Entries |
Document | Title | Date |
20080201945 | PRINTED CIRCUIT BOARD MANUFACTURING METHOD, PRINTED CIRCUIT BOARD, AND ELECTRONIC APPARATUS - A printed circuit board manufacturing method includes: a hole-forming step of forming a through hole in a substrate that will become an element of a printed circuit board after manufacturing; and a jig insertion step of inserting a jig in the through hole formed in the hole-forming step such that the jig adheres to a portion of an inner wall of the through hole, the inner wall having a portion connecting to the outside of the through hole. The method further includes a conductive-film forming step of forming a conductive film only on the portion of the inner wall of the through hole connecting to the outside of the through hole, after the jig is inserted into the through hole in the jig insertion step. | 08-28-2008 |
20080209722 | Method for forming via hole having fine hole land - A method for forming a via hole having a fine hole land with which the density of circuit patterns can be increased. The method includes forming a via hole in a copper clad laminate, coating an etching resist over the copper clad laminate, and forming a circuit pattern on the copper foil of the copper clad laminate; forming a seed layer, coating a photoresist, and exposing an inner wall of the via hole; and forming a plated layer on the inner wall of the via hole and removing the photoresist and the seed layer. | 09-04-2008 |
20080216314 | METHOD FOR MANUFACTURING THE BGA PACKAGE BOARD - Disclosed herein is a Ball Grid Array (BGA) package board. The BGA package board includes a first external layer on which a pattern comprising a circuit pattern and a wire bonding pad pattern is formed, a second external layer on which a pattern comprising a circuit pattern and a solder ball pad pattern is formed, an insulating layer formed between the first and second external layers, a first outer via hole to electrically connect the first and second external layers to each other, and a solder resist layer formed on each of the first and second external layers, with portions of the solder resist layer corresponding to the wire bonding pad pattern and the solder ball pad pattern being opened. The solder ball pad pattern is thinner than the circuit pattern of the second external layer. | 09-11-2008 |
20080250637 | METHOD FOR MANUFACTURING MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD - A method for manufacturing a multilayer FPCB includes the steps of: providing a first substrate, a second substrate and a binder layer; defining an opening on the binder layer; defining a first slit in the dielectric layer of the first substrate; laminating the first substrate, the binder layer and the second substrate; forming a second slit in the conductive layer of the first substrate, the second slit is configured to be aligned with the first slit, cutting the first substrate, the binder layer and the second substrate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas. | 10-16-2008 |
20080282538 | Print board and manufacturing method thereof - A method for manufacturing such a printed board with high efficiency is disclosed. The printed board is able to cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device. Since a carbon layer principally made of carbon and having excellent heat conductivity is provided inside an insulator or on a surface of the insulator in a laminated form, heat generated by the electronic component when the electronic component is energized is conducted to the carbon layer, diffused through the carbon layer, and then radiated to the outside. Therefore, the heat generated by the electronic component can be reliably radiated by heat conduction to the carbon layer and heat diffusion through the carbon layer, thereby cooling the electric component with high efficiency. | 11-20-2008 |
20080289178 | PROCESS FOR FORMING AN ISOLATED ELECTRICALLY CONDUCTIVE CONTACT THROUGH A METAL PACKAGE - A method of forming an isolated electrically conductive contact through a metal substrate by creating at least one via through the substrate. The at least one sidewall of the via is cleaned and coated with a non-conductive layer. In one example, the non-conductive layer is formed by anodizing the sidewall(s) of the via. In another example, the non-conductive layer may be formed by thin film deposition of a dielectric on the sidewall(s). An electrically conductive filler is then placed into the via. In the examples disclosed, the filler may be a conductive ink or a conductive epoxy. | 11-27-2008 |
20080301936 | Method For Interconnecting Tracks Present on Opposite Sides of a Substrate - A method and device for making an electrically conductive connection between two electrically conductive tracks present on two opposite sides of a dielectric substrate. The method: a) provides the substrate, with at least one first electrically conductive track present on one side thereof and at least one second electrically conductive track present on the other side of the substrate opposite the one side, b) forms a through hole through the substrate and through two opposite parts of a first track and a second track, respectively, and c) makes an electrically conductive connection via the through hole between the first track through which the through hole has been formed and the second hole through which the through hole has been formed. | 12-11-2008 |
20080307644 | Metal plugged substrates with no adhesive between metal and polyimide - In a method and apparatus for fabricating a semiconductor device having a flexible tape substrate, a hole is punched in the flexible tape substrate. The flexible tape substrate includes a metal layer attached to a polyimide layer without an adhesive there between. A cover is placed on the metal layer to cap a base of the hole. A metal is deposited on the cover exposed at the base of the hole, the metal being used to form a bond with the metal layer. The metal being deposited causes the hole to be plugged up to a selective height. Upon removal of the cover, the metal may also be deposited on the metal layer to increase a thickness of the metal layer. | 12-18-2008 |
20090013527 | COLLAPSABLE CONNECTION MOLD REPAIR METHOD UTILIZING FEMTOSECOND LASER PULSE LENGTHS - A method for repairing molds for collapsible connections utilizing a femtosecond laser pulse length. Also provided is a laser source for implementing a multistep profile repair process for the removal of excess material in C4 molds by utilizing the femtosecond laser pulse lengths. | 01-15-2009 |
20090019693 | PRINTED WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A solder resist comprising a thermosetting resin is printed on a surface of an insulating board ( | 01-22-2009 |
20090070996 | PRINTED CIRCUIT BOARD MANUFACTURING METHOD - A method for manufacturing a printed circuit board, including providing a core substrate and an electronic component contained in the core substrate, the electronic component having a die pad, forming a positioning mark on the core substrate, forming an interlayer insulating layer over the core substrate and the electronic component, forming a via hole opening connecting to the die pad of the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate, and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the die pad. | 03-19-2009 |
20090090004 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A method for manufacturing a printed circuit board having a substrate composed of an insulation material, a via hole formed in the substrate, and a via land formed around the opening of the via hole on a surface of the substrate includes processes of measuring deformation of the substrate having the via hole formed therein, calculating a position where the via land is to be patterned on the basis of the deformation of the substrate measured in the measurement process, and patterning the via land at a position corrected on the basis of the value calculated in the calculation process. | 04-09-2009 |
20090094825 | METHOD OF PRODUCING SUBSTRATE - The method of producing a substrate comprises the steps of: forming a through-hole in a base member; plating the base member so as to coat an inner face of the through-hole with a plated layer; applying photo resist on the base member; optically exposing and developing the photo resist so as to form a resist pattern, which coats at least a planar area of the through-hole; and etching an electrically conductive layer formed on the surface of the base member. The resist pattern is formed so as to separate an area of exposing the conductive layer a prescribed distance away from an edge of the through-hole, and the prescribed length is longer than a distance of etching a side face of the conductive layer in the etching step. | 04-16-2009 |
20090106977 | Manufacturing method of printed circuit board - A manufacturing method of a printed circuit board is disclosed. The method may include: forming a circuit pattern on a surface of an insulation layer, made primarily from a thermoplastic resin, such that the circuit pattern protrudes from the surface of the insulation layer, and burying the circuit pattern in the insulation layer by pressing the circuit pattern. | 04-30-2009 |
20090113705 | Method of making a Wiring Board having an Engineered Metallization Layer and Resultant Apparatus - The present invention relates to a method of manufacturing a printed wiring board (PWB) of the type depicted in FIG. | 05-07-2009 |
20090119915 | Method for Manufacturing Circuit Device - A method for manufacturing a circuit device, which is suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, is provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first wring layer is formed by laminating a first conductive film on a first insulating layer, and patterning the first conductive film. In the first wiring layer, a first connection part which is protruded in a thickness direction is formed. Moreover, the first wiring layer including the first connection part is covered with a second insulating layer. The second insulating layer is formed of a first resin film and a second resin film. The second resin film contains fewer inorganic fillers than the first resin film. Thus, there is an advantage that a through-hole can be easily formed. | 05-14-2009 |
20090139086 | METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD - The present invention relates to a method for manufacturing printed circuit boards. A substrate including a base and two conductive layers on two opposite surfaces of the base is provided. A through-hole passing through the base and the conductive layers is defined in the substrate. A metal layer is formed on the substrate. The metal layer has a first portion on an outer surface of the substrate and a second portion on an inner surface in the through-hole thereof. A protecting material is applied onto the metal layer in the through-hole, an unwanted section of the first portion of the metal layer is removed. Electrical traces in each of the conductive layers are formed. | 06-04-2009 |
20090217522 | PROCESS FOR PRODUCING MULTILAYER PRINTED WIRING BOARD - At least one base material having a wiring circuit that has been formed into a predetermined outer shape is bonded to a motherboard. The motherboard wiring board and the base material having a wiring circuit are electrically connected to each other at least one portion through an inner via hole. The outer shape of the base material having a wiring circuit is smaller than the outer shape of the motherboard, with the base material having a wiring circuit having an island shape on the motherboard. | 09-03-2009 |
20090255111 | MULTILAYER PRINTED WIRING BOARD - A method of forming a circuit board which includes generating laser light with a carbon dioxide laser and making a hole through an insulating substrate by irradiating the insulating substrate with the laser light. The hole includes a top opening in a top surface of the insulating substrate, a bottom opening in a bottom surface of the insulating substrate, and an inner wall extending from the top opening to the bottom opening along a thickness direction of the insulating substrate, the inner wall including a bulge which extends in a direction generally orthogonal to the thickness direction. A via hole is formed in the insulating substrate by providing metal in the hole such that the metal extends from the top opening to the bottom opening along the inner wall, and completely closes each of the top and bottom openings. | 10-15-2009 |
20090265930 | PRINTED WIRING BOARD WITH ENHANCED STRUCTURAL INTEGRITY - A structural printed wiring board panel includes a multilayer printed wiring board having opposing, outer faces and interlayer interconnects that route RF, power and control signals. Connection areas are formed in or on at least on one face for connecting the interlayer interconnects and any electrical components. A metallic face sheet is secured onto at least one outer face, adding structural rigidity to the multilayer printed wiring board. A metallic face sheet can have apertures positioned to allow access to connection areas. RF components can be carried by a face sheet and operatively connected to connection areas. Antenna elements can be positioned on the same or an opposing face sheet and operatively connected to RF components to form a phased array printed wiring board (PWB) panel. | 10-29-2009 |
20100011573 | METHOD FOR FABRICATING PRINTED CIRCUIT BOARD - A method for fabricating a printed circuit board is provided. The method includes manufacturing a base film including a first side and a second side opposite to the first side; printing a first wiring on the first side with a high-viscosity conductive material having a viscosity of 5,000 to 300,000 centipoise (CPS); forming a via-hole that passes through both sides of the base film, and passes by the first wiring; and printing a second wiring on the second side with a low-viscosity conductive material having a viscosity of 100 to 5,000 CPS. The low-viscosity conductive material is applied to an inner wall of the via-hole to conductively connect the first wiring to the second wiring. | 01-21-2010 |
20100024212 | Method of fabricating multilayer printed circuit board - A method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey. | 02-04-2010 |
20100031501 | METHOD FOR FILLING THROUGH HOLE OR NON-THROUGH HOLE FORMED ON BOARD WITH FILLER - A method for filling a through hole or a non-through hole formed on a board with a fluent filler comprises combining at least one filling method selected from a centrifugal filling method and a magnetic filling method with an ultrasonic filling method. | 02-11-2010 |
20100031502 | METHOD FOR FABRICATING BLIND VIA STRUCTURE OF SUBSTRATE - A method for fabricating a blind via structure of a substrate is provided. First, a substrate is provided, which includes a conductive layer, a metal layer, and a dielectric layer disposed between the conductive layer and the metal layer. Next, a cover layer is formed on the conductive layer. Finally, the substrate formed with the cover layer is irradiated by a laser beam to form at least one blind via structure extending from the cover layer to the metal layer. The blind via structure includes a first opening, a second opening, and a third opening linking to one another. The first opening passes through the cover layer. The second opening passes through the conductive layer. The third opening passes through the dielectric layer. For example, a size of the first opening is greater than a size of the second opening and a size of the third opening. | 02-11-2010 |
20100031503 | MULTILAYER PRINTED CIRCUIT BOARD AND MULTILAYER PRINTED CIRCUIT BOARD MANUFACTURING METHOD - A method of manufacturing a multilayer printed circuit board having interlayer insulating layers and conductor layers repeatedly formed on a substrate, via holes formed in the interlayer insulating layers, and establishing electrical connection through the via holes, including containing an electronic component in said substrate, removing a film on a surface of a die pad of said electronic component, forming a mediate layer to be connected to a via hole of a lowermost interlayer insulating layer, on said die pad, forming the interlayer insulating layers on said substrate, and forming the via holes connected to the conductor circuits and the mediate layers, in said interlayer resin insulating layers. | 02-11-2010 |
20100126009 | Method of enabling selective area plating on a substrate - A method of enabling selective area plating on a substrate ( | 05-27-2010 |
20100126010 | Radio Frequency Interconnect Circuits and Techniques - A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly. | 05-27-2010 |
20100132191 | Method for Forming a Circuit Board Via Structure for High Speed Signaling - One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the (PCB), and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes. | 06-03-2010 |
20100146782 | MINIATURE CIRCUITRY AND INDUCTIVE COMPONENTS AND METHODS FOR MANUFACTURING SAME - Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer. | 06-17-2010 |
20100162562 | METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD - A method of manufacturing a rigid-flexible printed circuit board, including providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the flexible copper foil laminate; forming a via hole in the rigid region, and, simultaneously, forming first windows in the coverlays in a flexible region; forming outer circuit patterns including areas adjacent to the first windows; and applying solder resist in the rigid region to expose portions of the external circuit patterns, where the outer circuit patterns formed in the areas adjacent to the first windows include additional plating portions for covering portions of the coverlays. | 07-01-2010 |
20100170088 | Method Of Fabricating Board Having High Density Core Layer And Structure Thereof - Structure and method of making a board having plating though hole (PTH) core layer substrate and stacked multiple layers of blind vias. More stacking layers of blind vias than conventional methods can be achieved. The fabrication method of the board having high-density core layer includes the following: after the making of the PTH, the filling material filled inside the PTH of the core layer is partially removed until the PTH has reached an appropriate flattened depression using etching; then image transfer and pattern plating are performed to fill and to level the depression portion up to a desired thickness to form a copper pad (overplating) as the core layer substrate is forming a circuit layer; finally using electroless copper deposition and the pattern plating to make the product. | 07-08-2010 |
20100223784 | ELECTRONIC SUBSTRATE, MANUFACTURING METHOD FOR ELECTRONIC SUBSTRATE, AND ELECTRONIC DEVICE - An electronic substrate includes: a substrate having a first face on which an active region is formed, and a second face on an opposite side to the first face and on which a passive element is formed. | 09-09-2010 |
20100269336 | METHODS FOR FABRICATING CIRCUIT BOARDS - A method, and apparatus resulting from the method, for fabricating a circuit board suitable for mounting electronic components. The method includes drilling a plurality of through-holes in a plurality of dielectric sheets, forming a conductive film on at least one side of each of the plurality of dielectric sheets, and substantially filling each of the plurality of through holes with a conductive material. The conductive material is both electrically and thermally uninterrupted from a first face to a second face of each of the plurality of dielectric sheets. The plurality of dielectric sheets are then sequentially mounted, one atop another, to form the circuit board. The sequential mounting step is performed after the steps of drilling the plurality of through-holes, forming the conductive layer, and substantially filling the plurality of through-holes. | 10-28-2010 |
20110005071 | Printed Circuit Board and Manufacturing Method Thereof - A printed circuit board and manufacturing method thereof is disclosed. First, a conductive layer disposed on an insulation layer is provided. The conductive layer is patterned to form at least a conductive layer opening and the insulation layer is drilled throughout to form a via at a position corresponding to the conductive layer opening. The via is then loaded with a conductive material. A plurality of substrates are formed through the steps above and are bonded to form a multi-layer printed circuit board. | 01-13-2011 |
20110067235 | Methods for filling holes in printed wiring boards - The invention comprises methods for filling holes in printed wiring boards and printed wiring boards produced by these methods. The methods involve plating metal conductors inside the holes of the printed wiring boards while protecting the conducting surfaces of the printed wiring boards from being plated using photoresist film. The side surfaces of a printed wiring board are covered with photoresist. The photoresist is exposed to developing light, except the photoresist covering the holes on one side of the board is masked to prevent exposure of the holes to the developing light. The undeveloped photoresist covering the holes is removed. The board is subjected to a plating process, which deposits conductive materials in the holes, but the photoresist on the conducting surfaces of the board prevents conductive materials to be plated on the surfaces of the board. | 03-24-2011 |
20110067236 | MULTI-CHIP PACKAGING USING AN INTERPOSER SUCH AS A SILICON BASED INTERPOSER WITH THROUGH-SILICON-VIAS - The formation of electronic assemblies, including assemblies having an interposer, are described. In one embodiment, a method includes forming a plurality of vias extending partially through a body, the vias including sidewalls defined by the body. An insulating layer is formed on the sidewalls and on an upper surface of the body. An electrically conductive layer is formed on the insulating layer in the vias and on the upper surface of the body, the electrically conductive layer defining a first metal pad layer on the upper surface and a second metal pad layer in contact with the first metal pad layer, the second metal pad layer having a denser pitch between adjacent pads than the first metal pad layer. The method also includes forming a dielectric layer between the adjacent metal pads in the first and second pad layers. The method also includes coupling a plurality of elements to the second metal pad layer. After the coupling the elements, the method includes thinning the body through a lower surface and exposing the electrically insulating layer in the vias. The method also includes removing a portion of the electrically insulating layer in the vias, and coupling the electrically conductive layer to a substrate, wherein the body is positioned between the elements and the substrate. Other embodiments are described and claimed. | 03-24-2011 |
20110099807 | Method of manufacturing printed circuit board - A fabrication method which can improve electrical properties, shorten processing time, and reduce the thickness of a chip package by achieving an ultra-thin fine circuit pattern. The method for fabricating a printed circuit board includes: providing an insulating material; forming in the insulating material at least one via-hole for interlayer electrical connection; ion beam treating the surface of the insulating material having the via-hole formed therein; forming a copper seed layer on the surface-treated insulating material using a vacuum deposition process; and plating a copper pattern on the copper seed layer to form a circuit pattern. | 05-05-2011 |
20110131807 | Process for Forming an Isolated Electrically Conductive Contact Through a Metal Package - A method of forming an isolated electrically conductive contact through a metallic substrate includes creating at least one via through the substrate, where the via includes a first opening in a top surface of the substrate, a second opening in an opposing bottom surface and at least one continuous sidewall extending therebetween. A dielectric sleeve is formed on the at least one sidewall of the via while preserving at least a portion of the through via. An electrically conductive filler is then placed into the via. In the examples disclosed, the filler may be a conductive ink or a conductive epoxy. | 06-09-2011 |
20110138622 | DRILL AND METHOD OF PRODUCING PRINTED WIRING BOARD - A printed wiring board manufacturing method for forming a hole penetrating through a board having an electric conductor layer and forming the electric conductor layer in the hole to make electrical connection, the method including forming a hole that penetrates through the board in accordance with a drill featured in that a blade portion is formed at a distal end and a groove is formed by one stripe, and an occupying rate of a metal at a proximal end of the blade tip of the body is in the range of 40% to 80%; and a curvature radius in an axially vertical direction of a deepest portion of the groove is in the range of 1.50 to 3.50 mm, forming an electric conductor layer in a hole, and forming an electric conductor circuit on a top layer of the board. | 06-16-2011 |
20110209344 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A wiring board and method of forming a wiring board. The wiring board includes a first substrate and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond at least one edge of the second substrate. At least one of the base substrate, the first substrate or the second substrate comprises pliable resin, and at least one other of the base substrate, the first substrate or the second substrate comprises an inorganic filler. | 09-01-2011 |
20110219612 | METHOD FOR METALIZING BLIND VIAS - A method for metalizing at least one blind via formed in at least one substrate, including at least the following steps:
| 09-15-2011 |
20110232085 | Method of Fabricating Wiring Board - A method of fabricating a wiring board including at least one conductor layer and at least one resin insulating layer, the method including a wiring groove forming step of forming a wiring groove in the resin insulating layer by irradiating a surface of the resin insulating layer with a laser, and a wiring layer forming step of forming the conductor layer such that at least a portion of the conductor layer is embedded in the wiring groove to form a wiring layer in the wiring groove. | 09-29-2011 |
20110232086 | MULTILAYER PRINTED WIRING BOARD AND MANUFACTURING METHOD THEREOF - A method of manufacturing a multi-layer printed wiring board including forming a core substrate, forming a first interlayer insulation layer over the core substrate, forming a first filled via in the first interlayer insulation layer, the first filled via having a bottom portion having a first diameter, forming a second interlayer insulation layer over the first interlayer insulation layer, and forming a second filled via in the second interlayer insulation layer, the second filled via having a bottom portion having a second diameter smaller than the first diameter. | 09-29-2011 |
20110252640 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A method of manufacturing a wiring board including forming a base substrate, forming a first insulation layer on a first surface of the base substrate and a second insulating layer on a second surface of the substrate opposing the first surface, forming an IVH (Interstitial Via Hole) that penetrates the base substrate, and cutting the first insulating layer in a first area and cutting the second insulating layer in a second area offset from said first area to form a first substrate laminated to a second substrate with the base layer interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond an edge of the second substrate. | 10-20-2011 |
20110252641 | MULTI-LAYER PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A method of manufacturing a multi-layer printed circuit board includes the following steps (A) and (B). (A) Providing penetrating openings which are formed into through holes and each of which has a small diameter for a core substrate, and (B) providing penetrating openings which are formed into through holes each having a large diameter for the core substrate. | 10-20-2011 |
20110258850 | Wiring substrate and method of manufacturing the same - In a method of manufacturing a wiring substrate of the present invention, a through-hole plating layer is formed from an inner surface of a through hole in a substrate to both surface sides, then a resin is filled in a through hole, and then a first resist in which an opening portion is provided on the through hole is formed. Then, a partial cover plating layer is formed in the opening portion in the first resist, then the first resist is removed, and then a second resist that covers a whole of the partial cover plating layer and has a pattern for patterning the through-hole plating layer is formed. Then, a pad wiring portion containing the partial cover plating layer and a wiring pattern are obtained by etching the through-hole plating layer while using the second resist as a mask. | 10-27-2011 |
20110277322 | WIRING BOARD AND METHOD OF MANUFACTURING WIRING BOARD - A wiring board and method of forming the wiring board. The wiring board includes a first substrate, and a second substrate having a smaller mounting area than a mounting area of the first substrate. A base substrate is laminated between the first substrate and the second substrate such that the first substrate extends beyond an edge of the second substrate, and at least one via formed in at least one of the first substrate or the second substrate. A thickness of a portion of the base substrate that is sandwiched between the first substrate and the second substrate is greater than a thickness of a portion of the base substrate that is not sandwiched between the first substrate and the second substrate. | 11-17-2011 |
20110277323 | Method for Forming a Circuit Board Via Structure for High Speed Signaling - One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the (PCB), and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes. | 11-17-2011 |
20110283534 | METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD - A method for manufacturing multilayer printed circuit board includes step below. A metal substrate is provide, the metal substrate includes a number of substrate unit. A first insulating layer is formed on one surface of the metal substrate. The first insulating layer has a number of first through holes. An electrically conductive circuit is formed in each substrate unit. A second insulating layer is formed on the other surface of the metal substrate. The second insulating layer has a number of second through holes. A first metal cylinder is formed in a first through hole and a second metal cylinder is formed in a second through hole. The number of substrate units are folded and laminated, the connected and aligned first metal cylinder and the second metal cylinder communicates the electrically conductive circuits. | 11-24-2011 |
20110283535 | WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A wiring board is provided. The wiring board includes: a resin substrate having a through-hole therethrough; metal foil patterns formed on the resin substrate; and a first wiring layer formed on the metal foil patterns and on an inner surface of the through-hole, wherein the first wiring layer includes: a first power feeding layer; and a first plated layer laminated on the first power feeding layer; a resin member filled in the through-hole and between adjacent wiring patterns of the first wiring layer, wherein an end surface of the resin member is flush with a surface of the first wiring layer; and a second wiring layer formed on the surface of the first wiring layer and formed to cover an end surface of the through-hole, wherein the second wiring layer includes: a second power feeding layer; and a second plated layer laminated on the second power feeding layer. | 11-24-2011 |
20110289774 | METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS USING PARALLEL PROCESSES TO INTERCONNECT WITH SUBASSEMBLIES - Methods of manufacturing printed circuit boards using parallel processes to interconnect with subassemblies are provided. In one embodiment, the invention relates to a method of manufacturing a printed circuit board including providing a core subassembly including at least one metal layer, providing a plurality of one-metal layer carriers after parallel processing each of the plurality of one-metal layer carriers, and attaching at least two of the plurality of one-metal layer carriers with each other and with the core subassembly. | 12-01-2011 |
20110296681 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a printed wiring board, including providing a support board having a metal foil secured to the support board, forming a resin insulation layer on the metal foil, forming openings in the resin insulation layer, forming a conductive circuit on the resin insulation layer, forming in the openings via conductors to electrically connect the conductive circuit and the metal foil, separating the support board and the metal foil, and forming from the metal foil external terminals to electrically connect to another substrate or electronic component. | 12-08-2011 |
20110296682 | MULTILAYER PRINTED WIRING BOARD AND METHOD OF MANUFACTURING MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board includes a first interlaminar resin insulating layer, a first conductor circuit formed on the first interlaminar resin insulating layer, a second interlaminar resin insulating layer formed on the first interlaminar resin insulating layer and the first conductor circuit, a second conductor circuit formed on the second interlaminar resin insulating layer. A via conductor can be formed in the opening portion. The opening portion of the second interlaminar resin insulating layer can expose a face of the first conductor circuit. The via conductor connects the first conductor circuit and the second conductor circuit. The via conductor includes an electroless plating film formed on inner wall face of the opening portion and includes an electrolytic plating film formed on the electroless plating film and on the exposed face of the first conductor circuit exposed by the opening portion. The second conductor circuit includes the electroless plating film and the electrolytic plating film. | 12-08-2011 |
20110302779 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME - A method for manufacturing a printed wiring board including providing a support member having a metal surface, securing a metal foil to the metal surface such that the metal foil is joined or bonded to a peripheral portion of the metal surface, forming a resin insulation layer on the metal foil secured on the metal surface, forming an opening for a via conductor in the resin insulation layer, forming a conductive circuit on the resin insulation layer, forming in the opening a via conductor electrically connecting the conductive circuit and the metal foil such that a laminated sheet body is formed, and cutting a portion of the laminated sheet body inside the peripheral portion of the metal surface of the support member such that the metal foil releases the portion of the laminated sheet body from the support member. | 12-15-2011 |
20110308082 | METHOD FOR MANUFACTURING MULTILAYER PRINTED CIRCUIT BOARD WITH PLATED THROUGH HOLES - A method for manufacturing multilayer printed circuit board includes steps below. A first copper clad laminate includes a central portion and a peripheral portion is provided. A group of concentric copper annular collars is formed by etching the peripheral portion. A second copper clad laminate and an adhesive layer is laminated on to the first copper clad laminate in a manner that the adhesive is sandwiched between the first copper clad laminate and the second copper clad laminate to form a multilayer substrate. A detection hole is formed run through the multilayer substrate. An offset distance is determined and plated through holes in the central portion of the multilayer substrate is formed based on the offset distance. | 12-22-2011 |
20120000068 | PRINTED CIRCUIT BOARD MANUFACTURING METHOD - A method for manufacturing a printed circuit board, including providing a core substrate having an electronic component accommodated in the core substrate; forming a positioning mark on the core substrate; forming an interlayer insulating layer over the core substrate, the positioning mark and the electronic component; forming a via hole opening connecting to the electronic component through the interlayer insulating layer in accordance with the positioning mark on the core substrate; and forming a via hole structure in the via hole opening in the interlayer insulating layer such that the via hole structure is electrically connected to the electronic component. | 01-05-2012 |
20120011716 | Method of manufacturing printed circuit board including outmost fine circuit pattern - A method of manufacturing a printed circuit board including: preparing a first double-sided substrate including a first insulating layer, a first lower copper layer, a second circuit layer including a first lower land, and a first via; preparing a second double-sided substrate including a second insulating layer, a third lower copper layer, a fourth circuit layer including a second lower land, and a second via; disposing a third insulating layer between the second circuit layer and the fourth circuit layer such that the first lower land and the second lower land are electrically connected to each other though a conductive bump; and forming a first circuit layer including a first circuit pattern connected to the first via on the first lower copper layer and forming a third circuit layer including a third circuit pattern connected to the second via on the third lower copper layer. | 01-19-2012 |
20120017437 | CIRCUITIZED SUBSTRATE WITH CONDUCTIVE PASTE, ELECTRICAL ASSEMBLY INCLUDING SAID CIRCUITIZED SUBSTRATE AND METHOD OF MAKING SAID SUBSTRATE - A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a metallic component including nano-particles and may include additional elements such as solder or other metal micro-particles, as well as a conducting polymer and organic. The particles of the paste composition sinter and, depending on what additional elements are added, melt as a result of lamination to thereby form effective contiguous circuit paths through the paste. A method of making such a substrate is also provided, as is an electrical assembly utilizing the substrate and including an electronic component such as a semiconductor chip coupled thereto. | 01-26-2012 |
20120042516 | METHOD FOR MANUFACTURING PROBE CARD - A method for manufacturing a probe card uses a probe having first and second metal layers made of a material in which wettability of a conductive jointing material to the metal layers is higher than wettability of the jointing material to an attaching portion on an outer circumferential surface of an upper area of the attaching portion and at two opposed surface areas of an area continuing downward from the upper area of the attaching portion, respectively, and having a jointing material layer at the upper area and the two surface areas to cover the first and second metal layers. Each probe is attached to a probe substrate at the attaching portion by melting and thereafter solidifying a material for the jointing material layer in a state where the attaching portion is inserted in a through hole of the probe substrate. | 02-23-2012 |
20120055016 | SPLIT WAVE COMPENSATION FOR OPEN STUBS - In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface and a second end near said second surface; a first conductive element electrically coupling said first end of said first via and said first end of said second via; a second conductive element electrically coupling said second end of said first via and said second end of said second via; an input signal line coupled to said first via; and an output signal line coupled to said second via. | 03-08-2012 |
20120060369 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD HAVING LANDLESS VIA HOLE - Method of manufacturing printed circuit board, including: providing a substrate including a first circuit layer having a lower land of a via; forming an insulating layer on the first circuit layer; forming a via hole in the insulating layer; filling the via hole with a first metal, thus forming a via; forming a seed layer with a second metal on the insulating layer and an exposed surface of the via; applying a resist film on the seed layer, and forming a resist pattern having an opening for a second circuit layer with a width formed on the via being smaller than a width of the via; plating a circuit region defined by the opening with a third metal, thus forming a plating layer formed of the third metal; and removing the resist film, and selectively removing an exposed portion of the seed layer, thus forming a second circuit layer. | 03-15-2012 |
20120066902 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD INCLUDING LANDLESS VIA - A method of manufacturing a printed circuit board, including: preparing a double-sided substrate which comprises an insulating layer, a first copper layer formed on one side of the insulating layer and a second copper layer formed on the other side of the insulating layer; forming a via-hole through the second copper layer and the insulating layer; forming a plating layer on an inner wall of the via-hole; and forming, on the double-sided substrate, a via, a first circuit layer including a circuit pattern that is formed on a surface of the via having a minimum diameter and has a line width smaller than the minimum diameter of the via, and a second circuit layer including a lower land. | 03-22-2012 |
20120096711 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board | 04-26-2012 |
20120137515 | THROUGH WAFER VIAS WITH DISHING CORRECTION METHODS - Methods of forming through wafer vias (TWVs) and standard contacts in two separate processes to prevent copper first metal layer puddling and shorts are presented. In one embodiment, a method may include forming a TWV into a substrate and a first dielectric layer over the substrate; forming a second dielectric layer over the substrate and the TWV; forming, through the second dielectric layer, at least one contact to the TWV and at least one contact to other structures over the substrate; and forming a first metal wiring layer over the second dielectric layer, the first metal wiring layer contacting at least one of the contacts. | 06-07-2012 |
20120167386 | HIGH-SPEED ROUTER WITH BACKPLANE USING MULTI-DIAMETER DRILLED THRU-HOLES AND VIAS - A high-speed router backplane is disclosed. The router backplane uses differential signal pairs on multiple signal layers, each sandwiched between a pair of digital ground layers. Thru-holes are used to connect the differential signal pairs to external components. To reduce routing complexity, at least some of the differential signal pairs route through a via pair, somewhere along their path, to a different signal layer. At least some of the thru-holes and vias are drilled to reduce an electrically conductive stub length portion of the hole. The drilled portion of a hole includes a transition from a first profile to a second profile to reduce radio frequency reflections from the end of the drilled hole. | 07-05-2012 |
20120174394 | METHOD FOR MANUFACTURING MULTILAYER CIRCUIT BOARD - Disclosed herein is a method for manufacturing a multilayer circuit board, and more particularly, is a method for manufacturing a coreless multilayer circuit board that forms a support including a separating layer made of a thermoplastic resin and allowing the support to be simply separated, thereby being advantageous in processing a subsequent process, regardless of a size of the board, and economical in the manufacturing process of the support and the manufacturing costs thereof. | 07-12-2012 |
20120192417 | METHOD OF MANUFACTURING A METAL CLAD LAMINATE - A method for manufacturing a printed circuit board having a via-on-pad (VOP) structure, the method including: preparing an insulator and a metal clad laminate, the laminate having a metal foil and a barrier layer successively formed on the insulator; processing a via hole in the insulator from an upper surface of the insulator, a bottom of the via hole being shielded by the metal foil; removing the barrier layer so as to expose a surface of the metal foil; forming a seed layer of the metal foil and in the via hole; forming a patterned plating resist on upper and lower surfaces of the laminate, a portion of the metal foil, which shields the bottom of the via hole, and a top of the via hole being open; and forming a via inside the via hole, and forming a pad on a lower side of the via. | 08-02-2012 |
20120266464 | MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER - A multi-level interposer plate and a multi-chip module (MCM) that includes the multi-level interposer plate are described. First surfaces and second surfaces in different regions of the multi-level interposer plate have associated, different thicknesses. Moreover, first micro-spring connectors and second micro-spring connectors are respectively disposed on the first surfaces and the second surfaces. In the MCM, a given one of the first surfaces of the multi-level interposer plate faces a bridge chip in a first layer in an array of chips in the MCM so that first connectors, disposed on the bridge chip, mechanically and electrically couple to the first micro-spring connectors. Similarly, a given one of the second surfaces of the multi-level interposer plate faces an island chip in a second layer in the array of chips so that second connectors, disposed on the island chip, mechanically and electrically couple to the second micro-spring connectors. | 10-25-2012 |
20120272520 | METHOD OF MANUFACTURING CIRCUIT BOARD - In a method of manufacturing a circuit board, a conductive paste is filled in a first hole formed on a first prepreg having both sides to which a first protective film is caused to stick so that a first circuit board is manufactured. A fiber piece housing paste obtained by mixing a fiber piece is recovered to obtain a recovery paste; filtration is carried out through a filter; a solvent or the like is added; and a viscosity, a composition ratio or the like is adjusted so that a reuse paste is fabricated. The reuse paste is filled in a second hole formed on a second prepreg having both sides to which a second protective film is caused to stick. | 11-01-2012 |
20120291276 | FLEX-RIGID WIRING BOARD AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a flex-rigid wiring board includes positioning a flexible board and a non-flexible substrate adjacent to each other, forming a metal layer over the flexible board such that the metal layer is formed to stop laser irradiation from reaching into the flexible board, forming an insulating layer such that the insulating layer covers the metal layer, the flexible board and the non-flexible substrate, irradiating laser upon the insulating layer such that a portion of the insulating layer covering the metal layer is cut; and removing the portion of the insulating layer covering the metal layer from the flexible board such that at least a portion of the flexible board is exposed. | 11-22-2012 |
20130036606 | SIGNAL DELIVERY IN STACKED DEVICE - Some embodiments include apparatus, systems, and methods having a base, a first die, a second arranged in a stacked with the first die and the base, and a structure located in the stack and outside at least one of the first and second dice and configured to transfer signals between the base and at least one of the first and second dice. | 02-14-2013 |
20130091701 | MONOLITHIC CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - In a method for manufacturing a monolithic ceramic electronic component, when an inner conductor is formed by printing an electrically conductive paste, a smear may be generated in an opening of the inner conductor at a side of the opening near to a position from which printing is started in a printing direction. The smear may cause an unwanted contact between the inner conductor and a via conductor, which is a conductor extending through the opening and having a potential different from that of the inner conductor, so as to cause a short-circuit. The inner conductor is printed such that the center of each via conductor is deviated from the center of the opening in the direction in which the electrically conductive paste is printed. With this structure, even if the smear is generated in the opening, the probability of a short-circuit is minimized. | 04-18-2013 |
20130139383 | Printed Circuit Board and Method Of Manufacturing The Same - Disclosed herein is a printed circuit board, including: a substrate including a first circuit layer formed on one side thereof and a second circuit layer formed on the other side thereof; and a strike-type through body externally inserted in the substrate and electrically connecting the first circuit layer and the second circuit layer. The printed circuit board is advantageous in that, since a strike-type through body is externally inserted in a substrate, conventional complicated processes, such as hole forming, deburring, desmearing, electroless copper plating and electrolytic copper plating, can be omitted, thus simplifying a process of manufacturing a printed circuit board and reducing the manufacturing cost thereof. | 06-06-2013 |
20130174417 | Interposer-on-Glass Package Structure - A method comprises providing an interposer comprising a substrate and a first through-substrate via (TSV) penetrating through the substrate, forming a first oxide layer on a surface of the interposer, bonding a glass substrate to the interposer through a fusion bonding, with the first oxide layer being between the interposer and the glass substrate and forming a second TSV in the glass substrate and electrically coupled to the first TSV. | 07-11-2013 |
20130199035 | CARRIER FOR MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE CARRIER - Disclosed herein is a carrier for manufacturing a printed circuit board, the carrier including: a core member composed of a base substrate, first metal layers stacked on both surfaces of the base substrate, and second metal layers stacked on the first metal layers; and a protecting unit completely wrapping an outskirt part of the core member, so that physical and chemical stresses can be minimized through a structure where an outskirt part of a carrier is wrapped by a protecting unit, thereby improving the manufacturing yield of the printed circuit board. | 08-08-2013 |
20130219714 | WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME - A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate. | 08-29-2013 |
20130232784 | METHOD OF MANUFACTURING WIRING SUBSTRATE - A method of manufacturing a wiring substrate includes: a process of forming a first laminate structure in which one or more conductor layers and one or more resin insulating layers are laminated on a supporting substrate; a process of laminating a metal core substrate, which has a metal layer disposed on the top main surface thereof, on the first laminate structure so that a bottom main surface of the metal core substrate comes in contact with the first laminate structure, and a process of forming a second laminate structure in which one or more conductor layers and one or more resin insulating layers are laminated on the metal core substrate. | 09-12-2013 |
20130239408 | POWER AND GROUND VIAS FOR POWER DISTRIBUTION SYSTEMS - A system for providing power and ground vias for power distributions systems includes first and second conductive layers on a microelectronic package. The conductive layers may include one or more conductive components such as, but not limited to, power planes, ground planes, pads, traces, and the like for electrically connecting to electronic components. A via may electrically connect the first and second conductive layers. The via may have a cross-section of at least three partially-overlapping shapes. Each of the shapes partially overlaps at least two of the other shapes. The shapes may be, for example, circular, triangular, rectangular, square, polygonal, rhomboidal shape, or any other shape. | 09-19-2013 |
20130247373 | METHOD OF PRODUCING PRINTED WIRING BOARD AND COPPER FOIL FOR LASER PROCESSING - An object of the present invention is to provide a method of producing a printed wiring board which reduces production steps, is excellent in infrared laser processability, and is suitable for formation of an excellent wiring pattern; and to provide a copper foil for laser processing and a copper-clad laminate. In order to achieve the object, a method of producing a printed wiring board comprises: forming a via-hole for interlayer connection in a laminate in which a copper foil for laser processing comprises a copper foil and an easily soluble laser absorption layer provided on a surface of the copper foil which has a higher etching rate to a copper etchant than the copper foil and absorbs an infrared laser beam and another conductor layer is laminated through an insulating layer, directly irradiating the infrared laser beam on the easily soluble laser absorption layer; and removing the easily soluble laser absorption layer from the surface of the copper foil in a desmear step of removing a smear in a via-hole and/or a microetching step as a pretreatment of an electroless plating step is adopted. | 09-26-2013 |
20130305531 | PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes a core substrate having a penetrating hole penetrating through the core substrate and having a first insulation layer, a second insulation layer and an insulative substrate interposed between the first and second layers, a first circuit formed on a surface of the core, a second circuit formed on opposite surface of the core, and a through-hole conductor formed in the penetrating hole of the core and connecting the first and second circuits. The penetrating hole has first and second opening portions, the first opening portion becomes thinner from the first surface toward the second surface, the second opening portion becomes thinner from the second surface toward the first surface, and the first and second insulation layers are comprised of resin materials easier to be processed by laser than resin material of the insulative substrate under same conditions of the laser. | 11-21-2013 |
20130326873 | METHOD OF FABRICATING MULTI-CHIP STACK PACKAGE STRUCTURE HAVING INNER LAYER HEAT-DISSIPATING BOARD - An inner-layer heat-dissipating board and a multi-chip stack package structure having the inner-layer heat-dissipating board are disclosed. The inner-layer heat-dissipating board includes a metal board body formed with a plurality of penetrating conductive through holes each comprising a plurality of nano wires and an oxidative block having nano apertures filled with the nano wires. The multi-chip stack package structure includes a first chip and an electronic component respectively disposed on the inner-layer heat-dissipating board to thereby facilitate heat dissipation in the multi-chip stack structure as well as increase the overall package rigidity. | 12-12-2013 |
20130326874 | METHOD FOR PRODUCING MULTILAYER SUBSTRATE AND DESMEARING METHOD - A method for producing a multilayer substrate involves: a base-material pretreatment step in which a hole forming step and a metal adhesion step are performed in no particular order, the hole forming step being a step of subjecting a core base material having at least an insulating layer and a first metal layer to a hole opening process, the metal adhesion step being a step in which a predetermined metal or metal ion is made to adhere to the other surface of the insulating layer; a desmearing step of performing desmearing by plasma etching; a cleaning step of cleaning the core base material by using an acidic solution; and a plating step of applying a plating catalyst or a precursor thereof onto the insulating layer and performing plating. | 12-12-2013 |
20130340249 | METHOD OF MANUFACTURING MULTILAYER CIRCUIT SUBSTRATE - A method of manufacturing a multilayer circuit substrate, the method includes: injecting a conductive paste into through-holes provided in an insulating substrate to one or both sides of which a protection film is attached; cooling and setting the conductive paste injected into the through-holes; and removing the protection film from the insulating substrate after cooling and setting the conductive paste. | 12-26-2013 |
20130340250 | Method for Forming a Circuit Board Via Structure for High Speed Signaling - One embodiment of the invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the PCB, and in so doing transgresses the power and ground planes between the signal plane. To minimize EM disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes. | 12-26-2013 |
20140000109 | MANUFACTURING METHOD OF SUBSTRATE STRUCTURE | 01-02-2014 |
20140026412 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A method for manufacturing a printed wiring board includes forming on a support sheet an intermediate body including a first insulation layer, a second insulation layer and a first conductive layer interposed between the first insulation layer and the second insulation layer, and separating the support sheet from the intermediate body including the insulation layer, the first conductive layer and the second insulation layer such that the intermediate body is detached from the support sheet. | 01-30-2014 |
20140026413 | SINGLE-LAYER PCB MICROFLUIDICS - A printed circuit board structure is coated with an encapsulant within which microfluidic channels have been formed. The microfluidic channels are formed by soldering fluidic connections to metal traces on a surface of the printed circuit board structure prior to encapsulation. The metal traces are removed by etching after encapsulation to form microchannels within the encapsulant. | 01-30-2014 |
20140053400 | METHOD FOR FABRICATING PACKAGE SUBSTRATE - A package substrate includes a core layer, a first dielectric layer, a second circuit pattern, a first solder mask and an insulating layer. A first circuit pattern is disposed on a first surface of the core layer. The first dielectric layer covers the first circuit pattern. The second circuit pattern is located on the first dielectric layer and the second circuit pattern includes an interconnection circuit pattern within a chip mounting area. The first solder mask covers a portion of the second circuit pattern outside the chip mounting area. The insulating layer covers the chip mounting area and the interconnection circuit pattern. A plurality of embedded pads are located on an upper surface of the insulating layer. | 02-27-2014 |
20140090245 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD - In accordance with various embodiments, there is provided a method of manufacturing a printed circuit board, the method including the steps of preparing a first carrier including a first pattern formed on one side thereof, preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof, pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates, attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other, and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer. | 04-03-2014 |
20140096382 | MANUFACTURING METHOD OF SUBSTRATE STRUCTURE - A manufacturing method of substrate structure is provided. The base material having a core layer and a first and second copper foil layers located at a first and second surfaces of the core layer is provided. A surface treatment is performed on the first and second copper foil layers so as to form a first and second roughened surfaces. A laser beam is irradiated on the first roughened surface so as to form at least one first blind hole extending from the first copper foil layer to the second surface. An etching process is performed on the second copper foil layer so as to form at least one second blind hole extending from the second copper foil layer to the second surface. A conductive layer fills up a through hole defined by the first and second blind holes and covers the first and second copper foil layers. | 04-10-2014 |
20140096383 | RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a rigid-flexible printed circuit board includes providing a base substrate in which coverlays are respectively formed on two sides of a flexible copper foil laminate on both sides of which inner circuit patterns and a first window are respectively formed; layering insulation layers and copper foil layers on portions of coverlays which are to be a rigid region of the base substrate; forming a via hole in the rigid region, and, simultaneously, forming a via hole to correspond to the first window in a flexible region; forming outer circuit patterns including areas adjacent to the first window; and applying solder resists in the rigid region to expose portions of external circuit patterns. The region adjacent to the via holes in the flexible region includes additional plating portions for covering the coverlays. | 04-10-2014 |
20140123488 | APPARATUS FOR FILLING A WAFER VIA WITH SOLDER AND HAVING A PRESSURE UNIT, AND METHOD FOR FILLING A WAFER VIA WITH SOLDER USING SAME - A wafer via solder filling device includes a solder bath comprising an accommodation space for accommodating a molten solder, with an open top, and an air outlet for exhausting air from the accommodation space; a fixing unit for fixing the wafer having a via formed in one surface in the accommodation space to seal the accommodation space airtight; and a pressing unit for pressing a bottom of the molten solder arranged in the solder bath and moving the molten solder upward, to fill the molten solder in the via. | 05-08-2014 |
20140123489 | THROUGH-HOLE-VIAS IN MULTI-LAYER PRINTED CIRCUIT BOARDS - Example multi-layer printed circuit boards (‘PCBs’) are described as well as methods of manufacturing a PCB. Embodiments include depositing upon layers of laminate printed circuit traces and joining the layers of laminate. Embodiments also include drilling at least one via hole through the layers of laminate and placing in the via hole a via conductor comprising a used portion and an unused portion, the via conductor comprising copper coated with a second metal having a conductivity lower than the conductivity of copper. | 05-08-2014 |
20140150258 | Method of Manufacturing Wiring Substrate - A wiring substrate includes a core portion and a wiring portion. The core portion includes a wiring layer and an organic resin core substrate. The wiring portion includes wiring layers and organic resin insulative layers. The wiring layer of the core portion is formed in a state in which the organic resin core substrate is supported by a support body. The wiring layers of the wiring portion are formed in a state in which the organic resin core substrate is adhered to a support body and the wiring layer of the core portion faces toward the support body. | 06-05-2014 |
20140190006 | METHOD FOR MANUFACTURING CHARGED PARTICLE BEAM LENS - There is provided a method for manufacturing a charged particle beam lens having a bonded electrode obtained by bonding at least a first conductive substrate having a first through-hole and a second conductive substrate having a second through-hole. The above method includes: forming the first through-hole in the first conductive substrate; forming the second through-hole in the second conductive substrate; and bonding the first conductive substrate and the second conductive substrate so that the first through-hole and the second through-hole communicate with each other. | 07-10-2014 |
20140201994 | LOW-STRESS TSV DESIGN USING CONDUCTIVE PARTICLES - A component can include a substrate having a first surface and a second surface remote therefrom, an opening extending in a direction between the first and second surfaces, and a conductive via extending within the opening. The substrate can have a CTE less than 10 ppm/° C. The conductive via can include a plurality of base particles each including a first region of a first metal substantially covered by a layer of a second metal different from the first metal. The base particles can be metallurgically joined together and the second metal layers of the particles can be at least partially diffused into the first regions. The conductive via can include voids interspersed between the joined base particles. The voids can occupy 10% or more of a volume of the conductive via. | 07-24-2014 |
20140201995 | CUTTING DRILL AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A cutting drill includes a shank having a hole and formed to be gripped in a tool holder, and a drill body having a rod shape and locked into the hole of the shank. The shank has an axis around which the drill body rotates. The drill body has a cutting-edge portion forming a tip portion of the drill body and a neck portion having a diameter smaller than a diameter of the cutting-edge portion. The cutting-edge portion has a first cutting-edge portion and a second cutting-edge portion formed between the first cutting-edge portion and the neck portion. The first cutting-edge portion is contiguous to the second cutting-edge portion by a step portion such that the second cutting-edge portion has a diameter which is smaller than a diameter of the first cutting-edge portion. | 07-24-2014 |
20140208590 | PROCESS FOR MANUFACTURING A PRINTED CIRCUIT BOARD HAVING HIGH DENSITY MICROVIAS FORMED IN A THICK SUBSTRATE - A process for manufacturing a printed circuit board having high-density microvias formed in a thick substrate is disclosed. The method includes the steps of forming one or more holes in a thick substrate using a laser drilling technique, electroplating the one or more holes with a conductive material, wherein the conductive material does not completely fill the one or more holes, and filling the one or more plated holes with a non-conductive material. | 07-31-2014 |
20140259659 | PHASED ARRAY STEERING FOR LASER BEAM POSITIONING SYSTEMS - A laser beam positioning system of a laser-based specimen processing system produces at beam positioner stage, from a fully fiber-coupled optics phased array laser beam steering system, a steered laser input beam. System directs beam through one or more other beam positioner stages to form a processing laser beam that processes target features of a workpiece mounted on a support. | 09-18-2014 |
20140317920 | METHODS OF FORMING FUEL CELL LAYERS - The present invention relates to electrically conductive paths in planar substrates. Various embodiments provide a method of forming one or more electrically conductive paths in a planar substrate, wherein substantially none of the substrate is removed during formation of the path. In various embodiments, by avoiding the removal of substrate during formation of the electrically conductive path, problems caused by residual substrate material can be advantageously avoided. In various embodiments, the planar substrate with the electrically conductive path can be used to make a planar fuel cell array. | 10-30-2014 |
20150026975 | MULTILAYER PRINTED WIRING BOARD - A multilayer printed wiring board includes a core base material having a penetrating portion, a low-thermal-expansion substrate accommodated inside the penetrating portion of the core base material and having a first surface for mounting a semiconductor element and a second surface on the opposite side of the first surface, a first through-hole conductor provided inside the low-thermal-expansion substrate and provided for electrical connection between the first surface and the second surface of the low-thermal-expansion substrate, a filler filled in a gap between the low-thermal-expansion substrate and an inner wall of the core base material, and a wiring layer formed on at least one of the first surface and the second surface of the low-thermal-expansion substrate and having a resin insulation layer and a conductive layer. The wiring layer has a via conductor connecting the first through-hole conductor and the conductive layer. | 01-29-2015 |
20150047188 | METHODS OF SEGMENTED THROUGH HOLE FORMATION USING DUAL DIAMETER THROUGH HOLE EDGE TRIMMING - Cost effective and efficient methods to maximize printed circuit board (PCB) utilization with minimized signal degradation are provided. The methods include electrically isolating a segmented via structure by controlling the formation of a conductive material within a plated via structure by utilizing different diameter drills within a via structure for trimming the conductive material at the via shoulder (i.e., the rim of a drilled two diameter hole boundary). The trimmed portion may be voided in the via structure for allowing electrically isolated plated through-hole (PTH) segments. One or more areas of trimmed rims within the via structure are used to form multiple stair like diameter holes to create one or more voids in the via structure. As a result, the formation of conductive material within the via structure may be limited to those areas necessary for the transmission of electrical signals. | 02-19-2015 |
20150059173 | METHOD FOR MANUFACTURING MULTI-LAYERED PRINTED CIRCUIT BOARD - Disclosed herein is a method for manufacturing a multi-layered printed circuit board, the method including: an operation of preparing a substrate having an insulating layer and a surface-treated copper foil sequentially formed on an inner layer circuit; an operation of forming a hole exposing the insulating layer by performing a primary processing for the surface-treated copper foil and a part of the insulating layer with laser; and an operation of forming a through-hole exposing the inner layer circuit by performing a secondary processing for the exposed insulating layer with a chemical etching liquid. | 03-05-2015 |
20150068034 | MANUFACTURING METHOD OF PACKAGE CARRIER - A manufacturing method of a package carrier is provided. An insulation substrate having an upper surface, a lower surface, plural cavities located at the lower surface and plural through holes passing through the insulation substrate and respectively communicating with the cavities is provided. Plural vias is defined by the cavities and the through holes. A conductive material filling up the vias is formed to define plural conductive posts. An insulation layer having a top surface and plural blind vias extending from the top surface to the conductive posts is formed on the upper surface. A patterned circuit layer filling up the blind vias, being connected to the conductive posts and exposing a portion of the top surface is formed on the top surface. A solder mask layer is formed on the patterned circuit layer and has plural openings exposing a portion of the patterned circuit layer to define plural pads. | 03-12-2015 |
20150089806 | HYBRID-CORE THROUGH HOLES AND VIAS - A semiconductor device substrate includes a front section and back section that are laminated cores disposed on a front- and back surfaces of a first core. The first core has a cylindrical plated through hole that has been metal plated and filled with air-core material. The front- and back sections have laser-drilled tapered vias that are filled with conductive material and that are coupled to the plated through hole. The back section includes an integral inductor coil that communicates to the front section. The first core and the laminated-cores form a hybrid-core semiconductor device substrate with an integral inductor coil. | 04-02-2015 |
20150121693 | MANUFACTURING METHOD FOR MULTI-LAYER CIRCUIT BOARD - A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, two core layers are compressed to form a substrate having two surfaces opposite to each other. Then, a via connecting the surfaces is formed. A patterned circuit layer including a concentric-circle pattern is then formed on each surface by using the via as an alignment target. Next, a first stacking layer is formed on each surface. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. A second stacking layer is then formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. | 05-07-2015 |
20150121694 | MANUFACTURING METHOD FOR MULTI-LAYER CIRCUIT BOARD - A manufacturing method for a multi-layer circuit board includes the following steps. Firstly, a substrate having two surfaces opposite to each other and a via connecting there between is provided. Next, a patterned circuit layer is formed on each of the surfaces by using the via as an alignment target. Each patterned circuit layer includes a concentric-circle pattern. Next, a first stacking layer is formed on each of the surfaces. Then, a first through hole penetrating regions of the first stacking layer and the substrate where a first concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. Next, a second stacking layer is formed on each first stacking layer. Afterward, a second through hole penetrating regions of the first, the second stacking layers and the substrate where a second concentric circle from the center of the concentric-circle pattern is orthogonally projected thereon is formed. | 05-07-2015 |
20150135527 | METHOD OF FABRICATING PACKAGING SUBSTRATE HAVING EMBEDDED THROUGH-VIA INTERPOSER - A packaging substrate having an embedded through-via interposer is provided, including an encapsulant layer, a through-via interposer embedded in the encapsulant layer and having a plurality of conductive through-vias therein, a redistribution layer embedded in the encapsulant layer and formed on the through-via interposer so as to electrically connect with first end surfaces of the conductive through-vias, and a built-up structure formed on the encapsulant layer and the through-via interposer for electrically connecting second end surfaces of the conductive through-vias. As such, the first end surfaces of the conductive through-vias of the through-via interposer are electrically connected to the redistribution layer to thereby be electrically connected to electrode pads of a semiconductor chip having smaller pitches, while the second end surfaces of the conductive through-vias electrically connect with conductive vias of the built-up structure having larger pitches, thereby allowing the packaging substrate to be coupled with the semiconductor chip having high-density circuits. | 05-21-2015 |
20160050771 | MANUFACTURING METHOD OF CIRCUIT STRUCTURE EMBEDDED WITH HEAT-DISSIPATION BLOCK - A manufacturing method of circuit structure embedded with heat-dissipation block including the following steps is provided. A core board including a first dielectric layer and two first conductive layers located on two opposite sides of the first dielectric layer is provided. A through hole penetrated the core board is formed. A heat-dissipation block is disposed into the through hole. Two inner-layer circuits are formed on two opposite sides of the core board. At least one build-up structure is bonded on the core board, wherein the build-up structure includes a second dielectric layer and a second conductive layer, and the second dielectric layer is located between the second conductive layer and the core board. A cavity is formed on a predetermined region of the build-up structure, and the cavity is communicated with the corresponding inner-layer circuit. Another manufacturing method of circuit structure embedded with heat-dissipation block is also provided. | 02-18-2016 |
20160079090 | CARRIER-LESS SILICON INTERPOSER - An interposer has conductive elements at a first side and terminals at a second side opposite therefrom, for connecting with a microelectronic element and a second component, respectively. The component includes a first element having a thermal expansion coefficient less than 10 ppm/° C., and an insulating second element, with a plurality of openings extending from the second side through the second element towards the first element. A conductive structure extending through the openings in the second element and through the first element electrically connects the terminals with the conductive elements. | 03-17-2016 |
20160081201 | MULTILAYER ELECTRONIC STRUCTURE WITH INTEGRAL FARADAY SHIELDING - A multilayer electronic support structure including at least one metallic component encapsulated in a dielectric material, and comprising at least one faraday barrier to shield the at least one metallic component from interference from external electromagnetic fields and to prevent electromagnetic emission from the metallic component. | 03-17-2016 |
20160128201 | METHOD FOR FORMING VIAS ON PRINTED CIRCUIT BOARDS - A method for filling a via on a printed circuit board formulates a paste as a dispersion of copper particulate that includes nanocopper particles in a solvent and a binder and depositing the paste into a via cavity formed in the printed circuit board. Heating the paste-filled cavity removes most of the solvent. The method sinters the deposited paste in the via cavity, planarizes the sintered via, and overplates the filled via with copper. | 05-05-2016 |
20160155651 | METHOD OF FORMING WAFERLESS INTERPOSER | 06-02-2016 |
20160163565 | MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE - When a plating layer is formed on through holes in semiconductor packages, first and second stacked bodies are stacked with first and second cavities formed in the first and second stacked bodies facing the inner side and are bonded together by applying adhesive to peripheral regions so that the cavities of the first and second stacked bodies form sealed spaces, and the through holes are formed such that part of the first and second stacked bodies including the bonding surface remains. Then, the through holes are plated to form the plating layer, the peripheral regions are removed as cutting allowances, i.e., removal regions, and the first and second stacked bodies are divided into a plurality of pieces along dicing lines to form semiconductor packages. | 06-09-2016 |
20160196986 | BALL GRID ARRAY PACKAGE SUBSTRATE WITH THROUGH HOLES AND METHOD OF FORMING SAME | 07-07-2016 |