Class / Patent application number | Description | Number of patent applications / Date published |
156321000 | Heating adhesive by contacting with heated lamina | 6 |
20080236742 | DENSIFICATION OF COMPRESSIBLE LAYERS DURING ELECTRODE LAMINATION - A compressible and deformable layer is densified and laminated to a layer of a material that is relatively resistant to stretching. The densification and bonding take place in a single step. As used in fabrication of electrodes, for example, electrodes for double layer capacitors, a deformable and compressible active electrode film is manufactured from activated carbon, conductive carbon, and a polymer. The electrode film may be bonded directly to a collector. Alternatively, a collector may be coated with a wet adhesive layer. The adhesive layer is subsequently dried onto the foil. The dried adhesive and foil combination may be manufactured as a product for later sale or use, and may be stored as such on a storage roll or other storage device. The active electrode film is overlayed on the metal foil, and processed in a laminating device, such as a calendar. Lamination both densifies the active electrode film and bonds the film to the metal foil. Spreading of the active electrode film in the plane parallel to the plane of the metal foil is reduced or eliminated during lamination, because of the adhesion between the film and the foil. | 10-02-2008 |
20090025873 | Impack Resistant Composite Building Panel - A composite building panel that includes a fabric reinforcing sheet between one of the metal skins and the core of the panel. The fabric reinforcing sheet, which is preferably made from aramid fibers improves the impact resistance and penetration resistance of the building panel without substantially increasing weight and without adding fuel content to the panel system. | 01-29-2009 |
20090078369 | Method and Apparatus for Forming Insulated Rotor Conductors - An apparatus is disclosed for forming an insulated rotor conductor by bonding an insulating material onto a single side of a flat electrical conductor under controlled heat and mechanical pressure. The rotor conductor is suitable for assembly into the rotor assembly of a rotating electrical machine such as an alternating current generator. The apparatus includes modules to facilitate easy relocation within a manufacturing environment and to make efficient use of available manufacturing space. A corresponding method is also disclosed. | 03-26-2009 |
20090114340 | Water-based adhesive curing process and associated apparatus - A process and implementing apparatus are disclosed by which the curing time of a water-based adhesive is shortened as applied to the bonding of two fibrous substrates, such as paperboard or corrugated fiberboard. | 05-07-2009 |
20100224319 | METHOD OF ASSEMBLING PAGEWIDTH PRINTHEAD - A method of assembling a pagewidth printhead. The method includes: aligning a multilayered adhesive film an said ink supply manifold such that ink supply holes in the film are aligned with respective ink outlets in the ink supply manifold; bonding a first adhesive layer of the film to a manifold bonding surface; heating a printhead integrated circuit and positioning the heated printhead integrated circuit on an opposite side of the film such that each ink supply hole is aligned with an ink inlet defined in a printhead bonding surface of the printhead integrated circuit; and repeatedly bonding printhead integrated circuits to the film to provide the pagewidth printhead. | 09-09-2010 |
20100294428 | Method of Integrating Electrochemical Devices Into and Onto Fixtures - Methods of integrating an electrochemical device to a fixture are disclosed. When performed, these methods may, for example, result in the improved performance and/or extended shelf life of the electrochemical device. These methods may include, for example, discharging an electrochemical device prior to an integration process, limiting the temperature exposure of the electrochemical device during the integration process, and/or applying a constraining force to a surface of the electrochemical device during an integration process. | 11-25-2010 |