The John Henry Company, A Multi Packaging Solutions Company Patent applications |
Patent application number | Title | Published |
20110072719 | FOLDED POT COVER - A foldable pot cover provides a foldable die cut pattern which can be imprinted on its exterior surfaces with any of a number of designs. The pot cover is formed from a die cut pattern which can be folded into overlapping flaps and tabs which are folded and interlocked to define a generally trapezoidal pot cover which can receive a variety of different pot sizes and types and resists moisture. The die cut pattern forming the pot cover can be of a universal shape but formed in a variety of different sizes to accommodate different sized potted plants. | 03-31-2011 |
20100170814 | PACKAGING FOR ELECTRICAL COMPONENTS - A package made from a biodegradable material, such as paperboard, utilizes multi-layered sheets of relatively thin material which can be cut to desired shapes relatively inexpensively and folded into adjacent layers which are adhesively attached to one another to form the package. In a preferred embodiment of the invention, the package defines a book-like package having an outer envelope with one side defining a sleeve for receiving a disk and an opposite side which receives a laminated multi-layered holder having a pocket in the shape of a memory chip/card or other electronic component to be held therein. | 07-08-2010 |