONT-TO-BACK COOLING SYSTEM FOR MODULAR SYSTEMS WITH ORTHOGONAL MIDPLANE CONFIGURATION - A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. Each set of modules is independently cooled. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exhausts from a back of the apparatus. A horizontal set of modules is cooled with horizontal front-to-back air flow. When the horizontal set of modules is at the front of the apparatus, a plenum extending exterior to the vertical set of modules allows exhausting horizontally flowing air to the rear of the apparatus. When the horizontal set of modules is at the rear of the apparatus, a plenum extending exterior to the vertical set of modules allows moving air from the front of the apparatus to a chamber holding the horizontal modules. | 01-20-2011 |
20110030920 | Heat Sink Structure - A heat sink structure includes a heat dissipating body and at least one heat pipe. The heat dissipating body includes a main body having two opposite first and second end faces, and a plurality of radiating fins formed on two wall surfaces of the main body. The heat dissipating body is made of a heat-conducting plastic material through injection molding, and the heat pipe is embedded in the heat dissipating body during the process of injection molding the heat dissipating body. The heat pipe has two opposite first and second ends respectively exposed from the first and second end faces of the heat dissipating body for directly contacting with a heat source, and a pipe body helically extended between the first and second ends and embedded in the heat dissipating body. With these arrangements, the heat sink structure has reduced weight and material cost while providing good heat dissipating effect. | 02-10-2011 |
20110048675 | HEAT SINK - A heat sink includes a plurality of first fins and a plurality of second fins. Each first fin and each second fin includes an inner end and an outer end opposite to the inner end, respectively. Each of the second fins is sandwiched between two respective adjacent first fins. The inner end of each of the first fins is engagingly received in the inner end of the previous adjacent first fin, sandwiching the inner end of a corresponding second fin therebetween. The outer end of each of the first fins is engagingly received in the outer end of the previous adjacent second fin, and the outer end of each of the second fins is engagingly received in the outer end of the previous adjacent first fin. | 03-03-2011 |
20110079370 | Non-Uniform Height And Density Fin Design For Heat Sink - A heat sink includes a heat sink plate and a heat generating electrical component mounted to a first side of the heat sink plate. Fins are connected and oriented perpendicular to a second side of the heat sink plate. The fins include a maximum height fin positioned proximate to the electrical component, and a minimum height fin spatially separated from the maximum height fin and the electrical component. A first group of fins is positioned between the maximum and minimum height fins. Each fin of the first group progressively decreases in height from a height of the maximum height fin to a height of the minimum height fin. A first spacing between the maximum height fin and a proximate one of the fins of the first group is less than a second spacing between any two consecutive ones of the first group of fins. | 04-07-2011 |
20110108237 | HEATSINK WITH FLEXIBLE BASE AND HEIGHT-ADJUSTED COOLING FINS - One embodiment provides a heatsink having a flexible base and height-adjusted cooling fins. The flexible base includes a single base plate, with cooling fins and heat pipes secured directly to an upper surface of the single base plate. The use of the single base plate allows the length of the cooling fins to be increased. The use of a single base plate also allows the base to flex when mounted at the outer region of the base plate to a circuit board using fasteners. The flexure of the base biases the heatsink against the heat-generating component. The flexure also displaces the outer cooling fins, and the length of the outer cooling fins is further increased to compensate for the anticipate displacement. | 05-12-2011 |
20110315343 | INTERLEAVED, IMMERSION-COOLING APPARATUSES AND METHODS FOR COOLING ELECTRONIC SUBSYSTEMS - Cooling apparatuses and methods are provided for immersion-cooling of an electronic subsystem of an electronics rack. The cooling apparatuses include a housing at least partially surrounding and forming a sealed compartment about the electronic subsystem and a dielectric fluid disposed within the sealed compartment, with the electronic subsystem being immersed within the dielectric fluid. A liquid-cooled vapor condenser is provided which includes a plurality of thermally conductive condenser fins extending within the sealed compartment. The condenser fins facilitate cooling and condensing of dielectric fluid vapor generated within the sealed compartment. Within the sealed compartment, multiple thermally conductive condenser fins are interleaved with multiple fluid-boiling fins of a heat spreader coupled to one or more of the electronic components immersed within the dielectric fluid. The interleaved fins facilitate localized cooling and condensing of dielectric fluid vapor within the sealed compartment. | 12-29-2011 |
20120031585 | DATA CENTER WITH FIN MODULES - A system for providing computing capacity includes a base module and two or more fin modules coupled to the base module. At least one of the fin modules includes one or more fins and two or more computer systems coupled to the fins. At least one of the fins to which the computer systems are coupled extends from the base module such that the fin has a primarily vertical orientation. An electrical power bus in the base module supplies power to computer systems of the fin modules. The site of operation may be indoors, out of doors, or in a limited shelter. | 02-09-2012 |
20120073784 | MACHINE TOOL WITH A HEAT CONDUCTION STRUCTURE - A machine tool with a heat conduction structure comprises a machine tool and a heat dissipation seat installed on the machine tool. The machine tool has a handle. The handle has an accommodation space accommodating a circuit board and having an opening at one end. The heat dissipation seat has a heat dissipation member arranged on the opening and a carrying member connected with the heat dissipation member and extended to the accommodation space. The carrying member carries the circuit board, contacts heat sources of the circuit board, and conducts heat to the heat dissipation member. As the machine tool is exempted from forming heat dissipation holes on the handle, the present invention can effectively prevent dust from entering the handle and damaging the circuit board. Further, the present invention can dissipate heat generated by the circuit board and maintain normal operation of the circuit board and the machine tool. | 03-29-2012 |
20120085516 | HEAT SINK AND LED COOLING SYSTEM - A heat sink for cooling LEDs, which includes a heat sink housing which is configured as a finned concentric tube configuration. Also, an LED heat sink assembly and an LED cooling system which include a heat sink housing which is configured as a finned concentric tube configuration. Also, a method for cooling LED modules. | 04-12-2012 |
20120111534 | SERVER CABINET - A server cabinet includes a rack, at least one assembling frame, a radiator and at least one fan. The rack has a first frame and a second frame opposite to each other. The assembling frame and the radiator are mounted on the first frame in sequence. The radiator transfers a coolant to flow inside a plurality of heatsink fins thereof in a circulating manner. The fan is mounted in the assembling frame, and the fan guides an airflow to flow into the first frame from the radiator, and blows the airflow in the rack to the second frame, thus lowering the temperature inside the rack. | 05-10-2012 |
20130133859 | HEAT SINK WITH HEAT BUS AND FIN STRUCTURE - A heat sink to remove heat from a processor within a chassis to air moving through a fin structure on the heat sink. An embodiment of the heat sink comprises a heat bus engaging the processor to conduct heat from the processor to a fin structure having interconnected, repeating cellular air channels. A U-shaped heat bus comprises a base and first and second legs extending therefrom connected to opposite sides of the fin structure. An embodiment of the heat bus has a solid conductive core to conductively transfer heat from the processor through the base and the first and second legs to sides of the fin structure. Alternately, an embodiment of the heat bus has a hollow core containing a fluid to evaporatively transfer heat from the processor through the base and the first and second legs to sides of the fin structure. | 05-30-2013 |
20130264029 | HEAT DISSIPATING MODULE CAPABLE OF ENHANCING HEAT DISSIPATING EFFICIENCY - A heat dissipating module includes a heat dissipating member and an air flow guiding mechanism. The air flow guiding mechanism includes a base, an air guiding plate and a stopping structure. The base is disposed on a side of the heat dissipating member, and the air guiding plate is pivoted to the base. The stopping structure is disposed on the base. A side of the stopping structure abuts against the air guiding plate, so as to allow the air guiding plate to rotate in a first direction and to stop the air guiding plate from rotating in a second direction opposite to the first direction. | 10-10-2013 |
20130299133 | HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COMPRESSION BONDING PROCESS - Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block. | 11-14-2013 |
20140034270 | Systems and Methods for Dissipating Heat in an Enclosure - An enclosure is presented. The enclosure includes an outer casing having one or more walls. Further, the enclosure includes a synthetic jet assembly configured to dissipate heat from the one or more walls, where the synthetic jet assembly includes a bracket operatively coupled to the one or more walls of the outer casing and two or more synthetic jets operatively coupled to the bracket, where the two or more synthetic jets are arranged in a multi-dimensional array. | 02-06-2014 |
20140069611 | Heat Dissipater - Embodiments of the present invention provide a heat dissipater and relate to the communications field. The heat dissipater includes a sub heat dissipater, a connecting apparatus, and a shared bracket; the sub heat dissipater is connected to the shared bracket through the connecting apparatus; the sub heat dissipater includes a first heat conducting surface, and the sub heat dissipater contacts a first heat source through the first heat conducting surface to dissipate heat for the first heat source; the shared bracket includes a second heat conducting surface, and the shared bracket contacts a second heat source through the second heat conducting surface to dissipate heat for the second heat source; and the second heat conducting surface and the sub heat dissipater are disposed in different positions of the shared bracket respectively. | 03-13-2014 |
20140150993 | BASE WITH HEAT ABSORBER AND HEAT DISSIPATING MODULE HAVING THE BASE - An exemplary base includes a heat absorber and clips attached to the heat absorber. The heat absorber includes a top surface and a bottom surface. A pair of receiving grooves is defined in opposite lateral sides of the heat absorber, respectively. Each receiving groove is located above a level of the bottom surface and below a level of the top surface. Each clip includes a positioning beam. The positioning beam is received in a corresponding one of the receiving grooves with a portion of the heat absorber adjacent to the positioning beam deformed and fixed in the positioning beam thereby fixing the positioning beam in the receiving groove. A heat dissipating module having the base is also provided. | 06-05-2014 |
20140166235 | DEVICE FOR GENERATING AN AIRFLOW FOR COOLING A HEAT DISSIPATING ELECTRONIC ELEMENT SUCH AS AN LED - The device for generating an air flow for cooling a heat dissipating electronic element such as an LED comprises a channel ( | 06-19-2014 |
20140182815 | HOLDER FOR PORTABLE ELECTRONIC DEVICE - A holder for a portable electronic device includes a seat, a receiving member, a thermal pad, and a heat dissipation sink. The receiving member is connected to the seat, and defines a receiving space configured to receive the portable electronic device. The thermal pad is received in the receiving space, and the heat dissipation sink is connected to the receiving member. When the portable electronic device is received in the receiving space, the thermal pad contacts the portable electronic device and transmits heat generated by the portable electronic device to the receiving member, so that the heat is dissipated by the heat dissipation sink. | 07-03-2014 |
20140202657 | METHOD AND APPARATUS FOR REMOVING HEAT FROM ELECTRONIC DEVICES USING SYNTHETIC JETS - An apparatus for removing heat comprises a heat sink having a cavity, and a synthetic jet stack comprising at least one synthetic jet mounted within the cavity. At least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod. The synthetic jet comprises at least one orifice through which a fluid is ejected. | 07-24-2014 |
20140262151 | CHANNEL DIVERSION DEVICE AND RELATED HEAT DISSIPATING SYSTEM - A channel diversion device includes a supporting structure, a piercing hole structure, a guiding baffle and a collecting mask. An electronic component can be accommodated inside the supporting structure. The supporting structure includes a first structural layer and a second structural layer. An opening is formed on the second structural layer. The piercing structure is formed on a lateral wall of the first structural layer, and the guiding baffle is disposed by a side of the opening on the second structural layer. The collecting mask is disposed by the first structural layer to cover the piercing hole structure, and a direction of an outlet of the collecting mask is substantially different from a direction of the opening on the second structural layer. | 09-18-2014 |
20140318740 | CHASSIS WITH DISTRIBUTED JET COOLING - A chassis with distributed jet cooling is provided. The chassis includes one or more sidewalls defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly comprising a multi-orifice synthetic jet or a number of single orifice synthetic jets disposed on a side of a respective one of the array(s) of fins. The chassis further includes at least one attachment means for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls. | 10-30-2014 |
20140332182 | Heat Sink For Cooling Power Electronics - A heat sink device for cooling a power electronics module includes a base platform having a first surface and a second surface on opposite sides of the base platform, a plurality of upright members extending outwardly from the first surface of the base platform and defining a cavity wherein the power electronics module is disposed in conductive heat exchange relationship with the first surface of the base platform, and a plurality of heat transfer fins extending outwardly from the second surface of the base platform and defining a plurality of cooling air flow channels. | 11-13-2014 |
20140338861 | CHASSIS WITH DISTRIBUTED JET COOLING - A chassis with distributed jet cooling is provided. The chassis includes one or more sidewalls defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly comprising a multi-orifice synthetic jet or a number of single orifice synthetic jets disposed on a side of a respective one of the array(s) of fins. The chassis further includes at least one attachment means for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls. | 11-20-2014 |
20140338862 | CHASSIS WITH DISTRIBUTED JET COOLING - A chassis with distributed jet cooling is provided. The chassis includes one or more sidewalls defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly comprising a multi-orifice synthetic jet or a number of single orifice synthetic jets disposed on a side of a respective one of the array(s) of fins. The chassis further includes at least one attachment means for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls. | 11-20-2014 |
20150136357 | HEAT DISSIPATION ASSEMBLY - A heat dissipating assembly including a layered stack of materials with a highly thermally conductive path for cooling a circuit, the stack including a structurally isolated material having a high coefficient of thermal expansion connected between materials having low coefficients of thermal expansion. | 05-21-2015 |
20150136358 | COOLING ELEMENT - A cooling element includes a first surface for receiving an electric component, and a second surface which is provided with fins for forwarding a heat load received from the electric component via the first surface to surroundings. One or more of the fins are provided with a respective flow channel for passing a fluid within each respective fin, to provide efficient cooling. | 05-21-2015 |
20150294886 | METHODS AND APPARATUS FOR RAPIDLY COOLING A SUBSTRATE - Embodiments of methods and apparatus for rapidly cooling a substrate are provided herein. In some embodiments, a cooling chamber for cooling a substrate includes a chamber body having an inner volume; a substrate support disposed in the chamber and having a support surface to support a substrate; a plate disposed in the chamber body opposite the substrate support, wherein the substrate support and the plate are movable with respect to each other between a first position and a second position, wherein when in the first position the substrate support and the plate are disposed away from each other such that the support surface is exposed to a first volume within the inner volume, wherein when in the second position the substrate support and the plate are disposed adjacent to each other such that the support surface is exposed to a second volume within the inner volume, and wherein the second volume is smaller than the first volume; a plurality of flow channels disposed in one or more of the plate or the substrate support to flow a coolant; and a gas inlet to provide a gas into the second volume. | 10-15-2015 |
20150305208 | Data Centre - A data centre ( | 10-22-2015 |
20150336470 | DEHUMIDIFICATION CHAMBER FOR BATTERY SYSTEMS AND RELATED METHODS - The present disclosure relates to reducing formation of condensate in a battery compartment using a dehumidification chamber in which air is conditioned prior to entering the battery compartment. In one embodiment, a cooling system may be configured to produce a flow of coolant. The dehumidification chamber configured to receive a flow of ambient air from an environment. A heat transfer device may be in thermal communication with the dehumidification chamber and configured to receive the flow of coolant. The heat transfer device may produce a flow of conditioned air from a thermal interaction between the flow of coolant and the flow of ambient air. The battery compartment may house a battery and may receive the flow of conditioned air and the flow of coolant. In some embodiments, the flow of coolant may pass through the heat transfer device before the flow of coolant passes through the battery compartment. | 11-26-2015 |
20150342085 | Heat Dissipative Air Guide - An improved shielding cage assembly that utilizes air guides is disclosed. The shielding cage has a hollow interior configured to receive an electronic module therein which generates heat during operation. An air guide member is provided that defines an entry for surrounding air to enter the shielding cage interior and circulate around the electronic module. A thermal transfer member is provided that defines at least one exit passage for the air in the interior of the shielding cage to exit. | 11-26-2015 |
20150342091 | HEAT SINK AND HOUSING FOR AN INVERTER WITH SUCH A HEAT SINK - A heat sink for cooling electronic power components arranged in a housing includes a cooling element having cooling fins arranged on a base surface, and a fan for intake of ambient air and for delivering the ambient air via the cooling fins of the cooling element, the cooling element having a recess, in which the fan is arranged spaced apart from the base surface. The fan includes a housing ring on the side facing away from the base surface of the cooling element, an intermediate space being formed between the bottom edge of the housing ring and the base surface of the cooling element. The fan is an axial fan, so that the ambient air taken in impinges upon the base surface of the cooling element, is deflected by essentially 90 degrees and guided through the intermediate space laterally between the cooling fins to the outside. | 11-26-2015 |
20150359142 | METHOD FOR PRODUCING COOLING DEVICE AND HEAT-DISSIPATING MEMBER - In the method for producing a heat-dissipating member of the present invention, the heat-dissipating member having a plurality of heat dissipation fins and lateral walls is produced by using a forging method such as impact molding. The producing method comprises: positioning a metal material on a lower die provided with projections corresponding to positions at which the plurality of heat dissipation fins and lateral walls to be provided in the heat-dissipating member are to be formed; and molding the metal material by pressing an upper die having recesses for molding the heat dissipation fins and lateral walls against the lower die on which the metal material is positioned, in a manner such that the recesses correspond to the projections on the lower die. | 12-10-2015 |
20160027718 | COMPOSITE SHEET AND DISPLAY DEVICE COMPRISING THE SAME - A display device including: a display panel; a bottom cover configured to accommodate the display panel; and a composite sheet disposed between the display panel and the bottom cover. The composite sheet includes a buffer sheet having at least one through hole and at least one heat-dissipating sheet accommodated in the through hole. | 01-28-2016 |
20160029516 | ADVANCED HEAT EXCHANGER WITH INTEGRATED COOLANT FLUID FLOW DEFLECTOR - A pin fin cooling system may include at least one first surface defining at least a base portion of the cooling system, and at least one pin fin array of a plurality of pin fins and at least one coolant fluid flow detector extending from the first surface. The coolant fluid flow deflector may be configured to split a coolant fluid flow from a primary flow into at least two secondary flows that follow a predetermined path over local heat sources, and may have a maximum wall thickness that is equal to a diameter of a cross-section of one of the pin fins. The cooling system may further include at least one boundary fin extending from the first surface that is in the shape of a spline, at least a portion of which may correspond and match at least a portion of a pattern of the pin fin array. | 01-28-2016 |
20160076755 | Heat Sink for Solid State Lamps - A heat sink of compact design that allows for direct mounting of solid state lights such as LED arrays to the heat sink, while providing a physical arrangement that maximizes the surface area available for effective heat dissipation, is provided. The heat sink of the present invention features a hollow, polyhedral core body and an outer structure comprised of a plurality of mounting surfaces for solid state lights. The outer structure is generally in the form of a tapered polyhedron with relieved cutouts at the corners to form a plurality of triangular shaped heat transfer structures. The outermost wall of each triangular shaped heat transfer structures comprises the mounting surface for an array of solid state | 03-17-2016 |
20160081225 | STACKABLE ROTATED HEAT SINK - A cooling assembly is provided which has a heat-transferring member, a heat sink assembly, and a plurality of heat-transferring columns. The heat-transferring member has first and second sides and the first side of the heat-transferring member is configured for attachment to a heat-generating body. The heat sink assembly includes first and second heat sinks provided in a stacked configuration. The first heat sink is between the second side and the second heat sink. Each of the first and second heat sinks has first and second support portions. Each of the first and second support portions has fins extending therefrom. The second heat sink is provided at an offset angle relative to the first heat sink. Each heat-transferring column extends from the second side of the heat-transferring member. Each heat-transferring column is configured to engage the heat sink assembly and to support the heat sink assembly relative to the heat-transferring member. | 03-17-2016 |
20160088770 | HEATSINK EQUIPPED WITH PLURAL FINS WHOSE CONNECTION METHODS ARE DIFFERENT - A heatsink comprises a heat receiving member having a first surface to which a heat generating component which needs to be cooled is attached and a second surface which is opposite to the first surface, and a plurality of fins protrudingly provided from the second surface of the heat receiving member. The plurality of fins include a first fin protrudingly provided on a first region of the second surface of the heat receiving member by a first attachment structure, and a second fin protrudingly provided on a second region of the second surface of the heat receiving member by a second attachment structure different from the first attachment structure. | 03-24-2016 |
20160095256 | HEAT DISSIPATION MODULE - A heat dissipation module includes a hollow housing, a plurality of heat dissipation fins and heat dissipation liquid. The hollow housing includes a chamber, a side surface, a top surface and a bottom surface opposite to the top surface. The side surface is connected to the top surface and the bottom surface. The heat dissipation fins are disposed on the side surface. The heat dissipation liquid is contained within the chamber, and a specific heat of the heat dissipation liquid is substantially greater than or equal to 1 cal/g° C. | 03-31-2016 |
20160106000 | LOW PROFILE HEAT SINK - A heat sink for an electronic component includes a base having a width. The base has a greater thickness at a middle portion along the width than at opposite end portions along the width. A plurality of elongate fins project from an upper surface of the base and extend in directions perpendicular to the upper surface. | 04-14-2016 |
20160135316 | CANISTER COOLING - A canister is disclosed for housing an electronic component. The canister includes a wall section with an inner wall surface directed to an inner volume of the canister. The inner wall surface includes a guiding structure with at least one guiding channel for guiding a medium inside the inner volume along the inner wall surface. | 05-12-2016 |
20160169594 | HEATSPREADER WITH EXTENDED SURFACE FOR HEAT TRANSFER THROUGH A SEALED CHASSIS WALL | 06-16-2016 |
20160174411 | AIR CONDITIONER | 06-16-2016 |
20160177159 | MULTI-PHASE ELASTOMERIC THERMALLY CONDUCTIVE MATERIALS | 06-23-2016 |
20160178289 | KINETIC HEAT-SINK WITH INTERDIGITATED HEAT-TRANSFER FINS | 06-23-2016 |
20160381833 | HEAT SINK, METHOD FOR MAKING THE SAME, AND ELECTRONIC DEVICE HAVING THE SAME - A heat sink includes a connecting member, a first substrate, a second substrate, and a cooling medium. The connecting member is sandwiched between the first substrate and the second substrate, and defines at least one hole passing through the connecting member. Each hole includes a first end and a second end respectively enclosed by the first substrate and the second substrate to define a cavity. The cooling medium is filled in each cavity. | 12-29-2016 |
20180025924 | METHODS AND APPARATUS FOR RAPIDLY COOLING A SUBSTRATE | 01-25-2018 |
20190146315 | Heat Dissipation Module | 05-16-2019 |