SOLARWORLD INDUSTRIES AMERICA, INC. Patent applications |
Patent application number | Title | Published |
20150349530 | USER CONFIGURABLE ELECTRICAL SUBPANEL SYSTEM WITH BACK FEED PREVENTION - In various embodiments, an electrical subpanel system is disclosed. The subpanel system may include a DC/AC inverter configured to accept a DC electrical input and to provide an auxiliary AC current output; a quick-disconnect coupling, a busbar connected between the auxiliary AC current output and the quick-disconnect coupling, a receptacle for connecting to at least one electrical device coupled in parallel to said busbar, where the quick-disconnect coupling may be configured to be selectively connected to a mains branch circuit current. | 12-03-2015 |
20150111020 | METHOD FOR PRODUCING SILICON-INGOTS - Method for producing silicon-ingots ( | 04-23-2015 |
20150101661 | SOLAR CELL CONTACT STRUCTURE - In various embodiments a solar cell may include a solar cell wafer substrate made of silicon having a major share of mono crystalline structure with {111} crystal plane parallel to one wafer edge; a dielectric layer disposed over the backside of solar cell wafer substrate; a plurality of contact openings extending through the dielectric layer to the solar cell wafer substrate; a plurality of metal contacts formed in the plurality of contact openings; and a metal layer disposed over the dielectric layer; wherein the metal layer is electrically coupled to the solar cell wafer substrate by means of the plurality of metal contacts; wherein at least one contact opening of the plurality of contact openings extends non parallel to {111} crystal plane. | 04-16-2015 |
20150040983 | ACIDIC ETCHING PROCESS FOR SI WAFERS - The present invention relates to a method for acidic surface etching of a silicon wafer, such as those used for solar cells, comprising contacting at least one surface of a silicon wafer as cut with an acidic etching agent, provided that the wafer is, prior to the acidic etching, not subjected to an alkaline etching step or process. Further, the present invention is directed to Si wafer, photovoltaic cells, PERC photovoltaic cells and solar modules produced according to the method of the present invention. | 02-12-2015 |
20140263524 | METHOD AND DEVICE FOR CLEAVING WAFERS - A method for cleaving wafers comprising the following steps: providing a slice of a crystalline material with at least a first plane side, providing at least one stressing means to be attached to said slice, wherein said at least one stressing means is at least in parts made of a material with a coefficient of thermal expansion different from that of the slice, attaching said stressing means to said first plane side of said slice to form a stack, inducing a thermal shear stress to said slice by applying a temperature change to said stack. | 09-18-2014 |
20140178286 | DEVICE FOR REMOVING LIQUID SILICON FROM A CRUCIBLE - A device for taking up a silicon melt comprises at least one block of a refractory with a capillary structure. | 06-26-2014 |
20130334667 | Alkaline Etching Liquid for Texturing a Silicon Wafer Surface - An etching liquid for texturing a silicon wafer surface is provided. The etching liquid may include an aqueous solution of at least one alkaline etching agent and at least one polysaccharide or derivative thereof. Also provided is a process for texture etching a silicon wafer using the etching liquid of the invention. | 12-19-2013 |
20130194564 | METHOD AND APPARATUS FOR MEASURING PHOTOVOLTAIC CELLS - A solar simulator is disclosed having a test chamber for receiving a photovoltaic device for testing, an illumination source for selectively illuminating the photovoltaic device to produce a test signal therefrom, a spectrophotometer for providing a measurement of the spectral distribution of the output of the illumination source, a database containing spectral response information of monitor cell, reference device and DUT, and a computation device for receiving said test signal and said measurement, wherein the computation device converts said test signal into a test value based on said measurement. | 08-01-2013 |
20120112321 | ALKALINE ETCHING LIQUID FOR TEXTURING A SILICON WAFER SURFACE - An etching liquid for texturing a silicon wafer surface is provided. The etching liquid may include an aqueous solution of at least one alkaline etching agent and at least one polysaccharide or derivative thereof. Also provided is a process for texture etching a silicon wafer using the etching liquid of the invention. | 05-10-2012 |
20120006394 | METHOD FOR MANUFACTURING OF ELECTRICAL CONTACTS ON A SOLAR CELL, SOLAR CELL, AND METHOD FOR MANUFACTURING A REAR SIDE CONTACT OF A SOLAR CELL - In various embodiments, a method for manufacturing of electrical contacts on a solar cell is provided. The method may include forming a dielectric layer on a region to be electrically contacted; forming a first metal layer over the dielectric layer; forming electrical contacts between the first metal layer and the region to be electrically contacted through the dielectric layer by laser pulses; annealing the formed electrical contacts; and forming a second metal layer comprising a solderable material at least over a portion of the first metal layer. | 01-12-2012 |
20110244184 | ALKALINE ETCHING SOLUTION FOR TEXTURING A SILICON WAFER SURFACE - An etching solution for texturing a silicon wafer surface is provided. The etching solution may include an aqueous solution of at least one alkaline etching agent and at least one organic compound, wherein the organic compound is a polyalcohol comprising at least four hydroxy groups or a derivative thereof. | 10-06-2011 |